PCB overturning and assembling equipment and assembling method

Abstract

The invention relates to the field of liquid crystal panel production, in particular to a PCB overturning and assembling device and method, and the overturning and assembling device comprises a feeding mechanism which completes the feeding of a liquid crystal panel; the film tearing mechanism is used for tearing off the protective film; the assembling mechanism comprises a first transferring device, a second positioning assembly, a first overturning assembly and a first visual device arranged right above the second positioning assembly, and is used for completing the assembly of the PCB; and the blanking mechanism is used for completing blanking of the liquid crystal panel assembled with the PCB. When the PCB is assembled, after the position of the positioning pin is collected, the positioning pin is driven to move downwards; the position of the positioning pin is adjusted by collecting the position of the positioning hole of the overturned PCB, taking the position of the positioning hole as a reference and according to the collected position of the positioning pin, so that the plane position of the positioning pin is the same as that of the positioning hole, the positioning pin is driven to move upwards to be connected with the positioning hole, and the positioning pin can be accurately connected with the positioning hole; and thus, the accuracy of PCB connection is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid crystal panel production, and in particular to a PCB board flip assembly device and an assembly method. Background Art

[0002] In the structure of the LCD panel, there is a PCB board connected to it through a flexible cable to achieve photoelectric conversion. Fig.12 As shown, the PCB board is usually connected to the edge of the panel, and the housing is provided with a positioning pin and a rubber strip. During assembly, the protective film at the rubber strip is first torn off, and then the PCB board is folded so that the positioning hole on the PCB board is connected to the positioning pin and adhered to the housing through the rubber strip. In the prior art, the above process is usually performed manually, but the labor intensity of manual labor is large and the efficiency is low. Manual labor will produce fatigue when working for a long time, and it is not possible to ensure that the positioning hole is accurately installed on the positioning pin, resulting in a high defect rate. In addition, the protective film on the rubber strip is torn off before the PCB board is installed, and too many processes should not be interspersed before assembly to avoid contamination of the tape and affect the viscosity. However, when tearing the film manually, it is necessary to use fingers or tools to remove the film, which is difficult to remove the film, affecting production efficiency, and it is easy to accidentally touch the tape, causing tape contamination. Therefore, how to improve the efficiency of tearing the tape protective film, PCB board assembly and the yield rate are issues that technicians in this field need to consider. Summary of the invention

[0003] The purpose of the present invention is to provide a PCB board flip assembly device and an assembly method to solve the problems of difficulty in tearing off the tape, low PCB board assembly efficiency and high defect rate in the prior art.

[0004] The technical solution of the present invention is: a PCB board flip assembly device, comprising: The loading mechanism completes the loading of the LCD panel and transfers it to the film tearing station; The film-tearing mechanism is arranged at the film-tearing station, and comprises a first conveying assembly, a first positioning assembly and a film-tearing assembly. The liquid crystal panel is loaded onto the first conveying assembly and positioned by the first positioning assembly, and then the protective film is torn off by the film-tearing assembly. The assembly mechanism includes a first transfer device, a second positioning component, a first flipping component and a first visual device arranged directly above the second positioning component; the second positioning component includes a first carrier plate, and a driving component arranged at the lower end of the first carrier plate and capable of driving the first carrier plate to move in the X-axis, Y-axis, Z-axis and Z-axis rotation axis; the first flipping component includes a first suction cup component and a first rotating device capable of driving the first suction cup component to flip 180 degrees; the first transfer device picks up the liquid crystal panel at the film tearing station and transfers it to the first carrier plate; when flipping, the first carrier plate first drives the liquid crystal panel to move downward, and after the first suction cup component drives the PCB board to flip 180 degrees, it moves upward after being adjusted by the driving device to complete assembly with the PCB board; The unloading mechanism is used to unload the LCD panel after assembling the PCB board.

[0005] Preferably, the film tearing assembly includes a clamping device, the clamping device includes a first clamping jaw and a second clamping jaw, the lower surface of the first clamping jaw is not lower than the lower surface of the second clamping jaw; the first clamping jaw is provided with a blowing hole, and the air outlet of the blowing hole is simultaneously opened on the lower surface of the first clamping jaw and on a side of the first clamping jaw close to the second clamping jaw; When tearing the film, the clamping device moves downward so that the lower surface of the second clamping jaw contacts the protective film, and the blowing hole blows air to make the non-adhesive section of the protective film tilt up; at the same time, the first clamping jaw moves toward the second clamping jaw, contacts the non-adhesive section of the protective film to the second clamping jaw, and completes the clamping; the clamping device then tilts upward to complete the film tearing; Preferably, the film tearing assembly includes a second transfer device and a collection box, the second transfer device is connected to a first drive device with a vertical driving direction; the clamping device is connected to the first drive device; after tearing the film, the protective film can be transferred to the collection box under the drive of the second transfer device.

