Laser drilling control method, device, equipment and storage medium

Abstract

The present invention discloses a laser drilling control method, device, equipment and storage medium, including obtaining a target hole coordinate data set; decomposing the target hole coordinate data set into a first hole coordinate data set and a second hole coordinate data set based on a preset filtering model, where the first hole coordinate data set is used to represent the coordinate data set to be assigned to the mobile platform, and the second hole coordinate data set is used to represent the coordinate data set to be assigned to the galvanometer assembly; performing path smoothing processing on the first hole coordinate data set to obtain a smoothed path data set; determining a control speed data set of the mobile platform based on the smoothed path data set and a preset line segment transition speed regulation model; and synchronously controlling the modulation deflector, the galvanometer assembly and the mobile platform based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set. The present invention can improve the efficiency of laser drilling through the synchronous cooperation of the modulation deflector, the galvanometer assembly and the mobile platform.

Description

Technical Field

[0001] The present invention relates to the technical field of automation equipment, and particularly relates to a laser drilling control method, device, equipment and storage medium. Background Art

[0002] Laser drilling equipment is a commonly used processing equipment in circuit board processing. As the number of holes to be processed in the circuit board continues to increase, the requirement for the processing efficiency of the laser drilling equipment is also getting higher and higher. The laser drilling equipment usually includes a moving platform and a galvanometer assembly, and realizes the function of switching the drilling position of the circuit board through the cooperation of the moving platform and the galvanometer assembly. However, the processing efficiency of the laser drilling equipment can no longer meet the requirements of the increasingly developed circuit board manufacturing process. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present invention provides a laser drilling control method, device, equipment and storage medium, which can improve the efficiency of laser drilling through the synchronous cooperation of a modulation deflector, a galvanometer assembly and a moving platform.

[0004] In a first aspect, an embodiment of the present invention provides a laser drilling control method, which is applied to a laser drilling equipment having a modulation deflector, a galvanometer assembly and a moving platform, and includes:

[0005] Obtain a target hole coordinate data set;

[0006] Based on a preset filtering model, decompose the target hole coordinate data set into a low-frequency part and a high-frequency part, use the low-frequency part as a first hole coordinate data set and use the high-frequency part as a second hole coordinate data set. The first hole coordinate data set is used to characterize the coordinate data set with smoother movement to be assigned to the moving platform, and the second hole coordinate data set is used to characterize the coordinate data set to be assigned to the galvanometer assembly;

[0007] Perform path smoothing processing on the first hole coordinate data set to obtain a smoothed path data set;

[0008] Based on the smoothed path data set and a preset line segment transition speed regulation model, determine a control speed data set of the moving platform;

[0009] Based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set, perform synchronous control on the modulation deflector, the galvanometer assembly and the moving platform.

[0010] According to some embodiments of the present invention, before obtaining the target hole coordinate data set, it further includes:

[0011] Obtain an original hole coordinate data set;

[0012] Perform path planning processing on the original hole coordinate dataset to obtain a target hole coordinate dataset.

[0013] According to some embodiments of the present invention, performing path planning processing on the original hole coordinate dataset to obtain a target hole coordinate dataset includes:

[0014] Based on the principle of global path optimization, perform path planning processing on the original hole coordinate dataset to obtain a target hole coordinate dataset.

[0015] According to some embodiments of the present invention, performing path planning processing on the original hole coordinate dataset to obtain a target hole coordinate dataset includes:

[0016] According to the scanning range of the galvanometer assembly, divide the original hole coordinate dataset into multiple local hole coordinate datasets;

[0017] Perform path planning processing on the multiple local hole coordinate datasets in sequence to obtain a target hole coordinate dataset;

[0018] During the path planning processing:

[0019] Based on the principle of local path optimization, use one of the hole coordinates as the path starting point, and perform path planning processing on the first local hole coordinate dataset to obtain an intermediate hole coordinate dataset;

[0020] Based on the principle of the shortest distance, determine the starting hole coordinate of the next local hole coordinate dataset. Among all the hole coordinates of the local hole coordinate dataset, the distance between the starting hole coordinate and the last hole coordinate of the intermediate hole coordinate dataset is the shortest;

[0021] Based on the principle of local path optimization, use the starting hole coordinate as the path starting point and perform path planning processing on the local hole coordinate dataset.

[0022] According to some embodiments of the present invention, the target hole coordinate dataset includes an X-axis hole coordinate dataset and a Y-axis hole coordinate dataset. Based on a preset filtering model, decompose the target hole coordinate dataset into a low-frequency part and a high-frequency part, and use the low-frequency part as the first hole coordinate dataset and the high-frequency part as the second hole coordinate dataset, including:

[0023] Based on a preset filtering model, decompose the X-axis hole coordinate dataset into a first X coordinate dataset and a second X coordinate dataset;

[0024] Based on a preset filtering model, decompose the Y-axis hole coordinate dataset into a first Y coordinate dataset and a second Y coordinate dataset;

[0025] Combine the first X - coordinate data set and the first Y - coordinate data set to obtain a first hole - coordinate data set;

[0026] Combine the second X - coordinate data set and the second Y - coordinate data set to obtain a second hole - coordinate data set.

