Degumming equipment for semiconductor wafer

Abstract

The invention relates to the field of wafer degumming, and discloses a degumming device for semiconductor wafers, the degumming device comprises a degumming frame and a cover plate, a heating medium and a temperature sensor are arranged in the degumming frame, the top end of the degumming frame is hinged with the cover plate through a hinge, a handle is mounted on the cover plate, and the handle is connected with the degumming frame. A rotary degumming structure is arranged in the degumming frame, wafers are placed on all the placing plates in the degumming frame, the wafers can be directly rotated, degumming work can be conducted on the multiple wafers at the same time through rotation that the side faces of the wafers are tightly attached to the degumming sheets, the structure is simpler, the manufacturing cost is low, and the degumming efficiency is improved. The work of placing or taking out the wafer in the degumming frame is also facilitated; and meanwhile, under the action of the first extrusion structure, when the wafer rotates, the first clamping structure can be automatically driven to clamp and fix the wafer in the placing plate, so that degumming is smoother.

Description

Technical Field

[0001] The invention relates to the technical field of wafer debonding, and in particular to a debonding device for semiconductor wafers. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. When the wafer is debonded from the material holder, a debonding device is required;

[0003] In the prior art, semiconductor wafer debonding equipment uses an integrated automatic debonding structure to debond and separate large-size wafers from material holders, thereby ensuring high-quality preparation of large-size wafers.

[0004] The degumming equipment in the prior art requires a corresponding number of clamps for each wafer when degumming each wafer, which increases the manufacturing cost of the equipment. In addition, the clamps are arranged above the wafers, and it is inconvenient to operate when taking out or putting in the wafers. Therefore, there is room for improvement. Summary of the invention

[0005] In order to solve the problems raised in the above background technology, the present invention provides a debonding device for semiconductor wafers.

[0006] The present invention provides a debonding device for semiconductor wafers using the following technical solution:

[0007] A debonding device for semiconductor wafers, comprising a debonding frame and a cover plate, wherein a heating medium and a temperature sensor are arranged in the debonding frame, the top of the debonding frame is hingedly connected to the cover plate through a hinge, a handle is installed on the cover plate, and a rotating debonding structure is arranged in the debonding frame;

[0008] The rotatable degumming structure comprises a plurality of fixed seats fixedly mounted on the left inner wall of the degumming frame, and the plurality of fixed seats are connected by a first connecting strip, and the plurality of fixed seats are connected by a first connecting strip, and the plurality of fixed seats are connected by a first connecting strip, and the plurality of fixed seats are connected by a first connecting strip, and the plurality of fixed seats are connected by a first connecting strip, and the plurality of fixed seats are connected by a first connecting strip, and the plurality of fixed seats are connected by a first connecting strip, and the plurality of fixed seats are connected by a first connecting strip, and the plurality of fixed seats are connected by a first connecting strip, and the plurality of rotating seats are connected by a

[0009] A degumming sheet is connected to the inner walls on both sides of the degumming frame near the upper right side, a second clamping structure is provided on the right inner wall of the degumming frame at the position corresponding to each fixing seat, and a collecting frame is installed on the lower inner wall of the degumming frame below the degumming sheet.

[0010] Preferably, the first clamping structure includes through holes opened on the front and rear side surfaces of the placing plate, and the front and rear side surfaces of the placing plate are connected with U-shaped bars at the positions of the through holes, and a first extrusion rod is movably passed through the middle of the U-shaped bar, and a clamp is connected to the end of the first extrusion rod inserted into the through hole, a fixed sleeve on the first extrusion rod is provided with a fixing sleeve, a first spring is connected between the fixing sleeve and the U-shaped bar, and a first extrusion structure is arranged between the first extrusion rod and the fixing seat.

