Capacitive induction touch sensor and preparation method thereof

Abstract

The invention belongs to the technical field of touch control, and particularly relates to a capacitive induction touch control sensor and a preparation method thereof.The capacitive touch control sensor comprises a transparent base layer, a golden finger, a transmitting TX electrode, a receiving RX electrode and a metal wire, and the golden finger, the transmitting TX electrode, the receiving RX electrode and the metal wire are arranged on the transparent base layer; the transmitting TX electrode is electrically connected with the golden finger through a metal wire; the receiving RX electrode is electrically connected with the golden finger through a metal wire; wherein the transmitting TX electrodes and the receiving RX electrodes are mutually nested to form electrode blocks, and a plurality of electrode blocks form an integral single-layer multi-point touch capacitor unit array. According to the capacitive touch sensor, the golden fingers, the electrode blocks and the metal wires are arranged on the same layer of the surface of the transparent substrate, so that the transmitting TX electrodes and the receiving RX electrodes are mutually nested to form the electrode blocks, the information input of touch positioning is realized, the structure and manufacturing process links of the capacitive touch sensor are simplified, the cost is reduced, and the production efficiency is improved. And the sensitivity of the capacitive touch sensor is improved.

Description

Technical Field

[0001] The present invention belongs to the field of touch technology, and in particular relates to a capacitive induction touch sensor and a preparation method thereof. Background Art

[0002] Touch screen technology, as the core of the interactive interface of modern electronic devices, has experienced diversified development from resistive, capacitive to infrared and surface acoustic wave. Among them, capacitive touch screens have gradually become the dominant choice in the market due to their high light transmittance, near-zero wear user experience, stable performance and long service life. This technology is mainly divided into two modes: mutual capacitance and self-capacitance, each suitable for different application scenarios, and sometimes even used in combination in the same device to optimize performance.

[0003] In the field of portable electronic products such as mobile phones, mutual capacitance technology occupies a dominant position. The early double-layer ITO orthogonal solution constructed a capacitor unit array through two layers of mutually perpendicular emitters TX and receivers RX, and the outside was connected to the gold fingers through metal traces, forming a three-layer material structure including the intermediate substrate. Subsequently, in order to further improve performance, a three-layer diamond bridging solution emerged. This solution uses a diamond-shaped ITO matrix to arrange the electrode layer, and isolates the intersection of the horizontal and vertical connections through the PI layer insulation. Although metal connections are still required outside the field of view, the overall structure is more compact and efficient. However, although these traditional solutions reduce the number of gold fingers connected to the chip, they increase manufacturing complexity and cost due to the dual material combination of ITO capacitor electrodes and metal wires and the three-layer structure design.

[0004] Among the self-capacitive multi-touch technologies, the in-cell solution that integrates the touch function in the TFT display is particularly prominent. This solution uses ITO electrodes and metal traces to connect the driver chip, and uses the characteristics of TFT voltage devices to achieve cyclic time-sharing drive, successfully integrating the capacitive touch sensor into the TFT display device. This in-cell solution is widely used in the market where mobile phones and laptops use TFT displays.

[0005] In the ink screen product market, since in-cell cannot be used and only external touch functions can be used, metal-mesh is gradually replacing ITO to become the mainstream market due to its performance and price advantages, especially in the Note book and AI tablet computer markets.

[0006] However, with the development of OLED technology, its self-luminous characteristics bring about lightness, realistic colors and gradually reduce costs. As the future display technology, it has been favored by the market in the fields of mobile phones and AI tablets, and is gradually replacing the dominant position of TFT.

[0007] Since OLED is based on the current driving principle, TFT IN-CELL using TDDI technology cannot be directly implemented on OLED. The biggest obstacle at present is that each capacitor electrode of IN-CELL needs to be connected to the driver chip. For example, a 6-inch screen design has more than 1,000 wires, which not only significantly increases the manufacturing difficulty and cost of the chip, but also makes it difficult to solve the visual shadow defects of dense wires in design and manufacturing in the absence of TFT BLACK MASK shading. As a result, the current OLED generally adopts the ON-CELL multi-point capacitive touch solution, and usually adopts a three-layer structure, which pushes up the cost.

