A gallium nitride semiconductor chip integrated packaging test device

Abstract

The present invention discloses a gallium nitride semiconductor chip integrated packaging test device, which relates to the field of chip testing devices, and includes a tester body, a base is slidably mounted on the tester body, and a fixture is movably mounted on the base. It should be noted that in an embodiment of the present invention, when the lifting seat moves down for testing, the base automatically slides to the bottom of the push knife, and when the lifting seat is reset, the base automatically slides away, so that when installing or removing the chip, it is far away from the push knife, which can obtain a wide operating space, ensure the convenience and accuracy of chip installation, and avoid contact with the push knife, causing personal injury or machine damage; in addition, when the lifting seat is reset, the isolation plate is automatically closed to further isolate the push knife, and after the test is completed, the two closed boxes are closed and isolated by the lubricating sponge, so that the push knife can be lubricated and prevented from being eroded by water vapor, effectively protecting the safety of the push knife.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing devices, and in particular to a gallium nitride semiconductor chip integrated packaging testing device. Background Art

[0002] GaN chip is a semiconductor chip made of GaN material. GaN is a semiconductor material composed of two ions, nitrogen and gallium. It has properties such as wide energy band gap, strong atomic bond, high thermal conductivity, good chemical stability and strong radiation resistance. It can show excellent switching performance at high temperature. It has gradually become a key core material and electronic component supporting the independent innovation and transformation and upgrading of industries such as new generation mobile communications, new energy vehicles, high-speed rail trains, and energy Internet. GaN chips need to be tested after packaging. Chip push-pull force test is mainly used to detect the reliability and manufacturing quality between chips to ensure that the chip will not fail or be damaged during long-term use.

[0003] During the test, a push-pull force testing machine is needed to install the chip on the fixture, and then the lifting seat is controlled to rise and fall through the operating table, and the test module is controlled to move, and the push knife is driven to test the chip. However, in the actual testing process, the fixture is directly installed under the push knife, which results in the installation or adjustment of the chip being carried out under the push knife. This is not only easy to cause scratches to the staff due to operating errors, but also the fixture may collide with the push knife due to accidental collision during installation or other reasons, causing damage to the push knife. Summary of the invention

[0004] The object of the present invention is to provide a gallium nitride semiconductor chip integrated packaging and testing device to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A gallium nitride semiconductor chip integrated packaging test device, comprising a tester body, a base is slidably mounted on the tester body, a fixture is movably mounted on the base, a lifting seat is mounted on the tester body, a test module is mounted on the lifting seat, a push knife for testing is mounted on the bottom side of the test module, and an observation microscope and two operating tables for operation are also mounted on the tester body;

[0007] It also includes a synchronous telescopic device, which is installed on the tester body and is used to drive the base to telescope; the synchronous telescopic device includes a telescopic push frame, which is installed on one side of the base, and a driving rotating rod is rotatably installed on one side of the tester body, and the driving rotating rod is movably installed on the telescopic push frame, and the driving rotating rod rotates to drive the telescopic push frame to move;

[0008] It also includes an isolation shielding device, which is mounted on the tester body and is used to isolate the fixture from the push knife; the isolation shielding device includes two mounting support frames, both of which are mounted on one side of the tester body, an isolation plate is rotatably mounted between the two mounting support frames, the isolation plate is used to isolate the fixture from the push knife, and a limiting blocking rod is installed between the two mounting support frames, the limiting blocking rod is used to limit the position of the isolation plate;

[0009] A closed lubrication device is installed on the isolation and shielding device, and the closed lubrication device is used for closed lubrication of the push knife; the closed lubrication device includes two closed boxes, both of which are slidably installed on the limiting blocking rod, and lubricating sponges are detachably installed in the two closed boxes, and lubricating liquid is injected into the lubricating sponges. The lubricating sponges wrap the push knife and lubricate and rust-proof the push knife through the lubricating liquid.

[0010] Further, in a preferred embodiment of the present invention, a driving shaft is rotatably mounted on one side of the tester body, and the driving rotating rod is sleeved on the driving shaft;

[0011] A driving gear is sleeved on the driving shaft, a lifting slot is provided on the tester body, a U-shaped rack is movably installed in the lifting slot, the U-shaped rack is meshed with the driving gear, and the U-shaped rack moves vertically to drive the driving gear to rotate.

