Component overturning unit and component mounting device

Abstract

A component reversing unit according to the present disclosure is a component reversing unit that reverses a component, the component reversing unit being provided with a component holding part that holds the component, a rotation mechanism that rotates the component holding part, and a control part, the component holding part having: a base member that has a receiving hole that is through so as to be able to receive the component; a first shutter member that is relatively movable with respect to the base member between a first closed position at which the housing hole is closed and a first open position at which the housing hole is open; and a second shutter member capable of moving relative to the base member between a second closed position at which the housing hole is closed by the second shutter surface and a second open position at which the housing hole is opened, the first shutter member having a first suction hole in the first shutter surface, and the second shutter member having a second suction hole in the second shutter surface. When the component holding portion is rotated by the rotation mechanism in a state in which the component is disposed in the housing hole, the control portion rotates the component in a state in which the component is adsorbed to the first adsorption hole.

Description

Technical Field

[0001] The present disclosure relates to a component reversing unit for reversing the front and back of a component and a component mounting device having the component reversing unit. Background Art

[0002] As a component reversing unit, for example, Patent Document 1 discloses a device for reversing the front and back of a micro component (workpiece) such as a semiconductor chip.

[0003] The device of Patent Document 1 has a head member having a workpiece receiving member and first and second cover members. The workpiece receiving member has a through hole for receiving a part. The first cover member is located at a position for opening and closing an opening on one side of the through hole, and the second cover member is located at a position for opening and closing an opening on the other side. The head member is turned over in a state where the through hole is closed by the first and second cover members.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent No. 4591758 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, when a component that is easily broken or damaged, such as a bare chip, is housed in a through-hole, the component moves in the through-hole during the turning operation and may collide with the wall portion in which the chip is housed, thereby causing breakage or damage.

[0009] Therefore, from the perspective of suppressing damage to components, there is still room for improvement.

[0010] The present disclosure is to solve the above-mentioned problems, and an object of the present disclosure is to provide a component reversing unit capable of suppressing damage to components.

[0011] Solutions to Solve Problems

[0012] The component turning unit involved in the present disclosure is a component turning unit for turning over a component having a first component surface and a second component surface opposite to the first component surface, wherein the component turning unit includes: a component holding portion that holds the component; a rotating mechanism that rotates the component holding portion; and a control portion, wherein the component holding portion includes: a base member that has a first main surface, a second main surface, and a receiving hole that passes from the first main surface to the second main surface and can receive the component; a first baffle member that has a first baffle surface facing the first main surface and can move relative to the base member between a first closed position in which the receiving hole is closed by the first baffle surface and a first open position in which the receiving hole is opened; and a second baffle member that has a second baffle surface facing the second main surface and can move relative to the base member between a second closed position in which the receiving hole is closed by the second baffle surface and a second open position in which the receiving hole is opened, wherein the first baffle member has a first suction hole on the first baffle surface, and when the component holding portion is rotated by the rotating mechanism in a state in which the component is arranged in the receiving hole, the control portion rotates the component in a state in which it is adsorbed to the first suction hole.

[0013] The component mounting device according to the present disclosure includes a component reversing unit and a mounting head that takes out a component from a receiving hole after a reversing operation of the component reversing unit and mounts the component on a substrate.

[0014] Effects of the Invention

[0015] According to the present disclosure, it is possible to provide a component reversing unit that can suppress damage to components. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1A It is a plan view showing a schematic structure of a component mounting device according to an embodiment of the present disclosure.

[0017] Figure 1B is a side view of the component.

[0018] Figure 2 It is a three-dimensional diagram of the component turning unit.

[0019] Figure 3 It is a three-dimensional diagram of the component turning unit.

[0020] Figure 4 It is a three-dimensional diagram of the component turning unit.

[0021] Figure 5A It is a perspective view of the component holding portion.

[0022] Figure 5B It is a perspective view of the component holding portion.

[0023] Fig. 6A This is an exploded view of a portion of the component holding section.

[0024] Figure 6B It is a partial cross-sectional view of the component holding portion.

[0025] Figure 6C It is a partial cross-sectional view of the component holding portion.

[0026] Fig.6D It is a partial cross-sectional view of the component holding portion.

[0027] Fig. 7A is a perspective view showing the air circuit of the first baffle member.

[0028] Figure 7B is a perspective view showing the air circuit of the second baffle member.

[0029] Figure 7C It is a cross-sectional view showing a component holding portion of the second air circuit.

[0030] Figure 8 This is a flowchart of the operation of the component mounting device.

[0031] Fig. 9A It is a perspective view of the component holding portion.

[0032] Fig. 9B It is a partial cross-sectional view of the component holding portion.

[0033] Fig. 10A It is a perspective view of the component holding portion.

[0034] Fig. 10B It is a partial cross-sectional view of the component holding portion.

[0035] Fig.11A It is a perspective view of the component holding portion.

[0036] Fig. 11B It is a partial cross-sectional view of the component holding portion.

[0037] Fig. 12A It is a perspective view of the component holding portion.

[0038] Fig. 12B It is a partial cross-sectional view of the component holding portion.

[0039] Fig.13A It is a perspective view of the component holding portion.

[0040] Fig. 13B It is a partial cross-sectional view of the component holding portion.

[0041] Fig.14A It is a perspective view of the component holding portion.

[0042] Fig. 14B It is a partial cross-sectional view of the component holding portion.

[0043] Fig.15A It is a perspective view of the component holding portion.

[0044] Fig. 15B It is a partial cross-sectional view of the component holding portion.

[0045] Fig.16A It is a perspective view of the component holding portion.

[0046] Fig. 16B It is a partial cross-sectional view of the component holding portion.

[0047] Fig.17A It is a perspective view of the component holding portion.

[0048] Fig. 17B It is a partial cross-sectional view of the component holding portion.

[0049] Fig.18A It is a perspective view of the component holding portion.

[0050] Fig.18B It is a partial cross-sectional view of the component holding portion. DETAILED DESCRIPTION

[0051] [Implementation Method]

[0052] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. The structures, shapes, etc. described below are examples for explanation and can be appropriately changed according to the specifications of the component mounting device 1. Figure 1A In the following description, the X-axis ( Figure 1A ), a Y axis ( Figure 1A In addition, the Z axis is shown as an axis orthogonal to the XY plane.

[0053] (Overall structure)

[0054] Reference Figure 1A The overall structure of the component mounting device 1 will be described. Figure 1A It is a top view of the component mounting device 1 according to the embodiment of the present disclosure. Figure 1B is a side view of component 3.

[0055] like Figure 1A As shown, the component mounting device 1 in the embodiment of the present disclosure includes a base 2, component supply parts 4 and 5, a wafer supply part 10, a component turning unit 6, a component mounting part 7, a pickup head 11, a mounting head 12, a component recognition camera 14, and a control part C. The component mounting device 1 is a device for mounting components 3 supplied by the component supply parts 4 and 5 on a substrate 13 arranged on the component mounting part 7.