[0006] Preferably, the first conveying assembly comprises two first conveying belts that move in parallel and synchronously, and there is a gap between the two first conveying belts; The first positioning assembly includes a first positioning frame and a second positioning frame arranged on both sides of the conveying direction of the first conveying assembly, and a third positioning frame and a fourth positioning frame arranged between the two first conveyor belts; when the liquid crystal panel is conveyed to the first conveyor belt, the first positioning frame and the second positioning frame move toward each other and contact the two sides of the liquid crystal panel to complete the left and right direction positioning; the fourth positioning frame contacts the liquid crystal panel in the direction of the third positioning frame to complete the front and back direction positioning.

[0007] Preferably, when the liquid crystal panel is placed on the first carrier board, the straight line where the liquid crystal panel is connected to the PCB board is higher than and parallel to the straight line where the rotation axis of the first rotating device is located; The first suction cup assembly is connected to the first rotating device through a first bracket; before flipping, the opening end of the suction port of the first suction cup assembly faces upward to suck the PCB board, and the plane where the opening end is located is lower than the horizontal plane where the rotation axis of the first rotating device is located.

[0008] Preferably, the driving assembly includes a second rotating device connected to the lower end of the first carrier and capable of driving the first carrier to rotate along the Z axis, a second driving device connected to the second rotating device and capable of driving the first carrier to move along the Z axis, a third driving device connected to the second driving device and capable of driving the first carrier to move in the Y axis direction, and a fourth driving device connected to the third driving device and capable of driving the first carrier to move in the X axis direction.

[0009] Preferably, the unloading mechanism includes a support plate, a fifth driving device connected to the support plate and capable of driving the support plate to move vertically, and a sixth driving device connected to the fifth driving device and capable of driving the support plate to move closer to or away from the first carrier plate; The first carrier plate is provided with a notch, the support plate moves upward through the notch and supports the liquid crystal panel, and then moves away from the first carrier plate under the drive of the sixth driving device to complete the unloading.

[0010] The PCB board flip assembly method includes the following steps: S1, after the first visual device collects the position data of the positioning pins on the liquid crystal panel, the second driving device drives the first carrier plate and drives the liquid crystal panel to move downward; S2, the first rotating device flips the PCB board 180 degrees through the first suction cup assembly, and then collects the position information of the positioning holes on the PCB board through the first visual device; S3, the driving assembly drives the first carrier plate to adjust the position of the liquid crystal panel according to the position information of the positioning hole and the positioning pin through the cooperation of the second rotating device, the third driving device and the fourth driving device, so that the positioning pin is directly below the positioning hole; S4, the second driving device drives the first carrier plate to move upward and reset, so that the positioning pin is connected with the positioning hole, and the PCB board is adhered to the adhesive surface.

[0011] Compared with the prior art, the advantages of the present invention are: (1) The automatic film tearing and PCB board automatic flip assembly settings greatly improve production efficiency while reducing labor intensity and costs; (2) When assembling the PCB board, after collecting the position of the positioning pin, drive it to move downward; then collect the position of the positioning hole of the flipped PCB board, take the position of the positioning hole as a reference, and adjust the position of the positioning pin according to the collected position of the positioning pin, so that the plane position of the positioning pin and the positioning hole are the same, and then drive the positioning pin to move upward to connect with the positioning hole, so that the positioning pin can be accurately connected with the positioning hole, thereby ensuring the accuracy of the PCB board connection; (3) When tearing the film, the film is peeled off by blowing air downward at an angle. The raised part of the protective film is between the clamping devices, and then the protective film is clamped for tearing. While improving the film peeling efficiency, it completely avoids accidental contact with the tape during the film tearing process and avoids contamination of the adhesive surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present invention will be further described below in conjunction with the accompanying drawings and embodiments: Figure 1 The structure diagram of the PCB board flip assembly device of the present invention is shown in FIG. Figure 1 ; Figure 2 The structure diagram of the PCB board flip assembly device of the present invention is shown in FIG. Figure 2 ; Figure 3 This is a schematic diagram of the top view of the PCB board flip assembly device of the present invention; Figure 4 It is a structural schematic diagram of the film tearing mechanism of the present invention; Figure 5 It is a structural schematic diagram of the clamping device of the present invention; Figure 6 It is a schematic structural diagram of a single clamping device according to the present invention; Figure 7 It is a schematic diagram of the structure of the clamping device of the present invention when film is being formed; Figure 8 It is a structural schematic diagram of the assembly mechanism of the present invention; Fig. 9 It is a schematic diagram of the structure of the driving assembly of the present invention; Fig.10 is a schematic structural diagram of the first flip assembly of the present invention; Fig.11 It is a structural schematic diagram of the material unloading mechanism of the present invention; Fig.12 is a schematic structural diagram of the liquid crystal panel of the present invention; Fig.13 The figure is a schematic diagram of the process of PCB flip assembly according to the present invention.

