Liquid supply finishing device and polishing equipment

By integrating the dressing mechanism and the liquid supply mechanism in the polishing equipment, coaxial operation is achieved, which solves the problems of large space occupied by equipment and interference between devices in the existing technology, and improves space utilization.

CN119347642AActive Publication Date: 2025-01-24江苏元夫半导体科技有限公司
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Patent Information

Application Number
CN202411535224.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-31
Publication Date
2025-01-24
Estimated Expiration
2044-10-31

AI Technical Summary

Technical Problem

In the existing polishing equipment, the polishing liquid supply and the polishing pad trimmer are arranged in different positions, occupying a large amount of workbench space, and interfering between devices is prone to occur.

Method used

Design a liquid supply repair device to integrate the repair mechanism and liquid supply mechanism in one device. By the design of the rotating shaft and ring rotor, the repair mechanism and the liquid supply mechanism operate the same axis to save the installation space.

Benefits of technology

The coaxial integration of the trimming mechanism and the liquid supply mechanism is realized, which saves installation space, improves the space utilization of CMP equipment, and avoids interference between devices.

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Abstract

The invention relates to the field of chemical mechanical polishing, and discloses a liquid supply trimming device and polishing equipment, the liquid supply trimming device comprises a trimming mechanism, a liquid supply mechanism, a liquid supply mechanism and a liquid supply mechanism, the trimming mechanism is rotatably connected to a bearing part through a rotating shaft, and the trimming mechanism can trim a polishing pad; the liquid supply mechanism is rotationally arranged on the bearing part through an annular rotating part, the annular rotating part is arranged around the rotating shaft, the rotating axis of the annular rotating part and the rotating axis of the rotating shaft are collinear, and the liquid supply mechanism can provide polishing liquid for the polishing pad; the first driving part is fixed relative to the bearing part, and the first driving part is connected with the rotating shaft so as to drive the trimming mechanism to swing; and the second driving piece is fixed relative to the bearing piece, and the second driving piece is connected with the annular rotating piece so as to drive the liquid supply mechanism to swing. According to the liquid supply finishing device and the polishing equipment, the finishing mechanism and the liquid supply mechanism are integrated, the installation space is saved, and the space utilization rate is increased.
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Description

Technical Field

[0001] The present application relates to the field of chemical mechanical polishing, and in particular to a liquid supply and finishing device and a polishing equipment. Background Art

[0002] CMP stands for Chemical Mechanical Polishing, which is one of the key technologies for semiconductor surface processing. The polishing module of CMP equipment is mainly composed of polishing disc, polishing head, cleaning station, polishing liquid supplier, polishing pad dresser, etc. The polishing liquid supplier is responsible for supplying polishing liquid and deionized water to the polishing pad during the polishing process, and the polishing pad dresser is responsible for repairing the polishing pad during the polishing process.

[0003] However, in a type of polishing equipment in the existing related technology, the polishing liquid supplier and the polishing pad dresser are respectively arranged on the liquid supply station and the dressing station, and arranged at different positions around the polishing pad, which not only occupies the space on the workbench of the polishing equipment, but also needs to consider whether there will be interference between the devices when arranging the positions. Summary of the invention

[0004] The embodiments of the present application disclose a liquid supply dressing device and a polishing equipment, which integrate a dressing mechanism and a liquid supply mechanism, save the installation space required for the dressing mechanism and the liquid supply mechanism on the carrier, and improve the space utilization rate of the CMP equipment.

[0005] In order to achieve the above-mentioned purpose, in a first aspect, an embodiment of the present application discloses a liquid supply trimming device for a polishing device, wherein the polishing device comprises a polishing platform and a carrier, wherein a polishing pad for carrying a material is provided on the polishing platform, wherein the carrier is used to carry the liquid supply trimming device, and wherein the liquid supply trimming device comprises:

[0006] A dressing mechanism, the dressing mechanism is rotatably connected to the carrier through a rotating shaft, and the dressing mechanism can dress the polishing pad;

[0007] a liquid supply mechanism, the liquid supply mechanism being rotatably disposed on the carrier member via an annular rotating member, the annular rotating member being disposed around the rotating shaft, the rotating axis of the annular rotating member being colinear with the rotating axis of the rotating shaft, and the liquid supply mechanism being capable of providing polishing liquid to the polishing pad;

[0008] a first driving member, wherein the first driving member is fixed relative to the bearing member and connected to the rotating shaft to drive the trimming mechanism to swing;

[0009] A second driving member, wherein the second driving member is fixed relative to the supporting member and connected to the annular rotating member to drive the liquid supply mechanism to swing.

