Horizontal electroplating device
By adopting the design of cup-shaped isolation groove and cathode conductive ring in the horizontal electroplating device, the problems of shortened effective plating distance, increased cost and increased floor space in the existing technology are solved, and the effects of uniform plating and cost reduction are achieved. .
Patent Information
- Application Number
- CN202411469471.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2025-01-24
AI Technical Summary
During the electroplating process, existing horizontal electroplating devices have problems such as shortening the effective electroplating distance, longer equipment length, increased cost and increased footprint.
The design of cup-shaped isolation groove and cathode conductive ring is adopted. Through the combination of scraping seat and scraping strip, the recovery and uniform distribution of electroplating liquid is achieved, the length of the conductive area is reduced, and the plating layer is prevented from thickening due to edge effect.
The effective electroplating area is increased, the equipment cost, power, and the area occupied are reduced, and uniform plating is achieved, preventing the problem of increasing local thickness or crystallization due to electroplating.
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Figure CN119352134A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of electroplating and relates to a horizontal electroplating device. Background Art
[0002] In the solar industry, the horizontal electroplating process of cells is widely used, such as BC (Back Contact) cells. Since the conductive surface and the electroplating surface of BC cells are on the same surface, the cell needs to contact the electroplating solution and the conductor at the same time to achieve electroplating.
[0003] In the current BC horizontal electroplating process, most electroplating devices use a conductive roller connected to the negative electrode of a constant current source as a cathode, and a titanium rod connected to the positive electrode of a constant current source and placed in the electroplating solution as an insoluble anode. When the cell is transferred in the tank, the cell contacts the electroplating solution and the conductive roller at the same time, so that the conductive roller, the electroplating solution, the titanium rod and the cell form a closed circuit to achieve electroplating.
[0004] However, the existing horizontal electroplating devices have many application limitations during the electroplating process, such as:
[0005] First, the conductive roller needs to be placed in an isolation tank to be isolated from the plating solution. Only when the battery cell contacts the plating solution can a closed circuit be formed for electroplating. Since there is no plating solution in the isolation tank, the area where the isolation tank is located cannot be electroplated, which will shorten the effective plating distance in the plating tank of the same length. This will lead to an increase in the number of plating tanks, making the overall length of the equipment longer and occupying plant space.
[0006] Second, once the number of electroplating tanks increases, more constant current sources, insoluble anodes, pumps and other components need to be equipped, which increases additional costs;
[0007] Therefore, it is necessary to provide a horizontal electroplating device. Summary of the invention
[0008] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a horizontal electroplating device for solving the above-mentioned series of application limitation problems existing in the horizontal electroplating device in the prior art during the electroplating process.
[0009] To achieve the above-mentioned object and other related objects, the present invention provides a horizontal electroplating device, which comprises:
[0010] Electroplating tanks;
[0011] Cathode conductive brush;
[0012] an anode, the anode being disposed in the electroplating tank;
[0013] A cup-shaped isolation tank, the cup-shaped isolation tank comprising a scraping seat and a confluence tank, the scraping seat being fixed in the confluence tank, the confluence tank being arranged in the electroplating tank, and a plating liquid isolation space being provided between the scraping seat and the confluence tank, the scraping seat being provided with a scraping strip and a through hole, the through hole being connected to the confluence tank, and the plating liquid isolation space being used to recover the plating liquid in the electroplating tank;
[0014] A cathode roller, the cathode roller is disposed in the electroplating tank and mounted on the cup-shaped isolation tank;
[0015] A cathode conductive ring, wherein the cathode conductive ring is arranged at intervals on the periphery of the cathode roller, and an isolation ring is provided on the periphery of the cathode conductive ring, and the cathode conductive ring is divided into an inner conductive ring area 1 and an outer conductive ring area 2 by the isolation ring, wherein the conductive ring area 1 is used to carry the electroplated parts, and the conductive ring area 2 is used to make electrical contact with the cathode conductive brush, and the conductive ring area 1 is electrically connected to the conductive ring area 2, and the conductive ring area 1 is arranged corresponding to the scraper seat, the isolation ring and the conductive ring area 2 are located in the confluence groove, and the plating liquid on the conductive ring area 1 is scraped at the first level by the inner wall of the scraper seat, and the plating liquid on the conductive ring area 1 is scraped at the second level by the scraper strip, and the scraped plating liquid is converged into the confluence groove through the through hole.
