Packaging built-in transformer and production method thereof

Abstract

The invention discloses a packaged built-in transformer and a production method thereof, and relates to the technical field of electronic devices, the packaged built-in transformer comprises a primary winding, a secondary winding and an insulating dielectric layer, the primary winding comprises a first coil and a first insulating packaging body, and the first coil is arranged in the first insulating packaging body; the secondary winding comprises a second coil and a second insulation packaging body, and the second coil is arranged in the second insulation packaging body; the insulating medium layer is arranged between the primary winding and the secondary winding; the packaging frame is connected with one side, far away from the insulating dielectric layer, of the primary winding or the secondary winding; the packaging frame is electrically connected with the primary winding or the secondary winding. According to the technical scheme provided by the invention, the insulating dielectric layer is added between the primary winding and the secondary winding, so that the voltage resistance of the packaged built-in transformer is improved. And secondly, the primary winding and the secondary winding can be independently manufactured and pre-assembled, so that a multi-layer winding structure can be conveniently produced, windings with different turn ratios can be matched according to requirements, and the overall processing period is shortened.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic devices, and in particular to a packaged built-in transformer and a production method thereof. Background Art

[0002] Transformers are devices that use the principle of electromagnetic induction to change voltage and are commonly used in circuits. Transformers on the market are basically made of a primary and secondary as a whole. They usually have the form of planar transformers based on circuit board carriers, planar transformers based on circuit board carriers, and transformers based on ceramic sintering. Planar transformers based on circuit board carriers are made of copper foil and prepreg laminated together. The primary and secondary windings are formed at one time and can be processed to form multiple layers of windings. However, due to the low insulation strength, the tens of thousands of volts scenario cannot be met. Even if it can be met, it requires a very thick dielectric; wafer-based on-chip transformers use a technology similar to rewiring. The primary and secondary coils are isolated by PI dielectrics. The number of transformer windings depends on the rewiring technology and cannot be processed to form multiple layers of windings; in addition, the isolation strength also depends on the wafer process. The PI layer cannot be made too thick, so the upper limit of the withstand voltage is low; transformers based on ceramic sintering are sintered with raw ceramic sheets and tungsten conductors. They have high withstand voltage, but the processing cycle is long and the cost is high. Therefore, the existing transformers have the problems of low withstand voltage performance, poor processing convenience of multi-layer windings, fixed winding turns ratio, and long processing cycle. Summary of the invention

[0003] The main purpose of the present invention is to propose a packaged built-in transformer and a production method thereof, aiming to solve the problems of low voltage resistance, poor processing convenience of multi-layer windings, fixed winding turn ratio and long processing cycle in existing transformers.

[0004] To achieve the above object, the packaged built-in transformer proposed in the present invention comprises:

[0005] The primary winding comprises a first coil and a first insulating package, wherein the first coil is arranged in the first insulating package;

[0006] The secondary winding comprises a second coil and a second insulating package, wherein the second coil is arranged in the second insulating package;

[0007] An insulating dielectric layer, provided between the primary winding and the secondary winding;

[0008] The packaging frame is connected to a side of the primary winding or the secondary winding away from the insulating medium layer; the packaging frame is electrically connected to the primary winding or the secondary winding.

[0009] In one embodiment, the frame includes a first base island and a second base island, one side of the first base island is connected to the primary winding or the secondary winding, one side of the second base island is connected to the primary winding or the secondary winding, and the first base island and the second base island are respectively arranged at both ends of the primary winding or the secondary winding.

[0010] In one embodiment, the packaged built-in transformer also includes a third insulating package body, the primary winding, the secondary winding, and the package frame are arranged in the third insulating package body, and the frame pins at least partially extend to the outside of the third insulating package body to form a pin lead-out structure.

[0011] In one embodiment, a side of the first base island away from the primary winding or the secondary winding extends to the outside of the third insulating package to form a first pin; a side of the second base island away from the primary winding or the secondary winding extends to the outside of the third insulating package to form a second pin, and the pin structure includes the first pin and the second pin.

