Polishing equipment

Abstract

The invention provides polishing equipment which comprises a base, a water surrounding tank and a polishing wheel, the base is arranged in the water surrounding tank, the polishing wheel is movably arranged above the base, and the polishing wheel comprises a profiling polishing part matched with a to-be-machined groove in a to-be-machined part in contour. The groove is polished through the profiling polishing piece designed in a profiling mode, the bottom face, the arc face and the like of the groove can be polished at a time in cooperation with the water surrounding groove and the base, machining procedures are reduced, the polishing efficiency is improved, meanwhile, it can be guaranteed that the polished part is completely covered with polishing liquid through soaking polishing, and the polishing effect is improved; and the situation that the polishing liquid in the machine table splashes is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of polishing equipment, and in particular relates to a polishing equipment. Background Art

[0002] In the field of consumer electronics, brittle materials (such as glass, gemstones, ceramics, etc.) have been widely used in electronic devices. In order to increase the use space and improve the aesthetics, the cover plate shape in the current electronic devices contains groove structures everywhere, where the grooves include straight body, curved surface, and bottom plane. Different parts of the conventional polishing grooves (straight body, curved surface, bottom plane) need to be replaced with different polishing rods to adapt to different parts, and the polishing efficiency is low. Or regular grinding is used to squeeze the groove to be processed to achieve one-time polishing, and polishing liquid is used to spray around the polishing grinding during the polishing process. However, this polishing method will result in uneven polishing removal and cause the groove profile to be NG (such as indentation, non-transparency, ripples, orange peel and other appearance defects). At the same time, the polishing liquid cannot fully cool the polishing contact surface, so that local overheating will occur during the polishing process, resulting in profile NG. Summary of the invention

[0003] The main purpose of the present invention is to provide a polishing device, aiming to solve the technical problems of poor polishing quality and low polishing efficiency of polishing devices in the prior art.

[0004] In order to achieve the above-mentioned purpose, the present invention provides a polishing device, which includes: a base, a water tank, and a polishing wheel, wherein the base is arranged in the water tank, and the polishing wheel is movably arranged above the base, wherein the polishing wheel includes a contoured polishing piece that matches the contour of a groove to be processed on the workpiece to be processed.

[0005] In the embodiment of the present invention, a through hole is provided at the center of the profiling polishing piece, and the outer peripheral surface and the bottom surface of the profiling polishing piece are connected through a profiling surface, and the profiling surface includes a first curved surface, and the first curved surface is connected to the bottom surface.

[0006] In an embodiment of the present invention, the first curved surface is an arc surface, the difference between the radius of the bottom surface and the radius of the through hole is d, the outer diameter of the contoured polishing part is D, the range of D / d is: 8 to 12, and the ratio of the area of ​​the bottom surface to the area of ​​the arc surface is: 0.2 to 0.8.

[0007] In an embodiment of the present invention, the polishing wheel further comprises a water collecting block connected to the contoured polishing member, the water collecting block is provided with a plurality of water suction ports, and the plurality of water suction ports are evenly distributed in a circle on the top of the contoured polishing member.

[0008] In an embodiment of the present invention, the water collecting block includes a bottom ring and a plurality of spiral blades, the bottom ring and the plurality of spiral blades form a liquid channel, the contoured polishing piece is connected to the bottom ring, the plurality of spiral blades are arranged on a side of the bottom ring away from the contoured polishing piece, the plurality of spiral blades are arranged divergently from the center, and a water suction port is formed between any two adjacent spiral blades.

[0009] In an embodiment of the present invention, the spiral blade comprises a guide surface and a water retaining surface which are arranged opposite to each other, and the guide surface and the water retaining surface are distributed at an angle.

