Sealing structure for photoelectric transceiving device

Abstract

A sealing structure for a photoelectric transceiver comprises a first shell, a second shell and a sealing assembly. And the photoelectric transceiving device is arranged between the first shell and the second shell. The at least one notch portion is disposed between the peripheral portions of the first housing and the second housing. The sealing assembly comprises at least one retaining block, the retaining block is arranged in the notch part and surrounds a part of the optical fiber assembly, and the optical fiber assembly is arranged in the photoelectric transceiving device and extends out of the notch part, so that the photoelectric transceiving device is prevented from being damaged due to permeation or leakage of the cooling liquid.

Description

Technical Field

[0001] The present invention relates to the technical field of optoelectronic devices, and in particular to a sealing structure of an optoelectronic transceiver used in an immersion cooling system. Background Art

[0002] Optoelectronic integrated circuits (OEICs) use photons instead of electrons to perform calculations and data transmission in integrated circuits, bringing great benefits to the development of industries that require high-efficiency data exchange, long-distance interconnection, 5G facilities and computing equipment. Optoelectronic integrated circuits are configured with photonic integrated circuits (PICs) and electronic integrated circuits (EICs), and can be packaged together as co-packaged optical components (CPOs). Today, CPO modules are widely used in servers, and it is well known that servers generate a lot of heat energy during operation. In order to avoid degradation of operating performance, the circuit boards in the server are immersed in the heat dissipation liquid in the cooling container to absorb the heat energy generated by the electronic components. This heat exchange method requires a large amount of heat dissipation liquid or fluid coolant, which is prone to leakage during use. Unfortunately, there is currently no mature or effective solution to this problem. Summary of the invention

[0003] The purpose of the present application is to provide a sealing structure for an optoelectronic transceiver used in an immersion cooling system, so as to effectively prevent the optoelectronic transceiver from being damaged due to penetration or leakage of cooling liquid.

[0004] In order to achieve the above-mentioned purpose, one aspect of the present application provides a sealing structure for an optoelectronic transceiver, wherein the optoelectronic transceiver includes a main board, a carrier board arranged on the main board, a processing unit arranged on the carrier board, and at least one optical fiber assembly connected to the processing unit. The sealing structure includes a first shell, a second shell, and a sealing assembly, wherein the second shell is arranged on the carrier board and assembled with the first shell, so that a part of the optical fiber assembly and the processing unit are arranged between the first shell and the second shell. At least one notch is arranged between the surrounding parts of the first shell and the second shell. The sealing assembly includes at least one retaining block, wherein the at least one retaining block is arranged in the notch and surrounds another part of the optical fiber assembly extending out of the notch.

[0005] Optionally, the first housing includes a first covering portion, the first covering portion covers the portion of the optical fiber assembly and the processing unit. The sealing assembly further includes a first sealing strip, a sealing block is disposed on the first sealing strip. The first sealing strip is disposed around the first covering portion facing the second housing. The thickness of the sealing block is greater than the thickness of the first sealing strip, and the sealing block is disposed to abut against the retaining block in the notch portion.

[0006] Optionally, the sealing block includes a pair of first protrusions extending outward from opposite sides of the first sealing strip to fit in the notch.

[0007] Optionally, the second shell includes a second covering portion, which supports the portion of the optical fiber assembly and the processing unit; the sealing assembly also includes a second sealing strip, on which a positioning block is provided, the second sealing strip is arranged around the second covering portion facing the first sealing strip, and the positioning block is arranged to abut against the retaining block in the recessed portion.

[0008] Optionally, the first shell further includes a first frame portion, which is disposed around the first covering portion and protrudes toward the second shell to form a first groove, and the first sealing strip is disposed in the first groove.

[0009] Optionally, the second shell further includes a second frame portion, which is disposed around the second covering portion and protrudes toward the first shell to form a second groove, and the second sealing strip is disposed in the second groove.

[0010] Optionally, the positioning block includes a pair of second protrusions extending outward from opposite sides of the second sealing strip to fit with the notch.

[0011] Optionally, the sealing assembly further comprises a third sealing strip, wherein the third sealing strip is disposed on a surface of the second shell, the surface of the second shell being opposite to a surface facing the second sealing strip.

[0012] Optionally, the second frame portion includes a third groove, the third groove is located below the second groove and is exposed to the outside in a direction opposite to the second groove, and the third sealing strip is arranged in the third groove.

[0013] Optionally, the first shell includes a first covering portion and a first frame portion, the first frame portion is arranged around the first covering portion and protrudes toward the second shell, and includes a first groove and a filling port connected to the first groove, and the sealing assembly also includes a sealing material filled by the filling port to fill the first groove and surround the retaining block in the recessed portion.

[0014] Optionally, the second shell includes a second covering portion and a second frame portion, the second frame portion is arranged around the second covering portion corresponding to the first frame portion, and includes a second groove communicating with the first groove, and the sealing material fills the second groove.

[0015] Optionally, the second frame portion further includes a third groove, which is located below the second groove and exposed to the outside in a direction opposite to the second groove, and the third groove is connected to the second groove, so that the sealing material fills the third groove from the second groove.

[0016] Optionally, the first shell includes a first frame portion, the second shell includes a second frame portion, the notch portion is located between the first frame portion and the second frame portion, and the first frame portion and the second frame portion are soldered or welded along the joint between the first shell and the second shell and the boundary between the first shell, the second shell and the retaining block, so that the first shell and the second shell are fixed together, and the retaining block, the first shell and the second shell are airtightly configured.

