Preparation method of beveled edge circuit board and beveled edge circuit board

Abstract

The invention provides a preparation method of a beveled edge circuit board and the beveled edge circuit board. The method comprises the following steps: providing a to-be-processed circuit board; determining golden finger target data according to the circuit board to be processed; according to the golden finger target data, bevel edge parameters and cutting parameters are determined; cutting the to-be-processed circuit board according to the cutting parameter and the bevel edge parameter to obtain a first circuit board; preprocessing the first circuit board to obtain a preprocessed first circuit board; carrying out electroplating treatment on the pretreated first circuit board to obtain a second circuit board; and obtaining a target bevel edge circuit board according to a preset detection condition and the second circuit board. The production efficiency of the target bevel edge circuit board is improved, and the product quality and reliability of the circuit board can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and also to a method for preparing a beveled-edge circuit board and the beveled-edge circuit board. Background Art

[0002] With the booming development of the electronics industry, printed circuit boards have been widely used in various computer products. The edge of the printed circuit board is the output terminal of the circuit (commonly known as the gold finger). The output terminal of the printed circuit board needs to be inserted into the computer connection port for connection. However, the edge of the output terminal is a right angle before processing, which makes it difficult to insert it into the connection port. Therefore, the edge of the output terminal of the printed circuit board generally needs to be cut into a bevel. However, the existing bevel processing process is complicated and the production efficiency is low. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a method for preparing a beveled edge circuit board and a beveled edge circuit board, so as to improve production efficiency.

[0004] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0005] A first aspect of the present invention provides a method for preparing a beveled edge circuit board, comprising:

[0006] Providing circuit boards to be processed;

[0007] Determine the gold finger target data according to the circuit board to be processed;

[0008] Determine the bevel parameters and cutting parameters according to the golden finger target data;

[0009] Cutting the circuit board to be processed according to the cutting parameters and the bevel parameters to obtain a first circuit board;

[0010] Preprocessing the first circuit board to obtain a preprocessed first circuit board;

[0011] Performing electroplating on the pretreated first circuit board to obtain a second circuit board;

[0012] A target beveled edge circuit board is obtained according to the preset detection conditions and the second circuit board.

[0013] Optionally, determining the gold finger target data according to the circuit board to be processed includes:

[0014] Determine the target type of the gold finger according to the circuit board to be processed and the target function data;

[0015] Determine the basic data of the gold finger according to the circuit board to be processed and the target connection data;

[0016] The golden finger target data is determined according to the golden finger basic data and the golden finger target type.

[0017] Optionally, determining the bevel parameters according to the golden finger target data includes:

[0018] Determine the bevel angle according to the golden finger target data;

[0019] Determine the bevel depth according to the golden finger target data and the bevel angle;

[0020] A bevel parameter is determined according to the bevel angle and the bevel depth.

[0021] Optionally, determining cutting parameters according to the golden finger target data includes:

[0022] According to the golden finger target data, a cutting path and a bevel depth are obtained;

[0023] Obtaining a cutting speed according to the gold finger target data and the circuit board to be processed;

[0024] Determining a cutting depth according to the bevel depth;

[0025] Cutting parameters are determined according to the cutting path, the cutting speed and the cutting depth.

[0026] Optionally, cutting the circuit board to be processed according to the cutting parameters and the bevel parameters to obtain a first circuit board includes:

[0027] According to the cutting parameters, the circuit board to be processed is fixed on the cutting equipment for cutting to obtain the cut circuit board;

[0028] The cut circuit boards are screened according to the bevel edge parameters to obtain a first circuit board.

[0029] Optionally, preprocessing the first circuit board to obtain a preprocessed first circuit board includes:

[0030] Deburring the first circuit board to obtain a flat first circuit board;

[0031] The flat first circuit board is cleaned to obtain a pre-treated first circuit board.

[0032] Optionally, electroplating the pretreated first circuit board to obtain a second circuit board includes:

[0033] Determining electroplating parameters according to the pretreated first circuit board;

[0034] The pre-treated first circuit board is electroplated according to the electroplating parameters to obtain a second circuit board.