[0013] Among them: feeding mechanism 1; Film tearing mechanism 2, film tearing station 2a, a first conveyor assembly 21, a first conveyor belt 211, a first positioning assembly 22, a first positioning frame 221, a second positioning frame 222, a third positioning frame 223, a fourth positioning frame 224, a film tearing assembly 23, a clamping device 231, a first jaw 2311, a second jaw 2312, a blowing hole 2313, a second transfer device 232, a first drive device 2321, a collection box 233; Assembling mechanism 3, a first transfer device 31, a second positioning assembly 32, a first carrier 321, a driving assembly 322, a second rotating device 3221, a second driving device 3222, a third driving device 3223, a fourth driving device 3224, a first flip assembly 33, a first suction cup assembly 331, a first rotating device 332, a first bracket 333, a first visual device 34; Unloading mechanism 4, support plate 41, fifth driving device 42, sixth driving device 43; Liquid crystal panel 51 , positioning pins 511 , PCB board 52 , positioning holes 521 , adhesive tape 53 , and non-adhesive section 531 . DETAILED DESCRIPTION

[0014] The present invention is further described in detail below in conjunction with specific embodiments: like Figure 1-Figure 3 As shown, the present invention is applied to the fixed assembly of PCB boards in the production process of liquid crystal panels. The PCB board is connected to the edge of the panel through a flexible flat cable. During assembly, it is necessary to bend the flexible flat cable so that the PCB board is connected to the shell. During connection, the positioning holes on the PCB board are connected to the positioning pins on the shell for accurate positioning; at the same time, the shell is adhered and fixed by the tape on the shell. In the present invention, the loading of the liquid crystal panel is completed at the loading mechanism; the tearing mechanism completes the tearing of the protective film of the tape on the shell; the assembly mechanism completes the folding and assembly of the PCB board; and then the unloading mechanism unloads the liquid crystal panel.

[0015] Specifically: A PCB board flip assembly device and assembly method, comprising: The loading mechanism 1 completes the loading of the liquid crystal panel and transfers it to the film tearing station 2a. In this embodiment, the loading mechanism 1 loads the liquid crystal panel through a conveyor belt; the conveyor belt of the loading mechanism 1 is connected to the first conveyor belt, and when loading, it is directly transferred to the first conveyor belt, and when the liquid crystal panel is transferred to the first conveyor belt 211, the shell is set upward. The specific structure is the existing technology and will not be repeated.

[0016] like Figure 4-Figure 7As shown, the film tearing mechanism 2 is arranged at the film tearing station 2a, and includes a first conveying component 21, a first positioning component 22 and a film tearing component 23. The liquid crystal panel is loaded onto the first conveying component 21 and positioned by the first positioning component 22, and then the protective film is torn off by the film tearing component 23.