[0010] As an optional embodiment, the first driving member is a first motor, the first motor includes a first stator and a first rotor, the first stator is fixedly connected to the supporting member, and the first rotor is connected to the rotating shaft; the second driving member is a second motor, the second motor includes a second stator and a second rotor, the second stator surrounds the rotating shaft and is fixedly connected to the supporting member, and the second rotor is connected to the annular rotating member.

[0011] As an optional implementation, the first stator is fixedly connected to the lower surface of the carrier, and the second stator is fixedly connected to the upper surface of the carrier.

[0012] As an optional implementation, the first rotor is rotatably connected to the carrier via a first rotatable connection member, and the second rotor is rotatably connected to the carrier via a second rotatable connection member.

[0013] As an optional embodiment, the first rotating connection member includes a first sliding member and a first guide member, and the first sliding member and the first guide member are slidingly connected; the second rotating connection member includes a second sliding member and a second guide member, and the second sliding member and the second guide member are slidingly connected; the first guide member and the second guide member respectively surround the rotation axis of the rotating shaft and are fixedly connected to the supporting member; the first sliding member and the first rotor are fixedly connected, and the second sliding member and the second rotor are fixedly connected.

[0014] As an optional embodiment, the trimming mechanism includes a first swing arm and a trimming head, the end of the first swing arm close to the rotating shaft is connected to the rotating shaft, and the trimming head is connected to the end of the first swing arm away from the rotating shaft. The liquid supply mechanism also includes a second swing arm and a liquid supply nozzle, the second swing arm is connected to the annular rotating member, and the liquid supply nozzle is arranged on the second swing arm.

[0015] As an optional implementation, the length of the first swing arm is greater than the length of the second swing arm, and the first swing arm is located above the second swing arm.

[0016] As an optional embodiment, the liquid supply nozzle includes a first liquid supply nozzle and a second liquid supply nozzle, the first liquid supply nozzle is arranged toward the polishing pad, and is used to provide polishing liquid to the polishing pad or to rinse the polishing pad, and the second liquid supply nozzle is used to rinse the dressing mechanism.

[0017] As an optional embodiment, the liquid supply trimming device also includes a first shell and a second shell, the first shell is arranged on the carrier, the first shell is connected to the liquid supply mechanism, the second shell is connected to the trimming mechanism, and the first shell and the second shell are spaced apart.

[0018] In a second aspect, the present application discloses a polishing device, comprising:

[0019] A carrier, wherein a polishing platform is provided on the carrier;

[0020] A polishing pad, which is disposed on the polishing platform and is used for polishing a material;

[0021] A polishing head assembly, wherein the polishing head assembly is arranged on the carrier, the polishing head assembly is arranged corresponding to the polishing pad, and the polishing head assembly is used to carry the material;

[0022] A loading assembly, the loading assembly is arranged on the carrier, and the loading assembly is used for cleaning and temporarily storing the polished material;

[0023] The liquid supply trimming device described in the first aspect is arranged on the supporting member.

[0024] Compared with the prior art, the beneficial effects of this application are:

[0025] The liquid supply dressing device provided in the embodiment of the present application integrates the dressing mechanism and the liquid supply mechanism, wherein the first driving member is connected to the rotating shaft, the second driving member is connected to the annular rotating member, and the annular rotating member is sleeved on the rotating shaft to realize the coaxiality of the dressing mechanism and the liquid supply mechanism. This can save the installation space required for the dressing mechanism and the liquid supply mechanism on the carrier, thereby improving the space utilization rate on the CMP equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 It is a structural schematic diagram of the liquid supply trimming device disclosed in the embodiment of the present application;

[0028] Figure 2 A schematic diagram of the structure of the polishing equipment disclosed in the embodiment of the present application;

[0029] Figure 3 for Figure 2Another structural schematic diagram of the polishing equipment in FIG.

[0030] Description of reference numerals:

[0031] 100-liquid supply and dressing device; 1-dressing mechanism; 11-rotating axis; 12-first swing arm; 13-dressing head; 2-liquid supply mechanism; 21-annular rotating member; 22-second swing arm; 3-first driving member; 31-first stator; 32-first rotor; 33-mounting seat; 4-second driving member; 41-second stator; 42-second rotor; 5-first rotating connecting member; 6-second rotating connecting member; 7-housing; 71-first shell; 72-second shell; 200-polishing equipment; 201-polishing platform; 202-carrying member; 203-polishing pad; 204-polishing head assembly; 205-loading assembly. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0033] In this application, the terms "upper", "lower", "inner", "vertical" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0034] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to specific circumstances.

