Manufacturing method of heat dissipation device suitable for high-power electronic components and electronic equipment

Abstract

The application discloses a manufacturing method of a heat dissipation device suitable for high-power electronic components and an electronic device. The manufacturing method comprises the following steps: step 1, preparing an upper cover plate, a bottom cavity, a heat dissipation A single piece and a heat dissipation B single piece; the upper cover plate is provided with a first solder layer on a top surface, and the upper cover plate is provided with a mounting through slot, and a top end peripheral edge of the mounting through slot is chamfered to form an annular flow guide surface; the heat dissipation A single piece and / or the heat dissipation B single piece are provided with a second solder layer, and the heat dissipation A single piece and the heat dissipation B single piece are downwardly extended at end portions of corresponding flow channel wall surfaces to form connecting portions; step 2, the heat dissipation A single piece and the heat dissipation B single piece are inserted into the mounting through slot in a mutual stacking mode, the connecting portions are stacked to form flow channel interface portions, and an annular gap is formed between an outer peripheral surface of the flow channel interface portions and the annular flow guide surface; and step 3, vacuum welding is performed, the first solder layer is melted and then flows into the annular gap along the annular flow guide surface, and then the outer peripheral surface of the flow channel interface portions and the annular flow guide surface are sealed and welded, so that the leakage prevention effect is good.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation devices, in particular to a manufacturing method of a heat dissipation device suitable for high-power electronic components and an electronic device. BACKGROUND

[0002] Heat dissipation devices are widely used in electronic devices, for example, in communication devices, heat dissipation devices are often used to dissipate heat from chips, power supplies, etc. A heat dissipation device generally includes a heat dissipation substrate and a plurality of heat dissipation fins arranged on the heat dissipation substrate. The heat generating components are generally attached to the heat dissipation substrate, and the heat generating components and the heat dissipation fins are distributed on both sides of the heat dissipation substrate. A cavity and a flow channel are pre-set in the heat dissipation substrate and the heat dissipation fins, and a working fluid medium (also referred to as refrigerant) flows inside. Since the heat dissipation fins are welded to the heat dissipation substrate, the welding seam is prone to leakage of the working fluid medium. Therefore, the technical personnel in the industry are committed to improving the problem of leakage of the working fluid medium.

[0003] For example: CN 117222184 A discloses a phase change heat dissipation device and a communication device, comprising: a substrate having a first hollow cavity; a plurality of tooth arrays, each tooth having a second hollow cavity, the second hollow cavities of the teeth are communicated through the connecting parts located outside the teeth; the teeth include first and second teeth located at both ends of the tooth array in the first extension direction, the bottom of the first tooth has a first inlet communicating with the second hollow cavity thereof, and the bottom of the second tooth has a first outlet communicating with the second hollow cavity thereof, each tooth array is fixedly connected to the substrate through the first inlet and the first outlet, the substrate absorbs heat from the heat generating components, so that the working medium undergoes phase change cycle in the first and second hollow cavities, and the heat is dissipated through the teeth. Each group of tooth array flow channel and the cavity of the substrate only has two interfaces to reduce the number of welding points, reduce leakage, and thus improve the use reliability of the heat dissipation device. However, the interface needs to be connected to a connecting pipe, and the connecting pipe is welded to the substrate, which is troublesome to operate, especially the step of adding the connecting pipe, which is prone to false welding and still has the risk of leakage of the working fluid medium.

[0004] For example, CN 117222183 A discloses a phase change heat sink and a communication device, the phase change heat sink includes a substrate unit and a fin unit, the substrate unit includes a first surface and a second surface, the first surface is used to face a heat generating element, and the second surface is used to mount the fin unit; the fin unit includes a mounting portion abutting the second surface and a heat dissipation portion extending from the mounting portion, the mounting portion is provided with a second opening communicating with a refrigerant channel of the heat dissipation portion, and the second surface is provided with a first opening communicating with a hollow inner cavity inside the substrate unit; when the mounting portion abuts the second surface, the first opening and the second opening are fixed by welding. By welding the two openings of the mounting portion and the substrate unit, the welding area is small, the welding seam is short, the welding difficulty is reduced, and the process yield is improved, so that refrigerant leakage is not easy to occur. In actual welding, the two openings are respectively fixed by surface welding. Limited by the flatness of the surface, the two surfaces are difficult to achieve ideal fit, resulting in the risk of working fluid medium leakage at the welded part.