[0012] Furthermore, in a preferred embodiment of the present invention, a rotating groove is provided on one side of the tester body, and the driving shaft is rotatably installed in the rotating groove;

[0013] A rotary torsion spring is installed on the inner wall of the rotary groove, and the other end of the rotary torsion spring is installed on the driving shaft.

[0014] Furthermore, in a preferred embodiment of the present invention, a retraction buffer groove is provided on the bottom side of the lifting seat, a retraction rod is movably installed in the retraction buffer groove, and the retraction rod is in contact with the U-shaped rack;

[0015] A buffer spring is installed at the top end of the retraction rod, and the top end of the buffer spring is installed on the inner wall of the retraction buffer groove.

[0016] Furthermore, in a preferred embodiment of the present invention, a push-pull shaft is rotatably mounted on the driving rotating rod, a push-pull hole is opened on the telescopic push frame, and the push-pull shaft is movably mounted in the push-pull hole.

[0017] Furthermore, in a preferred embodiment of the present invention, the isolation shielding device further comprises a flip shaft, the flip shaft is rotatably mounted on the two mounting support frames, and the isolation plate is sleeved on the mounting support frames;

[0018] An extrusion block is installed at the end of the flip shaft, and an extrusion push frame is installed on the lifting seat. The lifting seat moves downward to drive the extrusion push frame to squeeze the extrusion block to rotate.

[0019] Furthermore, in a preferred embodiment of the present invention, both of the two mounting support frames are provided with a flip groove, and the flip shaft is rotatably mounted in the two flip grooves;

[0020] A flip torsion spring is installed on the inner wall of the flip groove, and the other end of the flip torsion spring is installed on the flip shaft.

[0021] Furthermore, in a preferred embodiment of the present invention, the closed lubrication device further comprises two extension frames, both of which are rotatably mounted on the limiting blocking rod, and the two closing boxes are movably mounted on the two extension frames respectively;

[0022] The two closing boxes are provided with stretching grooves, and the two stretching frames are rotatably mounted with stretching shafts, which are movably mounted in the two stretching grooves respectively;

[0023] The limiting blocking rod is provided with two sliding grooves, and the two closing boxes are both provided with limiting slides, which are respectively slidably installed in the two sliding grooves.

[0024] Furthermore, in a preferred embodiment of the present invention, a connecting shaft is installed on each of the two stretching frames, and both of the connecting shafts are rotatably installed on the limiting and blocking rod;

[0025] Upper push rods are installed on the two stretching frames, and the isolation plate flips over and resets to squeeze the two upper push rods to rotate.

[0026] Furthermore, in a preferred embodiment of the present invention, two installation grooves are provided on the limiting and blocking rod, and the two connecting shafts are rotatably installed in the two installation grooves respectively;

[0027] A return torsion spring is installed on the inner wall of the installation groove, and the other ends of the two return torsion springs are respectively installed on the two connecting shafts.

[0028] The beneficial effects of the gallium nitride semiconductor chip integrated packaging and testing device proposed by the present invention are:

[0029] In the present invention, by setting a synchronous telescopic device, when testing the chip, the chip is mounted on the fixture, and then the tester body is started to move the lifting seat downward. The downward movement of the lifting seat causes the telescopic push frame to drive the base to slide to the bottom of the push knife, thereby automatically pushing the chip in. The lifting seat is reset, causing the base to automatically slide away, thereby keeping away from the push knife when installing or taking out the chip. A wide operating space can be obtained to ensure convenient and accurate chip installation, while avoiding contact with the push knife to cause personal injury or machine damage.

[0030] Furthermore, in the present invention, through the provision of an isolation and shielding device, when the lifting seat moves downward, the isolation plate automatically opens and the push knife is no longer isolated, so that the test module can drive the push knife to test the chip. In addition, when the lifting seat is reset, the isolation plate automatically closes to isolate the push knife, thereby avoiding scratches or collisions caused by the push knife during operation.

