Liquid immersion cooling platform with local cooling and fluid quality detection

Through liquid immersion cooling system, computer components are immersed in the diesel current, and the pump and valve system circulating mediatons are used to solve the problem of low efficiency and high energy consumption of traditional cooling systems, and achieve high -efficiency and low energy -consuming cooling effects.

CN119343775APending Publication Date: 2025-01-21TMGCORE LLC
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Patent Information

Application Number
CN202380043007.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2022-05-26
Filing Date
2023-05-26
Publication Date
2025-01-21

AI Technical Summary

Technical Problem

Traditional computing and server systems use air cooling, resulting in low cooling efficiency, high energy consumption and large space occupancy. Existing water-cooled computers avoid direct contact, limiting heat absorption efficiency.

Method used

Design a liquid immersion cooling system, use the diesel current to immerse the computer components in it, use the pump and valve system to circulate medium, use heat exchanges and filters to achieve efficient cooling, and control and control the cooling process through management system monitoring and controlling the cooling process of the cooling process. Essence

Benefits of technology

The system can significantly reduce the energy and space required for cooling, improve the temperature optimization ability of computing equipment, and ensure the efficiency and reliability of the cooling system by filtering and circulating management on demand.

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Abstract

An immersion cooling system and a method for operating the system are described. The system may include a management system including a processor and a memory; a tank configured to hold a thermally conductive dielectric fluid; a computer component configured to be at least partially submerged within the dielectric fluid; and a fluid circulation system comprising a pump and a valve system. In one example embodiment, the management system is configured to instruct the pump and the valve system to draw the dielectric fluid from the storage tank, pass the dielectric fluid through a heat exchanger, and deliver the dielectric fluid back to the storage tank.
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Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Application No. 63 / 346,061, filed on May 26, 2022, the entire disclosure of which is incorporated herein by reference.

[0003] This application is related to PCT publication WO2020 / 102090, entitled “Liquid Immersion Cooling Platform,” owned by TMGCore, LLC and filed on November 11, 2019, which is incorporated herein by reference. Technical Field

[0004] The present invention relates to a liquid immersion cooling system suitable for housing computing equipment, for example, a liquid immersion cooling system including a control system for optimizing the temperature of the system. Background Art

[0005] Conventional computing and / or server systems utilize air to cool the various components of these systems. Conventional liquid or water-cooled computers utilize flowing liquid to draw heat from computer components, but avoid direct contact between the computer components and the liquid itself. The development of non-conductive and / or dielectric fluids has enabled the use of immersion cooling, in which computer components and other electronic devices can be immersed in a dielectric or non-conductive liquid in order to draw heat directly from the components into the liquid. Immersion cooling can be used to reduce the overall energy required to cool computer components, and can also reduce the amount of space and equipment required for adequate cooling. Summary of the invention

[0006] Liquid immersion cooling systems are being implemented for a variety of computing needs. Therefore, it would be beneficial to describe an immersion cooling system that can be readily adapted for localized cooling and on-demand filtration of dielectric fluids.

[0007] Advantageously, the present application relates to an exemplary immersion cooling system and a method for operating the system. In an exemplary embodiment, the system includes: a management system including a processor and a memory; a storage tank that can hold a thermally conductive dielectric fluid; a computer component that can be at least partially immersed in the dielectric fluid; and a fluid circulation system including a pump and a valve system. In this example, the management system can instruct the pump and valve system to draw the dielectric fluid from the storage tank, pass the dielectric fluid through a heat exchanger, and transport the dielectric fluid back to the storage tank.

[0008] In one example, the system may include a sensor, and the management system may receive sensor data from the sensor and instruct the pump and the valve system based on the data. In one example, the sensor data is a fluid level in the storage tank. In one example, the management system may add the dielectric fluid to the storage tank when the sensor data drops below a threshold amount. In one example, the system includes a rack, and the computer component is placed in the rack. In one example, the system includes an RFID tag on the rack or the computer component. In one example, the storage tank includes an RFID scanner, which is configured to transmit or receive radio frequency waves and detect the RFID tag. In one example, the management system is configured to determine the inventory of multiple computer components in the storage tank based on the data detected by the RFID scanner.

