Laser drilling equipment for producing ultra-microporous acoustic board

Abstract

The invention discloses laser drilling equipment for producing an ultra-microporous acoustic board, and belongs to the technical field of laser drilling, the laser drilling equipment comprises a laser drilling equipment main body, a support frame is arranged at the top end of the laser drilling equipment main body in a sliding manner, a board is placed at the top end of the support frame, and the laser drilling equipment further comprises a detection element, a classification module, a central processing module and a laser drilling module; the detection element is used for obtaining material data, the classification module is used for inputting the material data into the plate classification model and outputting the plate category, the material of the machined plate is determined through the detection element, the plate category is obtained through the material, and a laser machining mode needed by the plate is matched according to the plate category; the wood board is used for producing the composite board, and the metal board is used for producing the common ultra-microporous acoustic board, so that the composite board and the common ultra-microporous acoustic board can be produced on the same laser drilling equipment.

Description

Technical Field

[0001] The invention belongs to the technical field of laser drilling, and in particular relates to a laser drilling device for producing ultra-microporous sound-absorbing panels. Background Art

[0002] Ultra-microporous sound-absorbing board is a material used for acoustic control. It has tiny holes on its surface. The diameter of these holes is usually between a few microns and tens of microns. Ultra-microporous sound-absorbing board absorbs and dissipates sound waves through the shape and arrangement of the holes, thereby reducing the generation of noise and echo. It is mainly used in hospitals, lecture halls, libraries, exhibition halls, auction halls and other places with high requirements for acoustic environment. Ordinary mechanical drills cannot meet the requirements of aperture. Usually, ultra-microporous sound-absorbing boards are made by laser processing, and the laser processing method will be different depending on the aperture requirements.

[0003] For example, the prior art patent CN110605488A discloses a ceramic laser drilling device, which includes a laser cutting unit, a control device and a gyratory vibration mechanism. The gyratory vibration mechanism is operated by the control device, so that the laser performs drilling by circular cutting, i.e., rotary cutting. Although the drilling quality is improved, there are still the following defects:

[0004] The above patent only discloses the method of rotary cutting for punching, which is different from single pulse punching. However, the materials of the ultra-microporous sound-absorbing board are divided into wood and metal materials. During the processing of the wooden board, rotary cutting or single pulse punching is selected according to the needs of the aperture, so that the wooden board can be used to produce composite boards. The composite board is designed according to the requirements of the acoustic environment of the site. The surface of the general ultra-microporous sound-absorbing board has only ultra-micropores of one aperture, and the surface of the composite board has ultra-micropores of different apertures. The ultra-microporous sound-absorbing board made of metal is only suitable for single pulse punching due to the problem of waste chips, and is not suitable for generating composite boards. Therefore, the above laser punching device cannot determine the punching method according to the material of the board, and thus cannot produce composite boards and ordinary ultra-microporous sound-absorbing boards at the same time. Summary of the invention

[0005] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0006] To solve the above problems, the present invention adopts the following technical solutions.

[0007] The laser drilling equipment used for producing ultra-microporous sound-absorbing panels includes a laser drilling equipment body, a support frame is slidably arranged on the top of the laser drilling equipment body, a plate is placed on the top of the support frame, and the laser drilling equipment also includes:

[0008] Detection element, used to obtain material data of the plate;

[0009] The classification module is used to input material data into the plate classification model and output the plate category;

[0010] The central processing module generates control instructions based on the board type;

[0011] The laser drilling module matches the laser micro-hole processing method according to the control instructions.

[0012] Preferably, the material data includes an ultrasonic reflection signal, and an ultrasonic detection module is provided inside the detection element; the ultrasonic detection module sends an ultrasonic signal to the surface of the plate, the ultrasonic signal is reflected by the surface of the plate, and the ultrasonic reflection signal is acquired.

