Flexible board gold-plated layer thickness detection method, system and device and storage medium

Abstract

The invention discloses a flexible plate gold-plated layer thickness detection method, system and device and a storage medium. The method comprises the steps that gold-plated thicknesses and gold element contents corresponding to multiple groups of gold-plated flexible plate samples are counted in advance; the gold plating thickness and the gold element content of each group of gold-plated flexible plate samples are different; curve fitting is carried out according to the gold plating thickness and the gold element content of all the gold-plated flexible plate samples, and a fitted curve is obtained; providing the to-be-detected flexible board which is plated with gold, and measuring the actual gold content of the to-be-detected flexible board by using the elemental analyzer; and substituting the actual gold content into the fitted curve to obtain the target gold-plated layer thickness of the to-be-detected flexible plate. According to the method, the content of the gold element can be measured, accurate thickness detection of any flexible plate gold plating layer can be indirectly achieved, the application range is wide, the thickness of the gold layer from the micron level to the nanometer level can be detected, and the measurement precision is high.

Description

Technical Field

[0001] The invention relates to the field of flexible circuit board manufacturing, and in particular to a method, system, device and storage medium for detecting the thickness of a gold-plated layer of a flexible circuit board. Background Art

[0002] Flexible printed circuit (FPC) has the advantages of being bendable, foldable, light in weight, and small in size. It is widely used in aerospace, mobile phones, computers, digital cameras, and other fields. In the production process of flexible circuit boards, electroplating gold is a commonly used surface treatment technology. By electroplating a layer of metal gold on the surface of FPC, the conductivity of FPC can be significantly improved, because gold is an excellent conductor that can ensure smooth transmission of current. In addition, electroplating gold can also enhance the corrosion resistance of FPC, protect the circuit from the influence of the external environment, and extend its service life. At the same time, the electroplating gold process can also improve the aesthetics of FPC, making it more visually attractive.

[0003] However, the thickness of the gold plating of FPC has an important impact on the product. The appropriate gold plating thickness can provide good conductivity, corrosion resistance, and welding performance. Of course, it will also affect the production cost and manufacturing complexity. A thicker gold plating layer usually requires more gold materials and manufacturing processes, which will increase the production cost. In addition, an overly thick gold plating layer may increase the difficulty of the manufacturing process and affect production efficiency. Therefore, FPC factories now have certain control over the thickness of gold plating.

[0004] At present, the measurement of the thickness of the FPC gold plating layer is mainly achieved by using a gold-nickel thickness gauge. A gold-nickel thickness gauge, also known as a metal thickness gauge, is a professional device used to measure the thickness of metals and their coatings. For a gold-nickel thickness gauge that uses the principle of X-ray fluorescence, it uses X-rays to illuminate the object being measured, and determines the content and thickness of the coating elements by measuring the intensity of the reflected X-ray fluorescence.

[0005] Although this method can directly measure the thickness of the gold layer, the X-ray instrument measurement window in the gold-nickel thickness gauge has size requirements. Generally, the industry uses a 2mm×2mm measurement standard disk, which requires a large measurement area. It is not suitable for measuring the thickness of the gold layer in increasingly fine and small-sized gold-plated areas. In addition, the measurement accuracy of the equipment is above 5%, and the measurement error is also large. Summary of the invention

[0006] In view of this, the present invention provides a method, system, device and storage medium for detecting the thickness of the gold-plated layer of a flexible plate, so as to solve the problem that the existing flexible plate gold-plated layer thickness detection technology cannot adapt to the gold layer thickness detection of fine-sized gold-plated areas and has large measurement errors.

[0007] The present invention provides a method for detecting the thickness of a gold-plated layer of a flexible plate, the method comprising:

[0008] Pre-statisticing the gold plating thickness and gold element content corresponding to a plurality of groups of gold-plated flexible plate samples; wherein the gold plating thickness and the gold element content of each group of the gold-plated flexible plate samples are different;

[0009] Performing curve fitting according to the gold plating thickness and the gold element content of all the gold-plated flexible plate samples to obtain a fitting curve between the gold plating thickness and the gold element content;

[0010] Providing a gold-plated flexible plate to be inspected, and measuring the actual gold content of the flexible plate to be inspected by using an element analyzer;

[0011] The actual gold content is substituted into the fitting curve to obtain the target gold-plated layer thickness of the flexible plate to be tested.

[0012] Optionally, the pre-statisticing of the gold plating thickness and gold element content corresponding to the multiple groups of gold-plated flexible plate samples includes:

[0013] Pre-fabricate a plurality of groups of the gold-plated flexible plate samples; wherein the number of samples in each group of the gold-plated flexible plate samples is at least five;

[0014] In each group of the gold-plated flexible plate samples, an ion cutting method is used to respectively produce a gold layer slice corresponding to each sample in each group of the gold-plated flexible plate samples;

[0015] Respectively measure the sample gold layer thickness corresponding to each gold layer slice in each group of the gold-plated flexible plate samples; and respectively obtain the gold plating thickness corresponding to each group of the gold-plated flexible plate samples according to the sample gold layer thickness of all the gold layer slices in each group of the gold-plated flexible plate samples;

[0016] The element analyzer is used to measure the sample gold content corresponding to each sample in each group of the gold-plated flexible plate samples; and the gold element content corresponding to each group of the gold-plated flexible plate samples is obtained based on the sample gold content of all samples in each group of the gold-plated flexible plate samples.

