A single bus temperature sensor array positioning and calibration device based on hot spot identification

Abstract

The application belongs to the technical field of sensor array positioning and temperature calibration, and particularly relates to a single-bus temperature sensor array positioning and calibration device based on hot spot identification, which comprises a test module and a main control board, the test module comprises a heating array substrate on which a heating unit array is arranged, the heating unit array comprises a plurality of heating units, each of which can independently generate heat; and a temperature sensor array comprising a plurality of single-bus temperature sensors; when a single heating unit works, a hot spot will be formed on the heating array substrate, and the temperature sensor array is used to measure the temperature of the hot spot, so that the single-bus temperature sensor is positioned and identified; and then, the ID number of the single-bus temperature sensor is bound to the physical space position based on the positioning. The single-bus temperature sensor array positioning and calibration device based on hot spot identification effectively solves the problem of corresponding binding of physical objects and IDs in the networking application of single-bus temperature sensors.

Description

Technical Field

[0001] The present invention belongs to the technical field of sensor array positioning and temperature calibration, and specifically relates to a relative position spatial positioning and temperature calibration device for a sensor array composed of single-bus type temperature sensors, and more particularly to a single-bus temperature sensor array positioning and calibration device based on hot spot recognition. Background Art

[0002] OneWire is a peripheral serial expansion bus technology developed by DALLAS, a US company. It utilizes a single signal line for transmission. This protocol consists of a bus master node or multiple slave nodes, which read data from multiple slave chips via a single signal line. Each OneWire-compliant slave chip has a unique ROMID (Serial Number ID), consisting of a 48-bit serial number, an 8-bit family code, and an 8-bit CRC code. The master chip uses this 64-bit ID to communicate bidirectionally with each chip. Therefore, a temperature array composed of OneWire temperature sensors can achieve large-scale, high-density temperature acquisition while conserving host system I / O pins, simplifying wiring, reducing costs, and facilitating bus expansion and maintenance.

[0003] But in a large number of sensors by a single bus consisting of sensor array, the host system from the bus read sensor ID number can not be one-to-one corresponding to the sensor in the physical space location, therefore, it is not convenient for temperature measurement system installation and debugging process sensor ID and sensor, test object and test parameter binding, which hinders the further promotion and application of single bus temperature sensor. Through the spatial positioning of single bus temperature sensor array, the following can be achieved: first, improve the accuracy of temperature measurement: by positioning the relative position of each sensor, the spatial resolution of temperature distribution can be determined more accurately, which is crucial for areas that need to understand the temperature gradient or temperature change in detail. At the same time, in different spatial positions, environmental conditions (such as light, ventilation, heat source, etc.) may be different, which will affect temperature measurement. By positioning each sensor in the sensor array, we can better understand the impact of these environmental differences on temperature measurement and make appropriate corrections. Second, realize multi-point temperature monitoring: sensor array is usually used to cover a larger area or equipment. By positioning the position of each sensor, we can ensure that the key points of the entire area or equipment are effectively monitored. In addition, in applications that require real-time monitoring of multi-point temperature (such as data centers, industrial production lines, etc.), positioning each sensor in the sensor array can help quickly identify and solve potential temperature problems. Third, it is beneficial to optimize the layout of sensor array: by positioning the position of each sensor, the layout of sensor array can be optimized to maximize the coverage and accuracy of temperature measurement. For example, we can increase the density of sensors in areas with large temperature gradients, and reduce the number of sensors in areas with relatively stable temperature. Reasonable sensor array layout can ensure measurement accuracy while avoiding unnecessary sensor overlap or omission, thereby maximizing cost efficiency. Fourth, support advanced data analysis and visualization: combining the position information of each sensor with temperature measurement data can support more advanced data analysis. For example, through spatial interpolation algorithm, more detailed temperature distribution map can be generated. Displaying the relative position of sensor array and its measured temperature data in geographic information system (GIS) or other visualization tools can help decision makers understand temperature distribution more intuitively and make more accurate decisions.

[0004] Furthermore, temperature calibration of single-bus temperature sensor arrays is extremely important. During the production process, even within the same batch of temperature sensors, initial measurement accuracy may vary due to factors such as manufacturing processes and material differences. Calibration can eliminate or reduce this initial error, ensuring that each sensor in the sensor array provides accurate temperature readings. Furthermore, temperature sensors are subject to environmental factors during use, such as temperature fluctuations, humidity, and electromagnetic interference, which can cause drift in sensor measurements. Regular calibration can promptly detect and correct these drifts, ensuring measurement accuracy. Furthermore, many industries, particularly those in the medical, aerospace, and food processing sectors, have stringent requirements for the accuracy and reliability of temperature sensors. Calibration ensures that sensor arrays comply with relevant industry standards and regulations, thus meeting these requirements.

