Preparation method of high-concentration LED light source

Abstract

The present invention relates to the technical field of LED light sources and discloses a method for preparing a high-concentration LED light source, comprising the following preparation steps: 1) providing a substrate, wherein a light-emitting area is provided in the substrate, and an inner dam is provided in the light-emitting area, and the inner dam surrounds and forms a central area; 2) arranging a light-emitting chip on the central area, with an inner ring area between the light-emitting chip and the inner side wall of the central area; 3) arranging a fluorescent adhesive layer; 4) arranging a light-transmitting adhesive layer, wherein the lower part of the light-transmitting adhesive layer is embedded in the light-emitting area to form an integral structure with the substrate; the upper part of the light-transmitting adhesive layer extends to the upper part of the substrate to form an upper section; the lower part of the light-transmitting adhesive layer is embedded in the light-emitting area to form a more stable overall structure with the substrate, the lower part of the light-transmitting adhesive layer is subject to the circumferential restriction of the light-emitting area, which restricts the light-transmitting adhesive layer from flowing excessively toward the periphery, and can maintain the upper section of the light-transmitting adhesive layer to form a higher arch shape, so as to limit the light irradiation range and achieve the effect of high-concentration irradiation.

Description

Technical Field

[0001] The patent of this invention relates to the technical field of LED light sources, specifically, to a method for preparing a high-concentration LED light source. Background Art

[0002] With the development of LED technology, LED light sources are now increasingly used in daily life and in various industries. With advantages such as small size, long life, and high efficiency, LED light sources can be used continuously for up to 100,000 hours, making them the mainstream light source in the lighting field.

[0003] In the prior art, an LED light source includes a substrate having a recessed light-emitting area, a light-emitting chip disposed on the light-emitting area, and a fluorescent adhesive layer covering the light-emitting area. Light emitted by the light-emitting chip passes through the fluorescent adhesive layer and irradiates outward. However, current LED light sources have the defect of insufficient concentration, making it difficult to meet the needs of high-concentration lighting. Summary of the Invention

[0004] The purpose of the present invention is to provide a method for preparing a high-concentration LED light source, aiming to solve the problem of insufficient concentration of LED light sources in the prior art.

[0005] The present invention is achieved by a method for preparing a high-concentration LED light source, comprising the following steps:

[0006] 1) Providing a substrate, wherein a recessed light-emitting area is provided in the substrate, wherein an inner dam is provided in the light-emitting area, and wherein the inner dam surrounds a central area; wherein the outer periphery of the light-emitting area has an outer reflective sidewall, and wherein the outer reflective sidewall surrounds the outer periphery of the light-emitting area;

[0007] 2) A light-emitting chip is arranged on the central region, and an inner ring region is provided between the light-emitting chip and the inner side wall of the central region, and the inner ring region is arranged around the periphery of the light-emitting chip; the periphery of the light-emitting chip has a peripheral light-emitting surface;

[0008] 3) A fluorescent adhesive layer is provided in the middle area, the fluorescent adhesive layer fills the inner ring area and covers the light-emitting chip;

[0009] 4) A light-transmitting adhesive layer is provided on the substrate, wherein the lower portion of the light-transmitting adhesive layer is embedded in the light-emitting area, covering the fluorescent adhesive layer and the inner dam, forming an integral structure with the substrate; the upper portion of the light-transmitting adhesive layer extends to the upper portion of the substrate, forming an upper section.

[0010] Furthermore, in the preparation step 1), the outer periphery of the inner dam extends to the outer reflective side wall and is connected to the outer reflective side wall to form a whole; in the preparation step 4), the lower part of the fluorescent glue layer covers the top of the inner dam.

[0011] Furthermore, in the preparation step 1), there is an outer ring area between the outer periphery of the inner dam and the outer reflective side wall, and the outer ring area is arranged around the outer periphery of the inner dam; in the preparation step 4), the lower part of the transparent adhesive layer is embedded in the outer ring area.

[0012] Furthermore, in the preparation step 1), the top of the inner dam is lower than the top of the light-emitting area, the inner side of the inner dam has an inner reflective side wall facing the light-emitting chip, and the inner reflective side wall is arranged around the outer periphery of the light-emitting chip; along the bottom-up direction of the inner dam, the inner reflective side wall is arranged obliquely away from the light-emitting chip; the inner reflective side wall reflects the light emitted from the outer peripheral light-emitting surface so that the light is irradiated outward away from the light-emitting area.