[0008] The performance of metal mesh as a replacement for ITO has been recognized by the industry. In the past two years, breakthroughs in finer 4μm line width and mass production of single-film double-sided have gradually made metal-mesh's price advantage apparent. Metal-mesh is the first choice in the ink screen market. In the mobile phone, notebook and tablet computer markets, OLED is becoming the main force in the market due to its advantages in lightness, realistic colors, and foldability. Currently, there are two biggest obstacles to the application of metal-mesh in the OLED industry: 1. The single-layer solution is derived from TFT's in-cell, but it has too many leads. A 6-inch screen has more than 1,000 in-cell leads, making it difficult to solve the problem of visual shadows on OLEDs.

[0009] 2. The pixel resolution of mobile phones, including foldable phones, is generally high, and moiré patterns must be avoided, requiring the grid lines to be around 2μm. However, the metal grid lines of metal-mesh are generally around 5μm. Even if the precision is higher, such as 2-3μm, the yield is very low, which places higher requirements on equipment precision and materials.

[0010] The above two factors are the main obstacles that make it difficult for metal-mesh to enter the mobile phone and notebook markets.

[0011] To overcome the above challenges, the present invention proposes a capacitive sensing touch sensor and a preparation method thereof, which greatly reduces the number of metal traces of products of the same size. In combination with a new manufacturing process, multi-touch and multi-layer structure problems are achieved with a single layer while ensuring sensitivity, and the grid lines are made at a level of about 2μm. Appropriate metal-mesh products are beginning to enter the folding mobile phone market. Summary of the invention

[0012] The purpose of the present invention is to provide a capacitive induction touch sensor, which arranges gold fingers, electrode blocks and metal traces on the same layer of the surface of a transparent substrate, so that a transmitting TX electrode and a receiving RX electrode are nested with each other to form an electrode block, thereby realizing information input for touch positioning, simplifying the structure and manufacturing process of the capacitive touch sensor, reducing the cost and improving the sensitivity of the capacitive touch sensor.

[0013] The technical solution adopted by the present invention is as follows: A capacitive inductive touch sensor comprises a transparent substrate and a gold finger, a transmitting TX electrode, a receiving RX electrode and a metal wiring arranged on the transparent substrate, wherein the transmitting TX electrode and the gold finger, and the receiving RX electrode and the gold finger are electrically connected through the metal wiring; Among them, the transmitting TX electrode and the receiving RX electrode are nested with each other to form an electrode block, and a plurality of the electrode blocks form an overall single-layer multi-touch capacitor unit array. The transmitting TX electrode and the receiving RX electrode are electrically connected to the chip through the cooperation of gold fingers and an external FPC to realize the information input of touch positioning.

[0014] In a preferred embodiment, a plurality of TX grid-shaped contact pins are provided on the transmitting TX electrode, a plurality of RX grid-shaped contact pins are provided on the receiving RX electrode, and the electrode block is formed by mutually nesting the TX grid-shaped contact pins and the RX grid-shaped contact pins.

[0015] In a preferred embodiment, the area of ​​a single electrode block is 10 mm 2 ~50mm 2 .

[0016] In a preferred embodiment, the transmitting TX electrode, receiving RX electrode and metal routing all adopt a grid design, and the interior of the transmitting TX electrode, receiving RX electrode and metal routing is designed to be multiple grids through a variety of grid lines, the width of the grid line is 1μm to 5μm, and the spacing between two adjacent grid lines with the same extension direction is 25μm to 300μm.

[0017] In a preferred embodiment, the surface of the electrode block forms a grid surface through a plurality of grid lines, and the shape of the grid surface is any one of the following shapes: a square grid, an oblique grid, a polygonal grid, a diamond grid, and a fingerprint-shaped grid.

[0018] In a preferred embodiment, the distance between adjacent TX grid-shaped contact pins and RX grid-shaped contact pins is greater than 5 μm.