[0005] Therefore, there is a need to study a new technical solution to solve the above problems. SUMMARY

[0006] Therefore, the present application aims to solve the problems in the prior art, and the main purpose is to provide a manufacturing method of a heat dissipation device suitable for high-power electronic components and electronic equipment. The upper cover plate, bottom cavity, heat dissipation A single piece, and heat dissipation B single piece are assembled and then welded once, which has good welding effect and effectively solves the problem of working fluid medium leakage at the welded part in traditional technology.

[0007] To achieve the above purpose, the present application adopts the following technical solutions:

[0008] A manufacturing method of a heat dissipation device suitable for high-power electronic components, comprising:

[0009] Step 1, prepare the upper cover plate, bottom cavity, heat dissipation A single piece, and heat dissipation B single piece; wherein the top surface of the upper cover plate is covered with a first solder layer, the top surface of the upper cover plate is provided with a mounting through slot, the top end of the mounting through slot is chamfered to form an annular flow surface around the mounting through slot; the superimposed side surface of the heat dissipation A single piece and / or the heat dissipation B single piece is covered with a second solder layer, the superimposed side surface of the heat dissipation A single piece and the heat dissipation B single piece is provided with a matching corresponding flow channel wall surface, and the heat dissipation A single piece and the heat dissipation B single piece extend downward at the end of the corresponding flow channel wall surface to form a connecting portion;

[0010] Step 2, the heat dissipation A monolithic and the heat dissipation B monolithic are inserted into the installation through slot by mutual superposition, wherein the connecting part superposition forms a flow channel interface part, an annular gap is formed between the outer peripheral surface of the flow channel interface part and the annular flow guide surface, and the bottom cavity is superposed on the bottom of the upper cover plate;

[0011] Step 3, vacuum welding is performed, the first solder layer on the top surface of the upper cover melts and flows into the annular gap along the annular flow guide surface, and then forms a sealed welding between the outer peripheral surface of the flow channel interface part and the annular flow guide surface.

[0012] As a preferred solution, the solder layer is a brazing filler metal layer, and in step 3, brazing is performed.

[0013] As a preferred solution, in step 1, a first capillary filler is also prepared; the first capillary filler is arranged corresponding to the flow channel wall surface;

[0014] And / or:

[0015] In step 1, a second capillary filler is also prepared; the second capillary filler is arranged corresponding to the bottom cavity.

[0016] As a preferred solution, in step 2, after the heat dissipation A monolithic and the heat dissipation B monolithic are inserted into the installation through slot by mutual superposition, the flow channel interface part protrudes from the bottom of the upper cover plate, and a pressing and fixing operation is performed on the protruding part of the flow channel interface part to fix the heat dissipation A monolithic and the heat dissipation B monolithic on the upper cover plate.

[0017] As a preferred solution, the connecting part includes a flow channel enclosing wall and widened abutting walls connected to both ends of the flow channel enclosing wall, respectively, the widened abutting wall includes a first wall body part close to the flow channel enclosing wall and a second wall body part away from the flow channel enclosing wall, the lower end surface of the second wall body part is higher than the lower end surface of the first wall body part, so that the lower end surface of the second wall body part serves as an abutting surface, and after the heat dissipation A monolithic and the heat dissipation B monolithic are inserted into the installation through slot by mutual superposition, the abutting surface abuts against the top surface of the upper cover plate.

