Composite protection method for electronic product

Abstract

The invention relates to an electronic product composite protection method, and belongs to the field of electronic product protection. Comprising seven steps of shell prefabrication, dip-coating, coating curing, dispensing, silica gel curing, shell cementation and cementation curing, and the electronic product obtained through the method can effectively overcome the defects of large weight, complex technological process, poor maintainability and large force and heat influence caused by a traditional silicon rubber and epoxy resin overall potting protection method; and the defects of weak protection function and insufficient reliability caused by a common simple three-proofing paint spraying and dispensing protection process can also be avoided.

Description

Technical Field

[0001] The invention belongs to the field of electronic product protection, and in particular relates to a composite protection method for electronic products. Background Art

[0002] The control components on missile weapons and equipment, such as onboard computers and flight controllers, are the core components for controlling the flight posture of missiles and achieving precision strikes. These components integrate a large number and variety of electronic components. When these components are directly exposed to the outside, they are very likely to fail due to external impact, vibration, collision, or corrosive gases and liquids, which will cause the entire weapon system to lose its combat capability. There are currently two basic methods for protecting such products:

[0003] The first type is to use three-proof paint (such as acrylic polyurethane varnish) to spray the PCB board to achieve the three-proof purpose, and then use silicone rubber or epoxy glue to reinforce the pins of key components to improve the product's ability to resist impact and vibration. This type of protection method can give the product basic protection capabilities, but if it encounters accidental bumps or corrosive gases (liquids), the risk of product failure is extremely high.

[0004] The second type is to use epoxy resin, silicone rubber or polyurethane foam materials to pot the product as a whole. This method can give the product strong protection, but the process is complicated and the maintainability is poor. At the same time, the potting material will produce large mechanical stress or thermal stress during the curing process, which makes the product quality fluctuate greatly and the process cost is high.

[0005] Based on the above reasons, the present invention has carried out research on a new type of composite protection process, which shortens the process flow, reduces the development cost, and ensures that the product has high reliability and quality consistency while meeting the higher protection requirements of the product. Summary of the invention

[0006] 1. Technical issues to be resolved

[0007] The technical problem to be solved by the present invention is to provide a composite protection method for electronic products to solve the problems of high failure risk and high process cost of existing protection methods.

[0008] (II) Technical solution

[0009] In order to solve the above technical problems, the present invention provides a composite protection method for electronic products, comprising the following steps:

[0010] Step 1: Model the PCB board to obtain a proportional three-dimensional model, and design the outer protective shell of the PCB board according to the three-dimensional model structure;

[0011] Step 2: Measure about 500 mL of nano-hydrophobic protective agent in a container, immerse the entire PCB board in the nano-hydrophobic protective agent, take it out after immersion for 3 minutes, and let it stand at room temperature;

[0012] Step 3: Place the PCB board dipped in the nano-hydrophobic protective agent at room temperature, place it horizontally on a clean table and cure it for 1 hour to form an ultra-thin transparent protective film layer on the surface of the product;

[0013] Step 4: Use a 10mL syringe to fill the single-component silicone rubber and apply the silicone rubber near the four corners of the electronic components on the PCB board;

[0014] Step 5: Place the glue-protected PCB horizontally on a clean workbench and cure it at room temperature for 24 hours;

[0015] Step 6: Use a 10mL syringe to fill the single-component silicone rubber, apply the silicone rubber to the edge of the outer protective shell prefabricated by 3D printing, and bond and package it with the prepared PCB board to form an integrated protective layer;

[0016] Step 7: Place the PCB board bonded to the outer protective shell in step 6 horizontally at room temperature for curing for 48 hours, and remove the silicone rubber burrs that overflow around it.

[0017] The outer protective shell in step 1 is configured as a single-sided honeycomb lightweight structure, the outer side of which is a closed plane and the inner side has an opening;

[0018] The outer protective shell is formed by a selective laser sintering process, and the material is engineering plastic nylon powder.

[0019] Wherein, when applying glue to electronic components in step 4, priority is given to applying silicone rubber protection to electronic components that are susceptible to mechanical impact, and the application height is no more than 1 / 3 of the component height.

[0020] The electronic components susceptible to mechanical impact include ball grid array devices and small outline integrated circuits.

