Optical module

Abstract

The optical module provided by the invention comprises a circuit board, a cover shell, a base, an optical waveguide substrate, a turning prism, an optical receiving chip, a laser chip, a reflector and a displacement prism. An opening is formed in one end of the base so that the circuit board can extend into the base. The optical waveguide substrate comprises a first input optical port and a first output optical port which are arranged on opposite sides and used for transmitting optical receiving signals, and further comprises a second input optical port and a second output optical port which are arranged on adjacent sides and used for transmitting optical transmitting signals, and the first input optical port and the second output optical port are located on the same side and used for transmitting optical receiving signals. The first output optical port and the second input optical port are located on different sides, and transmission lines for receiving optical signals and transmitting optical signals are reasonably arranged. The light receiving chip is located on one side of the first output light port to receive a light receiving signal. Because the laser chip and the optical waveguide substrate are in different layers, the optical emission signal is guided to the second input optical port through the displacement prism, and the optical emission signal is transmitted through the optical waveguide substrate.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules, as one of the key components in optical communication equipment, can realize the conversion of optical and electrical signals. In the development of optical communication technology, the data transmission rate of optical modules is required to be continuously improved.

[0003] In some optical modules, including light emitting components and light receiving components, multi-path transmission is usually performed to increase the transmission rate. In the case of limited internal space, it is difficult to reasonably arrange the light emitting components and light receiving components of the multiple light paths. Summary of the invention

[0004] The present application provides an optical module to rationally arrange optical emitting components and optical receiving components of multiple optical paths.

[0005] The optical module provided in this application includes:

[0006] Circuit boards;

[0007] A cover shell, one end of which is formed with an optical fiber port so that the internal optical fiber can extend into the interior of the cover shell;

[0008] A base, one end of which is formed with an opening so that the circuit board can extend into the base;

[0009] An optical waveguide substrate is arranged between the cover shell and the base, and the internal optical fiber passes through the optical fiber port and enters the interior of the cover shell until it is connected with the optical waveguide substrate; the optical waveguide substrate includes a first input optical port and a first output optical port arranged on opposite sides to transmit a light receiving signal, and also includes a second input optical port and a second output optical port arranged on adjacent sides to transmit a light transmitting signal; the first input optical port and the second output optical port are on the same side, and the first output optical port and the second input optical port are on different sides;

[0010] A turning prism, disposed at one side of the first light output port, for receiving and reflecting the light receiving signal;

[0011] A light receiving chip, disposed on a surface of the circuit board, for receiving a light receiving signal reflected by the turning prism;

[0012] a laser chip, which is not disposed on the surface of the circuit board and is electrically connected to another surface of the circuit board, wherein the laser chip and the optical waveguide substrate are located in different layers and are used to generate a light emission signal;

[0013] A reflector, disposed on the light-emitting optical path of the laser chip, for reflecting the light emission signal toward the side wall of the base;

[0014] A displacement prism is arranged on the side wall of the base, with the light input end facing the layer where the laser chip is located and the light output end facing the second input light port, and is used to guide the light emission signal output by the reflector to the second input light port so as to transmit the light emission signal through the optical waveguide substrate.

[0015] The optical module provided in the present application includes a circuit board, a cover shell, a base, an optical waveguide substrate, a turning prism, a light receiving chip, a laser chip, a reflector and a displacement prism. An opening is formed at one end of the base so that the circuit board can be inserted into the base. The optical waveguide substrate is arranged between the cover shell and the base, and the substrate of the cover shell is formed with an optical fiber port. The internal optical fiber extends from the optical fiber port into the inside of the cover shell until it is connected with the optical waveguide substrate, thereby realizing optical coupling between the internal optical fiber and the optical waveguide substrate. In the present application, based on the optical coupling between the optical waveguide substrate and the optical fiber plug, the optical receiving signal and the optical transmitting signal are transmitted through the optical waveguide substrate. The optical waveguide substrate includes a first input optical port and a first output optical port arranged on opposite sides for transmitting the optical receiving signal, and also includes a second input optical port and a second output optical port arranged on adjacent sides for transmitting the optical transmitting signal, wherein the first input optical port and the second output optical port are located on the same side, and the first output optical port and the second input optical port are located on different sides, then the input of the received optical signal and the output of the transmitted optical signal are converged on one side, while the output of the received optical signal and the input of the transmitted optical signal are dispersed on different transmission paths, and the transmission routes of the received optical signal and the transmitted optical signal are reasonably arranged. A light receiving chip is provided on one side of the first light output port, and the light receiving chip is provided on one surface of the circuit board. Since the circuit board extends into the interior of the base, and the optical waveguide substrate is on the surface of the base, the height of the optical waveguide substrate is greater than the height of the light receiving chip. A turning prism is provided before the light receiving chip. The turning prism is provided on one side of the first light output port to receive the receiving light signal output by the optical waveguide substrate, and reflect the receiving light signal toward the light receiving chip to transmit the receiving light signal to the surface of the light receiving chip. In the present application, the laser chip is not provided on the surface of the circuit board, the laser chip is electrically connected to the other surface of the circuit board, and the laser chip and the optical waveguide substrate are in different layers. A reflector is provided on the light output path of the laser chip, and the light emission signal generated by the laser chip is reflected toward the side wall of the base through the reflector; a displacement prism is provided on the side wall of the base, and the light input end of the displacement prism faces the laser chip, and the light output end faces the second input light port, and is used to guide the light emission signal reflected by the reflector to the second input light port, thereby transmitting the light emission signal through the optical waveguide substrate. In the present application, the space on the surface of the cover shell and the base is fully utilized, and the relative relationship between the optical waveguide substrate, the receiving optical path, and the transmitting optical path is reasonably arranged to realize the reception and transmission of optical signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0017] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments;

[0018] Figure 2 is a partial structural diagram of a host computer according to some embodiments;

[0019] Figure 3 is a structural diagram of an optical module according to some embodiments;

[0020] Figure 4 is an exploded view of an optical module according to some embodiments;

[0021] Figure 5 is a schematic diagram of assembling an interface claw and an optical fiber plug according to some embodiments;

[0022] Figure 6 is a structural diagram of an interface claw according to some embodiments;

[0023] Figure 7 is an assembly exploded view of an interface claw and an optical fiber plug according to some embodiments;

[0024] Figure 8 is a schematic diagram of assembling a cover shell and a base according to some embodiments;

[0025] Fig. 9 is an assembly cross-sectional view of an interface claw according to some embodiments;

[0026] Fig.10 A partial exploded diagram of an optical module according to some embodiments Figure 1 ;

[0027] Fig.11 A partial exploded diagram of an optical module according to some embodiments Figure 2 ;

[0028] Fig.12 A cover shell structure according to some embodiments Figure 1 ;

[0029] Fig.13A cover shell structure according to some embodiments Figure 2 ;

[0030] Fig.14 A structure of a base according to some embodiments Figure 1 ;

[0031] Fig.15 A structure of a base according to some embodiments Figure 2 ;

[0032] Fig.16 A structure of a base according to some embodiments Figure 3 ;

[0033] Fig.17 FIG. 1 is a schematic diagram of an assembly cross section of a cover shell and a base according to some embodiments. Figure 1 ;

[0034] Fig.18 Schematic diagram of assembly and decomposition of a cover shell and a base according to some embodiments Figure 1 ;

[0035] Fig.19 FIG. 1 is a schematic diagram of an assembly cross section of a cover shell and a base according to some embodiments. Figure 2 ;

[0036] Fig. 20 Schematic diagram of assembly and decomposition of a cover shell and a base according to some embodiments Figure 2 ;

[0037] Fig.21 is a schematic structural diagram of an optical waveguide substrate according to some embodiments;

[0038] Fig. 22 A schematic diagram of an optical path for transmitting an optical signal through an optical waveguide substrate according to some embodiments;

[0039] Fig.23 is a cross-sectional view of the internal structure of an optical module according to some embodiments;

[0040] Fig.24 is a schematic structural diagram of a protective cover according to some embodiments;

[0041] Fig.25 FIG. 1 is a schematic diagram of an assembly cross section of a protective cover according to some embodiments. Figure 1 ;

[0042] Fig.26 FIG. 1 is a schematic diagram of an assembly cross section of a protective cover according to some embodiments. Figure 2 ;

[0043] Fig. 27is a schematic diagram of an exploded assembly of a protective cover according to some embodiments;

[0044] Fig.28 is a schematic diagram of a transmission optical path of a light receiving component according to some embodiments;

[0045] Fig.29 Schematic diagram of the relative position relationship of a circuit board, a light emitting component and a light receiving component according to some embodiments Figure 1 ;

[0046] Fig.30 Schematic diagram of the relative position relationship of a circuit board, a light emitting component and a light receiving component according to some embodiments Figure 2 ;

[0047] Fig.31 is a structural diagram of a light receiving chip according to some embodiments;

[0048] Fig.32 Schematic diagram of a disassembled optical receiving chip according to some embodiments Figure 1 ;

[0049] Fig.33 Schematic diagram of a disassembled optical receiving chip according to some embodiments Figure 2 ;

[0050] Fig.34 is a structural diagram of another optical receiving chip according to some embodiments;

[0051] Fig.35 FIG. 2 is a schematic diagram of another optical receiving chip according to some embodiments. Figure 1 ;

[0052] Fig.36 FIG. 2 is a schematic diagram of another optical receiving chip according to some embodiments. Figure 2 ;

[0053] Fig.37 is a partial structural schematic diagram of another optical receiving chip according to some embodiments;

[0054] Fig.38 is a cross-sectional view of the internal structure of another optical module according to some embodiments;

[0055] Fig.39 is a cross-sectional view of the internal structure of another optical module according to some embodiments;

[0056] Fig.40 is a schematic diagram of assembling a base and a circuit board according to some embodiments;

[0057] Fig.41 is a structural diagram of a light emitting component according to some embodiments;

[0058] Fig.42 is a cross-sectional view of a light emitting component according to some embodiments;

[0059] Fig.43 is a partial structural diagram of a light emitting component according to some embodiments;

[0060] Fig.44 is a light path diagram of a light emitting component according to some embodiments;

[0061] Fig.45 is a side cross-sectional view 1 of a light emitting component according to some embodiments;

[0062] Fig.46 FIG. 2 is a second side cross-sectional view of a light emitting component according to some embodiments. DETAILED DESCRIPTION

[0063] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0064] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0065] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0066] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0067] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0068] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0069] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0070] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0071] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0072] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0073] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, a light emitting component and a light receiving component. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component and the light receiving component.

[0074] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0075] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0076] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0077] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the opening 204 and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component and the optical receiving component in the optical module 200.

[0078] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of the circuit board 300, the light emitting component, the light receiving component, etc. into the above shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the above components. In addition, when assembling the circuit board 300, the light emitting component and the light receiving component, etc., it is convenient to deploy the positioning components, heat dissipation components and electromagnetic shielding components of these components, which is conducive to the automated production.

[0079] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0080] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0081] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0082] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting amplifiers (Limiting amplifier), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, digital signal processing (Digital Signal Processing, DSP) chips.

[0083] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0084] The circuit board 300 also includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide more pins, so as to adapt to occasions where the number of pins is large. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0085] At least one of the light emitting component or the light receiving component is located on a side of the circuit board 300 away from the gold finger 301 .

[0086] In some embodiments, the light emitting component and the light receiving component are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0087] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0088] In some embodiments, a DSP chip 302 is also provided on the surface of the circuit board 300. The electrical signal is input from the electrical interface unit, and the DSP chip 302 performs preprocessing and signal modulation on the electrical signal, outputs the modulated electrical signal, and loads it onto the driver chip. The driver chip transmits the modulated electrical signal to the laser chip, and the laser chip converts the modulated electrical signal into an optical signal, thereby obtaining an optical emission signal carrying data. In this application, the side provided with the DSP chip 302 may be referred to as the front side of the circuit board 300, and the other side opposite thereto may be referred to as the back side of the circuit board 300.

[0089] The circuit board 300 is electrically connected to the optical transceiver cavity. For example, one end of the circuit board 300 extends into the interior of the optical transceiver cavity. The interior of the optical transceiver cavity is used to set various optical elements of the optical receiving end and various optical elements of the optical transmitting end. The optical transmitting components and the optical receiving components of multiple optical paths are reasonably arranged inside the optical transceiver cavity, so as to realize multi-optical path transmission and improve the transmission rate.

[0090] In order to transmit optical signals, the optical port side of the optical transceiver cavity is connected to one end of the optical fiber plug 800b, and the other end of the optical fiber plug 800b is connected to the optical fiber connector 800c. The optical fiber connector 800c is connected to the external optical fiber, and the optical port side of the optical transceiver cavity is connected to the internal optical fiber. The external optical fiber and the internal optical fiber are connected through the optical fiber plug 800b to transmit optical signals. For example, the optical receiving signal to be transmitted to the optical receiving end is transmitted to the optical transceiver cavity through the external optical fiber, the optical fiber connector 800c, the optical fiber plug 800b, and the internal optical fiber in sequence, and then transmitted to the optical receiving component; the optical transmission signal generated by the optical transmitting end is transmitted out of the optical transceiver cavity through the internal optical fiber, the optical fiber plug 800b, the optical fiber connector 800c, and the external optical fiber in sequence, and then transmitted to the inside of the optical module.