[0017] Optionally, the step of respectively measuring the sample gold layer thickness corresponding to each gold layer slice in each group of the gold-plated flexible plate samples comprises:

[0018] Select any group of the gold-plated flexible plate samples, and in the selected gold-plated flexible plate samples, use a scanning electron microscope to scan each of the gold layer slices according to a first specified magnification to obtain a slice image corresponding to each of the gold layer slices;

[0019] Based on an image recognition method, respectively identifying the thickness of the gold layer of the sample in each of the slice images of the selected gold-plated flexible plate sample;

[0020] Each group of the gold-plated flexible plate samples is traversed, and the thickness of the sample gold layer in each slice image in each group of the gold-plated flexible plate samples is obtained in the same manner.

[0021] Optionally, obtaining the gold plating thickness corresponding to each group of the gold-plated flexible plate samples according to the sample gold layer thicknesses of all the gold layer slices in each group of the gold-plated flexible plate samples comprises:

[0022] Select any group of the gold-plated flexible plate samples, and in the selected gold-plated flexible plate samples, average the gold layer thicknesses of the samples in all the slice images to obtain the gold plating thickness corresponding to the selected gold-plated flexible plate samples;

[0023] Each group of the gold-plated flexible plate samples is traversed, and the gold plating thickness corresponding to each group of the gold-plated flexible plate samples is obtained in the same manner.

[0024] Optionally, the element analyzer is used to measure the gold content of each sample in each group of the gold-plated flexible plate samples, including:

[0025] Select any group of the gold-plated flexible plate samples, and scan each sample in the selected gold-plated flexible plate samples using a scanning electron microscope according to a second specified magnification to obtain a sample image corresponding to each sample in the selected gold-plated flexible plate samples;

[0026] Using the element analyzer, respectively detecting the gold content of the sample in each sample image of the selected gold-plated flexible plate sample;

[0027] Each group of the gold-plated flexible plate samples is traversed, and the gold content of each sample in each group of the gold-plated flexible plate samples is obtained according to the same method.

[0028] Optionally, obtaining the gold content corresponding to each group of the gold-plated flexible plate samples according to the sample gold content of all samples in each group of the gold-plated flexible plate samples comprises:

[0029] Select any group of the gold-plated flexible plate samples, and average the gold contents of all samples in the selected gold-plated flexible plate samples to obtain the gold element content corresponding to the selected gold-plated flexible plate samples;

[0030] Each group of the gold-plated flexible plate samples is traversed, and the gold element content corresponding to each group of the gold-plated flexible plate samples is obtained according to the same method.

[0031] Optionally, the pre-fabrication of a plurality of groups of the gold-plated flexible plate samples comprises:

[0032] Providing at least eight groups of flexible plate samples to be gold-plated, wherein the number of samples in each group of the flexible plate samples to be gold-plated is at least five;

[0033] According to the preset thickness range, corresponding gold plating thickness parameters are designed for each group of the flexible plate samples to be gold plated; wherein the gold plating thickness parameters designed for each group of the flexible plate samples to be gold plated are different;

[0034] According to the gold plating thickness parameters designed for each group of the flex plate samples to be gold plated, each group of the flex plate samples to be gold plated is gold plated to obtain the gold plated flex plate samples corresponding to each group of the flex plate samples to be gold plated.

[0035] Optionally, performing curve fitting according to the gold plating thickness and the gold element content of all the gold-plated flexible plate samples to obtain a fitting curve between the gold plating thickness and the gold element content includes:

[0036] Pre-constructing an initial model corresponding to the fitting curve;

[0037] The gold plating thickness is used as the output variable of the initial model, and the gold content is used as the input variable of the initial model. The gold plating thickness and the gold content of each group of the gold-plated flexible plate samples are respectively input into the initial model by linear regression method, and a target model corresponding to the initial model is obtained by fitting;

[0038] The target model is determined as the fitting curve between the gold plating thickness and the gold element content.

[0039] Optionally, the measuring the actual gold content of the flexible plate to be tested by using an element analyzer includes:

[0040] Scanning the flexo plate to be inspected using a scanning electron microscope at a third specified magnification to obtain a flexo plate image corresponding to the flexo plate to be inspected;

[0041] The actual gold content in the flexographic plate image is detected by using the element analyzer.

[0042] In addition, the present invention also provides a flexible plate gold-plated layer thickness detection system, which is applied to the above-mentioned flexible plate gold-plated layer thickness detection method, and the system includes:

[0043] A sample data acquisition module is used to pre-statistically calculate the gold plating thickness and gold element content corresponding to a plurality of groups of gold-plated flexible plate samples; wherein the gold plating thickness and the gold element content of each group of the gold-plated flexible plate samples are different;

[0044] A curve fitting module, used for performing curve fitting according to the gold plating thickness and the gold element content of all the gold-plated flexible plate samples, to obtain a fitting curve between the gold plating thickness and the gold element content;

[0045] The actual gold content detection module is used to provide a gold-plated flexible plate to be tested, and use an element analyzer to measure the actual gold content of the flexible plate to be tested;

[0046] The gold plating thickness output module is used to substitute the actual gold content into the fitting curve to obtain the target gold plating thickness of the flexible board to be tested.

[0047] In addition, the present invention also provides a device for detecting the thickness of the gold-plated layer of a flexible plate, comprising a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein the computer program implements the method steps in the aforementioned method for detecting the thickness of the gold-plated layer of a flexible plate when the computer program is executed.

[0048] In addition, the present invention also provides a computer storage medium, which includes: at least one instruction, and when the instruction is executed, the method steps in the above-mentioned method for detecting the thickness of the gold-plated layer of the flexible plate are implemented.

