Micro-channel liquid cooling heat dissipation device, heat dissipation method and finite element simulation method

Abstract

The micro-channel liquid cooling heat dissipation device comprises a power device and a micro-channel liquid cooling heat dissipation plate, the micro-channel liquid cooling heat dissipation plate is used for dissipating heat of the power device, and the power device is attached to the surface of the micro-channel liquid cooling heat dissipation plate through heat conduction silicone grease. The micro-channel liquid cooling heat dissipation plate comprises a water inlet, a water outlet, cooling liquid, a water channel, fins and a water pump, the water channel is of a micro-channel structure and is connected with the water inlet and the water outlet, the water pump is used for driving the cooling liquid to circularly flow, the cooling liquid is injected into the water channel from the water inlet and is discharged from the water outlet, and the fins are of angle-adjustable structures and are arranged in the water channel. And the fin angle is optimized through finite element simulation. The micro fins are added in the channels, the fin angle is optimized by combining finite element simulation, the temperature uniformity between heating sources is improved, the design cost is greatly reduced on the basis of the accurate result, and finally the purposes of improving the heat transfer efficiency of the liquid cooling plate, reducing the junction temperature of a chip of a power device and improving the use reliability of the power device are achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of heat dissipation of power devices, and in particular relates to a microchannel liquid cooling heat dissipation method. Background Art

[0002] With the continuous advancement of power device technology, the integration and computing power of power device chips have increased rapidly, resulting in higher power consumption and greater heat generation; at the same time, in order to meet the needs of multiple short-term overcurrent applications such as grid-type converters, the requirements for heat dissipation capabilities are also increasing. Grid-type converters usually operate under higher power conditions, so more efficient heat dissipation design is required to prevent power device chips from overheating. This makes it increasingly important to effectively reduce the junction temperature of the power device chip (i.e., the maximum temperature inside the power device chip) and improve the uniformity of temperature (i.e., the uniformity of the temperature distribution inside the power device chip).

[0003] First, reducing the junction temperature of power device chips is crucial to improving the performance and reliability of power devices. High temperature will accelerate the aging of power device chip materials, leading to problems such as electron migration and thermal stress, thereby reducing their life and performance. In addition, excessively high junction temperature will also cause changes in the electrical characteristics of power device chips, such as threshold voltage drift and increased leakage current, which will affect the stability and reliability of power device chips. Effectively controlling the junction temperature can ensure that the power device chip operates stably within its design parameter range and extend its service life; secondly, improving temperature uniformity is also key. Uneven temperature will lead to inconsistent thermal expansion in different areas of the chip, generate mechanical stress, and increase the risk of chip failure. Especially in high-performance computing and high-power applications, temperature differences in various parts of the chip may cause local overheating, which in turn affects the overall performance. Uniform temperature distribution can reduce thermal stress and improve the mechanical reliability of the chip.

[0004] In short, reducing the junction temperature of power devices and improving temperature uniformity are key challenges in the development of current high-performance electronic devices. Effective thermal management can not only improve the performance and reliability of power device chips, but also significantly improve the energy efficiency of the system to meet higher computing needs in the future. Therefore, further improving the heat dissipation and temperature uniformity of power device chips is of great significance to improving the reliability of power device chips.

[0005] In the existing technology, traditional heat dissipation methods face many challenges. For example, although air cooling technology is widely used, its heat dissipation efficiency is limited and it is difficult to meet the needs of high-power density power device chips; although heat pipe and cold plate technology have improved the heat dissipation capacity to a certain extent, there are still bottlenecks in its thermal conductivity and temperature uniformity. In this context, microchannel liquid cooling technology, with its advantages of efficient heat dissipation, excellent temperature uniformity, flexible adaptability, compact size and high energy efficiency, solves many shortcomings of current power device heat dissipation technology and becomes an important direction for future high-performance electronic device heat dissipation solutions.

[0006] Prior art 1 discloses a flat-plate heat pipe microchannel composite radiator and a manufacturing method thereof (CN108120333A). The microchannel is sealed with the upper sealing cover plate to form a microflow channel, through which the coolant is passed for heat dissipation, thereby reducing the contact interface between one layer of heat pipe and the fin, and utilizing a microchannel liquid cooling method at the same time. However, the shortcoming of prior art 1 is that it does not analyze the fin angle and does not consider improving the temperature uniformity of the power device.