[0035] In addition, the terms "disposed", "provided with", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0037] CMP, or Chemical Mechanical Planarization, is a key process for achieving ultra-high surface flatness in semiconductor manufacturing. This technology combines chemical action and mechanical grinding to effectively remove materials and ensure the microscopic precision and flatness of the wafer surface. Among them, the polishing liquid supply system in the polishing module of the CMP equipment can distribute polishing liquid and deionized water to the surface of the polishing pad, and the polishing pad dressing device in the polishing module can dynamically maintain the flatness and structural integrity of the polishing pad during operation, ensuring that the polishing pad is always in the best working condition.

[0038] In the related art, the polishing liquid supply system and the polishing pad dressing mechanism are placed in different areas around the workbench. This layout not only occupies the working space, but also causes interference problems between devices.

[0039] Based on this, the embodiment of the present application discloses a liquid supply dressing device and a polishing equipment, which integrate the dressing mechanism and the liquid supply mechanism, save the installation space required for the dressing mechanism and the liquid supply mechanism on the carrier, and improve the space utilization rate of the CMP equipment.

[0040] The technical solution of the present application will be further described below in conjunction with embodiments and drawings.

[0041] See also Figure 1 , Figure 1 It is a schematic structural diagram of the liquid supply trimming device 100 disclosed in an embodiment of the present application.

[0042] In the first aspect, the embodiment of the present application discloses a liquid supply dressing device 100, which is used for a polishing device 200. The polishing device 200 includes a polishing platform 201 and a carrier 202. The polishing platform 201 is provided with a polishing pad 203 for carrying a material. The carrier 202 is used to carry the liquid supply dressing device 100. The liquid supply dressing device 100 includes:

[0043] A dressing mechanism 1, which is rotatably connected to the carrier 202 via a rotating shaft 11, and can dress the polishing pad 203;

[0044] A liquid supply mechanism 2, the liquid supply mechanism 2 is rotatably disposed on the carrier 202 via an annular rotating member 21, the annular rotating member 21 is disposed around the rotating shaft 11, the rotating axis of the annular rotating member 21 is colinear with the rotating axis of the rotating shaft 11, and the liquid supply mechanism 2 can provide polishing liquid for the polishing pad 203;

[0045] A first driving member 3, the first driving member 3 is fixed relative to the bearing member 202, and the first driving member 3 is connected to the rotating shaft 11 to drive the trimming mechanism 1 to swing;

[0046] The second driving member 4 is fixed relative to the bearing member 202 and is connected to the annular rotating member 21 to drive the liquid supply mechanism 2 to swing.

[0047] Specifically, the main function of the dressing mechanism 1 is to repair and maintain the surface of the polishing pad 203 to ensure that the polishing pad 203 can provide a uniform polishing effect during the polishing process. The dressing mechanism 1 generally includes one or more dressing heads 13, which can perform reciprocating scanning motion on the surface of the polishing pad 203 to remove protrusions and damage on the surface of the polishing pad 203 and restore the flatness and polishing performance of the polishing pad 203.

[0048] The liquid supply mechanism 2 is responsible for supplying polishing liquid to the polishing pad 203. The polishing liquid contains abrasive particles and chemical additives. The polishing liquid interacts with the surface of the material during the polishing process to achieve material removal. The liquid supply mechanism 2 needs to ensure that the polishing liquid can be evenly distributed on the surface of the polishing pad 203 and is continuously supplied during the polishing process to maintain the polishing effect.

[0049] The first driving member 3 and the second driving member 4 respectively control the swing of the trimming mechanism 1 and the liquid supply mechanism 2, and the first driving member 3 and the second driving member 4 drive the relevant components to achieve the required dynamic adjustment and control.

[0050] In one embodiment, when the polishing device 200 is ready to perform a polishing operation, the dressing mechanism 1 and the liquid supply mechanism 2 of the liquid supply and dressing device 100 move to a preset position. When the polishing device 200 completes loading, the liquid supply mechanism 2 supplies polishing liquid to the polishing pad 203. The polishing device 200 starts to perform a polishing operation on the polishing pad 203. The dressing mechanism 1 reciprocates around the axis of the rotating shaft 11 according to a preset path to dress the polishing pad 203.

[0051] In one embodiment, when the polishing device 200 completes the polishing operation, the polishing device 200 transfers the polished material and leaves the polishing pad 203, the liquid supply mechanism 2 stops supplying the polishing liquid and starts supplying deionized water to rinse the polishing pad 203, the trimming mechanism 1 stops reciprocating motion, and waits for the polishing device 200 to load the material again before starting to swing.

