Induction cooker panel with temperature detection function, manufacturing method thereof and induction cooker

Abstract

The present application belongs to the technical field of household appliances, and discloses an induction cooker panel with a temperature detection function, a manufacturing method thereof, and an induction cooker. A plurality of strip-shaped aluminum oxide films are prepared on the back of a glass substrate, and the two ends thereof are respectively connected to an anode circuit and a cathode circuit to form a plurality of temperature detection units, thereby realizing accurate detection of the temperature distribution of the entire heating area, effectively preventing the generation of hot spots, and having the advantages of being able to accurately detect the temperature distribution of the entire heating area, preventing the generation of hot spots, and improving the safety of use and the cooking effect.

Description

Technical Field

[0001] The present application relates to the technical field of household appliances, and in particular to an induction cooker panel with a temperature detection function, a manufacturing method thereof, and an induction cooker. Background Art

[0002] In order to prevent the water in the kitchenware from drying up or the bottom of the kitchenware from being uneven, which may cause the local temperature on the surface of the induction cooker to be too high, the existing induction cooker usually sets a fixed or retractable thermistor in the middle of the induction cooker coil to detect the temperature of the bottom of the kitchenware in real time, and adjust the power or automatically shut down according to the detection results.

[0003] However, this solution has some problems. When the middle part of the bottom surface of the kitchenware is a concave structure, the fixed thermistor cannot contact the bottom of the kitchenware, and thus cannot effectively detect the actual temperature of the bottom of the kitchenware. The bottom of many kitchenware is designed to be a structure with a concave middle part and a protruding edge, or even if the bottom is designed to be a flat structure, it may be concave in the middle due to being dropped during use. In this case, the fixed thermistor cannot accurately reflect the temperature condition of the bottom of the kitchenware, which may lead to improper temperature control.

[0004] Although the thermistor that can be extended up and down can reliably contact the bottom of the cookware and effectively detect the actual temperature in the middle of the bottom of the cookware, for cookware with uneven bottoms, the temperature at the position where it contacts the upper surface of the induction cooker is usually much higher than the temperature at the position that does not contact the upper surface of the induction cooker. This will cause "hot spots" to appear at the position that contacts the upper surface of the induction cooker. The generation of hot spots greatly increases the risk of the bottom of the cookware being burned through and the surface of the induction cooker being damaged. This not only affects the cooking effect, but may also cause safety hazards.

[0005] In addition, since only a single thermistor is used to measure the temperature at a local location, it is impossible to effectively sense all parts of the induction cooker's heating surface, making it difficult to prevent the generation of hot spots. This limitation makes it impossible for the induction cooker to fully grasp the temperature distribution of the entire heating area, and thus unable to take corresponding control measures for temperature differences at different locations.

[0006] This single-point temperature measurement method also has other drawbacks. For example, when there is a large temperature gradient at the bottom of the cookware, the single-point temperature measurement may not accurately reflect the average temperature of the entire heating area, thus affecting the accuracy of temperature control. At the same time, single-point temperature measurement cannot cope with cookware of different sizes and shapes, making it difficult to provide optimal heating control for various cooking needs.

[0007] The above problems not only affect the safety of the induction cooker, but may also shorten the service life of the induction cooker and kitchenware. The frequent occurrence of hot spots may accelerate the aging and damage of the induction cooker panel, and also increase the risk of the bottom of the kitchenware being burned through. This not only increases the user's cost of use, but may also cause safety accidents.

[0008] In view of the above problems, the existing technology needs to be improved urgently. Summary of the invention

[0009] The purpose of the present application is to provide an induction cooker panel with a temperature detection function, a manufacturing method thereof, and an induction cooker, which have the advantages of being able to accurately detect the temperature distribution of the entire heating area, prevent the generation of hot spots, and improve safety of use and cooking effects.

[0010] In a first aspect, the present application provides a method for manufacturing an induction cooker panel with a temperature detection function, which is used to prepare a glass panel of an induction cooker, comprising the steps of:

[0011] A1. Preparation of aluminum oxide thin film reaction sol;

[0012] A2. Printing the anode circuit and cathode circuit at a position outside the eddy current affected area on the back of the glass substrate; the eddy current affected area is the area facing the induction cooker coil when in use;

[0013] A3. Pasting a first mask having a plurality of parallel strip-shaped hollow regions on the back of the glass substrate, so that the two ends of each strip-shaped hollow region are respectively located at the anode circuit and the cathode circuit, and each strip-shaped hollow region passes through the eddy current affected area;

[0014] A4. The strip-shaped hollow area is coated with the aluminum oxide thin film reaction sol to obtain a coating layer;

[0015] A5. After the coating layer is hardened and treated to improve its density, the first mask is removed to obtain a plurality of strip-shaped aluminum oxide films;

[0016] A6. Electrodes are prepared at both ends of each of the strip-shaped aluminum oxide films so that both ends of the strip-shaped aluminum oxide film are connected to the anode circuit and the cathode circuit, respectively;

[0017] A7. Encapsulate the back side of the glass substrate to obtain a finished glass panel.

[0018] By preparing multiple strip-shaped aluminum oxide films on the back of a glass substrate and connecting the two ends thereof to the anode circuit and the cathode circuit respectively, multiple temperature detection units are formed, thereby realizing accurate detection of the temperature distribution of the entire heating area and effectively preventing the generation of hot spots. It has the advantages of being able to accurately detect the temperature distribution of the entire heating area, prevent the generation of hot spots, and improve safety of use and cooking effects.

[0019] Preferably, step A1 comprises:

[0020] A101. Aluminum isopropoxide is added to water and stirred to obtain an aluminum isopropoxide solution;

[0021] A102. Adding an acidic gelling agent to the aluminum isopropoxide solution and stirring until the solution becomes shrunk and gelatinous;

[0022] A103. Degas the solution under negative pressure and let it stand to obtain an aluminum oxide film reaction sol.

[0023] Through this preparation process, an aluminum oxide thin film reaction sol with uniform structure, few bubbles and good stability can be obtained, providing high-quality basic materials for the subsequent realization of the temperature detection function of the induction cooker panel. This preparation method can effectively control the molecular structure and purity of the sol, creating good conditions for the production of temperature sensors.