[0019] In a preferred solution, the edges of the transmitting TX electrode, the receiving RX electrode and the edges of the metal traces are not closed.

[0020] In a preferred embodiment, the material of the transmitting TX electrode, the receiving RX electrode, the gold finger and the metal wiring is one of the following materials: copper, nickel, copper alloy, nickel alloy, molybdenum-aluminum-molybdenum, titanium-aluminum-titanium.

[0021] A method for preparing a capacitive inductive touch sensor, applicable to any of the capacitive inductive touch sensors described above, comprises the following steps: S1. Select a transparent base layer, the thickness of the transparent base layer is 35 μm to 125 μm, and the material of the transparent base layer is one of the following materials: PET, CPI, UTG ultra-thin glass; S2. Coating a photoresist layer on the surface of the metal layer, wherein the thickness of the photoresist layer is 1.5 μm to 3.5 μm; S3. Make a mask according to the design file and expose the coated photoresist layer using a parallel light exposure machine; S4. Developing the exposed photoresist layer to obtain the emitter TX electrode, receiving TX electrode RX, metal traces and gold finger patterns required for the capacitive touch sensor; S5. Chemically passivate and ionize the exposed pattern area surface on the PET or UTG substrate using chemical immersion technology; S6. A single metal layer is formed on the exposed pattern area on the surface of the base layer using chemical plating technology, wherein the thickness of the metal layer is 0.4 μm to 2.0 μm.

[0022] The technical effects achieved by the present invention are: The present invention arranges gold fingers, transmitting TX electrodes, receiving RX electrodes and metal wiring on the same layer on the surface of a transparent substrate, so that the transmitting TX electrodes and the receiving RX electrodes are nested with each other to form an electrode block, and the information input of touch positioning is realized through the cooperation of the capacitor block, FPC and chip. Compared with the high-sensitivity touch function that requires two layers, three layers, four layers and at least three materials in the prior art, the structure of the capacitive touch sensor is simplified, the manufacturing process of the capacitive touch sensor is reduced, the cost is reduced, and the sensitivity of the capacitive touch sensor is improved; The present invention forms an electrode block by nesting the TX grid-shaped contact pins and the RX grid-shaped contact pins with each other, so that the number of metal routings and the number of gold fingers are greatly reduced. Compared with the in-cell touch pattern design, the metal routing is reduced, the design space is increased, the visual shadow defect problem caused by the dense metal routing is avoided, and the manufacturing difficulty of the capacitive touch sensor is reduced; The present invention arranges a transmitting TX electrode, a receiving RX electrode, a gold finger and a metal wiring of the same material on the surface of a transparent substrate in a single layer, so that the surface resistance of the capacitor is reduced, the resistivity is more uniform, the touch sensitivity is improved, and it is not easy to generate a sudden change in current resistance and signal crosstalk, which can reduce adverse factors such as current surge and improve the stability of the touch signal; The present invention adopts a new chemical process technology, and through the method of first coating, exposure, development, and then chemical plating, the manufacturing capacity of the width of the grid lines in the electrode blocks and metal wiring can be reduced to less than 2μm, which not only solves the industry problem of moiré and improves the light transmittance of the product, but also enables metal-mesh multi-touch products to enter the largest OLED mobile phone application market. At the same time, due to the improved stability of the new process, the production cost is also reduced, and the competitiveness of the product is improved; The present invention combines the electrode block of the metal grid with the UGT ultra-thin glass. When applied to OLED packaging, it not only has multi-touch function, but its chemical stability and cost are better than the previously commonly used CPI material. Its greatest advantage is that it solves the crease problem caused by the bending of the CPI package that has troubled the industry, and opens up a larger and more important application market for UTG ultra-thin glass. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of a capacitive inductive touch sensor of the present invention; Figure 2 is a schematic structural diagram of the metal layer of the present invention; Figure 3 It is a schematic structural diagram of a sawtooth-shaped transmitting TX electrode of the present invention; Figure 4 It is a schematic diagram of the structure of the sawtooth receiving RX electrode of the present invention; Figure 5 It is an edge schematic diagram and a comparative schematic diagram of a transmitting TX electrode and a receiving RX electrode of the present invention; Figure 6 It is a schematic diagram of the structure of the electrode block composed of the rectangular transmitting TX electrode of the present invention; Figure 7 It is a schematic diagram of the structure of a capacitor unit array composed of rectangular transmitting TX electrodes of the present invention.

