A silicon wafer surface treatment device

Abstract

The present invention belongs to the technical field of silicon wafer grinding, and discloses a silicon wafer surface treatment device, including a base, a support disk and a collection component, and further including: a grinding mechanism, including a lifting component, a cutting fluid pipe, a gear ring and a grinding wheel, a gear is meshed inside the gear ring, a driving component is connected to the upper end surface of the gear, a second connecting rod is rotatably connected to the lower end surface of the gear, a slider is rotatably installed at the lower end surface of the second connecting rod, and a fixed frame is slidably installed on the outer wall of the slider; a protection mechanism, including an extrusion component, a cooling component and a protection ring, a retaining ring is fixedly installed on the outer wall of the protection ring, a plurality of tension springs are uniformly installed along the circumference of the outer wall of the retaining ring, and a rotating block is installed on the side of the tension spring away from the retaining ring; the extrusion component includes extrusion blocks symmetrically installed on the outer wall of the slider and springs symmetrically installed on the inner wall of the fixed frame, a sliding rod is installed on the lower end surface of the spring, and a conical wheel is rotatably installed on the lower end surface of the sliding rod. The present invention solves the problem that the existing device is prone to chipping when grinding silicon wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer polishing, and specifically to a silicon wafer surface treatment device. Background Art

[0002] A silicon wafer, also known as a wafer, is the core raw material for manufacturing chips and various semiconductor devices. In semiconductor manufacturing, the surface treatment of silicon wafers is one of the key process steps, aiming to provide a high-quality foundation for subsequent processes such as lithography, doping, and deposition. Among them, polishing, as an important link in silicon wafer surface treatment, is mainly used to improve the surface quality of silicon wafers, remove surface defects and roughness, and lay a solid foundation for subsequent processing technologies.

[0003] The Chinese patent publication application number 202311214386.1, "A Single-Crystalline Silicon Wafer Surface Treatment Device with Cross-Section Grinding Function", relates to an improved polishing device. The device includes a machine shell, a surface treatment mechanism, a lifting frame, and a machine base, where the machine shell and the lifting frame are both arranged above the machine base, and the lifting frame is located inside the machine shell.

[0004] During the polishing process of this device, by adjusting the movement trajectory of the grinding wheel, uniform polishing of the silicon wafer is achieved. However, in actual operation, when the grinding wheel rotates on the surface of the silicon wafer, a large grinding force will be generated. Especially when the grinding wheel moves to the edge of the silicon wafer, the existing device cannot effectively protect the edge of the silicon wafer, which will increase the risk of surface defects of the silicon wafer, such as chipping and edge collapse, thus affecting the quality of the final product. Therefore, in view of this situation, the device needs to be optimized to reduce the occurrence of these defects. Summary of the Invention

[0005] The purpose of the present invention is to provide a silicon wafer surface treatment device, and the present invention solves the problem that the existing device is prone to chipping when polishing silicon wafers.

[0006] To achieve the above purpose, the present invention provides the following technical solution: A silicon wafer surface treatment device, including a base, a support disk located above the base for supporting the silicon wafer and rotatable, and a collection component located inside the base, further including:

[0007] A grinding mechanism, including a lifting component, a cutting fluid pipe, a gear ring, and a grinding wheel. A gear is meshed inside the gear ring. The upper end surface of the gear is connected to a driving component. The lower end surface of the gear is rotatably connected to a second connecting rod. The lower end surface of the second connecting rod is rotatably installed with a slider. The outer wall of the slider is slidably installed with a fixed frame. After the lifting component drives the grinding wheel to abut against the silicon wafer, the cutting fluid pipe supplies cutting fluid. The driving component drives the gear to rotate inside the gear ring. The gear drives the slider to reciprocate inside the fixed frame. The slider drives the grinding wheel to move on the silicon wafer to complete uniform polishing;

[0008] The protection mechanism includes an extrusion component, a cooling component and a protection ring. A retaining ring is fixedly installed on the outer wall of the protection ring. A plurality of tension springs are evenly installed on the outer wall of the retaining ring along its circumference. A rotating block is installed on the side of the tension spring away from the retaining ring; when the slider reciprocates, the extrusion component extrudes the retaining ring below the grinding wheel, and the retaining ring drives the protection ring to abut against the outer wall of the silicon wafer to prevent chipping.