[0056] The base 2 is a member that supports the component mounting device 1 extending along the XY plane. Two Y-axis tables 8 are arranged at both ends extending along the Y axis on the upper surface of the base 2. A plurality of beams 9A and 9B extending along the X axis are connected to the two Y-axis tables 8. The beams 9A and 9B can move in the Y direction by moving along the Y-axis tables 8.

[0057] The component supply units 4 and 5 are mechanisms for supplying components 3 of different types. The two component supply units 4 and 5 are provided on both sides of the base 2 (in the front-rear direction of the Y axis).

[0058] In the first component supply unit 4 , for example, the components 3 (bare cores) held on the wafer 15 pulled out from the wafer supply unit 10 are supplied.

[0059] like Figure 1B As shown, the component 3 supplied by the first component supply unit 4 has a first component surface R1 and a second component surface R2 opposite to the first component surface R1. The component 3 is, for example, a bare chip having a rectangular parallelepiped or a cubic shape.

[0060] On the other hand, back to Figure 1A The second component supply unit 5 is, for example, a tray feeder, a rod feeder, a tape feeder, etc. It should be noted that the second component supply unit 5 may also be a component supply device other than the above feeders.

[0061] The wafer supply unit 10 is provided adjacent to one end portion of the base 2 in the Y axis. The wafer supply unit 10 is a member that supports the wafer 15 .

[0062] The component flipping unit 6 is a device that flips the front and back of the component 3 supplied by the component supply parts 4 and 5 to change it to a specified installation posture. Here, the so-called flipping of the front and back refers to the action of the component 3 changing from the posture of the first component surface R1 facing downward to the first component surface R1 facing upward, or the action of changing from the posture of the second component surface R2 facing downward to the second component surface R2 facing upward. In the embodiment, the posture of the component 3 is changed from the posture of the first component surface R1 facing downward to the installation posture of the first component surface R1 facing upward by the flipping action. When the component 3 is installed in the installation posture, the second component surface R2 contacts and is electrically connected to the substrate 13. Therefore, the second component surface R2 can also be called the active surface of the component 3. It should be noted that when the front and back of the component 3 are not flipped by the component flipping unit 6 and the component 3 is mounted on the substrate with the active surface of the component 3 facing upward, the electrical connection between the active surface of the component 3 and the substrate is performed by wire bonding or the like.

[0063] The component mounting portion 7 is a member that supports the substrate 13. The component 3 whose posture is changed to a mounted posture by the component reversing unit 6 is mounted on the substrate 13 in the component mounting portion 7.

[0064] The pickup head 11 is a mechanism for holding the component 3 supplied from the component supply unit 4, 5 and placing it on the component reversing unit 6. The pickup head 11 is mounted on the beam 9B and is movable relative to the base 2 on the XY plane and between the component supply unit 4, 5 and the component reversing unit 6.

[0065] The pickup head 11 is provided with a suction nozzle for sucking the component 3 at its lower front end. Before the flipping operation, the first component surface R1 of the component 3 faces downward and the second component surface R2 faces upward, so the suction nozzle sucks the second component surface R2 of the component 3.

[0066] The mounting head 12 is a mechanism for holding the component 3 turned over by the component turning unit 6 and having a mounting posture and mounting it on the substrate 13 in the component mounting portion 7. The mounting head 12 is mounted on the beam 9A, can move relative to the base 2 on the XY plane, and can move between the component turning unit 6 and the component mounting portion 7.

[0067] A suction nozzle for sucking the component 3 is mounted at the front end of the lower end of the mounting head 12. After the flipping action, the first component surface R1 of the component 3 faces upward, so the suction nozzle sucks the first component surface R1 of the component 3. In the case of mounting the component 3 directly from the component supply part 4, 5 to the substrate 13, since the first component surface R1 of the component 3 in the component supply part 4, 5 is already facing upward, the suction nozzle also sucks the first component surface R1 of the component 3.

[0068] The component recognition camera 14 is adjacent to the component reversing unit 6 and is disposed between the component supply unit 4 and the component mounting unit 7. The component recognition camera 14 recognizes the posture of the component 3 after the reversing action and the relative position with respect to the mounting head 12. Specifically, when the mounting head 12 holding the component 3 passes above the component recognition camera 14, the component recognition camera 14 recognizes the component 3 from below.

[0069] The control unit C controls the operation of the component mounting device 1. The control unit C may include, for example, a memory M storing a program and a processing circuit (not shown) corresponding to a processor such as a CPU, and functions as these elements by the processor executing the program.

[0070] The control unit C obtains the recognition result of the component 3 recognized by the component recognition camera 14, and when the second component surface R2 of the component 3 is recognized, it is determined that the flipping action of the component 3 is correctly performed. In addition, the control unit C obtains the recognition result of the component 3 recognized by the component recognition camera 14, adjusts the position of the mounting head 12 relative to the substrate 13, and corrects the mounting position of the component 3.

[0071] (Structure of the component turning unit)

[0072] Next, refer to Figures 2 to 4 The structure of the component inverting unit 6 will be described in more detail. Figures 2 to 4 It is a perspective view of the component turning unit 6.

[0073] like Figure 2 As shown, the component turning unit 6 includes a support portion 20 , a component holding portion 21 , a lifting mechanism 22 , a rotating mechanism 23 , a pump connecting portion 24 , and baffle moving mechanisms 26 , 27 .

[0074] The support part 20 is a member that supports the component holding part 21, the lifting mechanism 22, the rotating mechanism 23, the pump connecting part 24, and the baffle moving mechanisms 26 and 27. The support part 20 is fixed to the component mounting device 1. Two fixed frame parts 25 are connected to the support part 20 on both sides of the component holding part 21 in the Y direction.

[0075] The component holding portion 21 has a concave groove (a housing hole 41 to be described later) for housing the component 3 , and is configured to be rotatable by a rotating mechanism 23 .

[0076] The component holding portion 21 , the rotating mechanism 23 , and the pump connecting portion 24 are configured to be able to be raised and lowered relative to the fixed frame portion 25 by the raising and lowering mechanism 22 . Figure 2 Shows the rising position, Figure 3 as well as Figure 4 Indicates the descending position. Figure 4 As shown, the component holding portion 21 is rotatable in the rotation direction R only in the lowered position.

[0077] The pump connection portion 24 is a portion that connects the internal space of the component holding portion 21 with the pump P ( Figure 1A More specifically, the pump connection portion 24 selectively connects the internal space of the component holding portion 21 to the pump P via the switching mechanisms 61 and 62 described later. The pump connection portion 24 is formed at both ends of the component holding portion 21 arranged in the X direction.