[0017] Optionally, the notch portion includes a first notch and a second notch, the first notch is arranged on the first shell, the second notch is arranged on the second shell and corresponds to the first notch, and the retaining block is located between the first notch and the second notch.

[0018] Optionally, the optoelectronic transceiver device further comprises a plurality of functional lines, one end of each of the functional lines is connected to the carrier board, and the other end of each of the functional lines passes through the sealing assembly and extends out of the main board.

[0019] Optionally, the retaining block includes an alloy body, a metal coating and a covering assembly, wherein the metal coating completely covers the other part of the optical fiber assembly, the alloy body combines the metal coating with the other part of the optical fiber assembly, and the covering assembly seals the opposite ends of the alloy body.

[0020] Optionally, the optoelectronic transceiver device further comprises at least one optoelectronic transceiver module connected to the optical fiber assembly, wherein the optoelectronic transceiver module comprises a base and a waveguide device disposed in the base.

[0021] Optionally, the optical fiber assembly includes a plurality of optical fibers and a docking connector, and the docking connector is configured to be connected to an optoelectronic transceiver connector.

[0022] Another aspect of the present application provides a sealing structure for an optoelectronic transceiver device, the optoelectronic transceiver device comprising a mainboard, a carrier board arranged on the mainboard, a processing unit arranged on the carrier board, and at least one optoelectronic transceiver module connected to the processing unit. The sealing structure comprises: a first shell, a second shell, and a sealing assembly, the second shell being arranged on the carrier board and assembled with the first shell so that a part of the optoelectronic transceiver module and the processing unit are arranged between the first shell and the second shell; the sealing assembly is arranged between the first shell and the second shell. The optoelectronic transceiver module comprises a detachable optical coupling structure. The optical coupling structure comprises a first connector and a second connector. The first connector is arranged on the carrier board and comprises a base and a waveguide device arranged in the base. The second connector comprises an optical fiber assembly, wherein the second connector is detachably connected to the first connector.

[0023] Optionally, at least one recess is provided between the peripheral portions of the first shell and the second shell, the sealing assembly comprises at least one retaining block, and the at least one retaining block is located in the recess and surrounds a portion of the optical fiber assembly extending out of the recess.

[0024] In the embodiment of the present application, the sealing structure enables the optoelectronic transceiver in the immersion cooling system to have good airtightness, which prevents liquid, moisture or air from entering the accommodation space, thereby protecting the internal components from damage caused by penetration or leakage problems. In addition, a portion of the optical fiber assembly is surrounded and retained in a retaining block in the recessed portion together with the sealing material, the welding material (or the stacking configuration of the first sealing strip and the second sealing strip), further ensuring the sealed state of the optoelectronic transceiver. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to describe the technical solutions in the embodiments of the present application, the following briefly introduces the drawings describing the embodiments. The drawings in the following description only illustrate some embodiments of the present application, and those skilled in the art can still derive other drawings from these drawings without creative efforts.

[0026] Figure 1 is a schematic exploded view of an optoelectronic transceiver device including a sealing structure according to an embodiment of the present application.

[0027] Figure 2 Yes Figure 1 A schematic exploded view of the sealed structure of the optoelectronic transceiver device from a bottom perspective.

[0028] Figure 2A yes Figure 2 A partial enlarged view of the sealing structure shown.

[0029] Figure 2B yes Figure 1 A partial enlarged view of the sealing structure shown.

[0030] Figure 3 Yes Figure 1 A schematic three-dimensional combination diagram of an optoelectronic transceiver device with a sealed structure.

[0031] Figure 4 yes Figure 3 Schematic cross-sectional view of the sealing structure.

[0032] Figure 4A It is a schematic structural diagram of the assembly of an optoelectronic transceiver connector and an optical fiber component included in an optoelectronic transceiver device according to an embodiment of the present application.

[0033] Figure 4B yes Figure 4A Schematic diagram of the structure of the optoelectronic transceiver connector and the optical fiber component in a separated state.

[0034] Figure 5 is a schematic exploded view of an optoelectronic transceiver device including a sealing structure according to an embodiment of the present application.

[0035] Figure 6 Yes Figure 5 A schematic exploded view of the sealed structure of the optoelectronic transceiver device from a bottom perspective.

[0036] Figure 7 Yes Figure 5 A schematic three-dimensional combination diagram of an optoelectronic transceiver device with a sealed structure.

[0037] Figure 8 yes Figure 7 Schematic cross-sectional view of the sealing structure.

[0038] Fig. 8A Schematically depicting a first shell having different structures Figure 8 Sealed structure.

[0039] Fig. 9 is a schematic exploded view of an optoelectronic transceiver device including a sealing structure according to an embodiment of the present application.

[0040] Fig.10 Yes Fig. 9 A schematic three-dimensional combination diagram of an optoelectronic transceiver device with a sealed structure.

[0041] Fig.11 yes Fig.10 Schematic cross-sectional view of the sealing structure.

[0042] Fig.12 A schematic cross-sectional view of a retaining block of a sealing structure according to an embodiment of the present application is depicted. DETAILED DESCRIPTION

[0043] The following embodiments will illustrate specific practicable embodiments of the present application with reference to the accompanying drawings. Directional terms described in the present application, such as up, down, front, back, left, right, inside, outside, side, etc., are only referenced to the directions of the accompanying drawings, so the directional terms used are intended to be used to describe and understand the present application, but the present application is not limited thereto.