[0016] Optionally, the scraper seat includes a contoured scraper seat arranged corresponding to an area of the conductive ring.
[0017] Optionally, the scraping strip is disposed on one side of the scraping seat, and the scraping strip is located on the screw-out side of the cathode roller.
[0018] Optionally, the through hole is located at the base of the scraper seat.
[0019] Optionally, the confluence groove includes a cup sleeve, a reflux pipe and a reflux groove that are interconnected, and the scraper seat is fixed by the cup sleeve.
[0020] Optionally, the cathode conductive rings are located on both sides of the cathode roller, and the cathode conductive rings are in contact with edge areas of the electroplated parts.
[0021] Optionally, the cathode conductive brush is fixed on a conductive brush support above the cathode roller.
[0022] Optionally, the cathode conductive brush is connected to the conductive brush support via a telescopic adjustment member.
[0023] Optionally, the scraping seats are located on both sides of the cathode roller and are symmetrically arranged.
[0024] Optionally, the cathode roller includes a PE roller, a PP roller or a PVDF roller; and the cathode conductive ring includes a titanium metal conductive ring or a copper metal conductive ring.
[0025] As described above, the horizontal electroplating device of the present invention includes an electroplating tank, a cathode conductive brush, an anode, a cup-shaped isolation tank, a cathode roller and a cathode conductive ring, wherein the cup-shaped isolation tank includes a scraping seat and a confluence tank, a plating liquid isolation space is provided between the scraping seat and the confluence tank, the scraping seat is provided with a scraping strip and a through hole, the through hole is connected to the confluence tank, the cathode conductive ring is divided into a conductive ring zone 1 and a conductive ring zone 2 by the isolation ring, the conductive ring zone 1 is arranged corresponding to the scraping seat, and the conductive ring zone 2 is located in the confluence tank and is in electrical contact with the cathode conductive brush.
[0026] The horizontal electroplating device of the present invention adopts a cup-shaped isolation groove, which can increase the effective electroplating area and reduce equipment cost, power and floor space; the cup-shaped isolation groove is arranged on both sides of the cathode roller, which can reduce the effective electroplating distance on both sides of the electroplated part, and can avoid the phenomenon that the plating layer on both sides of the electroplated part is thickened due to the edge effect, thereby achieving uniform electroplating; the conductive ring area forms a shorter conductive area, which can reduce the requirements for the flatness of the scraper strip, and combined with the primary scraping of the contoured scraper seat and the secondary scraping of the scraper strip, it can effectively prevent the cathode conductive ring from having a local thickness increase or crystallization due to electroplating; the cathode conductive brush with a telescopic adjustment part can ensure good contact with the cathode conductive ring, thereby achieving good electroplating. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 Shown is a schematic structural diagram of a horizontal electroplating device in the prior art.
[0028] Figure 2 Shown is a schematic diagram of the three-dimensional structure of a horizontal electroplating device in an embodiment of the present invention.
[0029] Figure 3 Display as Figure 2 Schematic diagram of the cross-sectional structure along the A-A' line.
[0030] Figure 4 Shown is a schematic diagram of the partial structure of a horizontal electroplating device in an embodiment of the present invention.
[0031] Figure 5 Display as Figure 4 Schematic diagram of the cross-sectional structure along the B-B' line.
[0032] Figure 6 Display as Figure 4 Schematic diagram of the cross-sectional structure along C-C'.
[0033] Figure 7 It is a schematic diagram of the assembly structure of the cathode roller and the scraper seat in an embodiment of the present invention.
