Display panel and electronic device including the same

Abstract

Disclosed are a display panel and an electronic device including the same. The display panel includes a base substrate including a front surface and a rear surface and having a first hole and a second hole, and a pixel layer on the base substrate. A display area is defined in the front surface. A first hole overlaps the display area and passes through the front surface and the rear surface. The second hole overlaps the display area, is adjacent to the first hole, and is recessed from the front surface. The base substrate further includes: a first base layer including a rear surface; a first barrier layer on the first base layer and including a first inorganic film having a first refractive index and a second inorganic film having a second refractive index; a second base layer on the first barrier layer; and a second barrier layer on the second base layer and including a front surface. The first inorganic films and the second inorganic films are alternately stacked.

Description

[0001] This application is a divisional application of the invention patent application with the application date of November 14, 2018, application number 201811352492.5, and name “Display panel and electronic device including the display panel”. Technical Field

[0002] Aspects of embodiments of the present invention relate to a display panel and an electronic device including the display panel. Background Art

[0003] The display device can display images, and the organic light emitting display device has attracted much attention as a next-generation display device. The organic light emitting display device has high-quality characteristics such as low power consumption, high brightness, and high response speed.

[0004] An organic light emitting display device may include an organic light emitting element. However, the organic light emitting element may be easily damaged by moisture or oxygen. Therefore, external moisture or oxygen should be stably blocked to improve the lifespan and reliability of the organic light emitting display device. Summary of the invention

[0005] According to aspects of embodiments of the present invention, a display panel having improved reliability and an electronic device including the display panel are provided. According to other aspects of embodiments of the present invention, a display panel capable of effectively blocking external contaminants and an electronic device including the display panel are provided.

[0006] According to one or more embodiments of the present invention, a display panel includes a base substrate and a pixel layer located on the base substrate, the base substrate including a front surface and a rear surface, and a first hole and a second hole are defined in the base substrate. The display area may be defined in the front surface. The first hole may overlap with the display area and may pass through the front surface and the rear surface. The second hole may overlap with the display area, may be adjacent to the first hole, and may be recessed from the front surface. The base substrate may include: a first base layer, including the rear surface of the base substrate; a first barrier layer, located on the first base layer and including a plurality of first inorganic films having a first refractive index and a plurality of second inorganic films having a second refractive index; a second base layer, located on the first barrier layer; and a second barrier layer, located on the second base layer and including the front surface of the base substrate. The second inorganic film and the first inorganic film may be stacked alternately. The second hole may be defined in the second base layer and the second barrier layer.

[0007] In an embodiment, the uppermost film of the first barrier layer may be one of the first inorganic films, and the lowermost film of the first barrier layer may be one of the second inorganic films. The second refractive index may be higher than the first refractive index.

[0008] In an embodiment, two or more of the first inorganic films may have different thicknesses from each other, and two or more of the second inorganic films may have different thicknesses from each other.

[0009] In an embodiment, the first inorganic film and the second inorganic film may have different thicknesses from each other.

[0010] In an embodiment, the thickness of the first barrier layer may be from 550 nm to 600 nm.

[0011] In an embodiment, the first inorganic film may include silicon oxide (SiO x ), the second inorganic film may include silicon nitride (SiN x ).

[0012] In an embodiment, the second hole may include a first sub-hole passing through the second barrier layer and a second sub-hole overlapping the first sub-hole and defined in the second base layer.

[0013] In an embodiment, a width of the second sub-hole defined in the second base layer may be greater than a width of the first sub-hole passing through the second barrier layer.

[0014] In an embodiment, the pixel layer may include a capping layer disposed on the second barrier layer and defining a third sub-hole overlapping the second hole.

[0015] In an embodiment, a width of the third sub-hole of the capping layer may be equal to or smaller than a width of the first sub-hole of the second barrier layer.

[0016] In an embodiment, the pixel layer may include: a thin film element layer located on the base substrate and including a thin film transistor; and a display element layer located on the base substrate and including an organic light emitting element connected to the thin film transistor.

[0017] In an embodiment, the display area may include a hole area overlapping the first hole, a peripheral area surrounding the hole area and overlapping the second hole, and a pixel area surrounding the peripheral area and overlapping the organic light emitting element. The organic light emitting element may not overlap the peripheral area.

[0018] In an embodiment, the pixel layer may not overlap the hole area.

[0019] In an embodiment, the third hole may be further defined in the base substrate. When viewed in plan view, the third hole may overlap the display area, and the third hole may be closer to the second hole than to the first hole. The third hole may be recessed from the front surface of the base substrate.

[0020] In an embodiment, the third hole may include a fourth sub-hole passing through the second barrier layer and a fifth sub-hole overlapping the fourth sub-hole and defined in the second base layer.

[0021] In an embodiment, a width of the fifth sub-hole defined in the second base layer may be greater than a width of the fourth sub-hole passing through the second barrier layer.

[0022] In an embodiment, the first base layer and the second base layer may include an organic material.

[0023] According to one or more embodiments of the present invention, an electronic device may include: a display panel including a base substrate including a front surface and a rear surface, and a first hole and a second hole are defined in the base substrate; and an electronic module, which is accommodated in the first hole and electrically connected to the display panel. In a plan view, a display area and a non-display area adjacent to the display area may be defined in the front surface. The first hole may overlap the display area and may pass through the front surface and the rear surface. The second hole may overlap the display area, may be adjacent to the first hole, and may be recessed from the front surface. The base substrate may include: a first base layer including the rear surface of the base substrate; a first barrier layer, located on the first base layer and including a plurality of first inorganic films having a first refractive index and a plurality of second inorganic films having a second refractive index; a second base layer, located on the first barrier layer; and a second barrier layer, located on the second base layer and including the front surface of the base substrate. The second inorganic film and the first inorganic film may be alternately stacked. The second hole may be defined in the second base layer and the second barrier layer.

[0024] In an embodiment, the electronic module may include at least one of a sound output module, a camera module, and a light receiving module.

[0025] In an embodiment, the second hole may have a closed loop shape surrounding the first hole when viewed in a plan view. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other aspects and features of the present invention will become more apparent by further describing some exemplary embodiments of the present invention in detail with reference to the accompanying drawings, in which: Figure 1A is a perspective view showing an electronic device according to an embodiment of the invention; Figure 1B is an exploded perspective view showing an electronic device according to an embodiment of the invention; Figure 1C is a block diagram showing an electronic device according to an embodiment of the invention; Figure 2 is along Figure 1B A cross-sectional view taken along line II'; Figure 3A yes Figure 2 an enlarged cross-sectional view of a portion of; Figure 3B yes Figure 3A an enlarged cross-sectional view of a portion of; Figure 4 is a diagram showing an embodiment according to the invention Figure 2 A cross-sectional view of a first barrier layer; Figure 5 is a graph showing characteristics of laser light transmitted through a first barrier layer according to an embodiment of the invention; Figure 6 is a diagram showing an embodiment according to the invention Figure 4 a cross-sectional view of a portion of a first barrier layer; 7A to 7D is a cross-sectional view showing a method of manufacturing a display panel according to an embodiment of the invention; Fig. 7E is an image showing a base substrate according to an embodiment of the invention; and Figure 8 is a cross-sectional view showing a display panel of an electronic device according to another embodiment of the invention. DETAILED DESCRIPTION

[0027] The invention will now be more fully described herein with reference to the accompanying drawings, in which various embodiments are shown. However, the invention may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will convey the scope of the invention to those skilled in the art. Like reference numerals refer to like elements throughout.

