Substrate processing system

Abstract

A substrate processing system includes a transfer device provided with a rack, a batch processing device, and a single sheet processing device. The transfer device, the single-sheet processing device, and the batch processing device are sequentially arranged in a straight line in a row. The batch processing apparatus includes, for example, a first batch transport mechanism that transports a plurality of substrates to a batch processing tank at a time. The first batch transfer mechanism receives the plurality of substrates converted into the vertical posture on the transfer device side, and directly transfers the substrates to a batch processing tank, for example, without using a substrate transfer robot of a single-sheet processing device.

Description

Technical Field

[0001] The present invention relates to a substrate processing system for processing a substrate. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of FPD include liquid crystal display devices, organic EL (electroluminescence) display devices, and the like. Background Art

[0002] In a conventional substrate processing system, a loading and unloading device, a single-wafer processing device, an interface device, and a batch processing device are sequentially arranged (for example, refer to Japanese Patent Laid-Open No. 2021-064652).

[0003] The loading and unloading device includes: a loading table for loading cassettes, a first transfer device, and a first transition device for temporarily storing substrates. The single-wafer processing device includes a second transfer device and a second transition device for temporarily storing substrates. The interface device includes a transfer robot and a batch forming unit.

[0004] The first transfer device takes out the five substrates in the cassette and transfers the five substrates to the first transition device. In addition, the five substrates are held horizontally inside the cassette. Then, the second transfer device receives the five substrates from the first transition device and transfers the five substrates to the second transition device. Then, the transfer robot receives the five substrates from the second transition device and transfers the five substrates to the batch forming unit. In the batch forming unit, the five substrates are held vertically. Summary of the invention

[0005] [Problems to be solved by the invention]

[0006] However, the following problems may occur in previous substrate processing systems. For example, in the substrate processing system of Japanese Patent Gazette No. 2021-064652, in order to process multiple substrates at a time using the processing tank of a batch processing device, the transport robot of the interface device arranges multiple substrates in a vertical posture in the batch forming part. Therefore, the substrate must be transported from the loading and unloading device to the interface device through the single-wafer processing device. Here, a second transport device is used to allow the substrate to pass through the single-wafer processing device. The second transport device is also used to transport the substrate from the liquid processing device in the single-wafer processing device to the drying device. Due to the increase in the substrate transport burden borne by the second transport device, the production capacity of the substrate processing system may be reduced.

[0007] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing system that prevents a reduction in throughput.

[0008] [Technical means to solve the problem]

[0009] In order to achieve this object, the present invention adopts the following structure. That is, the substrate processing system of the present invention is characterized in that: batch processing of a plurality of substrates is performed at one time and single-wafer processing of the plurality of substrates is performed one by one, and the system comprises: a transfer device provided with a carrier rack for placing carriers, the carriers being used to store the plurality of substrates in a horizontal posture at predetermined intervals; a batch processing device for processing the plurality of substrates at one time; and a single-wafer processing device for processing the plurality of substrates one by one; the transfer device, the single-wafer processing device and the batch processing device are sequentially arranged in a straight line in a row, the transfer device comprises a first posture conversion unit, the first posture conversion unit takes out the carrier placed on the carrier rack, The multiple substrates are converted from a horizontal posture to a vertical posture, the single-wafer processing device comprises: a plurality of single-wafer processing units, which process the multiple substrates one by one; and a first substrate conveying mechanism, which conveys the multiple substrates to the multiple single-wafer processing units; the batch processing device comprises: a batch processing unit, which processes the multiple substrates at a time; and a first batch conveying mechanism, which conveys the multiple substrates to the batch processing unit at a time; the first batch conveying mechanism receives the multiple substrates that have been converted to a vertical posture by the first posture conversion unit on one side of the transfer device, and directly conveys them to the batch processing unit without using the first substrate conveying mechanism of the single-wafer processing device.

[0010] According to the substrate processing system of the present invention, since the first substrate transfer mechanism of the single-wafer processing device is not used when transferring the substrate from the transfer device to the batch processing device, the burden of the first substrate transfer mechanism is reduced, and the substrate transfer to the batch processing device is quickly performed. Therefore, the productivity of the substrate processing system can be improved.

[0011] In addition, in the substrate processing system, preferably, the batch processing device has a batch substrate transfer area, the batch substrate transfer area is an area where the first batch transfer mechanism moves, the batch substrate transfer area is arranged on one end side of the transfer device in a second horizontal direction orthogonal to a first horizontal direction in which the transfer device and the batch processing device are arranged, and the batch substrate transfer area extends from the transfer device to the batch processing section of the batch processing device, the batch processing section performs the batch processing on the multiple substrates transferred by the first batch transfer mechanism, the first batch transfer mechanism receives the multiple substrates that have been subjected to the batch processing and transfers the multiple substrates to the single-wafer processing device in a vertical posture, the single-wafer processing device uses the multiple single-wafer processing sections to perform the single-wafer processing on the multiple substrates that have been subjected to the batch processing one by one, and the transfer device transfers the multiple substrates that have been transferred from the single-wafer processing device and subjected to the single-wafer processing to the carrier mounted on the carrier mounting rack.

[0012] The batch substrate transfer area extends from the transfer device to the batch processing section of the batch processing device. In addition, the batch substrate transfer area is arranged on one end side of the transfer device in a second horizontal direction orthogonal to the first horizontal direction.

[0013] In addition, in the substrate processing system, preferably, the transfer device comprises: a substrate conveying mechanism, which comprises a robot arm, and the robot arm takes out the multiple substrates from the carrier placed on the carrier rack in a horizontal posture; the first posture conversion unit, which converts the multiple substrates conveyed by the substrate conveying mechanism from a horizontal posture to a vertical posture; and a first vertical holding unit, which holds the multiple substrates received from the first posture conversion unit in a vertical posture; and the first batch conveying mechanism receives the multiple substrates in the vertical posture from the first vertical holding unit.

[0014] The first batch transfer mechanism can receive a plurality of substrates from a first vertical holding portion of the transfer device, and transfer the plurality of substrates from the transfer device to the batch processing device via the single wafer processing device in a vertical posture.

[0015] In addition, in the substrate processing system, preferably, the single-wafer processing device has an interface area extending in the first horizontal direction, the multiple single-wafer processing units are arranged on the opposite side of the batch substrate conveying area across the interface area, the interface area has a horizontal posture conversion mechanism, the horizontal posture conversion mechanism converts the multiple substrates conveyed by the first batch conveying mechanism from a vertical posture to a horizontal posture, and the first substrate conveying mechanism conveys the multiple substrates in a horizontal posture from the horizontal posture conversion mechanism to the multiple single-wafer processing units.

[0016] For example, there is an interface area between the single-wafer processing device and the batch processing device. In this case, due to the existence of the interface area, the substrate processing system becomes longer in the first horizontal direction where the transfer device and the batch processing device are arranged. In this regard, according to the present invention, the single-wafer processing device has an interface area and a single-wafer processing unit extending in the first horizontal direction. In addition, the single-wafer processing unit is arranged on the opposite side of the batch substrate transfer area across the interface area. With this configuration, it is possible to suppress the substrate processing system from becoming longer in the first horizontal direction.