[0024] In the accompanying drawings, the components represented by the reference numerals are listed as follows: 1. Transparent base layer; 2. Metal layer; 3. Photoresist layer; 4. Gold finger; 5. Electrode block; 51. Transmitting TX electrode; 511. TX grid-like contact pin; 52. Receiving RX electrode; 521. RX grid-like contact pin; 6. Metal routing; 7. Capacitor unit array. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0026] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0027] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure or characteristic that may be included in at least one implementation of the present invention. The term "in a preferred embodiment" that appears in different places in this specification does not refer to the same embodiment, nor is it a separate or selective embodiment that is mutually exclusive with other embodiments.

[0028] Secondly, the present invention is described in detail with reference to the schematic diagram. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0029] Please see attached Figures 1 to 4 , which is a first embodiment of the present invention, and provides a capacitive inductive touch sensor, comprising a transparent substrate 1, a gold finger 4, a transmitting TX electrode 51, a receiving RX electrode 52 and a metal trace 6 arranged on the transparent substrate 1, and the transmitting TX electrode 51 and the gold finger 4, and the receiving RX electrode 52 and the gold finger 4 are electrically connected through the metal trace 6; Among them, the transmitting TX electrode 51 and the receiving RX electrode 52 are nested with each other to form an electrode block 5, and multiple electrode blocks 5 are spaced by Dummy to form an overall single-layer multi-touch capacitor unit array 7. The transmitting TX electrode 51 and the receiving RX electrode 52 are electrically connected to the chip through the cooperation of the gold finger 4 and the external FPC to realize the information input of touch positioning.

[0030] It should be noted that whether Dummy is set needs to be adjusted according to the process requirements and spatial layout. Its main purpose is to avoid electrical signal crosstalk between adjacent electrode blocks 5 and improve signal accuracy and reliability. Dummy is an existing mature application and will not be further elaborated here. FPC is the abbreviation of flexible printed circuit board, also known as soft circuit board, flexible printed circuit board or flexible circuit board. It has light weight, thin thickness, can be freely bent and folded in three-dimensional space, and is widely used in the electronics industry.

[0031] In this embodiment, a gold finger 4, a transmitting TX electrode 51, a receiving RX electrode 52 and a metal trace 6 are arranged on the same layer on the surface of a transparent substrate, and the transmitting TX electrode 51 and the receiving RX electrode 52 are nested with each other to form an electrode block 5, and the information input of touch positioning is realized through the cooperation of the capacitor block, the FPC and the chip. The transmitting TX electrode 51 and the receiving RX electrode 52 are nested with each other, and the number of leads (i.e., metal traces) connected to the driving chip is greatly reduced while ensuring multi-point touch and touch sensitivity in a mutual capacitance manner, thereby improving production yield and production efficiency, and reducing costs. Compared with the high-sensitivity touch function that requires two layers, three layers, four layers and at least three materials in the prior art, the structure of the capacitive touch sensor is simplified, the manufacturing process of the capacitive touch sensor is reduced, the cost is reduced, and the sensitivity of the capacitive touch sensor is improved.

[0032] Next, please refer to Figures 3 to 5 A plurality of TX grid-shaped contact pins 511 are provided on the transmitting TX electrode 51, and a plurality of RX grid-shaped contact pins 521 are provided on the receiving RX electrode 52. The electrode block 5 is formed by the TX grid-shaped contact pins 511 of the transmitting TX electrode 51 and the RX grid-shaped contact pins 521 of the receiving RX electrode 52 being nested with each other.