[0044] It should be understood that although the terms first, second, etc. may be used herein to describe various components, these components should not be limited by these terms. Unless otherwise specified, these terms are only used to distinguish one component from another component. Therefore, without departing from the teachings of the present application, the first component, first part, or first portion discussed below may also be referred to as the second component, second part, or second portion. In addition, the present application may reuse reference numbers and / or letters in various examples, and this repetition is for the purpose of simplicity and clarity, and does not itself define the relationship between the various embodiments and / or configurations discussed.

[0045] The present invention provides a sealing structure for an optoelectronic transceiver. In some embodiments, the optoelectronic transceiver can be operated in an immersion cooling container with a fluid coolant, and the sealing structure of the present application can ensure the leakproof and airtight state of the optoelectronic transceiver.

[0046] Reference Figures 1 to 4 , Figure 1 is a schematic exploded view of an optoelectronic transceiver device including a sealing structure according to an embodiment of the present application, Figure 2 Yes Figure 1 A schematic exploded view of the sealed optoelectronic transceiver device from the bottom perspective, Figure 2A yes Figure 2 A partial enlarged view of the sealing structure shown, Figure 2B yes Figure 1 A partial enlarged view of the sealing structure shown, Figure 3 Yes Figure 1 A schematic three-dimensional combination diagram of an optoelectronic transceiver device with a sealed structure, and Figure 4 yes Figure 3 A schematic cross-sectional view of the sealing structure. Figure 1 and Figure 2As shown, the sealing structure 1 includes a first shell 11, a second shell 12 and a sealing assembly 13. The size and shape of the first shell 11 and the second shell 12 are designed to be tightly assembled with each other, and the optoelectronic transceiver 3 is accommodated therebetween. It should be noted that the tight assembly of the first shell 11 and the second shell 12 means that the bottom edge of the first shell 11 is connected to the top edge of the second shell 12 in a manner that liquid or air cannot enter the internal space where the optoelectronic transceiver 3 is located from the joint between the first shell 11 and the second shell 12. In some embodiments, the first shell 11 and the second shell 12 can be assembled in a stacked and tightly configured manner by, for example, screw locking, structural connection, bonding, etc.

[0047] like Figure 1 and Figure 2 As shown, the first housing 11 and the second housing 12 are square and detachably assembled to form the accommodation space 100, but the shapes of the first housing 11 and the second housing 12 are not limited thereto. Specifically, the first housing 11 includes a first covering portion 110 and a first frame portion 111. The first frame portion 111 is disposed on one side of the first covering portion 110 and faces the second housing 12. In some embodiments, as Figure 2 As shown, the first frame portion 111 is configured to surround the first cover portion 110 and is molded to form a first groove 112 located in the first frame portion 111. In detail, the first frame portion 111 protrudes outward from the first cover portion 110 toward the second housing 12, and the first groove 112 is configured along the entire first frame portion 111 and exposed to the second housing 12.

[0048] Still refer to Figure 1 and Figure 2 In the present embodiment, the first frame portion 111 includes a pair of first frame walls 111a spaced apart from each other to form a space in a single first groove 112 between the first frame walls 111a, but the number of the first grooves 112 is not limited thereto. In some embodiments, one or more partition walls (not shown) may be provided between the first frame walls 111a to form a plurality of first grooves 112.

[0049] like Figure 1 As shown, the second housing 12 includes a second covering portion 120 and a second frame portion 121. In some embodiments, the second frame portion 121 is disposed on one side of the second covering portion 120 and faces the first housing 11. Figure 1 and 2As shown, the second frame portion 121 is configured to surround the second cover portion 120, and is molded to form a second groove 122 located in the second frame portion 121. In detail, the second frame portion 121 protrudes outward from the second cover portion 120 toward the first housing 11, and the second groove 122 is configured along the entire second frame portion 121 and exposed to the first groove 112. In the present embodiment, the second frame portion 121 includes a pair of second frame walls 121a spaced apart from each other to form a single second groove 122 between the second frame walls 121a. Preferably, the second groove 122 is formed to correspond to the first groove 112.

[0050] Reference Figure 1 and Figure 2 , a plurality of notch portions 101 are disposed between the peripheral portions of the first shell 11 and the second shell 12. Specifically, each notch portion 101 is formed by a first notch 114 and a second notch 124. In detail, the first notch 114 is recessed from the edge of the first frame wall 111a, and the second notch 124 is recessed from the edge of the second frame wall 121a. After the first shell 11 and the second shell 12 are assembled, the first notch 114 and the second notch 124 together form the notch portion 101.

[0051] Reference Figure 1 , Figure 2 and 2A , the second housing 12 further includes a third groove 123, which is formed on a side of the second cover portion 120 facing the main board 36. In some embodiments, the third groove 123 is located below the second groove 122 and opposite to the second groove 122. Specifically, the second frame portion 121 further includes a pair of third frame walls 123a, which are spaced apart from each other and extend in a direction opposite to the second frame wall 121a to form a single third groove 123 between the third frame walls 123a.

