Test carrier plate, sample carrier and test box

Abstract

The embodiment of the invention provides a test carrier plate, a sample carrier and a test box, the test carrier plate is used for unbiased high acceleration stress test of a semiconductor packaging sample, the test carrier plate is used for bearing a to-be-tested sample, the test carrier plate is vertically placed in the test box when the to-be-tested sample is tested, the test carrier plate comprises a carrier plate body and a plurality of barrier strips, and the barrier strips are arranged on the carrier plate body. The carrier plate body comprises a substrate part located in the edge area and a bearing part located in the center area, and the bearing part is provided with a plurality of through grooves to form a hollow structure; the substrate part comprises a first sub-substrate part and a second sub-substrate part; the first sub-substrate part is oppositely arranged along a first direction; the second sub-substrate part is oppositely arranged along a second direction; the two ends of the plurality of barrier strips are movably arranged on the first sub-substrate part, so that a to-be-tested sample is fixed on the bearing part by two adjacent barrier strips at a preset interval; the test carrier plate can avoid the influence of condensate water generated by a high-temperature and high-humidity test on a sample in the test process, is suitable for samples of various sizes, and saves the cost of a test process and a test tool.

Description

Technical Field

[0001] The disclosed embodiments belong to the technical field of semiconductor packaging product testing, and specifically relate to a test carrier, a sample carrier, and a test box. Background Art

[0002] The unbiased highly accelerated stress test applies high temperature, high humidity and higher than normal atmospheric pressure to semiconductor packaged products. The principle of the test is to test the changes in the internal structure of semiconductor packaged products under conditions of high temperature and accelerated moisture intrusion, as well as the corrosion resistance and ion migration resistance of the materials, so as to accelerate the discovery and location of possible defects in the design and process of the product, shorten the test cycle, and continuously improve the design or process through defect failure analysis, thereby reducing the probability of design and process-related failures when the product is used on-site by the end customer, thereby improving product quality.

[0003] Existing semiconductor packaging products have the following technical problems when conducting unbiased high-acceleration stress tests:

[0004] 1) Sample loading method: There are two common methods for loading samples in laboratories. One is to load the sample into a stainless steel basket that comes with the equipment. The disadvantage is that an electrochemical reaction will occur when a product with a metal heat sink cover (the metal heat sink cover is made of copper-plated nickel) comes into contact with stainless steel, causing an oxide film or corrosion product film to form on the surface of the material, resulting in a poor appearance of the product and interference with the reliability results of the product (is it a quality problem caused by the material itself being intolerant to the temperature and humidity test environment, or is it an oxide produced by the contact between the loading fixture and the product).

[0005] Another sample loading method is to place the product on an MPPO tray dedicated to packaged products. The disadvantages of this sample loading method are: products of different sizes need to be loaded onto trays of corresponding sizes during testing, and the test tools cannot be standardized, increasing the cost of the test tools; the MPPO material will experience stress cracking and decomposition in a high temperature and high humidity test environment for a long time, contaminating the product and the test chamber cavity; when the sample is placed flat, condensed water mist during the test will accumulate on the product surface, accelerating the oxidation of the product and affecting the reliability of the product.

[0006] 2) Limitations of standard test chamber: After the conditions and time set by the program are completed, the standard test chamber will naturally cool down and reduce pressure to the required conditions, and the test will end. This process is prone to condensation. The steam in the cavity condenses to form water droplets that drip onto the sample. If the sample cannot be taken out immediately after the test, the longer the sample coexists with the condensed water in the test chamber, the greater the possibility of sample failure.

[0007] In view of the above problems, it is necessary to propose a test carrier, a sample carrier and a test box that are reasonably designed and can effectively solve the above problems. Summary of the invention

[0008] The embodiments of the present disclosure aim to solve at least one of the technical problems existing in the prior art and provide a test carrier, a sample carrier and a test box.