[0024] Preferably, the acidic gelling agent is nitric acid;

[0025] Step A102 includes:

[0026] At 40° C.-80° C., nitric acid is added to the aluminum isopropoxide solution and stirred to adjust the pH value of the solution to between 2 and 4 until the solution shrinks and becomes gelatinous, and stirring is stopped to obtain a suspension.

[0027] By selecting nitric acid as the acidic gelling agent and reacting within a specific temperature and pH range, the preparation conditions of the aluminum oxide film reaction sol can be effectively controlled. This method can ensure that the generated film has good quality and performance, thereby improving the temperature detection function of the induction cooker glass panel.

[0028] Preferably, step A103 includes:

[0029] Place the solution in a negative pressure environment of 0.07MPa-0.1MPa for 1 hour to 3 hours to allow the solution to expel bubbles;

[0030] After the negative pressure is released, the solution is allowed to stand at 23° C. to 30° C. for 12 to 24 hours to obtain an aluminum oxide thin film reaction sol.

[0031] Preferably, the anode circuit comprises an L-shaped circuit belt consisting of a common anode belt and an extension line, and an anode disk located at one end of the extension line away from the common anode belt, and the cathode circuit comprises a plurality of cathode disks, the cathode disks are arranged at intervals along a straight line parallel to the common anode belt, and the cathode disks and the common anode belt are arranged oppositely on both sides of the eddy current influence area, and the extension line extends from a side where the common anode belt is located to a side where the cathode disk is located;

[0032] Step A3 includes:

[0033] A first mask having a plurality of parallel strip-shaped hollow regions is pasted on the back of the glass substrate, so that one end of all the strip-shaped hollow regions is located on the common anode strip, and the other end of each strip-shaped hollow region is located on each cathode disk.

[0034] Preferably, step A5 comprises:

[0035] A501. The glass substrate is left to stand at 80°C-120°C for 1 hour to 3 hours to harden the coating layer;

[0036] A502. After the hardening treatment is completed, the glass substrate is placed in a formic acid furnace, the temperature in the formic acid furnace is increased from 300°C to 800°C at a heating rate of 2°C / min, oxygen is passed into the formic acid furnace, and the temperature is maintained for 1.5 hours to allow the coating layer to react to form an aluminum oxide film;

[0037] A503. Remove the first mask to obtain multiple strip-shaped aluminum oxide films.

[0038] Preferably, step A6 comprises:

[0039] A601. A second mask is attached to the back of the glass substrate; the second mask has a plurality of first hollow holes, a second hollow hole and a plurality of third hollow holes, each of the first hollow holes and each of the strip-shaped aluminum oxide films is arranged opposite to one end of the common anode strip, the second hollow hole is arranged opposite to the anode disk, and each of the third hollow holes is arranged opposite to each of the cathode disks;

[0040] A602. Electrodes are prepared at the first hollow hole, the second hollow hole and the third hollow hole, so that both ends of each of the strip-shaped aluminum oxide films are connected to the common anode belt and the corresponding cathode disk;

[0041] A603. Remove the second mask.

[0042] Preferably, step A602 includes:

[0043] Sputtering a copper mother layer in the first hollow hole, the second hollow hole and the third hollow hole;

[0044] A copper layer electrode is prepared on the copper mother layer by electroplating.

[0045] In the second aspect, the present application provides an induction cooker panel with a temperature detection function, comprising a glass substrate, the glass substrate having an eddy current influence area facing the induction cooker coil when in use; an anode circuit, a cathode circuit and a plurality of strip-shaped aluminum oxide films are arranged on the back side of the glass substrate, the anode circuit and the cathode circuit are located outside the eddy current influence area, the strip-shaped aluminum oxide films are parallel to each other and arranged at intervals, the two ends of the strip-shaped aluminum oxide film are respectively connected to the anode circuit and the cathode circuit, and all the strip-shaped aluminum oxide films pass through the eddy current influence area.

[0046] In the third aspect, the present application provides an induction cooker, comprising a power supply circuit, an induction cooker coil, a resonant circuit, a power regulation circuit and a glass panel, wherein the induction cooker coil and the resonant circuit are connected in parallel as a load to the output end of the power supply circuit; the glass panel is the induction cooker panel with temperature detection function as described above; the power regulation circuit is electrically connected to the power supply circuit, the load and the glass panel, and is used to adjust the power of the load according to the temperature detection signal of the glass panel.

[0047] Beneficial effects: The induction cooker panel with temperature detection function, its manufacturing method and induction cooker provided in the present application prepare multiple strip-shaped aluminum oxide films on the back of a glass substrate, and connect the two ends thereof to the anode circuit and the cathode circuit respectively to form multiple temperature detection units, thereby realizing accurate detection of the temperature distribution of the entire heating area and effectively preventing the generation of hot spots. It has the advantages of being able to accurately detect the temperature distribution of the entire heating area, prevent the generation of hot spots, and improve safety of use and cooking effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 A flow chart of a method for manufacturing an induction cooker panel with a temperature detection function provided in an embodiment of the present application.

[0049] Figure 2 A flow chart of another method for manufacturing an induction cooker panel with a temperature detection function provided in an embodiment of the present application.

[0050] Figure 3 Schematic diagram of the distribution position of the strip-shaped aluminum oxide film on the back of the glass substrate.

[0051] Figure 4 FIG. 4 is a bottom view of the glass substrate corresponding to step A2.

[0052] Figure 5 is a bottom view of the glass substrate corresponding to step A3.

[0053] Figure 6 is a bottom view of the glass substrate corresponding to step A4.

[0054] Figure 7 is a bottom view of the glass substrate corresponding to step A5.

[0055] Figure 8 is a bottom view of the glass substrate corresponding to step A6.

[0056] Fig. 9 FIG. 4 is a bottom view of the glass substrate corresponding to step A7.

[0057] Fig.10 This is a circuit diagram of the induction cooker provided in an embodiment of the present application.

