Cleaning detection feeding equipment and camera module assembly line

Abstract

The application provides a cleaning and detecting feeding equipment and a camera module assembly line. The cleaning and detecting feeding equipment comprises an equipment platform, a stock bin assembly, a cleaning assembly, a taking and placing assembly, a rear feeding assembly and a cleaning and detecting mechanism. The equipment platform comprises a mounting base plate, a transfer assembly, a flow transfer assembly and a feeding assembly. The transfer assembly is mounted on the mounting base plate and extends along a first direction. The flow transfer assembly is mounted on the mounting base plate and is arranged along a second direction and is spaced from the transfer assembly. The feeding assembly is mounted on the mounting base plate and is arranged and spaced from the transfer assembly and the flow transfer assembly. The stock bin assembly is mounted on the mounting base plate and is located at one end of the transfer assembly. The cleaning assembly is mounted on the mounting base plate and corresponds to the middle part of the transfer assembly. The taking and placing assembly is mounted on the mounting base plate and extends from the other end of the transfer assembly to the middle part of the flow transfer assembly along the second direction. The rear feeding assembly is mounted on the mounting base plate and extends from one end of the flow transfer assembly to the feeding assembly along the second direction. The cleaning and detecting mechanism is mounted on the mounting base plate and corresponds to the position between the taking and placing assembly and the rear feeding assembly on the flow transfer assembly.

Description

Technical Field

[0001] This invention relates to the field of camera module technology, and in particular to a cleaning and inspection feeding device and a camera module assembly line. Background Technology

[0002] With the rapid development of intelligent vehicles, in-vehicle camera modules are also developing rapidly. As autonomous driving technology advances rapidly, the requirements for camera modules are becoming increasingly stringent. This necessitates that defective products be prevented from leaving the assembly process to avoid impacting vehicle safety and user experience due to faulty camera modules.

[0003] Existing vehicle camera modules mainly consist of optical lenses and image sensors. Currently, most manufacturers manually clean the lenses and sensors during the assembly process, or simply load the modules without wiping them. This poses a significant risk of contaminated or defective products being mixed in, requiring subsequent equipment to re-inspect for contamination. Meanwhile, since existing subsequent equipment typically lacks automatic cleaning functions, it usually discards contaminated or defective products or uses contact methods such as dust sticks to manually remove dust and dirt. This results in product waste, low efficiency, incomplete dust removal, or product damage. Summary of the Invention

[0004] One advantage of this invention is that it provides a cleaning and inspection feeding device and a camera module assembly line, which can perform pretreatment on products before they enter the subsequent equipment for assembly, ensuring that the product surface is clean before entering the subsequent equipment, improving the assembly efficiency of the subsequent equipment, and increasing the product yield.

[0005] Another advantage of the present invention is that it provides a cleaning and inspection feeding device and a camera module assembly line. In one embodiment of the present invention, the cleaning and inspection feeding device can integrate automatic film tearing function and automatic feeding function, which can not only save labor and reduce the intensity of manual work, but also eliminate human interference and ensure the cleanliness of the product.

[0006] Another advantage of the present invention is that it provides a cleaning and testing loading device and a camera module assembly line. In one embodiment of the present invention, the cleaning and testing loading device can use a plasma cleaning mechanism to clean multiple products at one time, which can not only improve the equipment's production capacity, but also eliminate pollution and discharge interference.

[0007] Another advantage of this invention is that it provides a cleaning and inspection loading device and a camera module assembly line, wherein, to achieve the above objectives, complex structures and systems are not required. Therefore, this invention successfully and effectively provides a solution that not only offers a simple cleaning and inspection loading device and camera module assembly line, but also increases the practicality and reliability of the cleaning and inspection loading device and camera module assembly line.

[0008] To achieve at least one of the above-mentioned advantages or other benefits and objectives of the present invention, the present invention provides a cleaning and testing feeding device, comprising:

[0009] The equipment platform includes a mounting base, a transfer assembly mounted on the mounting base and extending along a first direction, a flow assembly mounted on the mounting base and spaced apart from the transfer assembly along a second direction perpendicular to the first direction, and a feeding assembly mounted on the mounting base and spaced apart from both the transfer assembly and the flow assembly.

[0010] A hopper assembly, mounted on the mounting base and located at one end of the transfer assembly, is used to provide a product blister pack to the transfer assembly;

[0011] A cleaning component is mounted on the mounting base and corresponds to the middle of the transfer component, for simultaneously cleaning multiple products in the product blister pack transferred by the transfer component.

[0012] A material handling assembly is mounted on the mounting base and extends from the other end of the transfer assembly along the second direction to the middle of the transfer assembly, for taking out products from the cleaned product blister tray and placing them into the product fixture of the transfer assembly;

[0013] A downstream feeding assembly, mounted on the mounting base and extending from one end of the transfer assembly along the second direction to the loading assembly, is used to remove products from the product fixture transferred via the transfer assembly and convey them to the loading assembly; and

[0014] A cleaning and inspection unit, mounted on the mounting base and corresponding to a position on the transfer assembly between the pick-and-place assembly and the downstream feeding assembly, is used to clean and inspect the surface of individual products flowing through the transfer assembly.

[0015] According to one embodiment of this application, the transfer assembly includes a lens transfer mechanism and a chip transfer mechanism arranged side by side along the second direction; the hopper assembly includes a lens hopper mechanism corresponding to the lens transfer mechanism and a chip hopper mechanism corresponding to the chip transfer mechanism; the cleaning assembly includes a lens cleaning mechanism located above the lens transfer mechanism and a chip cleaning mechanism located above the chip transfer mechanism; the lens cleaning mechanism and the chip cleaning mechanism are independent plasma cleaners.

[0016] According to one embodiment of this application, the plasma cleaner includes a plasma cleaning body located above the lens transfer mechanism or the chip transfer mechanism and a cleaning cylinder driven and connected to the plasma cleaning body, wherein the plasma cleaning body is raised and lowered under the drive of the cleaning cylinder.

[0017] According to one embodiment of this application, the chip hopper mechanism includes a pair of hopper opening cylinders, a pair of hopper opening and closing plates, a hopper Z-axis lift mounted on the mounting substrate, and a blister tray hopper corresponding to the chip transfer mechanism and used for stacking multiple blister trays; the blister tray hopper is fixedly mounted on the hopper Z-axis lift; the two hopper opening and closing plates are respectively movably disposed on the front and rear sides of the blister tray hopper; the two hopper opening cylinders are respectively correspondingly driven and connected to the two hopper opening and closing plates to drive the hopper opening and closing plates to open or close the blister tray hopper.

[0018] According to one embodiment of this application, both the lens transfer mechanism and the chip transfer mechanism are push-pull rod mechanisms; the push-pull rod mechanism includes a push-pull rod member, a push-pull rod cylinder that is driven connected to the push-pull rod member and extends vertically, and a push-pull rod X-axis transverse movement mechanism that is driven connected to the push-pull rod cylinder and extends along the first direction.

[0019] According to one embodiment of this application, the transfer assembly further includes a pair of blister tray return mechanisms corresponding one-to-one with the lens transfer mechanism and the chip transfer mechanism; the blister tray return mechanism includes a blister tray X-axis return machine located below the lens transfer mechanism or the chip transfer mechanism, a blister tray Z-axis return machine driven and connected to the blister tray X-axis return machine, a blister tray clamping mechanism installed on the blister tray Z-axis return machine and located below the material handling assembly, and a blister tray push rod cylinder driven and connected to the blister tray clamping mechanism.

[0020] According to one embodiment of this application, the material handling assembly includes a material handling track spanning the transfer assembly and the circulation assembly, a lens clamping mechanism drivenly connected to the material handling track, a chip picking mechanism drivenly connected to the material handling track and arranged side by side with the lens clamping mechanism, and a visual positioning mechanism drivenly connected to the material handling track and located between the lens clamping mechanism and the chip picking mechanism.

[0021] According to one embodiment of this application, the material handling assembly further includes a material handling mechanism disposed below the material handling track and between the transfer assembly and the circulation assembly; the material handling mechanism includes an optical imaging device and a QR code scanner arranged side by side; the optical imaging device is used to photograph and position the lens product and the chip product respectively; the QR code scanner is used to scan and record the QR codes of the lens product and the chip product.

