Conductive resin superhard grinding wheel based on double percolation effect and preparation method thereof

Abstract

The invention provides a conductive resin superhard grinding wheel based on a double percolation effect and a preparation method thereof, and the preparation method comprises the following steps: firstly, taking samples according to the following formula: by volume, 5% of conductive filler, 25% of superhard abrasive particles, 25-35% of liquid resin A, 30-40% of powdery resin B and 5% of auxiliary filler; then preparing a conductive filler / resin A mixed solution and wetting the resin B and the super-hard abrasive particles in sequence, so that a layer of conductive filler / resin A compound is adhered to the surfaces of the resin B and the super-hard abrasive particles; the preparation method comprises the following steps: firstly, carrying out mechanical mixing, carrying out compression molding on a grinding wheel base body, putting the molded grinding wheel base body and a mold pressing mold into a furnace, carrying out curing treatment, and finally, carrying out cutting machining and sharpening treatment on the grinding wheel base body to obtain the conductive resin super-hard grinding wheel. According to the invention, the conductive resin superhard grinding wheel with low conductive filler content and high conductivity can be prepared.

Description

Technical Field

[0001] The invention relates to the field of mechanical parts processing, in particular to the field of design and preparation of resin superhard grinding wheels with low conductive filler content and excellent conductive performance. Background Art

[0002] Grinding-electrolysis composite processing technology is an important means to achieve high-performance manufacturing of parts made of difficult-to-process materials. For example, in order to achieve ultra-precision mirror grinding of hard and brittle materials, Japanese scholars Murata and Ohmori proposed online electrolytic dressing (ELID) grinding technology. This technology uses the dynamic balance between the electrolytic dressing effect and the electrolytic inhibition effect of the oxide layer on the surface of the grinding wheel to continuously dress the grinding wheel to keep the abrasive grains at a constant protrusion, thereby obtaining stable and controllable grinding quality. In order to improve the grinding efficiency of high-strength and toughness alloy materials, American scholar Keeleric developed electrochemical grinding technology. This technology uses the electrolysis of the workpiece anode and the mechanical scraping of the electrolysis product by the grinding wheel cathode to complete material removal, thereby achieving efficient and high-quality grinding of high-strength and toughness alloys.

[0003] Conductive grinding wheel is a key component of the grinding-electrolytic composite processing system. Its performance and adaptability in the specific process determine the final processing quality of the parts. However, the system's requirement for the conductivity of the grinding wheel means that in process practice, only metal bonded grinding wheels can be selected as grinding tools. The singleness of the optional tools seriously limits the effectiveness of the grinding-electrolytic composite processing technology.

[0004] Therefore, there is an urgent need to develop new grinding tools with excellent conductive properties and grinding performance. Summary of the invention

[0005] In order to solve the above technical problems, the present invention proposes a method for preparing a conductive resin superhard grinding wheel based on the double percolation effect, thereby providing a new tool for constructing a grinding-electrolysis composite processing system.

[0006] The purpose of the present invention is achieved through the following technical solutions:

[0007] The present invention provides a method for preparing a conductive resin superhard grinding wheel based on a double percolation effect, wherein:

[0008] The preparation method comprises:

[0009] Step S01: taking a sample according to the following formula: by volume percentage, 5% conductive filler, 25% superhard abrasive grains, 25-35% liquid resin A, 30-40% powdered resin B, and 5% auxiliary filler;

[0010] Step S02: Preparation of a conductive filler / resin A mixed solution: adding nano conductive fillers to resin A and stirring for a set time to obtain a filler / resin A mixed solution;

[0011] Step S03: Wetting of resin B and super-hard abrasive grains: respectively adding resin B and super-hard abrasive grains into the conductive filler / resin A mixture for wetting, so that a layer of conductive filler / resin A composite is adhered to the surfaces of the two;

[0012] Step S04: Mechanical mixing: pour the moistened resin B, moistened superhard abrasive grains, and auxiliary fillers into a mixing container, set the rotation speed and mixing time, and obtain a mixture of conductive filler / resin A / resin B / superhard abrasive grains / auxiliary fillers;

[0013] Step S05: pressing and molding a grinding wheel matrix: according to the designed molding die, weigh a certain mass of the mixed material, fill it into the mold, place it on a press machine with a heating plate, and perform hot pressing molding using a constant pressure method to form a grinding wheel matrix;

[0014] Step S06: Curing treatment: setting the curing temperature, placing the formed grinding wheel matrix together with the molding die in a furnace for curing treatment, so that the conductive filler undergoes conductive percolation in the resin A, and the conductive filler / resin A composite system undergoes conductive percolation in the resin B;

[0015] Step S07: Grinding wheel pretreatment: cutting the grinding wheel substrate after curing to ensure the dimensional tolerance and geometric tolerance of the grinding wheel; sharpening the grinding wheel after cutting with a sanding strip to obtain a conductive resin superhard grinding wheel.