[0013] Preferably, the board categories include wooden boards and metal boards, and the board classification model is trained as follows:

[0014] A plurality of groups of boards are obtained, and material data of each group of boards is obtained by detecting each group of boards. The material data of each group of boards is generated into corresponding actual annotations according to the board category when collected. When the board category is wooden board, the actual annotation is 1, and when the board category is metal board, the actual annotation is 0; the material data of each group of boards is used as the input of the machine learning model, and the machine learning model uses the predicted annotation of each group of board material data as output, the actual annotation as the prediction target, and minimizing the sum of the prediction accuracy of all board material data as the training target; wherein the calculation formula of the prediction accuracy is: ,in, is the number of the plate material data, For prediction accuracy, For the The predicted annotation value corresponding to the group plate material data, For the The actual annotations corresponding to the material data of the group plate are obtained; the machine learning model is trained until the sum of the prediction accuracies reaches convergence, the training is stopped, and the trained machine learning model is used as the plate classification model, where the machine learning model is either a naive Bayes model or a support vector machine model.

[0015] Preferably, the control instruction includes a first control instruction and a second control instruction;

[0016] The control instructions are generated as follows:

[0017] If the board type is a wooden board, the central processing module generates a first control instruction;

[0018] If the type of the plate is a metal plate, the central processing module generates a second control instruction.

[0019] Preferably, the laser micro-hole processing method includes dual-mode punching and single-mode punching, the dual-mode punching includes single-pulse punching and rotary cutting punching, and the single-mode punching is single-pulse punching. The matching logic of the laser micro-hole processing method is:

[0020] If the control instruction is the first control instruction, the laser drilling module matches the dual-mode drilling;

[0021] If the control instruction is the second control instruction, the laser drilling module matches the single-mode drilling.

[0022] Preferably, the ventilation assembly includes a plate-like box body, ventilation holes and a blower. The top of the plate-like box body is fixedly connected to the bottom of the support frame. The top of the plate-like box body is also provided with a plurality of ventilation holes. The bottom of the plate-like box body is fixedly provided with a blower.

[0023] Preferably, the central processing module is arranged inside the control box, and generates control instructions and switch instructions based on the type of the plate, and the switch instructions include an opening instruction and a closing instruction;

[0024] The switch instruction is generated as follows:

[0025] If the board type is wooden board, the central processing module generates a closing instruction;

[0026] If the sheet type is metal sheet, the central processing module generates an opening instruction;

[0027] The blower ventilates the plate according to the opening command;

[0028] The blower stops ventilating the sheet in response to the shutdown command.

[0029] Preferably, an infrared heating module is also provided inside the detection element, which emits infrared rays to the surface of the plate, heats the surface of the plate and forms a detection area; the ultrasonic detection module then sends an ultrasonic signal to the detection area, the ultrasonic signal is reflected by the detection area, and an ultrasonic reflection signal is obtained.

[0030] Preferably, a support platform is also provided at the top of the main body of the laser drilling equipment, a laser drilling module is provided on one side of the support platform, the laser drilling module is used to laser drill holes in the plate, a control box is fixedly provided at one end of the support platform, and a central processing module and a classification module are provided inside the control box.

[0031] Compared with the prior art, the present invention has the following beneficial effects:

[0032] (1) The present invention determines the material of the processed board through the detection element, obtains the type of the board through the material, and matches the laser processing method required by the board according to the type of the board, so that the wooden board is used to produce the composite board, and the metal board is used to produce the ordinary ultra-microporous sound-absorbing board. In this way, not only can the composite board and the ordinary ultra-microporous sound-absorbing board be produced on the same laser drilling equipment, but also the quality of the ultra-microporous sound-absorbing board is effectively guaranteed through laser processing;

[0033] (2) During the laser processing of metal plates, a large amount of debris will accumulate at the ultra-micro holes. Therefore, the present invention sets a ventilation component at the bottom end of the support frame. After the type of the plate is obtained by the material, if the plate is a metal plate, the ventilation component starts to work to ventilate the plate to reduce the accumulation of debris at the ultra-micro holes. If the plate is a wooden plate, the ventilation component stops working to prevent the wooden plate from drying out too quickly during the drilling process, resulting in cracks at the ultra-micro holes. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of the structure of the laser drilling equipment when a plate is placed;

[0035] Figure 2 It is a structural schematic diagram of the laser drilling equipment when there is no plate;

[0036] Figure 3 It is a structural schematic diagram of the support frame and the ventilation assembly when combined;