[0007] Prior art 2 discloses a targeted heat dissipation microchannel liquid-cooled cold plate (CN110753484A), which efficiently dissipates point-to-point heat for an electronic component by means of a detachable combination of a base plate with a certain number of fins and a cover plate with a flow channel of a certain shape. However, the shortcoming of prior art 2 is that it only considers the reduction of junction temperature, but does not consider the improvement of temperature uniformity.

[0008] Prior art 3 discloses a liquid cooling heat sink device based on microchannels (CN217770734U), which adopts the arrangement of long fins, short fins, cross-shaped fins, and capsule-shaped fins, and is equipped with spoiler columns to enhance the spoiler and coolant flow rate. However, the shortcomings of prior art 3 are that it does not analyze the fin angle and does not consider the improvement of the temperature uniformity of the power device.

[0009] Prior art 4 discloses a microchannel copper-aluminum composite skived-tooth liquid-cooled radiator (CN215418156U). When the microchannel copper-aluminum composite skived-tooth liquid-cooled radiator is in use, the heat generated by the IGBT during operation is conducted to the heat dissipation fin unit via the heat dissipation substrate. The heat dissipation fin unit contacts the coolant in the liquid cooling tank and exchanges heat with the coolant. However, the shortcoming of prior art 4 is that it only considers the reduction of junction temperature, but does not consider the improvement of temperature uniformity.

[0010] Prior art 5 discloses a microchannel liquid cooling heat sink device (CN202816913U). Under the same processing conditions, the fin spacing in the microchannel heat sink is reduced by half, thereby increasing the fin density. However, the disadvantages of prior art 5 are that its structure is relatively complex, the processing is difficult, and it does not consider the improvement of the temperature uniformity of the heat source.

[0011] Prior art 6 discloses an IGBT module liquid cooling plate based on parallel liquid flow grooves and its manufacturing method (CN107452699A), which adjusts the flow distribution between the liquid cooling plate flow channels by setting multiple guide plates and arranging them at a certain angle. However, the disadvantage of prior art 6 is that the addition of guide plates will bring greater flow resistance, and the patent has no theoretical or simulation data support for the direction setting of the guide plates.

[0012] At present, the research and improvement of microchannel cold plates are mainly focused on controlling the overall temperature rise of power devices by changing the shape of internal fins, and the research on controlling the temperature difference between power device chips is still not in-depth enough. Uneven temperature will lead to inconsistent thermal expansion in different areas of the power device chip, generate mechanical stress, and increase the risk of failure of the power device chip. Especially in high-performance computing and high-power applications, the temperature difference between different parts of the power device chip may cause local overheating, which in turn affects the overall performance. Uniform temperature distribution can reduce thermal stress and improve the mechanical reliability of the power device chip. Therefore, reducing the junction temperature of the power device and improving the uniformity of temperature are key challenges in the current development of high-performance electronic devices. Effective thermal management can not only improve the performance and reliability of the power device chip, but also significantly improve the energy efficiency of the system to meet the higher heat flux density requirements in the future. Summary of the invention

[0013] In order to solve the deficiencies in the prior art, the present invention provides a microchannel liquid cooling device, a heat dissipation method and a finite element simulation method.

[0014] The present invention is achieved through the following technical solutions:

[0015] A first aspect of the present invention provides a microchannel liquid cooling device, comprising:

[0016] Power devices and microchannel liquid-cooled heat sinks, the microchannel liquid-cooled heat sinks are used to dissipate heat from power devices, the power devices are mounted on the surface of the microchannel liquid-cooled heat sinks through thermal grease, the microchannel liquid-cooled heat sinks include a water inlet, a water outlet, a coolant, a water channel, fins and a water pump, wherein the water channel is a microchannel structure connecting the water inlet and the water outlet, the water pump is used to drive the coolant to circulate, the coolant is injected into the water channel from the water inlet and discharged from the water outlet, the fins are an adjustable angle structure, arranged inside the water channel, and the fin angle is optimized through finite element simulation.