[0035] Optionally, determining electroplating parameters according to the pretreated first circuit board includes:

[0036] Determining a current density according to the pretreated first circuit board and a target electroplating current;

[0037] According to the current density, target electroplating layer thickness, preset coefficient and , get the electroplating time;

[0038] Determining electroplating parameters according to the current density and the electroplating time;

[0039] Wherein, t is the electroplating time, W is the target electroplating layer thickness, J is the current density, and k is the preset coefficient.

[0040] Optionally, obtaining a target beveled edge circuit board according to preset detection conditions and the second circuit board includes:

[0041] Performing appearance inspection on the second circuit board to obtain an appearance inspection result;

[0042] Performing a function test on the second circuit board to obtain a function test result;

[0043] The second circuit board is screened according to the preset detection conditions, the appearance detection result and the function detection result to obtain a target bevel edge circuit board.

[0044] A second aspect of the present invention provides a beveled circuit board, wherein the beveled circuit board is prepared by the method for preparing the beveled circuit board as described in the first aspect.

[0045] The above solution of the present invention includes at least the following beneficial effects:

[0046] The above scheme of the present invention determines the gold finger target data through the provided circuit board to be processed, and then determines the bevel parameters and cutting parameters and cuts the circuit board to be processed, and then obtains the target bevel circuit board by pre-processing, electroplating and testing the circuit board, which not only improves the production efficiency of the target bevel circuit board, but also can improve the product quality and reliability of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 It is a schematic flow chart of a method for preparing a beveled edge circuit board in an embodiment of the present invention. DETAILED DESCRIPTION

[0048] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0049] like Figure 1 As shown, an embodiment of the present invention provides a method for preparing a beveled edge circuit board, comprising the following steps:

[0050] Step 101, providing a circuit board to be processed;

[0051] Step 102, determining the gold finger target data according to the circuit board to be processed;

[0052] Step 103, determining bevel parameters and cutting parameters according to the golden finger target data;

[0053] Step 104, cutting the circuit board to be processed according to the cutting parameters and the bevel parameters to obtain a first circuit board;

[0054] Step 105, preprocessing the first circuit board to obtain a preprocessed first circuit board;

[0055] Step 106, electroplating the pretreated first circuit board to obtain a second circuit board;

[0056] Step 107, obtaining a target beveled edge circuit board according to preset detection conditions and the second circuit board.

[0057] The method for preparing a beveled circuit board proposed in an embodiment of the present invention determines the gold finger target data by providing a circuit board to be processed, and then determines the bevel parameters and cutting parameters and performs cutting processing on the circuit board to be processed, and then obtains the target beveled circuit board by pre-processing, electroplating and testing the circuit board, which not only improves the production efficiency of the target beveled circuit board, but also improves the product quality and reliability of the circuit board. In an optional embodiment of the present invention, step 101 includes:

[0058] Step 1011, providing a circuit board;

[0059] Specifically, the provided circuit boards may be provided in a variety of thicknesses and materials for subsequent selection and processing.

[0060] Step 1012, screening the circuit boards to obtain circuit boards to be processed.

[0061] Specifically, the thickness range of the circuit board that can be beveled is 1.2mm to 2.4mm. If the thickness of the circuit board is not within this range, the bevel treatment may not be performed or the treatment effect may be unsatisfactory. In addition, if there are pollutants on the surface of the circuit board, it may affect the quality of the subsequent bevel treatment and the electrical performance of the gold finger. In order to withstand the mechanical stress during the bevel treatment of the gold finger and the wear during plugging and unplugging, the material used for the circuit board should have good conductivity and mechanical strength. Therefore, from the provided circuit boards, circuit boards with a thickness range of 1.2mm to 2.4mm and made of copper-plated boards or composite boards can be screened out, and they can be cleaned and treated to ensure that the surface of the circuit board is clean, flat, and free of pollutants such as oil and dust. The cleaned circuit board is used as the circuit board to be processed for subsequent treatment.