[0028] It will be understood that when an element such as a layer, region or substrate is referred to as "on" another element, the element may be directly on the other element, or one or more intermediate elements may be present. On the contrary, the term "directly" means that there is no intermediate element. As used herein, the term "and / or" includes any combination and all combinations of one or more related listed items. The terms used herein are for the purpose of describing a particular embodiment and are not intended to be limiting. As used herein, unless the context otherwise clearly indicates, the singular forms "one", "a kind of" and "the (said)" are intended to include plural forms containing "at least one (kind, person)". "Or" means "and / or". As used herein, the term "and / or" includes any combination and all combinations of one or more related listed items. It will also be understood that when the term "including" and / or its variations or "including" and / or its variations are used in this specification, it is explained that there are stated features, regions, wholes, steps, operations, elements and / or components, but one or more other features, regions, wholes, steps, operations, elements, components and / or their groups are not excluded. Existence or addition. For ease of description, spatially relative terms such as "under ...", "below ...", "below ...", "above ...", "on ...", etc. may be used herein to describe the relationship between an element or feature as shown in the figure and an additional element or feature. It will be understood that, in addition to the orientation depicted in the figure, spatially relative terms are also intended to include different orientations of the device in use or operation. For example, if the device in the figure is turned over, the element described as "below" or "below" other elements or features will then be oriented "above" the other elements or features. Therefore, the exemplary term "below ..." can include both above and below orientations. The device can be positioned otherwise (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0029] It will be understood that, although the terms "first", "second", etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings herein, the "first" element, component, region, layer or part discussed below can be named as "second" element, component, region, layer or part. Some exemplary embodiments are described herein with reference to the cross-sectional illustration and / or planar illustration as an idealized exemplary illustration. In the accompanying drawings, for clarity, the thickness of the layer and region can be exaggerated. Therefore, it is expected that the change of the shape of the illustration caused by, for example, manufacturing technology and / or tolerance will be expected. Therefore, the exemplary embodiments should not be interpreted as being limited to the shape of the region shown here, but will include the deviation of the shape caused by, for example, manufacturing. For example, the etching area shown as a rectangle will generally have the feature of rounding or bending. Therefore, the regions shown in the figure are schematic in nature, and their shapes are not intended to necessarily show the actual shape of the region of the device, and are not intended to limit the scope of the exemplary embodiments.

[0030] Figure 1A is a perspective view showing an electronic device according to an embodiment of the invention; Figure 1B is an exploded perspective view showing an electronic device according to an embodiment of the invention; Figure 1C is a block diagram showing an electronic device according to an embodiment of the invention.

[0031] According to an embodiment of the invention, the electronic device EDD can be activated by an electrical signal. The electronic device EDD can be implemented as any one of various embodiments. For example, the electronic device EDD can be implemented as a tablet computer, a notebook computer, a personal computer, a smart TV, or a smart phone. In this embodiment, a smart phone is shown as an example of the electronic device EDD.

[0032] Reference Figure 1A , Figure 1B and Figure 1C The electronic device EDD may provide a display surface displaying the image IM at a front surface thereof. The display surface may be parallel to a plane defined by the first direction DR1 and the second direction DR2.

[0033] The normal direction of the display surface can be represented by the third direction DR3. The third direction DR3 can also represent the thickness direction of the electronic device EDD. The front surface and the rear surface of each of the components can be distinguished by the third direction DR3. However, the first direction DR1, the second direction DR2, and the third direction DR3 can be relative concepts and can be changed to other directions.

[0034] according to Figure 1A , the electronic device EDD can display the image IM through the transmissive area TA. Figure 1A , an internet search box is shown as an example of the image IM. In an embodiment, the transmission area TA may have a quadrilateral shape parallel to the first direction DR1 and the second direction DR2. However, the embodiments of the invention are not limited thereto, and the shape of the transmission area TA may be variously modified.

[0035] The border area BZA may be adjacent to the transmission area TA. In an embodiment, the border area BZA may surround the transmission area TA. However, embodiments of the invention are not limited thereto. In other embodiments, the border area BZA may be adjacent to one or more sides of the transmission area TA, or the border area BZA may be omitted. The electronic device EDD may include any of the various embodiments, but may not be limited to a specific embodiment.

[0036] according to Figure 1B In an embodiment, the electronic device EDD may include a display panel 100 , a window member 200 , a case member 300 , and an electronic module 400 .

[0037] like Figure 1C As shown in, in an embodiment, the electronic device EDD may further include a display module DM, a first electronic module EM1, a second electronic module EM2 and a power module PM. For ease and convenience of description and illustration, Figure 1C Some components shown in Figure 1B The electronic device EDD shown in is shown.

[0038] In an embodiment, the display module DM may include a display panel 100 and an input sensing unit TSU. The display panel 100 may generate an image IM. The input sensing unit TSU may sense an input supplied from the outside by a user. The user's input may include at least one of various external inputs, such as a part of the user's body (e.g., a finger), light, heat, and pressure. In an embodiment, the input sensing unit TSU may further include a touch sensor.

[0039] Refer again Figure 1B , a display area DA and a non-display area NDA may be defined in the display panel 100. An image IM may be generated through the display area DA. A plurality of pixels for generating the image IM may be provided in the display area DA. This will be described in further detail later.

[0040] The non-display area NDA may be adjacent to the display area DA. In an embodiment, the non-display area NDA may surround the display area DA. A driving circuit and / or a driving line for driving the display area DA may be disposed in the non-display area NDA.

[0041] In an embodiment, although not shown in the figure, the non-display area NDA of the display panel 100 may be partially curved. Therefore, a portion of the non-display area NDA may face the front surface of the electronic device EDD, and another portion of the non-display area NDA may face the rear surface of the electronic device EDD. Alternatively, the non-display area NDA may be omitted in the display panel 100 according to another embodiment of the invention.

[0042] According to an embodiment of the invention, the display panel 100 may include an accommodating portion OA overlapping the display area DA. The accommodating portion OA may include a space in which the electronic module 400 is disposed. The accommodating portion OA may include a first hole MH and a second hole BR.

[0043] The first hole MH may pass through the display panel 100. In an embodiment, the first hole MH may have a cylindrical shape having a certain height in the third direction DR3. The first hole MH may accommodate the electronic module 400. According to an embodiment, the display panel 100 includes the first hole MH, and a thin display device or electronic device may be implemented.

