Intelligent manufacturing temperature control type laser welding device

Through intelligent manufacturing temperature -controlled laser welding device, the laser heating welding location and spherical welded are used to achieve microporous and welded welding, solving the problem of depression and excessive welding slag caused by the traditional hot -melt method, improve the welding quality and the quality of welding and the quality of welding and the quality of the welding. Structure toughness.

CN119347023AInactive Publication Date: 2025-01-24WUHAN HANGNING PRECISION MACHINERY CO LTD
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Patent Information

Application Number
CN202411786179.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-06
Publication Date
2025-01-24
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

In laser welding technology, when replenishing materials through hot melting, replenishing materials can easily lead to depression and structural changes in the welding site, and high-temperature welding will produce excessive welding slag, reducing the toughness of the connection structure.

Method used

An intelligent manufacturing temperature-controlled laser welding device is used to heat the welding position and the spherical solder through the first and second laser emitters to fuse them to achieve low-temperature filler welding and reduce structural damage to the welding position.

Benefits of technology

It effectively avoids the depression of the welding position and the generation of excessive welding slag, improves the welding quality, reduces the damage to the welding position, and has higher precision and stability compared with traditional high-temperature welding.

✦ Generated by Eureka AI based on patent content.

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    Figure B6SS8F1HQRNEMRUTAM8WZ01PVLOWTYUUXWF18BEX
Patent Text Reader

Abstract

The invention belongs to the technical field of laser welding, and particularly relates to an intelligent manufacturing temperature control type laser welding device which comprises a base and a first laser transmitter horizontally and vertically moving on the top of the base. A second laser transmitter and an infrared sensor are arranged on the two sides of the first laser transmitter correspondingly, and a discharging opening is formed in the bottom of the first laser transmitter in an extending mode. Spherical welding flux is conveyed into a discharging opening, the spherical welding flux is heated through laser of a first laser transmitter, the molten spherical welding flux is discharged from the bottom of the discharging opening, a welding part is preheated through a second laser transmitter, and the spherical welding flux falls to the welding part and then is fused; the spherical welding flux is distributed into the discharging opening through the arranged distributing opening and the discharging device in the discharging opening lifting process. According to the low-temperature material supplementing welding device, material supplementing welding can be conducted on a micro defect part, material supplementing is achieved through low temperature, and meanwhile structural damage to the welding position is reduced.
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Description

Technical Field

[0001] The present invention belongs to the technical field of laser welding, and in particular relates to an intelligent manufacturing temperature-controlled laser welding device. Background Art

[0002] Laser welding is a high-efficiency and precision welding method that uses a high-energy-density laser beam as a heat source. It is widely used in industrial fields such as automobiles, precision instruments, electrical appliances, aerospace, and medical.

[0003] Problems with existing technologies: In laser welding technology, micro-hole patching welding is especially used in PCB electronic manufacturing, plate hole repair, and micro-gap patching and repair welding. For conventional micro-hole or micro-gap welding, the surrounding raw materials are melted and added to the gap by hot melting, which will form depressions and change the material structure. The high temperature generated during laser welding will also cause welding slag to form at the welding site, reducing the toughness between the connecting structures. Summary of the invention

[0004] The purpose of the present invention is to provide an intelligent manufacturing temperature-controlled laser welding device, which can realize the filling welding of micro-defective parts and reduce the structural damage to the welding position while realizing the filling at low temperature.

[0005] The technical solution adopted by the present invention is as follows: An intelligent manufacturing temperature-controlled laser welding device comprises a base and a first laser emitter which moves horizontally and vertically on the top of the base; A second laser emitter and an infrared sensor are respectively provided on both sides of the first laser emitter, and a feeding port is extended from the bottom of the first laser emitter; The spherical solder is transported to the inside of the feeding port, and the spherical solder is heated by the laser of the first laser emitter so that the spherical solder is melted and discharged from the bottom of the feeding port, and the welding part is preheated by the second laser emitter so that the spherical solder falls to the welding part and then fuses; The spherical solder is lifted and lowered through the material discharge port, and the spherical solder is distributed to the inside of the material discharge port through the material distribution port and the material discharger; A connecting plate is fixedly connected to one side of the discharge port, and lifting plates are slidably installed on both sides of the connecting plate. Transmission components are correspondingly arranged on the side surfaces of the lifting plates on both sides. The transmission components are hinged to drive the discharger to move vertically, and the spherical solder is vertically squeezed by the discharger to be transported to the inside of the discharge port.