[0016] More preferably, in the method for preparing the conductive resin superhard grinding wheel based on the double percolation effect:

[0017] The conductive filler includes any one or more of the following materials: carbon nanotubes, nano carbon black, and graphene.

[0018] More preferably, in the method for preparing the conductive resin superhard grinding wheel based on the double percolation effect: the superhard abrasive grains include any one or more of the following materials: diamond, CBN abrasive grains.

[0019] More preferably, in the method for preparing the conductive resin superhard grinding wheel based on the double percolation effect:

[0020] The resin A and the resin B include any one or more of the following materials: phenolic resin, polyamide resin, epoxy resin, polyurethane resin.

[0021] More preferably, in the method for preparing the conductive resin superhard grinding wheel based on the double percolation effect:

[0022] The auxiliary filler includes any one or more of the following materials: cryolite-sodium aluminum fluoride, pyrite, zinc sulfide, barium zinc sulfate, potassium fluoroborate, potassium chloride, and potassium sulfate.

[0023] The present invention also provides a conductive resin superhard grinding wheel based on double percolation effect, wherein the conductive resin superhard grinding wheel is prepared by the above-mentioned preparation method of the conductive resin superhard grinding wheel based on double percolation effect.

[0024] The present invention also provides a conductive resin superhard grinding wheel based on double percolation effect, wherein:

[0025] The conductive resin superhard matrix material is made of the following raw materials: by volume percentage, 5% conductive filler, 25% superhard abrasive grains, 25-35% liquid resin A, 30-40% powdered resin B, and 5% auxiliary filler.

[0026] More preferably: In the conductive resin superhard grinding wheel based on the double percolation effect:

[0027] The conductive filler includes any one or more of the following materials: carbon nanotubes, nano carbon black, and graphene.

[0028] More preferably: In the conductive resin superhard grinding wheel based on the double percolation effect:

[0029] The super-hard abrasive grains include any one or more of the following materials: diamond and CBN abrasive grains.

[0030] More preferably: In the conductive resin superhard grinding wheel based on the double percolation effect:

[0031] The resin A and the resin B include any one or more of the following materials: phenolic resin, polyamide resin, epoxy resin, polyurethane resin;

[0032] The auxiliary filler includes any one or more of the following materials: cryolite-sodium aluminum fluoride, pyrite, zinc sulfide, barium zinc sulfate, potassium fluoroborate, potassium chloride, and potassium sulfate.

[0033] It can be seen from the above technical solutions of the present invention that the present invention has the following technical effects:

[0034] The present invention adopts a novel method for preparing a conductive resin superhard grinding wheel, wherein a conductive filler is added to resin A to cause conductive percolation, and then a conductive filler / resin A composite system is added to resin B to cause conductive percolation, thereby preparing a conductive composite material with a low percolation threshold (i.e., conductive filler / resin A / resin B). The conductive composite material with a low percolation threshold is used as a grinding wheel binder raw material to further prepare a conductive resin superhard grinding wheel based on the double percolation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 The present invention is a schematic diagram of the preparation process of the conductive resin superhard grinding wheel based on the double percolation effect. DETAILED DESCRIPTION

[0036] The present invention is described in detail below with reference to the accompanying drawings and embodiments.

