Heat insulation structure for improving heat dissipation efficiency of circuit board

Abstract

The invention discloses a heat insulation structure for improving heat dissipation efficiency of a circuit board. The heat insulation structure comprises the circuit board; the multi-layer composite heat insulation board is arranged at the bottom of the circuit board, is suitable for absorbing heat of the circuit board, and is composed of a low-heat-conductivity layer, a micropore structure layer and a high-reflection film layer, and the low-heat-conductivity layer, the micropore structure layer and the high-reflection film layer are sequentially arranged from top to bottom. The low-heat-conductivity layer, the microporous structure layer and the high-reflection film layer are sequentially arranged from top to bottom; the heat dissipation channel is laid at the bottom of the multi-layer composite heat insulation plate, the heat dissipation channel is filled with a heat dissipation medium, the heat dissipation channel is connected with an external circulating pump, and the circulating pump drives the heat dissipation medium in the heat dissipation channel to circulate so as to be suitable for dissipating heat absorbed by the multi-layer composite heat insulation plate; and the temperature control assembly is arranged on the circuit board, and the temperature control assembly is connected with the circulating pump so as to be suitable for adjusting the working speed of the circulating pump.

Description

Technical Field

[0001] The invention relates to the technical field of circuit boards, and in particular to a heat insulation structure for improving the heat dissipation efficiency of a circuit board. Background Art

[0002] The names of circuit boards include: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum base board, high-frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed (copper etching technology) circuit board, etc.

[0003] Existing circuit boards generally dissipate heat through cooling fans, but after long-term use, dust will adhere to the cooling fans, resulting in poor cooling effect of the cooling fans. If the heat cannot be dissipated in time, the electronic components on the circuit boards may have performance problems or malfunctions. Summary of the invention

[0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, one object of the present invention is to provide a heat insulation structure for improving the heat dissipation efficiency of a circuit board, comprising:

[0005] Circuit boards;

[0006] A multi-layer composite heat insulation board, the multi-layer composite heat insulation board is arranged at the bottom of the circuit board, the multi-layer composite heat insulation board is suitable for absorbing the heat of the circuit board, the multi-layer composite heat insulation board is respectively composed of a low thermal conductivity layer, a microporous structure layer and a high reflective film layer, and the low thermal conductivity layer, the microporous structure layer and the high reflective film layer are arranged in sequence from top to bottom;

[0007] A heat dissipation channel, wherein the heat dissipation channel is laid at the bottom of the multi-layer composite heat insulation board, the heat dissipation channel is filled with a heat dissipation medium, and the heat dissipation channel is connected to an external circulation pump, and the circulation pump drives the heat dissipation medium in the heat dissipation pipeline to circulate, so as to dissipate the heat absorbed by the multi-layer composite heat insulation board;

[0008] A temperature control component is arranged on the circuit board and is connected to the circulation pump so as to be suitable for adjusting the working speed of the circulation pump.

[0009] Preferably, the low thermal conductivity layer is made of silicate fibers, alumina fibers and zirconia fibers through three-dimensional weaving.

[0010] Preferably, the microporous structure layer is made of a mixture of aerogel and nanoporous carbon.

[0011] Preferably, the high-reflection film layer is formed by a polyimide film coated with an aluminum oxide film with a thickness of 0.01 μm to 0.1 μm.

[0012] Preferably, the temperature control component comprises:

[0013] A temperature sensor, wherein the temperature sensor is disposed between the circuit board and the multi-layer composite heat insulation board;

[0014] A controller is arranged on the circuit board, and the controller is electrically connected to the circulation pump and the temperature sensor.

[0015] Preferably, a plurality of ventilation ducts are provided in the multi-layer composite heat insulation board, the plurality of ventilation ducts are staggered in the multi-layer composite heat insulation board, and the plurality of ventilation ducts pass through the side surfaces of the multi-layer composite heat insulation board.

[0016] Preferably, the circuit board and the multi-layer composite heat insulation board are bonded together by heat insulation adhesive.

[0017] Preferably, a metal mesh is provided between the low thermal conductivity layer and the microporous structure layer.

[0018] Preferably, an anti-ultraviolet protective layer is provided on the outer surface of the high-reflection film layer.

[0019] Preferably, the heat dissipation medium is low-viscosity silicone oil or ethylene glycol aqueous solution.