[0044] The second hole BR may be disposed adjacent to the first hole MH. The second hole BR may be formed to be recessed from the front surface of the display panel 100. When viewed in a plan view, the second hole BR may have a closed loop shape surrounding the first hole MH in a portion of the display panel 100. In the present embodiment, in a plan view, the second hole BR may have a ring shape surrounding the first hole MH.

[0045] According to an embodiment of the invention, the first hole MH may be a through hole passing through the front and rear surfaces of the display panel 100. Unlike the first hole MH, the second hole BR may not completely pass through the display panel 100, but may pass through only a portion of the display panel 100 in the third direction DR3. Therefore, the second hole BR may not be a through hole, but may have a concave or recessed shape. The first hole MH and the second hole BR will be described in more detail later.

[0046] The window member 200 may provide a front surface of the electronic device EDD. The window member 200 may be disposed on the front surface of the display panel 100 to protect the display panel 100. In an embodiment, the window member 200 may include, for example, a glass substrate, a sapphire substrate, or a plastic film. The window member 200 may have a single-layer or multi-layer structure. For example, the window member 200 may have a stacked structure including a plurality of plastic films bonded to each other by an adhesive, or may have a stacked structure including a glass substrate and a plastic film bonded to each other by an adhesive.

[0047] The window member 200 may be divided into a transmission area TA and a frame area BZA. The transmission area TA may correspond to the display area DA. For example, the transmission area TA may overlap all or at least a portion of the display area DA. The image IM displayed on the display area DA of the display panel 100 may be visible to the outside through the transmission area TA.

[0048] The border area BZA may define the shape of the transmission area TA. In an embodiment, in a plan view, the border area BZA may be adjacent to the transmission area TA and may surround the transmission area TA. The border area BZA may have a color (e.g., a predetermined color). The border area BZA may cover the non-display area NDA of the display panel 100 to prevent or substantially prevent the non-display area NDA from being visible to the outside. However, embodiments of the invention are not limited thereto. In another embodiment of the invention, the border area BZA may be omitted in the window member 200.

[0049] The shell member 300 may be coupled to the window member 200. The shell member 300 may provide a rear surface of the electronic device EDD. The shell member 300 may be coupled to the window member 200 to define an internal space, and the display panel 100, the electronic module 400, and various components may be accommodated in the internal space. The shell member 300 may be formed of a material having relatively high rigidity. For example, the shell member 300 may include a plurality of frames and / or plates that may be formed of glass, plastic, and / or metal. The shell member 300 may stably protect the components of the electronic device EDD accommodated in the internal space from external impacts.

[0050] The electronic module 400 may include at least one of various functional modules for operating the electronic device EDD.

[0051] Reference Figure 1C , the electronic module 400 may include at least one of the components of the first electronic module EM1 and the second electronic module EM2.

[0052] In an embodiment, the first electronic module EM1 may be directly mounted on a motherboard electrically connected to the display module DM. In another embodiment, the first electronic module EM1 may be mounted on an additional board to be electrically connected to the motherboard through a connector (not shown).

[0053] In an embodiment, the first electronic module EM1 may include a control module CM, a wireless communication module 510, an image input module 520, a sound input module 530, a memory 540, and an external interface 550. In an embodiment, one or more components (e.g., modules) may not be mounted on a motherboard, but may be electrically connected to the motherboard through a flexible circuit board.

[0054] The control module CM may control the overall operation of the electronic device EDD. The control module CM may include a microprocessor. For example, the control module CM may activate or deactivate the display module DM. In an embodiment, the control module CM may control one or more other modules (e.g., an image input module 520, a sound input module 530, etc.) based on a touch signal received from the display module DM.

[0055] For example, the wireless communication module 510 can send / receive wireless signals to / from one or more other terminals by using Bluetooth or Wi-Fi. The wireless communication module 510 can send / receive voice signals by using a general communication line. The wireless communication module 510 may include a transmitter 512 that modulates a signal to be sent and sends the modulated signal, and a receiver 511 that demodulates a received signal.

[0056] The image input module 520 may process the image signal to convert the image signal into image data for displaying an image in the display module DM. The sound input module 530 may receive an external sound signal through a microphone in a recording mode or a voice recognition mode and may convert the received sound signal into electronic sound data.

[0057] In an embodiment, the external interface 550 may be connected to and interfaced with an external charger, a wired / wireless data port, or a card slot (e.g., a memory card or a SIM / UIM card).

[0058] In an embodiment, the second electronic module EM2 may include a sound output module 560, a light emitting module 570, a light receiving module 580, and a camera module 590. The components of the second electronic module EM2 may be directly mounted on the motherboard, or may be mounted on an additional board to be electrically connected to the display module DM and / or the first electronic module EM1 through a connector (not shown).

[0059] The sound output module 560 may convert sound data received from the wireless communication module 510 or sound data stored in the memory 540 and may output the converted sound data to the outside.

[0060] The light emitting module 570 may generate light and may output the generated light. The light emitting module 570 may output infrared light. In an embodiment, the light emitting module 570 may include a light emitting diode (LED) element. The light receiving module 580 may sense infrared light. The light receiving module 580 may be activated when a certain level (e.g., a predetermined level) or higher of infrared light is sensed. In an embodiment, the light receiving module 580 may include a CMOS image sensor. After the infrared light generated in the light emitting module 570 is output, the infrared light may be reflected by an external object (e.g., a finger or face of a user), and the reflected infrared light may be incident on the light receiving module 580. The camera module 590 may acquire an external image.

[0061] Figure 1B The electronic module 400 shown in the figure may be one of the components of the second electronic module EM2. In this case, other components of the first electronic module EM1 and the second electronic module EM2 may be arranged at other locations. However, embodiments of the invention are not limited thereto. In other embodiments, the electronic module 400 may include one or more modules of the first electronic module EM1 and the second electronic module EM2.

[0062] The power module PM may supply power for the overall operation of the electronic device EDD. The power module PM may include a battery module.

[0063] Figure 2 is along Figure 1B A cross-sectional view taken along line II'; Figure 3A yes Figure 2 an enlarged cross-sectional view of a portion of; Figure 3B yes Figure 3A An enlarged cross-sectional view of a portion of.

[0064] according to Figure 2 , showing a display area DA and a non-display area NDA. According to an embodiment, the display area DA may include a hole area HA in which a first hole MH is formed, a peripheral area BA surrounding the hole area HA and in which a second hole BR is formed, and a pixel area PA surrounding the peripheral area BA. The organic light emitting element ED may be disposed on the thin film element layer 20 to overlap with the pixel area PA. The hole area HA may not overlap with the base substrate 10, the thin film element layer 20, and the display element layer 30, and the peripheral area BA may not overlap with the organic light emitting element ED.

[0065] Reference Figure 2 , the display panel 100 may include a base substrate 10 , a thin film element layer 20 and a display element layer 30 .