[0018] As a preferred solution, the bottom of the upper cover plate is provided with two groups of riveting protrusions corresponding to the positions of the two ends of the installation through slot, respectively, each group of riveting protrusions includes two riveting protrusions arranged at a left-right interval, the first wall body part extends downward into the space between the two riveting protrusions, and the two first wall body parts of the heat dissipation A monolithic and the heat dissipation B monolithic are pressed and fixed by pressing the riveting protrusions.

[0019] As a preferred solution, the heat dissipation A single piece and the heat dissipation B single piece are fixed to the upper cover plate, and then the bottom cavity is stacked at the bottom of the upper cover plate, and the third solder layer is arranged on the stacked side of the bottom cavity and the upper cover plate, and in step 3, the bottom cavity and the upper cover plate are welded and fixed.

[0020] As a preferred solution, in step 1, a connecting plate is also prepared, the connecting plate is provided with a plurality of positioning grooves, and the top end of the heat dissipation A single piece and / or the heat dissipation B single piece has an upward extending positioning part which extends into the positioning groove.

[0021] As a preferred solution, the heat dissipation A single piece is provided with a flange extending towards the heat dissipation B single piece, and after the heat dissipation A single piece and the heat dissipation B single piece are stacked, the flange extends out of the side of the heat dissipation B single piece away from the heat dissipation A single piece, and the extending end of the flange is in contact with the adjacent heat dissipation A single piece.

[0022] An electronic device comprises:

[0023] A heat generating element and a heat dissipation device;

[0024] The heat dissipation device is made by the method for manufacturing a heat dissipation device suitable for high-power electronic components according to any one of the preceding solutions.

[0025] Compared with the prior art, the present application has obvious advantages and beneficial effects. Specifically, according to the above technical solution, after the upper cover plate, the bottom cavity, the heat dissipation A single piece and the heat dissipation B single piece are assembled and welded and fixed at one time, the first solder layer on the top surface of the upper cover plate melts and flows into the annular gap along the annular flow surface, thereby forming a sealed weld between the outer circumferential surface of the flow passage interface part and the annular flow surface, the welding effect is good, effectively solving the problem of leakage of working fluid medium at the welding position in the traditional technology, and the manufacturing process is simple and the manufacturing yield is good.

[0026] To make the structure characteristics and effects of the present application clearer, the present application will be described in detail below in combination with the drawings and specific examples. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is a step diagram of the method for manufacturing a heat dissipation device suitable for high-power electronic components of an embodiment of the present application;

[0028] Figure 2 is an exploded view of a heat dissipation A single piece and a heat dissipation B single piece of an embodiment of the present application;

[0029] Figure 3 is an assembly view of a heat dissipation A single piece and a heat dissipation B single piece after stacking of an embodiment of the present application;

[0030] Figure 4 This is a partial structural diagram of a set of heat sinks disposed on a heat sink base according to an embodiment of the present invention;

[0031] Figure 5A This is a partial structural diagram of the flow channel interface and the upper cover plate after assembly (before welding) according to an embodiment of the present invention.

[0032] Figure 5B This is a partial structural diagram of the flow channel interface and the upper cover plate after assembly (after welding) according to an embodiment of the present invention.

[0033] Figure 6 This is a partial perspective view of heat dissipation unit A and heat dissipation unit B disposed behind the upper cover plate according to an embodiment of the present invention (showing the bottom structure of the upper cover plate).

[0034] Figure 7 An exploded view of another embodiment of the present invention, showing that a first capillary filler is disposed between heat dissipation sheet A and heat dissipation sheet B.

[0035] Figure 8 yes Figure 7 A cross-sectional view of the heat sink in the illustrated embodiment;

[0036] Figure 9 This is an exploded view of a second capillary filler disposed in the bottom cavity of another embodiment of the present invention;

[0037] Figure 10 This is an assembly diagram showing a second capillary filler disposed within the bottom cavity of another embodiment of the present invention;

[0038] Figure 11 A perspective view of a heat dissipation device with a connecting plate on top of the heat sink is shown.