[0027] According to some embodiments of the present invention, the decomposing the target hole - coordinate data set into a low - frequency part and a high - frequency part based on a preset filtering model, taking the low - frequency part as the first hole - coordinate data set and the high - frequency part as the second hole - coordinate data set, includes:

[0028] Based on a preset EMA low - pass filter, perform filtering processing on the target hole - coordinate data set to determine the low - frequency part in the target hole - coordinate data set;

[0029] Take the low - frequency part in the target hole - coordinate data set as the first hole - coordinate data set, and take the remaining part in the target hole - coordinate data set as the second hole - coordinate data set.

[0030] According to some embodiments of the present invention, the performing path smoothing processing on the first hole - coordinate data set to obtain a smoothed path data set includes:

[0031] Based on a Bessel curve model, perform path smoothing processing on the first hole - coordinate data set to obtain a smoothed path data set.

[0032] In a second aspect, an embodiment of the present invention provides a laser drilling control device, which is applied to a laser drilling device having a modulation deflector, a galvanometer assembly, and a moving platform, and includes:

[0033] An acquisition module, configured to acquire a target hole - coordinate data set;

[0034] A coordinate decomposition module, configured to decompose the target hole - coordinate data set into a low - frequency part and a high - frequency part based on a preset filtering model, take the low - frequency part as the first hole - coordinate data set and the high - frequency part as the second hole - coordinate data set, where the first hole - coordinate data set is used to represent the coordinate data set with smoother motion to be assigned to the moving platform, and the second hole - coordinate data set is used to represent the coordinate data set to be assigned to the galvanometer assembly;

[0035] A path smoothing processing module, configured to perform path smoothing processing on the first hole - coordinate data set to obtain a smoothed path data set;

[0036] A speed regulation module, configured to determine a control speed data set of the moving platform based on the smoothed path data set and a preset line - segment transition speed regulation model;

[0037] A control module, configured to synchronously control the modulation deflector, the galvanometer assembly, and the moving platform based on the target hole coordinate dataset, the first hole coordinate dataset, the second hole coordinate dataset, and the control speed dataset.

[0038] In a third aspect, an embodiment of the present invention provides a laser drilling device, including a processor, a memory, a modulation deflector, a galvanometer assembly, and a moving platform. A computer program is stored in the memory, and when the processor runs the computer program, it is used to implement the laser drilling control method as described above.

[0039] In a fourth aspect, an embodiment of the present invention provides a storage medium, in which a computer program is stored, and when the computer program is run, the above-mentioned laser drilling control method is implemented.

[0040] The embodiments of the present invention at least have the following beneficial effects:

[0041] Based on the filtering model, the target hole coordinate dataset is decomposed into a first hole coordinate dataset to be allocated to the moving platform and a second hole coordinate dataset to be allocated to the galvanometer assembly, and path smoothing processing and speed regulation are performed on the first hole coordinate dataset. Based on the target hole coordinate dataset, the first hole coordinate dataset, the second hole coordinate dataset, and the control speed dataset, synchronous control of the modulation deflector, the galvanometer assembly, and the moving platform is beneficial to improving the efficiency of laser drilling.

[0042] The additional aspects and advantages of the present invention will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present invention. Description of the Drawings

[0043] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, where:

[0044] Figure 1 is a schematic diagram of the laser drilling device according to an embodiment of the present invention;

[0045] Figure 2 is a flowchart of the steps of the laser drilling control method according to an embodiment of the present invention;

[0046] Figure 3 is a top view schematic diagram of the moving platform and the target workpiece according to an embodiment of the present invention;

[0047] Figure 4 is one of the working principle block diagrams of the filtering model according to an embodiment of the present invention;

[0048] Figure 5 is the second working principle block diagram of the filtering model according to an embodiment of the present invention;

[0049] Figure 6 This is a schematic block diagram of the laser drilling control device according to an embodiment of the present invention.

[0050] Reference numerals:

[0051] Target workpiece 10, modulation deflector 110, galvanometer assembly 120, moving platform 130, acquisition module 210, coordinate decomposition module 220, path smoothing processing module 230, speed regulation module 240, control module 250. Detailed implementation manners

[0052] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0053] In the description of the present invention, the meaning of "several" is one or more, the meaning of "multiple" is two or more, greater than, less than, exceeding, etc. are understood as not including the present number, and "above", "below", "within", etc. are understood as including the present number. If there is a description of "first", "second", etc., it is only for the purpose of distinguishing technical features and should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence of the indicated technical features.

[0054] In the description of the present invention, unless otherwise clearly defined, terms such as "arranged", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0055] Please refer to Figure 1 , in the related art, a laser drilling device generally includes a galvanometer assembly 120 and a moving platform 130. The galvanometer assembly 120 is used to control the position of the laser spot landing point on the target workpiece 10 (such as a circuit board), and the moving platform 130 is used to place the target workpiece 10 and drive the target workpiece 10 to move in the X-Y plane. Through the cooperation of the galvanometer assembly 120 and the moving platform 130, laser drilling is realized at different positions of the target workpiece 10. However, in the related art, the movement control of the galvanometer assembly 120 and the moving platform 130 is usually separated, that is, the moving platform 130 starts from a stationary state, then moves to the target position and stops, and then the galvanometer assembly 120 scans and drills a local position of the target workpiece 10. Compared with the time-consuming of laser drilling, the time-consuming of the start-stop and movement process of the moving platform 130 is relatively high, which becomes a bottleneck for improving the processing efficiency.