[0017] The first conveying assembly 21 includes two parallel and synchronously moving first conveying belts 211, and there is a gap between the two first conveying belts 211. The first positioning assembly 22 includes a first positioning frame 221 and a second positioning frame 222 arranged on both sides of the conveying direction of the first conveying assembly 21, and a third positioning frame 223 and a fourth positioning frame 224 arranged between the two first conveying belts 211. Among them, the first positioning frame 221 and the second positioning frame 222 can be connected to a driver simultaneously or separately to synchronously drive the first positioning frame 221 and the second positioning frame 222 to move toward each other or move away from each other. The third positioning frame 223 is arranged at the downstream end of the moving direction of the first conveying belt 211; the fourth positioning frame 224 is arranged at the upstream end of the moving direction of the first conveying belt 211, and is connected to a driver that can drive it to the fourth positioning frame 224 and a driver that can drive it to move vertically, so that the fourth positioning frame 224 moves upward to above the conveying surface of the first conveying belt 211 or moves downward to below the conveying surface of the first conveying belt 211. When the liquid crystal panel is transferred to the first conveyor belt 211 and contacts the third positioning frame 223, the fourth positioning frame 224 moves upward to above the conveying surface of the first conveyor belt 211 and moves toward the fourth positioning frame 224 to contact the liquid crystal panel to complete the front and rear direction positioning; at the same time, the first positioning frame 221 and the second positioning frame 222 move toward each other to contact the two sides of the liquid crystal panel to complete the left and right direction positioning. After positioning, the film is torn off.

[0018] The film tearing assembly 23 includes a clamping device 231 , a second transfer device 232 and a collection box 233 . The second transfer device 232 is connected to a first drive device 2321 with a vertical driving direction; the clamping device 231 is connected to the first drive device 2321 .

[0019] The clamping device 231 includes a first clamping jaw 2311 and a second clamping jaw 2312. The lower surface of the first clamping jaw 2311 is parallel to or slightly higher than the lower surface of the second clamping jaw 2312 to prevent the first clamping jaw 2311 from scratching the housing when clamping the protective film. The first clamping jaw 2311 is provided with a blowing hole 2313. The air outlet of the blowing hole 2313 is simultaneously opened on the lower surface of the first clamping jaw 2311 and on the side of the first clamping jaw 2311 close to the second clamping jaw 2312, that is, the direction of the air blown out of the blowing hole 2313 is inclined downward.

[0020] When tearing the film, the clamping device 231 moves downward under the drive of the first driving device 2321, so that the lower surface of the second clamping jaw 2312 contacts the protective film. At this time, the non-adhesive section of the protective film is between the first clamping jaw 2311 and the second clamping jaw 2312; the air blowing hole 2313 blows air, and the gas flows downward obliquely and spreads along the shell surface to the non-adhesive section of the protective film, so that the non-adhesive section is tilted and the film is removed; at the same time, the first clamping jaw 2311 moves toward the second clamping jaw 2312, contacts the non-adhesive section of the protective film to the second clamping jaw 2312, and completes the clamping; the clamping device 231 then moves upward and toward the tape at the same time to complete the film tearing. Afterwards, under the drive of the second transfer device 232, the clamping device 231 moves to the top of the collection box 233, opens the clamping jaws and throws the protective film into the collection box 233.

[0021] After the film is torn off, the first positioning assembly 22 is reset to cancel the positioning of the liquid crystal panel; the first transfer device picks up the liquid crystal panel and transfers it to the first carrier board to perform the PCB assembly process.

[0022] like Figure 8-Figure 10 As shown, the assembly mechanism 3 includes a first transfer device 31, a second positioning assembly 32, a first flipping assembly 33 and a first visual device 34 arranged directly above the second positioning assembly 32. The second positioning assembly 32 includes a first carrier plate 321, and a driving assembly 322 arranged at the lower end of the first carrier plate 321 and capable of driving the first carrier plate 321 to move along the X-axis, Y-axis, Z-axis and Z-axis rotation axis. The first flipping assembly 33 includes a first suction cup assembly 331 and a first rotating device 332 capable of driving the first suction cup assembly 331 to flip 180 degrees; the first suction cup assembly 331 is connected to the first rotating device 332 via a first bracket 333. The opening end of the air intake port of the first suction cup assembly 331 faces upward, and the plane where the opening end is located is parallel to and lower than the horizontal plane where the rotation axis of the first rotating device 332 is located. The driving assembly 322 includes a second rotating device 3221 connected to the lower end of the first carrier 321 and capable of driving the first carrier 321 to rotate along the Z axis, a second driving device 3222 connected to the second rotating device 3221 and capable of driving the first carrier 321 to move along the Z axis, a third driving device 3223 connected to the second driving device 3222 and capable of driving the first carrier 321 to move in the Y axis direction, and a fourth driving device 3224 connected to the third driving device 3223 and capable of driving the first carrier 321 to move in the X axis direction.