[0037] Figure 4 It is a structural schematic diagram when the support frame is separated from the ventilation assembly;

[0038] Figure 5 It is a bottom view of the plate-shaped box body;

[0039] Figure 6 It is a schematic diagram of the structure when the detection element detects the plate;

[0040] Figure 7 for Figure 6 A schematic diagram of the enlarged structure at B in the middle;

[0041] Figure 8 This is a schematic diagram of the internal structure of the control box;

[0042] Fig. 9 for Figure 1 A schematic diagram of the enlarged structure at A in the middle;

[0043] Fig.10 This is a schematic diagram of removing moisture from the surface of a plate by infrared rays;

[0044] Fig.11 This is a schematic diagram of testing the material of a plate using ultrasound;

[0045] Fig.12 Schematic diagram of the internal structure of the detection element.

[0046] The corresponding relationship between the illustrations and component names in the figure is as follows:

[0047] 10. Laser drilling equipment body; 11. Support platform; 20. Detection element; 21. Ultrasonic detection module; 22. Infrared heating module; 30. Support frame; 40. Ventilation assembly; 41. Plate-shaped box body; 42. Ventilation holes; 43. Blower; 50. Laser drilling module; 60. Control box; 61. Central processing module; 62. Classification module. DETAILED DESCRIPTION

[0048] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0049] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0050] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments.

[0051] Example 1

[0052] like Figure 1 to Figure 9 As shown, this embodiment provides a laser drilling device for producing ultra-microporous sound-absorbing panels, including a laser drilling device body 10, a support frame 30 is slidably provided at the top of the laser drilling device body 10, a detection element 20 is provided at one end of the laser drilling device body 10, a support table 11 is also provided at the top of the laser drilling device body 10, a laser drilling module 50 is provided on one side of the support table 11, a plate is placed at the top of the support frame 30, a ventilation component 40 is provided at the bottom of the support frame 30, and a control box 60 is provided at one end of the support table 11;

[0053] like Figure 6 and Figure 7 As shown, the detection element 20 is located on one side of the support frame 30 and is used to obtain material data of the plate;

[0054] It should be noted that material data includes but is not limited to ultrasonic reflection signals, such as Figure 6 and Fig.12 As shown, an ultrasonic detection module 21 is provided inside the detection element 20, and the ultrasonic detection module 21 sends an ultrasonic signal to the surface of the plate. The ultrasonic signal is reflected by the surface of the plate, and the ultrasonic detection module 21 obtains the ultrasonic reflection signal;

[0055] like Figure 8 As shown, the classification module 62 is disposed inside the control box 60 and is used to input material data into the board classification model and output the board category;

[0056] Specifically, the board categories include wooden boards and metal boards. The training method of the board classification model is as follows:

[0057] Multiple groups of boards are obtained in the experimental environment. Each group of boards is tested to obtain the material data of each group of boards. The material data of each group of boards is generated with corresponding actual annotations according to the board category when collected. When the board category is wooden board, the actual annotation is 1, and when the board category is metal board, the actual annotation is 0. The material data of each group of boards is used as the input of the machine learning model. The machine learning model uses the predicted annotation of each group of board material data as output, the actual annotation as the prediction target, and the minimization of the sum of the prediction accuracy of all board material data as the training target. The calculation formula for prediction accuracy is: ,in, is the number of the plate material data, For prediction accuracy, For the The predicted annotation value corresponding to the group plate material data, For the The actual annotations corresponding to the material data of the group plate are obtained; the machine learning model is trained until the sum of the prediction accuracies reaches convergence, the training is stopped, and the trained machine learning model is used as the plate classification model, where the machine learning model is a naive Bayes model or a support vector machine model;

[0058] The central processing module 61 is disposed inside the control box 60 and generates control instructions based on the type of the plate, and the control instructions include a first control instruction and a second control instruction;

[0059] The specific way to generate control instructions is as follows:

[0060] If the board type is a wooden board, the central processing module 61 generates a first control instruction;

[0061] If the sheet type is a metal sheet, the central processing module 61 generates a second control instruction;