[0013] Furthermore, in the preparation step 1), the outer reflective side wall is arranged obliquely away from the light-emitting chip along the bottom-up direction of the substrate; the outer reflective side wall reflects the light emitted from the peripheral light-emitting surface so that the light is directed outward away from the light-emitting area.

[0014] Furthermore, in the preparation step 3), the top of the fluorescent glue layer has an inner top surface, and the inner top surface is arched upward in an arc shape.

[0015] Furthermore, in the preparation step 4), the top of the upper portion has an external top surface, the external top surface is arched upward in an arc shape, and the curvature of the internal top surface is greater than the curvature of the external top surface.

[0016] Furthermore, in the preparation step 3), after the fluorescent glue layer is arranged on the central area, the middle part of the internal top surface is recessed downward to form a downward recessed embedded groove, and the diameter of the embedded groove gradually decreases along the depth direction of the embedded groove; in the preparation step 4), the lower part of the light-transmitting glue layer is embedded in and filled with the embedded groove, forming a whole with the fluorescent glue layer.

[0017] Furthermore, in the preparation step 1), a peripheral dam is provided on the substrate, the peripheral dam is arranged around the circumference of the light-emitting area, the inner side of the peripheral dam has an inward sidewall, the inward sidewall is formed with an upwardly arranged annular step, a plurality of the annular steps are arranged at intervals along the height direction of the inward sidewall, and the annular steps are arranged around the circumference of the peripheral dam;

[0018] The outer dam is provided with a plurality of reinforcement holes, which are arranged around the circumference of the outer dam; the inner sections of the reinforcement holes penetrate the inner side wall to form inner openings, the outer ends of the reinforcement holes are formed in the outer dam, and along the direction from the inner end to the outer end of the reinforcement holes, the reinforcement holes are arranged to face downward for cleaning;

[0019] The peripheral dam has a plurality of longitudinally arranged overflow holes, which are arranged around the circumference of the peripheral dam; the bottoms of the overflow holes are connected to the outer ends of the reinforcement holes, and the tops of the overflow holes pass through the top of the peripheral dam to form a top opening; the top of the peripheral dam is provided with a top groove, which is arranged around the circumference of the peripheral dam, and the top opening is formed at the bottom of the top groove;

[0020] In the preparation step 4), when the light-transmitting adhesive layer is arranged in the light-emitting area, the light-transmitting adhesive layer covers the annular step and enters the reinforcement hole through the inner opening, filling the reinforcement hole and the overflow hole. The light-transmitting adhesive layer overflows into the top groove through the top opening, forming a top ring segment filled in the top groove; the outer dam and the top ring segment respectively abut the outer periphery of the upper segment.

[0021] Furthermore, in the preparation step 4), a plurality of top ring segments are formed in the top groove, and the plurality of top ring segments are arranged circumferentially and spaced apart along the circumference of the peripheral dam. The plurality of top ring segments are respectively in contact with the outer circumference of the upper segment, forming an integral body with the upper segment.

[0022] Compared with the prior art, the method for preparing a high-concentration LED light source provided by the present invention forms a central area in the light-emitting area by arranging an inner dam, and a light-emitting chip is arranged in the central area to form an inner ring area. The inner ring area is filled by arranging a fluorescent adhesive layer and covers the light-emitting chip. A light-transmitting adhesive layer is then arranged on the substrate. The lower portion of the light-transmitting adhesive layer is embedded in the light-emitting area to form an integrated structure with the substrate, and the upper portion extends upward. Light emitted by the light-emitting chip is irradiated outward through the fluorescent adhesive layer and the light-transmitting adhesive layer to achieve the required lighting requirements.

[0023] Secondly, the lower part of the light-transmitting adhesive layer is embedded in the light-emitting area, which can form a more stable overall structure with the substrate. The lower part of the light-transmitting adhesive layer is circumferentially restricted by the light-emitting area, which limits the excessive flow of the light-transmitting adhesive layer toward the periphery. The upper section of the light-transmitting adhesive layer can be kept in a higher arch shape to limit the range of light exposure and achieve a high-concentration illumination effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a flow chart of the method for preparing a high-concentration LED light source provided by the present invention.