[0009] An aspect of an embodiment of the present disclosure provides a test carrier for a non-biased high-acceleration stress test of a semiconductor package sample, wherein the test carrier is used to carry the sample to be tested, and when the sample to be tested is tested, the test carrier is vertically placed in a test box, and the test carrier comprises:

[0010] The carrier body comprises a base plate portion located in its edge area and a bearing portion located in its central area, wherein the bearing portion is provided with a plurality of through grooves to form a hollow structure; wherein,

[0011] The substrate portion includes a first sub-substrate portion arranged opposite to each other along a first direction and a second sub-substrate portion arranged opposite to each other along a second direction;

[0012] A plurality of baffles, both ends of which are movably disposed on the first sub-base plate portion, so that two adjacent baffles fix the sample to be tested on the bearing portion at a preset interval.

[0013] Optionally, the first sub-base plate portion is provided with a drainage groove and a first drainage port;

[0014] The drainage groove is arranged along the length direction of the first sub-base plate portion, and the drainage groove is inclined from the first end thereof to the second end thereof; wherein,

[0015] When the sample to be tested is tested, the drainage groove is located at the bottom of the test carrier;

[0016] The first drain port is arranged to penetrate the first sub-base plate portion in a width direction, and the first drain port is communicated with the second end of the drain groove.

[0017] Optionally, the carrier body is an epoxy glass fiber board, and the epoxy glass fiber board includes a first substrate layer, a second substrate layer, and a plurality of transverse glass fiber layers, a plurality of resin cured layers, and a plurality of longitudinal glass fiber layers sandwiched between the first substrate layer and the second substrate layer;

[0018] The transverse glass fiber layer, the resin cured layer and the longitudinal glass fiber layer are stacked and arranged multiple times in an interlaced manner, so that the fiber content of the epoxy glass fiber board ranges from 40% to 60%. Optionally, the baffle is provided with fixing grooves on both sides of the second sub-base plate, and the sample to be tested is inserted into the corresponding fixing grooves of two adjacent baffles.

[0019] Optionally, the first sub-base plate portion is provided with a slide groove along its length direction, and the blocking bar is slidably arranged in the slide groove.

[0020] Optionally, a fastener is further included, a first through hole is provided on the groove wall of the slide groove, and second through holes are provided at both ends of the blocking bar;

[0021] The fastener passes through the first through hole and the second through hole in sequence to fix the blocking bar at a preset position.

[0022] Optionally, one of the second sub-substrate parts is provided with a positioning mark.

[0023] Another aspect of the disclosed embodiment provides a sample carrier for use in an unbiased highly accelerated stress test of a semiconductor package sample, the sample carrier comprising a test bracket and a plurality of test carrier plates;

[0024] The test bracket is provided with a plurality of slots, and the plurality of test carriers are vertically inserted into the corresponding slots, so that when the sample to be tested is tested, the plurality of test carriers are vertically placed in the test box; wherein,

[0025] The test carrier adopts the test carrier described above.

[0026] Optionally, when the test carrier is provided with a first drain outlet, the test bracket is provided with a second drain outlet, and the position of the second drain outlet corresponds to the position of the first drain outlet and the two drain outlets are connected to each other.

[0027] Another aspect of the embodiment of the present disclosure provides a test box for a non-biased high-acceleration stress test of a semiconductor package sample, the test box comprising a box body, a rotating base arranged on the box body, a sample carrier, and a condensing fan; wherein the sample carrier adopts the sample carrier described above; wherein,

[0028] The test bracket in the sample carrier is fixed to a rotating base so that the plurality of test carriers are arranged vertically and the second drain port of the test bracket is located at the bottom of the test bracket;

[0029] The condensation fan is used to automatically start when the pressure in the box is zero and provide circulating air to the surface of the sample to be tested, so as to remove condensed water on the surface of the sample to be tested.

[0030] The test carrier, sample carrier and test box of the disclosed embodiments are used for unbiased high-acceleration stress testing of semiconductor packaging samples. The test carrier is used to carry the samples to be tested, and when the samples to be tested are tested, the test carrier is placed vertically in the test box, so that condensation water is not easy to accumulate on the surface of the samples to be tested during the test and it is easier to remove the condensation water on its surface, thereby avoiding the impact of condensation water generated by high temperature and high humidity testing on the product during the test; the bearing part located in the central area of ​​the carrier body is a hollow structure, which is conducive to uniform heating of the temperature and humidity of the samples to be tested placed on the bearing part, thereby increasing the reliability of the sample testing; the two ends of the multiple baffles are movably arranged on the first sub-base plate part, and the distance between two adjacent baffles can be adjusted to a preset spacing according to the size of the samples to be tested, and the samples to be tested can be fixed by the baffles. By adjusting the distance between the baffles, the test carrier can test samples of different sizes without frequent replacement of test tools, thereby saving test procedures and test tool costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic diagram of the structure of a test carrier board according to an embodiment of the present disclosure;