[0010] In an embodiment of the present invention, the base is detachably fixed to the bottom of the water tank, and a placement position matching the shape of the workpiece to be processed is set on the base, and the size of the placement position on the base is 0.03mm to 0.08mm larger than the workpiece to be processed; and / or, a placement position matching the shape of the workpiece to be processed is set on the base, and a vacuum pipeline can be selectively set inside the base, and the vacuum pipeline is connected to the placement position on the base.

[0011] In an embodiment of the present invention, the water confining trough further includes a liquid inlet and a liquid outlet, the height of the liquid outlet is higher than the height of the workpiece to be processed on the base, and the height of the liquid inlet is higher than the height of the liquid outlet.

[0012] In an embodiment of the present invention, the height of the drainage port is higher than the height of the water collecting block in the polishing state; and / or, the height of the drainage port is not higher than 5 mm of the height of the water collecting block in the polishing state.

[0013] In an embodiment of the present invention, the polishing equipment also includes a drainage mechanism, which includes a water receiving trough, a guide pipe and a bottom trough. The water receiving trough is located below the surrounding water trough, the water receiving trough is connected to the drainage port, and the bottom trough is located below the water receiving trough and is connected to the water receiving trough through the guide pipe.

[0014] Through the above technical solution, the polishing equipment provided by the embodiment of the present invention has the following beneficial effects:

[0015] When the polishing equipment is polishing the workpiece to be processed, the workpiece to be processed can be fixed on the base in the water tank, and the profile of the profiling polishing piece on the polishing wheel matches the profile of the groove to be processed, so that the profiling polishing piece can polish different parts of the groove to be processed at the same time, improve the polishing efficiency, and ensure that the removal amount of each part of the groove to be processed is uniform, reduce the polishing profile NG, and improve the product yield. At the same time, the water tank in the polishing equipment can be used to surround water, which can ensure that the workpiece to be processed is always in a processing state of being soaked in polishing liquid during the polishing process on the base, and maximize the effectiveness of the polishing liquid in assisting the polishing of the profiling polishing piece. The present invention polishes the groove through the profiling polishing piece with a profiling design, and then cooperates with the water tank and the base to achieve one-time polishing of the bottom surface and curved surface of the groove, etc., reducing the processing steps and improving the polishing efficiency. At the same time, immersion polishing can ensure that the polishing part is completely covered by the polishing liquid, improve the polishing effect, and improve the situation of polishing liquid splashing in the machine.

[0016] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide an understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention, but do not constitute a limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 is a schematic diagram of the polishing wheel and base structure of a polishing device according to an embodiment of the present invention;

[0019] Figure 2 is a schematic diagram of the structure of a polishing wheel portion of a polishing device according to an embodiment of the present invention;

[0020] Figure 3 is a schematic diagram of the structure of a water collecting block of a polishing device according to an embodiment of the present invention;

[0021] Figure 4 is a schematic diagram of a cross-sectional structure of a profiled polishing piece of a polishing device according to an embodiment of the present invention;

[0022] Figure 5 is a schematic structural diagram of a contoured polishing member of a polishing device according to an embodiment of the present invention;

[0023] Figure 6 is a schematic structural diagram of a polishing device according to an embodiment of the present invention;

[0024] Figure 7 It is a schematic diagram of the base and water tank structure of a polishing device according to an embodiment of the present invention.

[0025] Description of Reference Numerals

[0026] Label Name Label Name

[0027] 1 Base 332 Spiral blade

[0028] 2 Water channel 333 guide surface

[0029] 21 Drain port 334 Water retaining surface

[0030] 22 Liquid inlet 335 Bottom ring

[0031] 3 Polishing wheel 3351 Liquid channel

[0032] 31 Profile polishing part 336 Connection hole

[0033] 311 through hole 4 drainage mechanism

[0034] 312 contoured surface 41 water tank

[0035] 313 outer surface 42 flow guide tube

[0036] 314 bottom surface 43 bottom groove

[0037] 32 Tool handle 5 Workbench

[0038] 33 Polymer block 6 Polishing shaft

[0039] 331 Water Inlet DETAILED DESCRIPTION

[0040] The specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0041] The polishing apparatus according to the present invention will be described below with reference to the accompanying drawings.