[0078] The baffle moving mechanisms 26 and 27 are components for opening the groove of the component holding portion 21 that receives the component 3. The component holding portion 21 has two upper and lower baffle members (later described baffle members 32 and 33) that cover the upper and lower openings of the groove. The baffle members are urged so as to always close the groove. Therefore, the baffle moving mechanism 26 moves the baffle member on one side to open the upper and lower openings of the groove, and the baffle moving mechanism 27 moves the baffle member on the other side to open the opposite opening of the groove. Figure 2As shown, when the component holding portion 21 is in the raised position, the baffle moving mechanism 26 engages with the upper baffle member to operate in a manner to open the groove. When the baffle moving mechanism 26 engages with the upper baffle member, the baffle moving mechanism 27 moves away from the lower baffle member. Therefore, even if the baffle moving mechanisms 26 and 27 move in conjunction, only the upper baffle member operates.

[0079] (Structure of component holding portion)

[0080] Next, refer to FIG. 5A to FIG. 7B The structure of the component holding portion 21 will be described in more detail. Figure 5A as well as Figure 5B It is a perspective view of the component holding portion 21 . Fig. 6A This is an exploded view of a part of the component holding portion 21 . FIG. 6B to FIG. 6D It is a partial cross-sectional view of the component holding portion 21 . Fig. 7A 1 is a perspective view showing the first air circuit 46 of the first baffle member 32 . Figure 7B 1 is a perspective view showing the second air circuit 47 of the second baffle member 33 .

[0081] like Figure 5A as well as Figure 5B As shown, the component holding portion 21 includes a frame portion 30, a base member 31 ( Fig. 6A ), the first baffle member 32, the second baffle member 33, the shaft 35 and the springs 36a, 36b.

[0082] The frame 30 is a member that integrally holds the base member 31, the first baffle member 32, the second baffle member 33, and the springs 36a and 36b. A shaft 35 connected to the rotating mechanism 23 extends outward from the frame 30, and the frame 30, the base member 31, the baffle members 32 and 33, and the springs 36a and 36b rotate integrally during the flipping operation. The first baffle member 32 and the second baffle member 33 are slidable relative to the frame 30, and are urged toward the closed position by the springs 36a and 36b.

[0083] like Fig. 6A As shown, the base member 31 is arranged so as to be sandwiched between the first baffle member 32 and the second baffle member 33 .

[0084] The base member 31 is a plate-shaped member that forms a plurality of receiving holes 41 for receiving the components 3. The receiving holes 41 penetrate from the first main surface R11 toward the second main surface R12 along the thickness direction (Z direction). In the embodiment, the 16 receiving holes 41 are arranged in two rows. In addition, the receiving holes 41 have rounded corners when viewed from above, which can prevent the corners of the component 3 from contacting the corners of the receiving holes 41 and causing the component 3 to be broken or damaged.

[0085] The shutter members 32 and 33 are plate-shaped members for opening and closing the accommodation hole 41. In the embodiment, the shutter members 32 and 33 are slidable in the X direction with respect to the accommodation hole 41 so as to open and close the accommodation hole 41.

[0086] The baffle members 32 and 33 are members having a common structure.

[0087] The first baffle member 32 has a first baffle surface 52 facing the first main surface R11 of the base member 31 and a through hole 42 penetrating in the thickness direction. The second baffle member 33 has a second baffle surface 53 facing the second main surface R12 of the base member 31 and a through hole 43 penetrating in the thickness direction. The through holes 42, 43 are formed in the same number and at the same pitch in a manner corresponding to the receiving hole 41.

[0088] As described above, the shutter members 32 , 33 slide along the sliding direction (X direction) between the closed position and the open position.

[0089] like Figure 6B As shown, the closed position of the baffle members 32 and 33 is a position of the baffle members 32 and 33 where the opening of the receiving hole 41 is covered by the baffle surfaces 52 and 53, respectively. In other words, in the closed position, the opening of the receiving hole 41 faces the baffle surfaces 52 and 53, and the through holes 42 and 43 and the receiving hole 41 are offset relative to each other in the X direction. The width W6 of the first baffle member 32 between adjacent through holes 42 and the width W8 of the second baffle member 33 between adjacent through holes 43 in the X direction are greater than the width W4 of the receiving hole 41. With such a structure, it is easy to fully cover the receiving hole 41 with the baffle surfaces 52 and 53.

[0090] like Figure 6C As shown, the open position of the first baffle member 32 is a position of the first baffle member 32 where the upper and lower openings of the receiving hole 41 are opened so that the receiving hole 41 is connected to the through hole 42. When the first baffle member 32 is in the open position, the second baffle member 33 is in the closed position to prevent the component 3 from falling from the component holding portion 21.

[0091] The wall portion 42 a defining the through hole 42 is inclined with respect to a perpendicular line of the first baffle surface 52 , and the through hole 42 widens in a direction away from the first main surface R11 so that the component 3 can be easily arranged in the accommodation hole 41 .

[0092] like Fig.6D As shown, the open position of the second baffle member 33 is a position of the second baffle member 33 where the upper and lower openings of the receiving hole 41 are opened and the receiving hole 41 communicates with the through hole 43 .

[0093] like Figure 5AAs shown in FIG. 1 , a claw portion 39a protruding in a direction away from the side wall is provided on the side wall of the first baffle member 32. The claw portion 39a on one side is connected to the baffle moving mechanism 26 ( Figure 2 ) engages and slides together with the baffle moving mechanism 26.

[0094] like Figure 5B As shown in FIG. 1 , a claw portion 39b is provided on the side wall of the second baffle member 33 so as to protrude in a direction away from the side wall. The claw portion 39b on one side is connected to the baffle moving mechanism 27 ( Figure 2 ) engages and slides together with the baffle moving mechanism 27.

[0095] Although the shutter members 32 and 33 have a common structure for easy manufacturing, the first shutter member 32 may have only one claw portion 39a engaged with the shutter moving mechanism 26 , and the second shutter member 33 may have only one claw portion 39b engaged with the shutter moving mechanism 27 .

[0096] like Fig. 7A As shown, the first baffle member 32 has a first air circuit 46 built in the first baffle member 32. Air flows in the first air circuit 46. By controlling the flow of air, the state of the first air circuit 46 can be switched between a vacuum state and a non-vacuum state.

[0097] The first suction holes 44 communicating with the first air circuit 46 are formed on the first baffle surface 52 between the through holes 42. When the first baffle member 32 is in the closed position, the first suction holes 44 communicate with the receiving hole 41. The first suction holes 44 suck air in the receiving hole 41 to hold the component 3 by suction, or discharge air toward the receiving hole 41 to release the holding of the component 3, depending on the state of the first air circuit 46.

[0098] The first air circuit 46 allows the first adsorption holes 44 to communicate with each other. With such a structure, air can be sucked in or discharged at the plurality of first adsorption holes 44 simultaneously through one path.

[0099] The first adsorption holes 44 are formed to correspond to the respective receiving holes 41. One or more first adsorption holes 44 may be formed to correspond to the respective receiving holes 41. In the embodiment, five first adsorption holes 44 are formed for one receiving hole 41.