[0017] In addition, in the substrate processing system, preferably, the single-wafer processing device includes a through area and a single-wafer substrate transfer area respectively extending in the first horizontal direction, the batch substrate transfer area, the through area and the single-wafer substrate transfer area are arranged in sequence in the second horizontal direction, the multiple single-wafer processing units are arranged on the opposite side of the through area across the single-wafer substrate transfer area, the first substrate transfer mechanism is arranged in the single-wafer substrate transfer area, the through area includes: a transfer device side area adjacent to the transfer device; and a batch processing device side area adjacent to the transfer device side area and the batch processing device; the batch processing The device side area is provided with a horizontal posture conversion mechanism, which converts the multiple substrates transported by the first batch transport mechanism from a vertical posture to a horizontal posture, and the horizontal posture conversion mechanism includes: a second posture conversion unit, which converts the multiple substrates from a vertical posture to a horizontal posture; and a second substrate transport mechanism, which is arranged on the opposite side of the batch processing device across the second posture conversion unit and transports one of the multiple substrates that has been converted to a horizontal posture; the first substrate transport mechanism in the single substrate transport area receives the one substrate from the second substrate transport mechanism, and transports the one substrate to the multiple single-wafer processing units.

[0018] According to the present invention, it is possible to suppress the substrate processing system from becoming longer in the first horizontal direction. In addition, a horizontal posture conversion mechanism is provided in the batch processing device side area of ​​the passing area. The horizontal posture conversion mechanism includes a second posture conversion unit and a second substrate conveying mechanism. The second substrate conveying mechanism is arranged on the opposite side of the batch processing device across the second posture conversion unit. That is, the second posture conversion unit and the second substrate conveying mechanism are arranged in sequence in the direction from the batch processing device toward the transfer device. Therefore, the first substrate conveying mechanism can receive a substrate in a horizontal posture at a position away from the batch processing device.

[0019] In addition, in the substrate processing system, preferably, the single-chip substrate conveying area comprises: a third posture conversion unit, which is arranged between the transfer device and the first substrate conveying mechanism, and converts the multiple substrates conveyed by the first substrate conveying mechanism from a horizontal posture to a vertical posture; and a second vertical holding unit, which holds the multiple substrates that have been converted into a vertical posture by the third posture conversion unit in a vertical posture; the first batch conveying mechanism receives the multiple substrates from the second vertical holding unit, and conveys the multiple substrates to the transfer device in a vertical posture; the transfer device converts the multiple substrates that are conveyed from the single-chip processing device and subjected to the single-chip processing from a vertical posture to a horizontal posture, and conveys the multiple substrates converted into a horizontal posture to the carrier mounted on the carrier mounting rack.

[0020] The third posture conversion unit converts the plurality of substrates transferred by the first substrate transfer mechanism from a horizontal posture to a vertical posture. The first batch transfer mechanism can receive the plurality of substrates in the vertical posture from the third posture conversion unit via the second vertical holding unit, and transfer the plurality of substrates from the single-wafer processing device to the transfer device. In addition, by configuring in this way, an existing transfer device can be used as the transfer device.

[0021] Furthermore, in the substrate processing system, preferably, the horizontal posture conversion mechanism includes a standby tank, the standby tank being arranged between the second posture conversion unit and the batch processing apparatus and storing an immersion liquid for immersing the plurality of substrates in a vertical posture.

[0022] The horizontal posture conversion mechanism can make the plurality of substrates in the vertical posture stand by while immersing the plurality of substrates in the immersion liquid stored in the standby tank.

[0023] In addition, in the substrate processing system, preferably, the horizontal posture conversion mechanism has a second batch transfer mechanism, and the second batch transfer mechanism has a pair of chucks in which a plurality of pairs of holding grooves and a plurality of pairs of passing grooves are alternately arranged. When a processing substrate group in which the plurality of substrates are alternately arranged with other plurality of substrates is immersed in the immersion liquid in the standby tank, the second batch transfer mechanism uses the pair of chucks to take out the plurality of substrates from the processing substrate group and transfers the taken-out plurality of substrates to the second posture conversion unit.

[0024] The second batch transfer mechanism can take out a plurality of substrates (the first substrate group) from a processing substrate group in which the plurality of substrates (the first substrate group) and other plurality of substrates (the second substrate group) are alternately arranged. The taken-out plurality of substrates (the first substrate group) are converted into a horizontal posture by the second posture conversion unit. In contrast, other plurality of substrates (the second substrate group) can wait while being immersed in the immersion liquid in the waiting tank. Thus, it is possible to prevent other plurality of substrates (the second substrate group) from drying out while waiting.

[0025] Furthermore, in the substrate processing system, the first batch transfer mechanism includes a pair of chucks for holding the plurality of substrates in a vertical posture, and the first batch transfer mechanism transfers the plurality of substrates held in the vertical posture by the pair of chucks.

[0026] In addition, in the substrate processing system, the batch processing section is a batch processing tank storing a processing liquid for immersing the plurality of substrates, and the plurality of single-wafer processing sections are a plurality of single-wafer processing chambers.

[0027] [Effects of the invention]

[0028] According to the substrate processing system of the present invention, it is possible to prevent a decrease in throughput. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to illustrate the invention, some forms currently considered to be preferred are shown in the drawings, but it should be understood that the invention is not limited to the structures and schemes shown in the drawings.

[0030] Figure 1 It is a plan view showing a schematic configuration of a substrate processing system according to an embodiment.

[0031] Figure 2 It is a side view showing the substrate transfer mechanism.

[0032] Figure 3A to Figure 3F It is a side view for explaining the first posture conversion mechanism.

[0033] Figure 4 It is a left side view showing the substrate processing system.

[0034] Figure 5 It is a top view showing the standby tank, the second pusher mechanism, and the second batch transfer mechanism.

[0035] Figure 6 It is a top view showing the second posture conversion unit.

[0036] Fig. 7A is a side view showing a situation where the second pusher receives a plurality of substrates from the first batch transfer mechanism, Figure 7B This is a side view showing a state where a plurality of substrates held by a second pusher are immersed in pure water in a standby tank.

[0037] Figure 8A to Figure 8C It is a side view for explaining the operation of the second posture conversion mechanism.

[0038] Figures 9A to 9C It is a side view for explaining the operation of the second posture conversion mechanism.

[0039] Figures 10A to 10C This is a side view for explaining the structure and operation of the third posture conversion mechanism.

[0040] Fig.11 This is a flowchart for explaining the operation of the substrate processing system according to the embodiment.

[0041] Fig. 12A , Fig. 12B It is a top view of the second posture converter section for explaining the modified example.

[0042] Fig.13 It is a plan view showing a schematic structure of a substrate processing system according to a modification.

[0043] Fig.14 It is a plan view schematically showing the structure of a substrate processing system according to a modification.

[0044] Fig.15 It is a plan view schematically showing the structure of a substrate processing system according to a modification.

[0045] Fig.16 It is a plan view schematically showing the structure of a substrate processing system according to a modification. DETAILED DESCRIPTION

[0046] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Figure 1 It is a plan view showing a schematic configuration of a substrate processing system 1 according to the embodiment.

