Connector assembly

Abstract

A connector assembly for high speed data communication is described. In one example, a connector assembly includes a plug mating interface, a surface mating interface, and a wafer assembly between the plug mating interface and the surface mating interface. The wafer assembly includes a wafer insert, a channel-like shield, a plurality of signal conductors extending within the channel-like shield, a conductive pad over an open edge of the channel-like shield, and a shield cover over the conductive pad. The conductive pad can be embodied as a conductive elastomeric pad and provide a conductive shield over the open edge of the channel-like shield. The conductive pad can be located between the shield cover and the open edge of the channel-like shield. The conductive pad and the shield cover help enclose open areas in the channel-like shield and provide additional shielding for the plurality of signal conductors.

Description

[0001] Related Applications

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 503,642, filed May 22, 2023. The disclosure of the above application is incorporated herein by reference in its entirety. Background Art

[0003] A range of input / output (I / O) connectors are designed for power, data, and power and data interconnect systems, including board-to-board systems, wire-to-wire systems, and wire-to-board systems. There are many designs for each type of system, depending on the requirements of the power and data communication environment in which the connector is used. As an example, a wire-to-board system includes a free-end connector attached to a wire and a fixed-end connector attached to a board.

[0004] High data rate connectors, cable assemblies, and interconnect systems often rely on two conductors arranged as a pair to transmit a differential signal as a differentially coupled signal pair. The transmitted signal is represented by the electrical difference measured between the conductor pairs. Differential signaling can help avoid parasitic signals and crosstalk and avoid unintentional signaling modes between adjacent signal pairs. In the connector interface, ground terminals can be relied upon to create a return path for electrical grounding, to provide shielding between differential pairs, and for other purposes.

[0005] Connectors used in high data rate applications are typically designed to meet a range of mechanical and electrical requirements. As an example, high data rate connectors are often used in backplane applications that require very high conductor density and data rates. In order to achieve the required mechanical and electrical requirements, connectors used in such applications often include one or more wafer assemblies. The use of wafer assemblies can help to utilize many different assembly processes to manufacture connectors that can achieve high data rates. Summary of the invention

[0006] Various aspects and embodiments of high-speed connector assemblies are described. In one example, a connector assembly includes a plug docking interface, a surface docking interface, and a thin sheet assembly between the plug docking interface and the surface docking interface. The thin sheet assembly includes a thin sheet plug, a channel-shaped shield, a plurality of signal conductors extending within the channel-shaped shield, a conductive gasket located above an opening edge of the channel-shaped shield, and a shielding cover located above the conductive gasket. The conductive gasket can be embodied as a conductive elastomeric gasket and provide a conductive shield above the opening edge of the channel-shaped shield. The conductive gasket can be located between the shielding cover and the opening edge of the channel-shaped shield. In other examples, the thin sheet assembly also includes a second channel-shaped shield, and the conductive gasket is located above the opening edge of the channel-shaped shield and above the second opening edge of the second channel-shaped shield.

[0007] In other aspects of the multiple embodiments, the channel-shaped shield includes a plurality of shielding tail contact terminals, the shielding cover includes a plurality of side tail contact portions and a middle tail contact portion, and the plurality of signal conductors include a plurality of signal tail contact terminals. At the surface docking interface, the signal tail contact terminals of the plurality of signal conductors are located between the plurality of shielding tail contact terminals of the channel-shaped shield and are adjacent to the middle tail contact portion of the shielding cover. In other aspects, the channel-shaped shield also includes a shielding tongue. At the surface docking interface, the signal tail contact terminals of the plurality of signal conductors are located between the plurality of shielding tail contact terminals of the channel-shaped shield in the front-to-back direction of the connector assembly, and between the middle tail contact portion of the shielding cover and the shielding tongue of the channel-shaped shield in the left-to-right direction of the connector assembly.

[0008] In other aspects of the embodiments, the connector assembly further comprises a surface interface shield at the surface docking interface of the connector assembly. The surface interface shield can be embodied as a plated plastic. At the surface docking interface, the channel-shaped shield and the plurality of signal conductors can extend through an opening in the surface interface shield. The channel-shaped shield can contact an inner surface of the opening in the surface interface shield. Additionally, at the surface docking interface, the shield cover can extend through a second opening in the surface interface shield. The shield cover can contact an inner surface of the second opening in the surface interface shield.

[0009] In another embodiment, a wafer assembly includes a wafer insert, a channel shield, a plurality of signal conductors extending within the channel shield, a conductive gasket located above an opening edge of the channel shield, and a shield cover located above the conductive gasket. The conductive gasket can be embodied as a conductive elastomeric gasket and provide a conductive shield above the opening edge of the channel shield. The conductive gasket can be located between the shield cover and the opening edge of the channel shield.

[0010] In another embodiment, a connector assembly includes a wafer assembly and a surface interface shield. The wafer assembly includes a wafer insert, a channel-shaped shield, a plurality of signal conductors extending within the channel-shaped shield, a conductive pad provided on an opening edge of the channel-shaped shield, and a shielding cover provided on the conductive pad. The surface interface shield can be embodied as a plated plastic component. The channel-shaped shield and the signal conductor can extend through an opening in the surface interface shield, and the channel-shaped shield can contact an inner surface of the opening in the surface interface shield. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Many aspects of the present disclosure may be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, but emphasis is placed on clearly illustrating the principles of the present disclosure. In addition, in the drawings, similar reference numerals throughout the several views represent corresponding parts.

[0012] Figure 1A A top perspective view of an example connector assembly according to various aspects of the present disclosure is shown.

[0013] Figure 1B The present invention shows various aspects of Figure 1A A side view of the connector assembly is shown.

[0014] Figure 1C The present invention shows various aspects of Figure 1A A bottom view of the connector assembly is shown.

[0015] Figure 2A The present invention shows various aspects of Figure 1A A first side perspective view of a connector assembly is shown with some components omitted.

[0016] Figure 2B The present invention shows various aspects of Figure 1A A second side perspective view of the connector assembly is shown with some components omitted.

