Display panel, preparation method thereof and display device

Abstract

The application discloses a display panel, a preparation method thereof and a display device. The display panel comprises a substrate and an isolation structure. The isolation structure is arranged on one side of the substrate and encloses an isolation opening. The isolation structure comprises a first isolation part and a second isolation part which are arranged in a stacking manner in a direction away from the substrate. The first isolation part is in the orthographic projection of the second isolation part on the substrate. The second isolation part comprises a protruding part arranged on the side of the first isolation part away from the substrate and extending towards the isolation opening. The protruding part is at least partially provided with a protection part on the side facing the substrate. The application improves the reliability and yield of the display panel.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel, a preparation method thereof and a display device. BACKGROUND

[0002] Organic light emitting diode (OLED) and flat display devices based on light emitting diode (LED) technology have been widely used in mobile phones, televisions, notebook computers, desktop computers and other consumer electronic products due to their high image quality, power saving, thin body and wide application range, and have become the mainstream of display devices.

[0003] However, the reliability of the current OLED display products needs to be improved. SUMMARY

[0004] Embodiments of the present application provide a display panel, a preparation method thereof and a display device, aiming to improve the reliability of OLED display products.

[0005] The first aspect of the present application provides a display panel, comprising a substrate and an isolation structure; the isolation structure is arranged on one side of the substrate, and the isolation structure encloses to form an isolation opening; the isolation structure comprises a first isolation part and a second isolation part which are sequentially stacked in a direction away from the substrate; the first isolation part is in the orthographic projection of the second isolation part on the substrate; the second isolation part comprises a protruding part arranged on the side of the first isolation part away from the substrate and extending towards the isolation opening; and the protruding part is at least partially provided with a protection part on the side facing the substrate.

[0006] According to the embodiment of the first aspect of the present application, the protection part extends to at least part of the space between the first isolation part and the second isolation part.

[0007] According to any one of the preceding embodiments of the first aspect of the present application, the material of the protection part comprises a metal oxide.

[0008] According to any one of the preceding embodiments of the first aspect of the present application, the material of the protection part comprises indium tin oxide.

[0009] According to any one of the preceding embodiments of the first aspect of the present application, the protection part comprises a main body part and an edge part on the side of the main body part facing the isolation opening; the main body part is located between the first isolation part and the second isolation part; and the edge part is arranged on the side of the protruding part facing the substrate.

[0010] According to any one of the preceding embodiments of the first aspect of the present application, the edge part is arranged in close contact with the side of the protruding part facing the substrate.

[0011] According to any one of the preceding embodiments of the first aspect of the present application, the film layer thickness of the edge portion is less than the film layer thickness of the main body portion.

[0012] According to any one of the preceding embodiments of the first aspect of the present application, the isolation structure is recessed towards the substrate to form a first recess, and a projection of the protection portion on the substrate covers a projection of the first recess on the substrate.

[0013] According to any one of the preceding embodiments of the first aspect of the present application, the film thickness of the isolation structure at the first recess is less than the film thickness of at least part of the isolation structure outside the first recess.

[0014] According to any one of the preceding embodiments of the first aspect of the present application, the display panel further comprises a pixel definition layer, the pixel definition layer is disposed between the isolation structure and the substrate, the pixel definition layer encloses a pixel opening, a projection of the pixel opening on the substrate is within a projection of the isolation opening on the substrate, the pixel definition layer is recessed towards the substrate to form a second recess, and the second recess is disposed in a spaced-apart manner from the pixel opening.

[0015] According to any one of the preceding embodiments of the first aspect of the present application, a projection of the second recess on the substrate at least partially overlaps a projection of the first recess on the substrate.

[0016] According to any one of the preceding embodiments of the first aspect of the present application, the display panel further comprises a first conductive portion, a planarization layer, and a first electrode layer; the first conductive portion is disposed between the substrate and the pixel definition layer; the planarization layer is disposed between the first conductive portion and the pixel definition layer, the planarization layer is provided with a via, and the via exposes at least part of the first conductive portion; the first electrode layer comprises a first electrode, the first electrode is disposed between the planarization layer and the pixel definition layer, and the first electrode is electrically connected to the first conductive portion through the via.

[0017] According to any one of the preceding embodiments of the first aspect of the present application, a projection of the via on the substrate at least partially overlaps a projection of the first recess on the substrate; and / or, a projection of the via on the substrate at least partially overlaps a projection of the second recess on the substrate.

[0018] According to any one of the preceding embodiments of the first aspect of the present application, a projection of the via on the substrate is at least partially within a projection of the protection portion on the substrate.

[0019] According to any one of the preceding embodiments of the first aspect of the present application, a projection of the first electrode on the substrate at least partially overlaps a projection of the isolation opening on the substrate.

[0020] According to any one of the preceding embodiments of the first aspect of the present application, the display panel further comprises a light-emitting functional layer, and the light-emitting functional layer is at least partially located within the pixel opening.

[0021] According to the first aspect of the present application, in any of the above-mentioned implementation forms of the first aspect, the display panel further comprises a second electrode layer, the second electrode layer comprises a second electrode, and the second electrode is arranged on a side of the light-emitting functional layer away from the substrate.

[0022] According to the first aspect of the present application, in any of the above-mentioned implementation forms of the first aspect, the material of the isolation structure comprises a conductive material, and the second electrode is electrically connected to the isolation structure.

[0023] According to the first aspect of the present application, in any of the above-mentioned implementation forms of the first aspect, the material of the pixel definition layer comprises an inorganic insulating material.

[0024] According to the first aspect of the present application, in any of the above-mentioned implementation forms of the first aspect, the display panel further comprises a first encapsulation layer, the first encapsulation layer comprises an encapsulation portion arranged on a side of the second electrode away from the substrate.

[0025] According to the first aspect of the present application, in any of the above-mentioned implementation forms of the first aspect, the first encapsulation layer comprises a plurality of encapsulation portions arranged at intervals.

[0026] According to the first aspect of the present application, in any of the above-mentioned implementation forms of the first aspect, a projection of the encapsulation portion on the substrate covers a projection of the corresponding isolation opening on the substrate.

[0027] According to the first aspect of the present application, in any of the above-mentioned implementation forms of the first aspect, the display panel further comprises a second encapsulation layer arranged on a side of the first encapsulation layer away from the substrate.

[0028] According to the first aspect of the present application, in any of the above-mentioned implementation forms of the first aspect, the material of the first encapsulation layer comprises an inorganic material, and / or the material of the second encapsulation layer comprises an organic material.

[0029] According to the first aspect of the present application, in any of the above-mentioned implementation forms of the first aspect, the display panel further comprises a third encapsulation layer arranged on a side of the second encapsulation layer away from the substrate.

[0030] According to the first aspect of the present application, in any of the above-mentioned implementation forms of the first aspect, the material of the third encapsulation layer comprises an inorganic material.

[0031] According to the first aspect of the present application, in any of the above-mentioned implementation forms of the first aspect, the first isolation portion has a first surface away from the substrate, and a projection of the first surface on the substrate is located within a projection of the protection portion on the substrate.

[0032] According to the first aspect of the present application, in any of the above-mentioned implementation forms of the first aspect, a projection of the first isolation portion on the substrate is located within a projection of the protection portion on the substrate.

[0033] According to the first aspect of the present application, in any of the above-mentioned implementation forms of the first aspect, a projection of the second isolation portion on the substrate is located within a projection of the protection portion on the substrate, or a projection of the second isolation portion on the substrate coincides with a projection of the protection portion on the substrate.

[0034] According to any one of the foregoing embodiments of the first aspect of the present application, the isolation structure further comprises a third isolation portion, the third isolation portion is arranged on a side of the first isolation portion facing the substrate, and a projection of the first isolation portion on the substrate is located within a projection of the third isolation portion on the substrate.

[0035] According to any one of the foregoing embodiments of the first aspect of the present application, the material of the first isolation portion comprises a conductive material, and / or the material of the third isolation portion comprises a conductive material.

[0036] The embodiments of the first aspect of the present application also provide a display panel, comprising a substrate and an isolation structure; the isolation structure is arranged on a side of the substrate, and the isolation structure encloses an isolation opening; the isolation structure comprises a first isolation portion, a protection portion and a second isolation portion arranged in sequence in a direction away from the substrate, a projection of the first isolation portion on the substrate is located within a projection of the second isolation portion on the substrate; wherein the first isolation portion has a first surface facing away from the substrate, and a projection of the protection portion on the substrate is at least partially located outside a projection of the first surface on the substrate.

[0037] According to the embodiments of the first aspect of the present application, a projection of the first surface on the substrate is located within a projection of the protection portion on the substrate.

[0038] According to any one of the foregoing embodiments of the first aspect of the present application, a side of the second isolation portion facing the substrate comprises a second surface and a third surface connected to each other, a projection of the second surface on the substrate coincides with a projection of the first surface on the substrate, a projection of the third surface on the substrate is located outside a projection of the first surface on the substrate, and the protection portion covers at least part of the third surface.

[0039] According to any one of the foregoing embodiments of the first aspect of the present application, the material of the protection portion comprises a metal oxide.

[0040] According to any one of the foregoing embodiments of the first aspect of the present application, the material of the protection portion comprises indium tin oxide.

[0041] The embodiments of the second aspect of the present application provide a preparation method of a display panel, the preparation method comprising:

[0042] forming a first isolation portion material layer, a protection portion material layer and a second isolation portion material layer in sequence on a side of the substrate;

[0043] performing a patterning process on the second isolation portion material layer to form a second isolation portion;

[0044] performing a patterning process on the protection portion material layer to form a protection portion;

[0045] performing a patterning process on the first isolation portion material layer to form a first isolation portion;

[0046] The first isolation portion has a first surface facing away from the substrate, and the protection portion is at least partially located outside the first surface in the projection of the substrate. The first isolation portion, the protection portion, and the second isolation portion jointly enclose the isolation opening.