[0052] In one embodiment, when the polishing device 200 completes re-loading, the liquid supply mechanism 2 stops supplying deionized water and starts supplying polishing liquid, and the trimming mechanism 1 starts to reciprocate around the axis of the rotating shaft 11 according to a preset path.

[0053] In the liquid supply dressing device 100 provided in the embodiment of the present application, the dressing mechanism 1 is connected to the rotating shaft 11, and the annular rotating member 21 in the liquid supply mechanism 2 is arranged around the rotating shaft 11, so that the dressing mechanism 1 and the liquid supply mechanism 2 are coaxially arranged, and the dressing mechanism 1 and the liquid supply mechanism 2 are integrated into one device. In this way, the liquid supply dressing device 100 provided in the embodiment of the present application can save the installation space required for the dressing mechanism 1 and the liquid supply mechanism 2 on the carrier 202 while realizing the two functions of dressing and liquid supply, thereby improving the space utilization rate of the CMP equipment.

[0054] Specifically, see Figure 1 The first driving member 3 is a first motor, which includes a first stator 31 and a first rotor 32. The first stator 31 is fixedly connected to the supporting member 202, and the first rotor 32 is connected to the rotating shaft 11; the second driving member 4 is a second motor, which includes a second stator 41 and a second rotor 42. The second stator 41 surrounds the rotating shaft 11 and is fixedly connected to the supporting member 202, and the second rotor 42 is connected to the annular rotating member 21.

[0055] In one embodiment, the first stator 31 is fixedly connected to the carrier 202, the first rotor 32 is connected to the rotating shaft 11, the first stator 31 drives the first rotor 32 to rotate by electromagnetic induction, the first rotor 32 drives the rotating shaft 11 and the dressing mechanism 1 to swing, the second stator 41 is fixedly connected to the carrier 202, the second rotor 42 is connected to the annular rotating member 21, the second stator 41 drives the second rotor 42 to rotate by electromagnetic induction, the second rotor 42 drives the annular rotating member 21 to rotate around the axis of the rotating shaft 11.

[0056] Among them, the first rotor 32 is connected to the rotating shaft 11, the second rotor 42 is connected to the annular rotating member 21, and the annular rotating member 21 is arranged around the rotating shaft 11, so that the trimming mechanism 1 and the liquid supply mechanism 2 are coaxial and can be controlled to rotate separately, thereby realizing the integration of the trimming mechanism 1 and the liquid supply mechanism 2. In addition, the coaxial design reduces additional guide and support structures, making the structure of the liquid supply trimming device 100 more concise, reducing manufacturing costs and complexity.

[0057] Optionally, see Figure 2 , Figure 2It is a structural schematic diagram of the polishing device 200 disclosed in the embodiment of the present application. The first stator 31 is fixedly connected to the lower surface of the carrier 202, the second stator 41 is fixedly connected to the upper surface of the carrier 202, and the rotating shaft 11 passes through the upper surface of the carrier 202 and is connected to the first stator 31 and the trimming mechanism 1. Specifically, the carrier 202 is provided with a mounting cavity, the first stator 31 is arranged in the mounting cavity and is fixedly connected to the carrier 202, and the second stator 41 is arranged on the upper surface of the carrier 202, so that the first driving member 3 and the second driving member 4 are stacked in the vertical direction and do not affect each other.

[0058] Among them, on the one hand, the first driving member 3 and the second driving member 4 are arranged in the vertical direction, and the trimming mechanism 1 and the liquid supply mechanism 2 are integrated, which can further reduce the space occupied by the trimming mechanism 1 and the liquid supply mechanism 2 and improve the space utilization rate. On the other hand, the first driving member 3 and the second driving member 4 are positioned independently, which reduces the potential mechanical or electrical interference between the first driving member 3 and the second driving member 4, and ensures that the operation of the first driving member 3 and the second driving member 4 is more stable and reliable.

[0059] See also Figure 1 , the first rotor 32 is rotatably connected to the carrier 202 through the first rotating connection member 5, and the second rotor 42 is rotatably connected to the carrier 202 through the second rotating connection member 6. Specifically, the first rotating connection member 5 includes a first sliding member and a first guide member, and the first sliding member and the first guide member are slidably connected; the second rotating connection member 6 includes a second sliding member and a second guide member, and the second sliding member and the second guide member are slidably connected; the first guide member and the second guide member respectively surround the rotation axis of the rotating shaft 11 and are fixedly connected to the carrier 202; the first sliding member and the first rotor 32 are fixedly connected, and the second sliding member and the second rotor 42 are fixedly connected.