[0047] <1. Overall composition>

[0048] Reference Figure 1 The substrate processing system 1 includes a stacker device 2, a transfer device 3, a single-wafer processing device 5, a batch processing device 7, and a batch substrate transfer area R1. The stacker device 2, the transfer device 3, the single-wafer processing device 5, and the batch processing device 7 are sequentially arranged in a straight line. In addition, the batch processing device 7 may also include a batch substrate transfer area R1.

[0049] The substrate processing system 1 performs, for example, a chemical liquid treatment, a cleaning treatment, a drying treatment, etc. on the substrate W. The substrate processing system 1 continuously performs batch processing and single-wafer processing on a plurality of substrates W (for example, 50 or 25). Specifically, the substrate processing system 1 adopts a processing method (so-called hybrid method) that combines batch processing and single-wafer processing. The batch processing is a method that processes a plurality of substrates W at once in a vertical posture state. The single-wafer processing is a method that processes a plurality of substrates W one by one in a horizontal posture state.

[0050] In this specification, for convenience, the direction in which the transfer device 3 and the batch processing device 7 are arranged is referred to as the "front-rear direction X". The front-rear direction X is horizontal. In the front-rear direction X, for example, the direction from the batch processing device 7 toward the transfer device 3 is referred to as the "front". The direction opposite to the front is referred to as the "rear". The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as the "right". The direction opposite to the right is referred to as the "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, the front, rear, right, left, top, and bottom are appropriately shown for reference.

[0051] <2. Stacker Device>

[0052] The stacker device 2 accommodates at least one carrier C. The carrier C stores a plurality of substrates W (e.g., 25) in a horizontal position at a predetermined interval (e.g., 10 mm). In addition, in the carrier C, the plurality of substrates W in a horizontal position are neatly arranged in the vertical direction Z. As the carrier C, for example, a FOUP (Front Opening Unify Pod) can be used, but it is not limited thereto.

[0053] The stacker device 2 includes a plurality of (e.g., two) load ports 9 and a stacker body 11. The two load ports 9 are adjacent to the front of the stacker body 11. The two load ports 9 are arranged in the width direction Y. The two load ports 9 are used to carry in and carry out the carrier C, respectively. The stacker device 2 includes a storage rack 15 and a carrier transport robot 17. The storage rack 15 is a rack for storing the carrier C. The carrier C is placed on the storage rack 15.

[0054] The carrier transport robot 17 transports the carrier C between the two load ports 9, the storage rack 15, and the rack 19 described later. The carrier transport robot 17, for example, includes a gripping portion 18 that grips a protrusion provided on the upper surface of the carrier C. The gripping portion 18 can be moved in the horizontal direction (front-rear direction X and width direction Y) and the vertical direction Z by the carrier transport robot 17. The carrier transport robot 17 is driven by one or more electric motors. In addition, the carrier transport robot 17 may also include a movable support portion that supports the lower surface of the carrier C instead of the gripping portion 18.

[0055] <3. Transfer device>

[0056] The transfer device 3 is provided with a rack 19 for placing the carrier C. The transfer device 3 takes out a plurality of substrates W (for example, 25 substrates) from the carrier C placed on the rack 19. The transfer device 3 converts the taken-out plurality of substrates W (for example, 25 substrates or 50 substrates) from a horizontal position to a vertical position. Then, the transfer device 3 transfers the plurality of substrates W converted to a vertical position to the first batch transport mechanism WTR1 (described later). Then, the transfer device 3 (substrate transport mechanism HTR) converts the plurality of substrates W transferred from the single-wafer processing device 5 and subjected to single-wafer processing from a vertical position to a horizontal position, and transports the plurality of substrates W converted to a horizontal position to the carrier C placed on the rack 19.

[0057] The transfer device 3 will be described in detail. The transfer device 3 includes a rack 19, a substrate transport mechanism (robot) HTR, and a first posture conversion mechanism 21. The rack 19 is a rack for taking out and storing substrates W. The carrier C is placed on the rack 19. The rack 19 corresponds to the carrier placement rack of the present invention.

[0058] The substrate transport mechanism HTR is provided behind the rack 19 . The substrate transport mechanism HTR takes out a plurality of (eg, 25) substrates W from the carrier C placed on the rack 19 in a horizontal posture, and transports the taken-out substrates W to the first posture conversion mechanism 21 .

[0059] Reference Figure 2 The substrate transport mechanism HTR includes a plurality of (eg, 25) robot arms 23. Each robot arm 23 holds one substrate W. Figure 2 In the figure, for the convenience of illustration, the substrate transport mechanism HTR has three robot arms 23. Figure 3A to Figure 3F In the embodiment, a pair of horizontal holding portions 31B and a pair of vertical holding portions 31C described later hold three substrates W. In addition, a first pusher 33A described later supports six substrates W.

[0060] The substrate transport mechanism HTR also includes a robot support part 25, an advance and retreat part 27, and a lifting and rotating part 29. The robot support part 25 supports a plurality of robots 23. Thus, the plurality of robots 23 can move as a whole. The advance and retreat part 27 advances and retreats the plurality of robots 23 via the robot support part 25. In order to change the orientation of the robot 23, the lifting and rotating part 29 rotates the advance and retreat part 27 around the vertical axis AX1. In addition, the advance and retreat part 27 and the lifting and rotating part 29 each include an electric motor. In addition, the substrate transport mechanism HTR may also include, in addition to the robot 23, a movable robot (not shown) that is used only to transport one substrate W.

[0061] Reference Figure 1 , Figure 3A to Figure 3FThe first posture conversion mechanism 21 includes a posture conversion unit 31 and a first pusher mechanism 33. The substrate transport mechanism HTR, the posture conversion unit 31, and the first pusher mechanism 33 (including the first pusher 33A) are sequentially arranged in the width direction Y orthogonal to the front-rear direction X in which the transfer device 3 and the batch processing device 7 are arranged. That is, the posture conversion unit 31 is arranged on the left side of the substrate transport mechanism HTR, and the first pusher mechanism 33 is arranged on the left side of the posture conversion unit 31.

[0062] Reference Figure 3A . The posture conversion unit 31 converts a plurality of substrates W (for example, 25 substrates) transported by the substrate transport mechanism HTR from a horizontal posture to a vertical posture. The posture conversion unit 31 includes a support table 31A, a pair of horizontal holding parts 31B, a pair of vertical holding parts 31C, and a rotation drive unit 31D. The pair of horizontal holding parts 31B and the pair of vertical holding parts 31C are provided on the support table 31A. When the substrate W is in a horizontal posture, the pair of horizontal holding parts 31B contacts the lower surface of each substrate W and supports the substrate W from below. In addition, when the substrate W is in a vertical posture, the pair of vertical holding parts 31C holds the substrate W. The rotation drive unit 31D rotates the support table 31A around the horizontal axis AX2.

[0063] Reference Figure 3F . The first pusher mechanism 33 includes a first pusher 33A, a lifting and rotating part 33B, a horizontal moving part 33C, and a track 33D. The first pusher 33A holds the lower part of each of the plurality of substrates W (for example, 25 or 50) in a vertical posture. In addition, the first pusher 33A holds the plurality of substrates W received from the posture conversion part 31 in a vertical posture. The lifting and rotating part 33B lifts the first pusher 33A in the vertical direction Z. In addition, the lifting and rotating part 33B rotates the first pusher 33A around the vertical axis AX3. Thus, the device surface of the substrate W indicated by the arrow AR1 can be oriented in any direction.