[0091] In some embodiments, the interface claw 800a is used to couple the optical fiber connector 800c and the optical fiber plug 800b together, the optical fiber connector 800c is connected to the external optical fiber, the end of the optical fiber plug 800b is connected to the internal optical fiber, the optical fiber connector 800c is inserted into one end of the interface claw 800a, and the optical fiber plug 800b is inserted into the other end of the interface claw 800a, and the optical fiber connector 800c and the optical fiber plug 800b are docked inside the interface claw 800a, thereby realizing optical docking between the internal optical fiber and the external optical fiber.

[0092] Figure 5is a schematic diagram of assembling an interface claw and an optical fiber plug according to some embodiments; Figure 6 FIG. 1 is a structural diagram of an interface claw according to some embodiments. Figure 5 and Figure 6 As shown, one end of the interface claw 800a is provided with a first claw 801a and a second claw 802a in the vertical direction, and the first claw 801a and the second claw 802a are arranged opposite to each other. The optical fiber plug 800b is arranged between the first claw 801a and the second claw 802a, and the first claw 801a and the second claw 802a are respectively clamped in the above-mentioned optical transceiver cavity, thereby connecting one end of the interface claw 800a with the optical transceiver cavity; the other end of the interface claw 800a is provided with a third claw 803a and a fourth claw 804a in the horizontal direction, and the third claw 803a and the fourth claw 804a are respectively clamped on the optical fiber connector 800c, thereby connecting the other end of the interface claw 800a with the optical fiber connector 800c.

[0093] In some embodiments, the surface of the first clamping claw 801a is recessed upward to form a first limiting portion 8011a, and the surface of the second clamping claw 802a is recessed downward to form a second limiting portion 8021a.

[0094] In order to prevent the optical fiber plug 800b from falling out of the interface claw 800a, a limiting plate 800d is provided at the end of the optical fiber plug 800b, and the limiting plate 800d is arranged between the first limiting portion 8011a and the second limiting portion 8021a. The first limiting portion 8011a and the second limiting portion 8021a respectively clamp the limiting plate 800d to fix the limiting plate 800d. The limiting plate 800d supports the optical fiber plug 800b to limit the optical fiber plug 800b between the interface claw 800a and the limiting plate 800d, thereby preventing the optical fiber plug 800b from falling out of the interface claw 800a, thereby limiting the optical fiber plug 800b.

[0095] In some embodiments, the ends of the optical fiber plug 800b are respectively formed with a first pin 801b and a second pin 802b, and the first pin 801b and the second pin 802b are used to connect with the above-mentioned optical transceiver cavity. The end of the optical fiber plug 800b is provided with an internal optical fiber, which is arranged between the first claw 801a and the second claw 802a. One end of the internal optical fiber is led out from the end of the optical fiber plug 800b, and the other end extends to the inside of the above-mentioned optical transceiver cavity to realize the transmission of optical signals with the internal optical elements. In view of the structure of the optical fiber plug 800b, illustratively, the structure of the limit plate 800d includes corresponding through holes for avoiding the first pin 801b and the second pin 802b, and corresponding through holes for avoiding the internal optical fiber.

[0096] Figure 7FIG. 1 is an exploded view of an interface claw and an optical fiber plug according to some embodiments. Figure 7 As shown, in some embodiments, the optical transceiver cavity includes a cover shell 910 and a base 920 that are connected to each other, and the cover shell 910 is embedded between two side walls of the base 920.

[0097] After the optical fiber plug 800b is connected to the optical transceiver cavity, the limiting piece 800d will be attached to the end surface of the cover shell 910. At this time, the limiting piece 800d is located between the optical fiber plug 800b and the end surfaces of the cover shell 910 and the base 920.

[0098] Figure 8 FIG. 1 is a schematic diagram of assembling a cover shell and a base according to some embodiments. Figure 8 As shown, an optical fiber port 913 is formed on the end edge of the cover shell 910, and the optical fiber plug 800b is optically connected to the optical fiber port 913, so that the internal optical fiber guided out from the optical fiber plug 800b can pass through and directly extend to the inside of the cover shell 910 to establish an optical connection with the optical element inside the cover shell 910.

[0099] A first plug hole 914a and a second plug hole 914b are formed on both sides of the optical fiber port 913 to respectively plug the first plug pin 801b and the second plug pin 802b, thereby plugging the optical fiber plug 800b and the cover shell 910 together to achieve connection between the two.

[0100] Since the optical fiber plug 800b connected to the internal optical fiber is arranged between the first claw 801a and the second claw 802a, the first claw 801a and the second claw 802a are arranged opposite to each other in the vertical direction, and the internal optical fiber needs to be optically connected to the optical fiber port 913, then in the cover shell 910, a first clamping portion 9111 and a second clamping portion 9121 are respectively formed on the upper and lower sides of the optical fiber port 913, and the first clamping portion 9111 and the second clamping portion 9121 are arranged in the upper and lower directions. In some embodiments, the first clamping portion 801a is inserted into the first clamping portion 9111, and the second clamping portion 802a is inserted into the second clamping portion 9121, so that the interface clamping portion 800a is fixed to the cover shell 910 to achieve the connection between the two. In some embodiments, when the thickness of the first clamping claw 801a and the second clamping claw 802a is relatively large, the depth of the first clamping portion 9111 is dug larger to set the first clamping claw 801a; the third clamping portion 9281 is set at the relative position of the second clamping portion 9121, and the second clamping claw 802a is avoided by the third clamping portion 9281, so as to provide a larger space for the clamping of the second clamping claw 802a. At this time, the second clamping claw 802a is set between the second clamping portion 9121 and the third clamping portion 9281.

[0101] In some embodiments, an optical waveguide substrate is provided inside the cover shell 910, and the optical waveguide substrate includes an optical waveguide for transmitting an optical receiving signal and an optical transmitting signal, wherein the optical receiving signal is an optical signal to be transmitted to the optical receiving end, and the optical transmitting signal is an optical signal generated by the optical transmitting end. The optical fiber port 913 is provided between the optical fiber plug 800b and the optical waveguide substrate, one side of the optical fiber port 913 is optically connected to the optical fiber plug 800b, and the other side is optically connected to the optical waveguide substrate. Exemplarily, the optical fiber port 913 is optically connected to the optical port of the optical waveguide substrate, then one end of the internal optical fiber is guided out of the optical fiber plug 800b, and then the other end passes through the optical fiber port 913 optically connected to the optical fiber plug 800b, until the other end of the internal optical fiber extends to the optical port of the optical waveguide substrate, thereby optically connecting the internal optical fiber with the optical waveguide substrate to achieve transmission of the optical signal.

[0102] In the present application, the optical fiber plug 800b is arranged between the first claw 801a and the second claw 802a, the optical fiber port is arranged between the first clamping portion 9111 and the second clamping portion 9121, the optical fiber plug 800b is optically connected to the optical fiber port, the first claw 801a is connected to the first clamping portion 9111, and the second claw 802a is connected to the second clamping portion 9121. Then, while the optical connection between the optical fiber plug 800b and the optical fiber port is achieved, the interface claw 800a is also fixed to the cover shell 910.

[0103] Fig. 9 FIG. 1 is a cross-sectional view of an assembly of an interface claw according to some embodiments. Fig. 9 As shown, in some embodiments of the present application, since an optical waveguide substrate for transmitting optical signals is provided in the cover shell 910, an optical fiber port 913 is formed at the end of the cover shell 910, and the optical fiber port 913 is optically connected to the optical waveguide substrate, and the internal optical fiber is provided at the first clamping claw 801a and the second clamping claw 802a which are relatively arranged in the vertical direction. The internal optical fiber needs to be optically connected to the optical fiber port 913 so as to pass the internal optical fiber through the optical fiber port 913 until it is optically connected to the optical waveguide substrate. Therefore, at the end of the cover shell 910, exemplarily, a first clamping portion 9111 and a second clamping portion 9121 are respectively formed on the upper and lower sides of the optical fiber port 913, the first clamping claw 801a above the internal optical fiber is provided in the first clamping portion 9111 above the optical fiber port 913, and the second clamping claw 802a below the internal optical fiber is provided in the second clamping portion 9121 below the optical fiber port 913, thereby simultaneously realizing the optical connection between the internal optical fiber and the optical fiber port 913, and the connection between the interface clamping claw 800a and the cover shell 910.

[0104] Fig.10 A partial exploded diagram of an optical module according to some embodiments Figure 1 .like Fig.10As shown, in some embodiments, the optical transceiver cavity includes a cover shell 910 and a base 920 that are connected to each other, and the two side walls of the base 920 are recessed relative to the surface so that the cover shell 910 is disposed between the two side walls of the base 920 .

[0105] The optical waveguide substrate 900 a is disposed between the cover shell 910 and the base 920 . Exemplarily, the cover shell 910 has a receiving cavity for enclosing the optical waveguide substrate 900 a . Therefore, the optical waveguide substrate 900 a is disposed on the surface of the base 920 and is covered and enclosed by the cover shell 910 .

[0106] In some embodiments, the cover shell 910 includes a main body structure 911, and the main body structure 911 is used to cover and encapsulate the optical waveguide substrate 900a. Since the optical fiber plug 800b is optically connected to the optical waveguide substrate 900a, and the optical fiber plug 800b is arranged between the first clamping claw 801a and the second clamping claw 802a which are arranged opposite to each other in the upper and lower directions, the first clamping portion 9111 and the second clamping portion 9121 should be arranged on the upper and lower sides of the optical waveguide substrate 900a respectively. Since the upper structure of the optical waveguide substrate 900a is the main body structure 911, the first clamping portion 9111 is formed on the surface of the main body structure 911. As mentioned above, the surface of the first clamping claw 801a is recessed upward to form the first limiting portion 8011a, and the surface of the second clamping claw 802a is recessed downward to form the second limiting portion 8021a. In order to achieve the limiting fixation of the first clamping claw 801a and the second clamping claw 802a, the upper surface of the main body structure 911 is recessed downward to form the first clamping portion 9111, so as to set the first clamping claw 801a and the second clamping claw 802a. 01a; a second clamping portion 9121 is recessed upward at a certain position to set the second clamping claw 802a. The distance between the first clamping claw 801a and the second clamping claw 802a is smaller than the thickness of the base 920. Therefore, the second clamping portion 9121 recessed upward is not suitable for being set on the base 920. The second clamping portion 9121 should be set on the cover shell 910. Since the thickness of the main body structure 911 covering the optical waveguide substrate 900a is smaller than the distance between the first clamping claw 801a and the second clamping claw 802a, at this time, one end of the main body structure 911 extends downward to form an extension plate 912, and the bottom surface of the extension plate 912 is recessed upward to form the second clamping portion 9121. At the same time, a fiber optic port 913 is set on the surface of the extension plate 912, so that the fiber optic port 913 is located between the first clamping portion 9111 and the second clamping portion 9121.

[0107] In order to achieve the connection between the cover shell 910 and the base 920, the present application forms a support groove 928 at the end of the base 920, and the extension plate 912 is embedded in the support groove 928 to connect the cover shell 910 and the base 920. Exemplarily, when the thickness of the second clamping claw 802a is large, the surface of the support groove 928 is recessed downward to form a third clamping portion 9281, and the third clamping portion 9281 is arranged opposite to the second clamping portion 9121 to avoid the second clamping claw 802a, providing a larger space for the clamping and extension of the second clamping claw 802a.

[0108] An optical waveguide substrate 900a is provided between the cover shell 910 and the base 920, and the optical waveguide substrate 900a is optically connected to the optical fiber port 913. The internal optical fiber is led out from the end of the optical fiber plug 800b, passes through the optical fiber port 913, and is directly connected to the optical waveguide substrate 900a, thereby realizing the optical coupling between the optical fiber plug 800b and the optical waveguide substrate 900a, so as to transmit the optical signal through the internal optical fiber. Exemplarily, the optical receiving chip is transmitted to the optical receiving end through the external optical fiber, the optical fiber connector 800c, the optical fiber plug 800b, the internal optical fiber, and the optical channel in the optical waveguide substrate 900a in sequence; the optical transmission signal is transmitted to the outside of the optical module through the optical channel in the optical waveguide substrate 900a, the internal optical fiber, the optical fiber plug 800b, the optical fiber connector 800c, and the external optical fiber in sequence.

[0109] An opening 927 is formed at one end of the base 920 to allow the circuit board 300 to extend into the base 920 , and then the circuit board 300 is electrically connected to the light receiving end and the light emitting end respectively, so as to transmit electrical signals.

[0110] A gold finger 301 is provided at one end of the circuit board 300, a DSP chip 302 is provided on the surface, and the other end extends into the optical transceiver cavity, so as to transmit the electrical signal to the optical transmitting end, or transmit the electrical signal generated by the optical receiving end to the host computer through the gold finger 301. In this application, the side of the circuit board 300 provided with the DSP chip 302 is called the front side of the circuit board 300, and the other side opposite is the back side of the circuit board 300. Exemplarily, the front side of the circuit board 300 is provided with some optical elements of the optical receiving end, and the back side of the circuit board 300 is electrically connected to the electrical elements of the optical transmitting end. Since the DSP chip 302 has a large amount of heat dissipation when working, the DSP chip 302 is arranged on the front side of the circuit board 300. At this time, since the front surface of the circuit board 300 is covered with an upper shell 201, the heat generated by the DSP chip 302 can be dissipated through the upper shell 201. Of course, the DSP chip can also be arranged on the back side of the circuit board 300.

