Single-channel frequency conversion SiP module integrating cost vibration source

Abstract

The invention discloses a single-channel frequency conversion SiP module integrated with a cost vibration source, which comprises a ceramic package, an upper layer substrate and a lower layer substrate, a frequency conversion link is arranged on the lower layer substrate, and a phase lock link is arranged on the upper layer substrate. The frequency conversion link comprises a first amplifier, a numerical control attenuator, a first band-pass filter, a frequency mixer, a second band-pass filter, a second amplifier, an attenuator, a third amplifier and a first low-pass filter, and the phase-locked link comprises a second low-pass filter, a phase-locked loop and a fourth amplifier. An input radio frequency signal passes through the first amplifier, the numerical control attenuator and the first band-pass filter and then is mixed with a local oscillator signal in the frequency mixer to generate an intermediate frequency signal, and the intermediate frequency signal passes through the second band-pass filter, the second amplifier, the attenuator, the third amplifier and the first low-pass filter and then is output. The input reference signal passes through the second low-pass filter, the phase-locked loop and the fourth amplifier in sequence to generate a local oscillator signal. According to the invention, the requirements of miniaturization, multiple functions and low cost can be met.

Description

Technical Field

[0001] The invention belongs to the field of radar technology, and in particular relates to a single-channel frequency conversion SiP module with an integrated local oscillator source. Background Art

[0002] As the requirements for electronic technology in the new generation of equipment increase, module components need to have the characteristics of multi-function, high performance, low cost, and rapid construction, so as to improve the adaptability of the whole equipment to complex environments, operational efficiency and intelligence level. In this trend, the integrated design of multiple functional modules is crucial to the performance of the communication system. The system-level packaging technology (System in Package, SiP) can integrate a variety of different functions in a very small package, and use a three-dimensional structure to construct the chip in a three-dimensional manner. It has the characteristics of high performance, high integration, lightweight, and low cost. It is widely used in key military information equipment such as radar, communication, and electronic warfare, and civil infrastructure such as 5G / 6G communication and satellite Internet. Summary of the invention

[0003] The purpose of the present invention is to provide a miniaturized, multifunctional, low-cost single-channel frequency conversion SiP module with an integrated local oscillator source.

[0004] In order to achieve the above-mentioned purpose, one aspect of the present invention provides a single-channel frequency conversion SiP module with an integrated local oscillator source, including a ceramic package and an upper substrate and a lower substrate carried by the ceramic package as a carrier, a frequency conversion link is arranged on the lower substrate, a phase-locked link is arranged on the upper substrate, and the upper substrate and the lower substrate realize signal transmission through a board-level stacking process.

[0005] The frequency conversion link includes a first amplifier, a digitally controlled attenuator, a first bandpass filter, a mixer, a second bandpass filter, a second amplifier, an attenuator, a third amplifier, and a first low-pass filter; the phase-locked link includes a second low-pass filter, a phase-locked loop, and a fourth amplifier; the input radio frequency signal passes through the first amplifier, the digitally controlled attenuator, and the first bandpass filter, and then is mixed with the local oscillator signal in the mixer to generate an intermediate frequency signal; the intermediate frequency signal passes through the second bandpass filter, the second amplifier, the attenuator, the third amplifier, and the first low-pass filter before being output; the local oscillator signal is generated by the input reference signal passing through the second low-pass filter, the phase-locked loop, and the fourth amplifier in sequence;

[0006] The first amplifier is used to ensure the RF pre-stage gain of the frequency conversion link; the digitally controlled attenuator is used to ensure the dynamic range of the frequency conversion link and improve the frequency conversion link's ability to receive large signals; the first bandpass filter is used to achieve frequency selection, suppress RF images, and suppress low-pass or high-frequency noise outside the working frequency band; the mixer is used to mix the RF signal and the local oscillator signal to generate an intermediate frequency signal; the second bandpass filter is used to suppress the RF and local oscillator leakage signals after mixing and suppress intermodulation; the second amplifier, attenuator and third amplifier are used to generate sufficient link gain, and the attenuator is used to match the standing wave between the second amplifier and the third amplifier; the first low-pass filter is used to suppress high-frequency spurious and suppress intermediate frequency signal harmonics; the second low-pass filter is used to filter out high-frequency noise in space to ensure the quality of the reference signal; the phase-locked loop is used to generate the required local oscillator signal; the fourth amplifier is used to generate the local oscillator driving power to drive the mixer.

[0007] Preferably, the input radio frequency signal is 0.99-1.13 GHz, the generated local oscillator signal is 1.265-1.405 GHz, the generated intermediate frequency signal is 275 MHz, and the input reference signal is 100 MHz.