[0023] like Fig.13As shown, when the liquid crystal panel is placed on the first carrier 321, the side surface of the liquid crystal panel connected to the PCB board is flush with the edge of the first carrier 321; at the same time, the straight line where the liquid crystal panel and the PCB board are connected is parallel to the straight line where the rotation axis of the first rotating device 332 is located. The PCB board is suspended relative to the first carrier 321, but it is just overlapped on the first suction cup assembly 331, so that the PCB board is in a horizontal state. Afterwards, the PCB board is assembled, and the assembly includes the following steps: S1. After the first visual device 34 collects the position data of the positioning pins on the housing of the liquid crystal panel, the second driving device 3222 drives the liquid crystal panel to move vertically downward by driving the first carrier plate 321. At this time, the PCB board is sucked by the first suction cup assembly 331 and does not move downward with the liquid crystal panel.

[0024] S2, the first rotating device 332 flips the PCB board 180 degrees through the first suction cup assembly 331, and then collects the position information of the positioning holes on the PCB board through the first visual device 34. At this time, the height of the PCB board after flipping is slightly higher than the height of the PCB board before flipping. Of course, in other embodiments, the height of the first suction cup assembly 331 can be set so that before flipping, the upper end surface of the first suction cup assembly 331 and the connection between the PCB board and the liquid crystal panel are on the same horizontal plane, thereby making the height of the PCB board after flipping equal to the height before flipping.

[0025] S3, the driving assembly 322 uses the position of the positioning hole in step S2 as a reference. According to the position information of the positioning pin in S1, the data required for the positioning pin to move can be calculated. Through the cooperation of the second rotating device 3221, the third driving device 3223 and the fourth driving device 3224, the first carrier 321 is driven to rotate and move in the X-axis direction and the Y-axis direction to adjust the position of the liquid crystal panel, so that the positioning pin is directly below the positioning hole.

[0026] S4. The second driving device 3222 drives the first carrier plate 321 to move vertically upward to an initial height, so that the positioning pins are connected to the positioning holes, and the PCB board is adhered to the adhesive surface.

[0027] It should be noted that in actual operation, due to factors such as the accuracy of equipment components, the LCD panel may be slightly offset when placed on the first carrier plate 321, causing the edge to be uneven with the edge of the first carrier plate 321. However, the PCB board and the LCD panel are softly connected, so it will not affect the subsequent rotation and assembly of the PCB.

[0028] The downward or upward movement height of the first carrier 321 can be adjusted according to the height after the flip assembly flips the PCB board, so that when the first carrier 321 moves upward, the positioning pins and positioning holes on the liquid crystal panel can be connected and contact the tape.

[0029] like Fig.11 As shown, the blanking mechanism 4 completes the blanking of the liquid crystal panel after the PCB board is assembled. The blanking mechanism 4 includes a support plate 41, a fifth driving device 42 connected to the support plate 41 and capable of driving the support plate 41 to move vertically, and a sixth driving device 43 connected to the fifth driving device 42 and capable of driving the support plate 41 to move closer to or away from the first carrier plate 321. A notch 3211 is provided on the first carrier plate 321, and the support plate 41 moves upward through the notch 3211 to support the liquid crystal panel, and continues to move upward to make the liquid crystal panel detach from the first carrier plate 321, and then moves away from the first carrier plate 321 under the drive of the sixth driving device 43 to complete the blanking. In this embodiment, a detection device such as a detection camera can be provided at the blanking mechanism 4 to detect the assembly quality of the PCB board. This is a prior art and will not be repeated in this embodiment.

[0030] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the scope of protection of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present invention.

Claims

1. A PCB board flip assembly device, characterized in that: include: The loading mechanism completes the loading of the LCD panel and transfers it to the film tearing station; The film-tearing mechanism is arranged at the film-tearing station, and comprises a first conveying assembly, a first positioning assembly and a film-tearing assembly. The liquid crystal panel is loaded onto the first conveying assembly and positioned by the first positioning assembly, and then the protective film is torn off by the film-tearing assembly. The assembly mechanism includes a first transfer device, a second positioning component, a first flipping component and a first visual device arranged directly above the second positioning component; the second positioning component includes a first carrier plate, and a driving component arranged at the lower end of the first carrier plate and capable of driving the first carrier plate to move in the X-axis, Y-axis, Z-axis and Z-axis rotation axis; the first flipping component includes a first suction cup component and a first rotating device capable of driving the first suction cup component to flip 180 degrees; The first transfer device picks up the liquid crystal panel at the film tearing station and transfers it to the first carrier; when flipping, the first carrier first drives the liquid crystal panel to move downward, and after the first suction cup assembly drives the PCB board to flip 180 degrees, it moves upward after adjustment by the driving assembly to complete assembly with the PCB board; The unloading mechanism is used to unload the LCD panel after assembling the PCB board.