[0017] Figure 2CThe present invention shows various aspects of Figure 1A The second side perspective view of the connector assembly is shown with some components omitted.

[0018] Figure 3A The present invention shows various aspects of Figure 1A A front view of a wafer assembly in a connector assembly is shown.

[0019] Figure 3B The present invention shows various aspects of Figure 3A A rear view of the wafer assembly is shown.

[0020] Figure 3C The present invention shows various aspects of Figure 3A A top view of the wafer assembly is shown.

[0021] Figure 3D The present invention shows various aspects of Figure 3A A bottom view of the wafer assembly is shown.

[0022] Figure 3E The present invention shows various aspects of Figure 3A A three-dimensional view of the wafer assembly is shown.

[0023] Figure 3F The present invention shows various aspects of Figure 3A An exploded perspective view of the wafer assembly is shown.

[0024] Figure 3G The present invention shows various aspects of Figure 3A The trailing contact portion of the wafer assembly is shown.

[0025] Figure 4A The present invention shows various aspects of Figure 1A The bottom components of the connector assembly are shown.

[0026] Figure 4B The present invention shows various aspects of Figure 1A A first region of a bottom portion of a connector assembly is shown.

[0027] Figure 4C The present invention shows various aspects of Figure 1A A second region of the bottom portion of the connector assembly is shown.

[0028] Figure 4D The present invention shows various aspects of Figure 1A A surface interface shield of a connector assembly is shown. DETAILED DESCRIPTION

[0029] Connectors are typically designed to meet a range of mechanical and electrical requirements. As an example, high data rate connectors are often used in backplane applications that require very high conductor density and data rates. In order to achieve the required mechanical and electrical requirements, connectors used in such applications often include one or more wafer assemblies. The use of wafer assemblies can help to utilize a series of different assembly processes to manufacture connectors capable of high data rates. In any case, it remains challenging to design wafers and connectors in new systems with the conductor density and small pinout required for high data rate applications while also maintaining the desired electrical characteristics for data transmission with signal integrity.

[0030] In the sections set forth above, various aspects and embodiments of high-speed connector assemblies are described. In one example, a connector assembly includes a plug docking interface, a surface docking interface, and a thin sheet assembly between the plug docking interface and the surface docking interface. The thin sheet assembly includes a thin sheet plug-in, a channel-shaped shield, a plurality of signal conductors extending within the channel-shaped shield, a conductive gasket located above the opening edge of the channel-shaped shield, and a shielding cover located above the conductive gasket. The conductive gasket can be embodied as a conductive elastomeric gasket and provide a conductive shield above the opening edge of the channel-shaped shield. The conductive gasket can be located between the shielding cover and the opening edge of the channel-shaped shield. The conductive gasket and the shielding cover help to close the opening area in the channel-shaped shield and provide additional shielding for the signal conductors.

[0031] Turning to the attached figure, Figure 1A A top perspective view of an example connector assembly 10 (ie, connector 10 ) is shown. Figure 1B A side view of the connector 10 is shown, and Figure 1C A bottom view of a connector 10 according to various aspects of the present disclosure is shown. The connector 10 is shown as a representative example and is not drawn to any particular scale or size. The shape, size, ratio, and other characteristics of the connector 10 can vary relative to what is shown. In addition, although the connector 10 and other connectors discussed herein are described for use in high-speed backplanes and related interconnection applications, the concept is not limited to use with such interconnection applications or systems. The concept can be extended to use in other types of connectors for other types of interconnection applications or systems.

[0032] Reference Figures 1A to 1CThe connector 10 includes a plug mating interface 12 and a surface interface 14. In one example, a plug connector can be mated and electrically connected to the connector 10 at the plug mating interface 12. In another example, the free end of an interconnect system cable can be mated and electrically connected to the connector 10 at the plug mating interface 12. Additionally, the connector 10 is a hermaphroditic or genderless type connector. In other words, a replica of the connector 10 can be rotated and mated to the connector 10 (i.e., itself) at the plug mating interface 12.

[0033] The surface interface 14 of the connector 10 can be mounted and electrically connected to a printed circuit board (PCB). The connector 10 also includes a housing 20, retaining clips 22, 24 (see Figure 2B ), with support columns 31A, 31B, 33A, 33B alignment plug-in 30, 32 (see Figure 1C ) and a surface interface shield 40 and other components. The connector 10 is a hermaphroditic or genderless type connector. In other words, a replica of the connector 10 can be rotated and docked with the connector 10 (i.e., itself) at the plug docking interface 12.

[0034] The housing 20 can be formed of a plastic or polymer such as a liquid crystal polymer (LCP), polyethylene (PE), polytetrafluoroethylene (PTFE), a fluoropolymer or other plastic or insulating material. The housing 20 can be formed using any suitable additive or subtractive manufacturing technology including molding, injection molding, printing and other technologies. In some cases, the outer surface of the housing 20 can be plated with one or more plated metals for conductivity, and the housing 20 can be embodied as a plated plastic component. The surface can be etched in some cases and metalized or plated in a bath, barrel plated, plated by physical vapor deposition (PVD), plated by chemical plating, electroplating, sputtering, ion plating, or other plating techniques, or a combination thereof. The surface of the housing 20 can be metalized or plated with copper, nickel, tin, silver, another other plated metal, or a combination of these plated metals.

[0035] As described later, a plurality of wafer assemblies are located in a side-by-side arrangement within the housing 20. The housing 20 is located on the plurality of wafer assemblies and secures the plurality of wafer assemblies in the connector 10. In the examples described herein, the connector 10 includes eight wafer assemblies. However, in other cases, the connector 10 can include other numbers of wafer assemblies, including fewer or more wafer assemblies. Figures 3A to 3GEach of the plurality of wafer assemblies described in further detail includes pairs of signal conductors and a channel-shaped shield for each pair of signal conductors. In the illustrated examples, each of the plurality of wafer assemblies includes four pairs of signal conductors and four channel-shaped shields. Each pair of signal conductors extends within a channel of a respective channel-shaped shield, and the channel-shaped shield provides a common ground and shielding for the pair of signal conductors. These and other aspects of the plurality of wafer assemblies are described in more detail below.