[0009] In one example, the rack further includes a fan or a pump, and the fan or the pump is used to circulate the dielectric fluid in the rack. In one example, the sensor data includes the tank temperature of the dielectric fluid in the tank, the rack temperature of the dielectric fluid in the rack, and the computer component temperature of the computer component. In one example, the management system can instruct the pump and the valve system to circulate the dielectric fluid based on the tank temperature, the rack temperature, and the computer component temperature. In one example, the fluid circulation system is configured to circulate the dielectric fluid in at least one of the following loops: a first loop, in which the dielectric fluid can be drawn from the tank and the dielectric fluid can be transported back to the tank; a second loop, in which the dielectric fluid can be drawn from the rack and the dielectric fluid can be transported back to the tank; and a third loop, in which the dielectric fluid can be drawn from the vicinity of the computer component and the dielectric fluid can be transported back to the tank.

[0010] In one example, the fluid circulation system is configured to: when the storage tank temperature exceeds a first threshold value, the fluid circulation system circulates the dielectric fluid in the first loop, the second loop, and the third loop. In one example, the fluid circulation system is configured to: when the rack temperature exceeds a second threshold value, the fluid circulation system circulates the dielectric fluid in the second loop. In one example, the fluid circulation system is configured to: when the computer component temperature exceeds a third threshold value, the fluid circulation system circulates the dielectric fluid in the third loop.

[0011] In one example, the system includes an overflow pan extending below the storage tank. In one example, the overflow pan can collect any dielectric fluid that overflows from the storage tank. In one example, the system includes a fluid sensor (or a marker sensor) in the overflow pan. In one example, the management sensor is configured to shut down the system when the fluid sensor detects an increase in the dielectric fluid level in the overflow tank below a threshold level.

[0012] In one example, the fluid circulation system further includes a plurality of filters, and the valve system is configured to connect each filter to the pump or disconnect each filter from the pump. In one example, the plurality of filters include a coarse filter, a particle filter, or an adsorption filter. In one example, the system includes a sensor system, and the sensor system includes a conductivity sensor, a resistivity sensor, a capacitive sensor, a relative humidity sensor, or a pressure sensor. In one example, the management system is configured to connect or disconnect at least one of the plurality of filters based on sensor data received from the sensor system. In one example, the management system can determine a pressure difference of at least one of the plurality of filters based on the sensor data received from the sensor system. In one example, the management system can determine that at least one of the plurality of filters has failed based on the pressure difference.

[0013] This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to describe the manner in which the above and other advantages and features can be obtained, a more particular description of the subject matter briefly described above will be rendered by reference to specific embodiments that are illustrated in the accompanying drawings. Understanding that these drawings depict only typical embodiments and are therefore not to be considered limiting in scope, the embodiments will be described and explained with additional specificity and detail through the use of the accompanying drawings, in which:

[0015] Figure 1 A liquid immersion cooling system according to an example embodiment of the present disclosure is shown.

[0016] Figure 2 Another liquid immersion cooling system according to an example embodiment of the present disclosure is shown.

[0017] Figure 3 Yet another liquid immersion cooling system according to an example embodiment of the present disclosure is shown.

[0018] Figure 4 An exemplary computer component according to an example embodiment of the present disclosure is shown.

[0019] Figure 5 An exemplary heat transfer system is shown according to an exemplary embodiment.

[0020] Figure 6 Yet another liquid immersion cooling system according to an example embodiment of the present disclosure is shown.

[0021] Throughout the drawings, unless otherwise specified, the same reference numerals and characters are used to represent the same features, elements, components or parts of the illustrated embodiments. In addition, although the present disclosure will now be described in detail with reference to the accompanying drawings, the description of the present disclosure is carried out in conjunction with exemplary embodiments and is not limited to the specific embodiments shown in the drawings and claims. DETAILED DESCRIPTION

[0022] Exemplary embodiments of the present invention will now be described to illustrate the various features of the present invention. The embodiments described herein are not intended to limit the scope of the present invention, but are intended to provide examples of the components, uses, and operations of the present invention.

[0023] Immersion Cooling System

[0024] In an example embodiment, the immersion cooling system or container may include a bath area, a tank area, a weir (e.g., between the bath area and the tank area), a computing device, an optional robot, an optional pressure control system, and a management system. In one example, the container may be a pressure-controlled storage tank maintained at atmospheric pressure (or maintained within the range of atmospheric pressure), and a heat exchanger may be used to cool the storage tank. In another example, the container is not pressure controlled. The computing device may be immersed in the dielectric fluid of the bath area of ​​the container. The computing device may be connected to a network and perform various processing and computing tasks while immersed in the dielectric fluid (or "fluid"). The container may include a lid for entering and exiting the bath area, accessing the computing device, and the tank area.