[0064] The horizontal moving unit 33C horizontally moves the first pusher 33A and the lifting and rotating unit 33B along the rail 33D. The rail 33D extends in the width direction Y. In addition, the rotation drive unit 31D, the lifting and rotating unit 33B, and the horizontal moving unit 33C each include an electric motor.

[0065] The posture conversion unit 31 corresponds to the first posture conversion unit of the present invention. The first pusher 33A corresponds to the first vertical holding unit of the present invention. The front-rear direction X corresponds to the first horizontal direction of the present invention. The width direction Y corresponds to the second horizontal direction of the present invention.

[0066] Here, the operation of the first posture conversion mechanism 21 is described. For example, the four batch processing tanks BT1 to BT4 described later of the batch processing device 7 process 50 substrates W corresponding to two carriers C at a time. Therefore, the first posture conversion mechanism 21 converts the postures of 50 substrates W (W1, W2) in units of 25 while holding the 50 substrates W on the first pusher 33A. The 25 substrates W1 are called the first substrate group. The 25 substrates W2 are called the second substrate group. The 50 substrates W (W1, W2) are called the processed substrate group. When the substrates W1 and W2 are not particularly distinguished, the substrates W1 and W2 are recorded as substrates W.

[0067] Reference Figure 3A . The posture conversion unit 31 receives 25 substrates W1 from the substrate transport mechanism HTR. At this time, the 25 substrates W1 are in a horizontal posture and are neatly arranged at a full pitch (for example, 10 mm intervals). In addition, the full pitch is also called a standard pitch. In addition, the device surface of each substrate W1 faces upward. In addition, the device surface of the substrate W is the surface for forming electronic circuits, which is called the "front side". In addition, the back side of the substrate W refers to the surface where no electronic circuits are formed. The surface on the opposite side of the device surface is the back side.

[0068] Reference Figure 3B The rotation drive unit 31D of the posture conversion unit 31 rotates the pair of horizontal holding units 31B and the like by 90 degrees around the horizontal axis AX2, thereby converting the 25 substrates W1 from the horizontal posture to the vertical posture. Figure 3C Thereafter, the first pusher mechanism 33 raises the first pusher 33A to receive the 25 substrates W1 from the posture conversion section 31 .

[0069] Reference Figure 3D Then, the first pusher mechanism 33 rotates the first pusher 33A 180 degrees around the vertical axis AX3. Thus, the orientation of the 25 substrates W1 is changed from the left to the right. In addition, the posture conversion unit 31 receives the 25 substrates W2 from the substrate transport mechanism HTR. Figure 3E The first pusher mechanism 33 lowers the first pusher 33A holding the 25 substrates W1 to the retracted position. Then, the posture conversion unit 31 converts the 25 substrates W2 from the horizontal posture to the vertical posture. The posture conversion unit 31 and the first pusher mechanism 33 operate without interfering with each other.

[0070] Reference Figure 3F. Then, the first pusher mechanism 33 raises the first pusher 33A holding 25 substrates W1. Thus, the first pusher 33A further receives 25 substrates W2. The first pusher 33A holds 50 substrates W (W1, W2). The 25 substrates W1 and the 25 substrates W2 are arranged alternately. The 50 substrates W are neatly arranged at a half pitch (e.g., 5 mm interval). In addition, the half pitch is an interval of half the full pitch.

[0071] Thereafter, the first pusher mechanism 33 moves the first pusher 33A holding the 50 substrates W along the track 33D to a first substrate delivery position PP1 below a pair of chucks 37 and 38 (described later) of a first batch transfer mechanism WTR1 (described later).

[0072] <4. Batch substrate transfer area>

[0073] Reference Figure 1 . The batch substrate transfer area R1 is arranged, for example, on one end side of the transfer device 3 in the width direction Y that is orthogonal to the front-to-back direction X in which the transfer device 3 and the batch processing device 7 are arranged. That is, the batch substrate transfer area R1 is adjacent to the left side of the transfer device 3, the single-wafer processing device 5, and the batch processing device 7. In addition, the batch substrate transfer area R1 extends from the transfer device 3 to the batch processing device 7 (the four batch processing tanks BT1 to BT4 described later). That is, in the front-to-back direction X, one end of the batch substrate transfer area R1 extends to the transfer device 3. The other end of the batch substrate transfer area R1 extends to the batch processing device 7 (the four batch processing tanks BT1 to BT4).

[0074] The batch substrate transfer region R1 includes a batch transfer mechanism (robot) WTR1. The first batch transfer mechanism WTR1 transfers a plurality of substrates W in a vertical posture between a first substrate delivery position PP1, a second substrate delivery position PP2, a standby tank 57, and four batch processing tanks BT1 to BT4.

[0075] The first substrate delivery position PP1 , the second substrate delivery position PP2 , the standby tank 57 , and the four batch processing tanks BT1 to BT4 are arranged in a row in the front-rear direction X. Therefore, the first batch transfer mechanism WTR1 transfers the plurality of substrates W in the front-rear direction X.

[0076] The first batch transport mechanism WTR1 includes a pair of chucks 37, 38 and a guide rail 39. The pair of chucks 37, 38 includes 50 pairs of holding grooves, for example, in order to hold 50 substrates W in a vertical posture. That is, the two chucks 37, 38 each include 50 holding grooves. The two chucks 37, 38 extend in the width direction Y, respectively. The first batch transport mechanism WTR1 opens or closes the two chucks 37, 38. The two chucks 37, 38 hold a plurality of substrates W (for example, 50) arranged neatly in the width direction Y. The guide rail 39 extends in the front-rear direction X. The first batch transport mechanism WTR1 moves the pair of chucks 37, 38 along the guide rail 39. The first batch transport mechanism WTR1 is driven by an electric motor.

[0077] <5. Batch processing device>

[0078] The batch processing apparatus 7 is adjacent to the rear of the single-wafer processing apparatus 5. The batch processing apparatus 7 processes a plurality of substrates W at a time. The batch processing apparatus 7 performs a designated batch process on a plurality of substrates W transported by the first batch transport mechanism WTR1. The batch processing apparatus 7 includes, for example, four batch processing tanks BT1 to BT4. The four batch processing tanks BT1 to BT4 are arranged in a row in the front-rear direction X.

[0079] The four batch processing tanks BT1 to BT4 perform immersion processing on a plurality of substrates W (for example, 25 or 50 substrates) at a time. The four batch processing tanks BT1 to BT4 store processing liquids (for example, chemical liquid or pure water) for immersing the plurality of substrates W, respectively.

[0080] The four batch processing tanks BT1 to BT4 include, for example, two chemical processing tanks BT1 and BT3 and two water washing processing tanks BT2 and BT4. The chemical processing tank BT1 and the water washing processing tank BT2 are set as one group, and the chemical processing tank BT3 and the water washing processing tank BT4 are set as another group. In addition, the combination of the chemical processing tank and the water washing processing tank is not limited to this example. In addition, the number of batch processing tanks is not limited to 4, as long as it is 1 or 2 or more.