[0066] The thin film element layer 20 and the display element layer 30 may be included in the pixel layer. The base substrate 10, the thin film element layer 20, and the display element layer 30 may be stacked in the third direction DR3.

[0067] The base substrate 10 may include a first base layer 11 , a first barrier layer 12 , a second base layer 13 , and a second barrier layer 14 .

[0068] The first base layer 11 may correspond to a lower layer of the base substrate 10. A rear surface of the first base layer 11 may define a rear surface of the base substrate 10.

[0069] In an embodiment, the first base layer 11 may be an insulating layer including an organic material. In an embodiment, the first base layer 11 may include a flexible plastic. For example, the first base layer 11 may include polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyarylate, polycarbonate (PC), polyetherimide (PEI), or polyethersulfone (PES).

[0070] In an embodiment, the first barrier layer 12 may include an inorganic material and may be disposed on the first base layer 11. In other words, the first barrier layer 12 may be an insulating layer including an inorganic material. For example, the first barrier layer 12 may include silicon oxide (SiO x )、Silicon Nitride(SiN x ) or amorphous silicon (Si).

[0071] The second base layer 13 may be disposed on the first barrier layer 12 and may be an insulating layer including an organic material. In an embodiment, the second base layer 13 may include the same material as that of the first base layer 11 .

[0072] In an embodiment, the second barrier layer 14 may include an inorganic material, and a front surface of the second barrier layer 14 may define a front surface of the base substrate 10 .

[0073] The first and second base layers 11 and 13 and the first and second barrier layers 12 and 14 may be alternately stacked. Specifically, the first and second barrier layers 12 and 14 may block moisture or oxygen passing through the outside of the first and second base layers 11 and 13, respectively.

[0074] According to an embodiment of the invention, the first hole MH may pass through the first base layer 11, the first barrier layer 12, the second base layer 13, and the second barrier layer 14. The second hole BR may surround the first hole MH and may be formed in the second base layer 13 and the second barrier layer 14. The second hole BR is not formed in the first base layer 11 and the first barrier layer 12.

[0075] If the second hole BR is further formed in a portion of the first base layer 11 and the first barrier layer 12, moisture or oxygen penetrating through the rear surface of the first base layer 11 is transferred to the thin film element layer 20 or the display element layer 30 through the second hole BR. Since external moisture or oxygen can be blocked by the first barrier layer 12 and the second barrier layer 14 including an inorganic material, if the second hole BR is defined in both the first barrier layer 12 and the second barrier layer 14, moisture or oxygen penetrating through the rear surface of the first base layer 11 is provided to the pixel area PA through the second hole BR.

[0076] However, the second holes BR according to the invention surround the first holes MH and are formed in the second base layer 13 and the second barrier layer 14. In other words, the second holes BR according to the invention are not formed in the first base layer 11 and the first barrier layer 12.

[0077] In an embodiment, an external laser may be used to form the first hole MH and the second hole BR. In this case, the first hole MH may be formed by a laser of a first wavelength band, and the second hole BR may be formed by a laser of a second wavelength band. The laser of the first wavelength band may completely recess a portion of the base substrate 10 to form the first hole MH. The laser of the second wavelength band may recess a portion of the second barrier layer 14 and a portion of the second base layer 13 to form the second hole BR.

[0078] According to an embodiment of the invention, the first barrier layer 12 may include a plurality of first inorganic films having a first refractive index and a plurality of second inorganic films having a second refractive index. The first inorganic films and the second inorganic films may be alternately stacked. The first refractive index may be different from the second refractive index.

[0079] In an embodiment, when the laser of the second wavelength band for forming the second hole BR is incident on the first barrier layer 12, the first barrier layer 12 may reflect the laser of the second wavelength band. Therefore, the second hole BR may not be formed in the first barrier layer 12 and the first base layer 11 by the laser of the second wavelength band. Therefore, moisture or oxygen penetrating through the rear surface of the first base layer 11 may be blocked by the first barrier layer 12. The structure of the first barrier layer 12 will be described in more detail later.

[0080] The thin film element layer 20 may be disposed on the base substrate 10. The thin film element layer 20 may include a plurality of insulating layers and a thin film transistor TR. Each of the insulating layers may include an inorganic material and / or an organic material. The insulating layer may include a first insulating layer 21, a second insulating layer 22, and a third insulating layer 23.

[0081] The thin film transistor TR may include a semiconductor pattern SL, a control electrode CE, an input electrode IE, and an output electrode OE. The thin film transistor TR may control charge movement in the semiconductor pattern SL through the control electrode CE to output an electrical signal input from the input electrode IE through the output electrode OE.

[0082] The first insulating layer 21 may be disposed between the semiconductor pattern SL and the control electrode CE. In the present embodiment, the control electrode CE is disposed on the semiconductor pattern SL. However, the embodiments of the invention are not limited thereto. In another embodiment, the thin film transistor TR may include a semiconductor pattern SL disposed on the control electrode CE.

[0083] The second insulating layer 22 may be disposed between the control electrode CE and the input electrode IE and the output electrode OE. The second insulating layer 22 may cover the control electrode CE, and the input electrode IE and the output electrode OE may be disposed on the second insulating layer 22. The input electrode IE and the output electrode OE may pass through the first insulating layer 21 and the second insulating layer 22 to be connected to portions of the semiconductor pattern SL, respectively. However, the embodiments of the invention are not limited thereto. In another embodiment, the input electrode IE and the output electrode OE may be directly connected to the semiconductor pattern SL.

[0084] The third insulating layer 23 may be disposed on the second insulating layer 22 . The third insulating layer 23 may cover the thin film transistor TR. The third insulating layer 23 may electrically insulate the thin film transistor TR from the display element layer 30 .

[0085] The display element layer 30 may include an organic light emitting element ED and a plurality of insulating layers. The insulating layer of the display element layer 30 may include a fourth insulating layer 31 and an encapsulation member TE.

[0086] The fourth insulating layer 31 may be disposed on the third insulating layer 23. A plurality of openings may be defined in the fourth insulating layer 31. The organic light emitting element ED may be disposed in each of the openings.

[0087] The organic light emitting element ED may overlap the pixel area PA. The organic light emitting element ED may include a first electrode E1, a second electrode E2, an emission layer EL, and a charge control layer OL. The first electrode E1 may be disposed on the thin film element layer 20. The first electrode E1 may pass through the third insulating layer 23 to be electrically connected to the thin film transistor TR (e.g., the output electrode OE of the thin film transistor TR). The first electrode E1 may be provided in plurality. At least a portion of each of the first electrodes E1 may be exposed by each of the openings.

[0088] The second electrode E2 may be disposed on the first electrode E1. The second electrode E2 may have an integral shape overlapped with the plurality of first electrodes E1 and the fourth insulating layer 31. When the organic light emitting element ED is provided in plurality, the second electrode E2 of the organic light emitting element ED may have a common voltage. Therefore, an additional patterning process for forming the second electrode E2 may be omitted. However, the embodiments of the invention are not limited thereto. In another embodiment, the second electrode E2 may be provided in plurality, and the plurality of second electrodes E2 may correspond to the plurality of openings, respectively.