[0058] Explanation of reference numerals: 1. glass substrate; 101. eddy current affected area; 102. display pattern; 2. anode circuit; 201. common anode strip; 202. extension line; 203. anode disk; 3. cathode circuit; 301. cathode disk; 4. strip-shaped aluminum oxide film; 5. first high-temperature resistant insulating coating; 6. power supply circuit; 601. rectifier bridge; 602. choke; 603. capacitor; 7. induction cooker coil; 8. resonant circuit; 9. power regulation circuit; 901. switch tube; 902. PWM chip; 903. current comparison circuit; 904. gate drive circuit; 10. glass panel; 11. load. DETAILED DESCRIPTION

[0059] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0060] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0061] Existing temperature detection schemes for induction cookers have technical problems such as inaccurate local temperature measurement and inability to effectively prevent the generation of hot spots. Specifically, traditional induction cookers usually set a single thermistor in the middle of the coil to detect the temperature of the bottom of the kitchenware. However, this method is difficult to adapt to kitchenware with different bottom shapes, especially when the middle part of the bottom surface of the kitchenware is a concave structure, the fixed thermistor may not be able to contact the bottom of the kitchenware, resulting in inaccurate temperature detection. Although the thermistor that can be extended up and down can improve the contact problem, for kitchenware with uneven bottoms, it is still impossible to fully monitor the temperature distribution of the entire heating surface, which can easily cause "hot spots" to appear in certain areas. This single-point temperature measurement method cannot effectively detect and prevent the formation of hot spots, which seriously affects the safety performance and service life of the induction cooker.

[0062] To this end, the present application provides an innovative method for manufacturing an induction cooker panel with a temperature detection function.

[0063] Please refer to Figure 1 In some embodiments of the present application, a method for manufacturing an induction cooker panel with a temperature detection function is used to prepare a glass panel 10 of an induction cooker, comprising the steps of:

[0064] A1. Preparation of aluminum oxide thin film reaction sol;

[0065] A2. The anode circuit 2 and the cathode circuit 3 are printed at a position outside the eddy current affected area 101 on the back of the glass substrate 1; the eddy current affected area 101 is the area facing the induction cooker coil 7 when in use;

[0066] A3. A first mask having a plurality of parallel strip-shaped hollow regions is attached to the back of the glass substrate 1, so that the two ends of each strip-shaped hollow region are located at the anode circuit 2 and the cathode circuit 3, respectively, and each strip-shaped hollow region passes through the eddy current affected area 101;

[0067] A4. The strip-shaped hollow area is coated with an aluminum oxide film reaction sol to obtain a coating layer;

[0068] A5. After the coating layer is hardened and treated to improve its density, the first mask is removed to obtain a plurality of strip-shaped aluminum oxide films 4;

[0069] A6. Electrodes are prepared at both ends of each strip-shaped aluminum oxide film 4 so that both ends of the strip-shaped aluminum oxide film 4 are connected to the anode circuit 2 and the cathode circuit 3, respectively;

[0070] A7. Encapsulate the back side of the glass substrate 1 to obtain a finished glass panel.

[0071] By preparing a plurality of strip-shaped aluminum oxide films 4 on the back of the glass substrate 1, and connecting the two ends thereof to the anode circuit 2 and the cathode circuit 3 respectively, a plurality of temperature detection units are formed (when the glass panel 10 is heated, the resistance value of the strip-shaped aluminum oxide film 4 will change, and the temperature at the corresponding position can be calculated by measuring these changes), thereby achieving accurate detection of the temperature distribution of the entire heating area and effectively preventing the generation of hot spots. The method has the advantages of being able to accurately detect the temperature distribution of the entire heating area, prevent the generation of hot spots, and improve safety of use and cooking effects.

[0072] In addition, the anode circuit 2 and the cathode circuit 3 are printed outside the eddy current affected area 101 on the back of the glass substrate 1. These circuits provide a basis for the subsequent connection of the temperature sensor. At the same time, because they are located outside the eddy current affected area 101, the magnetic field generated by the induction cooker coil 7 can be prevented from affecting the anode circuit 2 and the cathode circuit 3, thereby interfering with the temperature measurement result. The back of the glass substrate 1 is packaged to protect the temperature detection structure.

[0073] Among them, the eddy current affected area 101 refers to the area facing the induction cooker coil 7 when in use. It can be determined by marking the area corresponding to the induction cooker coil 7 on the back of the glass substrate 1, or the position information of the eddy current affected area 101 can be stored in the automated manufacturing system, so that the eddy current affected area 101 can be determined according to the position information during manufacturing.

[0074] The key to this design is to use multiple strip-shaped aluminum oxide films 4 as temperature sensors. Since these temperature sensors are evenly distributed throughout the heating area, the temperature changes at multiple locations can be monitored simultaneously, thereby achieving comprehensive temperature monitoring of the entire heating surface. Compared with traditional single-point temperature measurement, this method can more accurately detect temperature changes at different locations and effectively prevent the generation of hot spots.

[0075] The reason for choosing aluminum oxide film as a temperature sensor is its good high temperature resistance and stability. Aluminum oxide has a high melting point and thermal stability, and can maintain stable performance within the operating temperature range of the induction cooker. At the same time, the preparation process of aluminum oxide film is relatively mature, and large-area, uniform film preparation can be achieved through methods such as the sol-gel method.

[0076] In fact, reference Figure 2 , before step A2, the method may further include the following steps:

[0077] A00. Printing the display pattern 102 on the back side of the glass substrate 1 .

[0078] Printing the display pattern 102 on the back of the glass substrate 1 can form a beautiful decorative effect on the glass panel 10 and provide different indication patterns for buttons and indicator lights with different functions (such as Figure 3 as shown).

[0079] There are many methods for printing the display pattern 102. For example, screen printing technology can be used to transfer the designed pattern to the back of the glass substrate 1 through a screen. Inkjet printing technology can also be used to directly print the digitized pattern on the back of the glass substrate 1. In addition, thermal transfer technology can also be considered to transfer a pre-made pattern film to the back of the glass substrate 1 at high temperature. The specific pattern and position of the display pattern 102 can be adjusted according to actual needs.