[0111] Fig.11 A partial exploded diagram of an optical module according to some embodiments Figure 2 .like Fig.11As shown, in some embodiments, the surface of the extension plate 912 is provided with a fiber port 913 and a second clamping portion 9121, so that the fiber port 913 and the optical waveguide substrate 900a are optically connected, and the internal optical fiber passes through the fiber port 913 until it extends into the optical waveguide substrate 900a.

[0112] Based on the setting of the extension plate 912 , a support groove 928 is formed on one end surface of the base 920 , and the extension plate 912 is embedded in the support groove 928 , thereby connecting the cover shell 910 and the base 920 .

[0113] In the present application, since the bottom surface of the extension plate 912 needs to be recessed upward to form the second clamping portion 9121, the support area between the extension plate 912 and the support groove 928 is relatively small. In order to increase the support surface between the extension plate 912 and the support groove 928 to facilitate limiting, the width of the extension plate 912 is set to be smaller than the width of the main body structure 911, so as to form overlapping portions 915 between the extension plate 912 and the main body structure 911, respectively. Overlap portions 915 are formed on both sides. Correspondingly, the width of the support groove 928 is smaller than the width of the surface of the base 920, thereby forming a first support portion 9244 and a second support portion 9245 on both sides of the support groove 928, respectively, and the overlapping portion 915 on one side is connected to the first support portion 9244, and the overlapping portion 915 on the other side is connected to the second support portion 9245, thereby increasing the support surface between the extension plate 912 and the support groove 928, and realizing the limiting connection between the cover shell 910 and the base 920.

[0114] In the present application, a light receiving chip 503 is provided on one side of the output light port of the optical waveguide substrate. Exemplarily, the light receiving chips 503 are arranged in the form of an array, and each light receiving chip 503 arranged in the array form is arranged on the surface of the circuit board. Since the circuit board extends into the interior of the base 920, and the optical waveguide substrate is located on the surface of the base 920, the height of the optical waveguide substrate is greater than the height of the light receiving chip 503. In some embodiments, a turning prism 502 can be provided before the light receiving chip 503. The turning prism 502 is provided on one side of the light output end of the optical waveguide substrate to receive the light receiving signal output by the optical waveguide substrate, and reflect the light receiving signal toward the light receiving chip 503 to transmit the light receiving signal to the surface of the light receiving chip 503. Exemplarily, a light receiving chip 503 is provided on the front side of the circuit board 300, and the turning prism 502 is located on the light outlet side of the optical waveguide substrate 900a. The surface of the base 920 is relatively higher than the surface of the circuit board 300, and the light outlet surface of the turning prism 502 faces the light receiving chip 503. The turning prism 502 is used to turn the optical signal output by the optical waveguide substrate 900a toward the light receiving chip 503, thereby turning the light receiving signal to the surface of the light receiving chip 503.

[0115] In some embodiments, a first lens 501 is provided between the light outlet of the optical waveguide substrate 900a and the turning prism 502. Exemplarily, the first lens 501 is a converging lens for converging the optical signal outputted by the optical waveguide substrate 900a to reduce the received optical power loss, and then transmitting the optical signal to the turning prism 502.

[0116] In some embodiments, a TIA504 is provided on the surface of the circuit board 300 and on the light output path of the light receiving chip 503 . The TIA504 is used to convert the photocurrent signal generated by the light receiving chip 503 into a voltage signal and amplify the voltage signal.

[0117] Fig.12 A cover shell structure according to some embodiments Figure 1 ; Fig.13 A cover shell structure according to some embodiments Figure 2 .like Fig.12 and Fig.13 As shown, the cover shell 910 includes a body structure 911, the surface of the body structure 911 is recessed downward to form a first clamping portion 9111, one end of the body structure 911 extends downward to form an extension plate 912, and the surface of the extension plate 912 is used to set the optical fiber port 913 and the second clamping portion 9121. Exemplarily, the bottom surface of the extension plate 912 is recessed upward to form the second clamping portion 9121.

[0118] The end of the optical fiber plug 800b is formed with an optical fiber port, and the internal optical fiber passes through the optical fiber port. The optical fiber port is optically connected with the optical fiber port 913, and the internal optical fiber passes through the optical fiber port 913 until it extends to the optical port of the optical waveguide substrate 900a. The optical fiber port of the optical fiber plug 800b is provided with a first pin 801b and a second pin 802b on both sides, and correspondingly, a first plug hole 914a and a second plug hole 914b are formed on both sides of the optical fiber port 913. The first plug hole 914a is used to insert the first plug pin 801b, and the second plug hole 914b is used to insert the second plug pin 802b, so as to achieve the connection between the optical fiber plug 800b and the cover shell 910.

[0119] Exemplarily, the main body structure 911 includes a first side wall 9112 and a second side wall 9113 that are arranged opposite to each other. A avoidance groove 9114 is formed through the middle of the first side wall 9112 , and a boss 9115 is formed on one side of the first side wall 9112 .

[0120] An accommodating cavity 9116 is formed between the first side wall 9112 and the second side wall 9113 to enclose and accommodate the optical waveguide substrate 900a. In order to facilitate the dismantling and repairing of the optical waveguide substrate 900a, a notch 9117 is provided on one side of the second side wall 9113, so that the optical waveguide substrate 900a can be taken out from the notch 9117 with the help of certain work to carry out dismantling and repairing.

[0121] Fig.14 A structure of a base according to some embodiments Figure 1 ; Fig.15 A structure of a base according to some embodiments Figure 2 .like Fig.14 and Fig.15 As shown, in some embodiments, the base 920 includes a third side wall 921 and a fourth side wall 922, the surface of the base 920 is relatively recessed in the third side wall 921 and the fourth side wall 922, and the distance between the third side wall 921 and the fourth side wall 922 is greater than the distance between the first side wall 9112 and the second side wall 9113, so that the cover shell 910 is disposed between the third side wall 921 and the fourth side wall 922.

[0122] The base 920 is a layered structure, and a baffle 923 is formed in the middle of the base 920. The baffle 923 divides the base 920 into an upper space 924 located above the baffle 923 and a lower space 925 located below the baffle 923. The upper space 924 and the lower space 925 are separated by the baffle 923. The upper space 924 is used to set the optical waveguide substrate 900a, the first lens 501, and the turning prism 502, and the lower space 925 is used to set the optical element of the light emitting end. The turning prism 502 is arranged on a surface of the baffle 923. For example, the turning prism 502 is arranged in the upper space 924.

[0123] Since the optical waveguide substrate 900a, the first lens 501, and the turning prism 502 are all located in the upper space 924, the transmission of the optical receiving signal is the same-layer transmission. The optical signal output by the optical waveguide substrate 900a is transmitted along the same layer to the first lens 501 and the turning prism 502. The transmission optical path of the optical receiving signal does not need to be highly switched and guided between the upper and lower spaces. The optical receiving road is simple, thereby reducing optical power loss.

[0124] The upper space 924 includes a first surface 9241, a second surface 9242, and a third surface 9243, respectively. The first surface 9241, the second surface 9242, and the third surface 9243 are located on the top surface of the baffle 923. The optical waveguide substrate 900a is disposed between the cover shell 910 and the first surface 9241. The second surface 9242 is used to set the first lens 501, and the third surface 9243 is used to set the turning prism 502. Exemplarily, the height of the second surface 9242 can be higher than the height of the third surface 9243, so that the optical axes of the first lens 501 and the turning prism 502 are on the same axis.

[0125] An opening 927 is formed at one end of the partition 923 so that the circuit board 300 can extend into the interior of the partition 923. The front side of the circuit board 300 can be used to carry the optical receiving chip 503 and TIA504, thereby establishing an electrical connection with the optical receiving end. The circuit board 300 extends into the optical emitting component, thereby establishing an electrical connection with the optical emitting end.

[0126] The first surface 9241 includes a surface for supporting the optical waveguide substrate 900a, and also includes a first support portion 9244, a second support portion 9245 and a third support portion 9246. The first support portion 9244 and the second support portion 9245 are located on the optical port side of the optical transceiver cavity, and the third support portion 9246 is located on the electrical port side of the optical transceiver cavity.

[0127] A support groove 928 is provided between the first support portion 9244 and the second support portion 9245. The support groove 928 is U-shaped and is recessed relative to the surface of the base 920. For example, the support groove 928 is recessed relative to the surface of the first surface 9241, so that the extension plate 912 is provided in the support groove 928, and the overlapping portions 915 on both sides overlap on the first surface 9241. For example, the overlapping portions 915 on both sides overlap on the first support portion 9244 and the second support portion 9245, respectively, so that the extension plate 912 is inserted into the support groove 928, the support groove 928 supports the extension plate 912, and then the overlapping portion 915 matches and overlaps with the first support portion 9244 and the second support portion 9245, so as to realize the limiting connection between the cover shell 910 and the base 920.

[0128] In some embodiments, a fourth surface 929 is formed on one side of the first surface 9241 close to the third sidewall 921 . Exemplarily, the fourth surface 929 is recessed relative to the first surface 9241 .

[0129] In some embodiments, the third side wall 921 is hollowed out to form an embedded portion 926, which is a through hole. The embedded portion 926 exposes the upper and lower surfaces of the partition 923. Exemplarily, the height of the embedded portion 926 is greater than the height of the partition 923, so the upper and lower surfaces of the partition 923 are exposed relative to the embedded portion 926.

[0130] Fig.16 A structure of a base according to some embodiments Figure 3 .like Fig.16As shown, the surface of the lower space 925 is respectively recessed to different degrees toward the upper space 924, forming a first recessed portion 9251 and a second recessed portion 9252, the first recessed portion 9251 and the second recessed portion 9252 are located on the bottom surface of the baffle 923, and illustratively, the first recessed portion 9251 and the second recessed portion 9252 are used to set the optical element of the light emitting end, and the first recessed portion 9251 is more recessed than the second recessed portion 9252. One side of the second recessed portion 9252 is connected to a first vertical surface 9253 and a second vertical surface 9254, respectively.

[0131] The first recessed portion 9251 and the second recessed portion 9252 are respectively used to dispose optical elements of the light emitting end.

[0132] Fig.17 FIG. 1 is a schematic diagram of an assembly cross section of a cover shell and a base according to some embodiments. Figure 1 .like Fig.17 As shown, the width between the third side wall 921 and the fourth side wall 922 of the base 920 is relatively larger than the first side wall 9112 and the second side wall 9113 of the cover shell 910, then the cover shell 910 is arranged between the third side wall 921 and the fourth side wall 922, and the surface of the cover shell 910 can be on the same plane with the surfaces of the third side wall 921 and the fourth side wall 922.

[0133] The optical waveguide substrate 900a is disposed between the cover shell 910 and the base 920. For example, the optical waveguide substrate 900a is located between the cover shell 910 and the upper space 924 of the base 920. The second side wall 9113 of the cover shell 910 wraps the optical waveguide substrate 900a. The width of the optical waveguide substrate 900a is smaller than the width between the first side wall 9112 and the second side wall 9113. Then, one side of the optical waveguide substrate 900a is still at a distance from the second side wall 9113 to achieve the design and adjustment of the optical path. In some packaging processes, the optical waveguide substrate 900a needs to be fixed first. For example, the optical waveguide substrate 900a can be fixed by wrapping the optical waveguide substrate 900a with the cover shell 910.

[0134] Since the optical waveguide substrate 900a is located in the upper space 924, and the optical element of the light emitting end is located in the lower space 925, the transmission of the optical emission signal is cross-layer transmission, and it is necessary to switch and guide the transmission optical path of the optical emission signal in height. For example, the transmission direction of the optical emission signal is turned toward the upper space 924, so that the output direction of the optical emission signal is toward the optical waveguide substrate 900a, and finally the optical emission signal is transmitted into the optical waveguide substrate 900a. In some embodiments, by setting a displacement prism 407, the transmission direction of the optical emission signal is turned toward the upper space 924, so that the output direction of the optical emission signal is transmitted to the optical waveguide substrate 900a, and the optical emission signal is guided into the optical waveguide substrate 900a.

[0135] In some embodiments, the displacement prism 407 is disposed in the embedding portion 926. For example, the displacement prism 407 is disposed in the fixing frame 408, and then the fixing frame 408 is embedded in the embedding portion 926, so that the displacement prism 407 is embedded in the embedding portion 926, thereby fixing the displacement prism 407.

[0136] In some embodiments, the fixing frame 408 is a frame with an opening, such as including a top surface, a bottom surface, and a side surface connecting the top surface and the bottom surface. The displacement prism 407 is arranged between the top surface and the bottom surface. The displacement prism 407 is clamped up and down by the top surface and the bottom surface, and the displacement prism 407 is fixed by the side surface.