[0036] The retaining clips 22, 24 can be formed separately from a flat sheet of metal (e.g., by stamping, shearing, or other means). The retaining clips 22, 24 can be inserted into retaining slots formed in the housing 20. For example, Figure 1B As shown, the retaining clip 22 is inserted through the retaining slit 26 formed through the housing 20. The retaining clip 24 is inserted through another retaining slit formed on an opposite side of the housing 20. Figure 2A In further detail, the retaining clips 22, 24 include retaining tabs.

[0037] The alignment plugs 30, 32 can be formed separately from a flat sheet of metal (e.g., by stamping, shearing, or other means). In one example, the alignment plugs 30, 32 can be inserted into alignment slots formed in the housing 20. Figure 1C As shown, the alignment inserts 30, 32 are respectively inserted into the alignment slots 28, 29 formed in the housing 20. In one embodiment, the alignment inserts 30, 32 can be fixed in the alignment slots 28, 29 by a mechanical interference or friction fit. In other examples, the housing 20 can be molded around the alignment inserts 30, 32.

[0038] The alignment plug-in 30 includes support posts 31A, 31B. The alignment plug-in 32 includes support posts 33A, 33B. The support posts 31A, 31B, 33A, 33B extend downward from a bottom surface of the housing 20 in the surface interface 14 area of ​​the connector 10. For example, when the surface interface 14 area of ​​the connector 10 is fixed to and electrically connected to the PCB, each of the support posts 31A, 31B, 33A, 33B can be inserted into a cover opening of a PCB and soldered in place. As further described in detail below, the support posts 31A, 31B, 33A, 33B provide mechanical support to the connector 10 and help reduce stress on the tail contact end of the connector 10, especially when the connector 10 is docked with a plug connector at the plug docking interface 12.

[0039] Reference Figure 1C, the connector 10 includes a surface interface shield 40 at the surface interface 14 area of ​​the connector 10. The surface interface shield 40 can be formed of a plated plastic material. For example, the surface interface shield 40 can be formed of LCP, PE, PTFE or other plastic materials, and in some cases, include one or more additives to which the plated metal will adhere better. The surface interface shield 40 can be formed using any suitable additive or subtractive manufacturing technology including molding, injection molding, printing and other technologies. The outer surface of the surface interface shield 40 can be plated with one or more plated metals for conductivity, and the surface interface shield 40 can be embodied as a plated plastic component. The surface can be etched in some cases and can be metallized or plated in a plating solution, barrel plated, plated by PVD, plated by chemical plating, electroplating, sputtering, ion plating, or other plating techniques or a combination thereof. The surface of the surface interface shield 40 can be metallized or plated with copper, nickel, tin, silver, another other plated metal or a combination of these plated metals. The surface interface shield 40 provides additional shielding at the surface mating interface 14 of the connector 10 .

[0040] The surface interface shield 40 includes a plurality of apertures or openings, and the ends of the sheet assembly extend through the apertures or openings, such as Figure 1C The channel-shaped shield of each of the plurality of wafer assemblies also contacts the outer surface of the surface interface shield 40. Thus, the surface interface shield 40 electrically connects all the channel-shaped shields of the plurality of wafer assemblies in the connector 10 together at the surface interface 14 of the connector 10.

[0041] Figure 2A Show Figure 1A A first side perspective view of the connector 10 is shown, wherein some components are omitted, and Figure 2B Show Figure 1A A second side view of the connector 10 is shown, wherein some components are omitted. In particular, Figure 1A and Figure 1B The housing 20 is omitted in the view of FIG. As shown, the connector 10 includes a number of wafer assemblies, including wafer assemblies 50A, 50B, 50C, 50N, etc. (collectively referred to as wafer assemblies 50). A plurality of wafer assemblies 50 are arranged side by side in the connector 10. In the example shown, the connector 10 includes eight wafer assemblies 50. However, in other cases, the connector 10 can include other numbers of wafer assemblies, including fewer or more numbers of wafer assemblies.

[0042] Reference Figure 2AThe retaining card 22 includes retaining tabs 23A-23N (collectively referred to as retaining tabs 23). The retaining card 24 also includes a plurality of similar retaining tabs. When the retaining card 22 is inserted through the retaining slit 26 in the housing 20 (see Figure 1A and Figure 1B ), the plurality of retaining tabs 23 extend between the plurality of retaining grooves of the plurality of wafer components 50 and interlock in the plurality of retaining grooves of the plurality of wafer components 50 to hold and fix the plurality of wafer components 50 in place relative to the housing 20 in the connector 10. For example, the retaining tab 23A of the retaining card 22 extends into the retaining groove 220 of the wafer component 50A, as shown in FIG. Figure 2A As shown, and other retaining tabs 23 extend into similar retaining grooves in multiple thin-sheet components 50. Additionally, the retaining card 24 is inserted through an opposite side of the housing 20 (ie, Figure 1B Another retaining slit is formed on the opposite side of the shell 20 shown in the figure, and the multiple retaining tabs of the retaining card 24 extend between the multiple retaining grooves on the other side of the multiple thin-film components 50 and interlock in the multiple retaining grooves on the other side of the multiple thin-film components 50.

[0043] Figure 2C Show Figure 2B The second side view of the connector 10 is shown, wherein some components are omitted. The housing 20, the alignment plugs 30, 32 and the surface interface shield 40 are Figure 2C The surface mount (SMT) tails of the plurality of wafer components 50 are omitted in the view of FIG. Figure 2C When the connector 10 is mounted and connected to a PCB, the tail ends of the plurality of wafer components 50 can be electrically connected (eg, soldered, sintered, etc.) to a conductive pad or trace on a PCB. The tail ends of the plurality of wafer components 50 will be described in further detail later.

