Method and equipment for detecting heat conductivity coefficient of cable insulation layer and storage medium

Abstract

The invention discloses a method and equipment for detecting the heat conductivity coefficient of a cable insulation layer and a storage medium. The method comprises the following steps: constructing a steady-state thermal circuit model for a cable; the structure of the cable in the steady-state thermal circuit model sequentially comprises an outer sheath, an aluminum sheath, a buffer layer, an insulating layer and a conductor from outside to inside. Detecting a first thermal resistance value of the outer sheath; detecting a whole-line heat flow value between the outer sheath and the aluminum sheath according to the first heat resistance value; detecting a second thermal resistance value of a part of the insulating layer according to the whole-line thermal flow value; and detecting the thermal conductivity coefficient of the insulating layer according to the second thermal resistance value. According to the embodiment, the thermal conductivity coefficient of the whole insulating layer is detected through thermal parameters of part of the insulating layer by utilizing the material characteristics of the insulating layer, temperature sensors can be arranged according to different structures, the cost is low, the punching precision requirement is reduced, and the efficiency of detecting the thermal conductivity coefficient of the cable insulating layer can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electric power, and in particular to a method, a device and a storage medium for detecting thermal conductivity of a cable insulation layer. Background Art

[0002] With the development of the electric power industry, cables are more widely used in the entire transmission line and their importance is more prominent. Considering the stability and safety of cable operation, operation and maintenance personnel usually calculate the conductor temperature value through the thermal circuit model. During the operation of the cable, the voltage level of the conductor, the conductor temperature, the humidity and temperature of the cable operating environment, etc. will affect the material properties of the insulation layer, causing the thermal conductivity of the insulation layer in the thermal circuit model to change, thereby affecting the accuracy of the established thermal circuit model.

[0003] At present, there are two main methods for detecting the thermal conductivity of the insulation layer: the first method uses a material property analysis instrument to obtain the thermal conductivity of the material, and the second method infers the thermal conductivity based on the thermal parameters of the insulation layer.

[0004] The first type of detection method requires obtaining samples of the insulation material for characteristic analysis, which has high time and economic costs. The second type of method uses temperature sensors to measure thermal parameters and infer thermal conductivity, which has high requirements for drilling holes. Measuring the thermal parameters of the insulation layer requires drilling holes to the insulation outer shield. In actual situations, this solution is not feasible. Summary of the invention

[0005] In view of this, the present invention provides a method, a device and a storage medium for detecting the thermal conductivity of a cable insulation layer, so as to improve the efficiency of detecting the thermal conductivity of the cable insulation layer.

[0006] A first aspect of the present invention provides a method for detecting thermal conductivity of a cable insulation layer, comprising:

[0007] A steady-state thermal circuit model is constructed for the cable; the structure of the cable in the steady-state thermal circuit model includes, from outside to inside, an outer sheath, an aluminum sheath, a buffer layer, an insulating layer and a conductor;

[0008] detecting a first thermal resistance value of the outer sheath;

[0009] Detecting the full-line heat flow value between the outer sheath and the aluminum sheath according to the first thermal resistance value;

[0010] Detecting a second thermal resistance value of a portion of the insulation layer according to the full-line heat flow value;

[0011] The thermal conductivity of the insulating layer is detected according to the second thermal resistance value.

[0012] Optionally, the first thermal resistance value is expressed as:

[0013]

[0014] Among them, T 1 is the first thermal resistance value, ρ T is the thermal resistance coefficient of the insulating material, D OC D is the diameter of an imaginary concentric cylinder tangent to the outer side of the corrugated metal sleeve wave crest. it is the diameter of an imaginary concentric cylinder tangent to the inner side of the corrugated metal sheath trough, t 3 is the thickness of the outer sheath, t s is the thickness of the metal sleeve.