[0047] According to the embodiment of the second aspect of the present application, before the step of patterning the second isolation portion material layer, the preparation method further comprises:

[0048] forming an etching stop layer on the side of the second isolation portion material layer facing away from the substrate;

[0049] patterning the etching stop layer to form an etching opening.

[0050] According to any one of the preceding embodiments of the second aspect of the present application, the material of the first isolation portion material layer comprises aluminum; and / or, the material of the protection portion material layer comprises indium tin oxide; and / or, the material of the second isolation portion material layer comprises titanium.

[0051] According to any one of the preceding embodiments of the second aspect of the present application, the step of patterning the second isolation portion material layer comprises:

[0052] dry etching the second isolation portion material layer through the etching opening;

[0053] The step of patterning the protection portion material layer comprises:

[0054] wet etching the protection portion material layer through the etching opening;

[0055] The step of patterning the first isolation portion material layer comprises:

[0056] wet etching the first isolation portion material layer through the etching opening.

[0057] According to any one of the preceding embodiments of the second aspect of the present application, in the step of wet etching the first isolation portion material layer through the etching opening, a developing solution is used for wet etching.

[0058] According to any one of the preceding embodiments of the second aspect of the present application, the isolation structure further comprises a third isolation portion, and before the step of forming the first isolation portion material layer on one side of the substrate, the preparation method further comprises:

[0059] forming a third isolation portion material layer on one side of the substrate;

[0060] After the step of wet etching the first isolation portion through the etching opening, the preparation method further comprises:

[0061] dry etching the third isolation portion material layer through the etching opening to form the third isolation portion.

[0062] According to any one of the preceding embodiments of the second aspect of the application, the material of the third isolation portion material layer comprises molybdenum.

[0063] According to any one of the preceding embodiments of the second aspect of the application, the method further comprises, before the step of forming the first isolation portion material layer on one side of the substrate:

[0064] forming a first electrode layer on one side of the substrate, and patterning the first electrode layer to form a first electrode;

[0065] forming a pixel definition material layer on a side of the first electrode layer facing away from the substrate.

[0066] According to any one of the preceding embodiments of the second aspect of the application, the material of the pixel definition material layer comprises an inorganic insulating material.

[0067] According to any one of the preceding embodiments of the second aspect of the application, the method further comprises, after the step of patterning the first isolation portion material layer to form the first isolation portion:

[0068] patterning the pixel definition material layer to form a pixel opening, a footprint of the pixel opening on the substrate being within a footprint of the isolation opening on the substrate.

[0069] According to any one of the preceding embodiments of the second aspect of the application, the method further comprises, before the step of forming the first electrode layer on one side of the substrate:

[0070] forming a first conductive portion and a planarization material layer in sequence on one side of the substrate;

[0071] patterning the planarization material layer to form a via, the via exposing at least part of the first conductive portion;

[0072] Preferably, the first electrode is electrically connected to the first conductive portion through the via.

[0073] According to any one of the preceding embodiments of the second aspect of the application, the method further comprises, after the step of patterning the first isolation portion material layer to form the first isolation portion:

[0074] forming, in sequence, a light-emitting material layer, a second electrode material layer and an encapsulation material layer on one side of the substrate, and patterning the encapsulation material layer, the second electrode material layer and the light-emitting material layer to form a light-emitting functional layer at least partially within the isolation opening, a second electrode, and an encapsulation portion on a side of the second electrode facing away from the substrate.

[0075] According to any one of the preceding embodiments of the second aspect of the application, the step of patterning the encapsulation material layer, the second electrode material layer and the light-emitting material layer comprises:

[0076] patterning the encapsulation material layer by dry etching; and / or,

[0077] patterning the second electrode material layer by dry etching; and / or,

[0078] patterning the light-emitting material layer by dry etching.

[0079] An embodiment of the third aspect of the present application provides a display device, which comprises the display panel of any of the embodiments of the first aspect.

[0080] According to the display panel provided in the embodiments of the present application, the display panel comprises a substrate and an isolation structure. The protection portion is arranged on at least one side of the protruding portion facing the substrate, so that at least part of the structure in the protection portion can be arranged beyond the first isolation portion in the direction parallel to the plane where the substrate is located, thereby protecting the protection portion in the etching process in the subsequent preparation process of the light-emitting functional layer and the encapsulation portion. The etching process can even damage the lower surface of the protruding portion, that is, the part of the second isolation portion exposed relative to the first isolation portion can be protected. In the embodiments of the present application, the protection portion can block the etching process of the first isolation portion, thereby protecting the integrity of the isolation structure. In the subsequent preparation of the encapsulation portion corresponding to the position, the adverse effects of encapsulation caused by the damage of the first isolation portion can be reduced, the encapsulation effect is improved, and the reliability and yield of the display panel are improved. BRIEF DESCRIPTION OF DRAWINGS

[0081] Other characteristics, objects and advantages of the present application will become more apparent from the following detailed description of non-restrictive embodiments, with reference to the attached drawings, in which the same or similar reference signs refer to the same or similar features, and the drawings are not drawn to scale.

[0082] Figure 1 is a schematic diagram of a partial top view structure of a display panel provided in an embodiment of the present application;

[0083] Figure 2 is a schematic diagram of a partial top view structure of a display panel provided in an embodiment of the present application; Figure 1 is a schematic diagram of a cross-sectional structure at A-A in the display panel;

[0084] Figure 3 is a schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application;

[0085] Figure 4 is a schematic diagram of another partial cross-sectional structure of a display panel provided in an embodiment of the present application;

[0086] Figure 5 is a schematic diagram of a partial cross-sectional structure of a display panel provided in an embodiment of the present application; Figure 4Structure schematic view of the normal projection of the substrate and the first isolation part;

[0087] Figure 6 Figure 3 is a partial cross-sectional structure schematic view of a display panel according to an embodiment of the present application;

[0088] Figure 7 Figure 4 is a partial cross-sectional structure schematic view of a display panel according to an embodiment of the present application;

[0089] Figure 8 Figure 5 is a partial cross-sectional structure schematic view of a display panel according to an embodiment of the present application;

[0090] Figure 9 Figure 6 is a partial cross-sectional structure schematic view of a display panel according to an embodiment of the present application;

[0091] Figure 10 Figure 7 is a partial cross-sectional structure schematic view of a display panel according to an embodiment of the present application;

[0092] Figure 11 Figure 8 is a partial cross-sectional structure schematic view of a display panel according to an embodiment of the present application;

[0093] Figure 12 Figure 9 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present application;

[0094] Figure 13 Figure 10 is a flow chart of a method for manufacturing a display panel according to another embodiment of the present application;

[0095] Figure 14 Figure 11 is a structure flow schematic view of a display panel during manufacturing according to an embodiment of the present application;

[0096] Figure 15 Figure 12 is a structure flow schematic view of a display panel during manufacturing according to an embodiment of the present application.

[0097] Legend of reference signs:

[0098] 1, substrate; 11, first conductive part; 12, planarization layer; 121, via hole;

[0099] 2, pixel definition layer; 20, pixel opening; 21, second groove;

[0100] 3, isolation structure; 30, isolation opening; 300, first groove; 31, first isolation part; 311, first surface; 312, fourth surface; 32, second isolation part; 321, protruding part; 322, second surface; 323, third surface; 33, third isolation part; 34, protection part; 341, main part; 342, edge part;

[0101] 41, light-emitting functional layer; 42, first electrode layer; 421, first electrode; 43, second electrode layer; 431, second electrode;

[0102] 5, first encapsulating layer; 50, encapsulating part; 6, second encapsulating layer; 7, third encapsulating layer. DETAILED DESCRIPTION

[0103] The features and exemplary embodiments of the various aspects of the present application will be described in detail below with reference to the drawings. The following detailed description is merely intended to explain the present application and is not intended in any way to limit the present application. The present application can be carried out in ways not specifically described herein without departing from the spirit and essential characteristics of the present application. The following description of the embodiments is merely provided to give a better understanding of the present application by showing examples of the present application.

[0104] It should be noted that the terms such as first and second, etc., are merely used to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between such entities or operations. Also, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed or inherent to such processes, methods, articles or devices. Without more limitations, the elements defined by the statement "include" do not exclude the presence of other identical elements in the processes, methods, articles or devices including the elements.

[0105] It should be understood that when describing the structure of a component, when a layer, a region is referred to as being "on" or "above" another layer, another region, it can mean that it is directly on or above the other layer, another region, or other layers or regions are included therebetween. Also, if the component is flipped, the layer, the region will be "under" or "below" the other layer, another region.

[0106] ​In some display panels, due to the presence of the isolation structure, a precise mask plate can be cancelled when preparing the light-emitting functional layer, and the light-emitting material is blocked by the isolation structure to form the light-emitting functional layer. When preparing light-emitting functional layers of different colors, first, a first color light-emitting material and an electrode material are uniformly evaporated, so that the first color light-emitting material and the electrode material fall into a plurality of isolated openings and are encapsulated, and then part of the encapsulating material and the first color light-emitting material and the electrode material in part of the isolated openings are etched and removed, part of the first color light-emitting material and the electrode material in part of the isolated openings and the encapsulating material covering the isolated openings are reserved, to form a light-emitting functional layer with a first color and a second electrode. Then the above operation is repeated to form a light-emitting functional layer with a second color and a light-emitting functional layer with a third color. However, when etching and removing part of the encapsulating material and etching and removing part of the first color light-emitting material and the electrode material in part of the isolated openings, the etching material may cause etching to the isolation structure. When preparing light-emitting functional layers of other colors in the subsequent process, the etching step is repeated, which further aggravates the etching to the isolation structure, and the isolation structure is easily damaged, which damages the film layer below the isolation structure and causes damage to the circuit film layer and other structures below, thereby affecting the reliability of the display panel.