[0100] The first air circuit 46 further includes an opening 46a formed in the side wall of the first baffle member 32 and an opening 46b formed in the first baffle surface 52. The opening 46a is closed. The opening 46b is connected to the first switching mechanism 61 via the pump connection portion 24. The first switching mechanism 61 has a two-stage structure, and is composed of an atmosphere connection valve V1 and a pump connection valve V2.

[0101] The atmosphere connection valve V1 switches the state of the first air circuit 46 between a state in which the first air circuit 46 is open to the atmosphere (atmosphere open state S0) and a state in which the first air circuit 46 is connected to the pump connection valve V2 through the opening 46b. The atmosphere open state S0 means a state in which the first air circuit 46 is connected to the environment surrounding the component mounting device 1, and the pressure of the environment may be atmospheric pressure or may be different from atmospheric pressure.

[0102] The pump connection valve V2 switches the state of the first air circuit 46 between the vacuum state S1, the closed circuit state S2, and the positive pressure air supply state S3 through the opening 46b and the atmosphere connection valve V1. The vacuum state S1 means a state where the first air circuit 46 is connected to the pump P and the pump P is loaded with negative pressure. The positive pressure air supply state S3 means a state where the first air circuit 46 is connected to the pump P and the pump P is loaded with positive pressure. The closed circuit state S2 means a state where the flow path extending from the pump connection valve V2 is closed, and the first air circuit 46 is isolated from the atmosphere and the pump P. In other words, the closed circuit state S2 is a state where the air supply to the first air circuit 46 through the opening 46b and the air discharge from the first air circuit 46 are suppressed.

[0103] The atmosphere open state S0, the closed circuit state S2 and the positive pressure air supply state S3 may also be collectively referred to as non-vacuum states in order to distinguish them from the vacuum state S1.

[0104] like Figure 7B As shown, since the baffle members 32 and 33 are common members, the second baffle member 33 also has the second air circuit 47 built therein. The second adsorption holes 45 communicating with the second air circuit 47 are formed on the second baffle surface 53 between the through holes 43 .

[0105] The second air circuit 47 further includes an opening 47a formed in the side wall of the second baffle member 33 and an opening 47b formed in the second baffle surface 53. The opening 47a is closed. The opening 47b is connected to the second switching mechanism 62 via the pump connection portion 24. The second switching mechanism 62 has a two-stage structure, and is composed of an atmosphere connection valve V11 and a pump connection valve V12.

[0106] The atmosphere connection valve V11 switches the state of the second air circuit 47 between a state in which the second air circuit 47 is open to the atmosphere (atmosphere open state S10 ) and a state in which the second air circuit 47 is connected to the pump connection valve V12 through the opening 47 b .

[0107] The pump connection valve V12 switches the state of the second air circuit 47 between the vacuum state S11 , the closed circuit state S12 , and the positive pressure air supply state S13 via the opening 47 b and the atmosphere connection valve V11 .

[0108] Control Unit C ( Figure 1A ) has the function of switching the first air circuit 46 between four states S0-S3 and switching the second air circuit 47 between four states S10-S13 by controlling the operation of the switching mechanisms 61 and 62.

[0109] The baffle surfaces 52 and 53 formed with the adsorption holes 44 and 45 may be subjected to surface treatment. For example, the baffle surfaces 52 and 53 may be subjected to surface treatment in a manner to improve wear resistance. With such a structure, wear of the baffle surfaces 52 and 53 can be suppressed, thereby suppressing air leakage from the worn parts.

[0110] like Fig. 6A As shown, the thicknesses T2 and T3 of the baffle members 32 and 33 are greater than the thickness T1 of the base member 31. With such a structure, the air circuits 46 and 47 for adsorption can be easily provided inside the baffle members 32 and 33.

[0111] Here, the connection between the air circuits 46 and 47 and the switching mechanisms 61 and 62 will be described. As a representative example of the air circuits 46 and 47 , the second air circuit 47 will be mainly described, but the following description is also applicable to the first air circuit 46 .

[0112] Figure 7C 4 is a cross-sectional view showing the component holding portion 21 of the second air circuit 47. Figure 7C In the figure, the first baffle member 32 is omitted. In addition, as the pump connection part 24, a pump connection part 24A on the right side of the figure and a pump connection part 24B on the left side of the figure are provided. The pump connection part 24A is connected to the first switching mechanism 61, and the pump connection part 24B is connected to the second switching mechanism 62.

[0113] like Figure 7C As shown, the second baffle member 33 is located at the lower side, that is, at the closed position. In this case, the second air circuit 47 is connected to the pump connection portion 24B through the opening 47b and the frame portion 30. On the other hand, since the opening 47a is closed, the communication between the second air circuit 47 and the pump connection portion 24A can be suppressed. When the pump P is driven, the air in the receiving hole 41 flows into the second air circuit 47 through the second adsorption hole 45, and flows into the pump connection portion 24 through the opening 47b (arrow B).

[0114] When the component holding portion 21 rotates and the second shutter member 33 is located at the open position, the second air circuit 47 is separated from the pump connecting portion 24B.

[0115] Although the first baffle member 32 is omitted, when the first baffle member 32 is in the closed position, the first air circuit 46 is opened through the opening 46b ( Fig. 7A) and communicates with the pump connection portion 24A (arrow A).

[0116] (action)

[0117] Based on the above structure, refer to Figures 8 to 16B An example of the operation of the component mounting device 1 will be described. Figure 8 This is a flowchart of the operation of the component mounting device 1 . Fig. 9A , Fig. 10A , Fig.11A , Fig. 12A , Fig.13A , Fig.14A , Fig.15A , Fig.16A , Fig.17A as well as Fig.18A It is a perspective view of the component holding portion 21 . Fig. 9B , Fig. 10B , Fig. 11B , Fig. 12B , Fig. 13B , Fig. 14B , Fig. 15B , Fig. 16B , Fig. 17B as well as Fig.18B It is a partial cross-sectional view of the component holding portion 21 .

[0118] like Figure 8 As shown, the operations of the component mounting device 1 include: holding the component 3 from the wafer 15 and storing it in the component reversing unit 6 (component storing operation), reversing the component 3 (reversing operation), and taking out the component 3 and mounting it on the substrate 13 (mounting operation).

[0119] (Parts collection action)

[0120] like Fig. 9A As shown, at the start of the operation, the component holding portion 21 is in the raised position. The raised position may also be referred to as the component storage height. In addition, the first baffle member 32 faces upward, and the second baffle member 33 faces downward. The baffle moving mechanism 26 is hooked on the claw portion 39a.

[0121] like Fig. 9B As shown, the baffle members 32 and 33 are arranged at the closed position, and the accommodation hole 41 is closed. The states of the air circuits 46 and 47 are respectively the atmosphere open states S0 and S10.

[0122] Therefore, if Fig. 10A As shown, the control unit C slides the shutter moving mechanisms 26 and 27 in directions away from each other (arrows F, G). The first shutter member 32 slides together with the shutter moving mechanism 26 (arrow F) and moves to the open position.