[0052] Reference Figure 1In some embodiments, the optoelectronic transceiver device 3 includes a plurality of optoelectronic transceiver modules 31, a processing unit 35, a carrier board 34, and a main board 36. The optoelectronic transceiver module 31 is electrically connected to the processing unit 35, and the processing unit 35 is disposed on the carrier board 34, such as a printed circuit board. Specifically, each optoelectronic transceiver module 31 includes an optoelectronic transceiver connector 32 and an optical fiber assembly 33 connected to the optoelectronic transceiver connector 32. In some embodiments, the processing unit 35 may include one or more electronic integrated circuits (electronic integrated circuits, EICs), such as a microprocessor, an application specific integrated circuit (application specific integrated circuit, ASIC) or a memory, and one or more photonic integrated circuits (photonic integrated circuits, PICs). In the present embodiment, four optoelectronic transceiver modules 31 are arranged around the processing unit 35. In some other embodiments, each side of the processing unit 35 may be connected to two, four, or eight optoelectronic transceiver modules 31. It should be noted that the number of optoelectronic transceiver modules 31 is determined according to the needs of the actual application. In some embodiments, the optical fiber assembly 33 includes a plurality of optical fibers 331 (such as Figure 4A shown).

[0053] like Figure 1 As shown, the optoelectronic transceiver module 31, the processing unit 35 and the carrier board 34 are arranged in the accommodation space 100. In some embodiments, the optoelectronic transceiver device 3 also includes a plurality of functional lines 37, one end of each functional line 37 is connected to the carrier board 34, and the other end of the functional line 37 passes through the sealing assembly 13 and extends out of the main board 36. In some embodiments, the above-mentioned functional line 37 includes two power lines 371 and two pressure regulating tubes 372. The power line 371 is used to supply power to the components arranged on the carrier board 34. The pressure regulating tube 372 is used to maintain the atmospheric pressure of the accommodation space 100 in response to the temperature change in the accommodation space 100, so as to ensure the normal operation of the optoelectronic transceiver device 3. As shown in FIG. Figure 1 and 2 As shown, the first cover portion 110 covers a portion of the optical fiber assembly 33, the optoelectronic transceiver connector 32, and the processing unit 35. In this embodiment, the heat dissipation portion 115 is provided on a surface of the first cover portion 110 opposite to the surface facing the second housing 12, and the heat conductive component 370 is disposed between and in contact with the processing unit 35 and the first cover portion 110. The heat dissipation portion 115 and the heat conductive component 370 are provided to facilitate heat dissipation of the processing unit 35. The second cover portion 120 supports a portion of the optical fiber assembly 33, the optoelectronic transceiver connector 32, and the processing unit 35.

[0054] Please continue reading Figure 1 and Figure 2, the sealing assembly 13 includes a first sealing strip 131, a second sealing strip 132, a third sealing strip 133 and a plurality of retaining blocks 134. The first sealing strip 131 is arranged around the first covering portion 110. Specifically, the first sealing strip 131 is located in and along the first frame portion 111, and its size is designed to fit in the entire first groove 112. In some embodiments, the first sealing strip 131 can be made of materials including, for example, rubber, silicon, fluororubber (also known as Viton, FPM or FKM), silicone or silicone compounds, but the present invention is not limited thereto. It should be noted that the first sealing strip 131 is made of a material that can provide excellent heat and cold resistance, and has an operating temperature range of -60°C to 250°C to prevent gas and fluid leakage in static and dynamic applications.

[0055] Reference Figure 1 and Figure 2B , each retaining block 134 is tightly disposed in a corresponding one of the recessed portions 101 and surrounds a portion of the optical fiber assembly 33 extending out of the recessed portion 101. In some embodiments, the retaining block 134 surrounds the optical fiber 331 of the optical fiber assembly 33, so that the optical fiber 331 is sealed by the retaining block 134 and is firmly positioned in the recessed portion 101. Specifically, the size of the retaining block 134 is set to be able to be disposed in the second recess 124 of the recessed portion 101. More specifically, as Figure 2B As shown, the retaining block 134 has a width in a width direction perpendicular to the second frame wall 121a and between the second frame walls 121a, and the width of the retaining block 134 is less than the width of the second sealing strip 132 plus the width of any second frame wall 121a, so that the retaining block 134 can be completely surrounded by the first sealing strip 131 and the second sealing strip 132 and sandwiched therebetween. In some embodiments, the retaining block 134 is made of the same material as the first sealing strip 131, but the present invention is not limited thereto.

[0056] like Figure 1 As shown, the first sealing strip 131 includes a sealing block 1311 disposed on the first sealing strip 131. In some embodiments, the sealing block 1311 includes a pair of first protrusions 1312, which extend outward from opposite sides of the first sealing strip 131 in the width direction to fit with the recessed portion 101. In some embodiments, the thickness of the sealing block 1311 is greater than the thickness of the first sealing strip 131 to fit with the retaining block 134 in the recessed portion 101, thereby enhancing the fixed arrangement of the retaining block 134 and improving the sealing performance in the recessed portion 101.

[0057] like Figures 1 to 2BAs shown, the second sealing strip 132 is disposed on the periphery of the second covering portion 120. Specifically, the second sealing strip 132 is located in the second frame portion 121 and is disposed along the second frame portion 121, and the size of the second sealing strip 132 closely fits the entire second groove 122. In some embodiments, the second sealing strip 132 can be made of the same material as the first sealing strip 131, but the present invention is not limited thereto. Figure 2 and Figure 2B As shown, the second sealing strip 132 includes a positioning block 1321 positioned in the notch portion 101. In this embodiment, the positioning block 1321 includes a pair of second protrusions 1322, which extend outward from opposite sides of the second sealing strip 132 in the width direction to fit with the second notch 124. More specifically, as shown in FIG. Figure 2 , Figure 2A and Figure 2B As shown, the second protrusion 1322 is assembled on the edge of the second frame wall 121a in the second recess 124 in such a way that the optical fiber 331 of the optical fiber assembly 33 does not contact the second frame wall 121a, thereby providing sufficient sealing for the second recess 124.

