Chip test base

Abstract

A chip testing base comprises a base main bottom plate, a rotating shaft sleeve, a pressing piece and a chip positioning frame. Wherein the rotating shaft sleeve is provided with two sections which are coaxially fixed at one end of the upper surface of the base main bottom plate. The two ends of the opening end of the pressing piece are bent to form rotating shafts and installed in the rotating shaft sleeve, and the pressing piece can rotate by 180 degrees through cooperation of the rotating shafts and the rotating shaft sleeve. The other end of the pressing piece is attached to the base main bottom plate. The chip positioning frame is fixed on the upper surface of the base main bottom plate except the two ends of the opening part; and the opening end of the opening part is close to the fixed section of the pressing piece. The pressing piece is made of a steel wire, the process is simple and convenient, the pressing piece can be freely disassembled and assembled, the pressing piece is suitable for chips of various sizes, chip replacement in the chip testing process is facilitated, the chip disassembling / assembling time is shortened by 30%, the chip damage rate in the chip testing process is reduced by 70%, and therefore the service life of the tested chip is prolonged.

Description

Technical Field

[0001] The invention relates to a chip testing base, in particular to a low-cost testing base which is easy to replace and not prone to damaging the chip. Background Art

[0002] The BGA test socket is a test socket for BGA chips, which physically connects the chip to be tested with the test equipment to perform functional verification and performance testing on the chip. The BGA chip test socket is mainly composed of three parts: 1. Carrier: used to carry the chip to ensure a stable connection between the chip and the test socket; 2. Connector: connects the test socket to the test instrument to achieve electrical signal transmission; 3. Clamp: used to fix the chip and the carrier to ensure stability and safety during the test. Among them, the clamp of the BGA test socket generally adopts a flip-top knob fixing mechanism, which can easily and quickly place the chip to be tested on the test socket, and also ensure that the chip will not move or tilt during the test. At present, when the company debugs and verifies the products, the chip test sockets used are all purchased parts, which are relatively expensive; on the other hand, the flip-top knob fixing mechanism frequently opens and closes the cover, which makes the damage rate of the BGA chip extremely high.

[0003] Therefore, the BGA chip test base is improved to solve the above-mentioned problems. Summary of the invention

[0004] In order to overcome the shortcomings of the prior art that the chip has a very high damage rate and is difficult to replace, the present invention provides a chip test base.

[0005] The present invention comprises a base main bottom plate, a rotating shaft sleeve, a clamping piece, and a chip positioning frame. The rotating shaft sleeve has two sections, one end of which is coaxially fixed to the upper surface of the base main bottom plate. The two ends of the opening end of the clamping piece are bent into a rotating shaft and installed in the rotating shaft sleeve, and the clamping piece can be rotated 180 degrees through the cooperation between the two. The other end of the clamping piece is attached to the base main bottom plate; the chip positioning frame is fixed to the upper surface of the base main bottom plate except for the two ends of the opening part; the opening end of the opening part is close to the fixed section of the clamping piece.

[0006] The clamping member is made of a steel wire with a diameter of 1mm, which is bent into two parallel sections, forming a "J" shape as a whole. The middle part of the clamping member is a clamping section that matches the chip to be tested; both ends of the clamping section are force-applying sections, namely the first force-applying section and the second force-applying section; the two ends of one end of the first force-applying section of the clamping member are bent into a rotating shaft that matches the rotating sleeve, and the fixed section connected to one end of the second force-applying section matches the two ends of the open end of the chip positioning frame. The first force-applying section, the second force-applying section and the clamping section are bent into a bow shape.

[0007] The distance W between the two parallel sections in the clamping member must satisfy 1 / 2W0<W<W0. The length L of the clamping section in the clamping member must satisfy 1 / 2L0<L<L0. W0 is the width of the chip under test; L0 is the length of the chip under test.

[0008] The angle between the two ends of the first force-applying section and the main bottom plate of the base is α, 30°≤α≤90°; the upward bending angle of the first force-applying section is β, 30°≤β≤60°; the angle between the clamping section and the second force-applying section is γ, 120°≤γ≤160°; the downward bending angle of the second force-applying section is θ, 90°≤θ≤120°.

[0009] The chip positioning frame is rectangular and made of a steel wire with a diameter of 1 mm. An opening is provided on one short side of the chip positioning frame, and two ends of the opening extend outward to form a pressure head for fixing the chip to be tested. The four corners of the chip positioning frame are bent and protruded to avoid the four corners of the chip to be tested.

[0010] The length×width of the inner frame of the chip positioning frame is slightly larger than the length×width of the chip under test, and when the chip under test is installed in the chip positioning frame, the two are clearance-matched;

[0011] When testing a chip, the chip to be tested is placed in the chip positioning frame; the pressing piece is rotated to make the fixed section fit on the upper surface of the main bottom plate of the base, the pressing section fits on the chip surface, the two ends of the chip positioning frame extending outward are bent and tightly buckled on the fixed ends of the pressing piece, and the BGA chip to be tested is pressed by the pressing section. At this point, the chip to be tested is fixed on the chip test base.