[0039] Figure 12 yes Figure 11 An exploded view of the heat dissipation device shown.

[0040] Figure 13 An exploded view of another heat dissipation device with fins integrated into the heat sink is shown. Detailed Implementation

[0041] Please refer to Figures 1 to 13 As shown, it illustrates the specific structure of various embodiments of the present invention.

[0042] In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0043] A manufacturing method of a heat dissipation device suitable for high-power electronic components, comprising:

[0044] Step 1, prepare the upper cover plate 1, the bottom cavity 2, a plurality of heat dissipation A single piece 3, a plurality of heat dissipation B single piece 4;

[0045] Among them, the upper cover plate 1 is a composite layer material with a solder layer, such as aluminum-based brazing composite layer material, so that a first solder layer C1 is provided on the top surface of the upper cover plate 1, and a plurality of left and right spaced mounting through slots 101 are arranged on the top surface of the upper cover plate 1, wherein the mounting through slots 101 penetrate the top surface and the bottom surface of the upper cover plate 1, and the top end of the mounting through slots 101 is chamfered to form an annular flow surface 102 around the mounting through slots 101.

[0046] The bottom cavity 2 is provided with a cavity 201, and a plurality of protruding columns 202 are arranged in the cavity 201 to divide the cavity 201 into a plurality of tortuous flow channels, and the top end of the bottom cavity 2 is provided with a mounting column 203, and the upper cover plate 1 is provided with a mounting hole 103 corresponding to the mounting column 203, and the mounting column 203 is inserted into the corresponding mounting hole 103 to form the mutual assembly and positioning of the upper cover plate 1 and the bottom cavity 2. Further, the mounting column 203 can also be provided in the cavity 201, and the mounting hole 103 is correspondingly provided in the upper cover plate 1 to improve the assembly stability of the upper cover plate 1 and the bottom cavity 2. In the subsequent welding process, the mounting column 203 and the mounting hole 103 are welded and fixed, and specifically, the outer circumferential surface of the mounting column 203 and the inner circumferential surface of the mounting hole 103, as well as the top surface of the upper cover plate 1, and even the top end of the bottom cavity 2 and the bottom surface of the upper cover plate 1, the outer circumferential surface of the mounting column 203, and the inner circumferential surface of the mounting hole 103 are integrally welded and sealed.

[0047] The heat dissipation unit A 3 and / or the heat dissipation unit B 4 are also composite layer materials with solder layers, such as aluminum-based brazing composite materials. Therefore, a second solder layer is provided on their overlapping side. Preferably, the second solder layer is provided on the overlapping side of both the heat dissipation unit A 3 and the heat dissipation unit B 4. Compared with the case where only the overlapping side of the heat dissipation unit A 3 or the heat dissipation unit B 4 is provided with a second solder layer, it is easier to weld and the welding effect is better. Moreover, the heat dissipation unit A 3 and the heat dissipation unit B 4 can adopt the same structure (e.g., symmetrical structure) design, which can unify the design and production of heat dissipation units, which is conducive to mass production, better control of production quality and reduction of production costs. The overlapping sides of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are provided with (e.g., recessed) matching flow channel wall surfaces 341. In this embodiment, the overlapping sides of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are both recessed with flow channel wall surfaces 341. Alternatively, only one overlapping side may be recessed with flow channel wall surfaces 341, while the other overlapping side is a flat surface. This is equivalent to the flow channel wall surfaces 341 on the other overlapping side being flat. Furthermore, the heat dissipation A single piece 3 and the heat dissipation B single piece 4 extend downward at the ends of the corresponding flow channel wall surfaces 341 to form connecting portions 342. The second solder layer may be on the entire overlapping side, or it may cover the area on the overlapping side except for the flow channel wall surfaces 341. Alternatively, it may at least satisfy the requirement that the heat dissipation A single piece 3 and the heat dissipation B single piece 4 can form a closed flow channel 348 after being stacked and welded.

