PCB manufacturing method and PCB

Abstract

The invention discloses a PCB manufacturing method and a PCB. The PCB manufacturing method comprises the steps that at least two core boards are provided; arranging the core plates in the pre-arranging bracket, wherein the arranged core plates and the pre-arranging bracket form a pre-arranging assembly; the pre-arranged assembly is placed in a sealing bag; the sealing bag is vacuumized, so that the liquid resin enters the sealing bag and fills the gap between the core plates; and the sealing bag is put into a pressing machine, and the pre-discharging assembly is pressed. By adopting the scheme provided by the invention, the dielectric thickness of the PCB can be more accurately controlled, and the dielectric thickness of the PCB is more uniform, so that the product performance of the PCB is improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a PCB manufacturing method and a PCB board. Background Art

[0002] PCB boards usually require the core board and the prepreg to be pressed together. During the pressing process, the resin in the prepreg softens after being heated at high temperature to reduce the viscosity, and then flows to fill the empty area. After the core board is etched, the location with a large residual copper rate (copper area / total area) has less resin filling, and the location with a small residual copper rate has more resin filling, which will cause the dielectric thickness to become thinner. When the copper thickness of the core board is thicker (for example, reaching 3OZ), when the residual copper rate is the same, the greater the copper thickness of the core board, the larger the empty volume that needs to be filled with resin, resulting in a thinner dielectric thickness. This may not only lead to a decrease in the uniformity of the dielectric thickness, but also too thin a dielectric thickness will affect the reliability indicators of the PCB finished product, such as impedance, insertion loss, and withstand voltage.

[0003] In the related art, in order to make the dielectric thickness of the PCB more uniform, the method of first applying resin in the gaps of the core board surface pattern, and then vacuuming and curing is usually adopted. However, this solution has at least the following problems: for some closed small-pitch positions, when rolling the resin, the bubbles in the small gaps are easily covered by the resin and are not easy to escape, which will cause voids to form during pressing, affecting reliability. At the same time, when the resin is coated on the surface of the core board, due to the fluidity of the liquid resin, the coating thickness is unstable, which easily causes the dielectric thickness to exceed the tolerance range. Summary of the invention

[0004] In order to solve at least one of the above technical problems, the present application provides a PCB board manufacturing method and a PCB board, which can pre-arrange the core board and facilitate the control of the dielectric thickness of the core board. The technical solution adopted is as follows.

[0005] The PCB board manufacturing method provided in the first aspect of the present application includes:

[0006] providing at least two core panels;

[0007] Arranging the core plates in a pre-arrangement bracket, wherein the arranged core plates and the pre-arrangement bracket form a pre-arrangement assembly;

[0008] placing the pre-row components into a sealed bag;

[0009] Vacuuming the sealing bag to allow the liquid resin to enter the sealing bag and fill the gaps between the core plates;

[0010] The sealed bag is placed in a press and the pre-arranged assembly is pressed.

[0011] In certain embodiments of the first aspect of the present application, the pre-arranged bracket includes a clamping structure and a column, the clamping structure is disposed on the column, and arranging the core plate in the pre-arranged bracket includes:

[0012] placing the core panels into the pre-arranged brackets in a stacking order;

[0013] The position of the clamping structure on the column is adjusted to adjust the gap between the core plates.

[0014] In certain embodiments of the first aspect of the present application, the pre-arranged bracket includes at least one group of columns arranged on two opposite sides of the core board, and a light-transmitting structure is provided in the clamping structure. After adjusting the position of the clamping structure on the column to adjust the gap between the core boards, the PCB board manufacturing method further includes:

[0015] A light emitting device is arranged on the outer side of one of the pillars, and a light sensing device is arranged on the outer side of the other pillar;

[0016] turning on the light emitting device to emit horizontal light;

[0017] The clamping structure on the pillar is adjusted until the light passes through the light-transmitting structures of the clamping structures on the two pillars in sequence to reach the photosensitive device.

[0018] In certain embodiments of the first aspect of the present application, the pre-arrangement bracket further includes a support member, and placing the core panels in the pre-arrangement bracket in a stacking order includes:

[0019] A support member is installed between the two columns, so that two ends of the support member are respectively connected to the two clamping structures on the same layer;

[0020] The core plate is placed on the top surface of the support member.

[0021] In certain embodiments of the first aspect of the present application, after placing the sealed bag into a press and pressing the pre-arranged components, the method for manufacturing the PCB board further includes:

[0022] The pre-arrangement components are milled to remove the pre-arrangement brackets.

[0023] In certain embodiments of the first aspect of the present application, before arranging the core board in the pre-arrangement bracket, the PCB board manufacturing method further includes:

[0024] Coating magnetic inactivation glue on the surface of the pre-arranged stent;

[0025] The pre-arranged support is heated to cure the magnetically inactivated glue.

[0026] In certain embodiments of the first aspect of the present application, after milling the edges of the pre-arranged components to remove the pre-arranged brackets, the PCB manufacturing method further includes:

[0027] placing the pre-arranged support with the edge material of the core plate attached thereto into an alternating magnetic field to melt the magnetically inactivated glue and separate the edge material of the core plate from the pre-arranged support;

[0028] The pre-arranged stent is recovered.