[0011] Preferably, the first extrusion structure includes first extrusion strips arranged at the front and rear sides of each fixing seat, one end of the first extrusion strip away from the first extrusion rod is connected to the fixing seat, and the end of the first extrusion strip close to the first extrusion rod is provided with a first extrusion portion with an inclined surface, and a squeezing ball is connected to the bottom end of the first extrusion rod, and each of the first extrusion rods passes between the two second connecting strips of each group.

[0012] Preferably, the second clamping structure includes a guide rail installed on the right inner wall of the degumming frame at the position of each fixed seat, the guide rail is slidably provided with a second movable seat, and an arc-shaped second spring is connected between the second movable seat and the inner wall of the lower end of the guide rail, and a groove is opened on the side surface of the second movable seat away from the guide rail, and a fixing rod is connected between the groove walls at both ends of the groove, and a moving block is movably sleeved at both ends of the fixing rod, and the side surface of the moving block is tightly attached to the inner wall of the groove, and a third spring is sleeved in the middle of the fixing rod, and the two ends of the third spring in a compressed state are respectively connected to the two moving blocks, and a second extrusion structure is provided between the two moving blocks and the right inner wall of the degumming frame, a clamping block is provided on the two moving blocks, and a pulling structure is provided between the second moving seat and the first moving seat.

[0013] Preferably, the second extrusion structure includes a second extrusion rod connected to a side surface of each group of two moving blocks away from each other, the right inner wall of the degumming frame is connected to a second extrusion strip at the front and rear sides of each guide rail, and a second extrusion portion with an arc-shaped surface is provided at the upper end of the second extrusion strip close to one side of the guide rail, one end of the second extrusion rod is inserted into a position corresponding to the second extrusion strip and the guide rail, and a driving structure is provided between the clamping block and the second extrusion strip.

[0014] Preferably, the driving structure includes an insertion block connected to a side of the clamping block close to the moving block, a first slot for movably inserting the insertion block is provided on the end face of the moving block, an insertion rod is connected to a side face of each group of two moving blocks away from each other, a first arc groove is provided at the upper end of a side face away from each other of two second extrusion strips in each group, a connecting groove connected to the bottom end of the first arc groove is provided on the second extrusion strip, a second arc groove connected to the bottom end of the connecting groove is provided on the second extrusion strip, the groove wall of the second arc groove is 1.1 times the groove diameter of the first arc groove, and one end of the insertion rod movably passes through the first arc groove.

[0015] Preferably, the pulling structure includes a first arc-shaped bar connected to the second movable seat near the bottom end, a first pull bar is connected to the bottom end of the first arc-shaped bar, a second arc-shaped bar passing through the guide rail groove is connected to the right end of the first movable seat, and one end of the second arc-shaped bar is connected to a second pull bar extending above the first pull bar.

[0016] Preferably, a second slot for the collection frame to movably pass through is opened at the lower right side of the front side of the degumming frame, and a plug plate is connected to the front end of the collection frame. The plug plate is movably inserted into the second slot, and a magnetic strip is fixedly embedded on the inner side surface of the plug plate. The magnetic strip is adsorbed on the iron bar on the inner groove of the second slot, and a pull ring is installed in the middle of the front side of the plug plate.

[0017] In summary, the present invention includes the following beneficial technical effects:

[0018] 1. The present invention provides a rotating degumming structure, a degumming sheet, a first clamping structure and a first extrusion structure on the degumming frame, and places the wafer on each placement plate in the degumming frame, and can directly rotate the wafer. By using the side of the wafer to cling to the rotation of the degumming sheet, multiple wafers can be degummed at the same time, and the structure is simpler, the manufacturing cost is low, and it is convenient to place or remove the wafer in the degumming frame; at the same time, under the action of the first extrusion structure, when the wafer rotates, it can automatically drive the first clamping structure to clamp and fix the wafer in the placement plate, so that the degumming is smoother;

[0019] 2. The present invention provides a second clamping structure, a second extrusion structure, a driving structure and a pulling structure in the degumming frame, so that the wafer can be clamped to the degumming material seat on the side of the wafer by the second clamping structure while rotating, and after clamping, the second clamping structure can pull the material seat toward the square away from the center of the wafer, thereby better performing the degumming work and making the degumming smoother. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of a debonding device for semiconductor wafers in an embodiment of the present invention;