[0062] In an optional embodiment of the present invention, step 102 includes:

[0063] Step 1021, determining the target type of the gold finger according to the circuit board to be processed and the target function data;

[0064] Specifically, making gold fingers on a circuit board can improve the efficiency and reliability of the circuit board's transmission of current and signals, and improve the circuit board's heat dissipation performance. Therefore, before cutting the circuit board, it is necessary to determine the target type and basic data of the gold fingers, so as to accurately perform subsequent processing on the circuit board and improve the performance of the circuit board. The types of gold fingers include conventional gold fingers (flush fingers), long and short gold fingers (uneven gold fingers), segmented gold fingers (intermittent gold fingers), arc type, straight line type or double-sided type, etc. The target type of gold fingers needs to be determined based on the length, width, shape, thickness, etc. of the circuit board to be processed and the target function data of the circuit board to be processed. Among them, the target function data refers to the functions of the circuit board required by the user, such as the target function data of the circuit board is a storage device for high-speed data transmission, etc.

[0065] In a specific embodiment, the length of the circuit board to be processed is 150 mm, the width is 100 mm, the shape is rectangular, the thickness is 1.6 mm, and the target functional data is that the network card needs to be stably connected to the slot on the motherboard to achieve the transmission of network communication data. Considering that the length-to-width ratio of the network card circuit board is moderate and a stable connection is required, the target type of the gold finger is a conventional gold finger (flush finger). This type of gold finger is arranged in a neat manner on the edge of the circuit board, and the length and width are the same as the rectangular pad, which can provide a stable electrical connection. Depending on the specific application scenario and needs, the target type of the gold finger can be different.

[0066] Step 1022, determining basic data of the gold finger according to the circuit board to be processed and the target connection data;

[0067] Specifically, the basic data of the gold fingers generally include the number, arrangement, position, length, width, etc. of the gold fingers, which can be determined according to the length, width, shape, thickness, etc. of the circuit board to be processed and the target connection data of the circuit board to be processed, wherein the target connection data refers to the connection requirement data of the circuit board, that is, which external device the circuit board will be used to connect to.

[0068] In a specific embodiment, the length of the circuit board to be processed is 200 mm, the width is 150 mm, the shape is rectangular, the thickness is 1.6 mm, and the target connection data is that the circuit board needs to transmit data and supply power to an external device (such as another circuit board, processor, memory, etc.). Considering the rate and stability of data transmission, the gold finger needs to have good conductivity and contact reliability, and the power supply part needs to withstand a large current, so the width and number of the gold fingers need to be appropriately increased. For example, according to the above target connection data, the circuit board to be processed requires 8 gold fingers for data transmission and 4 gold fingers for power supply, so the number of gold fingers is 12; the arrangement is: the data transmission gold fingers are arranged in a single row and are located on one side of the circuit board, and the power supply gold fingers are arranged in double rows and are located on the other side of the circuit board to disperse the current load; Position: The data transmission gold fingers are located on one edge of the circuit board, close to the data interface, and the power supply gold fingers are located on the other edge of the circuit board, close to the power interface; Length: The length of the data transmission gold fingers is 20mm to provide sufficient contact area and stable connection, and the length of the power supply gold fingers is 25mm to withstand a larger current load; Width: The width of the data transmission gold fingers is 2mm to ensure good conductivity and signal integrity, and the width of the power supply gold fingers is 4mm to withstand a larger current load and reduce resistance.

[0069] Step 1023, determining the cheating target data according to the cheating basic data and the cheating target type.

[0070] Specifically, the gold finger target data includes the basic data and target type of the gold finger. According to these data, it is convenient to determine the parameters for processing the circuit board in the future to improve production efficiency and meet the expected functions and user needs of the circuit board. Here, the gold finger target data can also include the bevel angle, which can be determined according to the type of circuit board to be processed, the target material of the gold finger, the expected number of plug-ins and unplugs, and the expected service life. For example, if the type of circuit board to be processed is a memory stick, the target material of the gold finger is a gold-plated copper alloy, the expected number of plug-ins and unplugs is greater than 10,000 times, and the expected service life is greater than 5 years, then the corresponding bevel angle is 45 degrees. The reasons are as follows: The main function of the memory stick gold finger is to connect the motherboard slot to achieve rapid data transmission. The gold finger needs to have good electrical conductivity and plug-in performance to ensure data stability and reliability; the gold-plated copper alloy has good electrical conductivity and wear resistance, and the bevel treatment can reduce friction and wear during plug-in and unplugging, and extend the service life of the gold finger; the expected number of plug-ins and unplugs reaches more than 10,000 times, requiring the gold finger to have good wear resistance and durability. The selection of the bevel angle needs to take into account the friction and wear during plug-in and unplugging to ensure that the gold finger can still maintain good electrical conductivity after long-term use. Based on the above reasons, 45 degrees is selected as the bevel angle of the gold finger. This angle can ensure good conductivity while reducing friction and wear during plugging and unplugging. It can also provide sufficient contact area to ensure a stable connection between the gold finger and the motherboard slot. Other angles (ranging from 15 degrees to 45 degrees) can also be selected according to actual needs, such as 20 degrees, 30 degrees, etc.