[0031] Furthermore, in the present invention, by setting a closed lubrication device, after the test is completed, when the lifting seat drives the push knife to reset, under the rebound force of the two flip torsion springs, the flip shaft drives the isolation plate to reset and is blocked by the limiting blocking rod, so that the isolation plate isolates the push knife and the clamp, and the isolation plate squeezes the two upper push rods to rotate, and the upper push rods rotate in the installation groove through the connecting shaft, and drive the reset torsion spring to be stressed, and at the same time, the connecting shaft rotates to drive the extension frame to rotate, so that the extension frame drives the closing box to move through the extension shaft, and then the two closing boxes close and isolate the push knife through the lubricating sponge, so that the push knife can be lubricated and prevented from being eroded by water vapor, thereby effectively protecting the safety of the push knife. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic diagram of the three-dimensional structure of a gallium nitride semiconductor chip integrated packaging and testing device provided by an embodiment of the present invention;

[0033] Figure 2 A schematic diagram of the structure of the connection between a pusher and a sealing box and other structures of a gallium nitride semiconductor chip integrated packaging and testing device provided by an embodiment of the present invention;

[0034] Figure 3 A schematic structural diagram of a telescopic push frame and a driving rotating rod and other structures of a gallium nitride semiconductor chip integrated packaging and testing device provided by an embodiment of the present invention;

[0035] Figure 4 A partial cross-sectional structural diagram of the connection between a U-shaped rack frame and a retraction rod and other structures of a gallium nitride semiconductor chip integrated packaging and testing device provided by an embodiment of the present invention;

[0036] Figure 5 A schematic diagram of a partial cross-sectional structure of a gallium nitride semiconductor chip integrated packaging and testing device provided by an embodiment of the present invention, wherein a driving rotating rod and a driving gear and other structures are connected;

[0037] Figure 6 A schematic structural diagram of the connection between a blocking rod and a sealing box and other structures of a gallium nitride semiconductor chip integrated packaging and testing device provided by an embodiment of the present invention;

[0038] Figure 7 A schematic diagram of a partial cross-sectional structure of a gallium nitride semiconductor chip integrated packaging and testing device provided by an embodiment of the present invention, wherein an isolation plate and a flip axis and other structures are connected;

[0039] Figure 8 A schematic structural diagram of the connection between an isolation plate and a sealing box and other structures of a gallium nitride semiconductor chip integrated packaging and testing device provided by an embodiment of the present invention;

[0040] Fig. 9 A schematic structural diagram of the connection between a connecting shaft and an upper push rod and other structures of a gallium nitride semiconductor chip integrated packaging and testing device provided by an embodiment of the present invention;

[0041] Fig.10 A schematic diagram of a partial cross-sectional structure of a connection between a limiting blocking rod and a connecting shaft and other structures of a gallium nitride semiconductor chip integrated packaging and testing device provided by an embodiment of the present invention;

[0042] Fig.11 A gallium nitride semiconductor chip integrated packaging test device provided by an embodiment of the present invention Figure 6 Schematic diagram of the structure of part A.

[0043] In the figure: 1-test instrument body; 2-base; 3-clamp; 4-lifting seat; 5-test module; 6-push knife; 7-synchronous telescopic device; 701-telescopic push frame; 702-driving rotating rod; 703-driving shaft; 704-push-pull shaft; 705-push-pull hole; 706-driving gear; 707-U-shaped rack; 708-lifting slot; 709-retraction buffer slot; 710-retraction rod; 711-buffer spring; 712-rotation slot; 713-rotation torsion spring; 8-isolation shielding device; 801-installation support Frame; 802-isolation plate; 803-limit blocking rod; 804-flip shaft; 805-flip groove; 806-flip torsion spring; 807-extrusion block; 808-extrusion push frame; 9-closed lubrication device; 901-closed box; 902-lubricating sponge; 903-sliding groove; 904-stretching frame; 905-stretching groove; 906-stretching shaft; 907-connecting shaft; 908-upper push rod; 909-installation groove; 910-reset torsion spring; 911-limit slide; 10-observation microscope; 11-operating table. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0045] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0047] In addition, in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, or the orientation or position relationship in which the invented product is usually placed when in use, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0048] In addition, the terms "horizontal", "vertical", "vertical" and the like do not mean that the components are required to be absolutely vertical, but can be slightly tilted. For example, "vertical" only means that its direction is more vertical than "horizontal", and does not mean that the structure must be completely vertical, but can be slightly tilted.

[0049] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] Please refer to the attached manual Figure 1-11 An embodiment of the present invention provides a gallium nitride semiconductor chip integrated packaging test device, which includes a tester body 1, a base 2 is slidably mounted on the tester body 1, a fixture 3 is movably mounted on the base 2, a lifting seat 4 is mounted on the tester body 1, a test module 5 is mounted on the lifting seat 4, a push knife 6 for testing is mounted on the bottom side of the test module 5, and an observation microscope 10 and two operating tables 11 for operation are also mounted on the tester body 1.