[0017] Preferably, the width of the water channel is 0.1 mm to 1 mm, and the microchannel is machined and then welded using a friction welding process.

[0018] A second aspect of the present invention provides a heat dissipation method based on the above-mentioned microchannel liquid cooling heat dissipation device, comprising:

[0019] Step 1, mounting the power device on the surface of the microchannel liquid cooling device through thermal conductive silicone grease;

[0020] Step 2, injecting coolant into the water inlet of the microchannel liquid cooling device, the coolant flows out through the water outlet along the microchannel waterway of the fin, and the coolant is driven by a water pump to circulate and take away the heat;

[0021] Step 3: Optimize the fin angle through finite element simulation and adjust it to achieve uniform temperature of power devices.

[0022] A third aspect of the present invention provides a finite element simulation method based on the above-mentioned microchannel liquid cooling heat dissipation device, comprising:

[0023] Step 1, collecting the average flow rate of the coolant, the average temperature of the coolant and the heating power of the power device;

[0024] Step 2, based on the data collected in step 1, construct a finite element simulation mathematical model of the microchannel liquid cooling device and calculate the fin angle;

[0025] Step 3, based on the fin angle calculated in step 2, calculating the temperature uniformity performance and heat dissipation efficiency of the microchannel liquid cooling heat sink;

[0026] Step 4, based on the temperature uniformity performance and heat dissipation efficiency calculated in step 3, determine whether the optimal conditions are met. If so, output the current fin angle as the optimal fin angle; otherwise, go to step 2 to adjust the proportional coefficient and recalculate the fin angle.

[0027] Preferably, in step 2, the fin angle calculation formula is:

[0028] α i =k*p i / (q i *T i )

[0029] Among them, α i is the fin angle in the i-th channel from left to right, q i is the average flow rate of coolant, p i is the heat generation power of the power device, T i is the average temperature of the coolant, and k is the proportionality coefficient.

[0030] Preferably, in step 3, the temperature uniformity performance of the microchannel liquid cooling heat sink is measured by the temperature variance, and the heat dissipation efficiency is measured by the average temperature of all heat sources;

[0031] The temperature variance calculation formula is:

[0032]

[0033] in, is the temperature variance, n is the number of heat sources, is the average temperature of all heat sources, T i ′ is the temperature of the i-th heat source from left to right.

[0034] Preferably, a comprehensive consideration parameter D is introduced to comprehensively judge the temperature uniformity performance and heat dissipation efficiency of the microchannel liquid cooling heat sink;

[0035] The calculation formula of comprehensive consideration parameter D is:

[0036] D=ω1·E+ω2·U

[0037] Among them, ω1 and ω2 are the weight coefficients of heat dissipation efficiency and temperature uniformity performance respectively, and ω1+ω2=1, E is the standardized heat dissipation efficiency, and U is the standardized temperature uniformity performance.

[0038] Preferably, the standardized heat dissipation efficiency calculation formula is as follows:

[0039]

[0040] Where T′ max and T′ min are the maximum and minimum temperatures of all heat sources, respectively. is the average temperature of all heat sources, E is the standardized heat dissipation efficiency;

[0041] The standardized temperature uniformity performance calculation formula is as follows:

[0042]

[0043] in and are the maximum and minimum values ​​of the temperature variance of all heat sources, respectively. is the temperature variance, and U is the standardized temperature uniformity performance.

[0044] A fourth aspect of the present invention provides a terminal, including a processor and a storage medium;

[0045] The storage medium is used to store instructions;

[0046] The processor is used to operate according to the instructions to execute the steps of the above method.

[0047] A fifth aspect of the present invention provides a computer-readable storage medium having a computer program stored thereon.

[0048] When the program is executed by a processor, the steps of the method described in any one of claims 3 to 8 are implemented.

[0049] Compared with the prior art, the beneficial effects of this solution are:

[0050] The present invention adds micro fins inside the channel and optimizes the fin angle in combination with finite element simulation, so that the flow rate of the refrigerant is accelerated when flowing through the heat source, thereby more effectively dissipating the heat of the power device. The fin angle can be adjusted according to the heat consumption of the heat source to improve the temperature uniformity between the heat sources while ensuring that the pressure drop loss is within an acceptable range.