[0025] In one example, the heat exchanger can be a fluid-to-fluid heat exchanger. For example, the heat exchanger can receive a warm dielectric fluid from the container and simultaneously receive a cold working medium. The heat exchanger can transfer heat from the dielectric fluid to the working medium. In one example, the working medium can be transferred to a cooling device (which can be a field cooling device or a remote cooling device). In another example, the heat exchanger can be a cooling device, such as a heat sink, a refrigerator, a cooler, etc. with or without a fan. In this example, it may not be necessary to cool the working medium, because the heat exchanger can cool the dielectric fluid without transmitting the working medium to another facility. In one example, the heat exchanger can be placed in a storage tank. In another example, the heat exchanger can be placed outside the storage tank.

[0026] In one example, when the lid is open, the robot can lift the computing device from the bathing area of ​​the container. The robot can place the lifted computing device in a bin provided for storing computing devices or on a vehicle. The robot can also lift the computing device from the bin (or vehicle) and place the computing device in place of the computing device lifted from the bathing area. The robot can be attached to the container, vehicle, or other location. In this example embodiment, the container can be a two-phase cooling system. In other example embodiments, the container can be a single-phase cooling system, which may or may not have one or more of the components mentioned above.

[0027] In an example embodiment, the pump can circulate the fluid in the container. For example, the pump can extract the dielectric fluid from the tank area and transfer the fluid to the bath area. Then, the fluid can flow through the weir and return to the tank area. Before the fluid is transferred to the bath area, the pump can circulate the fluid through, for example, a heat exchanger, a filter, various pipelines and valves. The pump can circulate the fluid after receiving an instruction from a management system. In one example, the pump can extract the fluid from the tank area and transfer it to the bath area. In another example, the pump can extract the fluid from the bath area and transfer it to the tank area.

[0028] In one example, the management system can receive data generated by sensors included in the liquid immersion cooling system. In one example, the management system can provide an alarm and / or take another appropriate action, such as shutting down the container based on the sensor reading. For example, the management system can adjust or control the heating element, the pressure in the fluid flow or temperature, the storage tank, the fluid level, the fluid purity and / or any number of other system parameters. This adjustment is usually based on one or more sensed parameters (e.g., parameters detected by the sensor) of the liquid immersion cooling system. The sensed parameters can include, for example, temperature (temperature inside or outside the container), pressure, fluid level (fluid level in the bath or tank area), or the power consumption of the system. In one example, when the fluid level drops below the threshold level, the management system can indicate the pump and / or valve system of the storage tank to allow the addition of dielectric fluid to the storage tank. The dielectric fluid can come from an external storage tank or storage tank.

[0029] In one example embodiment, the immersion cooling system may be a single-phase immersion cooling system. In this example, the dielectric fluid may remain in liquid form throughout the operation of the immersion cooling system. This may be different from a two-phase system, in which the dielectric fluid may evaporate and condense while, for example, cooling computer components.

[0030] In one example, the immersion cooling system may include a tank that holds a certain volume of dielectric fluid. The tank may also be configured to hold computer components. A pump may extract dielectric fluid from the tank area and transfer it to the tank. In this example embodiment, the pump may allow the fluid to flow through the weir and flow into the tank area. In an example embodiment, a liquid immersion cooling system may include a bath area without a tank area. A pump may extract fluid from the bath area and transfer the fluid to, for example, a heat exchanger, a filter, and / or other components. Subsequently, the fluid may return to the bath area (for example, after losing heat in a heat exchanger or cleaning in a filter). In this example embodiment, there may not be any need for the fluid to flow through the weir and flow into the tank area, but in other embodiments. The immersion cooling system may include a weir.

[0031] Figure 1A liquid immersion cooling system 100 is shown according to an example embodiment of the present disclosure. In this example embodiment, the liquid immersion cooling system 100 may include a container 105 and a vehicle 130. The container 105 may include a tank 110, which includes a bath area 111, a tank area 112, a weir 140, a fluid 113, a computer component 114, a pump 115, a filter 118, a door 116, a management system 117, and a heat exchanger 119. The computer component 114 may be immersed in the fluid 113. The vehicle 130 may include an automatic handling machine 131. The automatic handling machine 131 may lift the computer component 114 when the door 116 is opened and place the computer component 114 on the vehicle 130. The fluid 113 may flow through the weir 140 and accumulate in the tank area 112. In one example, pump 115 may draw fluid 113 from tank area 112 and deliver the fluid to bath area 111 after passing the fluid through heat exchanger 119 and filter 118. One of ordinary skill in the art recognizes that an embodiment may include other components or arrangements of components in the fluid delivery and circulation system, such as valves, pipes, etc., which are Figure 1 may not be shown in the exemplary embodiments.

