A split, dual-mode, multi-scale digital image full-field deformation measurement system
Through the split-type digital image full-field deformation measurement system, the problem that existing equipment cannot perform long-distance and large-scale measurements is solved, and flexible measurement of 2D and 3D deformation fields is realized, and efficient and lightweight data transmission capabilities are provided.
Patent Information
- Application Number
- CN202411920905.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2044-12-25
AI Technical Summary
The existing 3D-DIC integrated measurement equipment cannot perform long-distance and large-scale measurements, and has a single function, and can only be used for one of 2D or 3D deformation field measurements.
A split-type, dual-mode, multi-scale digital image full-field deformation measurement system is designed. By designing the DIC image acquisition system into two devices, 2D and 3D deformation field measurement is realized, and the measurement field and scale are adjusted through multiple sets of measurement units and universal adjustment brackets with different measurement ranges.
It realizes full-field deformation measurement with adjustable field of view and flexible layout. It has the functions of 2D-DIC and 3D-DIC modes. It does not require replacement of equipment. It is suitable for long-distance and large-scale structural deformation measurement, and is compact in structure and highly versatile.
Smart Images

Figure CN119354093B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of structural monitoring, and in particular to a split-type, dual-mode, multi-scale digital image full-field deformation measurement system. Background Art
[0002] In the field of civil engineering, measuring the deformation (displacement and strain) of a structure is of great significance for understanding the safety performance and service status of the structure. For in-service structures, due to long-term load and environmental effects, material aging, and component damage, the safety of the structure decreases, and even the structural system fails. Therefore, it is necessary to monitor the structure in real time to further complete the evaluation of the reliability of the structure; for structures in the construction process, there are also frequent safety accidents caused by improper control of the construction process and structural damage and failure. Therefore, for the construction process of important structures such as bridges, building construction, and foundation pit support, the state and local governments have relevant specifications and standards that require construction monitoring. For some large structures, displacement has become an important research part of health monitoring because it directly reflects the structural performance; for some small components, it is often necessary to know their deformation under load, which is often analyzed through displacement field or strain field.
[0003] Traditional deformation measurement methods mainly include strain gauges, displacement meters and fiber grating sensors, which are all contact measurement methods and have the following limitations: complex preparation, large amount of preliminary work, cumbersome operation process and easy to be disturbed by the environment, only point measurement or line measurement can be performed, and it is difficult to achieve full-field displacement and full-field strain measurement, and it is impossible to achieve real-time, dynamic and high-precision measurement.
[0004] Digital image correlation (DIC) has the advantages of non-contact, full-field, and high precision. It is a widely used measurement method and is also closely related to engineering practice. The digital image correlation method calculates the displacement vector of each pixel point by comparing the different states of the surface of the measured target before and after deformation, and completes the two-dimensional deformation field measurement. Furthermore, by collecting images of the measured target at two different angles, images under different viewing angles are obtained, and the three-dimensional coordinates of the object are determined by analyzing the position of the measured target in the two images, thereby obtaining the displacement of each feature point or pixel point, and completing the three-dimensional deformation field measurement of the measured target.
[0005] At present, deformation measurement based on digital image correlation method has the following two main problems: 1. The existing 3D-DIC integrated measurement equipment is mainly aimed at indoor experiments, with fixed measurement field of view and scale, and the distance between measurement units and acquisition angle are not adjustable, and it does not have long-distance and large-scale measurement capabilities; 2. The existing deformation measurement equipment has a single function and can only measure one of the 2D or 3D deformation fields. Summary of the invention
[0006] The present invention aims to solve the deficiencies of the prior art and provides a split, dual-mode, multi-scale digital image full-field deformation measurement system. The DIC image acquisition system is innovatively split into two devices. A single device can complete 2D deformation field measurement, and two devices can complete 3D deformation field measurement when used together. In addition, the DIC image acquisition system includes multiple groups of measurement units with different measurement ranges, which cooperate with a universal adjustment bracket to achieve the adjustment of the measurement field of view and scale. The present invention is a split, dual-mode, multi-scale digital image full-field deformation measurement system with an adjustable field of view and flexible arrangement after calculation of a monocular or binocular imaging model. It can be applied to the measurement of two-dimensional or three-dimensional deformation fields before and after deformation of long-distance, large fields of view, such as building main bodies, bridge main beams, foundation settlement, or close-range, small fields of view, such as structural components.