[0051] The present invention optimizes the fin direction through finite element simulation to greatly reduce the design cost on the basis of accurate results, and ultimately achieves the purpose of improving the heat transfer efficiency of the liquid cooling plate, reducing the junction temperature of the power device, and improving the reliability of the power device. It can be used in scenarios with multiple short-term overcurrent application requirements such as grid-type converters.

[0052] The present invention increases the flow velocity and adjusts the flow velocity distribution to improve the temperature uniformity by adding fins between the flow channels and adjusting the direction. Firstly, the increase in flow resistance is relatively small. Secondly, the direction of the fins is the result of theoretical calculation, optimization and verification through finite element simulation, which can maximize the temperature uniformity effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 It is a schematic diagram of the microchannel structure of the liquid cooling plate in the present invention;

[0054] Figure 2 It is a schematic diagram of the temperature rise simulation results of the microchannel power device without fins in the present invention;

[0055] Figure 3 It is a schematic diagram of the temperature rise simulation results of the power device after the microchannel fin angle is optimized in the present invention. DETAILED DESCRIPTION

[0056] In order to make the purpose, technical scheme and advantages of the present invention clearer, the technical scheme of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. The embodiments described in this application are only part of the embodiments of the present invention, not all of them. Based on the spirit of the present invention, other embodiments obtained by ordinary technicians in this field without creative work are all within the scope of protection of the present invention.

[0057] The present application is further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present application.

[0058] like Figure 1 As shown, an example of the present invention provides a novel microchannel liquid-cooled heat dissipation device, including: a power device and a microchannel liquid-cooled heat sink, the microchannel liquid-cooled heat sink is used to dissipate heat from the power device, the power device is mounted on the surface of the microchannel liquid-cooled heat sink through thermal grease, the microchannel liquid-cooled heat sink includes a water inlet, a water outlet, a coolant, a water channel, fins and a water pump, wherein the water channel connects the water inlet and the water outlet, forming a group of rectangular channel structures, the water pump is used to drive the coolant to circulate, the coolant is injected into the water channel from the water inlet and discharged from the water outlet, the fins are arranged inside the water channel, the water channel is a microchannel structure, and the fins are an adjustable angle structure; and the fin angle is optimized through fin element simulation.

[0059] By adding fins inside the water channel and optimizing the fin angle in combination with fin simulation, the flow rate of the refrigerant is accelerated when flowing through the heat source, thereby more effectively dissipating the heat of the power device. The fin angle can be adjusted according to the heat consumption of the heat source to improve the temperature uniformity between the heat sources. By optimizing the fin direction through fin simulation, the design cost is greatly reduced on the basis of accurate results, and ultimately the purpose of improving the heat transfer efficiency of the liquid cooling plate, reducing the junction temperature of the power device, and improving the reliability of the power device is achieved. It can be used in scenarios with multiple short-term overcurrent application requirements such as grid-type converters.

[0060] In the embodiment of the present invention, the water channel spacing is minimized on the basis of meeting the processing strength of the liquid cooling plate, and the general water channel width is controlled within the range of 0.1mm to 1mm. The microchannel is machined and then welded by friction welding. This allows a larger contact area between the coolant and the liquid cooling plate, thereby achieving sufficient heat dissipation of the power device chip by the coolant.

[0061] In addition to whether micro-fins are added inside the microchannel, which will affect the temperature equalization effect, the shape of the water channel, the position of the water inlet and outlet, and the change in the water channel diameter will also affect the temperature equalization effect. In a preferred but non-limiting embodiment of the present invention, since the U-shaped water channel is prone to form a temperature gradient at the far end, and the serpentine water channel can provide more uniform cooling, the attached drawings of the present invention show a serpentine water channel structure, but the heat dissipation structure of adding micro-fins inside the microchannel of the present invention is also applicable to the U-shaped water channel. The water inlet and outlet are located at opposite ends to increase the fluid coverage area and optimize the temperature equalization effect. However, the technical solution of the present invention is also applicable to the distribution method in which the water inlet and the water outlet are on opposite sides or different sides. Increasing the diameter of the water channel will reduce the flow rate, resulting in uneven cooling, but also reduce the pressure drop; on the contrary, reducing the diameter will increase the flow rate and improve the heat exchange efficiency, but may cause uneven cooling. Reasonable design of these parameters can achieve better temperature equalization performance

[0062] In the embodiment of the present invention, fins are arranged inside the microchannel and the direction of the fins is adjusted through finite element simulation to achieve the effect of enhancing heat exchange efficiency and improving temperature uniformity. There is no restriction on other structures such as the shape of the water channel and the direction of the opening. As long as the solution of using fins inside the microchannel and adjusting the direction of the fins through finite element simulation falls within the protection scope of the present invention.

