The bonding and imprinting method of the display panel and the display panel

Abstract

This disclosure provides a bonding and imprinting method for a display panel and a display panel in the field of optoelectronic manufacturing technology. The bonding and imprinting method includes: providing an article comprising a carrier plate and at least one light-emitting core disposed on the carrier plate; fabricating an imprinting template, the surface of which has at least one imprinting protrusion, wherein the arrangement of the imprinting protrusions on the imprinting template is the same as the arrangement of the light-emitting core; coating a color-conversion material layer on the imprinting protrusions of the imprinting template, wherein the color-conversion material layer on different types of imprinting protrusions is used to convert incident light into light of different colors; and bonding the color-conversion material layer on the imprinting template to each light-emitting core of the article. This disclosure can reduce the manufacturing difficulty and cost of display panels.

Description

Technical Field

[0001] This disclosure relates to the field of optoelectronic manufacturing technology, and in particular to a bonding and imprinting method for a display panel and a display panel. Background Technology

[0002] Micro LED display panels have unparalleled advantages in terms of luminous efficiency, power consumption, contrast ratio, response speed, and lifespan. A micro LED display panel typically consists of a carrier substrate and multiple pixels arranged in an array on the substrate. Each pixel is a micrometer-sized LED chip.

[0003] In related technologies, when manufacturing display panels, laser mass transfer is typically used to transfer LED chips of different emitting colors to corresponding positions on a carrier board, thereby achieving full-color display of the display panel.

[0004] However, laser mass transfer mainly relies on laser stripping and laser transfer, which are relatively complex and difficult to perform, thus easily leading to poor transfer accuracy. Summary of the Invention

[0005] This disclosure provides a bonding and imprinting method for a display panel and a display panel itself, which can reduce the manufacturing difficulty and cost of the display panel. The technical solution is as follows:

[0006] This disclosure provides a bonding and imprinting method for a display panel, the bonding and imprinting method comprising: providing an article, the article including a carrier plate and at least one light-emitting core disposed on the carrier plate; fabricating an imprinting template, the surface of the imprinting template having at least one imprinting protrusion, wherein one arrangement of the imprinting protrusions on the imprinting template is the same as one arrangement of the light-emitting core; coating a color-conversion material layer on the imprinting protrusions of the imprinting template, wherein the color-conversion material layer on different types of imprinting protrusions is used to convert incident light into light of different colors; and bonding the color-conversion material layer on the imprinting template to each light-emitting core of the article.

[0007] In another implementation of this disclosure, the fabrication of the imprint template includes: preparing a first substrate, the surface of which has at least one groove, wherein the arrangement of the grooves on the first substrate is the same as the arrangement of the light-emitting core; coating a quantum dot layer on the surface of a second substrate; bonding the surface of the second substrate having the quantum dot layer to the surface of the first substrate having the groove, such that the quantum dot layer is embedded in the groove, controlling the bonding pressure to be 100 kg to 3000 kg, controlling the bonding temperature to be 50 °C to 200 °C, and controlling the bonding time to be 2 min to 100 min; and after curing the quantum dot layer, forming the imprint protrusion on the second substrate to obtain the imprint template.

[0008] In another implementation of this disclosure, a plurality of first light-emitting cores, a plurality of second light-emitting cores, and a plurality of third light-emitting cores are arranged at intervals on the carrier plate, and the first, second, and third light-emitting cores emit the same color. The surface of the imprinting template has a plurality of first imprinting protrusions, a plurality of second imprinting protrusions, and a plurality of third imprinting protrusions arranged at intervals. The arrangement of the first imprinting protrusions on the imprinting template is the same as the arrangement of the first light-emitting cores on the carrier plate, and the arrangement of the second imprinting protrusions on the imprinting template is the same as the arrangement of the second light-emitting cores on the carrier plate. The arrangement of the third embossing protrusions on the embossing template is the same as that of the third light-emitting core on the carrier plate; the surface of the first substrate has a plurality of first grooves, a plurality of second grooves and a plurality of third grooves arranged at intervals, the arrangement of the first grooves on the first substrate is the same as that of the first light-emitting core on the carrier plate, the arrangement of the second grooves on the first substrate is the same as that of the second light-emitting core on the carrier plate, and the arrangement of the third grooves on the first substrate is the same as that of the third light-emitting core on the carrier plate.