[0006] A horizontal slide rail is horizontally arranged on the top of the base, and the horizontal slide rail drives the first laser emitter through a first motor transmission screw arranged on the back of the horizontal slide rail. The first laser emitter is fixedly installed on the side of the fixed plate by bolts, and the fixed plate is slidably installed on the side of the horizontal slide rail and is connected to the first motor in a transmission manner. A material box for installing the spherical solder is arranged on one side of the top of the horizontal slide rail, and the material box is fixed to one side of the top of the fixing plate.

[0007] The second laser emitter and the infrared sensor are both fixedly mounted on the side of the fixing plate, the second laser emitter and the infrared sensor are cross-arranged, and the bottom extension focus intersects with the vertical falling trajectory of the spherical solder from the bottom of the discharge port.

[0008] The infrared sensor includes at least one distance sensor.

[0009] A material barrel is extended from the top of the material discharge port, and the material barrel abuts against the bottom of the first laser emitter.

[0010] The spherical solder is transported from the material box to the inside of the discharge port through the material distribution port, the guide piece, and the material guide pipe in sequence. The material guide pipe is arranged through one side of the discharge port and is fitted on the side of the discharge port through a connecting plate.

[0011] A lifting connection piece is extended from the top of the lifting plate, a micro motor which is vertically threaded with the lifting connection piece is arranged on the top of the lifting connection piece, and the micro motor is fixedly mounted on the side of the fixed plate.

[0012] The transmission assembly includes a fixed rod fixed to the side of the lifting plate, and a flip rod hinged by a hinge, one end of the flip rod is fixedly installed on the side of the connecting plate through a hinged base, and the other end of the flip rod is hinged to both sides of the bottom of the feeder through a hinge; A ferrule is abutted against the bottom of the feeder, and the ferrule is sleeved with the material guide pipe and fixed on the side of the connecting plate.

[0013] The bottom end of the material distribution port extends and narrows, and is penetrated by the feeder. The feeder squeezes and lifts the spherical solder inside the material distribution port into the inside of the guide member through vertical movement. The guide member is inclined and bent to the top of the guide tube.

[0014] A slanted pressing plate is provided at the top of the inner side of the guide member adjacent to the material distribution port, and a material distribution groove is opened on one side of the top of the feeder. The spherical solder is vertically squeezed upward by the feeder and further squeezed against one side of the pressing plate, so that the spherical solder rolls along the inclined inner wall of the material distribution groove and the guide member.

[0015] The technical effects achieved by the present invention are: The present invention can avoid cold solder joints between the spherical solder and the welding parts when applied to the soldering process by heating the welding position. By heating the welding position and the spherical solder together, excessive heating of the welding position by the laser can be reduced. After the spherical solder and the welding position are fused, the adhesion between them is increased, and the spherical solder is further heated by laser to melt it and fuse it with the welding position, thereby realizing fusion welding, thereby avoiding depression of the welding position and generating excessive welding slag.

[0016] The present invention achieves high-temperature welding compared with traditional welding by laser heating the welding position and the spherical solder, thereby reducing the damage to the welding position. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 It is a schematic diagram of the structural installation position of the first laser emitter in the present invention; Figure 3 is a schematic structural diagram of the first laser emitter in the present invention; Figure 4 is a schematic diagram of the back structure of the first laser emitter in the present invention; Figure 5 It is a schematic diagram of the structural installation of the material distribution port in the present invention; Figure 6 It is a structural schematic diagram of the micro motor and the material distribution port in the present invention; Figure 7 It is a schematic diagram of the structural connection between the micro motor and the material distribution port in the present invention; Figure 8 The present invention Figure 7 A magnified view of the structure at center A; Fig. 9 It is a schematic cross-sectional view of the middle portion of the material distribution port in the present invention; Fig.10 The present invention Fig. 9 A magnified view of the structure at B in the middle; Fig.11 It is a structural schematic diagram of the feeder in the present invention.

[0018] In the accompanying drawings, the components represented by the reference numerals are listed as follows: 1. Base; 2. Horizontal slide rail; 21. First motor; 22. Material box crawler frame; 23. Fixed plate; 3. First laser transmitter; 4. Second laser transmitter; 5. Infrared sensor; 6. Feeding port; 61. Feeding barrel; 62. Connecting plate; 63. Hoop; 7. Micro motor; 71. Lifting connector; 72. Lifting plate; 73. Transmission assembly; 731. Fixed rod; 732. Articulated member; 733. Flip rod; 8. material distribution port; 81. material guide pipe; 82. guide piece; 83. material pressing inclined plate; 9. Feeder; 91. Feeding chute. DETAILED DESCRIPTION

[0019] In order to make the purpose and advantages of the present invention more clearly understood, the present invention is specifically described below in conjunction with embodiments. It should be understood that the following text is only used to describe one or several specific embodiments of the present invention, and does not strictly limit the scope of protection of the specific claims of the present invention.