[0022] According to one embodiment of this application, the transfer assembly includes a lens transfer mechanism and a chip transfer mechanism arranged side by side along the second direction; the lens transfer mechanism includes a lens X-axis transfer machine mounted on the mounting substrate and a lens fixing fixture drivenly connected to the lens X-axis transfer machine for temporarily fixing the lens product; the chip transfer mechanism includes a chip X-axis transfer machine mounted on the mounting substrate and a chip adsorption fixture drivenly connected to the chip X-axis transfer machine for temporarily adsorbing the chip product.

[0023] According to one embodiment of this application, the cleaning and testing loading equipment further includes a film-tearing mechanism, which is mounted on the mounting substrate and located on the chip transfer mechanism adjacent to one end of the pick-and-place assembly. The film-tearing mechanism includes a film-tearing X-axis motor mounted on the mounting substrate, a film-tearing Z-axis motor driven by the film-tearing X-axis motor, a film-tearing substrate driven by the film-tearing Z-axis motor, a feed roll rotatably disposed on the film-tearing substrate for releasing the tape, a take-up roll rotatably disposed on the film-tearing substrate for retrieving the tape, a film-tearing U-axis rotary motor mounted on the film-tearing substrate and driven by the take-up roll, and a pressing mechanism mounted on the film-tearing substrate for pressing the tape against the surface of the chip product.

[0024] According to one embodiment of this application, the pressing mechanism includes an X-axis cylinder mounted on the film-tearing substrate, a pressure sensor fixed to the bottom of the X-axis cylinder, a flexible roller slidably disposed on the film-tearing substrate and located below the pressure sensor, and a spring disposed between the pressure sensor and the flexible roller; the film-tearing mechanism further includes a plurality of tape tensioning rollers mounted on the film-tearing substrate, the tape tensioning rollers being respectively located between the unloading roll and the take-up roll and the flexible roller, and the tape tensioning rollers and the flexible rollers being triangularly distributed on the film-tearing substrate.

[0025] According to one embodiment of this application, the cleaning and inspection mechanism includes a gantry mounted on the mounting substrate and spanning the lens transfer mechanism and the chip transfer mechanism, a detection Z-axis motor mounted on the gantry, a detection camera driven and connected to the detection Z-axis motor, a pair of dust removal Z-axis motors mounted side by side on the gantry, and a pair of dust removal heads driven and connected to the dust removal Z-axis motors and corresponding to the lens transfer mechanism and the chip transfer mechanism, respectively; the dust removal heads are dry ultrasonic dust collectors.

[0026] According to one embodiment of this application, the cleaning and inspection loading equipment further includes a flipping mechanism, which comprises a flipping Z-axis motor mounted on the mounting base, an electric platform driven and connected to the flipping Z-axis motor, a flipping motor fixedly mounted on the electric platform, and a clamping cylinder fixedly connected to the flipping motor and used for clamping lens products.

[0027] According to one embodiment of this application, the downstream feeding assembly includes a feeding Y-axis track spanning the transfer assembly and the loading assembly, a feeding X-axis motor driven and connected to the feeding Y-axis track, a chip adsorption mechanism driven and connected to the feeding X-axis motor, a lens clamping mechanism driven and connected to the feeding X-axis motor, and a camera imaging mechanism driven and connected to the feeding X-axis motor.

[0028] According to one embodiment of this application, the back-end feeding assembly further includes a tray Y-axis track arranged parallel to the feeding Y-axis track, a lens NG tray driven and connected to the tray Y-axis track for holding lens defective products, a chip NG tray driven and connected to the tray Y-axis track for holding chip defective products, and a back-end feeding unloading and loading mechanism, wherein the back-end feeding unloading and loading mechanism is mounted on the mounting substrate and located below the feeding Y-axis track.

[0029] According to one embodiment of this application, the feeding assembly includes a rear feeding front track mechanism and a rear feeding rear track mechanism arranged side by side along the second direction below the feeding Y-axis track; the rear feeding front track mechanism includes a front track frame mounted on the mounting base, a front track barcode scanner disposed on the front track frame for scanning the rear pallet fixture, a front track upper transfer mechanism mounted on the front track frame for transferring the rear pallet fixture backward to the rear equipment, a front track fixture opening mechanism mounted on the front track frame for opening the rear pallet fixture, a front track upper limit plate fixed to the front track frame and located above the front track fixture opening mechanism, and a front track position sensor fixed to the front track frame.

[0030] According to one embodiment of this application, the pre-feeding track mechanism further includes an ion pump mounted on the front track frame and arranged toward the post-feeding track mechanism, and a lower-level front track conveyor mounted on the front track frame and located below the upper-level front track conveyor; the feeding assembly further includes a post-feeding return track mechanism, which is disposed in front of the pre-feeding track mechanism and the post-feeding track mechanism, for returning the post-feeding tray fixture transmitted via the lower-level front track conveyor to the upper-level front track conveyor and the post-feeding track mechanism.

[0031] According to one embodiment of this application, the backflow track mechanism includes a backflow track frame fixed to the mounting base plate, a backflow Y-axis motor mounted on the backflow track frame, a backflow Z-axis motor driven and connected to the backflow Y-axis motor, and a backflow transmission mechanism driven and connected to the backflow Z-axis motor.

[0032] According to another aspect of this application, this application further provides a camera module assembly line, comprising:

[0033] Back-end equipment is used to assemble lens products and chip products; and

[0034] The cleaning and testing loading equipment described above is located at the loading end of the downstream equipment and is used to automatically load the cleaned and tested lens products and chip products into the downstream equipment. Attached Figure Description

[0035] Figure 1 This is a perspective view of a cleaning and testing feeding device according to an embodiment of this application;

[0036] Figure 2 A top view schematic diagram of a cleaning and testing feeding device according to the above embodiments of this application is shown;

[0037] Figure 3 A schematic diagram of the structure of the cleaning component in the cleaning and testing feeding device according to the above embodiments of this application is shown;

[0038] Figure 4 A schematic diagram of the chip hopper mechanism in the cleaning and testing feeding equipment according to the above embodiments of this application is shown;

[0039] Figure 5 A schematic diagram of the push-pull rod mechanism in the cleaning and testing feeding equipment according to the above embodiments of this application is shown;

[0040] Figure 6 A schematic diagram of the material handling assembly in the cleaning and testing feeding device according to the above embodiments of this application is shown;

[0041] Figure 7 A schematic diagram of the blister tray return mechanism in the cleaning and testing feeding equipment according to the above embodiments of this application is shown;

[0042] Figure 8 A schematic diagram of the material handling mechanism in the cleaning and testing feeding device according to the above embodiments of this application is shown.

[0043] Figure 9 A schematic diagram of the lens transfer mechanism in the cleaning and inspection feeding device according to the above embodiments of this application is shown;

[0044] Figure 10 A schematic diagram of the chip transfer mechanism in the cleaning and testing feeding equipment according to the above embodiments of this application is shown;

[0045] Figure 11 A schematic diagram of the film-tearing mechanism in the cleaning and testing feeding equipment according to the above embodiments of this application is shown;

[0046] Figure 12 A schematic diagram of the cleaning and inspection mechanism in the cleaning and inspection feeding equipment according to the above embodiments of this application is shown;

[0047] Figure 13 A schematic diagram of the tilting mechanism in the cleaning and testing feeding device according to the above embodiments of this application is shown;

[0048] Figure 14 A schematic diagram of the structure of the downstream feeding assembly in the cleaning and testing feeding equipment according to the above embodiments of this application is shown;

[0049] Figure 15 A schematic diagram of the structure of the downstream feeding mechanism in the downstream feeding assembly according to the above embodiments of this application is shown.

[0050] Figure 16A schematic diagram of the structure of the track mechanism before the downstream feeding stage in the cleaning and testing feeding equipment according to the above embodiments of this application is shown.

[0051] Figure 17 A schematic diagram of the structure of the post-feeding track mechanism in the cleaning and testing feeding equipment according to the above embodiments of this application is shown.

[0052] Figure 18 A schematic diagram of the structure of the downstream return track mechanism in the cleaning and testing feeding equipment according to the above embodiments of this application is shown;

[0053] Figure 19 This is a schematic diagram of the module structure of a camera module assembly line according to an embodiment of this application.