[0032] Figure 2 A liquid immersion cooling system 200 is shown according to an example embodiment of the present disclosure. In this example embodiment, the liquid immersion cooling system 200 may include a tank 210 including a bath area 211, a fluid 213, a computer component 214, a pump 215, a heat exchanger 219, a door 216, and a management system 217. The computer component 214 may be immersed in the fluid 213. In this example embodiment, the tank 210 may not be pressure controlled, but in some other example embodiments, the tank may be pressure controlled. In this example embodiment, the immersion cooling system may be a single-phase system, but in some other example embodiments, the immersion cooling system may be a two-phase system.

[0033] In this example embodiment, pump 215 may receive instructions from management system 217 to draw fluid from bathing area 211 and deliver it to heat exchanger, for example, to maintain the temperature of fluid 213 below a threshold temperature or to cool computer component 214. In response, pump 215 may draw fluid 213 from bathing area 211 and pass fluid 213 through heat exchanger 219. Fluid 213 may then be delivered to bathing area 211. One of ordinary skill in the art will recognize that other embodiments may include additional or fewer components to draw fluid 213 from bathing area 211, and that these components may have different arrangements in different embodiments, for example, a heat exchanger may be placed before pump 215.

[0034] In an example embodiment, the liquid immersion cooling system 200 may include a fluid level sensor 251 and an external reservoir 250. In this example embodiment, the fluid level sensor may detect the fluid level within the reservoir 210 and transmit data to the management system 217. When the fluid level drops below a threshold level, the management system 217 may instruct the pump 215 to draw fluid from the external reservoir 250. In one example, when the fluid level exceeds the threshold level, the management system 217 may instruct the pump 215 to return fluid to the external reservoir 250. In one example, a rack may include a fluid level sensor, and the management system may instruct the pump to draw fluid from (or return fluid to) the external reservoir based on data relayed by the sensor disposed in the rack.

[0035] Local heat dissipation

[0036] In an example embodiment, in addition to circulating the fluid in the bath area, or as an alternative to circulating the fluid in the bath area, various apparatuses can be provided to extract fluid from one or more computer components (such as servers, racks or CPUs) and transfer the fluid to a heat exchanger. In one example, each computer component can be placed in a rack, and the rack can include an input for receiving a dielectric fluid and an output for transferring the fluid to the outside of the rack. In this example, the output of the rack can be fluidically coupled to a heat exchanger or heat absorber (such as, by a hose or a pipe), and optionally, a pump can be provided to extract fluid from the rack. In this example, the computer component can heat the fluid in its vicinity or in the rack, and the pump can extract the fluid. Because the fluid is extracted from an area close to a heat generating component, the pump can extract the hottest fluid and effectively cool the fluid.

[0037] In another example, each computer component (e.g., CPU) may include a component for pumping out fluid (e.g., an input valve, a heat sink, or a metal plate with a liquid input and outlet). This component may be coupled to a heat exchanger using a pump and various pipes or hoses. Thus, the pump may pump out warm fluid from the vicinity of the computer component.

[0038] In another example, heat from computer components can be transferred using heat pipes. In one example, a heat receiving component can be placed above or near the computer components (e.g., the heat receiving component can be thermodynamically coupled to the computer components). The heat receiving component can also be coupled to various heat pipes that can transfer heat from the computer components to a heat sink or radiator that is placed separately from the computer components. In this example, the heat from the computer components can be dissipated where the heat sink or radiator is located.

[0039] Figure 3A liquid immersion cooling system 300 is shown according to an example embodiment of the present disclosure. In this example embodiment, the liquid immersion cooling system 300 may include a tank 310, a fluid 213, a door 316, a management system 217, a pump 215, and a heat exchanger 219. The tank 310 may also include a rack 323 for placing computer components 314. The rack 323 may include an input 321 and an output 322. The fluid 213 may enter the rack 323, for example, through the input 321, and leave the rack through the output 322. In this example, the output is connected to the pump 215, for example, using a pipe. The pump 215 can draw fluid from the tank 310 and pass it to the heat exchanger 219 to cool the fluid 213. Subsequently, the fluid can be passed back to the tank 310. In this example embodiment, the pump 215 can draw fluid 213 from near the computer components 314, thereby being able to cool the hottest fluid 213 in the tank 310.