[0025] Figure 2 This is a schematic diagram of the main view of the high-concentration LED light source provided by the present invention;

[0026] Figure 3 It is a partial front view schematic diagram of the high-concentration LED light source provided by the present invention. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0028] The implementation of the present invention is described in detail below with reference to specific embodiments.

[0029] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", etc. indicate the orientation or position relationship, they are based on the orientation or position relationship shown in the drawings. This is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0030] Reference Figure 1-3 The figure shows a preferred embodiment of the present invention.

[0031] A method for preparing a high-concentration LED light source includes the following steps:

[0032] 1) Providing a substrate 100, wherein a recessed light-emitting area is defined in the substrate 100, and an inner dam 400 is defined in the light-emitting area, the inner dam 400 surrounding a central area; and an outer reflective sidewall 102 is defined on the periphery of the light-emitting area, the outer reflective sidewall 102 surrounding the periphery of the light-emitting area;

[0033] 2) A light-emitting chip 300 is disposed on the central region. An inner ring region 103 is provided between the light-emitting chip 300 and the inner sidewall of the central region. The inner ring region 103 is arranged around the periphery of the light-emitting chip 300. The periphery of the light-emitting chip 300 has a peripheral light-emitting surface.

[0034] 3) A fluorescent adhesive layer 500 is provided in the middle area. The fluorescent adhesive layer 500 fills the inner ring area 103 and covers the light emitting chip 300;

[0035] 4) A light-transmitting adhesive layer 200 is provided on the substrate 100. The lower portion of the light-transmitting adhesive layer 200 is embedded in the light-emitting area, covering the fluorescent adhesive layer 500 and the inner dam 400, forming an integral structure with the substrate 100; the upper portion of the light-transmitting adhesive layer 200 extends to the top of the substrate 100, forming an upper section.

[0036] The above-mentioned method for preparing a high-concentration LED light source forms a central area in the light-emitting area by arranging an inner dam 400, and sets a light-emitting chip 300 in the central area to form an inner ring area 103. The inner ring area 103 is filled by arranging a fluorescent glue layer 500, and the light-emitting chip 300 is covered. Then, a translucent glue layer 200 is arranged on the substrate 100, and the lower part of the translucent glue layer 200 is embedded in the light-emitting area to form an integrated structure with the substrate 100, and the upper section is extended upward. The light emitted by the light-emitting chip 300 is irradiated outward through the fluorescent glue layer 500 and the translucent glue layer 200 to meet the required lighting requirements.

[0037] Secondly, the lower part of the light-transmitting adhesive layer 200 is embedded in the light-emitting area, and can form a more stable overall structure with the substrate 100. The lower part of the light-transmitting adhesive layer 200 is circumferentially restricted by the light-emitting area, which limits the excessive flow of the light-transmitting adhesive layer 200 toward the periphery, and can maintain the upper section of the light-transmitting adhesive layer 200 to form a higher arch shape to limit the light irradiation range and achieve a high-concentration irradiation effect.

[0038] In step 1), the periphery of the inner dam 400 extends to the outer reflective sidewall 102, abutting against the outer reflective sidewall 102 to form a single piece. In step 4), the lower portion of the fluorescent adhesive layer 500 covers the top of the inner dam 400. This facilitates the formation of the inner dam 400, and the abutment of the inner dam 400 against the outer reflective sidewall 102 strengthens the overall structure of the inner dam 400 and the substrate 100.

[0039] Alternatively, as another embodiment, in step 1), an outer ring region 101 is defined between the outer periphery of the inner dam 400 and the outer reflective sidewall 102, and the outer ring region 101 is arranged along the outer periphery of the inner dam 400; in step 4), the lower portion of the light-transmitting adhesive layer 200 is embedded in the outer ring region 101. Thus, by arranging the inner dam 400 in the light-emitting area, an inner ring region 103 and an outer ring region 101 are formed, the fluorescent adhesive layer 500 fills the inner ring region 103, and the lower portion of the light-transmitting adhesive layer 200 is embedded in the outer ring region 101.