[0054] Key component symbols: 1. Cleaning and inspection loading equipment; 10. Equipment platform; 11. Mounting base plate; 12. Transfer assembly; 120. Push-pull rod mechanism; 1201. Push-pull rod component; 1202. Push-pull rod cylinder; 1203. Push-pull rod X-axis transverse transfer machine; 121. Lens transfer mechanism; 122. Chip transfer mechanism; 123. Blister tray return mechanism; 1231. Blister tray X-axis return machine; 1232. Blister tray Z-axis return machine; 1233. Blister tray clamping mechanism; 1234. Blister tray push rod cylinder; 13. Transfer assembly; 131. Lens transfer mechanism; 1311. Lens X-axis transfer machine; 1312. Lens fixing fixture; 132. Chip transfer mechanism; 1321. Chip X-axis transfer machine; 1322. 14. Chip adsorption fixture; 14. Feeding assembly; 141. Front track mechanism for rear feeding; 1411. Front track frame; 1412. Front track barcode scanner; 1413. Upper front track transmission mechanism; 1414. Front track fixture opening mechanism; 1415. Upper limit plate of front track; 1416. Front track position sensor; 1417. Ion pump; 1418. Lower front track transmission mechanism; 142. Rear track mechanism for rear feeding; 1421. Rear track frame; 1422. Rear track barcode scanner; 1423. Upper rear track transmission mechanism; 1424. Rear track fixture opening mechanism; 1425. Upper limit plate of rear track; 1426. Rear track position sensor; 143. Rear return track mechanism; 1431. Return track 1432. Rear-flow Y-axis motor; 1433. Rear-flow Z-axis motor; 1434. Rear-flow conveyor mechanism; 20. Hopper assembly; 21. Lens hopper mechanism; 22. Chip hopper mechanism; 221. Hopper opening cylinder; 222. Hopper opening and closing plate; 223. Hopper Z-axis lift; 224. Blister tray hopper; 30. Cleaning assembly; 31. Lens cleaning mechanism; 32. Chip cleaning mechanism; 300. Plasma cleaner; 301. Plasma cleaning body; 302. Cleaning cylinder; 40. Material handling assembly; 41. Material handling track; 42. Lens clamping mechanism; 43. Chip suction mechanism; 44. Visual positioning mechanism; 45. Material handling mechanism; 451. Optical imaging equipment; 452. QR code scanner; 50. Post-processing feeding assembly; 51. Feeding Y-axis track; 52. Feeding X-axis motor; 53. Chip adsorption mechanism; 54. Lens clamping mechanism; 55. Camera taking picture mechanism; 56. Material tray Y-axis track; 57. Lens NG material tray; 58. Chip NG material tray; 59. Post-processing feeding lower and upper mechanism; 60. Cleaning and inspection mechanism; 61. Gantry; 62. Inspection Z-axis motor; 63. Inspection camera; 64. Dust removal Z-axis motor; 65. Dust removal head; 70. Film tearing mechanism; 71. Film tearing X-axis motor; 72. Film tearing Z-axis motor; 73. Film tearing substrate; 74. Unloading roll; 75. Rewind roll; 76. Film tearing U-axis rotary motor; 77. Pressing mechanism; 771. X-axis cylinder;772. Pressure sensor; 773. Flexible roller; 774. Spring; 78. Belt tensioner; 80. Tilting mechanism; 81. Tilting Z-axis motor; 82. Electric platform; 83. Tilting motor; 84. Clamping cylinder.

[0055] The above description of the main component symbols, together with the accompanying drawings and specific embodiments, provides a more detailed explanation of the present invention. Detailed Implementation

[0056] The following description is intended to disclose the present invention and enable those skilled in the art to implement it. The preferred embodiments described below are merely examples, and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the invention.

[0057] Those skilled in the art should understand that, in the disclosure of this invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting this invention.

[0058] In this invention, the term "a" in the claims and specification should be understood as "one or more," that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. Unless explicitly indicated in the disclosure of this invention that the number of the element is only one, the term "a" should not be construed as unique or single, and the term "a" should not be construed as a limitation on the quantity.

[0059] In the description of this invention, it should be understood that terms such as "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, terms such as "connected" or "linked" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through a medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0060] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0061] Considering that existing automotive camera modules typically involve manual cleaning of the lens and chip during assembly, or even direct loading without wiping, there is a significant risk of contaminated or defective products being introduced, necessitating further contamination detection by downstream equipment. Furthermore, existing downstream equipment often discards contaminated or defective products or uses contact methods such as dust pumps to manually remove dust and dirt, resulting in product waste, low efficiency, incomplete dust removal, or product damage. This application provides a cleaning, inspection, and loading device that pre-treats products before they enter downstream assembly equipment, ensuring clean product surfaces, improving assembly efficiency, and increasing product yield.

[0062] Specifically, refer to the accompanying drawings in the specification of this application. Figures 1 to 19 According to one embodiment of this application, a camera module assembly line is provided, which may include a back-end device (not shown in the figure) for assembling lenses and chips, and a cleaning and inspection loading device 1. The cleaning and inspection loading device 1 is disposed at the loading end of the back-end device and is used to automatically load the cleaned and inspected products (including lenses and / or chips) to the back-end device. It is understood that the camera module mentioned in this application may, but is not limited to, be implemented as an automotive camera.

[0063] More specifically, such as Figure 1 and Figure 2As shown, the cleaning and inspection loading device 1 may include a device platform 10, a hopper assembly 20, a cleaning assembly 30, a material handling assembly 40, a downstream feeding assembly 50, and a cleaning and inspection mechanism 60. The device platform 10 includes a mounting base 11, a transfer assembly 12 mounted on the mounting base 11 and extending along a first direction, a flow assembly 13 mounted on the mounting base 11 and spaced apart from the transfer assembly 12 along a second direction perpendicular to the first direction, and a loading assembly 14 mounted on the mounting base 11 and spaced apart from both the transfer assembly 12 and the flow assembly 13. The hopper assembly 20 is mounted on the mounting base 11 and located at one end of the transfer assembly 12, for providing product blister packs to the transfer assembly 12. The cleaning assembly 30 is mounted on the mounting base 11 and corresponds to the middle of the transfer assembly 12, for simultaneously cleaning multiple products in the product blister packs transferred via the transfer assembly 12. The pick-and-place assembly 40 is mounted on the mounting base 11 and extends from the other end of the transfer assembly 12 along the second direction to the middle of the transfer assembly 13. It is used to remove products from the cleaned product blister pack and place them into the product fixture of the transfer assembly 13. The downstream feeding assembly 50 is mounted on the mounting base 11 and extends from one end of the transfer assembly 13 along the second direction to the loading assembly 14. It is used to remove products from the product fixture transferred via the transfer assembly 13 and transport them to the loading assembly 14 for automatic loading into downstream equipment. The cleaning and inspection mechanism 60 is mounted on the mounting base 11 and corresponds to the position on the transfer assembly 13 between the pick-and-place assembly 40 and the downstream feeding assembly 50. It is used to clean and inspect the surface of individual products transferred via the transfer assembly 13 to screen out good products.

[0064] Thus, the product blister packs (carrying lenses or chips) supplied by the hopper assembly 20 are first transferred to the cleaning assembly 30 via the transfer assembly 12 to clean multiple products carried by the product blister packs in batches. Then, the cleaned product blister packs are transferred to the pick-and-place assembly 40 via the transfer assembly 12. Next, the pick-and-place assembly 40 removes each cleaned product individually from the product blister pack and places it into the product fixture of the transfer assembly 13. After that, the transfer assembly 13 transfers the product fixture carrying a single lens or a single chip to the cleaning and inspection mechanism 60 to screen out good products (including good lenses and good chips), and then transfers it to the downstream supply assembly 50 to supply to the loading assembly 14. Finally, the loading assembly 14 automatically loads the good lenses and good chips to the downstream equipment for subsequent product assembly.

[0065] It is worth noting that, since the cleaning and inspection feeding equipment 1 of this application performs pretreatment such as cleaning and inspection before the product enters the subsequent equipment for assembly, ensuring that the surface of the product entering the subsequent equipment is clean, the subsequent equipment does not need to perform cleaning and inspection again when assembling the product, which helps to improve the assembly efficiency of the subsequent equipment and increase the product yield. At the same time, the cleaning and inspection feeding equipment 1 of this application can not only automatically clean and inspect the product, but also provide automatic feeding for the subsequent equipment, which can eliminate human interference, ensure the cleanliness of the product, save labor, and reduce the labor intensity of the workers.