[0062] The laser drilling module 50 matches the laser micro-hole processing mode according to the control instructions;

[0063] The specific matching logic of laser micro-hole processing method is:

[0064] If the control instruction is the first control instruction, the laser drilling module 50 matches the dual-mode drilling;

[0065] If the control instruction is the second control instruction, the laser drilling module 50 matches the single-mode drilling;

[0066] It should be noted that laser micro-hole processing methods include dual-mode drilling and single-mode drilling. Dual-mode drilling includes single-pulse drilling and rotary cutting drilling. Single-mode drilling is single-pulse drilling. Single-pulse drilling is to use pulsed lasers or other high-energy pulse sources to generate high-energy pulse beams in a very short time to locally heat and melt the material to form holes. Rotary cutting drilling is a combination of drilling technology and cutting technology. The laser beam first impacts a small hole at the center of the hole, and then focuses the beam to make a circular motion on the surface of the workpiece to form a small hole after removing excess material in the circle. The micro-holes processed by rotary cutting drilling have better roundness, thinner recast layers, and higher quality of processed holes. The relative motion between the material and the laser can process holes with larger apertures.

[0067] It can be understood that in the present embodiment, since the wood board can choose to use rotary cutting or single pulse punching according to the need of aperture during the processing, the wood board can be used to produce composite boards. Composite boards are different from ordinary ultra-microporous sound-absorbing boards. Ordinary ultra-microporous sound-absorbing boards have ultra-micro holes with only one aperture on their surface. As the environment develops, the environment has higher and higher requirements for noise reduction, and ordinary ultra-microporous sound-absorbing boards cannot meet the needs. The composite board has ultra-micro holes with different apertures on its surface to meet the noise reduction needs of the environment. Single-pulse punching is suitable for ultra-micro holes with smaller apertures, and rotary cutting is suitable for ultra-micro holes with larger apertures. Dual-mode punching includes single-pulse punching and rotary cutting. It should be noted that dual-mode punching includes single-pulse punching and rotary cutting. The mode switching between single-pulse punching and rotary cutting is set in advance by the staff. For example, the staff sets the single punching time to T and the single-pulse punching time to , the rotary cutting and punching time is , when the punching time is When the laser punching mode is switched from the single pulse punching mode to the rotary cutting punching mode, the laser punching device can determine the laser micro-hole processing method according to the material of the plate, so that the composite board and the ordinary ultra-micro-hole sound-absorbing board can be produced at the same time.

[0068] Example 2

[0069] This embodiment is a further improvement on the basis of Embodiment 1.

[0070] like Figure 4 and Figure 5As shown, the ventilation assembly 40 includes a plate-shaped box body 41, ventilation holes 42 and a blower 43. The top of the plate-shaped box body 41 is fixedly connected to the bottom of the support frame 30. The top of the plate-shaped box body 41 is also provided with a plurality of ventilation holes 42. The bottom of the plate-shaped box body 41 is fixedly provided with a blower 43.

[0071] The central processing module 61 is disposed inside the control box 60 and generates control instructions and switch instructions based on the type of the plate, and the control instructions include a first control instruction and a second control instruction;

[0072] The specific way to generate control instructions is as follows:

[0073] If the board type is a wooden board, the central processing module 61 generates a first control instruction;

[0074] If the type of the plate is a metal plate, the central processing module 61 generates a second control instruction.

[0075] The specific generation method of the switch instruction is:

[0076] If the board type is a wooden board, the central processing module 61 generates a closing instruction;

[0077] If the type of the plate is a metal plate, the central processing module 61 generates an opening instruction.

[0078] The blower 43 ventilates the plate according to the opening instruction;

[0079] The blower 43 stops ventilating the plate according to the closing instruction.