[0012] In one embodiment, the first insulating package body, the second insulating package body and the third insulating package body are made of epoxy resin, polyester resin, acrylic resin or polyimide material; and / or,

[0013] Two opposite sides of the third insulating packaging body parallel to the packaging frame are both provided with planes.

[0014] In one embodiment, the packaged built-in transformer further includes a connecting wire, and the primary winding or the secondary winding is electrically connected to the packaging frame via the connecting wire.

[0015] In one embodiment, the packaged built-in transformer also includes a first magnet and a second magnet, the first magnet is arranged on a side of the primary winding away from the insulating medium layer; the second magnet is arranged on a side of the secondary winding away from the insulating medium layer, and the second magnet is located between the first substrate and the second substrate.

[0016] In one embodiment, the primary winding and the insulating medium layer are bonded; and / or,

[0017] The secondary winding is bonded to the insulating medium layer; and / or,

[0018] The primary winding or the secondary winding is bonded to the packaging frame.

[0019] In one embodiment, the insulating dielectric layer is made of one or more materials selected from the group consisting of quartz, polytetrafluoroethylene, epoxy resin, mica, asbestos, and nano-composite insulation.

[0020] The present invention also provides a method for producing a packaged built-in transformer, comprising the following steps:

[0021] Selecting the first coil and the second coil to be adapted according to the preset input and output performance;

[0022] combining the molten encapsulating material with the first coil to form a primary winding after solidification;

[0023] combining the molten encapsulating material with the second coil and solidifying to form a secondary winding;

[0024] Bonding the primary winding and the secondary winding to both sides of the insulating dielectric layer;

[0025] The primary winding or the secondary winding is bonded to the packaging frame to form a packaged built-in transformer.

[0026] The technical solution of the present invention is to add an insulating dielectric layer between the primary winding and the secondary winding, and make the primary winding and the secondary winding electrically connected to the frame, and then electrically connected to the outside through the frame pin; the addition of the insulating dielectric layer can increase the physical distance between the primary winding and the secondary winding, which can effectively reduce the overall electric field strength; and the insulating dielectric layer can make the electric field more evenly dispersed, reduce the area where the electric field is concentrated, thereby reducing the risk of local discharge and breakdown of the transformer; therefore, the addition of the insulating dielectric layer can reduce the electric field strength, and at the same time make the electric field distribution more uniform, thereby improving the withstand voltage performance of the packaged built-in transformer. Secondly, the primary winding includes a first coil and a first insulating package, and the secondary winding includes a second coil and a second insulating package, which is convenient for the primary winding and the secondary winding to be independently manufactured and pre-assembled; it is also possible to select primary windings and secondary windings of different performances for combination according to different input and output requirements, thereby improving the processing flexibility and processing convenience of the packaged built-in transformer; and because the primary winding and the secondary winding can be manufactured independently and in parallel, the overall processing cycle of the transformer is shortened, and the production efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0028] Figure 1 A schematic diagram of the structure of an embodiment of a packaged built-in transformer provided by the present invention;

[0029] Figure 2 A schematic top view of an embodiment of a packaged built-in transformer provided by the present invention;

[0030] Figure 3 A schematic structural diagram of another embodiment of a packaged built-in transformer provided by the present invention;

[0031] Figure 4 A schematic diagram of the steps of an embodiment of a method for producing a packaged built-in transformer provided by the present invention.

[0032] Description of Figure Numbers:

[0033] 1. primary winding; 11. first coil; 12. first insulating package; 2. secondary winding; 21. second coil; 22. second insulating package; 3. insulating medium layer; 4. package frame; 51. first base island; 52. second base island; 6. third insulating package; 61. plane; 7. connecting line; 8. first magnet; 9. second magnet.