[0071] In an optional embodiment of the present invention, step 103 includes:

[0072] Step 1031, determining the bevel angle according to the golden finger target data;

[0073] Specifically, the cheating target data may include a bevel angle, so the bevel angle may be directly extracted from the cheating target data, for example, the bevel angle is 45 degrees.

[0074] Step 1032, determining the bevel depth according to the gold finger target data and the bevel angle;

[0075] Specifically, the bevel depth can be calculated based on the length and bevel angle in the gold finger target data. The formula is: , where d is the hypotenuse depth, L is the length in the gold finger target data, For example, if the length of the gold finger target data is 20 mm and the bevel angle is 45 degrees, the bevel depth can be calculated to be about 7.07 mm according to the above formula. However, considering that the bevel depth in actual operation usually does not reach half of the gold finger length, and a certain margin needs to be left to avoid damaging the circuit structure, the actual bevel depth may be adjusted according to the specific situation. For example, in this embodiment, the calculated bevel depth of 7.07 mm can be adjusted to 1 mm.

[0076] Step 1033: Determine the bevel parameters according to the bevel angle and the bevel depth.

[0077] Specifically, the bevel parameters include the bevel angle and the bevel depth, which are mainly used to determine qualified circuit boards by checking whether the gold fingers on the circuit boards meet the bevel parameters after the circuit boards are cut.

[0078] In an optional embodiment of the present invention, step 103 includes:

[0079] Step 1034, obtaining a cutting path and a bevel depth according to the gold finger target data;

[0080] Specifically, the bevel depth can be calculated and adjusted in the above-mentioned manner. The cutting path needs to be determined according to the type, arrangement and position of the gold finger in the gold finger target data. If the gold finger is arranged along the edge of the circuit board, the cutting path will be carried out along the length direction of the gold finger. Among them, if the type of the gold finger is a conventional gold finger (flush finger), the corresponding cutting path can be relatively simple, because the gold finger is flush, and there is no need to consider additional space or angle, just ensure that the cutting path will not damage the gold finger; if the type of the gold finger is a long and short gold finger (uneven gold finger), special attention should be paid to the length difference of the gold finger to ensure that the cutting path will not shorten or damage any gold finger to adapt to the unevenness of the gold finger; if the type of the gold finger is a segmented gold finger (intermittent gold finger), the cutting path needs to avoid the intermittent part of the gold finger to ensure the integrity and function of the gold finger. At this time, an additional support structure can be designed at the discontinuity of the gold finger to prevent the gold finger from being damaged during the cutting process. If the gold fingers are arranged in a single row, the cutting path can be relatively linear. Since the gold fingers are only arranged on one side, it is necessary to ensure that the cutting path does not affect the arrangement and position of the gold fingers. The cutting path needs to avoid the position of the gold fingers to prevent damage. Additional support structures or cutting paths can be designed around the gold fingers to ensure the safety of the gold fingers.

[0081] Step 1035, obtaining a cutting speed according to the gold finger target data and the circuit board to be processed;

[0082] Specifically, the cutting speed needs to be determined according to the material of the circuit board to be processed, the thickness of the gold finger in the gold finger target data, the material and performance of the cutting tool, etc. In a specific embodiment, the material of the circuit board to be processed is FR-4 epoxy resin glass fiber board, the thickness of the gold finger in the gold finger target data is 15μm, the material of the cutting tool is a diamond-coated blade, and the performance of the cutting tool is high hardness, high wear resistance and high cutting efficiency. The corresponding cutting speed can be 1000 revolutions per minute (RPM) to ensure the stability and accuracy of the cutting process, avoid cracks or damage to the circuit board to be processed during the cutting process, avoid uneven thickness of the gold finger, and ensure the stability and economy of the cutting process.