[0005] Therefore, a relative position spatial positioning and temperature calibration device for a sensor array composed of single-bus type temperature sensors is provided to achieve spatial positioning and temperature calibration of each temperature sensor in the single-bus temperature sensor array, which has positive significance for promoting the further promotion and application of single-bus temperature sensors. Summary of the Invention

[0006] The purpose of the present invention is to address the above-mentioned technical problems and provide a single-bus temperature sensor array positioning and calibration device based on hot spot recognition to achieve the purpose of spatial positioning and temperature calibration of each temperature sensor in the single-bus temperature sensor array.

[0007] In view of this, the present invention provides a single-bus temperature sensor array positioning and calibration device based on hot spot identification, comprising: a test module and a main control board, wherein the test module is connected to the main control board, and the main control board can adjust the state of the test module;

[0008] Wherein, the test module includes:

[0009] A heating array substrate, on which a heating unit array is arranged, wherein the heating unit array includes a plurality of heating units, each of which can be individually controlled by the main control board to generate heat according to its row and column position;

[0010] A temperature sensing array comprising a plurality of single-bus temperature sensors, wherein the temperature sensing array is arranged opposite to the heating unit array, and each single-bus temperature sensor is configured with a heating unit corresponding thereto;

[0011] In the single heating unit working, a hot spot will be formed on the heating array substrate, the temperature of the hot spot is measured by the temperature sensing array, the positioning and identification of the single bus temperature sensor are realized, and then the ID number of the single bus temperature sensor is bound to the physical space position based on the positioning.

[0012] Further, the heating unit array is prepared by printed circuit processing, and the heating array substrate is prepared by thermoelectric isolation multilayer material.

[0013] Further, the temperature sensing array is located on the upper side of the heating array substrate, and the heating unit array is arranged on the lower side of the heating array substrate.

[0014] Further, the test module further comprises:

[0015] The liquid cooling plate has a cooling liquid passing through the inside, and the liquid cooling plate is located on the lower side of the heating array substrate.

[0016] The liquid cooling plate is a hollow structure, and the inside of the liquid cooling plate is filled with a circulating cooling medium.

[0017] Further, the single bus temperature sensing array positioning and calibration device based on hot spot identification further comprises a base;

[0018] The upper part of the base is provided with a groove, forming a containing space of the liquid cooling plate, the heating array substrate, the heating unit array and the temperature sensing array, and the temperature sensing array, the heating array substrate, the heating unit array and the liquid cooling plate are arranged in the groove in turn from top to bottom.

[0019] Further, the single bus temperature sensing array positioning and calibration device based on hot spot identification further comprises a heat shield, which is buckled on the base, and the test module is located in the enclosed space formed by the base and the heat shield.

[0020] Further, the single bus temperature sensing array positioning and calibration device based on hot spot identification further comprises a heating and ventilation module, which can deliver air of a certain temperature to the enclosed space formed by the base and the heat shield during work, for regulating the environmental temperature in the enclosed space.

[0021] Further, the heating and ventilation module comprises:

[0022] The conveying pipeline is connected with the first air inlet arranged on the outer side wall of the base at one end, and connected with the second air inlet arranged on the upper surface of the base at the other end, and the second air inlet is located in the enclosed space formed by the base and the heat shield.

[0023] An air outlet is arranged on the upper surface of the base and is capable of connecting the closed space formed by the base and the heat shield with the external atmosphere to discharge the gas in the closed space formed by the base and the heat shield;

[0024] An air temperature sensor is arranged for measuring the ambient temperature in the closed space;

[0025] An air inlet temperature sensor is arranged for detecting the temperature of the air entering through the first air inlet.