[0015] Optionally, the full line heat flow value is expressed as:

[0016]

[0017] Wherein, Q is the heat flow value of the whole line, T 1 is the first thermal resistance value, θ 0 is the temperature of the outer surface of the outer sheath, θ 1 is the temperature of the aluminum sheath.

[0018] Optionally, detecting a second thermal resistance value of a portion of the insulation layer according to the full-line heat flow value includes:

[0019] Positioning a first sampling point and a second sampling point in the insulating layer;

[0020] Detecting a temperature difference between the first sampling point and the second sampling point;

[0021] The ratio between the temperature difference value and the full-line heat flow value is calculated as a second thermal resistance value between the first sampling point and the second sampling point.

[0022] Optionally, detecting the temperature difference between the first sampling point and the second sampling point includes:

[0023] Collecting a first temperature value at the first sampling point; the first sampling point is located in the insulating layer;

[0024] Collecting a second temperature value at the second sampling point; the second sampling point is located at the shielding layer of the conductor;

[0025] The first temperature value is subtracted from the second temperature value to obtain a temperature difference value of a portion of the insulating layer.

[0026] Optionally, detecting the thermal conductivity of the insulation layer according to the second thermal resistance value includes:

[0027] Measuring an outer diameter of a portion of the insulating layer according to the first sampling point and the second sampling point;

[0028] Calculating the thermal conductivity between the first sampling point and the second sampling point according to the second thermal resistance value and an outer diameter of a portion of the insulating layer;

[0029] The thermal conductivity between the first sampling point and the second sampling point is set as the thermal conductivity of the insulating layer.

[0030] Optionally, measuring the outer diameter of part of the insulating layer according to the first sampling point and the second sampling point includes:

[0031] Querying the inner diameter of the insulating layer;

[0032] measuring a first distance from the first sampling point to an outer surface of the outer sheath;

[0033] measuring a second distance from the second sampling point to the outer surface of the outer sheath;

[0034] The inner diameter of the insulating layer is added with twice the distance difference to obtain the outer diameter of part of the insulating layer; the distance difference is the difference between the second distance and the first distance.

[0035] Optionally, the thermal conductivity is expressed as:

[0036]

[0037] Wherein, λ is the thermal conductivity, ′ 3 is the second thermal resistance value, x 1 is the first distance, x 2 is the second distance, and R is the inner diameter of the insulating layer.

[0038] A second aspect of the present invention provides a device for detecting thermal conductivity of a cable insulation layer, comprising:

[0039] A cable modeling module is used to construct a steady-state thermal circuit model for the cable; the structure of the cable in the steady-state thermal circuit model includes an outer sheath, an aluminum sheath, a buffer layer, an insulating layer and a conductor from the outside to the inside;

[0040] A first thermal resistance detection module, used for detecting a first thermal resistance value of the outer sheath;

[0041] A full-line heat flow value detection module, used for detecting the full-line heat flow value between the outer sheath and the aluminum sheath according to the first thermal resistance value;

[0042] A second thermal resistance detection module, used for detecting a second thermal resistance value of a portion of the insulation layer according to the full-line heat flow value;

[0043] A thermal conductivity detection module is used to detect the thermal conductivity of the insulation layer according to the second thermal resistance value.

[0044] Optionally, the first thermal resistance value is expressed as:

[0045]

[0046] Among them, T 1 is the first thermal resistance value, ρ T is the thermal resistance coefficient of the insulating material, D OC D is the diameter of an imaginary concentric cylinder tangent to the outer side of the corrugated metal sleeve wave crest. it is the diameter of an imaginary concentric cylinder tangent to the inner side of the corrugated metal sheath trough, t 3 is the thickness of the outer sheath, t s is the thickness of the metal sleeve.

[0047] Optionally, the full line heat flow value is expressed as:

[0048]

[0049] Wherein, Q is the heat flow value of the whole line, T 1 is the first thermal resistance value, θ 0 is the temperature of the outer surface of the outer sheath, θ 1 is the temperature of the aluminum sheath.