[0040] In this embodiment, in preparation step 1), the top of the inner dam 400 is lower than the top of the light-emitting area, and the inner side of the inner dam 400 has an inner reflective side wall 401 facing the light-emitting chip 300, and the inner reflective side wall 401 is arranged around the outer periphery of the light-emitting chip 300; along the bottom-up direction of the inner dam 400, the inner reflective side wall 401 is arranged obliquely away from the light-emitting chip 300; the inner reflective side wall 401 reflects the light emitted from the outer peripheral light-emitting surface so that the light is directed away from the light-emitting area and irradiated outward.

[0041] The light emitted from the peripheral light-emitting surface of the light-emitting chip 300 passes through the fluorescent glue layer 500 and irradiates the inner reflective side wall 401. Then, the light is reflected by the inner reflective side wall 401 and irradiates outward away from the light-emitting area, thereby greatly improving the light efficiency of the LED light source.

[0042] In this embodiment, in the preparation step 1), the outer reflective side wall 102 is arranged tilted away from the light-emitting chip 300 along the bottom-up direction of the substrate 100; the outer reflective side wall 102 reflects the light emitted from the peripheral light-emitting surface so that the light is directed away from the light-emitting area and irradiated outward.

[0043] The outer reflective sidewalls 102 also reflect light from the peripheral light-emitting surface. First, some of the light is reflected by the inner reflective sidewalls 401. Some of the light that is not reflected by the inner reflective sidewalls 401 is then directed outwards to the outer reflective sidewalls 102. This reflection by the outer reflective sidewalls 102 significantly improves the luminous efficiency of the LED light source.

[0044] In this embodiment, in step 3), the top of the fluorescent adhesive layer 500 has an inner top surface 501 that is arched upward. This allows light emitted by the light-emitting chip 300 to initially focus as it passes through the fluorescent adhesive layer 500 and then, upon passing through the transparent adhesive layer 200, to achieve a secondary focusing effect. This achieves highly concentrated illumination from the LED light source.

[0045] In this embodiment, in preparation step 4), the top portion of the upper portion has an outer top surface 201 that arches upward in an arc shape, and the curvature of the inner top surface 501 is greater than that of the outer top surface 201. First, the light-concentrating effects of the inner top surface 501 and the outer top surface 201, respectively, can achieve a high light-concentrating effect. Second, the upward arch of the inner top surface 501 increases the contact area between the inner top surface 501 and the light-transmitting adhesive layer 200. This allows the upper section of the light-transmitting adhesive layer 200 to arch upward even higher, thereby limiting the flow of light from the upper section toward the periphery.

[0046] In this embodiment, in preparation step 3), after the fluorescent glue layer 500 is arranged on the middle area, the middle part of the internal top surface 501 is recessed downward to form a downward recessed embedded groove 502. Along the depth direction of the embedded groove 502, the diameter of the embedded groove 502 gradually decreases; in preparation step 4), the lower part of the transparent glue layer 200 is embedded in the embedded groove 502 to form a whole with the fluorescent glue layer 500.

[0047] By forming an embedded groove 502 in the middle of the fluorescent adhesive layer 500, during the arrangement of the light-transmitting adhesive layer 200, the lower portion of the light-transmitting adhesive layer 200 will be embedded in the embedded groove 502, so that the connection between the lower portion of the light-transmitting adhesive layer 200 and the fluorescent adhesive layer 500 is more stable and integrated. In addition, the light-transmitting adhesive layer 200 can cooperate with the substrate 100 to better support the light-transmitting adhesive layer 200, so that the upper section of the light-transmitting adhesive layer 200 can form a larger arch upward to achieve the requirement of high light concentration.

[0048] In this embodiment, in preparation step 1), a peripheral dam 600 is provided on the substrate 100. The peripheral dam 600 is arranged around the circumference of the light-emitting area. The inner side of the peripheral dam 600 has an inward sidewall, and an upwardly arranged annular step 603 is formed on the inward sidewall. The multiple annular steps 603 are arranged at intervals along the height direction of the inward sidewall. The annular steps 603 are arranged around the circumference of the peripheral dam 600.

[0049] The peripheral dam 600 is provided with a plurality of reinforcement holes 602, which are arranged around the circumference of the peripheral dam 600. The inner sections of the reinforcement holes 602 penetrate the inner side wall to form inner openings. The outer ends of the reinforcement holes 602 are formed in the peripheral dam 600, and the reinforcement holes 602 are arranged to face downward from the inner end to the outer end.