[0009] In another implementation of this disclosure, after controlling the bonding time of the first substrate and the second substrate, the method further includes: controlling the first substrate and the second substrate to cool to below 25°C to solidify the quantum dot layer.

[0010] In another implementation of the present disclosure, the preparation of the first substrate includes: etching the first groove, the second groove and the third groove on the surface of a silicon substrate to obtain the first substrate, wherein the groove depth of the first groove, the second groove and the third groove is 20 μm to 40 μm.

[0011] In another implementation of the present disclosure, the length of the first groove is 45 μm to 65 μm and the width of the first groove is 20 μm to 40 μm; the length of the second groove is 45 μm to 65 μm and the width of the second groove is 20 μm to 40 μm; the length of the third groove is 45 μm to 65 μm and the width of the third groove is 20 μm to 40 μm.

[0012] In another implementation of this disclosure, coating a color-changing material layer on at least two types of embossing protrusions of the embossing template includes: coating a first quantum dot material layer on the first embossing protrusion, the first quantum dot material layer being used to convert incident light of a first color into light of a second color; coating a second quantum dot material layer on the second embossing protrusion, the second quantum dot material layer being used to convert incident light of the first color into light of a third color; and coating a third quantum dot material layer on the third embossing protrusion, the third quantum dot material layer being used to convert incident light of the first color into light of a fourth color.

[0013] In another implementation of the present disclosure, bonding the color-changing material layer on the imprint template to each of the light-emitting core particles of the article includes: bonding the first imprint protrusion coated with the first quantum dot material layer to the first light-emitting core particle; bonding the second imprint protrusion coated with the second quantum dot material layer to the second light-emitting core particle; and bonding the third imprint protrusion coated with the third quantum dot material layer to the third light-emitting core particle.

[0014] In another implementation of the present disclosure, the preparation of the article includes: bonding the electrodes of the first light-emitting core, the second light-emitting core, and the third light-emitting core to the surface of the carrier plate, and controlling the surfaces of the first light-emitting core, the second light-emitting core, and the third light-emitting core that are away from the electrodes to face away from the carrier plate.

[0015] This disclosure provides a display panel fabricated using the bonding and imprinting method described above. The display panel includes: a carrier plate, a plurality of first light-emitting particles, a plurality of second light-emitting particles, and a plurality of third light-emitting particles. The plurality of first light-emitting particles, the plurality of second light-emitting particles, and the plurality of third light-emitting particles are arranged alternately on the carrier plate. The first light-emitting particles, the second light-emitting particles, and the third light-emitting particles emit the same color. A first quantum dot material layer is provided on the surface of the first light-emitting particles away from the carrier plate. The first quantum dot material layer is used to convert incident light of a first color into light of a second color. A second quantum dot material layer is provided on the surface of the second light-emitting particles away from the carrier plate. The second quantum dot material layer is used to convert incident light of a first color into light of a third color. A third quantum dot material layer is provided on the surface of the third light-emitting particles away from the carrier plate. The third quantum dot material layer is used to convert incident light of a first color into light of a fourth color.

[0016] The beneficial effects of the technical solutions provided in this disclosure include at least the following:

[0017] The bonding and imprinting method provided in this disclosure first produces an article in which each luminescent core has a consistent luminescent color. Then, an imprinting template is created, and imprinting protrusions corresponding one-to-one with the luminescent cores on the article are formed on the template. Next, different color-transfer material layers are coated onto the different types of imprinting protrusions on the imprinting template. Finally, the color-transfer material layers on the imprinting protrusions are bonded to the luminescent cores using the imprinting template, thereby forming different color-transfer material layers on all the luminescent cores.