[0066] Furthermore, the transfer component 12, circulation component 13, and feeding component 14 in the cleaning and testing feeding equipment 1 of this application are reasonably arranged on the mounting base plate 11, and the hopper component 20, cleaning component 30, material handling component 40, downstream feeding component 50, and cleaning and testing mechanism 60 are arranged along the conveying route of the transfer component 12 and circulation component 13. This not only enhances the overall compactness of the equipment, but also avoids overlapping of conveying routes as much as possible, shortens the conveying stroke, and improves conveying efficiency.

[0067] For example, such as Figure 1 and Figure 2 As shown, the transfer assembly 12 may include a lens transfer mechanism 121 and a chip transfer mechanism 122 arranged side by side along the second direction; the hopper assembly 20 includes a lens hopper mechanism 21 corresponding to the lens transfer mechanism 121 and a chip hopper mechanism 22 corresponding to the chip transfer mechanism 122; the cleaning assembly 30 includes a lens cleaning mechanism 31 located above the lens transfer mechanism 121 and a chip cleaning mechanism 32 located above the chip transfer mechanism 122. In this way, blister packs carrying multiple lens products and blister packs carrying multiple chip products can be simultaneously supplied to the lens transfer mechanism 121 and the chip transfer mechanism 122 via the lens hopper mechanism 21 and the chip hopper mechanism 22, respectively; after being simultaneously cleaned by the lens cleaning mechanism 31 and the chip cleaning mechanism 32, respectively, they are transferred to the pick-and-place assembly 40 via the lens transfer mechanism 121 and the chip transfer mechanism 122, respectively. This facilitates the simultaneous transfer and cleaning of multiple lens products and multiple chip products, improving product cleaning efficiency and increasing equipment capacity.

[0068] Optionally, such as Figure 3As shown, the lens cleaning mechanism 31 and the chip cleaning mechanism 32 are implemented as independent plasma cleaners 300, so that each plasma cleaner 300 can simultaneously clean multiple lens products or multiple chip products, avoiding mutual interference or contamination between the lens products and chip products when cleaning surface dirt, resulting in neither contamination nor discharge interference. It is understood that the plasma cleaner 300 mentioned in this application can be implemented as a vacuum plasma cleaner (i.e., a vacuum plasma module) or as an atmospheric plasma cleaner (i.e., an atmospheric plasma module).

[0069] Optionally, such as Figure 3 As shown, each plasma cleaner 300 includes a plasma cleaning body 301 located above the lens transfer mechanism 121 or the chip transfer mechanism 122 and a cleaning cylinder 302 driven by the plasma cleaning body 301. The plasma cleaning body 301 rises and falls under the drive of the cleaning cylinder 302 to perform surface cleaning on multiple lens products or multiple chip products in the entire blister tray when it is close to the lens transfer mechanism 121 or the chip transfer mechanism 122, and to avoid the blister tray or other moving parts carrying lens products or chip products when it is away from the lens transfer mechanism 121 or the chip transfer mechanism 122, so as to ensure that the lens transfer mechanism 121 and the chip transfer mechanism 122 can transfer the blister tray normally.

[0070] It is worth noting that the lens hopper mechanism 21 and the chip hopper mechanism 22 mentioned in this application can have the same structure, with the same size internal blister tray. The load-bearing details can be differentiated according to the differences in the actual products (lens products and chip products). It is understood that the first direction mentioned in this application can refer to the front-back direction, i.e., the X-axis direction; the second direction mentioned in this application can refer to the left-right direction, i.e., the Y-axis direction; correspondingly, the up-down direction corresponds to the Z-axis direction.

[0071] For example, such as Figure 4As shown, taking the chip hopper mechanism 22 as an example, the chip hopper mechanism 22 may include a pair of hopper opening cylinders 221, a pair of hopper opening and closing plates 222, a hopper Z-axis lift 223 mounted on the mounting base plate 11, and a blister tray hopper 224 corresponding to the chip transfer mechanism 122 and used for stacking multiple blister trays; the blister tray hopper 224 is fixed to the hopper Z-axis lift 223 and is lifted and lowered under the drive of the hopper Z-axis lift 223, so that the multiple blister trays in the blister tray hopper 224 are sequentially aligned with the chip transfer mechanism 122, facilitating the transfer of the blister trays. Plastic tray; two hopper opening and closing plates 222 are respectively movably disposed on the front and rear sides of the blister tray hopper 224. Two hopper opening cylinders 221 are respectively driven and connected to the two hopper opening and closing plates 222 to drive the hopper opening and closing plates 222 to open or close the blister tray hopper 224, so that the multiple blister trays in the blister tray hopper 224 can remain aligned front and back when the two hopper opening and closing plates 222 close the blister tray hopper 224, ensuring that the front and back positions of each blister tray in the blister tray hopper 224 are consistent, which helps to reduce the risk of impact or inability to remove. It is understood that when the hopper opening plate 222 opens the blister tray hopper 224 under the action of the hopper opening cylinder 221, the blister tray carrying the chip product can be manually placed into or removed from the blister tray hopper 224, or it can be automatically removed from the blister tray hopper 224 by the chip transfer mechanism 122 and transferred to the area below the chip cleaning mechanism 32. It is understood that the hopper Z-axis lifting mechanism 223 mentioned in this application can be, but is not limited to, a linear motor, cylinder, push rod motor, or lead screw nut, etc., that moves the hopper along the Z-axis direction.

[0072] Optionally, such as Figure 5 As shown, both the lens transfer mechanism 121 and the chip transfer mechanism 122 are implemented as push-pull rod mechanisms 120; the push-pull rod mechanism 120 may include a push-pull rod 1201, a push-pull rod cylinder 1202 that is driven to and extends and retracts vertically connected to the push-pull rod 1201, and a push-pull rod X-axis transverse movement mechanism 1203 that is driven to and connected to the push-pull rod cylinder 1202 and extends along the first direction. In this way, the push-pull rod 1201 can move up and down under the action of the push-pull rod cylinder 1202 to lift or lower the blister tray; the push-pull rod 1201, together with the push-pull rod cylinder 1202, pushes and pulls the blister tray along the first direction under the action of the push-pull rod X-axis transverse mechanism 1203; in other words, the push-pull rod cylinder 1202 and the push-pull rod X-axis transverse mechanism 1203 cooperate with each other to first pull the blister tray from the material hopper assembly 20 to the cleaning assembly 30 through the push-pull rod 1201, and then push the blister tray from the cleaning assembly 30 to the material pick-and-place assembly 40.

[0073] Optionally, such as Figure 6As shown, the material handling assembly 40 includes a material handling track 41 spanning the transfer assembly 12 and the circulation assembly 13, a lens clamping mechanism 42 drivenly connected to the material handling track 41, a chip picking mechanism 43 drivenly connected to the material handling track 41 and arranged side by side with the lens clamping mechanism 42, and a visual positioning mechanism 44 drivenly connected to the material handling track 41 and located between the lens clamping mechanism 42 and the chip picking mechanism 43. Thus, the loading and unloading track 41 is used to drive the lens clamping mechanism 42, the chip picking mechanism 43, and the visual positioning mechanism 44 to move laterally between the transfer component 12 and the circulation component 13; the visual positioning mechanism 44 is used to take pictures of the lens product and the chip product for accurate positioning before picking up the material; the lens clamping mechanism 42 is used to clamp a single lens product from the blister tray to complete the lens picking, and place the single lens product into the lens fixture of the circulation component 13 to complete the lens unloading; the chip picking mechanism 43 is used to pick up a single chip product from the blister tray to complete the chip picking, and place the single chip product into the chip fixture of the circulation component 13 to complete the chip unloading.