[0029] In certain embodiments of the first aspect of the present application, placing the sealed bag into a press and pressing the pre-arranged components comprises:

[0030] placing the pre-discharge assembly into a cabin pressure press;

[0031] Before laminating the pre-arranged components and / or during laminating the pre-arranged components, the sealing bag is evacuated.

[0032] In certain embodiments of the first aspect of the present application, before placing the pre-arranged components into a sealed bag, the PCB board manufacturing method further includes:

[0033] Providing a protective layer on the top and bottom surfaces of the pre-arrangement assembly;

[0034] After placing the sealed bag into a press and pressing the pre-arranged components, the PCB board manufacturing method further includes:

[0035] The protective layer is removed.

[0036] In a second aspect, the present application further provides a PCB board, which is manufactured by the PCB board manufacturing method provided in the first aspect.

[0037] The embodiments of the present application have at least the following beneficial effects: by using a pre-arrangement bracket to pre-arrange multiple core boards, each layer of core boards can be adjusted to a suitable spacing, so that two adjacent layers of core boards can meet the design requirements of dielectric thickness. By placing the pre-arrangement components in a sealed bag and then evacuating the sealed bag, liquid resin can be drawn into the sealed bag, and the fluidity of the liquid resin can be used to fill the gap between the core boards, thereby achieving the effect of interconnection between two adjacent layers of core boards, and then the sealed bag containing the pre-arrangement components is pressed to obtain a PCB board product. This method can avoid the problem of too thin dielectric thickness in areas with low residual copper rate, and utilize the sealing bag to retain the pre-arranged components after filling with liquid resin, solve the problem of unstable thickness of liquid resin in the preset gap, and avoid excessive dielectric thickness. On the other hand, the free flow of liquid resin between the patterns on the surface of the core board helps to fill the liquid resin to the position with smaller spacing between patterns, solves the problem of voids or pits formed due to lack of resin in the position with smaller spacing, improves the filling effect of resin, and makes the dielectric thickness more uniform after lamination of the core board. The PCB board product can meet the reliability indicators such as dielectric thickness uniformity, impedance, insertion loss, and withstand voltage. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The aspects and advantages described and / or attached in the embodiments of the present application will become apparent and easy to understand in conjunction with the following drawings. It should be noted that the embodiments embodied in the following drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0039] Figure 1 It is a schematic diagram of the flow of resin in the core board during the core board pressing process in the related art;

[0040] Figure 2 A schematic diagram of the core board thickness in the related technology;

[0041] Figure 3 It is a schematic diagram of the effect of rolling resin on the core board in the related art;

[0042] Figure 4 A flow chart of a PCB board manufacturing method provided in an embodiment of the present application;

[0043] Figure 5 A schematic diagram of a core board in step S100 provided in an embodiment of the present application;

[0044] Figure 6 A schematic diagram of a core board in step S200 provided in an embodiment of the present application;

[0045] Figure 7 A top view of a pre-arranged bracket used in the PCB board manufacturing method provided in an embodiment of the present application;

[0046] Figure 8 A schematic structural diagram of a clamping structure of a pre-arranged bracket used in a PCB board manufacturing method provided in an embodiment of the present application;

[0047] Fig. 9 A schematic diagram of a core board in steps S230 to S250 provided in an embodiment of the present application;

[0048] Fig.10 A schematic diagram of a core board in step S210 provided in an embodiment of the present application;

[0049] Fig.11 A schematic diagram of a core board in step S400 provided in an embodiment of the present application;

[0050] Fig.12 A schematic diagram of a core board in step S500 provided in an embodiment of the present application;

[0051] Fig.13 A schematic diagram of a core board provided in an embodiment of the present application before step S600 is performed;

[0052] Fig.14 A schematic diagram of the structure of a PCB board provided in an embodiment of the present application;

[0053] Fig.15 A schematic diagram of the pre-arranged bracket in step S600 provided in an embodiment of the present application;

[0054] Fig.16 A schematic diagram of the pre-arranged bracket provided in an embodiment of the present application after completing step S700.

[0055] Reference numerals: 100, pre-arranged components; 10, core board; 11, metal pattern; 12, protective layer; 13, prepreg;

[0056] 20. Pre-arrangement bracket; 21. Column; 22. Clamping structure; 221. Light-transmitting structure; 222. Mounting slot; 231. Light-emitting device; 232. Photosensitive device; 24. Base; 25. Support; 30. Sealing bag; 31. Liquid suction port; 311. Electric valve; 32. First vacuum port; 33. Vacuuming equipment; 34. Buffer device; 40. Liquid resin; 41. Liquid storage tank; 51. Liquid level measuring instrument; 52. Controller; 60. Press; 61. Pressure pump; 62. Heating device; 63. Vacuuming device; 200. PCB board. DETAILED DESCRIPTION

[0057] Combine the following Figures 1 to 16Embodiments of the present application are described in detail, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0058] In the description of the present application, it should be understood that if the terms "center", "middle", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, "multiple" means two or more.