[0107] To solve the above problems, embodiments of the present application provide a display panel, a preparation method thereof and a display device. The display panel, the preparation method thereof and the display device will be described below with reference to the accompanying drawings.

[0108] Please refer to Figures 1 to 4 The first aspect of the present application provides a display panel, which comprises a substrate 1 and an isolation structure 3. The isolation structure 3 is arranged on one side of the substrate 1 and encloses an isolated opening 30. The isolation structure 3 comprises a first isolation portion 31 and a second isolation portion 32 arranged in sequence in a direction away from the substrate 1. The first isolation portion 31 is in the orthographic projection of the substrate 1 within the orthographic projection of the second isolation portion 32 on the substrate 1. The second isolation portion 32 comprises a protruding portion 321 arranged on the side of the first isolation portion 31 away from the substrate 1 and extending towards the isolated opening 30. The side of the protruding portion 321 away from the substrate 1 is at least partially provided with a protective portion 34.

[0109] Optionally, the side of the protruding portion 321 away from the substrate 1 is at least partially provided with a protective portion 34, that is, the protective portion 34 is arranged on the side of the protruding portion 321 away from the substrate 1. It can be understood that the protective portion 34 covers part of the lower surface of the protruding portion 321, or the protective portion 34 covers the entire lower surface of the protruding portion 321, or the protective portion 34 can also cover the side surface of the protruding portion 321, such as the side surface facing the isolated opening 30. In some embodiments, the protective portion 34 can also cover the upper surface of the protruding portion 321.

[0110] Optionally, the structure above can be referred to in the orthographic projection direction of the substrate 1.Figure 2 The Z-axis direction is the thickness direction of the display panel.

[0111] Optionally, as shown in Figure 1 The isolation structure 3 can be in a grid shape to facilitate the division of the sub-pixels in the display panel. The hollow region in the grid-shaped isolation structure 3 can be the isolation opening 30.

[0112] The substrate 1 mainly serves as a support and can be provided with various film layer structures. The specific film layer structure of the substrate 1 is not limited in the embodiments of the present application.

[0113] In the display panel provided by the embodiments of the present application, the display panel includes a substrate 1 and an isolation structure 3. The isolation structure 3 is arranged on one side of the substrate 1 and encloses the isolation opening 30, which can be used to accommodate the light-emitting functional layer 41. The isolation structure 3 can be used to divide the sub-pixels of the display panel. The isolation structure 3 is arranged on the substrate 1 and encloses a plurality of isolation openings 30, which can separate the light-emitting material layer into a plurality of disconnected light-emitting functional layers 41, thereby reducing the crosstalk of carriers in the light-emitting functional layer 41, improving the display effect of the display panel, and reducing the development and use of the precision mask plate, thereby reducing the preparation cost.

[0114] When the light-emitting functional layer 41 is prepared, the light-emitting material layer has a large difference at the edge of the isolation opening 30. Since the second isolation part 32 has a protruding part 321 arranged towards the isolation opening 30 protruding from the first isolation part 31, that is, the first isolation part 31 is arranged concave relative to the second isolation part 32, the light-emitting material layer is difficult to connect at the edge of the isolation opening 30, thereby breaking to prepare the disconnected light-emitting functional layer 41. The protection part 34 is arranged at least on one side of the protruding part 321 towards the substrate 1, so that at least part of the structure in the protection part 34 can be arranged beyond the first isolation part 31 in the direction parallel to the plane where the substrate 1 is located, thereby protecting the protruding part 321 from the etching process in the subsequent preparation process of the light-emitting functional layer 41 and the encapsulation part 50. The etching process can even damage the lower surface of the protruding part 321, that is, the part of the second isolation part 32 exposed relative to the first isolation part 31. In the embodiments of the present application, the protection part 34 can block the etching of the first isolation part 31 in the etching process, thereby protecting the integrity of the isolation structure 3. When the encapsulation part 50 corresponding to the position is prepared later, the damage of the first isolation part 31 can be reduced, the encapsulation effect is improved, and the reliability and yield of the display panel are improved.

[0115] The composition and preparation of the isolation structure 3 (or partition structure or isolation column) are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, CN117979755A, CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, CN117396039A, CN116669480A, CN116600606A, CN117500332A, and the like, for reference.

[0116] As shown in Figure 4 and Figure 6 , the protection part 34 can be a planar structure, and the orthographic projection of the protection part 34 on the substrate 1 can overlap with the orthographic projection of the first isolation part 31 on the substrate 1 away from the surface of the substrate 1, that is, the protection part 34 is partially sandwiched between the first isolation part 31 and the second isolation part 32. Alternatively, as shown in Figure 7 and Figure 8 , the protection part 34 can also be a ring-shaped structure, and the orthographic projection of the protection part 34 on the substrate 1 can be completely located outside the orthographic projection of the first isolation part 31 on the substrate 1 away from the surface of the substrate 1, in which case the first isolation part 31 can be directly attached to the second isolation part 32.

[0117] Referring to Figures 2 to 6 , in some optional embodiments, the protection part 34 extends to at least part of the space between the first isolation part 31 and the second isolation part 32, that is, part of the protection part 34 is located between the first isolation part 31 and the second isolation part 32.

[0118] In these embodiments, the protection part 34 can not only protect the lower surface of the protruding part 321 of the second isolation part 32 from bottom to top, but also protect the upper surface of the first isolation part 31 from top to bottom. Even after etching part of the second isolation part 32 from top to bottom, the protection part 34 can still protect the first isolation part 31, protect the integrity of the first isolation part 31, and thus reduce the possibility of the entire isolation structure 3 being etched through in the thickness direction, thereby protecting the film layer below the isolation structure 3 and further improving the reliability of the display panel.

[0119] Optionally, the material of the protection part 34 comprises a metal oxide. The metal oxide has good dry etching resistance, and has a better protection effect on the first isolation part 31 and the second isolation part 32. Optionally, the metal oxide can comprise at least one of ITO (indium tin oxide), IGZO (indium gallium zinc oxide), IAZO (indium aluminum zinc oxide), ITZO (indium tin zinc oxide), IATZO (indium aluminum tin zinc oxide), and IGO (indium gallium oxide).

[0120] For example, the material of the protection part 34 comprises indium tin oxide (ITO).

[0121] For example, the material of the protection part 34 comprises indium tin oxide (ITO). Figure 3 Figure 4 In some optional embodiments, the protection part 34 comprises a main body part 341 and an edge part 342 located on a side of the main body part 341 facing the isolation opening 30, the main body part 341 is located between the first isolation part 31 and the second isolation part 32, and the edge part 342 is arranged on a side of the protruding part 321 facing the substrate 1.

[0122] In these embodiments, the main body part 341 can protect the upper surface of the first isolation part 31 from top to bottom. Even if part of the second isolation part 32 is etched from top to bottom, the protection part 34 can still protect the first isolation part 31, protect the integrity of the first isolation part 31, and thus reduce the possibility of the isolation structure 3 being etched through in the thickness direction as a whole, thereby protecting the film layer below the isolation structure 3 and improving the reliability of the display panel; the edge part 342 can protect the lower surface of the protruding part 321 of the second isolation part 32 from bottom to top, reduce the adverse effects of poor encapsulation caused by damage to the first isolation part 31, improve the encapsulation effect, and improve the reliability and yield of the display panel.

[0123] Optionally, the edge part 342 is arranged in close contact with the side of the protruding part 321 facing the substrate 1.

[0124] In these embodiments, the edge part 342 and the protruding part 321 are not arranged with other film layers therebetween, and the edge part 342 is arranged in close contact with the lower surface of the protruding part 321. It should be noted that in some other embodiments, the edge part 342 and the protruding part 321 can also be arranged with other film layers therebetween, such as other protective film layers, to further improve the protection effect on the first isolation part 31.

[0125] ​Optionally, the film layer thickness of the edge portion 342 is less than the film layer thickness of the main body portion 341. In the preparation of the protection portion 34, the edge portion 342 and the main body portion 341 can be prepared at the same time, and the forming thicknesses are the same. After the display panel is prepared and formed, since the edge portion 342 has a directly exposed surface relative to the main body portion 341, part of the exposed surface of the edge portion 342 will be damaged in the etching process, so that the average film layer thickness of the edge portion 342 is less than the average film layer thickness of the main body portion 341.

[0126] With reference to Figure 4 and Figure 5 In some optional embodiments, the first isolation portion 31 has a first surface 311 facing away from the substrate 1, and the orthographic projection of the first surface 311 on the substrate 1 is located within the orthographic projection of the protection portion 34 on the substrate 1.

[0127] In these embodiments, the protection portion 34 is arranged between the first isolation portion 31 and the second isolation portion 32, and not only completely covers the first surface 311, but also has a part arranged beyond the first isolation portion 31 in a direction parallel to the plane on which the substrate 1 is located, thereby being capable of protecting the first surface 311 and the lower surface of the second isolation portion 32 at the same time, protecting the integrity of the isolation structure 3 in the preparation of the light-emitting functional layer 41 and the encapsulation portion 50, and improving the reliability and yield of the display panel.

[0128] Optionally, the orthographic projection of the first isolation portion 31 on the substrate 1 is located within the orthographic projection of the protection portion 34 on the substrate 1.

[0129] It should be noted that the first isolation portion 31 also includes a fourth surface 312 facing toward the substrate 1, and the present application embodiments do not limit the size relationship between the first surface 311 and the fourth surface 312. Exemplarily, the orthographic projection of the first surface 311 on the substrate 1 is located within the orthographic projection of the fourth surface 312 on the substrate 1, i.e., the longitudinal section of the first isolation portion 31 can be a right trapezoidal structure.