[0033] Here, the shapes of the TX grid-shaped contact pins 511 and the RX grid-shaped contact pins 521 include but are not limited to rectangular, square, wavy, zigzag or other shapes. Preferably, in this embodiment, the TX grid-shaped contact pins 511 and the RX grid-shaped contact pins 521 are both zigzag.

[0034] In this embodiment, the electrode block 5 is formed by mutually nesting the TX grid-shaped contact pins 511 and the RX grid-shaped contact pins 521, so that the number of leads and the number of gold fingers 4 are greatly reduced, thereby avoiding the problem of visual shadows caused by the large number of leads. Compared with the in-cell touch pattern design, the number of gold fingers 4 is reduced by about 85%.

[0035] In a preferred embodiment, the area of ​​a single electrode block 5 is 10 mm 2 ~50mm 2 .

[0036] In this implementation, this nested pattern design greatly reduces the number of leads and gold fingers, allowing single-layer metal grid multi-touch to be realized on OLEDs. Compared with the in-cell touch pattern design, the number of gold fingers is reduced by about 85%. For example, a 6-inch mobile phone screen, the original in-cell has more than 1,000 leads, and now our mutual capacitance nested design only needs 115 wiring. With fewer wiring and larger design space, the visual shadow defect problem caused by dense metal wires can be solved when the metal grid design is fully realized, reducing the manufacturing difficulty of capacitive touch sensors.

[0037] It should be noted that the area of ​​a single electrode block 5 needs to be adjusted according to the resolution and sensitivity required by the customer.

[0038] In a preferred embodiment, the transmitting TX electrode 51, the receiving RX electrode 52 and the metal routing 6 all adopt a grid design, and the interior of the transmitting TX electrode 51, the receiving RX electrode 52 and the metal routing 6 are made into multiple grids through a variety of grid line designs, the width of the grid line is 1μm~5μm, and the spacing between two adjacent grid lines with the same extension direction is 25μm~300μm.

[0039] Furthermore, the metal trace 6 includes the metal trace 6 in the visual area and the metal trace 6 outside the visual area. The width of the metal trace 6 outside the visual area is greater than that of the metal trace 6 in the visual area. The design of the metal trace 6 in the visual area takes into account the electrode block and the trace width in a balanced manner to ensure that the trace width is greater than 30μm. In the grid design, the distance between two adjacent metal traces 6 is greater than 5μm. Considering the visual shadow problem, a Dummy design is added when necessary. The metal trace 6 and the interval outside the visual area of ​​0.5mm are balanced and distributed. The wider the better. The gold finger 4 is designed as a solid block and appropriately extended beyond the sensor outline to facilitate testing without damaging the gold finger 4.

[0040] In this embodiment, since under normal circumstances, the minimum resolution limit of the human eye is approximately below 5μm, by controlling the width of the grid lines to 1μm to 5μm and the grid line spacing to 25μm to 300μm, the electrode block 5 can be made transparent, and the light transmittance of the touch sensor is guaranteed to reach more than 88%, meeting the light transmittance requirements of various electronic products. At the same time, the mutually nested grid electrodes can also improve the touch accuracy and response speed, and can also improve the user's interactive experience. Compared with the original ITO, the touch sensing sensitivity of the electrode block 5 is further improved, wherein "inside the viewing area" refers to the effective touch area on the transparent base layer 1 in the touch sensor, and "outside the viewing area" refers to the area outside the effective touch area on the transparent base layer 1 in the touch sensor.

[0041] In a preferred embodiment, the surface of the electrode block 5 forms a grid surface through a plurality of grid lines, and the shape of the grid surface includes but is not limited to a rectangular grid, a square grid, an oblique grid, a polygonal grid, a diamond grid, a fingerprint-shaped grid or other shapes.

[0042] Specifically, the specific shape of the grid surface is selected according to the requirements or process.