[0034] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0037] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0038] Transformer is a device that changes voltage by electromagnetic induction principle, and is a commonly used device in circuit. Transformers on the market are basically primary windings and secondary windings that are processed at the same time to form a whole. They are usually in the form of planar transformers based on circuit board carriers, planar transformers based on circuit board carriers, and transformers based on ceramic sintering. Planar transformers based on circuit board carriers are made of copper foil and prepreg laminated together. The primary winding and secondary winding are formed at one time, and can be processed to form multiple winding layers. However, due to the low insulation strength, it is not suitable for use scenarios with voltages of tens of thousands of volts; wafer-based on-chip transformers use a technology similar to rewiring. The primary coil and the secondary coil are isolated by PI dielectric. The number of transformer winding layers depends on the rewiring technology, and it is impossible to process multiple winding layers; and the isolation strength also depends on the wafer process. The PI layer cannot be made too thick, so the upper limit of the withstand voltage is low; while the transformer based on ceramic sintering is made of raw ceramic sheets and tungsten conductors, which have high withstand voltage, but the processing cycle is long and the cost is high. Therefore, the existing transformers have the problems of low withstand voltage performance, poor processing convenience of multi-layer windings, and long processing cycle.

[0039] In order to solve the above problems, the present invention provides a packaged built-in transformer.

[0040] See also Figure 1 to Figure 2 In one embodiment of the present invention, the packaged built-in transformer includes a primary winding 1, a secondary winding 2 and an insulating medium layer 3, the primary winding 1 includes a first coil 11 and a first insulating package 12, the first coil 11 is arranged in the first insulating package 12; the secondary winding 2 includes a second coil 21 and a second insulating package 22, the second coil 21 is arranged in the second insulating package 22; the insulating medium layer 3 is arranged between the primary winding 1 and the secondary winding 2; the packaging frame 4 is connected to the side of the primary winding 1 or the secondary winding 2 away from the insulating medium layer 3; the packaging frame 4 is electrically connected to the primary winding 1 or the secondary winding 2.

[0041] In the above structure, an insulating dielectric layer 3 is added between the primary winding 1 and the secondary winding 2, and the primary winding 1 and the secondary winding 2 are electrically connected to the packaging frame 4, and then electrically connected to the outside through the packaging frame 4; the addition of the insulating dielectric layer 3 can increase the physical distance between the primary winding 1 and the secondary winding 2, which can effectively reduce the overall electric field strength; and the insulating dielectric layer 3 can make the electric field more evenly dispersed, reduce the area where the electric field is concentrated, thereby reducing the risk of local discharge and breakdown of the transformer; therefore, the addition of the insulating dielectric layer 3 can reduce the electric field strength, and at the same time make the electric field distribution more uniform, thereby improving the withstand voltage performance of the packaged built-in transformer. Secondly, the primary winding 1 includes a first coil 11 and a first insulating package 12, and the secondary winding 2 includes a second coil 21 and a second insulating package 22, which facilitates independent manufacturing and pre-assembly of the primary winding 1 and the secondary winding 2; it is also possible to select primary windings 1 and secondary windings 2 with different performances for combination according to different input and output requirements, thereby improving the processing flexibility and convenience of the packaged built-in transformer; and because the primary winding 1 and the secondary winding 2 can be manufactured independently and in parallel, the overall processing cycle of the transformer is shortened and the production efficiency is improved.

[0042] The present invention also provides a method for producing a packaged built-in transformer, referring to Figure 4 , including the following steps:

[0043] S100: Selecting the first coil 11 and the second coil 21 to adapt to each other according to the preset input and output performance;

[0044] S200: combining the molten packaging material with the first coil 11 and forming a primary winding 1 after solidification;

[0045] S300: combining the molten packaging material with the second coil 21 and forming a secondary winding 2 after solidification;

[0046] S400: bonding the primary winding 1 and the secondary winding 2 to both sides of the insulating medium layer 3;

[0047] S500: bonding the primary winding 1 or the secondary winding 2 to the packaging frame 4 to form a packaged built-in transformer.