[0080] The aluminum oxide film reaction sol refers to a precursor solution for preparing an aluminum oxide film, and can be prepared by mixing aluminum isopropoxide and water and then adding an acidic gelling agent.

[0081] In some embodiments, step A1 comprises:

[0082] A101. Aluminum isopropoxide is added to water and stirred to obtain an aluminum isopropoxide solution;

[0083] A102. Add an acidic gelling agent to the aluminum isopropoxide solution and stir until the solution shrinks and becomes gelatinous;

[0084] A103. Degas the solution under negative pressure and let it stand to obtain an aluminum oxide film reaction sol.

[0085] Through this preparation process, an aluminum oxide thin film reaction sol with uniform structure, few bubbles and good stability can be obtained, providing high-quality basic materials for the subsequent realization of the temperature detection function of the induction cooker panel. This preparation method can effectively control the molecular structure and purity of the sol, creating good conditions for the production of temperature sensors.

[0086] In step A101, preferably aluminum isopropoxide with a purity greater than 99% and deionized water are used, that is, aluminum isopropoxide with a purity greater than 99% is added to deionized water and stirred evenly to obtain an aluminum isopropoxide solution. This reduces the introduction of impurities (especially metal impurities) and reduces the impurity content of the final strip-shaped aluminum oxide film 4, thereby reducing the influence of the magnetic field of the induction cooker coil 7 on the strip-shaped aluminum oxide film 4 and improving the temperature detection accuracy.

[0087] Among them, the acidic gelling agent can be nitric acid or hydrochloric acid.

[0088] Preferably, the acidic gelling agent is nitric acid;

[0089] Step A102 includes:

[0090] At 40°C-80°C, add nitric acid to the aluminum isopropoxide solution and stir until the pH value of the solution is between 2-4, until the solution shrinks and becomes gelatinous, stop stirring, and obtain a suspension.

[0091] By selecting nitric acid as the acidic gelling agent and reacting within a specific temperature and pH range, the preparation conditions of the aluminum oxide film reaction sol can be effectively controlled. This method can ensure that the generated film has good quality and performance, thereby improving the temperature detection function of the induction cooker glass panel.

[0092] Specifically, nitric acid is used as the acidic gelling agent because nitric acid has strong acidity and oxidizing properties, and can be used as a catalyst to effectively promote the hydrolysis and condensation reaction of aluminum isopropoxide (the specific reaction is: aluminum isopropoxide + water = aluminum hydroxide isopropoxide + isopropanol + alkyl acid). The reaction is carried out in the temperature range of 40°C-80°C in order to provide appropriate reaction kinetic conditions. Too low a temperature may result in a slow reaction rate, while too high a temperature may cause a too fast reaction, resulting in an uneven sol structure.

[0093] By controlling the pH value of the solution between 2 and 4, the rates of hydrolysis and condensation reactions can be precisely adjusted. In this pH range, the hydrolysis rate of aluminum isopropoxide is moderate, which is conducive to the formation of a uniform sol network structure. At the same time, this pH range also helps prevent the sol from gelling too quickly, thereby ensuring the controllability of the reaction.

[0094] In addition, in order to further improve the uniformity of the sol structure, when adding nitric acid, a slow dripping method can be adopted, while stirring while dripping.

[0095] Preferably, step A103 includes:

[0096] Place the solution in a negative pressure environment of 0.07MPa-0.1MPa for 1 hour to 3 hours to allow the solution to expel bubbles;

[0097] After the negative pressure is released, the solution is allowed to stand at 23° C. to 30° C. for 12 to 24 hours to obtain an aluminum oxide thin film reaction sol.

[0098] By precisely controlling the two key process parameters of negative pressure and static temperature, bubbles in the solution can be effectively removed, the uniformity and stability of the sol can be promoted, and finally a high-quality aluminum oxide film reaction sol can be prepared. This method can ensure that the temperature detection film prepared subsequently has good performance and consistency, thereby improving the temperature detection accuracy and reliability of the induction cooker panel.

[0099] In the negative pressure degassing step, the solution is placed in a negative pressure environment of 0.07MPa-0.1MPa (tiny bubbles are easily discharged in this negative pressure environment) and left to stand for 1 hour to 3 hours. The purpose of this step is to effectively remove the bubbles in the solution and improve the uniformity and purity of the sol. The negative pressure environment can be created by a vacuum pump or other negative pressure equipment. In this environment, the bubbles in the solution will be extracted due to the pressure difference, thereby significantly reducing the bubble content in the solution.

[0100] After the negative pressure is released, the solution is allowed to stand for 12 to 24 hours at 23°C-30°C. The purpose of this step is to promote the chemical reaction in the solution so that the particles in the solution grow in an acidic environment to form a stable colloidal structure. The choice of temperature range takes into account the balance between reaction kinetics and solution stability. The temperature range of 23°C-30°C can ensure a moderate reaction rate without causing unnecessary changes in the composition of the solution due to excessively high temperatures. The standing time is set at 12 to 24 hours to give the solution enough time to complete the chemical reaction and structural adjustment. In this process, the molecules and ions in the solution will gradually reach a state of equilibrium and form a stable sol structure. The choice of this time range ensures that the reaction is fully carried out while avoiding the sol aging problem that may be caused by too long a time.

[0101] Specifically, step A2 includes:

[0102] A201. Using a metal-doped metal paste, the anode circuit 2 and the cathode circuit 3 are printed at a position outside the eddy current affected area 101 on the back of the glass substrate 1;

[0103] A202. Perform high temperature curing on the printed anode circuit 2 and cathode circuit 3.

[0104] This method can not only form a stable conductive circuit on the glass surface, but also prevent the circuit from being disturbed by the eddy current generated when the induction cooker is working, providing a reliable electrical connection basis for the subsequent preparation of temperature detection elements. High-temperature curing treatment further enhances the adhesion and durability of the circuit, ensuring the stability and reliability of the circuit during use.

[0105] The bottom view of the glass substrate 1 after completing step A2 is as follows: Figure 4 shown.