[0060] In one embodiment, the first stator 31 is fixedly connected to the supporting member 202 via a mounting seat 33, the first stator 31 is connected to the mounting seat 33, the first rotor 32 is connected to the rotating shaft 11, the rotating shaft 11 is connected to the first rotating connection member 5, and the first rotating connection member 5 is connected to the supporting member 202, so that when the first rotor 32 drives the rotating shaft 11 to rotate, the rotating shaft 11 can rotate relative to the supporting member 202.

[0061] In one embodiment, the first rotating connecting member 5 includes a first sliding member and a first guide member, the first guide member is fixedly connected to the bearing member 202, and the first sliding member is connected to the rotating shaft 11. When the first stator 31 drives the first rotor 32 to rotate, the first rotor 32 drives the rotating shaft 11 to rotate, and the first sliding member rotates relative to the first guide member following the rotating shaft 11. The first sliding member can be directly fixedly connected to the rotating shaft 11, or directly fixedly connected to the first stator 31.

[0062] Among them, the first rotating connecting member 5 can be a first bearing, the first guiding member is a first outer ring, the first sliding member is a first inner ring, the first outer ring is fixedly connected to the supporting member 202, and the first inner ring is fixedly connected to the rotating shaft 11. When the first stator 31 drives the first rotor 32 to rotate, the first rotor 32 drives the rotating shaft 11 to rotate, and the first inner ring follows the rotating shaft 11 to rotate relative to the first outer ring.

[0063] In another embodiment, the first guide member is an annular guide rail, the first sliding member may be a pulley, the annular guide rail is fixedly connected to the supporting member 202, the pulley is connected to the rotating shaft 11, when the first stator 31 drives the first rotor 32 to rotate, the first rotor 32 drives the rotating shaft 11 to rotate, and the pulley rolls on the annular guide rail following the rotating shaft 11. The embodiment of the present application does not limit the selection of the first rotating connector 5.

[0064] In one embodiment, the second stator 41 is fixedly connected to the carrier 202, the second stator 41 is arranged around the rotating axis 11, the second rotating connection member 6 is arranged around the rotating axis 11 and fixedly on the carrier 202, the second rotor 42 is rotatably arranged on the second rotating connection member 6, and the annular rotating member 21 is fixedly connected to the second rotor 42. When the second stator 41 drives the second rotor 42 to rotate, the second rotor 42 drives the annular rotating member 21 to rotate relative to the second rotating connection member 6.

[0065] In one embodiment, the second rotating connecting member 6 includes a connecting member body, a second guide member and a second sliding member. The connecting member body is fixedly arranged on the supporting member 202, the second guide member is fixedly arranged on the connecting member body, and the second rotor is connected to the second sliding member. When the second stator 41 drives the second rotor 42 to rotate, the second rotor 42 drives the second sliding member to rotate relative to the second guide member, so that the second rotor 42 can rotate relative to the supporting member 202.

[0066] In one embodiment, the second rotating connecting member 6 may be a second bearing, which includes a second outer ring and a second inner ring, the second outer ring is connected to the second rotor 42, and the second inner ring is arranged on the supporting member 202. When the second stator 41 drives the second rotor 42 to rotate, the second rotor 42 drives the second outer ring to rotate relative to the second inner ring; wherein the second inner ring can be fixed to the supporting member 202 through the connecting member body, or can be directly fixed to the supporting member 202.

[0067] In one embodiment, the second guide member may be an annular guide rail, and the second sliding member may be a pulley. The annular guide rail is arranged on the upper surface of the connecting member body, and the pulley is arranged on the lower surface of the second rotor 42. When the second stator 41 drives the second rotor 42 to rotate, the second rotor 42 can drive the pulley to roll on the annular guide rail. The embodiment of the present application does not limit the selection of the second rotating connecting member 6.

[0068] Among them, the first rotor 32 and the rotating shaft 11 are rotated relative to the supporting member 202 through the first rotating connecting member 5. On the one hand, the first sliding member and the first guiding member in the first rotating connecting member 5 cooperate with each other, which not only supports the rotating shaft 11, but also avoids the shaking of the rotating shaft 11 due to the lack of limit during rotation, and avoids the rotating shaft 11 from contacting the supporting member 202 during rotation, causing unnecessary wear on the supporting member 202 and the rotating shaft 11, thereby ensuring the stability of the rotation of the rotating shaft 11 and the first rotor 32, and extending the service life of the rotating shaft 11.