[0021] Figure 2 is a schematic diagram of the structure after the cover plate is disassembled in an embodiment of the present invention;

[0022] Figure 3 It is a schematic diagram of the structure inside the degumming frame in an embodiment of the present invention;

[0023] Figure 4 is a schematic diagram of the structure after the cover plate and the debonding frame are disassembled in an embodiment of the present invention;

[0024] Figure 5 is a schematic structural diagram of a fixing seat in an embodiment of the present invention;

[0025] Figure 6 In the embodiment of the present invention Figure 5 A magnified view of the structure at A;

[0026] Figure 7 is a structural schematic diagram of the second clamping structure in an embodiment of the present invention;

[0027] Figure 8 It is a schematic diagram of the structure of the collection frame in an embodiment of the present invention.

[0028] Description of reference numerals: 1. degumming frame; 2. cover plate; 3. handle; 5. fixed seat; 6. first connecting strip; 7. guide rail groove; 8. first moving seat; 9. placement plate; 10. placement groove; 11. second connecting strip; 12. third connecting strip; 13. rotating rod; 14. turntable; 15. motor; 16. degumming sheet; 17. U-shaped strip; 18. first extrusion rod; 19. clip; 20. through hole; 21. extrusion ball; 22. first extrusion strip; 23. first extrusion part; 24. guide rail; 25. The second movable seat; 26, groove; 27, fixed rod; 28, movable block; 29, clamping block; 30, second extrusion rod; 31, plug block; 32, first slot; 33, plug rod; 34, first arc groove; 35, second arc groove; 36, connecting groove; 37, second extrusion part; 38, second extrusion strip; 39, first arc strip; 40, first pull strip; 41, second arc strip; 42, second pull strip; 43, collection frame; 44, plug board; 45, pull ring; 46, magnetic strip; 47, second slot. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-Figure 8 The present invention is described in further detail.

[0030] The embodiment of the present invention discloses a debonding device for semiconductor wafers, comprising a debonding frame 1 and a cover plate 2, wherein a heating medium and a temperature sensor are arranged in the debonding frame 1, the top of the debonding frame 1 is hingedly connected to the cover plate 2 through a hinge, a handle 3 is installed on the cover plate 2, and a rotating debonding structure is arranged in the debonding frame 1;

[0031] The rotating degumming structure includes a plurality of fixed seats 5 fixedly mounted on the left inner wall of the degumming frame 1, and the plurality of fixed seats 5 are connected by a first connecting strip 6. A guide rail groove 7 is provided on the arc surface of the fixed seat 5 away from the left inner wall of the degumming frame 1, and a first movable seat 8 is slidably provided in the guide rail groove 7. A placement plate 9 is installed in the middle of the upper part of the first movable seat 8, and a placement groove 10 is provided in the placement plate 9. The front and rear side surfaces of the placement plate 9 are both provided with a first clamping structure, and the front and rear side surfaces of each first movable seat 8 are connected with a first clamping structure. Two connecting bars 11, a plurality of first movable seats 8 are connected by the second connecting bars 11, and the ends of the second connecting bars 11 at both ends away from the first movable seats 8 are respectively connected with third connecting bars 12, and the top ends of each group of two third connecting bars 12 are connected with a turntable 14, and a rotating rod 13 is fixedly connected to the front turntable 14, and one end of the rotating rod 13 is rotatably connected to the front inner wall of the degumming frame 1, and a motor 15 is installed on the rear side of the degumming frame 1, and one end of the output shaft of the motor 15 is connected to another turntable 14;