[0074] It is worth noting that the lens gripping mechanism 42 mentioned in this application mainly consists of a U-axis rotary machine, a pneumatic gripper, and a Z-axis motor. The pneumatic gripper is mounted on the U-axis rotary machine, and the rear end of the U-axis rotary machine is connected to the Z-axis motor. The Z-axis motor is mounted on the pick-and-place track 41, so as to drive the U-axis rotary machine and the pneumatic gripper to lift and lower as a whole through the Z-axis motor. Similarly, the chip picking mechanism 43 mainly consists of a micron-level high-precision U-axis rotary machine, a suction cup, and a Z-axis motor. The suction cup is mounted on the U-axis rotary machine, and the rear end of the U-axis rotary machine is connected to the Z-axis motor. The Z-axis motor is mounted on the pick-and-place track 41, so as to drive the U-axis rotary machine and the suction cup to lift and lower as a whole through the Z-axis motor.

[0075] In addition, such as Figure 1 and Figure 7 As shown, the transfer assembly 12 may further include a pair of blister tray return mechanisms 123 corresponding one-to-one with the lens transfer mechanism 121 and the chip transfer mechanism 122, for conveying empty blister trays from the loading and unloading assembly 40 back to the hopper assembly 20.

[0076] Optionally, such as Figure 7As shown, the blister tray return mechanism 123 includes a blister tray X-axis return machine 1231 located below the lens transfer mechanism 121 or the chip transfer mechanism 122, a blister tray Z-axis return machine 1232 driven and connected to the blister tray X-axis return machine 1231, a blister tray clamping mechanism 1233 installed on the blister tray Z-axis return machine 1232 and located below the material handling assembly 40, and a blister tray push rod cylinder 1234 driven and connected to the blister tray clamping mechanism 1233. In this way, after being cleaned by the cleaning component 30, the blister tray carrying the lens product or chip product is first transferred to the pick-and-place component 40 by the lens transfer mechanism 121 or the chip transfer mechanism 122, and then temporarily fixed by the blister tray clamping mechanism 1233. After that, the pick-and-place component 40 first takes a picture by the vision positioning mechanism 44 to drive the position of the lens product or chip product in the blister tray, and then picks up the material from the blister tray by the lens clamping mechanism 42 or the chip picking mechanism 43. Then, after the lens product or chip product in the blister tray has been picked up, the blister tray Z-axis return machine 1232 and the blister tray X-axis return machine 1231 cooperate to make the blister tray clamping mechanism 1233 lower and return the empty blister tray to the hopper component 20. Finally, the blister tray pusher cylinder 1234 pushes the empty blister tray held by the blister tray clamping mechanism 1233 into the hopper of the hopper component 20.

[0077] According to embodiments of this application, such as Figure 1 and Figure 8 As shown, the material handling assembly 40 may further include a material handling down-and-up mechanism 45 disposed below the material handling track 41. The material handling down-and-up mechanism 45 is located between the transfer assembly 12 and the circulation assembly 13, and is used to photograph, position and scan the QR code of the lens product or chip product during the process of transporting the lens product or chip product from the transfer assembly 12 to the circulation assembly 13 on the material handling track 41.

[0078] Optionally, such as Figure 8 As shown, the material handling and loading mechanism 45 of this application includes an optical imaging device 451 and a QR code scanner 452 arranged side by side; the optical imaging device 451 is used to take pictures and position the lens product and the chip product respectively; the QR code scanner 452 is used to scan and record the QR codes of the lens product and the chip product.

[0079] It is worth noting that, similar to the transfer component 12, such as Figure 1 , Figure 9 as well as Figure 10As shown, the transfer assembly 13 may include a lens transfer mechanism 131 and a chip transfer mechanism 132 arranged side by side along the second direction; the lens transfer mechanism 131 may include a lens X-axis transfer machine 1311 mounted on the mounting substrate 11 and a lens fixing fixture 1312 driven and connected to the lens X-axis transfer machine 1311 for temporarily fixing the lens product, and the lens fixing fixture 1312 drives the lens product from the loading and unloading assembly 40 sequentially under the drive of the lens X-axis transfer machine 1311. The chip is transferred to the cleaning and testing mechanism 60 and the downstream feeding assembly 50. The chip transfer mechanism 132 may include a chip X-axis transfer machine 1321 mounted on the mounting substrate 11 and a chip adsorption fixture 1322 driven by the chip X-axis transfer machine 1321 and used for temporarily adsorbing chip products. The chip adsorption fixture 1322 drives the chip products from the pick-and-place assembly 40 to the cleaning and testing mechanism 60 and the downstream feeding assembly 50 in sequence.

[0080] Furthermore, since chip products are typically coated with a protective film, and this film needs to be removed before assembling the module, therefore... Figure 1 and Figure 11 As shown, the cleaning and testing loading equipment 1 of this application may further include a film-removing mechanism 70, which is mounted on the mounting substrate 11 and located on the chip transfer mechanism 132 near one end of the pick-and-place assembly 40, for automatically removing the protective film on the chip product transferred through the chip transfer mechanism 132.

[0081] Optionally, such as Figure 11 As shown, the film-tearing mechanism 70 includes a film-tearing X-axis motor 71 mounted on the mounting substrate 11, a film-tearing Z-axis motor 72 driven and connected to the film-tearing X-axis motor 71, a film-tearing substrate 73 driven and connected to the film-tearing Z-axis motor 72, a feed roll 74 rotatably disposed on the film-tearing substrate 73 for releasing the adhesive tape, a take-up roll 75 rotatably disposed on the film-tearing substrate 73 for retrieving the adhesive tape, a film-tearing U-axis rotary motor 76 mounted on the film-tearing substrate 73 and driven and connected to the take-up roll 75, and a pressing mechanism 77 mounted on the film-tearing substrate 73 for pressing the adhesive tape against the surface of the chip product. In this way, the X-axis motor 71 can adjust the overall position of the film-tearing substrate 73 and the pressing mechanism 77, so that the pressing mechanism 77 can be aligned with the protective film of the chip product; the Z-axis motor 72 can raise and lower the film-tearing substrate 73 and the pressing mechanism 77, so that the pressing mechanism 77 can press down the tape to contact the protective film on the chip product; the U-axis rotary motor 76 can drive the take-up roll 75 to rotate to wind and recycle the tape with the protective film, and drive the unload roll 74 to rotate to release new tape (i.e. tape without the protective film).

[0082] Optionally, such as Figure 11 As shown, the pressing mechanism 77 includes an X-axis cylinder 771 mounted on the film-tearing substrate 73, a pressure sensor 772 fixed to the bottom of the X-axis cylinder 771, a flexible roller 773 slidably disposed on the film-tearing substrate 73 and located below the pressure sensor 772, and a spring 774 disposed between the pressure sensor 772 and the flexible roller 773. Thus, since the pressure sensor 772 can detect the downward pressure of the flexible roller 773, and the spring 774 can act as a downward pressure buffer to prevent damage to the chip product; therefore, when the Z-axis motor 72 adjusts the pressing mechanism 77 to lower the pressing tape and contact the protective film on the chip product, the pressure sensor 772 can detect the downward pressure of the flexible roller 773 so as to control the pressure value within the set range; then, the X-axis cylinder 771 moves laterally to drive the pressure sensor 772, the spring 774 and the flexible roller 773 to move laterally together so as to peel off the protective film covering the surface of the chip product.

[0083] Optionally, such as Figure 11 As shown, the film-tearing mechanism 70 further includes a plurality of tape tensioning rollers 78 mounted on the film-tearing substrate 73. The tape tensioning rollers 78 are respectively located between the unloading roll 74 and the take-up roll 75 and the flexible roller 773. The tape tensioning rollers 78 and the flexible roller 773 are triangularly distributed on the film-tearing substrate 73 to ensure that the tape is V-shaped between the tape tensioning rollers 78 and the flexible roller 773 while tensioning the tape between the unloading roll 74 and the take-up roll 75. Thus, when the X-axis cylinder 771 moves laterally to drive the pressure sensor 772, the spring 774, and the flexible roller 773 to move laterally together, the tape can be torn from one end of the protective film to mimic the process of tearing film by hand, thereby improving the film-tearing efficiency.

[0084] According to the above embodiments of this application, as Figure 12 As shown, the cleaning and inspection mechanism 60 may include a gantry 61 mounted on the mounting substrate 11 and spanning the lens transfer mechanism 131 and the chip transfer mechanism 132, a detection Z-axis motor 62 mounted on the gantry 61, and a detection camera 63 driven and connected to the detection Z-axis motor 62. Thus, the detection Z-axis motor 62 can drive the detection camera 63 to move up and down, precisely adjusting the height of the detection camera 63 relative to the lens transfer mechanism 131 and the chip transfer mechanism 132. This facilitates the detection of micron-level dirt and damage on the surfaces of the lens and chip products through the detection camera 63, and enables automated optical inspection (AOI) of the lens and chip products.