[0050] The peripheral dam 600 has a plurality of longitudinally arranged overflow holes 601 arranged around the circumference of the peripheral dam 600. The bottom of the overflow hole 601 is connected to the outer end of the reinforcement hole 602, and the top of the overflow hole 601 passes through the top of the peripheral dam 600 to form a top opening. The top of the peripheral dam 600 is provided with a top groove, which is arranged around the circumference of the peripheral dam 600, and the top opening is formed at the bottom of the top groove.

[0051] In preparation step 4), when the light-transmitting adhesive layer 200 is arranged in the light-emitting area, the light-transmitting adhesive layer 200 covers the annular step 603 and enters the reinforcement hole 602 through the inner opening, filling the reinforcement hole 602 and the overflow hole 601. The light-transmitting adhesive layer 200 overflows into the top groove through the top opening, forming a top ring segment 700 filled in the top groove; the outer dam 600 and the top ring segment 700 respectively abut the outer periphery of the upper segment.

[0052] By forming multiple annular steps 603, the light-transmitting adhesive layer 200 abuts against the multiple annular steps 603, and the peripheral dam 600 can be used to better circumferentially limit and support the light-transmitting adhesive layer 200. The light-transmitting adhesive layer 200 is embedded in the reinforcement hole 602, and overflows into the overflow hole 601. Then, through the top opening of the overflow hole 601, it overflows into the top groove, forming a top ring segment 700. In this way, the light-transmitting adhesive layer 200 is integrated with the peripheral dam 600 through multiple methods such as internal penetration and abutment, so that the peripheral dam 600 can better support and circumferentially limit the light-transmitting adhesive layer 200.

[0053] In addition, by forming a top ring segment 700 in the top groove, the top ring segment 700 is used to abut against the outer periphery of the transparent adhesive layer 200, so as to further restrict the outer periphery of the transparent adhesive layer 200 and form an integral body with the transparent adhesive layer 200.

[0054] In this embodiment, in preparation step 4), a plurality of top ring segments 700 are formed in the top groove, and the plurality of top ring segments 700 are arranged circumferentially and spaced apart along the outer dam 600 . The plurality of top ring segments 700 are respectively in contact with the outer periphery of the upper segment, forming a whole with the upper segment.

[0055] In this way, by forming multiple top ring segments 700 and arranging them at intervals along the outer circumference of the upper segment, multiple positions abutting the outer circumference of the upper segment are formed, which can be integrated with the upper segment and further restrict the circumferential flow of the upper segment.

[0056] In this embodiment, in preparation step 4), during the process of arranging the light-transmitting adhesive layer 200, adhesive is first dispensed in the light-emitting area to form a lower section, which covers the fluorescent adhesive layer 500 and the inner dam, and the middle part of the lower section is recessed downward to form a transition groove, and a plurality of recessed positions are formed at the bottom of the transition groove.

[0057] Then, glue is dispensed on the lower section to form the above-mentioned upper section. The bottom of the upper section is embedded in the transition groove and in multiple recessed positions. In this way, under the limitation of the transition groove, the height of the upper section after glue dispensing can be better arched to achieve a further focusing effect.

