Auxiliary device and system for batch tinning of SMD packaging braid packaging

Abstract

The invention discloses an auxiliary device and system for batch tinning of SMD packaging braid packaging. Comprising an adapter, one side of which is provided with a first positioning part; a second positioning part matched with the first positioning part is arranged on one side of the auxiliary part; the second positioning part and the first positioning part abut against the bottom and the top of the SMD packaging braid package respectively. The fixing piece is provided with an SMD fixing part, and the SMD fixing part and the first positioning part abut against the top and the bottom of the SMD respectively; the adapter is detachably connected with the auxiliary part or the fixing part. The SMD packaging braid is fixed in the fixed cavity formed by the first positioning part and the second positioning part through the connection of the adapter and the auxiliary part; the fixing part is provided with the SMD fixing part, so that fixing of the SMD packaging braid package is achieved, the components are exposed outside, and batch tinning of the components on the SMD packaging braid package is achieved through connection of the fixing part and the adapter.

Description

Technical Field

[0001] The invention relates to the technical field of electronic component tinning, and in particular to an SMD package braiding packaging batch tinning auxiliary device and system. Background Art

[0002] SMD is a surface mount device. Electronic packaging is achieved by attaching components to the surface of the PCB through patch technology. The emergence of SMD has greatly improved the integration of electronic products, making electronic equipment thinner, more beautiful and more efficient. At present, SMD technology has been widely used in aviation, aerospace, weapons and equipment, household appliances and other fields. In the production process of electronic products, axial plug-in components are required to be tinned before installation. When the SMD package tape is tinned, due to the large number of components, they need to be placed one by one by hand, that is, the operator holds the components in the tin pot and tinsels them one by one. This method mainly has the following problems: manual operation is inefficient and is not suitable for large-scale gold removal and tinning operations. Summary of the invention

[0003] In view of this, according to one aspect of the present application, a batch tinning auxiliary device for SMD package tape packaging is provided to solve the problem of low operating efficiency in the above-mentioned prior art SMD package tape packaging due to the need to manually place the tin during tinning. The specific solution is:

[0004] An SMD package tape packaging batch tinning auxiliary device, the tinning auxiliary device comprising:

[0005] The adapter has a first positioning portion disposed on one side;

[0006] The auxiliary part is provided with a second positioning part matching the first positioning part on one side facing the adapter; the second positioning part is located below the first positioning part, and is pressed against the bottom and top of the SMD package tape package together with the first positioning part, respectively, to fix the SMD package tape package;

[0007] The fixing member is provided with an SMD fixing portion, the SMD fixing portion is located above the first positioning portion, and is respectively pressed against the top and bottom of the SMD package taping package to fix the SMD package taping package;

[0008] The adapter is detachably connected to the auxiliary component or the fixing component, respectively, and the adapter and the auxiliary component are detachably connected to form a positioning mechanism for the SMD packaging tape;

[0009] The adapter is connected to the fixing member to form a fixing mechanism for SMD packaging tape packaging.

[0010] Preferably, the first positioning portion and the second positioning portion are respectively in the form of a matching mounting boss and a concave mounting cavity;

[0011] The mounting boss is mounted on the adapter, and a plurality of positioning protrusions are evenly arranged on a side of the mounting boss facing away from the adapter;

[0012] The concave installation cavity is installed on the auxiliary component, and the cavity body of the concave installation cavity is correspondingly provided with a plurality of positioning grooves matching the positioning protrusions;

[0013] The positioning protrusion and the positioning groove are respectively arranged along the extension direction of the mounting boss and the concave mounting cavity.

[0014] Preferably, the positioning protrusion and the positioning groove match the size and shape of the SMD tape package respectively.

[0015] Preferably, the positioning protrusion and the positioning groove are respectively provided with a first positioning countersunk hole and a second positioning countersunk hole corresponding to the components located on the SMD tape packaging;

[0016] The hole spacing between the adjacent first positioning countersunk holes and the adjacent second positioning countersunk holes is the same as the spacing between two adjacent components on the SMD tape package;

[0017] The sizes of the first positioning countersunk hole and the second positioning countersunk hole match the components on the SMD tape packaging.

[0018] Preferably, the side walls of the concave installation cavity are respectively provided with penetration holes and separation grooves for SMD tape packaging;

[0019] The penetration holes and the separation grooves are arranged in one-to-one correspondence and are respectively located at the ends of the positioning grooves. The penetration holes are perpendicular to the side walls of the concave installation cavity and penetrate the side walls of the concave installation cavity. The two ends of the penetration holes are respectively connected to the outside and the concave installation cavity.

[0020] The separation groove is arranged along the vertical direction of the side wall of the concave installation cavity, the separation groove is parallel to the side wall of the concave installation cavity, the top end of the separation groove is located outside the concave installation cavity, and the bottom end of the separation groove is respectively connected to the positioning groove and the penetration hole.