[0130] The orthographic projection of the first isolation portion 31 on the substrate 1 is located within the orthographic projection of the protection portion 34 on the substrate 1, i.e., the orthographic projections of the first surface 311 and the fourth surface 312 on the substrate 1 are both located within the orthographic projection of the protection portion 34 on the substrate 1. This design can ensure that the protection portion 34 has a relatively large projection area on the substrate 1, so as to increase the area of the protection portion 34 covering the lower surface of the protruding portion 321, improve the protection effect of the protection portion 34 on the protruding portion 321, and improve the reliability.

[0131] The orthogonal projection of the protection part 34 on the substrate 1 is not a ring structure, but a planar structure. In this way, during the preparation of the isolation structure 3, the first isolation part 31 material layer, the protection part 34 material layer, and the second isolation part 32 material layer can be formed in sequence, and then the first isolation part 31, the protection part 34, and the second isolation part 32 can be formed through a patterning process. This preparation method is simple and efficient.

[0132] The orthogonal projection of the second isolation part 32 on the substrate 1 can be located within the orthogonal projection of the second isolation part 32 on the substrate 1, the orthogonal projection of the second isolation part 32 on the substrate 1 can be completely coincident with the orthogonal projection of the protection part 34 on the substrate 1, or the orthogonal projection of the protection part 34 on the substrate 1 can be partially located outside the orthogonal projection of the second isolation part 32 on the substrate 1.

[0133] In some optional embodiments, the orthogonal projection of the second isolation part 32 on the substrate 1 is located within the orthogonal projection of the protection part 34 on the substrate 1; or, the orthogonal projection of the second isolation part 32 on the substrate 1 coincides with the orthogonal projection of the protection part 34 on the substrate 1.

[0134] This design can further increase the area of the orthogonal projection of the protection part 34 on the substrate 1, thereby further increasing the area of the protection part 34 covering the lower surface of the protruding part 321, improving the protection effect of the protection part 34 on the protruding part 321, and improving the reliability. Optionally, in the direction parallel to the plane on which the substrate 1 is located, the protection part 34 at least partially protrudes beyond the second isolation part 32, that is, the orthogonal projection of the protection part 34 on the substrate 1 is partially located outside the orthogonal projection of the second isolation part 32 on the substrate 1.

[0135] Reference Figure 2 and Figure 3 In some optional embodiments, the isolation structure 3 is recessed to form a first recess 300 toward the substrate 1, and the orthogonal projection of the protection part 34 on the substrate 1 covers the orthogonal projection of the first recess 300 on the substrate 1.

[0136] Optionally, the film thickness of the isolation structure 3 at the first recess 300 is smaller than the film thickness of at least part of the isolation structure 3 located outside the first recess 300.

[0137] The formation of the first recess 300 can be that when the isolation structure 3 is formed on the substrate 1, the underlying film layer has a relatively recessed area, and when the isolation structure 3 is prepared, the isolation structure 3 will also form a first recess 300 similar to the recess. It can also be that due to the preparation process during the preparation of the isolation structure 3, the isolation structure 3 itself has a weak position to form the first recess 300.

[0138] In the embodiments, due to the existence of the gap, the overall film layer thickness of the isolation structure 3 at the first groove 300 is relatively thin compared to the overall film layer thickness at the flat part, and thus the protection capability of the position is weak and the first groove 300 is easily etched. The orthographic projection of the protection part 34 covers the orthographic projection of the first groove 300 on the substrate 1. The main part 341 in the protection part 34 can provide protection for the first isolation part 31 at the first groove 300, and the overall strength of the isolation structure 3 at the first groove 300 can be increased, and the etching resistance of the isolation structure 3 can be improved, so as to protect the weak area of the isolation structure 3, and the weak area of the isolation structure 3 is not easily etched in the subsequent process of preparing the light-emitting functional layer 41, so that the isolation structure 3 can protect the underlying circuit film layer and other structures, and the display panel is not prone to display defects, and the reliability and yield of the display panel are improved.

[0139] Optionally, the display panel includes a light-emitting functional layer 41, and the light-emitting functional layer 41 is used to realize light-emitting display of the display panel. One light-emitting functional layer 41 can be arranged in correspondence with one isolation opening 30.

[0140] Reference Figure 2 In some optional embodiments, the display panel further includes a first electrode layer 42, and the first electrode layer 42 includes a first electrode 421 arranged between the substrate 1 and the light-emitting functional layer 41.

[0141] Optionally, the display panel further includes a second electrode layer 43, and the second electrode layer 43 includes a second electrode 431 arranged on a side of the light-emitting functional layer 41 away from the substrate 1. One of the first electrode 421 and the second electrode 431 can serve as an anode, and the other can serve as a cathode to drive the light-emitting functional layer 41 to emit light. The embodiments of the present application take the first electrode 421 as the anode of the display panel and the second electrode 431 as the cathode of the display panel as an example.

[0142] Optionally, the orthographic projection of the first electrode 421 on the substrate 1 at least partially overlaps the orthographic projection of the isolation opening 30 on the substrate 1. By preparing the light-emitting functional layer 41 and the second electrode 431 in the isolation opening 30, the light-emitting functional layer 41 can be driven to emit light by the first electrode 421 and the second electrode 431.

[0143] Optionally, the light-emitting functional layer 41 can include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting structure, an electron injection layer (EIL), and an electron transport layer (ETL).

[0144] In some optional embodiments, the material of the isolation structure 3 comprises a conductive material, and the second electrode 431 is electrically connected with the isolation structure 3. The isolation structure 3 separates the second electrode layer 43 to form mutually spaced second electrodes 431, which are electrically connected through the isolation structure 3 to form a full-area electrode, thereby ensuring normal light emission of the light-emitting functional layer 41.

[0145] Optionally, the material of the first isolation portion 31 can comprise a conductive material, and the second electrode 431 can be connected with the first isolation portion 31, so that the second electrodes 431 of adjacent sub-pixels can be electrically connected through the first isolation portion 31.

[0146] Optionally, when the light-emitting functional layer 41 and the second electrode layer 43 of the display panel are evaporated, the second isolation portion 32 can shield at least part of the material used to prepare the light-emitting functional layer 41 and the second electrode layer 43, so as to separate the light-emitting functional layer 41 and the second electrode layer 43 between adjacent sub-pixels, and facilitate the formation of a plurality of spaced light-emitting functional layers 41 located in the isolation opening 30 and a plurality of spaced second electrodes 431 located in the isolation opening 30, thereby eliminating the need to set a mask plate with high precision when evaporating the light-emitting functional layer 41 and the second electrode layer 43 of the display panel, for example, eliminating the need to set a fine metal mask (FMM) when evaporating the light-emitting functional layer 41 and the second electrode layer 43, thereby better reducing the production cost of the display panel.

[0147] Reference Figure 2 and Figure 3 In some optional embodiments, the display panel further comprises a pixel definition layer 2, which is arranged between the isolation structure 3 and the substrate 1. The pixel definition layer 2 encloses a pixel opening 20, the orthographic projection of the pixel opening 20 on the substrate 1 is located within the orthographic projection of the isolation opening 30 on the substrate 1, the pixel opening 20 can be in communication with the isolation opening 30, and the pixel definition layer 2 is recessed to form a second recess 21 toward the substrate 1, and the second recess 21 is arranged spaced apart from the pixel opening 20. The formation of the second recess 21 can refer to the first recess 300, which will not be described here.

[0148] Optionally, the light-emitting functional layer 41 is at least partially located in the pixel opening 20. The pixel opening 20 is used to expose at least part of the first electrode 421, so as to facilitate the electrical connection between the light-emitting functional layer 41 and the first electrode 421 formed in the pixel opening 20. The relative positional relationship between the isolation structure 3 and the pixel definition layer 2 can be set in various ways, for example, the isolation structure 3 can be arranged on the side of the pixel definition layer 2 away from the substrate 1, or the pixel definition layer 2 can be provided with a relief opening, and the isolation structure 3 can be located in the relief opening.

[0149] Optionally, the pixel definition layer 2 is located between the isolation structure 3 and the first electrode 421. Optionally, the material of the pixel definition layer 2 includes inorganic insulating material, which can include silicon nitride, or silicon nitride and silicon oxide, etc., and the pixel definition layer 2 separates the first electrode 421 from the isolation structure 3, so as to avoid short circuit connection between the first electrode 421 and the second electrode 431.

[0150] Optionally, the second recess 21 is at least partially overlapped with the first recess 300 in the orthographic projection of the substrate 1.

[0151] In these embodiments, the second recess 21 and the first recess 300 can be formed due to the recesses of the underlying film layers, and the second recess 21 and the first recess 300 are formed above the recesses, respectively, so that the second recess 21 is at least partially overlapped with the first recess 300 in the orthographic projection of the substrate 1.

[0152] In some optional embodiments, the display panel further includes a first conductive part 11, a planarization layer 12 and a first electrode layer 42; the first conductive part 11 is disposed between the substrate 1 and the pixel definition layer 2; the planarization layer 12 is disposed between the first conductive part 11 and the pixel definition layer 2, and the planarization layer 12 is provided with a via hole 121, which exposes at least part of the first conductive part 11; the first electrode layer 42 includes the first electrode 421, which is disposed between the planarization layer 12 and the pixel definition layer 2, and the first electrode 421 is electrically connected with the first conductive part 11 through the via hole 121.

[0153] Optionally, the via hole 121 is at least partially overlapped with the first recess 300 in the orthographic projection of the substrate 1; and / or, the via hole 121 is at least partially overlapped with the second recess 21 in the orthographic projection of the substrate 1.