[0008] Preferably, the ceramic package is a standard HTCC package.

[0009] Preferably, a vertical interconnection structure is formed between the upper substrate and the lower substrate through BGA solder balls, and the vertical interconnection structure is a quasi-coaxial structure and constitutes a circular waveguide resonant cavity.

[0010] Preferably, the lower substrate uses GCPW transmission lines and BGA arrays to achieve channel isolation.

[0011] The single-channel frequency conversion SiP module with integrated local oscillator source according to the above aspects of the present invention can meet the requirements of miniaturization, multi-function and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings used in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0013] Figure 1 It is a link block diagram of a single-channel frequency conversion SiP module with an integrated local oscillator source according to an embodiment of the present invention;

[0014] Figure 2 It is a schematic diagram of the stacking structure of a single-channel frequency conversion SiP module with an integrated local oscillator source according to an embodiment of the present invention;

[0015] Figure 3Schematic diagram of a vertical interconnect structure according to an embodiment of the present invention. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] One embodiment of the present invention provides a single-channel frequency conversion SiP module with integrated local oscillator source (hereinafter referred to as "SiP module"), which is a multifunctional SiP module integrating a local oscillator source and single-channel frequency conversion. Figure 1 As shown, it includes a frequency conversion link and a phase-locked link. The frequency conversion link includes a first amplifier, a digitally controlled attenuator, a first bandpass filter, a mixer, a second bandpass filter, a second amplifier, an attenuator, a third amplifier, and a first low-pass filter. The phase-locked link includes a second low-pass filter, a phase-locked loop, and a fourth amplifier.

[0018] The input RF signal of 0.99-1.13 GHz passes through the first amplifier, the digitally controlled attenuator, and the first band-pass filter, and is mixed with the local oscillator signal of 1.265-1.405 GHz at the mixer to produce an intermediate frequency signal of 275 MHz; the intermediate frequency signal passes through the second band-pass filter, the second amplifier, the attenuator, the third amplifier, and the first low-pass filter and then outputs the signal; the local oscillator signal is generated by the input 100 MHz reference signal through the second low-pass filter, the phase-locked loop, and the fourth amplifier.

[0019] On the frequency conversion link, the first amplifier ensures its RF pre-stage gain, so that it has good receiving characteristics and low noise coefficient. The frequency conversion link mainly realizes the functions of receiving frequency conversion, amplification, filtering and gain adjustment. In order to ensure its low noise, high spurious suppression, large dynamic and other characteristics, a digitally controlled attenuator is set on the frequency conversion link. The digitally controlled attenuator improves the overall link's ability to receive large signals while ensuring its dynamic range. The first bandpass filter realizes the frequency selection function, completes the RF image suppression function, and suppresses low-pass or high-frequency noise outside the working frequency band. The mixer is used to mix the RF signal and the local oscillator signal to generate an intermediate frequency signal; the second bandpass filter is used to suppress the RF and local oscillator leakage signals after mixing and suppress intermodulation; the second amplifier, attenuator, and third amplifier are used to generate sufficient link gain, and the attenuator is used to match the standing wave between the two-stage amplifier; the first low-pass filter is located at the end of the link to suppress high-frequency spurious and suppress the harmonics of the intermediate frequency signal. By setting the frequency selection filter at the key position of the frequency conversion link, the high spurious suppression of the link is guaranteed.

[0020] On the phase-locked link, the 100MHz reference signal enters and first passes through the second low-pass filter to filter out high-frequency noise in the space to ensure the quality of the reference signal; then the reference signal enters the phase-locked loop to generate the required local oscillator signal; the local oscillator signal passes through the fourth amplifier to generate sufficient local oscillator drive power to drive the mixer.

[0021] In an embodiment of the present invention, the reference signal is filtered and then enters the phase-locked loop to generate a local oscillator signal, which is then amplified to drive the mixer. The radio frequency signal 0.99-1.13 GHz enters the mixer after low-noise amplification, digitally controlled attenuation, and pre-selection, and is mixed with the local oscillator signal 1.265-1.405 GHz to generate a 275 MHz intermediate frequency signal, which is then filtered, amplified in two stages, and filtered out harmonics before being output. The first bandpass filter is used as a radio frequency filter to suppress the image frequency component of the radio frequency, and the filter is also used to select the frequency domain of the radio frequency signal. The second bandpass filter and the first low-pass filter are used as intermediate frequency filters to select the intermediate frequency signal in the complex intermodulation environment after mixing, filter out other out-of-band signals, and also have the function of anti-aliasing filter of A / D. The gain of the entire channel is realized by a three-stage amplifier, and there is a first-stage digitally controlled attenuator at the input end to reduce the signal amplitude when a large signal is input, so that the subsequent receiving channel is not saturated.