[0069] Among them, the second rotor 42 can rotate relative to the supporting member 202 through the second rotating connecting member 6. The connecting member body in the second rotating connecting member 6 is fixed on the supporting member 202, providing stable support and precise positioning for the second rotor 42 and the liquid supply mechanism 2, ensuring the smoothness and accuracy of the rotational movement of the second rotor 42. The second guide member provides a movement path for the second rotor 42, ensuring that the second rotor 42 can rotate smoothly along a predetermined trajectory when rotating, avoiding wear caused by additional radial or lateral displacement, and extending the service life of the second rotor 42.

[0070] Optionally, see Figure 1 The trimming mechanism 1 includes a first swing arm 12 and a trimming head 13. The end of the first swing arm 12 close to the rotating shaft 11 is connected to the rotating shaft 11. The trimming head 13 is connected to the end of the first swing arm 12 away from the rotating shaft 11. The liquid supply mechanism 2 includes a second swing arm 22 and a liquid supply nozzle. The second swing arm 22 is connected to the annular rotating member 21. The liquid supply nozzle is arranged on the second swing arm 22.

[0071] In one embodiment, when the polishing device 200 is ready to perform a polishing operation, the first driving member 3 drives the rotating shaft 11 to drive the first swing arm 12 and the dressing head 13 to rotate to a preset position, and the second driving member 4 drives the annular rotating member 21 to drive the second swing arm 22 and the liquid supply nozzle to rotate to a preset position. When the polishing device 200 starts the polishing operation, the second driving member 4 and the second swing arm 22 are stationary, the liquid supply nozzle supplies polishing liquid to the polishing pad 203, the first driving member 3 drives the first swing arm 12 to swing back and forth along a preset path, and the dressing head 13 rotates to grind and trim the polishing pad 203.

[0072] In one embodiment, when the polishing equipment 200 completes the polishing operation, the first driving member 3 stops driving the rotating shaft 11 to rotate, the first swing arm 12 and the second swing arm 22 are stationary, the second driving member 4 and the second swing arm 22 are stationary, and the liquid supply nozzle stops supplying polishing liquid and starts supplying deionized water to rinse the polishing pad 203.

[0073] It can be understood that by setting the first swing arm 12 and the second swing arm 22, the first swing arm 12 is responsible for carrying the dressing head 13 and driving the dressing head 13 to polish at a preset position; the second swing arm 22 ensures the positioning of the liquid supply nozzle, and the first swing arm 12 and the second swing arm 22 work together to improve the accuracy of the polishing operation, and the independent first swing arm 12 and the second swing arm 22 are easy to maintain.

[0074] Optionally, see Figure 1 On the one hand, the length of the first swing arm 12 is greater than that of the second swing arm 22. Specifically, because swing arms of different lengths will occupy different spaces when in motion, in the polishing device 200, the first swing arm 12 and the second swing arm 22 swing around the rotation axis 11. If the first swing arm 12 and the second swing arm 22 have the same length, the first swing arm 12 and the second swing arm 22 will contact and interfere with each other when swinging, limiting the range of motion and working freedom of the dressing mechanism 1. By designing the first swing arm 12 and the second swing arm 22 to have different lengths, it can be ensured that the first swing arm 12 and the second swing arm 22 will not collide with each other when working, thereby allowing the first swing arm 12 and the second swing arm 22 to move freely in a preset space, ensuring the normal operation of the polishing device 200.

[0075] On the other hand, the first swing arm 12 is located above the second swing arm 22. Specifically, when the first swing arm 12 and the second swing arm 22 are working, the liquid supply nozzle on the second swing arm 22 needs to provide polishing liquid to the polishing pad 203, and the liquid supply mechanism 2 is usually fixed when the polishing device 200 is working, and the dressing head 13 on the first swing arm 12 needs to dress different positions on the polishing pad 203, so the first swing arm 12 usually reciprocates according to a preset path when the polishing device 200 is working. If the first swing arm 12 is below the second swing arm 22, the polishing liquid or deionized water provided by the liquid supply nozzle on the second swing arm 22 will be sprayed. The polishing liquid is a chemical liquid, and the first swing arm 12 and the dressing head 13 will accelerate the wear and corrosion of mechanical parts due to long-term liquid erosion, reduce the service life of the liquid supply and dressing device 100, and increase maintenance costs. In addition, the polishing liquid or deionized water provided by the liquid supply nozzle on the second swing arm 22 will be sprayed on the first swing arm 12 and the dressing head 13 and splashed around. Accidental spraying of liquid may cause the operating environment to be slippery, increase the risk of workers slipping, or cause safety problems such as short circuits near electrical components.