[0081] The two chemical liquid treatment tanks BT1 and BT3 perform etching treatment using chemical liquid. As the chemical liquid, phosphoric acid is used, for example. The chemical liquid treatment tanks BT1 and BT3 store chemical liquid supplied from a chemical liquid discharge pipe not shown in the figure. The two water washing treatment tanks BT2 and BT4 perform pure water washing treatment, that is, rinse the chemical liquid attached to the plurality of substrates W with pure water. As the pure water, deionized water (DIW) is used, for example. The water washing treatment tanks BT2 and BT4 store pure water supplied from a pure water discharge pipe not shown in the figure.

[0082] Four lifters LF1 to LF4 are respectively provided in the four batch processing tanks BT1 to BT4. For example, lifter LF1 holds substrates W arranged in a vertical position at a predetermined interval, i.e., half pitch (e.g., 5 mm interval). Lifter LF1 lifts and lowers a plurality of substrates W between a processing position inside the batch processing tank BT1 and a delivery position above the batch processing tank BT1. The other three lifters LF2 to LF4 are also configured similarly to lifter LF1. In addition, the four batch processing tanks BT1 to BT4 are respectively equivalent to the batch processing units of the present invention.

[0083] <6. Single chip processing device>

[0084] The single-wafer processing apparatus 5 processes a plurality of (eg, 50 or 25) substrates W one by one. That is, the single-wafer processing apparatus 5 performs a designated single-wafer process on a plurality of substrates W that have undergone a designated batch process one by one.

[0085] The wafer processing device 5 is adjacent to the rear of the transfer device 3 and adjacent to the front of the batch processing device 7. The wafer processing device 5 includes a wafer substrate processing area R2 and an interface area R3, each extending in the front-rear direction X. In addition, the interface area R3 includes a wafer substrate transfer area R4 and a passing area R5, each extending in the front-rear direction X.

[0086] The single-wafer processing region R2 and the interface region R3 (the single-wafer substrate transfer region R4 and the through region R5) extend from the transfer device 3 to the batch processing device 7, respectively. In addition, the single-wafer substrate processing region R2 and the interface region R3 are arranged in the width direction Y. In addition, the single-wafer substrate transfer region R4 and the through region R5 are arranged in the width direction Y. The batch substrate transfer region R1, the through region R5, the single-wafer substrate transfer region R4 and the single-wafer substrate processing region R2 are arranged in the width direction Y ( Figure 1 That is, the single-wafer processing area R2 is adjacent to the right of the single-wafer conveying area R4. The passing area R5 is adjacent to the left of the single-wafer conveying area R4. The batch substrate conveying area R1 is adjacent to the left of the passing area R5.

[0087] <6-1. Single-wafer substrate processing area>

[0088] The single-wafer processing region R2 is provided on the opposite side of the batch substrate transfer region R1 across the interface region R3. In addition, the single-wafer processing region R2 is provided on the opposite side of the passing region R5 across the single-wafer transfer region R4.

[0089] The substrate processing region R2 includes a rear tower TW1, a front tower TW2, and a substrate transfer robot CR1. The rear tower TW1, the substrate transfer robot CR1, and the front tower TW2 are provided along the substrate transfer region R4.

[0090] The rear tower TW1 is disposed behind the substrate transport robot CR1. The front tower TW2 is disposed in front of the substrate transport robot CR1. Figure 4 As shown, the rear tower TW1 includes one first single-wafer processing chamber SW1 and two second single-wafer processing chambers SW2 stacked in the vertical direction Z. The front tower TW2 includes three second single-wafer processing chambers SW2 stacked in the vertical direction Z. That is, the single-wafer substrate processing area R2 includes six single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2). Each single-wafer processing chamber (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2) performs a designated single-wafer processing on one substrate W. In addition, each single-wafer processing chamber (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2) is equivalent to the single-wafer processing unit of the present invention.

[0091] The substrate transport robot CR1 includes a robot 41, an advance and retreat unit 42, and an elevating and rotating unit 43. The robot 41 holds a substrate W in a horizontal position and is movable. The advance and retreat unit 42 moves the robot 41 forward and backward. The elevating and rotating unit 43 elevates the robot 41 and the advance and retreat unit 42. In addition, the elevating and rotating unit 43 rotates the robot 41 and the advance and retreat unit 42 around the vertical axis AX4 in order to change the orientation of the robot 41.

[0092] The substrate transfer robot CR1 transfers one substrate W in a horizontal posture between the three single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2) of the rear tower TW1 and the three second single-wafer processing chambers SW2 of the front tower TW2. In addition, the type and number of single-wafer processing chambers provided in the rear tower TW1 and the front tower TW2 can be appropriately set.

[0093] The first single-wafer processing chamber SW1 includes, for example, a holding and rotating unit 45 and a nozzle 46. The holding and rotating unit 45 includes: a rotating chuck for holding a substrate W in a horizontal position; and an electric motor for rotating the rotating chuck around a vertical axis passing through the center of the substrate W. The nozzle 46 supplies a processing liquid onto the substrate W held by the holding and rotating unit 45. As the processing liquid, for example, pure water (for example, DIW) and IPA (isopropyl alcohol) can be used. After the substrate W is cleaned with pure water, for example, the first single-wafer processing chamber SW1 forms an IPA liquid film on the upper surface of the substrate W.

[0094] The second single-wafer processing chamber SW2 performs drying treatment using, for example, a supercritical fluid. As the fluid, for example, carbon dioxide can be used. When the fluid is carbon dioxide, the supercritical state is obtained when the critical temperature is 31° C. and the critical pressure is 7.38 MPa. By performing drying treatment using a supercritical fluid, the substrate W can be made less susceptible to pattern collapse.

[0095] The second single-wafer processing chamber SW2 includes a chamber body (container) 47, a support tray 48, and a cover. The chamber body 47 includes a processing space provided inside, an opening for placing a substrate W into the processing space, a supply port, and an exhaust port. The substrate W is supported by the support tray 48 and accommodated in the processing space. The cover covers the opening of the chamber body 47. For example, each second single-wafer processing chamber SW2 supplies a supercritical fluid from the supply port to the processing space in the chamber body 47 in such a way that the fluid is in a supercritical state. One substrate W is dried using the supercritical fluid supplied to the processing space.

[0096] <6-2. Passing Area>

[0097] The passage area R5 includes a transfer device side area R7 and a batch processing device side area R8. The transfer device side area R7 is adjacent to the rear of the transfer device 3. The batch processing device side area R8 is adjacent to the rear of the transfer device side area R7 and to the front of the batch processing device 7.

[0098] Figure 5 It is a plan view showing the standby tank 57, the second pusher 63A, and the second batch transport mechanism WTR2. Figure 6 It is a plan view showing the second posture conversion unit 59 . Fig. 7A This is a diagram showing a state where the second pusher 63A receives a plurality of substrates W from the first batch transfer mechanism WTR1. Figure 7B 1 and 2 are diagrams showing a state in which a plurality of substrates W held by the second pusher 63A are immersed in pure water in the standby tank 57. FIG.