[0032] Figure 2 It is a schematic structural diagram of another embodiment of the present disclosure after the test carrier and the sample to be tested are assembled;

[0033] Figure 3 is a cross-sectional view of a baffle and a second sub-base plate portion of another embodiment of the present disclosure;

[0034] Figure 4 is a cross-sectional view of a drainage groove according to another embodiment of the present disclosure;

[0035] Figure 5 It is a schematic structural diagram of an epoxy glass fiber board according to another embodiment of the present disclosure;

[0036] Figure 6 It is a front view and a left view of a sample carrier of another embodiment of the disclosed embodiment;

[0037] Figure 7 It is a front view and a left view of a test stand of another embodiment of the disclosed embodiment;

[0038] Figure 8 It is a structural schematic diagram of a test box before testing according to another embodiment of the present disclosure;

[0039] Fig. 9 It is a schematic diagram of the structure of the test box when conducting a test in another embodiment of the present disclosure. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, the embodiments of the present disclosure are further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0041] like Figure 1 and Figure 2 As shown, one aspect of an embodiment of the present disclosure provides a test carrier 100, which is used to perform a non-biased high-acceleration stress test on a semiconductor package sample. The test carrier 100 is used to carry a sample A to be tested, and when the sample A to be tested is tested, the test carrier 100 is vertically placed in a test box.

[0042] like Figure 1 As shown, the test carrier 100 includes a carrier body 110 and a plurality of baffles 120. The carrier body 110 includes a substrate portion 111 located at its edge area and a bearing portion 112 located at its central area, and the bearing portion 112 is used to bear the sample to be tested. The bearing portion 112 is provided with a plurality of through grooves to form a hollow structure. The hollow structure of the bearing portion 112 can make the temperature and humidity of the sample to be tested uniformly heated, thereby increasing the reliability of the sample test.

[0043] like Figure 2 As shown, the substrate portion 111 includes a first sub-substrate portion 111a disposed oppositely along a first direction and a second sub-substrate portion 111b disposed oppositely along a second direction. In this embodiment, the two first sub-substrate portions 111a are disposed oppositely along the width direction of the carrier body 110, and the two second sub-substrate portions 111b are distributed oppositely along the length direction of the carrier body 110. Specifically, in this embodiment, the carrier body 110 is rectangular, the first sub-substrate portion 111a is the two long sides of the rectangle, and the second sub-substrate portion 111b is the two short sides of the rectangle.

[0044] Both ends of the plurality of baffles 120 are movably disposed on the first sub-base plate portion 111a, so that a plurality of samples A to be tested are fixed to the bearing portion 112 at a preset interval between two adjacent baffles 120. Specifically, the distance between two adjacent baffles 120 can be adjusted to a preset distance according to the size of the sample to be tested, and the plurality of samples A to be tested can be fixed to the bearing portion 112 through the adjacent baffles 120 to perform a non-biased high acceleration stress test.

[0045] The test carrier of the disclosed embodiment is used for unbiased high-acceleration stress testing of semiconductor packaging samples. The test carrier is used to carry the samples to be tested, and when the samples to be tested are tested, the test carrier is placed vertically in a test box. In this way, condensation water is not easy to accumulate on the surface of the samples to be tested during the test and it is easier to remove the condensation water on its surface, thereby avoiding the impact of condensation water generated by high temperature and high humidity tests on the products during the test. The bearing portion located in the central area of ​​the carrier body is a hollow structure, which is conducive to uniform heating of the temperature and humidity of the samples to be tested placed on the bearing portion, thereby increasing the reliability of the sample test. By adjusting the distance between the baffles, the test carrier can test samples of different sizes without frequent replacement of test tools, thereby saving test procedures and test tool costs.

[0046] For example, Figure 1 and Figure 4 As shown, the first sub-substrate portion 111 a is provided with a drainage groove 130 and a first drainage port 140 .