[0042] like Figures 1 to 7 As shown, in an embodiment of the present invention, the polishing equipment includes: a base 1, a water trough 2, and a polishing wheel 3, wherein the base 1 is arranged in the water trough 2, and the polishing wheel 3 is movably arranged above the base 1, wherein the polishing wheel 3 includes a contoured polishing part 31 matching the contour of the groove to be processed on the workpiece to be processed.

[0043] It should be noted that the workpiece to be processed can be fixed on the base 1, the polishing liquid can enter the surrounding water tank 2, and the contour polishing piece 31 can be driven by the driving mechanism to rotate.

[0044] When the polishing equipment in this embodiment is used to polish the workpiece, the workpiece can be fixed on the base 1 in the water tank 2, and the profile of the profiling polishing piece 31 on the polishing wheel 3 matches the profile of the groove to be processed, so that the profiling polishing piece 31 can polish different parts of the groove to be processed at the same time, improve the polishing efficiency, and ensure that the removal amount of each part of the groove to be processed is uniform, reduce the polishing profile NG, and improve the product yield. At the same time, the water tank 2 in the polishing equipment can be used to surround water, which can ensure that the workpiece is always in a processing state of being immersed in the polishing liquid during the polishing process on the base 1, and maximize the effectiveness of the polishing liquid in assisting the polishing of the profiling polishing piece 31. This embodiment polishes the groove through the profiling polishing piece with a profiling design, and then cooperates with the water tank and the base to achieve one-time polishing of the bottom surface and arc surface of the groove, etc., which reduces the processing steps and improves the polishing efficiency. At the same time, immersion polishing can ensure that the polishing part is completely covered by the polishing liquid, improves the polishing effect, and improves the situation of polishing liquid splashing in the machine.

[0045] Specifically, the polishing method in which the polishing liquid completely immerses the part to be polished can avoid the appearance problems such as indentations, ripples, and orange peel caused by insufficient polishing liquid on the contact surface between the bottom of the polishing rod and the workpiece to be processed in the prior art. Allowing the base 1 to be immersed in the polishing liquid for processing not only solves the hygiene problem that the polishing liquid splashes around the machine or fogs at a certain height, causing the polishing liquid to solidify into a solid powder, but also maximizes the effectiveness of the polishing liquid for auxiliary polishing. In addition, allowing the base 1 to be immersed in the polishing liquid for processing can also avoid the polishing powder entering the internal structure of the machine during the operation of the machine, causing the machine to fail to work normally and resulting in a high machine failure rate. Since the contour of the groove to be processed is non-standard, the contour design of the contour polishing piece 31 can avoid the uneven removal amount caused by using a standard polishing rod to polish a non-standard contour in the prior art, resulting in an incomplete R angle and a contour degree NG caused by uneven removal amount.

[0046] In one embodiment, if Figure 2 , Figure 4 and Figure 5 As shown, a through hole 311 is provided at the center of the profiling polishing member 31 , and an outer peripheral surface 313 of the profiling polishing member 31 is connected to a bottom surface 314 via a profiling surface 312 . The profiling surface 312 includes a first curved surface, and the first curved surface is connected to the bottom surface 314 .

[0047] During the polishing process, the polishing liquid can circulate in the center of the profiling polishing piece 31 through the through hole 311 set in the center of the profiling polishing piece 31, thereby improving the bottom polishing effect and solving the appearance defects caused by the inability to completely cool the bottom in the prior art. The outer peripheral surface 313 and the bottom surface 314 of the profiling polishing piece 31 are connected through the profiling surface 312. The first curved surface of the profiling surface 312 processes the side wall of the groove to be processed, which can ensure that the removal amount of each point of the side wall of the groove to be processed is uniform. At the same time, the bottom surface 314 processes the bottom of the groove to be processed. The method of connecting the outer peripheral surface 313 and the bottom surface 314 through the profiling surface 312 can solve the problem of poor polishing effect at the root R angle position between the bottom and the side wall.