2. The PCB board flip assembly equipment according to claim 1, characterized in that: The film tearing assembly includes a clamping device, which includes a first clamping jaw and a second clamping jaw, wherein the lower surface of the first clamping jaw is not lower than the lower surface of the second clamping jaw; the first clamping jaw is provided with a blowing hole, and the air outlet of the blowing hole is simultaneously opened on the lower surface of the first clamping jaw and on a side of the first clamping jaw close to the second clamping jaw; When tearing the film, the clamping device moves downward so that the lower surface of the second clamping jaw contacts the protective film, and the blowing hole blows air to make the non-adhesive section of the protective film tilt up; at the same time, the first clamping jaw moves toward the second clamping jaw, contacts the non-adhesive section of the protective film to the second clamping jaw, and completes the clamping; the clamping device then tilts upward to complete the film tearing.

3. The PCB board flip assembly equipment according to claim 2, characterized in that: The film tearing assembly comprises a second transfer device and a collection box, and the second transfer device is connected to a first drive device with a vertical driving direction; The clamping device is connected to the first driving device; After the film is torn off, the protective film can be transported to the collection box under the drive of the second transfer device.

4. The PCB board flip assembly equipment according to claim 1, characterized in that: The first conveying assembly comprises two first conveying belts that move in parallel and synchronously, with a gap between the two first conveying belts; The first positioning assembly includes a first positioning frame and a second positioning frame arranged on both sides of the conveying direction of the first conveying assembly, and a third positioning frame and a fourth positioning frame arranged between the two first conveyor belts; when the liquid crystal panel is conveyed to the first conveyor belt, the first positioning frame and the second positioning frame move toward each other and contact the two sides of the liquid crystal panel to complete the left and right direction positioning; the fourth positioning frame contacts the liquid crystal panel in the direction of the third positioning frame to complete the front and back direction positioning.

5. The PCB board flip assembly equipment according to claim 1, characterized in that: When the liquid crystal panel is placed on the first carrier board, the straight line where the liquid crystal panel is connected to the PCB board is higher than and parallel to the straight line where the rotation axis of the first rotating device is located; The first suction cup assembly is connected to the first rotating device through a first bracket; before flipping, the opening end of the suction port of the first suction cup assembly faces upward to suck the PCB board, and the plane where the opening end is located is lower than the horizontal plane where the rotation axis of the first rotating device is located.

6. The PCB board flip assembly equipment according to claim 5, characterized in that: The driving assembly includes a second rotating device connected to the lower end of the first carrier and capable of driving the first carrier to rotate along the Z axis, a second driving device connected to the second rotating device and capable of driving the first carrier to move along the Z axis, a third driving device connected to the second driving device and capable of driving the first carrier to move in the Y axis direction, and a fourth driving device connected to the third driving device and capable of driving the first carrier to move in the X axis direction.

7. The PCB board flip assembly equipment according to claim 1, characterized in that: The unloading mechanism includes a support plate, a fifth driving device connected to the support plate and capable of driving the support plate to move vertically, and a sixth driving device connected to the fifth driving device and capable of driving the support plate to move closer to or away from the first carrier plate; The first carrier plate is provided with a notch, the support plate moves upward through the notch and supports the liquid crystal panel, and then moves away from the first carrier plate under the drive of the sixth driving device to complete the unloading.

8. According to the PCB board flip assembly equipment of claim 6, the PCB board flip assembly method comprises the following steps: S1, after the first visual device collects the position data of the positioning pins on the liquid crystal panel, the second driving device drives the first carrier plate and drives the liquid crystal panel to move downward; S2, the first rotating device flips the PCB board 180 degrees through the first suction cup assembly, and then collects the position information of the positioning holes on the PCB board through the first visual device; S3, the driving assembly drives the first carrier plate to adjust the position of the liquid crystal panel according to the position information of the positioning hole and the positioning pin through the cooperation of the second rotating device, the third driving device and the fourth driving device, so that the positioning pin is directly below the positioning hole; S4, the second driving device drives the first carrier plate to move upward and reset, so that the positioning pin is connected with the positioning hole, and the PCB board is adhered to the adhesive surface.

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