[0058] Continue to refer to Figure 1 In some embodiments, the second frame portion 121 further includes a plurality of positioning grooves 125 disposed on the second frame wall 121a. The power line 371 and the pressure regulating tube 372 are arranged in place through the positioning grooves 125 and pass through the positioning grooves 125 and the second sealing strip 132 respectively.

[0059] Reference Figure 2 and 2A , the third sealing strip 133 is disposed on a surface of the second housing 12 opposite to the surface facing the second sealing strip 132. Specifically, the third sealing strip 133 is positioned in and along the third groove 123, and its size is designed to fit snugly in the entire third groove 123. In some embodiments, the third sealing strip 133 may be made of the same material as the first sealing strip 131, but the present invention is not limited thereto.

[0060] Reference Figures 1 to 4After assembly, the first sealing strip 131, the second sealing strip 132 and the third sealing strip 133 are arranged vertically up and down relative to the first shell 11 and the second shell 12. Due to the arrangement of the sealing assembly 13, a sealing barrier is formed around the accommodating space 100, which makes the assembly of the first shell 11 and the second shell 12 have good airtightness and prevents liquid and air from entering the accommodating space 100, thereby preventing the fluid coolant or liquid from penetrating and protecting the internal components from damage caused by penetration or leakage problems. In addition, in addition to the stacking arrangement of the first sealing strip 131 and the second sealing strip 132, the portion of the optical fiber assembly 33 extending out of the accommodating space 100 is also surrounded and retained by the retaining block 134 in the notch portion 101, which surrounds and sandwiches the retaining block 134 between the sealing block 1311 and the positioning block 1321 to further ensure the sealing state in the notch portion 101.

[0061] Please combine Figure 1 And refer to Figure 4A and Figure 4B , Figure 4A is a schematic diagram of the assembly structure of the optoelectronic transceiver connector 32 and the optical fiber assembly 33 included in the optoelectronic transceiver device 3, Figure 4B yes Figure 4A Schematic diagram of the structure in which the optoelectronic transceiver connector 32 and the optical fiber assembly 33 are in a separated state. In some embodiments, the optoelectronic transceiver module 31 includes a detachable optical coupling structure, which includes: a first connector (e.g., the optoelectronic transceiver connector 32) and a second connector (e.g., the optical fiber assembly 33). The second connector is detachably connected to the first connector. The optoelectronic transceiver connector 32 includes a base 320 and a waveguide device 321. The base 320 includes a lower surface 320B, an upper surface 320T, and a front end 320F connected between the lower surface 320B and the upper surface 320T. In some embodiments, a recessed portion 322 is formed in the base 320 and is recessed from the front end 320F, and the waveguide device 321 is disposed in the recessed portion 322. In detail, the recessed portion 322 is configured to pass through a portion of the lower surface 320B, the upper surface 320T, and the front end 320F of the base 320.

[0062] In some embodiments, Figure 4BAs shown, a plurality of positioning components 323 are symmetrically arranged on the front end 320F of the base 320 relative to the middle of the base 320, and are spaced apart from each other on opposite sides of the recessed portion 322 and the waveguide device 321. A retaining wall 324 is formed on the base 320, and is bent and extended downward from the lower surface 320B, so that the base 320 has an inverted L-shaped cross-sectional profile. In this embodiment, there are two positioning components 323, which are pin-shaped and extend outward from the front end 320F on the retaining wall 324, respectively. In some embodiments, the base 320 is made of a material having high temperature resistance, such as ceramic or metal, such as zirconium dioxide (ZrO2). Alternatively, the base 320 can be made of a non-metallic material, such as an organic binder (such as a resin), a polymer or a plastic.

[0063] Preferably, the waveguide device 321 is made of a material including, for example, silicon dioxide. Alternatively, the waveguide device 321 can be made of a material including silicon-on-insulator (SOI), lithium niobate (LiNbO3), or a polymer. In some embodiments, the waveguide device 321 can be formed using materials such as fused quartz, quartz, glass, borosilicate glass, etc. It should be noted that the waveguide device 321 includes a planar lightwave circuit (PLC). In some embodiments, the planar lightwave circuit can be configured in various ways, including but not limited to a straight line circuit, a separator circuit, an array waveguide grating wavelength multiplexer, and a cross-connection type circuit. In many embodiments of the present application, different types of waveguide circuits or devices can be used for the planar lightwave circuit.

[0064] Continue to refer to Figure 4A and 4B In some embodiments, the optical fiber assembly 33 includes an optical fiber 331 and a docking connector 332, wherein the docking connector 332 is configured to be detachably connected to the optoelectronic transceiver connector 32. The optical fiber 331 has a plurality of optical fiber ends 333, and the optical fiber ends 333 terminate at the docking connector 332 (e.g., Figure 4A In this embodiment, the docking connector 332 is used as an optical multi-channel connector and includes a connection surface 334 configured to face the front end 320F of the base 320, and a plurality of notches (not shown) of the docking connector 332 are configured to correspond to the pin-shaped positioning components 323 (such as Figure 4B As shown in Figure 4A As shown, the optical fiber assembly 33 is plugged into the optoelectronic transceiver connector 32. Figure 4B As shown, the fiber optic assembly 33 can be removed from the base 320 of the optical / electrical transceiver connector 32 .