[0049] The beneficial effects of the present invention are as follows: multiple groups of gold-plated flexible plate samples with different gold-plating thicknesses and gold element contents are counted in advance, and the relationship between the gold-plating thickness and the gold element content corresponding to these gold-plated flexible plate samples conforms to the general law between the thickness of the gold-plated layer of the flexible plate and the element content, so through these different gold-plating thicknesses and gold element contents, a standard curve between the thickness of the gold-plated layer of the flexible plate and the element content, that is, a fitting curve between the gold-plating thickness and the gold element content can be fitted; by counting the gold-plating thickness, the gold element content of the sample and the curve fitting between the two, it is convenient to directly apply the fitting curve obtained by fitting to the flexible plate in the actual generation process; for any flexible plate to be inspected that has completed gold plating, the actual gold content of the gold-plated layer can be measured by an element analyzer, and the actual gold content is substituted into the fitting curve, so that the thickness of the gold-plated layer of the flexible plate to be inspected can be indirectly detected based on the element content, and an accurate target gold-plated layer thickness can be obtained;

[0050] The flexible plate gold-plated layer thickness detection method, system, device and storage medium of the present invention can not only measure the content of gold element based on the fitting curve obtained by fitting and the actual gold content obtained by the element analysis method, but also indirectly realize the precise thickness detection of any flexible plate gold-plated layer. It is not limited to the size of the gold-plated area and has a wide range of applications. The thickness of the gold layer from the micron level to the nanometer level can be detected with high measurement accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The features and advantages of the present invention will be more clearly understood by referring to the accompanying drawings, which are schematic and should not be construed as limiting the present invention in any way. In the accompanying drawings:

[0052] Figure 1 A flow chart of a method for detecting the thickness of a gold-plated layer of a flexible plate in Embodiment 1 of the present invention is shown;

[0053] Figure 2 A schematic diagram showing the pre-calculation of the gold plating thickness and the gold element content in the first embodiment of the present invention is shown;

[0054] Figure 3 and Figure 4 Schematic diagrams of slice images of two gold layer slices in Example 1 of the present invention are respectively shown;

[0055] Figure 5 A schematic diagram of a sample image in the first embodiment of the present invention is shown;

[0056] Figure 6 A schematic diagram showing the elemental composition per unit area of ​​two regions in a sample image measured by an EDS element analyzer in the first embodiment of the present invention;

[0057] Figure 7 The element spectrum corresponding to the lower left corner area of ​​the sample image in the first embodiment of the present invention is shown;

[0058] Figure 8 A flow chart of obtaining a fitting curve in the first embodiment of the present invention is shown;

[0059] Fig. 9 The figure corresponding to the target model in the first embodiment of the present invention is shown;

[0060] Fig.10 A flow chart showing the actual gold content of the flexible plate to be tested in the first embodiment of the present invention is shown;

[0061] Fig.11 The structure diagram of a flexible plate gold-plated layer thickness detection system in the second embodiment of the present invention is shown. DETAILED DESCRIPTION

[0062] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0063] Embodiment 1

[0064] This embodiment provides a method for detecting the thickness of a gold-plated layer of a flexible plate. Figure 1 As shown, including:

[0065] S1: Preliminarily calculating the gold plating thickness and gold element content corresponding to a plurality of groups of gold-plated flexible plate samples; wherein the gold plating thickness and the gold element content of each group of the gold-plated flexible plate samples are different;

[0066] S2: performing curve fitting according to the gold plating thickness and the gold element content of all the gold-plated flexible plate samples to obtain a fitting curve between the gold plating thickness and the gold element content;

[0067] S3: providing a gold-plated flexible plate to be inspected, and measuring the actual gold content of the flexible plate to be inspected by using an element analyzer;

[0068] S4: Substituting the actual gold content into the fitting curve to obtain the target gold-plated layer thickness of the flexible plate to be tested.

[0069] In the present embodiment, a plurality of groups of gold-plated flexible plate samples with different gold-plating thicknesses and gold element contents are pre-stated, and the relationship between the gold-plating thickness and the gold element content corresponding to these gold-plated flexible plate samples conforms to the general law between the thickness of the gold-plated layer of the flexible plate and the element content, so through these different gold-plating thicknesses and gold element contents, a standard curve between the thickness of the gold-plated layer of the flexible plate and the element content, that is, a fitting curve between the gold-plating thickness and the gold element content can be fitted; by statistically analyzing the gold-plating thickness, the gold element content of the samples and the curve fitting between the two, it is convenient to directly apply the fitting curve obtained by fitting to the flexible plate in the actual generation process; for any flexible plate to be inspected that has completed gold plating, the actual gold content of the gold-plated layer can be measured by an element analyzer, and the actual gold content is substituted into the fitting curve, so that the thickness of the gold-plated layer of the flexible plate to be inspected can be indirectly detected based on the element content, and an accurate target gold-plated layer thickness can be obtained.

[0070] The method for detecting the thickness of the gold-plated layer of the flexible plate of the present embodiment can not only measure the content of the gold element based on the fitting curve obtained by fitting and the actual gold content obtained by the element analysis method, but also can indirectly realize the precise thickness detection of the gold-plated layer of any flexible plate. It is not limited to the size of the gold-plated area and has a wide range of applications. The thickness of the gold layer from the micron level to the nanometer level can be detected with high measurement accuracy.

[0071] Each step of the detection method of this embodiment is described in detail below.