[0020] The above solution of the present invention includes at least the following beneficial effects:

[0021] By combining the low thermal conductivity layer, the microporous structure layer and the high reflective film layer, an efficient thermal insulation barrier is formed, which can not only effectively reduce the transfer of heat to the surrounding environment, but also provide additional heat dissipation channels through the microporous structure layer to enhance the heat dissipation effect; a heat dissipation channel is laid at the bottom of the multi-layer composite insulation board and filled with heat dissipation medium. Through the action of an external circulation pump, the heat dissipation medium circulates in the channel to take away the heat absorbed by the multi-layer composite insulation board and dissipate it to the external environment; a temperature control component is connected to the circulation pump, and by monitoring the working temperature of the circuit board, the working rate of the circulation pump is intelligently adjusted, thereby achieving precise control of the heat dissipation process and ensuring that the circuit board always works within the optimal temperature range.

[0022] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0024] Figure 1 is a schematic diagram of the structure of a circuit board provided in an embodiment of the present invention;

[0025] Figure 2 yes Figure 1 Schematic diagram of the AA cross-section structure.

[0026] Description of Figure Numbers:

[0027] 1. Circuit board, 2. Multi-layer composite heat insulation board, 3. Heat dissipation channel, 4. Heat dissipation medium, 5. Temperature control component, 6. Ventilation duct;

[0028] 201, low thermal conductivity layer, 202, microporous structure layer, 203, high reflection film layer;

[0029] 501. Temperature sensor. 502. Controller.

[0030] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0031] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but are not to be construed as limiting the present invention. All other embodiments obtained by ordinary technicians in the field without creative work based on the embodiments of the present invention are within the scope of protection of the present invention.

[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0036] A heat insulation structure for improving heat dissipation efficiency of a circuit board according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0037] See also Figures 1-2In this embodiment, it includes: a circuit board 1; a multi-layer composite heat insulation board 2, which is arranged at the bottom of the circuit board 1, and the multi-layer composite heat insulation board 2 is suitable for absorbing the heat of the circuit board 1. The multi-layer composite heat insulation board 2 is respectively composed of a low thermal conductivity layer 201, a microporous structure layer 202 and a high reflective film layer 203, and the low thermal conductivity layer 201, the microporous structure layer 202 and the high reflective film layer 203 are arranged from top to bottom in sequence; a heat dissipation channel 3, which is laid at the bottom of the multi-layer composite heat insulation board 2, and the heat dissipation channel 3 is filled with a heat dissipation medium 4, and the heat dissipation channel 3 is connected to an external circulation pump, and the circulation pump drives the heat dissipation medium 4 in the heat dissipation pipeline to circulate, so as to be suitable for dissipating the heat absorbed by the multi-layer composite heat insulation board 2; a temperature control component 5, which is arranged on the circuit board 1, and the temperature control component 5 is connected to the circulation pump The multilayer composite heat insulation board 2 is connected to the microporous structure layer 202 to adjust the working rate of the circulation pump; by combining the low thermal conductivity layer 201, the microporous structure layer 202 and the high reflective film layer 203, an efficient heat insulation barrier is formed, which can not only effectively reduce the heat transfer to the surrounding environment, but also provide an additional heat dissipation channel 3 through the microporous structure layer 202 to enhance the heat dissipation effect; a heat dissipation channel 3 is laid at the bottom of the multilayer composite heat insulation board 2 and filled with a heat dissipation medium 4. Through the action of an external circulation pump, the heat dissipation medium 4 circulates in the channel to take away the heat absorbed by the multilayer composite heat insulation board 2 and dissipate it to the external environment; a temperature control component 5 is set to be connected to the circulation pump, and by monitoring the working temperature of the circuit board 1, the working rate of the circulation pump is intelligently adjusted, thereby realizing precise control of the heat dissipation process and ensuring that the circuit board 1 always works within the optimal temperature range.