[0047] The drainage groove 130 is arranged along the length direction of the first sub-base plate portion 111a, and the drainage groove 130 is inclined from its first end to its second end. When the sample to be tested is tested, the drainage groove 130 is located at the bottom of the test carrier 100 to collect condensed water on the surface of the sample to be tested.

[0048] The first drain port 140 is disposed throughout the width direction of the first sub-substrate portion 111 a , and the first drain port 140 is communicated with the second end of the drain groove 130 .

[0049] It should be noted that if Figure 4 As shown, in the present embodiment, the longitudinal section of the drainage groove 130 is in a "V" shape, or in a "U" shape. There is no specific limitation on the shape of the drainage groove 130, and it can be selected according to actual needs.

[0050] It should be further explained that, in this embodiment, the two first sub-base plate portions 111 a are both provided with a drainage groove 130 and a first drainage port 140 .

[0051] Specifically, when testing the samples to be tested, the test carrier 100 is vertically arranged in the test box, and the condensed water on the surface of each sample to be tested can flow into the drainage groove 130 to be collected, and the condensed water in the drainage groove 130 flows from the first end of the drainage groove 130 to its second end and is discharged through the first drainage port 140.

[0052] In this embodiment, by providing a drainage groove and a first drainage port on the first sub-base plate, condensed water on the surface of the sample to be tested on the vertically placed test carrier can be collected and discharged in time during the test, thereby improving the reliability of the sample test.

[0053] For example, in this embodiment, Figure 5 As shown, the carrier body 110 is an epoxy glass fiber board, which includes a first substrate layer 113, a second substrate layer 114, and a plurality of transverse glass fiber layers 115, a plurality of resin curing layers 116, and a plurality of longitudinal glass fiber layers 117 sandwiched between the first substrate layer 113 and the second substrate layer 114. The transverse glass fiber layers 115, the resin curing layers 116, and the longitudinal glass fiber layers 117 are stacked and arranged in an interlaced manner for many times, so that the fiber content in the epoxy glass fiber board ranges from 40% to 60%. In this embodiment, the fiber content in the epoxy glass fiber board is preferably 50%. Among them, the material of the first substrate layer 113 and the second substrate layer 114 can be epoxy resin adhesive.

[0054] Specifically, in order to enhance the mechanical properties of the epoxy glass fiber board, high-temperature reinforced epoxy resin and glass fiber with a higher glass transition temperature are required; the transverse glass fiber layer 115 / resin curing layer 116 / longitudinal glass fiber layer 117 are laid alternately for many times, the fiber is bonded to the resin curing agent matrix interface, and the deformation of the fiber and the matrix is ​​mutually restricted, so that the mechanical properties and warping of the board are well enhanced; special manufacturing processes such as increasing pressure and temperature and using longer curing time are used to improve the curing degree of the epoxy resin and the bonding strength of the glass cloth; the thickness and number of layers of the carrier body 110 are controlled, that is, the fiber content is controlled to 50%. If the content is too high, some fibers cannot be fully infiltrated by the resin to form a weak interface, resulting in decreased interface performance; if the content is too low, the mechanical strength and the temperature, humidity and corrosion resistance are decreased.

[0055] In this embodiment, the carrier body is made of epoxy fiberglass board, and the sample to be tested will not undergo electrochemical reaction with the carrier body, will not cause oxide film products to be generated on the surface of the material, will not cause poor product appearance, and increase the reliability of sample testing; the carrier body is made of epoxy fiberglass board, and will not have stress cracking and decomposition under high temperature and high humidity test environment, will not contaminate the product and the test box cavity, and increase the reliability of sample testing.

[0056] For example, Figure 3 As shown, fixing grooves 121 are provided on both sides of the blocking bar 120 facing the second sub-base plate portion 111b, and the sample A to be tested is inserted into the corresponding fixing grooves 121 of two adjacent blocking bars 120. In addition, a fixing groove is also provided on one side of the second sub-base plate portion 111b facing the blocking bar 120, and one end of the sample A to be tested located at the edge of the bearing portion 112 is inserted into the fixing groove of the second sub-base plate portion 111b, and the other end of the sample A to be tested is inserted into the fixing groove 121 of the outermost blocking bar 120 close to the second sub-base plate portion 111b.