[0007] In order to achieve the above object, the present invention adopts the following technical solutions:
[0008] A split, dual-mode, multi-scale digital image full-field deformation measurement system, consisting of two identical measuring devices and a computer, each measuring device including a support structure, a DIC image acquisition system, a data processing and computing unit, and a remote communication transmission unit;
[0009] The supporting structure includes a universal adjustment bracket, a lower cover plate, an upper cover plate, a connecting plate and a baffle plate. The lower cover plate is installed on the top of the universal adjustment bracket, the upper cover plate is installed on the top of the lower cover plate, the connecting plate is installed in the middle position of the cavity formed by the lower cover plate and the upper cover plate, a baffle plate mounting hole is opened on one side wall of the lower cover plate and the baffle plate is installed in the baffle plate mounting hole, and a filter is embedded on the baffle plate;
[0010] The DIC image acquisition system includes three measuring units, which are used to collect the surface speckle image of the measured target and transmit the images collected during the measurement process to the data processing and calculation unit. Each measuring unit includes a camera, a fixed-focus lens and an adapter plate. The adapter plate is fixed on the connecting plate, the fixed-focus lens is installed on the adapter plate, and the camera is set on one side of the fixed-focus lens. The cameras of the three measuring units correspond to three filter settings respectively, and the fixed-focus lenses of the three measuring units have different measurement ranges.
[0011] The data processing and computing unit is a micro embedded industrial computer, which is used to analyze and process the images collected by the camera and calculate the displacement and strain data of the measured target. The micro embedded industrial computer is arranged on the top of the connecting plate;
[0012] The remote communication transmission unit is a POE switch, which transmits the analysis results of the data processing calculation unit back to the computer through the 4G / 5G or WIFI network, and converts the transmission content from the image sequence collected by the camera into displacement and strain data values; the POE switch is arranged at the bottom of the connection board;
[0013] The computer uses a remote communication transmission unit and wireless data transmission to receive the images collected by the DIC image acquisition system and the results analyzed by the data processing calculation unit, and generates a displacement map and a strain map of the two-dimensional or three-dimensional deformation field of the measured target in real time.
[0014] Two of the measuring units are mounted on the top of the connecting plate and one measuring unit is mounted on the bottom of the connecting plate.
[0015] The universal adjustment bracket includes a lower horizontal plate, a middle horizontal plate, and an upper horizontal plate. A first vertical plate is provided on the front and rear sides of the upper surface of the lower horizontal plate, a second vertical plate is provided on the front and rear sides of the lower surface of the middle horizontal plate, and a third vertical plate is provided on the left and right sides of the upper surface, and a fourth vertical plate is provided on the left and right sides of the lower surface of the upper horizontal plate. The corresponding first vertical plate and second vertical plate are hingedly arranged through a pin shaft, a first arc-shaped adjustment groove is opened on the first vertical plate, two first tightening screws are arranged on the second vertical plate, and the two first tightening screws are inserted into the first arc-shaped adjustment groove, and the corresponding third vertical plate and fourth vertical plate are hingedly arranged through a pin shaft, a second arc-shaped adjustment groove is opened on the third vertical plate, two second tightening screws are arranged on the fourth vertical plate, and the two second tightening screws are inserted into the second arc-shaped adjustment groove.
[0016] The lower cover plate is mounted on the upper horizontal plate of the universal adjustment bracket by bolts.
[0017] The lower cover plate and the upper cover plate are connected by fasteners.