[0059] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0060] See also Figures 1 to 3 The PCB board usually needs to press the core board and the prepreg 13 together. During the pressing process, the resin in the prepreg 13 is softened by high temperature heating to reduce the viscosity, and then flows to fill the empty area between the metal patterns 11. Figure 1 The dotted arrow in the middle shows the flow direction of the resin in the prepreg 13. The resin filling is less in the location where the residual copper ratio (copper area / total area) is large after the core board is etched, and the resin filling is more in the location where the residual copper ratio is small, which will cause the dielectric thickness to become thinner. The dielectric thickness can be measured by the distance from the copper surface of the upper core board to the copper surface of the next core board (such as Figure 2 As shown in the figure). When the copper thickness of the core board is thicker, for example, when it reaches 3OZ, under the condition of the same residual copper rate, the thicker the copper thickness of the core board, the larger the empty volume that needs to be filled by the resin, thus resulting in a thinner dielectric thickness. This may not only lead to a decrease in dielectric thickness uniformity, but also a too thin dielectric thickness will affect the impedance, insertion loss, withstand voltage and other reliability indicators of the PCB finished product.

[0061] In the related art, in order to make the dielectric thickness of the PCB more uniform, a method is usually adopted to first apply resin in the gaps of the surface pattern of the core board 10, and then vacuumize and cure. However, this solution has at least the following problems: Figure 3 For some closed small-spacing positions, when rolling the resin, the bubbles in the small gaps are easily covered by the resin and are not easy to escape, which will cause voids to form during lamination, affecting reliability. At the same time, when the resin is coated on the surface of the core board 10, due to the fluidity of the liquid resin 40, the coating thickness is unstable, which easily causes the dielectric thickness to exceed the tolerance range.

[0062] For this reason, please see Figure 4 In a first aspect, the present application provides a PCB manufacturing method, comprising:

[0063] S100. Providing at least two core plates 10;

[0064] S200. Arrange the core plate 10 in the pre-arranged bracket 20, and the arranged core plate 10 and the pre-arranged bracket 20 are formed into a pre-arranged assembly 100;

[0065] S300. The pre-row assembly 100 is placed in a sealed bag 30;

[0066] S400. The sealing bag 30 is evacuated so that the liquid resin 40 enters the sealing bag 30 and fills the gap between the core plates 10;

[0067] S500 . Place the sealed bag 30 into the press 60 and press the pre-arranged assembly 100 .

[0068] In the present application, a plurality of core plates 10 are first pre-arranged using a pre-arrangement bracket 20, such as Figure 5 and Figure 6 As shown, by adjusting the position of each core board 10 on the pre-arrangement bracket 20, each layer of core boards 10 can be adjusted to a suitable spacing, and the dielectric thickness can be more accurately controlled (the dielectric thickness can be measured as the distance from the copper surface of the upper core board 10 to the copper surface of the lower core board 10), so that the two adjacent layers of core boards 10 can meet the design requirements of dielectric thickness. Compared with the method of stacking prepregs 13 between two adjacent core boards 10, the use of pre-arrangement brackets 20 to adjust the distance between core boards 10 can improve the flexibility of adjusting the spacing between core boards 10. In view of the need to set different gaps between core boards 10, there is no need to purchase prepregs 13 of different thicknesses, which improves the practicality and convenience of pre-arrangement of core boards 10.

[0069] Secondly, by placing the pre-arrangement component 100 in a sealing bag 30 and then evacuating the sealing bag 30, on the one hand, the gas between the core panels 10 can be discharged to avoid the generation of bubbles in the liquid resin 40 during the filling process; on the other hand, the liquid resin 40 can be drawn into the sealing bag 30 under the action of negative pressure, and the fluidity of the liquid resin 40 can be used to fill the liquid resin 40 into the gap between the core panels 10, thereby achieving the effect of interconnecting two adjacent layers of core panels 10.

[0070] Furthermore, the sealing characteristics of the sealing bag 30 can be used to retain the liquid resin 40 filled in the gap, preventing the liquid resin 40 from leaking before being pressed and cured. Compared with the solution of first coating the liquid resin 40 on the surface of the core board 10 and then stacking the core boards 10, the method of the present application can prevent the liquid resin 40 from leaking before being heated and cured, thereby solving the problem of unstable thickness of the liquid resin 40 in the preset gap, avoiding excessive dielectric thickness, and avoiding the problem of too thin dielectric thickness in the area with a small residual copper rate, which helps to improve the uniformity of dielectric thickness of the PCB board.

[0071] Finally, the sealing bag 30 containing the pre-arranged components 100 is pressed together to obtain a PCB board product. The liquid resin 40 can flow freely between the patterns on the surface of the core board 10, which helps to fill the liquid resin 40 into the position with smaller pattern spacing, thereby solving the problem that the position with smaller spacing cannot be filled with resin and forms voids or pits, thereby improving the resin filling effect and making the dielectric thickness of the core board 10 more uniform after lamination. The PCB board product can meet reliability indicators such as dielectric thickness uniformity, impedance, insertion loss, and withstand voltage.

[0072] In some embodiments, see Figure 6 and Figure 7 The pre-arrangement bracket 20 includes a clamping structure 22 and a column 21, and the clamping structure 22 is arranged on the column 21. The above step S200. Arranging the core board 10 in the pre-arrangement bracket 20 includes:

[0073] S210. The core plate 10 is placed in the pre-arranged bracket 20 in stacking order;

[0074] S220 . Adjust the position of the clamping structure 22 on the column 21 to adjust the gap between the core plates 10 .