[0020] like Figure 1-3 As shown, an intelligent manufacturing temperature-controlled laser welding device includes a base 1 and a first laser emitter 3 that moves horizontally and vertically on the top of the base 1, a second laser emitter 4 and an infrared sensor 5 are respectively provided on both sides of the first laser emitter 3, and a feed port 6 is extended from the bottom of the first laser emitter 3.

[0021] According to the above structure, its working principle is: The spherical solder is conveyed to the inside of the discharge port 6, and the spherical solder is laser-heated by the first laser emitter 3 so that it is melted and discharged from the bottom of the discharge port 6. The welding part is preheated by the second laser emitter 4 so that the spherical solder falls to the welding part and then fuses, thereby achieving filler welding of the welding part.

[0022] Further references Figure 4-8 During the lifting process of the spherical solder through the discharge port 6, the spherical solder is distributed to the inside of the discharge port 6 through the provided distribution port 8 and the discharge device 9.

[0023] Furthermore, a connecting plate 62 is fixedly connected to one side of the discharge port 6, and lifting plates 72 are slidably installed on both sides of the connecting plate 62. Transmission components 73 are correspondingly arranged on the sides of the lifting plates 72 on both sides. The transmission component 73 articulates and drives the discharger 9 to move vertically, and the spherical solder is vertically extruded by the discharger 9 and transported to the inside of the discharge port 6.

[0024] A lifting connector 71 is extended from the top of the lifting plate 72, and a micro motor 7 is provided on the top of the lifting connector 71 for vertical thread transmission therewith, and the micro motor 7 is fixedly mounted on the side of the fixed plate 23; The transmission assembly 73 includes a fixed rod 731 fixed to the side of the lifting plate 72, and a flip rod 733 hinged by a hinge 732, one end of the flip rod 733 is fixedly installed on the side of the connecting plate 62 through a set hinge base, and the other end of the flip rod 733 is hinged to both sides of the bottom of the feeder 9 through the hinge 732; A hoop 63 is abutted against the bottom of the feeder 9 , and the hoop 63 is sleeved with the material guide pipe 81 and fixed on the side of the connecting plate 62 .

[0025] According to the above structure: When the lifting plate 72 is lifted by the micromotor 7, the fixed rod 731 moves vertically upward, and the flip rod 733 is driven by the hinge 732, so that the flip rod 733 is hinged around the end away from the feeder 9. At this time, the feeder 9 is lifted, and then the feeder 9 squeezes the spherical solder that slides to the top of the feeder 9, so that the spherical solder is lifted vertically upward and transported to the inside of the feeder port 6; When the lifting plate 72 is driven down by the micromotor 7 spirally, the fixed rod 731 moves vertically downward accordingly. At this time, the flip rod 733 is driven by the hinge 732, so that the flip rod 733 is hinged around the end away from the feeder 9. At this time, the feeder 9 descends, and then the top of the feeder 9 slides vertically into the material distribution port 8. At this time, the spherical solder rolls to the top of the feeder 9, and rises and falls back and forth in turn to realize the single material distribution and transportation of the spherical solder.

[0026] In addition, according to the fluctuation height of the welding position, a lifting mechanism can be set between the horizontal slide rail 2 and the fixed plate 23 to vertically lift the fixed plate 23 and its auxiliary mounting structure to achieve a wider range of applications. This is the prior art and is not shown in the figure.

[0027] Furthermore, refer again to Figure 2 and Figure 3 In use, the first laser emitter 3 is used to heat the spherical solder inside the feed port 6. According to the welding temperature, the second laser emitter 4 is operated to heat the base of the welding part. At this time, after the welding part and the spherical solder are heated to the preset temperature, the spherical solder is discharged from the bottom end of the feed port 6 and falls to the welding position, thereby realizing the rapid fusion of the spherical solder and the welding position. By heating the welding position, on the one hand, when applied to the soldering process, the virtual solder between the spherical solder and the welding part can be avoided. On the other hand, by heating together, the excessive heating of the welding position by the laser can be reduced. After the spherical solder is fused with the welding position, its adhesion is increased, and the spherical solder is further heated by laser to melt it and fuse it with the welding position, thereby realizing fusion welding, thereby avoiding the depression of the welding position and the generation of excessive welding slag.