[0083] Step 1036, determining a cutting depth according to the bevel depth;

[0084] Specifically, the cutting depth needs to be equal to or greater than the bevel depth to ensure that the bevel of the gold finger can be fully formed. If the bevel depth is 1mm, the cutting depth should also be set to 1mm or slightly larger (such as 1.1mm) to ensure the integrity of the cutting.

[0085] Step 1037, determining cutting parameters according to the cutting path, the cutting speed and the cutting depth.

[0086] Specifically, the cutting parameters include cutting path, cutting speed and cutting depth, which are used for subsequent accurate cutting of the circuit board to obtain a circuit board that meets expected requirements.

[0087] In an optional embodiment of the present invention, step 104 includes:

[0088] Step 1041, fixing the circuit board to be processed on a cutting device for cutting according to the cutting parameters to obtain a cut circuit board;

[0089] Specifically, the cutting parameters can be converted into a format to obtain cutting control parameters that meet the requirements of the cutting equipment (such as a drilling machine or a laser cutting machine), and the cutting control parameters can be input into the controller of the cutting equipment. The circuit board to be processed can be placed on the cutting base plate of the cutting equipment, and the circuit board to be processed can be fixed with a clamp or adhesive to avoid deviation or shaking during the cutting process. The cutting equipment is then started to cut the circuit board to form gold fingers on the circuit board to facilitate subsequent electroplating and other treatments on the gold fingers.

[0090] Step 1042: Screen the cut circuit boards according to the bevel edge parameters to obtain a first circuit board.

[0091] Specifically, a goniometer can be placed vertically on the bevel of the gold finger on the cut circuit board to ensure that the goniometer is in close contact with the surface of the gold finger, and the angle value displayed by the goniometer can be read. If the angle value is consistent with the bevel angle of the bevel parameter or the error is within the preset angle error range, it means that the cut circuit board meets the expected requirements; use a microscope or optical projector to observe the cutting edge of the gold finger on the cut circuit board to ensure that the observation angle and lighting conditions are appropriate, and use the magnification function of the microscope or projector to accurately measure the depth of the gold finger. If the depth of the gold finger is consistent with the bevel depth of the bevel parameter or the error is within the preset depth error range, it means that the cut circuit board meets the expected requirements; if the angle value and depth of the gold finger on the cut circuit board meet the expected requirements, the corresponding cut circuit board is the first circuit board. Otherwise, the cut circuit board needs to be reworked, repaired, etc. to improve the product qualification rate.

[0092] In an optional embodiment of the present invention, step 105 includes:

[0093] Step 1051, deburring the first circuit board to obtain a flat first circuit board;

[0094] Specifically, a deburring tool may be used to deburr the bevel of the gold finger on the first circuit board to ensure that the bevel is flat and smooth without protrusions or flaws, so as to prevent the safety of the circuit board from being affected by the burrs.

[0095] Step 1052: Clean the flat first circuit board to obtain a pre-treated first circuit board.

[0096] Specifically, a cleaning agent is used to clean the gold finger on the flat first circuit board to remove oil, dust and impurities on the surface, and ensure that the surface cleanliness of the gold finger meets the preset cleanliness to improve the effect of subsequent electroplating. Here, sulfuric acid or other cleaning agents can be used to wash away the oxide layer on the surface of the gold finger, and then water and deionized water are used to clean the surface of the gold finger to ensure that there is no oil, dust and impurities.

[0097] In an optional embodiment of the present invention, step 106 includes:

[0098] Step 1061, determining electroplating parameters according to the pretreated first circuit board;

[0099] Specifically, the electroplating parameters mainly include current density and electroplating time. The current density and electroplating time will affect the electroplating effect and can be determined based on the surface area of ​​the gold finger on the first circuit board after pretreatment.

[0100] Step 1062, electroplating the pre-treated first circuit board according to the electroplating parameters to obtain a second circuit board.

[0101] Specifically, electroplating the pretreated first circuit board can form a gold layer on the surface of the gold finger, thereby significantly improving the conductivity, corrosion resistance, and wear resistance of the gold finger, as well as improving the appearance and texture, reducing wear and damage during the plugging and unplugging process, reducing signal loss and interference, extending the service life of the circuit board, and improving reliability. Here, the pretreated first circuit board can be placed in the electroplating tank to ensure that the gold finger is completely immersed in the electroplating solution in the electroplating tank, and the power supply is turned on. The electroplating treatment is performed according to the current density and electroplating time in the electroplating parameters. After the electroplating is completed, the surface of the circuit board can be cleaned with deionized water to remove residual electroplating solution and impurities.