[0065] In this configuration, if Figure 4AAs shown, the fiber end 333 of the optical fiber 331 is positioned to directly face the recessed portion 322 at the front end 320F of the base 320, so that a signal is transmitted between the optical fiber 331 and the waveguide device 321 through surface coupling. It should be noted that the signal transmission between the optical fiber 331 and the waveguide device 321 is not limited to the surface coupling type as described above, but can be various forms of optical coupling.

[0066] Reference Figures 5 to 8 , which illustrates the sealing structure of the optoelectronic transceiver in the second embodiment of the present application, Figure 5 is a schematic exploded view of an optoelectronic transceiver device including a sealing structure according to a second embodiment of the present application, Figure 6 Yes Figure 5 A schematic exploded view of a sealed optoelectronic transceiver device. Figure 7 Yes Figure 5 A schematic three-dimensional combination diagram of a sealed structure optoelectronic transceiver device, Figure 8 yes Figure 7 It should be noted that the same components and structures as those included in the sealing structure in the first embodiment will not be described in detail in this embodiment.

[0067] like Figure 5 and Figure 6 As shown, the sealing structure 1' includes a first shell 11, a second shell 12 and a sealing assembly 13. Specifically, the first shell 11 includes a first covering portion 110 and a first frame portion 111. The first frame portion 111 is configured to surround the first covering portion 110 and is molded to form a first groove 112 located in the first frame portion 111. The first frame portion 111 also includes a filling port 1121 connected to the first groove 112. In some embodiments, as Figure 5 As shown, the filling port 1121 is exposed on the upper surface of the first frame portion 111 and passes through the upper surface of the first frame portion 111 to reach its lower surface. In detail, the filling port 1121 is groove-shaped and extends to a predetermined length along the first frame portion 111. In some other embodiments, the filling port 1121 may be exposed on the side surface of the first frame portion 111. Figure 5 As shown, similar to the first embodiment, a first notch 114 is formed on the first frame portion 111 .

[0068] Reference Figure 5 and Figure 7, the second housing 12 is disposed on the main board 36, and includes a second covering portion 120 and a second frame portion 121. The second frame portion 121 is configured to surround the second covering portion 120, and is molded to form a second groove 122' and a third groove 123 located in the second frame portion 121. In the present embodiment, the bottom of the second groove 122' is exposed to the third groove 123, so that the second groove 122' is connected to the third groove 123.

[0069] Continue to refer to Figure 5 and Figure 6 In the second embodiment of the present application, the sealing assembly 13 of the sealing structure 1' is integrally formed by filling the sealing material 130 to form a sealing assembly 13 having a structure similar to the combination of the first sealing strip 131, the second sealing strip 132 and the third sealing strip 133 of the sealing structure 1. In some embodiments, the sealing material 130 can be the same material as the first sealing strip 131 described in the first embodiment.

[0070] See also Figures 5 to 8 After assembly, the filling port 1121 is located at the top of the first shell 11, and the first notch 114 and the second notch 124 together form the notch portion 101 (such as Figure 7 As shown), the retaining block 134 surrounds the optical fiber of the optical fiber assembly 33 within the recessed portion 101. In this way, the fluid sealing material 130 is filled from the filling port 1121 to flow into and fill the first groove 112, the second groove 122' and the third groove 123. After the sealing material 130 is cured for a period of time by a natural curing process or other appropriate methods, the fluid sealing material 130 becomes a solid sealing material 130, which is similar to a structure in which the first sealing strip, the second sealing strip and the third sealing strip are integrated. It should be noted that the internal spaces of the first groove 112, the second groove 122' and the third groove 123 can be in various forms, but must be interconnected.

[0071] For the sealing structure 1' described in the second embodiment, the sealing assembly 13 is used as a sealing barrier around the accommodating space 100, which to a certain extent makes the assembly of the first shell 11 and the second shell 12 have good airtightness, thereby protecting the internal components from damage caused by penetration or leakage problems. In addition, the portion of the optical fiber assembly 33 extending out of the accommodating space 100 is surrounded and retained in the retaining block 134 in the recessed portion 101, and the retaining block 134 is surrounded and sandwiched by the sealing material 130, further ensuring the sealing state in the recessed portion 101.

[0072] Reference Fig. 8A , Fig. 8A Schematically depicted Figure 8 The sealing structure 1' has a first shell 11 with a different structure. Fig. 8AAs shown, the shielding portion 1122 is formed on the top of the groove-shaped filling port 1121 to reduce the volume of the filling port 1121, which in turn reduces the amount of sealing material 130 required and saves production costs.

[0073] Reference Figures 9 to 11 , Fig. 9 is a schematic exploded view of an optoelectronic transceiver device including a sealing structure according to a third embodiment of the present application, Fig.10 Yes Fig. 9 A schematic three-dimensional combination diagram of a sealed structure optoelectronic transceiver device, Fig.11 yes Fig.10 A schematic cross-sectional view of the sealing structure. Figures 9 to 11 As shown, a sealing structure 1 in a third embodiment of the present application is provided. The main difference between the sealing structure 1 and the sealing structures of the first and second embodiments is that the first shell 11 and the second shell 12 are assembled by soldering or welding. It should be noted that the components and structures that are the same as those included in the sealing structure in the above embodiments will not be described in detail in this embodiment. Fig. 9 As shown, the sealing structure 1" includes a first shell 11, a second shell 12 and a sealing assembly 13. In this embodiment, the sealing assembly 13 does not include the first sealing strip 131, the second sealing strip 132 and the third sealing strip 133, but includes a retaining block 134'.