[0057] In this embodiment, by providing fixing grooves on both sides of the blocking bar facing the second sub-base plate portion, the sample to be tested can be fixed.

[0058] Exemplarily, the first sub-base plate portion 111a is provided with a slide groove along its length direction, and a stop bar 120 is slidably provided in the slide groove. The stop bar 120 slides in the slide groove to adjust the distance between two adjacent stop bars 120 and the distance between the stop bar 120 and the second sub-base plate portion 111b.

[0059] For example, Figure 1 and Figure 2 As shown, the test carrier 100 further includes a fastener 150, a first through hole is provided on the slot wall of the slide slot, and second through holes are provided at both ends of the blocking bar 120. The fastener 150 passes through the first through hole and the second through hole in sequence to fix the blocking bar 120 at a preset position.

[0060] Specifically, after adjusting the distance between the blocking bars 120 to a preset distance, the two ends of the blocking bars 120 are fixed to the first sub-base plate portion 111a by fasteners 150, so as to fix the sample A to be tested to the bearing portion 112. It should be noted that the fasteners 150 may be screws, and the corresponding first through holes and second through holes are threaded holes. The type of the fasteners 150 is not specifically limited and can be selected according to actual needs.

[0061] Exemplarily, one of the second sub-base plate portions 111 b is provided with a positioning mark 160 . The positioning mark 160 can be used to position the test carrier 100 when it is inserted into the test bracket 210 .

[0062] like Figure 6 As shown, another aspect of the embodiment of the present disclosure provides a sample carrier 200 for a non-biased highly accelerated stress test of a semiconductor package sample. The sample carrier 200 includes a test bracket 210 and a plurality of test carriers 100 .

[0063] like Figure 6 and Figure 7 As shown, the test bracket 210 is provided with a plurality of slots 211, and a plurality of test carriers 100 are vertically inserted into the corresponding slots 211, so that when the test sample A is tested, the plurality of test carriers 100 are vertically placed in the test box 310. The test carrier 100 adopts the test carrier 100 mentioned above, and the specific structural features of the test carrier 100 have been described in detail above, which will not be repeated here.

[0064] The sample carrier of the disclosed embodiment and the test bracket can be arranged according to the inner cavity size of the test box, and a plurality of test carriers are vertically inserted into the card slots of the corresponding test brackets. Condensation water is not easy to accumulate on the surface of the sample to be tested and it is easier to remove the condensation water on its surface, thereby avoiding the influence of condensation water generated by high temperature and high humidity tests on the product during the test and improving the reliability of the sample test.

[0065] For example, Figure 6 and Figure 7 As shown, when the test carrier 100 is provided with the first drain port 140 , the test bracket 210 is provided with the second drain port 212 , and the position of the second drain port 212 corresponds to the position of the first drain port 140 and is connected to each other.

[0066] Specifically, when testing the sample to be tested, the second drain port 212 of the test bracket 210 is located at the bottom of the test bracket 210, and the water collected in the drainage groove 130 is discharged through the first drain port 140 and the second drain port 212 in sequence to prevent the accumulation of condensed water on the surface of the sample to be tested and cause sample failure.

[0067] like Figure 8 and Fig. 9 As shown, another aspect of the embodiment of the present disclosure provides a test box 300 for non-biased high accelerated stress testing of semiconductor package samples, the test box 300 comprises a box body 310 and a rotating base 320 disposed on the box body 310, a sample carrier 200 and a condensing fan 330. The sample carrier 200 adopts the sample carrier 200 described above, and the specific structure of the sample carrier 200 has been described in detail above, which will not be repeated here.

[0068] The test rack 210 in the sample carrier 200 is fixed to the rotating base 320 , so that the plurality of test carriers 100 are vertically arranged and the second drain port 212 of the test rack 210 is located at the bottom of the test rack 210 .

[0069] Specifically, the bottom of the test bracket 210 in the sample carrier 200 is fixed to the rotating base 320 so that the multiple test carriers 100 are arranged vertically, and the first drain port 140 and the second drain port 212 are located at the bottom of the test bracket 210 to facilitate the discharge of condensed water.