[0050] Optionally, the second thermal resistance detection module includes:

[0051] A sampling point positioning module, used for positioning a first sampling point and a second sampling point in the insulating layer;

[0052] A temperature difference value calculation module, used to detect the temperature difference value between the first sampling point and the second sampling point;

[0053] The second thermal resistance value calculation module is used to calculate the ratio between the temperature difference value and the full-line heat flow value as the second thermal resistance value between the first sampling point and the second sampling point.

[0054] Optionally, the temperature difference value calculation module includes:

[0055] A first temperature value acquisition module, used for acquiring a first temperature value at the first sampling point; the first sampling point is located in the insulating layer;

[0056] A second temperature value acquisition module, used for acquiring a second temperature value at the second sampling point; the second sampling point is located at the shielding layer of the conductor;

[0057] The temperature subtraction module is used to subtract the first temperature value from the second temperature value to obtain a temperature difference value of a part of the insulation layer.

[0058] Optionally, the thermal conductivity detection module includes:

[0059] An outer diameter measuring module, used for measuring an outer diameter of a portion of the insulating layer according to the first sampling point and the second sampling point;

[0060] a thermal conductivity calculation module, configured to calculate the thermal conductivity between the first sampling point and the second sampling point according to the second thermal resistance value and an outer diameter of a portion of the insulating layer;

[0061] The thermal conductivity setting module is used to set the thermal conductivity between the first sampling point and the second sampling point as the thermal conductivity of the insulating layer.

[0062] Optionally, the outer diameter measurement module includes:

[0063] An inner diameter query module, used to query the inner diameter of the insulating layer;

[0064] A first distance measurement module, used for measuring a first distance from the first sampling point to the outer surface of the outer sheath;

[0065] A second distance measurement module, used for measuring a second distance from the second sampling point to the outer surface of the outer sheath;

[0066] The outer diameter calculation module is used to add twice the distance difference to the inner diameter of the insulating layer to obtain the outer diameter of the insulating layer; the distance difference is the difference between the second distance and the first distance.

[0067] Optionally, the thermal conductivity is expressed as:

[0068]

[0069] Where λ is the thermal conductivity, T′ 3 is the second thermal resistance value, x 1 is the first distance, x 2 is the second distance, and R is the inner diameter of the insulating layer.

[0070] A third aspect of the present invention provides an electronic device, the electronic device comprising:

[0071] at least one processor; and

[0072] a memory communicatively connected to the at least one processor; wherein,

[0073] The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can perform the method for detecting thermal conductivity of a cable insulation layer as described in the first aspect above.

[0074] A fourth aspect of the present invention provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the method for detecting thermal conductivity of a cable insulation layer as described in the first aspect above.

[0075] A fifth aspect of the present invention provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the method for detecting thermal conductivity of a cable insulation layer as described in the first aspect above is implemented.

[0076] In this embodiment, a steady-state thermal circuit model is constructed for the cable; the structure of the cable in the steady-state thermal circuit model includes an outer sheath, an aluminum sheath, a buffer layer, an insulating layer and a conductor from the outside to the inside; a first thermal resistance value is detected for the outer sheath; the full-line heat flow value is detected between the outer sheath and the aluminum sheath based on the first thermal resistance value; a second thermal resistance value is detected for part of the insulating layer based on the full-line heat flow value; and the thermal conductivity coefficient of the insulating layer is detected based on the second thermal resistance value. This embodiment utilizes the material properties of the insulating layer and detects the thermal conductivity coefficient of the insulating layer as a whole through the thermal parameters of part of the insulating layer. Temperature sensors can be arranged for different structures, which is not only low-cost, but also reduces the precision requirements for punching holes, and can effectively improve the efficiency of detecting the thermal conductivity coefficient of the cable insulation layer.

[0077] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0078] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0079] Figure 1 This is a flow chart of a method for detecting thermal conductivity of a cable insulation layer provided in Embodiment 1 of the present invention.