[0026] Further, the single-bus temperature sensor array positioning and calibration device based on hot spot recognition can operate in a first mode, which is used for calibrating the hot spot temperature of each point on the heat-generating array substrate under standard working conditions. The first mode includes the following steps:

[0027] S1, the standard temperature sensor array integrated circuit is placed on the heat-generating array substrate and connected to the main control board through the data line, and then the heat shield is covered;

[0028] S2, set the working condition parameters and start the test by pressing the start button. The main control board controls the liquid cooling plate and the air temperature in the cover according to the set value;

[0029] S3, after the liquid cooling plate and the air temperature in the cover are stable, the main control board controls the heat-generating units on the heat-generating array substrate one by one to heat at constant power, thereby forming hot spots;

[0030] S4, the main control board reads the sensor temperature at the hot spot position by using ID. When the temperature value is stable, the temperature value at this time is read and taken as the equilibrium temperature T std (i) is assigned to the heat-generating unit forming the hot spot, and the temperature value is stored in the hot spot array standard temperature matrix T std ;

[0031] S5, after the hot spot temperature reading of all heat-generating units is completed one by one, the complete hot spot array standard temperature matrix T std is obtained, and the standard working condition calibration is completed.

[0032] Further, the single-bus temperature sensor array positioning and calibration device based on hot spot recognition can operate in a second mode, which is used for address binding and temperature correction of the temperature sensor array integrated circuit to be tested. The second mode includes the following steps:

[0033] P1, the to-be-tested member is placed on the heat-generating array substrate and connected to the main control board through the data line, and then the heat shield is covered;

[0034] P2, set the working parameters and press the start button to start the test. The main control board controls the temperature of the liquid cooling plate 301 and the air inside the cover according to the set values;

[0035] P3: After the temperature of the liquid cooling plate and the air inside the cover stabilizes, the main control board controls the heating units on the heating array substrate one by one to perform constant power heating, thereby forming a hot spot;

[0036] P4: The main control board reads the temperature array formed by the temperature values ​​of all sensors on the device under test. After the temperature values ​​stabilize, it extracts the highest temperature value and reads the sensor ID number corresponding to the highest temperature value.

[0037] P5, the highest temperature value is taken as the hot spot equilibrium temperature T cal (i) Assign a value to the corresponding sensor, assign the sensor ID number corresponding to the highest temperature value to the corresponding sensor, and store the highest temperature value and the sensor ID number corresponding to the highest temperature value in the hot spot balance temperature matrix T corresponding to the hot spot array. cal and ID number matrix Addr;

[0038] P6, after all the heat-generating units have completed the hot spot equilibrium temperature and ID number reading, the hot spot equilibrium temperature matrix T cal Export the data of the ID matrix Addr to the external storage device to complete the address binding;

[0039] P7, for the standard temperature matrix T std and hot spot equilibrium temperature matrix T cal Make a comparison and calibrate the temperature of the test piece.

[0040] The beneficial effects of the present invention are:

[0041] The single-bus temperature sensor array positioning and calibration device based on hot spot identification, described in this invention, is based on heat transfer theory and integrates multiple aspects, including heat transfer, structure, and circuit design. It leverages the rapid heat dissipation characteristics of a high-temperature, small-sized heating module on a highly thermally conductive metal plate to form a concentrated hot spot on the metal plate. Furthermore, the temperature sensor's numerical response to the hot spot is used to bind the sensor ID to its physical location in the temperature sensor array. Furthermore, the circuit design enables programmatic control of the hot spot, thereby achieving automated batch identification and binding of temperature sensor arrays.

[0042] The single-bus temperature sensor array positioning and calibration device based on hot spot recognition described in the present invention not only solves the problem of binding physical objects and IDs in the networking application of single-bus temperature sensors, but also improves the efficiency of automatic batch reading and debugging of ID numbers in the bus temperature sensor array networking system, thereby improving the feasibility of networking applications of single-bus temperature sensors in industrial scenarios, reducing installation and debugging costs, simplifying wiring harness layout, and reducing wiring harness costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a schematic diagram of the three-dimensional structure of the single-bus temperature sensor array positioning and calibration device based on hot spot recognition according to the present invention;

[0044] Figure 2 3D schematic diagram of the single-bus temperature sensor array positioning and calibration device based on hot spot recognition according to the present invention from another perspective;

[0045] Figure 3 Schematic diagram of the perspective structure of the single-bus temperature sensor array positioning and calibration device based on hot spot recognition according to the present invention;

[0046] Figure 4 2 is a perspective structural diagram of the single-bus temperature sensor array positioning and calibration device based on hot spot recognition according to the present invention from another perspective;

[0047] Figure 5 This is a schematic diagram of the three-dimensional structure of the single-bus temperature sensor array positioning and calibration device based on hot spot recognition according to the present invention after the heat shield is removed;