[0009] The extrusion component includes extrusion blocks symmetrically installed on the outer wall of the slider and springs symmetrically installed on the inner wall of the fixed frame. A sliding rod is installed on the lower end surface of the spring. A conical wheel is rotatably installed on the lower end surface of the sliding rod; when the slider moves, it drives the extrusion block to extrude the sliding rod, and the sliding rod drives the conical wheel to descend, and the conical wheel extrudes the retaining ring.

[0010] Preferably, the collection component includes a cutting fluid chamber opened on the base, and a filter plate is slidably installed on the inner wall of the cutting fluid chamber.

[0011] Preferably, the lifting component includes a support plate fixedly installed on the outer wall of the base. An electric telescopic rod is installed on the lower end surface of the support plate, and a support frame is installed on the lower end surface of the electric telescopic rod.

[0012] Preferably, the driving component includes a second servo motor. The upper end surface of the second servo motor is installed on the support frame. A first connecting rod is fixedly installed on the output shaft of the second servo motor, and the first connecting rod is rotatably installed on the gear at the end away from the second servo motor.

[0013] Preferably, the fixed frame is fixedly connected to the support frame. A fixed ring is fixedly installed on the lower end surface of the support frame, and the lower end surface of the fixed ring is fixedly connected to the toothed ring.

[0014] Preferably, a chute is opened on the outer wall of the fixed frame corresponding to the sliding rod, and the inner wall of the chute is slidably connected to the sliding rod.

[0015] Preferably, a first servo motor is fixedly installed on the lower end surface of the slider, and the output shaft of the first servo motor is fixedly connected to the grinding wheel.

[0016] Preferably, the cooling component includes a water channel opened on the outer wall of the protection ring. A blocking block is installed on the inner wall of the water channel. A water inlet pipe and a water outlet pipe are respectively installed through one side of the water channel and penetrate through the retaining ring, and the water inlet pipe and the water outlet pipe are located on both sides of the blocking block. A water tank is installed on the side of the water inlet pipe and the water outlet pipe away from the water channel, and the water tank is installed on the lower end surface of the support disc.

[0017] Preferably, a third servo motor is installed on the upper end surface of the base, and the output shaft of the third servo motor is fixedly connected to the support disc.

[0018] Preferably, a plurality of through holes are formed in the outer wall of the support disk, and an annular groove is abutted against the corresponding positions of the through holes on the lower end face of the support disk. A plurality of pipes are uniformly communicated along the circumference of the lower end face of the annular groove, and the lower end face of the pipes penetrates through the base and is communicated with the cutting fluid tank.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] The present invention is provided with a grinding mechanism. When the grinding wheel abuts against the silicon wafer, the first servo motor drives the grinding wheel to rotate to polish the silicon wafer. The second servo motor drives the first connecting rod to rotate, and the first connecting rod drives the gear to rotate on the toothed ring. The gear drives the slider to reciprocate in the fixed frame through the second connecting rod, so that the slider can drive the grinding wheel to reciprocate on the silicon wafer for uniform polishing.

[0021] The present invention is provided with a protection mechanism. When the slider reciprocates in the fixed frame, the extrusion block on the slider will first extrude the sliding rod. The sliding rod slides in the sliding groove, driving the tapered wheel to descend and stretching the spring. At this time, the tapered wheel will squeeze the retaining ring, and the retaining ring drives the protection ring to abut against the outer wall of the silicon wafer. As the slider continues to drive the extrusion block to move, at this time, the slider drives the grinding wheel to polish the edge of the silicon wafer, and the protection ring will protect the edge of the silicon wafer, and the protection ring will cool the edge of the silicon wafer at the polishing position to reduce the occurrence of fracture or chipping. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 is a schematic diagram of the grinding mechanism of the present invention;

[0024] Figure 3 is Figure 2 an enlarged schematic view of part A in

[0025] Figure 4 is Figure 2 a cross-sectional view;

[0026] Figure 5 is a schematic diagram of the protection mechanism of the present invention;

[0027] Figure 6 is Figure 5 a schematic diagram with the silicon wafer and the retaining ring removed;

[0028] Figure 7 is Figure 6 a schematic diagram from another perspective;

[0029] Figure 8 is a schematic diagram of the inside of the cutting fluid tank of the present invention.