[0021] (III) Beneficial effects

[0022] Compared with the prior art, the present invention has the following beneficial effects: the structure of the protective shell adopts a unidirectional honeycomb lightweight design to reduce its own weight, the raw material adopts high-performance engineering plastic nylon powder to give the protective shell good structural strength and corrosion resistance, and the molding method adopts selective laser sintering process preforming to shorten the process preparation time. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a flow chart of the method of the present invention;

[0024] Figure 2 This is a protection case diagram of the present invention. DETAILED DESCRIPTION

[0025] In order to make the purpose, content, and advantages of the present invention more clear, the specific implementation methods of the present invention are further described in detail below in conjunction with the accompanying drawings and examples.

[0026] This embodiment provides a composite protection method for electronic products, comprising the following steps:

[0027] 1) Prefabricated shell: First, the PCB board is modeled to obtain a proportional three-dimensional model, and then the outer protective shell structure is designed according to the model structure. The solid part is designed as a single-sided honeycomb lightweight structure with a closed plane on the outside and an open hole on the inside. The shell material is selected from engineering plastic nylon powder to add structural strength and corrosion resistance;

[0028] 2) Dip coating: Take about 500 mL of nano-hydrophobic protective agent in a container, immerse the entire PCB board in the nano-hydrophobic protective agent, take it out after immersion for 3 minutes, and let it stand at room temperature;

[0029] 3) Coating curing: Place the PCB board dipped in the nano-hydrophobic protective agent at room temperature and place it horizontally on a clean table for curing for 1 hour, so that an ultra-thin transparent protective film layer is formed on the surface of the product to achieve the purpose of insulating the circuit board, moisture-proof, dust-proof, salt spray-proof, and mildew-proof;

[0030] 4) Dispensing: Use a 10mL syringe to fill the single-component silicone rubber, and apply silicone rubber near the four corners of electronic components that are susceptible to mechanical impact, such as ball grid array devices and small outline integrated circuits, for protection. The dispensing height should not exceed 1 / 3 of the component height;

[0031] 5) Silicone curing: Place the PCB board with good glue protection horizontally on a clean workbench and cure it at room temperature for 24 hours to ensure that the silicone rubber is completely bonded;

[0032] 6) Shell bonding: Use a 10mL syringe to fill the single-component silicone rubber, apply silicone rubber on the edge of the outer protective shell prefabricated by 3D printing, and bond and package it with the prepared PCB board to form an integrated protective layer.

[0033] 7) Glue bonding and curing: Place the successfully bonded product horizontally at room temperature for 48 hours to ensure that the protective shell and the PCB are completely bonded. Use a scalpel to remove the silicone rubber burrs that overflow around the product. Finally, the electronic product with composite protection by this method is obtained, such as Figure 2 Case shown.

[0034] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A composite protection method for electronic products, characterized in that: The following steps are involved: Step 1: Model the PCB board to obtain a proportional three-dimensional model, and design the outer protective shell of the PCB board according to the three-dimensional model structure; Step 2: Measure about 500 mL of nano-hydrophobic protective agent in a container, immerse the entire PCB board in the nano-hydrophobic protective agent, take it out after immersion for 3 minutes, and let it stand at room temperature; Step 3: Place the PCB board dipped in the nano-hydrophobic protective agent at room temperature, place it horizontally on a clean table and cure it for 1 hour to form an ultra-thin transparent protective film layer on the surface of the product; Step 4: Use a 10mL syringe to fill the single-component silicone rubber and apply the silicone rubber near the four corners of the electronic components on the PCB board; Step 5: Place the glue-protected PCB horizontally on a clean workbench and cure it at room temperature for 24 hours; Step 6: Use a 10mL syringe to fill the single-component silicone rubber, apply the silicone rubber to the edge of the outer protective shell prefabricated by 3D printing, and bond and package it with the prepared PCB board to form an integrated protective layer; Step 7: Place the PCB board bonded to the outer protective shell in step 6 horizontally at room temperature for curing for 48 hours, and remove the silicone rubber burrs that overflow around it.

2. The electronic product composite protection method according to claim 1, characterized in that: The outer protective shell in step 1 is configured as a single-sided honeycomb lightweight structure, with a closed plane on the outside and an opening on the inside; the outer protective shell is formed by a selective laser sintering process, and the material used is engineering plastic nylon powder.

3. The composite protection method for electronic products according to claim 2, characterized in that: When applying glue to electronic components in step 4, priority is given to applying silicone rubber protection to electronic components that are susceptible to mechanical impact, and the application height is no more than 1 / 3 of the component height.

4. The electronic product composite protection method according to claim 3, characterized in that: The electronic components susceptible to mechanical impact include: ball grid array devices and small outline integrated circuits.

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