[0072] Preferably, if Figure 2 As shown, S1 pre-statistics the gold plating thickness and gold element content corresponding to multiple groups of gold-plated flexible plate samples, including:

[0073] S11: Pre-fabricate multiple groups of the gold-plated flexible plate samples; wherein the number of samples in each group of the gold-plated flexible plate samples is at least five;

[0074] S12: in each group of the gold-plated flexible plate samples, using an ion cutting method to respectively produce a gold layer slice corresponding to each sample in each group of the gold-plated flexible plate samples;

[0075] S13: measuring the sample gold layer thickness corresponding to each gold layer slice in each group of the gold-plated flexible plate samples respectively; and obtaining the gold plating thickness corresponding to each group of the gold-plated flexible plate samples respectively according to the sample gold layer thickness of all the gold layer slices in each group of the gold-plated flexible plate samples;

[0076] S14: Using the element analyzer, measure the sample gold content corresponding to each sample in each group of the gold-plated flexible plate samples; and obtain the gold element content corresponding to each group of the gold-plated flexible plate samples based on the sample gold content of all samples in each group of the gold-plated flexible plate samples.

[0077] In S11, the gold-plated flexographic plate samples refer to flexographic plate samples that have completed the gold-plating process according to the conventional flexographic plate manufacturing process. The number of samples in each group of samples is at least five, and the gold-plating thickness and gold element content of the gold layer of each group of samples are different. By making these samples in advance, it is convenient to measure these different gold-plating thicknesses and gold element contents separately in the subsequent measurement, which in turn provides sufficient data basis for exploring the law between the gold-plating thickness and the gold element content, fitting a fitting curve that conforms to the actual situation, and ensuring the accuracy of the fitted fitting curve.

[0078] In S12 to S13, for the measurement of gold plating thickness, firstly, the ion cutting method is used to produce a gold layer slice for each sample in each group of gold-plated flexible plate samples, and the obtained gold layer slice is smooth and lossless, which is convenient for the subsequent more efficient and accurate measurement of the sample gold layer thickness of each sample in each group of gold-plated flexible plate samples; finally, the gold plating thickness corresponding to each group of gold-plated flexible plate samples is determined according to the sample gold layer thickness of all samples in each group of gold-plated flexible plate samples, which can effectively overcome process errors and facilitate improving the accuracy of subsequent curve fitting.

[0079] In S14, for the gold content, an element analyzer is directly used to measure the gold content of each sample in each group of gold-plated flexible plate samples. The gold content of each sample is measured with high accuracy and simple measurement principle, and is applicable to gold-plated areas of flexible plates of different sizes. Similarly, the gold content of each group of gold-plated flexible plate samples is finally determined based on the gold content of all samples in each group of gold-plated flexible plate samples, which can effectively overcome process errors and facilitate improving the accuracy of subsequent curve fitting.

[0080] Specifically, S11 includes:

[0081] S111: providing at least eight groups of flexible plate samples to be gold-plated, wherein the number of samples in each group of the flexible plate samples to be gold-plated is at least five;

[0082] S112: designing corresponding gold plating thickness parameters for each group of the flexible plate samples to be gold plated according to a preset thickness range; wherein the gold plating thickness parameters designed for each group of the flexible plate samples to be gold plated are different;

[0083] S113: performing gold plating on each group of the flexible plate samples to be gold plated according to the gold plating thickness parameters designed for each group of the flexible plate samples to be gold plated, so as to obtain the gold plated flexible plate samples corresponding to each group of the flexible plate samples to be gold plated.

[0084] The flexographic plate samples to be gold-plated refer to the flexographic plate samples that are about to be gold-plated according to the conventional flexographic plate manufacturing process. At least eight groups of such flexographic plate samples to be gold-plated are provided to facilitate the subsequent production of at least eight groups of gold-plated flexographic plate samples, which can effectively ensure that the gold plating thickness and the gold element content are sufficient in quantity, and can also ensure the accuracy of each group of gold plating thickness and gold element content used for curve fitting, thereby providing sufficient and accurate data basis for subsequent curve fitting; a corresponding gold plating thickness parameter is designed for each group of flexographic plate samples to be gold-plated, which can provide a design reference for the subsequent gold plating of the flexographic plate samples to be gold-plated, and ensure that each group of flexographic plate samples to be gold-plated can obtain a gold-plated layer that meets the design requirements, thereby producing gold-plated flexographic plate samples that meet the requirements.

[0085] In this embodiment, 8 groups of flexible plate samples to be gold-plated (specifically, 100 μm thick copper foil, which is about to be gold-plated) are provided, with 5 samples in each group. Nickel plating is performed by a wet process, and then a preset thickness range is set to 0.03-0.1 μm. The concentration and time of the gold plating solution are adjusted so that the gold plating thickness of the 8 groups of samples can form a continuous step-by-step increase, that is, the gold plating thickness parameters designed for each group of flexible plate samples to be gold-plated are 0.03 μm, 0.04 μm, 0.045 μm, 0.05 μm, 0.055 μm, 0.06 μm, 0.07 μm and 0.08 μm, respectively. According to these 8 groups of gold plating thickness parameters, 8 groups of flexible plate samples to be gold-plated are gold-plated respectively to obtain 8 groups of gold-plated flexible plate samples. Among them, the specific operating methods of nickel plating and gold plating are conventional operating methods, and the specific details are not repeated here.

[0086] Specifically, in this embodiment S12, an argon ion cutting method is specifically used to obtain a smooth and damage-free gold layer slice of each sample.