[0030] In the figure: 1, base; 2, cutting fluid tank; 3, silicon wafer; 4, support plate; 5, cutting fluid pipe; 6, electric telescopic rod; 7, support frame; 8, fixing ring; 9, support disk; 10, control panel; 11, toothed ring; 12, fixing frame; 13, chute; 14, spring; 15, extrusion block; 16, slide bar; 17, tapered wheel; 18, gear; 19, first servo motor; 20, grinding wheel; 21, second servo motor; 22, first connecting rod; 23, second connecting rod; 24, slider; 25, water inlet pipe; 26, rotating block; 27, tension spring; 28, water outlet pipe; 29, protective ring; 30, retaining ring; 31, water channel; 32, stop block; 33, through hole; 34, water tank; 35, annular groove; 36, pipeline; 37, third servo motor; 38, filter plate. Detailed implementation mode

[0031] Please refer to Figures 1 to 8 , the present invention provides a technical solution: a silicon wafer surface treatment device, including a base 1, a support disk 9 located above the base 1 for supporting the silicon wafer 3 and capable of rotating, and a collection component located inside the base 1, further including:

[0032] A grinding mechanism, including a lifting component, a cutting fluid pipe 5, a toothed ring 11 and a grinding wheel 20. The inner side of the toothed ring 11 is meshed with a gear 18. The upper end surface of the gear 18 is connected with a driving component. The lower end surface of the gear 18 is rotatably connected with a second connecting rod 23. The lower end surface of the second connecting rod 23 is rotatably installed with a slider 24. The outer wall of the slider 24 is slidably installed in a fixing frame 12. After the lifting component drives the grinding wheel 20 to abut against the silicon wafer 3, the cutting fluid pipe 5 supplies cutting fluid. The driving component drives the gear 18 to rotate in the toothed ring 11. The gear 18 drives the slider 24 to reciprocate in the fixing frame 12. The slider 24 drives the grinding wheel 20 to move on the silicon wafer 3 to complete uniform grinding;

[0033] A protection mechanism, including an extrusion component, a cooling component and a protective ring 29. The outer wall of the protective ring 29 is fixedly installed with a retaining ring 30. A plurality of tension springs 27 are uniformly installed on the outer wall of the retaining ring 30 along its circumference. The side of the tension spring 27 away from the retaining ring 30 is installed with a rotating block 26. The rotating block 26 is rotatably installed on the support disk 9. When the slider 24 reciprocates, the extrusion component extrudes the retaining ring 30 below the grinding wheel 20. The retaining ring 30 drives the protective ring 29 to abut against the outer wall of the silicon wafer 3 to prevent chipping;

[0034] The extrusion component includes extrusion blocks 15 symmetrically installed on the outer wall of the slider 24 and springs 14 symmetrically installed on the inner wall of the fixing frame 12. The lower end surface of the spring 14 is installed with a slide bar 16. The lower end surface of the slide bar 16 is rotatably installed with a tapered wheel 17. When the slider 24 moves, it drives the extrusion block 15 to extrude the slide bar 16. The slide bar 16 drives the tapered wheel 17 to descend. The tapered wheel 17 extrudes the retaining ring 30;

[0035] Further, as Figure 1 and Figure 8 shown, the collection component includes a cutting fluid tank 2 opened on the base 1, and a filter plate 38 is slidably installed on the inner wall of the cutting fluid tank 2;

[0036] The cutting fluid tank 2 collects the cutting fluid, and the filter plate 38 filters the cutting fluid;

[0037] Further, as Figure 1 shown, the lifting component includes a support plate 4, the support plate 4 is fixedly installed on the outer wall of the base 1, an electric telescopic rod 6 is installed on the lower end surface of the support plate 4, and a support frame 7 is installed on the lower end surface of the electric telescopic rod 6;

[0038] When the electric telescopic rod 6 moves up and down, it drives the support frame 7 to move up and down;