[0048] Figure 6 This is an exploded view of the structure of the single-bus temperature sensor array positioning and calibration device based on hot spot recognition according to the present invention after the heat shield is removed;

[0049] Figure 7 This is a logic diagram of the connections between the modules in the single-bus temperature sensor array positioning and calibration device based on hot spot recognition described in the present invention;

[0050] Figure 8 This is a flowchart of the operation of the single-bus temperature sensor array positioning and calibration device based on hot spot recognition in the first mode of the present invention;

[0051] Figure 9 This is a flowchart of the operation of the single-bus temperature sensor array positioning and calibration device based on hot spot recognition in the second mode of the present invention;

[0052] The marks in the figure are:

[0053] 1. Base; 101. Display screen; 102. Operation buttons; 103. USB port; 104. Power port; 105. Communication port; 106. First air inlet; 107. Water inlet; 108. Water outlet; 2. Heat shield; 3. Test module; 301. Liquid cooling plate; 302. Heating array substrate; 303. Heating unit array; 304. Temperature sensor array; 305. Cooling medium inlet; 306. Cooling medium outlet; 4. Heating and ventilation module; 401. Delivery pipe; 402. Second air inlet; 403. Exhaust port; 404. Air temperature sensor inside the cover; 405. Inlet air temperature sensor; 5. Main control board; DETAILED DESCRIPTION

[0054] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0055] In the description of this application, it should be noted that the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the exemplary embodiments according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn according to the actual proportional relationship. Technologies, methods and equipment known to ordinary technicians in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods and equipment should be considered as part of the authorization specification. In all examples shown and discussed here, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, so once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0056] It should be noted that the term "and / or" in the specification and claims of this application indicates at least one of the connected objects, and the character " / " generally indicates that the front and back related objects are in an "or" relationship. In the description of this application, the orientation or position relationship indicated by the terminology of directional words such as "front, back, up, down, left, right", "lateral, vertical, vertical, horizontal" and "top, bottom" is usually based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of this application; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0057] It should be noted that, in the present application, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0058] like Figures 1 to 9 As shown, a single-bus temperature sensor array positioning and calibration device based on hot spot identification includes: a test module 3 and a main control board 5, wherein the test module 3 is connected to the main control board 5, and the main control board 5 can adjust the state of the test module 3;

[0059] Wherein, the test module 3 includes:

[0060] A heating array substrate 302 on which a heating unit array 303 is provided. The heating unit array 303 includes a plurality of heating units, each of which can be individually controlled by the main control board 5 to generate heat according to its row or column position;

[0061] A temperature sensing array 304, comprising a plurality of single-bus temperature sensors, the temperature sensing array 304 being arranged opposite the heating unit array 303, each single-bus temperature sensor being configured with a corresponding heating unit;

[0062] When a single heating unit is working, a hot spot will be formed on the heating array substrate 302. The temperature of the hot spot is measured by the temperature sensing array 304 to realize the positioning and identification of the single-bus temperature sensor. Then, based on the positioning, the ID number of the single-bus temperature sensor is bound to the physical space position.

[0063] As some examples of the present invention, the number of heating units can be greater than the number of single-bus temperature sensors, as long as each single-bus temperature sensor is configured with a corresponding heating unit. In this way, the same heating unit array 303 can be used to position multiple types of temperature sensor arrays 304.

[0064] Preferably, the heating unit array 303 is prepared by printed circuit processing.

[0065] Preferably, the heating array substrate 302 is made of a multi-layer structure material with thermal and electrical isolation, such as a copper substrate or an aluminum substrate.

[0066] Preferably, the temperature sensing array 304 measures the highest temperature point of the hot spot to achieve positioning, identification and temperature calibration of the single-bus temperature sensor.

[0067] As some examples of the present invention, the heating unit array 303 can be set on the upper side or lower side of the heating array substrate 302. It is only necessary that the heating unit array 303 can heat the heating array substrate 302 and form hot spots at different positions on the heating array substrate 302.

[0068] Preferably, the heating unit array 303 is arranged on the lower side of the heating array substrate 302 , that is, on the side close to the liquid cooling plate 301 .

[0069] Furthermore, the testing module 3 also includes:

[0070] The liquid cooling plate 301 has cooling liquid passing therethrough. The liquid cooling plate 301 is located on the lower side of the heating array substrate 302, and the temperature sensing array 304 is located on the upper side of the heating array substrate 302. In this way, the operation of the liquid cooling plate 301 can ensure that a constant uniform temperature field is formed around the heating array substrate 302.