[0034] Figure 8 Display as Figure 7 Schematic diagram of the cross-sectional structure along the middle line D-D'.
[0035] Fig. 9 It is a schematic diagram of the structure of the scraper seat in an embodiment of the present invention.
[0036] Fig.10 Display as Fig. 9 Schematic diagram of the top view structure.
[0037] Fig.11 Display as Fig. 9 Schematic diagram of the side structure.
[0038] Fig.12 Shown is a schematic structural diagram of a cathode conductive brush in an embodiment of the present invention.
[0039] Fig.13 Display as Fig.12 Schematic diagram of the cross-sectional structure along E-E'.
[0040] Description of Reference Numerals
[0041] 1 Anode
[0042] 2 Drive rollers
[0043] 3 Cathode roller
[0044] 4 Isolation slots
[0045] 5. Battery Cell
[0046] 6 Trough
[0047] 7 Power Supply
[0048] 100 Plating tank
[0049] 101 Bevel gear
[0050] 102 shaft support
[0051] 103 Collar
[0052] 200 Cathode Conductive Brush
[0053] 300 Anode
[0054] 400 Cup Isolation Tank
[0055] 410 Scratching Seat
[0056] 411 Scratch Strip
[0057] 412 Through hole
[0058] 413 Scrape Strip Guard
[0059] 420 cup holder
[0060] 430 Plating solution isolation space
[0061] 440 Reflux pipe
[0062] 450 Reflow Tank
[0063] 500 Cathode Roller
[0064] 501 Stainless Steel Pipe
[0065] 502 PE pipe
[0066] 600 Cathode conductive ring
[0067] 601 Conductive Ring Zone 1
[0068] 602 Conductive Ring Zone 2
[0069] 700 Isolation Ring
[0070] 800 Conductive Brush Holder
[0071] 901 Moving axis
[0072] 902 Spring DETAILED DESCRIPTION
[0073] See also Figure 1 An existing horizontal electroplating equipment is illustrated, wherein 1 represents anode, 2 represents driving roller, 3 represents cathode roller, 4 represents isolation tank, 5 represents battery sheet, 6 represents tank body, 7 represents power source, and all cathode rollers 3 are connected to the negative pole of power source 7 by wires, and anode 1 is connected to the positive pole of power source 7. The existing horizontal electroplating equipment encounters many problems in production due to the structural setting of isolation tank and cathode roller.
[0074] The following describes the embodiments of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.
[0075] It should be noted that the illustrations provided in this embodiment are only used to illustrate the basic concept of the present invention in a schematic manner. Therefore, the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.
[0076] See also Figure 2 to Figure 13, this embodiment provides a horizontal electroplating device, the horizontal electroplating device comprising:
[0077] Electroplating tank 100;
[0078] Cathode conductive brush 200;
[0079] an anode 300, wherein the anode 300 is disposed in the electroplating tank 100;
[0080] A cup-shaped isolation tank 400, the cup-shaped isolation tank 400 includes a scraping seat 410 and a confluence tank, the scraping seat 410 is fixed in the confluence tank, the confluence tank is arranged in the electroplating tank 100, and there is a plating liquid isolation space 430 between the scraping seat 410 and the confluence tank, the scraping seat 410 is provided with a scraping strip 411 and a through hole 412, the through hole 412 is connected to the confluence tank, and the plating liquid isolation space 430 is used to recover the plating liquid in the electroplating tank 100;
[0081] A cathode roller 500, wherein the cathode roller 500 is disposed in the electroplating tank 100 and mounted on the cup-shaped isolation tank 400;
[0082] The cathode conductive ring 600 is arranged at intervals on the periphery of the cathode roller 500, and an isolation ring 700 is sleeved on the periphery of the cathode conductive ring 600. The isolation ring 700 divides the cathode conductive ring 600 into an inner conductive ring area 1 601 and an outer conductive ring area 2 602. The conductive ring area 1 601 is used to carry the electroplated parts, and the conductive ring area 2 602 is used to electrically contact the cathode conductive brush 200. 1 is electrically connected to the conductive ring second area 602, and the conductive ring first area 601 is correspondingly arranged with the scraper seat 410, the isolation ring 700 and the conductive ring second area 602 are located in the confluence groove, the plating liquid on the conductive ring first area 601 is firstly scraped through the inner wall of the scraper seat 410, and the plating liquid on the conductive ring first area 601 is secondarily scraped through the scraping strip 411, and the scraped plating liquid is converged into the confluence groove through the through hole 412.