[0051] More specifically, in the embodiment of the present invention, a synchronous telescopic device 7 is further included, which is installed on the tester body 1 and is used to drive the base 2 to telescope; the synchronous telescopic device 7 includes a telescopic push frame 701, which is installed on one side of the base 2, and a driving rotating rod 702 is rotatably installed on one side of the tester body 1, and the driving rotating rod 702 is movably installed on the telescopic push frame 701, and the driving rotating rod 702 rotates to drive the telescopic push frame 701 to move. It should be noted that in the embodiment of the present invention, when testing the chip, the chip is installed on the fixture 3, and then the tester body 1 is started, so that the lifting seat 4 moves downward, and then the driving rotating rod 702 drives the telescopic push frame 701 to move, and the telescopic push frame 701 drives the base 2 to slide to the bottom of the push knife 6, so that the chip is automatically pushed in.

[0052] For further information, please refer to the attached manual. Figure 6-7 , a gallium nitride semiconductor chip integrated packaging test device provided by an embodiment of the present invention also includes an isolation shielding device 8, which is installed on the tester body 1, and is used to isolate the fixture 3 and the push knife 6; the isolation shielding device 8 includes two mounting support frames 801, and the two mounting support frames 801 are both installed on one side of the tester body 1, and an isolation plate 802 is rotatably installed between the two mounting support frames 801, and the isolation plate 802 is used to isolate the fixture 3 and the push knife 6, and a limiting blocking rod 803 is installed between the two mounting support frames 801, and the limiting blocking rod 803 is used to limit the position of the isolation plate 802. It should be noted that in the embodiment of the present invention, when the lifting seat 4 moves down, the isolation plate 802 is automatically opened, and the push knife 6 is no longer isolated, so that the test module 5 can drive the push knife 6 to test the chip, and when the lifting seat 4 is reset, the isolation plate 802 is automatically closed to isolate the push knife 6, so as to avoid being scratched by the push knife 6 or hitting the push knife 6 during operation.

[0053] More specifically, in the embodiment of the present invention, a closed lubrication device 9 is installed on the isolation and shielding device 8, and the closed lubrication device 9 is used to perform closed lubrication on the push knife 6; the closed lubrication device 9 includes two closed boxes 901, and the two closed boxes 901 are both slidably installed on the limiting blocking rod 803, and the two closed boxes 901 are both detachably installed with lubricating sponges 902, and the lubricating sponges 902 are injected with lubricating liquid. The lubricating sponges 902 wrap the push knife 6 and lubricate and rust-proof the push knife 6 through the lubricating liquid. It should be noted that in the embodiment of the present invention, after the test is completed, when the lifting seat 4 drives the push knife 6 to reset, the two closed boxes 901 are closed and isolated by the lubricating sponges 902, so that the push knife 6 can be lubricated and prevented from being corroded by water vapor, thereby effectively protecting the safety of the push knife 6.

[0054] For further information, please refer to the attached manual. Figure 3-5 , a gallium nitride semiconductor chip integrated packaging test device provided by an embodiment of the present invention, a driving shaft 703 is rotatably installed on one side of the tester body 1, and a driving rotating rod 702 is sleeved on the driving shaft 703; a driving gear 706 is sleeved on the driving shaft 703, and a lifting slot 708 is provided on the tester body 1, and a U-shaped rack frame 707 is movably installed in the lifting slot 708, and the U-shaped rack frame 707 is meshed with the driving gear 706, and the U-shaped rack frame 707 moves vertically to drive the driving gear 706 to rotate. It should be noted that in the embodiment of the present invention, the lifting seat 4 moves downward and squeezes the U-shaped rack frame 707 downward through the retraction rod 710, so that the U-shaped rack frame 707 moves vertically in the lifting slot 708, and squeezes the driving gear 706 to rotate, and the driving gear 706 drives the driving rotating rod 702 to rotate through the driving shaft 703.

[0055] More specifically, in the embodiment of the present invention, a rotating groove 712 is provided on one side of the tester body 1, and the drive shaft 703 is rotatably installed in the rotating groove 712; a rotating torsion spring 713 is installed on the inner wall of the rotating groove 712, and the other end of the rotating torsion spring 713 is installed on the drive shaft 703. It should be noted that in the embodiment of the present invention, the arrangement of the rotating torsion spring 713 can help the drive shaft 703 to reset, and then the drive shaft 703 can drive the driving rod 702 to reset.