[0038] In this embodiment, the low thermal conductivity layer is made of silicate fibers, alumina fibers and zirconia fibers through three-dimensional weaving; the above-mentioned silicate fibers, alumina fibers and zirconia fibers account for 65%, 20% and 15% respectively; silicate fibers have good high temperature resistance and chemical stability. The addition of silicate fibers provides the necessary thermal stability for the low thermal conductivity layer, so that it can maintain structural integrity and thermal conduction efficiency under extreme temperature conditions; alumina fibers bring thermal insulation properties to the low thermal conductivity layer. The thermal conductivity of alumina fibers is relatively low, which helps the low thermal conductivity layer 201 reduce heat loss during operation, thereby improving the overall thermal efficiency. In addition, alumina fibers also have good mechanical strength and corrosion resistance, which allows the low thermal conductivity layer to be used even in harsh environments. Maintain stable performance; zirconia fiber has an extremely high melting point and excellent thermal stability, which enables the low thermal conductivity layer to work at higher temperatures without performance degradation; at the same time, zirconia fiber also has good thermal shock resistance and can maintain structural stability in an environment with rapid temperature changes; and silicate fiber, alumina fiber and zirconia fiber can be woven tightly together through three-dimensional weaving technology to form a uniform and three-dimensional low thermal conductivity layer; three-dimensional weaving technology not only improves the mechanical strength of the material, but also ensures that the low thermal conductivity layer has good thermal conductivity in all directions; this weaving structure enables the low thermal conductivity layer to evenly disperse stress when subjected to mechanical and thermal stress, thereby improving the reliability and durability of the material.

[0039] In this embodiment, the microporous structure layer 202 is made of a mixture of 50% aerogel and 50% nanoporous carbon; aerogel is a porous solid material with extremely low density and high specific surface area, which makes it excellent in heat insulation and sound insulation; the pore structure of aerogel can effectively limit the transfer of heat; and the nanoporous carbon provides additional mechanical strength and thermal management capabilities for the microporous structure layer 202 due to its high specific surface area and good thermal stability; the high thermal conductivity of nanoporous carbon helps to quickly conduct and disperse heat, while the porous structure of aerogel can provide sufficient surface area to promote heat exchange.

[0040] In this embodiment, the high-reflection film layer 203 is composed of a polyimide film coated with an aluminum oxide film with a thickness of 0.01μm to 0.1μm; the polyimide film itself has good mechanical properties and high temperature resistance, while the aluminum oxide film has excellent chemical stability and insulation properties; the polyimide film has extremely high thermal stability and good mechanical strength, and the aluminum oxide film also has good corrosion resistance and wear resistance, which enables the high-reflection film layer 203 to maintain its performance stability even in a high temperature environment.

[0041] In this embodiment, the temperature control component 5 includes: a temperature sensor 501, which is arranged between the circuit board 1 and the multi-layer composite insulation board 2; a controller 502, which is arranged on the circuit board 1, and the controller 502 is electrically connected to the circulation pump and the temperature sensor 501; the temperature sensor 501 is the core part of the temperature control component 5, which is responsible for real-time monitoring of the temperature of the circuit board 1; in order to improve the accuracy of temperature detection, the temperature sensor 501 is carefully placed between the circuit board 1 and the multi-layer composite insulation board 2; the main function of the multi-layer composite insulation board 2 is to isolate the heat generated by the circuit board 1 to prevent the heat from being too fast. It is transmitted to other sensitive components or the external environment, and it also helps the temperature sensor 501 to capture the actual temperature of the circuit board 1 more accurately; the controller 502 analyzes the current temperature state of the circuit board 1 by receiving the real-time temperature data provided by the temperature sensor 501, and according to the preset temperature threshold and control strategy, the controller 502 will decide whether it is necessary to start the circulation pump to adjust the temperature; the controller 502 also has an overheating protection function. Once it detects that the temperature of the circuit board 1 exceeds the safety threshold, the controller 502 will immediately take measures, such as cutting off the power supply or increasing the operating frequency of the cooling pump, to prevent the equipment from being damaged due to overheating.

[0042] In this embodiment, a plurality of ventilation ducts 6 are provided in the multi-layer composite insulation board 2, and the plurality of ventilation ducts 6 are staggered in the multi-layer composite insulation board 2, and the plurality of ventilation ducts 6 pass through the side of the multi-layer composite insulation board 2; the ventilation ducts 6 not only help to adjust the temperature and humidity inside the insulation board, but also reduce the heat conduction effect of the material to a certain extent; the layout of the ventilation ducts 6 in the multi-layer composite insulation board 2 is staggered, which means that they are not simply arranged in parallel, but interspersed with each other in an intricate way; this design can maximize the use of limited space while ensuring that air can flow freely inside the insulation board, thereby improving the overall insulation effect, and the staggered duct layout can also help to disperse pressure, reduce stress concentration caused by temperature changes, and further enhance the structural stability of the multi-layer composite insulation board 2; these ventilation ducts 6 pass through the side of the multi-layer composite insulation board 2; this design allows air to flow in from one side of the insulation board, pass through the internal ventilation ducts 6, and then flow out from the other side; this ventilation method not only helps to quickly dissipate heat, but also forms convection on both sides of the insulation board, further improving the insulation efficiency.