[0056] To improve the processing efficiency, a modulation deflector 110, such as an electro-optic deflector, an acousto-optic deflector, a liquid crystal phased array, a liquid crystal polarization grating, an optical phased array, etc., is added to the laser drilling equipment in the related art. The modulation deflector 110 changes the refractive index of a transparent medium by using the electro-optic effect, the acousto-optic effect, or the liquid crystal birefringence, etc., to achieve the deflection of transmitted light, or uses an optical phased array to achieve the deflection scanning of a light beam. Compared with a mechanical deflection structure such as a galvanometer assembly 120, the scanning speed of the modulation deflector 110 is very fast, but the scanning range is relatively narrow. Therefore, in the related art, adding the modulation deflector 110 on the basis of the galvanometer assembly 120 and the moving platform 130 can integrate the advantages of the modulation deflector 110 and the mechanical deflection structure, thereby improving the processing efficiency.

[0057] Although adding the modulation deflector 110 can improve the processing efficiency to a certain extent, it still cannot well meet the requirements of the increasingly developing printed circuit board manufacturing process. For this reason, the present embodiment provides a laser drilling control method, device, equipment, and storage medium, which can improve the efficiency of laser drilling through the synchronous cooperation of the modulation deflector 110, the galvanometer assembly 120, and the moving platform 130.

[0058] Please refer to Figure 1 and Figure 2 , the present embodiment discloses a laser drilling control method, which is applied to a laser drilling device having a modulation deflector 110, a galvanometer assembly 120, and a moving platform 130. The laser drilling control method includes steps S100 to S500. It should be noted that the step numbers in the present embodiment are only for the convenience of review and understanding, rather than limiting the execution order of the steps.

[0059] Before elaborating on the laser drilling control method of the present embodiment in detail, the inventive concept of the present embodiment will be elaborated first, so as to better understand the laser drilling control method of the present embodiment.

[0060] Taking an acousto-optic deflector (AOD) as an example of the modulation deflector 110, compared with the galvanometer assembly 120, the scanning speed of the acousto-optic deflector is relatively fast, but the scanning range of the acousto-optic deflector (as shown by the mark Z2 in Figure 3 ) is usually only a few micrometers, while the scanning speed of the galvanometer assembly 120 is relatively slow, but the scanning range of the galvanometer assembly 120 (as shown by the mark Z1 in Figure 3 ) is larger than that of the acousto-optic deflector. For example, the scanning range of the galvanometer assembly 120 is 30×30 micrometers. The scanning range refers to the range in which the acousto-optic deflector or the galvanometer assembly 120 can drive the laser to change the spot landing position on the target plane (such as the surface of the target workpiece 10) under the condition that other conditions remain unchanged. Generally speaking, the scanning range of the galvanometer assembly 120 is smaller than the size of the target workpiece 10. Therefore, it is necessary to drive the target workpiece 10 to move in the X-Y plane through the moving platform 130.

[0061] Assume that the time taken for laser drilling is T1, the time taken for the acousto-optic deflector to jump from one hole position to the next is T2, the jump time of the galvanometer assembly 120 is T3, and the movement time of the moving platform 130 is T4. Then, the processing time T = T1 + T2 + T3 + T4. As mentioned above, the acousto-optic deflector has the fastest jump speed, followed by the galvanometer assembly 120, and the moving platform 130 is the slowest. Therefore, a better control strategy is to make the most of the acousto-optic deflector for position jumps between holes. When the hole position exceeds the jump range of the acousto-optic deflector, the galvanometer assembly 120 is used for the jump. When the hole position exceeds the jump range of the galvanometer assembly 120, the moving platform 130 is used for the jump. Considering that the start and stop of the moving platform 130 are relatively slow and the time taken for frequent start and stop is relatively long, an ideal control strategy is: during the drilling process, control the galvanometer assembly 120 and the moving platform 130 to keep moving, so that new holes (holes outside the scanning range of the acousto-optic deflector) continuously enter the scanning range of the acousto-optic deflector. Therefore, it is necessary to decompose the drilling path composed of all holes to the galvanometer assembly 120 and the moving platform 130 to facilitate the synchronous control of the galvanometer assembly 120 and the moving platform 130.