[0022] In terms of packaging options, ceramic packaging currently includes standard ceramic HTCC (High Temperature Co-fired Ceramic) tube shells, customized HTCC tube shells, DPC boards (Direct Plating Copper, direct copper-plated ceramic substrates) and other implementation methods. HTCC is mainly made of black and white porcelain sheets of AL2O3 material, and is fired at high temperature with internal wiring metal tungsten. The resistivity of tungsten metal is relatively large, and the impact of insertion loss on the link system needs to be comprehensively considered. DPC boards are made of ALN materials and are wired by electroplating copper on the surface. The material has good thermal conductivity and can form a vertical coaxial structure through electroplating copper. It is mostly used in systems with double-sided transmission and high heat dissipation requirements.

[0023] Based on the considerations of low cost, fast construction and convenience for mass production, the embodiment of the present invention preferably selects a low-cost standard HTCC tube shell in terms of packaging selection. The upper and lower layers of signal transmission are realized through the board-level stacking process (PoP, Package on Package), and the package is used as a carrier board to carry the upper and lower substrates. The lower substrate is provided with a frequency conversion link, and the upper substrate is provided with a phase-locked link, such as Figure 2 The link unit chip is bonded to the substrate with gold wires, and the upper and lower substrates are connected vertically through BGA solder balls. The SiP module is reduced to 16×11×4mm in size. 3 , which is only 10% of traditional components.

[0024] like Figure 3 As shown, the vertical RF transmission structure (vertical interconnection structure) is a coaxial structure, and its upper and lower surfaces are grounded over a large area, forming a circular waveguide resonant cavity, and its lowest oscillation mode TE 111 The mode resonance frequency is related to the circular waveguide radius, length and dielectric node constant. The resonance frequency can be improved by reducing the waveguide radius and shortening the waveguide length so that it falls outside the operating frequency band of the packaged product. The package shell, as a closed cavity, can be considered as a waveguide resonator to a certain extent. The electric field and magnetic field energy are stored inside the cavity, and the power is consumed on the metal wall of the cavity and in the medium filling the cavity. If the cavity resonance falls within the working band of the packaged product, it will seriously affect the working state of the product. The resonant frequency of the SiP module of the embodiment of the present invention is in the Ka band and does not affect the working frequency band.

[0025] In the PoP structure, the lower substrate mainly uses GCPW (Grounded Coplanar Waveguide) transmission lines and BGA arrays (Ball Grid Array) to achieve channel isolation. The lower substrate channels can achieve good spatial isolation through BGA, and the high-frequency signal isolation characteristics are guaranteed by arranging the high-frequency signal in the lower substrate. The simulation results show that the PoP structure can achieve a high isolation characteristic of more than 80dBc.

[0026] The key parts of the SiP module of the embodiment of the present invention are simulated, and the results show that the vertical interconnection structure of the module can achieve good transmission characteristics in the working frequency band; the resonant frequency of the module is in the Ka band, which is much larger than the working frequency band and has no effect on the working frequency band; the BGA isolation of the lower substrate is simulated and verified, and the results show that the isolation is greater than 80dBc, which meets the use requirements.

[0027] The SiP module of the embodiment of the present invention is modeled and simulated as a whole. The results show that the field is confined near the GCPW, and the suppression is more than 40dBc at 0.5mm away from the RF line in the L band, meeting the design requirements. The SiP module of the embodiment of the present invention is modeled and simulated in a field-path collaborative manner. The module simulation results can achieve a gain of 48dB, a standing wave of less than 1.5, and a port isolation that far meets the actual use requirements. The simulation results show that the SiP module can achieve the required transmission characteristics well within the working frequency band.

[0028] The SiP module of the embodiment of the present invention is physically processed and tested using a test fixture. The test results have a high degree of overlap with the simulation results, and the gain difference is within 0.5dB. The test results of the receiving channel are shown in Table 1 below. The receiving gain is greater than 45dB, the channel noise is less than 5dB, and the spurious suppression is greater than 65dBc. Specifically, the gain is greater than 45dB, the noise figure is 5dB, the intermediate frequency flatness is 1.2, the image suppression is greater than 40dBc, the local oscillator leakage level is less than 70dBm, the input P-1 is -3dBm, the output signal spurious is greater than 65dBc, and the standing wave is less than 1.5.