[0075] By moving the clamping structure 22 along the extension direction of the column 21, the position of the clamping structure 22 on the column 21 can be adjusted, so that the spacing between two adjacent clamping structures 22 on the same column 21 is changed, thereby achieving the gap adjustment between two adjacent core panels 10. Arranging the core panels 10 in this way can not only realize the pre-arrangement of the core panels 10 according to the stacking order of the core panels 10, but also can flexibly adjust the spacing between the core panels 10, simplify the operation of adjusting the gap between the core panels 10, and meet the design requirements of the spacing between each core panel 10.

[0076] Exemplarily, the clamping structure 22 may be clamped or held on the outer edge of the core panel 10 in the form of a clamping between the upper and lower ends, or supported on the lower surface of the core panel 10 in the form of a cantilever or a supporting block, that is, the outer edge of the core panel 10 overlaps the supporting surface of the clamping structure 22, or abuts against the upper surface of each layer of the core panel 10, and clamps the same layer of the core panel 10 together with the clamping structure 22 on the lower surface of the same layer of the core panel 10, which is not limited here. The clamping structure 22 and the column 21 may be connected by a sliding connection, a snap connection, or the like. For example, when a sliding connection is used, the clamping structure 22 adjusts its position by sliding, and the clamping structure 22 maintains its position by using static friction with the column 21. When a snap connection is used, a plurality of slots may be provided along the height direction of the column 21, and the clamping structure 22 adjusts its position by snapping with different slots, and maintains its position by snapping with the slots, which is not limited here.

[0077] Optionally, the pre-arrangement bracket 20 may further include a base 24, which may be a plate-like structure with a larger area than the core plate 10. The base 24 is horizontally arranged, and the columns 21 are vertically arranged on the base 24. The base 24 can fix the columns 21 and support the core plate 10. The base plate and the columns 21 can be assembled or disassembled in a detachable connection, further improving the flexibility of assembling the pre-arrangement bracket 20.

[0078] In some embodiments, the pre-arranged bracket 20 includes at least one group of columns 21 disposed on opposite sides of the core plate 10. A group of columns 21 can provide support for the opposite sides of the core plate 10, thereby improving the balance and stability of the core plate 10 after arrangement. Exemplarily, the core plate 10 can be a rectangular structure, and thus has two opposite sets of opposite sides. Multiple groups of columns 21 can be provided, and multiple groups of columns 21 can be provided on only one set of opposite sides of the core plate 10, and the multiple groups of columns 21 are provided at intervals; of course, columns 21 can also be provided on both sets of opposite sides of the core plate 10 for support, thereby further improving the stability of the arrangement of the core plate 10; further, multiple groups of columns 21 can also be provided around the outer periphery of the core plate 10, which helps to improve the stability and alignment accuracy of the arrangement of the core plate 10.

[0079] Since the columns 21 are arranged on at least one set of opposite sides of the core board 10, in order to ensure that both sides of the core board 10 have the same height, that is, to ensure that the core board 10 has a good levelness during pre-arrangement, it is necessary to adjust and detect the levelness of the core board 10. Therefore, in some embodiments, please refer to 8 and Fig. 9 ,in, Figure 8 (a) and Figure 8 (c) is a front view of the clamping structure 22, Figure 8 (b) and Figure 8 (d) is a side view of the clamping structure 22, in which a light-transmitting structure 221 is provided. After adjusting the position of the clamping structure 22 on the column 21 to adjust the gap between the core boards 10 in step S220, the PCB manufacturing method further includes:

[0080] S230. A light emitting device 231 is provided on the outer side of one of the columns 21, and a light sensing device 232 is provided on the outer side of the other column 21;

[0081] S240. Turn on the light emitting device 231 to emit horizontal light;

[0082] S250 . Adjust the clamping structure 22 on the pillar 21 until the light passes through the light-transmitting structures 221 of the clamping structures 22 on the two pillars 21 in sequence to reach the photosensitive device 232 .

[0083] By utilizing the cooperation between the light emitting device 231 and the photosensitive device 232, when the clamping structure 22 is adjusted to the point where the photosensitive device 232 can detect light, it means that the clamping structures 22 on both sides of the same core board 10 are at the same horizontal height. At this time, the opposite sides of the core board 10 can be at the same horizontal height, thereby realizing the adjustment and detection of the horizontality of the core board 10, meeting the precision requirements of the pre-arrangement of the core board 10, and improving the manufacturing quality of the PCB board. By arranging the light emitting device 231 and the photosensitive device 232 on the outside of the column 21, the arrangement of the core board 10 between the columns 21 can be maintained, so that the light emitting device 231 and the photosensitive device 232 will not interfere with each other between the core board 10. By using the light alignment method to adjust the horizontality, the horizontality detection of the core board 10 can be realized without adding a physical structure, thereby simplifying the structure of the pre-arrangement bracket 20, and also making the operation process of adjusting and detecting the horizontality of the core board 10 simpler.