[0048] Step 2: The heat dissipation unit A 3 and the heat dissipation unit B 4 are stacked and inserted into the mounting slot 101. The connecting portions 342 of the heat dissipation unit A 3 and the heat dissipation unit B 4 are stacked to form a flow channel interface 347. The flow channel interface 347 forms a closed ring, and an annular gap is formed between the outer peripheral surface of the flow channel interface 347 and the annular guide surface 102. Figure 5A As shown, the annular gap surrounds the outer periphery of the flow channel interface 347. The overlapping sides of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are in contact. One heat dissipation A single piece 3 and one heat dissipation B single piece 4 are stacked to form a set of heat dissipation fins 200. Their flow channel walls 341 are matched to form a flow channel, and their connecting parts 342 are also matched accordingly. Two sets of connecting parts 342 are formed at the lower end of the set of heat dissipation fins 200, corresponding to the fluid inlet and fluid outlet of the set of heat dissipation fins 200. Furthermore, the bottom cavity 2 is stacked on the bottom of the upper cover plate 1. The upper cover plate 1 and the bottom cavity 2 constitute a heat dissipation base 100.

[0049] Step 3, the assembly is put into a vacuum welding furnace for welding operation, usually a vacuum welding is performed, the first solder layer C1 on the top surface of the upper cover plate 1 melts and flows into the annular gap along the annular flow guide surface 102, forming a whole circle of solder D in the annular gap, and further forming a sealing weld between the outer circumferential surface of the flow channel interface part 347 and the annular flow guide surface 102, solving the problem of leakage of working fluid medium, such as Figure 5B

[0050] Further, the solder layer is a brazing filler metal layer, and in step 3, brazing operation is performed, and the assembly is put into a vacuum brazing furnace for brazing operation, and the finished product is brazed in one time.

[0051] As shown in Figure 7 and Figure 8 , in step 1, a first capillary filler 6 is also prepared; the first capillary filler 6 is filled and arranged corresponding to the flow channel wall surface 341, so that the flow channel is filled with the first capillary filler 6.

[0052] As shown in Figure 9 and Figure 10 , in step 1, a second capillary filler 7, such as a capillary mesh, is also prepared; the second capillary filler 7 is filled and arranged corresponding to the bottom cavity 2, so that the capillary mesh is filled in the cavity formed by the stacking of the upper cover plate 1 and the bottom cavity 2.

[0053] As shown in Figure 1 , Figure 2 , Figure 4 and Figure 6 ​As shown, in step 2, after the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are inserted into the mounting through slot 101, the flow channel interface part 347 extends downward from the bottom of the upper cover plate 1, and the extending part of the flow channel interface part 347 is pressed and fixed to fix the heat dissipation A single piece 3 and the heat dissipation B single piece 4 on the upper cover plate 1. The connecting part 342 includes a flow channel enclosing wall 343 and a widened abutting wall 344 connected to the front and rear ends of the flow channel enclosing wall 343, respectively. The widened abutting wall 344 includes a first wall body part 345 close to the flow channel enclosing wall 343 and a second wall body part 346 away from the flow channel enclosing wall 343. The lower end surface of the second wall body part 346 is higher than the lower end surface of the first wall body part 345, so that the lower end surface of the second wall body part 346 serves as an abutting surface. After the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are inserted into the mounting through slot 101, the abutting surface abuts against the top surface of the upper cover plate 1. On the one hand, it plays a role of assembly positioning and limits the insertion depth. On the other hand, in the subsequent welding process, the first solder layer C1 on the top surface of the upper cover plate 1 is welded and fixed with the abutting surface, thereby strengthening the combination stability of the entire heat dissipation fin 200 and the upper cover plate 1. The bottom of the upper cover plate 1 is provided with two groups of riveting protrusions corresponding to the front and rear ends of the mounting through slot 101. Each group of riveting protrusions includes two riveting protrusions 104 arranged at a left-right interval. The first wall body part 345 extends downward between the two riveting protrusions 104, and the two first wall body parts 345 of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are pressed and fixed by pressing the two riveting protrusions 104. In actual operation, the two riveting protrusions 104 can be pressed in both directions, or one riveting protrusion 104 is pressed towards the other riveting protrusion 104 to press the two first wall body parts 345 of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 between the two riveting protrusions 104, thereby fixing the heat dissipation fin 200.