[0021] Preferably, a first connecting component is provided between the adapter and the auxiliary component, and a second connecting component is provided between the adapter and the fixing component;

[0022] The first connecting component and the second connecting component are respectively located at four corners of the auxiliary component, the adapter component and the fixing component, and the first connecting component and the second connecting component are partially shared;

[0023] The first connecting component is respectively connected to the adapter and the auxiliary component, and the second connecting component is respectively connected to the adapter and the fixing component.

[0024] Preferably, the first connecting assembly includes positioning pins arranged at four corners of the auxiliary member and positioning holes arranged at four corners of the adapter member;

[0025] The second connecting component includes positioning holes provided at four corners of the adapter and fixing pins provided at four corners of the fixing component, which are common to the first connecting component;

[0026] The positioning pin is installed on a side of the auxiliary component facing the adapter;

[0027] The fixing pin is installed on a side of the fixing member facing the adapter;

[0028] The fixing pin or the positioning pin is detachably connected to the positioning hole.

[0029] Preferably, the fixing member is a hollow structure as a whole;

[0030] The connector in the hollow structure constitutes the fixing part of the SMD, which is pressed on the edge of the SMD package tape package. The hollow part corresponds to the positioning protrusion, so that the components on the SMD package tape package are exposed, which is convenient for tinning.

[0031] According to another aspect of the present application, a SMD package taping packaging batch tinning auxiliary system is provided to realize the control process of the entire auxiliary device, and the auxiliary system includes:

[0032] A monitoring module is placed above the tinning auxiliary device to monitor the specific position of the SMD packaging tape in the auxiliary component;

[0033] Auxiliary modules, including SMD package taping packaging film removal unit, SMD package taping packaging laying unit and flip unit;

[0034] The SMD packaging tape packaging film removal unit and the SMD packaging tape packaging laying unit are respectively placed at two opposite ends of the auxiliary component;

[0035] The flip unit is placed on one side of the auxiliary component or the adapter;

[0036] The control module is respectively connected to the monitoring module, the SMD package tape packaging film removal unit, the SMD package tape packaging laying unit and the flipping unit.

[0037] Preferably, the SMD package tape packaging film removal unit and the SMD package tape packaging laying unit are respectively installed on the outside of the auxiliary component;

[0038] The SMD package tape packaging film removal unit includes a first bracket and a first fixing device; the first bracket is installed at the starting end of the SMD package tape packaging, and the first bracket can be lifted and lowered in the vertical direction; the first fixing device is installed on the top of the first bracket;

[0039] The SMD packaging tape packaging laying unit comprises a second bracket and a second fixing device; the second bracket is installed at the end of the SMD packaging tape, and the second bracket can be lifted and lowered in the vertical direction and extended and retracted in the longitudinal direction of the auxiliary component; the second fixing device is installed on the top of the second bracket;

[0040] The flip unit includes a third bracket and a clamping mechanism, wherein the third bracket is installed outside one side of the auxiliary component, and the third bracket can be lifted and lowered in the vertical direction, and rotated around the horizontal plane and the vertical plane; the clamping mechanism is installed at the movable end of the third bracket;

[0041] The first fixing device and the second fixing device are respectively vacuum adsorption devices;

[0042] The controller of the first fixing device, the controller of the second fixing device, the controller of the first bracket, the controller of the second bracket, the controller of the clamping device and the controller of the third bracket are respectively connected to the control module.

[0043] Compared with the prior art, the beneficial effects of this application are:

[0044] The present application provides a first positioning portion on one side of the adapter, and a second positioning portion adapted to the first positioning portion is correspondingly provided on the side of the auxiliary member facing the adapter. By connecting the adapter and the auxiliary member, the SMD package tape package is fixed in the fixing cavity formed by the first positioning portion and the second positioning portion; an SMD fixing portion is provided on the fixing member to fix the SMD package tape package, and the components on the SMD package tape package are exposed outside. By connecting the fixing member and the adapter, the overall structure formed by the connection of the fixing member and the adapter is placed in a tin pot to implement batch tinning of the components on the SMD package tape package, thereby solving the problem of low operating efficiency in the prior art due to the need to manually place the tin when tinning the SMD package tape package.

[0045] The SMD packaging tape packaging film removal unit in the auxiliary system of the present application is used to remove the plastic film on the SMD packaging tape packaging, and the SMD packaging tape packaging laying unit is used to lay the SMD packaging tape packaging after the plastic film is removed in the positioning groove. The flipping unit is used to realize the clamping of the adapter, the overall flipping of the auxiliary part and the adapter, and the clamping of the adapter and the fixing part, so as to realize the entire control process of the auxiliary device. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 It is a schematic diagram of the installation of auxiliary parts and adapters in this application;

[0047] Figure 2 It is a schematic diagram of the installation of the fixing parts and the adapter parts in this application;

[0048] Figure 3 is a cross-sectional schematic diagram of the auxiliary component in the first embodiment of the present application;

[0049] Figure 4 is a top view of the adapter in the first embodiment of the present application;