[0084] It can be understood that the inner side and the outer side of the column 21 are relative to the position of the core plate 10. The side of the column 21 facing the core plate 10 is the inner side, and the side away from the core plate 10 is the outer side. Figure 8The light-transmitting structure 221 can be a light-transmitting through hole, a light-transmitting groove, etc., provided on the clamping structure 22. The light-transmitting direction of the light-transmitting structure 221 runs through the inner side and the outer side of the column 21, that is, the light-transmitting direction points from the outer side of the column 21 to the inner side of the column 21, or from the inner side of the column 21 to the outer side of the column 21. The detection light can be a laser, which has good penetrating power and can maintain parallelism, thereby improving the reliability of the horizontal detection of the core board 10.

[0085] In some embodiments, in order to prevent the liquid resin 40 from entering the light-transmitting structure 221 during the filling process of the liquid resin 40, the light-transmitting structure 221 can be set as a solid structure with a light-transmitting effect. Taking the light-transmitting through hole as an example, a light-transmitting material (such as glass, etc.) can be buried in the light-transmitting through hole, and the light-transmitting material can fill the entire light-transmitting through hole. The clamping structure 22 is made of opaque material. In this way, the light-transmitting structure 221 can not only allow the detection light to pass through, but also form a solid structure to prevent the liquid resin 40 from entering the light-transmitting through hole during filling, causing the light-transmitting through hole to be blocked, which is conducive to the recycling of the pre-arranged bracket 20.

[0086] Since the columns 21 and the clamping structure 22 are arranged at the periphery of the core plate 10, they play a supporting and fixing role on the periphery of the core plate 10. When the core plate 10 has a large area, the middle area of ​​the core plate 10 is prone to be concave under its own gravity due to lack of support, thereby causing the core plate 10 to warp and deform. Therefore, in some embodiments, please refer to Fig.10 The pre-arrangement bracket 20 further includes a support member 25. The above step S210. Arranging the core plate 10 in the pre-arrangement bracket 20 includes:

[0087] S211. A support member 25 is set between the two columns 21 so that both ends of the support member 25 are connected to the two clamping structures 22 of the same layer;

[0088] S212 . Place the core board 10 on the top surface of the support member 25 .

[0089] By erecting a support member 25 between the two columns 21, the support member 25 can be used to provide support for the middle area of ​​the core board 10, thereby improving the overall support strength of the core board 10, making the support force distribution of the core board 10 more uniform, and avoiding the concave deformation of the core board 10, thereby improving the manufacturing accuracy and manufacturing yield of the PCB board.

[0090] Exemplarily, the support member 25 can be made of the same material as the prepreg 13, or the support member 25 can be formed by cutting the prepreg 13 into a rod shape or a plate shape. That is, the support member 25 contains resin, and after the support member 25 and the core board 10 are pressed together, the support member 25 can be cured into an integrated structure with the liquid resin, thereby being pressed between adjacent core boards 10. In this way, there is no need to remove the support member 25 after the core board 10 is pressed together, and the support member 25 will not affect the performance of the PCB board. Of course, in other examples, the support member 25 can also be made of other materials, and the support member 25 can be set on the top surface of the top core board 10 or the bottom surface of the bottom core board 10. After the core board 10 is pressed together, the support member 25 is exposed on the top surface or bottom surface of the core board 10, so that the support member 25 can be removed (for example, it can be removed by grinding or other methods).

[0091] Optionally, please review Figure 8 , Figure 8 (c) and Figure 8 (d) shows the front view and the side view of the clamping structure 22, respectively. In order to improve the stability between the support member 25 and the clamping structure 22, a mounting groove 222 can be provided in the clamping structure 22, and the two ends of the support member 25 can be snapped into the mounting groove 222, so that relative sliding between the support member 25 and the clamping structure 22 can be avoided, thereby preventing the support member 25 from sliding off the clamping structure 22. When a light-transmitting through hole is provided on the clamping structure 22, the mounting groove 222 and the light-transmitting through hole can be spaced apart along the extension direction of the column 21, so that the setting of the mounting groove 222 and the light-transmitting through hole can not interfere with each other. Exemplarily, the support member 25 can be a rod or a plate, and the mounting groove 222 can be set to a shape (round groove, square groove, etc.) that is adapted to the cross-sectional shape of the support member 25 according to the specific shape of the support member 25 (round rod, square rod, etc.).

[0092] In some embodiments, before the above step S300 of placing the pre-arranged component 100 into the sealed bag 30, the PCB board manufacturing method further includes:

[0093] S310. A protective layer 12 is provided on the top and bottom surfaces of the pre-arrangement assembly 100;

[0094] After the above step S500, in which the sealing bag 30 is placed in the press 60 and the pre-arranged components 100 are pressed, the PCB board manufacturing method further includes:

[0095] S800. Remove the protective layer 12.

[0096] By providing a protective layer 12 on the top and bottom surfaces of the core board 10 before pre-arranging the core board 10, it is possible to prevent the core board 10 from being scratched during subsequent pre-arrangement, filling with liquid resin 40, lamination, and milling, or to prevent it from being covered by the liquid resin 40, so as to ensure that the performance of the top and bottom core boards 10 is not affected. Usually, the top surface of the top core board 10 and the bottom surface of the bottom core board 10 need to be covered with a copper foil layer, and the protective layer 12 can protect the copper foil layer from being damaged during the above-mentioned manufacturing steps of the PCB board, thereby improving the performance reliability of the finished PCB board. After the lamination is completed, the protective layer 12 is removed, and a finished PCB board with copper foil layers covering the upper and lower surfaces can be obtained.