[0048] In a specific embodiment, in order to further improve the polishing efficiency and synchronize the polishing of the bottom and side walls of the groove to be processed, it can be achieved by controlling the ratio of the outer diameter of the profiling polishing member 31 and the difference between the radius of the bottom surface 314 and the radius of the through hole 311, such as Figure 4 As shown, the first curved surface is an arc surface, the difference between the radius of the bottom surface 314 and the radius of the through hole 311 is d, the outer diameter of the profiling polishing member 31 is D, the range of D / d is: 8 to 12, and the ratio of the area of ​​the bottom surface 314 to the area of ​​the arc surface is: 0.2 to 0.8. When the ratio of the outer diameter D of the profiling polishing member 31 to the difference d between the radius of the bottom surface 314 and the radius of the through hole 311 is between 8 and 12, and the ratio of the area of ​​the bottom surface 314 to the area of ​​the arc surface is within the range of 0.2 to 0.8, the situation that the bottom surface 314 and the arc surface of the profiling polishing member 31 cannot be worn synchronously can be avoided, and the side wall and the bottom of the workpiece to be processed can be polished synchronously, and the bottom surface of the groove to be processed has met the requirements but the R angle removal is too small / large or the R angle at the root of the groove to be processed is not good, and the polishing efficiency is further improved.

[0049] It should be noted that the profiling polishing member 31 can be a polishing leather member or a polyurethane member. The polishing leather member and the polyurethane member are easy to obtain and manufacture, and can ensure the polishing effect while reducing the cost. In other embodiments, the profiling polishing member 31 can be a rubber member, a wooden member or a metal member. The profiling polishing member 31 of matching material can be selected according to the grooves of different materials to be polished.

[0050] In one embodiment, if Figures 1 to 3As shown, the polishing wheel 3 also includes a water collecting block 33 connected to the profile polishing member 31, and the water collecting block 33 is provided with a plurality of water suction ports 331, and the plurality of water suction ports 331 are evenly distributed on the top of the profile polishing member 31 in a circumferential manner. In this embodiment, the profile polishing member 31 can be connected to the polishing shaft 6 through the water collecting block 33, so that the polishing liquid can circulate at the center of the profile polishing member 31, improve the bottom polishing effect, and solve the bottom appearance defects. The plurality of water suction ports 331 are located at the top of the through hole 311, so that the polishing liquid can enter the through hole 311 through the plurality of water suction ports 331 at the same time, so that the polishing liquid circulates to the center of the profile polishing member 31, increases the contact area and contact time between the polishing liquid and the groove to be polished, improves the polishing cooling efficiency, and thus improves the polishing effect.

[0051] In a specific embodiment, if Figure 3 As shown, the water collecting block 33 includes a bottom ring 335 and a plurality of spiral blades 332, the bottom ring 335 and the plurality of spiral blades 332 form a liquid channel 3351, the profiling polishing member 31 is connected to the bottom ring 335, the plurality of spiral blades 332 are arranged on the side of the bottom ring 335 away from the profiling polishing member 31, the plurality of spiral blades 332 are arranged to diverge from the center, and a water suction port 331 is formed between any two adjacent spiral blades 332. The upper part of the water collecting block 33 is a blade-like structure, when rotating at high speed, the pressure around the spiral blades 332 is small, and the external pressure is large, at this time, the external polishing liquid flows from the high pressure area to the low pressure area. When the water collecting block 33 is immersed in the polishing liquid and rotates at high speed, the rotation and convection principle can be used to make the polishing liquid converge into the through hole 311 through the plurality of water suction ports 331, so that the polishing liquid can circulate in the center of the profiling polishing member 31.