[0028] Furthermore, by laser heating the welding position and the spherical solder, high temperature welding compared to conventional welding is achieved, thereby reducing damage to the welding position.

[0029] When controlling the welding temperature, the laser is used to change the temperature of the welding position by adjusting the power, and the temperature is controlled by a preset value, or by integrating a temperature detection sensor inside the infrared sensor 5 to achieve real-time temperature monitoring.

[0030] Please refer to Figure 1 and Figure 2A horizontal slide rail 2 is horizontally arranged on the top of the base 1. The horizontal slide rail 2 drives the first laser emitter 3 through a first motor 21 transmission screw arranged on the back thereof. The first laser emitter 3 is fixedly installed on the side of a fixed plate 23 by bolts. The fixed plate 23 is slidably installed on the side of the horizontal slide rail 2 and is transmission-connected to the first motor 21.

[0031] Furthermore, a material box for installing spherical solder is provided on one side of the top of the horizontal slide rail 2. The material box is fixed to one side of the top of the fixed plate 23, and the material box is installed at the end of the material box crawler frame 22. The material box is lifted by the material box crawler frame 22 and combined with the horizontal movement of the fixed plate 23 to realize the integrated setting of the material box. A corrugated pipe is extended between the material box and the material distribution port 8 to transport the spherical solder between the material box and the material distribution port 8.

[0032] Please refer to Figure 2 and Figure 3 The second laser emitter 4 and the infrared sensor 5 are both fixedly mounted on the side of the fixing plate 23 , the second laser emitter 4 and the infrared sensor 5 are cross-arranged, and the bottom extension focus intersects with the vertical falling trajectory of the spherical solder from the bottom of the discharge port 6 .

[0033] Furthermore, a material barrel 61 is extended from the top of the material discharge port 6 , and the material barrel 61 abuts against the bottom of the first laser emitter 3 .

[0034] According to the above structure, the second laser emitter 4, the infrared sensor 5 and the feed port 6 are fixedly installed on one side of the fixed plate 23. When adjusting the feed speed and welding speed of the spherical solder, the feed speed and the excitation time of the second laser emitter 4 and the feed port 6 are adjusted, so that the welding speed can be controlled, and parameter adjustment confusion caused by changes in the positions of the second laser emitter 4, the infrared sensor 5 and the feed port 6 can be avoided.

[0035] Furthermore, the infrared sensor 5 includes at least one distance sensor, or an infrared temperature sensor and a distance sensor. When the welding parameters of the second laser emitter 4, the infrared sensor 5 and the feed port 6 are fixed or preset, or the laser power is fixed according to the set temperature of the welding material and the welding time, the infrared sensor 5 includes a distance sensor for focusing between the second laser emitter 4 and the feed port 6 during the welding process. Otherwise, an infrared temperature sensor needs to be added for real-time monitoring of the welding position and the temperature of the spherical solder.

[0036] Please refer to Figure 6-10 The spherical solder is transported from the material box to the inside of the discharge port 6 through the material distribution port 8, the guide member 82, and the material guide pipe 81 in sequence. The material guide pipe 81 is set through one side of the discharge port 6 and is installed on the side of the discharge port 6 through the connecting plate 62.

[0037] The working principle of material unloading through 8 is: First, the bottom end of the material distribution port 8 is extended and narrowed, and is penetrated by the feeder 9. The feeder 9 squeezes and lifts the spherical solder inside the material distribution port 8 into the guide member 82 through vertical movement. The guide member 82 is tilted and bent to the top of the guide tube 81.

[0038] Further, see Fig.11 A slanted pressing plate 83 is provided at the top of the inner side of the guide member 82 adjacent to the material distribution port 8, and a material distribution groove 91 is opened on one side of the top of the feeder 9. The spherical solder is vertically squeezed upward through the feeder 9, and further squeezed against one side of the pressing plate 83, so that the spherical solder rolls along the inclined inner wall of the material distribution groove 91 and the guide member 82.

[0039] The above is only a preferred embodiment of the present invention. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications should also be considered as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the art unless otherwise specified and limited.