[0106] The metal paste may be silver paste, copper paste or other metal pastes with good conductivity. The doped metal may be nano silver, nano copper or other metal particles that can improve conductivity.

[0107] When the anode circuit 2 and the cathode circuit 3 are cured at high temperature, they can be cured at 250° C.-300° C. for 30 minutes, and then cleaned and dried to remove residues (such as flux components, etc.).

[0108] Preferably, see Figure 4 The anode circuit 2 includes an L-shaped circuit belt composed of a common anode belt 201 and an extension line 202, and an anode disk 203 located at one end of the extension line 202 away from the common anode belt 201. The cathode circuit 3 includes a plurality of cathode disks 301, and the cathode disks 301 are arranged at intervals along a straight line parallel to the common anode belt 201, and the cathode disks 301 and the common anode belt 201 are arranged opposite to each other on both sides of the eddy current influence area 101, and the extension line 202 extends from the side where the common anode belt 201 is located to the side where the cathode disks 301 are located.

[0109] The spaced arrangement of multiple cathode disks 301 allows the formation of multiple independent temperature detection channels, significantly improving the accuracy and resolution of temperature detection. The design of the extended circuit 202 enables convenient electrical connection between the common anode belt 201 and the cathode disk 301 (all the strip-shaped aluminum oxide films 4 share the anode, and only one anode disk 203 needs to be retained as the anode input terminal, and the anode disk 203 is close to the cathode disk 301, and wiring is performed at a close position, which is convenient for line connection), simplifying the manufacturing process.

[0110] Thus, step A3 includes:

[0111] A first mask having a plurality of parallel strip-shaped hollow regions is pasted on the back of the glass substrate 1 , so that one end of all the strip-shaped hollow regions is located on the common anode strip 201 , and the other end of each strip-shaped hollow region is located on each cathode disk 301 .

[0112] By using a special first mask on the back of the glass substrate 1 and utilizing its multiple parallel strip-shaped hollow areas, the position of the strip-shaped aluminum oxide film 4 can be precisely controlled.

[0113] The strip-shaped hollow area refers to a strip-shaped opening on the first mask, which can be formed on the mask by laser cutting or etching. Figure 5 In the figure, a is the first mask and b is the strip-shaped hollow area.

[0114] Preferably, the length, width and depth of each strip-shaped hollow area are the same, so as to make the structure and size of each strip-shaped aluminum oxide film 4 consistent, unify the conversion relationship between the temperature detection signal (such as output current) and temperature of each strip-shaped aluminum oxide film 4, and simplify the control logic. The specific size can be set according to actual needs.

[0115] Furthermore, in step A4, after coating the aluminum oxide thin film reaction sol on the strip-shaped hollow area, it can be left to stand for 15 minutes to 30 minutes, and then the thickness of the coating layer can be detected by a detection instrument to determine whether the thickness meets the design requirements. If not, it can be coated again and left to stand, and this process can be repeated until the thickness meets the design requirements.

[0116] The bottom view of the glass substrate 1 after completing step A4 is as follows: Figure 6 As shown in FIG. Wherein, c is the coating layer.

[0117] In some embodiments, step A5 comprises:

[0118] A501. Place the glass substrate 1 at 80°C-120°C for 1 hour to 3 hours to harden the coating layer (this process is called hardening treatment);

[0119] A502. After the hardening treatment is completed, the glass substrate 1 is placed in a formic acid furnace, and the temperature in the formic acid furnace is raised from 300°C to 800°C at a heating rate of 2°C / min. Oxygen is then passed into the formic acid furnace, and the temperature is maintained for 1.5 hours to allow the coating layer to react to form an aluminum oxide film (this process is the density enhancement treatment);

[0120] A503. Remove the first mask to obtain multiple strip-shaped aluminum oxide films 4.

[0121] The initial low-temperature hardening treatment can stabilize the coating layer structure, and the subsequent high-temperature treatment and oxygen introduction can promote the full reaction of the coating layer to form a high-quality aluminum oxide film. This step-by-step, finely controlled treatment method can effectively solve the problem of hardening and density improvement of aluminum oxide film coating, thereby obtaining a temperature detection element with excellent performance.

[0122] Among them, the aluminum hydroxide isopropoxide in the coating layer will decompose to obtain aluminum hydroxide at 80℃-120℃, providing a material basis for the subsequent density improvement treatment to form an aluminum oxide film. Standing for 1 hour to 3 hours can ensure that the aluminum hydroxide isopropoxide in the coating layer is repeatedly decomposed and ensure that the coating layer can be fully hardened.

[0123] In step A502, the temperature is slowly increased at a rate of 2°C / min, which can effectively prevent the coating layer from cracking or falling off due to rapid temperature changes. Under the temperature condition of 300°C-800°C, aluminum hydroxide can be decomposed to form aluminum oxide and other residual foreign matter can be volatilized, and this temperature range is within the temperature tolerance of the glass substrate 1 to avoid damage to the glass substrate 1. The step of introducing oxygen at high temperature and maintaining it for 1.5 hours is crucial to the formation of high-quality aluminum oxide film. The introduction of oxygen can promote the decomposition of aluminum hydroxide in the coating layer and the volatilization of other residual foreign matter to form a dense aluminum oxide film structure. The holding time of 1.5 hours is to ensure that the reaction is fully completed.

[0124] The bottom view of the glass substrate 1 after completing step A5 is as follows: Figure 7 shown.

[0125] Preferably, step A6 comprises:

[0126] A601. A second mask is attached to the back of the glass substrate 1; the second mask has a plurality of first hollow holes, a second hollow hole and a plurality of third hollow holes, each first hollow hole and each strip-shaped aluminum oxide film 4 is located at one end of the common anode belt 201 and is arranged one by one, the second hollow hole is opposite to the anode disk 203, and each third hollow hole is opposite to each cathode disk 301;

[0127] A602. Electrodes are prepared at the first hollow hole, the second hollow hole and the third hollow hole, so that both ends of each strip-shaped aluminum oxide film 4 are connected to the common anode belt 201 and the corresponding cathode disk 301;

[0128] A603. Remove the second mask.