[0043] In this embodiment, the grid surface with a grid design allows the user to perform multi-touch operations, such as zooming, rotating and other gestures. In addition, the grid design helps to evenly distribute the capacitance on the screen surface, reduce the uneven capacitance during touch, improve the accuracy of touch, reduce the impact of external electromagnetic interference on the touch signal, and improve the stability and reliability of the screen. At the same time, grid surfaces of different shapes make the touch sensing area more flexible and changeable, and can be applied to different application scenarios and usage requirements. For example, the square grid surface is suitable for scenarios with high touch accuracy requirements due to its regular arrangement, such as touch screens of precision instruments and high-end electronic products; oblique grids or polygonal grids can provide a more natural touch and are suitable for daily consumer products, such as touch interfaces of smartphones and tablets; unique designs such as diamond grids and fingerprint-shaped grids not only increase the visual appeal of the touch sensor, but may also provide a unique touch experience in specific applications. When selecting the shape of the grid surface, the design requirements of the product, the feasibility of the production process and the touch experience of the user are comprehensively considered to achieve the best balance in all aspects.

[0044] In a specific embodiment, Figures 2 to 5 As shown, the mesh surface of the electrode block 5 is a square mesh, and the TX mesh-shaped contact pins 511 and the RX mesh-shaped contact pins 521 are both zigzag-shaped, which can provide a more natural touch and a higher response speed.

[0045] In another specific embodiment, Figure 6 to Figure 7 As shown, the grid surface of the electrode block 5 is a rectangular grid, and the TX grid-shaped contact pins 511 and the RX grid-shaped contact pins 521 are both rectangular, which can meet better touch accuracy requirements.

[0046] Please refer again Figure 5 As shown in b, the distance between adjacent TX mesh-shaped contact pins 511 and RX mesh-shaped contact pins 521 is more than 5 μm. If the distance is too large, visual shadows may occur, and Dummy should be considered for filling. The edge of the transmitting TX electrode 51, the edge of the receiving RX electrode 52, the edge of the metal trace 6, and the Dummy mesh are not closed.

[0047] It should be noted that the attached Figure 5 The style shown in a is only a comparative example and does not mean that the style shown in a is the style in this embodiment.

[0048] In this embodiment, the edges of the electrode blocks 5 with a grid-shaped surface are designed without an edge wrapping, that is, the edges of the grid-shaped electrode blocks 5 are not closed, so that the grid-shaped electrode blocks 5 have an illusion of continuous extension at the intervals in all directions, avoiding visual shadows and moiré fringes.

[0049] In a preferred embodiment, the material of the transmitting TX electrode 51, the receiving RX electrode 52, the gold finger 4 and the metal trace 6 is one of the following materials: copper, nickel, copper alloy, nickel alloy, molybdenum aluminum molybdenum, titanium aluminum titanium, etc., and the material of the transmitting TX electrode 51, the receiving RX electrode 52 and the metal trace 6 are the same.

[0050] It should be noted that, in this embodiment, the materials of the transmitting TX electrode 51 , the receiving RX electrode 52 , the gold finger 4 , and the metal trace 6 are the following materials, all of which are preferably copper.

[0051] In this embodiment, the transmitting TX electrode 51, receiving RX electrode 52, gold finger 4 and metal wiring 6 of the same material are arranged in a single layer. The above arrangement avoids the risk of micro fractures caused by bending multiple times when the capacitor is prepared using a mixture of indium oxide and tin oxide (ITO) in the prior art. Secondly, unlike the traditional ITO+metal wiring 6, the electrode, lead and gold finger 4 use the same metallic material, which reduces the surface resistance of the capacitor, makes the resistivity more uniform, improves the touch sensitivity, and is less likely to produce current resistance mutations and signal crosstalk, and can reduce adverse factors such as current surges, so that the stability of the touch signal is greatly enhanced. Finally, the preparation process of the capacitive touch sensor is simplified, and good conduction performance between each electrode block 5 and the metal wiring 6 is also ensured. Combining the above advantages, using copper as the metal with the best ductility in nature can make a touch sensor with the best bending performance.