[0089] The emission layer EL may be disposed between the first electrode E1 and the second electrode E2. The emission layer EL may be disposed in plural, and the plural emission layers EL may be disposed in the plural openings respectively. The organic light emitting element ED may activate the emission layer EL to generate light by the potential difference between the first electrode E1 and the second electrode E2.

[0090] The charge control layer OL may be disposed between the first electrode E1 and the second electrode E2. The charge control layer OL may be disposed adjacent to the emission layer EL. In the present embodiment, the charge control layer OL is disposed between the emission layer EL and the second electrode E2. However, the embodiments of the invention are not limited thereto. In other embodiments, the charge control layer OL may be disposed between the emission layer EL and the first electrode E1, or the charge control layer OL may include a plurality of layers stacked in the third direction DR3, and the emission layer EL is disposed between the plurality of layers.

[0091] In an embodiment, the charge control layer OL may have an integral shape overlapping substantially the entire top surface of the base substrate 10 without an additional patterning process. The charge control layer OL may be disposed in the opening and may also be disposed on the top surface of the fourth insulating layer 31 .

[0092] The encapsulation member TE may be disposed on the organic light emitting element ED. The encapsulation member TE may include an inorganic layer and / or an organic layer. In the present embodiment, the encapsulation member TE may include a first inorganic layer 32 , an organic layer 33 , and a second inorganic layer 34 .

[0093] Each of the first inorganic layer 32 and the second inorganic layer 34 may include an inorganic material. For example, each of the first inorganic layer 32 and the second inorganic layer 34 may include at least one of aluminum oxide, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, titanium oxide, zirconium oxide, and zinc oxide. The first inorganic layer 32 and the second inorganic layer 34 may include the same material as each other or different materials from each other.

[0094] The organic layer 33 may be disposed between the first inorganic layer 32 and the second inorganic layer 34. The organic layer 33 may include an organic material. For example, the organic layer 33 may include at least one of epoxy resin, polyimide (PI), polyethylene terephthalate (PET), polycarbonate (PC), polyethylene (PE), and polyacrylate.

[0095] In an embodiment, each of the first inorganic layer 32 and the second inorganic layer 34 may have an integral shape provided on substantially the entire surface of the display panel 100. Each of the first inorganic layer 32 and the second inorganic layer 34 may partially overlap the organic layer 33. Therefore, the first inorganic layer 32 and the second inorganic layer 34 may be spaced apart from each other in the third direction DR3 in one region with the organic layer 33 interposed therebetween, and the first inorganic layer 32 and the second inorganic layer 34 may be in direct contact with each other in the third direction DR3 in another region.

[0096] In an embodiment, the display panel 100 may further include a dam portion DMP. The dam portion DMP may extend in the non-display area NDA along an edge of the display area DA (see FIG. Figure 2 ). The dam portion DMP may surround the display area DA.

[0097] In an embodiment, the dam portion DMP may include a first dam DM1 and a second dam DM2. In an embodiment, the first dam DM1 may include the same material as the third insulating layer 23, and the first dam DM1 may be formed concurrently (eg, simultaneously) with the third insulating layer 23 and may be disposed on the same layer as the third insulating layer 23.

[0098] The second dam DM2 may be stacked on the first dam DM1. In an embodiment, the second dam DM2 may include the same material as that of the fourth insulating layer 31, the second dam DM2 may be formed concurrently (e.g., simultaneously) with the fourth insulating layer 31, and may be disposed on the same layer as the fourth insulating layer 31. However, embodiments of the invention are not limited thereto. In another embodiment, the dam portion DMP may have a single-layer structure.

[0099] The dam DMP may define a region where the liquid organic material spreads in the process of forming the organic layer 33. In an embodiment, the liquid organic material may be provided on the first inorganic layer 32 by an inkjet method to form the organic layer 33. At this time, the dam DMP may define a boundary of a region where the liquid organic material is provided, thereby preventing or substantially preventing the liquid organic material from overflowing to the outside.

[0100] Here, we will refer to Figure 3A and Figure 3B The area defined by the first hole MH and the second hole BR is described in more detail. Figure 3B, for the purpose of ease and convenience of description and illustration, the first inorganic layer 32 and the second inorganic layer 34 are not shown. The first hole MH may pass through the display panel 100 along the third direction DR3. Since the first hole MH is defined in the display area DA, the first hole MH may also pass through some layers constituting the display area DA in addition to the base substrate 10.

[0101] In more detail, the first hole MH may pass through the base substrate 10. The inner surface 10-EG_H of the first hole MH may be defined by the ends of the plurality of layers. The end 11-E of the first base layer 11, the end 12-E of the first barrier layer 12, the end 13-E of the second base layer 13, and the end 14-E of the second barrier layer 14 may be defined at the first base layer 11, the first barrier layer 12, the second base layer 13, and the second barrier layer 14, respectively.

[0102] In addition, the first hole MH may also pass through one or more layers constituting the display area DA. For example, the first hole MH may pass through the first insulating layer 21, the charge control layer OL, the first inorganic layer 32, and the second inorganic layer 34. Therefore, the end 21-E of the first insulating layer 21, the end OL-E of the charge control layer OL, the end 32-E of the first inorganic layer 32, and the end 34-E of the second inorganic layer 34 may be defined at the first insulating layer 21, the charge control layer OL, the first inorganic layer 32, and the second inorganic layer 34, respectively.

[0103] In the present embodiment, the end 11-E of the first base layer 11, the end 12-E of the first barrier layer 12, the end 13-E of the second base layer 13, the end 14-E of the second barrier layer 14, the end 21-E of the first insulating layer 21, the end OL-E of the charge control layer OL, the end 32-E of the first inorganic layer 32, and the end 34-E of the second inorganic layer 34 may be aligned with each other in the third direction DR3. Therefore, the first hole MH may have a cylindrical shape with a certain height in the third direction DR3. However, the embodiments of the invention are not limited thereto. In another embodiment, at least one of the ends of the layer defining the first hole MH may not be aligned with at least another of the ends. In the present embodiment, the first hole MH has a cylindrical shape. However, the embodiments of the invention are not limited thereto. In other embodiments, for example, the first hole MH may have a quadrilateral column shape or a polygonal column shape.

[0104] The second hole BR may be defined adjacent to the first hole MH. The second hole BR may be spaced apart from the first hole MH in the first direction DR1. The second hole BR may be recessed from the front surface of the base substrate 10 in the third direction DR3. The second hole BR may pass through the front surface of the base substrate 10, but may not pass through the rear surface of the base substrate 10.

[0105] The second hole BR may be formed by removing a portion of the base substrate 10. For example, the second hole BR may be formed by removing a portion of the second base layer 13 and a portion of the second barrier layer 14.