[0018] Different types of embossed protrusions have color-transfer material layers that convert incident light into different colors. Each light-emitting core emits light, which is then converted into other colors by the color-transfer material layers, achieving full-color display. Compared to related technologies that use laser mass transfer to transfer light-emitting cores of different colors onto a substrate, this disclosure avoids laser mass transfer and instead uses bonding embossing to form different color-transfer material layers on the light-emitting cores, achieving the same full-color display. Therefore, it effectively reduces the manufacturing difficulty and cost of the display panel, and the bonding embossing method ensures that the color-transfer material layers are accurately bonded to the designed areas, thus guaranteeing the accuracy of the three-color pattern on the product and improving the manufacturing yield of the display panel. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a flowchart of a bonding and imprinting method for a display panel provided in an embodiment of this disclosure;

[0021] Figure 2 This is a schematic diagram of the structure of an article provided in an embodiment of this disclosure;

[0022] Figure 3 This is a state diagram of the fabrication of a first substrate provided in an embodiment of this disclosure;

[0023] Figure 4 This is a bonding state diagram of a first substrate and a second substrate provided in an embodiment of this disclosure;

[0024] Figure 5 This is a schematic diagram of an embossing template provided in an embodiment of this disclosure;

[0025] Figure 6 This is a state diagram of coating quantum dot material on an embossed protrusion according to an embodiment of the present disclosure;

[0026] Figure 7 This is a schematic diagram of a display panel provided in an embodiment of this disclosure.

[0027] The markings in the diagram are explained as follows:

[0028] 10. Carrier plate;

[0029] 11. First light-emitting core; 12. Second light-emitting core; 13. Third light-emitting core; 14. Electrode;

[0030] 20. Imprinting template; 21. First imprinting protrusion; 22. Second imprinting protrusion; 23. Third imprinting protrusion;

[0031] 201. Second substrate; 202. Quantum dot layer;

[0032] 30. Color-changing material layer; 31. First quantum dot material layer; 32. Second quantum dot material layer; 33. Third quantum dot material layer;

[0033] 40. First substrate; 41. First groove; 42. Second groove; 43. Third groove;

[0034] 50. Mask. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0036] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” “top,” and “bottom,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0037] Figure 1 This is a flowchart of a bonding and imprinting method for a display panel provided in an embodiment of this disclosure. Figure 1 As shown, the bonding imprinting method includes:

[0038] Step S11: Provide an article.

[0039] The product includes a carrier plate 10 and at least one light-emitting core disposed on the carrier plate 10.

[0040] For example, the article includes a carrier plate 10 and a plurality of first light-emitting cores 11, a plurality of second light-emitting cores 12 and a plurality of third light-emitting cores 13 arranged at intervals on the carrier plate 10, wherein the first light-emitting cores 11, the second light-emitting cores 12 and the third light-emitting cores 13 emit the same light color.

[0041] Step S12: Create the embossing template 20.

[0042] The embossing template 20 has at least one embossing protrusion on its surface, and the arrangement of the embossing protrusion on the embossing template 20 is the same as the arrangement of the light-emitting core.

[0043] For example, the surface of the embossing template 20 has a plurality of first embossing protrusions 21, a plurality of second embossing protrusions 22 and a plurality of third embossing protrusions 23 arranged at intervals. The arrangement of the first embossing protrusions 21 on the embossing template 20 is the same as the arrangement of the first light-emitting core 11 on the carrier plate. The arrangement of the second embossing protrusions 22 on the embossing template 20 is the same as the arrangement of the second light-emitting core 12 on the carrier plate. The arrangement of the third embossing protrusions 23 on the embossing template 20 is the same as the arrangement of the third light-emitting core 13 on the carrier plate.

[0044] Step S13: Apply a color-changing material layer 30 to the embossing protrusions of the embossing template 20.

[0045] Among them, the color-changing material layer 30 on different types of embossed protrusions is used to convert incident light into light of different colors.

[0046] Step S14: Bond the color-transfer material layer 30 on the imprinting template 20 to each light-emitting core of the product.