[0087] Specifically, in S13, respectively measuring the sample gold layer thickness corresponding to each gold layer slice in each group of the gold-plated flexible plate samples includes:

[0088] S131: selecting any group of the gold-plated flexible plate samples, and scanning each of the gold layer slices in the selected gold-plated flexible plate samples by using a scanning electron microscope according to a first specified magnification to obtain a slice image corresponding to each of the gold layer slices;

[0089] S132: Based on an image recognition method, respectively identify the thickness of the gold layer of the sample in each of the slice images of the selected gold-plated flexible plate sample;

[0090] S133: traverse each group of the gold-plated flexible plate samples, and obtain the sample gold layer thickness in each slice image in each group of the gold-plated flexible plate samples according to the same method.

[0091] For each gold layer slice in each group of gold-plated flexible plate samples, a scanning electron microscope is used to scan at a first specified magnification, and a high-definition magnified photo (i.e., a slice image) corresponding to each gold layer slice can be obtained, which is convenient for subsequent accurate image recognition and the accurate sample gold layer thickness of each gold layer slice can be obtained. The method is simple to operate and the obtained sample gold layer thickness has a high accuracy rate, which can further improve the efficiency and accuracy of the entire gold-plated layer thickness detection.

[0092] Specifically, for any gold layer slice, put it into a scanning electron microscope, and in the SE2 working mode of the scanning electron microscope (mainly using the SE2 detector to capture and analyze the secondary electrons scattered from the sample surface, the SE2 detector is very sensitive to the scattering of secondary electrons, and can capture the tiny morphological changes on the sample surface, providing a high-resolution surface morphology image), set the acceleration voltage to 10KV and the first specified magnification to 50000 times, scan and photograph the gold layer slice, and obtain the slice image; Figure 3 and Figure 4 Two of the slice images are displayed, and image recognition technology is used to identify the thickness of the gold layer of the samples in the two slice images, which are 45nm and 55mm respectively.

[0093] Specifically, in S13, the gold plating thickness corresponding to each group of the gold-plated flexible plate samples is obtained according to the sample gold layer thicknesses of all the gold layer slices in each group of the gold-plated flexible plate samples, including:

[0094] S134: selecting any group of the gold-plated flexible plate samples, and calculating the average value of the gold layer thickness of all the sample slice images in the selected gold-plated flexible plate samples to obtain the gold plating thickness corresponding to the selected gold-plated flexible plate samples;

[0095] S135: traverse each group of the gold-plated flexible plate samples, and obtain the gold plating thickness corresponding to each group of the gold-plated flexible plate samples according to the same method.

[0096] Since there are process errors in the actual gold-plating process of the flexographic plate samples, the gold layer thickness of all slice images in each group of gold-plated flexographic plate samples is directly averaged and the result is used as the gold-plating thickness of the corresponding gold-plated flexographic plate samples. This can effectively overcome the gold-plating process error, and the obtained gold-plating thickness has a high accuracy rate. The calculation method is simple and reasonable.

[0097] Specifically, in S14, the element analyzer is used to measure the gold content of each sample in each group of the gold-plated flexible plate samples, including:

[0098] S141: selecting any group of the gold-plated flexible plate samples, and scanning each sample in the selected gold-plated flexible plate samples using a scanning electron microscope according to a second specified magnification to obtain a sample image corresponding to each sample in the selected gold-plated flexible plate samples;

[0099] S142: using the element analyzer, respectively detecting the gold content of the sample in each sample image of the selected gold-plated flexible plate sample;

[0100] S143: Traverse each group of the gold-plated flexible plate samples, and obtain the sample gold content corresponding to each sample in each group of the gold-plated flexible plate samples according to the same method.

[0101] For each group of gold-plated flexible plate samples, a scanning electron microscope is used to directly scan each sample at a second specified magnification, and a high-definition image of each sample (i.e., sample image) can also be obtained, which is convenient for the subsequent use of an element analyzer to accurately detect the gold content of each sample.

[0102] Among them, the element analyzer specifically uses an EDS element analyzer, that is, an energy dispersive X-ray spectrometer (Energy Dispersive Spectroscopy), which is a high-precision instrument for analyzing material elements. In a vacuum environment, the instrument uses a high-energy electron beam to bombard the sample surface to excite the atoms in the material, causing them to emit characteristic X-rays. The wavelength (or energy) of these X-rays is a specific sign of the element, similar to a fingerprint. The instrument measures the energy of the X-rays through a detector and converts the received energy information into an electrical signal. Then, it is amplified, filtered and data processed by a pulse processor and finally sent to a multi-channel analyzer (MCA). MCA divides the energy range into multiple channels, each channel corresponds to a specific energy range, thereby achieving qualitative and quantitative analysis of different elements.

[0103] In the above process of measuring the gold content of the sample, since the EDS element analyzer can detect the metal layer to a certain depth (up to 1 μm), and the thickness of the gold layer in the FPC process is generally controlled at 0.03-0.1 μm, the EDS element analyzer can completely penetrate the gold layer to reach the nickel layer, so the gold content can be counted, and then the gold content of different gold layer thicknesses can be counted; since the measurement accuracy of the EDS element analyzer can reach 0.1% wt, the accuracy is relatively high, so the component content can be obtained more accurately, which will reduce the measurement error; in addition, since the EDS element analyzer can be used in conjunction with a scanning electron microscope, the content can be analyzed at the micron and nanometer levels, so the measurement of small-sized gold-plated areas is also applicable.