Claims

1. An intelligent manufacturing temperature-controlled laser welding device, characterized in that: include: A base (1) and a first laser emitter (3) that moves horizontally and vertically on the top of the base (1); A second laser emitter (4) and an infrared sensor (5) are respectively provided on both sides of the first laser emitter (3); a feed opening (6) is extended from the bottom of the first laser emitter (3); The spherical solder is conveyed into the discharge port (6), the spherical solder is heated by a laser through a first laser emitter (3), the spherical solder is melted and discharged from the bottom of the discharge port (6), and the welding part is preheated by a second laser emitter (4), so that the spherical solder falls to the welding part and then fuses; The spherical solder is lifted and lowered through the discharge port (6), and the spherical solder is distributed to the inside of the discharge port (6) through the provided distribution port (8) and the discharge device (9); A connecting plate (62) is fixedly connected to one side of the discharge port (6), and lifting plates (72) are slidably mounted on both sides of the connecting plate (62). Transmission components (73) are correspondingly arranged on the sides of the lifting plates (72) on both sides. The transmission components (73) are hingedly driven to drive the discharger (9) to move vertically, and the spherical solder is vertically squeezed by the discharger (9) to be transported to the inside of the discharge port (6).

2. The intelligent manufacturing temperature-controlled laser welding device according to claim 1, characterized in that: A horizontal slide rail (2) is horizontally arranged on the top of the base (1); the horizontal slide rail (2) drives the first laser emitter (3) via a first motor (21) drive screw arranged on the back of the horizontal slide rail (2); the first laser emitter (3) is fixedly mounted on the side of a fixing plate (23) by bolts; the fixing plate (23) is slidably mounted on the side of the horizontal slide rail (2) and is in driving connection with the first motor (21); A material box for installing the spherical solder is provided on one side of the top of the horizontal slide rail (2), and the material box is fixed to one side of the top of the fixing plate (23).

3. The intelligent manufacturing temperature-controlled laser welding device according to claim 1, characterized in that: The second laser emitter (4) and the infrared sensor (5) are both fixedly mounted on the side of the fixing plate (23), the second laser emitter (4) and the infrared sensor (5) are arranged crosswise, and the bottom extension focus intersects with the vertical falling trajectory of the spherical solder from the bottom of the discharge port (6).

4. The intelligent manufacturing temperature-controlled laser welding device according to claim 1, characterized in that: The infrared sensor (5) comprises at least one distance sensor.

5. The intelligent manufacturing temperature-controlled laser welding device according to claim 1, characterized in that: A material barrel (61) is extended from the top of the material discharge port (6), and the material barrel (61) abuts against the bottom of the first laser emitter (3).

6. The intelligent manufacturing temperature-controlled laser welding device according to claim 1, characterized in that: The spherical solder is transported from the material box to the inside of the material discharge port (6) in sequence through the material distribution port (8), the guide member (82), and the material guide pipe (81); the material guide pipe (81) is arranged through one side of the material discharge port (6) and is fitted to the side of the material discharge port (6) through a connecting plate (62).

7. The intelligent manufacturing temperature-controlled laser welding device according to claim 1 is characterized in that: A lifting connection piece (71) is extended from the top of the lifting plate (72), and a micro motor (7) is provided on the top of the lifting connection piece (71) for vertical thread transmission therewith, and the micro motor (7) is fixedly mounted on the side of the fixing plate (23).

8. The intelligent manufacturing temperature-controlled laser welding device according to claim 1, characterized in that: The transmission assembly (73) comprises a fixed rod (731) fixed to the side of the lifting plate (72), and a flip rod (733) hingedly connected via a hinge (732); one end of the flip rod (733) is fixedly mounted on the side of the connecting plate (62) via a hinged base, and the other end of the flip rod (733) is hingedly connected to two sides of the bottom of the feeder (9) via the hinge (732); The bottom of the feeder (9) is butted against a sleeve hoop (63), and the sleeve hoop (63) sleeves the material guide pipe (81) and is fixed on the side of the connecting plate (62).

9. The intelligent manufacturing temperature-controlled laser welding device according to claim 6, characterized in that: The bottom end of the material distribution port (8) extends and narrows, and is penetrated by the feeder (9). The feeder (9) squeezes and lifts the spherical solder inside the material distribution port (8) into the inside of the guide member (82) through vertical movement. The guide member (82) is inclined and bent to the top of the guide tube (81).

10. The intelligent manufacturing temperature-controlled laser welding device according to claim 6, characterized in that: An inclined material pressing inclined plate (83) is provided at the top of the inner part of the guide member (82) adjacent to the material distribution opening (8), and a material distribution groove (91) is provided at one side of the top end of the feeder (9). The spherical solder is vertically pressed upward by the feeder (9) and further pressed against one side of the material pressing inclined plate (83), so that the spherical solder rolls along the inclined inner wall of the material distribution groove (91) and the guide member (82).