[0076] The first swing arm 12 and the dressing head 13 need to be rinsed after grinding the polishing pad 203 to ensure the dressing effect of the dressing head 13 on the polishing pad 203. In the related art, a flushing mechanism is usually set separately for the dressing mechanism 1. Optionally, the liquid supply nozzle includes a first liquid supply nozzle and a second liquid supply nozzle. The first liquid supply nozzle is set toward the polishing pad 203, and is used to provide polishing liquid to the polishing pad 203 or to rinse the polishing pad 203. The second liquid supply nozzle is used to rinse the dressing mechanism 1.

[0077] In one embodiment, when the polishing device 200 is ready to perform a polishing operation, the second swing arm 22 drives the first liquid supply nozzle and the second liquid supply nozzle to move to a preset position, and the first liquid supply nozzle supplies polishing liquid to the polishing pad 203 .

[0078] In another embodiment, when the polishing equipment 200 completes the polishing operation, the first swing arm 12 stops above the second swing arm 22, the first liquid supply nozzle on the first swing arm 12 provides deionized water to the polishing pad 203 to rinse the polishing pad 203, and the second liquid supply nozzle is directed toward the dressing mechanism 1 to rinse the dressing mechanism 1.

[0079] It can be understood that, compared with separately setting up a flushing mechanism for the dressing mechanism 1, through the first liquid supply nozzle and the second liquid supply nozzle, the first liquid supply nozzle is used to provide polishing liquid and deionized water to the polishing pad 203, and the second liquid supply nozzle is used to flush the dressing mechanism 1. There is no need to additionally design and install an independent flushing mechanism, which reduces material and manufacturing costs. In addition, by setting up the first liquid supply nozzle and the second liquid supply nozzle, the need for an additional flushing mechanism is reduced, the structure of the liquid supply dressing device 100 is simplified, space is saved, and the liquid supply dressing device 100 is more compact as a whole.

[0080] Optionally, the trimming mechanism 1 further comprises a third driving member, which is connected to the first swing arm 12 to drive the first swing arm 12 to drive the trimming head 13 to move in the vertical direction to adjust the position and pressure of the trimming head 13 .

[0081] It can be understood that by driving the first swing arm 12 through the third driving member, the position of the dressing head 13 in the vertical direction can be adjusted to ensure that the dressing head 13 can be aligned with a specific area of ​​the polishing pad 203, thereby improving the accuracy of the polishing process.

[0082] Optionally, the liquid supply trimming device 100 further includes a first shell 71 and a second shell 72 , the first shell 71 is disposed on the carrier 202 , the liquid supply mechanism 2 is connected to the first shell 71 , the second shell 72 is connected to the trimming mechanism 1 , and the first shell 71 and the second shell 72 are spaced apart.

[0083] It can be understood that the first shell 71 and the second shell 72 can prevent dust, impurities and external forces from damaging the internal liquid supply mechanism 2 and the trimming mechanism 1, ensuring the stable operation of the liquid supply and trimming device 100, and through the application of shock-absorbing materials, the first shell 71 and the second shell 72 can reduce the vibration and noise of the liquid supply and trimming device 100 during operation, creating a quieter working environment. The first shell 71 and the second shell 72 are arranged at intervals so that the liquid supply mechanism 2 and the trimming mechanism 1 can be controlled separately during operation without affecting each other, ensuring the working effect of the liquid supply mechanism 2 and the trimming mechanism 1.

[0084] Second, see Figure 2 , the embodiment of the present application provides a polishing device 200, comprising:

[0085] A carrier 202, on which a polishing platform 201 is disposed;

[0086] A polishing pad 203, which is disposed on the polishing platform 201 and is used for polishing the material;

[0087] A polishing head assembly 204, which is disposed on the carrier 202, and the polishing head assembly 204 is disposed corresponding to the polishing pad 203, and is used to carry materials;

[0088] A loading assembly 205, which is disposed on the carrier 202, and is used for cleaning and temporarily storing the polished material;

[0089] In the first aspect, the liquid supply trimming device 100 is disposed on a carrier 202 .

[0090] See also Figure 2 and Figure 3 , Figure 3 for Figure 2 Another structural schematic diagram of the polishing device 200 in the embodiment of the present application includes the following working process:

[0091] S1. The trimming mechanism 1 and the liquid supply mechanism 2 are moved to a preset position;

[0092] S2. The polishing head assembly 204 loads the material from the loading assembly 205;

[0093] S3. The polishing head assembly 204 moves to a preset position on the polishing pad 203;

[0094] S4. The liquid supply mechanism 2 delivers the polishing liquid to the polishing pad 203, while the polishing head assembly 204 presses the material onto the polishing pad 203 for polishing;

[0095] S5. The dressing mechanism 1 starts to swing back and forth, and at the same time, the dressing mechanism 1 presses the dressing head 13 onto the polishing pad 203 for dressing;