[0063] The shape of the water channel inside the heat sink is adapted to the shape of the fin to optimize the contact area. The flat and curved features of the fins will have a significant impact on the temperature uniformity performance. Flat fins usually provide uniform heat dissipation, but may cause local overheating when the flow velocity is unevenly distributed. Curved fins can better guide the fluid and enhance the heat transfer efficiency of the fluid in a specific area, thereby improving the temperature uniformity performance. In addition, curved fins can also reduce flow dead zones, promote uniform distribution of coolant, and improve overall temperature uniformity.

[0064] In a preferred but non-limiting embodiment of the present invention, straight or serrated fins are used in rectangular water channels to increase the contact area between the coolant and the wall surface and improve the heat exchange efficiency. In circular or curved water channels, spiral or wavy fins are more suitable, which can better match the flow channel curve, avoid fluid dead zones, and enhance the overall heat dissipation effect.

[0065] In a preferred but non-limiting embodiment of the present invention, a rectangular water channel is selected for finite element simulation. In the rectangular water channel, straight fins and curved fins have their own advantages and disadvantages:

[0066] Straight fins: Straight-line design suitable for rectangular waterways, providing uniform heat dissipation surface area, simple manufacturing and assembly. Suitable for applications with relatively stable fluid flow, easy to predict and optimize flow velocity distribution.

[0067] Curved fins: Although they do not completely match the geometry in a rectangular flow channel, curved fins can increase the turbulence effect and improve heat transfer efficiency. This design helps reduce boundary layer effects, avoid local overheating, and improve temperature uniformity.

[0068] In general, if efficient heat exchange and temperature uniformity are pursued, curved fins may be more advantageous; but if the complexity of the manufacturing process and the balance performance are considered, straight fins are more practical. In order to facilitate simulation modeling and mainly to illustrate this design method, the present invention adopts straight fins as the design structure.

[0069] The embodiment of the present invention optimizes the direction and shape of the fins by using finite elements, not limited to straight lines or curved surfaces, to improve the heat dissipation efficiency. This design emphasizes maximizing the temperature uniformity performance and reducing the flow dead zone through the precise positioning and shape adjustment of the fins, thereby enhancing the local cooling effect.

[0070] The fins in contact with the middle of the liquid cooling plate and the power device have a larger rotation angle, while the fins in contact with the edge of the power device have a vertical or smaller rotation angle, which speeds up the flow rate of the coolant in contact with the hotter position, thereby more effectively dissipating heat from the power device and improving temperature uniformity. The fin angle change method can be flexibly designed according to the heat distribution of the power device, the flow distribution of different flow channels, and the corresponding fluid temperature distribution, such as gradual change, step change, monotonic change, etc. The fluid-solid thermal coupling heat dissipation simulation can be performed based on the fin rotation angle of zero, and the specific solution design of the fin rotation angle can be carried out after obtaining the overall temperature rise and temperature distribution of the power device.

[0071] The embodiment of the present invention further provides a liquid cooling method based on the above microchannel liquid cooling structure, including:

[0072] Step 1, mounting the power device on the surface of the microchannel liquid cooling device through thermal conductive silicone grease;

[0073] Step 2, injecting coolant into the water inlet of the microchannel liquid cooling device, the coolant flows out through the water outlet along the microchannel waterway of the fin, and the coolant is driven by a water pump to circulate and take away the heat;

[0074] Step 3: Optimize the fin angle through finite element simulation and adjust it to achieve uniform temperature of power devices.