[0052] In a specific embodiment, the spiral blade 332 is provided with a guide surface 333 and a water retaining surface 334, and the guide surface 333 and the water retaining surface 334 are distributed at an angle. The guide surface 333 can be set as an arc surface, and the guide arc direction of the guide surface 333 is in the opposite direction to the rotation direction of the polishing shaft 6. The guiding function of the guide surface 333 and the water retaining function of the water retaining surface 334 can form a water absorption structure, so that the polishing liquid enters the water absorption port 331 between the guide surface 333 and the water retaining surface 334. The middle of the lower part of the water collecting block 33 is hollowed out to form a liquid channel 3351, and the diameter of the liquid channel 3351 is greater than or equal to the diameter of the through hole 311 in the center of the contoured polishing member 31. It not only reduces the weight of the water-collecting block 33, but also combines with the through hole 311 structure in the center of the contoured polishing piece 31 to play the role of gathering the polishing liquid. At the same time, since the workpiece to be processed is completely immersed in the polishing liquid, the powder in the polishing liquid can more easily gather on the polishing surface, making the polishing of the contoured polishing piece 31 and the workpiece to be processed more complete, thereby effectively improving the appearance defects of the bottom surface 314 of the groove to be processed.

[0053] In one embodiment, the polishing wheel 3 further comprises a handle 32, which is connected to the polishing shaft 6 and the water collecting block 33 respectively. A connection hole 336 can be provided at the center of the spiral blade 332, and the spiral blade 332 can be detachably connected to the handle 32 through the connection hole 336, so as to facilitate the replacement of the water collecting block 33. In addition, in order to facilitate the replacement and maintenance of the profile polishing member 31 and the water collecting block 33, the profile polishing member 31 and the water collecting block 33 can be detachably connected by bonding. The profile polishing member 31 in this embodiment is a flexible member, and the bonding method can avoid the situation that the screw connection is prone to being stressed, and can also avoid the situation that the profile polishing member 31 is deformed due to the connection, thereby further ensuring the stability and polishing accuracy of the profile polishing member 31.

[0054] In one embodiment, if Figure 6 and Figure 7 As shown, the water tank 2 also includes a liquid inlet 22 and a liquid discharge port 21. The height of the liquid discharge port 21 is higher than the height of the workpiece to be processed on the base 1, and the height of the liquid inlet 22 is higher than the height of the liquid discharge port 21. In this way, when the workpiece to be processed on the base 1 is processed, the polishing liquid flows into the water tank 2 from the liquid inlet 22, and the liquid level can immerse the workpiece to be processed. When the polishing liquid is higher than the liquid discharge port 21, it will overflow. In this way, it can be ensured that the contoured polishing part 31 is always in the polishing liquid in the polishing state, so that the polishing liquid is in full contact with the groove to be polished, avoiding local overheating.

[0055] In a specific embodiment, the height of the drain port 21 is higher than the height of the water collecting block 33 in the polishing state. The main reason is that in the polishing state, if the height of the water collecting block 33 is higher than the liquid level of the polishing liquid, the polishing liquid cannot enter the through hole 311 of the contour polishing member 31 from the water collecting block 33, so that the workpiece cannot be completely cooled, the polishing cannot be fully wetted, and local overheating will occur, resulting in appearance problems. Preferably, the height of the drain port 21 is not higher than the height of the water collecting block 33 in the polishing state by 5 mm. This is mainly because if the height of the water collecting block 33 is lower than the liquid level of the polishing liquid by more than 5 mm, splashing will occur, causing dirt inside the machine, affecting both hygiene and the sealing of the machine.

[0056] In one embodiment, if Figure 1 and Figure 7 As shown, the base 1 arranged in the water trough 2 is detachably fixed to the bottom of the water trough 2, and a placement position matching the shape of the workpiece to be processed is arranged on the base 1. The size of the placement position on the base 1 is 0.03mm to 0.08mm larger than the workpiece to be processed. In this way, a certain gap is left between the workpiece to be processed and the base 1, which can compensate for the influence of the placement deviation of the workpiece to be processed on the polishing removal amount, so that the polishing force is more uniform.