[0062] The content of each step of the laser drilling control method is described in detail below:

[0063] S100. Obtain the target hole coordinate data set;

[0064] Exemplarily, the laser drilling control method of this embodiment can be executed in a host computer (such as a personal computer) or in a laser drilling device (which has relatively high computing power requirements for the laser drilling device). When executed in the host computer, the target hole coordinate data set can be the hole coordinate data set of the target workpiece 10 to be produced, or the hole coordinate data set after path planning, where path planning refers to the processing method of arranging the hole positions in a certain order to achieve the optimal drilling efficiency. The target hole coordinate data set contains the coordinates of a series of holes. Let the coordinate of each hole be P(x, y). Then, the target hole coordinate data set is a data set stored by arranging all the holes in a certain order, and the arrangement order is usually the order of drilling. For example, P 0 (x 0 , y 0 ), P 1 (x 1 , y 1 ), P 2 (x 2 , y 2 ),.....P n (x n , y n), where n is a positive integer. The target hole coordinate dataset can be obtained by the user manually importing it, or it can be an intermediate dataset generated after the original hole coordinate dataset is operated by the previous program.

[0065] S200. Based on a preset filtering model, decompose the target hole coordinate dataset into a low-frequency part and a high-frequency part. Use the low-frequency part as the first hole coordinate dataset and the high-frequency part as the second hole coordinate dataset. The first hole coordinate dataset is used to represent the coordinate dataset with smoother movement to be assigned to the mobile platform 130, and the second hole coordinate dataset is used to represent the coordinate dataset to be assigned to the galvanometer assembly 120;

[0066] Exemplarily, the mobile platform 130 is driven by a motor. For example, the mobile platform 130 has an X-axis motor and a Y-axis motor, and is used to move along the X-axis direction under the drive of the X-axis motor and along the Y-axis direction under the drive of the Y-axis motor, so as to realize movement in the X-Y plane under the cooperation of the X-axis motor and the Y-axis motor. During the movement, it takes a certain amount of time for the motor to drive the mobile platform 130 to accelerate or decelerate. Therefore, the control of the mobile platform 130 should be as smooth as possible to avoid the impact of sudden acceleration or deceleration on the mobile platform 130 and reduce the time-consuming ratio during the acceleration and deceleration processes.

[0067] The galvanometer assembly 120 has an X-axis galvanometer motor and a Y-axis galvanometer motor. The X-axis galvanometer motor is connected to an X-axis galvanometer, and the Y-axis galvanometer motor is connected to a Y-axis galvanometer. By driving the X-axis galvanometer and the Y-axis galvanometer to deflect respectively by the X-axis galvanometer motor and the Y-axis galvanometer motor, the laser spot landing point can be jumped within the X-Y plane. Compared with the X-axis motor and the Y-axis motor, the response speed of the X-axis galvanometer motor and the Y-axis galvanometer motor is faster, and the hole position can be jumped faster within a certain range.

[0068] Please refer to Figure 4 , in this embodiment, the target hole coordinate dataset is filtered through a filtering model to distinguish the low-frequency part (smooth part) and the high-frequency part (the part with large changes). The low-frequency part is used as the first hole coordinate dataset, and the remaining high-frequency part is used as the second hole coordinate dataset. The movement represented by the first hole coordinate dataset as the low-frequency part is smoother and is suitable for realizing the jump through the mobile platform 130. The movement represented by the second hole coordinate dataset as the high-frequency part changes relatively greatly. Realizing the jump through the galvanometer assembly 120 can avoid the sudden change of the speed of the mobile platform 130 and is beneficial to saving the time-consuming of the sudden acceleration and deceleration of the mobile platform 130. Among them, the filtering model can be a conventional low-pass filter or a high-pass filter, and the specific filtering model is determined according to the actual application requirements.

[0069] S300. Perform path smoothing processing on the first hole coordinate dataset to obtain a smooth path dataset;

[0070] Exemplarily, the movement characterized by the first hole coordinate data set obtained through filtering processing is relatively smooth. However, the hole coordinates in the first hole coordinate data set represent discrete points. If the moving platform 130 moves according to the hole coordinates in the first hole coordinate data set, the movement path will appear as continuous micro-segments in the plane. Thus, smooth movement still cannot be well achieved. For this reason, path smoothing processing needs to be performed on the first hole coordinate data set. For example, based on the Bezier curve model, path smoothing processing is performed on the first hole coordinate data set to obtain a smooth path data set. Or, based on the exponential smoothing model, path smoothing processing is performed to make the transition between adjacent micro-segments in the moving path smoother and reduce the speed change of the motor. It should be noted that the models for path smoothing processing have been fully disclosed in the related art, and will not be exemplified one by one in this embodiment.

[0071] S400. Based on the smooth path data set and the preset line segment transition speed regulation model, determine the control speed data set of the moving platform 130;

[0072] Exemplarily, after path smoothing is completed, the movement of the moving platform 130 also needs speed control. Inputting the smooth path data set into the preset line segment transition speed regulation model can determine the control speed data set of the moving platform 130 for speed control of the moving platform 130. Among them, the moving platform 130 is driven by an X-axis motor and a Y-axis motor. In practical applications, the control speed data set can be decomposed into the speed data set of the X-axis motor and the data set of the Y-axis motor based on the rules of speed synthesis and decomposition. The synthesis and decomposition of speed have been fully disclosed in the related art, and will not be elaborated in this embodiment. It is worth mentioning that the line segment transition speed regulation model can refer to the related art, such as the line segment transition speed regulation models of a section of line segment transition, circular arc transition, spline curve transition, and hybrid transition based on line segment and circular arc disclosed in the doctoral thesis "Research on Path and Speed Look-ahead Planning Algorithms for CNC Systems in High-precision Machining of Continuous Micro-segments" published by Zhu Changfeng.