[0075] like Figure 2 and Figure 3 As shown, Comsol finite element simulation software is used here to simulate the temperature rise of power devices at the same water inlet temperature and heat generation for heat sinks without fins and after fin angle optimization with equal appearance dimensions and water flow. It can be seen that the overall temperature rise and temperature difference of power devices of the microchannel cold plate after fin angle optimization are significantly reduced.

[0076] The embodiment of the present invention also provides a finite element simulation method for a microchannel liquid cooling device, comprising:

[0077] Step 1, collecting the average flow rate of the coolant, the average temperature of the coolant and the heating power of the power device;

[0078] Step 2, based on the data collected in step 1, construct a finite element simulation mathematical model of the microchannel liquid cooling device and calculate the fin angle;

[0079] Specifically, the direction of the fins is optimized by establishing a mathematical model that combines the heat generation power of the power device and fluid dynamics. The formula for calculating the fin angle is as follows:

[0080] α i =k*p i / (q i *T i )

[0081] Among them, α i is the fin angle in the i-th channel from left to right, q i is the average flow rate of coolant, p i is the heat generation power of the power device, T i is the average temperature of the coolant, and k is the proportionality coefficient, which is related to factors such as the coolant fluid characteristics and the flow channel geometry.

[0082] When the power of the power device is high, it means that the heat load of the flow channel is high, so a larger fin angle is needed to increase heat exchange; when the average temperature of the fluid in this area is low, it means that a larger fin angle is also needed to increase heat exchange; when the average flow rate is large, it means that the fluid in the flow channel can take away heat faster, so the fin angle can be reduced to reduce fluid resistance and balance the flow rate. When the heat source power increases, the heat exchange demand of the water channel increases, so the fin angle needs to be increased to improve the heat exchange effect. Similarly, the average flow rate affects the heat exchange capacity of the fluid in the flow channel. An increase in the average flow rate can take away more heat, thereby reducing the requirements for the fin angle. Therefore, the fin angle should be proportional to the heat source power and inversely proportional to the flow rate.

[0083] The fin angle calculation optimization process includes:

[0084] Initialization parameters: Based on the established mathematical model of the microchannel liquid cooling structure, as well as the fluid characteristics and design requirements, the initial proportional coefficient k is set.

[0085] The initial value of the proportionality factor k should be selected to ensure that it is physically reasonable and does not lead to unrealistic fin angles. The proportionality factor k should make the fin angle α i Within a reasonable range, for example, the fin length is a, the channel width is b, if a>b, then α i Need to be less than

[0086] Iterative adjustment: Through finite element simulation, adjust the proportional coefficient k to optimize the overall temperature uniformity. The specific adjustment method is: First, establish a flow-heat simulation model of the microchannel liquid-cooled heat sink and fluid, and define the initial k value. Run the initial simulation and record the temperature distribution and flow rate. According to the results, adjust the k value to optimize the fin angle to make the temperature more uniform. Repeat the simulation and adjustment to gradually approach the optimal k value until the heat dissipation and temperature uniformity goals are met. Each iteration fine-tunes the k value based on the previous result until the system performance is stable.

[0087] Calculate angle: Use the optimized k to calculate the fin angle in each flow channel.

[0088] Step 3, based on the fin angle calculated in step 2, calculating the temperature uniformity performance and heat dissipation efficiency of the microchannel liquid cooling heat sink;

[0089] Verification and optimization: The temperature uniformity performance and heat dissipation efficiency of the microchannel liquid cooling heat sink are verified through simulation, and the proportional coefficient k is further adjusted if necessary.

[0090] The evaluation method of heat dissipation efficiency and temperature uniformity performance is as follows: Set the temperature of the i-th heat source from left to right as T i ′, where the heat dissipation efficiency is calculated by the average temperature of all heat sources The lower the average temperature, the better the heat dissipation efficiency; the average temperature performance is evaluated by the temperature variance. To measure, assuming there are n heat sources in total, the temperature variance calculation formula is:

[0091]

[0092] in, is the temperature variance, n is the number of heat sources, n is a natural number, is the average temperature of all heat sources, T i ′ is the temperature of the i-th heat source from left to right.

[0093] like If it is close to zero, it means that the temperature of the heat source is almost uniform and the temperature uniformity performance is very good.