[0083] In this embodiment, due to the use of the cup-shaped isolation groove 400, the effective electroplating area can be increased, and the equipment cost, power and floor space can be reduced; the cup-shaped isolation groove 400 is arranged on both sides of the cathode roller 500, which can reduce the effective electroplating distance on both sides of the electroplated part, and can avoid the phenomenon that the plating layer on both sides of the electroplated part is thickened due to the edge effect, thereby achieving uniform electroplating; the conductive ring area 601 forms a shorter conductive area, and the required length of the scraping strip 411 will also be shortened accordingly, which can reduce the requirement for the flatness of the scraping strip 411, and the plating solution on the conductive ring area 601 is scraped at the first level in combination with the inner wall of the scraping seat 410, and the plating solution on the conductive ring area 601 is scraped at the second level by the scraping strip 411, which can effectively prevent the conductive ring area 601 from having a local thickness increase or crystallization due to electroplating, thereby achieving good electroplating, and the plating solution can be recycled through the arrangement of the cup-shaped isolation groove 400.
[0084] For details, see Figure 2 and Figure 3 The schematic diagram of the structure of the horizontal electroplating device in this embodiment is shown, wherein the horizontal electroplating device includes a first water washing area Q1, an electroplating area Q2 and a second water washing area Q3, and the electroplating tank 100 is located in the electroplating area Q2. The type of electroplating solution in the electroplating area Q2 can be selected as needed, and no excessive restrictions are made here. The anode 300 is arranged in the electroplating tank 100 and is electrically connected to the positive electrode of the power supply, such as the positive electrode of the constant current source. The material of the anode 300 can be selected such as titanium, copper, nickel, etc., and no excessive restrictions are made here. In this embodiment, the cathode conductive brush 200 is used to be electrically connected to the negative pole of a power source, such as the negative pole of a constant current source, so that when the cathode conductive brush 200 contacts the cathode conductive ring 600 located at the periphery of the cathode roller 500, the cathode conductive ring 600 can be charged and used as a negative pole, so that the electroplated parts such as battery cells can form a closed circuit after contacting the cathode conductive ring 600 and the electroplating solution to perform the electroplating process.
[0085] As an example, the cathode conductive brush 200 may be fixed on a conductive brush holder 800 above the cathode roller 500. Furthermore, it is preferred that the cathode conductive brush 200 and the conductive brush holder 800 are connected via a telescopic adjustment member.
[0086] For details, see Figure 2 , Figure 3 , Fig.12 and Fig.13In this embodiment, the cathode conductive brush 200 is fixed above the cathode roller 500 through the conductive brush bracket 800, and the cathode conductive brush 200 is electrically contacted with the conductive ring zone 2 602. Since the conductive ring zone 1 601 and the conductive ring zone 2 602 are connected and are both conductors, when the conductive ring zone 2 602 is charged, the conductive ring zone 1 601 is also charged at the same time. In addition, the isolation ring 700 located between the conductive ring zone 1 601 and the conductive ring zone 2 602 can effectively prevent the plating solution from overflowing or sputtering onto the conductive ring zone 2 602 and / or the cathode conductive brush 200 due to the rotation of the cathode roller 500, thereby achieving good contact between the conductive ring zone 2 602 and the cathode conductive brush 200. However, the fixing position of the cathode conductive brush 200 is not limited thereto.