[0129] By using a second mask and precisely positioned hollow holes, the problem of accuracy in electrode preparation position is solved. This method can ensure reliable connection between the strip-shaped aluminum oxide film 4 and the common anode strip 201 and cathode disk 301, thereby improving the accuracy and stability of the temperature detection function of the induction cooker panel. By preparing electrodes at specific positions, the present application realizes effective connection between the strip-shaped aluminum oxide film 4 and the anode circuit 2 and cathode circuit 3, laying the foundation for multi-point temperature detection, and helping to solve the safety hazards and shortened service life caused by single-point temperature measurement mentioned in the background technology.

[0130] Among them, the electrodes can be prepared at the first hollow hole, the second hollow hole and the third hollow hole by using processes such as electroplating, deposition, and vacuum sputtering.

[0131] For example, in some possible implementations, step A602 includes:

[0132] Sputtering a copper mother layer in the first hollow hole, the second hollow hole and the third hollow hole;

[0133] A copper layer electrode is prepared on a copper mother layer by electroplating.

[0134] The sputtered copper mother layer provides a good conductive foundation for subsequent electroplating, while the electroplated copper layer electrode further improves the conductivity and mechanical strength of the electrode. This method overcomes the limitations of traditional direct electroplating technology on the substrate and can improve the adhesion and uniformity of the electrode.

[0135] In a specific implementation, the step of sputtering the copper mother layer can adopt a variety of process methods. For example, magnetron sputtering, radio frequency sputtering or direct current sputtering and other technologies can be selected to form a copper mother layer with uniform thickness and strong adhesion at the hollow hole by controlling the sputtering power, gas pressure and the distance between the target material and the substrate. During the sputtering process, the glass substrate 1 can be placed in a vacuum chamber, and appropriate target materials and sputtering gases can be selected to ensure the conductivity and uniformity of the mother layer.

[0136] The step of electroplating the copper layer electrode can control the thickness and quality of the copper layer by adjusting the composition of the electroplating solution, the current density and the electroplating time. The electroplating solution can be a copper sulfate electrolyte, and appropriate additives can be added to improve the density and glossiness of the copper layer. During the electroplating process, pulse current or direct current can be used to obtain a copper layer electrode of the desired thickness and performance by precisely controlling the electroplating parameters.

[0137] The bottom view of the glass substrate 1 after completing step A6 is as follows: Figure 8 In the figure, d is the electrode.

[0138] Specifically, step A7 includes:

[0139] The back side of the glass substrate 1 is covered with a first high temperature resistant insulating coating 5 , and the electrodes at the anode disk 203 and the cathode disk 301 are exposed.

[0140] A first high temperature resistant insulating coating 5 is provided on the back of the glass substrate 1 to protect the back circuit and provide insulation protection, while retaining the electrodes at the anode disk 203 and the cathode disk 301 for connection with an external circuit (induction cooker circuit). This design realizes multi-point temperature detection.

[0141] The first high temperature resistant insulating coating 5 can be made of insulating materials such as epoxy resin, polyurethane or silicone resin, and can be coated by scraping, spin coating or spraying, and the coating thickness can be adjusted according to actual needs.

[0142] For example, a thermal expansion coefficient of 3.2×10 -5 / ℃-3.8×10 -5 / ℃ high temperature resistant insulating coating is applied to obtain a first high temperature resistant insulating coating 5 with a thickness of 3μm-5μm. Its thermal expansion coefficient is close to that of the glass substrate 1, which helps to reduce the thermal stress between the first high temperature resistant insulating coating 5 and the glass substrate 1 and reduce the risk of the first high temperature resistant insulating coating 5 falling off.

[0143] The bottom view of the glass substrate 1 after completing step A7 is as follows: Fig. 9 shown.

[0144] In some preferred embodiments, reference Figure 2 , after step A00 and before step A2, the method may further include the following steps:

[0145] A01. Coat a second high-temperature resistant insulating coating on the back of the glass substrate 1.

[0146] Applying the second high temperature resistant insulating coating can protect the printed display pattern 102 and prevent it from being affected by the subsequent circuit printing and coating process. It can also effectively prevent direct contact between the glass substrate 1 and the electrical components, reduce the risk of short circuits, and improve overall electrical safety. At the same time, applying the second high temperature resistant insulating coating can also provide a flat and insulating foundation for the subsequent circuit printing step, which is conducive to improving the quality and reliability of the anode circuit 2 and the cathode circuit 3.

[0147] The second high temperature resistant insulating coating can be made of insulating materials such as epoxy resin, polyurethane or silicone resin, and can be coated by scraping, spin coating or spraying, and its coating thickness can be adjusted according to actual needs.

[0148] For example, a thermal expansion coefficient of 3.2×10 -5 / ℃-3.8×10 -5 / ℃ high temperature resistant insulating coating is applied to obtain a second high temperature resistant insulating coating with a thickness of 10μm-15μm. Its thermal expansion coefficient is close to that of the glass substrate 1, which helps to reduce the thermal stress between the second high temperature resistant insulating coating and the glass substrate 1 and reduce the risk of the second high temperature resistant insulating coating falling off.

[0149] refer to Figure 3 , Figure 4 , Figure 8The present application provides an induction cooker panel with a temperature detection function, comprising a glass substrate 1, wherein the glass substrate 1 has an eddy current influence area 101 facing the induction cooker coil 7 when in use; an anode circuit 2, a cathode circuit 3 and a plurality of strip-shaped aluminum oxide films 4 are arranged on the back of the glass substrate 1, wherein the anode circuit 2 and the cathode circuit 3 are located outside the eddy current influence area 101, and each strip-shaped aluminum oxide film 4 is parallel to each other and arranged at intervals, and both ends of the strip-shaped aluminum oxide film 4 are respectively connected to the anode circuit 2 and the cathode circuit 3, and all the strip-shaped aluminum oxide films 4 pass through the eddy current influence area 101.

[0150] In some embodiments, the induction cooker panel with temperature detection function can be prepared by the aforementioned manufacturing method.