[0102] In an optional embodiment of the present invention, step 1061 includes:

[0103] Step 10611, determining a current density according to the pretreated first circuit board and a target electroplating current;

[0104] Specifically, the surface area of ​​the gold finger on the first circuit board after pretreatment, the target electroplating current and the formula The current density is calculated, where J is the current density, M is the surface area of ​​the gold finger, and S is the target electroplating current. If the material of the gold finger on the first circuit board after pretreatment is copper, the surface area is 2 , the target plating current is 0.5A, then the current density .

[0105] Step 10612, according to the current density, target electroplating layer thickness, preset coefficient and , get the electroplating time;

[0106] Specifically, since the electroplating time is usually measured in minutes or hours, and a certain electroplating current and time need to be maintained during the electroplating process, the actual electroplating time may be adjusted according to the performance of the electroplating equipment and the requirements of the electroplating solution, such as adjusting the electroplating time to 5 minutes to 2 hours, depending on the performance of the electroplating equipment and the required thickness of the electroplating layer.

[0107] Step 10613, determining electroplating parameters according to the current density and the electroplating time;

[0108] Where t is the plating time, W is the target plating thickness (the required plating thickness), J is the current density, and k is a preset coefficient (such as 0.6).

[0109] Specifically, the electroplating parameters include current density and electroplating time, and may also include pH value and temperature of the electroplating solution.

[0110] In an optional embodiment of the present invention, step 107 includes:

[0111] Step 1071, performing appearance inspection on the second circuit board to obtain an appearance inspection result;

[0112] Specifically, during appearance inspection, it is necessary to ensure that the inspection environment is well-lit and clean, avoid dust or debris interfering with the appearance inspection results, and use tools such as a magnifying glass or a microscope to perform appearance inspection on the second circuit board; you can also use a standard (i.e., a circuit board that meets the preset inspection conditions) circuit board appearance inspection sample as a comparison and reference.

[0113] In a specific embodiment, the surface of the second circuit board and the gold finger can be inspected to see whether it is flat, smooth, and whether there are obvious scratches, depressions or protrusions within the range of light intensity of 800 to 1200 Lux. A magnifying glass or microscope can be used to inspect whether the edge of the gold finger on the second circuit board is smooth, whether there are burrs or rough edges, whether the coating is uniform, whether there is copper exposure, nickel exposure or coating shedding, whether there are defects such as oxidation, stains or residual glue on the surface, and a measuring tool can be used to inspect whether the length, width, thickness and position of the gold finger on the second circuit board conform to the corresponding length, width, thickness and position in the gold finger target data. Each appearance inspection result is recorded in the appearance inspection table of the appearance inspection result, and the appearance inspection result may include information such as defect type, location, size and quantity. For example, an appearance inspection result is: there are 2 obvious scratches on the gold finger on the second circuit board, 1 area has burrs, the number is 5, the length is 20 mm, and the width is 5 mm.

[0114] Step 1072, performing a function test on the second circuit board to obtain a function test result;

[0115] Specifically, the second circuit board can be functionally tested in the following ways: use a resistance tester to measure the resistance value of the gold finger on the second circuit board when it contacts other electronic devices; immerse the gold finger on the second circuit board in a salt spray test chamber and conduct a corrosion resistance test for a certain period of time; use a multimeter to test the conductivity of the gold finger, including the transmission of current and voltage; perform a peel strength test on the gold finger on the second circuit board to check the adhesion between the coating and the substrate. All test results are recorded in the functional test results. For example, a specific functional test result is: the resistance value of the gold finger on the second circuit board when it contacts other electronic devices, corrosion resistance results, current and voltage transmission, peel strength results, etc.

[0116] Step 1073, screening the second circuit board according to the preset detection conditions, the appearance detection result and the function detection result to obtain a target beveled edge circuit board.