[0154] The via hole 121 is at least partially overlapped with the first recess 300 in the orthographic projection of the substrate 1, which means that the orthographic projection of the via hole 121 is located in the orthographic projection of the first recess 300, or the orthographic projection of the via hole 121 is located in the orthographic projection of the first recess 300, or the orthographic projection of the via hole 121 and the orthographic projection of the first recess 300 coincide or have no overlapping part.

[0155] In the optional embodiments, the first recess 300 of the isolation structure 3 and the second recess 21 of the pixel definition layer 2 are both formed due to the via 121. To realize the connection between the first electrode 421 and the first conductive part 11, the via 121 is formed on the planarization layer 12 to expose part of the first conductive part 11, and then the first electrode layer 42 is prepared to facilitate the electrical connection between the first electrode 421 and the first conductive part 11, and then the electrical signal is provided for the light-emitting functional layer 41. Then, when the pixel definition layer 2 and the isolation structure 3 are prepared on the first electrode layer 42, the pixel definition layer 2 is recessed towards the via 121 at the position of the via 121 to form the second recess 21, and the isolation structure 3 is recessed towards the via 121 at the position of the via 121 to form the first recess 300. Therefore, the orthographic projection of the first recess 300 on the substrate 1 at least partially overlaps the orthographic projection of the via 121 on the substrate 1, and the orthographic projection of the second recess 21 on the substrate 1 at least partially overlaps the orthographic projection of the via 121 on the substrate 1.

[0156] Optionally, the planarization layer 12 comprises an organic insulating material. The planarization layer 12 comprises an organic insulating material so as to have good flow and insulation effects.

[0157] Optionally, the isolation structure 3 is insulatively arranged with the first conductive part 11. The insulative arrangement of the isolation structure 3 with the first conductive part 11 can prevent the anode and the cathode from short-circuiting.

[0158] Optionally, an array layer can be further included between the substrate 1 and the light-emitting functional layer 41, and the array layer can comprise a pixel circuit. The first conductive part 11 can be a conductive layer directly electrically connected with the first electrode 421 in the pixel circuit. For example, the array layer can further comprise a second conductive layer and a third conductive layer which are sequentially arranged with the first conductive part 11 in the direction close to the substrate 1. Insulating layers are arranged between adjacent conductive layers. For example, the pixel circuit arranged in the array layer comprises a transistor and a storage capacitor. The transistor comprises a semiconductor, a gate, a source and a drain. The storage capacitor comprises a first plate and a second plate.

[0159] Optionally, the orthographic projection of the via 121 on the substrate 1 is located within the orthographic projection of the protection part 34 on the substrate 1.

[0160] The orthographic projection of the via 121 on the substrate 1 is located within the orthographic projection of the protection part 34 on the substrate 1, which means that the protection part 34 completely covers the via 121, and the coverage range of the protection part 34 is greater than the area of the orthographic projection of the via 121 on the substrate 1.

[0161] In the embodiments, the protection part 34 is arranged between the first isolation part 31 and the second isolation part 32 of the isolation structure 3, and the through hole 121 is located in the orthographic projection of the substrate 1 within the orthographic projection of the protection part 34 on the substrate 1, so that the weak area of the isolation structure 3 affected by the through hole 121 is protected. In the subsequent process of preparing the light-emitting functional layer 41, the protection part 34 can block the damage of the etching process to the isolation structure 3, so as to protect the integrity of the isolation structure 3, so that the weak area of the isolation structure 3 is not easy to be etched through, especially the first isolation part 31, so that the isolation structure 3 can protect the structure such as the circuit film layer below, and the problem of display failure is not easy to occur, and the yield and use performance of the display panel are improved. The circuit film layer can be the first electrode 421 and the first conductive part 11.

[0162] In some optional embodiments, the display panel further comprises a first encapsulation layer 5, and the first encapsulation layer 5 comprises an encapsulation part 50 located on a side of the light-emitting functional layer 41 away from the substrate 1. The encapsulation part 50 is used for encapsulating the light-emitting functional layer 41. The number of the light-emitting functional layer 41 is multiple, and the multiple encapsulation parts 50 can be arranged one by one corresponding to the multiple light-emitting functional layers 41. Optionally, the multiple encapsulation parts 50 are arranged at intervals. Optionally, the material of the first encapsulation layer 5 can be inorganic material, which has good density and water vapor prevention effect, and has good encapsulation effect with thin thickness. The first encapsulation layer 5 can be prepared by a chemical vapor deposition (CVD) process.

[0163] Optionally, the second electrode 431 is located between the light-emitting functional layer 41 and the encapsulation part 50.

[0164] Optionally, the orthographic projection of the encapsulation part 50 on the substrate 1 covers the orthographic projection of the corresponding isolation opening 30 on the substrate 1. Optionally, the encapsulation part 50 extends to a side of the isolation structure 3 away from the substrate 1 through the side wall of the isolation structure 3 facing the isolation opening 30.

[0165] In the embodiments, the encapsulation part 50 completely covers and encapsulates the isolation opening 30. The encapsulation part 50 is located on a side of the light-emitting functional layer 41 away from the substrate 1 and covers the side wall of the isolation structure 3 facing the isolation opening 30, and extends to a side of the isolation structure 3 away from the substrate 1, so as to completely and continuously encapsulate the inside and the periphery of the isolation opening 30, and improve the encapsulation effect of the display panel.

[0166] Reference Figure 9 and Figure 10In some optional embodiments, the isolation structure 3 further comprises a third isolation portion 33, which is disposed on a side of the first isolation portion 31 facing the substrate 1, and a projection of the first isolation portion 31 on the substrate 1 is located within a projection of the third isolation portion 33 on the substrate 1. For example, the third isolation portion 33 protrudes from the first isolation portion 31 towards the isolation opening 30. Optionally, the third isolation portion 33 can be made of a conductive material, and the second electrode 431 can be connected to the third isolation portion 33, so that the second electrodes 431 of adjacent sub-pixels can be electrically connected through the third isolation portion 33. By disposing the third isolation portion 33 to protrude from the first isolation portion 31 towards the isolation opening 30, the third isolation portion 33 can have a larger size to facilitate connection with the second electrode 431.

[0167] Optionally, the second isolation portion 32 is made of titanium (Ti) or molybdenum (Mo), the first isolation portion 31 is made of aluminum (Al), silver (Ag) or copper (Cu), and the third isolation portion 33 is made of titanium (Ti) or molybdenum (Mo). For example, the isolation structure 3 is a three-layer metal composite material of Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum).

[0168] Referring to Figure 11 Optionally, the display panel further comprises a second encapsulation layer 6 disposed on a side of the first encapsulation layer 5 facing away from the substrate 1. Optionally, the display panel further comprises a third encapsulation layer 7 disposed on a side of the second encapsulation layer 6 facing away from the substrate 1. The second encapsulation layer 6 can be made of an organic material, so that the second encapsulation layer 6 has good flowability and the surface of the side of the second encapsulation layer 6 facing away from the substrate 1 is relatively flat. The third encapsulation layer 7 can be made of an inorganic material to further improve the encapsulation effect of the display panel. Optionally, the second encapsulation layer 6 can be prepared by an ink jet printing (IJP) technology, and the third encapsulation layer 7 can be prepared by a chemical vapor deposition process.

[0169] Optionally, the display panel further comprises a touch layer, a polarizing layer and a cover plate disposed on the third encapsulation layer 7. The touch layer can be used to realize touch work of the display panel, the polarizing layer can be used for light filtering to improve the display effect of the display panel, and the cover plate can be used to protect the underlying film layers to improve the strength of the display panel.

[0170] In some optional embodiments, the display panel further comprises a light emitting device, at least part of the light emitting device is located in the isolation opening 30, the light emitting device comprises a first electrode 421, a light emitting functional layer 41 and a second electrode 431 which are sequentially stacked in a direction away from the substrate 1; a projection of the via 121 on the substrate 1 is located outside a projection of the isolation opening 30 on the substrate 1; and the first electrode 421 is electrically connected to the first conductive portion 11 through the via 121. The light emitting device and the isolation opening 30 can be one-to-one corresponding.

[0171] Optionally, the display panel comprises a plurality of light emitting devices with different light emitting colors, and the light emitting devices with different light emitting colors are located in different isolation openings 30. Exemplarily, the colors of the light emitting devices can be three, which are red, green and blue respectively. The types of the isolation openings 30 correspond to the colors of the light emitting devices, and can also be three types.

[0172] Please refer to Figures 1 to 11 The first aspect of the present application also provides a display panel, comprising a substrate 1 and an isolation structure 3; the isolation structure 3 is arranged on one side of the substrate 1, and the isolation structure 3 encloses to form an isolation opening 30, and the isolation structure 3 comprises a first isolation part 31, a protection part 34 and a second isolation part 32 which are sequentially stacked away from the substrate 1, and the first isolation part 31 is in the orthographic projection of the substrate 1 within the orthographic projection of the second isolation part 32 on the substrate 1; wherein the first isolation part 31 has a first surface 311 away from the substrate 1, and the orthographic projection of the protection part 34 on the substrate 1 is at least partially outside the orthographic projection of the first surface 311 on the substrate 1.

[0173] In the display panel provided by the embodiments of the present application, the display panel comprises a substrate 1 and an isolation structure 3, the protection part 34 is located on the side of the second isolation part 32 facing the substrate 1, and the protection part 34 is at least partially outside the orthographic projection of the first surface 311 on the substrate 1, so that at least part of the structure in the protection part 34 can be arranged beyond the first isolation part 31 in the direction parallel to the plane where the substrate 1 is located, so that in the subsequent preparation process of the light emitting functional layer 41 and the encapsulation part 50, the protection part 34 can protect the second isolation part 32 from being etched or even damaged by the etching process on the lower surface of the part exposed relative to the first isolation part 31. In the embodiments of the present application, the protection part 34 can block the etching process of the first isolation part 31, so as to protect the integrity of the isolation structure 3, and in the subsequent preparation of the encapsulation part 50 corresponding to this position, the adverse effects caused by the damage of the first isolation part 31 can be reduced, the encapsulation effect is improved, and the reliability and yield of the display panel are improved.