[0106] According to an embodiment of the invention, the second hole BR may include an inner surface defined in the base substrate 10 and have an undercut shape. The second hole BR may include a first sub-hole 14-OP passing through the second barrier layer 14 and a second sub-hole 13-OP overlapping the first sub-hole 14-OP and defined in the second base layer 13. The first sub-hole 14-OP and the second sub-hole 13-OP may form an undercut shape at the inner surface of the second hole BR.

[0107] The second sub-hole 13-OP defined in the second base layer 13 and the first sub-hole 14-OP passing through the second barrier layer 14 may be stacked in a direction from the first barrier layer 12 toward the front surface of the base substrate 10. The first sub-hole 14-OP passing through the second barrier layer 14 and the second sub-hole 13-OP defined in the second base layer 13 may form an undercut shape.

[0108] In an embodiment, the inner surface of the first sub-hole 14-OP passing through the second barrier layer 14 may be aligned with the inner surface of the second sub-hole 13-OP defined in the second base layer 13, or may protrude laterally from the inner surface of the second sub-hole 13-OP defined in the second base layer 13. When the inner surface of the first sub-hole 14-OP protrudes laterally from the inner surface of the second sub-hole 13-OP, an undercut shape may be formed between the first sub-hole 14-OP passing through the second barrier layer 14 and the second sub-hole 13-OP defined in the second base layer 13.

[0109] In an embodiment, the second sub-hole 13-OP defined in the second base layer 13 may have different plane areas along the third direction DR3. In an embodiment, the width of the second sub-hole 13-OP at the rear surface of the second base layer 13 in the first direction DR1 may be smaller than the width R2 of the second sub-hole 13-OP at the front surface of the second base layer 13 in the first direction DR1. In an embodiment, the second sub-hole 13-OP defined in the second base layer 13 may have a truncated cone shape. However, embodiments of the invention are not limited thereto. In other embodiments, the second sub-hole 13-OP defined in the second base layer 13 may have a truncated pyramid shape or a truncated elliptical cone shape, which corresponds to the shape of the second hole BR in a plan view.

[0110] In an embodiment, the thin film element layer 20 and the display element layer 30 may partially overlap the second hole BR. For example, the first insulating layer 21 may extend adjacent to the second hole BR and may partially overlap the second hole BR. The first insulating layer 21 may cover at least a portion of the second hole BR. The first insulating layer 21 may include a third sub-hole 21-OP defined in an area corresponding to the second hole BR. The third sub-hole 21-OP of the first insulating layer 21 may overlap the second hole BR.

[0111] In the present embodiment, the width R3 of the third sub-hole 21-OP of the first insulating layer 21 in the first direction DR1 may be equal to or smaller than the width R1 of the first sub-hole 14-OP passing through the second barrier layer 14 in the first direction DR1. The inner surface of the third sub-hole 21-OP of the first insulating layer 21 may be aligned with the inner surface of the first sub-hole 14-OP passing through the second barrier layer 14, or may protrude laterally from the inner surface of the first sub-hole 14-OP passing through the second barrier layer 14. When the inner surface of the third sub-hole 21-OP protrudes laterally from the inner surface of the first sub-hole 14-OP, an undercut shape may be formed between the third sub-hole 21-OP of the first insulating layer 21 and the first sub-hole 14-OP passing through the second barrier layer 14.

[0112] The charge control layer OL may extend to a region adjacent to the first hole MH and a region adjacent to the second hole BR. The charge control layer OL may not overlap at least a portion of the second hole BR. Therefore, the charge control layer OL may have a broken end adjacent to the second hole BR.

[0113] The first inorganic layer 32 and the second inorganic layer 34 may extend to the region where the second hole BR is provided. In an embodiment, the first inorganic layer 32 and the second inorganic layer 34 may be provided in a region adjacent to the second hole BR and may extend along the inner surface of the second hole BR. Therefore, the interior of the second hole BR may be covered by the first inorganic layer 32 and the second inorganic layer 34.

[0114] According to an embodiment of the invention, the charge control layer OL may have a broken end adjacent to the second hole BR and may not overlap at least a portion of the second hole BR. The broken end of the charge control layer OL adjacent to the second hole BR is covered by the first and second inorganic layers 32 and 34.

[0115] like Figure 3A and Figure 3B As shown in , the base substrate 10, the thin film element layer 20, and the display element layer 30 may have a broken end in a region adjacent to the first hole MH. The broken end is exposed through the first hole MH. Moisture or oxygen outside the display panel 100 may be provided to the base substrate 10, the thin film element layer 20, and the display element layer 30 through the broken end exposed by the first hole MH.

[0116] However, according to an embodiment of the invention, since the second holes BR are defined adjacent to the first holes MH, moisture or oxygen provided from the first holes MH may be blocked. Figure 3A As shown in , the charge control layer OL whose end OL-E is exposed by the first hole MH does not extend to the second hole BR, but is cut off. The second hole BR can separate the portion of the charge control layer OL disposed between the first hole MH and the second hole BR from another portion of the charge control layer OL disposed outside the second hole BR. Therefore, even if external moisture or oxygen is provided through the first hole MH, the external moisture or oxygen will not be transferred to the outside of the second hole BR. Therefore, it is possible to stably prevent damage to the thin film element layer 20 and / or the display element layer 30 existing outside the second hole BR.

[0117] In addition, according to an embodiment of the invention, the first inorganic layer 32 and the second inorganic layer 34 may cover the portion between the first hole MH and the second hole BR, the inside of the second hole BR, and the outside of the second hole BR. In other words, the charge control layer OL and / or the first insulating layer 21 adjacent to the second hole BR and cut may be covered by the first inorganic layer 32 and the second inorganic layer 34. Therefore, external moisture or oxygen may be further blocked.

[0118] Figure 4 is a diagram showing an embodiment according to the invention Figure 2 A cross-sectional view of a first barrier layer. Figure 5 is a graph showing characteristics of laser light transmitted through a first barrier layer according to an embodiment of the invention. Figure 6 is a diagram showing an embodiment according to the invention Figure 4 A cross-sectional view of a portion of a first barrier layer.

[0119] Reference Figure 4 , the first barrier layer 12 may include a plurality of reflective layers INL1 to INLn. The reflective layers INL1 to INLn may block or reflect laser light of a specific wavelength band. Here, the laser light of a specific wavelength band may be used to form a reference Figure 2 The second wavelength band laser of the second hole BR is described.

[0120] according to Figure 5 For example, the laser light LS of the second wavelength band may have a wavelength in the range of 300 nm to 400 nm. Figure 5In the graph of , the horizontal axis represents wavelength, and the vertical axis represents absorptivity, reflectivity, and transmittance of light. The laser LS may remove a portion of the second barrier layer 14 and a portion of the second base layer 13 to form a second hole BR overlapping the peripheral area BA. In other words, the second barrier layer 14 and the second base layer 13 may have a high absorptivity for absorbing the laser LS of the second wavelength band. In an embodiment, the second barrier layer 14 according to the invention may be formed of a single layer including an inorganic material, so the transmittance and reflectivity of the laser LS in the second barrier layer 14 may be low.