[0047] The bonding and imprinting method provided in this embodiment first produces an article with each light-emitting core having a consistent light-emitting color. Then, an imprinting template 20 is fabricated, forming first imprinting protrusions 21 corresponding to the first light-emitting core 11 on the article, second imprinting protrusions 22 corresponding to the second light-emitting core 12, and third imprinting protrusions 23 corresponding to the third light-emitting core 13. Next, different color-transfer material layers 30 are coated onto the different types of imprinting protrusions in the imprinting template 20. Finally, the color-transfer material layers 30 on the first imprinting protrusions 21 are bonded to the first light-emitting core 11, the color-transfer material layers 30 on the second imprinting protrusions 22 are bonded to the second light-emitting core 12, and the color-transfer material layers 30 on the third imprinting protrusions 23 are bonded to the third light-emitting core 13 using the imprinting template 20, thus forming different color-transfer material layers 30 on all the light-emitting cores.

[0048] The color-conversion material layers 30 on different types of imprinted protrusions are used to convert incident light into different colors. Thus, after each light-emitting core emits light, it is converted into other colors by the color-conversion material layers 30, achieving full-color display. Compared to related technologies that use laser mass transfer to transfer light-emitting cores of different colors onto the carrier substrate 10, this disclosure avoids laser mass transfer and instead uses bonding imprinting to form different color-conversion material layers 30 on the light-emitting cores, achieving the same full-color display. Therefore, it effectively reduces the manufacturing difficulty and cost of the display panel, and the bonding imprinting method ensures that the color-conversion material layers 30 are accurately bonded to the designed areas, thereby ensuring the accuracy of the three-color pattern on the product and improving the manufacturing yield of the display panel.

[0049] Optionally, step S11 may include: bonding the electrodes 14 of the first light-emitting core 11, the second light-emitting core 12, and the third light-emitting core 13 to the surface of the carrier plate 10, and controlling the surfaces of the first light-emitting core 11, the second light-emitting core 12, and the third light-emitting core 13 that are away from the electrodes 14 to face away from the carrier plate 10.

[0050] Figure 2 This is a schematic diagram of the structure of an article provided in an embodiment of this disclosure. For example... Figure 2 As shown, a first light-emitting core 11, a second light-emitting core 12, and a third light-emitting core 13 are provided on the surface of the carrier plate 10. The electrodes 14 of each light-emitting core are connected to the carrier plate 10.

[0051] In this embodiment, the first light-emitting core 11, the second light-emitting core 12, and the third light-emitting core 13 emit the same color.

[0052] For example, the first light-emitting core 11, the second light-emitting core 12, and the third light-emitting core 13 all emit white light.

[0053] For example, the carrier plate 10 can be a circuit board, and the electrodes 14 of the light-emitting cores are bonded to the surface of the circuit board so as to control the light emission of each light-emitting core through the circuit board.

[0054] Optionally, preparing the imprint template 20 in step S12 may include the following steps:

[0055] The first step is to prepare the first substrate 40.

[0056] The surface of the first substrate 40 has at least one groove, and the arrangement of the grooves on the first substrate 40 is the same as the arrangement of the light-emitting core.

[0057] Specifically, this may include etching a first groove 41, a second groove 42 and a third groove 43 on the surface of a silicon substrate to obtain a first substrate 40.

[0058] Figure 3 This is a state diagram of the fabrication of a first substrate 40 provided in an embodiment of this disclosure. (As shown...) Figure 3 As shown, an array pattern is fabricated on a silicon substrate using an ultraviolet light irradiation mask 50.

[0059] In this embodiment of the disclosure, the first substrate 40 is a silicon substrate, and an array pattern is formed on the silicon substrate by ultraviolet light etching.

[0060] Optionally, such as Figure 3 As shown, the array pattern on the surface of the first substrate 40 includes a plurality of first grooves 41, a plurality of second grooves 42 and a plurality of third grooves 43 arranged at intervals.

[0061] For example, the arrangement of the first groove 41 on the first substrate 40 is the same as the arrangement of the first light-emitting core 11 on the carrier plate, the arrangement of the second groove 42 on the first substrate 40 is the same as the arrangement of the second light-emitting core 12 on the carrier plate, and the arrangement of the third groove 43 on the first substrate 40 is the same as the arrangement of the third light-emitting core 13 on the carrier plate.