[0012] In order to overcome the shortcomings of the existing chip test base that it is difficult to install / disassemble the chip, the chip is easily damaged, and the cost is high, the present invention provides a chip test base.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. Since the pressing piece is a pressing steel wire, the manufacturing process is simple and convenient, and it can be freely disassembled and installed, so the chip test base can be flexibly adapted to chips of various sizes.

[0015] 2. The pressing parts in the chip test base are easy to flip and open, making the chip easy to disassemble and install. The protruding structure of the four corners of the chip positioning frame completely avoids the four corners of the chip under test, which is not easy to damage the chip while meeting the fixation requirements. It is conducive to chip replacement during chip testing, shortening the chip removal / installation time by 30% and reducing the chip damage rate during chip testing by 70%, thereby increasing the service life of the chip under test.

[0016] 3. Currently, the company's chip test bases are all purchased parts, with a purchase cost of about 150 yuan. The cost of the new test base will be reduced by 80%. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the present invention.

[0018] Figure 2 It is a structural diagram of the clamping parts.

[0019] Figure 3 yes Figure 2 Side view of.

[0020] Figure 4 This is the chip positioning frame structure diagram.

[0021] Figure 5 This is the matching diagram of the clamping piece and the sleeve.

[0022] Figure 6 This is the matching diagram of the chip positioning frame and the clamping piece.

[0023] Figure 7 This is the front view of the chip test base after chip assembly.

[0024] Figure 8 It is a top view of the chip test base after chip assembly.

[0025] Fig. 9 It is a side view of the chip test base after chip assembly.

[0026] In the figure: 1. Main bottom plate of the base; 2. Rotating sleeve; 3. Pressing member; 4. Chip positioning frame; 5. First force application section; 6. Second force application section; 7. Pressing section; 8. Fixed section DETAILED DESCRIPTION

[0027] The purpose of this embodiment is to provide a low-cost BGA chip test base that is easy to install / disassemble and not prone to damaging the chip.

[0028] This embodiment is a chip test base, such as Figure 1 As shown, it includes a base main bottom plate 1, a rotating shaft sleeve 2, a clamping member 3, and a chip positioning frame 4. The rotating shaft sleeve 2 has two sections, which are coaxially fixed to one end of the upper surface of the base main bottom plate. The two ends of the opening end of the clamping member 3 are bent into a rotating shaft and installed in the rotating shaft sleeve, and the clamping member can achieve 180° rotation through the cooperation between the two. The other end of the clamping member is attached to the base main bottom plate; the chip positioning frame is fixed to the upper surface of the base main bottom plate except for the two ends of the opening part; the opening end of the opening part is close to the fixed section 8 of the clamping member.

[0029] The pressing member 3 is made of a steel wire with a diameter of 1 mm, and the steel wire is bent into a shape as shown in FIG. Figure 2 The two parallel sections shown are in the shape of a "J". The middle part of the clamping member is a clamping section 7 that matches the chip to be tested; both ends of the clamping section are force-applying sections, namely the first force-applying section 5 and the second force-applying section 6; the two ends of one end of the first force-applying section 5 of the clamping member are bent into a rotating shaft that matches the rotating sleeve 2, and the fixed section 8 that matches the two ends of the open end of the chip positioning frame is connected to one end of the second force-applying section 6. The first force-applying section 5, the second force-applying section 6 and the clamping section 7 are bent into a bow shape, as shown in the side view. Figure 3 .

[0030] The distance W between the two parallel sections in the clamping member must satisfy 1 / 2W0<W<W0. The length L of the clamping section in the clamping member must satisfy 1 / 2L0<L<L0. W0 is the width of the chip under test; L0 is the length of the chip under test.

[0031] The angle between the two ends of the first force-applying section and the main bottom plate 1 of the base is α, 30°≤α≤90°; the upward bending angle of the first force-applying section is β, 30°≤β≤60°; the angle between the clamping section and the second force-applying section is γ, 120°≤γ≤160°; the downward bending angle of the second force-applying section is θ, 90°≤θ≤120°.

[0032] In this embodiment, the distance W between the two parallel sections of the pressing member is 3 / 4 of the chip width W0.

[0033] Right now

[0034]

[0035] The length L of the pressing section in the pressing member is 2 / 3 of the chip length L0.

[0036]

[0037] In this embodiment, the angle α between the two ends of the first force-applying section and the main bottom plate 1 of the base is 75°; the upward bending angle of the first force-applying section is β=45°; the angle between the clamping section and the second force-applying section is γ=160°; and the downward bending angle of the second force-applying section is θ=90°.

[0038] The chip positioning frame 4 is rectangular and made of a steel wire with a diameter of 1 mm. There is an opening on one short side of the chip positioning frame, and the two ends of the opening extend outward to form a pressure head for fixing the chip to be tested. The four corners of the chip positioning frame 4 are bent and protruded to avoid the four corners of the chip to be tested.