[0058] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for preparing a high-concentration LED light source, characterized in that: The method comprises the following preparation steps: 1) Providing a substrate, wherein a recessed light-emitting area is provided in the substrate, wherein an inner dam is provided in the light-emitting area, and wherein the inner dam surrounds a central area; wherein the outer periphery of the light-emitting area has an outer reflective sidewall, and wherein the outer reflective sidewall surrounds the outer periphery of the light-emitting area; 2) A light-emitting chip is arranged on the central area, and an inner ring area is provided between the light-emitting chip and the inner side wall of the central area. The inner ring area is arranged around the periphery of the light-emitting chip; the periphery of the light-emitting chip has an outer peripheral light-emitting surface; 3) A fluorescent adhesive layer is provided in the middle area, the fluorescent adhesive layer fills the inner ring area and covers the light-emitting chip; 4) A light-transmitting adhesive layer is provided on the substrate, wherein the lower portion of the light-transmitting adhesive layer is embedded in the light-emitting area, covering the fluorescent adhesive layer and the inner dam, forming an integral structure with the substrate; the upper portion of the light-transmitting adhesive layer extends above the substrate to form an upper section; In the preparation step 1), a peripheral dam is provided on the substrate, the peripheral dam is arranged around the circumference of the light-emitting area, the inner side of the peripheral dam has an inward sidewall, the inward sidewall is formed with an upwardly arranged annular step, a plurality of the annular steps are arranged at intervals along the height direction of the inward sidewall, and the annular steps are arranged around the circumference of the peripheral dam; The outer dam is provided with a plurality of reinforcement holes, which are arranged around the circumference of the outer dam; the inner sections of the reinforcement holes penetrate the inner side wall to form inner openings, the outer ends of the reinforcement holes are formed in the outer dam, and along the direction from the inner end to the outer end of the reinforcement holes, the reinforcement holes are arranged to face downward for cleaning; The peripheral dam has a plurality of longitudinally arranged overflow holes, which are arranged around the circumference of the peripheral dam; the bottoms of the overflow holes are connected to the outer ends of the reinforcement holes, and the tops of the overflow holes pass through the top of the peripheral dam to form a top opening; the top of the peripheral dam is provided with a top groove, which is arranged around the circumference of the peripheral dam, and the top opening is formed at the bottom of the top groove; In the preparation step 4), when the light-transmitting adhesive layer is arranged in the light-emitting area, the light-transmitting adhesive layer covers the annular step and enters the reinforcement hole through the inner opening, filling the reinforcement hole and the overflow hole. The light-transmitting adhesive layer overflows into the top groove through the top opening, forming a top ring segment filling the top groove; the outer dam and the top ring segment respectively abut the outer periphery of the upper segment; In the preparation step 4), a plurality of top ring segments are formed in the top groove, and the plurality of top ring segments are arranged circumferentially and spaced apart along the outer dam. The plurality of top ring segments respectively abut against the outer circumference of the upper segment and form a whole with the upper segment.

2. The method for preparing a high-concentration LED light source according to claim 1, wherein: In the preparation step 1), the outer periphery of the inner dam extends to the outer reflective side wall and is connected to the outer reflective side wall to form a whole; in the preparation step 4), the lower part of the fluorescent glue layer covers the top of the inner dam.

3. The method for preparing a high-concentration LED light source according to claim 1, wherein: In the preparation step 1), an outer ring area is provided between the outer periphery of the inner dam and the outer reflective side wall, and the outer ring area is arranged around the outer periphery of the inner dam; in the preparation step 4), the lower portion of the light-transmitting adhesive layer is embedded in the outer ring area.

4. The method for preparing a high-concentration LED light source according to any one of claims 1 to 3, wherein: In the preparation step 1), the top of the inner dam is lower than the top of the light-emitting area, the inner side of the inner dam has an inner reflective side wall facing the light-emitting chip, and the inner reflective side wall is arranged around the outer periphery of the light-emitting chip; along the inner dam from bottom to top, the inner reflective side wall is arranged obliquely away from the light-emitting chip; the inner reflective side wall reflects light emitted from the outer peripheral light-emitting surface so that the light is directed outward away from the light-emitting area.

5. The method for preparing a high-concentration LED light source according to any one of claims 1 to 3, wherein: In the preparation step 1), the outer reflective sidewall is arranged obliquely away from the light-emitting chip along the bottom-up direction of the substrate; the outer reflective sidewall reflects the light emitted from the peripheral light-emitting surface so that the light is directed away from the light-emitting area and irradiated outward.

6. The method for preparing a high-concentration LED light source according to any one of claims 1 to 3, wherein: In the preparation step 3), the top of the fluorescent glue layer has an inner top surface, and the inner top surface is arched upward to form an arc shape.

7. The method for preparing a high-concentration LED light source according to claim 6, wherein: In the preparation step 4), the top of the upper portion has an outer top surface, the outer top surface is arched upward in an arc shape, and the curvature of the inner top surface is greater than that of the outer top surface.

8. The method for preparing a high-concentration LED light source according to claim 7, wherein: In the preparation step 3), after the fluorescent glue layer is arranged on the central area, the central part of the internal top surface is recessed downward to form a downwardly recessed embedded groove, and the diameter of the embedded groove gradually decreases along the depth direction of the embedded groove; in the preparation step 4), the lower part of the transparent glue layer is embedded in the embedded groove to form a whole with the fluorescent glue layer.

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