[0062] For example, the groove depths of the first groove 41, the second groove 42, and the third groove 43 are 20 μm to 40 μm.

[0063] As an example, the groove depths of the first groove 41, the second groove 42, and the third groove 43 are 30 μm.

[0064] For example, the length of the first groove 41 is 45 μm to 65 μm, and the width of the first groove 41 is 20 μm to 40 μm.

[0065] As an example, the length of the first groove 41 is 55 μm and the width of the first groove 41 is 30 μm.

[0066] For example, the length of the second groove 42 is 45 μm to 65 μm, and the width of the second groove 42 is 20 μm to 40 μm.

[0067] As an example, the length of the second groove 42 is 55 μm and the width of the second groove 42 is 30 μm.

[0068] For example, the length of the third groove 43 is 45 μm to 65 μm, and the width of the third groove 43 is 20 μm to 40 μm.

[0069] As an example, the length of the third groove 43 is 55 μm and the width of the third groove 43 is 30 μm.

[0070] It should be noted that the first groove 41, the second groove 42 and the third groove 43 can be set according to the actual size of the light-emitting core on the product, and this embodiment does not impose any restrictions.

[0071] The second step is to coat a quantum dot layer 202 on the surface of the second substrate 201.

[0072] For example, the second substrate 201 may be a sapphire substrate.

[0073] Figure 4 This is a bonding state diagram of a first substrate 40 and a second substrate 201 provided in an embodiment of this disclosure. Figure 4 As shown, quantum dot material is spin-coated onto the surface of a sapphire substrate.

[0074] The third step, as Figure 4As shown, the surface of the second substrate 201 with the quantum dot layer 202 is bonded to the surface of the first substrate 40 with the groove, such that the quantum dot layer 202 is embedded in the first groove 41, the second groove 42 and the third groove 43.

[0075] Optionally, when bonding the first substrate 40 and the second substrate 201, the bonding pressure is controlled to be 100 kg to 3000 kg, the bonding temperature is controlled to be 50 °C to 200 °C, and the bonding time is controlled to be 2 min to 100 min.

[0076] For example, when bonding the first substrate 40 and the second substrate 201, the bonding pressure is controlled at 500 kg, the bonding temperature is controlled at 100 °C, and the bonding time is controlled at 20 min.

[0077] Step four, as Figure 5 As shown, after the quantum dot layer 202 is solidified, a first imprinting protrusion 21, a second imprinting protrusion 22 and a third imprinting protrusion 23 are formed on the second substrate 201 to obtain an imprinting template 20.

[0078] For example, curing the quantum dot layer 202 may include controlling the first substrate 40 and the second substrate 201 to cool to below 25°C in order to cure the quantum dot layer 202.

[0079] During the bonding process, the quantum dot layer 202 coated on the second substrate 201 is still a fluid liquid quantum dot. Therefore, during bonding, the quantum dot layer 202 can flow into each groove, and after curing, the quantum dots can form the required imprint protrusions according to the shape of each groove.

[0080] Optionally, steps S13 to S14 may include the following steps:

[0081] Figure 6 This is a state diagram of coating quantum dot material on an embossed protrusion according to an embodiment of the present disclosure.

[0082] First step, such as Figure 6 As shown in the first attached figure on the left, a first quantum dot material layer 31 is coated on the first embossed protrusion 21.

[0083] The first quantum dot material layer 31 is used to convert incident light of the first color into light of the second color.

[0084] For example, the first quantum dot material layer 31 may be a blue quantum dot material layer.

[0085] The second step is to bond the first imprinted protrusion 21 coated with the first quantum dot material layer 31 to the first light-emitting core 11.

[0086] like Figure 6As shown in the first attached figure on the right, after the first quantum dot material layer 31 is bonded to the first light-emitting core 11, the light emitted from the first light-emitting core 11 is converted from the first color to blue light, thus obtaining the blue light core.

[0087] The third step, as Figure 6 As shown in the second attached figure on the left, a second quantum dot material layer 32 is coated on the second embossed protrusion 22.

[0088] The second quantum dot material layer 32 is used to convert incident light of the first color into light of the third color.