[0080] Specifically, in the present embodiment, the plate is processed by laser from one side of the plate to the other side of the plate, so the ultra-micro holes formed on the surface of the plate are in a penetrating state, and the blower 43 introduces airflow into the plate-shaped box body 41, and the airflow reaches the bottom of the plate through the ventilation hole 42. Because the ultra-micro holes are in a penetrating state, the airflow reaches the top of the plate through the ultra-micro holes. Therefore, during the laser processing of the metal plate, there will be more debris at the hole opening produced by laser drilling, and it is necessary to reduce the accumulation of debris at the hole opening by airflow assistance. However, during the laser processing of the wood plate, there will be less debris at the hole opening produced by laser drilling. At the same time, during the drilling process of the wooden board, ventilation will cause the moisture in the wood chips produced by the drilling to evaporate quickly, thereby accelerating the drying process of the wood. Too fast drying may cause the risk of cracking or deformation of the wood. Therefore, the wooden board cannot be assisted by airflow during laser processing. Then, when the processed board is a metal board, the blower 43 ventilates the board according to the opening instruction. When the processed board is a wooden board, the blower 43 stops ventilating the board according to the closing instruction. This not only enables the production of composite boards and ordinary ultra-microporous sound-absorbing boards, but also reduces the debris generated at the holes on the surface of the metal board, thereby improving the quality of the ultra-micropores on the surface of the metal board.

[0081] Example 3

[0082] This embodiment is a further improvement on the basis of Embodiment 1.

[0083] like Fig.10 , Fig.11 and Fig.12 As shown, an infrared heating module 22 is also provided inside the detection element 20. The infrared heating module 22 emits infrared rays to the surface of the plate, heats the surface of the plate and forms a detection area. The ultrasonic detection module 21 then sends an ultrasonic signal to the detection area. The ultrasonic signal is reflected by the detection area, and the ultrasonic detection module 21 obtains the ultrasonic reflection signal.

[0084] It should be noted that before laser processing, the surface of the plate usually has a lot of moisture. Since moisture can absorb and scatter ultrasonic waves, causing them to deflect or scatter on the surface of the object, it may cause the signal intensity to attenuate. At the same time, moisture has a certain influence on the propagation speed and attenuation coefficient of ultrasonic waves, which will cause signal distortion. Therefore, in order to ensure the accuracy of the ultrasonic reflection signal, it is necessary to remove the moisture on the surface of the plate. The removal method is to emit infrared rays to the surface of the plate. The energy of the infrared rays will be absorbed and converted into heat energy. When the infrared rays are irradiated to the surface of the plate, the absorbed energy triggers the vibration and rotation of molecules and atoms, causing the surface temperature of the plate to rise, thereby removing the moisture from the surface of the plate.

[0085] The above formulas are all dimensionless and numerical calculations. The formula is a formula for the most recent real situation obtained by collecting a large amount of data and performing software simulation. The preset parameters, weights and thresholds in the formula are set by technicians in this field according to actual conditions.

[0086] The above embodiments may be implemented in whole or in part by software, hardware, firmware or any other combination thereof. When implemented by software, the above embodiments may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer programs are loaded or executed on a computer, the process or function described in the embodiment of the present invention is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from one website, computer, server or data center to another website, computer, server or data center via a wired network or a wireless network. The computer-readable storage medium may be any available medium that can be accessed by a computer or a data storage device such as a server or data center that includes one or more available media sets. The available medium may be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD) or a semiconductor medium. The semiconductor medium may be a solid-state hard disk.

[0087] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed in the present invention can be implemented in electronic hardware or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the present invention.

[0088] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0089] In the several embodiments provided by the present invention, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of the units is only one, and there may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0090] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0091] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0092] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

[0093] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A laser drilling device for producing ultra-microporous sound-absorbing panels, comprising a laser drilling device body (10), characterized in that: A support frame (30) is slidably disposed at the top of a laser drilling device body (10), and a plate is placed at the top of the support frame (30); and the device further comprises: A detection element (20) for obtaining material data of the plate; A classification module (62), used for inputting material data into a plate classification model and outputting a plate category; A central processing module (61) generates control instructions based on the type of the plate; The laser drilling module (50) matches the laser micro-hole processing mode according to the control instruction.

2. The laser drilling equipment for producing ultra-microporous sound-absorbing panels according to claim 1 is characterized in that: The material data includes an ultrasonic reflection signal. An ultrasonic detection module (21) is provided inside the detection element (20). The ultrasonic detection module (21) sends an ultrasonic signal to the surface of the plate. The ultrasonic signal is reflected by the surface of the plate, and the ultrasonic reflection signal is obtained.