[0121] In an embodiment, the first barrier layer 12 according to the invention may include a plurality of reflective layers INL1 to INLn. Therefore, the first barrier layer 12 may have a low absorptivity and a low transmittance of the laser LS in the second band, but may have a high reflectivity of the laser LS. Therefore, the second hole BR may not be formed in the first barrier layer 12 by the laser LS. Therefore, since moisture or oxygen penetrating through the rear surface of the first base layer 11 is blocked by the first barrier layer 12, it is possible to prevent or substantially prevent moisture or oxygen from penetrating through the second hole BR to the thin film element layer 20 and / or the display element layer 30.

[0122] Refer again Figure 4 According to an embodiment of the invention, each of the reflective layers INL1 to INLn may include a first inorganic film and a second inorganic film having refractive indices different from each other and stacked. In more detail, the first barrier layer 12 may include a plurality of first inorganic films IO1 to IOn having a first refractive index and a plurality of second inorganic films IN1 to INn having a second refractive index. In an embodiment, the second inorganic films IN1 to INn and the first inorganic films IO1 to IOn may be stacked overlappingly. In addition, the total thickness of the first barrier layer 12 according to the invention may have a certain height H1, and in an embodiment, the height H1 may be in the range of 550nm to 600nm.

[0123] For ease and convenience of description and illustration, Figure 4 4, 102, 10n-1, and 10n of the first inorganic films 101 to 10n and 4, IN1, IN2, INn-1, and INn of the second inorganic films IN1 to INn are shown in FIG.

[0124] In an embodiment, the uppermost film of the first barrier layer 12 may be the uppermost inorganic film IO1 among the first inorganic films IO1 to IOn, and the lowermost film of the first barrier layer 12 may be the last inorganic film INn among the second inorganic films IN1 to INn.

[0125] In an embodiment, the first inorganic films IO1 to IOn may include silicon oxide (SiO xIn an embodiment, the second inorganic films IN1 to INn may include silicon nitride (SiN x In an embodiment, the second refractive index of the second inorganic films IN1 to INn may be higher than the first refractive index of the first inorganic films IO1 to IOn.

[0126] According to the above description, the first barrier layer 12 according to the present invention can be provided as a distributed Bragg reflector having high reflectivity. Since each of the reflective layers INL1 to INLn includes first and second inorganic films having different refractive indices, reflectivity to external laser light can be improved.

[0127] In an embodiment, the first inorganic films IO1 to IOn are made of silicon oxide (SiO x ) is formed, and the second inorganic films IN1 to INn are made of silicon nitride (SiN x ) is formed. However, the embodiment of the invention is not limited thereto. In another embodiment, each of the first inorganic films IO1 to IOn and the second inorganic films IN1 to INn may include SiO x 、SiN x 、TiO x 、AlO x In yet another embodiment, the first barrier layer 12 may be provided as a metal layer.

[0128] Reference Figure 6 , two or more of the first inorganic films IO1 to IOn according to the invention may have different thicknesses from each other. For example, the uppermost first inorganic film IO1 may have a first height Ha, and the second uppermost first inorganic film IO2 may have a second height Hc. In an embodiment, the second height Hc of the second uppermost first inorganic film IO2 may be greater than the first height Ha of the uppermost first inorganic film IO1.

[0129] In addition, two or more of the second inorganic films IN1 to INn according to the invention may have different thicknesses from each other. For example, the uppermost second inorganic film IN1 may have a third height Hb, and the second uppermost second inorganic film IN2 may have a fourth height Hd. In an embodiment, the fourth height Hd of the second uppermost second inorganic film IN2 may be less than the third height Hb of the uppermost second inorganic film IN1.

[0130] In an embodiment, Figure 6 As shown in , the first height Ha may be different from the third height Hb, and the second height Hc may be different from the fourth height Hd. In other words, in the embodiment, the first inorganic films IO1 to IOn and the second inorganic films IN1 to INn may have different thicknesses from each other.

[0131] FIG. 7A to FIG. 7Dis a cross-sectional view illustrating a method of manufacturing a display panel according to an embodiment of the invention. Fig. 7E are images showing a base substrate according to an embodiment of the invention.

[0132] like Fig. 7A As shown in , an untreated base substrate 10_I1 may be provided. The untreated base substrate 10_I1 may include a first untreated base layer 11_I, a first untreated barrier layer 12_I, a second untreated base layer 13_I, and a second untreated barrier layer 14_I. The first untreated base layer 11_I and the second untreated base layer 13_I may be alternately stacked with the first untreated barrier layer 12_I and the second untreated barrier layer 14_I.

[0133] The first untreated base layer 11_I, the first untreated barrier layer 12_I, the second untreated base layer 13_I, and the second untreated barrier layer 14_I may be sequentially stacked in an upward direction. The first untreated base layer 11_I may correspond to the lowermost layer of the untreated base substrate 10_I1, and the second untreated barrier layer 14_I may correspond to the uppermost layer of the untreated base substrate 10_I1.

[0134] Afterwards, if Figure 7B As shown in FIG. 1 , a capping layer MSL may be formed on the second unprocessed barrier layer 14_I. The capping layer MSL may cover the second unprocessed barrier layer 14_I.

[0135] The thin film element layer 20 described above can be used (see Figure 2 ) and the display element layer 30 (see Figure 2 ) to form the cover layer MSL. For example, the first insulating layer 21, the second insulating layer 22, the third insulating layer 23 and the fourth insulating layer 31 and the control electrode CE, the input electrode IE, the output electrode OE and the first electrode E1 (see Figure 2 ) to form the covering layer MSL.

[0136] A through hole MSL-OP exposing at least a portion of the second unprocessed barrier layer 14_I may be formed in the overcoat MSL. In an embodiment, the through hole MSL-OP of the overcoat MSL may be formed concurrently (e.g., simultaneously) in a process of forming the first insulating layer 21, the second insulating layer 22, the third insulating layer 23, and the fourth insulating layer 31 and at least one of the control electrode CE, the input electrode IE, the output electrode OE, and the first electrode E1. Therefore, the overcoat MSL may be formed using an existing process without an additional process, and therefore, process time and process cost may be reduced.

[0137] Afterwards, if Figure 7CAs shown in , laser LS may be provided to the cover layer MSL. The laser LS may be a laser having a wavelength in the range of 300nm to 400nm. The laser LS may be light provided in the etching process. Figure 7C As shown in , in the embodiment, the laser light LS may be provided in a radial form WV. Therefore, each layer may be etched in a shape in which the width becomes wider toward the top thereof.