[0050] Figure 5 is a front view of the adapter in the first embodiment of the present application;

[0051] Figure 6 is a side view of the adapter in the first embodiment of the present application;

[0052] Figure 7 is a top view of the fixing member in the first embodiment of the present application;

[0053] Figure 8 is a front view of the fixing member in the first embodiment of the present application;

[0054] Fig. 9 is a front view of the fixing member in the second embodiment of the present application;

[0055] In the figure: 1. auxiliary part; 2. adapter; 3. fixing part; 4. locking nut; 5. insertion hole; 6. component; 7. mounting boss; 8. separation groove; 9. mounting cavity; 10. positioning groove; 11. first positioning countersunk hole; 12. second positioning countersunk hole; 13. positioning protrusion; 14. positioning hole; 15. frame body; 16. three crimping rods; 17. fixing pin; 18. second connecting plate; 19. second lifting rod; 20. horizontal telescopic rod; 21. second fixing device; 22. third bracket; 23. first lifting rod; 24. first fixing device; 25. first connecting plate. DETAILED DESCRIPTION

[0056] According to the attached Figure 1-2 A batch tinning auxiliary device for SMD package taping packaging is provided, and the tinning auxiliary device comprises:

[0057] The adapter has a first positioning portion disposed on one side;

[0058] The auxiliary part is provided with a second positioning part matching the first positioning part on one side facing the adapter; the second positioning part is located below the first positioning part, and is pressed against the bottom and top of the SMD package tape package together with the first positioning part, respectively, to fix the SMD package tape package;

[0059] The fixing member is provided with an SMD fixing portion, the SMD fixing portion is located above the first positioning portion, and is respectively pressed against the top and bottom of the SMD package braid package to fix the SMD;

[0060] The adapter is detachably connected to the auxiliary part or the fixing part respectively, and the adapter and the auxiliary part are detachably connected to form a positioning mechanism for the SMD package taping package, and the adapter and the fixing part are connected to form a fixing mechanism for the SMD package taping package.

[0061] It should be noted that:

[0062] In the present application, when the adapter is connected to the auxiliary part, the auxiliary part is located at the bottom of the adapter, at which time the first positioning portion of the adapter is located below the adapter, the first positioning portion is located above the second positioning portion, the first positioning portion and the second positioning portion are respectively pressed on the upper and lower sides of the SMD package tape package, the adapter is installed on the top of the auxiliary part, and then reversed 180° so that the first positioning portion of the adapter faces upward, and then the auxiliary part is removed so that the SMD package tape package is independently placed on the first positioning portion, and the SMD pad is exposed;

[0063] Then install the fixing piece on the top of the adapter so that the fixing part of the fixing piece is pressed against the periphery of the SMD package taping package, so that the components of the SMD package taping package are exposed to facilitate tinning;

[0064] After the adapter is connected to the auxiliary component, or the adapter is connected to the fixing component, the whole structure is a box-type structure.

[0065] Furthermore, the first positioning portion and the second positioning portion are respectively formed as a matching mounting boss and a concave mounting cavity;

[0066] The mounting boss is mounted on the adapter, and a plurality of positioning protrusions are evenly arranged on a side of the mounting boss facing away from the adapter;

[0067] The concave installation cavity is installed on the auxiliary component, and the cavity body of the concave installation cavity is correspondingly provided with a plurality of positioning grooves matching the positioning protrusions;

[0068] The positioning protrusion and the positioning groove are respectively arranged along the extension direction of the mounting boss and the concave mounting cavity.

[0069] After the adapter is connected to the auxiliary component, the mounting boss is inserted into the concave mounting cavity, and at this time, the adapter is flush with the auxiliary component.

[0070] Furthermore, the positioning protrusion and the positioning groove are matched with the size and shape of the SMD tape package respectively.

[0071] Furthermore, the positioning protrusion and the positioning groove are respectively provided with a first positioning countersunk hole and a second positioning countersunk hole corresponding to the components located on the SMD tape packaging;

[0072] The hole spacing between the adjacent first positioning countersunk holes and the adjacent second positioning countersunk holes is the same as the spacing between two adjacent components on the SMD tape package;

[0073] The sizes of the first positioning countersunk hole and the second positioning countersunk hole match the components on the SMD tape packaging, so as to accurately position the components.

[0074] It should be noted that:

[0075] In the present application, the positioning protrusion and the mounting boss are respectively formed integrally with the adapter;

[0076] The plurality of positioning protrusions are parallel to each other and are respectively arranged along the extension direction of the adapter;

[0077] The plurality of positioning grooves are parallel to each other and are respectively arranged along the extension direction of the auxiliary member in a strip shape;

[0078] The positioning protrusion and the positioning groove are matched with the size and shape of the SMD tape package respectively, so as to facilitate fixing the SMD tape package.