[0117] Specifically, the preset detection conditions are the criteria for screening the second circuit board, and only the second circuit board that fully meets the preset detection conditions can be used as the target bevel circuit board, that is, a qualified product. Here, the preset detection conditions may include: the appearance detection conditions are that the number of scratches on the gold finger is less than 1, there is no burr, the number of gold fingers is consistent with the number in the gold finger target data, the length of the gold finger is consistent with the length in the gold finger target data, the width of the gold finger is consistent with the width in the gold finger target data, the thickness of the gold finger is consistent with the thickness in the gold finger target data, and the position of the gold finger is consistent with the position in the gold finger target data; the functional detection conditions are the standard resistance value of the gold finger on the second circuit board when it contacts other electronic devices, good corrosion resistance, good transmission of current and voltage, peeling strength standard, etc. If the appearance detection result meets the appearance detection condition and the functional detection result meets the functional detection condition, the corresponding second circuit board can be used as a qualified product, that is, a target bevel circuit board. In this way, the second circuit board that does not meet the preset detection conditions can be reworked and repaired until it is qualified, which is conducive to improving the product qualification rate and ensuring product quality.

[0118] A specific embodiment of the method for preparing a beveled edge circuit board according to the embodiment of the present invention includes:

[0119] Step 111, providing a circuit board to be processed;

[0120] The multiple circuit boards provided are screened, and the circuit boards that meet the circuit board thickness range of 1.2mm to 2.4mm and meet the preset material etc. are selected as the circuit boards to be processed for subsequent processing to improve the effect of subsequent processing.

[0121] Step 112, determining the gold finger target data;

[0122] The gold finger target data includes the target type of the gold finger, such as conventional gold finger (flush finger), long and short gold finger (uneven gold finger), segmented gold finger (intermittent gold finger), arc type, straight line type or double-sided type, etc.; it also includes the basic data of the gold finger, such as the number, arrangement, position, length, width, etc. of the gold finger; it can also include the bevel angle.

[0123] Step 113, determining bevel parameters and cutting parameters;

[0124] Bevel parameters such as bevel angle and bevel depth are determined according to the gold finger target data, and are used to determine qualified circuit boards by checking whether the gold fingers on the circuit boards meet the bevel parameters after the circuit boards are cut. In addition, cutting parameters such as cutting path, cutting speed and cutting depth need to be determined according to the gold finger target data and the circuit boards to be processed, so that the cutting equipment can cut the circuit boards according to the cutting parameters and form gold fingers on the circuit boards.

[0125] Step 114, cutting process;

[0126] The cutting parameters are format-converted and input into the controller of the cutting device, so that the cutting device cuts the fixed circuit board to be processed, and then detects it according to the bevel parameters to obtain the first circuit board.

[0127] Step 115, pre-processing;

[0128] The first circuit board is deburred to prevent the burrs from affecting the safety of the circuit board during use; the circuit board is then cleaned to ensure that it is free of oil, dust and impurities.

[0129] Step 116, electroplating treatment;

[0130] According to the determined electroplating parameters such as current density and electroplating time, the first circuit board is placed in the electroplating solution in the electroplating tank for electroplating. After the electroplating is completed, the surface of the circuit board can be cleaned with deionized water to remove residual electroplating solution and impurities.

[0131] Step 117, detecting and obtaining the target beveled edge circuit board.

[0132] The electroplated circuit boards are subjected to appearance inspection and functional inspection. Only circuit boards that fully meet the preset inspection conditions can be packaged and sent to customers as qualified products, thereby improving customer satisfaction and product quality.

[0133] The method for preparing a beveled circuit board in an embodiment of the present invention ensures that the corresponding processing parameters meet the expected requirements or the expected functions of the circuit board in each step, and performs multiple tests and screenings, which can greatly improve the quality and pass rate of the circuit board, and improve product reliability and user satisfaction. The beveled circuit board in this embodiment mainly refers to a circuit board obtained by beveling the gold finger portion on the circuit board. Gold fingers refer to metal interfaces processed on the edge of a circuit board, which are used for connection and communication in electronic products. A circuit board with beveled gold fingers can increase the contact area, reduce contact resistance, and improve the plug-in force and contact stability of the circuit board.

[0134] An embodiment of the present invention further provides a beveled circuit board, which is prepared by the beveled circuit board preparation method as described in any one of the above embodiments.