[0018] The adapter plates of the three measurement units of the DIC image acquisition system, the micro embedded industrial computer of the data processing and computing unit, and the POE switch of the remote communication transmission unit are all fixed to the connecting plate of the supporting structure by bolts.
[0019] The baffle plate and the baffle plate mounting hole of the lower cover plate are connected by a keyway.
[0020] An interface for connecting an external power supply is reserved at the bottom of the lower cover.
[0021] When using 2D-DIC software, a measuring device is required. According to the distance and position to the target, a measuring unit in the measuring device is selected and the angle of the device is adjusted through the universal adjustment bracket. After analysis by the data processing and calculation unit and transmission by the remote communication transmission unit, the displacement map and strain map of the two-dimensional field deformation of the target are drawn. You can choose whether to transmit the image data.
[0022] When using 3D-DIC software, two measuring devices need to be used at the same time and arranged separately. According to the distance between the device and the target to be measured, each measuring device selects a measuring unit and adjusts the field of view of the device through a universal adjustment bracket. The arrangement distance between the two measuring devices is not restricted. It is sufficient to ensure that the target to be measured is in the effective measurement field of view of the measuring units in the two measuring devices. The collected image data is transmitted through a remote communication transmission unit, and the displacement map and strain map of the three-dimensional field deformation of the target to be measured are calculated.
[0023] The beneficial effects of the present invention are as follows: the present invention has two deformation measurement modes, 2D-DIC and 3D-DIC, which can be selected according to actual measurement needs without changing equipment; after integrating functions such as image acquisition, data calculation, and signal transmission, a split independent design is performed, which has a compact structure and strong versatility, avoiding the problem of large volume of the integrated equipment caused by technical requirements during long-distance measurement, and is more convenient to carry; it can meet the multi-scale measurement of the long, medium and short distances of the entire field at the same time, and the field of view can be arbitrarily adjusted, which better meets the complex scenes used in engineering; it can process images in real time and calculate displacement and strain data, making data transmission more efficient and lightweight. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 It is a structural schematic diagram of the present invention;
[0025] Figure 2 This is a schematic diagram of the present invention after the upper cover plate is omitted;
[0026] Figure 3 It is a schematic diagram of the structure inside the support structure of the present invention;
[0027] Figure 4 It is a structural schematic diagram of the support structure in the present invention;
[0028] Figure 5 It is a structural schematic diagram of the universal adjustment bracket in the present invention;
[0029] Figure 6 It is a structural schematic diagram of a single measurement unit of the DIC image acquisition system of the present invention;
[0030] In the figure: 1-support structure; 2-DIC image acquisition system; 3-data processing and calculation unit; 4-remote communication transmission unit;
[0031] 11-universal adjustment bracket; 12-lower cover; 13-upper cover; 14-connecting plate; 15-baffle; 16-filter;
[0032] 111-lower horizontal plate; 112-middle horizontal plate; 113-upper horizontal plate; 114-first vertical plate; 115-second vertical plate; 116-third vertical plate; 117-fourth vertical plate; 118-first arc-shaped adjustment slot; 119-first tightening screw; 120-second arc-shaped adjustment slot; 121-second tightening screw;
[0033] 21- camera; 22- fixed focus lens; 23- adapter plate;
[0034] The following is a detailed description of the embodiments of the present invention with reference to the accompanying drawings. DETAILED DESCRIPTION
[0035] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The embodiments are only used to explain the present invention and are not used to limit the scope of the present invention. The present invention is described in more detail by way of example with reference to the accompanying drawings in the following paragraphs. The advantages and features of the present invention will become clearer according to the following description. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, and are only used to facilitate and clearly assist in explaining the purpose of the embodiments of the present invention.
[0036] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.
[0038] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:
[0039] like Figures 1 to 6 As shown, a split, dual-mode, multi-scale digital image full-field deformation measurement system is composed of two identical measuring devices and a computer. Each measuring device includes a support structure 1, a DIC image acquisition system 2, a data processing and computing unit 3 and a remote communication transmission unit 4.