[0099] <6-2-1. Batch processing equipment side area>

[0100] like Figure 1 As shown, the batch processing device side region R8 is provided with a second posture conversion mechanism 55. The second posture conversion mechanism 55 converts the plurality of substrates W transported by the first batch transport mechanism WTR1 from a vertical posture to a horizontal posture. The second posture conversion mechanism 55 includes a standby tank 57, a second batch transport mechanism (robot) WTR2, a second posture conversion unit 59, and a belt conveyor 61. In addition, the second posture conversion mechanism 55 is equivalent to the horizontal posture conversion mechanism of the present invention. The second posture conversion unit 59 is equivalent to the second posture conversion unit of the present invention. The belt conveyor 61 is equivalent to the second substrate transport mechanism of the present invention.

[0101] The standby tank 57 is arranged between the second posture conversion unit 59 and the batch processing device 7. That is, the standby tank 57 is arranged in front of the four batch processing tanks BT1 to BT4 and arranged behind the second posture conversion unit 59. The standby tank 57 stores an immersion liquid for immersing a plurality of substrates W in a vertical posture. Pure water (for example, DIW) can be used as the immersion liquid. The pure water is supplied from a pure water discharge pipe (not shown).

[0102] like Figure 5 , Fig. 7A As shown in FIG. 5 , a second pusher mechanism 63 is provided in the standby tank 57. The second pusher mechanism 63 includes a second pusher 63A that holds the lower portion of a plurality of substrates W (e.g., 50 or 25 substrates) in a vertical posture. The second pusher mechanism 63 can move the second pusher 63A up and down and rotate the second pusher 63A around a vertical axis AX5. The second pusher mechanism 63 is driven by at least one of an electric motor and an air cylinder.

[0103] The second batch transfer mechanism WTR2 transfers a plurality of (eg, 25) substrates W from the standby tank 57 to the second posture conversion unit 59 along a guide rail (not shown) extending in the front-rear direction X in a vertical posture.

[0104] The second batch transport mechanism WTR2 includes a pair of chucks 65, 66 and a drive unit 67. The pair of chucks 65, 66 includes a plurality of pairs (for example, 25 pairs) of holding grooves 69, 70 and a plurality of pairs (for example, 25 pairs) of passing grooves 73, 74. The 25 pairs of holding grooves 69, 70 and the 25 pairs of passing grooves 73, 74 are alternately arranged. In addition, the chuck 65 is provided with 25 holding grooves 69 and 25 passing grooves 73. In addition, the chuck 66 is provided with 25 holding grooves 70 and 25 passing grooves 74. In addition, the pair of chucks 65, 66 may be provided with a plurality of pairs of holding grooves 69, 70 instead of a plurality of pairs of passing grooves 73, 74.

[0105] For example, 50 substrates W1 and W2 of a processing substrate group in which 25 substrates W1 (first substrate group) and other 25 substrates W2 (second substrate group) are alternately arranged may be immersed in the immersion liquid in the standby tank 57. In this case, the second batch transfer mechanism WTR2 takes out 25 substrates W1 (W2) from the 50 substrates W1 and W2 of the processing substrate group using a pair of chucks 65 and 66, and transfers the taken out 25 substrates W1 (W2) to the second posture conversion unit 59.

[0106] The driving unit 67 of the second batch transport mechanism WTR2 opens and closes the two chucks 65 and 66. That is, the driving unit 67 moves the chucks 65 and 66 in the width direction Y, for example, so that the chucks 65 and 66 are closer to or farther from each other. Figure 5In the figure, the chucks 65 and 66 shown by the solid lines are in the closed state. At this time, the chucks 65 and 66 hold, for example, 25 substrates W1 of the 50 substrates W1 and W2 held by the second pusher 63A. In addition, the pair of chucks 65 and 66 shown by the dotted lines are in the open state. The chucks 65 and 66 do not hold any of the 50 substrates W1 and W2 held by the second pusher 63A.

[0107] The driving unit 67 moves the pair of chucks 65 and 66 along a guide rail (not shown) extending in the front-rear direction X. The driving unit 67, the driving unit 79 (described later), and the horizontal push-out mechanism 81 (described later) each include at least one of an electric motor and an air cylinder.

[0108] also, Figure 5 , Fig. 7A , Fig. 8A In the figure, for the convenience of illustration, the second pusher 63A holds six substrates W (W1, W2). Figure 5 In the embodiment, a pair of chucks 65 and 66 have three pairs of holding grooves 69 and 70 and three pairs of through grooves 73 and 74. Figure 5 , Figure 8B , Fig.9A In the figure, the chucks 65, 66 and the chucks 77, 78 hold three substrates W respectively.

[0109] Reference Figure 1 , Figure 6 . The second posture conversion unit 59 converts a plurality of (for example, 25) substrates W from a vertical posture to a horizontal posture. The second posture conversion unit 59 is arranged between the belt conveyor 61 and the batch processing device 7. The second posture conversion unit 59 includes a pair of chucks 77, 78, a drive unit 79, a horizontal ejection mechanism 81 and a posture conversion groove 82. The second posture conversion unit 59 holds 25 substrates W by clamping, for example, 25 substrates W with the chucks 77, 78. A pair of chucks 65, 66 includes a plurality of (for example, 25 pairs) holding grooves 83, 84. In addition, Figure 6 In FIG. 8 , the chucks 77 , 78 are shown in cross-sectional view with a pair of retaining grooves 83 , 84 .

[0110] The driving unit 79 opens and closes the two chucks 77 and 78. That is, the driving unit 79 moves the chucks 77 and 78 in the width direction Y so that the chucks 77 and 78 move closer to or farther from each other. Figure 6 The chucks 77 and 78 are shown in the open state. In the open state, 25 substrates W are placed in a horizontal position on the 25 pairs of holding grooves 83 and 84.

[0111] Furthermore, two rotating shafts 87 and 88 are connected to the two chucks 77 and 78, respectively. The rotating shafts 87 and 88 extend in the width direction Y. Furthermore, the driving unit 79 rotates the chucks 77 and 78 around the rotating shafts 87 and 88 (horizontal axis AX6). The horizontal axis AX6 extends in the width direction Y.

[0112] The horizontal push-out mechanism 81 is disposed behind the substrate W held by the chucks 77 and 78. Figure 6 As shown in FIG. 1 , the horizontal push-out mechanism 81 includes a push-out member 81A for pushing out a single substrate W in a horizontal posture. The horizontal push-out mechanism 81 moves the push-out member 81A in the front-rear direction X.

[0113] The posture conversion tank 82 stores pure water (eg, DIW) supplied from a pure water discharge pipe (not shown). Thus, the 25 substrates W held by the chucks 77 and 78 can be immersed in the pure water in the posture conversion tank 82 .

[0114] Reference Figure 1 . The belt conveyor 61 is arranged on the opposite side of the batch processing device 7 across the second posture conversion unit 59. That is, the belt conveyor 61 is arranged in front of the second posture conversion unit 59. The belt conveyor 61 transports the plurality of substrates W converted into a horizontal posture one by one in the direction from the batch processing device 7 toward the transfer device 3 (i.e., in the front). The belt conveyor 61 includes two pulleys 61A, two conveyor belts 61B, and a pin lifting unit 61C. The two conveyor belts 61B are mounted on the two pulleys 61A. The pin lifting unit 61C is provided at the front end portion of the belt conveyor 61. The pin lifting unit 61C has three lifting pins PN. The pin lifting unit 61C lifts up one substrate W on the two conveyor belts 61B by the three lifting pins PN. At least one of the two pulleys 61A and the pin lifting unit 61C are driven by electric motors, respectively.