[0137] In some embodiments, the width of the fixing frame 408 is relatively greater than the width of the third side wall 921, so an escape groove 9114 needs to be formed through the middle of the first side wall 9112 of the cover shell 910 to escape the fixing frame 408. Exemplarily, one side of the fixing frame 408 is connected to the escape groove 9114.

[0138] In some embodiments, the second side wall 9113 of the cover shell 910 is disposed between the fourth side wall 922 of the base 920 and the optical waveguide substrate 900 a ; and the first side wall 9112 is connected to the third side wall 921 .

[0139] Fig.18 Schematic diagram of assembly and decomposition of a cover shell and a base according to some embodiments Figure 1 .like Fig.18 As shown, a evacuation groove 9114 is formed through the middle of the first side wall 9112 to avoid the fixing frame 408. Exemplarily, one side of the fixing frame 408 is connected to the evacuation groove 9114. An embedding portion 926 is dug in the third side wall 921 to embed the fixing frame 408.

[0140] Fig.19 FIG. 1 is a schematic diagram of an assembly cross section of a cover shell and a base according to some embodiments. Figure 2 ; Fig. 20 Schematic diagram of assembly and decomposition of a cover shell and a base according to some embodiments Figure 2 .like Fig.19 and Fig. 20 As shown, an avoidance groove 9114 is formed through the middle of the first side wall 9112 , and a boss 9115 is formed on one side of the first side wall 9112 . The boss 9115 is connected to a partial area of ​​the third support portion 9246 , and a partial surface of the third support portion 9246 is used to support the boss 9115 .

[0141] The cover case is formed with a receiving cavity 919 to receive the optical waveguide substrate 900a.

[0142] Fig.21FIG. 1 is a schematic diagram of the structure of an optical waveguide substrate according to some embodiments. Fig.21 As shown, in some embodiments, a first input optical port 901a and a second output optical port 904a are formed on one side of the optical waveguide substrate 900a close to the optical fiber plug 800b, a first output optical port 902a is formed on the side opposite to the first input optical port 901a, and a second input optical port 903a is formed on the side adjacent to the second output optical port 904a.

[0143] The first input optical port 901a is connected to the first output optical port 902a, and multiple optical channels are provided between the two to realize the transmission of multiple optical signals. The optical channel between the first input optical port 901a and the first output optical port 902a is used to transmit the external optical signal, that is, the optical receiving signal, to the optical receiving end.

[0144] The second input optical port 903a is connected to the second output optical port 904a, and multiple optical channels are also provided between the two to realize the transmission of multiple optical signals. The optical channel between the second input optical port 903a and the second output optical port 904a is used to transmit the optical signal generated by the optical transmitting end, that is, the optical transmitting signal, to the outside of the optical module.

[0145] The first input optical port 901a and the first output optical port 902a arranged on the opposite side are used to transmit the optical receiving signal; the second input optical port 903a and the second output optical port 904a arranged on the adjacent side are used to transmit the optical transmitting signal.

[0146] The first input optical port 901a and the first output optical port 902a are located on opposite sides, and the optical receiving chip 503 is located on one side of the first output optical port 902a. The light incident direction of the optical receiving chip 503 is consistent with the output direction of the optical signal of the optical waveguide substrate 900a. The output optical path direction of the optical waveguide substrate 900a is consistent with the input optical path direction of the optical receiving chip 503. Exemplarily, both are toward the optical port end of the optical module. Therefore, the optical signal output by the optical waveguide substrate 900a can be directly received by the optical receiving chip 503, which reduces optical loss and is conducive to ensuring optical receiving power.

[0147] The second input optical port 903a and the second output optical port 904a are located on two adjacent sides. If the light emitting direction of the laser chip at the light emitting end is inconsistent with the input direction of the optical waveguide substrate 900a, the direction of the input optical path of the optical waveguide substrate 900a is inconsistent with the direction of the light emitting path of the laser chip. Exemplarily, the light emitting path of the laser chip is toward the optical port, and the input optical path of the optical waveguide substrate 900a is toward the side. Therefore, the light emission signal generated by the laser chip at the light emitting end needs to be turned and guided in the transmission direction so as to transmit the light emission signal to the optical waveguide substrate 900a.

[0148] The first input optical port 901a and the second output optical port 904a are located on the same side. Exemplarily, the first input optical port 901a and the second output optical port 904a are both located on the side close to the optical fiber plug 800b, then the received light of the optical receiving end and the emitted light of the optical transmitting end are both concentrated on one side, the received light of the optical receiving end enters the optical waveguide substrate 900a on this side, and the emitted light of the optical transmitting end is output from the optical waveguide substrate 900a on this side.

[0149] The first output light port 902a and the second input light port 903a are on different sides. Exemplarily, the first output light port 902a and the second input light port 903a are located on two adjacent sides. In the optical waveguide substrate 900a, the transmission starting point of the received light and the transmission end point of the emitted light are on the same side, and then the received light is transmitted along the transmission starting point to the side opposite to the transmission starting point, while the transmission starting point of the emitted light is located on a different side from the transmission terminal of the emitted light. Based on the reversibility of the optical path, the present application is equivalent to the received light and the emitted light converging on the same side, and then dispersing and transmitting to different sides.

[0150] In the present application, the transmission direction of the optical receiving signal is consistent with the direction of the optical port of the optical module, and the transmission direction of the optical transmitting signal is guided to the side of the optical waveguide substrate through the reflector and the displacement prism.

[0151] In the present application, the input of the optical receiving signal and the output of the optical transmitting signal converge on one side, while the output of the optical receiving signal and the input of the optical transmitting signal are dispersed on different transmission paths, and the transmission routes of the optical receiving signal and the optical transmitting signal are reasonably arranged. In the present application, the space on the surface of the cover shell and the base is fully utilized, and the relative relationship between the optical waveguide substrate, the receiving optical path, and the transmitting optical path is reasonably arranged to realize the reception and transmission of optical signals.

[0152] The second surface 9242 and the third surface 9243 are both located on one side of the first output light port 902a of the optical waveguide substrate 900a, so as to transmit the optical signal output by the first output light port 902a to the first lens 501 set on the surface of the second surface 9242 and the turning prism 502 set on the surface of the third surface 9243 in sequence.

[0153] The fourth surface 929 is located at one side of the second input optical port 903a of the optical waveguide substrate 900a, so as to transmit the optical signal output by the optical element disposed on the fourth surface 929 to the second input optical port 903a, and then output it through the second output optical port 904a.

[0154] The embedded portion 926 is also located on one side of the second input optical port 903a of the optical waveguide substrate 900a, so as to transmit the optical signal output by the optical element installed in the embedded portion 926 to the second input optical port 903a, and then output it through the second output optical port 904a.

[0155] Exemplarily, when the optical module is an 800G optical module, the first input optical port 901a is connected to the first output optical port 902a, and 8 optical channels are arranged between the two, which are 8 optical receiving channels; the second input optical port 903a is connected to the second output optical port 904a, and 8 optical channels are also arranged between the two, which are 8 optical transmitting channels. By reasonably arranging the positions of each optical port, a reasonable layout between the 8 optical receiving channels and the 8 optical transmitting channels can be achieved to avoid mutual interference between the channels.

[0156] In the present application, a light receiving signal and a light transmitting signal are transmitted simultaneously through an optical waveguide substrate 900a. Since the optical device at the light receiving end and the optical device at the light transmitting end are in different layers of space, if the light receiving signal and the light transmitting signal are transmitted through an optical fiber ribbon, fiber winding or fiber coiling will occur. Fiber winding or fiber coiling causes optical power loss, thereby reducing optical power. Therefore, the present application can avoid fiber winding or fiber coiling through the optical waveguide substrate 900a, thereby reducing optical power loss.

[0157] Fig. 22 FIG. 1 is a schematic diagram of an optical path for transmitting an optical signal through an optical waveguide substrate according to some embodiments. Fig. 22 As shown, in some embodiments, the optical receiving end includes a first lens 501, a turning prism 502, and an optical receiving chip 503. By way of example, the optical receiving signal enters the optical waveguide substrate 900a from the first input optical port 901a via the internal optical fiber, and then is transmitted through the optical channel in the optical waveguide substrate 900a and output from the first output optical port 902a. The first lens 501 is disposed on one side of the first output optical port 902a to receive the optical receiving signal output from the first output optical port 902a.

[0158] In some embodiments, the light emitting end includes a laser chip 402, a reflector 405, etc. Compared with the light receiving chip 503 disposed on the surface of the circuit board 300, the laser chip 402 is not disposed on the surface of the circuit board 300, but is disposed on the other surface of the partition 923. Exemplarily, the laser chip 402 is disposed in the lower space 925, and the light emission signal emitted by the laser chip 402 is reflected by the reflector 405 into the displacement prism 407. The displacement prism 407 turns and guides the transmission direction of the light emission signal output by the reflector 405 toward the second input optical port 903a of the optical waveguide substrate 900a, so that the light emission signal is transmitted to the optical waveguide substrate 900a. Exemplarily, the light emitting side of the displacement prism 407 is located on one side of the second input optical port 903a, and the optical emission signal output from the displacement prism 407 enters the optical waveguide substrate 900a from the second input optical port 903a, and then is transmitted to the second output optical port 904a through the optical channel in the optical waveguide substrate 900a. The optical emission signal is output from the second output optical port 904a, enters the internal optical fiber, and then is transmitted to the outside of the optical module through the external optical fiber coupled to the internal optical fiber.

[0159] Fig.23 FIG. 1 is a cross-sectional view of the internal structure of an optical module according to some embodiments. Fig.23 As shown, an opening 927 is formed at one end of the baffle 923, and one end of the circuit board 300 extends into the baffle 923 from the opening 927. The surface length of the upper space 924 is relatively greater than the length of the cover shell 910, and the surface of the upper space 924 is exposed relative to the cover shell 910. The first lens 501 and the turning prism 502 are respectively arranged on the exposed surface, and the light receiving chip 503 and the TIA504 are arranged on a surface of the circuit board 300. For example, the light receiving chip 503 and the TIA504 are arranged on the front of the circuit board 300. The first lens 501 and the turning prism 502 are arranged toward the front of the circuit board 300, and the light emitting surface of the turning prism 502 is toward the front of the circuit board 300. For example, the light emitting surface of the turning prism 502 is toward the light receiving chip 503 arranged on the front of the circuit board 300.

[0160] The lower space 925 is used to respectively set the laser chip 402 and the reflector 405. One end of the circuit board 300 extends into the baffle 923 from the opening 927. When the circuit board 300 extends to one side of the laser chip 402, the laser chip 402 is electrically connected to the other surface of the circuit board 300 by wire bonding. For example, the laser chip 402 is connected to the reverse side of the circuit board 300. At the same time, in order to ensure the transmission performance of high-frequency signals, the other surface of the circuit board 300 is flush with the surface of the laser chip 402. For example, the reverse side of the circuit board 300 is flush with the surface of the laser chip 402, which is conducive to shortening the wire bonding length between the circuit board 300 and the laser chip 402, thereby ensuring the transmission performance of high-frequency signals.

[0161] The circuit board 300 extends into the baffle 923 from the opening 927. At this time, one surface of the circuit board 300, such as the front side, is used to set the light receiving chip 503 and TIA504, and the other surface of the circuit board 300, such as the back side, is flush with the surface of the laser chip 402. The back side of the circuit board 300 and the laser chip 402 are connected by wire bonding.

[0162] The first lens 501 is located on the side of the first output light port 902a of the optical waveguide substrate 900a to receive the optical receiving signal output from the optical waveguide substrate 900a; the light emitting surface of the first lens 501 faces the turning prism 502; the turning prism 502 is used to reflect the optical signal toward the optical receiving chip 503, so as to transmit the optical receiving signal to the optical receiving chip 503. Exemplarily, the light emitting surface of the turning prism 502 faces the front side of the circuit board 300, for example, the light emitting surface of the turning prism 502 faces the optical receiving chip 503; the optical receiving chip 503 is used to convert the optical receiving signal into an electrical signal, and transmit the electrical signal to the TIA504, and the TIA504 is used to convert the electrical signal into a voltage signal and amplify the voltage signal.

[0163] In some embodiments, when packaging the optical waveguide substrate 900a, the optical receiving chip 503, the laser chip 402, etc., it is usually necessary to fix the optical waveguide substrate 900a through the cover shell 910. Therefore, after the optical waveguide substrate 900a is installed, the cover shell 910 needs to be installed to fix the optical waveguide substrate 900a; then the optical components of the optical emitting end such as the laser chip 402 are packaged to ensure the optical transmission power; and then the optical components of the optical receiving end such as the optical receiving chip 503 are packaged. In order to facilitate the packaging of the optical receiving chip 503, etc. As for the optical elements at the light receiving end, the length of the cover shell 910 is relatively smaller than the surface length of the upper space 924, so as to leave a certain space on the top surface of the base 920 for arranging the optical elements at the light receiving end such as the light receiving chip 503. By way of example, the optical elements at the light receiving end such as the light receiving chip 503 are encapsulated on the surface of the base 920 exposed relative to the cover shell 910. Therefore, the optical elements at the light receiving end such as the light receiving chip 503 are exposed relative to the cover shell 910, so as to facilitate the assembly of the optical elements at the light receiving end such as the light receiving chip 503.