[0074] like Fig. 9 As shown, the first shell 11 of the sealing structure 1" includes a first covering portion 110 and a first frame portion 111 surrounding the first covering portion 110. In this embodiment, the first frame portion 111 includes a pair of first frame walls 111a spaced apart from each other. Fig. 9 The second housing 12 includes a second covering portion 120 and a second frame portion 121 surrounding the second covering portion 120. In this embodiment, the second frame portion 121 includes a pair of second frame walls 121a spaced apart from each other. Fig. 9 As shown, the first notch 114 is recessed from the edge of the first frame wall 111a, the second notch 124 is recessed from the edge of the second frame wall 121a, and the first notch 114 and the second notch 124 together form the notch portion 101 (as shown in FIG. Fig.10 shown).

[0075] like Figures 9 to 11As shown, the size of retaining block 134 'is designed to completely block the notch portion 101, i.e. the combination of the first notch 114 and the second notch 124. Preferably, retaining block 134 'is made of Kovar, but the present invention is not limited thereto. In the present embodiment, the first frame portion 111 and the second frame portion 121 are combined together in a soldering or welding manner. In certain embodiments, the sealing assembly 13 also includes a welding material 136, such as tin. When assembling, the first housing 11 and the second housing 12 are welded on the connection boundary between the first frame wall 111a and the second frame wall 121a by the welding material 136, and on the connection boundary between retaining block 134 ', the first frame portion 111 and the second frame portion 121. In another embodiment, the first frame portion 111 and the second frame portion 121 are laser welded along the connection boundary between the first shell 11 and the second shell 12 and the connection boundary between the first shell 11, the second shell 12 and the retaining block 134, so that the first shell 11 and the second shell 12 are fixed together, and the retaining block 134 is in an airtight configuration with the first shell 11 and the second shell 12. Utilizing the sealing structure 1", the first shell 11 and the second shell 12 are in a well-sealed state to prevent liquid and air from entering the accommodating space 100, thereby protecting the internal components from damage caused by penetration or leakage problems.

[0076] See also Fig.12 , Fig.12 1 is a schematic cross-sectional view of the detailed structure of the retaining blocks 134 and 134' in the present application. Fig.12 As shown, the retaining blocks 134 and 134' include an alloy body 1341, a metal coating 1342 and a cover assembly 1343. The metal coating 1342 completely covers the optical fiber 331, that is, a portion of the optical fiber assembly 33. The alloy body 1341 combines the metal coating 1342 with the optical fiber 331, that is, the alloy body 1341 covers the portion of the optical fiber assembly 33 through the metal coating 1342. The metal coating 1342 provides good adhesion of the alloy body 1341 on the optical fiber 331. Preferably, the thermal expansion coefficient of the alloy body 1341 is suitable for the optical fiber. Preferably, the alloy body 1341 is made of Kovar alloy. The cover assembly 1343 seals the opposite ends of the alloy body 1341. The alloy body 1341 can be soldered or welded to the first shell 11 and the second shell 12. The retaining blocks 134 and 134' are used to provide a good seal and prevent the transmission characteristics of the optical fiber 331 from being affected by the pressure generated by the assembly of the first shell 11 and the second shell 12.

[0077] Therefore, the sealing structure provided in the embodiment of the present application enables the optoelectronic transceiver in the immersion cooling system to have good airtightness to prevent liquid, moisture or air from entering the accommodation space, thereby protecting the internal components from damage due to penetration or leakage problems. In addition, a portion of the optical fiber assembly together with the sealing material, the welding material (or the stacking configuration of the first sealing strip and the second sealing strip) is surrounded and retained in the retaining block in the recessed portion, further ensuring the sealed state of the optoelectronic transceiver.

[0078] The above embodiments are used to illustrate the technical ideas of the present disclosure, but not to limit the technical ideas of the present disclosure. Therefore, the scope of rights of the present disclosure is not limited to the embodiments. The protection scope of the present disclosure shall be interpreted by the claims, and shall be interpreted as all technical ideas that are the same or equivalent to the above protection scope are included in the scope of rights of the present disclosure.

Claims

1. A sealing structure for an optoelectronic transceiver, the optoelectronic transceiver comprising a main board, a carrier board arranged on the main board, a processing unit arranged on the carrier board, and at least one optical fiber assembly connected to the processing unit, characterized in that: The sealing structure comprises: a first shell; a second housing disposed on the carrier and assembled with the first housing so that a portion of the optical fiber assembly and the processing unit are disposed between the first housing and the second housing, wherein at least one notch is disposed between surrounding portions of the first housing and the second housing; and The sealing assembly includes at least one retaining block, which is disposed in the recess and surrounds another portion of the optical fiber assembly extending out of the recess.

2. The sealing structure for an optoelectronic transceiver according to claim 1, characterized in that: The first shell includes a first covering portion, which covers the portion of the optical fiber assembly and the processing unit; the sealing assembly also includes a first sealing strip, on which a sealing block is arranged, wherein the first sealing strip is arranged around the first covering portion facing the second shell, and the thickness of the sealing block is greater than the thickness of the first sealing strip, and the sealing block is arranged to abut against the retaining block in the recessed portion.

3. The sealing structure for an optoelectronic transceiver as claimed in claim 2, characterized in that: The sealing block includes a pair of first protrusions extending outward from opposite sides of the first sealing strip to fit in the notch.