[0037] Embodiment 1:

[0038] Embodiment 1 of the present invention provides a method for preparing a conductive resin superhard grinding wheel based on the double percolation effect, wherein the preparation process comprises the following steps: formula design, preparation of a conductive filler / resin A mixed solution, wetting of resin B (powder) and superhard abrasive grains, mechanical mixing, pressing and molding, curing treatment, etc. (e.g. Figure 1 The specific implementation is as follows:

[0039] Step S01: Formula design, the sample is prepared using the following raw materials, in terms of volume percentage, conductive filler 5%, superhard abrasive 25%, resin A (liquid) 25-35%, resin B (powder) 30-40%, auxiliary filler 5%;

[0040] Wherein: the conductive filler includes any one or more of the following materials: carbon nanotubes, nano carbon black and graphene;

[0041] The super-hard abrasive grains include any one or more of the following materials: diamond or CBN abrasive grains;

[0042] Resin A and resin B include any one or more of the following materials: phenolic resin, polyamide resin, epoxy resin, polyurethane resin, etc.;

[0043] The auxiliary filler includes any one or more of the following materials: cryolite-sodium aluminum fluoride, pyrite, zinc sulfide, barium zinc sulfate, potassium fluoroborate and potassium chloride, potassium sulfate, etc.;

[0044] Step S02: preparing a conductive filler / resin A mixed solution, adding the nano conductive filler to the resin A, stirring for a set time, and obtaining a filler / resin A mixed solution;

[0045] Step S03: Wetting of resin B and super-hard abrasive grains, respectively adding resin B and super-hard abrasive grains into the conductive filler / resin A mixed solution for wetting, so that a layer of conductive filler / resin A composite is adhered to the surfaces of the two;

[0046] Step S04: mechanical mixing, pouring the moistened resin B, the moistened superhard abrasive grains, and the auxiliary filler into a mixing container, setting the rotation speed and mixing time, and obtaining a mixture of conductive filler / resin A / resin B / superhard abrasive grains / auxiliary filler;

[0047] Step S05: pressing and molding a grinding wheel matrix: according to the designed molding die, weigh a certain mass of the mixed material, fill it into the mold, place it on a press machine with a heating plate, and perform hot pressing molding using a constant pressure method to form a grinding wheel matrix;

[0048] Step S06: Curing treatment: setting the curing temperature, placing the formed grinding wheel matrix together with the molding die in a furnace for curing treatment, so that the conductive filler percolates in the resin A, and the conductive filler / resin A composite system percolates in the resin B, thereby making the grinding wheel abrasive layer as a whole have good conductive properties;

[0049] It can be placed in a muffle furnace for curing.

[0050] Step S07: Grinding wheel pretreatment: cutting the grinding wheel to ensure the dimensional tolerance and geometric tolerance of the grinding wheel; using a sand bar (the material can be aluminum oxide or silicon carbide) to sharpen the grinding wheel so that the abrasive grains have a certain edge height, and a conductive resin superhard grinding wheel is obtained.

[0051] The grinding wheel can be cut by CNC machine tools to ensure the dimensional tolerance and form and position tolerance of the grinding wheel.

[0052] Embodiment 2:

[0053] Embodiment 2 of the present invention provides a conductive resin superhard grinding wheel based on the double percolation effect. The base material of the grinding wheel is made of the following raw materials, which are, by volume percentage, 5% conductive filler, 25% superhard abrasive grains, 25-35% resin A (liquid), 30-40% resin B (powder), and 5% auxiliary filler.

[0054] Wherein: the conductive filler includes any one or more of the following materials: carbon nanotubes, nano carbon black and graphene;

[0055] The super-hard abrasive grains include any one or more of the following materials: diamond or CBN abrasive grains;

[0056] Resin A and resin B include any one or more of the following materials: phenolic resin, polyamide resin, epoxy resin, polyurethane resin, etc.;

[0057] The auxiliary filler includes any one or more of the following materials: cryolite-sodium aluminum fluoride, pyrite, zinc sulfide, barium zinc sulfate, potassium fluoroborate, potassium chloride, potassium sulfate, etc.

[0058] The conductive resin superhard grinding wheel based on the double percolation effect of the present invention is manufactured by the preparation method of Example 1. It will not be described in detail here.

[0059] Experiments have shown that by adding conductive filler to resin A to cause conductive percolation, and then adding the conductive filler / resin A composite system to resin B to cause conductive percolation, a conductive composite material with a low percolation threshold (i.e., conductive filler / resin A / resin B) can be prepared. The conductive composite material with a low percolation threshold can be used as a grinding wheel binder raw material to further prepare a conductive resin superhard grinding wheel.

