HJT battery metal patterning method

Abstract

The invention discloses an HJT battery metal patterning method, and relates to the technical field of solar batteries. The method comprises the following steps: by taking an HJT battery as a base material, carrying out PVD treatment on the surface to form a copper seed layer, and printing an electroplating mask on the surface of the HJT battery by adopting a silk-screen printing process; the printed electroplating mask is subjected to UV curing treatment, a laser back-etching process is utilized, an area which does not need the electroplating mask is subjected to accurate ablation, a copper seed layer to be electroplated is exposed, copper and tin electroplating is carried out on the area subjected to laser back-etching, and a designed electrode structure is formed; and finally, removing the electroplating mask and the copper seed layer below the electroplating mask, and leaving the designed copper grid line. Through the screen printing and laser processing technology, high-precision control over the electrode pattern is achieved, the preparation efficiency is improved, the cost is reduced, stability is good, and the application prospect is wide.

Description

Technical Field

[0001] The present invention relates to the technical field of solar cells, and in particular to a metal patterning method for HJT cells. Background Art

[0002] Crystalline silicon heterojunction solar cells (HJT) require precise electrode structures to improve photoelectric conversion efficiency, but traditional electroplating methods have problems with insufficient precision when forming thin-wire electrodes, low electrode preparation efficiency, low stability, and material waste. In order to solve the above problems, it is particularly necessary to develop a HJT cell metal patterning method. Summary of the invention

[0003] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a metal patterning method for HJT batteries, which can achieve high-precision control of electrode patterns through screen printing and laser processing technology, improve preparation efficiency, reduce costs, have good stability, and be easy to promote and use.

[0004] In order to achieve the above object, the present invention is implemented by the following technical method: a HJT battery metal patterning method, the steps of which are:

[0005] (1) Substrate treatment: Using HJT cells as substrates, PVD treatment is performed on the surface to form a copper seed layer to improve the adhesion and uniformity of subsequent printing and electroplating;

[0006] (2) Screen printing: The electroplating mask is printed on the surface of the HJT cell using the screen printing process;

[0007] (3) UV curing: UV curing is performed on the printed electroplating mask to ensure that it maintains a stable shape in the subsequent process;

[0008] (4) Laser back-etching: Using the laser back-etching process, the unnecessary electroplating mask area is precisely ablated to expose the copper seed layer to be electroplated, ensuring the fine line width and high precision of the electrode;

[0009] (5) Electroplating process: Copper and tin are electroplated in the laser-etched area to form a designed electrode structure;

[0010] (6) Finally, remove the electroplating mask and the copper seed layer underneath, leaving the designed copper gate line.

[0011] Preferably, in step (1), the surface of the HJT battery is subjected to physical vapor deposition treatment in a vacuum environment at 200-400° C., and the thickness of the copper seed layer formed by the PVD treatment is 100 nm.

[0012] Preferably, in the step (2), the mask determines the structure and position of the electrode according to a pre-designed graphic layout.

[0013] Preferably, the parameters of the UV curing treatment in step (3) are a wavelength of 365 nm and an energy intensity of 600-900 mJ / cm 2 , the curing time is 3-6s.

[0014] Beneficial effects of the present invention: The present invention realizes high-precision control of electrode patterns through screen printing and laser processing technology, improves preparation efficiency, reduces costs, ensures electrode quality, and has broad application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments;

[0016] Figure 1 It is a flow chart of the present invention. DETAILED DESCRIPTION

[0017] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0018] Reference Figure 1 , this specific implementation adopts the following technical method: a HJT battery metal patterning method, the steps are:

[0019] (1) Substrate treatment: Using HJT cells as substrates, PVD treatment is performed on the surface to form a copper seed layer with a thickness of 100 nm to improve the adhesion and uniformity of subsequent printing and electroplating;

[0020] (2) Screen printing: The electroplating mask is printed on the surface of the HJT battery using the screen printing process. The mask determines the structure and position of the electrode according to the pre-designed graphic layout;

[0021] (3) UV curing: UV curing is performed on the printed electroplating mask to ensure that it maintains a stable shape in the subsequent process;

[0022] (4) Laser back-etching: Using the laser back-etching process, the unnecessary electroplating mask area is precisely ablated to expose the copper seed layer to be electroplated, ensuring the fine line width and high precision of the electrode;

[0023] (5) Electroplating process: Copper and tin are electroplated in the laser-etched area to form a designed electrode structure. During the electroplating process, the electroplating time and conditions are controlled to ensure that the line width is within the required range.

[0024] (6) Finally, remove the electroplating mask and the copper seed layer underneath, leaving the designed copper gate line.

[0025] It is worth noting that the step (1) is to perform physical vapor deposition treatment on the surface of the HJT battery in a vacuum environment at 200-400°C.

[0026] In addition, the parameters of the UV curing treatment in step (3) are a wavelength of 365 nm and an energy intensity of 600-900 mJ / cm 2 , the curing time is 3-6s.

[0027] This specific implementation method achieves high-precision control of the electrode pattern through screen printing and precise laser processing. This electroplating method not only improves the manufacturing accuracy and preparation efficiency of the metal patterned electrode of the HJT battery, but also significantly reduces material waste while ensuring the quality and stability of the electrode. It has significant technical advantages. The metal patterned electrode with optimized shape and performance prepared by this method can be widely used in the manufacture of solar cells and has broad market application prospects.

[0028] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A HJT battery metal patterning method, characterized in that: The steps are: (1) Substrate treatment: Using HJT cells as substrates, PVD treatment is performed on the surface to form a copper seed layer; (2) Screen printing: The electroplating mask is printed on the surface of the HJT cell using the screen printing process; (3) UV curing: UV curing the printed electroplating mask; (4) Laser back-etching: Using the laser back-etching process, the unnecessary electroplating mask area is precisely ablated to expose the copper seed layer to be electroplated; (5) Electroplating process: Copper and tin are electroplated in the laser-etched area to form a designed electrode structure; (6) Finally, remove the electroplating mask and the copper seed layer underneath, leaving the designed copper gate line.

2. A HJT battery metal patterning method according to claim 1, characterized in that: The step (1) performs physical vapor deposition treatment on the surface of the HJT battery in a vacuum environment at 200-400°C.

3. A HJT battery metal patterning method according to claim 1, characterized in that: The thickness of the copper seed layer formed in step (1) is 100 nm.

4. A HJT battery metal patterning method according to claim 1, characterized in that: In the step (2), the mask determines the structure and position of the electrode according to a pre-designed graphic layout.

5. A HJT battery metal patterning method according to claim 1, characterized in that: The parameters of the UV curing treatment in step (3) are a wavelength of 365 nm and an energy intensity of 600-900 mJ / cm 2 , the curing time is 3-6s.

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