[0174] In some embodiments, the orthographic projection of the first surface 311 on the substrate 1 is within the orthographic projection of the protection part 34 on the substrate 1.

[0175] In the embodiments, the protection part 34 is arranged between the first isolation part 31 and the second isolation part 32 and can completely cover the first surface 311, so that the protection part 34 can protect the first surface 311 from top to bottom. Even if part of the second isolation part 32 is etched from top to bottom, the protection part 34 can still protect the first isolation part 31, thereby protecting the integrity of the first isolation part 31, reducing the possibility of the isolation structure 3 being etched through in the thickness direction as a whole, and further protecting the film layer below the isolation structure 3 to further improve the reliability of the display panel.

[0176] The orthogonal projection of the protection part 34 on the substrate 1 is a planar structure. In this way, during the preparation of the isolation structure 3, a full-surface first isolation part 31 material layer, a full-surface protection part 34 material layer, and a full-surface second isolation part 32 material layer can be formed in sequence, and then a patterning process is performed to form the first isolation part 31, the protection part 34, and the second isolation part 32. This preparation method is simple and efficient.

[0177] In some optional embodiments, the side of the second isolation part 32 facing the substrate 1 includes a second surface 322 and a third surface 323 connected to each other, the orthogonal projection of the second surface 322 on the substrate 1 coincides with the orthogonal projection of the first surface 311 on the substrate 1, and the orthogonal projection of the third surface 323 on the substrate 1 is located outside the orthogonal projection of the first surface 311 on the substrate 1. The protection part 34 covers at least part of the third surface 323.

[0178] In these optional embodiments, the second surface 322 is the part of the lower surface of the second isolation part 32 that has an area equal to and coincides with the first surface 311, and the third surface 323 is the part of the lower surface of the second isolation part 32 that protrudes relative to the first isolation part 31. By arranging the protection part 34 to cover at least part of the third surface 323, the protection part 34 can effectively protect the third surface 323 and block the etching process from etching the first isolation part 31, thereby protecting the integrity of the isolation structure 3 and improving the reliability and yield of the display panel.

[0179] Optionally, the material of the protection part 34 includes a metal oxide. The metal oxide has good dry etching resistance and can better protect the first isolation part 31 and the second isolation part 32. Optionally, the metal oxide can include at least one of ITO (indium tin oxide), IGZO (indium gallium zinc oxide), IAZO (indium aluminum zinc oxide), ITZO (indium tin zinc oxide), IATZO (indium aluminum tin zinc oxide), and IGO (indium gallium oxide).

[0180] For example, the material of the protection part 34 includes indium tin oxide (ITO).

[0181] Optionally, the display panel provided by the embodiments of the first aspect of the present application can be the display panel provided by any of the foregoing embodiments, and thus the display panel provided by the embodiments of the present application can have the beneficial effects of the display panel provided by any of the foregoing embodiments, which will not be described herein again. For example, the substrate 1 can be the substrate 1 provided by any of the foregoing embodiments. For example, the protection portion 34 can be the protection portion 34 provided by any of the foregoing embodiments. For example, the display panel can further include the first electrode layer 42 and the second electrode layer 43 provided by any of the foregoing embodiments. For example, the first electrode 421 and the second electrode 431 can be the anode and the cathode of the display panel, respectively. For example, the isolation structure 3 can be the isolation structure 3 provided by any of the foregoing embodiments, and the isolation structure 3 can include the first isolation portion 31 and the second isolation portion 32 provided by any of the foregoing embodiments, so that the isolation structure 3 can be used to isolate the material of the light-emitting functional layer 41 and the second electrode layer 43 when the light-emitting functional layer 41 and the second electrode layer 43 are prepared.

[0182] Figure 12 FIG. 1 is a flowchart of a method for preparing a display panel according to an embodiment of the present application.

[0183] Referring to Figure 12 The embodiments of the second aspect of the present application provide a method for preparing a display panel. The method for preparing a display panel can be used to prepare the display panel provided by the foregoing embodiments. The isolation structure includes a first isolation portion, a protection portion, and a second isolation portion. The method for preparing a display panel includes the following steps.

[0184] S10, sequentially forming a first isolation portion material layer, a protection portion material layer, and a second isolation portion material layer on one side of a substrate.

[0185] S20, performing a patterning process on the second isolation portion material layer to form a second isolation portion.

[0186] S30, performing a patterning process on the protection portion material layer to form a protection portion.

[0187] S40, performing a patterning process on the first isolation portion material layer to form a first isolation portion.

[0188] The first isolation portion is located in the orthographic projection of the second isolation portion on the substrate. The first isolation portion has a first surface facing away from the substrate. The orthographic projection of the protection portion on the substrate is at least partially located outside the orthographic projection of the first surface on the substrate. The first isolation portion, the protection portion, and the second isolation portion jointly enclose an isolation opening.

[0189] The isolation structure is arranged on the substrate and encloses to form a plurality of isolation openings, and the luminescent material layer can be cut off to form disconnected luminescent functional layers, so as to reduce the crosstalk of carriers in the luminescent functional layer, improve the display effect of the display panel, and reduce the development and use of the precision mask plate, thereby reducing the preparation cost.

[0190] In the preparation method of the display panel provided in the embodiment of the present application, the first isolation part material layer, the protection part material layer and the second isolation part material layer are sequentially formed, and the preparation process can be simplified and the preparation efficiency can be improved by etching from top to bottom. The orthographic projection of the formed protection part on the substrate is at least partially located outside the orthographic projection of the first surface on the substrate, so that at least part of the structure in the protection part can be arranged beyond the first isolation part in the direction parallel to the plane where the substrate is located, so that in the subsequent preparation process of the luminescent functional layer and the encapsulation part, the protection part can protect the etching process, and the etching process even damages the lower surface of the part of the second isolation part exposed relative to the first isolation part. In the embodiment of the present application, the protection part can block the etching process of the first isolation part, so as to protect the integrity of the isolation structure, and when the encapsulation part corresponding to the position is prepared later, the adverse effects of encapsulation caused by damage of the first isolation part can be reduced, the encapsulation effect is improved, and the reliability and yield of the display panel are improved.

[0191] Figure 13 is a flow of a preparation method of a display panel provided by another embodiment of the present application; Figure 14 is one of structural flow diagrams of a display panel in preparation provided by an embodiment of the present application; Figure 15 is another structural flow diagram of a display panel in preparation provided by an embodiment of the present application. Among them, Figure 14 and Figure 15 Steps a to h in are sequentially prepared, the pixel definition material layer 20' is used to form the pixel definition layer, the first isolation part material layer 31' is used to form the first isolation part 31, the second isolation part material layer 32' is used to form the second isolation part 32, the third isolation part material layer 33' is used to form the third isolation part 33, the protection part material layer 34' is used to form the protection part 34, and the etching stop layer 4' can protect the film layer structure below, and the etching opening 40' can expose the film layer structure below for etching.

[0192] Referring to Figures 13 to 15 In some optional embodiments, before step S20, the preparation method further includes:

[0193] S15, forming an etching stop layer on the side of the second isolation part material layer away from the substrate.

[0194] S16, performing a patterning process on the etching stop layer to form an etching opening.

[0195] In these embodiments, the etching stop layer can protect the covered structure so that the structure under the covered structure is not etched by the subsequent etching process, and then the exposed part can be accurately etched, thereby simplifying the patterning process and improving the efficiency. Optionally, the etching stop layer can be a photoresist, and the patterning process on the etching stop layer can include an exposure and development process.

[0196] Optionally, the step S20 includes:

[0197] The dry etching is performed on the second isolation part material layer through the etching opening.

[0198] Optionally, the material of the second isolation part can be titanium (Ti) or molybdenum (Mo), and exemplarily, the material can be titanium. The dry etching can effectively etch the second isolation part material layer through the etching opening, thereby forming the second isolation part.

[0199] The step S30 includes:

[0200] The wet etching is performed on the protection part material layer through the etching opening.

[0201] Optionally, the material of the protection part material layer can be a metal oxide, and exemplarily, the material can be ITO, which has a good dry etching resistance. The wet etching process can effectively etch the protection part material layer through the etching opening, thereby forming the protection part.

[0202] The step S40 includes:

[0203] The wet etching is performed on the first isolation part material layer through the etching opening.

[0204] Optionally, the material of the first isolation part can be aluminum (Al), silver (Ag), or copper (Cu), and exemplarily, the material can be aluminum. The wet etching can effectively remove the exposed aluminum through the etching opening, and by controlling the wet etching time, the aluminum layer can be concave relative to the titanium layer to form a partition structure.

[0205] Optionally, in the step of performing the wet etching on the first isolation part material layer through the etching opening, a developing solution is used for the wet etching. The developing solution can effectively etch aluminum, but has a weak etching effect on ITO, thereby reducing the damage to the ITO when the aluminum layer is wet etched, and improving the integrity and subsequent etching resistance of the protection part.

[0206] Optionally, the isolation structure further includes a third isolation part, and before the step S10, the preparation method further includes:

[0207] forming a third isolation portion material layer on the side of the substrate.

[0208] After the step of wet etching the first isolation portion through the etching opening, the preparation method further comprises:

[0209] dry etching the third isolation portion material layer through the etching opening to form a third isolation portion.