[0071] As some examples of the present invention, the liquid cooling plate 301 is a hollow structure, and the liquid cooling plate 301 is filled with a cooling medium.

[0072] Preferably, the liquid cooling plate 301 is filled with a circulating cooling medium. Specifically, a cooling medium inlet 305 and a cooling medium outlet 306 are provided on the liquid cooling plate 301. External low-temperature cooling medium can enter the liquid cooling plate 301 through the cooling medium inlet 305 and be discharged through the cooling medium outlet 306 after being heated by heat exchange.

[0073] Furthermore, the single-bus temperature sensor array positioning and calibration device based on hot spot recognition also includes: a base 1, the liquid cooling plate 301, the heating array substrate 302, the heating unit array 303, the temperature sensor array 304 and the main control board 5 are arranged on the base 1.

[0074] Specifically, the upper part of the base 1 is provided with a recess, forming a containing space of the liquid cooling plate 301, the heat array substrate 302, the heat unit array 303 and the temperature sensing array 304, and the temperature sensing array 304, the heat array substrate 302, the heat unit array 303 and the liquid cooling plate 301 are sequentially arranged in the recess from top to bottom.

[0075] As some examples of the present application, a hollow space for containing the main control board 5 is further arranged in the base 1, preferably, the main control board 5 is arranged below the liquid cooling plate 301, so that the heat generated by the heat unit array 303 does not adversely affect the main control board 5, and the space below the liquid cooling plate 301 can be cooled, thereby indirectly cooling the main control board 5.

[0076] As some examples of the present application, the base 1 is further provided with a display screen 101, an operation button 102, a USB interface 103, a power interface 104 and a communication interface 105, wherein the display screen 101 is used to display text, pictures, videos and other information, the operation button 102 is used to input instructions to the display screen 101 or the single bus temperature sensing array positioning and calibration device based on hot spot identification, and control, the instructions input by the operation button 102 can be power on, power off, mode switching, etc.; the USB interface 103 is used to realize the communication connection between the single bus temperature sensing array positioning and calibration device based on hot spot identification and external equipment; the power interface 104 is used to connect with external power supply equipment, and supply power to the single bus temperature sensing array positioning and calibration device based on hot spot identification; the communication interface 105 is used to connect external cooling equipment, and monitor the temperature, flow, start-stop state and the like of the cooling medium (such as water) provided by the cooling equipment, the external cooling equipment is connected with the liquid cooling plate 301, to receive the high-temperature cooling medium discharged by the liquid cooling plate 301, cool the cooling medium, and input the low-temperature cooling medium to the liquid cooling plate 301.

[0077] As some examples of the present application, the base 1 is further provided with a water inlet 107 and a water outlet 108, the water inlet 107 and the water outlet 108 are respectively connected with the cooling medium inlet 305 and the cooling medium outlet 306 on the liquid cooling plate 301 through connecting hoses, and the water inlet 107 and the water outlet 108 are also connected with external cooling equipment.

[0078] Further, the single bus temperature sensing array positioning and calibration device based on hot spot identification further comprises a heat shield 2, which is buckled on the base 1, and the test module 3 is located in the enclosed space formed by the base 1 and the heat shield 2. The heat shield 2 plays a role in heat insulation during testing, reducing heat loss and environmental impact.

[0079] Furthermore, the single-bus temperature sensor array positioning and calibration device based on hot spot recognition also includes a heating and ventilation module 4. During operation, the heating and ventilation module 4 can deliver air of a certain temperature to the enclosed space formed by the base 1 and the heat insulation cover 2, so as to regulate the ambient temperature in the enclosed space.

[0080] Specifically, the heating and ventilation module 4 includes:

[0081] A delivery pipe 401 is connected at one end to the first air inlet 106 provided on the outer wall of the base 1, and at the other end to a second air inlet 402 provided on the upper surface of the base 1. The second air inlet 402 is located within the enclosed space formed by the base 1 and the heat shield 2. Thus, the delivery pipe 401 connects the external space of the hot spot recognition-based single-bus temperature sensor array positioning and calibration device with the enclosed space formed by the base 1 and the heat shield 2, thereby delivering external air into the enclosed space formed by the base 1 and the heat shield 2.

