Plate pressing device

CN119381284APending Publication Date: 2025-01-28ZHISHENG SCI & TECH GUANGZHOU
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Patent Information

Application Number
CN202310920536.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-07-25
Publication Date
2025-01-28

AI Technical Summary

Technical Problem

When the existing wafer pressing device presses multiple stacked wafers at one time, the stress of each wafer may cause damage or warping due to the different up and down positions.

Method used

A board suppression device is designed, which contains a fixed frame and a suppression module. The fixed rack includes multiple fixed plates with upper and lower intervals, and the suppression module includes a activity rack that can displacement from the fixed rack. The activity plate of the activity shelf is staggered with the fixed board, which can be clamped and pressed the board parts together with the fixed board to ensure that the force of each board is consistent.

Benefits of technology

Through the staggered clamping of the fixed board and the activity board, the uniform suppression of the board is achieved, avoiding the wafer damage or warning caused by unevenness due to unevenness, and ensure the flatness of the board.

✦ Generated by Eureka AI based on patent content.

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Abstract

A plate pressing device is suitable for pressing a plurality of plates. The plate pressing device comprises a fixing frame and a pressing module. The fixing frame comprises a plurality of vertically-spaced fixing plates. The pressing module comprises a movable frame capable of moving up and down relative to the fixed frame, the movable frame comprises a plurality of movable plates which are arranged at intervals up and down and can be used for placing the plates, the fixed plate and the movable plates are staggered, and the movable plates and the fixed plate can jointly clamp and press the plates respectively.
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