[0079] Furthermore, the side walls of the concave installation cavity are respectively provided with penetration holes and separation grooves for SMD tape packaging;

[0080] The penetration holes and the separation grooves are arranged in one-to-one correspondence and are respectively located at the ends of the positioning grooves. The penetration holes are perpendicular to the side walls of the concave installation cavity and penetrate the side walls of the concave installation cavity. The two ends of the penetration holes are respectively connected to the outside and the concave installation cavity.

[0081] The separation groove is arranged along the vertical direction of the side wall of the concave installation cavity, the separation groove is parallel to the side wall of the concave installation cavity, the top end of the separation groove is located outside the concave installation cavity, and the bottom end of the separation groove is respectively connected to the positioning groove and the penetration hole.

[0082] It should be noted that:

[0083] In the present application, an SMD tape package insertion hole is provided on one side of the concave mounting cavity. The plastic film of the SMD tape package is torn open by about 1 cm, the tape is inserted into the SMD tape package insertion hole, and the plastic film extends outward from the top of the separation groove. The SMD tape package is gently pulled toward the other end along the corresponding positioning groove, so that the SMD tape package and the plastic film can be quickly separated.

[0084] Furthermore, a first connecting component is provided between the adapter and the auxiliary component, and a second connecting component is provided between the adapter and the fixing component;

[0085] The first connecting component and the second connecting component are respectively located at four corners of the auxiliary component, the adapter component and the fixing component, and the first connecting component and the second connecting component are partially shared;

[0086] The first connecting component is respectively connected to the adapter and the auxiliary component, and the second connecting component is respectively connected to the adapter and the fixing component.

[0087] Further, the first connecting assembly includes positioning pins arranged at four corners of the auxiliary component and positioning holes arranged at four corners of the adapter component;

[0088] The second connecting component includes positioning holes provided at four corners of the adapter and fixing pins provided at four corners of the fixing component, which are common to the first connecting component;

[0089] The positioning pin is installed on a side of the auxiliary component facing the adapter;

[0090] The fixing pin is installed on a side of the fixing member facing the adapter;

[0091] The fixing pin or the positioning pin is detachably connected to the positioning hole.

[0092] It should be noted that:

[0093] In the present application, the positioning pin and the fixing pin are respectively threadedly connected to the positioning hole, and are both configured with locking nuts.

[0094] Furthermore, the fixing member is a hollow structure as a whole;

[0095] The connector in the hollow structure constitutes the fixing part of the SMD, which is pressed on the edge of the SMD package tape package. The hollow part corresponds to the positioning protrusion, so that the components on the SMD package tape package are exposed, which is convenient for tinning.

[0096] Furthermore, the connecting parts between the adapter and the auxiliary are both chamfered.

[0097] Furthermore, the surfaces of the auxiliary component, the adapter and the fixing component are all hard anodized.

[0098] Furthermore, the present application provides an SMD packaging tape packaging batch tinning auxiliary system to realize the control process of the entire auxiliary device, and the auxiliary system includes:

[0099] A monitoring module is placed above the tinning auxiliary device to monitor the specific position of the SMD packaging tape in the auxiliary component;

[0100] Auxiliary modules, including SMD package taping packaging film removal unit, SMD package taping packaging laying unit and flip unit;

[0101] The SMD packaging tape packaging film removal unit and the SMD packaging tape packaging laying unit are respectively placed at two opposite ends of the auxiliary component;

[0102] The flip unit is placed on one side of the auxiliary component or the adapter;

[0103] The control module is respectively connected to the monitoring module, the SMD package tape packaging film removal unit, the SMD package tape packaging laying unit and the flipping unit.

[0104] Further, the SMD package tape packaging film removal unit and the SMD package tape packaging laying unit are respectively installed on the outside of the auxiliary component;

[0105] The SMD package tape packaging film removal unit includes a first bracket and a first fixing device; the first bracket is installed at the starting end of the SMD package tape packaging, and the first bracket can be lifted and lowered in the vertical direction; the first fixing device is installed on the top of the first bracket;

[0106] The SMD packaging tape packaging laying unit comprises a second bracket and a second fixing device; the second bracket is installed at the end of the SMD packaging tape, and the second bracket can be lifted and lowered in the vertical direction and extended and retracted in the longitudinal direction of the auxiliary component; the second fixing device is installed on the top of the second bracket;

[0107] The flip unit includes a third bracket and a clamping mechanism, wherein the third bracket is installed outside one side of the auxiliary component, and the third bracket can be lifted and lowered in the vertical direction, and rotated around the horizontal plane and the vertical plane; the clamping mechanism is installed at the movable end of the third bracket;

[0108] The first fixing device and the second fixing device are respectively vacuum adsorption devices;

[0109] The controller of the first fixing device, the controller of the second fixing device, the controller of the first bracket, the controller of the second bracket, the controller of the clamping device and the controller of the third bracket are respectively connected to the control module.