[0073] S500. Based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set, and the control speed data set, perform synchronous control on the modulation deflector 110, the galvanometer assembly 120, and the moving platform 130.

[0074] Exemplarily, when the laser drilling method of this embodiment is executed in the host computer, the generated target hole coordinate dataset, the first hole coordinate dataset, the second hole coordinate dataset, and the control speed dataset can be imported into the laser drilling device, and after data parsing, the modulation deflector 110, the galvanometer assembly 120, and the moving platform 130 are synchronously controlled. When the laser drilling method of this embodiment is executed in the laser drilling device, the modulation deflector 110, the galvanometer assembly 120, and the moving platform 130 can be synchronously controlled according to the generated target hole coordinate dataset, the first hole coordinate dataset, the second hole coordinate dataset, and the control speed dataset.

[0075] Among them, the modulation deflector 110 determines the position of the hole to be processed on the target workpiece 10 according to the target hole coordinate dataset, the moving platform 130 performs motion control according to the first hole coordinate dataset and the control speed dataset, and the galvanometer assembly 120 performs motion control according to the second hole coordinate dataset. It should be noted that during the motion process, the moving platform 130 and the galvanometer assembly 120 are in a constantly moving state, so as to switch the holes outside the scanning range of the modulation deflector 110 to the scanning range of the modulation deflector 110.

[0076] Based on the filtering model, the target hole coordinate dataset is decomposed into the first hole coordinate dataset to be assigned to the moving platform 130 and the second hole coordinate dataset to be assigned to the galvanometer assembly 120, and the first hole coordinate dataset is subjected to path smoothing processing and speed regulation. Based on the target hole coordinate dataset, the first hole coordinate dataset, the second hole coordinate dataset, and the control speed dataset, the modulation deflector 110, the galvanometer assembly 120, and the moving platform 130 are synchronously controlled, which is beneficial to improving the efficiency of laser drilling.

[0077] Before step S100, obtaining the target hole coordinate dataset, it further includes:

[0078] S110, obtaining the original hole coordinate dataset;

[0079] S120, performing path planning processing on the original hole coordinate dataset to obtain the target hole coordinate dataset.

[0080] Exemplarily, the processing of a circuit board usually provides the coordinate data of the holes to be processed, that is, the original hole coordinate dataset. However, the original hole coordinate dataset only records the coordinate data of the holes and does not plan the processing sequence of the holes. In order to improve the processing efficiency, it is necessary to perform path planning processing on the original hole coordinate dataset to arrange the holes to be processed in a certain order to obtain the target hole coordinate dataset. In this way, the distance between two adjacent holes to be processed is shortened, and the processing efficiency is improved. Among them, the methods of path planning processing can adopt ant colony algorithm, ant colony optimization algorithm, genetic algorithm, and A algorithm, etc.

[0081] In some of these application examples, step S120, performing path planning processing on the original hole coordinate data set to obtain a target hole coordinate data set, includes:

[0082] S121, performing path planning processing on the original hole coordinate data set based on the principle of global path optimization to obtain a target hole coordinate data set.

[0083] Exemplarily, in order to achieve the optimal efficiency effect, all the coordinate data of the holes in the original hole coordinate data set are regarded as the input data for path planning processing, determining the optimal path passing through all the holes, that is, global path optimization, sorting all the holes in the order of the path and outputting them to obtain the target hole coordinate data set.

[0084] In practical applications, the number of holes to be processed is very large, and the path planning processing method based on the principle of global path optimization has relatively high requirements for the computing power of the device. In the case of limited device computing power, path planning processing can be performed on the original hole coordinate data set based on the principle of local path optimization to obtain a target hole coordinate data set. For example, in some other application examples, step S120, performing path planning processing on the original hole coordinate data set to obtain a target hole coordinate data set, includes:

[0085] S122, dividing the original hole coordinate data set into multiple local hole coordinate data sets according to the scanning range of the galvanometer assembly 120;

[0086] S123, performing path planning processing on the multiple local hole coordinate data sets in sequence to obtain a target hole coordinate data set;

[0087] Exemplarily, please refer to Figure 2 , the scanning range of the galvanometer assembly 120 is usually smaller than the size of the target workpiece 10. Taking the scanning range of the galvanometer assembly 120 as a processing unit (such as Figure 2 marked as D in

[0088] ), the target workpiece 10 is divided into multiple processing units, and the coordinate data of all the holes in each processing unit form a local hole coordinate data set, that is, the original hole coordinate data set is divided into multiple local hole coordinate data sets. In order to achieve local path optimization, the optimal drilling path is planned in each processing unit to improve the processing efficiency of each processing unit, that is, each local hole coordinate data set is used as a unit for path planning processing to achieve local path optimization.