[0052] It should be noted that in the prior art, capacitive screens all use transparent conductive materials (ITO) as capacitor electrodes. Because ITO is an oxide, its surface resistance is above 100 ohms. The resistance of the loop composed of transmission and reception is too large, which will affect the touch sensitivity. Therefore, a highly conductive metal trace 6 must be used to connect to the chip electrode. Therefore, at least two types of two-layer materials are required. The technical solution of the present invention uses a single-layer metal material to realize the entire loop from transmission to reception. The resistance is within 1 / 3 of that of ITO, which greatly reduces the RC time constant and can increase the number of frame rate scans. The reporting rate of the touch screen is also increased from 100 times / second of ITO to more than 200 times / second, thereby improving the touch sensitivity.

[0053] A method for preparing a capacitive inductive touch sensor, applicable to any of the above capacitive inductive touch sensors, comprises the following steps: S1. Select a transparent base layer 1, wherein the thickness of the transparent base layer 1 is 35 μm to 125 μm, and the material of the transparent base layer 1 is one of the following materials: PET, CPI, UTG ultra-thin glass; S2. A photoresist layer 3 is coated on the surface of the metal layer 2, wherein the thickness of the photoresist layer 3 is 1.5 μm to 3.5 μm; S3. Prepare a mask according to the design file and expose the coated photoresist layer 3 using a parallel light exposure machine; S4. Develop the exposed photoresist layer 3 to obtain the patterns of the emitter TX electrode, the receiving TX electrode RX, the metal trace 6 and the gold finger 4 required for the capacitive touch sensor, wherein the minimum line width is 1 μm.

[0054] S5. Use chemical immersion technology to chemically passivate and ionize the surface of the exposed pattern area on the PET or UTG substrate.

[0055] S6. A single-layer metal layer 2 is formed on the exposed pattern area on the surface of the base layer using chemical plating technology, wherein the thickness of the metal layer 2 is 0.4 μm to 2.0 μm.

[0056] It should be noted that, in this embodiment, the thickness of the UTG ultra-thin glass is 35 μm to 125 μm.

[0057] Here, in S4, the lines refer to the grid lines constituting the TX electrodes, the receiving TX electrodes RX, the metal traces and the gold fingers.

[0058] In this embodiment, the pattern outlines of the grid-shaped electrode blocks 5, metal traces 6 and gold fingers 4 are completed at one time by means of glue coating, exposure and development technology, and then copper or other conductive metals are formed on the surface of the transparent base layer 1 by means of innovative surface treatment technology and chemical plating technology to form a single-layer metal including the electrode blocks 5, gold fingers 4 and metal traces 6, thereby avoiding the multi-layer, multi-material magnetron sputtering process, reducing the complex and fine processes such as glue coating, exposure, development and etching of each layer and each material, while reducing the process cost, and also because the ITO transparent conductive layer made of rare metals is removed, the material cost is greatly reduced, and the sensitivity is also improved. Compared with the ITO material that is still widely used, a reporting rate greater than 150 can be achieved, solving the problem of low touch sensitivity caused by the large resistance of a single-layer ITO, and, through this preparation method, the lines of the metal-mesh can be made as thin as 2um, and the moiré effect can be eliminated, so that the metal-mesh single-layer multi-touch can enter high-end display modules such as OLED.

[0059] Furthermore, by combining the electrode block 5 of the metal grid with UGT, when applied to OLED packaging, it not only has multi-touch, but its chemical stability and cost are better than the previously commonly used CPI material. It also better solves the crease problem of CPI material in flexible OLED applications, and develops a larger and more important application market for UTG.

[0060] It should be noted that the specific material selection of the transparent base layer 1 needs to be adjusted accordingly according to customer needs and processes. For example, PET is used in low-end, mid-to-low-end products or products with low temperature resistance requirements; CPI is used in automotive products or products with high temperature resistance requirements; UTG is used in high-end products (such as ON-CELL flexible OLED packaging glass with touch, folding screen mobile phones, tablets, etc.).

[0061] The above are only preferred embodiments of the present invention. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of the present invention, and these improvements and modifications should also be considered as the protection scope of the present invention. The structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to conventional means in the art unless otherwise specified and limited.