[0094] During the entire finite element simulation iteration process, the temperature uniformity performance and heat dissipation efficiency need to be considered comprehensively, and a comprehensive consideration parameter D is introduced, which combines the heat dissipation efficiency and temperature uniformity performance.

[0095] Here are the steps to define and calculate this parameter:

[0096] 1) For comprehensive consideration, the heat dissipation efficiency and temperature uniformity performance are first standardized so that they can be compared on the same scale. The standardized heat dissipation efficiency calculation formula is as follows:

[0097]

[0098] Where T′ max and T′ min are the maximum and minimum temperatures of all heat sources, respectively. is the average temperature of all heat sources, and E is the standardized heat dissipation efficiency.

[0099] The standardized temperature uniformity performance calculation formula is as follows:

[0100]

[0101] in and are the maximum and minimum values ​​of the temperature variance of all heat sources, respectively. is the temperature variance, and U is the standardized temperature uniformity performance.

[0102] 2) Set the comprehensive consideration parameter D to measure the overall heat dissipation effect. The calculation formula of the comprehensive consideration parameter is as follows:

[0103] D=ω1·E+ω2·U

[0104] Where ω1 and ω2 are the weight coefficients of heat dissipation efficiency and temperature uniformity performance, respectively, and ω1+ω2=1, E is the standardized heat dissipation efficiency, and U is the standardized temperature uniformity performance.

[0105] 3) Determination of optimal system heat dissipation effect: The smaller the comprehensive consideration parameter D is, the better the overall heat dissipation effect of the system.

[0106] By adjusting the design parameters (such as fin angle, flow rate, etc.), D is minimized to optimize the heat dissipation effect of the system. If the heat dissipation efficiency and temperature distribution performance cannot be optimized at the same time, by adjusting the values ​​of ω1 and ω2, decide whether to prioritize lower average temperature or more uniform temperature distribution.

[0107] 4) Weight coefficient selection: In different application scenarios, the weights ω1 and ω2 can be adjusted according to actual needs.

[0108] For example, for scenarios where heat dissipation efficiency is more critical, ω1 can be increased; and for scenarios where temperature uniformity is more required, ω2 can be increased.

[0109] Step 4, based on the temperature uniformity performance and heat dissipation efficiency calculated in step 3, determine whether the optimal conditions are met. If so, output the current fin angle as the optimal fin angle; otherwise, go to step 2 to adjust the proportional coefficient and recalculate the fin angle.

[0110] The selection of the proportional coefficient k needs to consider the total pressure drop of the system, because too large a fin angle will significantly increase the fluid resistance and affect the overall flow distribution. Finite element analysis is used to accurately determine the proportional coefficient k and the fin angle α i After this processing, the fin angle not only takes into account the power of the heat source, but also combines the influence of the flow rate, thereby more accurately optimizing the heat dissipation effect and temperature uniformity of the liquid cooling plate.

[0111] In a preferred but non-limiting embodiment of the present invention, when the water inlet temperature is 20°C, the water inlet flow rate is 13L / min, the liquid cooling plate is an equal-diameter 10 rectangular water channel structure, the calorific value of the left 5 flow channel heat source is 20W, and the calorific value of the right 5 flow channel heat source is 30W. When no fins are added, the heat source temperature distribution range is 26.7°C-38.3°C; after a preliminary calculation of the fin angle according to the above formula and optimization of the k coefficient by finite element, the heat source temperature distribution range is 22.8°C-29.5°C. It can be seen that the heat dissipation efficiency and temperature uniformity performance are significantly improved.

[0112] The beneficial technical effects of this solution are: effectively improving the heat dissipation of power devices, improving the overall temperature uniformity of power devices, ensuring the full performance of power devices, and improving the service life and safety of power devices.

[0113] The applicant of the present invention has made a detailed explanation and description of the implementation examples of the present invention in conjunction with the drawings in the specification. However, those skilled in the art should understand that the above implementation examples are only preferred implementation schemes of the present invention, and the detailed description is only to help readers better understand the spirit of the present invention, but not to limit the scope of protection of the present invention. On the contrary, any improvements or modifications based on the inventive spirit of the present invention should fall within the scope of protection of the present invention.