[0210] Optionally, the third isolation portion material is titanium (Ti) or molybdenum (Mo), and the material of the third isolation portion material layer is molybdenum, for example.

[0211] The third isolation portion material layer can be effectively etched through the etching opening by dry etching, so as to form the third isolation portion. Thus, the first isolation portion, the second isolation portion, the third isolation portion, and the protection portion are combined to form an isolation opening.

[0212] In some optional embodiments, before the step S10, and also before the step of forming the third isolation portion material layer on the side of the substrate, the preparation method further comprises:

[0213] preparing a first electrode layer on the side of the substrate, and patterning the first electrode layer to form a first electrode.

[0214] forming a pixel definition material layer on the side of the first electrode layer away from the substrate.

[0215] Optionally, the material of the pixel definition material layer comprises an inorganic insulating material.

[0216] In these optional embodiments, the first electrode can serve as an anode of a light-emitting functional layer, the pixel definition material layer is used to form a pixel definition layer, the pixel definition layer has a pixel opening to accommodate the light-emitting functional layer, the pixel definition material layer is an insulating material, and can isolate the first electrode layer and the isolation structure to avoid electrical connection therebetween.

[0217] Optionally, after the step S40, if the display panel is prepared with the third isolation portion, the step is also located after the etching process of the third isolation portion material layer, and the preparation method further comprises:

[0218] patterning the pixel definition material layer to form a pixel opening, the pixel opening being in communication with the isolation opening.

[0219] By preparing the light-emitting functional layer in the isolation opening, the light-emitting functional layer falls into the pixel opening and is overlapped with the first electrode exposed by the pixel opening.

[0220] Optionally, before the step of preparing the first electrode layer on the side of the substrate, the preparation method further comprises:

[0221] forming a first conductive portion and a planarization material layer in sequence on the side of the substrate.

[0222] The planarization material layer is patterned to form a via, the via exposing at least part of the first conductive portion.

[0223] In these embodiments, the first conductive portion can be formed by disposing a first conductive material on the substrate in a whole layer, and then performing a partial etching process on the first conductive material, and the part of the first conductive material that is protected from etching forms the first conductive portion. The first conductive portion can be used to provide an electrical signal to the first electrode. To achieve the connection between the first electrode and the first conductive portion, a via is first formed by etching the planarization layer to expose part of the first conductive portion, and then the first electrode layer is prepared to facilitate the electrical connection between the first electrode and the first conductive portion, thereby providing an electrical signal to the light-emitting functional layer. When the pixel definition layer and the isolation structure are then prepared on the first electrode layer, the pixel definition layer will be recessed towards the via at the position of the via to form a second recess, and the isolation structure will be recessed towards the via at the position of the via to form a first recess.

[0224] Optionally, the first electrode is electrically connected to the first conductive portion through the via.

[0225] In some optional embodiments, after the step of patterning the first isolation portion material layer to form the first isolation portion, the preparation method further comprises:

[0226] The light-emitting material layer, the second electrode material layer, and the encapsulation material layer are sequentially formed on one side of the substrate, and the encapsulation material layer, the second electrode material layer, and the light-emitting material layer are patterned to form a light-emitting functional layer, a second electrode, and an encapsulation portion located away from the substrate on the side of the second electrode.

[0227] Optionally, the step of patterning the encapsulation material layer, the second electrode material layer, and the light-emitting material layer comprises:

[0228] The encapsulation material layer is patterned by dry etching; and / or,

[0229] The second electrode material layer is patterned by dry etching; and / or,

[0230] The light-emitting material layer is patterned by dry etching.

[0231] In these optional embodiments, the processes of patterning the encapsulation material layer, the second electrode material layer and the light-emitting material layer can all be dry etching processes. For example, when the encapsulation material layer, the second electrode material layer and the light-emitting material layer are patterned, there are two dry etching processes, the first dry etching process removes the excess encapsulation material and part of the excess second electrode material, and the second dry etching process removes the remaining part of the excess second electrode material and the excess light-emitting material. The use of dry etching processes can effectively prevent damage to the isolation structure caused by wet etching, so that the protection part with good dry etching resistance can more effectively protect the integrity of the isolation structure.

[0232] For example, the isolation openings can include first-type isolation openings and second-type isolation openings. After step S40, the preparation method further includes:

[0233] forming a first preparation material layer, and patterning the first preparation material layer to form the light-emitting functional layer, the second electrode of the first light-emitting device located in the first-type isolation opening, and the encapsulation part located on the side of the first light-emitting device away from the substrate.

[0234] forming a second preparation material layer, and patterning the second preparation material layer to form the light-emitting functional layer, the second electrode of the second light-emitting device located in the second-type isolation opening, and the encapsulation part located on the side of the second light-emitting device away from the substrate.

[0235] In these embodiments, the first preparation material layer is prepared on the substrate in a whole layer, and then the excess first preparation material layer is etched away, and the first preparation material layer at the first-type isolation opening is reserved, thereby forming the light-emitting functional layer, the second electrode of the first light-emitting device located in the first-type isolation opening, and the encapsulation part located on the side of the first light-emitting device away from the substrate. When the excess first preparation material layer is etched, the etching process can cause over-etching damage to the isolation structure at the second-type isolation opening, and the protection part can protect the lower surface of the second isolation part, thereby improving the integrity of the isolation structure at the second-type isolation opening. When the encapsulation part corresponding to the second-type isolation opening is prepared later, the adverse effects of encapsulation caused by damage to the first isolation part can be reduced, the encapsulation effect is improved, and the reliability and yield of the display panel are further improved.

[0236] Optionally, the isolation openings further include third-type isolation openings. After the step of forming the second preparation material layer and patterning the second preparation material layer to form the light-emitting functional layer, the second electrode of the second light-emitting device located in the second-type isolation opening, and the encapsulation part located on the side of the second light-emitting device away from the substrate, the preparation method further includes:

[0237] forming a third preparation material layer, and performing a patterning process on the third preparation material layer to form the light emitting functional layer, the second electrode of the third light emitting device located in the third type of isolation opening, and the encapsulation part located on a side of the third light emitting device away from the substrate.

[0238] The preparation material layer can include a material for forming the light emitting functional layer, a material for forming the second electrode, and a material for forming the encapsulation part.

[0239] In these embodiments, the isolation structure at the third type of isolation opening is the same as the isolation structure at the second type of isolation opening. When etching away the excess first preparation material layer, the protection part can protect the lower surface of the second isolation part at the second type of isolation opening and at the third type of isolation opening, thereby improving the integrity of the isolation structure at the second type of isolation opening and at the third type of isolation opening. When etching away the excess second preparation material layer, the protection part can protect the lower surface of the second isolation part at the third type of isolation opening, thereby improving the integrity of the isolation structure at the third type of isolation opening.

[0240] Optionally, the light emitting colors of the first light emitting device, the second light emitting device, and the third light emitting device are different. For example, the light emitting colors of the light emitting devices can be red, green, and blue.

[0241] Optionally, the process of performing the patterning process on the first preparation material layer includes a dry etching process; and / or, the process of performing the patterning process on the second preparation material layer includes a dry etching process; and / or, the process of performing the patterning process on the third preparation material layer includes a dry etching process.

[0242] Embodiments of the third aspect of the present application provide a display device, which includes the display panel of any of the embodiments of the first aspect or the display panel prepared according to any of the embodiments of the second aspect. Since the display device provided by the embodiments of the third aspect of the present application includes the display panel of any of the embodiments of the first aspect or the display panel prepared according to any of the embodiments of the second aspect, the display device provided by the embodiments of the third aspect of the present application has the beneficial effects of the display panel of any of the embodiments of the first aspect or the display panel prepared according to any of the embodiments of the second aspect, which will not be described herein again.

[0243] The display device in the embodiments of the present application includes, but is not limited to, a mobile phone, a personal digital assistant (PDA), a tablet computer, an electronic book, a television, an access control, a smart fixed phone, a console, and other devices with display functions.

[0244] It should be understood that the various forms of flow shown above can be used to reorder, add, or delete steps. For example, the steps described in the present application can be performed in parallel, in series, or in a different order, as long as the desired results of the technical solutions of the present application can be achieved, which are not limited herein.

[0245] The above detailed description does not constitute a limitation on the protection scope of the present application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application.

[0246] In accordance with the embodiments of the present application described above, the embodiments do not describe all the details and limit the present application to the specific embodiments described. Obviously, many modifications and variations can be made in light of the above description. The present application selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can well utilize the present application and make modifications and uses on the basis of the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized by, The application relates to a substrate, an isolation structure arranged on one side of the substrate, the isolation structure enclosing an isolation opening, the isolation structure comprising a first isolation part and a second isolation part arranged in sequence in a direction away from the substrate, the first isolation part being in the orthographic projection of the substrate and located in the orthographic projection of the second isolation part on the substrate, the second isolation part comprising a protruding part arranged on the side of the first isolation part away from the substrate and extending towards the isolation opening, the protruding part being at least partially provided with a protection part on the side of the substrate, the protection part extending to at least part of the space between the first isolation part and the second isolation part, the material of the protection part comprising metal oxide to improve the dry etching resistance of the first isolation part and the second isolation part. The material of the protection part comprises indium tin oxide. The protection part comprises a main part and an edge part on the side of the main part towards the isolation opening, the main part being located between the first isolation part and the second isolation part, and the edge part being arranged on the side of the protruding part towards the substrate. The edge part is arranged in close contact with the side of the protruding part towards the substrate. The film layer thickness of the edge part is smaller than that of the main part.

2. The display panel of claim 1, wherein, The isolation structure is recessed towards the substrate to form a first groove, and the orthographic projection of the protection part covers the orthographic projection of the first groove on the substrate.