[0048] According to the design requirements of the packaged built-in transformer, for example, according to the input and output performance, power level and voltage level, a suitable first coil 11 and a second coil 21 are selected, and a molten packaging material (such as epoxy resin, polyurethane, etc.) is poured or injected onto the first coil 11, and then solidified to form a first insulating packaging body 12. The first insulating packaging body 12 can protect the first coil 11, provide mechanical support, and enhance the electrical insulation performance of the coil. Then, a molten packaging material (such as epoxy resin, polyurethane, etc.) is poured or injected onto the second coil 21, and then solidified to form a second insulating packaging body 22. The second insulating packaging body 22 can also protect the second coil 21, provide mechanical support, and enhance the electrical insulation performance of the coil. Then, the solidified primary winding 1 and secondary winding 2 are placed on both sides of the insulating dielectric layer 3, and they are bonded and fixed with an adhesive. The insulating dielectric layer 3 can be quartz, mica, polyimide film or other high-insulation material to ensure sufficient electrical isolation between the primary and secondary windings 2. The bonded primary winding 1, secondary winding 2 and insulating medium layer 3 are bonded to the packaging frame 4. Specifically, either the primary winding 1 or the secondary winding 2 can be bonded to the packaging frame 4. In the present embodiment, the secondary winding 2 is bonded to the packaging frame 4. The packaging frame 4 is used to fix the built-in transformer and provide electrical connection. Finally, the molten packaging material (such as epoxy resin, polyurethane, etc.) can be poured on the overall structure formed by the primary winding 1, the secondary winding 2, the insulating medium layer 3 and the packaging frame 4, and then allowed to solidify to form the third insulating packaging body 6 described below, so that the primary winding 1, the secondary winding 2 and the packaging frame 4 are wrapped in the third insulating packaging body 6.

[0049] In one embodiment, the packaging frame 4 includes a first base island 51 and a second base island 52, one side of the first base island 51 is connected to the primary winding 1 or the secondary winding 2, one side of the second base island 52 is connected to the primary winding 1 or the secondary winding 2, and the first base island 51 and the second base island 52 are respectively arranged at the two ends of the primary winding 1 or the secondary winding 2. The first base island 51 and the second base island 52 provide electrical connection points for the transformer, so that the primary winding 1 and the secondary winding 2 can be electrically connected to the external circuit or other electronic components through the first base island 51 and the second base island 52; in addition, the packaging frame 4 can also provide support for the two ends of the primary winding 1 or the secondary winding 2, thereby enhancing the mechanical stability of the packaged built-in transformer; and the first base island 51 and the second base island 52 can serve as a heat conduction path to help conduct the heat generated by the winding to the housing or other heat dissipation components of the packaged built-in transformer, thereby improving the thermal management efficiency of the transformer.

[0050] In one embodiment, the packaged built-in transformer further includes a third insulating package body 6, the primary winding 1, the primary winding 1, and the package frame 4 are arranged in the third insulating package body 6, and the package frame 4 at least partially extends to the outside of the third insulating package body 6 to form a pin structure. The third insulating package body 6 can significantly improve the overall insulation performance of the packaged built-in transformer by wrapping all components in a continuous insulating package body, reduce the risk of electrical failure, and enhance the electrical safety and reliability of the packaged built-in transformer; the third insulating package body 6 can also provide additional mechanical protection for the transformer, so that it can resist physical shock and vibration; the third insulating package body 6 can also prevent moisture, dust and other environmental factors from corroding the internal components of the packaged built-in transformer, thereby extending its service life. The package frame 4 at least partially extends to the outside of the third insulating package body 6, so that the packaged built-in transformer can be directly connected to an external circuit or other components, simplifying the assembly and connection process.

[0051] In one embodiment, the first base island 51 extends from one side of the primary winding 1 or the secondary winding 2 to the outside of the third insulating package 6 to form a first pin; the second base island 52 extends from one side of the primary winding 1 or the secondary winding 2 to the outside of the third insulating package 6 to form a second pin, and the pin structure includes the first pin and the second pin. The extensions of the first base island 51 and the second base island 52 provide additional electrical connection points for connecting the packaged built-in transformer to an external circuit or other electronic components. The first base island 51 can be used as an input terminal and the second base island 52 can be used as an output terminal, providing a clear electrical interface, making circuit design and connection more intuitive.