[0044] Figure 3A Show Figure 1A A front view of the wafer assembly 50A in the connector 10 is shown, Figure 3B A rear view of the wafer assembly 50A is shown, Figure 3C A top view of the wafer assembly 50A is shown, and Figure 3D A bottom view of wafer assembly 50A is shown. Wafer assembly 50A is shown as a representative example and is not drawn to any particular scale or size. The shape, size, ratio, and other characteristics of wafer assembly 50A can vary relative to that shown. Each of the plurality of wafer assemblies 50 in connector 10 can be similar to wafer assembly 50A and include the same components and features as wafer assembly 50A.

[0045] Reference FIG. 3A to FIG. 3F1 , the wafer assembly 50A includes channel shields 101-104, a wafer insert 200, a conductive gasket 300, a shielding cover 350, and signal conductors 401-408. The signal conductors 401-408 are conductors for data signals passing through the connector 10. The channel shields 101-104 are common or grounded shields in the connector 10, and together with the surface interface shield 40, the conductive gasket 300, and the shielding cover 350 form a common shielding or grounding network for the connector 10.

[0046] In the examples described herein, the channel-shaped shields 101-104 are formed as U-shaped shields, but the channel-shaped shields 101-104 can be formed in other shapes. Each of the channel-shaped shields 101-104 includes a pair of side walls extending generally orthogonal to a rear wall to form a U-shaped shield. Pairs of signal conductors 401-408 extend in channels of the channel-shaped shields 101-104. In particular, signal conductors 401, 402 extend in a channel of the channel-shaped shield 101, signal conductors 403, 404 extend in a channel of the channel-shaped shield 102, signal conductors 405, 406 extend in a channel of the channel-shaped shield 103, and signal conductors 407, 408 extend in a channel of the channel-shaped shield 104. The signal conductors 401 - 408 include signal head contact terminals 401A - 408A and signal tail contact terminals 401B - 408B, respectively.

[0047] The channel-shaped shields 101-104 include shield head contact terminals 101A-104A and shield tail contact terminals 101B-104B and other contact terminals, respectively. Each of the shield head contact terminals 101A-104A extends from one end of a first side wall of the channel-shaped shield 101-104, respectively. Each of the shield tail contact terminals 101B-104B extends from the other end of the first side wall of the channel-shaped shield 101-104, respectively. Each of the channel-shaped shields 101-104 also includes another shield head contact terminal extending from a second side wall of the channel-shaped shield 101-104. Additionally, each of the channel-shaped shields 101-104 includes another shield tail contact terminal extending from the second side wall of the channel-shaped shield 101-104, respectively.

[0048] The signal conductors 401-408 can be formed from a flat sheet of metal such as a lead frame (e.g., by stamping, shearing, or otherwise forming). In some cases, the sheet of metal or the lead frame can be plated with one or more plated metals. The shapes of the signal head contact terminals 401A-408A and the signal tail contact terminals 401B-408B can be formed by bending, pressing, or stamping, respectively. As described below with reference to Figure 4BIn further detail, the signal tail contacts 401B-408B are formed as J-shaped headers for surface mounting (SMT) to a PCB. In other examples, the signal tail contacts 401B-408B can be formed with perforations (eg, eye of needle, EON) or other contact styles.

[0049] The channel-shaped shields 101-104 can be independently formed from a flat sheet of metal material (e.g., by stamping, shearing, or other means). The shapes of the shield head contact ends 101A-104A and the shield tail contact ends 101B-104B can be formed by bending, pressing, or stamping, respectively. Figure 4B Illustratively, the shield tail contacts 101B-104B are also formed as J-heads for SMT connection to a PCB. In various other examples, the shield tail contacts 101B-104B can be formed as EON or other style contacts.

[0050] The wafer insert 200 can be formed of a plastic or polymer such as LCP, PE, PTFE, fluoropolymer or other plastic or insulating material. The wafer insert 200 can be molded around the lead frame forming the signal conductors 401-408 before the signal conductors 401-408 are separated from the larger lead frame. The wafer insert 200 secures the conductors 401-408 and positions the conductors 401-408 relative to each other and relative to other components of the wafer assembly 50A. As an example, the wafer insert 200 secures the signal conductors 401-408 and positions the signal conductors 401-408 relative to the channel-shaped shields 101-104, the conductive gasket 300, and the shield cover 350.

[0051] The wafer insert 200 includes channel spacers 211-214. The channel spacers 211-214 are sized to fit into the U-shaped channels within the channel-shaped shields 101-104. The channel spacers 211-214 support the signal conductors 401-408 within the channel-shaped shields 101-104 and electrically isolate the signal conductors 401-408 from the channel-shaped shields 101-104. The channel spacers 211-214 maintain the position and spacing of the signal conductors 401-408 within the channels of the channel-shaped shields 101-104.

[0052] As described above, the wafer insert 200 can be molded around the lead frame forming the signal conductors 401-408 before the signal conductors 401-408 are separated from the larger lead frame. Thus, in the wafer assembly 50A, the signal conductors 401, 402 extend through the channel spacer 211, the signal conductors 403, 404 extend through the channel spacer 212, the signal conductors 405, 406 extend through the channel spacer 213, and the signal conductors 407, 408 extend through the channel spacer 214. When the wafer insert 200 is first molded around the signal conductors 401-408, the wafer insert 200 includes a plurality of heat stakes. In particular, each of the channel spacers 211-214 includes a plurality of heat stakes. As described later, the heat stakes are used to secure the components of the wafer assembly 50A together.

[0053] After the wafer insert 200 is formed around the signal conductors 401-408 of the lead frame, the channel shields 101-104 can be inserted and positioned around the channel spacers 211-214 of the wafer insert 200. The channel shields 101-104 include a plurality of openings or apertures. The heat-staking posts extending through the channel spacers 211-214 extend through the openings of the channel shields 201-204, and the channel shields 201-204 are positioned around the channel spacers 211-214. Additionally, as described below with reference to Figure 3F Illustratively, the conductive gasket 300 and the shielding cover 350 are also formed to include openings or holes. The conductive gasket 300 and the shielding cover 350 are located on the channels of the channel-shaped shielding members 101-104, such as Figure 3A As shown, the heat stakes of the channel spacers 211 - 214 extend through the conductive gasket 300 and the shielding cover 350 .