[0039] Further, as Figure 4 shown, the driving component includes a second servo motor 21, the upper end surface of the second servo motor 21 is installed on the support frame 7, a first connecting rod 22 is fixedly installed on the output shaft of the second servo motor 21, and one end of the first connecting rod 22 away from the second servo motor 21 is rotatably installed on the gear 18;

[0040] When the second servo motor 21 rotates, it drives the first connecting rod 22 to rotate, and the first connecting rod 22 drives the gear 18 to rotate on the toothed ring 11;

[0041] Further, as Figure 4 shown, the fixed frame 12 is fixedly connected to the support frame 7, a fixed ring 8 is fixedly installed on the lower end surface of the support frame 7, and the lower end surface of the fixed ring 8 is fixedly connected to the toothed ring 11;

[0042] When the support frame 7 rises or falls, it drives the fixed frame 12 and the fixed ring 8 to move, and the fixed ring 8 drives the toothed ring 11 to move;

[0043] Further, as shown in the figure, a chute 13 is opened on the outer wall of the fixed frame 12 corresponding to the sliding rod 16, and the inner wall of the chute 13 is slidably connected to the sliding rod 16;

[0044] The sliding rod 16 rises or falls in the chute 13;

[0045] Further, as Figure 3 shown, a first servo motor 19 is fixedly installed on the lower end surface of the slider 24, and the output shaft of the first servo motor 19 is fixedly connected to the grinding wheel 20;

[0046] The rotation of the first servo motor 19 drives the grinding wheel 20 to rotate;

[0047] Further, as Figure 6 and Figure 7As shown, the cooling component includes a water channel 31 formed on the outer wall of the protective ring 29. A stop block 32 is installed on the inner wall of the water channel 31. On one side of the water channel 31, a water inlet pipe 25 and a water outlet pipe 28 are respectively installed through the retaining ring 30, and the water inlet pipe 25 and the water outlet pipe 28 are located on both sides of the stop block 32. A water tank 34 is installed on the side away from the water channel 31 of the water inlet pipe 25 and the water outlet pipe 28. The water tank 34 is installed on the lower end face of the support disk 9, and a water pump (not shown in the figure) is installed inside the water tank 34;

[0048] When the water pump works, the water in the water tank 34 enters the water channel 31 from the water inlet pipe 25. Since the water channel 31 is blocked by the stop block 32, the water in the water channel 31 will flow around the water channel 31 and finally flow back into the water tank 34 from the water outlet pipe 28. The flow of water can accelerate the heat dissipation of the protective ring 29;

[0049] Further, as Figure 7 shown, a third servo motor 37 is installed on the upper end face of the base 1, and the output shaft of the third servo motor 37 is fixedly connected to the support disk 9;

[0050] The third servo motor 37 drives the silicon wafer 3 on the support disk 9 to rotate slowly;

[0051] Further, as Figure 6 and Figure 7 shown, a plurality of through holes 33 are formed on the outer wall of the support disk 9. An annular groove 35 abuts against the corresponding positions of the through holes 33 on the lower end face of the support disk 9. A plurality of pipes 36 are uniformly communicated along the circumference of the lower end face of the annular groove 35, and the lower end faces of the pipes 36 penetrate through the base 1 and are communicated with the cutting fluid tank 2;

[0052] The cutting fluid on the silicon wafer 3 falls into the annular groove 35 through the through holes 33, and then enters the cutting fluid tank 2 through the pipes 36;

[0053] Further, as Figure 6 shown, a suction cup is arranged at the center position of the support disk 9;

[0054] For adsorbing the silicon wafer 3 to prevent it from moving;

[0055] Further, as Figure 1 shown, a control panel 10 is installed on the outer wall of the base 1;

[0056] For setting the relevant parameters of the device and controlling the operation of the device.