[0060] Although the present invention has been disclosed as above with preferred embodiments, the embodiments are not intended to limit the present invention. Any equivalent changes or modifications made without departing from the spirit and scope of the present invention also belong to the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the content defined by the claims of this application.

Claims

1. A method for preparing a conductive resin superhard grinding wheel based on double percolation effect, characterized in that: The preparation method comprises: Step S01: taking a sample according to the following formula: by volume percentage, 5% conductive filler, 25% superhard abrasive grains, 25-35% liquid resin A, 30-40% powdered resin B, and 5% auxiliary filler; Step S02: Preparation of a conductive filler / resin A mixed solution: adding nano conductive fillers to resin A and stirring for a set time to obtain a filler / resin A mixed solution; Step S03: Wetting of resin B and super-hard abrasive grains: respectively adding resin B and super-hard abrasive grains into the conductive filler / resin A mixture for wetting, so that a layer of conductive filler / resin A composite is adhered to the surfaces of the two; Step S04: Mechanical mixing: pour the moistened resin B, moistened superhard abrasive grains, and auxiliary fillers into a mixing container, set the rotation speed and mixing time, and obtain a mixture of conductive filler / resin A / resin B / superhard abrasive grains / auxiliary fillers; Step S05: pressing and molding a grinding wheel matrix: according to the designed molding die, weigh a certain mass of the mixed material, fill it into the mold, place it on a press machine with a heating plate, and perform hot pressing molding using a constant pressure method to form a grinding wheel matrix; Step S06: Curing treatment: setting the curing temperature, placing the formed grinding wheel matrix together with the molding die in a furnace for curing treatment, so that the conductive filler undergoes conductive percolation in the resin A, and the conductive filler / resin A composite system undergoes conductive percolation in the resin B; Step S07: Grinding wheel pretreatment: cutting the grinding wheel substrate after curing to ensure the dimensional tolerance and geometric tolerance of the grinding wheel; sharpening the grinding wheel after cutting with a sanding strip to obtain a conductive resin superhard grinding wheel.

2. The method for preparing a conductive resin superhard grinding wheel based on double percolation effect according to claim 1, characterized in that: The conductive filler includes any one or more of the following materials: carbon nanotubes, nano carbon black, and graphene.

3. The method for preparing a conductive resin superhard grinding wheel based on double percolation effect according to claim 1, characterized in that: The super-hard abrasive grains include any one or more of the following materials: diamond and CBN abrasive grains.

4. The method for preparing a conductive resin superhard grinding wheel based on double percolation effect according to claim 1, characterized in that: The resin A and the resin B include any one or more of the following materials: phenolic resin, polyamide resin, epoxy resin, polyurethane resin.

5. The method for preparing a conductive resin superhard grinding wheel based on double percolation effect according to claim 1, characterized in that: The auxiliary filler includes any one or more of the following materials: cryolite-sodium aluminum fluoride, pyrite, zinc sulfide, barium zinc sulfate, potassium fluoroborate, potassium chloride, and potassium sulfate.

6. A conductive resin superhard grinding wheel based on double percolation effect, characterized in that: The conductive resin superhard grinding wheel is prepared by the preparation method of a conductive resin superhard grinding wheel based on double percolation effect as described in any one of claims 1 to 5.

7. A conductive resin superhard grinding wheel based on double percolation effect, characterized in that: The conductive resin superhard matrix material is made of the following raw materials: by volume percentage, 5% conductive filler, 25% superhard abrasive grains, 25-35% liquid resin A, 30-40% powdered resin B, and 5% auxiliary filler.

8. The conductive resin superhard grinding wheel based on double percolation effect according to claim 1, characterized in that: The conductive filler includes any one or more of the following materials: carbon nanotubes, nano carbon black, and graphene.

9. The conductive resin superhard grinding wheel based on double percolation effect according to claim 1, characterized in that: The super-hard abrasive grains include any one or more of the following materials: diamond and CBN abrasive grains.

10. The conductive resin superhard grinding wheel based on double percolation effect according to claim 1, characterized in that: The resin A and the resin B include any one or more of the following materials: phenolic resin, polyamide resin, epoxy resin, polyurethane resin; The auxiliary filler includes any one or more of the following materials: cryolite-sodium aluminum fluoride, pyrite, zinc sulfide, barium zinc sulfate, potassium fluoroborate, potassium chloride, and potassium sulfate.

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