[0054] After the wafer insert 200 is assembled with the signal conductors 401-408, the channel shields 101-104, the conductive gasket 300, and the shield cover 350, a separate heat-seal process step can be performed to secure the wafer assembly 50A together. In particular, the heat-seal posts of the wafer insert 200 are heat-seal and partially reshaped in a separate process step to form heat-seal caps. Many heat-seal caps such as heat-seal caps 210A-210C are shown in FIG. Figure 3A and Figure 3B The heat-melted caps 210A-210C secure the channel shields 101-104, the conductive gasket 300, and the shield cover 350 together with the wafer insert 200 and the signal conductors 401-408 to hold the wafer assembly 50A together.

[0055] The wafer insert 200 of the wafer assembly 50A includes retaining grooves 220, 221 at both ends of the wafer insert 200. The wafer inserts of other wafer assemblies 50 also include similar retaining grooves and both ends. The retaining clips 22, 24 include a plurality of retaining tabs. Return to reference Figure 2A , the retaining card 22 includes a plurality of retaining tabs 23, and the retaining card 24 also includes a plurality of similar retaining tabs. When the retaining card 22 is inserted through the retaining slit 26 in the housing 20 (see Figure 1A and Figure 1B ), the plurality of retaining tabs 23 extend between the retaining grooves of the plurality of wafer components 50 and interlock in the retaining grooves of the plurality of wafer components 50 to hold and fix the plurality of wafer components 50 in place relative to the housing 20 in the connector 10. For example, the retaining tab 23A of the retaining card 22 extends into the retaining groove 220 of the wafer component 50A, as shown in FIG. Figure 2A As shown, and other retaining tabs 23 extend into similar retaining grooves in multiple thin-sheet components 50. In addition, the retaining card 24 is inserted through an opposite side of the housing 20 (ie, as shown in FIG. Figure 1B Another retaining slit (on the opposite side of the shell 20 shown in the figure), and multiple retaining tabs of the retaining card 24 extend between and interlock with multiple retaining grooves on the other side of the multiple thin-film components 50, including a retaining groove 221 extending to the thin-film component 50A.

[0056] Figure 3E A perspective view showing the wafer assembly 50A, and Figure 3F An exploded perspective view of the wafer assembly 50A is shown. Figure 3F As best shown, when the wafer assembly 50A is assembled, the conductive gasket 300 is interposed between the shield cover 350 on one side and the wafer insert 200 and the surfaces of the channeled shields 101 - 104 on the other side.

[0057] The conductive gasket 300 can be formed of a conductive elastomer or foam material. The conductive gasket 300 is elastic and compressible to some extent. As an example, the conductive gasket 300 can be embodied as a polyurethane foam multilayer laminate including a conductive material such as copper, nickel or other conductive metal or material. In a particular example, the conductive gasket 300 can be embodied as a polyurethane foam multilayer laminate manufactured by Polymer Science Corporation of Monticello, Indiana. The conductive gasket 300 may be a conductive foam or conductive foam tape or sheet of the brand PS-1323, but other suitable types of conductive elastomers or foam materials may be relied upon. The conductive gasket 300 may vary in thickness between 0.1-3 mm, and example thicknesses include 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, and 3.0 mm, but other thicknesses may be relied upon. The conductive gasket 300 includes a bottom surface 310 and a top surface 311, and a plurality of openings or apertures through the conductive gasket 300 as described below.

[0058] The shield cover 350 can be formed from a flat sheet of metal or other conductive material (e.g., by stamping, shearing, or otherwise forming). The shield cover 350 can vary in thickness between 0.5-2 mm, and example thicknesses include 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, but can be other thicknesses.

[0059] Along one side, the shielding cover 350 includes side tail contacts 361-368 and middle tail contacts 381-384. In the example shown, the side tail contacts 361-368 and the middle tail contacts 381-384 are all formed in a J-shaped head for SMT connection to a PCB. In other cases, the tail contacts of the shielding cover 350 can also be formed in an EON or other style of contact. The middle tail contact 381 is located between the two side tail contacts 361, 362, the middle tail contact 382 is located between the two side tail contacts 363, 364, the middle tail contact 383 is located between the two side tail contacts 365, 366, and the middle tail contact 384 is located between the two side tail contacts 367, 368. In the wafer assembly 50A, the middle tail contact 381 of the shielding cover 350 is located adjacent to or adjacent to the signal tail contact ends 401B, 402B of the signal conductors 401, 402, as shown in FIG. Figure 3E and 3G In addition, the side tail contact portions 361, 362 of the shielding cover 350 are located close to or adjacent to the shielding tail contact ends 101B, 101BB of the channel-shaped shielding member 101, as shown in FIG. Figure 3E In the wafer assembly 50A, the other tail contact ends of the shield cover 350 are located adjacent to other shield tail contact ends of other channel-shaped shields and other signal tail contact ends of other signal conductors, as shown in FIG. Figure 3E The layout of the tail end contact portion in the wafer assembly 50A will be described later. Figure 3G illustrate.

[0060] The conductive gasket 300 and the shielding cover 350 each include a number of openings or apertures. For example, the shielding cover 350 includes openings 351-353, etc. Additionally, the conductive gasket 300 includes openings 301-303, etc. During assembly of the wafer assembly 50A, the hot melt posts of the wafer insert 200 can extend through the openings of the conductive gasket 300 and the shielding cover 350 before the hot melt posts are hot melted to form the hot melt caps 210A-210C, etc. The location and layout of the openings through the conductive gasket 300 and the shielding cover 350 are shown in a representative example and can rely on other configurations. When the wafer assembly 50A is assembled, the hot melt posts of the wafer insert 200 extend through the openings 301, 302 in the conductive gasket 300 and through the openings 351, 352 in the shielding cover 350. Additionally, the locating mounting portion 230 of the wafer insert 200 extends through the locating opening 303 of the conductive gasket 300 and through the locating opening 353 of the shield cover 350. After the components of the wafer assembly 50A are arranged together, the heat staking caps 210A, 210B, etc. are formed on the top surface 371 of the shield cover 350 during a heat staking process.