[0056] More specifically, in the embodiment of the present invention, a retraction buffer groove 709 is provided on the bottom side of the lifting seat 4, a retraction rod 710 is movably installed in the retraction buffer groove 709, and the retraction rod 710 is in contact with the U-shaped rack frame 707;

[0057] In addition, a buffer spring 711 is installed at the top of the retraction rod 710, and the top of the buffer spring 711 is installed on the inner wall of the retraction buffer groove 709. It should be noted that in the embodiment of the present invention, when the lifting seat 4 continues to move downward, the U-shaped rack frame 707 moves downward to a certain position, and at this time, the retraction rod 710 is reversely squeezed to retract, and the retraction rod 710 moves in the retraction buffer groove 709, and the buffer spring 711 is stressed, so that the lifting seat 4 will not be affected during the operation.

[0058] Please continue to refer to the instruction manual Figure 3-5 Specifically, in the embodiment of the present invention, a push-pull shaft 704 is rotatably mounted on the driving rod 702, a push-pull hole 705 is provided on the telescopic push frame 701, and the push-pull shaft 704 is movably mounted in the push-pull hole 705. It should be noted that in the embodiment of the present invention, when the driving rod 702 rotates, the telescopic push frame 701 is driven to move through the push-pull shaft 704, and then the telescopic push frame 701 pushes the base 2 to slide, and the push-pull shaft 704 slides in the push-pull hole 705.

[0059] For further information, please refer to the attached manual. Figure 6-7 , an embodiment of the present invention provides a gallium nitride semiconductor chip integrated packaging and testing device, the isolation shielding device 8 also includes a flip shaft 804, the flip shaft 804 is rotatably mounted on two mounting support frames 801, and the isolation plate 802 is sleeved on the mounting support frame 801;

[0060] In addition, a squeezing block 807 is installed at the end of the flip shaft 804, and a squeezing push frame 808 is installed on the lifting seat 4. The lifting seat 4 moves downward to drive the squeezing push frame 808 to squeeze the squeezing block 807 to rotate. It should be noted that in the embodiment of the present invention, when the lifting seat 4 moves downward, the squeezing push frame 808 is driven to squeeze the squeezing block 807 to rotate, and the squeezing block 807 rotates to drive the flip shaft 804 to rotate, so that the flip shaft 804 drives the isolation plate 802 to rotate and open.

[0061] Please continue to refer to the instruction manual Figure 6-7 Specifically, in the embodiment of the present invention, both mounting support frames 801 are provided with a flip groove 805, and the flip shaft 804 is rotatably installed in the two flip grooves 805; a flip torsion spring 806 is installed on the inner wall of the flip groove 805, and the other end of the flip torsion spring 806 is installed on the flip shaft 804. It should be noted that in the embodiment of the present invention, the provision of the flip torsion spring 806 can help the flip shaft 804 to reset, thereby enabling the flip shaft 804 to drive the isolation plate 802 to reset.

[0062] For further information, please refer to the attached manual. Figure 6 and Figure 8-11 , a gallium nitride semiconductor chip integrated packaging and testing device provided by an embodiment of the present invention, the closed lubrication device 9 also includes two stretching frames 904, the two stretching frames 904 are both rotatably mounted on the limiting blocking rod 803, and the two closed boxes 901 are respectively movably mounted on the two stretching frames 904; the two closed boxes 901 are both provided with stretching grooves 905, and the two stretching frames 904 are both rotatably mounted with stretching shafts 906, and the two stretching shafts 906 are respectively movably mounted in the two stretching grooves 905;

[0063] In addition, two slide grooves 903 are formed on the limiting blocking rod 803, and limiting slides 911 are installed on the two closed boxes 901, and the two limiting slides 911 are respectively slidably installed in the two slide grooves 903. It should be noted that in the embodiment of the present invention, when the two stretching frames 904 rotate, the two closed boxes 901 are driven to slide through the two stretching shafts 906, and the two stretching shafts 906 slide in the two stretching grooves 905, and the closed boxes 901 slide horizontally in the slide grooves 903 through the limiting slides 911.