[0104] Specifically, any one sample in each group of gold-plated flexible plate samples is placed in a scanning electron microscope, and in the SE2 working mode of the scanning electron microscope, an acceleration voltage of 25 KV and a second designated magnification of 1000 times are set, and the sample is scanned and photographed to obtain a sample image; Figure 5 One of the sample images is shown, and the EDS element analyzer is used to measure the element composition per unit area in the sample image and the content of each element component. The schematic diagram of the EDS element analyzer measuring the element composition per unit area of ​​two regions in the sample image is shown in FIG. Figure 6 As shown, the element spectrum corresponding to the lower left corner area is as follows Figure 7 The content of the obtained elemental components is shown in Table 1 below.

[0105] Table 1 The content of elemental components in one of the sample images

[0106] element Line Type Weight Percent Weight Percent Deviation P (Phosphorus) K-line system 6.7 0.16 Ni(Nickel) K-line system 70.65 0.45 Au(gold) L Line 22.65 0.47 Total 100

[0107] Specifically, in S14, the gold content corresponding to each group of the gold-plated flexible plate samples is obtained according to the sample gold content of all samples in each group of the gold-plated flexible plate samples, including:

[0108] S144: selecting any group of the gold-plated flexible plate samples, and calculating the average gold content of all samples in the selected gold-plated flexible plate samples to obtain the gold element content corresponding to the selected gold-plated flexible plate samples;

[0109] S145: Traverse each group of the gold-plated flexible plate samples, and obtain the gold element content corresponding to each group of the gold-plated flexible plate samples according to the same method.

[0110] Similar to the gold plating thickness, the gold content of all sample images in each group of gold-plated flexible plate samples is directly averaged, and the obtained result is used as the gold element content of the corresponding gold-plated flexible plate sample. This can effectively overcome the error of the gold plating process, and the obtained gold element content has a high accuracy rate, and the calculation method is simple and reasonable.

[0111] Preferably, if Figure 8 As shown, this embodiment S2 includes:

[0112] S21: constructing an initial model corresponding to the fitting curve in advance;

[0113] S22: taking the gold plating thickness as the output variable of the initial model, taking the gold content as the input variable of the initial model, and using a linear regression method to input the gold plating thickness and the gold content of each group of the gold-plated flexible plate samples into the initial model, respectively, to obtain a target model corresponding to the initial model by fitting;

[0114] S23: Determine the target model as the fitting curve between the gold plating thickness and the gold element content.

[0115] Through the above method, the relationship between the gold plating thickness and the gold element content can be accurately estimated, which is convenient for the subsequent direct measurement of the actual gold content obtained based on elemental analysis, and the thickness of the gold layer in the gold-plated area can be quickly, efficiently and accurately measured. There is no requirement for the size of the gold-plated area, and it is applicable from the micron level to the nanometer level.

[0116] Specifically, the expression of the pre-built initial model is Y=aX+b (a linear function), the gold-plated thickness of the eight groups of gold-plated flexible plate samples is taken as the X-axis, and the corresponding gold content is taken as the Y-axis. The linear regression method is used to fit the model, and the graph corresponding to the target model is as follows: Fig. 9 As shown, the expression of the target model is Y = 0.359X, which is the fitting curve obtained by curve fitting. In the fitting process, the coefficient of determination R of the linear function Y = 0.359X is 2 At 0.9996, it is very close to 1, as expected.

[0117] Preferably, if Fig.10 As shown, this embodiment S3 includes:

[0118] S31: scanning the flexographic plate to be inspected by using a scanning electron microscope according to a third specified magnification to obtain a flexographic plate image corresponding to the flexographic plate to be inspected;

[0119] S32: Using the element analyzer, the actual gold content in the flexible plate image is detected.

[0120] The flexo plate to be tested is a flexo plate whose gold plating thickness needs to be measured in the actual production process. Its actual gold content is measured by a method similar to the gold element content of the aforementioned gold-plated flexo plate sample, which has high accuracy, small error and simple operation.

[0121] The third designated magnification may be the same as or different from the second designated magnification. In this embodiment, 1000 times (ie, the same as the second designated magnification) is specifically selected.

[0122] In the present embodiment S4, for any flexible plate to be inspected, when its actual gold content is measured, it is input as the X value into Y=0.359X to obtain its corresponding target gold plating layer thickness.

[0123] Embodiment 2

[0124] A flexible plate gold-plated layer thickness detection system is applied to the flexible plate gold-plated layer thickness detection method of embodiment 1, such as Fig.11 As shown, including:

[0125] A sample data acquisition module is used to pre-statistically calculate the gold plating thickness and gold element content corresponding to a plurality of groups of gold-plated flexible plate samples; wherein the gold plating thickness and the gold element content of each group of the gold-plated flexible plate samples are different;

[0126] A curve fitting module, used for performing curve fitting according to the gold plating thickness and the gold element content of all the gold-plated flexible plate samples, to obtain a fitting curve between the gold plating thickness and the gold element content;

[0127] The actual gold content detection module is used to provide a gold-plated flexible plate to be tested, and use an element analyzer to measure the actual gold content of the flexible plate to be tested;

[0128] The gold plating thickness output module is used to substitute the actual gold content into the fitting curve to obtain the target gold plating thickness of the flexible board to be tested.