[0123] like Fig. 10BAs shown, the through hole 42 of the first baffle member 32 communicates with the receiving hole 41, and the receiving hole 41 is opened. The second baffle surface 53 of the second baffle member 33 is exposed through the receiving hole 41 and the through hole 42.

[0124] Next, the control unit C ( Figure 1A ) The component 3 to be mounted on the substrate 13 is determined based on the production program stored in the memory M, and the component 3 is held by the pickup head 11. The pickup head 11 holds the second component surface R2 of the component 3. The pickup head 11 moves above a receiving hole 41 in the component flip unit 6.

[0125] Next, the pickup head 11 places the component 3 in the receiving hole 41 .

[0126] like Fig. 11B As shown in FIG. 1 , the component 3 is disposed in the receiving hole 41 with the first component surface R1 facing downward. The component 3 covers the second suction hole 45 .

[0127] The pickup head 11 repeats the above operation to place the components 3 in all other receiving holes 41. On the other hand, in this operation, the components 3 may be accommodated in only a part of the 16 receiving holes 41 that are opened.

[0128] (Flip action)

[0129] Then, if Fig. 12A As shown, the control unit C slides the shutter moving mechanisms 26 and 27 in directions approaching each other (arrows H, I). The first shutter member 32 slides together with the shutter moving mechanism 26 (arrow H) and moves to the closed position.

[0130] like Fig. 12B As shown, the first baffle surface 52 closes the opening of the receiving hole 41 , and a closed space K is formed between the baffle surfaces 52 , 53 and the receiving hole 41 .

[0131] Then, if Fig. 13B As shown, the control unit C switches the atmosphere connection valve V1 to a state connected to the pump connection valve V2 in the first switching mechanism 61, and switches the pump connection valve V2 to the closed circuit state S2. The control unit C switches the atmosphere connection valve V11 to a state connected to the pump connection valve V12 in the second switching mechanism 62, and switches the pump connection valve V12 to the vacuum state S11. The first component surface R1 of the component 3 is adsorbed on the second baffle surface 53 through the second adsorption hole 45.

[0132] Since the first baffle member 32 completely covers the housing hole 41, air does not flow from the outside into the space K, thereby suppressing air leakage from the housing hole 41. Therefore, the efficiency of the pump P performing suction through the second switching mechanism 62 can be improved, and the component 3 can be stably adsorbed.

[0133] Furthermore, since the space K is closed, even if the housing hole 41 that does not house the component 3 exists due to a malfunction in operation and the second adsorption hole 45 is exposed, leakage through the exposed second adsorption hole 45 can be suppressed.

[0134] The switching of the switching mechanisms 61 , 62 may be performed before or simultaneously with the movement of the first shutter member 32 to the closed position.

[0135] Then, if Fig.14A As shown, the control unit C lowers the component holding unit 21 from the raised position to the lowered position by means of the lifting mechanism 22. The lowered position may also be referred to as the rotation height. The difference between the raised position and the lowered position may be greater than the rotation radius of the component holding unit 21. The rotation radius of the component holding unit 21 refers to the rotation radius of the frame 30 along the axis 35 ( Figure 5A ) is the distance between the end and the axis 35.

[0136] Next, the control unit C rotates the component holding unit 21 using the rotating mechanism 23, and Fig.15A As shown, the component holding portion 21 is raised from the lowered position to the raised position by the lifting mechanism 22 .

[0137] like Fig. 15B As shown, in the rotated component holding portion 21, the second baffle member 33 is located on the upper side and the first baffle member 32 is located on the lower side. In addition, when the component 3 is adsorbed on the second baffle member 33, the first component surface R1 of the component 3 faces upward and the second component surface R2 faces downward.

[0138] Then, if Fig. 16B As shown, the control unit C switches the pump connection valve V2 to the vacuum state S1 at the first switching mechanism 61. In addition, the control unit C switches the pump connection valve V12 to the positive pressure air supply state S13 at the second switching mechanism 62. The component 3 is efficiently blown off from the second baffle surface 53 toward the first baffle surface 52.

[0139] Then, if Fig. 17B As shown, the control unit C switches the atmosphere connection valve V1 to the atmosphere open state S0 at the first switching mechanism 61. Also, the control unit C switches the atmosphere connection valve V11 to the atmosphere open state S10 at the second switching mechanism 62.

[0140] Then, if Fig.18A As shown, the control unit C slides the shutter moving mechanisms 26 and 27 in directions away from each other (arrows F and G). The second shutter member 33 slides together with the shutter moving mechanism 27 (arrow G) and moves to the open position.

[0141] like Fig.18BAs shown, the through hole 43 of the second baffle member 33 communicates with the receiving hole 41, and the receiving hole 41 is opened. The first member surface R1 of the member 3 is exposed through the receiving hole 41 and the through hole 43.

[0142] (Installation Action)

[0143] The control unit C moves the mounting head 12 above the component reversing unit 6 and holds the component 3. The suction nozzle of the mounting head 12 suctions the first component surface R1 of the component 3. The mounting head 12 moves above the substrate 13 while holding the component 3, and mounts the component 3 on the substrate 13. The component 3 is mounted on the substrate 13 with the second component surface R2 facing downward.

[0144] (Summarize)

[0145] The above description is summarized and the features of the present disclosure are described.

[0146] The component reversing unit 6 according to the embodiment is a mechanism for reversing the component 3 accommodated in the accommodation hole 41. On the other hand, there is a possibility that the side surface and corner of the component 3 collide with the wall portion forming the accommodation hole 41, thereby causing damage to the component 3. In the case where the component 3 is a bare chip, the risk of damage caused by cracking and defect is significant. Therefore, a method for fixing the component 3 relative to the accommodation hole 41 is sought.

[0147] In the present disclosure, the air circuits 46 and 47 are used to adsorb the component 3 to one of the baffle surfaces 52 and 53, so that the shaking of the component 3 during the flipping action can be suppressed. Specifically, the first air circuit 46 is connected to the plurality of first adsorption holes 44 formed on the first baffle surface 52, and the component 3 is adsorbed to the first baffle surface 52 through the first adsorption holes 44. By connecting one first air circuit 46 to the plurality of first adsorption holes 44, the adsorption of the component 3 can be achieved with a simple structure compared to a structure in which a pump is connected to each first adsorption hole 44.

[0148] In addition, in order to efficiently and stably adsorb the component 3, it is sought to suppress leakage from the receiving hole 41 during adsorption. In the present disclosure, the air circuits 46 and 47 are switched between the vacuum state S1 and S11 and the non-vacuum state. As the non-vacuum state, in addition to the atmospheric open state S0 and S10, the closed circuit state S2 and S12 are also included. Therefore, even when the air circuits 46 and 47 are not in the vacuum state S1 and S11, the inflow of air into the receiving hole 41 can be suppressed.