[0089] For example, the second quantum dot material layer 32 may be a green quantum dot material layer.

[0090] The fourth step is to bond the second imprinted protrusion 22 coated with the second quantum dot material layer 32 to the second light-emitting core 12.

[0091] like Figure 6 As shown in the first attached figure on the right, after the second quantum dot material layer 32 is bonded to the second light-emitting core 12, the light emitted from the second light-emitting core 12 changes from the first color to green light, thus obtaining the green light core.

[0092] Fifth step, as Figure 6 As shown in the third figure on the left, a third quantum dot material layer 33 is coated on the third imprinted protrusion 23.

[0093] The third quantum dot material layer 33 is used to convert incident light of the first color into light of the fourth color.

[0094] For example, the third quantum dot material layer 33 may be a red quantum dot material layer.

[0095] The sixth step is to bond the third imprinted protrusion 23 coated with the third quantum dot material layer 33 to the third light-emitting core 13.

[0096] like Figure 6 As shown in the first attached figure on the right, after the third quantum dot material layer 33 is bonded to the third luminescent core 13, the light emitted from the third luminescent core 13 changes from the first color to red light, thus obtaining the red light core.

[0097] Figure 7 This is a schematic diagram of a display panel provided in an embodiment of this disclosure. The display panel is fabricated using the bonding and imprinting method described above.

[0098] like Figure 7As shown, the display panel includes: a carrier plate 10, a plurality of first light-emitting cores 11, a plurality of second light-emitting cores 12 and a plurality of third light-emitting cores 13. The plurality of first light-emitting cores 11, a plurality of second light-emitting cores 12 and a plurality of third light-emitting cores 13 are arranged alternately on the carrier plate 10, and the first light-emitting cores 11, the second light-emitting cores 12 and the third light-emitting cores 13 emit the same color.

[0099] like Figure 7 As shown, the surface of the first light-emitting core 11 away from the carrier plate 10 has a first quantum dot material layer 31, which is used to convert incident light of the first color into light of the second color.

[0100] like Figure 7 As shown, the second light-emitting core 12 has a second quantum dot material layer 32 on its surface away from the carrier plate 10. The second quantum dot material layer 32 is used to convert the incident first color light into third color light.

[0101] like Figure 7 As shown, the surface of the third light-emitting core 13 away from the carrier plate 10 has a third quantum dot material layer 33, which is used to convert the incident first color light into fourth color light.

[0102] In this embodiment, the first light-emitting core 11, the second light-emitting core 12, and the third light-emitting core 13 all have the same structure.

[0103] Taking the first light-emitting chip 11 as an example, the first light-emitting chip 11 includes an epitaxial layer, a first electrode 14 and a second electrode 14. The epitaxial layer typically includes a first semiconductor layer, a multiple quantum well layer and a second semiconductor layer stacked sequentially. The second semiconductor layer has a groove that exposes the first semiconductor layer.

[0104] The first electrode 14 is located on the surface of the second semiconductor layer, and the second electrode 14 is located in the groove and connected to the first semiconductor layer.

[0105] Optionally, one of the first semiconductor layer and the second semiconductor layer is a p-type layer, and the other of the first semiconductor layer and the second semiconductor layer is an n-type layer.

[0106] For example, the p-type layer includes a p-type GaN layer.

[0107] The multiple quantum well layer may include alternating InGaN quantum well layers and GaN quantum barrier layers. The first light-emitting layer may include 3 to 8 alternating stacked InGaN quantum well layers and GaN quantum barrier layers.

[0108] For example, the n-type layer includes an n-type GaN layer.

[0109] Optionally, the thickness of the first light-emitting core 11 is 2 μm to 10 μm.

[0110] For example, the carrier plate 10 can be a circuit board, and the electrodes 14 of the light-emitting cores are bonded to the surface of the circuit board so as to control the light emission of each light-emitting core through the circuit board.

[0111] For example, the surface of the first light-emitting core 11 is bonded with a first quantum dot material layer 31. After the light emitted from the first light-emitting core 11 passes through the first quantum dot material layer 31, it can be converted from the first color to blue light, thus obtaining a blue light core.