[0082] Furthermore, the heating and ventilation module 4 further includes:

[0083] The exhaust port 403 is provided on the upper surface of the base 1 and can connect the closed space formed by the base 1 and the heat insulation cover 2 with the external atmosphere to discharge the gas in the closed space formed by the base 1 and the heat insulation cover 2.

[0084] Preferably, the number of the exhaust ports 403 is 3 to 6, and the exhaust ports 403 are arranged around the test module 3 .

[0085] Furthermore, a plurality of air temperature sensors 404 are provided in the closed space formed by the base 1 and the heat insulation cover 2 . The air temperature sensors 404 are used to measure the ambient temperature in the closed space.

[0086] Preferably, the number of the air temperature sensors 404 inside the hood is 3 to 8, and the air temperature sensors 404 inside the hood are evenly arranged at various locations in the enclosed space.

[0087] In addition, an air inlet temperature sensor 405 is provided at the first air inlet 106 , and the air inlet temperature sensor 405 is used to detect the temperature of the air entering through the first air inlet 106 .

[0088] Furthermore, the heating and ventilation module 4 also includes: a heating device and an air delivery device such as a fan, which can achieve constant temperature control of the air temperature in the enclosed space by controlling the heating power and air volume of the heating device and combining the PID algorithm.

[0089] Furthermore, the connection logic between the modules in the single bus temperature sensor array positioning and calibration device based on hot spot recognition is as follows: Figure 7 As shown: the main control board 5 is connected to all sensors and control components to realize functions such as data acquisition, equipment control, data display, and data storage. Specifically, the detection and input devices such as the operation button 102, the air temperature sensor 404 inside the hood, the air inlet temperature sensor 404, and the temperature sensor array 304 are respectively connected to the main control board 5, and can input detection data or instructions to the main control board 5. In addition, the main control board 5 is also connected to the heating and ventilation module 4, the heating array substrate 302, the display screen 101, and the cooling control module. At the same time, the temperature sensor array 304 is connected to an external storage device through the main control board 5 to store data during the sensor positioning and calibration process.

[0090] Furthermore, depending on the test purpose, the single-bus temperature sensor array positioning and calibration device based on hot spot recognition has two operating modes:

[0091] The first mode is used to calibrate the hot spot temperature at each point on the heating array substrate 302 under standard working conditions;

[0092] The second mode is used to perform address binding and temperature calibration on the temperature sensor array integrated circuit under test.

[0093] The operation process of the first mode is as follows: Figure 8 As shown, it mainly includes the following steps:

[0094] S1, place the standard temperature sensor array integrated circuit on the heating array substrate 302, connect it to the main control board 5 via a data line, and then cover it with the heat insulation cover 2;

[0095] S2, set the working parameters, such as the temperature of the liquid cooling plate 301, the air temperature inside the cover, etc., and press the start button to start the test. The main control board 5 controls the temperature of the liquid cooling plate 301 and the air temperature inside the cover according to the set values;

[0096] S3, after the temperature of the liquid cooling plate 301 and the air inside the cover is stable, the main control board 5 controls the heating units on the heating array substrate 302 one by one to perform constant power heating, thereby forming a hot spot;

[0097] S4, the main control board 5 uses the ID to read the sensor temperature at the hot spot position. When the temperature value stabilizes, read the temperature value at this time and use it as the equilibrium temperature Tstd (i) Assign a value to the heating unit that forms the hot spot and store the temperature value in the hot spot array standard temperature matrix T std middle;

[0098] S5, after all the hot spot temperatures of all the heating units are read in sequence, the complete hot spot array standard temperature matrix T is obtained. std , complete the standard working condition calibration.

[0099] It should be noted that in the first mode, a matching temperature sensor array integrated circuit standard component must be used for testing. The standard component has known ID numbers of each sensor and corresponding ID data files, and each sensor has been temperature calibrated.

[0100] In addition, the operation process of the second mode is as follows Figure 9 As shown, it mainly includes the following steps:

[0101] P1, place the DUT on the heating array substrate 302 and connect it to the main control board 5 via a data line, then cover it with the heat shield 2;

[0102] P2, set the working parameters, such as the temperature of the liquid cooling plate 301, the air temperature inside the cover, etc., and press the start button to start the test. The main control board 5 controls the temperature of the liquid cooling plate 301 and the air temperature inside the cover according to the set values;

[0103] P3, after the temperature of the liquid cooling plate 301 and the air inside the cover stabilizes, the main control board 5 controls the heating units on the heating array substrate 302 one by one to perform constant power heating, thereby forming a hot spot;