[0080] Figure 2 It is a structural schematic diagram of a steady-state thermal circuit model provided in Example 1 of the present invention.

[0081] Figure 3It is a structural schematic diagram of a cable provided in Embodiment 1 of the present invention.

[0082] Figure 4 It is a structural schematic diagram of a device for detecting thermal conductivity of a cable insulation layer provided in Embodiment 2 of the present invention.

[0083] Figure 5 It is a structural schematic diagram of an electronic device provided in Embodiment 3 of the present invention. DETAILED DESCRIPTION

[0084] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0085] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present invention described herein can cover sequential implementations other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0086] Embodiment 1

[0087] See also Figure 1 , shows a flow chart of a method for detecting thermal conductivity of a cable insulation layer provided by a first embodiment of the present invention. The method can be performed by a device for detecting thermal conductivity of a cable insulation layer. The device for detecting thermal conductivity of a cable insulation layer can be implemented in the form of hardware and / or software. The device for detecting thermal conductivity of a cable insulation layer can be configured in an electronic device. Figure 1 As shown, the method includes:

[0088] Step 101: construct a steady-state thermal circuit model for the cable.

[0089] In this embodiment, if Figure 2As shown in FIG. 1 , a steady-state thermal circuit model can be established based on Fourier's heat transfer law and combined with the measured structural parameters of each layer of the cable. In the steady-state thermal circuit model, the structure of the cable includes the outer sheath M 1 , Aluminum sheath M 2 , buffer layer M 3 , insulation layer M 4 With conductor M 5 .

[0090] Among them, the insulating layer M 4 Typically XLPE (cross-linked polyethylene).

[0091] In the steady-state thermal circuit model, θ 0 is the temperature of the outer surface of the outer sheath, θ 1 is the temperature of the aluminum sheath, θ 2 is the temperature of the outer surface of the insulation layer, θ 3 is the temperature of the conductor, θ 0 ,θ 1 ,θ 2 ,θ 3 The unit can be ℃, T 1 is the thermal resistance of the outer sheath, T 2 is the thermal resistance of the buffer layer, T 3 is the thermal resistance of the insulation layer, T 1 , T 2 , T 3 The unit of can be K·m / W, Q is the full-line heat flow value of the conductor, and the unit can be W / m.

[0092] Step 102: Detect a first thermal resistance value of the outer sheath.

[0093] In this embodiment, the first thermal resistance value of the outer sheath can be detected according to standard specifications using parameters detectable by the steady-state thermal circuit model and preset hyperparameters.

[0094] In a specific implementation, the first thermal resistance value of the outer sheath is expressed as:

[0095]

[0096] Among them, T 1 is the first thermal resistance value of the outer sheath, ρ T is the thermal resistance coefficient of the insulating material (in K·m / W), D OC D is the diameter of an imaginary concentric cylinder tangent to the outer side of the corrugated metal sleeve crest (in mm), it is the diameter of an imaginary concentric cylinder tangent to the inner side of the corrugated metal sheath trough (in mm), t 3 is the thickness of the outer sheath, t s is the thickness of the metal sleeve.

[0097] Step 103: Detect the full-line heat flow value between the outer sheath and the aluminum sheath according to the first thermal resistance value.

[0098] In this embodiment, on the one hand, the outer sheath can be reasonably connected to the surface of the cable to measure the temperature θ of the outer surface of the outer sheath. 0 On the other hand, for the aluminum sheath, an electric drill can be used to drill holes on the outside of the aluminum sheath, and a temperature sensor can be used to detect the temperature of the aluminum sheath. 1 , thus the full-line heat flux Q is calculated from the first thermal resistance value of the outer sheath, the temperature of the aluminum sheath and the temperature of the outer surface of the outer sheath.

[0099] Generally, in order to ensure the accuracy of the temperature sensor measurement data, the temperature sensor can be connected to the same experimental instrument for calibration before using it.