[0040] The supporting structure 1 includes a universal adjustment bracket 11, a lower cover plate 12, an upper cover plate 13, a connecting plate 14 and a baffle 15. The lower cover plate 12 is installed on the top of the universal adjustment bracket 11, the upper cover plate 13 is installed on the top of the lower cover plate 12, the connecting plate 14 is installed in the middle position of the cavity formed by the lower cover plate 12 and the upper cover plate 13, a baffle mounting hole is opened on one side wall of the lower cover plate 12 and the baffle 15 is installed in the baffle mounting hole, and a filter 16 is embedded on the baffle 15.
[0041] The filter 16 is used to filter out red light with a longer wavelength.
[0042] The universal adjustment bracket 11 can be a commonly used product on the market, for example, the Shimingtong indoor and outdoor three-dimensional universal joint bracket can be used, and the specific structure is as follows:
[0043] The universal adjustment bracket 11 includes a lower horizontal plate 111, a middle horizontal plate 112, and an upper horizontal plate 113. The lower horizontal plate 111 has first vertical plates 114 on both sides of the front and rear of the upper surface, the middle horizontal plate 112 has second vertical plates 115 on both sides of the lower surface, and third vertical plates 116 on both sides of the upper surface, and the upper horizontal plate 113 has fourth vertical plates 117 on both sides of the lower surface. The corresponding first vertical plates 114 and second vertical plates 115 are hingedly connected by pins. The first vertical plates 114 A first arc-shaped adjustment groove 118 is opened on the top, two first tightening screws 119 are provided on the second vertical plate 115 and the two first tightening screws 119 are inserted into the first arc-shaped adjustment groove 118, and the corresponding third vertical plate 116 and fourth vertical plate 117 are hingedly arranged through a pin shaft, a second arc-shaped adjustment groove 120 is opened on the third vertical plate 116, two second tightening screws 121 are provided on the fourth vertical plate 117 and the two second tightening screws 121 are inserted into the second arc-shaped adjustment groove 120.
[0044] The universal adjustment bracket 11 ensures that the measuring device can rotate in any direction and angle. The bottom of the universal adjustment bracket 11 is provided with an interface matching with a tripod or other fixed objects.
[0045] The lower cover plate 12 is bolted to the upper horizontal plate 113 of the universal adjustment bracket 11. The lower cover plate 12 and the upper cover plate 13 are connected by fasteners to keep the internal structure of the measuring device stable. The baffle plate 15 is connected to the baffle plate mounting hole of the lower cover plate 12 by a keyway.
[0046] An interface for connecting to an external power source is reserved at the bottom of the lower cover 12 .
[0047] The DIC image acquisition system 2 includes three measuring units, which are used to acquire the surface speckle image of the measured target and transmit the image acquired during the measurement process to the data processing and calculation unit 3. Each measuring unit includes a camera 21, a fixed-focus lens 22 and an adapter plate 23. The adapter plate 23 is fixed on the connecting plate 14, the fixed-focus lens 22 is installed on the adapter plate 23, and the camera 21 is arranged on one side of the fixed-focus lens 22. The cameras 21 of the three measuring units correspond to the three filters 16 respectively. The fixed-focus lenses 22 of the three measuring units have different measurement ranges, which respectively cover three distances: far, medium and near.
[0048] Two of the measuring units are mounted on the top of the connecting plate 14 and another measuring unit is mounted on the bottom of the connecting plate 14 .
[0049] The data processing and computing unit 3 is a micro embedded industrial computer with powerful edge computing capabilities. It is internally configured with two-dimensional digital image correlation measurement and analysis software for analyzing and processing images collected by the camera 21 and calculating the displacement and strain data of the measured target. The micro embedded industrial computer is arranged on the top of the connecting plate 14 and is provided with a storage function, which can save the original image data as needed.