[0089] Based on the principle of local path optimization, using one of the hole coordinates as the path starting point, performing path planning processing on the first local hole coordinate data set to obtain an intermediate hole coordinate data set;

[0090] Determine the starting hole coordinates of the next local hole coordinate dataset based on the principle of the shortest distance, where, among all the hole coordinates in the local hole coordinate dataset, the distance between the starting hole coordinates and the last hole coordinates of the intermediate hole coordinate dataset is the shortest;

[0091] Based on the principle of local path optimization, use the starting hole coordinates as the starting point of the path and perform path planning processing on the local hole coordinate dataset.

[0092] For example, take the upper left corner of the target workpiece 10 as the origin of the X-Y coordinates. As Figure 2 shown, divide it into multiple processing units. The movement path between each processing unit is shown by the dotted arrow L in the figure, that is, move from left to right and then return from right to left. In this way, the switching distance between two rows of processing units (that is, the distance between the last processing unit in the first row and the first processing unit in the second row) can be shortened. During the path planning process, start path planning from the first processing unit in the upper left corner. After completing the path planning of the first processing unit, there will inevitably be a hole (the last hole, as Figure 2 marked P k shown) at the end of the drilling order in the first processing unit. In the second processing unit, there may be multiple holes adjacent to the last hole. Based on the principle of the shortest distance, select the hole with the shortest distance from the last hole among the multiple holes as the starting hole for the path planning of the second processing unit (as Figure 2 marked P k+1 shown). In this way, based on the principle of local path optimization, use the starting hole coordinates as the starting point of the path and perform path planning processing on all the holes in the second processing unit, and so on. After completing the path planning of all processing units, a better path for all the holes of the target workpiece 10 can be obtained.

[0093] Among them, the target hole coordinate dataset includes the X-axis hole coordinate dataset and the Y-axis hole coordinate dataset. Step S200, based on a preset filtering model, decompose the target hole coordinate dataset into a low-frequency part and a high-frequency part, and use the low-frequency part as the first hole coordinate dataset and the high-frequency part as the second hole coordinate dataset, including:

[0094] S210, based on a preset filtering model, decompose the X-axis hole coordinate dataset into a first X coordinate dataset and a second X coordinate dataset;

[0095] S220, based on a preset filtering model, decompose the Y-axis hole coordinate dataset into a first Y coordinate dataset and a second Y coordinate dataset;

[0096] S230, combine the first X coordinate dataset and the first Y coordinate dataset to obtain the first hole coordinate dataset;

[0097] S240. Combine the second X coordinate dataset and the second Y coordinate dataset to obtain the second hole coordinate dataset.

[0098] Exemplarily, taking one hole P in the target hole coordinate dataset 0 as an example, assume the coordinates of hole P 0 are (x 0 , y 0 ). For the data x 0 in the X-axis dimension, after being filtered by the filtering model, two components can be obtained. The first component is denoted as (one element in the first X coordinate dataset), and the second component is denoted as (one element in the second X coordinate dataset). Similarly, for the data y 0 in the Y-axis dimension, after being filtered by the filtering model, two components can also be obtained. The first component is denoted as (one element in the first Y coordinate dataset), and the second component is denoted as (one element in the second Y coordinate dataset). Combining component and component can obtain the coordinate component ( , ), and combining component and component can obtain the coordinate component ( , ). Performing the same processing on the other coordinate data of the X-axis hole coordinate dataset and the Y-axis hole coordinate dataset as that of hole P 0 can obtain the first X coordinate dataset, the second X coordinate dataset, the first Y coordinate dataset, and the second Y coordinate dataset, and further combine them to obtain the first hole coordinate dataset and the second hole coordinate dataset. Through filtering and decomposition by the filtering model, it can be simply understood that the coordinates of a hole are decomposed into two parts. One part is achieved by the movement of the galvanometer component, and the other part is achieved by the movement of the moving platform. Since the movement speed of the galvanometer component is fast but the movement range is small, while the movement speed of the moving platform is slow but the movement range is wide, the combination of the two can achieve the complementary advantages with the galvanometer component as the main and the moving platform as the auxiliary.

[0099] In some application examples, step S200. Based on a preset filtering model, decompose the target hole coordinate dataset into a low-frequency part and a high-frequency part, and use the low-frequency part as the first hole coordinate dataset and the high-frequency part as the second hole coordinate dataset, including:

[0100] S201. Filter the target hole coordinate dataset based on a preset EMA (Exponential Moving Average) low-pass filter to determine the low-frequency part in the target hole coordinate dataset;

[0101] S202. Use the low-frequency part in the target hole coordinate dataset as the first hole coordinate dataset, and use the remaining part in the target hole coordinate dataset as the second hole coordinate dataset.

[0102] Exemplarily, the model relation formula of the EMA low-pass filter is:

[0103] y(t)=KdGain*u(t)+(1-KdGain)*y(t-1), KdGain∈[0, 1];

[0104] In the formula, y(t) is the output signal; u(t) is the input signal at time t; KdGain is a coefficient that affects the cut-off frequency of the filter. The low-frequency component after passing through the EMA low-pass filter is used as the first hole coordinate dataset and is allocated to the moving platform 130; while the remaining moving amount is used as the second hole coordinate dataset and is allocated to the galvanometer assembly 120, so as to achieve both high stroke and high response.