[0100] In the specific implementation, the full line heat flow value is expressed as:

[0101]

[0102] Among them, Q is the heat flow value of the whole line, T 1 is the first thermal resistance value of the outer sheath (in K·m / W), θ 0 is the temperature of the outer surface of the outer sheath (in °C), θ 1 is the temperature of the aluminum sheath (in °C).

[0103] Step 104 , detecting a second thermal resistance value of a portion of the insulation layer according to the heat flow value of the entire line.

[0104] In this embodiment, based on the analysis of the insulation layer temperature difference detection method, a solution for improving the temperature sensor arrangement position is proposed, and the second thermal resistance value of a part of the insulation layer is detected according to the full-line heat flow value.

[0105] In one embodiment of the present invention, step 104 may include the following steps:

[0106] Step 1041 , locating a first sampling point and a second sampling point in the insulating layer.

[0107] In this embodiment, if Figure 3 As shown, the structure of the cable includes the outer skin N from the outside to the inside. 5 、Outer sheath M 1 , Aluminum sheath M 2 , air gap layer N 1 , Wrapping tape N 2 , insulation layer M 4 Shielding layer N 3 , insulation layer M 4 、Conductor M 5 Shielding layer N 4With conductor M 5 .

[0108] Among them, the air gap layer N 1 , Wrapping tape N 2 Can characterize the buffer layer M 3 .

[0109] In the insulation layer M 4 The first sampling point D can be located by drilling holes or other methods. 1 With the second sampling point D 2 , the first sampling point D 1 With the second sampling point D 2 Distributed in the radial direction of the cable at 180°.

[0110] Among them, the first sampling point D 1 Located in the insulation layer M 4 , and does not reach the conductor M 5 , record the first sampling point D 1 With outer skin 5 The first distance between 1 (Unit: mm).

[0111] In addition, the second sampling point D 2 Located on conductor M 5 Shielding layer N 4 , record the first sampling point D 1 With outer skin 5 The second distance between 2 (Unit: mm).

[0112] At this time, (x 2 -x 1 ) is the thickness of the partial insulation layer.

[0113] Step 1042: Detect the temperature difference between the first sampling point and the second sampling point.

[0114] In this embodiment, the temperature difference between the first sampling point and the second sampling point may be detected and recorded as a temperature difference value.

[0115] In a specific implementation, a temperature sensor and a data recorder may be used to collect a first temperature value at a first sampling point, and a second temperature value at a second sampling point, and the first temperature value may be subtracted from the second temperature value to obtain a temperature difference value of a portion of the insulation layer.

[0116] Step 1043: Calculate the ratio between the temperature difference value and the heat flow value of the entire line as the second thermal resistance value between the first sampling point and the second sampling point.

[0117] In this embodiment, the ratio between the temperature difference value between the first sampling point and the second sampling point and the heat flow value of the entire line may be calculated as the second thermal resistance value between the first sampling point and the second sampling point.

[0118] Then, the second thermal resistance value between the first sampling point and the second sampling point can be expressed as:

[0119]

[0120] Among them, T′ 3 is the second thermal resistance between the first sampling point and the second sampling point, θ′ 2 is the first temperature value, θ 3 is the second temperature value, and Q is the heat flow value of the entire line.

[0121] Step 105: detecting the thermal conductivity of the insulation layer according to the second thermal resistance value.

[0122] In this embodiment, based on Fourier's heat transfer law, the thermal conductivity of the insulating layer is detected using the second thermal resistance value.

[0123] In one embodiment of the present invention, step 105 may include the following steps:

[0124] Step 1051: Measure the outer diameter of a portion of the insulation layer according to the first sampling point and the second sampling point.

[0125] In this embodiment, the outer diameter of a portion of the insulating layer may be measured according to the first sampling point and the second sampling point using standard specifications.