[0085] Optionally, such as Figure 12 As shown, the cleaning and inspection mechanism 60 further includes a pair of dust removal Z-axis motors 64 mounted side-by-side on the gantry 61, and a pair of dust removal heads 65 respectively driven and connected to the dust removal Z-axis motors 64 and corresponding to the lens transfer mechanism 131 and the chip transfer mechanism 132. Thus, the dust removal Z-axis motors 64 can drive the dust removal heads 65 to move closer to or further away from the lens or chip products, enabling the dust removal heads 65 to precisely clean dust and other contaminants from the surface of individual lens or chip products, further ensuring the cleanliness of products for subsequent equipment.

[0086] Optionally, the dust removal head 65 is implemented as a dry ultrasonic dust collector to clean lens products or chip products non-contactly and ensure that the cleaned lens products or chip products remain clean and dry to meet the needs of subsequent module assembly.

[0087] It is worth noting that because the lens product needs to be flipped before being transferred to the downstream feeding assembly 50, therefore, if Figure 1 and Figure 13 As shown, the cleaning and inspection feeding device 1 of this application may further include a flipping mechanism 80, which is mounted on the mounting base plate 11 and located on the lens transfer mechanism 131 near one end of the downstream feeding component 50, for automatically flipping the lens products transferred through the lens transfer mechanism 131.

[0088] Optionally, such as Figure 13 As shown, the flipping mechanism 80 includes a flipping Z-axis motor 81 mounted on the mounting base plate 11, an electric platform 82 driven by the flipping Z-axis motor 81, a flipping motor 83 fixedly mounted on the electric platform 82, and a clamping cylinder 84 fixedly connected to the flipping motor 83 and used for clamping the lens product. Thus, the flipping Z-axis motor 81 can drive the electric platform 82, the flipping motor 83, and the clamping cylinder 84 to rise and fall as a whole; the electric platform 82 can finely adjust the clamping position of the clamping cylinder 84 so that the clamping position can be calibrated with one click when switching between different lens products; the flipping motor 83 can rotate the clamping cylinder 84 180° to flip the lens product clamped by the clamping cylinder 84, realizing the clamping and flipping of the lens product.

[0089] According to the above embodiments of this application, as Figure 14As shown, the downstream feeding assembly 50 may include a feeding Y-axis track 51 spanning the transfer assembly 13 and the loading assembly 14, a feeding X-axis motor 52 driven by the feeding Y-axis track 51, a chip adsorption mechanism 53 driven by the feeding X-axis motor 52, a lens clamping mechanism 54 driven by the feeding X-axis motor 52, and a camera imaging mechanism 55 driven by the feeding X-axis motor 52. It is understood that the chip adsorption mechanism 53 mentioned in this application may have the same structure as the chip suction mechanism 43, used for lifting and lowering chip products; the lens clamping mechanism 54 may have the same structure as the lens clamping mechanism 42, used for lifting and lowering lens products; and the camera imaging mechanism 55 may have the same structure as the visual positioning mechanism 44, used for photographing the downstream fixture for precise positioning, so as to ensure that the downstream fixtures in different positions can accurately place lens products or chip products.

[0090] Optionally, such as Figure 14 As shown, the downstream feeding assembly 50 further includes a tray Y-axis rail 56 arranged parallel to the feeding Y-axis rail 51, a lens NG tray 57 driven and connected to the tray Y-axis rail 56 for holding defective lenses, and a chip NG tray 58 driven and connected to the tray Y-axis rail 56 for holding defective chips. Thus, the tray Y-axis rail 56 can move the lens NG tray 57 and the chip NG tray 58 between the feeding assembly 14 and the front end of the equipment, facilitating the discharge of the lens NG tray 57 and the chip NG tray 58.

[0091] Optionally, both the lens NG tray 57 and the chip NG tray 58 are equipped with a foolproof structure, so that the storage positions of the lens NG tray 57 and the chip NG tray 58 cannot be interchanged, and the front and back orientations of the trays cannot be reversed, so as to accurately store defective lenses and defective chips.

[0092] Optionally, such as Figure 1 and Figure 15 As shown, the back-end feeding assembly 50 also includes a back-end feeding unloading and loading mechanism 59. This mechanism 59 is mounted on the mounting substrate 11 and located below the feeding Y-axis track 51, and is used to photograph and position the lens product held by the lens clamping mechanism 54 and the chip product adsorbed by the chip adsorption mechanism 53. It is understood that, compared to the aforementioned unloading and loading mechanism 45 of this application, the back-end feeding unloading and loading mechanism 59 mentioned in this application only requires an optical camera detection system and does not require an additional QR code scanner.

[0093] According to the above embodiments of this application, as Figure 1 and Figure 2As shown, the feeding assembly 14 may include a pre-feeding track mechanism 141 and a post-feeding track mechanism 142. The pre-feeding track mechanism 141 and the post-feeding track mechanism 142 are arranged side by side along the second direction below the feeding Y-axis track 51, for automatically feeding the lens products and chip products supplied by the post-feeding assembly 50 to the post-feeding equipment.

[0094] Optionally, such as Figure 16 As shown, the back-end loading front track mechanism 141 includes a front track frame 1411 mounted on the mounting base plate 11, a front track barcode scanner 1412 mounted on the front track frame 1411 for scanning the back-end tray fixture, a front track upper layer transfer mechanism 1413 mounted on the front track frame 1411 for transferring the back-end tray fixture to the back-end equipment, and a front track fixture opening mechanism 1414 mounted on the front track frame 1411 for opening the back-end tray fixture to pick up and put in lens products and chip products. It is understood that the back-end tray fixture mentioned in this application is mainly used to temporarily fix individual lens products and individual chip products for circulation within the equipment; after scanning the back-end tray fixture, the front track barcode scanner 1412 can bind the products to the fixture one-to-one with the scanned QR codes of the lens products and chip products carried by the back-end tray fixture.

[0095] Optionally, such as Figure 16 As shown, the rear loading front track mechanism 141 also includes a front track top limiting plate 1415 fixed to the front track frame 1411 and located above the front track fixture opening mechanism 1414, and a front track position sensor 1416 fixed to the front track frame 1411. The front track top limiting plate 1415 is used to block the rear track tray fixture that is pushed upward by the front track fixture opening mechanism 1414, so that the cover of the chip product on the rear track tray fixture is first pushed open by the front track fixture opening mechanism 1414 and then moved away by the front track fixture opening mechanism 1414, thereby opening the fixture. The front track position sensor 1416 is used to sense the running position of the rear track tray fixture on the front track upper transfer mechanism 1413 to ensure the safe transfer of the rear track tray fixture.

[0096] It is worth noting that the rear feeding track mechanism 142 can have a similar structure to the front feeding track mechanism 141, that is, as... Figure 17As shown, the rear loading track mechanism 142 may include a rear track frame 1421 mounted on the mounting base plate 11, a rear track barcode scanner 1422 disposed on the rear track frame 1421 for scanning the rear track tray fixture, a rear track upper layer transfer mechanism 1423 mounted on the rear track frame 1421 for transferring the rear track tray fixture to the rear track equipment, a rear track fixture opening mechanism 1424 mounted on the rear track frame 1421 for opening the rear track tray fixture to pick up and put in lens products and chip products, a rear track upper limit plate 1425 fixed on the rear track frame 1421 and located above the rear track fixture opening mechanism 1424, and a rear track position sensor 1426 fixed on the rear track frame 1421.

[0097] However, in order to reduce costs and improve structural compactness, such as Figure 1 and Figure 16 As shown, the rear loading front track mechanism 141 of this application further includes an ion pump 1417 installed on the front track frame 1411 and arranged towards the rear loading rear track mechanism 142, and a front track lower layer transfer mechanism 1418 installed on the front track frame 1411 and located below the front track upper layer transfer mechanism 1413; the ion pump 1417 is used to simultaneously clean the surface and remove static electricity from the rear track tray fixtures transferred via the front track upper layer transfer mechanism 1413 and the rear track upper layer transfer mechanism 1423; the front track lower layer transfer mechanism 1418 is used to return empty rear track tray fixtures from the rear equipment forward.