[0097] For example, the protective layer 12 may be a high temperature resistant tape, a high temperature resistant coating, etc., and may be provided by pasting, coating, etc. Accordingly, the protective layer 12 may be separated or removed by tearing or by using a solution that can react with the material of the protective layer 12 .

[0098] Exemplarily, the sealing bag 30 may be provided with a liquid suction port 31 and a first vacuum port 32, wherein the liquid suction port 31 is used to introduce the liquid resin 40 into the sealing bag 30, and the first vacuum port 32 is used to vacuum the sealing bag 30. The liquid resin 40 may be stored in a liquid storage tank 41, and the liquid suction port 31 is connected to the liquid storage tank 41 through a pipeline, so that the liquid resin 40 can be sucked into the sealing bag 30.

[0099] In some embodiments, see Fig.11 The liquid suction port 31 of the inner bag is connected to an electric valve 311, and the electric valve 311 is used to block the liquid resin 40 from entering the inner bag, or to allow the liquid resin 40 to pass into the inner bag. The above step S400. evacuates the inner bag so that the liquid resin 40 enters the sealing bag 30 and fills the gap between the core plates 10, including:

[0100] S410. When the vacuum degree in the inner bag is higher than the preset value, the electric valve 311 is closed;

[0101] S420. When the vacuum degree in the inner bag is reduced to a preset value, the electric valve 311 is opened to allow the liquid resin 40 to enter the inner bag.

[0102] By setting the electric valve 311, the opening and closing state of the electric valve 311 can be used to control the on and off of the liquid resin 40, thereby ensuring that there is sufficient vacuum in the inner bag before the liquid resin 40 enters the inner bag, avoiding the residual air in the inner bag from causing bubbles when filling the liquid resin 40, thereby ensuring that the liquid resin 40 can achieve a good filling effect.

[0103] Optionally, the vacuum degree of the inner bag can be detected by a liquid level measuring instrument 51. The liquid level measuring instrument 51 and the electric valve 311 are both electrically connected to the controller 52. The controller 52 uses the liquid level measuring instrument 51 to detect the vacuum degree of the inner bag. When the air pressure in the inner bag is higher than a preset value, the electric valve 311 remains in a closed state, and the liquid resin 40 cannot enter the inner bag. The inner bag is evacuated until the vacuum degree in the inner bag reaches a preset value. At this time, the controller 52 controls the electric valve 311 to open, so that the liquid resin 40 is drawn into the inner bag by the vacuum device 33 to fill the gap of the core board 10. Exemplarily, a conductive liquid (such as mercury) can be set in the liquid level measuring instrument 51, and the change in the liquid level of the conductive liquid can generate different electrical signals, thereby realizing the detection of the vacuum degree of the inner bag.

[0104] Optionally, a buffer device 34 may be provided between the vacuum pumping device 33 and the first vacuum pumping port 32 of the inner bag. The buffer device 34 is used to store waste liquid resin 40 extracted from the inner bag, and the resin volatiles may be discharged after condensation.

[0105] In some embodiments, see Fig.12 The above step S500 of placing the sealing bag 30 into the press 60 and pressing the pre-arrangement assembly 100 includes:

[0106] S501. The pre-discharge assembly 100 is placed into the cabin pressure press 60;

[0107] S502. Before laminating the pre-arrangement assembly 100, evacuate the sealing bag 30.

[0108] The cabin pressure press 60 has a sealed cabin structure, which can pressurize and heat the cabin, so that the core boards 10 can be pressed together under high temperature and high pressure to form a finished PCB board. Before pressing the core boards 10, vacuuming can further discharge the gas in the gaps of the core boards 10 to prevent the liquid resin 40 from generating voids and pits during the curing process.

[0109] In some embodiments, after executing the above step S502, the following steps may also be included:

[0110] S503. During the process of pressing the pre-arrangement assembly 100, the sealing bag 30 is evacuated.

[0111] By vacuuming during the pressing process, the volatile gas in the core plate 10 can be extracted, thereby reducing the impact of the volatile gas on the quality of the core plate 10 during the pressing process.

[0112] Optionally, the sealing bag 30 may be evacuated only before the core board 10 is pressed, or the sealing bag 30 may be evacuated only during the pressing process of the core board 10. Alternatively, in other examples, the sealing bag 30 may be evacuated both before and during the pressing process of the core board 10, which is not limited in this example.

[0113] In some embodiments, the cabin pressure press 60 can be fed with inert gas during operation, and the inert gas does not react with the core plate 10, resin, etc. The inert gas can be pressurized and heated by the pressure pump 61 and the heating device 62, and after reaching the set pressure and temperature, it is fed into the cabin pressure press 60, which can further improve the pressing effect of the core plate 10 in a high temperature and high pressure environment.

[0114] Optionally, see Fig.12 , Fig.12 The middle arrow shows the flow direction of the high-temperature and high-pressure inert gas, which can be introduced through the top, bottom, and peripheral side of the cabin pressure press 60 to form an airflow around the sealing bag 30 and the core board 10 placed in the cabin pressure press 60, so that the core board 10 is heated and pressurized more evenly during the pressing process, thereby improving the pressing quality of the core board 10. The cabin pressure press 60 can also be provided with an exhaust device 63 connected to the cabin body for extracting the inert gas to control the air pressure in the cabin body.