[0057] Working principle: The first step: Place the silicon wafer 3 at the center position on the suction cup of the support disk 9, and then connect an external power supply. At this time, control the electric telescopic rod 6 to descend and control the third servo motor 37 to rotate. The electric telescopic rod 6 drives the support frame 7 to descend, and the support frame 7 drives the fixed ring 8 and the fixed frame 12 to descend. At this time, the fixed frame 12 drives the grinding wheel 20 to descend through the slider 24 and the first servo motor 19 and abuts against the silicon wafer 3. At the same time, the cutting fluid pipe 5 drips cutting fluid, and the third servo motor 37 drives the silicon wafer 3 on the support disk 9 to rotate, so that the cutting fluid is evenly dripped on the silicon wafer 3. When it descends to the specified position, the electric telescopic rod 6 stops descending;

[0058] The second step: When the grinding wheel 20 abuts against the silicon wafer 3, control the first servo motor 19 and the second servo motor 21 to rotate at this time. The first servo motor 19 drives the grinding wheel 20 to rotate to polish the silicon wafer 3. The second servo motor 21 drives the first connecting rod 22 to rotate, and the first connecting rod 22 drives the gear 18 to rotate on the toothed ring 11. The gear 18 drives the slider 24 to reciprocate in the fixed frame 12 through the second connecting rod 23, so that the slider 24 can drive the grinding wheel 20 to reciprocate on the silicon wafer 3 for uniform polishing;

[0059] The third step: When the slider 24 reciprocates in the fixed frame 12, at this time Figure 1 and Figure 3 For example, the extrusion block 15 on the slider 24 will first extrude the sliding rod 16. The sliding rod 16 slides in the chute 13, drives the tapered wheel 17 to descend, and stretches the spring 14. At this time, the tapered wheel 17 will extrude the retaining ring 30, and the retaining ring 30 drives the protective ring 29 to abut against the outer wall of the silicon wafer 3. At this time, the retaining ring 30 will extrude the tension spring 27 on the side close to the grinding wheel 20, and the other tension springs 27 are stretched. The stretched tension springs 27 drive the rotating block 26 to rotate on the support disk 9 for direction adjustment. As the slider 24 continues to drive the extrusion block 15 to move, at this time the slider 24 drives the grinding wheel 20 to polish the edge of the silicon wafer 3, and the protective ring 29 will protect the edge of the silicon wafer 3 to prevent chipping;

[0060] When the slider 24 drives the extrusion block 15 away from the sliding rod 16, the spring 14 contracts, drives the sliding rod 16 to slide upward in the chute 13, and the sliding rod 16 drives the tapered wheel 17 away from the retaining ring 30. At the same time, the tension springs 27 that are extruded and stretched on the outer wall of the retaining ring 30 are stretched or contracted, so that the retaining ring 30 drives the protective ring 29 to move away from the silicon wafer 3. At this time, the grinding debris and cutting fluid will fall into the annular groove 35 through the through hole 33, and then flow into the cutting fluid tank 2 through the pipeline 36 and are filtered by the filter plate 38;

[0061] Fourth step: When the grinding wheel 20 grinds the silicon wafer 3, the water pump in the water tank 34 starts to work, causing the water in the water tank 34 to flow into the water channel 31 through the water inlet pipe 25 and then flow into the interior of the water tank 34 from the water outlet pipe 28, which can prevent the temperature of the protective ring 29 from being too high. When the grinding wheel 20 grinds the edge of the silicon wafer 3, the high temperature will increase its brittleness and it is prone to fracture or chipping. At this time, while the protective ring 29 abuts against the edge of the silicon wafer 3 for protection, it can also cool down the silicon wafer 3, reducing the occurrence of fracture or chipping.