[0032] A degumming sheet 16 is connected to the inner walls of the front and rear sides of the degumming frame 1 near the upper right side, and a second clamping structure is provided on the right inner wall of the degumming frame 1 at the position corresponding to each fixed seat 5. A collecting frame 43 is installed on the lower inner wall of the degumming frame 1 below the degumming sheet 16. The wafer to be degummed and the material seat are placed in the placement groove 10 of the placement plate 9 as a whole, and the material seat is located directly above the placement plate 9. The cover plate 2 is closed, and the temperature in the degumming frame 1 is heated to the degumming temperature by using a heating medium through a temperature sensor. The motor 15 is started to drive the first movable seat 8 and the wafer as a whole to rotate in the guide groove 7 in a clockwise direction. The side of the wafer is rotated against the degumming sheet 16 to separate the wafer and the material seat, thereby realizing the degumming work, and the degummed material seat falls into the collecting frame 43 for collection;

[0033] A second slot 47 is provided at the lower right side of the front side of the degumming frame 1 for the collecting frame 43 to movably pass through. A plug plate 44 is connected to the front end of the collecting frame 43, and the plug plate 44 is movably inserted into the second slot 47. A magnetic strip 46 is fixedly embedded on the inner side surface of the plug plate 44. The magnetic strip 46 is adsorbed on the iron bar on the inner groove of the second slot 47. A pull ring 45 is installed in the middle of the front side of the plug plate 44. When it is necessary to clean the material seats collected in the collecting frame 43, the collecting frame 43 can be directly pulled out from the degumming frame 1, and the collected material seats can be centrally processed.

[0034] See also Figure 1-Figure 6 The first clamping structure includes through holes 20 opened on the front and rear side surfaces of the placement plate 9, and the front and rear side surfaces of the placement plate 9 are connected with U-shaped bars 17 at the positions of the through holes 20, and a first extrusion rod 18 is movably passed through the middle of the U-shaped bar 17, and a clamping piece 19 is connected to one end of the first extrusion rod 18 inserted into the through hole 20, and a fixed sleeve is fixed on the first extrusion rod 18, and a first spring is connected between the fixed sleeve and the U-shaped bar 17, and a first extrusion structure is provided between the first extrusion rod 18 and the fixed seat 5;

[0035] The first extrusion structure includes a first extrusion strip 22 arranged at the front and rear sides of each fixing seat 5, and the end of the first extrusion strip 22 away from the first extrusion rod 18 is connected to the fixing seat 5, and the end of the first extrusion strip 22 close to the first extrusion rod 18 is provided with a first extrusion portion 23 with an inclined surface, and the bottom end of the first extrusion rod 18 is connected with a squeezing ball 21, and each first extrusion rod 18 passes through between two second connecting strips 11 of each group. When the first movable seat 8 slides in the guide groove 7, the squeezing ball 21 at the bottom end of the first extrusion rod 18 is driven to slide on the first extrusion portion 23 of the first extrusion strip 22. The first extrusion strip 22 pushes the squeezing ball 21, which can automatically drive the two clamps 19 to move in a direction close to each other, and automatically clamp the wafer in the placement plate 9, so that the wafer can be debonded smoothly.

[0036] See also Figure 1 , Figure 6 and Figure 8 , the second clamping structure includes a guide rail 24 installed on the right inner wall of the degumming frame 1 at the position of each fixed seat 5, a second movable seat 25 is slidably arranged in the guide rail 24, and an arc-shaped second spring is connected between the second movable seat 25 and the inner wall of the lower end of the guide rail 24, and a groove 26 is opened on the side surface of the second movable seat 25 away from the guide rail 24, and a fixing rod 27 is connected between the groove walls at both ends of the groove 26, and a movable block 28 is movably sleeved at both ends of the fixed rod 27, and the side of the movable block 28 is tightly attached to the inner wall of the groove 26, and a third spring is sleeved in the middle of the fixed rod 27, and the two ends of the third spring in a compressed state are respectively connected to the two movable blocks 28, and a second extrusion structure is arranged between the two movable blocks 28 and the right inner wall of the degumming frame 1, and a clamping block 29 is arranged on the two movable blocks 28, and a pulling structure is arranged between the second movable seat 25 and the first movable seat 8;