[0126] In the specific implementation, Figure 3 As shown, the inner diameter R (in mm) of the insulating layer can be queried. On the one hand, the measurement is performed from the first sampling point D 1 To the outer surface of the outer sheath (outer skin N 5 ) between the first distance x 1 On the other hand, the measurement from the second sampling point D 2 To the outer surface of the outer sheath (outer skin N 5 ) 2 .

[0127] The inner diameter R of the insulating layer plus twice the distance difference is obtained to obtain the outer diameter of the partial insulating layer; wherein the distance difference is the second distance x 2 Subtract the difference x from the first distance 1 At this time, the outer diameter of the insulation layer is expressed as R+2(x 2 -x 1 )(unit: mm).

[0128] Step 1052: Calculate the thermal conductivity between the first sampling point and the second sampling point according to the second thermal resistance value and the outer diameter of a portion of the insulating layer.

[0129] In this embodiment, the thermal conductivity between the first sampling point and the second sampling point can be calculated according to the second thermal resistance value and the outer diameter of a portion of the insulating layer using standard specifications.

[0130] In a specific implementation, the thermal conductivity is expressed as:

[0131]

[0132] Where λ is the thermal conductivity, T′ 3 is the second thermal resistance value, x 1 is the first distance, x 2 is the second distance, and R is the inner diameter of the insulating layer.

[0133] Step 1053: Set the thermal conductivity between the first sampling point and the second sampling point as the thermal conductivity of the insulating layer.

[0134] According to the material properties of the insulating layer, the thermal conductivity of the entire insulating layer is consistent with the thermal conductivity of the partial insulating layer. Therefore, the thermal conductivity between the first sampling point and the second sampling point can be set as the thermal conductivity of the insulating layer.

[0135] In this embodiment, a steady-state thermal circuit model is constructed for the cable; the structure of the cable in the steady-state thermal circuit model includes an outer sheath, an aluminum sheath, a buffer layer, an insulating layer and a conductor from the outside to the inside; a first thermal resistance value is detected for the outer sheath; the full-line heat flow value is detected between the outer sheath and the aluminum sheath based on the first thermal resistance value; a second thermal resistance value is detected for part of the insulating layer based on the full-line heat flow value; and the thermal conductivity coefficient of the insulating layer is detected based on the second thermal resistance value. This embodiment utilizes the material properties of the insulating layer and detects the thermal conductivity coefficient of the insulating layer as a whole through the thermal parameters of part of the insulating layer. Temperature sensors can be arranged for different structures, which is not only low-cost, but also reduces the precision requirements for punching holes, and can effectively improve the efficiency of detecting the thermal conductivity coefficient of the cable insulation layer.

[0136] Embodiment 2

[0137] See also Figure 4 , shows a schematic diagram of the structure of a device for detecting thermal conductivity of a cable insulation layer provided by Embodiment 2 of the present invention. Figure 4 As shown, the device comprises:

[0138] The cable modeling module 401 is used to construct a steady-state thermal circuit model for the cable; the structure of the cable in the steady-state thermal circuit model includes an outer sheath, an aluminum sheath, a buffer layer, an insulating layer and a conductor from the outside to the inside;

[0139] A first thermal resistance detection module 402, used to detect a first thermal resistance value of the outer sheath;

[0140] A full-line heat flow value detection module 403, used for detecting the full-line heat flow value between the outer sheath and the aluminum sheath according to the first thermal resistance value;

[0141] A second thermal resistance detection module 404, configured to detect a second thermal resistance value of a portion of the insulation layer according to the full-line heat flow value;

[0142] The thermal conductivity detection module 405 is used to detect the thermal conductivity of the insulation layer according to the second thermal resistance value.

[0143] In one embodiment of the present invention, the first thermal resistance value is expressed as:

[0144]

[0145] Among them, T 1 is the first thermal resistance value, ρ T is the thermal resistance coefficient of the insulating material, D OC D is the diameter of an imaginary concentric cylinder tangent to the outer side of the corrugated metal sleeve wave crest. it is the diameter of an imaginary concentric cylinder tangent to the inner side of the corrugated metal sheath trough, t 3 is the thickness of the outer sheath, t s is the thickness of the metal sleeve.