Claims

1. A capacitive touch sensor, characterized in that: It comprises a transparent base layer (1), a gold finger (4), a transmitting TX electrode (51), a receiving RX electrode (52), and a metal wiring (6) arranged on the transparent base layer (1), wherein the transmitting TX electrode (51) and the gold finger (4), and the receiving RX electrode (52) and the gold finger (4) are electrically connected via the metal wiring (6); The transmitting TX electrode (51) and the receiving RX electrode (52) are nested with each other to form an electrode block (5), and a plurality of the electrode blocks (5) form an overall single-layer multi-touch capacitor unit array (7). The transmitting TX electrode (51) and the receiving RX electrode (52) are electrically connected to the chip through the cooperation of the gold finger (4) and an external FPC, so as to realize the information input of touch positioning.

2. A capacitive touch sensor according to claim 1, characterized in that: The transmitting TX electrode (51) is provided with a plurality of TX grid-shaped contact pins (511), the receiving RX electrode (52) is provided with a plurality of RX grid-shaped contact pins (521), and the electrode block (5) is formed by the TX grid-shaped contact pins (511) and the RX grid-shaped contact pins (521) being nested with each other.

3. The capacitive inductive touch sensor according to claim 1, characterized in that: The area of ​​a single electrode block (5) is 10 mm 2 ~50mm 2 .

4. The capacitive inductive touch sensor according to claim 1, characterized in that: The transmitting TX electrode (51), the receiving RX electrode (52) and the metal wiring (6) all adopt a grid design, and the inside of the transmitting TX electrode (51), the receiving RX electrode (52) and the metal wiring (6) is made into a plurality of grids by designing a plurality of grid lines, the width of the grid line is 1 μm to 5 μm, and the spacing between two adjacent grid lines with the same extension direction is 25 μm to 300 μm.

5. The capacitive inductive touch sensor according to claim 1, characterized in that: The surface of the electrode block (5) forms a grid surface through a plurality of grid lines, and the shape of the grid surface is any one of the following shapes: a square grid, an oblique grid, a polygonal grid, a diamond grid, and a fingerprint-shaped grid.

6. The capacitive inductive touch sensor according to claim 2, characterized in that: The distance between adjacent TX grid-shaped contact pins (511) and RX grid-shaped contact pins (521) is greater than 5 μm.

7. The capacitive inductive touch sensor according to claim 1, characterized in that: The edge of the transmitting TX electrode (51), the edge of the receiving RX electrode (52) and the edge of the metal wiring (6) are not closed.

8. The capacitive inductive touch sensor according to claim 1, characterized in that: The material of the transmitting TX electrode (51), the receiving RX electrode (52), the gold finger (4) and the metal wiring (6) is one of the following materials: copper, nickel, copper alloy, nickel alloy, molybdenum-aluminum-molybdenum, and titanium-aluminum-titanium.

9. A method for preparing a capacitive inductive touch sensor, applicable to a capacitive inductive touch sensor according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1. Selecting a transparent base layer (1), wherein the thickness of the transparent base layer (1) is 35 μm to 125 μm, and the material of the transparent base layer (1) is one of the following materials: PET, CPI, UTG ultra-thin glass; S2. Coating a photoresist layer (3) on the surface of the metal layer (2), wherein the thickness of the photoresist layer (3) is 1.5 μm to 3.5 μm; S3. Prepare a mask according to the design file, and expose the coated photoresist layer (3) using a parallel light exposure machine; S4. Developing the exposed photoresist layer (3) to obtain the emitter TX electrode, the receiving TX electrode RX, the metal trace (6) and the gold finger (4) pattern required for the capacitive touch sensor; S5. Chemically passivate and ionize the exposed pattern area surface on the PET or UTG substrate using chemical immersion technology; S6. Using chemical plating technology to form a single metal layer (2) on the exposed pattern area on the surface of the base layer, the thickness of the metal layer (2) is 0.4 μm to 2.0 μm.

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