[0129] In an embodiment, a plurality of groups of gold-plated flexible plate samples with different gold-plating thicknesses and gold element contents are pre-stated through a sample data acquisition module, and the relationship between the gold-plating thickness and the gold element content corresponding to these gold-plated flexible plate samples conforms to the general law between the thickness of the gold-plated layer of the flexible plate and the element content, so a curve fitting module is used to fit a standard curve between the thickness of the gold-plated layer of the flexible plate and the element content, that is, a fitting curve between the gold-plating thickness and the gold element content, through these different gold-plating thicknesses and gold element contents; by statistically analyzing the gold-plating thickness, gold element content and curve fitting between the two of the samples, it is convenient to directly apply the fitting curve obtained by fitting to the flexible plate in the actual generation process; for any flexible plate to be inspected that has completed gold plating, the actual gold content of the gold-plated layer can be measured by an element analyzer through an actual gold content detection module, and the actual gold content is substituted into the fitting curve by a gold plating thickness output module, so that the thickness of the gold-plated layer of the flexible plate to be inspected can be indirectly detected based on the element content, and an accurate target gold-plated layer thickness can be obtained.

[0130] The flexible plate gold-plated layer thickness detection system of this embodiment can not only measure the content of gold elements based on the fitting curve obtained by fitting and the actual gold content obtained by the element analysis method, but also indirectly realize the precise thickness detection of any flexible plate gold-plated layer. It is not limited to the size of the gold-plated area and has a wide range of applications. The thickness of the gold layer from the micron level to the nanometer level can be detected with high measurement accuracy.

[0131] The functions of each module in the flexible plate gold-plated layer thickness detection system described in this embodiment are the same as the method steps of the flexible plate gold-plated layer thickness detection method described in Example 1. Therefore, for the details not covered in this embodiment, please refer to Example 1 and Example 2. Figures 1 to 10 The detailed description will not be repeated here.

[0132] Embodiment 3

[0133] A device for detecting the thickness of a gold-plated layer of a flexible plate comprises a processor, a memory and a computer program stored in the memory and executable on the processor. When the computer program is executed, the method steps in the method for detecting the thickness of a gold-plated layer of a flexible plate of embodiment 1 are implemented.

[0134] Through the computer program stored in the memory and running on the processor, based on the fitting curve obtained by fitting and the actual gold content obtained by elemental analysis method, not only the content of gold element can be measured, but also the precise thickness detection of the gold-plated layer of any flexible plate can be achieved indirectly. It is not limited to the size of the gold-plated area and has a wide range of applications. The thickness of the gold layer from micron level to nanometer level can be detected with high measurement accuracy.

[0135] The processor may be a central processing unit (CPU), other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc. The processor is the control center of a computer device, and uses various interfaces and lines to connect various parts of the entire computer device.

[0136] The memory can be used to store computer programs and / or models. The processor realizes various functions of the computer device by running or executing the computer programs and / or models stored in the memory, and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system and at least one application required for a function (such as a sound playback function, an image playback function, etc.); the data storage area can store data created according to the use of the mobile phone (such as audio data, video data, etc.). In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (SmartMedia Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0137] It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by a computer program. These computer programs can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0138] These computer programs may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0139] These computer programs can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, so that the instructions executed on the computer or other programmable device provide instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0140] This embodiment further provides a computer storage medium, which includes: at least one instruction, and when the instruction is executed, the method steps in the method for detecting the thickness of the gold-plated layer of the flexible plate of the first embodiment are implemented.

[0141] By executing a computer storage medium containing at least one instruction, based on the fitting curve obtained by fitting and the actual gold content obtained by the elemental analysis method, not only the content of the gold element can be measured, but also the precise thickness detection of the gold-plated layer of any flexible plate can be indirectly realized. It is not limited to the size of the gold-plated area and has a wide range of applications. The thickness of the gold layer from the micron level to the nanometer level can be detected with high measurement accuracy.

[0142] Similarly, for details not yet provided in this embodiment, please refer to Embodiment 1, Embodiment 2 and Figures 1 to 11 The detailed description will not be repeated here.

[0143] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A method for detecting the thickness of a gold-plated layer of a flexible plate, characterized in that: The method comprises: Pre-statisticing the gold plating thickness and gold element content corresponding to a plurality of groups of gold-plated flexible plate samples; wherein the gold plating thickness and the gold element content of each group of the gold-plated flexible plate samples are different; Performing curve fitting according to the gold plating thickness and the gold element content of all the gold-plated flexible plate samples to obtain a fitting curve between the gold plating thickness and the gold element content; Providing a gold-plated flexible plate to be inspected, and measuring the actual gold content of the flexible plate to be inspected by using an element analyzer; The actual gold content is substituted into the fitting curve to obtain the target gold-plated layer thickness of the flexible plate to be tested.

2. The method according to claim 1, characterized in that The method of pre-stating the gold plating thickness and gold element content corresponding to the multiple groups of gold-plated flexible plate samples includes: Pre-fabricate a plurality of groups of the gold-plated flexible plate samples; wherein the number of samples in each group of the gold-plated flexible plate samples is at least five; In each group of the gold-plated flexible plate samples, an ion cutting method is used to respectively produce a gold layer slice corresponding to each sample in each group of the gold-plated flexible plate samples; Respectively measure the sample gold layer thickness corresponding to each gold layer slice in each group of the gold-plated flexible plate samples; and respectively obtain the gold plating thickness corresponding to each group of the gold-plated flexible plate samples according to the sample gold layer thickness of all the gold layer slices in each group of the gold-plated flexible plate samples; The element analyzer is used to measure the sample gold content corresponding to each sample in each group of the gold-plated flexible plate samples; and the gold element content corresponding to each group of the gold-plated flexible plate samples is obtained based on the sample gold content of all samples in each group of the gold-plated flexible plate samples.