[0110] It should be noted that:

[0111] In the present application, the SMD package tape packaging film removal unit is located at one end (i.e., the starting end) of the positioning groove where the SMD package tape packaging is inserted, and the SMD package tape packaging laying unit is located at the other end (i.e., the end) of the same positioning groove. When the SMD tape packaging with a torn plastic film opening is inserted through the SMD tape packaging insertion hole, the control module controls the first bracket and the second bracket to move simultaneously, so that the first fixing device is located at the top of the separation groove to adsorb the end of the torn plastic film; the second fixing device is located at the top of the torn SMD tape packaging with an opening of the plastic film to synchronously adsorb the end of the torn SMD tape packaging; then the control module controls the first bracket and the second bracket to cause the first fixing device to drive the adsorbed plastic film upward, and the second fixing device to drive the torn SMD tape packaging toward the end of the positioning groove, thereby realizing the demolding process of the SMD tape packaging;

[0112] When the second bracket is pulling and laying the SMD tape package toward the end of the positioning groove, the monitoring module monitors the entire process. When the monitoring module detects that the distance between the SMD tape package and the end of the positioning groove is 0, the monitoring module feeds back to the control module, and the control module controls the third bracket accordingly to clamp the adapter.

[0113] The adapter is flipped so that the mounting boss of the adapter faces downward, and the adapter is buckled on the top of the auxiliary component. After the positioning pins are fixed in the corresponding positioning holes, the adapter and the auxiliary component are connected manually.

[0114] The control button is used to control the flipping of the clamping mechanism so that the auxiliary part is located on the top of the adapter. The auxiliary part is then removed manually, and the fixing part is installed on the top of the adapter accordingly. The connection axis between the fixing part and the auxiliary part is fed back to the control module through the control button. The control module clamps the installed fixing part and auxiliary part and places them in the tin pot for tinning. After the tinning is completed, they are clamped out for subsequent processes.

[0115] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0116] Embodiment 1

[0117] See also Figure 3-8 This embodiment provides an SMD package tape packaging batch tin-plating auxiliary device, and the batch tin-plating auxiliary device is a "box" type structure formed by a detachable connection between an auxiliary part and a transition part, or a detachable connection between a transition part and a fixing part.

[0118] In this embodiment, the adapter, the auxiliary component and the fixing component are all plate-shaped structures.

[0119] The opposite sides of the auxiliary component 1 and the adapter 2 are respectively an open concave structure and a convex structure, specifically: an open concave installation cavity 9 is provided on the top of the auxiliary component to form a rectangular concave surface, and a rectangular installation boss 7 is provided on one side of the adapter 2, that is, the side facing the auxiliary component is a "convex" structure. During installation, the auxiliary component 1 is located below the adapter 2, the concave surface of the auxiliary component 1 faces upward, and the installation boss of the adapter 2 faces and is inserted into the concave installation cavity, so that the adapter 2 is installed flatly on the top of the auxiliary component 1.

[0120] In this embodiment, a plurality of penetration holes 5 for SMD tape packaging are vertically arranged on the side wall of the installation cavity 9. The penetration holes 5 are respectively located at the two ends of each positioning groove 10 and are respectively connected with the positioning groove 10 and the outside. The penetration holes 5 are used to penetrate the SMD tape packaging with plastic sealing film.

[0121] A plurality of separation grooves 8 are vertically arranged on the side wall of the installation cavity 9. The separation grooves 8 are arranged corresponding to the penetration holes 5. The separation grooves 8 are parallel to the cavity wall of the installation cavity 9. One end of the separation groove 8 is respectively connected to the positioning groove 10 and the penetration hole 5, and the other end of the separation groove 8 is connected to the outside.

[0122] Tear the plastic sealing film of the SMD tape package about 1 cm, and extend the tape into the installation cavity from the insertion hole of the SMD tape package. At this time, the SMD tape package with the plastic sealing film is located at one end of the positioning groove 10. Extend the plastic sealing film from the upper edge of the separation groove 8, gently pull the tape package, pull the plastic sealing film out of the separation groove 8, and pull the SMD tape package toward one end of the corresponding positioning groove 10, so that the SMD tape package is placed in the corresponding positioning groove 10, so as to achieve rapid separation of the SMD tape package and the plastic sealing film.

[0123] In this embodiment, the mounting boss 7 is provided with a SMD tape packaging positioning cavity on one side opposite to the mounting cavity 9; the SMD tape packaging positioning cavity includes a positioning protrusion and a positioning groove;

[0124] The positioning protrusion 13 and the positioning groove 10 are used to load the completely separated SMD tape package into the positioning cavity formed by the positioning protrusion and the positioning groove respectively;

[0125] Among them, there are 4 positioning protrusions and 4 positioning grooves respectively;

[0126] Four parallel positioning grooves 10 are evenly arranged at the bottom of the installation cavity 9, and 24 first positioning countersunk holes 11 are evenly arranged in the positioning grooves 10, so that 24 components can be installed; when the SMD tape package is loaded into the installation cavity of the auxiliary component, the 24 components on the SMD tape package are respectively located in the 24 first positioning countersunk holes 11;