[0070] The condensation fan 330 is used to automatically start when the pressure in the box 310 is zero and provide circulating air to the surface A of the sample to be tested, so as to remove condensed water on the surface of the sample A to be tested.

[0071] Specifically, Figures 1 to 9 As shown, the working process of the test box 300 can be as follows:

[0072] 1) Before the test, the samples A to be tested are loaded onto the test carrier 100 , and the first row of samples A to be tested are placed on the carrier portion 112 starting from the second sub-base plate portion 111 b , wherein one side edge of the samples A to be tested is inserted into the fixing groove of the second sub-base plate portion 111 b .

[0073] 2) Move the stop bar 120 to the position of the sample A to be tested, and insert the edge of the other side of the sample A to be tested into the fixing groove 121 of the stop bar 120 .

[0074] 3) The two ends of the blocking bar 120 are fixed at the preset positions by the fasteners 150, thereby fixing the first row of samples A to be tested.

[0075] 4) If Figure 1 and Figure 2 As shown, according to the size of the sample A to be tested, the distance between the two blocking bars 120 is adjusted, and the sample A to be tested is sequentially installed on the bearing portion 112 in the same manner as above until the loading of the sample to be tested is completed.

[0076] 5) If Figure 7 As shown, the length and width of the test bracket 210 are determined according to the inner box size of the test box 300 , and the test bracket 210 is provided with a slot 211 for fixing the test carrier 100 .

[0077] 6) Fix the rotating base 320 on the tray 340 of the test box 300 , and fix the bottom of the test rack 210 on the rotating base 320 , so that the second drain port 212 of the test rack 210 is located at the bottom of the test rack 210 .

[0078] 7) If Figure 8 As shown, the test carrier 100 is inserted into the slot 211 of the test bracket 210 from the side of the door of the test box 300 in a direction perpendicular to the test box 300, and pushed to the end of the test bracket 210. Note that the positioning mark 160 faces inward to facilitate the correspondence between the first drain port 140 of the test carrier 100 and the second drain port 212 of the test bracket 210.

[0079] 8) If Fig. 9 As shown, after all the test brackets 210 are installed, the rotating base 320 rotates the test bracket 210 by 90 degrees, and the test carrier 100 and the test box 300 are placed horizontally, and then the test box door is pushed in to close the test box.

[0080] Note: The highly accelerated stress test chamber is designed with sliding doors. The test carrier 100 cannot be placed directly in the horizontal test chamber when loaded, and needs to be turned with the help of a rotating base 320. The purpose of placing the test carrier 100 in the horizontal test chamber is to allow the condensation fan designed at the rear end of the test chamber to blow air in a horizontal direction after the subsequent test, so that all the test carriers 100 are evenly blown by the wind to quickly disperse the condensed moisture on the surface of the sample A to be tested.

[0081] 9) Set the equipment program according to the test conditions, close the test box 300, and start the test according to the program.

[0082] 10) After the time specified in the test procedure ends, the controller of the test box 300 monitors that the automatic pressure relief of the test box 300 is completed. When the controller of the test box 300 detects that the pressure gauge pressure is 0, the installed condensing fan 330 is automatically started. The wind speed of the condensing fan 330 is 3.4m / s to 5.4m / s until the temperature of the test box 300 reaches 25 degrees and the humidity reaches 35%RH, that is, the condensing fan 330 stops.

[0083] 11) Open the box door, rotate the base 320 to rotate the test carrier 100 90 degrees to a vertical position, and pull out each test carrier 100.

[0084] 12) Place the test carrier plate flat on the operating table, loosen the fasteners 150 at both ends of the stop bar 120, remove the stop bar 120, and take out the samples A to be tested in turn, and the test is finished.

[0085] The test chamber of the disclosed embodiment, when conducting an unbiased high-acceleration stress test on semiconductor package samples, solves the impact of condensed water generated by high-temperature and high-humidity tests on the package products during high-acceleration stress reliability tests by changing the carrier material of the packaged products, the loading method of the packaged products, and the air circulation design after the test chamber is cooled and depressurized, and changes the problem of abnormal oxidation appearance of the samples due to deviations in the carrier or device method of the sample to be tested, and eliminates the reasons of poor test resistance of the raw materials or improper sample loading methods; accurately locates the failure mode of the test sample, facilitates subsequent design and process improvements, and thus improves the reliability of the semiconductor package samples.