[0054] Preferably, after the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are fixed on the upper cover plate 1, the bottom cavity 2 is stacked on the bottom of the upper cover plate 1. The third solder layer is arranged on the stacked side of the bottom cavity 2 and the upper cover plate 1. In step 3, the bottom cavity 2 and the upper cover plate 1 are welded and fixed. The third solder layer is usually a brazing filler metal layer, so that in step 3, the upper cover plate 1, the bottom cavity 2, the heat dissipation A single piece 3, and the heat dissipation B single piece 4 are brazed to realize the welding and fixation of all accessories at one time.

[0055] As shown in FIG. 1, the heat dissipation fin 200 includes an upper cover plate 1, a bottom cavity 2, a plurality of heat dissipation A single pieces 3, and a plurality of heat dissipation B single pieces 4. The upper cover plate 1 is provided with a mounting through slot 101, and the bottom cavity 2 is provided with a mounting through slot 102 corresponding to the mounting through slot 101 of the upper cover plate 1. The mounting through slot 101 and the mounting through slot 102 are arranged in a one-to-one correspondence, and the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are arranged in a one-to-one correspondence. Figure 11 and Figure 12As shown, the step 1 is also prepared for the connecting plate 5, which is provided with several positioning slots 501, and the top end of the heat dissipation A single piece 3 and / or the heat dissipation B single piece 4 has an upwardly extending positioning part 349, which extends into the positioning slot 501, and the upper cover plate 1 and the bottom cavity 2 form a heat dissipation base 100, and the connecting plate 5 is usually arranged in parallel with the heat dissipation base 100, which is equivalent to positioning the upper and lower ends of the several groups of heat dissipation fins 200.

[0056] As shown in the figure, Figure 13 As shown, the heat dissipation A single piece 3 is provided with a folding piece 301 extending towards the heat dissipation B single piece 4, and after the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are overlapped, the folding piece 301 extends out of the side of the heat dissipation B single piece 4 away from the heat dissipation A single piece 3, and the extending end of the folding piece 301 is in contact with the adjacent heat dissipation A single piece 3.

[0057] The folding piece 301 can be arranged at the edge positions of the heat dissipation A single piece 3, such as the front side, the back side, and the top, so as to form a clamping positioning of the heat dissipation A single piece 3 to the peripheral edge of the heat dissipation B single piece 4, which is beneficial to the stability of the overlapping of the two, and the overall integrity of the overlapped heat dissipation single piece is good, and the folding pieces 301 can also be arranged on the plate of the heat dissipation A single piece 3 in the middle area (here, the middle area does not mean the completely central position in the absolute sense, but actually refers to the internal area surrounded by the edge) other than the edge, and these folding pieces 301 are bent from the hollow part 302 on the heat dissipation A piece, and correspondingly, a hollow part is also formed on the heat dissipation B single piece 4, which is opposite to the folding piece 301 and has the same shape or basically the same shape. Of course, the heat dissipation B single piece 4 usually does not need to retain the hollow part to cut and bend the folding piece 301 like the heat dissipation A piece, and the hollow part of the heat dissipation B single piece 4 is mainly used for the folding piece 301 of the heat dissipation A piece of the heat dissipation fin 200 in the group to pass through, which plays a role in avoiding obstacles. In actual production, if the heat dissipation B single piece 4 also retains the hollow part to cut and bend the folding piece 301 like the heat dissipation A piece, it can also be realized that the folding pieces 301 of the heat dissipation A piece and the heat dissipation B piece form a stacked shape. Since the middle area can be provided with one or more folding pieces 301, these folding pieces 301 play a good role in positioning the heat dissipation fins 200 of adjacent groups in the left and right directions, strengthen the structural correlation between the heat dissipation fins 200 of each group, and make the heat dissipation fins 200 of each group not prone to shaking, so that the overall structural strength is better, and the folding pieces 301 can also play a role in strengthening the heat conduction between the heat dissipation fins 200 of each group. Figure 13The multiple flaps 301 of the intermediate region are arranged in multiple rows along the up-down interval, and each row includes multiple flaps 301 arranged along the front-rear interval. The arrangement of the multiple flaps 301 uniformly disperses the contact positioning stress points between the groups of fins 200. After welding, the contact positioning points are welded and fixed, so that all the fins 200 form a heat dissipation module with good strength and low deformation. Compared with the prior art, the heat dissipation device has the advantages of convenient assembly and good structural stability. Figure 11 and Figure 12 The heat dissipation device shown in the figure eliminates the step of assembling the top connecting plate, is more convenient to assemble, and has better structural stability.