[0037] The second extrusion structure includes a second extrusion rod 30 connected to a side surface of each group of two moving blocks 28 away from each other, and the right inner wall of the degumming frame 1 is connected to the second extrusion strips 38 at the front and rear sides of each guide rail 24, and the second extrusion strip 38 is provided with a second extrusion portion 37 with an arc-shaped surface at the upper end of the second extrusion strip 38 close to one side of the guide rail 24, and one end of the second extrusion rod 30 is inserted into the position corresponding to the second extrusion strip 38 and the guide rail 24, and a driving structure is provided between the clamping block 29 and the second extrusion strip 38, and the guide rail 24 is provided concentrically with the guide rail groove 7;

[0038] The driving structure includes an insert block 31 connected to a side of the clamping block 29 close to the moving block 28, a first slot 32 for the insert block 31 to be movably inserted is provided on the end surface of the moving block 28, an insert rod 33 is connected to a side surface of each group of two moving blocks 28 away from each other, a first arc groove 34 is provided at the upper end of a side surface away from each other of two second extrusion bars 38 in each group, a connecting groove 36 connected to the bottom end of the first arc groove 34 is provided on the second extrusion bar 38, a second arc groove 35 connected to the bottom end of the connecting groove 36 is provided on the second extrusion bar 38, the groove wall of the second arc groove 35 is 1.1 times the groove diameter of the first arc groove 34, and one end of the insert rod 33 movably passes through the first arc groove 34;

[0039] The pulling structure includes a first arc-shaped bar 39 connected to the second moving seat 25 near the bottom end, a first pull bar 40 is connected to the bottom end of the first arc-shaped bar 39, a second arc-shaped bar 41 passing through the guide groove 7 is connected to the right end of the first moving seat 8, and a second pull bar 42 extending to the top of the first pull bar 40 is connected to one end of the second arc-shaped bar 41. When the first moving seat 8 moves, the second arc-shaped bar 41 and the second pull bar 42 are driven to rotate as a whole. When the second pull bar 42 moves to the first pull bar 40, as the first moving seat 8 continues to rotate, it can be automatically pulled. The second movable seat 25 is moved to slide on the guide rail 24. When the second movable seat 25 moves, the second extrusion portion 37 on the second extrusion bar 38 squeezes the second extrusion rod 30, pushing the clamping block 29 on the movable block 28 to move and clamp the material seat on the wafer. After clamping, as the second movable seat 25 continues to rotate, one end of the insertion rod 33 is driven to slide from the first arc groove 34 and the connecting groove 36 to the second arc groove 35. The clamping block 29 can pull the material seat to move away from the final center of the wafer, making the debonding of the wafer smoother.

[0040] The implementation principle of a degumming device for semiconductor wafers in an embodiment of the present invention is as follows: first, multiple groups of wafers to be degummed and the material holder as a whole are placed on the placement plate 9 in the degumming frame 1 respectively, and the cover plate 2 is tightly covered on the degumming frame 1 by using the handle 3, and then the temperature in the degumming frame 1 is heated to the degumming temperature by using the heating medium through the temperature sensor, and then the motor 15 is started to drive the first movable seat 8 and the wafer as a whole to slide in the guide groove 7 of the fixed seat 5, and the side of the wafer is pressed against the degumming sheet 16, and the first movable seat 8 and the wafer as a whole are ... When the moving seat 8 slides, it drives the squeezing ball 21 at the bottom end of the first squeezing rod 18 to slide on the first squeezing portion 23 of the first squeezing strip 22. The first squeezing strip 22 pushes the squeezing ball 21, which can automatically drive the two clamps 19 to move in a direction close to each other, and automatically clamp the wafer in the placement plate 9, so that the rotation of the first moving seat 8 can drive the wafer to rotate, so that the debonding sheet 16 can smoothly debond the wafer and the material seat, and the first moving seat 8 rotates. At the same time, the second arc strip 41 and the second pull strip 42 are driven to rotate as a whole. When the second pull strip 42 moves to the first pull strip 40, as the first moving seat 8 continues to rotate, the second moving seat 25 can be automatically pulled to slide on the guide rail 24. When the second moving seat 25 moves, the second extrusion portion 37 on the second extrusion strip 38 squeezes the second extrusion rod 30 to push the clamping block 29 on the moving block 28 to move and clamp the material seat on the wafer. After clamping, as the second moving seat 25 continues to rotate, The movement drives one end of the insertion rod 33 to slide from the first arc groove 34 and the connecting groove 36 to the second arc groove 35, and the clamping block 29 can pull the material seat to move away from the final center of the wafer, so that the degumming of the wafer is smoother. After degumming, the motor 15 drives the first movable seat 8 to rotate in the opposite direction. Under the resetting action of the second spring on the second movable seat 25, the two clamping blocks 29 automatically release the degummed material seat, and the material seat falls into the collection frame 43 for collection, so that the degumming work of the wafer can be realized.