[0127] The mounting boss 7 of the adapter 2 is evenly provided with four parallel positioning protrusions 13, and each positioning protrusion 13 is evenly provided with 24 second positioning countersunk holes 12 corresponding to the first positioning countersunk holes 11;

[0128] Pass the positioning pin of the auxiliary component 1 through the positioning hole 14 of the adapter 2, and then install the adapter 2 on the side of the auxiliary component 1 provided with the installation cavity 9 through the locking nut 4. At this time, the installation boss 7 faces the installation cavity 9 (that is, the "convex" is downward), and the auxiliary component 1 and the adapter 2 are turned over 180° as a whole, so that the "convex" of the adapter 2 is upward. After removing the auxiliary component 1, the SMD tape packaging is independently placed on the positioning boss 13 of the adapter 2, so that the SMD pad is exposed;

[0129] When the fixing part 3 and the adapter 2 are detachably connected, the "convex" part of the adapter 2 faces upward, the fixing part 3 is placed above the "convex" part of the adapter 2, the fixing pin 17 set on the fixing part 3 is passed through the positioning hole 14 on the adapter, and the fixing part 3 and the adapter 2 are fixed by the locking nut 4. Since the fixing part 3 is a hollow structure, the SMD pad is kept exposed. At this time, the fixing part 3 and the adapter 2 installed together are placed in the tin pot as a whole to carry out tinning of each component 6.

[0130] In this embodiment, the fixing member 3 includes a frame body 15 and three crimping rods 16;

[0131] Three crimping rods 16 are arranged along the extension direction of the fixing member 3, the three crimping rods are parallel to each other and arranged at intervals, and the two ends of the three crimping rods 16 are respectively connected to the two ends of the frame body 15. The three crimping rods 16 form the fixing part of the SMD, and the three crimping rods 16 divide the fixing member into four hollow parts corresponding to the positioning protrusions;

[0132] The frame body 15 matches the plane dimensions of the adapter 2, and the crimping rod is respectively located between two adjacent positioning protrusions, and the width of the crimping rod is smaller than the spacing between two adjacent components located on two adjacent positioning protrusions, so that the crimping rod can be pressed on the edge of the SMD tape package located in the two adjacent positioning protrusions, and the components on the SMD tape package can be exposed for tinning, and the two ends of the crimping rod are respectively connected to the opposite sides of the frame body.

[0133] In this embodiment, the side edges at the four corners of the auxiliary component 1 and the side edges at the corners of the adapter 2 are respectively rounded to facilitate the disassembly of the auxiliary component 1 and the adapter 2.

[0134] In this embodiment, the structure of the fixing member 3 is a flat plate structure. The fixing member 3 is set to a hollow structure, which can expose the SMD pad to facilitate tinning and reduce the weight at the same time.

[0135] The practical process of this device is:

[0136] Before tinning, tear off the plastic film of the SMD tape packaging by about 1 cm, then insert the tape packaging into the hole on the side of the auxiliary part 1, and the plastic film extends from the upper edge of the side. Gently pull the tape packaging to separate the remaining plastic film. After complete separation, assemble them one by one according to the countersunk holes on the bottom of the auxiliary part 1 and the tape packaging components; the adapter 2 is "convex" downward, and is positioned and installed through the positioning holes of the adapter 2 and the positioning pins of the auxiliary part 1. After the auxiliary part 1 and the adapter 2 are installed flat, rotate the overall structure 180° so that the "convex" of the adapter 2 is upward, and hold the side of the auxiliary part 1 vertically. Apply force straight upward to remove the auxiliary part 1, so that the SMD is placed independently in the groove of the adapter 2, with the SMD pad exposed, and check whether the device is placed stably; use the threaded positioning pin of the fixing part 3 and the positioning hole of the adapter 2 for positioning and installation, use the locking nut 4 to fix the fixing part 3 and the adapter 2, and check whether the crimping rod of the fixing part 3 covers the SMD pad. After the inspection is completed, put the overall structure into the tin pot for tinning, loosen the locking nut 4 after the solder cools down, separate the fixing part 3 and the adapter 2, and take out the SMD, thereby achieving the purpose of efficient SMD tinning.

[0137] Embodiment 2

[0138] Please refer to the attached Fig. 9 This embodiment provides a SMD package taping packaging batch tinning auxiliary system, including:

[0139] A monitoring module is placed above the tinning auxiliary device to monitor the specific position of the SMD package tape in the auxiliary component; in this embodiment, the monitoring module is an image collector to collect the gap between the moving end of the SMD package tape package and the end face of the positioning groove in the auxiliary component. When the gap between the two is 0, the SMD package tape package is completely laid into the positioning groove;

[0140] Auxiliary modules, including SMD package taping packaging film removal unit, SMD package taping packaging laying unit and flip unit;

[0141] The SMD packaging tape packaging film removal unit and the SMD packaging tape packaging laying unit are respectively placed at two opposite ends of the auxiliary component;