[0050] The remote communication transmission unit 4 is a POE switch, which can transmit the analysis results of the data processing and calculation unit 3 back to the computer through the 4G / 5G or WIFI network, and convert the transmission content from the image sequence captured by the camera 21 into displacement and strain data values, greatly reducing the data transmission volume; the POE switch is arranged at the bottom of the connecting plate 14.
[0051] The adapter plates 23 of the three measuring units of the DIC image acquisition system 2 , the micro embedded industrial computer of the data processing and computing unit 3 , and the POE switch of the remote communication transmission unit 4 are all fixed to the connection plate 14 of the supporting structure 1 by bolts.
[0052] The computer is equipped with two-dimensional and three-dimensional digital image correlation (2D-DIC and 3D-DIC) full-field deformation measurement and analysis software, which uses a remote communication transmission unit 4 and a wireless data transmission method to receive the images collected by the DIC image acquisition system 2 and the results analyzed by the data processing and calculation unit 3, and generates a displacement map and a strain map of the two-dimensional or three-dimensional deformation field of the measured target in real time.
[0053] When using the 2D-DIC software, a measuring device is required. According to the distance and position to the measured target, a measuring unit in the measuring device is selected and the angle of the device is adjusted through the universal adjustment bracket 11. After analysis by the data processing and calculation unit 3 and transmission by the remote communication transmission unit 4, the displacement map and strain map of the two-dimensional field deformation of the measured target are drawn, and whether to perform image data transmission is selected by the user.
[0054] When using the 3D-DIC software, two measuring devices need to be used simultaneously and arranged separately. According to the distance between the device and the target to be measured, each measuring device selects a measuring unit and adjusts the field of view of the device through the universal adjustment bracket 11. The arrangement distance between the two measuring devices is not restricted. It is sufficient to ensure that the target to be measured is in the effective measurement field of view of the measuring units in the two measuring devices. The collected image data is transmitted through the remote communication transmission unit 4, and the displacement map and strain map of the three-dimensional field deformation of the target to be measured are calculated.
[0055] The present invention only uses the remote communication transmission unit 4 to transmit the displacement and strain data calculated by the data processing calculation unit 3. When image transmission is not performed, data can be transmitted efficiently and lightly.
[0056] Compared with the existing digital image measuring devices with separate two-dimensional deformation field and three-dimensional deformation field measurement functions, the present invention includes a multi-scale, adjustable field of view, split full-field deformation measurement system with 2D-DIC and 3D-DIC modes. The system adopts a split measuring device and provides 2D and 3D measurement modes. Each measuring device has an independent two-dimensional field deformation measurement function and can be used alone. The two measuring devices are combined into a set of measuring systems with a three-dimensional full-field deformation measurement function. The measuring device includes three sets of DIC image acquisition units 2 with different measurement scales. According to the requirements of the measurement scene, the appropriate measuring unit can be selected and the measurement position and angle of the device can be adjusted.
[0057] The present invention has rich functions, compact structure, wide application scenarios, and is easy to carry and use.
[0058] Under the premise that the resolution of the camera 21 is determined, the present invention can perform 2D or 3D deformation measurement of the target to be measured according to the selected measurement mode, and can measure the measured areas of different distances and ranges according to different measurement fields of view and scales; under the premise that the resolution of the camera 21 is determined, the targets within the field of view of different measurement units can be measured successively, and the same measurement unit in the measurement equipment, that is, two cameras 21 with the same focal length, are selected each time.
[0059] The specific operation method is:
[0060] 1 Install the measuring device on a tripod or other fixed device, connect it to a computer and turn on the power supply, and adjust the image acquisition frequency and the brightness of the illumination source according to the actual situation so that the image grayscale is within an appropriate range;
[0061] 2 Determine the selected field of view: according to the area size and distance range of the measured target, adjust the angle of the measuring device and select a suitable measuring unit until the speckles sprayed on the surface of the measured target are clearly visible in the field of view of the camera 21;
[0062] 3. Calibrate the camera 21 in the measurement unit, collect multiple images, and determine external parameters such as the position of the camera 21 and internal parameters such as the position of the lens optical center, so as to facilitate subsequent calculations;
[0063] 4 Start measuring. When selecting the 2D-DIC measurement mode, only one measuring device is needed. You can select whether to transmit and save the acquired image data as needed. When selecting the 3D-DIC measurement mode, two measuring devices are needed at the same time to automatically transmit and save the acquired image data.