[0146] In one embodiment of the present invention, the full-line heat flow value is expressed as:

[0147]

[0148] Wherein, Q is the heat flow value of the whole line, T 1 is the first thermal resistance value, θ 0 is the temperature of the outer surface of the outer sheath, θ 1 is the temperature of the aluminum sheath.

[0149] In one embodiment of the present invention, the second thermal resistance value detection module 404 includes:

[0150] A sampling point positioning module, used for positioning a first sampling point and a second sampling point in the insulating layer;

[0151] A temperature difference value calculation module, used to detect the temperature difference value between the first sampling point and the second sampling point;

[0152] The second thermal resistance value calculation module is used to calculate the ratio between the temperature difference value and the full-line heat flow value as the second thermal resistance value between the first sampling point and the second sampling point.

[0153] In one embodiment of the present invention, the temperature difference value calculation module includes:

[0154] A first temperature value acquisition module, used for acquiring a first temperature value at the first sampling point; the first sampling point is located in the insulating layer;

[0155] A second temperature value acquisition module, used for acquiring a second temperature value at the second sampling point; the second sampling point is located at the shielding layer of the conductor;

[0156] The temperature subtraction module is used to subtract the first temperature value from the second temperature value to obtain a temperature difference value of a part of the insulation layer.

[0157] In one embodiment of the present invention, the thermal conductivity detection module 405 includes:

[0158] An outer diameter measuring module, used for measuring an outer diameter of a portion of the insulating layer according to the first sampling point and the second sampling point;

[0159] a thermal conductivity calculation module, configured to calculate the thermal conductivity between the first sampling point and the second sampling point according to the second thermal resistance value and an outer diameter of a portion of the insulating layer;

[0160] The thermal conductivity setting module is used to set the thermal conductivity between the first sampling point and the second sampling point as the thermal conductivity of the insulating layer.

[0161] In one embodiment of the present invention, the outer diameter measurement module comprises:

[0162] An inner diameter query module, used to query the inner diameter of the insulating layer;

[0163] A first distance measurement module, used for measuring a first distance from the first sampling point to the outer surface of the outer sheath;

[0164] A second distance measurement module, used for measuring a second distance from the second sampling point to the outer surface of the outer sheath;

[0165] The outer diameter calculation module is used to add twice the distance difference to the inner diameter of the insulating layer to obtain the outer diameter of part of the insulating layer; the distance difference is the difference between the second distance and the first distance.

[0166] In one embodiment of the present invention, the thermal conductivity is expressed as:

[0167]

[0168] Where λ is the thermal conductivity, T′ 3 is the second thermal resistance value, x1 is the first distance, x 2 is the second distance, and R is the inner diameter of the insulating layer.

[0169] The device for detecting the thermal conductivity of a cable insulation layer provided in an embodiment of the present invention can execute the method for detecting the thermal conductivity of a cable insulation layer provided in any embodiment of the present invention, and has functional modules and beneficial effects corresponding to the method for detecting the thermal conductivity of a cable insulation layer.

[0170] Embodiment 3

[0171] See also Figure 5 , showing a schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workbenches, personal digital assistants, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0172] like Figure 5 As shown, the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0173] A number of components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0174] The processor 11 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as a method for detecting thermal conductivity of a cable insulation layer.

[0175] In some embodiments, the method for detecting thermal conductivity of the cable insulation layer can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the method for detecting thermal conductivity of the cable insulation layer described above can be performed. Alternatively, in other embodiments, the processor 11 can be configured to execute the method for detecting thermal conductivity of the cable insulation layer in any other appropriate manner (for example, by means of firmware).