[0115] <6-2-2. Operation of the Second Posture Conversion Mechanism>

[0116] Here, the operation of the second posture conversion mechanism 55 will be described. Figures 7A to 9C 2 is a diagram for explaining the operation of the second posture conversion mechanism 55. Fig. 7A , Figure 7B In the figure, the horizontal direction is the width direction Y. In contrast, Figures 8A to 9C In the figure, the transverse direction is the front-to-back direction X.

[0117] First, the first batch transport mechanism WTR1 transports, for example, 50 substrates W that have been processed by one of the two water washing treatment tanks BT2 and BT4 to the top of the standby tank 57 of the single-wafer processing device 5. At this time, the 50 substrates W are neatly arranged in the width direction Y. Thereafter, the second pusher mechanism 63 causes the second pusher 63A to rise. In addition, the second pusher mechanism 63 causes the second pusher 63A to rotate 90 degrees around the vertical axis AX5 to receive the 50 substrates W from the first batch transport mechanism WTR1. As a result, the unillustrated holding grooves of the second pusher 63A are neatly arranged in the width direction Y. Thereafter, as shown Fig. 7A As shown, the second pusher 63A holds the lower portions of the 50 substrates W held by the pair of chucks 37 and 38 of the first batch transfer mechanism WTR1.

[0118] Then, the pair of chucks 37 and 38 are opened, and the second pusher 63A receives 50 substrates W from the first batch transport mechanism WTR1. The second pusher mechanism 63 lowers the second pusher 63A to a height position where the chucks 37 and 38 do not interfere with the 50 substrates W held by the second pusher 63A. Figure 7B As shown by the dotted line, the second pusher mechanism 63 rotates the 50 substrates W by 90 degrees around the vertical axis AX5 so that the 50 substrates W are aligned in the front-back direction X. The rotation direction is an arbitrary direction.

[0119] Then, the second pusher mechanism 63 immerses the 50 substrates W aligned in the front-rear direction X in the pure water in the standby tank 57 while passing the 50 substrates W between the two chucks 65 and 66 of the second batch transport mechanism WTR2. At this time, the two chucks 65 and 66 are in the open state.

[0120] Reference Fig. 8A The two chucks 65 and 66 are kept in an open state. The second pusher mechanism 63 causes the 50 substrates W to pass through the two chucks 65 and 66 while raising the 50 substrates W arranged in the front-back direction X. In addition, the driving unit 79 ( Figure 6 ) causes a pair of chucks 77 and 78 to rise.

[0121] Reference Figure 8B The chucks 65 and 66 of the second batch transport mechanism WTR2 are closed. Then, the second pusher mechanism 63 lowers the second pusher 63A. Thus, the second batch transport mechanism WTR2 uses the 25 pairs of holding grooves 83 and 84 (see Figure 5 ), 25 substrates W1 are held from the 50 substrates W1 and W2 held by the second pusher 63A (refer to Figure 8BIn addition, 25 substrates W2 are passed through 25 pairs of chucks 65 and 66 through grooves 73 and 74 (see Figure 5 ). Therefore, 25 substrates W2 remain on the second pusher 63A. In order to prevent drying, the 25 substrates W2 are immersed in pure water in the standby tank 57.

[0122] Afterwards, if Figure 8B As shown by the solid line, the second batch transport mechanism WTR2 moves the 25 substrates W1 held by the chucks 65 and 66 to above the posture conversion groove 82. That is, the 25 substrates W1 move between the chucks 77 and 78 and the posture conversion groove 82.

[0123] Reference Figure 8C The chucks 77 and 78 are in the open state. The second posture conversion unit 59 (driving unit 79) lowers the chucks 77 and 78 to a specified height position. Thereafter, the second posture conversion unit 59 clamps 25 substrates W1 with the chucks 77 and 78. That is, the second posture conversion unit 59 changes the chucks 77 and 78 to the closed state. Thus, the second posture conversion unit 59 holds the 25 substrates W1.

[0124] Reference Fig.9A . Then, the second batch transport mechanism WTR2 opens the chucks 65 and 66. Thus, the 25 substrates W1 are transferred to the chucks 77 and 78 of the second posture conversion unit 59. Then, the second batch transport mechanism WTR2 moves the chucks 65 and 66 in the opened state to the top of the standby tank 57. Then, the second posture conversion unit 59 lowers the chucks 77 and 78 holding the 25 substrates W1. Thus, the 25 substrates W1 are immersed in the pure water in the posture conversion tank 82.

[0125] Reference Fig. 9B The second posture conversion unit 59 rotates the 25 substrates W1 counterclockwise by 90 degrees about the two rotation axes 87 and 88 (horizontal axis AX6), for example. Thus, the 25 substrates W1 are converted from a vertical posture to a horizontal posture in the pure water of the posture conversion tank 82. In addition, the device surface of each substrate W1 faces upward.

[0126] Reference Fig. 9C The second posture conversion unit 59, for example, lifts the chucks 77 and 78 to take out the substrate W in the horizontal posture from the pure water. When the chucks 77 and 78 are in the open state, the horizontal push-out mechanism 81 pushes out the substrate W1 taken out from the pure water forward by the push-out member 81A. Thus, the pushed-out substrate W1 is conveyed to the belt conveyor 61.

[0127] After the 25 substrates W1 are transferred from the chucks 77 and 78, the remaining 25 substrates W2 immersed in the pure water in the standby tank 57 are transferred to a horizontal posture. In addition, the second batch transfer mechanism WTR2 holds the 25 substrates W2 by the 25 pairs of holding grooves 69 and 70 of the chucks 65 and 66. In addition, when transferring to a horizontal posture, the 25 substrates W2 may be rotated 90 degrees clockwise. Regarding other operations, the same posture transfer of the 25 substrates W1 is performed (refer to Figures 8A to 9C ).

[0128] <6-3. Single-wafer substrate transport area>

[0129] Return to Figure 1 The single-wafer substrate transfer area R4 is equipped with a substrate transfer robot CR2. The substrate transfer robot CR2, for example, transfers one substrate W from the second posture conversion mechanism 55 to one first single-wafer processing chamber SW1 in a horizontal posture. That is, the substrate transfer robot CR2 receives one substrate W from the belt conveyor 61 and transfers the one substrate W to one first single-wafer processing chamber SW1. In addition, the substrate transfer robot CR2 transfers one substrate W between six single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2), the second posture conversion mechanism 55, and the third posture conversion mechanism 91 (described later).

[0130] The substrate transport robot CR2 is provided with a robot hand 41, an advance / retract unit 42, and an elevating / rotating unit 43, similarly to the substrate transport robot CR1. The substrate transport robot CR2 is further provided with a guide rail 89 extending in the front-rear direction X. The substrate transport robot CR2 (the elevating / rotating unit 43) can move along the guide rail 89. In addition, the substrate transport robot CR2 preferably has two robot hands 41. In this case, the first robot hand 41 is used to transport the wet substrate W, and the second robot hand 41 is used to transport the substrate W dried in the second single-wafer processing chamber SW2.