[0057] In a specific embodiment, if Figure 7As shown, in order to better fix the workpiece to be processed on the base 1, a vacuum pipeline can be selectively set inside the base 1, and the vacuum pipeline is connected to the placement position on the upper surface of the base 1, so that the workpiece to be processed can be fixed on the base 1 by vacuum adsorption, avoiding poor polishing caused by displacement of the workpiece to be processed during processing.

[0058] In one embodiment, if Figure 6 As shown, the polishing device also includes a drainage mechanism 4, which is connected to the drainage port 21. In this embodiment, the water tank 2 and the drainage mechanism 4 are added on the basis of the original design, so that the base 1 can be immersed in the polishing liquid for processing, and the liquid level of the polishing liquid is controlled at the same time, so that there will be no splashing and fogging in the polishing state, which not only solves the machine hygiene problem, but also maximizes the effectiveness of the polishing liquid in assisting the polishing of the contoured polishing piece 31, so that immersion polishing can be achieved and the polishing efficiency can be improved.

[0059] The drainage mechanism 4 includes a water receiving trough 41, a guide pipe 42 and a bottom trough 43, wherein the drainage port 21 in the surrounding water trough 2 flows to the water receiving trough 41. When the height of the polishing liquid in the trough is higher than the height of the drainage port 21, the polishing liquid will flow out from the drainage port 21 to the water receiving trough 41, and when the height of the polishing liquid is lower than the height of the drainage port 21, it will not flow out. In this way, the polishing liquid in the surrounding water trough 2 can be maintained at a stable height, ensuring that the contoured polishing part 31 can be immersed in the polishing liquid all the time. At the same time, the surrounding water trough 2 can also prevent the polishing liquid from splashing around the machine, effectively controlling the hygiene of the machine.

[0060] In order to prevent the polishing liquid flowing out of the water tank 2 from splashing to the outside when flowing to the water receiving tank 41, the water tank 2 and the water receiving tank 41 are connected by a guide member, and the guide member is connected to the drain port 21, which can guide the polishing liquid overflowing from the water tank 2 to the water receiving tank 41. The water receiving tank 41 can filter the glass powder in the polishing liquid and discharge the polishing liquid into the bottom tank 43 through the guide pipe 42; the polishing liquid in the bottom tank 43 can be recycled after treatment. The profiling polishing piece 31 is polished by immersing it in the water tank 2, which can effectively improve the appearance problems such as indentation, ripples, orange peel, etc. caused by insufficient polishing liquid on the contact surface between the bottom of the profiling polishing piece 31 and the workpiece to be processed, and also avoid the problem of poor machine hygiene caused by splashing polishing liquid.

[0061] In one embodiment, in order to make the arrangement of the various components in the polishing equipment more regular, reduce the space of the polishing equipment, and make the various components cooperate with each other more smoothly, the polishing equipment also includes a workbench 5, the surrounding water tank 2 and the base 1 are both installed on the workbench 5, the workbench 5 can drive the surrounding water tank 2 and the base 1 to move, and the drainage mechanism 4 includes a water receiving tank 41 installed on the workbench 5, the water receiving tank 41 is located below the surrounding water tank 2, and the upper end of the water receiving tank 41 is provided with an opening connected to the drainage port 21, the bottom tank 43 is located below the water receiving tank 41 and is connected to the water receiving tank 41 through the guide pipe 42, so that the self-gravity of the polishing liquid can be fully utilized to flow from the surrounding water tank 2 to the water receiving tank 41, and then to the bottom tank 43, thereby avoiding the polishing liquid in the prior art from being transmitted to the corresponding receiving point through a pipeline. At the same time, the polishing liquid is filtered by the water receiving tank 41 during the outflow process, thereby reducing the subsequent processing steps.