3. The method according to claim 2, characterized in that The step of respectively measuring the sample gold layer thickness corresponding to each gold layer slice in each group of the gold-plated flexible plate samples comprises: Select any group of the gold-plated flexible plate samples, and in the selected gold-plated flexible plate samples, use a scanning electron microscope to scan each of the gold layer slices according to a first specified magnification to obtain a slice image corresponding to each of the gold layer slices; Based on an image recognition method, respectively identifying the thickness of the gold layer of the sample in each of the slice images of the selected gold-plated flexible plate sample; Each group of the gold-plated flexible plate samples is traversed, and the thickness of the sample gold layer in each slice image in each group of the gold-plated flexible plate samples is obtained in the same manner.

4. The method according to claim 3, characterized in that The step of obtaining the gold plating thickness corresponding to each group of the gold-plated flexible plate samples according to the sample gold layer thicknesses of all the gold layer slices in each group of the gold-plated flexible plate samples comprises: Select any group of the gold-plated flexible plate samples, and in the selected gold-plated flexible plate samples, average the gold layer thicknesses of the samples in all the slice images to obtain the gold plating thickness corresponding to the selected gold-plated flexible plate samples; Each group of the gold-plated flexible plate samples is traversed, and the gold plating thickness corresponding to each group of the gold-plated flexible plate samples is obtained in the same manner.

5. The method according to claim 2, characterized in that: The element analyzer is used to measure the gold content of each sample in each group of the gold-plated flexible plate samples, including: Select any group of the gold-plated flexible plate samples, and scan each sample in the selected gold-plated flexible plate samples using a scanning electron microscope according to a second specified magnification to obtain a sample image corresponding to each sample in the selected gold-plated flexible plate samples; Using the element analyzer, respectively detecting the gold content of the sample in each sample image of the selected gold-plated flexible plate sample; Each group of the gold-plated flexible plate samples is traversed, and the gold content of each sample in each group of the gold-plated flexible plate samples is obtained according to the same method.

6. The method according to claim 5, characterized in that The step of obtaining the gold content corresponding to each group of the gold-plated flexible plate samples according to the sample gold content of all samples in each group of the gold-plated flexible plate samples comprises: Select any group of the gold-plated flexible plate samples, and average the gold contents of all samples in the selected gold-plated flexible plate samples to obtain the gold element content corresponding to the selected gold-plated flexible plate samples; Each group of the gold-plated flexible plate samples is traversed, and the gold element content corresponding to each group of the gold-plated flexible plate samples is obtained according to the same method.

7. The method according to claim 2, characterized in that The method of pre-fabricating a plurality of groups of gold-plated flexible plate samples comprises: Providing at least eight groups of flexible plate samples to be gold-plated, wherein the number of samples in each group of the flexible plate samples to be gold-plated is at least five; According to the preset thickness range, corresponding gold plating thickness parameters are designed for each group of the flexible plate samples to be gold plated; wherein the gold plating thickness parameters designed for each group of the flexible plate samples to be gold plated are different; According to the gold plating thickness parameters designed for each group of the flex plate samples to be gold plated, each group of the flex plate samples to be gold plated is gold plated to obtain the gold plated flex plate samples corresponding to each group of the flex plate samples to be gold plated.

8. The method according to claim 1, characterized in that The step of performing curve fitting according to the gold plating thickness and the gold element content of all the gold-plated flexible plate samples to obtain a fitting curve between the gold plating thickness and the gold element content includes: Pre-constructing an initial model corresponding to the fitting curve; The gold plating thickness is used as the output variable of the initial model, and the gold content is used as the input variable of the initial model. The gold plating thickness and the gold content of each group of the gold-plated flexible plate samples are respectively input into the initial model by linear regression method, and a target model corresponding to the initial model is obtained by fitting; The target model is determined as the fitting curve between the gold plating thickness and the gold element content.

9. The method according to claim 1, characterized in that: The measuring the actual gold content of the flexible plate to be tested by using an element analyzer comprises: Scanning the flexo plate to be inspected using a scanning electron microscope at a third specified magnification to obtain a flexo plate image corresponding to the flexo plate to be inspected; The actual gold content in the flexographic plate image is detected by using the element analyzer.

10. A flexible plate gold plating layer thickness detection system, characterized in that: Applied to the method for detecting the thickness of the gold-plated layer of a flexible plate as claimed in any one of claims 1 to 9, the system comprises: A sample data acquisition module is used to pre-statistically calculate the gold plating thickness and gold element content corresponding to a plurality of groups of gold-plated flexible plate samples; wherein the gold plating thickness and the gold element content of each group of the gold-plated flexible plate samples are different; A curve fitting module, used for performing curve fitting according to the gold plating thickness and the gold element content of all the gold-plated flexible plate samples, to obtain a fitting curve between the gold plating thickness and the gold element content; The actual gold content detection module is used to provide a gold-plated flexible plate to be tested, and use an element analyzer to measure the actual gold content of the flexible plate to be tested; The gold plating thickness output module is used to substitute the actual gold content into the fitting curve to obtain the target gold plating thickness of the flexible board to be tested.

11. A device for detecting the thickness of a gold-plated layer of a flexible plate, characterized in that: The method comprises a processor, a memory and a computer program stored in the memory and executable on the processor, wherein the computer program implements the method steps in the method for detecting the thickness of the gold-plated layer of a flexible plate as claimed in any one of claims 1 to 9 when the computer program is executed.

12. A computer storage medium, characterized in that: The computer storage medium comprises: at least one instruction, and when the instruction is executed, the method steps in the method for detecting the thickness of the gold-plated layer of the flexible plate according to any one of claims 1 to 9 are implemented.

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