[0052] In one embodiment, the first insulating package 12, the second insulating package 22 and the third insulating package 6 are made of epoxy resin, polyester resin, acrylic resin or polyimide material. Epoxy resin has good bonding properties and electrical insulation, and forms a hard plastic body after curing, which can provide good mechanical protection. Polyester resin also has good heat resistance and electrical insulation properties, and its cost-effectiveness is high, and it is an economical insulating material that can reduce the production cost of the transformer. Acrylic resin has good transparency and weather resistance, which is convenient for observing the internal structure of the transformer. Polyimide has excellent heat resistance and electrical insulation properties, which helps the transformer to dissipate heat.

[0053] In one embodiment, the third insulating package body 6 is provided with a plane 61 on both sides of the opposite sides parallel to the package frame 4. The plane 61 of the third insulating package body 6 helps to more evenly distribute the internal stress caused by temperature changes or other mechanical stresses, and reduce material fatigue or damage caused by stress concentration. In addition, the plane 61 of the third insulating package body 6 helps to stably place the transformer on the mounting plane 61, which facilitates the operation of connecting and fixing the transformer with external electrical equipment, such as facilitating electrical welding.

[0054] In one embodiment, the packaged built-in transformer further includes a connecting wire 7, and the primary winding 1 or the secondary winding 2 is electrically connected to the package frame 4 via the connecting wire 7. The connecting wire 7 provides a flexible connection method, and the connection between the primary winding 1 or the secondary winding 2 and the package frame 4 can be easily adjusted to meet different circuit design and layout requirements.

[0055] In one embodiment, referring to Figure 3 The packaged built-in transformer also includes a first magnet 8 and a second magnet 9. The first magnet 8 is arranged on the side of the primary winding 1 away from the insulating medium layer 3; the second magnet 9 is arranged on the side of the secondary winding 2 away from the insulating medium layer 3, and the second magnet 9 is located between the first base island 51 and the second base island 52. By arranging the first magnet 8 and the second magnet 9 around the primary winding 1 and the secondary winding 2, the magnetic flux density can be enhanced, and the efficiency and power density of the packaged built-in transformer can be improved. The first magnet 8 and the second magnet 9 can be made of materials such as ferrite, neodymium iron boron, and samarium cobalt.

[0056] In one embodiment, the primary winding 1 is bonded to the insulating medium layer 3; the secondary winding 2 is bonded to the insulating medium layer 3; the primary winding 1 or the secondary winding 2 is bonded to the packaging frame 4. The primary winding 1 and the secondary winding 2 are bonded to the insulating medium, which can ensure that the winding and the insulating medium layer 3 are tightly combined, improve the overall structural stability of the packaged built-in transformer, and reduce displacement caused by vibration or impact. In addition, the primary winding 1 and the secondary winding 2 are bonded to the insulating medium layer 3, which can reduce the air gap between the winding and the insulating medium layer 3, thereby reducing electromagnetic interference and improving the electromagnetic compatibility of the packaged built-in transformer. Exemplarily, the bonding material can use glue.

[0057] In one embodiment, the insulating dielectric layer 3 can be made of various high-voltage materials according to the application scenario, such as one or more materials selected from polytetrafluoroethylene, epoxy resin, mica, asbestos, and nano-composite insulation. Quartz material has very high insulation strength and can withstand very high voltage without being conductive; and the quartz material can withstand a high electric field strength under the action of the electric field without breakdown, so that the transformer can meet the ultra-high voltage withstand scenario. It should be noted that other high-temperature resistant insulating materials can also be used to form the insulating dielectric layer 3 according to needs.