[0098] Optionally, such as Figure 1 and Figure 18 As shown, the feeding assembly 14 further includes a rear return track mechanism 143, which is disposed in front of the rear feeding front track mechanism 141 and the rear feeding rear track mechanism 142. It is used to return the rear pallet fixture transmitted via the front lower track transmission mechanism 1418 to the front upper track transmission mechanism 1413 and the rear upper track transmission mechanism 1423, so as to realize the recycling of the rear pallet fixture.

[0099] Optionally, such as Figure 18As shown, the backflow reflux track mechanism 143 includes a reflux track frame 1431 fixed to the mounting base plate 11, a backflow reflux Y-axis motor 1432 mounted on the reflux track frame 1431, a backflow reflux Z-axis motor 1433 driven and connected to the backflow reflux Y-axis motor 1432, and a backflow reflux transmission mechanism 1434 driven and connected to the backflow reflux Z-axis motor 1433. The rear return Y-axis motor 1432 and the rear return Y-axis motor 1432 cooperate to move the rear return transmission mechanism 1434, so that when the rear return transmission mechanism 1434 is aligned with the lower front track transmission mechanism 1418, it receives the rear tray fixture returned by the lower front track transmission mechanism 1418, and when it is aligned with the upper front track transmission mechanism 1413 or the upper rear track transmission mechanism 1423, it transmits the empty rear tray fixture to the upper front track transmission mechanism 1413 or the upper rear track transmission mechanism 1423 to wait for carrying lens products and chip products.

[0100] In summary, as Figure 19 As shown, after the blister packs containing lens products and chip products are manually placed into the blister pack hopper (i.e., lens hopper module) of lens hopper mechanism 21 and the blister pack hopper 224 (i.e. chip hopper module) of chip hopper mechanism 22:

[0101] Step 1: The chip hopper mechanism 22 first lifts the blister tray hopper 224 containing the chip product using the hopper Z-axis lifting mechanism 223, and then opens the blister tray hopper 224 using the hopper opening cylinder 221 in conjunction with the hopper opening and closing plate 222; at the same time, the lens hopper mechanism 21 first lifts the blister tray hopper containing the lens product using the hopper Z-axis lifting mechanism, and then opens the blister tray hopper using the hopper opening cylinder in conjunction with the hopper opening and closing plate.

[0102] Step 2: The chip transfer mechanism 122 (i.e., the chip push-pull rod module) in the transfer assembly 12 pulls the blister tray containing the chip product from the blister tray hopper of the chip hopper mechanism 22 to the cleaning assembly 30 (i.e., the PLASM module) for plasma cleaning of the product surface; at the same time, the lens transfer mechanism 121 (i.e., the lens push-pull rod module) in the transfer assembly 12 pulls the blister tray containing the lens product from the blister tray hopper of the lens hopper mechanism 21 to the cleaning assembly 30 (i.e., the PLASM module) for plasma cleaning of the product surface.

[0103] Step 3: After the PLASMA surface cleaning of the chip product is completed, the chip push-pull rod module pushes the blister tray containing the chip product to the corresponding blister tray return mechanism 123 (i.e., the chip blister tray return module) for temporary fixation of the blister tray; at the same time, after the PLASMA surface cleaning of the lens product is completed, the lens push-pull rod module pushes the lens blister tray to the corresponding blister tray return mechanism 123 (i.e., the lens blister tray return module) for temporary fixation of the blister tray.

[0104] Step 4: The material handling component 40 (i.e., the material handling module) first determines the position of the chip product in the blister tray through the vision positioning mechanism 44, and then picks up the chip product through the chip suction mechanism 43; at the same time, the material handling component 40 (i.e., the material handling module) first determines the position of the lens product in the blister tray through the vision positioning mechanism 44, and then picks up the lens product through the lens clamping mechanism 42; thereafter, the clamped lens product and the adsorbed chip product are photographed and positioned by the material handling mechanism 45 (i.e., the material handling module), and the relative position of the lens and the QR code are scanned, and the chip product is photographed and positioned and the QR code is scanned.

[0105] Step 5: The loading and unloading module places the lens product into the fixture within the lens transfer mechanism 131 (i.e., the lens transfer module) for temporary fixation; and places the chip product into the fixture within the chip transfer mechanism 132 (i.e., the chip transfer module) for temporary adsorption. Simultaneously, the blister packs containing the lens and chip products are returned to the lens hopper module and chip hopper module respectively via the blister pack return mechanism 123 (i.e., the chip blister pack return module and the lens blister pack return module).

[0106] Step 6: In the lens transfer module, the product moves along with the fixture and first passes through the cleaning and inspection mechanism 60 (i.e., the cleaning and inspection module) for surface dry dust removal and AOI inspection, and then passes through the flipping mechanism 80 (i.e., the flipping module) to flip the lens product in both directions; at the same time, in the chip transfer module, the product moves along with the fixture and first passes through the film removal mechanism 70 (i.e., the film removal module) to remove the protective film on the chip surface, and then passes through the cleaning and inspection module for surface dry dust removal and AOI inspection.

[0107] Step 7: After the lens and chip processing is completed, the back-end feeding assembly 50 (i.e., the back-end feeding module) clamps and removes the lens product from the lens fixture and adsorbs and removes the chip product from the chip fixture. According to the AOI inspection results, defective products are placed in the defective material tray; good lenses and chip products continue to the back-end feeding lower and upper mechanism 59 (i.e., the back-end feeding lower and upper module) for photographing and positioning. Then, the products are placed in the back-end fixture on the back-end loading front track mechanism 141 (i.e., the back-end loading front track module) or the back-end loading rear track mechanism 142 (i.e., the back-end loading rear track module) for temporary fixation.

[0108] Step 8: The rear track module or the front track module of the rear loading process transfers the rear fixture containing the lens product and the chip product to the rear equipment. The empty fixture is transferred to the rear track return mechanism 143 (i.e., the rear track return module) through the lower layer of the front track module of the rear loading process, and then the empty fixture is returned to the rear track module of the rear loading process or the front track module of the rear loading process through the rear track return module.

[0109] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0110] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. A cleaning and testing feeding device, characterized in that, include: The equipment platform includes a mounting base, a transfer assembly mounted on the mounting base and extending along a first direction, a flow assembly mounted on the mounting base and spaced apart from the transfer assembly along a second direction perpendicular to the first direction, and a feeding assembly mounted on the mounting base and spaced apart from both the transfer assembly and the flow assembly. A hopper assembly, mounted on the mounting base and located at one end of the transfer assembly, is used to provide a product blister pack to the transfer assembly; A cleaning assembly, mounted on the mounting base and corresponding to the center of the transfer assembly, is used to simultaneously clean multiple products in a product blister pack transferred by the transfer assembly; the transfer assembly includes a lens transfer mechanism and a chip transfer mechanism arranged side by side along the second direction; the hopper assembly includes a lens hopper mechanism corresponding to the lens transfer mechanism and a chip hopper mechanism corresponding to the chip transfer mechanism; the cleaning assembly includes a lens cleaning mechanism located above the lens transfer mechanism and a chip cleaning mechanism located above the chip transfer mechanism; the lens cleaning mechanism and the chip cleaning mechanism are independent plasma cleaners; A material handling assembly is mounted on the mounting base and extends from the other end of the transfer assembly along the second direction to the middle of the transfer assembly, for taking out products from the cleaned product blister tray and placing them into the product fixture of the transfer assembly; A downstream feeding assembly is mounted on the mounting base and extends from one end of the transfer assembly along the second direction to the feeding assembly, for taking out products from the product fixture that has been transferred via the transfer assembly and conveying them to the feeding assembly. as well as A cleaning and inspection unit is mounted on the mounting base and corresponds to a position on the transfer assembly between the material handling assembly and the downstream feeding assembly, for cleaning and inspecting the surface of individual products flowing through the transfer assembly; The transfer assembly includes a lens transfer mechanism and a chip transfer mechanism arranged side-by-side along the second direction; the cleaning and inspection mechanism includes a gantry mounted on the mounting substrate and spanning the lens transfer mechanism and the chip transfer mechanism, an inspection Z-axis motor mounted on the gantry, an inspection camera driven and connected to the inspection Z-axis motor, a pair of dust removal Z-axis motors mounted side-by-side on the gantry, and a pair of dust removal heads driven and connected to the dust removal Z-axis motors and corresponding to the lens transfer mechanism and the chip transfer mechanism, respectively; the dust removal heads are dry ultrasonic dust collectors; The downstream feeding assembly includes a feeding Y-axis track spanning the transfer assembly and the loading assembly, a feeding X-axis motor driven and connected to the feeding Y-axis track, a chip adsorption mechanism driven and connected to the feeding X-axis motor, a lens clamping mechanism driven and connected to the feeding X-axis motor, and a camera taking picture mechanism driven and connected to the feeding X-axis motor. The feeding assembly includes a rear feeding front track mechanism and a rear feeding rear track mechanism arranged side-by-side below the feeding Y-axis track along the second direction; the rear feeding front track mechanism includes a front track frame mounted on the mounting base, a front track barcode scanner mounted on the front track frame for scanning the rear pallet fixture, a front track upper transfer mechanism mounted on the front track frame for transferring the rear pallet fixture to the rear equipment, a front track fixture opening mechanism mounted on the front track frame for opening the rear pallet fixture, a front track top limiting plate fixed on the front track frame and located above the front track fixture opening mechanism, and a front track position sensor fixed on the front track frame.