[0061] In some cases, a conductive adhesive can be applied between the top surface 311 of the conductive gasket 300 and the bottom surface 370 of the shielding cover 350 to hold the conductive gasket 300 and the shielding cover 350 together. Together, the conductive gasket 300 and the shielding cover 350 close the edges of the channel-shaped shields 101-104 along at least a portion of the length of the channel-shaped shields 101-104. In that manner, the conductive gasket 300 and the shielding cover 350 help to close and shield the signal conductors 401-408 extending within the channel-shaped shields 101-104. Both the conductive gasket 300 and the shielding cover 350 are conductive and electrically connected to a common or grounded network in the connector 10. Thus, the conductive gasket 300 and the shielding cover 350 provide a type of electromagnetic radiation shielding, reducing crosstalk coupling between the signal conductors 401-408 in the connector 10 and the associated signal interference.

[0062] Due to manufacturing tolerances and related factors, the opening edges of the U-shaped channel-shaped shields 101-104 are not necessarily in the exact same plane. Due to its elastomeric properties, the conductive gasket 300 can be compressed against the opening edges of the U-shaped channel-shaped shields 101-104 along at least a portion of the length of the channel-shaped shields 101-104 to cross and continuously contact along the opening edges. Compared with the case where only the shielding cover 350 is used, the conductive gasket 300 achieves a better seal and closure along the opening edges of the channel-shaped shields 101-104. The improved shielding provided by the conductive gasket 300 helps maintain the signal integrity on the signal conductors 401-408 and facilitates a higher data throughput for the connector 10. The conductive properties of the conductive gasket 300 also electrically connect the channel-shaped shields 101-104 and share the potential between the channel-shaped shields 101-104. The shield cover 350 also helps to close the channel shields 101 - 104 and holds the conductive gasket 300 in place.

[0063] Figure 3F It is also shown how the channel-shaped shields 101-104 are formed in a U-shaped shield. Each of the channel-shaped shields 101-104 includes a pair of side walls extending generally orthogonal to a rear wall to form a U-shaped shield. For example, the channel-shaped shield 101 includes a first side wall 120, a second side wall 121, and a rear wall 123. The two side walls 120, 121 extend generally orthogonal to the rear wall 123. The channel-shaped shields 101-104 include first shield head contact ends 101A-104A and second shield head contact ends 101AA-104AA and other contact ends. Referring to the channel-shaped shield 101, the first shield head contact end 101A extends from one end of the first side wall 120, and the second shield head contact end 101AA extends from one end of the second side wall 121. Additionally, the channel shields 101 - 104 include first shield tail contacts 101B- 104B and second shield tail contacts 101BB- 104BB. Again with respect to the channel shield 101 , the first shield tail contact 101B extends from the other end of the first sidewall 120 , and the second shield tail contact 101BB extends from the other end of the second sidewall 121 .

[0064] Figure 3G The present invention shows various aspects of Figure 3A As shown, the middle tail contact 381 of the shield cover 350 is located adjacent to or adjacent to the signal tail contact ends 401B, 402B of the signal conductors 401, 402. Additionally, the side tail contacts 361, 362 of the shield cover 350 are located adjacent to or adjacent to the shield tail contact ends 101B, 101BB of the channel-shaped shield 101. Figure 3GIt also shows how the bottom surface 310 of the conductive gasket 300 contacts the edge 111 of the top surface of the channel-shaped shield 101 and other edges of the top surface of the channel-shaped shield 101 to form an electrical connection between the conductive gasket 300 and the channel-shaped shield 101 .

[0065] Figure 3G The shielding tongue 130 of the channel-shaped shield 101 is also shown. Each of the other channel-shaped shields 102-104 of the thin-film assembly 50A also includes a similar shielding tongue. Additionally, each of the channel-shaped shields of the plurality of thin-film assemblies 50 includes a shielding tongue. The shielding tongue 130 extends from the rear wall 123 of the channel-shaped shield 101 toward the middle of the channel-shaped shield 101. The shielding tongue 130 includes a tongue bending portion 131, and the rear wall 123 of the channel-shaped shield 101 is bent toward the middle of the channel-shaped shield 101 at the tongue bending portion 131. The end of the shielding tongue 130 is close to but does not contact the signal tail contact terminals 401B, 402B. In any case, the shielding tongue 130 of the channel-shaped shield 101 extends near the signal tail contact terminals 401B, 402B relative to the rear wall 123. The end surface 132 of the shield tongue 130 does not extend to the mounting end surface 401C of the signal tail contact terminal 401B. Similarly, the end surface 132 of the shield tongue 130 does not extend to the mounting end surface 402C of the signal tail contact terminal 402B.

[0066] Figure 4A Show Figure 1A The bottom part of the connector assembly 10 is shown. The housing 20 and the retaining clips 22 and 24 are Figure 4A 4 is omitted from the view of FIG. 4 so that the surface interface shield 40 is visible. The surface interface shield 40 can be formed of a plated plastic material. For example, the surface interface shield 40 can be formed of LCP, PE, PTFE or other plastic materials, and in some cases, include one or more additives to which the plated metal will adhere better. The surface interface shield 40 can be formed using any suitable additive or subtractive manufacturing technology including molding, injection molding, printing and other technologies. The outer surface of the surface interface shield 40 can be plated with one or more plated metals for conductivity, and the surface interface shield 40 can be embodied as a plated plastic component. The surface can be etched in some cases and can be metallized or plated in a plating bath, barrel plated, plated by PVD, plated by chemical plating, electroplating, sputtering, ion plating, or other plating techniques or a combination thereof. The surface of the surface interface shield 40 can be metallized or plated with copper, nickel, tin, silver, another other plated metal or a combination of these plated metals.