[0149] Furthermore, the baffle members 32 and 33 cover the receiving hole 41 in their respective closed positions, so that a closed space K can be formed by the baffle members 32 and 33 and the receiving hole 41. When the component 3 is not arranged in the receiving hole 41 and the adsorption holes 44 and 45 are exposed, even if the air circuits 46 and 47 are in a vacuum state, the space K is closed, so that the inflow of air from the outside can be suppressed. Therefore, the occurrence of leakage can be suppressed, the efficiency of the pump P can be improved, and the component 3 can be stably held.

[0150] (Effect)

[0151] According to the component reversing unit 6 according to the embodiment, the following effects can be achieved.

[0152] As described above, the component reversing unit 6 of the embodiment is a component reversing unit 6 that reverses the component 3 having the first component surface R1 and the second component surface R2 opposite to the first component surface R1. The component reversing unit 6 includes a component holding portion 21 that holds the component 3, a rotating mechanism 23 that rotates the component holding portion 21, and a control portion C. The component holding portion 21 includes a base member 31, a first baffle member 32, and a second baffle member 33. The base member 31 includes a first main surface R11, a second main surface R12, and a receiving hole 41 that passes from the first main surface R11 to the second main surface R12 and can receive the component 3. The first baffle member 32 includes a first baffle surface 52 that faces the first main surface R11, and can move relative to the base member 31 between a first closed position in which the receiving hole 41 is closed by the first baffle surface 52 and a first open position in which the receiving hole 41 is opened. The second baffle member 33 has a second baffle surface 53 facing the second main surface R12, and can move relative to the base member 31 between a second closed position where the receiving hole 41 is closed by the second baffle surface 53 and a second open position where the receiving hole 41 is opened. The first baffle member 32 has a first adsorption hole 44 on the first baffle surface 52. When the component holding portion 21 is rotated by the rotating mechanism 23 in a state where the component 3 is arranged in the receiving hole 41, the control unit C rotates the component 3 in a state where it is adsorbed to the first adsorption hole 44.

[0153] With such a configuration, the movement of the component 3 during the reversing operation can be suppressed by adsorbing the component 3. Therefore, damage such as cracking and chipping of the component 3 during the reversing operation can be suppressed.

[0154] In the component reversing unit 6 of this embodiment, the second shutter member 33 has the second suction hole 45 on the second shutter surface 53. When the component holding portion 21 is rotated by the rotating mechanism 23 with the component 3 arranged in the receiving hole 41, the control unit C rotates the component 3 while being sucked to the first suction hole 44 or the second suction hole 45.

[0155] With such a configuration, when the component holding portion 21 is rotated by the rotating mechanism 23 in a state where the component 3 is arranged in the accommodation hole 41 , the component 3 can be rotated in a state where it is adsorbed to one of the adsorption holes 44 , 45 .

[0156] In the component reversing unit 6 of the present embodiment, the component holding portion 21 is rotated from the posture in which the first baffle member 32 is located at the lower side to the posture in which the first baffle member 32 is located at the upper side by the rotating mechanism 23. At this time, the control unit C rotates the component 3 in a state of being adsorbed to the first adsorption hole 44. In addition, the component holding portion 21 is rotated from the posture in which the second baffle member 33 is located at the lower side to the posture in which the second baffle member 33 is located at the upper side by the rotating mechanism 23. At this time, the control unit C rotates the component 3 in a state of being adsorbed to the second adsorption hole 45.

[0157] With such a configuration, the first member surface R1 of the component 3 adsorbed to the first baffle member 32 or the second baffle member 33 can be changed from the lower side to the upper side.

[0158] In the component reversing unit 6 of the present embodiment, the first baffle member 32 has a built-in first air circuit 46 communicating with the first adsorption hole 44. The second baffle member 33 has a built-in second air circuit 47 communicating with the second adsorption hole 45. The component reversing unit 6 has a first switching mechanism 61 and a second switching mechanism 62. The first switching mechanism 61 switches the first air circuit 46 between the vacuum state S1 and the non-vacuum state. The second switching mechanism 62 switches the second air circuit 47 between the vacuum state S11 and the non-vacuum state.

[0159] With such a structure, the vacuum state can be switched to the non-vacuum state, thereby improving the efficiency of the vacuum pump. In addition, by fixing the component 3 by adsorption and releasing the adsorption of the component 3, it is easy to take out the component 3.

[0160] In the component reversing unit 6 of this embodiment, the non-vacuum state of the first air circuit 46 includes an atmosphere open state S0 and a closed circuit state S2. The non-vacuum state of the second air circuit 47 includes an atmosphere open state S10 and a closed circuit state S12.

[0161] With such a configuration, the closed circuit states S2 and S12 that are not connected to the outside are included as non-vacuum states, thereby preventing leakage during adsorption. Therefore, the pump efficiency is improved, and the component 3 can be adsorbed more stably.

[0162] In the component reversing unit 6 of this embodiment, when the first air circuit 46 is in the vacuum state S1, the control unit C switches the second air circuit 47 to the closed circuit state S12. When the second air circuit 47 is in the vacuum state S11, the control unit C switches the first air circuit 46 to the closed circuit state S2.

[0163] With such a structure, the component 3 can be sucked through one of the air circuits 46 and 47. By switching the other air circuits 47 and 46 to the closed circuit state S12 and S2, leakage through the air circuits 46 and 47 in the vacuum state S1 and S11 can be suppressed. Therefore, the pump efficiency is improved, and the component 3 can be sucked more stably.

[0164] In the component reversing unit 6 of this embodiment, the non-vacuum state of the first air circuit 46 includes the atmospheric release state S0 and the positive pressure air supply state S3. The non-vacuum state of the second air circuit 47 includes the atmospheric release state S10 and the positive pressure air supply state S13.

[0165] With such a configuration, the non-vacuum state includes the positive-pressure air supply states S3 and S13 , and thus air can be intentionally caused to flow into the housing hole 41 .

[0166] In the component reversing unit 6 of the present embodiment, when the component holding portion 21 is rotated from the posture in which the first baffle member 32 is located at the lower side to the posture in which the first baffle member 32 is located at the upper side, the control unit C switches the first air circuit 46 from the vacuum state S1 to the positive pressure air supply state S3. When the component holding portion 21 is rotated from the posture in which the second baffle member 33 is located at the lower side to the posture in which the second baffle member 33 is located at the upper side, the control unit C switches the second air circuit 47 from the vacuum state S11 to the positive pressure air supply state S13.

[0167] With such a structure, when the inversion is completed, the component 3 can be efficiently dropped from the surface of the upper baffle member 32, 33 adsorbed to the lower baffle member 33, 32 by the positive pressure air supply state S3, S13.

[0168] In the component reversing unit 6 of this embodiment, when the first air circuit 46 is switched to the positive pressure air supply state S3, the control unit C switches the second air circuit 47 to the vacuum state S11. When the second air circuit 47 is switched to the positive pressure air supply state S13, the control unit C switches the first air circuit 46 to the vacuum state S1.