[0040] In one example embodiment, the rack may include one or more secondary pumps, fans, or any other device that can improve the flow of fluid into or out of the rack (e.g., a pumpless or pumpless air stone bubbler). In another example, the pump or fan may be mounted on or within the vicinity of a computer component. For example, in Figure 3 In the liquid immersion cooling system 300, the rack 323 may include a secondary pump 324 to facilitate the transfer and / or movement of the fluid 213 in the rack 323. The pump 324 may draw fluid from the input 321 and / or push fluid into the rack 323, so that the fluid 213 is transferred from the outside of the rack 323 to the output 322. In this example, the pump 324 may transfer the heat generated by the computer components 314 to the outside of the rack 324 more quickly.

[0041] In an example embodiment, the liquid immersion cooling system 300 may include an overflow pan 360. In the event that there is an overflow of the fluid 213, the fluid may be directed to the overflow pan 360. The overflow pan 360 may prevent the fluid 213 from gushing onto the floor. In an example, the overflow pan 360 may include a fluid sensor 361. The fluid sensor 361 may detect the presence of the fluid 213 in the overflow pan 360. The fluid sensor 361 may transmit data to the management system 217. In an example, the fluid sensor 361 may be a continuous float level sensor, a miniature continuous float level sensor, a miniature side mounted 90 degree float switch, a high level float switch, a low level float switch, a combination of high and low level float switches, an oil-water interface, an adjustable float switch, a side mounted, a multi-point float switch, a visual level indicator, a submersible suspended float switch, an optical liquid level sensor, an oil level sensor, an oil pressure sensor, a conductivity sensor, or a point level sensor.

[0042] If the fluid sensor 361 detects fluid in the overflow pan 360, the management system 217 can transmit a message to the central server indicating a possible leak at the liquid immersion cooling system 300. In one example, if the fluid sensor 361 detects fluid in the overflow pan 360 and detects that the fluid level exceeds a threshold, the management system 217 can send a message indicating that the overflow pan 360 should be emptied or replaced. If the fluid level exceeds a threshold level, or if the fluid level increases by more than a threshold for a given period of time, the management system can detect an active leak. In this case, in one example, the management system can shut down the operation of the liquid immersion cooling system 300. In one embodiment, if the management system 217 detects an active leak, the management system 217 can instruct the pump 215 to return the fluid 213 to the sump 250.

[0043] Figure 4 An exemplary computer component 414 is shown according to an example embodiment of the present disclosure. In this exemplary embodiment, in addition to or in lieu of circulating the fluid in a tank, and / or in addition to or in lieu of circulating the fluid in a rack, the fluid may be circulated in a component attached to the computer component 414. In this example embodiment, the component may be a heat sink 430, which may include an input 421 and an output 422. The fluid 213 may enter the heat sink 430 from the input 421 and leave the heat sink 430 through the output 422. The fluid 213 may be drawn from the output 422, for example, by a pump and various conduits, and provided to a heat exchanger for cooling. In one example, the component attached to the computer component 414 may be an input valve or a housing having an input and an output. In one example embodiment, a fan 415 may be placed on the heat sink 430 to allow additional cooling of the computer component 414. In one example, a heat spreader 416 (or vapor chamber, cold plate, heat pipe, or heat sink) may be provided to transfer heat from computer component 414 to fluid 213 .

[0044] In one example, fluid can be drawn from the vicinity of computer components and cooled at a heat exchanger in a storage tank or rack. For example, a storage tank can include a primary heat exchanger in the storage tank (or, the primary heat exchanger can be outside the storage tank, but the secondary heat exchanger can be inside the storage tank). A pump can draw fluid from the vicinity of computer components and transport it to the heat exchanger in the storage tank. The heat exchanger in the storage tank can be located near an input point for cooled dielectric fluid in, for example, the storage tank.

[0045] In one example embodiment, the liquid immersion cooling system can circulate the fluid in various operating modes. For example, in one operating mode, the pump can circulate the fluid in the tank. In another optional mode, the pump can circulate the fluid in one or more racks. In this mode, the fluid can circulate in a selected number of racks, but other racks may be excluded from such fluid circulation. However, in another optional mode, the pump can circulate the fluid in one or more components attached to one or more computer components. In this mode, the fluid can circulate in a selected number of computer components (or components attached to computer components), but other computer components may be excluded from such fluid circulation. In this example, the management system can instruct the valve system and / or pump to enable the liquid immersion cooling system to operate in one or more of the above operating modes, for example, switching valves between a first loop, a second loop, and / or a third loop, each loop being able to implement fluid circulation for a specific rack and / or computer component and / or multiple racks and / or computer components. In this example, the management system can circulate the fluid in a selective set of individual racks and / or computer components. In another example, the management system can instruct the fluid to circulate in all or multiple racks and / or computer components. In one example, the management system may circulate fluid in a combination of the first circuit, the second circuit, and the third circuit.