[0164] Since the optical elements of the light receiving end such as the light receiving chip 503 are exposed relative to the cover 910 , a protective cover 930 is provided to protect the light receiving chip 503 and the like. Exemplarily, the protective cover 930 covers the surface of the light receiving chip 503 .

[0165] In some embodiments, the protective cover 930 covers the surface of the light receiving chip 503; in some embodiments, the protective cover 930 covers the surfaces of the first lens 501, the turning prism 502, the light receiving chip 503 and the TIA504. At this time, one end of the protective cover 930 is connected to the cover shell 910, and the bottom end of the protective cover 930 is set on the front side of the circuit board 300. By way of example, the side wall where the bottom end of the protective cover 930 is located overlaps the front side of the circuit board 300, thereby covering the surfaces of the first lens 501, the turning prism 502, the light receiving chip 503 and the TIA504.

[0166] Fig.24 FIG. 1 is a schematic diagram of the structure of a protective cover according to some embodiments. Fig.24 As shown, the protective cover 930 includes a cover plate 933, a side plate 934, a side plate 935 and a side plate 936 connected to the cover plate 933. The cover plate 933 is used to cover the light receiving component, the side plate 934 is used to connect to the base 920, the side plate 935 is used to connect to the base 920, and the side plate 936 is used to connect to the circuit board 300. One side of the protective cover 930 is connected to the cover shell 910.

[0167] The surface of the protective cover 930 is respectively formed with a first notch 931 and a second notch 932. The first notch 931 is used to connect with the base 920; the second notch 932 is used to avoid the fourth side wall 922. The first notch 931 is overlapped with the surface of the base 920, and the second notch 932 is spliced ​​with the fourth side wall 922, so as to fix the protective cover 930. In some embodiments, the first notch 931 can overlap the surface of the baffle 923, and the second notch 932 can be spliced ​​on the fourth side wall 922.

[0168] Fig.25 FIG. 1 is a schematic diagram of an assembly cross section of a protective cover according to some embodiments. Figure 1 ; Fig.26 FIG. 1 is a schematic diagram of an assembly cross section of a protective cover according to some embodiments. Figure 2 ; Fig. 27 FIG. 1 is a schematic diagram of an assembly explosion of a protective cover according to some embodiments. Figure 25-27 As shown, in some embodiments, in order to facilitate the assembly of the protective cover 930 and to facilitate the removal of the protective cover 930 when the protective cover 930 needs to be disassembled and repaired, a gap is provided between the side wall of the protective cover 930 and the third side wall 921. The existence of the gap leaves an operating space for clamping the protective cover 930, thereby facilitating the removal and placement of the protective cover. Exemplarily, the protective cover 930 is clamped between the gap and the outward side of the second notch 932, so that the protective cover 930 is removed and the protective cover 930 is disassembled and repaired.

[0169] The first notch 931 is connected to the surface of the partition 923. Exemplarily, the first notch 931 is connected to the surface of the third support portion 9246, and the first notch 931 overlaps the surface of the third support portion 9246; the second notch 932 is connected to the fourth side wall 922. Exemplarily, the second notch 932 is spliced ​​and connected to the fourth side wall 922; one side of the protective cover 930 is connected to the side wall of the cover shell 910, and the bottom surface of the protective cover 930 is arranged on the surface of the circuit board 300. The protective cover 930 is supported by the circuit board 300, and the protective cover 930 is respectively connected to the cover shell 910, the base 920, and the circuit board 300, so as to fix the protective cover 930, so as to protect the first lens 501, the turning prism 502, the light receiving chip 503 and the TIA504 through the protective cover 930.

[0170] Fig.28 is a schematic diagram of a transmission optical path of a light receiving component according to some embodiments; Fig.29 Schematic diagram of the relative position relationship of a circuit board, a light emitting component and a light receiving component according to some embodiments Figure 1 ; Fig.30 Schematic diagram of the relative position relationship of a circuit board, a light emitting component and a light receiving component according to some embodiments Figure 2 .like Figure 28-Figure 30 As shown, the optical waveguide substrate 900a is arranged between the cover shell 910 and the base 920. Exemplarily, the optical waveguide substrate 900a is arranged between the cover shell 910 and the upper space 924. The upper space 924 is also used to set the first lens 501 and the turning prism 502. The lower space 925 is used to set optical elements such as the laser chip 402. It can be seen that the optical waveguide substrate 900a, the first lens 501, and the turning prism 502 are on the same layer, and the optical waveguide substrate 900a and the laser chip 402 are on different layers. Then, the optical receiving signal output by the optical waveguide substrate 900a is transmitted to the optical receiving chip 503 after one reflection, and the optical emission signal generated by the laser chip 402 needs to be guided by the guiding light path to guide the generated optical emission signal into the optical waveguide substrate 900a.

[0171] The optical receiving signal output by the optical waveguide substrate 900a is transmitted to the first lens 501, and the turning prism 502 is used to reflect the optical receiving signal downward to turn the transmission direction of the optical receiving signal to the surface of the optical receiving chip 503. Exemplarily, the first lens 501 and the turning prism 502 are located on one side of the first optical output port 902a to receive the optical receiving signal output by the first optical output port 902a.

[0172] In some embodiments, the optical port of the optical waveguide substrate 900a is optically connected to the internal optical fiber to transmit the optical receiving signal and the optical transmitting signal. The extension plate 912 of the cover shell 910 is embedded in the support groove 928 of the base 920, thereby connecting the cover shell 910 and the base 920. The cover shell 910 has a receiving cavity to accommodate and fix the optical waveguide substrate 900a.

[0173] In some embodiments, the top surface of the base 920 is respectively formed with a first surface 9241, a second surface 9242, and a third surface 9243, wherein the surface of the first surface 9241 is used to set the optical waveguide substrate 900a. The surfaces of the second surface 9242 and the third surface 9243 are respectively used to set the first lens 501 and the turning prism 502. If the length of the top surface of the base 920 is relatively greater than the length of the cover shell 910, the first lens 501 and the turning prism 502 are set on the extra surface of the top surface. At this time, the first lens 501 and the turning prism 502 are exposed relative to the cover shell 910, which is convenient for mounting the first lens 501 and the turning prism 502.

[0174] The optical axes of the first lens 501 and the turning prism 502 are on the same axis, the turning prism 502 is arranged on the output optical path of the first lens 501, the optical receiving chip 503 is located below the turning prism 502, and the TIA504 is located on one side of the optical receiving chip 503. Exemplarily, the first lens 501 is a converging lens, the turning prism 502 is used to reflect the optical receiving signal transmitted from the first lens 501, and reflect it to the surface of the optical receiving chip 503, the optical receiving chip 503 is used to convert the received optical receiving signal into a photocurrent signal, and transmit the electrical signal to the TIA504, and the TIA504 is used to convert the photocurrent signal into a voltage signal and amplify the voltage signal. When the optical module is multi-channel, the first lens 501 is arranged in the form of an array, and accordingly, the turning prism 502, the optical receiving chip 503, and the TIA504 are all arranged in the form of an array.

[0175] The first lens 501 is located on the surface of the second surface 9242, and the light incident surface of the first lens 501 faces the optical waveguide substrate 900a. Exemplarily, the light incident surface of the first lens 501 faces the first output light port 902a of the optical waveguide substrate 900a to receive the optical receiving signal output from the first output light port 902a; the light exit surface of the first lens 501 faces the turning prism 502 to transmit the optical receiving signal transmitted from the first lens 501 to the inside of the turning prism 502.

[0176] The turning prism 502 is located on the surface of the third surface 9243, the light incident surface of the turning prism 502 faces the first lens 501, and the light emitting surface faces the light receiving chip 503 disposed on the front of the circuit board 300, and the turning prism 502 is used to reflect the received light receiving signal toward the surface of the light receiving chip 503 disposed on the front of the circuit board 300. Exemplarily, the turning prism 502 has an inclined surface, through which the light receiving signal incident on its surface can be reflected, and the inclination angle of the inclined surface can be a preset inclination angle, so as to achieve a total reflection effect, and the light signal incident on its surface is totally reflected. Exemplarily, the light incident surface of the turning prism 502 faces the first lens 501 to receive the light signal transmitted through the first lens 501 and reflect the light signal, thereby turning its light path. Exemplarily, the transmission light path of the light signal is turned downward to reflect the light signal into the light receiving chip 503 located below the turning prism 502; the light emitting surface of the turning prism 502 faces the light receiving chip 503 to transmit the reflected light signal into the light receiving chip 503.

[0177] The optical receiving chip 503 is located on a surface of the circuit board 300. Exemplarily, the optical receiving chip 503 is located on the front side of the circuit board 300. The optical receiving chip 503 is wired connected to the TIA504. The light incident surface of the optical receiving chip 503 faces the light emitting surface of the turning prism 502 to receive the optical receiving signal reflected by the turning prism 502.

[0178] The TIA 504 is located on a surface of the circuit board 300 . Exemplarily, the TIA 504 is located on the front side of the circuit board 300 and on one side of the optical receiving chip 503 . The TIA 504 is connected to the circuit board 300 by wire bonding.

[0179] In some embodiments, after entering the optical module, the optical receiving signal enters the optical waveguide substrate 900a from the first input optical port 901a of the optical waveguide substrate 900a along the internal optical fiber, is output from the first output optical port 902a along the internal optical channel, is transmitted to the first lens 501, and after being converged by the first lens 501, continues to be transmitted to the turning prism 502. After being reflected by the inclined surface of the turning prism 502, the optical path turns downward and turns to the surface of the optical receiving chip 503 on the circuit board 300. The optical receiving chip 503 converts the received optical receiving signal into a photocurrent signal, and then the TIA504 converts the photocurrent signal into a voltage signal and amplifies the voltage signal.

[0180] The first lens 501 is located on the surface of the second surface 9242, and the light receiving chip 503 is located on the surface of the circuit board 300. The height of the second surface 9242 is higher than the height of the circuit board 300, and there is a certain positional misalignment between the first lens 501 and the light receiving chip 503. Therefore, a turning prism 502 is arranged on the output light path of the first lens 501, and the light path of the light signal transmitted through the first lens 501 is turned downward by the turning prism 502 to the surface of the light receiving chip 503.

[0181] The first lens 501 and the turning prism 502 are arranged opposite to each other so that the optical signal transmitted from the first lens 501 is incident on the turning prism 502. The focal length of the first lens 501 should be sufficient to ensure that the optical signal transmitted from the first lens 501 is reflected by the turning prism 502 and then focused on the surface of the optical receiving chip 503, thereby reducing the size of the light spot and making the optical receiving signal fall within the light receiving range of the optical receiving chip 503.

[0182] In some embodiments, the first surface 9241 where the optical waveguide substrate 900a is located, the second surface 9242 where the first lens 501 is located, and the third surface 9243 where the turning prism 502 is located are arranged in a stepped manner. The purpose of the arrangement is to make the optical axes of the optical waveguide substrate 900a, the first lens 501, and the turning prism 502 all on the same axis.

[0183] In some embodiments, one end of the circuit board 300 extends into the opening 927, and the exposed surface of the circuit board 300 relative to the cover 910 is provided with a light receiving chip 503 and a TIA 504. The optical signal output from the turning prism 502 is transmitted to the surface of the light receiving chip 503, and then the optical signal is converted and processed.

[0184] Exemplarily, a portion of the turning prism 502 is disposed on the third surface 9243; a portion is not disposed on the third surface 9243, and the portion is suspended relative to the third surface 9243, and a light receiving chip 503 is provided under the suspended portion, so that the light signal reflected by the turning prism 502 passes through the light emitting surface of the suspended portion and is transmitted to the light receiving chip 503.

[0185] Exemplarily, since the thickness of the optical waveguide substrate 900 a is smaller than the height of the first lens 501 , the height of the first surface 9241 where the optical waveguide substrate 900 a is located is higher than the height of the second surface 9242 where the first lens 501 is located.

[0186] In the present application, the optical receiving chip 503 and the optical waveguide substrate 900a are on the same layer, and the transmission of the optical receiving signal is on the same layer. There is no need to switch and guide the optical path at the upper and lower heights. The optical receiving signal transmission path is relatively simple, and there are fewer optical devices on the transmission path, thereby reducing the loss of optical power and allowing more optical receiving signals to be transmitted to the surface of the optical receiving chip 503.

[0187] In some embodiments of the present application, as the rate of the optical module increases, the photosensitive surface of the optical receiving chip 503 becomes smaller and smaller. For example, the photosensitive surface is reduced from 30um to 16um, or even 12um. However, the smaller photosensitive surface affects the optical coupling efficiency. The first lens 501 focuses the received optical receiving signal once. In order to improve the optical coupling efficiency, a second focusing may be performed before the optical receiving signal is transmitted to the surface of the optical receiving chip 503 to improve the optical coupling efficiency and increase the coupling tolerance.