[0176] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0177] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0178] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0179] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0180] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0181] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0182] Embodiment 4

[0183] An embodiment of the present invention further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the method for detecting thermal conductivity of a cable insulation layer provided by any embodiment of the present invention is implemented.

[0184] In the process of implementation, the computer program product can be written in one or more programming languages ​​or a combination thereof to perform the computer program code of the present invention, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (for example, using an Internet service provider to connect through the Internet).

[0185] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0186] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for detecting thermal conductivity of a cable insulation layer, characterized in that: include: Construct a steady-state thermal circuit model for the cable; The structure of the cable in the steady-state thermal circuit model includes, from outside to inside, an outer sheath, an aluminum sheath, a buffer layer, an insulating layer and a conductor; detecting a first thermal resistance value of the outer sheath; Detecting the full-line heat flow value between the outer sheath and the aluminum sheath according to the first thermal resistance value; Detecting a second thermal resistance value of a portion of the insulation layer according to the full-line heat flow value; The thermal conductivity of the insulating layer is detected according to the second thermal resistance value.

2. The method according to claim 1, characterized in that The first thermal resistance value is expressed as: Wherein, T1 is the first thermal resistance value, ρ T is the thermal resistance coefficient of the insulating material, D OC D is the diameter of an imaginary concentric cylinder tangent to the outer side of the corrugated metal sleeve wave crest. it is the diameter of an imaginary concentric cylinder tangent to the inner side of the corrugated metal sheath trough, t3 is the thickness of the outer sheath, t s is the thickness of the metal sleeve.

3. The method according to claim 2, characterized in that The full line heat flow value is expressed as: Wherein, Q is the full-line heat flux value, T1 is the first thermal resistance value, θ0 is the temperature of the outer surface of the outer sheath, and θ1 is the temperature of the aluminum sheath.

4. The method according to claim 1, characterized in that: The detecting a second thermal resistance value of a portion of the insulation layer according to the full-line heat flow value comprises: Positioning a first sampling point and a second sampling point in the insulating layer; Detecting a temperature difference between the first sampling point and the second sampling point; The ratio between the temperature difference value and the full-line heat flow value is calculated as a second thermal resistance value between the first sampling point and the second sampling point.

5. The method according to claim 4, characterized in that The detecting the temperature difference between the first sampling point and the second sampling point includes: Collecting a first temperature value at the first sampling point; the first sampling point is located in the insulating layer; Collecting a second temperature value at the second sampling point; the second sampling point is located at the shielding layer of the conductor; The first temperature value is subtracted from the second temperature value to obtain a temperature difference value of a portion of the insulating layer.

6. The method according to claim 4, characterized in that The detecting the thermal conductivity of the insulating layer according to the second thermal resistance value comprises: Measuring an outer diameter of a portion of the insulating layer according to the first sampling point and the second sampling point; Calculating the thermal conductivity between the first sampling point and the second sampling point according to the second thermal resistance value and an outer diameter of a portion of the insulating layer; The thermal conductivity between the first sampling point and the second sampling point is set as the thermal conductivity of the insulating layer.

7. The method according to claim 6, characterized in that The measuring of the outer diameter of a portion of the insulating layer according to the first sampling point and the second sampling point comprises: Querying the inner diameter of the insulating layer; measuring a first distance from the first sampling point to an outer surface of the outer sheath; measuring a second distance from the second sampling point to the outer surface of the outer sheath; The inner diameter of the insulating layer is added with twice the distance difference to obtain the outer diameter of part of the insulating layer; the distance difference is the difference between the second distance and the first distance.

8. The method according to claim 7, characterized in that The thermal conductivity is expressed as: Wherein, λ is the thermal conductivity, ′3 is the second thermal resistance value, x1 is the first distance, x2 is the second distance, and R is the inner diameter of the insulating layer.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor so that the at least one processor can perform the method for detecting thermal conductivity of a cable insulation layer according to any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method for detecting thermal conductivity of a cable insulation layer according to any one of claims 1 to 8 is implemented.

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