[0067] The surface interface shield 40 provides additional shielding at the surface mating interface 14 of the connector 10. The surface interface shield 40 includes a plurality of apertures or openings, and the trailing end of the channel-shaped shield of each of the plurality of wafer assemblies 50 extends through the apertures or openings, such as Figure 4A The channel-shaped shielding member of each of the plurality of wafer assemblies 50 contacts the outer surface of the surface interface shielding member 40, and the channel-shaped shielding member in the connector 10 is electrically connected to the surface interface shielding member 40. Thus, the surface interface shielding member 40 electrically connects all the channel-shaped shielding members of the plurality of wafer assemblies 50 together at the surface docking interface 14 of the connector 10.

[0068] Figure 4B Show Figure 4A BB-labeled view of the portion of the wafer assembly 50A. As shown, the signal tail contact ends 401B, 402B of the signal conductors 401, 402 of the wafer assembly 50A extend through an opening 41 in the surface interface shield 40. Each of the signal tail contact ends of the signal conductors of the other wafer assemblies 50 in the connector 10 also extends through other openings in the surface interface shield 40. In the example shown, the signal tail contact ends 401B, 402B and the signal tail contact ends of the other signal conductors in the connector 10 are all formed in SMT J-shaped headers.

[0069] The shield tail contact end of the channel-shaped shield of each of the plurality of wafer assemblies 50 also extends through the opening in the surface interface shield 40. For example, the channel-shaped shield 101 of the wafer assembly 50A includes shield tail contact ends 101B, 101BB. The shield tail contact ends 101B, 101BB extend through the opening 41 in the surface interface shield 40. The outer surface of the channel-shaped shield 101 contacts the inner surface of the surface interface shield 40 within the opening 41 over at least a portion of the channel-shaped shield 101. Each shield tail contact end of the channel-shaped shield in the plurality of wafer assemblies 50 in the connector 10 extends through the opening in the surface interface shield 40. Additionally, the outer surfaces of other channel-shaped shields 101 in the connector 10 contact the inner surfaces of other openings passing through the surface interface shield 40. Thus, the surface interface shield 40 electrically connects all of the channel-shaped shields in the plurality of wafer assemblies 50 in the connector 10 at the surface interface 14 of the connector 10 .

[0070] The side tail contacts and the middle tail contacts of the shield cover of each of the plurality of wafer assemblies 50 in the connector 10 also extend through the opening in the surface interface shield 40. For example, the shield cover 350 of the wafer assembly 50A includes the side tail contacts 361, 362 and the middle tail contact 381 (see also Figure 3G). The side tail contacts 361, 362 and the middle tail contact 381 extend through the opening 42 in the surface interface shield 40. The outer surface of the shield cover 350 contacts the inner surface of the surface interface shield 40 within the opening 42 over at least a portion of the shield cover 350. Additionally, the outer surfaces of other shield covers in the connector 10 contact the inner surfaces of other openings through the surface interface shield 40. Thus, the surface interface shield 40 electrically connects all of the shield covers of the plurality of wafer assemblies 50 in the connector 10 at the surface interface 14 of the connector 10. The tail contacts of the shield covers of the plurality of wafer assemblies 50 help reduce crosstalk between the signal tail contact ends of the signal conductors of the plurality of wafer assemblies 50.

[0071] Figure 4C Shown in Figure 4B FIG. 1 is a view of the portion designated CC in FIG. 1. As shown, the signal tail contact terminals 401B, 402B extend through an opening 41 in the surface interface shield 40. The shield tail contact terminals 101B, 101BB also extend through the opening 41. The side tail contact portions 361, 362 and the middle tail contact portion 381 of the shield cover 350 extend through the opening 42 in the surface interface shield 40. The middle tail contact portion 381 of the shield cover 350 is located proximate to or adjacent to the signal tail contact terminals 401B, 402B. Additionally, the side tail contact portions 361, 362 of the shield cover 350 are located proximate to or adjacent to the shield tail contact terminals 101B, 101BB of the channel-shaped shield 101.

[0072] As measured from the front to the back of the connector 10, the length L of the middle tail contact portion 381 is the same as the distance measured from the front side surface of the signal tail contact terminal 402B to the back side surface of the signal tail contact terminal 401B. In other examples, the length L of the middle tail contact portion 381 can be greater than the distance between the outer side surfaces of the two signal tail contact terminals 401B, 402B, but the length L is preferably not shorter than that distance. The size of the middle tail contact portion 381 can be tailored or tuned to reduce crosstalk interference at the surface mating interface 14 of the connector 10.

[0073] As measured from left to right of the connector 10, the width W of the shield tail contact terminals 101B, 101BB is the same as the distance measured from the left side surface of the signal tail contact terminals 401B, 402B to the right side surface of the signal tail contact terminals 401B, 402B. In other examples, the width W of the shield tail contact terminals 101B, 101BB can be larger than the dimensions shown, but the width W is preferably not shorter than the dimensions shown. The dimensions of the shield tail contact terminals 101B, 101BB can be adjusted or regulated to reduce crosstalk interference at the surface docking interface 14 of the connector 10.

[0074] Figure 4D The surface interface shield 40 of the connector 10 is shown separately. In particular, Figure 4D The top side of the surface interface shield 40 is shown, and the top side and the surface interface shield 40 are FIG. 4A to FIG. 4C The side shown is opposite.

[0075] As described above, the surface interface shield 40 includes a plurality of openings extending through the surface interface shield 40. Example openings 41, 42 are each indicated at Figure 4D In the embodiment of the present invention, the surface interface shield 40 includes a row of openings for each of the plurality of wafer assemblies 50 in the connector 10 .

[0076] The terms top, bottom, side, front, back, right, and left are not intended to provide an absolute frame of reference. Rather, these terms are relative and are intended to identify certain features in relationship to one another, as the posture of the structures described herein can vary. The terms comprising, including, having, and the like are synonymous and are used in an open-ended manner and do not exclude additional elements, features, actions, operations, and the like. Furthermore, the term or is used in its inclusive sense rather than in its exclusive sense, so that when used to connect a list of elements, the term or means one, some, or all of the elements in the list.