2. The cleaning, testing, and feeding equipment according to claim 1, characterized in that, The plasma cleaner includes a plasma cleaning body located above the lens transfer mechanism or the chip transfer mechanism and a cleaning cylinder connected to the plasma cleaning body. The plasma cleaning body is raised and lowered under the drive of the cleaning cylinder.

3. The cleaning and testing feeding equipment according to claim 1, characterized in that, The chip hopper mechanism includes a pair of hopper opening cylinders, a pair of hopper opening and closing plates, a hopper Z-axis lift mounted on the mounting base plate, and a blister tray hopper corresponding to the chip transfer mechanism and used for stacking multiple blister trays; the blister tray hopper is fixedly mounted on the hopper Z-axis lift; the two hopper opening and closing plates are respectively movably disposed on the front and rear sides of the blister tray hopper; the two hopper opening cylinders are respectively driven and connected to the two hopper opening and closing plates to drive the hopper opening and closing plates to open or close the blister tray hopper.

4. The cleaning and testing feeding equipment according to claim 1, characterized in that, Both the lens transfer mechanism and the chip transfer mechanism are push-pull rod mechanisms; the push-pull rod mechanism includes a push-pull rod, a push-pull rod cylinder that is driven and connected to the push-pull rod and extends and retracts vertically, and a push-pull rod X-axis transverse movement mechanism that is driven and connected to the push-pull rod cylinder and extends along the first direction.

5. The cleaning, testing, and feeding equipment according to claim 1, characterized in that, The transfer assembly further includes a pair of blister tray return mechanisms that correspond one-to-one with the lens transfer mechanism and the chip transfer mechanism, respectively; the blister tray return mechanism includes a blister tray X-axis return machine located below the lens transfer mechanism or the chip transfer mechanism, a blister tray Z-axis return machine driven and connected to the blister tray X-axis return machine, a blister tray clamping mechanism installed on the blister tray Z-axis return machine and located below the material handling assembly, and a blister tray push rod cylinder driven and connected to the blister tray clamping mechanism.

6. The cleaning and testing feeding equipment according to any one of claims 1 to 5, characterized in that, The material handling assembly includes a material handling track spanning the transfer assembly and the circulation assembly, a lens clamping mechanism driven and connected to the material handling track, a chip picking mechanism driven and connected to the material handling track and arranged side by side with the lens clamping mechanism, and a visual positioning mechanism driven and connected to the material handling track and located between the lens clamping mechanism and the chip picking mechanism.

7. The cleaning and testing feeding equipment according to claim 6, characterized in that, The material handling assembly further includes a material handling mechanism located below the material handling track and between the transfer assembly and the circulation assembly; the material handling mechanism includes an optical imaging device and a QR code scanner arranged side by side; the optical imaging device is used to photograph and position the lens product and the chip product respectively; the QR code scanner is used to scan and record the QR codes of the lens product and the chip product.

8. The cleaning and testing feeding equipment according to any one of claims 1 to 5, characterized in that, The lens transfer mechanism includes a lens X-axis transfer machine mounted on the mounting substrate and a lens fixing fixture driven and connected to the lens X-axis transfer machine for temporarily fixing the lens product; the chip transfer mechanism includes a chip X-axis transfer machine mounted on the mounting substrate and a chip adsorption fixture driven and connected to the chip X-axis transfer machine for temporarily adsorbing the chip product.

9. The cleaning, testing, and feeding equipment according to claim 8, characterized in that, The cleaning and testing loading equipment further includes a film-tearing mechanism, which is mounted on the mounting substrate and located on the chip transfer mechanism near one end of the pick-and-place assembly. The film-tearing mechanism includes a film-tearing X-axis motor mounted on the mounting substrate, a film-tearing Z-axis motor driven by the film-tearing X-axis motor, a film-tearing substrate driven by the film-tearing Z-axis motor, a feed roll rotatably disposed on the film-tearing substrate for releasing the tape, a take-up roll rotatably disposed on the film-tearing substrate for retrieving the tape, a film-tearing U-axis rotary motor mounted on the film-tearing substrate and driven by the take-up roll, and a pressing mechanism mounted on the film-tearing substrate for pressing the tape against the surface of the chip product.

10. The cleaning and testing feeding equipment according to claim 9, characterized in that, The pressing mechanism includes an X-axis cylinder mounted on the film-tearing substrate, a pressure sensor fixed to the bottom of the X-axis cylinder, a flexible roller slidably disposed on the film-tearing substrate and located below the pressure sensor, and a spring disposed between the pressure sensor and the flexible roller; the film-tearing mechanism further includes a plurality of tape tensioning rollers mounted on the film-tearing substrate, the tape tensioning rollers being respectively located between the unloading roll and the take-up roll and the flexible roller, and the tape tensioning rollers and the flexible rollers being triangularly distributed on the film-tearing substrate.

11. The cleaning and testing feeding equipment according to claim 8, characterized in that, The cleaning and inspection loading equipment further includes a flipping mechanism, which includes a flipping Z-axis motor mounted on the mounting base plate, an electric platform driven and connected to the flipping Z-axis motor, a flipping motor fixedly mounted on the electric platform, and a clamping cylinder fixedly connected to the flipping motor and used to clamp the lens product.

12. The cleaning and testing feeding equipment according to any one of claims 1 to 5, characterized in that, The back-end feeding assembly further includes a tray Y-axis track arranged parallel to the feeding Y-axis track, a lens NG tray driven and connected to the tray Y-axis track for holding defective lenses, a chip NG tray driven and connected to the tray Y-axis track for holding defective chips, and a back-end feeding lowering and uppering mechanism. The back-end feeding lowering and uppering mechanism is mounted on the mounting substrate and located below the feeding Y-axis track.

13. The cleaning and testing feeding equipment according to any one of claims 1 to 5, characterized in that, The pre-feeding track mechanism further includes an ion pump installed on the front track frame and arranged towards the post-feeding track mechanism, and a lower-level front track conveyor installed on the front track frame and located below the upper-level front track conveyor mechanism; the feeding assembly further includes a post-feeding return track mechanism, which is disposed in front of the pre-feeding track mechanism and the post-feeding track mechanism, for returning the post-feeding tray fixture transmitted via the lower-level front track conveyor mechanism to the upper-level front track conveyor mechanism and the post-feeding track mechanism.

14. The cleaning and testing feeding equipment according to claim 13, characterized in that, The backflow track mechanism includes a backflow track frame fixed to the mounting base plate, a backflow Y-axis motor mounted on the backflow track frame, a backflow Z-axis motor driven and connected to the backflow Y-axis motor, and a backflow transmission mechanism driven and connected to the backflow Z-axis motor.

15. A camera module assembly line, characterized in that, include: Back-end equipment used for assembling lens products and chip products; and The cleaning and testing loading device as described in any one of claims 1 to 14 is located at the loading end of the downstream equipment and is used to automatically load the cleaned and tested lens products and chip products into the downstream equipment.

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