[0114] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the present invention can still be modified or replaced by equivalents, and any modifications or equivalent replacements that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A microchannel liquid cooling device, characterized in that: include: Power devices and microchannel liquid-cooled heat sinks, the microchannel liquid-cooled heat sinks are used to dissipate heat from power devices, the power devices are mounted on the surface of the microchannel liquid-cooled heat sinks through thermal grease, the microchannel liquid-cooled heat sinks include a water inlet, a water outlet, a coolant, a water channel, fins and a water pump, wherein the water channel is a microchannel structure connecting the water inlet and the water outlet, the water pump is used to drive the coolant to circulate, the coolant is injected into the water channel from the water inlet and discharged from the water outlet, the fins are an adjustable angle structure, arranged inside the water channel, and the fin angle is optimized through finite element simulation.

2. The microchannel liquid cooling device according to claim 1, characterized in that: The width of the water channel is 0.1mm to 1mm. The microchannel is machined and then welded using a friction welding process.

3. The heat dissipation method of the microchannel liquid cooling device according to any one of claims 1 to 2, characterized in that: include: Step 1, mounting the power device on the surface of the microchannel liquid cooling device through thermal conductive silicone grease; Step 2, injecting coolant into the water inlet of the microchannel liquid cooling device, the coolant flows out through the water outlet along the microchannel waterway of the fin, and the coolant is driven by a water pump to circulate and take away the heat; Step 3: Optimize the fin angle through finite element simulation and adjust it to achieve uniform temperature of power devices.

4. The finite element simulation method of the microchannel liquid cooling device according to any one of claims 1-2, characterized in that: include: Step 1, collecting the average flow rate of the coolant, the average temperature of the coolant and the heating power of the power device; Step 2, based on the data collected in step 1, construct a finite element simulation mathematical model of the microchannel liquid cooling device and calculate the fin angle; Step 3, based on the fin angle calculated in step 2, calculating the temperature uniformity performance and heat dissipation efficiency of the microchannel liquid cooling heat sink; Step 4: determine whether the optimal condition is met based on the temperature uniformity performance and heat dissipation efficiency calculated in step 3. If so, output the current fin angle as the optimal fin angle; Otherwise, go to step 2 to adjust the proportional coefficient and recalculate the fin angle.

5. The finite element simulation method according to claim 4, characterized in that: In step 2, the fin angle calculation formula is: α i =k*p i / (q i *T i ) Among them, α i is the fin angle in the i-th channel from left to right, q i is the average flow rate of coolant, p i is the heat generation power of the power device, T i is the average temperature of the coolant, and k is the proportionality coefficient.

6. The finite element simulation method according to claim 4, characterized in that: In step 3, the temperature uniformity performance of the microchannel liquid cooling heat sink is measured by the temperature variance, and the heat dissipation efficiency is measured by the average temperature of all heat sources; The temperature variance calculation formula is: in, is the temperature variance, n is the number of heat sources, is the average temperature of all heat sources, T′ i is the temperature of the i-th heat source from left to right.

7. The finite element simulation method according to claim 6, characterized in that: The comprehensive consideration parameter D is introduced to comprehensively judge the temperature uniformity performance and heat dissipation efficiency of the microchannel liquid cooling heat sink; The calculation formula of comprehensive consideration parameter D is: D=ω1·E+ω2·U in, ω1 and ω2 are weight coefficients of heat dissipation efficiency and temperature uniformity performance, respectively, and ω1+ω2=1, E is the standardized heat dissipation efficiency, and U is the standardized temperature uniformity performance.

8. The finite element simulation method according to claim 7, characterized in that: The standardized heat dissipation efficiency calculation formula is as follows: Where T′ max and T′ min are the maximum and minimum temperatures of all heat sources, respectively. is the average temperature of all heat sources, E is the standardized heat dissipation efficiency; The standardized temperature uniformity performance calculation formula is as follows: in and are the maximum and minimum values ​​of the temperature variance of all heat sources, respectively. is the temperature variance, and U is the standardized temperature uniformity performance.

9. A terminal comprising a processor and a storage medium; characterized in that: The storage medium is used to store instructions; The processor is configured to operate according to the instructions to execute the steps of the method according to any one of claims 3-8.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the steps of the method described in any one of claims 3 to 8 are implemented.

Images