[0046] In one example, the management system can receive sensor data indicating that one or more operating modes in the above-mentioned operating modes must be activated. For example, the sensor data can include the temperature of the dielectric fluid in the storage tank, the temperature of one or more racks, and the temperature of one or more computer components. If the management system detects that the temperature or temperature increase exceeds an acceptable threshold value, the management system can instruct the pump and valve to activate one or more circuits in these circuits. For example, if the temperature increase of the rack exceeds an acceptable temperature or the temperature around the rack, the management system can activate the fluid circulation for the rack to maintain the temperature of the rack at an acceptable level. As another example, if the temperature increase of the computer component exceeds an acceptable temperature or the temperature around the computer component, the management system can activate the fluid circulation for the computer component to maintain the temperature of the computer component at an acceptable level. In one example, if the temperature increase of the fluid in the storage tank exceeds a first threshold value, the management system can activate the fluid circulation for the entire storage tank. If the temperature increase of the fluid in the storage tank also exceeds a second threshold value, in addition to the fluid circulation in the storage tank, the management system can also activate the fluid circulation in one or more racks and / or one or more computer components.

[0047] In one example embodiment, the management system can activate a secondary pump within the rack or attached to a computer component based on the temperature of the rack or computer component. For example, if the temperature of the rack or computer component exceeds a threshold, the management system can activate one or more secondary pumps to facilitate rapid heat transfer from the rack or computer component.

[0048] Figure 5 An exemplary heat transfer system 500 is shown according to an example embodiment. In this example embodiment, the heat transfer system 500 may include a heat receiving component 510, which may be thermally coupled to a computer component 514. The heat receiving component 510 may be a thermal interface material, a heat spreader, a cold plate with or without small or micro-channels, a vapor chamber, or a combination of one or more of the foregoing.

[0049] The heat transfer system 500 may also include a heat pipe 515 and a heat sink 520 (or radiator 520). In this example, the heat receiving component 510 may receive heat from the computer component 514 and transfer the heat to the heat sink 520 using the heat pipe 515. The heat sink 520 may be located in a rack where the computer component 514 is placed. The heat sink 520 may also be located in the tank, for example, near a fluid inlet or near a fluid outlet. By using the heat transfer system 500, the heat generated by the computer component 514 may be dissipated elsewhere in the tank.

[0050] In an example embodiment, the liquid immersion cooling system may include one or more of the localized heat dissipation systems described above. For example, a rack may include a pump, a heat transfer system, and a radiator to dissipate the heat.

[0051] RFID Tags

[0052] In one example embodiment, the management system and / or the sub-system may track components installed or operated in an immersion cooling system. In this example embodiment, the management system and / or the sub-system may scan the components, such as using an automated machine or other scanner. In one example, each trackable component, such as a rack or computer component, may have an RFID tag. For example, the management system and / or the sub-system may transmit a radio frequency in a tank and determine which RFID tags are present in the tank. In another example, each trackable component may include a visual barcode, such as a QR code, and the management system and / or the sub-system may scan the visual barcode. In one example, an RFID tag may be placed on a computer component. In another example, an RFID tag may be placed on a rack.

[0053] In one example embodiment, a storage tank may include a robot that can move inside the storage tank or outside the storage tank and can scan each traceable component in the storage tank. For example, the robot can be a gantry robot, or a robot arm on a vehicle, which can move close to each traceable component and scan the component, such as by transmitting or receiving an RF signal. The robot can then transmit the data to a management system. In another example, the storage tank may include one or more scanners within the storage tank, such as each scanner can be located within a certain distance of another scanner. Each scanner can be configured to detect traceable components within its scanning range.

[0054] In one example embodiment, the management system may receive data regarding the temperature of a rack and / or computer component. If the rack or computer component operates above a threshold temperature for longer than a threshold period of time, the management system may infer that the rack and / or computer component requires servicing and / or replacement. In one example, the management system may infer that the rack and / or computer component requires servicing, for example, if the rack and / or computer component operates below a threshold temperature, for example, significantly below the operating temperature of the rack and / or computer component.

[0055] When the management system infers that a rack and / or computer component requires maintenance, the management system can transmit a message to the central server to dispatch, for example, a maintenance robot. Even if the rack or computer component is not damaged, for example, when a monthly or annual maintenance is required, the management system can also transmit a message. In this example embodiment, the maintenance robot can approach the tank and communicate with the management system, such as directly or through a central server. The management system can provide data about the rack and / or computer component that needs maintenance. The data may include identification information (such as an RFID tag) for the rack or computer component and / or its location in the tank. In this example, the maintenance robot can locate the damaged component, for example, using identification or location information or by scanning the RFID tag of the component. The maintenance robot can also be configured to lift the component from the tank.