[0077] Unless otherwise specified, combinational language, such as at least one of X, Y, and Z, or any of X, X, or Z, is generally used to identify one of them, a combination of any two, or all three (or more if a larger group is identified), such as X and only X, Y and only Y, Z and only Z, X and Y, a combination of X and Z and Y and Z, and all of X, Y, and Z. Unless otherwise specified, such combinational language is generally not intended to and does not identify or require the inclusion of at least one of X, at least one of Y, and at least one of Z. Unless otherwise defined herein, the terms about and substantially, which are associated with a particular range, percentage, or related measure of deviation, illustrate at least some manufacturing tolerances between a theoretical design and a manufactured product or component, such as the American Society of Mechanical Engineers. Y14.5 and related international standardization organizations As recognized by those skilled in the art, such manufacturing tolerances are still considered despite the absence of explicit reference to about, substantially, or related terms, or even the use of theoretical terms such as perpendicular, orthogonal, apex, colinear, coplanar, etc., for geometry.

[0078] The above-described embodiments of the present disclosure are merely examples of implementation, to provide a clear understanding of the principles of the present disclosure. Many variations and modifications may be made to the above-described embodiments without departing substantially from the concepts and principles of the present disclosure. In addition, the components and features described for one embodiment may be included in another embodiment. All of these modifications and variations will be included within the scope of the present disclosure.

Claims

1. A connector assembly, comprising: A plug docking interface; a surface docking interface; as well as A thin sheet assembly between the plug docking interface and the surface docking interface, the thin sheet assembly comprising: a thin sheet insert; a channel-shaped shield; a plurality of signal conductors extending within the channel-shaped shield; a conductive pad located above the opening edge of the channel-shaped shield; and A shielding cover is located above the conductive pad.

2. The connector assembly according to claim 1, wherein: The conductive gasket includes a conductive elastomeric gasket and provides a conductive shield over the open edge of the channel-shaped shield.

3. The connector assembly according to claim 2, wherein: The conductive gasket is located between the shielding cover and the opening edge of the channel-shaped shielding member.

4. The connector assembly according to claim 1, wherein: The sheet assembly further includes a second channel-shaped shielding member; and The conductive pad is located above the opening edge of the channel-shaped shield and above the second opening edge of the second channel-shaped shield.

5. The connector assembly according to claim 1, wherein: The channel-shaped shielding member includes a plurality of shielding tail contact ends; The shielding cover comprises a plurality of side tail contacts and a middle tail contact; The plurality of signal conductors include a plurality of signal tail contacts; and The signal tail contact ends of the plurality of signal conductors are located between the plurality of shield tail contact ends of the channel-shaped shield and adjacent to the middle tail contact portion of the shield cover at the surface docking interface.

6. The connector assembly according to claim 5, wherein: The channel-shaped shielding member further includes a shielding tongue plate; and At the surface docking interface, the signal tail contact ends of the multiple signal conductors are located between the multiple shielding tail contact ends of the channel-shaped shielding component in the front-to-back direction of the connector assembly, and between the middle tail contact portion of the shielding cover and the shielding tongue plate of the channel-shaped shielding component in the left-to-right direction of the connector assembly.

7. The connector assembly according to claim 1, further comprising: A surface interface shield is located at the surface mating interface of the connector assembly.

8. The connector assembly according to claim 7, wherein: The surface interface shield includes a plated plastic member.

9. The connector assembly according to claim 8, wherein: At the surface mating interface, the channel-shaped shield and the plurality of signal conductors extend through an opening in the surface interface shield.

10. The connector assembly according to claim 9, wherein: At the surface docking interface, the channel-shaped shield contacts an inner surface of the opening in the surface interface shield.

11. The connector assembly according to claim 10, wherein: At the surface docking interface, the shield cover extends through a second opening in the surface interface shield; and The shield cover contacts an inner surface of the second opening in the surface interface shield.

12. A sheet assembly comprising: a thin sheet insert; a channel-shaped shield; a plurality of signal conductors extending within the channel-shaped shield; a conductive pad located above the opening edge of the channel-shaped shielding member; as well as A shielding cover is located above the conductive pad.

13. The wafer assembly according to claim 12, wherein: The conductive gasket includes a conductive elastomeric gasket and provides a conductive shield over the open edge of the channel-shaped shield.

14. The wafer assembly according to claim 13, wherein: The conductive gasket is located between the shielding cover and the opening edge of the channel-shaped shielding member.

15. The wafer assembly according to claim 12, wherein: The sheet assembly further includes a second channel-shaped shielding member; and The conductive pad is located above the opening edge of the channel-shaped shield and above the second opening edge of the second channel-shaped shield.

16. The wafer assembly according to claim 12, wherein: The channel-shaped shielding member includes a plurality of shielding tail contact ends; The shielding cover comprises a plurality of side tail contacts and a middle tail contact; The plurality of signal conductors include a plurality of signal tail contacts; and The signal tail contact ends of the plurality of signal conductors are located between the plurality of shield tail contact ends of the channel-shaped shield and are adjacent to the middle tail contact portion of the shield cover.

17. The wafer assembly according to claim 16, wherein: The channel-shaped shielding member further includes a shielding tongue plate; and At the surface docking interface, the signal tail contact ends of the multiple signal conductors are located between the multiple shielding tail contact ends of the channel-shaped shielding component in the front-to-back direction of the thin-film body assembly, and are located between the middle tail contact portion of the shielding cover and the shielding tongue plate of the channel-shaped shielding component in the left-right direction of the thin-film body assembly.

18. A connector assembly comprising: A thin-sheet assembly includes: a thin sheet insert; a channel-shaped shield; a plurality of signal conductors extending within the channel-shaped shield; a conductive pad located above the opening edge of the channel-shaped shield; and a shielding cover located above the conductive pad; and A surface interface shield.

19. The connector assembly according to claim 18, wherein: The conductive gasket comprises a conductive elastomeric gasket and provides a conductive shield over the open edge of the channel-shaped shield; and The conductive gasket is located between the shielding cover and the opening edge of the channel-shaped shielding member.

20. The connector assembly of claim 18, wherein: The surface interface shield comprises a plated plastic member; The channel shield and the plurality of signal conductors extend through an opening in the surface interface shield; and The channel-shaped shield contacts an inner surface of the opening in the surface interface shield.

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