[0105] Specifically, for step S210, based on the EMA low-pass filter, decompose the X-axis hole coordinate dataset into a first X coordinate dataset and a second X coordinate dataset, where the first X coordinate dataset is the low-frequency component passing through the EMA low-pass filter, and the second X coordinate dataset is the remaining component in the X-axis hole coordinate dataset; similarly, for step S220, based on the EMA low-pass filter, decompose the Y-axis hole coordinate dataset into a first Y coordinate dataset and a second Y coordinate dataset, where the first Y coordinate dataset is the low-frequency component passing through the EMA low-pass filter, and the second Y coordinate dataset is the remaining component in the Y-axis hole coordinate dataset.

[0106] Please refer to Figure 6 , this embodiment further provides a laser drilling control device, which is applied to a laser drilling device having a modulation deflector 110, a galvanometer assembly 120, and a moving platform 130. The laser drilling control device includes an acquisition module 210, a coordinate decomposition module 220, a path smoothing processing module 230, a speed regulation module 240, and a control module 250.

[0107] The acquisition module 210 is used to acquire the target hole coordinate dataset;

[0108] The coordinate decomposition module 220 is configured to decompose the target hole coordinate dataset into a low-frequency part and a high-frequency part based on a preset filtering model, use the low-frequency part as the first hole coordinate dataset, and use the high-frequency part as the second hole coordinate dataset. The first hole coordinate dataset is used to represent the coordinate dataset with smoother movement to be assigned to the mobile platform 130, and the second hole coordinate dataset is used to represent the coordinate dataset to be assigned to the galvanometer assembly 120;

[0109] The path smoothing processing module 230 is configured to perform path smoothing processing on the first hole coordinate dataset to obtain a smoothed path dataset;

[0110] The speed regulation module 240 is configured to determine the control speed dataset of the mobile platform 130 based on the smoothed path dataset and a preset line segment transition speed regulation model;

[0111] The control module 250 is configured to synchronously control the modulation deflector 110, the galvanometer assembly 120, and the mobile platform 130 based on the target hole coordinate dataset, the first hole coordinate dataset, the second hole coordinate dataset, and the control speed dataset.

[0112] The inventive concept of the embodiment of this laser drilling control device is the same as that of the embodiment of the above laser drilling control method. For the content not involved in the embodiment of this laser drilling control device, reference may be made to the embodiment of the above laser drilling control method, which will not be elaborated here.

[0113] Decomposing the target hole coordinate dataset into the first hole coordinate dataset to be assigned to the mobile platform 130 and the second hole coordinate dataset to be assigned to the galvanometer assembly 120 based on the filtering model, performing path smoothing processing and speed regulation on the first hole coordinate dataset, and synchronously controlling the modulation deflector 110, the galvanometer assembly 120, and the mobile platform 130 based on the target hole coordinate dataset, the first hole coordinate dataset, the second hole coordinate dataset, and the control speed dataset is beneficial to improving the efficiency of laser drilling.

[0114] Please refer to Figure 1, this embodiment also provides a laser drilling device, which includes a processor, a memory, a modulation deflector 110, a galvanometer assembly 120, and a moving platform 130. A computer program is stored in the memory. When the processor runs the computer program, it is used to implement the laser drilling control method as described above. The specific content of the laser drilling control method is detailed above and will not be elaborated here. Based on the filtering model, the target hole coordinate data set is decomposed into a first hole coordinate data set to be assigned to the moving platform 130 and a second hole coordinate data set to be assigned to the galvanometer assembly 120. Path smoothing processing and speed regulation are performed on the first hole coordinate data set. Based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set, and the control speed data set, synchronous control of the modulation deflector 110, the galvanometer assembly 120, and the moving platform 130 is beneficial to improving the efficiency of laser drilling.

[0115] This embodiment also provides a storage medium, in which a computer program is stored. When the computer program is run, the above-mentioned laser drilling control method is implemented. The specific content of the laser drilling control method is detailed above and will not be elaborated here. Based on the filtering model, the target hole coordinate data set is decomposed into a first hole coordinate data set to be assigned to the moving platform 130 and a second hole coordinate data set to be assigned to the galvanometer assembly 120. Path smoothing processing and speed regulation are performed on the first hole coordinate data set. Based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set, and the control speed data set, synchronous control of the modulation deflector 110, the galvanometer assembly 120, and the moving platform 130 is beneficial to improving the efficiency of laser drilling.

[0116] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the knowledge scope of those of ordinary skill in the art to which the present invention pertains, various changes can be made without departing from the purpose of the present invention.

Claims

1. A laser drilling control method, applied to a laser drilling device having a modulation deflector, a galvanometer assembly and a mobile platform, characterized in that: include: Obtain target hole coordinate data set; Based on a preset filtering model, the target hole coordinate data set is decomposed into a low-frequency part and a high-frequency part, the low-frequency part is used as a first hole coordinate data set and the high-frequency part is used as a second hole coordinate data set, the first hole coordinate data set is used to represent a coordinate data set with smoother motion to be assigned to the mobile platform, and the second hole coordinate data set is used to represent a coordinate data set to be assigned to the galvanometer assembly; Performing path smoothing processing on the first hole coordinate data set to obtain a smoothed path data set; Determining a control speed data set of the mobile platform based on the smooth path data set and a preset line segment transition speed control model; Based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set, the modulation deflector, the galvanometer assembly and the mobile platform are synchronously controlled, wherein the modulation deflector determines the position of the hole to be processed on the target workpiece according to the target hole coordinate data set.