[0062] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer surface treatment device, comprising a base (1), a rotatable support plate (9) located above the base (1) for supporting a silicon wafer (3), and a collecting assembly located inside the base (1), characterized in that: Also includes: The grinding mechanism comprises a lifting component, a cutting fluid pipe (5), a gear ring (11) and a grinding wheel (20); a gear (18) is meshed inside the gear ring (11); the upper end surface of the gear (18) is connected to a driving component; the lower end surface of the gear (18) is rotatably connected to a second connecting rod (23); a slider (24) is rotatably mounted on the lower end surface of the second connecting rod (23); a fixed frame (12) is slidably mounted on the outer wall of the slider (24); when the lifting component drives the grinding wheel (20) to abut against the silicon wafer (3), the cutting fluid pipe (5) supplies cutting fluid, the driving component drives the gear (18) to rotate inside the gear ring (11), the gear (18) drives the slider (24) to reciprocate inside the fixed frame (12), and the slider (24) drives the grinding wheel (20) to move on the silicon wafer (3), thereby completing uniform grinding; The protection mechanism comprises an extrusion component, a cooling component and a protection ring (29); a retaining ring (30) is fixedly mounted on the outer wall of the protection ring (29); a plurality of tension springs (27) are evenly mounted on the outer wall of the retaining ring (30) along its circumference; a rotating block (26) is mounted on the side of the tension spring (27) away from the retaining ring (30); when the slider (24) moves back and forth, the extrusion component squeezes the retaining ring (30) below the grinding wheel (20), and the retaining ring (30) with the protection ring (29) abuts against the outer wall of the silicon wafer (3) to prevent edge collapse; The extrusion assembly comprises an extrusion block (15) symmetrically mounted on the outer wall of a slider (24) and a spring (14) symmetrically mounted on the inner wall of a fixed frame (12); a slide bar (16) is mounted on the lower end surface of the spring (14); a conical wheel (17) is rotatably mounted on the lower end surface of the slide bar (16); when the slider (24) moves, the extrusion block (15) is driven to extrude the slide bar (16); the slide bar (16) drives the conical wheel (17) to descend; and the conical wheel (17) extrude the retaining ring (30); The lifting assembly comprises a support plate (4), the support plate (4) is fixedly mounted on the outer wall of the base (1), an electric telescopic rod (6) is mounted on the lower end surface of the support plate (4), and a support frame (7) is mounted on the lower end surface of the electric telescopic rod (6); The driving assembly comprises a second servo motor (21), the upper end surface of the second servo motor (21) is mounted on a support frame (7), a first connecting rod (22) is fixedly mounted on an output shaft of the second servo motor (21), and the first connecting rod (22) is rotatably mounted on a gear (18) at one end away from the second servo motor (21).

2. The silicon wafer surface treatment equipment according to claim 1, characterized in that: The collecting assembly comprises a cutting fluid chamber (2) opened on a base (1), and a filter plate (38) is slidably mounted on the inner wall of the cutting fluid chamber (2).

3. The silicon wafer surface treatment equipment according to claim 1, characterized in that: The fixing frame (12) is fixedly connected to the support frame (7); a fixing ring (8) is fixedly mounted on the lower end surface of the support frame (7); and the lower end surface of the fixing ring (8) is fixedly connected to the gear ring (11).

4. The silicon wafer surface treatment equipment according to claim 1, characterized in that: A sliding groove (13) is provided on the outer wall of the fixed frame (12) corresponding to the sliding rod (16), and the inner wall of the sliding groove (13) is slidably connected to the sliding rod (16).

5. The silicon wafer surface treatment equipment according to claim 1, characterized in that: A first servo motor (19) is fixedly mounted on the lower end surface of the slider (24), and an output shaft of the first servo motor (19) is fixedly connected to the grinding wheel (20).

6. The silicon wafer surface treatment equipment according to claim 1, characterized in that: The cooling assembly comprises a water channel (31) opened on the outer wall of the protective ring (29), a block (32) is installed on the inner wall of the water channel (31), a water inlet pipe (25) and a water outlet pipe (28) are installed on one side of the water channel (31) penetrating the block ring (30), and the water inlet pipe (25) and the water outlet pipe (28) are located on both sides of the block (32), and a water tank (34) is installed on the side of the water inlet pipe (25) and the water outlet pipe (28) away from the water channel (31), and the water tank (34) is installed on the lower end surface of the support plate (9).

7. The silicon wafer surface treatment equipment according to claim 1, characterized in that: A third servo motor (37) is mounted on the upper end surface of the base (1), and an output shaft of the third servo motor (37) is fixedly connected to the support plate (9).

8. The silicon wafer surface treatment equipment according to claim 1, characterized in that: The outer wall of the support plate (9) is provided with a plurality of through holes (33); the lower end surface of the support plate (9) is abutted against an annular groove (35) corresponding to the through holes (33); the lower end surface of the annular groove (35) is evenly connected with a plurality of pipes (36) along its circumference; the lower end surface of the pipe (36) passes through the base (1) and is connected with the cutting fluid chamber (2).

Images