[0151] In some embodiments, the anode circuit 2 includes an L-shaped circuit belt consisting of a common anode belt 201 and an extension line 202, and an anode disk 203 located at one end of the extension line 202 away from the common anode belt 201, and the cathode circuit 3 includes a plurality of cathode disks 301, and the cathode disks 301 are arranged at intervals along a straight line parallel to the common anode belt 201, and the cathode disks 301 and the common anode belt 201 are relatively arranged on both sides of the eddy current influence area 101, and the extension line 202 extends from the side where the common anode belt 201 is located to the side where the cathode disks 301 are located.

[0152] In some embodiments, electrodes are disposed between one end of each strip-shaped aluminum oxide film 4 and the common anode strip 201 , between the other end of each strip-shaped aluminum oxide film 4 and the corresponding cathode disk 301 , and at the anode disk 203 .

[0153] Furthermore, the induction cooker panel with temperature detection function also includes a first high temperature resistant insulating coating 5, which covers the back of the glass substrate 1, the anode circuit 2, the cathode circuit 3 and the strip aluminum oxide film 4, and the electrodes at the anode disk 203 and the cathode disk 301 are exposed.

[0154] Preferably, the back of the glass substrate 1 is also covered with a second high temperature resistant insulating coating, and the anode circuit 2, cathode circuit 3, strip-shaped aluminum oxide film 4 and the first high temperature resistant insulating coating 5 are all arranged on the side of the second high temperature resistant insulating coating facing away from the glass substrate 1.

[0155] refer to Fig.10The present application provides an induction cooker, comprising a power supply circuit 6, an induction cooker coil 7, a resonant circuit 8, a power regulation circuit 9 and a glass panel 10. The induction cooker coil 7 and the resonant circuit 8 are connected in parallel as a load 11 connected to the output end of the power supply circuit 6; the glass panel 10 is the induction cooker panel with a temperature detection function as mentioned above; the power regulation circuit 9 is electrically connected to the power supply circuit 6, the load 11 and the glass panel 10, and is used to adjust the power of the load 11 according to the temperature detection signal of the glass panel 10.

[0156] In the present application, the temperature detection signal is an output current signal, and each strip-shaped aluminum oxide film 4 corresponds to one output current signal.

[0157] The power regulating circuit 9 can obtain the output current signal of the strip-shaped aluminum oxide film 4 by being electrically connected to the power supply circuit 6, the load 11 and the glass panel 10. The power regulating circuit 9 adjusts the power of the load 11 according to these current signals, thereby realizing precise control of the heating power, which is beneficial to preventing the generation of hot spots.

[0158] Among them, the induction cooker coil 7 and the resonant circuit 8 are prior arts and will not be described in detail here.

[0159] In the present application, the power regulation circuit 9 can be implemented in a variety of ways.

[0160] For example Fig.10 In the embodiment, the power regulation circuit 9 includes a switch tube 901, a PWM chip 902 and a current comparison circuit 903. The current comparison circuit 903 is electrically connected to the glass panel 10 and the PWM chip 902. The PWM chip 902 is also electrically connected to the gate of the switch tube 901. The switch tube 901 is connected in series with the load 11. One of the drain and the source of the switch tube 901 is connected to one end of the load 11, and the other of the drain and the source of the switch tube 901 is connected to an output end of the power supply circuit 6.

[0161] The current comparison circuit 903 is used to compare the output current signals of each strip-shaped aluminum oxide film 4 to generate an adjustment signal and send it to the PWM chip 902; the PWM chip 902 is used to output a PWM signal according to the adjustment signal to control the on and off of the switch tube 901.

[0162] The current comparison circuit 903 and the PWM chip 902 may adopt existing technologies, which will not be described in detail here.

[0163] Preferably, a gate drive circuit 904 may be connected between the PWM chip 902 and the gate of the switch tube 901. The gate drive circuit 904 is used to output a corresponding level signal to the gate of the switch tube 901 according to the PWM signal to drive the gate of the switch tube 901 to be turned on and off; thereby reducing the restriction on the level of the output signal of the PWM chip 902, ensuring the reliable operation of the switch tube 901, and expanding the optional range of the PWM chip 902.

[0164] In one possible implementation, see Fig.10 The power supply circuit 6 includes a rectifier bridge 601, a choke 602 and a capacitor 603. The rectifier bridge 601 and the choke 602 are connected in series, and the ends of the rectifier bridge 601 and the choke 602 that are far away from each other serve as two output ends of the power supply circuit 6 respectively, and the two ends of the capacitor 603 are respectively connected to the two output ends of the power supply circuit 6.

[0165] The function of the rectifier bridge 601 is to convert AC power into DC power; the choke 602 is mainly used to suppress the common-mode interference signal in the power supply; and the capacitor 603 is used to filter out the AC component in the output current of the power supply circuit 6 .

[0166] Preferably, the capacitor 603 is a polarized capacitor, which has the advantages of large capacity, small size, and high withstand voltage.

[0167] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0168] The above description is only an embodiment of the present application and is not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for manufacturing an induction cooker panel with a temperature detection function, used for preparing a glass panel (10) for an induction cooker, characterized in that: Includes steps: A1. Preparation of aluminum oxide thin film reaction sol; A2. Printing an anode circuit (2) and a cathode circuit (3) at a position outside the eddy current influence area (101) on the back of the glass substrate (1); the eddy current influence area (101) is an area facing the induction cooker coil (7) when in use; A3. A first mask having a plurality of parallel strip-shaped hollow regions is attached to the back of the glass substrate (1), so that the two ends of each strip-shaped hollow region are respectively located at the anode circuit (2) and the cathode circuit (3), and each strip-shaped hollow region passes through the eddy current influence area (101); A4. The strip-shaped hollow area is coated with the aluminum oxide thin film reaction sol to obtain a coating layer; A5. After hardening and density-enhancing treatment of the coating layer, the first mask is removed to obtain a plurality of strip-shaped aluminum oxide films (4); A6. preparing electrodes at both ends of each of the strip-shaped aluminum oxide films (4) so ​​that the two ends of the strip-shaped aluminum oxide films (4) are connected to the anode circuit (2) and the cathode circuit (3) respectively; A7. Encapsulate the back side of the glass substrate (1) to obtain a finished glass panel.