4. The sealing structure for an optoelectronic transceiver according to claim 2, characterized in that: The second shell includes a second covering portion, which supports the portion of the optical fiber assembly and the processing unit, and the sealing assembly also includes a second sealing strip, on which a positioning block is provided, the second sealing strip is arranged around the second covering portion facing the first sealing strip, and the positioning block is arranged to abut against the retaining block in the recessed portion.

5. The sealing structure for an optoelectronic transceiver as claimed in claim 4, characterized in that: The first housing further includes a first frame portion, which is disposed around the first covering portion and protrudes toward the second housing to form a first groove, and the first sealing strip is disposed in the first groove.

6. The sealing structure for an optoelectronic transceiver according to claim 5, characterized in that: The second housing further includes a second frame portion, which is disposed around the second covering portion and protrudes toward the first housing to form a second groove, and the second sealing strip is disposed in the second groove.

7. The sealing structure for an optoelectronic transceiver according to claim 6, characterized in that: The positioning block includes a pair of second protrusions extending outward from opposite sides of the second sealing strip to fit with the notch.

8. The sealing structure for an optoelectronic transceiver according to claim 6, characterized in that: The sealing assembly further includes a third sealing strip, which is disposed on a surface of the second shell, and the surface of the second shell is opposite to a surface facing the second sealing strip.

9. The sealing structure for an optoelectronic transceiver according to claim 8, characterized in that: The second frame portion includes a third groove, the third groove is located below the second groove and is exposed to the outside in a direction opposite to the second groove, and the third sealing strip is arranged in the third groove.

10. The sealing structure for an optoelectronic transceiver according to claim 1, characterized in that: The first shell includes a first covering portion and a first frame portion, wherein the first frame portion is arranged around the first covering portion and protrudes toward the second shell, and includes a first groove and a filling port connected to the first groove, and the sealing assembly also includes a sealing material filled by the filling port to fill the first groove and surround the retaining block in the recessed portion.

11. The sealing structure for an optoelectronic transceiver according to claim 10, characterized in that: The second housing includes a second covering portion and a second frame portion. The second frame portion is disposed around the second covering portion corresponding to the first frame portion and includes a second groove communicating with the first groove. The sealing material fills the second groove.

12. The sealing structure for an optoelectronic transceiver according to claim 11, characterized in that: The second frame portion further includes a third groove, which is located below the second groove and exposed to the outside in a direction opposite to the second groove, and is communicated with the second groove, so that the sealing material fills the third groove from the second groove.

13. The sealing structure for an optoelectronic transceiver according to claim 1, characterized in that: The first shell includes a first frame portion, the second shell includes a second frame portion, the notch portion is located between the first frame portion and the second frame portion, and the first frame portion and the second frame portion are soldered or welded along the joint between the first shell and the second shell and the boundary between the first shell, the second shell and the retaining block, so that the first shell and the second shell are fixed together, and the retaining block, the first shell and the second shell are airtightly configured.

14. The sealing structure for an optoelectronic transceiver according to claim 1, characterized in that: The notch portion includes a first notch and a second notch, the first notch is arranged on the first shell, the second notch is arranged on the second shell and corresponds to the first notch, and the retaining block is located between the first notch and the second notch.

15. The sealing structure for an optoelectronic transceiver according to claim 1, characterized in that: The optoelectronic transceiver device further comprises a plurality of functional lines, one end of each of the functional lines is connected to the carrier board, and the other end of each of the functional lines passes through the sealing component and extends out of the main board.

16. The sealing structure for an optoelectronic transceiver according to claim 1, characterized in that: The retaining block includes an alloy body, a metal coating and a covering assembly, wherein the metal coating completely covers the other part of the optical fiber assembly, the alloy body combines the metal coating with the other part of the optical fiber assembly, and the covering assembly seals the opposite ends of the alloy body.

17. The sealing structure for an optoelectronic transceiver according to claim 1, characterized in that: The optoelectronic transceiver device further comprises at least one optoelectronic transceiver module connected to the optical fiber assembly, wherein the optoelectronic transceiver module comprises a base and a waveguide device arranged in the base.

18. The sealing structure for an optoelectronic transceiver according to claim 16, characterized in that: The optical fiber assembly includes a plurality of optical fibers and a docking connector, and the docking connector is configured to be connected to an optoelectronic transceiver connector.

19. A sealing structure for an optoelectronic transceiver, the optoelectronic transceiver comprising a main board, a carrier board arranged on the main board, a processing unit arranged on the carrier board, and at least one optoelectronic transceiver module connected to the processing unit, characterized in that: The sealing structure comprises: a first shell; A second housing is disposed on the carrier board and assembled with the first housing so that a portion of the optoelectronic transceiver module and the processing unit are disposed between the first housing and the second housing; and A sealing assembly is arranged between the first housing and the second housing, wherein the optoelectronic transceiver module includes a detachable optical coupling structure, and the optical coupling structure includes: A first connector is disposed on the carrier board, wherein the first connector comprises: a base; and a waveguide device disposed in the base; and A second connector includes a fiber optic assembly, wherein the second connector is detachably connected to the first connector.

20. The sealing structure for an optoelectronic transceiver according to claim 19, characterized in that: At least one recess is provided between the peripheral portions of the first shell and the second shell, the sealing assembly comprises at least one retaining block, and the at least one retaining block is located in the recess and surrounds a portion of the optical fiber assembly extending out of the recess.

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