[0115] In some embodiments, a buffer device 34 may be provided to be connected to the sealing bag 30. The buffer device 34 has the function of storing liquid. When the sealing bag 30 is evacuated before or during lamination, the waste liquid formed by cooling the volatile gas in the sealing bag 30 and the overflowing part of the resin in the sealing bag 30 after thermal expansion can be discharged into the buffer device 34, thereby preventing the volatile gas and overflowing resin from affecting the lamination quality of the core board 10, and further improving the lamination effect of the core board 10.

[0116] As an alternative embodiment, the press 60 is not limited to the cabin pressure press 60, and other existing pressing equipment may be used to press the core plate 10, which is not limited here.

[0117] In some embodiments, after the above step S500 of placing the sealing bag 30 into the press 60 and pressing the pre-arrangement component 100, the method for manufacturing the PCB board further includes:

[0118] S600 . Mill the edges of the pre-arrangement component 100 to remove the pre-arrangement bracket 20 .

[0119] See also Figures 13 to 15 , Fig.13It is a schematic diagram of the structure of the core board 10 after being filled with liquid resin 40 and cured. At this time, the core board 10 and the pre-arranged bracket 20 are cured in the sealing bag 30. By using the milling equipment, the peripheral structure of the pressed core board 10, including the pre-arranged bracket 20 and the sealing bag 30 attached to the side of the core board 10 with the liquid resin 40, can be milled off, so as to obtain a finished PCB board. Optionally, the core board 10 can also be designed with edge materials reserved on all sides, and the edge materials can be milled off during milling. At this time, the pre-arranged bracket 20 attached to the edge materials and the sealing bag 30 on the peripheral surface of the edge materials can be removed together, and finally a finished PCB board (such as Fig.14 As shown), the milled pre-arranged bracket 20 is as shown Fig.15 shown.

[0120] In order to achieve the recycling of the pre-arrangement bracket 20, in some embodiments, before arranging the core board 10 in the pre-arrangement bracket 20 in the above step S200, the PCB board manufacturing method further includes:

[0121] S201. The surface of the pre-arranged stent 20 is coated with magnetic inactivation glue;

[0122] S202. Heat the pre-arrangement bracket 20 to solidify the magnetic inactivation glue.

[0123] The magnetic inactivation glue can remain on the surface of the pre-arrangement bracket 20 after solidification. The magnetic inactivation glue contains iron oxide particles. In a magnetic field of a specific oscillation frequency, the iron oxide particles will be heated to melt the glue and lose its adhesion. By coating the magnetic inactivation glue on the surface of the pre-arrangement bracket 20 in advance and solidifying the magnetic inactivation glue, when the core board 10 is arranged in the pre-arrangement bracket 20, due to the presence of the magnetic inactivation glue, the core board 10 and the pre-arrangement bracket 20 are not in direct contact, but the core board 10 and the pre-arrangement bracket 20 are isolated from each other by the magnetic inactivation glue. When the pre-arrangement bracket 20 needs to be recycled, it is only necessary to melt the magnetic inactivation glue to separate the pre-arrangement bracket 20 from the edge material of the core board 10, thereby realizing the recycling of the pre-arrangement bracket 20.

[0124] In some embodiments, see Fig.15 and Fig.16 After the pre-arrangement component 100 is milled to remove the pre-arrangement bracket 20 in the above step S600, the PCB board manufacturing method further includes:

[0125] S710. The pre-arranged bracket 20 attached with the edge material of the core plate 10 is placed in an alternating magnetic field to melt the magnetic inactivation glue and separate the edge material of the core plate 10 from the pre-arranged bracket 20;

[0126] S720. Recover the pre-arranged bracket 20.

[0127] After the core plate 10 is milled out, the edge material of the core plate 10 still remains in the pre-arranged bracket 20 (such as Fig.15As shown), the magnetic inactivation glue is melted by an alternating magnetic field, so that the bonding between the edge material of the core plate 10 and the pre-arranged bracket 20 can be released, so that the edge material of the core plate 10 and the pre-arranged bracket 20 can be separated from each other (as shown). Fig.16 As shown), it is helpful to recycle the pre-arranged bracket 20.

[0128] Exemplarily, the pre-arranged bracket 20 with the core panel 10 edge material attached thereto can be placed in a conveyor belt, and an alternating magnetic field with a certain oscillation frequency is applied to the area of ​​the conveyor belt, so that the iron oxide particles in the magnetically inactivated glue are exposed to the alternating magnetic field and the iron oxide particles are heated to melt the magnetically inactivated glue.

[0129] As an optional embodiment, the magnetic inactivation glue can be cured by thermal curing. When a light-transmitting structure 221 is provided in the clamping structure 22 of the pre-arrangement bracket 20, the light-transmitting structure 221 can be protected before the magnetic inactivation glue is cured, and the protection of the light-transmitting structure 221 can be removed after the magnetic inactivation glue is cured. For example, a protective tape is attached to the surface of the light-transmitting through hole, and the protective tape is removed after the magnetic inactivation glue is cured and the light-transmitting protective tape is re-attached in the light-transmitting through hole. In this way, the magnetic inactivation glue can be prevented from infiltrating into the light-transmitting through hole or covering the light-transmitting material filled in the light-transmitting through hole, which affects the light-transmitting effect of the light-transmitting through hole.