[0087] For further information, see Fig.12 and Fig.13 In this embodiment, the cathode conductive brush 200 is preferably connected to the conductive brush support 800 through a telescopic adjustment member, so that the position of the cathode conductive brush 200 can be adjusted vertically to ensure good contact between the cathode conductive brush 200 and the conductive ring second area 602. In this embodiment, refer to Fig.13 The telescopic adjustment member includes a movable shaft 901 and a spring 902 that can be lifted and lowered vertically. The extension and contraction of the spring 902 drives the cathode conductive brush 200 to upgrade vertically, thereby improving the contact stability between the cathode conductive brush 200 and the conductive ring second zone 602, achieving good electroplating, and avoiding circuit breakage caused by poor contact.
[0088] As an example, the cathode roller 500 may include a PE roller, a PP roller, or a PVDF roller.
[0089] For details, see Figure 7 and Figure 8 In this embodiment, the cathode roller 500 includes a stainless steel tube 501 and a PE tube 502 located on the periphery of the stainless steel tube 501, so that the cathode roller 500 has sufficient strength through the stainless steel tube 501, and in order to prevent the stainless steel tube 501 from being electroplated, it is preferred to arrange the PE tube 502 covering the stainless steel tube 501 and having insulation and corrosion resistance on the periphery of the stainless steel tube 501. Of course, a PP tube or PVDF tube can also be used to cover the stainless steel tube 501, or a PE roller, PP roller or PVDF roller can be directly used as the cathode roller 500 to avoid being electroplated itself, thereby avoiding the deplating process, extending the service life of the cathode roller 500, reducing costs, and increasing production capacity.
[0090] As an example, the cathode conductive ring 600 may include a titanium metal conductive ring or a copper metal conductive ring. The material of the cathode conductive ring 600 can be selected according to needs. In this embodiment, a more commonly used titanium metal conductive ring is selected.
[0091] In this embodiment, the driving component of the cathode roller 500 adopts bearing transmission, that is, the driving component may include a bevel gear 101 and a rotating shaft (not shown) connected to the bevel gear 101, and the rotating shaft may be fixed by a shaft support 102 and a shaft ring 103, and the shaft support 102 and the shaft ring 103 may be fixed on the equipment, and the rotating shaft may rotate within the shaft support 102 and the shaft ring 103, so that when a power part such as a motor drives the bevel gear 101 to rotate, it can synchronously drive the rotating shaft to rotate, thereby driving the cathode roller 500 to rotate, but the type of the driving component is not limited to this.
[0092] As an example, the scraping seat 410 includes a contoured scraping seat arranged corresponding to the conductive ring area 601 .
[0093] For details, see Figure 7 to Figure 11 In this embodiment, the scraper seat 410 adopts a contoured scraper seat corresponding to the cathode conductive ring 600, and the scraper seat 410 is preferably plastic, so that when the cathode roller 500 is placed in the scraper seat 410, the conductive ring area 1 601 can be in good contact with the inner wall of the scraper seat 410, so that when the cathode conductive ring 600 rotates, the inner wall of the scraper seat 410 can perform a primary scraping on the conductive ring area 1 601, and can scrape off a large amount of electroplating liquid brought by the surface of the electroplated part. Then, the surface of the conductive ring area 1 601 is scraped twice by the scraper bar 411 to remove the electroplating liquid brought by the upward rotation of the cathode roller 500. After the secondary scraping, the cathode roller 500 will become dry, which can prevent the conductive ring area 1 601 from having a local thickness increase or crystallization due to electroplating.
[0094] As an example, the scraping strip 411 is preferably provided on one side of the scraping seat 410 , and the scraping strip 411 is located on the screw-out side of the cathode roller 500 .