[0112] For example, the first quantum dot material layer 31 may be a blue quantum dot material layer.

[0113] For example, the surface of the second light-emitting core 12 is bonded with a second quantum dot material layer 32. After the light emitted from the second light-emitting core 12 passes through the second quantum dot material layer 32, it can be converted from the first color to green light, thus obtaining a green light core.

[0114] For example, the second quantum dot material layer 32 may be a green quantum dot material layer.

[0115] For example, the surface of the third light-emitting core 13 is bonded with a third quantum dot material layer 33. The light emitted from the third light-emitting core 13 can be converted from the first color to red light after passing through the third quantum dot material layer 33, thus obtaining a red light core.

[0116] Among them, the third quantum dot material layer 33 can be a red light quantum dot material layer.

[0117] Optionally, the display panel may also include a driver integrated circuit (IC), with the driver IC located on the carrier board.

[0118] The driver IC is located on a carrier board and electrically connected to the carrier board via driver traces. The electrodes of the multiple light-emitting chips are also electrically connected to the driver traces on the carrier board. In this way, the driver IC can control each light-emitting chip through the driver traces.

[0119] The above is not intended to limit this disclosure in any way. Although this disclosure has been disclosed above through embodiments, it is not intended to limit this disclosure. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this disclosure. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this disclosure without departing from the content of the technical solution of this disclosure shall still fall within the scope of the technical solution of this disclosure.

Claims

1. A bonding and imprinting method for a display panel, characterized in that, The bonding imprinting method includes: An article is provided, the article comprising a carrier plate (10) and at least one light-emitting core disposed on the carrier plate (10); Fabricating an embossing template (20), wherein the surface of the embossing template (20) has at least one embossing protrusion, and the arrangement of the embossing protrusion on the embossing template (20) is the same as the arrangement of the light-emitting core particles. Fabricating the embossing template (20) includes: preparing a first substrate (40), the surface of the first substrate (40) having at least one groove, and the arrangement of the groove on the first substrate (40) being the same as the arrangement of the light-emitting core particles; coating a quantum dot layer (202) on the surface of a second substrate (201); bonding the surface of the second substrate (201) having the quantum dot layer (202) to the surface of the first substrate (40) having the groove, such that the quantum dot layer (202) is embedded in the groove; and curing the quantum dot layer (202) to form the embossing protrusion on the second substrate (201) to obtain the embossing template (20). A color-changing material layer (30) is coated on the embossing protrusions of the embossing template (20). The color-changing material layer (30) on different types of embossing protrusions is used to convert incident light into light of different colors. The color-changing material layer (30) on the imprint template (20) is bonded to each light-emitting core of the article.

2. The bonding imprinting method according to claim 1, characterized in that, When bonding the second substrate (201) to the first substrate (40), the bonding temperature is controlled to be 50°C to 200°C, and the bonding time is controlled to be 2 min to 100 min.

3. The bonding imprinting method according to claim 2, characterized in that, On the carrier plate (10), a plurality of first light-emitting core particles (11), a plurality of second light-emitting core particles (12) and a plurality of third light-emitting core particles (13) are arranged at intervals, and the first light-emitting core particles (11), the second light-emitting core particles (12) and the third light-emitting core particles (13) emit the same light color; The embossing template (20) has a plurality of first embossing protrusions (21), a plurality of second embossing protrusions (22) and a plurality of third embossing protrusions (23) arranged at intervals. The arrangement of the first embossing protrusions (21) on the embossing template (20) is the same as the arrangement of the first light-emitting core (11) on the carrier plate (10). The arrangement of the second embossing protrusions (22) on the embossing template (20) is the same as the arrangement of the second light-emitting core (12) on the carrier plate (10). The arrangement of the third embossing protrusions (23) on the embossing template (20) is the same as the arrangement of the third light-emitting core (13) on the carrier plate (10). The surface of the first substrate (40) has a plurality of first grooves (41), a plurality of second grooves (42) and a plurality of third grooves (43) arranged at intervals. The arrangement of the first grooves (41) on the first substrate (40) is the same as the arrangement of the first light-emitting core (11) on the carrier plate (10). The arrangement of the second grooves (42) on the first substrate (40) is the same as the arrangement of the second light-emitting core (12) on the carrier plate (10). The arrangement of the third grooves (43) on the first substrate (40) is the same as the arrangement of the third light-emitting core (13) on the carrier plate (10).