[0130] Optionally, the above-mentioned step S600 of milling the pre-arrangement component 100 to remove the pre-arrangement bracket 20 can be performed before the above-mentioned step S800 of removing the protective layer 12, that is, after the pre-arrangement component 100 is pressed, the pre-arrangement component 100 is first milled, and then the protective layer 12 is removed. In this way, the protective layer 12 can protect the top and bottom surfaces of the core board 10 during the milling process to prevent the copper foil layer from being scratched.

[0131] As an optional embodiment, when the core board 10 is milled, the milling depth does not exceed the protective layer 12 of the bottom core board 10, so that the protective layer 12 on the bottom surface can be retained when the core board 10 is milled to play a protective role.

[0132] In a second aspect, the present application further provides a PCB board 200, which is manufactured using the PCB board manufacturing method provided in the first aspect.

[0133] In the description of this specification, if the reference terms "one embodiment", "some examples", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" appear, it means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0134] The above describes the implementation methods of the present application in detail in conjunction with the accompanying drawings, but the present application is not limited to the above implementation methods. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present application.

[0135] In the description of this application, if "," appears in the patent name, it means an "and" relationship, not an "or" relationship. For example, if the patent name is "a kind of A, B", it means that the content required to be protected by this application is: the technical solution with the subject name A and the technical solution with the subject name B.

Claims

1. A method for manufacturing a PCB board, characterized in that: include providing at least two core panels; Arranging the core plates in a pre-arrangement bracket, wherein the arranged core plates and the pre-arrangement bracket form a pre-arrangement assembly; placing the pre-row components into a sealed bag; Vacuuming the sealing bag to allow the liquid resin to enter the sealing bag and fill the gaps between the core plates; The sealed bag is placed in a press and the pre-arranged assembly is pressed.

2. The PCB manufacturing method according to claim 1, characterized in that: The pre-arrangement bracket includes a clamping structure and a column, the clamping structure is arranged on the column, and arranging the core plate in the pre-arrangement bracket includes: placing the core panels into the pre-arranged brackets in a stacking order; The position of the clamping structure on the column is adjusted to adjust the gap between the core plates.

3. The PCB manufacturing method according to claim 2, characterized in that: The pre-arranged bracket includes at least one group of columns arranged on two opposite sides of the core board, and the clamping structure is provided with a light-transmitting structure. After adjusting the position of the clamping structure on the columns to adjust the gap between the core boards, the PCB board manufacturing method further includes: A light emitting device is arranged on the outer side of one of the pillars, and a light sensing device is arranged on the outer side of the other pillar; turning on the light emitting device to emit horizontal light; The clamping structure on the pillar is adjusted until the light passes through the light-transmitting structures of the clamping structures on the two pillars in sequence to reach the photosensitive device.

4. The method for manufacturing a PCB board according to claim 2, characterized in that: The pre-arrangement bracket further includes a support member, and placing the core panels in the pre-arrangement bracket in a stacking order includes: A support member is installed between the two columns, so that two ends of the support member are respectively connected to the two clamping structures on the same layer; The core plate is placed on the top surface of the support member.

5. The method for manufacturing a PCB according to any one of claims 1 to 4, characterized in that: After the sealed bag is placed in a press and the pre-arranged components are pressed, the method for manufacturing the PCB board further includes: The pre-arrangement components are milled to remove the pre-arrangement brackets.

6. The method for manufacturing a PCB board according to claim 5, characterized in that: Before arranging the core boards in the pre-arrangement bracket, the PCB board manufacturing method further includes: Coating magnetic inactivation glue on the surface of the pre-arranged stent; The pre-arranged support is heated to cure the magnetically inactivated glue.

7. The method for manufacturing a PCB board according to claim 6, characterized in that: After the pre-arranged components are milled to remove the pre-arranged brackets, the PCB manufacturing method further includes: placing the pre-arranged support with the edge material of the core plate attached thereto into an alternating magnetic field to melt the magnetically inactivated glue and separate the edge material of the core plate from the pre-arranged support; The pre-arranged stent is recovered.

8. The method for manufacturing a PCB board according to any one of claims 1 to 4, characterized in that: Placing the sealed bag into a press and pressing the pre-arranged components comprises: placing the pre-discharge assembly into a cabin pressure press; Before laminating the pre-arranged components and / or during laminating the pre-arranged components, the sealing bag is evacuated.

9. The method for manufacturing a PCB board according to any one of claims 1 to 4, characterized in that: Before placing the pre-arranged components into the sealed bag, the PCB board manufacturing method further includes: Providing a protective layer on the top and bottom surfaces of the pre-arrangement assembly; After placing the sealed bag into a press and pressing the pre-arranged components, the PCB board manufacturing method further includes: The protective layer is removed.

10. A PCB board, characterized in that: The PCB is manufactured by the PCB manufacturing method as claimed in any one of claims 1 to 9.

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