[0169] With such a structure, the component 3 can be more reliably dropped from the sucked upper baffle members 32, 33 to the lower baffle members 33, 32. In addition, positional deviation and shaking of the dropped component 3 with respect to the lower baffle members 33, 32 can be suppressed.

[0170] In the component reversing unit 6 of the present embodiment, the thickness T2 of the first baffle member 32 is greater than the thickness T1 of the base member 31 , and the thickness T3 of the second baffle member 33 is greater than the thickness T1 of the base member 31 .

[0171] With such a structure, the air circuits 46 and 47 can be easily formed inside the baffle members 32 and 33, respectively.

[0172] In the component reversing unit 6 of the present embodiment, the first shutter surface 52 covers the accommodation hole 41 at the first closing position, and the second shutter surface 53 covers the accommodation hole 41 at the second closing position.

[0173] With such a structure, the space K closed by covering the housing hole 41 with the baffle members 32 and 33 can be formed. Therefore, even when the housing hole 41 does not house the component 3 and the adsorption holes 44 and 45 are not covered, leakage through the adsorption holes 44 and 45 can be suppressed.

[0174] The component mounting device 1 of the present embodiment includes the component reversing unit 6 and the mounting head 12 that takes out the component 3 from the receiving hole 41 after the reversing operation of the component reversing unit 6 and mounts the component 3 on the substrate 13 .

[0175] With such a structure, the component 3 can be turned over and mounted on the substrate 13 in a correct front and back posture.

[0176] It should be noted that, in the embodiment, the example in which the component mounting device 1 performs the flipping operation is described, but this is not limited to the case where the flipping operation is performed on all components 3. When the component 3 already has the mounting posture, the component 3 may be directly mounted on the substrate 13 from the component supplying parts 4 and 5.

[0177] It should be noted that, in the embodiment, the baffle members 32 and 33 have the through holes 42 and 43, but the present invention is not limited thereto. For example, the baffle surfaces 52 and 53 form a continuous plane. In this case, the baffle members 32 and 33 are slid until the receiving hole 41 is exposed.

[0178] It should be noted that, in the embodiment, an example is described in which the first baffle member 32 has the first adsorption hole 44 and the second baffle member 33 has the second adsorption hole 45, but it is not limited to this. It is also possible to form an adsorption hole only on one side of the baffle members 32 and 33. For example, only the first baffle surface 52 has the first adsorption hole 44. In this case, the flipping action can also be started from the state where the first baffle member 32 is arranged on the lower side. In addition, it is also possible to start the flipping action in the state where the first baffle member 32 is arranged on the upper side, and the first adsorption hole 44 adsorbs the component 3 arranged on the second baffle surface 53 in a lifted manner. It is also possible to return to the state where the first baffle member 32 is arranged on the lower side or the upper side after performing a certain flipping action, and then perform the next flipping action.

[0179] In addition, instead of having the adsorption holes 44 and 45, at least one of the first baffle surface 52 and the second baffle surface 53 may be formed of a porous material. With such a structure, leakage can be further suppressed.

[0180] It should be noted that, in the embodiment, an example is described in which the sliding direction of the baffle members 32 and 33 is along the X direction, but the present invention is not limited thereto. For example, the sliding direction of the baffle members 32 and 33 may be along the Y direction. On the other hand, in the structure of the embodiment, since the sliding direction is the X direction, the space of the component reversing unit 6 can be saved.

[0181] It should be noted that, in the embodiment, the control unit C determines whether the component 3 needs to be turned over based on the production program, but the present invention is not limited thereto. For example, the control unit C may determine whether the component 3 needs to be turned over by identifying the component 3 using a camera or the like.

[0182] The component turning unit of the first scheme is a component turning unit for turning over a component having a first component surface and a second component surface opposite to the first component surface, wherein the component turning unit comprises: a component holding portion for holding the component; a rotating mechanism for rotating the component holding portion; and a control portion, wherein the component holding portion comprises: a base member having a first main surface, a second main surface, and a receiving hole penetrating from the first main surface to the second main surface so as to receive the component; a first baffle member having a first baffle surface facing the first main surface and being movable relative to the base member between a first closed position in which the receiving hole is closed by the first baffle surface and a first open position in which the receiving hole is opened; and a second baffle member having a second baffle surface facing the second main surface and being movable relative to the base member between a second closed position in which the receiving hole is closed by the second baffle surface and a second open position in which the receiving hole is opened, wherein the first baffle member has a first adsorption hole on the first baffle surface, and when the component holding portion is rotated by the rotating mechanism in a state in which the component is arranged in the receiving hole, the control portion rotates the component in a state in which the component is adsorbed to the first adsorption hole.

[0183] As a component flipping unit of the second scheme, based on the component flipping unit of the first scheme, the second baffle member has a second adsorption hole on the second baffle surface. When the component holding part is rotated by using the rotating mechanism when the component is configured in the receiving hole, the control part rotates the component in a state of being adsorbed on the first adsorption hole or the second adsorption hole.

[0184] As a component flipping unit of the third scheme, based on the component flipping unit of the second scheme, when the component holding part is rotated from a posture where the first baffle member is located on the lower side to a posture where the first baffle member is located on the upper side by using the rotating mechanism, the control unit rotates the component in a state of being adsorbed to the first adsorption hole, and when the component holding part is rotated from a posture where the second baffle member is located on the lower side to a posture where the second baffle member is located on the upper side by using the rotating mechanism, the control unit rotates the component in a state of being adsorbed to the second adsorption hole.

[0185] As a component flipping unit of the fourth scheme, on the basis of the component flipping unit of the second or third scheme, the first baffle member has a built-in first air circuit connected to the first adsorption hole, and the second baffle member has a built-in second air circuit connected to the second adsorption hole, and the component flipping unit has: a first switching mechanism, which switches the first air circuit between a vacuum state and a non-vacuum state; and a second switching mechanism, which switches the second air circuit between a vacuum state and a non-vacuum state.

[0186] As a component reversing unit of the fifth scheme, based on the component reversing unit of the fourth scheme, the non-vacuum state of the first air circuit includes an atmospheric open state and a closed circuit state, and the non-vacuum state of the second air circuit includes an atmospheric open state and a closed circuit state.

[0187] As the component reversal unit of the sixth scheme, based on the component reversal unit of the fifth scheme, when the first air circuit is in a vacuum state, the control unit switches the second air circuit to a closed circuit state, and when the second air circuit is in a vacuum state, the control unit switches the first air circuit to a closed circuit state.

[0188] As the component flipping unit of the seventh scheme, based on the component flipping unit in any one of the fourth to sixth schemes, the non-vacuum state of the first air circuit includes an atmospheric open state and a positive pressure air supply state, and the non-vacuum state of the second air circuit includes an atmospheric open state and a positive pressure air supply state.