[0188] In some embodiments, a spherical lens is arranged between the turning prism 502 and the light receiving chip 503, and the first lens 501 focuses the received light signal once, and the spherical lens focuses the light signal output by the turning prism 502 for a second time, thereby improving the light coupling efficiency. The light spots output by the spherical lens are mostly light spots with uneven energy distribution. When the light spots with uneven energy distribution are coupled to the photosensitive surface, the energy in a certain range of the photosensitive surface is too concentrated, resulting in a photocurrent overshoot phenomenon. At the same time, the focal length of the spherical lens is difficult to adjust, thereby affecting the light coupling efficiency. In addition, for the spherical lens, due to its manufacturing process, the poor consistency of the lens center leads to poor consistency of the optical path, which also reduces the coupling efficiency.

[0189] In some embodiments, an aspheric lens is arranged between the turning prism 502 and the light receiving chip 503. For example, such as a super lens, the first lens 501 focuses the received light signal once, and the aspheric lens focuses the light signal output by the turning prism 502 for a second time, thereby improving the light coupling efficiency. The aspheric lens has strong flexibility and freedom, and can output a uniform light spot, thereby avoiding the phenomenon of photocurrent overshoot. For example, the aspheric lens includes a substrate and a plurality of dielectric units arranged on the surface of the substrate. By changing the size or arrangement of the dielectric units, a light spot with uniform energy distribution can be output, thereby avoiding the phenomenon of photocurrent overshoot. At the same time, the focal length of the aspheric lens is easier to control. For example, the focal length is adjusted by changing the size or arrangement of the dielectric units, thereby improving the light coupling efficiency. In addition, in the present application, the aspheric lens is integrated with the light receiving chip monolithically or wafer-integrated, thereby reducing the tolerance introduced in the patch process, thereby improving the coupling efficiency.

[0190] Fig.31 is a structural diagram of a light receiving chip according to some embodiments; Fig.32Schematic diagram of a disassembled optical receiving chip according to some embodiments Figure 1 ; Fig.33 Schematic diagram of a disassembled optical receiving chip according to some embodiments Figure 2 .like Figure 31-Figure 33 As shown, in some embodiments, an aspheric lens 505 is provided on the surface of the light receiving chip 503. Relative to the aspheric lens 505, the first lens 501, the second lens 403, and the third lens 409 are spherical lenses. The aspheric lens 505 and the photosensitive surface of the light receiving chip 503 are concentrically arranged. The first lens 501 focuses the light receiving signal once and enters the turning prism 502. The aspheric lens 505 focuses the light signal reflected from the turning prism 502 for a second time, thereby reducing the spot size, so that the light spot is focused on a smaller photosensitive surface, and improving the light coupling efficiency.

[0191] The aspheric lens 505 outputs a light spot with uniform energy distribution to avoid photocurrent overshoot. At the same time, the focal length of the aspheric lens 505 is easy to adjust, so that the light spot is focused on the photosensitive surface of the light receiving chip 503, thereby improving the light coupling efficiency.

[0192] In some embodiments, the optical receiving chip 503 includes a top surface 5033, the surface of the top surface 5033 has a photosensitive surface 5031, and a GSG pad 5032 is provided on the surface surrounding the photosensitive surface 5031, and the GSG pad 5032 is a ground-signal-ground pad. As the channel transmission rate increases, the area of ​​the photosensitive surface 5031 decreases, so the light spot of the optical receiving signal coupled to the optical receiving chip 503 should be reduced in size so that the light spot falls within the photosensitive surface 5031.

[0193] In some embodiments, the aspheric lens 505 can be mounted on the surface of the light receiving chip 503. When mounting the aspheric lens 505, it is necessary to identify the relative position of the aspheric lens 505 and the center of the photosensitive surface of the light receiving chip 503. The accuracy requirement is very high. The compatibility between the channels must also be considered during array coupling.

[0194] In some embodiments, the aspheric lens 505 is combined with the light receiving chip 503 through a MEMS process to achieve optical expansion of the photosensitive surface of the front-illuminated light receiving chip 503, thereby improving the light coupling efficiency. Exemplarily, the MEMS process includes the steps of photolithography, epitaxy, thin film deposition, oxidation, diffusion, injection, sputtering, evaporation, etching, dicing and packaging.

[0195] In the present application, on the one hand, the spherical lens cannot output a uniform light spot to the light receiving chip. On the other hand, the surface of the substrate 5051 faces the turning prism 502. At this time, if a spherical lens is set on the surface of the substrate 5051, then since the spherical lens achieves the focusing effect through refraction, and the curved surface is relatively far away from the photosensitive surface of the light receiving chip 503, it is easy for the light spot output by the spherical lens to be focused above the photosensitive surface. Therefore, the lens structure set between the turning prism 502 and the light receiving chip 503 in the present application is an aspherical lens.

[0196] In some embodiments, when a non-spherical dielectric unit is etched on the surface of the substrate 5051, an aspherical lens 505 is obtained. For example, when the aspherical lens 505 is a superlens, the focal length can be adjusted by adjusting the size or arrangement of the dielectric unit and other parameters so that the output light spot falls on the photosensitive surface. Superlens, also known as supersurface lens, is a two-dimensional aspherical lens structure. Superlens focuses light through a supersurface, such as a planar two-dimensional metamaterial with sub-wavelength thickness. Compared with traditional lenses, superlenses have the advantages of thinner volume, lighter weight, lower cost, better imaging, and easier integration. It provides a potential solution for compact integrated optical systems, and can adjust the properties of light such as polarization, phase and amplitude by adjusting the shape, rotation direction, height and other parameters of the structure.

[0197] In some embodiments, the aspheric lens 505 is disposed on the surface of the light receiving chip 503 by a CMOS process. Exemplarily, a substrate 5051 is grown along the GSG pad 5032 on the top surface 5033 of the aspheric lens 505, and then a plurality of dielectric units 5052 are etched on the exposed surface of the substrate 5051, i.e., the top surface. Since the GSG pad 5032 has a certain thickness, grooves are formed on the bottom surface 5054 of the substrate 5051, and each groove is just embedded in the surface of the GSG pad 5032. Since the bottom surface of the substrate 5051 needs to be embedded in the surface of the GSG pad 5032, each groove is formed on the bottom surface of the substrate 5051, and the top surface of the substrate 5051 needs to ensure flatness to facilitate etching to form the dielectric unit 5052. Exemplarily, the center of the dielectric unit 5052 is concentric with the center of the photosensitive surface 5031 to improve the light coupling efficiency.

[0198] The material of the substrate 5051 and the dielectric unit 5052 is a light-transmitting material, such as SiO 2 The specific materials of the substrate 5051 and the dielectric unit 5052 can be flexibly selected according to the wavelength, transmittance, and CTE matching of the optical receiving signal.

[0199] In some embodiments, the dielectric unit is in the form of a dielectric column, and each dielectric column is arranged in the form of an array. The array can be a rectangular array, or the center of the substrate 5051 can be used as the center of a circle and etching is performed outward in sequence to arrange each dielectric unit, such as winding a certain number of dielectric columns into a circle, and then obtaining dielectric column array circles of different diameters.

[0200] Exemplarily, the dielectric column is a silicon column or a silicon oxide column. By adjusting the size of the dielectric column or the arrangement of each dielectric unit array, such as the arrangement interval, continuous phase adjustment is achieved, and the initial phase of the incident light incident on different positions is regulated, so that interference occurs between different incident lights, so that the energy of the incident light is gradually concentrated in the same direction, thereby achieving a focusing effect.

[0201] In the present application, by adjusting the size of the dielectric column, or the arrangement of each dielectric unit array, such as the arrangement interval, the properties of the light spot, such as the energy distribution of the light spot, can be adjusted to output a light spot with uniform energy distribution, thereby avoiding photocurrent overshoot.

[0202] In the present application, since the substrate is grown by thin film growth, in order to avoid stress, the substrate cannot be grown too thick, that is, the size of the substrate 5051 is relatively thin. At this time, the focal length of the lens on the substrate surface is required to be relatively small, so that the light spot is focused on the photosensitive surface; in some embodiments, if a spherical lens is set on the substrate surface, the focusing effect of the spherical lens is affected by the radius of curvature and the refractive index. It is difficult to adjust the radius of curvature or the refractive index so that the spherical lens has a very small focal length. At this time, the focal length of the spherical lens causes the light spot to be focused below the photosensitive surface, thereby reducing the light coupling efficiency.

[0203] Since the thickness of the substrate is very thin, the corresponding focal length is very small. Even if the radius of curvature and the refractive index of the spherical lens are adjusted to the limit, such a small focal length cannot be achieved. The focal length of the aspherical lens can be adjusted by adjusting the size of the dielectric column or the arrangement of each dielectric unit array, such as the arrangement interval, so that the aspherical lens has a smaller focal length, so as to adapt to the thinner substrate, so as to focus the light spot on the photosensitive surface. For example, the preset focal length of the aspherical lens 505 can be obtained according to the thickness of the substrate, that is, there is a preset relationship between the preset focal length of the aspherical lens 505 and the thickness of the substrate. When the substrate is thinner, the preset focal length of the preset lens is smaller. The preset focal length of the aspherical lens 505 can match the thickness of the substrate, and finally the light spot is focused on the surface of the light receiving chip 503.

[0204] In some embodiments, when mounting the light receiving chip 503, the mounting alignment is usually performed through the center of the photosensitive surface. Since the surface of the photosensitive surface is covered by the aspheric lens 505 in the present application, an identification position 5053 is formed on the surface of the aspheric lens 505. The light receiving chip 503 is mounted through the relative position relationship between the identification position 5053 and the center of the photosensitive surface 5031 to ensure the mounting accuracy.

[0205] Fig.34 FIG. 4 is a structural diagram of another optical receiving chip according to some embodiments. Fig.34 As shown, in some embodiments, an aspheric lens 506 is mounted on the surface of the light receiving chip 503, and there is a certain distance between the substrate of the aspheric lens 506 and the surface of the light receiving chip 503. The aspheric lens 506 and the photosensitive surface of the light receiving chip 503 are concentrically arranged. The first lens 501 focuses the light signal once and enters the turning prism 502. The aspheric lens 506 focuses the light signal reflected from the turning prism 502 for a second time, thereby reducing the size of the light spot, so that the light spot is focused on a smaller photosensitive surface, and the light coupling efficiency is improved.

[0206] The aspheric lens 506 outputs a light spot with uniform energy distribution to avoid photocurrent overshoot. At the same time, the focal length of the aspheric lens 506 is easy to adjust, so that the light spot is focused on the photosensitive surface of the light receiving chip 503, thereby improving the light coupling efficiency.

[0207] In some embodiments, the aspheric lens 506 may be bonded to the surface of the light receiving chip 503 by optical adhesive; in some embodiments, the aspheric lens 506 may also be combined with the light receiving chip 503 by MEMS technology.

[0208] Fig.35 FIG. 2 is a schematic diagram of another optical receiving chip according to some embodiments. Figure 1 ; Fig.36 FIG. 2 is a schematic diagram of another optical receiving chip according to some embodiments. Figure 2 ; Fig.37 FIG. 1 is a schematic diagram of a partial structure of another optical receiving chip according to some embodiments. Figure 35-Figure 37 As shown, in some embodiments, the aspheric lens 505 is a super lens. When the aspheric lens 506 is a super lens, and the super lens is combined with the light receiving chip 503 through the CMOS process, in addition to the photosensitive surface 5031 and the GSG pad 5032, the surface of the light receiving chip 503 is also formed with a connecting pad 5034. Exemplarily, the connecting pad 5034 is used to connect the light receiving chip 503 and the super lens.

[0209] In some embodiments, when the aspheric lens 506 is a super lens, the aspheric lens 5056 includes a substrate 5061, a dielectric unit 5062 formed by etching the top surface of the substrate 5061, and a protrusion 5063 formed by electroplating the bottom surface of the substrate 5061. Exemplarily, the substrate 5061 is a silicon-based wafer, and the dielectric unit 5062 is formed by etching on the surface of the silicon-based wafer; Exemplarily, the protrusion 5063 is in the form of a convex column, and the convex column can be in the form of a metal column, such as a copper column. The protrusion 5063 is connected to the connecting pad 5034 by metal solder, thereby realizing the connection between the light receiving chip 503 and the super lens.

[0210] Similarly, the dielectric unit is in the form of a dielectric column, and each dielectric column is arranged in the form of an array. The array can be a rectangular array, or the center of the substrate 5051 can be used as the center of a circle and etching is performed outward in sequence to arrange each dielectric unit, such as winding a certain number of dielectric columns into a circle, and then obtaining dielectric column array circles of different diameters.

[0211] Exemplarily, the dielectric column is a silicon column or a silicon oxide column. By adjusting the size of the dielectric column or the arrangement of each dielectric unit array, such as the arrangement interval, the properties of the light spot, such as the light spot energy distribution, can be adjusted to output a light spot with uniform energy distribution, thereby avoiding the photocurrent overshoot phenomenon.

[0212] In some embodiments, an aspheric lens, such as a super lens, is disposed on the surface of the substrate. The focal length can be adjusted by adjusting the size of the dielectric column or the arrangement of each dielectric unit array, such as the arrangement spacing, so that the aspheric lens has a smaller focal length to adapt to a thinner substrate, thereby focusing the light spot on the photosensitive surface.