[0058] In addition, the heat dissipation A single piece 3 and the heat dissipation B single piece 4 are preferably composite layer materials with a solder layer, which can be single-sided or double-sided with a solder layer. In the case of a single-sided solder layer, the solder layer is located on the stacking side, so that the flaps 301 of the heat dissipation A single piece 3 and the heat dissipation B single piece 4 in the same group of fins are in contact and positioned during assembly and are welded and fixed during welding.

[0059] The top cover plate 1 is at least a composite layer material with a solder layer, i.e., the top surface is covered with a solder layer, and can also be double-sided with a solder layer, i.e., the bottom surface is also covered with a solder layer, i.e., the third solder layer is arranged on the bottom surface, and the third solder layer can also be arranged on the top surface of the bottom cavity 2.

[0060] Preferably, the same solder layer is provided in the same heat dissipation device to facilitate the guarantee of the vacuum welding effect. The heat dissipation A single piece 3, the heat dissipation B single piece 4, the top cover plate 1, the bottom cavity 2, and the connecting plate are all metal substrates, such as aluminum substrates, and some use aluminum alloy, copper, copper alloy, copper-aluminum composite materials, etc.

[0061] In addition, an electronic device, such as a communication device, is provided, which includes a heat generating element and a heat dissipation device. Typically, the bottom of the bottom cavity 2 of the heat dissipation device is attached to the heat generating element, and the heat dissipation device is made by the method for making a heat dissipation device suitable for high-power electronic components as described above.

[0062] The design focus of the present application is that the top cover plate 1, the bottom cavity 2, the heat dissipation A single piece 3, and the heat dissipation B single piece 4 are assembled and welded at one time. The first solder layer C1 on the top surface of the top cover plate 1 melts and flows into the annular gap along the annular flow surface 102, and then forms a sealed weld between the outer peripheral surface of the flow passage interface part 347 and the annular flow surface 102. The welding effect is good, effectively solving the problem of leakage of working fluid medium at the welding site in the prior art, and the manufacturing process is simple and the manufacturing yield is good.

[0063] The above merely describes preferred embodiments of the present application, and is not intended to limit the technical scope of the present application in any way. Any minor modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application shall still fall within the technical scope of the present application.