[0142] The SMD package tape packaging film removal unit and the SMD package tape packaging laying unit are respectively installed on the outside of the auxiliary component;

[0143] The SMD package tape packaging film removal unit includes a first bracket and a first fixing device; the first bracket is installed at the starting end of the SMD package tape packaging, and the first bracket can be lifted and lowered in the vertical direction; the first fixing device is installed on the top of the first bracket;

[0144] The SMD packaging tape packaging laying unit comprises a second bracket and a second fixing device; the second bracket is installed at the end of the SMD packaging tape, and the second bracket can be lifted and lowered in the vertical direction and extended and retracted in the longitudinal direction of the auxiliary component; the second fixing device is installed on the top of the second bracket;

[0145] The flip unit is placed on one side of the auxiliary component or the adapter;

[0146] The flip unit includes a third bracket and a clamping mechanism, wherein the third bracket is installed outside one side of the auxiliary component, and the third bracket can be lifted and lowered in the vertical direction, and rotated around the horizontal plane and the vertical plane; the clamping mechanism is installed at the movable end of the third bracket;

[0147] In this embodiment, the first bracket includes a first lifting rod 23, and the first lifting rod 23 includes but is not limited to a hydraulic or electric telescopic rod;

[0148] The top end of the first lifting rod 23 is connected to a first connecting plate 25. In this embodiment, the first connecting plate 25 is in a T-shaped structure, and the vertical beam of the T-shaped structure is connected to the telescopic end of the first lifting rod 23; the first fixing devices 24 are respectively installed on the horizontal beams of the T-shaped structure;

[0149] In this embodiment, the second bracket is a two-axis telescopic mechanism that is telescopic in the vertical and horizontal directions. The second bracket includes a second lifting rod 19, a horizontal telescopic rod 20, and a second connecting plate 18 arranged on the horizontal telescopic rod 20; the horizontal telescopic rod 20 is perpendicular to the second lifting rod 19, one end of the horizontal telescopic rod 20 is connected to the lifting end of the second lifting rod 19, and the other end of the horizontal telescopic rod 20 faces the first lifting rod 23, and the second lifting rod 19 and the first lifting rod 23 are respectively installed at opposite ends of the auxiliary component; the second connecting plate 18 is vertically connected to the horizontal telescopic rod 20; the second fixing devices 21 are respectively installed on the second connecting plate 18;

[0150] In this embodiment, the number of the first fixing devices and the second fixing devices matches the number of the positioning slots, wherein the first fixing devices and the second fixing devices are respectively mounted on the telescopic ends of the first bracket and the second bracket through a connecting plate or a connecting rod;

[0151] In this embodiment, the first lifting rod 23, the second lifting rod 19, the first fixing device 24, the second fixing device 21 and the third bracket 22 are respectively automatic control devices.

[0152] In this embodiment, the gripping mechanism is a mechanical gripper, which is commercially available, and the specific specifications / models are: DH electric gripper PGC-50-35;

[0153] In this embodiment, the first fixing device and the second fixing device are electrically controlled vacuum suction cups;

[0154] In this real-time example, the third bracket 22 is a mechanical arm, which is commercially available, and the specific specifications / models are: KF-0111;

[0155] The control module is respectively connected to the controller of the first fixing device, the controller of the second fixing device, the controller of the first bracket, the controller of the second bracket, the controller of the clamping device and the controller of the third bracket; in this embodiment, the control module is a PLC machine.

Claims

1. An auxiliary device for batch tinning of SMD packaging tape packaging, characterized in that: The tinning auxiliary device comprises: The adapter has a first positioning portion disposed on one side; The auxiliary part is provided with a second positioning part matching the first positioning part on one side facing the adapter; the second positioning part is located below the first positioning part, and is pressed against the bottom and top of the SMD package tape package together with the first positioning part, respectively, to fix the SMD package tape package; The fixing member is provided with an SMD fixing portion, the SMD fixing portion is located above the first positioning portion, and is respectively pressed against the top and bottom of the SMD package taping package to fix the SMD package taping package; The adapter is detachably connected to the auxiliary component or the fixing component, and the adapter and the auxiliary component are detachably connected to form a positioning mechanism for SMD packaging tape packaging; The adapter is connected to the fixing member to form a fixing mechanism for SMD packaging tape packaging.

2. The SMD packaging tape packaging batch tinning auxiliary device according to claim 1 is characterized in that: The first positioning portion and the second positioning portion are respectively in the form of a matching mounting boss and a concave mounting cavity; The mounting boss is mounted on the adapter, and a plurality of positioning protrusions are evenly arranged on a side of the mounting boss facing away from the adapter; The concave installation cavity is installed on the auxiliary component, and the cavity body of the concave installation cavity is correspondingly provided with a plurality of positioning grooves matching the positioning protrusions; The positioning protrusion and the positioning groove are respectively arranged along the extension direction of the mounting boss and the concave mounting cavity.