[0213] Since there is a protrusion 5063 between the substrate 5061 and the photosensitive surface of the light receiving chip 503, the upper and lower surfaces of the substrate 5061 can be etched to form a dielectric unit.

[0214] The protrusion 5063 has a preset height to match the focal length of the aspheric lens 506 so that the output light spot is focused on the photosensitive surface of the light receiving chip 503 .

[0215] In some embodiments, an identification position 5064 is formed on the surface of the aspheric lens 506 , and the light receiving chip 503 is mounted based on the relative position relationship between the identification position 5064 and the center of the photosensitive surface 5031 to ensure mounting accuracy.

[0216] Fig.38 FIG. 4 is a cross-sectional view of the internal structure of another optical module according to some embodiments. Fig.38As shown, in some embodiments, an aspheric lens 507 is provided on the light-emitting surface of the turning prism 502 , and the aspheric lens 507 is adhered to the light-emitting surface of the turning prism 502 by optical adhesive.

[0217] The optical signal output by the turning prism 502 is converged by the aspheric lens 507 and then incident on the surface of the optical receiving chip 503, thereby further reducing the size of the optical signal spot through secondary focusing, so that the spot falls on the photosensitive surface of the optical receiving chip 503, thereby improving the optical coupling efficiency.

[0218] In some embodiments, the aspheric lens 507 also includes a substrate, and a dielectric unit is etched on the surface of the substrate. The focal length of the dielectric unit is adjusted by changing the size or arrangement of the dielectric unit so that the light spot is focused on the photosensitive surface, and the output light spot is a light spot with uniform energy distribution.

[0219] In some embodiments, the substrate of the aspheric lens 507 is connected to the light-emitting surface of the turning prism 502 , and a dielectric unit is formed by etching on the surface of the substrate facing the light receiving chip.

[0220] In some embodiments of the present application, the light-emitting surface of the turning prism 502 is used as a substrate, and a dielectric unit is formed thereon. Since the light-emitting surface of the turning prism 502 is made of glass, it is difficult to form the dielectric unit through an etching process. Exemplarily, the dielectric unit can be formed by melt injection molding.

[0221] Fig.39 FIG. 4 is a cross-sectional view of the internal structure of another optical module according to some embodiments. Fig.39 As shown, a support portion 508a is provided on the surface of the circuit board 300, and an aspheric lens 508 is provided on the surface of the support portion 508a. The aspheric lens 508 is arranged between the turning prism 502 and the light receiving chip 503. The aspheric lens 508 performs secondary focusing on the light signal reflected from the turning prism 502 to reduce the size of the light signal spot so that the spot falls on the photosensitive surface of the light receiving chip 503, thereby improving the light coupling efficiency.

[0222] In some embodiments, the aspheric lens 508 also includes a substrate, and a dielectric unit is formed by etching the surface of the substrate. The substrate in the aspheric lens 508 is manufactured by the same process as the substrate in the aspheric lens 506, and the dielectric unit in the aspheric lens 508 is manufactured by the same process as the dielectric unit in the aspheric lens 506. The substrate of the aspheric lens 508 is a silicon-based wafer, and a dielectric unit is formed by etching the surface of the silicon-based wafer. The dielectric unit in the aspheric lens 508 is also a super lens, and by adjusting the initial phase of the incident light incident on different positions, interference occurs between different incident lights, so that the energy of the incident light is gradually concentrated in the same direction, thereby achieving a focusing effect.

[0223] In the present application, the optical receiving chip 503 and the optical waveguide substrate 900a are in the same layer, the transmission of the optical receiving signal is same-layer transmission, and the transmission optical path of the optical receiving signal is simple; the laser chip 402 and the optical waveguide substrate 900a are in different layers, the transmission of the optical transmitting signal is cross-layer transmission, and the transmission optical path of the optical transmitting signal is relatively complex. When active coupling is performed, since the optical transmitting end has its own light source, the optical power loss borne by the optical transmitting end is higher than that of the optical receiving end, so the optical receiving end needs to make a simpler optical path than the optical transmitting end, that is, the optical transmitting end is more suitable for making a complex optical path than the optical receiving end. For this reason, in the present application, the transmission of the optical receiving signal and the optical waveguide substrate 900a are set as same-layer transmission, and the transmission of the optical transmitting signal and the optical waveguide substrate 900a are set as cross-layer transmission.

[0224] Fig.40 FIG. 1 is a schematic diagram of an assembly of a base and a circuit board according to some embodiments. Fig.40 As shown, the reverse side of the circuit board 300 is in the same direction as the bottom surface of the base 920. As can be seen from the above, the reverse side of the circuit board 300 refers to the opposite side where the DSP chip 302 is provided.

[0225] The bottom surface of the base 920 is further provided with a cover 940 , which is buckled on the bottom surface of the base 920 to protect the light emitting component.

[0226] Fig.41 is a structural diagram of a light emitting component according to some embodiments, Fig.42 FIG. 4 is a cross-sectional view of a light emitting component according to some embodiments. Fig.41 and Fig.42 As shown, after opening the cover 940 from the bottom surface of the base 920, it can be seen that the bottom surface of the base 920 is recessed toward the upper space 924 to form a lower space 925, and the lower space 925 includes a first recessed portion 9251 and a second recessed portion 9252 with different recessed degrees. Optical elements of the light emitting end, such as TEC401, laser chip 402, second lens 403, reflector, etc., are respectively arranged in the lower space 925. The light emitted by the laser chip 402 is divergent light; the second lens 403 is a collimating lens, which is used to collimate the divergent light emitted by the laser chip 402 into parallel light; the third lens 409 is a converging lens. When the optical module is multi-channel, the laser chip 402, the second lens 403, the third lens 409, etc. are arranged in the form of an array. The laser chip 402 and the second lens 403 are both arranged on the surface of TEC401. The second lens 403 is arranged on the light output path of the laser chip 402. TEC401 is used to ensure that the laser chip 402 is within a certain working range, thereby ensuring the stability of the output optical power of the laser chip 402.

[0227] TEC401, laser chip 402, and second lens 403 constitute a light-emitting component, which is arranged in the first recessed portion 9251. Since the laser chip 402 is located in the lower space 925 and the optical waveguide substrate 900a is located in the upper space 924, it is necessary to guide the optical path to guide the light emission signal generated by the laser chip 402 to the optical waveguide substrate 900a, so as to transmit the light emission signal through the optical waveguide substrate 900a. To this end, a reflector is arranged on the light output path of the laser chip 402, and the reflector is used to guide the light emission signal toward the side wall of the base 920, exemplarily, the light emission signal is guided toward the side wall of the baffle 923; then, a displacement prism is arranged on the side wall of the base 920, exemplarily, on the side wall of the baffle 923, and the reflector reflects the light emission signal toward the displacement prism, and guides the light emission signal into the optical waveguide substrate 900a through the displacement prism, exemplarily, the light emission signal is guided into the second input optical port 903a, thereby transmitting the light emission signal to the optical waveguide substrate 900a through the second input optical port 903a, and transmitting the light emission signal through the optical waveguide substrate 900a.

[0228] In some embodiments, the side of the second recessed portion 9252 is connected to a vertical surface, and the reflector is arranged on the vertical surface, thereby fixing the reflector. Since the TEC 401 in the light-emitting assembly has a certain height, in order to ensure that the collimated light transmitted from the second lens 403 is incident on the reflector, the first recessed portion 9251 is more recessed than the second recessed portion 9252.

[0229] In some embodiments, the light input end and the light output end of the displacement prism are exposed relative to the baffle 923, the light input end of the displacement prism faces the lower space 925, and the light output end of the displacement prism faces the upper space 924. The displacement prism is used to guide the light emission signal generated by the laser chip 402 to the second input light port 903a located in the upper space 924, and then the light emission signal is transmitted to the optical waveguide substrate 900a.

[0230] In some embodiments, when the optical module is an 800G optical module, it includes 8 laser chips 402, and the 8 laser chips 402 are divided into two groups, namely a first laser chip array 402a and a second laser chip array 402b. The first laser chip array 402a and the second laser chip array 402b include 4 laser chips 402 respectively. In order to monitor the working temperature of the laser chip 402, a thermistor is provided between the first laser chip array 402a and the second laser chip array 402b, that is, a thermistor is provided between two adjacent laser chips in the first laser chip array 402a and the second laser chip array 402b, and the four laser chips 402 in the first laser chip array 402a are equally spaced, and the four laser chips 402 in the second laser chip array 402b are equally spaced. However, the presence of the thermistor increases the distance between the last laser chip 402 in the first laser chip array 402a and the first laser chip 402 in the second laser chip array 402b, that is, the distance between two adjacent laser chips in the first laser chip array 402a and the second laser chip array 402b increases. To this end, illustratively, the reflector includes a first reflector 404 and a second reflector 405, and the first reflector 404 and the second reflector 405 are offset to compensate for the optical channel spacing difference caused by the presence of the thermistor.

[0231] Correspondingly, when the number of laser chips 402 is 8, the number of second lenses 403 is 8, and the 8 second lenses 403 are divided into two groups, namely the first lens array 403a and the second lens array 403b. The first lens array 403a is arranged on the output optical path of the first laser chip array 402a, and the two correspond one to one; the second lens array 403b is arranged on the output optical path of the second laser chip array 402b, and the two correspond one to one.

[0232] The light incident surface of the first lens array 403a is arranged opposite to the light emitting surface of the first laser chip array 402a, and the light emitting surface is arranged opposite to the first reflector 404, so that the light emission signal emitted by the first laser chip array 402a is incident on the surface of the first reflector 404 after passing through the first lens array 403a, and the first reflector 404 reflects and transmits the received light emission signal.

[0233] The light incident surface of the second lens array 403b is arranged opposite to the light emitting surface of the second laser chip array 402b, and the light emitting surface is arranged opposite to the second reflector 405, so that the light emission signal emitted by the second laser chip array 402b is incident on the surface of the second reflector 405 after passing through the second lens array 403b, and the second reflector 405 reflects and transmits the received light emission signal.

[0234] In order to set the first reflector 404 and the second reflector 405, a first vertical surface 9253 and a second vertical surface 9254 are respectively connected to one side of the second recessed portion 9252. The first vertical surface 9253 and the second vertical surface 9254 are perpendicular to the surface of the second recessed portion 9252. The first vertical surface 9253 is used to set the first reflector 404, and the second vertical surface 9254 is used to set the second reflector 405. Exemplarily, the first reflector 404 is attached to the surface of the first vertical surface 9253, and the second reflector 405 is attached to the surface of the second vertical surface 9254, so as to achieve the fixation of the first reflector 404 and the second reflector 405.

[0235] Fig.43 FIG. 1 is a partial structural diagram of a light emitting component according to some embodiments. Fig.43 As shown, the divergent light output by the laser chip 402 is converted into collimated light after being collimated by the second lens 403 , and the collimated light beam transmitted through the second lens 403 is incident on the surface of the corresponding first reflector 404 or the second reflector 405 .

[0236] In some embodiments, the first reflector 404 is in the form of a long reflector, which receives the light signal transmitted from the first lens array 403a with a larger light receiving area; the second reflector 405 is also in the form of a long reflector, which receives the light signal transmitted from the second lens array 403b with a larger light receiving area.

[0237] In order to compensate for the optical channel spacing difference caused by the position of the thermistor, the first reflector 404 and the second reflector 405 are staggered. Exemplarily, the first reflector 404 is farther away from the position of the second lens 403 than the second reflector 405 .

[0238] Fig.44 is a light path diagram of a light emitting component according to some embodiments; Fig.45 is a side cross-sectional view 1 of a light emitting component according to some embodiments; Fig.46 FIG. 2 is a side cross-sectional view of a light emitting component according to some embodiments. Figure 44-Figure 46 As shown, the displacement prism is arranged on the side wall of the base 920. Exemplarily, the displacement prism is arranged on the side wall of the baffle 923. The light input end of the displacement prism is toward the layer where the laser chip 402 is located, and the light output end is toward the light input end of the optical waveguide substrate 900a, such as toward the second input light port 903a, so as to guide the light emission signal output by the reflector toward the second input light port 903a.

[0239] In order to correspond to the first reflector 404 and the second reflector 405, the displacement prism includes a first displacement prism 406 and a second displacement prism 407. The first reflector 404 corresponds to the first displacement prism 406, and the second reflector 405 corresponds to the second displacement prism 407. The light-emitting surface of the first reflector 404 faces the light-incident surface of the first displacement prism 406, so that the light signal output by the first reflector 404 is transmitted to the surface of the first displacement prism 406; the light-emitting surface of the second reflector 405 faces the light-incident surface of the second displacement prism 407, so that the light signal output by the second reflector 405 is transmitted to the surface of the second displacement prism 407.

[0240] In some embodiments, the first displacement prism 406 and the second displacement prism 407 are both fixed in a fixing frame 408, the fixing frame 408 wraps the first displacement prism 406 and the second displacement prism 407, and then the fixing frame 408 is fixed in the embedded portion 926 on the side wall of the base 920, thereby fixing the first displacement prism 406 and the second displacement prism 407.