[0064] More specifically, in the embodiment of the present invention, the two extension frames 904 are both mounted with connecting shafts 907, and the two connecting shafts 907 are both rotatably mounted on the limiting blocking rod 803; in addition, the two extension frames 904 are both mounted with upper push rods 908, and the isolation plate 802 is flipped and reset to squeeze the two upper push rods 908 to rotate. It should be noted that in the embodiment of the present invention, after the test is completed and the lifting seat 4 is moved upward, the isolation plate 802 is reset, and the isolation plate 802 squeezes the two upper push rods 908, thereby causing the two upper push rods 908 to drive the two connecting shafts 907 to rotate, and the two connecting shafts 907 drive the two closing boxes 901 through the two extension frames 904 to close the push knife 6.

[0065] Please continue to refer to the instruction manual Figure 6 and Figure 8-11 More specifically, in the embodiment of the present invention, two mounting grooves 909 are provided on the limiting blocking rod 803, and two connecting shafts 907 are respectively rotatably mounted in the two mounting grooves 909; a reset torsion spring 910 is mounted on the inner wall of the mounting groove 909, and the other ends of the two reset torsion springs 910 are respectively mounted on the two connecting shafts 907. It should be noted that in the embodiment of the present invention, when the isolation plate 802 is flipped away from the push knife 6, the two connecting shafts 907 are reset under the resilience of the two reset torsion springs 910, and the reset of the two connecting shafts 907 drives the two closing boxes 901 to slide and unfold through the two extension frames 904, so that the push knife 6 is automatically opened for use.

[0066] In summary, the working principle of a gallium nitride semiconductor chip integrated packaging and testing device provided by an embodiment of the present invention is:

[0067] When testing the chip, the chip is mounted on the fixture 3, and then the tester body 1 is started, so that the lifting seat 4 moves downward. The lifting seat 4 moves downward and squeezes the U-shaped rack frame 707 downward through the retraction rod 710, so that the U-shaped rack frame 707 moves vertically in the lifting slot 708 and squeezes the driving gear 706 to rotate. The driving gear 706 drives the driving rod 702 to rotate through the driving shaft 703. At the same time, the driving shaft 703 rotates in the rotating slot 712 and drives the rotating torsion spring 713 to be compressed. The force drives the rotating rod 702 to rotate and drives the telescopic push frame 701 to move through the push-pull shaft 704, so that the telescopic push frame 701 drives the base 2 to slide to the bottom of the push knife 6, so that the chip is automatically pushed in, and in the process of the lifting seat 4 continuing to move downward, the U-shaped rack frame 707 moves down to the right position, and the retraction rod 710 is retracted by reverse extrusion at this time, and the retraction rod 710 moves in the retraction buffer groove 709, and the buffer spring 711 is stressed, so that the lifting seat 4 will not be affected during the operation;

[0068] Furthermore, when the lifting seat 4 moves downward, the extrusion push frame 808 is driven to squeeze the extrusion block 807 to rotate, and the extrusion block 807 rotates to drive the flip shaft 804 to rotate in the two flip grooves 805, and drives the two flip torsion springs 806 to be stressed, and the rotation of the flip shaft 804 drives the isolation plate 802 to rotate, so that the isolation plate 802 is opened, and the push knife 6 is no longer isolated, so that the test module 5 can drive the push knife 6 to test the chip, and when the lifting seat 4 drives the extrusion push frame 808 to continue to move downward, the extrusion push frame 808 moves on the extrusion block 807, which does not affect the continuous downward movement of the lifting seat 4;

[0069] Furthermore, after the test is completed, when the lifting seat 4 drives the push knife 6 to reset, under the rebound force of the two flip torsion springs 806, the flip shaft 804 drives the isolation plate 802 to reset, and is blocked by the limiting blocking rod 803, so that the isolation plate 802 isolates the push knife 6 and the clamp 3, and the isolation plate 802 squeezes the two upper push rods 908 to rotate, and the upper push rods 908 rotate through the connecting shaft 907 in the installation groove 909, and drive the reset torsion spring 910 to be stressed, and at the same time, the connecting shaft 907 rotates to drive the extension frame 904 to rotate, so that the extension frame 904 drives the closing box 901 to move through the extension shaft 906, so that the two closing boxes 901 can close and isolate the push knife 6 through the lubricating sponge 902, so that the push knife 6 can be lubricated and prevented from being eroded by water vapor, thereby effectively protecting the safety of the push knife 6.