[0138] Figure 7B The first untreated base layer 11_I, the first untreated barrier layer 12_I, the second untreated base layer 13_I and the second untreated barrier layer 14_I can be respectively changed into a first heat-treated base layer 11_T, a first heat-treated barrier layer 12_T, a second heat-treated base layer 13_T and a second heat-treated barrier layer 14_T by laser LS.

[0139] In this case, the shapes of the second untreated base layer 13_I and the second untreated barrier layer 14_I may be different from the shapes of the second heat-treated base layer 13_T and the second heat-treated barrier layer 14_T. Fig.7D As shown in FIG. 1 , a second hole BR_A may be formed in the second heat-treated base layer 13_T and the second heat-treated barrier layer 14_T.

[0140] On the contrary, the shapes of the first untreated base layer 11_I and the first untreated barrier layer 12_I may be the same or substantially the same as the shapes of the first heat-treated base layer 11_T and the first heat-treated barrier layer 12_T. Fig. 7E As shown in FIG. 1 , since the first barrier layer 12 reflects most of the laser light LS, holes may not be formed in the first barrier layer 12 and the first base layer 11 by the laser light LS.

[0141] In addition, if Fig.7D As shown in , when viewed in a cross-sectional view, the inner surface of the second hole BR_A may have an undercut shape by the difference in absorptivity between the layers with respect to the laser LS. Like the region "BB", the second heat-treated base layer 13_T may be undercut relative to the second heat-treated barrier layer 14_T. Therefore, the inner surface of the first sub-hole 14-OP passing through the second heat-treated barrier layer 14_T may protrude laterally from the inner surface of the second sub-hole 13-OP defined in the second heat-treated base layer 13_T.

[0142] Figure 8 is a cross-sectional view showing a display panel of an electronic device according to another embodiment of the invention.

[0143] Reference Figure 8 ,and Figure 2Compared with the display panel 100 shown in FIG. 1 , the display panel 100 - 1 may further include a third hole BR2 . Figure 8 The other components of the display panel 100-1 may be Figure 2 Corresponding components of the display panel 100 shown in FIG. 1 are the same or substantially the same, and thus, a description thereof will be omitted.

[0144] In the present embodiment, a third hole BR2 recessed from the front surface of the base substrate 10 may be further defined in the base substrate 10. When viewed in a plan view, the third hole BR2 may be closer to the second hole BR1 than to the first hole MH overlapping the hole area HA. ​​When viewed in a plan view, the second hole BR1 may surround the first hole MH and may be spaced apart from the first hole MH by a certain distance (e.g., a predetermined distance). When viewed in a plan view, the third hole BR2 may surround the second hole BR1 and may be spaced apart from the second hole BR1 by a certain distance (e.g., a predetermined distance).

[0145] The structures of the second hole BR1 and the third hole BR2 can be Figure 2 The structure of the second hole BR shown in FIG. 1 is the same or substantially the same. Therefore, descriptions of the structures of the second hole BR1 and the third hole BR2 are omitted.

[0146] According to the above description, moisture or oxygen penetrating through the first holes MH may be blocked by the second and third holes BR1 and BR2 , and thus, it is possible to effectively prevent moisture or oxygen from being transferred to the thin film element layer 20 and / or the display element layer 30 .

[0147] According to the present invention, it is possible to effectively prevent the components from being damaged by moisture or oxygen penetrating from the outside, thereby improving the reliability of the electronic device in the manufacturing process and in use.

[0148] Specifically, it is possible to block moisture or oxygen penetrating through the rear surface of the base substrate of the display panel.

[0149] Although the invention has been described with reference to some example embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Therefore, it should be understood that the above-described embodiments are not restrictive but illustrative. Therefore, the scope of the invention will be determined by the broadest permissible interpretation of the claims and their equivalents, and should not be limited or defined by the foregoing description.

Claims

1. A display panel, comprising: a base substrate having a through hole portion and a first recessed portion defined therein, wherein the through hole portion penetrates the front and rear surfaces of the base substrate, and wherein the first recessed portion is adjacent to the through hole portion and is recessed from the front surface of the base substrate; and a pixel layer, located on the front surface of the base substrate, Wherein, the base substrate includes: a first base layer, including the rear surface of the base substrate; a first barrier layer, located on the first base layer and including at least two inorganic films with different refractive indices; a second base layer, located on the first barrier layer; and a second barrier layer, located on the second base layer and including the front surface of the base substrate.

2. The display panel according to claim 1, wherein: When viewed in a plan view, the first recessed portion surrounds the through hole portion.

3. The display panel according to claim 1, wherein: The first recessed portion is defined in the second base layer and the second barrier layer.

4. The display panel according to claim 1, wherein: The at least two inorganic films include a plurality of first inorganic films having a first refractive index and a plurality of second inorganic films having a second refractive index, and The plurality of first inorganic films and the plurality of second inorganic films have different thicknesses from each other.

5. The display panel according to claim 1, wherein: A plurality of second recessed portions are also defined in the base substrate, wherein, when viewed in a plan view, the second recessed portion is closer to the first recessed portion than to the through hole portion, and Wherein, the second recessed portion is recessed from the front surface of the base substrate.

6. The display panel according to claim 5, wherein: In a plan view, the second recessed portion surrounds the first recessed portion, and The second recessed portion is not defined in the first base layer and the first barrier layer.

7. The display panel according to claim 5, wherein: The second recessed portion is not defined in the first base layer and the first barrier layer.

8. The display panel according to claim 1, wherein: The first barrier layer includes a plurality of first inorganic films having a first refractive index and a plurality of second inorganic films having a second refractive index, The plurality of first inorganic films and the plurality of second inorganic films are alternately stacked.

9. The display panel according to claim 8, wherein: At least two of the first inorganic films have thicknesses different from each other, and at least two of the second inorganic films have thicknesses different from each other.

10. The display panel according to claim 8, wherein: The uppermost film in the first barrier layer is one of the first inorganic films, and the lowermost film in the first barrier layer is one of the second inorganic films, and Wherein, the second refractive index is higher than the first refractive index.

11. The display panel according to claim 1, wherein: In a plan view, the first concave portion is disposed between the through hole portion and the pixel layer.

12. An electronic device, comprising: A display panel comprising: a base substrate in which a through hole portion and a first recessed portion are defined, wherein the through hole portion penetrates a front surface and a rear surface of the base substrate, and wherein the first recessed portion is adjacent to the through hole portion and is recessed from the front surface of the base substrate; and an electronic module partially overlapping the through hole, Wherein, the base substrate includes: a first base layer, including the rear surface of the base substrate; a first barrier layer, located on the first base layer and including at least two inorganic films with different refractive indices; a second base layer, located on the first barrier layer; and a second barrier layer, located on the second base layer and including the front surface of the base substrate.

13. The electronic device according to claim 12, wherein: The electronic module overlaps with the display area of ​​the display panel.

14. The electronic device according to claim 12, wherein: The first concave portion is disposed between the through hole portion and a pixel region included in the display region.

Images