[0095] For details, see Figures 4 to 7 In this embodiment, the scraping strip 411 is provided on one side of the scraping seat 410, and the scraping strip 411 is located on the side where the cathode roller 500 is about to be rotated out of the scraping seat 410, so that the surface of the conductive ring area 601 that is rotated out of the scraping seat 410 can be dried. Fig. 9 and Fig.11The scraping seat 410 is provided with a scraping strip baffle 413 at its edge, and the scraping strip 411 can be limited by the scraping strip baffle 413. Regarding the installation method of the scraping strip 411, no excessive restriction is made here.
[0096] In this embodiment, since the conductive ring area 601 forms a shorter conductive area, the requirement for the flatness of the scraping strip 411 can be reduced. In addition, the primary scraping of the contoured scraping seat 410 and the secondary scraping of the scraping strip 411 can prevent the conductive ring area 601 from having a local thickness increase or crystallization due to electroplating.
[0097] As an example, the scraping seats 410 are preferably located on both sides of the cathode roller 500 and are symmetrically arranged to reduce the edge plating effect of the plated part.
[0098] As an example, it is preferred that the cathode conductive ring 600 is located on both sides of the cathode roller 500, and the cathode conductive ring 600 is in contact with the edge area of the electroplating part.
[0099] For details, see Figure 4 In this embodiment, the cathode conductive ring 600 is arranged on both sides of the cathode roller 500, which can increase the effective electroplating area and reduce equipment cost, power and floor space; it can reduce the effective electroplating distance on both sides of the electroplated parts, avoid the phenomenon of thickening of the plating layer on both sides of the electroplated parts due to edge effect, and achieve uniform electroplating.
[0100] As an example, the through hole 412 is preferably located at the base of the scraper seat 410 .
[0101] For details, see Fig. 9 and Fig.10 In this embodiment, the through hole 412 is provided at the base of the scraper seat 410, so that the plating liquid scraped from the inner wall of the scraper seat 410 and the scraper strip 411 can be conveniently converged into the confluence groove through the through hole 412 for timely discharge or reuse.
[0102] As an example, the confluence groove may include a cup sleeve 420 , a reflux pipe 440 , and a reflux groove 450 that are connected to each other, and the scraper seat 410 is fixed by the cup sleeve 420 .
[0103] For details, see Figures 4 to 6In this embodiment, the confluence groove includes a cup sleeve 420, a return pipe 440 and a return groove 450 which are connected to each other. The scraper seat 410 is fixed in the cup sleeve 420. The fixing method may include plastic clamping, mortise and tenon joint, etc., so as to fix the scraper seat 410 through the cup sleeve 420 to prevent the scraper seat 410 from rotating. The specific structure and distribution morphology of the confluence groove are not excessively limited here.
[0104] Among them, see Figure 5 and Figure 6 There is a plating liquid isolation space 430 between the scraping seat 410 and the cup sleeve 420, and the plating liquid isolation space 430 is annular, so that the positively charged plating liquid in the plating tank 100 can flow back into the cup sleeve 420 through the plating liquid isolation space 430 to avoid the contact between the positively charged plating liquid and the cathode conductive ring 600, so that the cup sleeve 420 can fix the scraping seat 410 while isolating the cathode conductive ring 600 from the plating liquid in the plating tank 100.
[0105] To summarize, the horizontal electroplating device of the present invention comprises an electroplating tank, a cathode conductive brush, an anode, a cup-shaped isolation tank, a cathode roller and a cathode conductive ring, wherein the cup-shaped isolation tank comprises a scraping seat and a confluence tank, a plating liquid isolation space is provided between the scraping seat and the confluence tank, the scraping seat is provided with a scraping strip and a through hole, the through hole is connected with the confluence tank, the cathode conductive ring is divided into a conductive ring zone 1 and a conductive ring zone 2 by the isolation ring, the conductive ring zone 1 is arranged corresponding to the scraping seat, and the conductive ring zone 2 is located in the confluence tank and is in electrical contact with the cathode conductive brush.