[0056] Fluid Filters

[0057] In an example embodiment, the liquid immersion cooling system may include one or more filters. The liquid immersion cooling system may also include one or more sensors (e.g., a sensor system including a plurality of sensors) that can detect whether the fluid needs to be filtered. In an example embodiment, each filter can be connected to or disconnected from the fluid line according to the requirements of the management system. For example, each filter can be connected or disconnected based on sensor readings. On-demand filtering can provide several benefits. For example, when the filters can be connected on demand, the pump does not need to pass the dielectric liquid through all the filters all the time. This selective connection of the filters can save power because a lower pressure is required to circulate the fluid in the fluid circulation system. For another example, since each filter can be isolated, the pressure difference of each filter, the temperature of the filter, and / or the conductivity of the filter can be detected over time. This information can indicate whether the filter has failed and therefore needs to be replaced or repaired.

[0058] Figure 6 A liquid immersion cooling system 600 is shown according to an example embodiment of the present disclosure. In this exemplary embodiment, the liquid immersion cooling system 600 may include a sensor system 671, a plurality of filters 672-674, and a plurality of valves 675. During operation of the system 600, the sensor system 671 may detect conditions that may require filtering of the fluid. For example, the sensor system 671 may detect particles, whiskers, plasticizers, or moisture in the fluid 213. The sensor system 671 may communicate this information to the management system 217. In this example, the management system 217 may determine that one or more of the filters 672-674 may be activated or connected to remedy the condition detected by the sensor system 671. Therefore, the management system 217 may instruct one or more of the valves 675 to open or close to direct the fluid 213 to the appropriate direction. In one example, the filter may include a coarse filter, a particle filter, an adsorption filter, and / or a water separator. In one example, the sensor system may include a conductivity sensor, a resistivity sensor, a permittivity sensor, a relative humidity sensor, and / or a pressure sensor.

[0059] In one example, when an adsorption filter (e.g., a carbon or aluminum filter) operates at a suboptimal condition, the conductivity of the filter may decrease. In this example, a conductivity sensor can be used to determine whether the filter needs to be serviced and / or replaced. In an example embodiment, a sensor system can be provided in the storage tank. The sensor system can be, for example, a Raman spectrometer, a humidity sensor, and / or a conductivity sensor. In this example, the sensor system can trigger filtration in the storage tank.

[0060] exist Figure 6In an example embodiment, the management system 217 can isolate each of the filters 672-674. In one example, the management system 217 can record the pressure differential and / or temperature of each filter over time. For example, when each filter is installed, the management system can record the pressure differential and / or temperature of the filter during the operation of the filter. If the change in the pressure differential and / or temperature of the filter exceeds a threshold amount, this may indicate that the filter is not operating as expected, such as a filter failure. In this example embodiment, the management system can transmit a message to the central server informing that the filter must be replaced and / or requires maintenance. In some embodiments, if a particular filter fails, the management system can stop the operation of the system to prevent damage to the computer component 214. In an example embodiment, if the change in the pressure differential and / or temperature of the filter is less than another threshold amount, this may indicate that the filter is not operating as expected.

[0061] In an exemplary embodiment, the liquid immersion cooling system may include one or more filtration circuits. Each filtration circuit may draw fluid from a storage tank and circulate the fluid through one or more filters and / or other components, such as pumps, heat exchangers, sensors, etc. Figure 6 In the exemplary embodiment, there are two exemplary filter loops. One exemplary filter loop may include filters 672-674. The filter loop may also include pump 215, heat exchanger 219 and various sensors, such as temperature and pressure sensors. The second filter loop may include filter 681. In this exemplary embodiment, the second filter loop may also include valve 682, various pipes, pumps and sensors ( Figure 6 672-674 of the first circuit is not operating properly, or when another condition is met. By using multiple filter circuits, the liquid immersion cooling system can provide redundancy. For example, in one example, even if one filter fails, the system can still operate while the failed filter is replaced because the filters are set on separate circuits.

[0062] In the foregoing description, various embodiments have been described with reference to the accompanying drawings. However, it will be apparent that various modifications and variations may be made thereto, and additional embodiments may be implemented, without departing from the broader scope of the invention as set forth in the appended claims. Accordingly, the description and drawings are to be regarded as illustrative rather than restrictive.