4. The bonding imprinting method according to claim 3, characterized in that, After controlling the bonding time of the first substrate (40) and the second substrate (201), the method further includes: The first substrate (40) and the second substrate (201) are controlled to cool to below 25°C to solidify the quantum dot layer (202).

5. The bonding imprinting method according to claim 3, characterized in that, The fabrication of the first substrate (40) includes: The first groove (41), the second groove (42) and the third groove (43) are etched on the surface of the silicon substrate to obtain the first substrate (40). The groove depth of the first groove (41), the second groove (42) and the third groove (43) is 20 μm to 40 μm.

6. The bonding imprinting method according to claim 3, characterized in that, The length of the first groove (41) is 45 μm to 65 μm, and the width of the first groove (41) is 20 μm to 40 μm; The length of the second groove (42) is 45 μm to 65 μm, and the width of the second groove (42) is 20 μm to 40 μm; The length of the third groove (43) is 45 μm to 65 μm, and the width of the third groove (43) is 20 μm to 40 μm.

7. The bonding imprinting method according to any one of claims 3 to 6, characterized in that, Coating a color-changing material layer (30) onto at least two types of embossing protrusions of the embossing template (20) includes: A first quantum dot material layer (31) is coated on the first embossed protrusion (21), the first quantum dot material layer (31) being used to convert incident light of a first color into light of a second color; A second quantum dot material layer (32) is coated on the second embossed protrusion (22), the second quantum dot material layer (32) being used to convert incident light of the first color into light of the third color; A third quantum dot material layer (33) is coated on the third embossed protrusion (23), the third quantum dot material layer (33) being used to convert incident light of the first color into light of the fourth color.

8. The bonding imprinting method according to claim 7, characterized in that, Bonding the color-transfer material layer (30) on the imprinting template (20) to each light-emitting core of the article includes: The first imprinted protrusion (21) coated with the first quantum dot material layer (31) is bonded to the first light-emitting core (11); The second imprinted protrusion (22) coated with the second quantum dot material layer (32) is bonded to the second light-emitting core (12); The third imprinted protrusion (23) coated with the third quantum dot material layer (33) is bonded to the third light-emitting core (13).

9. The bonding imprinting method according to any one of claims 3 to 6, characterized in that, The preparation of the article includes: The electrodes (14) of the first light-emitting core (11), the second light-emitting core (12) and the third light-emitting core (13) are bonded to the surface of the carrier plate (10), and the surfaces of the first light-emitting core (11), the second light-emitting core (12) and the third light-emitting core (13) away from the electrodes (14) are controlled to face away from the carrier plate (10).

10. A display panel, characterized in that, The display panel is prepared by the bonding and imprinting method as described in any one of claims 1 to 9. The display panel includes: a carrier plate (10), a plurality of first light-emitting particles (11), a plurality of second light-emitting particles (12), and a plurality of third light-emitting particles (13). The plurality of first light-emitting particles (11), the plurality of second light-emitting particles (12), and the plurality of third light-emitting particles (13) are arranged alternately on the carrier plate (10). The first light-emitting particles (11), the second light-emitting particles (12), and the third light-emitting particles (13) have the same light-emitting color. The first light-emitting core (11) has a first quantum dot material layer (31) on its surface away from the carrier plate (10), the first quantum dot material layer (31) being used to convert incident light of a first color into light of a second color; The second light-emitting core (12) has a second quantum dot material layer (32) on its surface away from the carrier plate (10), the second quantum dot material layer (32) being used to convert incident light of the first color into light of the third color; The third light-emitting core (13) has a third quantum dot material layer (33) on its surface away from the carrier plate (10), the third quantum dot material layer (33) being used to convert incident light of the first color into light of the fourth color.

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