[0062] In the description of the present invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0063] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0064] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0065] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A polishing device, characterized in that: The polishing device comprises: a base (1), a water trough (2), and a polishing wheel (3); the base (1) is arranged in the water trough (2); the polishing wheel (3) is movably arranged above the base (1); wherein the polishing wheel (3) comprises a contoured polishing piece (31) matching the contour of a groove to be processed on a workpiece to be processed.

2. The polishing device according to claim 1, characterized in that: A through hole (311) is provided at the center of the profiling polishing piece (31); an outer peripheral surface (313) of the profiling polishing piece (31) is connected to a bottom surface (314) via a profiling surface (312); the profiling surface (312) comprises a first curved surface, and the first curved surface is connected to the bottom surface (314).

3. The polishing device according to claim 2, characterized in that: The first curved surface is an arc surface, the difference between the radius of the bottom surface (314) and the radius of the through hole (311) is d, the outer diameter of the contoured polishing piece (31) is D, the range of D / d is: 8 to 12, and the ratio of the area of ​​the bottom surface (314) to the area of ​​the arc surface is: 0.2 to 0.

8.

4. The polishing device according to any one of claims 1 to 3, characterized in that: The polishing wheel (3) further comprises a water collecting block (33) connected to the contoured polishing piece (31), wherein the water collecting block (33) is provided with a plurality of water suction ports (331), and the plurality of water suction ports (331) are evenly distributed in a circumferential manner on the top of the contoured polishing piece (31).

5. The polishing device according to claim 4, characterized in that: The water collecting block (33) comprises a bottom ring (335) and a plurality of spiral blades (332), wherein the bottom ring (335) and the plurality of spiral blades (332) form a liquid channel (3351), the contoured polishing member (31) is connected to the bottom ring (335), the plurality of spiral blades (332) are arranged on a side of the bottom ring (335) away from the contoured polishing member (31), the plurality of spiral blades (332) are arranged to diverge from the center, and a water suction port (331) is formed between any two adjacent spiral blades (332).

6. The polishing device according to claim 5, characterized in that: The spiral blade (332) comprises a guide surface (333) and a water retaining surface (334) which are arranged opposite to each other, and the guide surface (333) and the water retaining surface (334) are distributed at an angle.

7. The polishing device according to any one of claims 1 to 3, characterized in that: The base (1) is detachably fixed to the bottom of the water conserving tank (2), and a placement position matching the shape of the workpiece to be processed is provided on the base (1), and the size of the placement position on the base (1) is 0.03 mm to 0.08 mm larger than the workpiece to be processed; And / or, a placement position matching the shape of the workpiece to be processed is provided on the base (1), and a vacuum pipeline can be selectively provided inside the base (1), and the vacuum pipeline is connected to the placement position on the base (1).

8. The polishing device according to claim 4, characterized in that: The water confining tank (2) further comprises a liquid inlet (22) and a liquid outlet (21), wherein the height of the liquid outlet (21) is higher than the height of the workpiece to be processed on the base (1), and the height of the liquid inlet (22) is higher than the height of the liquid outlet (21).

9. The polishing device according to claim 8, characterized in that: The height of the liquid discharge port (21) is higher than the height of the water collecting block (33) in the polishing state; And / or, the height of the drainage port (21) is not higher than 5 mm of the height of the water collecting block (33) in the polishing state.

10. The polishing device according to claim 8, characterized in that: The polishing device further comprises a drainage mechanism (4), the drainage mechanism (4) comprising a water receiving trough (41), a flow guide pipe (42) and a bottom trough (43), the water receiving trough (41) being located below the surrounding water trough (2), the water receiving trough (41) being connected to the drainage port (21), and the bottom trough (43) being located below the water receiving trough (41) and being connected to the water receiving trough (41) through the flow guide pipe (42).

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