[0039] The length×width of the inner frame of the chip positioning frame is slightly larger than the length×width of the chip under test, and when the chip under test is installed in the chip positioning frame, the two are clearance-matched;

[0040] During assembly, the rotating sleeve 2 is welded to the pad of the main base plate 1, such as Figure 5 As shown, the rotating shaft of the pressing member 3 passes through two rotating sleeves, and the pressing member can achieve 180° rotation through the matching of the shaft holes.

[0041] When testing a chip, the chip to be tested is placed in the chip positioning frame; the pressing member is rotated so that the fixing section is attached to the upper surface of the main bottom plate of the base, and the pressing section is attached to the surface of the chip. Figure 6 As shown in FIG. 1 , the two ends of the chip positioning frame extending outward are bent and tightly buckled at the fixed end of the clamping member, and the BGA chip to be tested is clamped by the clamping section. At this point, the chip to be tested is fixed on the chip test base. After the installation is completed, the front view, top view, and side view of the chip test base are shown in FIG. Figure 7 , Figure 8 , Fig. 9 .

[0042] This embodiment can freely disassemble / install the chip, is not easy to damage the chip under the premise of meeting the fixing requirements, and is conducive to chip replacement during chip testing, shortening the chip disassembly / installation time by 30%. In this embodiment, the four corners of the chip positioning frame completely avoid the four corners of the chip, reducing the chip damage rate during chip testing by 70%. The clamping member uses a clamping steel wire, and its manufacturing process is simple and convenient, and the cost of the test base is reduced by 80%.

Claims

1. A chip test base, characterized in that: It comprises a base main bottom plate (1), a rotating shaft sleeve (2), a pressing piece (3), and a chip positioning frame (4); wherein the rotating shaft sleeve (2) has two sections, one end of which is coaxially fixed to the upper surface of the base main bottom plate; the two ends of the opening end of the pressing piece (3) are bent into a rotating shaft and installed in the rotating shaft sleeve, and the pressing piece can be rotated 180 degrees through the cooperation between the two ends; the other end of the pressing piece is attached to the base main bottom plate; the chip positioning frame is fixed to the upper surface of the base main bottom plate except for the two ends of the opening part; The opening end of the opening portion is close to the fixing section (8) of the pressing member.

2. The chip test base as claimed in claim 1, characterized in that: The clamping member (3) is made of a steel wire with a diameter of 1 mm, and the steel wire is bent into two parallel sections, which are in the shape of a "J" as a whole; the middle part of the clamping member is a clamping section (7) that cooperates with the chip to be tested; both ends of the clamping section are force-applying sections, namely a first force-applying section (5) and a second force-applying section (6); the two ends of one end of the first force-applying section of the clamping member are bent into a rotating shaft that cooperates with the rotating sleeve (2), and the fixed section (8) that cooperates with the two ends of the open end of the chip positioning frame is connected to one end of the second force-applying section; the first force-applying section, the second force-applying section and the clamping section (7) are bent into a bow shape.

3. The chip test base as claimed in claim 2, characterized in that: The distance W between the two parallel sections in the clamping member must satisfy 1 / 2W0<W<W0; the length L of the clamping section in the clamping member must satisfy 1 / 2L0<L<L0; W0 is the width of the chip under test; L0 is the length of the chip under test.

4. The chip test base as claimed in claim 1, characterized in that: The included angle between the two ends of the first force-applying section and the main bottom plate (1) of the base is α, 30°≤α≤90°; the upward bending angle of the first force-applying section is β, 30° ≤β≤60°; the angle between the pressing section and the second force-applying section is γ, 120°≤γ≤160°; the downward bending angle of the second force-applying section is θ, 90°≤θ≤120°.

5. The chip test base as claimed in claim 1, characterized in that: The chip positioning frame (4) is rectangular and made of a steel wire with a diameter of 1 mm. An opening is provided on one short side of the chip positioning frame, and two ends of the opening extend outward to form a pressure head for fixing the chip to be tested. The four corners of the chip positioning frame are bent and protruded to avoid the four corners of the chip to be tested.

6. The chip test base as claimed in claim 1, characterized in that: The length×width of the inner frame of the chip positioning frame is slightly larger than the length×width of the chip under test, and when the chip under test is installed in the chip positioning frame, the two are clearance-matched.

7. The chip test base as claimed in claim 1, characterized in that: When testing a chip, the test chip is placed in a chip positioning frame; the pressing piece is rotated to make the fixed section fit on the upper surface of the main bottom plate of the base, the pressing section fits on the chip surface, the two ends of the chip positioning frame extending outward are bent and tightly fastened on the fixed ends of the pressing piece, and the BGA chip to be tested is pressed by the pressing section; at this point, the chip to be tested is fixed on the chip test base.

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