[0041] The above are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A debonding device for semiconductor wafers, comprising a debonding frame (1) and a cover plate (2), characterized in that: A heating medium and a temperature sensor are arranged in the degumming frame (1); a cover plate (2) is hingedly connected to the top of the degumming frame (1) via a hinge; a handle (3) is installed on the cover plate (2); and a rotating degumming structure is arranged in the degumming frame (1); The rotating degumming structure comprises a plurality of fixed seats (5) fixedly mounted on the left inner wall of the degumming frame (1), the plurality of fixed seats (5) being connected by a first connecting strip (6), a guide rail groove (7) being provided on the arc surface of the fixed seat (5) away from the left inner wall of the degumming frame (1), a first movable seat (8) being slidably arranged in the guide rail groove (7), a placement plate (9) being installed in the middle of the upper part of the first movable seat (8), a placement groove (10) being provided in the placement plate (9), a first clamping structure being provided on both the front and rear side surfaces of the placement plate (9), and a first clamping structure being connected to both the front and rear side surfaces of each of the first movable seats (8). Two connecting bars (11), a plurality of the first movable seats (8) are connected by the second connecting bars (11), and the second connecting bars (11) at both ends are respectively connected to third connecting bars (12) at one end away from the first movable seat (8), and a rotating disk (14) is connected to the top end of each group of two third connecting bars (12), and a rotating rod (13) is fixedly connected to the rotating disk (14) on the front side, and one end of the rotating rod (13) is rotatably connected to the front inner wall of the degumming frame (1), and a motor (15) is installed on the rear side of the degumming frame (1), and one end of the output shaft of the motor (15) is connected to another rotating disk (14); A degumming sheet (16) is connected to the inner walls of the front and rear sides of the degumming frame (1) at a position close to the upper right side, a second clamping structure is provided on the right inner wall of the degumming frame (1) at a position corresponding to each fixing seat (5), and a collecting frame (43) is installed on the lower inner wall of the degumming frame (1) at a position below the degumming sheet (16).

2. The debonding device for semiconductor wafers according to claim 1, characterized in that: The first clamping structure comprises through holes (20) provided on the front and rear side surfaces of the placement plate (9); the front and rear side surfaces of the placement plate (9) are connected with U-shaped strips (17) at the positions of the through holes (20); a first extrusion rod (18) movably passes through the middle of the U-shaped strip (17); a clamping piece (19) is connected to one end of the first extrusion rod (18) inserted into the through hole (20); a fixed sleeve is provided on the first extrusion rod (18); a first spring is connected between the fixed sleeve and the U-shaped strip (17); and a first extrusion structure is provided between the first extrusion rod (18) and the fixing seat (5).