[0104] P4, the main control board 5 reads the temperature array formed by the temperature values ​​of all sensors on the device under test. After the temperature values ​​stabilize, it extracts the highest temperature value and reads the sensor ID number corresponding to the highest temperature value;

[0105] P5, the highest temperature value is taken as the hot spot equilibrium temperature T cal (i) Assign a value to the corresponding sensor, assign the sensor ID number corresponding to the highest temperature value to the corresponding sensor, and store the highest temperature value and the sensor ID number corresponding to the highest temperature value in the hot spot balance temperature matrix T corresponding to the hot spot array. cal and ID number matrix Addr;

[0106] P6, after all the heat-generating units have completed the hot spot equilibrium temperature and ID number reading, the hot spot equilibrium temperature matrix T cal The data of the ID number matrix Addr is exported to an external storage device, and the address binding is finally completed.

[0107] Furthermore, the second mode further includes the steps of:

[0108] P7, for the standard temperature matrix T std and hot spot equilibrium temperature matrix T cal Make a comparison and calibrate the temperature of the test piece.

[0109] In the present invention, the standard temperature matrix T std and hot spot equilibrium temperature matrix T cal The specific process of performing comparison and achieving temperature correction of the test piece is well known to those skilled in the art and will not be described in detail here.

[0110] In summary, the single-bus temperature sensor array positioning and calibration device based on hot spot identification, described in this invention, is based on heat transfer theory and integrates multiple aspects, including heat transfer, structure, and circuit design. It leverages the rapid heat dissipation characteristics of a high-temperature, small-sized heating module on a highly thermally conductive metal plate to form a concentrated hot spot on the metal plate. Furthermore, the temperature sensor's numerical response to the hot spot is used to bind the sensor ID to its physical location in the temperature sensor array. Furthermore, the circuit design enables programmatic control of the hot spot, thereby achieving automated batch identification and binding of temperature sensor arrays.

[0111] The single-bus temperature sensor array positioning and calibration device based on hot spot recognition described in the present invention not only solves the problem of binding physical objects and IDs in the networking application of single-bus temperature sensors, but also improves the efficiency of automatic batch reading and debugging of ID numbers in the bus temperature sensor array networking system, thereby improving the feasibility of networking applications of single-bus temperature sensors in industrial scenarios, reducing installation and debugging costs, simplifying wiring harness layout, and reducing wiring harness costs.

[0112] The embodiments of the present application are described above in conjunction with the accompanying drawings. Unless there is a conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A single bus temperature sensor array positioning and calibration device based on hot spot recognition, characterized in that: include: A test module (3) and a main control board (5), wherein the test module (3) is connected to the main control board (5), and the main control board (5) is capable of regulating the state of the test module (3); Wherein, the test module (3) comprises: A heating array substrate (302) is provided with a heating unit array (303), wherein the heating unit array (303) includes a plurality of heating units, and each heating unit can be individually controlled by the main control board (5) to generate heat according to its row and column position; A temperature sensing array (304) comprising a plurality of single-bus temperature sensors, wherein the temperature sensing array (304) is arranged opposite to the heating unit array (303), and each single-bus temperature sensor is configured with a heating unit corresponding thereto; When a single heating unit is working, a hot spot will be formed on the heating array substrate (302). The temperature of the hot spot is measured by the temperature sensing array (304) to achieve the positioning and identification of the single-bus temperature sensor. Then, based on the positioning, the ID number of the single-bus temperature sensor is bound to the physical space position.

2. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 1, characterized in that: The heating unit array (303) is manufactured by printed circuit processing, and the heating array substrate (302) is manufactured by using a thermal and electrical isolation multilayer material.

3. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 1, characterized in that: The temperature sensing array (304) is located on the upper side of the heating array substrate (302), and the heating unit array (303) is arranged on the lower side of the heating array substrate (302).

4. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 1, characterized in that: The test module (3) further comprises: a liquid cooling plate (301) having cooling liquid passing therethrough, the liquid cooling plate (301) being located on the lower side of the heating array substrate (302); The liquid cooling plate (301) is a hollow structure, and a circulating cooling medium is filled inside the liquid cooling plate (301).

5. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 4, characterized in that: The single-bus temperature sensor array positioning and calibration device based on hot spot identification further comprises: a base (1); A groove is provided on the upper portion of the base (1) to form a housing space for the liquid cooling plate (301), the heating array substrate (302), the heating unit array (303) and the temperature sensing array (304); the temperature sensing array (304), the heating array substrate (302), the heating unit array (303) and the liquid cooling plate (301) are sequentially arranged in the groove from top to bottom.

6. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 5, characterized in that: The single-bus temperature sensor array positioning and calibration device based on hot spot recognition further comprises a heat shield (2) which is fastened to the base (1), and the test module (3) is located in a closed space formed by the base (1) and the heat shield (2).

7. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 6, characterized in that: The single-bus temperature sensor array positioning and calibration device based on hot spot recognition further comprises a heating and ventilation module (4). During operation, the heating and ventilation module (4) is capable of delivering air of a certain temperature into a closed space formed by the base (1) and the heat insulation cover (2), so as to regulate the ambient temperature in the closed space.

8. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 7, characterized in that: The heating and ventilation module (4) comprises: a delivery pipe (401), one end of which is connected to a first air inlet (106) provided on the outer side wall of the base (1), and the other end of which is connected to a second air inlet (402) provided on the upper surface of the base (1), wherein the second air inlet (402) is located in a closed space formed by the base (1) and the heat insulation cover (2); an exhaust port (403), the exhaust port (403) being arranged on the upper surface of the base (1), and the exhaust port (403) being capable of connecting the closed space formed by the base (1) and the heat insulation cover (2) with the external atmosphere, so as to discharge the gas in the closed space formed by the base (1) and the heat insulation cover (2); an air temperature sensor (404) for measuring the ambient temperature in the enclosed space; An air inlet temperature sensor (405) is used to detect the temperature of air entering through the first air inlet (106).

9. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to any one of claims 1 to 8, characterized in that: The single-bus temperature sensor array positioning and calibration device based on hot spot identification can operate in a first mode, which is used to calibrate the hot spot temperature at each point on the heating array substrate under standard working conditions. The first mode includes the following steps: S1, place the standard temperature sensor array integrated circuit on the heating array substrate, connect it to the main control board through the data line, and then cover it with a heat shield; S2, set the working parameters and press the start button to start the test. The main control board controls the temperature of the liquid cooling plate and the air inside the cover according to the set values; S3, after the temperature of the liquid cooling plate and the air inside the cover stabilizes, the main control board controls the heating units on the heating array substrate one by one to perform constant power heating, thereby forming a hot spot; S4, the main control board uses the ID to read the sensor temperature at the hot spot position. When the temperature value stabilizes, read the temperature value at this time and use it as the equilibrium temperature T std (i) Assign a value to the heating unit that forms the hot spot and store the temperature value in the hot spot array standard temperature matrix T std middle; S5, after completing the hot spot temperature reading of all heating units in sequence, the complete hot spot array standard temperature matrix T is obtained. std , complete the standard working condition calibration.

10. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to any one of claims 1 to 8, characterized in that: The single-bus temperature sensor array positioning and calibration device based on hot spot identification can operate in a second mode, which is used to perform address binding and temperature correction on a temperature sensor array integrated circuit under test. The second mode includes the following steps: P1, place the DUT on the heating array substrate and connect it to the main control board via a data cable, then cover it with a heat shield; P2, set the working parameters and press the start button to start the test. The main control board controls the temperature of the liquid cooling plate 301 and the air inside the cover according to the set values; P3: After the temperature of the liquid cooling plate and the air inside the cover stabilizes, the main control board controls the heating units on the heating array substrate one by one to perform constant power heating, thereby forming a hot spot; P4: The main control board reads the temperature array formed by the temperature values ​​of all sensors on the device under test. After the temperature values ​​stabilize, it extracts the highest temperature value and reads the sensor ID number corresponding to the highest temperature value. P5, the highest temperature value is taken as the hot spot equilibrium temperature T cal (i) Assign a value to the corresponding sensor, assign the sensor ID number corresponding to the highest temperature value to the corresponding sensor, and store the highest temperature value and the sensor ID number corresponding to the highest temperature value in the hot spot balance temperature matrix T corresponding to the hot spot array. cal and ID number matrix Addr; P6, after all the heat-generating units have completed the hot spot equilibrium temperature and ID number reading, the hot spot equilibrium temperature matrix T cal Export the data of the ID matrix Addr to the external storage device to complete the address binding; P7, for the standard temperature matrix T std and hot spot equilibrium temperature matrix T cal Make a comparison and calibrate the temperature of the test piece.

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