3. The display panel of claim 1, wherein, The film thickness of the isolation structure at the first groove is smaller than that of at least part of the isolation structure outside the first groove.

4. The display panel of claim 3, wherein, Further comprising:

5. The display panel of claim 3, wherein, a pixel definition layer arranged between the isolation structure and the substrate, the pixel definition layer enclosing a pixel opening, the orthographic projection of the pixel opening being located in the orthographic projection of the isolation opening on the substrate, the pixel definition layer being recessed towards the substrate to form a second groove, and the second groove being arranged in space with the pixel opening.

6. The display panel of claim 1, wherein, The orthographic projection of the second groove at least partially overlaps the orthographic projection of the first groove on the substrate.

7. The display panel of claim 6, wherein, Further comprising:

8. The display panel of claim 6, wherein, a first conductive part arranged between the substrate and the pixel definition layer; a planarization layer arranged between the first conductive part and the pixel definition layer, the planarization layer being provided with a via hole, and the via hole exposing at least part of the first conductive part; 9. The display panel of claim 8, wherein, a first electrode layer comprising a first electrode, the first electrode being arranged between the planarization layer and the pixel definition layer, and the first electrode being electrically connected with the first conductive part through the via hole.

10. The display panel of claim 8, wherein, The orthographic projection of the via hole at least partially overlaps the orthographic projection of the first groove on the substrate, and / or the orthographic projection of the via hole at least partially overlaps the orthographic projection of the second groove on the substrate. The orthographic projection of the via hole at least partially overlaps the orthographic projection of the protection part on the substrate. The orthographic projection of the first electrode at least partially overlaps the orthographic projection of the isolation opening on the substrate. Further comprising:

11. The display panel of claim 10, wherein, a light-emitting functional layer, the light-emitting functional layer being at least partially located in the pixel opening.

12. The display panel of claim 10, wherein, ​ 13. The display panel of claim 10, wherein, ​ 14. The display panel of claim 8, wherein, ​ ​ A second electrode layer includes a second electrode disposed on a side of the light-emitting functional layer facing away from the substrate.

15. The display panel of claim 14, wherein, The material of the isolation structure includes a conductive material, and the second electrode is electrically connected with the isolation structure.

16. The display panel of claim 14, wherein, The material of the pixel definition layer includes an inorganic insulating material.

17. The display panel of claim 14, wherein, The display panel further includes a first encapsulation layer including an encapsulation portion disposed on a side of the second electrode facing away from the substrate.

18. The display panel of claim 17, wherein, The first encapsulation layer includes a plurality of encapsulation portions arranged at intervals.

19. The display panel of claim 17, wherein, The encapsulation portion covers a projection of the isolation opening on the substrate.

20. The display panel of claim 17, wherein, The display panel further includes a second encapsulation layer disposed on a side of the first encapsulation layer facing away from the substrate.

21. The display panel of claim 20, wherein, The material of the first encapsulation layer includes an inorganic material, and / or the material of the second encapsulation layer includes an organic material.

22. The display panel of claim 20, wherein, The display panel further includes a third encapsulation layer disposed on a side of the second encapsulation layer facing away from the substrate.

23. The display panel of claim 22, wherein, The material of the third encapsulation layer includes an inorganic material.

24. The display panel of claim 1, wherein, The first isolation portion has a first surface facing away from the substrate, and a projection of the first surface on the substrate is located within a projection of the protection portion on the substrate.

25. The display panel of claim 24, wherein, The first isolation portion has a first surface facing away from the substrate, and a projection of the first surface on the substrate is located within a projection of the protection portion on the substrate.

26. The display panel of claim 25, wherein, The second isolation portion has a first surface facing away from the substrate, and a projection of the first surface on the substrate is located within a projection of the protection portion on the substrate. The second isolation portion has a first surface facing away from the substrate, and a projection of the first surface on the substrate is located within a projection of the protection portion on the substrate.

27. The display panel of claim 1, wherein, The isolation structure further includes a third isolation portion disposed on a side of the first isolation portion facing the substrate, and a projection of the first isolation portion on the substrate is located within a projection of the third isolation portion on the substrate.

28. The display panel of claim 27, wherein, The material of the first isolation portion includes a conductive material, and / or the material of the third isolation portion includes a conductive material.

29. A display panel, comprising: Comprising: a substrate; an isolation structure disposed on a side of the substrate, the isolation structure enclosing an isolation opening, the isolation structure including a first isolation portion, a protection portion, and a second isolation portion sequentially stacked in a direction away from the substrate, a projection of the first isolation portion on the substrate being located within a projection of the second isolation portion on the substrate; wherein the first isolation portion has a first surface facing away from the substrate, and a projection of the protection portion on the substrate is at least partially located outside a projection of the first surface on the substrate; the protection portion extends to at least part of a space between the first isolation portion and the second isolation portion, and the material of the protection portion includes a metal oxide to improve the dry etching resistance of the first isolation portion and the second isolation portion.

30. The display panel of claim 29, wherein, The first surface on the substrate is located within the projection of the protection portion on the substrate.

31. The display panel of claim 30, wherein, The side of the second isolation portion facing the substrate includes a second surface and a third surface connected to each other, the projection of the second surface on the substrate coincides with the projection of the first surface on the substrate, the projection of the third surface on the substrate is located outside the projection of the first surface on the substrate, and the protection portion covers at least part of the third surface.

32. The display panel of claim 29, wherein, The material of the protection part includes indium tin oxide.

33. A method for manufacturing a display panel, characterized in that, The preparation method comprises: forming a first isolation part material layer, a protection part material layer and a second isolation part material layer on one side of a substrate in sequence; performing a patterning process on the second isolation part material layer to form a second isolation part; performing a patterning process on the protection part material layer to form a protection part; performing a patterning process on the first isolation part material layer to form a first isolation part; wherein the orthographic projection of the first isolation part on the substrate is located in the orthographic projection of the second isolation part on the substrate, the first isolation part has a first surface facing away from the substrate, the orthographic projection of the protection part on the substrate is at least partially located outside the orthographic projection of the first surface on the substrate, the first isolation part, the protection part and the second isolation part jointly enclose an isolation opening; the protection part extends to at least part of the space between the first isolation part and the second isolation part, and the material of the protection part includes metal oxide to improve the dry etching resistance of the first isolation part and the second isolation part.

34. The method of producing a display panel according to claim 33, wherein Before the step of performing a patterning process on the second isolation part material layer, the preparation method further comprises: forming an etching stop layer on the side of the second isolation part material layer facing away from the substrate; performing a patterning process on the etching stop layer to form an etching opening.

35. The method of producing a display panel according to claim 34, wherein The material of the first isolation part material layer includes aluminum; and / or, the material of the protection part material layer includes indium tin oxide; and / or, the material of the second isolation part material layer includes titanium.

36. The method of producing a display panel according to claim 34, wherein The step of performing a patterning process on the second isolation part material layer comprises: performing dry etching on the second isolation part material layer through the etching opening; The step of performing a patterning process on the protection part material layer comprises: performing wet etching on the protection part material layer through the etching opening; The step of performing a patterning process on the first isolation part material layer comprises: performing wet etching on the first isolation part material layer through the etching opening.

37. The method of producing a display panel according to claim 36, wherein In the step of performing wet etching on the first isolation part material layer through the etching opening, a developing solution is used for the wet etching.

38. The method of producing a display panel according to claim 36, wherein Before the step of forming a first isolation part material layer on one side of a substrate, the preparation method further comprises: forming a third isolation part material layer on one side of the substrate; After the step of performing wet etching on the first isolation part through the etching opening, the preparation method further comprises: performing dry etching on the third isolation part material layer through the etching opening to form a third isolation part.

39. The method of producing a display panel according to claim 38, wherein The material of the third isolation part material layer includes molybdenum.

40. The method of producing a display panel according to claim 33, wherein Before the step of forming a first isolation part material layer on one side of a substrate, the preparation method further comprises: preparing a first electrode layer on one side of the substrate, and performing a patterning process on the first electrode layer to form a first electrode; forming a pixel definition material layer on the side of the first electrode layer facing away from the substrate.

41. The method of producing a display panel according to claim 40, wherein The material of the pixel definition material layer includes inorganic insulating material.

42. The method of producing a display panel according to claim 40, wherein After the step of performing a patterning process on the first isolation part material layer to form a first isolation part, the preparation method further comprises: The material layer of the pixel is patterned to form a pixel opening, a projection of the pixel opening on the substrate is located within a projection of the isolation opening on the substrate.

43. The method of producing a display panel according to claim 40, wherein Before the step of preparing the first electrode layer on one side of the substrate, the preparation method further comprises: forming a first conductive part and a planarization material layer on one side of the substrate in sequence; the planarization material layer is patterned to form a via, the via exposes at least part of the first conductive part.

44. The method of producing a display panel according to claim 43, wherein The first electrode is electrically connected with the first conductive part through the via.

45. The method of producing a display panel according to claim 33, wherein After the step of patterning the first isolation part material layer to form the first isolation part, the preparation method further comprises: forming a light-emitting material layer, a second electrode material layer and an encapsulation material layer on one side of the substrate in sequence, and patterning the encapsulation material layer, the second electrode material layer and the light-emitting material layer to form a light-emitting functional layer located at least partially within the isolation opening, a second electrode, and an encapsulation part located on a side of the second electrode away from the substrate.

46. The method of producing a display panel according to claim 45, wherein The step of patterning the encapsulation material layer, the second electrode material layer and the light-emitting material layer comprises: patterning the encapsulation material layer by dry etching; and / or, patterning the second electrode material layer by dry etching; and / or, patterning the light-emitting material layer by dry etching.

47. A display device comprising: The display panel as claimed in any one of claims 1 to 32. The display panel as claimed in any one of claims 1 to 32.

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