[0070] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A gallium nitride semiconductor chip integrated packaging test device, characterized in that: It includes a tester body, a base is slidably mounted on the tester body, a fixture is movably mounted on the base, a lifting seat is mounted on the tester body, a test module is mounted on the lifting seat, a push knife for testing is mounted on the bottom side of the test module, and an observation microscope and two operating tables for operation are also mounted on the tester body; It also includes a synchronous telescopic device, which is installed on the tester body and is used to drive the base to telescope; the synchronous telescopic device includes a telescopic push frame, which is installed on one side of the base, and a driving rotating rod is rotatably installed on one side of the tester body, and the driving rotating rod is movably installed on the telescopic push frame, and the driving rotating rod rotates to drive the telescopic push frame to move; It also includes an isolation shielding device, which is mounted on the tester body and is used to isolate the fixture from the push knife; the isolation shielding device includes two mounting support frames, both of which are mounted on one side of the tester body, an isolation plate is rotatably mounted between the two mounting support frames, the isolation plate is used to isolate the fixture from the push knife, and a limiting blocking rod is installed between the two mounting support frames, the limiting blocking rod is used to limit the position of the isolation plate; A closed lubricating device is installed on the isolation shielding device, and the closed lubricating device is used to perform closed lubrication on the push knife; the closed lubricating device includes two closed boxes, both of which are slidably installed on the limiting blocking rod, and lubricating sponges are detachably installed in the two closed boxes, and lubricating liquid is injected into the lubricating sponges, and the lubricating sponges wrap the push knife, and lubricate and rust-proof the push knife through the lubricating liquid; A driving shaft is rotatably mounted on one side of the tester body, and the driving rotating rod is sleeved on the driving shaft; A driving gear is sleeved on the driving shaft, a lifting slot is provided on the tester body, a U-shaped rack is movably installed in the lifting slot, the U-shaped rack is meshed with the driving gear, and the U-shaped rack moves vertically to drive the driving gear to rotate; A rotating groove is provided on one side of the tester body, and the driving shaft is rotatably installed in the rotating groove; A rotary torsion spring is installed on the inner wall of the rotary groove, and the other end of the rotary torsion spring is installed on the driving shaft; A retraction buffer groove is provided on the bottom side of the lifting seat, a retraction rod is movably installed in the retraction buffer groove, and the retraction rod is in contact with the U-shaped rack frame; A buffer spring is installed at the top end of the retraction rod, and the top end of the buffer spring is installed on the inner wall of the retraction buffer groove; A push-pull shaft is rotatably mounted on the driving rotating rod, a push-pull hole is opened on the telescopic push frame, and the push-pull shaft is movably mounted in the push-pull hole.

2. A gallium nitride semiconductor chip integrated packaging and testing device according to claim 1, characterized in that: The isolation shielding device further comprises a flip shaft, the flip shaft is rotatably mounted on the two mounting support frames, and the isolation plate is sleeved on the mounting support frames; An extrusion block is installed at the end of the flip shaft, and an extrusion push frame is installed on the lifting seat. The lifting seat moves downward to drive the extrusion push frame to squeeze the extrusion block to rotate.

3. A gallium nitride semiconductor chip integrated packaging and testing device according to claim 2, characterized in that: The two mounting support frames are each provided with a flip groove, and the flip shaft is rotatably mounted in the two flip grooves; A flip torsion spring is installed on the inner wall of the flip groove, and the other end of the flip torsion spring is installed on the flip shaft.

4. The gallium nitride semiconductor chip integrated packaging and testing device according to claim 1, characterized in that: The closed lubrication device also includes two stretching frames, both of which are rotatably mounted on the limiting blocking rod, and the two closing boxes are movably mounted on the two stretching frames respectively; The two closing boxes are provided with stretching grooves, and the two stretching frames are rotatably mounted with stretching shafts, which are movably mounted in the two stretching grooves respectively; The limiting blocking rod is provided with two sliding grooves, and the two closing boxes are both provided with limiting slides, which are respectively slidably installed in the two sliding grooves.

5. The gallium nitride semiconductor chip integrated packaging and testing device according to claim 4, characterized in that: The two stretching frames are both equipped with connecting shafts, and the two connecting shafts are both rotatably mounted on the limiting and blocking rods; Upper push rods are installed on the two stretching frames, and the isolation plate flips over and resets to squeeze the two upper push rods to rotate.

6. The gallium nitride semiconductor chip integrated packaging and testing device according to claim 5, characterized in that: The limiting and blocking rod is provided with two mounting grooves, and the two connecting shafts are rotatably mounted in the two mounting grooves respectively; A return torsion spring is installed on the inner wall of the installation groove, and the other ends of the two return torsion springs are respectively installed on the two connecting shafts.

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