[0096] S6. The polishing head assembly 204 transfers the polished material to the loading assembly 205, and at the same time, the liquid supply mechanism 2 stops delivering the polishing liquid and starts delivering deionized water to rinse the polishing pad 203;

[0097] S7. Repeat S2 to S6 for polishing;

[0098] S8. After the polishing operation is completed, the dressing mechanism 1 and the liquid supply mechanism 2 return to their initial positions.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid supply dressing device for a polishing device, the polishing device comprising a polishing platform and a carrier, the polishing platform is provided with a polishing pad for carrying materials, the carrier is used to carry the liquid supply dressing device, characterized in that: The liquid supply finishing device comprises: A dressing mechanism, the dressing mechanism is rotatably connected to the carrier through a rotating shaft, and the dressing mechanism can dress the polishing pad; a liquid supply mechanism, the liquid supply mechanism being rotatably disposed on the carrier member via an annular rotating member, the annular rotating member being disposed around the rotating shaft, the rotating axis of the annular rotating member being colinear with the rotating axis of the rotating shaft, and the liquid supply mechanism being capable of providing polishing liquid to the polishing pad; a first driving member, wherein the first driving member is fixed relative to the bearing member and connected to the rotating shaft to drive the trimming mechanism to swing; A second driving member, wherein the second driving member is fixed relative to the supporting member and connected to the annular rotating member to drive the liquid supply mechanism to swing.

2. The liquid supply trimming device according to claim 1, characterized in that: The first driving member is a first motor, which includes a first stator and a first rotor, the first stator is fixedly connected to the supporting member, and the first rotor is connected to the rotating shaft; the second driving member is a second motor, which includes a second stator and a second rotor, the second stator surrounds the rotating shaft and is fixedly connected to the supporting member, and the second rotor is connected to the annular rotating member.

3. The liquid supply trimming device according to claim 2, characterized in that: The first stator is fixedly connected to the lower surface of the bearing member, and the second stator is fixedly connected to the upper surface of the bearing member.

4. The liquid supply trimming device according to claim 2 or 3, characterized in that: The first rotor is rotatably connected to the carrier via a first rotatable connection member, and the second rotor is rotatably connected to the carrier via a second rotatable connection member.

5. The liquid supply trimming device according to claim 4, characterized in that: The first rotating connection member includes a first sliding member and a first guide member, and the first sliding member and the first guide member are slidably connected; the second rotating connection member includes a second sliding member and a second guide member, and the second sliding member and the second guide member are slidably connected; the first guide member and the second guide member respectively surround the rotation axis of the rotating shaft and are fixedly connected to the supporting member; the first sliding member and the first rotor are fixedly connected, and the second sliding member and the second rotor are fixedly connected.

6. The liquid supply trimming device according to claim 1, characterized in that: The trimming mechanism includes a first swing arm and a trimming head, wherein one end of the first swing arm close to the rotating shaft is connected to the rotating shaft, and the trimming head is connected to the end of the first swing arm away from the rotating shaft. The liquid supply mechanism also includes a second swing arm and a liquid supply nozzle, wherein the second swing arm is connected to the annular rotating member, and the liquid supply nozzle is arranged on the second swing arm.

7. The liquid supply trimming device according to claim 6, characterized in that: The length of the first swing arm is greater than that of the second swing arm, and the first swing arm is located above the second swing arm.

8. The liquid supply trimming device according to claim 6, characterized in that: The liquid supply nozzle includes a first liquid supply nozzle and a second liquid supply nozzle. The first liquid supply nozzle is arranged toward the polishing pad and is used to provide polishing liquid to the polishing pad or to rinse the polishing pad. The second liquid supply nozzle is used to rinse the dressing mechanism.

9. The liquid supply trimming device according to claim 1, characterized in that: The liquid supply trimming device further includes a first shell and a second shell, wherein the first shell is disposed on the carrier, the first shell is connected to the liquid supply mechanism, the second shell is connected to the trimming mechanism, and the first shell and the second shell are spaced apart.

10. A polishing device, characterized in that: include: A carrier, wherein a polishing platform is provided on the carrier; A polishing pad, which is disposed on the polishing platform and is used for polishing a material; A polishing head assembly, wherein the polishing head assembly is arranged on the carrier, the polishing head assembly is arranged corresponding to the polishing pad, and the polishing head assembly is used to carry the material; A loading assembly, the loading assembly is arranged on the carrier, and the loading assembly is used for cleaning and temporarily storing the polished material; The liquid supply trimming device according to any one of claims 1 to 9, wherein the liquid supply trimming device is arranged on the carrier.

Citation Information

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