[0029] Table 1 Summary of receiving channel test results

[0030]

[0031] The single-channel frequency conversion SiP module with integrated local oscillator source according to the embodiment of the present invention has the following beneficial effects:

[0032] The present invention integrates a phase-locked link internally, and can generate a local oscillator signal from an input 100MHz reference signal, thereby realizing the integration of a local oscillator source, no longer relying on an external source, and realizing the miniaturization and integration of the module while ensuring the single-channel frequency conversion function.

[0033] The present invention integrates the frequency conversion link and the phase-locked link in the same module based on HTCC packaging and PoP packaging technology, and can reduce the module size to 16×11×4mm while meeting the performance requirements. 3 , which is only 10% of the traditional components. The simulation and test verification results show that the SiP module of the present invention can well realize the L-band down-conversion function, and the spurious suppression is greater than 65dBc, the gain is greater than 45dB, and the channel noise is less than 6dB, which has good engineering application value.

[0034] The present invention realizes the receiving down-conversion function of the radio frequency signal and the phase-locked loop generation function of the local oscillator signal, and has multi-functional characteristics; the structure is based on the board-level stacking process (PoP), and the standard HTCC package is used as the carrier board to realize the multi-functional integrated design, which has the characteristics of low cost and miniaturization; the isolation design designs the frequency conversion link on the lower substrate to achieve good isolation characteristics of different frequency signals. The practicality of the design scheme is verified through design simulation and physical testing.

[0035] The above description is only by way of illustration of certain exemplary embodiments of the present invention. It is undoubted that those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A single-channel frequency conversion SiP module with integrated local oscillator, characterized in that: It includes a ceramic package and an upper substrate and a lower substrate that are supported by the ceramic package. The lower substrate is provided with a frequency conversion link, and the upper substrate is provided with a phase-locked link. The upper substrate and the lower substrate realize signal transmission through a board-level stacking process. The frequency conversion link includes a first amplifier, a digitally controlled attenuator, a first bandpass filter, a mixer, a second bandpass filter, a second amplifier, an attenuator, a third amplifier, and a first low-pass filter; the phase-locked link includes a second low-pass filter, a phase-locked loop, and a fourth amplifier; the input radio frequency signal passes through the first amplifier, the digitally controlled attenuator, and the first bandpass filter, and then is mixed with the local oscillator signal in the mixer to generate an intermediate frequency signal; the intermediate frequency signal passes through the second bandpass filter, the second amplifier, the attenuator, the third amplifier, and the first low-pass filter before being output; the local oscillator signal is generated by the input reference signal passing through the second low-pass filter, the phase-locked loop, and the fourth amplifier in sequence; The first amplifier is used to ensure the RF pre-stage gain of the frequency conversion link; the digitally controlled attenuator is used to ensure the dynamic range of the frequency conversion link and improve the receiving ability of the frequency conversion link for large signals; The first bandpass filter is used to achieve frequency selection, suppress RF images, and suppress low-pass or high-frequency noise outside the working frequency band; the mixer is used to mix the RF signal and the local oscillator signal to generate an intermediate frequency signal; the second bandpass filter is used to suppress the RF and local oscillator leakage signals after mixing and suppress intermodulation; the second amplifier, attenuator and third amplifier are used to generate sufficient link gain, and the attenuator is used to match the standing wave between the second amplifier and the third amplifier; the first low-pass filter is used to suppress high-frequency spurious and suppress intermediate frequency signal harmonics; the second low-pass filter is used to filter out high-frequency noise in space to ensure the quality of the reference signal; the phase-locked loop is used to generate the required local oscillator signal; the fourth amplifier is used to generate the local oscillator driving power to drive the mixer.

2. The single-channel frequency conversion SiP module with integrated local oscillator source as claimed in claim 1, characterized in that: The input RF signal is 0.99~1.13GHz, the generated local oscillator signal is 1.265~1.405GHz, the generated intermediate frequency signal is 275MHz, and the input reference signal is 100MHz.

3. The single-channel frequency conversion SiP module with integrated local oscillator source as claimed in claim 1 or 2, characterized in that: The ceramic package is a standard HTCC tube shell.

4. The single-channel frequency conversion SiP module with integrated local oscillator source as claimed in claim 1 or 2, characterized in that: A vertical interconnection structure is formed between the upper substrate and the lower substrate through BGA solder balls. The vertical interconnection structure is a quasi-coaxial structure and constitutes a circular waveguide resonant cavity.

5. The single-channel frequency conversion SiP module with integrated local oscillator source as claimed in claim 1 or 2, characterized in that: The lower substrate uses GCPW transmission lines and BGA arrays to achieve channel-to-channel isolation.

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