[0135] The beveled edge circuit board of this embodiment is prepared by using the beveled edge circuit board preparation method described in any one of the above embodiments, and has the advantages of a simple preparation method and a high product qualification rate.

[0136] It should be noted that in the apparatus and method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present invention. In addition, the steps of performing the above series of processes can naturally be performed in chronological order according to the order of description, but do not necessarily need to be performed in chronological order. Some steps can be performed in parallel, crosswise or independently of each other.

[0137] It should be noted that, in the above-mentioned embodiments, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "include one..." do not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the implementation of the above-mentioned embodiments is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0138] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for preparing a beveled edge circuit board, characterized in that: include: Providing circuit boards to be processed; Determine the gold finger target data according to the circuit board to be processed; Determine the bevel parameters and cutting parameters according to the golden finger target data; Cutting the circuit board to be processed according to the cutting parameters and the bevel parameters to obtain a first circuit board; Preprocessing the first circuit board to obtain a preprocessed first circuit board; Performing electroplating on the pretreated first circuit board to obtain a second circuit board; A target beveled edge circuit board is obtained according to the preset detection conditions and the second circuit board.

2. The method for preparing a beveled edge circuit board according to claim 1, characterized in that: According to the circuit board to be processed, determining the gold finger target data includes: Determine the target type of the gold finger according to the circuit board to be processed and the target function data; Determine the basic data of the gold finger according to the circuit board to be processed and the target connection data; The golden finger target data is determined according to the golden finger basic data and the golden finger target type.

3. The method for preparing a beveled edge circuit board according to claim 1, characterized in that: According to the golden finger target data, the bevel parameters are determined, including: Determine the bevel angle according to the golden finger target data; Determine the bevel depth according to the golden finger target data and the bevel angle; A bevel parameter is determined according to the bevel angle and the bevel depth.

4. The method for preparing a beveled edge circuit board according to claim 1, characterized in that: According to the gold finger target data, the cutting parameters are determined, including: According to the golden finger target data, a cutting path and a bevel depth are obtained; Obtaining a cutting speed according to the gold finger target data and the circuit board to be processed; Determining a cutting depth according to the bevel depth; Cutting parameters are determined according to the cutting path, the cutting speed and the cutting depth.

5. The method for preparing a beveled edge circuit board according to claim 1, characterized in that: The circuit board to be processed is cut according to the cutting parameters and the bevel parameters to obtain a first circuit board, including: According to the cutting parameters, the circuit board to be processed is fixed on the cutting equipment for cutting to obtain the cut circuit board; The cut circuit boards are screened according to the bevel edge parameters to obtain a first circuit board.

6. The method for preparing a beveled edge circuit board according to claim 1, characterized in that: Preprocessing the first circuit board to obtain a preprocessed first circuit board includes: Deburring the first circuit board to obtain a flat first circuit board; The flat first circuit board is cleaned to obtain a pre-treated first circuit board.

7. The method for preparing a beveled edge circuit board according to claim 1, characterized in that: The pre-treated first circuit board is electroplated to obtain a second circuit board, comprising: Determining electroplating parameters according to the pretreated first circuit board; The pre-treated first circuit board is electroplated according to the electroplating parameters to obtain a second circuit board.

8. The method for preparing a beveled edge circuit board according to claim 7, characterized in that: Determining electroplating parameters according to the pretreated first circuit board includes: Determining a current density according to the pretreated first circuit board and a target electroplating current; According to the current density, target electroplating layer thickness, preset coefficient and , get the electroplating time; Determining electroplating parameters according to the current density and the electroplating time; Wherein, t is the electroplating time, W is the target electroplating layer thickness, J is the current density, and k is the preset coefficient.

9. The method for preparing a beveled edge circuit board according to claim 1, characterized in that: According to the preset detection conditions and the second circuit board, a target beveled edge circuit board is obtained, including: Performing appearance inspection on the second circuit board to obtain an appearance inspection result; Performing a function test on the second circuit board to obtain a function test result; The second circuit board is screened according to the preset detection conditions, the appearance detection result and the function detection result to obtain a target bevel edge circuit board.

10. A beveled edge circuit board, characterized in that: The beveled edge circuit board is prepared by the beveled edge circuit board preparation method according to any one of claims 1 to 9.

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