Claims

1. A method of fabricating a heat dissipating device for high power electronic components, characterized in that, The application relates to a heat dissipation device, which comprises the following steps. Step 1, preparing an upper cover plate, a bottom cavity, a heat dissipation A single piece and a heat dissipation B single piece; wherein the top surface of the upper cover plate is covered with a first solder layer, the top surface of the upper cover plate is provided with a mounting through slot, the top end of the peripheral edge of the mounting through slot is chamfered to form an annular flow guide surface around the mounting through slot, two groups of riveting convex parts are arranged at the positions corresponding to the two ends of the mounting through slot at the bottom of the upper cover plate, each group of riveting convex parts comprises two riveting convex parts arranged at intervals, the superimposed side of the heat dissipation A single piece and / or the heat dissipation B single piece is covered with a second solder layer, the superimposed side of the heat dissipation A single piece and the heat dissipation B single piece is provided with corresponding matching flow channel wall surfaces, and the heat dissipation A single piece and the heat dissipation B single piece are downwardly extended at the ends of the corresponding flow channel wall surfaces to form connecting parts; the connecting part comprises a flow channel enclosing wall and widened abutting walls connected to the two ends of the flow channel enclosing wall, the widened abutting wall comprises a first wall body part close to the flow channel enclosing wall and a second wall body part away from the flow channel enclosing wall, the lower end surface of the second wall body part is higher than the lower end surface of the first wall body part, so that the lower end surface of the second wall body part serves as an abutting surface; Step 2, inserting the heat dissipation A single piece and the heat dissipation B single piece into the mounting through slot, the first wall body part is inserted into the two riveting convex parts, the two first wall body parts of the heat dissipation A single piece and the heat dissipation B single piece are fixed by riveting the riveting convex parts, the abutting surface abuts against the top surface of the upper cover plate, the connecting part is superimposed to form a flow channel interface part, an annular gap is formed between the outer peripheral surface of the flow channel interface part and the annular flow guide surface, and the bottom cavity is superimposed at the bottom of the upper cover plate; Step 3, performing vacuum welding, the first solder layer of the top surface of the upper cover plate is melted along the annular flow guide surface and flows into the annular gap, and then the outer peripheral surface of the flow channel interface part and the annular flow guide surface are sealed and welded.

2. The method of claim 1, wherein the method further comprises: The solder layer is a brazing filler metal layer, and step 3 is a brazing operation.

3. The method of claim 1, wherein the method further comprises: In step 1, a first capillary filler is also prepared; the first capillary filler is filled and arranged corresponding to the flow channel wall surface; And / or: In step 1, a second capillary filler is also prepared; the second capillary filler is filled and arranged corresponding to the bottom cavity.

4. The method of claim 1, wherein the method further comprises: In step 2, after the heat dissipation A single piece and the heat dissipation B single piece are inserted into the mounting through slot, the flow channel interface part protrudes from the bottom of the upper cover plate, and the protruding part of the flow channel interface part is fixed by pressing, so that the heat dissipation A single piece and the heat dissipation B single piece are fixed on the upper cover plate.

5. The method of claim 4, wherein the step of forming the heat sink comprises the step of: forming the heat sink by a method selected from the group consisting of a powder metallurgy method, a sintering method, a casting method, a pressing method, a molding method, and a combination thereof. After the heat dissipation A single piece and the heat dissipation B single piece are fixed on the upper cover plate, the bottom cavity is superimposed at the bottom of the upper cover plate, the superimposed sides of the bottom cavity and the upper cover plate are provided with a third solder layer, and the bottom cavity and the upper cover plate are welded and fixed in step 3.

6. The method of claim 1, wherein the method further comprises: In the step 1, a connecting plate is prepared, which is provided with a plurality of positioning grooves, and the top end of the heat dissipation A single piece and / or the heat dissipation B single piece is provided with a positioning portion extending upwardly and into the positioning grooves.

7. The method of claim 1, wherein the method further comprises: The heat dissipation A single piece is provided with a bending piece extending towards the heat dissipation B single piece, and after the heat dissipation A single piece and the heat dissipation B single piece are overlapped, the bending piece extends out of the side of the heat dissipation B single piece away from the heat dissipation A single piece, and the extending end of the bending piece is in contact with the adjacent heat dissipation A single piece.

8. An electronic device, comprising: Comprise: A heating element and a heat dissipation device; The heat dissipation device is made by the method for making the heat dissipation device suitable for high-power electronic components according to any one of claims 1 to 7.

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