2. The method for manufacturing an induction cooker panel with a temperature detection function according to claim 1, characterized in that: Step A1 includes: A101. Aluminum isopropoxide is added to water and stirred to obtain an aluminum isopropoxide solution; A102. Adding an acidic gelling agent to the aluminum isopropoxide solution and stirring until the solution becomes shrunk and gelatinous; A103. Degas the solution under negative pressure and let it stand to obtain an aluminum oxide film reaction sol.

3. The method for manufacturing an induction cooker panel with a temperature detection function according to claim 2, characterized in that: The acidic gelling agent is nitric acid; Step A102 includes: At 40° C.-80° C., nitric acid is added to the aluminum isopropoxide solution and stirred to adjust the pH value of the solution to between 2 and 4 until the solution shrinks and becomes gelatinous, and stirring is stopped to obtain a suspension.

4. The method for manufacturing an induction cooker panel with a temperature detection function according to claim 2, characterized in that: Step A103 includes: Place the solution in a negative pressure environment of 0.07MPa-0.1MPa for 1 hour to 3 hours to allow the solution to expel bubbles; After the negative pressure is released, the solution is allowed to stand at 23° C. to 30° C. for 12 to 24 hours to obtain an aluminum oxide thin film reaction sol.

5. The method for manufacturing an induction cooker panel with a temperature detection function according to claim 1, characterized in that: The anode circuit (2) comprises an L-shaped circuit belt consisting of a common anode belt (201) and an extension line (202), and an anode disk (203) located at one end of the extension line (202) away from the common anode belt (201); the cathode circuit (3) comprises a plurality of cathode disks (301), the cathode disks (301) being arranged at intervals along a straight line parallel to the common anode belt (201), and the cathode disks (301) and the common anode belt (201) being arranged opposite to each other on both sides of the eddy current influence area (101), and the extension line (202) extending from a side where the common anode belt (201) is located to a side where the cathode disks (301) are located; Step A3 includes: A first mask having a plurality of parallel strip-shaped hollow regions is pasted on the back of the glass substrate (1), so that one end of all the strip-shaped hollow regions is located on the common anode strip (201), and the other end of each strip-shaped hollow region is located on each cathode disk (301).

6. The method for manufacturing an induction cooker panel with a temperature detection function according to claim 1, characterized in that: Step A5 includes: A501. The glass substrate (1) is left to stand at 80°C-120°C for 1 hour to 3 hours to harden the coating layer; A502. After the hardening treatment is completed, the glass substrate (1) is placed in a formic acid furnace, the temperature in the formic acid furnace is raised from 300°C to 800°C at a heating rate of 2°C / min, oxygen is passed into the formic acid furnace, and the temperature is maintained for 1.5 hours to allow the coating layer to react to form an aluminum oxide film; A503. Remove the first mask to obtain a plurality of strip-shaped aluminum oxide films (4).

7. The method for manufacturing an induction cooker panel with a temperature detection function according to claim 5, characterized in that: Step A6 includes: A601. A second mask is attached to the back of the glass substrate (1); the second mask has a plurality of first hollow holes, a second hollow hole and a plurality of third hollow holes, each of the first hollow holes is arranged opposite to each of the strip-shaped aluminum oxide films (4) located at one end of the common anode strip (201), the second hollow hole is arranged opposite to the anode disk (203), and each of the third hollow holes is arranged opposite to each of the cathode disks (301); A602. Electrodes are prepared at the first hollow hole, the second hollow hole and the third hollow hole, so that the two ends of each of the strip-shaped aluminum oxide films (4) are respectively connected to the common anode strip (201) and the corresponding cathode disk (301); A603. Remove the second mask.

8. The method for manufacturing an induction cooker panel with a temperature detection function according to claim 7, characterized in that: Step A602 includes: Sputtering a copper mother layer in the first hollow hole, the second hollow hole and the third hollow hole; A copper layer electrode is prepared on the copper mother layer by electroplating.

9. An induction cooker panel with a temperature detection function, comprising a glass substrate (1), wherein the glass substrate (1) has an eddy current influence area (101) facing the induction cooker coil (7) when in use; characterized in that: An anode circuit (2), a cathode circuit (3) and a plurality of strip-shaped aluminum oxide films (4) are arranged on the back of the glass substrate (1); the anode circuit (2) and the cathode circuit (3) are located outside the eddy current influence area (101); the strip-shaped aluminum oxide films (4) are parallel to each other and arranged at intervals; two ends of the strip-shaped aluminum oxide films (4) are respectively connected to the anode circuit (2) and the cathode circuit (3); and all the strip-shaped aluminum oxide films (4) pass through the eddy current influence area (101); The anode circuit (2) comprises an L-shaped circuit belt composed of a common anode belt (201) and an extension line (202), and an anode disk (203) located at one end of the extension line (202) away from the common anode belt (201); the cathode circuit (3) comprises a plurality of cathode disks (301), the cathode disks (301) being arranged at intervals along a straight line parallel to the common anode belt (201), and the cathode disks (301) and the common anode belt (201) being arranged opposite to each other on both sides of an eddy current influence area (101), and the extension line (202) extending from a side where the common anode belt (201) is located to a side where the cathode disks (301) are located; one end of each strip-shaped aluminum oxide film (4) is connected to the common anode belt (201), and the other end of each strip-shaped aluminum oxide film (4) is connected to each cathode disk (301).

10. An induction cooker, comprising a power supply circuit (6), an induction cooker coil (7), a resonant circuit (8), a power regulation circuit (9) and a glass panel (10), wherein the induction cooker coil (7) and the resonant circuit (8) are connected in parallel as a load (11) connected to an output end of the power supply circuit (6); characterized in that: The glass panel (10) is the induction cooker panel with a temperature detection function as claimed in claim 9; the power regulation circuit (9) is electrically connected to the power supply circuit (6), the load (11) and the glass panel (10), and is used to regulate the power of the load (11) according to a temperature detection signal of the glass panel (10).

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