[0064] 5. The image data collected by the digital image correlation measurement system or the calculated displacement and strain data are transmitted to the computer, and the two-dimensional deformation field or three-dimensional deformation field of the measured target is processed and drawn through the digital image correlation measurement analysis software.
[0065] The present invention has two deformation measurement modes, 2D-DIC and 3D-DIC, which can be selected according to actual measurement requirements without changing equipment.
[0066] The present invention integrates the functions of image acquisition, data calculation, signal transmission, etc. into one, and adopts a split independent design with a compact structure and strong versatility. It solves the problem that traditional equipment is incapable of long-distance and large-scale measurement, and at the same time avoids the problem of large size of the integrated equipment caused by technical requirements during long-distance measurement, and is more convenient to carry.
[0067] The present invention can satisfy multi-scale measurements of the entire field at long, medium and short distances at the same time, and the field of view can be adjusted arbitrarily, which can better meet the complex scenes used in engineering.
[0068] The present invention can process images and calculate displacement and strain data in real time, making data transmission more efficient and lightweight.
[0069] The present invention is described above by way of example in conjunction with the accompanying drawings. It is obvious that the specific implementation of the present invention is not limited to the above-mentioned method. As long as various improvements are made using the method concept and technical solution of the present invention, or are directly applied to other occasions without improvement, they are all within the protection scope of the present invention.
Claims
1. A split, dual-mode, multi-scale digital image full-field deformation measurement system, characterized in that: It is composed of two identical measuring devices and a computer, each measuring device including a support structure (1), a DIC image acquisition system (2), a data processing and computing unit (3) and a remote communication transmission unit (4); The support structure (1) comprises a universal adjustment bracket (11), a lower cover plate (12), an upper cover plate (13), a connecting plate (14) and a baffle plate (15); the lower cover plate (12) is mounted on the top of the universal adjustment bracket (11); the upper cover plate (13) is mounted on the top of the lower cover plate (12); the connecting plate (14) is mounted at a middle position in a cavity formed by the lower cover plate (12) and the upper cover plate (13); a baffle plate mounting hole is provided on a side wall of the lower cover plate (12) and the baffle plate (15) is mounted in the baffle plate mounting hole; and a filter (16) is embedded on the baffle plate (15); The universal adjustment bracket (11) comprises a lower horizontal plate (111), a middle horizontal plate (112), and an upper horizontal plate (113); a first vertical plate (114) is provided on the front and rear sides of the upper surface of the lower horizontal plate (111); a second vertical plate (115) is provided on the front and rear sides of the lower surface of the middle horizontal plate (112), and a third vertical plate (116) is provided on the left and right sides of the upper surface; a fourth vertical plate (117) is provided on the left and right sides of the lower surface of the upper horizontal plate (113); the corresponding first vertical plate (114) and the second vertical plate (115) are hingedly arranged by a pin shaft; the first vertical plate (114) ) is provided with a first arc-shaped adjustment groove (118), the second vertical plate (115) is provided with two first tightening screws (119), and the two first tightening screws (119) are inserted into the first arc-shaped adjustment groove (118), the corresponding third vertical plate (116) and the fourth vertical plate (117) are hingedly arranged through a pin shaft, the third vertical plate (116) is provided with a second arc-shaped adjustment groove (120), the fourth vertical plate (117) is provided with two second tightening screws (121), and the two second tightening screws (121) are inserted into the second arc-shaped adjustment groove (120); The DIC image acquisition system (2) comprises three measuring units for acquiring a surface speckle image of a measured target and transmitting the image acquired during the measurement process to a data processing and calculation unit (3), each measuring unit comprising a camera (21), a fixed-focus lens (22) and an adapter plate (23), the adapter plate (23) being fixed on a connecting plate (14), the fixed-focus lens (22) being mounted on the adapter plate (23), the camera (21) being arranged on one side of the fixed-focus lens (22), the cameras (21) of the three measuring units being arranged corresponding to three filters (16) respectively, and the fixed-focus lenses (22) of the three measuring units having different measurement ranges; two of the measuring units being mounted on the top of the connecting plate (14) and the other measuring unit being mounted on the bottom of the connecting plate (14); The data processing and computing unit (3) is a micro embedded industrial computer, which is used to analyze and process images collected by the camera (21) and calculate displacement and strain data of the measured target. The micro embedded industrial computer is arranged on the top of the connecting plate (14); The remote communication transmission unit (4) is a POE switch, which transmits the analysis results of the data processing calculation unit (3) back to the computer via a 4G / 5G or WIFI network, and converts the transmission content from the image sequence collected by the camera (21) into displacement and strain data values; the POE switch is arranged at the bottom of the connection plate (14); The computer uses a remote communication transmission unit (4) and a wireless data transmission method to receive the image collected by the DIC image acquisition system (2) and the result analyzed by the data processing calculation unit (3), and generates a displacement map and a strain map of the two-dimensional or three-dimensional deformation field of the measured target in real time.
2. The split-type, dual-mode, multi-scale digital image full-field deformation measurement system according to claim 1 is characterized in that: The lower cover plate (12) is mounted on the upper horizontal plate (113) of the universal adjustment bracket (11) by means of bolts.
3. The split-type, dual-mode, multi-scale digital image full-field deformation measurement system according to claim 2 is characterized in that: The lower cover plate (12) and the upper cover plate (13) are connected by fasteners.
4. The split-type, dual-mode, multi-scale digital image full-field deformation measurement system according to claim 3 is characterized in that: The adapter plates (23) of the three measurement units of the DIC image acquisition system (2), the micro embedded industrial computer of the data processing and computing unit (3), and the POE switch of the remote communication transmission unit (4) are all fixed to the connection plate (14) of the support structure (1) by bolts.
5. The split-type, dual-mode, multi-scale digital image full-field deformation measurement system according to claim 4 is characterized in that: The baffle plate (15) and the baffle plate mounting hole of the lower cover plate (12) are connected by a keyway.
6. The split-type, dual-mode, multi-scale digital image full-field deformation measurement system according to claim 5 is characterized in that: An interface for connecting to an external power supply is reserved at the bottom of the lower cover plate (12).
7. The split-type, dual-mode, multi-scale digital image full-field deformation measurement system according to claim 6 is characterized in that: When using the 2D-DIC software, a measuring device is required. According to the distance and position to the target, a measuring unit in the measuring device is selected and the angle of the device is adjusted through a universal adjustment bracket (11). After analysis by the data processing and calculation unit (3) and transmission by the remote communication transmission unit (4), a displacement map and a strain map of the two-dimensional field deformation of the target are drawn. The user can choose whether to transmit the image data.
8. The split-type, dual-mode, multi-scale digital image full-field deformation measurement system according to claim 7 is characterized in that: When using the 3D-DIC software, two measuring devices need to be used simultaneously and arranged separately. According to the distance between the device and the target to be measured, each measuring device selects a measuring unit and adjusts the field of view of the device through a universal adjustment bracket (11). The arrangement distance between the two measuring devices is not restricted, ensuring that the target to be measured is respectively within the effective measurement field of view of the measuring units in the two measuring devices. The collected image data is transmitted through a remote communication transmission unit (4), and a displacement map and a strain map of the three-dimensional field deformation of the target to be measured are calculated.
Citation Information
Patent Citations
Portable, double-view-field and multi-scale three-dimensional digital image correlation measurement system
CN113551989A