[0241] In order to facilitate the transmission of the optical path, the hollow size of the embedded portion 926 exposes the upper and lower surfaces of the partition 923, and the light input end of the displacement prism faces the lower surface of the partition 923, and the light output end faces the upper surface of the partition 923. Then, the light input end and the light output end of the displacement prism are both exposed relative to the partition 923, which is beneficial to the transmission of light emission signals on the upper and lower surfaces of the partition. For example, the light emission signals transmitted to the first displacement prism 406 and the second displacement prism 407 are transmitted on the lower surface of the partition, and the light emission signals output from the first displacement prism 406 and the second displacement prism 407 are transmitted on the upper surface of the partition.

[0242] The first displacement prism 406 and the second displacement prism 407 are respectively used to turn the transmission direction of the optical emission signals generated by the first laser chip array 402a and the second laser chip array 402b toward the optical waveguide substrate 900a, so as to transmit the optical emission signals emitted by the optical emission components to the outside of the optical module through the optical waveguide substrate 900a.

[0243] One end of the first displacement prism 406 faces the first reflector 404, and the other end faces the optical waveguide substrate 900a. One end of the second displacement prism 407 faces the second reflector 405, and the other end faces the optical waveguide substrate 900a, so as to respectively reflect the optical signals reflected by the corresponding reflectors, so that the optical transmission signal is transmitted to the optical waveguide substrate 900a.

[0244] In some embodiments, the first displacement prism 406 is used to receive the optical signals outputted sequentially from the first laser chip array 402a, the first lens array 403a, and the first reflector 404, and change the transmission direction of the optical signals. For example, the optical signals are reflected twice on the bottom surface of the base 920 and then turned to be transmitted on the top surface of the base 920. Similarly, the second displacement prism 407 also has the same function.

[0245] The first displacement prism 406 includes a straight surface, a first inclined surface, and a second inclined surface. One end of the straight surface is connected to the first inclined surface, and the other end of the straight surface is connected to the second inclined surface. The straight surface is both a light incident surface and a light emitting surface. The straight surface faces the first reflector 404 and the optical waveguide substrate 900a at the same time. The portion of the straight surface as the light incident surface faces the first reflector 404, and the portion of the straight surface as the light emitting surface faces the optical waveguide substrate 900a. The first inclined surface and the second inclined surface are arranged opposite to each other, and the inclination trend of the first inclined surface is arranged opposite to the inclination trend of the second inclined surface. The first inclined surface faces the bottom surface of the base 920, illustratively, toward the first reflector 404; the second inclined surface faces the top surface of the base 920, illustratively, toward the direction where the third lens 409 and the optical waveguide substrate 900a are located. The second inclined surface faces the third lens 409, and the third lens 409 faces the second input optical port 903a of the optical waveguide substrate 900a, so that the optical emission signal output by the laser chip 402 is transferred to the second input optical port 903a of the optical waveguide substrate 900a, and transmitted to the second output optical port 904a along the optical channel in the optical waveguide substrate 900a, and output along the second output optical port 904a, output to the internal optical fiber, and then transmitted to the outside of the optical module along the external optical fiber, so as to realize the emission of the optical emission signal. Similarly, the working principle of the second displacement prism 407 is the same.

[0246] The first inclined surface of the first displacement prism 406 faces the first reflector 404, and is used for receiving the light emission signal reflected by the first reflector 404, and reflecting the light emission signal reflected by the first reflector 404 toward the second inclined surface; the second inclined surface faces the direction of the third lens 409 and the optical waveguide substrate 900a, and is used for receiving the light emission signal reflected from the first inclined surface, and reflecting the light signal reflected by the first inclined surface, so that the transmission direction of the light emission signal is toward the third lens 409, and then toward the optical waveguide substrate 900a.

[0247] The first displacement prism 406 and the second displacement prism 407 are both vertically arranged across the side wall of the bottom surface to the side wall of the top surface of the base 920, so that the light path turns to the top surface of the base 920 after being transmitted in the first displacement prism 406, and illustratively enters the optical waveguide substrate 900a on the top surface of the base 920.

[0248] In some embodiments, the light emission signal reflected from the first reflector 404 first reaches the first inclined surface of the first displacement prism 406, and then reaches the second inclined surface after being reflected by the first inclined surface. Then, after being reflected by the second inclined surface, the light emission signal is output through a straight surface and reaches the third lens 409. The third lens 409 faces the second input optical port 903a of the optical waveguide substrate 900a, thereby turning the light emission signal generated by the laser chip 402 to the second input optical port 903a of the optical waveguide substrate 900a, transmitting it along the optical channel in the optical waveguide substrate 900a to the second output optical port 904a, and outputting it along the second output optical port 904a. Therefore, the first displacement prism 406 can perform two reflections and two turns of the transmission direction of the optical signal: the first reflection is performed by the first inclined surface, and the optical signal reflected from the first reflector 404 is reflected to the second inclined surface, and the transmission direction of the optical emission signal is turned from the direction along the output optical path of the first reflector 404 to the vertical direction, that is, to the second inclined surface; the second reflection is performed by the second inclined surface, and the optical signal reflected to the second inclined surface is turned from the vertical direction to the direction toward the optical waveguide substrate 900a. The "vertical direction" refers to the direction from the upper space 924 to the lower space 925.

[0249] In some embodiments, the third lens 409 is arranged in an array on the surface of the fourth surface 929, and the fourth surface 929 is located on the side of the second input light port 903a of the optical waveguide substrate 900a, so that the optical signal transmitted by the third lens 409 enters the optical waveguide substrate 900a from the second input light port 903a.

[0250] In some embodiments, the fourth surface 929 on which the third lens 409 is disposed is more recessed relative to the first surface 9241 on which the optical waveguide substrate 900a is disposed, so as to make the light output axis of the third lens 409 and the light input axis of the optical waveguide substrate 900a be on the same straight line.

[0251] In the embodiment of the present application, by setting the displacement prism along the vertical direction, the first inclined surface in the displacement prism faces the bottom surface of the base 920, and the second inclined surface faces the top surface of the base 920, the displacement prism is vertically arranged across the side wall of the base 920, so that the light path originally on the bottom surface of the base 920 can be turned twice, thereby turning the light path to the bottom surface of the base 920, illustratively, to the optical waveguide substrate 900a arranged on the bottom surface of the base 920, wherein the "vertical direction" refers to the direction from the upper space 924 to the lower space 925.

[0252] In the embodiment of the present application, the optical waveguide substrate 900a and the optical receiving chip 503 are both located in the upper space, i.e., the top surface of the baffle 923, so that the optical receiving signal can be directly transmitted to the optical receiving chip 503 along the optical channel inside the optical waveguide substrate 900a, thereby realizing the reception of the optical signal; since the laser chip 402 is located in the lower space, i.e., the bottom surface of the baffle 923, the optical emission signal generated by the laser chip 402 is guided by the reflector and the displacement prism to guide the optical emission signal to the second input optical port 903a of the optical waveguide substrate 900a, thereby realizing the emission of the optical signal.

[0253] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An optical module, characterized in that: include: Circuit boards; A cover shell, one end of which is formed with an optical fiber port so that the internal optical fiber can extend into the interior of the cover shell; A base, one end of which is formed with an opening so that the circuit board can extend into the base; An optical waveguide substrate is arranged between the cover shell and the base, and the internal optical fiber passes through the optical fiber port and enters the interior of the cover shell until it is connected with the optical waveguide substrate; the optical waveguide substrate includes a first input optical port and a first output optical port arranged on opposite sides to transmit a light receiving signal, and also includes a second input optical port and a second output optical port arranged on adjacent sides to transmit a light transmitting signal; the first input optical port and the second output optical port are on the same side, and the first output optical port and the second input optical port are on different sides; A turning prism, disposed at one side of the first light output port, for receiving and reflecting the light receiving signal; A light receiving chip, disposed on a surface of the circuit board, for receiving a light receiving signal reflected by the turning prism; a laser chip, which is not disposed on the surface of the circuit board and is electrically connected to another surface of the circuit board, wherein the laser chip and the optical waveguide substrate are located in different layers and are used to generate a light emission signal; A reflector, disposed on the light-emitting optical path of the laser chip, for reflecting the light emission signal toward the side wall of the base; A displacement prism is arranged on the side wall of the base, with the light input end facing the layer where the laser chip is located and the light output end facing the second input light port, and is used to guide the light emission signal output by the reflector to the second input light port so as to transmit the light emission signal through the optical waveguide substrate.

2. The optical module according to claim 1, characterized in that: The cover shell includes a first side wall and a second side wall that are oppositely disposed, and the base includes a third side wall and a fourth side wall, and the width between the third side wall and the fourth side wall is greater than the width between the first side wall and the second side wall, so that the cover shell is disposed between the third side wall and the fourth side wall; The base includes a baffle, an upper space located above the baffle, and a lower space located below the baffle; The optical waveguide substrate is located between the cover shell and the upper space, and the turning prism is located in the upper space; The laser chip is located in the lower space; The displacement prism is located on the side wall of the partition, the light input end and the light output end of the displacement prism are exposed relative to the partition, the light input end of the displacement prism faces the lower space, and the light output end of the displacement prism faces the upper space.

3. The optical module according to claim 2, characterized in that: An embedding portion is formed on the third side wall, and the embedding portion exposes the upper and lower surfaces of the barrier, and the embedding portion is used to embed the displacement prism.

4. The optical module according to claim 2, characterized in that: A third lens is provided between the displacement prism and the second input light port. The third lens is provided in the upper space and is used for converging the light emission signal output by the displacement prism into the optical waveguide substrate through the second input light port.

5. The optical module according to claim 1, characterized in that: The base includes a baffle, an upper space located above the baffle, and a lower space located below the baffle; The lower space is recessed toward the upper space to form a first recessed portion and a second recessed portion, respectively. The first recessed portion is used to arrange the laser chip, and the vertical surface of the second recessed portion is used to arrange the reflector.

6. The optical module according to claim 1, characterized in that: The optical module further comprises an interface claw, one end of which is respectively formed with a first claw and a second claw which are arranged opposite to each other up and down, an optical fiber plug is arranged between the first claw and the second claw, and an internal optical fiber is arranged at the end of the optical fiber plug; The cover shell includes a main body structure and an extension plate extending relative to the main body structure; a first clamping portion is formed on the surface of the main body structure, and a fiber port and a second clamping portion are respectively formed on the surface of the extension plate, wherein the first clamping portion and the second clamping portion are respectively located at the upper and lower sides of the fiber port; The first clamping claw is connected to the first clamping portion, and the second clamping claw is connected to the second clamping portion; The optical fiber plug is optically connected to the optical fiber port so that the internal optical fiber passes through the optical fiber port until it is connected to the optical waveguide substrate.

7. The optical module according to claim 6, characterized in that: A supporting groove is formed at the other end of the base, the extension plate is embedded in the supporting groove, and the surface of the supporting groove is recessed downward to form a third clamping portion, and the third clamping portion is arranged opposite to the second clamping portion.

8. The optical module according to claim 1, characterized in that: The base includes a third side wall and a fourth side wall; The surface of the light receiving chip is covered with a protective cover; The surface of the protective cover is respectively formed with a first notch and a second notch, the first notch is used to connect with the base, and the second notch is used to avoid the fourth side wall; wherein, the first notch is overlapped with the surface of the base, there is a gap between the side wall of the first notch and the third side wall, and the second notch is spliced ​​with the fourth side wall.

9. The optical module according to claim 1, characterized in that: An aspheric lens is provided between the turning prism and the light receiving chip. The aspheric lens is provided on the light output path of the turning prism and includes a substrate and a dielectric unit provided on the surface of the substrate. The aspheric lens is used to adjust the focal length by changing the size or arrangement of the dielectric unit, thereby converging the light signal output by the turning prism into a light spot.

10. An optical module, characterized in that: include: Circuit boards; A cover shell, one end of which is formed with an optical fiber port so that the internal optical fiber can extend into the interior of the cover shell; A base, one end of which is formed with an opening so that the circuit board can extend into the base; An optical waveguide substrate is arranged between the cover shell and the base, and the internal optical fiber passes through the optical fiber port and enters the interior of the cover shell until it is connected with the optical waveguide substrate; the optical waveguide substrate includes a first input optical port and a first output optical port arranged on opposite sides to transmit a light receiving signal, and also includes a second input optical port and a second output optical port arranged on adjacent sides to transmit a light transmitting signal; the first input optical port and the second output optical port are on the same side, and the first output optical port and the second input optical port are on different sides; A turning prism, disposed at one side of the first light output port, for receiving and reflecting the light receiving signal; A light receiving chip, disposed on a surface of the circuit board, for receiving a light receiving signal reflected by the turning prism; a laser chip, which is not disposed on the surface of the circuit board and is electrically connected to another surface of the circuit board, wherein the laser chip and the optical waveguide substrate are located in different layers and are used to generate a light emission signal; A reflector, disposed on the light-emitting optical path of the laser chip, for reflecting the light emission signal toward the side wall of the base; a displacement prism, arranged on the side wall of the base, with a light input end facing the layer where the laser chip is located and a light output end facing the second input light port, and used for guiding the light emission signal output by the reflector into the second input light port, so as to transmit the light emission signal through the optical waveguide substrate; The third lens is arranged between the displacement prism and the second input light port.

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