[0189] As the component flipping unit of the eighth scheme, on the basis of the component flipping unit of the seventh scheme, when the component holding part is rotated from the posture where the first baffle member is located on the lower side to the posture where the first baffle member is located on the upper side, the control unit switches the first air circuit from the vacuum state to the positive pressure air supply state, and when the component holding part is rotated from the posture where the second baffle member is located on the lower side to the posture where the second baffle member is located on the upper side, the control unit switches the second air circuit from the vacuum state to the positive pressure air supply state.

[0190] As the component flipping unit of the ninth scheme, based on the component flipping unit of the eighth scheme, when the first air circuit is switched to the positive pressure air supply state, the control unit switches the second air circuit to the vacuum state, and when the second air circuit is switched to the positive pressure air supply state, the control unit switches the first air circuit to the vacuum state.

[0191] As a tenth aspect, in addition to the component turning unit in any one of the first to ninth aspects, the first baffle member is thicker than the base member, and the second baffle member is thicker than the base member.

[0192] As a component reversing unit of the eleventh aspect, in addition to the component reversing unit in any one of the first to tenth aspects, the first shutter surface covers the receiving hole in the first closing position, and the second shutter surface covers the receiving hole in the second closing position.

[0193] The component reversing unit according to a twelfth aspect is the component reversing unit according to any one of the first to eleventh aspects, wherein at least one of the first baffle surface and the second baffle surface is formed of a porous material.

[0194] A component mounting device according to a thirteenth aspect comprises the component reversing unit according to any one of the first to twelfth aspects, and a mounting head that takes out the component from the receiving hole after the reversing operation of the component reversing unit and mounts the component on the substrate.

[0195] The present disclosure has been fully described with reference to the accompanying drawings and in conjunction with the preferred embodiments, but various modifications and variations will be apparent to those skilled in the art. Such modifications and variations should be understood to be included within the scope of the present invention as long as they do not depart from the scope of the present invention based on the attached technical solutions.

[0196] Industrial Applicability

[0197] The component reversing unit disclosed in the present invention has an effect of mounting a component in a predetermined arbitrary posture with respect to a substrate, and is particularly useful in a component mounting device used when mounting components such as bare chips.

[0198] Description of Reference Numerals

[0199] 1: component mounting device, 3: component, 4: component supply part, 5: component supply part, 6: component turning unit, 7: component mounting part, 11: pickup head, 12: mounting head, 13: substrate, 20: support part, 21: component holding part, 22: lifting mechanism, 23: rotation mechanism, 24: pump connection part, 25: fixed frame part, 26: baffle moving mechanism, 27: baffle moving mechanism, 30: frame part, 31: base member, 32: first baffle member, 33: second baffle member, 35: shaft, 41: receiving hole, 42: through hole, 43: through hole, 44: adsorption hole, 45: adsorption hole 46: first air circuit, 47: second air circuit.

Claims

1. A component turning unit, which turns over a component having a first component surface and a second component surface opposite to the first component surface, wherein: The component turning unit comprises: A component holding portion that holds the component; a rotating mechanism that rotates the component holding portion; and Control Department, The component holding portion has: A base member having a first main surface, a second main surface, and a receiving hole penetrating from the first main surface to the second main surface so as to receive a component; a first baffle member having a first baffle surface facing the first main surface and capable of moving relative to the base member between a first closed position in which the receiving hole is closed by the first baffle surface and a first open position in which the receiving hole is opened; as well as a second baffle member having a second baffle surface facing the second main surface and capable of moving relative to the base member between a second closed position where the receiving hole is closed by the second baffle surface and a second open position where the receiving hole is opened, The first baffle member has a first adsorption hole on the first baffle surface. When the component holding portion is rotated by the rotating mechanism in a state where the component is arranged in the housing hole, the control portion rotates the component in a state where the component is adsorbed to the first adsorption hole.

2. The component turning unit according to claim 1, wherein: The second baffle member has a second adsorption hole on the second baffle surface. When the component holding portion is rotated by the rotating mechanism in a state where the component is arranged in the housing hole, the control portion rotates the component in a state where the component is adsorbed to the first adsorption hole or the second adsorption hole.

3. The component turning unit according to claim 2, wherein: When the component holding portion is rotated by the rotating mechanism from a posture in which the first shutter member is located at a lower side to a posture in which the first shutter member is located at an upper side, the control portion rotates the component in a state in which the component is adsorbed to the first adsorption hole. When the component holding portion is rotated by the rotating mechanism from a posture in which the second shutter member is located at a lower side to a posture in which the second shutter member is located at an upper side, the control portion rotates the component in a state in which the component is adsorbed to the second adsorption hole.

4. The component turning unit according to claim 2, wherein: The first baffle member has a first air circuit connected to the first adsorption hole built therein. The second baffle member has a second air circuit connected to the second adsorption hole. The component turning unit has: a first switching mechanism that switches the first air circuit between a vacuum state and a non-vacuum state; and A second switching mechanism switches the second air circuit between a vacuum state and a non-vacuum state.

5. The component turning unit according to claim 4, wherein: The non-vacuum state of the first air circuit includes an atmospheric open state and a closed circuit state. The non-vacuum state of the second air circuit includes an atmosphere open state and a closed circuit state.

6. The component turning unit according to claim 5, wherein: When the first air circuit is in a vacuum state, the control unit switches the second air circuit to a closed circuit state. When the second air circuit is in a vacuum state, the control unit switches the first air circuit to a closed circuit state.

7. The component turning unit according to claim 4, wherein: The non-vacuum state of the first air circuit includes an atmospheric open state and a positive pressure air supply state. The non-vacuum state of the second air circuit includes an atmosphere open state and a positive pressure air supply state.

8. The component turning unit according to claim 7, wherein: When the component holding portion is rotated from the posture in which the first baffle member is located at the lower side to the posture in which the first baffle member is located at the upper side, the control unit switches the first air circuit from the vacuum state to the positive pressure air supply state. When the component holding portion is rotated from the posture in which the second shutter member is located at a lower side to the posture in which the second shutter member is located at an upper side, the control portion switches the second air circuit from a vacuum state to a positive pressure air supply state.

9. The component turning unit according to claim 8, wherein: When the first air circuit is switched to the positive pressure air supply state, the control unit switches the second air circuit to the vacuum state. When the second air circuit is switched to the positive pressure air supply state, the control unit switches the first air circuit to the vacuum state.

10. The component turning unit according to claim 1, wherein: The thickness of the first baffle member is greater than the thickness of the base member, The second baffle member has a thickness greater than a thickness of the base member.

11. The component turning unit according to claim 1, wherein: The first baffle surface covers the receiving hole in the first closed position, The second baffle surface covers the receiving hole at the second closed position.

12. The component turning unit according to claim 1, wherein: At least one of the first baffle surface and the second baffle surface is formed of a porous material.

13. A component mounting device, comprising: The component turning unit according to any one of claims 1 to 12; and The mounting head takes out the component from the receiving hole after the turning action of the component turning unit and mounts the component on the substrate.

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