Claims

1. A system comprising: A management system, the management system comprising a processor and a memory; a tank configured to hold a thermally conductive dielectric fluid; a computer component configured to be at least partially immersed in the dielectric fluid; and a fluid circulation system, the fluid circulation system comprising a pump and a valve system; The management system is configured to instruct the pump and the valve system to extract the dielectric fluid from the storage tank, pass the dielectric fluid through a heat exchanger, and transport the dielectric fluid back to the storage tank.

2. The system according to claim 1, further comprising a sensor, wherein: The management system is configured to receive sensor data from the sensor and to instruct the pump and the valve system based on the data.

3. The system according to claim 2, wherein: The sensor data is the fluid level in the tank.

4. The system according to claim 3, wherein: The management system is configured to add the dielectric fluid to the storage tank when the sensor data drops below a threshold amount.

5. The system of claim 2, further comprising a rack, wherein: The computer components are placed in the rack.

6. The system of claim 5, further comprising an RFID tag on the rack or the computer component.

7. The system according to claim 6, wherein: The storage tank includes an RFID scanner configured to transmit or receive radio frequency waves and detect the RFID tag.

8. The system according to claim 7, wherein: The management system is configured to determine an inventory of a plurality of computer components in the storage tank based on data detected by the RFID scanner.

9. The system according to claim 5, wherein: The rack also includes a heat transfer system including a heat receiving component, a heat pipe, and a heat sink, wherein the heat receiving component is thermodynamically coupled to the computer component and is configured to transfer heat from the computer component to the heat sink using the heat pipe.

10. The system according to claim 5, wherein: The frame also includes a fan or pump for circulating the dielectric fluid within the frame.

11. The system according to claim 5, wherein: The sensor data includes a tank temperature of the dielectric fluid in the tank, a rack temperature of the dielectric fluid in a rack, and a computer component temperature of the computer component.

12. The system according to claim 11, wherein: The management system is configured to instruct the pump and the valve system to circulate the dielectric fluid based on the storage tank temperature, the rack temperature, and the computer component temperature.

13. The system according to claim 11, wherein: The fluid circulation system is configured to circulate the dielectric fluid in at least one of the following loops: a first loop in which the dielectric fluid is drawn from the storage tank and transported back to the storage tank; a second circuit in which the dielectric fluid is drawn from the rack and transported back to the tank; and A tertiary loop in which the dielectric fluid is drawn away from the vicinity of the computer components and transported back to the storage tank.

14. The system according to claim 13, wherein: The fluid circulation system is configured to circulate the dielectric fluid in the first circuit, the second circuit, and the third circuit when the tank temperature exceeds a first threshold.

15. The system of claim 13, wherein: The fluid circulation system is configured to circulate the dielectric fluid in the second loop when the rack temperature exceeds a second threshold.

16. The system of claim 13, wherein: The fluid circulation system is configured to circulate the dielectric fluid in the third loop when the temperature of the computer component exceeds a third threshold.

17. The system of claim 1 further comprising an overflow pan extending below the storage tank.

18. The system of claim 17, wherein: The overflow pan is configured to collect any dielectric fluid that overflows from the tank.

19. The system of claim 17, further comprising a fluid sensor in the overflow pan.

20. The system of claim 19, wherein: The management sensor is configured to shut down the system when the fluid sensor detects an increase in the dielectric fluid level in the overflow tank below a threshold level.

21. The system of claim 1, wherein: The fluid circulation system also includes a plurality of filters, and the valve system is configured to connect each filter to the pump or disconnect each filter from the pump.

22. The system of claim 21, wherein: The plurality of filters include a coarse filter, a particulate filter, or an adsorption filter.

23. The system of claim 21, further comprising a sensor system comprising a conductivity sensor, a resistivity sensor, a permittivity sensor, a relative humidity sensor, or a pressure sensor.

24. The system of claim 23, wherein: The management system is configured to connect or disconnect at least one filter of the plurality of filters based on sensor data received from the sensor system.

25. The system of claim 23, wherein: The management system is configured to determine a pressure differential of at least one filter of the plurality of filters based on sensor data received from the sensor system.

26. The system of claim 25, wherein: The management system is configured to determine that the at least one filter of the plurality of filters has failed based on the pressure differential.

27. The system of claim 23, wherein: The management system is configured to determine a conductivity of at least one filter of the plurality of filters based on sensor data received from the sensor system.

Citation Information

Patent Citations

  • Liquid immersion cooling platform

    WO2020102090A1