3. A debonding device for semiconductor wafers according to claim 2, characterized in that: The first extrusion structure comprises a first extrusion strip (22) arranged at the front and rear sides of each fixing seat (5); one end of the first extrusion strip (22) away from the first extrusion rod (18) is connected to the fixing seat (5); one end of the first extrusion strip (22) close to the first extrusion rod (18) is provided with a first extrusion portion (23) with an inclined surface; a squeezing ball (21) is connected to the bottom end of the first extrusion rod (18); and each first extrusion rod (18) passes between two second connection strips (11) of each group.

4. The debonding device for semiconductor wafers according to claim 1, characterized in that: The second clamping structure comprises a guide rail (24) installed on the right inner wall of the degumming frame (1) at the position of each fixed seat (5), a second movable seat (25) is slidably arranged in the guide rail (24), an arc-shaped second spring is connected between the second movable seat (25) and the inner wall of the lower end of the guide rail (24), a groove (26) is provided on the side surface of the second movable seat (25) away from the guide rail (24), a fixing rod (27) is connected between the groove walls at both ends of the groove (26), and the two ends of the fixing rod (27) are connected to each other. A movable sleeve is provided with a moving block (28), the side surface of the moving block (28) is tightly attached to the inner wall of the groove (26), a third spring is sleeved in the middle of the fixed rod (27), the two ends of the third spring in a compressed state are respectively connected to the two moving blocks (28), a second extrusion structure is provided between the two moving blocks (28) and the right inner wall of the degumming frame (1), a clamping block (29) is provided on the two moving blocks (28), and a pulling structure is provided between the second moving seat (25) and the first moving seat (8).

5. The debonding device for semiconductor wafers according to claim 4, characterized in that: The second extrusion structure comprises a second extrusion rod (30) connected to a side surface of each group of two moving blocks (28) away from each other, and the right inner wall of the degumming frame (1) is connected to a second extrusion strip (38) at both the front and rear sides of each guide rail (24), and a second extrusion portion (37) with an arc-shaped surface is provided at the upper end of the second extrusion strip (38) close to a side surface of the guide rail (24), one end of the second extrusion rod (30) is inserted into a position corresponding to the second extrusion strip (38) and the guide rail (24), and a driving structure is provided between the clamping block (29) and the second extrusion strip (38).

6. The debonding device for semiconductor wafers according to claim 5, characterized in that: The driving structure comprises an insert block (31) connected to a side of the clamping block (29) close to the moving block (28); a first slot (32) for the insert block (31) to be movably inserted is provided on the end surface of the moving block (28); an insert rod (33) is connected to a side surface of each group of two moving blocks (28) away from each other; a first arc groove (34) is provided at the upper end of a side surface away from each other of each group of two second extrusion strips (38); a connecting groove (36) connected to the bottom end of the first arc groove (34) is provided on the second extrusion strip (38); a second arc groove (35) connected to the bottom end of the connecting groove (36) is provided on the second extrusion strip (38); a groove wall of the second arc groove (35) is 1.1 times the groove diameter of the first arc groove (34); one end of the insert rod (33) movably passes through the first arc groove (34).

7. The debonding device for semiconductor wafers according to claim 4, characterized in that: The pulling structure comprises a first arc-shaped bar (39) connected to the second movable seat (25) near the bottom end, the bottom end of the first arc-shaped bar (39) is connected to a first pull bar (40), the right end of the first movable seat (8) is connected to a second arc-shaped bar (41) passing through the guide rail groove (7), and one end of the second arc-shaped bar (41) is connected to a second pull bar (42) extending above the first pull bar (40).

8. The debonding device for semiconductor wafers according to claim 1, characterized in that: A second slot (47) for the collection frame (43) to movably pass through is provided at the lower right side of the front side of the degumming frame (1); a plug plate (44) is connected to the front end of the collection frame (43); the plug plate (44) is movably inserted into the second slot (47); a magnetic strip (46) is fixedly embedded on the inner side of the plug plate (44); the magnetic strip (46) is adsorbed on the iron strip on the inner groove of the second slot (47); and a pull ring (45) is installed in the middle of the front side of the plug plate (44).

Images