[0043] In this embodiment, the circuit board 1 and the multi-layer composite insulation board 2 are bonded together by thermal insulation glue; the circuit board 1 and the multi-layer composite insulation board 2 form a solid overall structure with good thermal insulation performance; this structure not only improves the heat dissipation efficiency of the circuit board 1, but also enhances the stability and reliability of the entire circuit board 1.

[0044] In this embodiment, a metal mesh is provided between the low thermal conductivity layer 201 and the microporous structure layer 202; the metal mesh is suitable for enhancing the structural integrity and preventing material delamination.

[0045] In this embodiment, an anti-ultraviolet protective layer is provided on the outer surface of the high-reflective film layer 203; the anti-ultraviolet protective layer effectively protects the reflective film from environmental aging.

[0046] In this embodiment, the heat dissipation medium 4 is low-viscosity silicone oil or ethylene glycol aqueous solution; low-viscosity silicone oil has excellent thermal stability and chemical inertness. Due to its low viscosity characteristics, silicone oil can maintain good fluidity even at low temperatures, which makes it very useful in applications that require rapid heat conduction; ethylene glycol is an organic compound with good thermal conductivity and a low freezing point.

[0047] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0048] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A heat insulation structure for improving the heat dissipation efficiency of a circuit board, characterized in that: include: Circuit boards; A multi-layer composite heat insulation board, the multi-layer composite heat insulation board is arranged at the bottom of the circuit board, the multi-layer composite heat insulation board is suitable for absorbing the heat of the circuit board, the multi-layer composite heat insulation board is respectively composed of a low thermal conductivity layer, a microporous structure layer and a high reflective film layer, and the low thermal conductivity layer, the microporous structure layer and the high reflective film layer are arranged in sequence from top to bottom; A heat dissipation channel, wherein the heat dissipation channel is laid at the bottom of the multi-layer composite heat insulation board, the heat dissipation channel is filled with a heat dissipation medium, and the heat dissipation channel is connected to an external circulation pump, and the circulation pump drives the heat dissipation medium in the heat dissipation pipeline to circulate, so as to dissipate the heat absorbed by the multi-layer composite heat insulation board; A temperature control component is arranged on the circuit board and is connected to the circulation pump so as to be suitable for adjusting the working speed of the circulation pump.

2. A heat insulation structure for improving heat dissipation efficiency of a circuit board according to claim 1, characterized in that: The low thermal conductivity layer is made of silicate fiber, alumina fiber and zirconia fiber through three-dimensional weaving.

3. The heat insulation structure for improving heat dissipation efficiency of a circuit board according to claim 1, characterized in that: The microporous structure layer is made of a mixture of aerogel and nanoporous carbon.

4. The heat insulation structure for improving heat dissipation efficiency of a circuit board according to claim 1, characterized in that: The high-reflection film layer is composed of a polyimide film coated with an aluminum oxide film with a thickness of 0.01 μm to 0.1 μm.

5. The heat insulation structure for improving heat dissipation efficiency of a circuit board according to claim 1, characterized in that: The temperature control component comprises: A temperature sensor, wherein the temperature sensor is disposed between the circuit board and the multi-layer composite heat insulation board; A controller is arranged on the circuit board, and the controller is electrically connected to the circulation pump and the temperature sensor.

6. The heat insulation structure for improving heat dissipation efficiency of a circuit board according to claim 1, characterized in that: A plurality of ventilation ducts are arranged in the multi-layer composite heat insulation board. The plurality of ventilation ducts are staggered in the multi-layer composite heat insulation board, and the plurality of ventilation ducts pass through the side surfaces of the multi-layer composite heat insulation board.

7. The heat insulation structure for improving heat dissipation efficiency of a circuit board according to claim 1, characterized in that: The circuit board and the multi-layer composite heat insulation board are bonded together by heat insulation adhesive.

8. The heat insulation structure for improving heat dissipation efficiency of a circuit board according to claim 1, characterized in that: A metal mesh is provided between the low thermal conductivity layer and the microporous structure layer.

9. The heat insulation structure for improving heat dissipation efficiency of a circuit board according to claim 1, characterized in that: The outer surface of the high-reflection film layer is provided with an anti-ultraviolet protective layer.

10. The heat insulation structure for improving heat dissipation efficiency of a circuit board according to claim 1, characterized in that: The heat dissipation medium is low-viscosity silicone oil or ethylene glycol aqueous solution.

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