[0106] The horizontal electroplating device of the present invention adopts a cup-shaped isolation groove, which can increase the effective electroplating area and reduce equipment cost, power and floor space; the cup-shaped isolation groove is arranged on both sides of the cathode roller, which can reduce the effective electroplating distance on both sides of the electroplated part, and can avoid the phenomenon that the plating layer on both sides of the electroplated part is thickened due to the edge effect, thereby achieving uniform electroplating; the conductive ring area forms a shorter conductive area, which can reduce the requirements for the flatness of the scraper strip, and combined with the primary scraping of the contoured scraper seat and the secondary scraping of the scraper strip, it can effectively prevent the cathode conductive ring from having a local thickness increase or crystallization due to electroplating; the cathode conductive brush with a telescopic adjustment part can ensure good contact with the cathode conductive ring, thereby achieving good electroplating.
[0107] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.
Claims
1. A horizontal electroplating device, characterized in that: The horizontal electroplating device comprises: Electroplating tanks; Cathode conductive brush; an anode, the anode being disposed in the electroplating tank; A cup-shaped isolation tank, the cup-shaped isolation tank comprising a scraping seat and a confluence tank, the scraping seat being fixed in the confluence tank, the confluence tank being arranged in the electroplating tank, and a plating liquid isolation space being provided between the scraping seat and the confluence tank, the scraping seat being provided with a scraping strip and a through hole, the through hole being connected to the confluence tank, and the plating liquid isolation space being used to recover the plating liquid in the electroplating tank; A cathode roller, the cathode roller is disposed in the electroplating tank and mounted on the cup-shaped isolation tank; A cathode conductive ring, wherein the cathode conductive ring is arranged at intervals on the periphery of the cathode roller, and an isolation ring is provided on the periphery of the cathode conductive ring, and the cathode conductive ring is divided into an inner conductive ring area 1 and an outer conductive ring area 2 by the isolation ring, wherein the conductive ring area 1 is used to carry the electroplated parts, and the conductive ring area 2 is used to make electrical contact with the cathode conductive brush, and the conductive ring area 1 is electrically connected to the conductive ring area 2, and the conductive ring area 1 is arranged corresponding to the scraper seat, the isolation ring and the conductive ring area 2 are located in the confluence groove, and the plating liquid on the conductive ring area 1 is scraped at the first level by the inner wall of the scraper seat, and the plating liquid on the conductive ring area 1 is scraped at the second level by the scraper strip, and the scraped plating liquid is converged into the confluence groove through the through hole.
2. The horizontal electroplating device according to claim 1, characterized in that: The scraping seat comprises a contoured scraping seat arranged corresponding to an area of the conductive ring.
3. The horizontal electroplating device according to claim 1, characterized in that: The scraping strip is arranged on one side of the scraping seat, and the scraping strip is located at the screw-out side of the cathode roller.
4. The horizontal electroplating device according to claim 1, characterized in that: The through hole is located at the base of the scraping seat.
5. The horizontal electroplating device according to claim 1, characterized in that: The confluence groove comprises a cup sleeve, a reflux pipe and a reflux groove which are connected to each other, and the scraping seat is fixed by the cup sleeve.
6. The horizontal electroplating device according to claim 1, characterized in that: The cathode conductive rings are located on both sides of the cathode roller, and the cathode conductive rings are in contact with the edge area of the electroplating part.
7. The horizontal electroplating device according to claim 1, characterized in that: The cathode conductive brush is fixed on a conductive brush support above the cathode roller.
8. The horizontal electroplating device according to claim 7, characterized in that: The cathode conductive brush is connected to the conductive brush support via a telescopic adjusting member.
9. The horizontal electroplating device according to claim 1, characterized in that: The scraping seats are located on both sides of the cathode roller and are symmetrically arranged.
10. The horizontal electroplating device according to claim 1, characterized in that: The cathode roller includes a PE roller, a PP roller or a PVDF roller; the cathode conductive ring includes a titanium metal conductive ring or a copper metal conductive ring.