2. The laser drilling control method according to claim 1, characterized in that: The step of obtaining the target hole coordinate data set also includes: Get the original hole coordinate data set; The original hole coordinate data set is processed by path planning to obtain a target hole coordinate data set.

3. The laser drilling control method according to claim 2, characterized in that: Performing path planning processing on the original hole coordinate data set to obtain a target hole coordinate data set includes: Based on the global path optimization principle, the original hole coordinate data set is processed by path planning to obtain a target hole coordinate data set.

4. The laser drilling control method according to claim 2, characterized in that: Performing path planning processing on the original hole coordinate data set to obtain a target hole coordinate data set includes: According to the scanning range of the galvanometer assembly, the original hole coordinate data set is divided into a plurality of local hole coordinate data sets; Performing path planning processing on the multiple local hole coordinate data sets in sequence to obtain a target hole coordinate data set; During the path planning process: Based on the local path optimal principle, taking one of the hole coordinates as the path starting point, performing path planning processing on the first local hole coordinate data set to obtain an intermediate hole coordinate data set; Based on the shortest distance principle, determining the starting hole coordinates of the next local hole coordinate data set, wherein, among all the hole coordinates of the local hole coordinate data set, the distance between the starting hole coordinates and the last hole coordinates of the intermediate hole coordinate data set is the shortest; Based on the local path optimal principle, the starting hole coordinates are used as the path starting point, and the path planning process is performed on the local hole coordinate data set.

5. The laser drilling control method according to claim 1, characterized in that: The target hole coordinate data set includes an X-axis hole coordinate data set and a Y-axis hole coordinate data set. Based on a preset filtering model, the target hole coordinate data set is decomposed into a low-frequency part and a high-frequency part, the low-frequency part is used as a first hole coordinate data set, and the high-frequency part is used as a second hole coordinate data set, including: Based on a preset filtering model, decomposing the X-axis hole coordinate data set into a first X-coordinate data set and a second X-coordinate data set; Based on a preset filtering model, decomposing the Y-axis hole coordinate data set into a first Y-coordinate data set and a second Y-coordinate data set; Combining the first X-coordinate data set and the first Y-coordinate data set to obtain a first hole coordinate data set; The second X-coordinate data set and the second Y-coordinate data set are combined to obtain a second hole coordinate data set.

6. The laser drilling control method according to claim 1, characterized in that: The method of decomposing the target hole coordinate data set into a low-frequency part and a high-frequency part based on a preset filtering model, using the low-frequency part as a first hole coordinate data set and using the high-frequency part as a second hole coordinate data set includes: Based on a preset EMA low-pass filter, filtering is performed on the target hole coordinate data set to determine a low-frequency portion in the target hole coordinate data set; The low-frequency part of the target hole coordinate data set is used as the first hole coordinate data set, and the remaining part of the target hole coordinate data set is used as the second hole coordinate data set.

7. The laser drilling control method according to claim 1, characterized in that: The performing path smoothing processing on the first hole coordinate data set to obtain a smoothed path data set includes: Based on the Bezier curve model, path smoothing processing is performed on the first hole coordinate data set to obtain a smoothed path data set.

8. A laser drilling control device, applied to a laser drilling device having a modulation deflector, a galvanometer assembly and a moving platform, characterized in that: include: An acquisition module, used to acquire a target hole coordinate data set; A coordinate decomposition module, for decomposing the target hole coordinate data set into a low-frequency part and a high-frequency part based on a preset filtering model, using the low-frequency part as a first hole coordinate data set and the high-frequency part as a second hole coordinate data set, wherein the first hole coordinate data set is used to represent a coordinate data set with smoother motion to be assigned to the mobile platform, and the second hole coordinate data set is used to represent a coordinate data set to be assigned to the galvanometer assembly; A path smoothing processing module, used for performing path smoothing processing on the first hole coordinate data set to obtain a smoothed path data set; A speed control module, used to determine a control speed data set of the mobile platform based on the smooth path data set and a preset line segment transition speed control model; A control module is used to synchronously control the modulation deflector, the galvanometer assembly and the moving platform based on the target hole coordinate data set, the first hole coordinate data set, the second hole coordinate data set and the control speed data set, wherein the modulation deflector determines the position of the hole to be processed on the target workpiece according to the target hole coordinate data set.

9. A laser drilling device, comprising a processor, a memory, a modulation deflector, a galvanometer assembly and a mobile platform, wherein a computer program is stored in the memory, characterized in that: When the processor runs the computer program, it is used to implement the laser drilling control method according to any one of claims 1 to 7.

10. A storage medium storing a computer program, wherein: When the computer program is executed, the laser drilling control method according to any one of claims 1 to 7 is implemented.

Images