3. The SMD packaging tape packaging batch tinning auxiliary device according to claim 2 is characterized in that: The positioning protrusion and the positioning groove are matched with the size and shape of the SMD tape package respectively.

4. The SMD packaging tape packaging batch tinning auxiliary device according to claim 2 is characterized in that: The positioning protrusion and the positioning groove are respectively provided with a first positioning countersunk hole and a second positioning countersunk hole corresponding to the components located on the SMD tape packaging; The hole spacing between the adjacent first positioning countersunk holes and the adjacent second positioning countersunk holes is the same as the spacing between two adjacent components on the SMD tape package; The sizes of the first positioning countersunk hole and the second positioning countersunk hole match the components on the SMD tape packaging.

5. The SMD packaging tape packaging batch tinning auxiliary device according to claim 2 is characterized in that: The side walls of the concave installation cavity are respectively provided with penetration holes and separation grooves for SMD tape packaging; The penetration holes and the separation grooves are arranged in one-to-one correspondence and are respectively located at the ends of the positioning grooves. The penetration holes are perpendicular to the side walls of the concave installation cavity and penetrate the side walls of the concave installation cavity. The two ends of the penetration holes are respectively connected to the outside and the concave installation cavity. The separation groove is arranged along the vertical direction of the side wall of the concave installation cavity, the separation groove is parallel to the side wall of the concave installation cavity, the top end of the separation groove is located outside the concave installation cavity, and the bottom end of the separation groove is respectively connected to the positioning groove and the penetration hole.

6. The SMD packaging tape packaging batch tinning auxiliary device according to claim 1 is characterized in that: A first connecting component is provided between the adapter and the auxiliary component, and a second connecting component is provided between the adapter and the fixing component; The first connecting component and the second connecting component are respectively located at four corners of the auxiliary component, the adapter component and the fixing component, and the first connecting component and the second connecting component are partially shared; The first connecting component is respectively connected to the adapter and the auxiliary component, and the second connecting component is respectively connected to the adapter and the fixing component.

7. The SMD packaging tape packaging batch tinning auxiliary device according to claim 6 is characterized in that: The first connection assembly includes positioning pins arranged at four corners of the auxiliary member and positioning holes arranged at four corners of the adapter member; The second connecting component includes positioning holes provided at four corners of the adapter and fixing pins provided at four corners of the fixing component, which are common to the first connecting component; The positioning pin is installed on a side of the auxiliary component facing the adapter; The fixing pin is installed on a side of the fixing member facing the adapter; The fixing pin or the positioning pin is detachably connected to the positioning hole.

8. The SMD packaging tape packaging batch tinning auxiliary device according to claim 1 is characterized in that: The fixing member is in a hollow structure as a whole; The connector in the hollow structure constitutes the fixing part of the SMD, which is pressed on the edge of the SMD package tape package. The hollow part corresponds to the positioning protrusion, so that the components on the SMD package tape package are exposed, which is convenient for tinning.

9. An SMD packaging tape packaging batch tinning auxiliary system, characterized in that: The system is applied to an SMD packaging tape packaging batch tinning auxiliary device as described in any one of claims 1 to 8, and the auxiliary system comprises: A monitoring module is placed above the tinning auxiliary device to monitor the specific position of the SMD packaging tape in the auxiliary component; Auxiliary modules, including SMD package taping packaging film removal unit, SMD package taping packaging laying unit and flip unit; The SMD packaging tape packaging film removal unit and the SMD packaging tape packaging laying unit are respectively placed at two opposite ends of the auxiliary component; The flip unit is placed on one side of the auxiliary component or the adapter; The control module is respectively connected to the monitoring module, the SMD package tape packaging film removal unit, the SMD package tape packaging laying unit and the flipping unit.

10. The SMD packaging tape packaging batch tinning auxiliary system according to claim 9, characterized in that: The SMD package tape packaging film removal unit and the SMD package tape packaging laying unit are respectively installed on the outside of the auxiliary component; The SMD package tape packaging film removal unit includes a first bracket and a first fixing device; the first bracket is installed at the starting end of the SMD package tape packaging, and the first bracket can be lifted and lowered in the vertical direction; the first fixing device is installed on the top of the first bracket; The SMD packaging tape packaging laying unit comprises a second bracket and a second fixing device; the second bracket is installed at the end of the SMD packaging tape, and the second bracket can be lifted and lowered in the vertical direction and extended and retracted in the longitudinal direction of the auxiliary component; the second fixing device is installed on the top of the second bracket; The flip unit includes a third bracket and a clamping mechanism, wherein the third bracket is installed outside one side of the auxiliary component, and the third bracket can be lifted and lowered in the vertical direction, and rotated around the horizontal plane and the vertical plane; the clamping mechanism is installed at the movable end of the third bracket; The first fixing device and the second fixing device are respectively vacuum adsorption devices; The controller of the first fixing device, the controller of the second fixing device, the controller of the first bracket, the controller of the second bracket, the controller of the clamping device and the controller of the third bracket are respectively connected to the control module.

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