[0086] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the embodiments of the present disclosure, but the embodiments of the present disclosure are not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of the present disclosure, and these modifications and improvements are also considered to be within the protection scope of the embodiments of the present disclosure.

Claims

1. A test carrier for use in a non-biased highly accelerated stress test of a semiconductor package sample, characterized in that: The test carrier is used to carry the sample to be tested, and when the sample to be tested is tested, the test carrier is vertically placed in the test box, and the test carrier includes: The carrier body comprises a base plate portion located in its edge area and a bearing portion located in its central area, wherein the bearing portion is provided with a plurality of through grooves to form a hollow structure; wherein, The substrate portion includes a first sub-substrate portion arranged opposite to each other along a first direction and a second sub-substrate portion arranged opposite to each other along a second direction; A plurality of baffles, both ends of which are movably disposed on the first sub-base plate portion, so that two adjacent baffles fix the sample to be tested on the bearing portion at a preset interval.

2. The test carrier according to claim 1, characterized in that: The first sub-base plate portion is provided with a drainage groove and a first drainage port; The drainage groove is arranged along the length direction of the first sub-base plate portion, and the drainage groove is inclined from the first end thereof to the second end thereof; wherein, When the sample to be tested is tested, the drainage groove is located at the bottom of the test carrier; The first drain port is arranged to penetrate the first sub-base plate portion in a width direction, and the first drain port is communicated with the second end of the drain groove.

3. The test carrier according to claim 1, characterized in that: The carrier body is an epoxy glass fiber board, and the epoxy glass fiber board includes a first substrate layer, a second substrate layer, and a plurality of transverse glass fiber layers, a plurality of resin cured layers, and a plurality of longitudinal glass fiber layers sandwiched between the first substrate layer and the second substrate layer; The transverse glass fiber layers, the resin solidification layers and the longitudinal glass fiber layers are stacked and arranged alternately for multiple times, so that the fiber content in the epoxy glass fiber board is in the range of 40% to 60%.

4. The test carrier according to any one of claims 1 to 3, characterized in that: The blocking bar is provided with fixing grooves on both sides facing the second sub-base plate portion, and the sample to be tested is inserted into the corresponding fixing grooves of two adjacent blocking bars.

5. The test carrier according to any one of claims 1 to 3, characterized in that: The first sub-base plate portion is provided with a slide groove along its length direction, and the blocking bar is slidably arranged in the slide groove.

6. The test carrier according to claim 5, characterized in that: It also includes a fastener, the groove wall of the slide groove is provided with a first through hole, and the two ends of the blocking bar are provided with second through holes; The fastener passes through the first through hole and the second through hole in sequence to fix the blocking bar at a preset position.

7. The test carrier according to any one of claims 1 to 3, characterized in that: One of the second sub-substrate parts is provided with a positioning mark.

8. A sample carrier for use in a non-biased highly accelerated stress test of a semiconductor package sample, characterized in that: The sample carrier includes a test bracket and a plurality of test carrier plates; The test bracket is provided with a plurality of slots, and the plurality of test carriers are vertically inserted into the corresponding slots, so that when the sample to be tested is tested, the plurality of test carriers are vertically placed in the test box; wherein, The test carrier is the test carrier according to any one of claims 1 to 7.

9. The sample carrier according to claim 8, characterized in that: When the test carrier is provided with a first drain port, the test bracket is provided with a second drain port, and the position of the second drain port corresponds to the position of the first drain port and the two drain ports are connected to each other.

10. A test chamber for unbiased highly accelerated stress testing of semiconductor packaging samples, characterized in that: The test box comprises a box body and a rotating base, a sample carrier and a condensing fan arranged on the box body; wherein the sample carrier is the sample carrier according to claim 8 or claim 9; wherein, The test bracket in the sample carrier is fixed to a rotating base so that the plurality of test carriers are arranged vertically and the second drain port of the test bracket is located at the bottom of the test bracket; The condensation fan is used to automatically start when the pressure in the box is zero and provide circulating air to the surface of the sample to be tested, so as to remove condensed water on the surface of the sample to be tested.

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