3. The laser drilling equipment for producing ultra-microporous sound-absorbing panels according to claim 1 is characterized in that: The board categories include wooden boards and metal boards. The training method of the board classification model is as follows: A plurality of groups of boards are obtained, and material data of each group of boards is obtained by detecting each group of boards. The material data of each group of boards is generated into corresponding actual annotations according to the board category when collected. When the board category is wooden board, the actual annotation is 1, and when the board category is metal board, the actual annotation is 0; the material data of each group of boards is used as the input of the machine learning model, and the machine learning model uses the predicted annotation of each group of board material data as output, the actual annotation as the prediction target, and minimizing the sum of the prediction accuracy of all board material data as the training target; wherein the calculation formula of the prediction accuracy is: ,in, is the number of the plate material data, For prediction accuracy, For the The predicted annotation value corresponding to the group plate material data, For the The actual annotations corresponding to the material data of the group plate are obtained; the machine learning model is trained until the sum of the prediction accuracies reaches convergence, the training is stopped, and the trained machine learning model is used as the plate classification model, where the machine learning model is either a naive Bayes model or a support vector machine model.

4. The laser drilling equipment for producing ultra-microporous sound-absorbing panels according to claim 3 is characterized in that: The control instruction includes a first control instruction and a second control instruction; The specific way to generate control instructions is as follows: If the board type is a wooden board, the central processing module (61) generates a first control instruction; If the type of the sheet material is a metal sheet material, the central processing module (61) generates a second control instruction.

5. The laser drilling equipment for producing ultra-microporous sound-absorbing panels according to claim 4 is characterized in that: Laser micro-hole processing methods include dual-mode punching and single-mode punching. Dual-mode punching includes single-pulse punching and rotary cutting punching. Single-mode punching is single-pulse punching. The matching logic of laser micro-hole processing methods is: If the control instruction is the first control instruction, the laser drilling module (50) matches the dual-mode drilling; If the control instruction is the second control instruction, the laser drilling module (50) matches the single-mode drilling.

6. The laser drilling equipment for producing ultra-microporous sound-absorbing panels according to claim 5 is characterized in that: A ventilation assembly (40) is arranged at the bottom end of the support frame (30), and the ventilation assembly (40) comprises a plate-shaped box body (41), ventilation holes (42) and a blower (43). The top end of the plate-shaped box body (41) is fixedly connected to the bottom end of the support frame (30), and a plurality of ventilation holes (42) are also formed at the top end of the plate-shaped box body (41). The blower (43) is fixedly arranged at the bottom end of the plate-shaped box body (41).

7. The laser drilling equipment for producing ultra-microporous sound-absorbing panels according to claim 6 is characterized in that: The central processing module (61) is arranged inside the control box (60) and generates control instructions and switch instructions based on the type of the plate material, wherein the switch instructions include an opening instruction and a closing instruction; The switch instruction is generated as follows: If the board type is a wooden board, the central processing module (61) generates a closing instruction; If the type of the plate is a metal plate, the central processing module (61) generates an opening instruction; The blower (43) ventilates the plate according to the opening instruction; The blower (43) stops ventilating the plate in response to the closing command.

8. The laser drilling equipment for producing ultra-microporous sound-absorbing panels according to claim 5 is characterized in that: An infrared heating module (22) is also provided inside the detection element (20), and the infrared heating module (22) emits infrared rays to the surface of the plate, heats the surface of the plate and forms a detection area; the ultrasonic detection module (21) then sends an ultrasonic signal to the detection area, the ultrasonic signal is reflected by the detection area, and an ultrasonic reflection signal is obtained.

9. The laser drilling equipment for producing ultra-microporous sound-absorbing panels according to claim 1 is characterized in that: A support platform (11) is also provided at the top of the laser drilling equipment body (10); a laser drilling module (50) is provided on one side of the support platform (11); the laser drilling module (50) is used to perform laser drilling on the plate; a control box (60) is fixedly provided at one end of the support platform (11); a central processing module (61) and a classification module (62) are provided inside the control box (60).

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