[0058] The technical solution of the present invention is to add an insulating dielectric layer 3 between the primary winding 1 and the secondary winding 2, and electrically connect the primary winding 1 and the secondary winding 2 to the packaging frame 4, and then electrically connect to the outside through the packaging frame 4; the addition of the insulating dielectric layer 3 can increase the physical distance between the primary winding 1 and the secondary winding 2, which can effectively reduce the overall electric field strength; and the insulating dielectric layer 3 can make the electric field more evenly dispersed, reduce the area where the electric field is concentrated, thereby reducing the risk of local discharge and breakdown of the transformer; therefore, the addition of the insulating dielectric layer 3 can reduce the electric field strength, and at the same time make the electric field distribution more uniform, thereby improving the withstand voltage performance of the packaged built-in transformer. Secondly, the primary winding 1 includes a first coil 11 and a first insulating package 12, and the secondary winding 2 includes a second coil 21 and a second insulating package 22, which facilitates independent manufacturing and pre-assembly of the primary winding 1 and the secondary winding 2; it is also possible to select primary windings 1 and secondary windings 2 with different performances for combination according to different input and output requirements, thereby improving the processing flexibility and convenience of the packaged built-in transformer; and because the primary winding 1 and the secondary winding 2 can be manufactured independently and in parallel, the overall processing cycle of the transformer is shortened and the production efficiency is improved.

[0059] The above are only exemplary embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A packaged built-in transformer, characterized in that: include: The primary winding comprises a first coil and a first insulating package, wherein the first coil is arranged in the first insulating package; The secondary winding comprises a second coil and a second insulating package, wherein the second coil is arranged in the second insulating package; An insulating dielectric layer, provided between the primary winding and the secondary winding; A packaging frame connected to a side of the primary winding or the secondary winding away from the insulating medium layer; The packaging frame is electrically connected to the primary winding or the secondary winding.

2. The packaged built-in transformer according to claim 1, characterized in that: The packaging frame assembly includes a first base island and a second base island, one side of the first base island is connected to the primary winding or the secondary winding, one side of the second base island is connected to the primary winding or the secondary winding, and the first base island and the second base island are respectively arranged at both ends of the primary winding or the secondary winding.

3. The packaged built-in transformer according to claim 2, characterized in that: It also includes a third insulating package body, wherein the primary winding, the secondary winding and the package frame are arranged in the third insulating package body, and the package frame at least partially extends to the outside of the third insulating package body to form a pin structure.

4. The packaged built-in transformer according to claim 3, characterized in that: A side of the first base island away from the primary winding or the secondary winding extends to the outside of the third insulating package to form a first pin; a side of the second base island away from the primary winding or the secondary winding extends to the outside of the third insulating package to form a second pin, and the pin structure includes the first pin and the second pin.

5. The packaged built-in transformer according to claim 4, characterized in that: The first insulating package body, the second insulating package body and the third insulating package body are made of epoxy resin, polyester resin, acrylic resin or polyimide material; and / or, Two opposite sides of the third insulating packaging body parallel to the packaging frame are both provided with planes.

6. The encapsulated built-in transformer according to any one of claims 1 to 5, characterized in that: It also includes a connecting wire, and the primary winding or the secondary winding is electrically connected to the packaging frame through the connecting wire.

7. The encapsulated built-in transformer according to any one of claims 2 to 5, characterized in that: It also includes a first magnet and a second magnet, the first magnet is arranged on the side of the primary winding away from the insulating medium layer; the second magnet is arranged on the side of the secondary winding away from the insulating medium layer, and the second magnet is located between the first base island and the second base island of the frame.

8. The encapsulated built-in transformer according to any one of claims 1 to 5, characterized in that: The primary winding and the insulating medium layer are bonded; and / or, The secondary winding is bonded to the insulating medium layer; and / or, The primary winding or the secondary winding is bonded to the packaging frame.

9. The encapsulated built-in transformer according to any one of claims 1 to 5, characterized in that: The insulating medium layer is made of one or more materials selected from quartz, polytetrafluoroethylene, epoxy resin, mica, asbestos, and nano-composite insulation.

10. A method for producing a packaged built-in transformer, characterized in that: The following steps are involved: Selecting the first coil and the second coil to be adapted according to the preset input and output performance; combining the molten encapsulating material with the first coil to form a primary winding after solidification; combining the molten encapsulating material with the second coil and solidifying to form a secondary winding; Bonding the primary winding and the secondary winding to both sides of the insulating dielectric layer; The primary winding or the secondary winding is bonded to the packaging frame to form a packaged built-in transformer.

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