[0131] In addition, the single substrate transport region R4 includes a third posture conversion mechanism 91. The third posture conversion mechanism 91 includes a third posture conversion unit 93 and a third pusher mechanism 95. The third posture conversion unit 93 converts a plurality of substrates W (e.g., 25 substrates) transported by the substrate transport robot CR2 from a horizontal posture to a vertical posture. The third posture conversion unit 93 is disposed between the transfer device 3 and the substrate transport robot CR2. That is, the third posture conversion unit 93 is disposed behind the transfer device 3 and in front of the substrate transport robot CR2.

[0132] Figures 10A to 10C91 is a side view for explaining the third posture conversion mechanism 91. The third posture conversion unit 93 includes a support table 93A, a pair of horizontal holding parts 93B, a pair of vertical holding parts 93C, and a rotation drive unit 93D. The support table 93A, the pair of horizontal holding parts 93B, and the pair of vertical holding parts 93C are configured similarly to the support table 31A, the pair of horizontal holding parts 31B, and the pair of vertical holding parts 31C of the first posture conversion unit 31. The rotation drive unit 93D of the third posture conversion unit 93 rotates the support table 93A around a horizontal axis AX7 extending in the width direction Y.

[0133] like Fig. 10C As shown, the third pusher mechanism 95 includes a third pusher 95A, a lifting and rotating part 95B, a horizontal moving part 95C and a rail 95D. The third pusher 95A is arranged between the transfer device 3 and the third posture conversion part 93 (see Figure 1 ).

[0134] The third pusher 95A holds the lower part of a plurality of (e.g., 25) substrates W converted into a vertical posture by the third posture conversion unit 93. The lifting and rotating unit 95B lifts the third pusher 95A and rotates the third pusher 95A around the vertical axis AX8. The horizontal moving unit 95C moves the third pusher 95A and the lifting and rotating unit 95B horizontally along the rail 95D. In addition, the rotation driving unit 93D, the lifting and rotating unit 95B, and the horizontal moving unit 95C are driven by an electric motor.

[0135] The rail 95D extends in the width direction Y. Specifically, the rail 95D extends from the single substrate transfer region R4 to the transfer device side region R7. The second substrate delivery position PP2 is set in the transfer device side region R7. The third pusher 95A can move the plurality of substrates W converted into a vertical posture by the third posture conversion unit 93 to the second substrate delivery position PP2 in the transfer device side region R7.

[0136] In addition, the substrate transfer robots CR1 and CR2 correspond to the first substrate transfer mechanism of the present invention. The third pusher 95A corresponds to the second vertical holding unit of the present invention. Figures 10A to 10C In the figure, for convenience of illustration, a pair of horizontal holding parts 93B, a pair of vertical holding parts 93C and a third pusher 95A hold three substrates W.

[0137] Here, the operation of the third posture conversion mechanism 91 will be described. Fig. 10A The substrate transport robot CR2 transports, for example, the substrate W processed in the second single-wafer processing chamber SW2 to the third posture conversion unit 93. The third posture conversion unit 93 holds the substrate W using a pair of horizontal holding units 93B and a pair of vertical holding units 93C.

[0138] Reference Figure 1 0B. When, for example, 25 substrates W are conveyed to the third posture conversion unit 93, the third posture conversion unit 93 turns down a pair of horizontal holding units 93B and the like, and rotates the 25 substrates W by 90 degrees around the horizontal axis AX7. Thus, the third posture conversion unit 93 converts the 25 substrates W from the horizontal posture to the vertical posture. In addition, the 25 substrates W converted to the vertical posture are neatly arranged in the front-rear direction X.

[0139] Thereafter, the third pusher mechanism 95 receives the 25 substrates W in the vertical posture from the third posture converter 93 by raising the third pusher 95A. The third pusher 95A holds the 25 substrates W aligned in the front-rear direction X.

[0140] Reference Fig. 10C . Then, the third posture conversion unit 93 rotates the support table 93A around the horizontal axis AX7 by -90 degrees in order to make the pair of horizontal holding units 93B etc. stand up. Then, the third pusher mechanism 95 moves the third pusher 95A holding the 25 substrates W in a vertical posture from the single substrate transfer area R4 to the transfer device side area R7. That is, the third pusher mechanism 95 moves the third pusher 95A from the substrate delivery position relative to the third posture conversion unit 93 to the second substrate delivery position PP2 relative to the first batch transfer mechanism WTR1.

[0141] In addition, the third pusher mechanism 95 rotates the third pusher 95A by 90 degrees around the vertical axis AX8 so that the 25 substrates W held by the third pusher 95A are aligned in the width direction Y. In addition, the orientation of the 90-degree rotation is such that the device surface faces upward when the first posture conversion unit 31 converts the substrates into a horizontal posture. By this operation, the first batch transfer mechanism WTR1 can transfer the 25 substrates W aligned in the width direction Y from the third posture conversion mechanism 91 (second substrate delivery position PP2) to the first posture conversion mechanism 21 (first substrate delivery position PP1).

[0142] <7. Control Unit>

[0143] The substrate processing system 1 includes a control unit 110 (see Figure 1 ) and a storage unit (not shown). The control unit 110 controls each component of the substrate processing system 1. The control unit 110 includes one or more processors such as a central processing unit (CPU). The storage unit includes at least one of a ROM (Read-Only Memory), a RAM (Random-Access Memory), and a hard disk. The storage unit stores computer programs required to control each component of the substrate processing system 1.

[0144] <8. Operation of substrate processing system>

[0145] Next, refer to Fig.11 The operation of the substrate processing system 1 is described in the flowchart of FIG. Figure 1 .

[0146] [Step S01] Taking out the substrate from the carrier

[0147] An external transfer robot (not shown) transfers two carriers C to the load port 9 . The two carriers C each store, for example, 25 substrates W in a horizontal position. The carrier transfer robot 17 of the stacker device 2 transfers the first carrier C from the load port 9 to the rack 19 while holding the first carrier C with the gripper 18 .

[0148] The substrate transport mechanism HTR takes out 25 substrates W1 (first substrate group) from the first carrier C placed on the rack 19, and transports the 25 substrates W1 in a horizontal posture to the first posture conversion unit 31. Thereafter, the carrier transport robot 17 transports the first carrier C (empty carrier) from which the 25 substrates W1 have been taken out from the rack 19 to the first storage rack 15.

[0149] Thereafter, the carrier transport robot 17 transports the second carrier C from the load port 9 to the rack 19. The substrate transport mechanism HTR takes out 25 substrates W2 (second substrate group) from the second carrier C placed on the rack 19, and transports the 25 substrates W2 in a horizontal posture to the first posture conversion unit 31. Thereafter, the carrier transport robot 17 transports the second carrier C (empty carrier) from which the 25 substrates W2 have been taken out from the rack 19 to the second storage rack 15.

[0150] [Step S02] First vertical posture conversion

[0151] like Figure 3A to Figure 3C As shown, the first posture conversion unit 31 converts the 25 substrates W1 and the 25 substrates W2 from the horizontal posture to the vertical posture. In addition, the first pusher 33A of the first pusher mechanism 33 holds the 50 substrates W (W1, W2) in which the 25 substrates W1 and the 25 substrates W2 are alternately arranged in the vertical posture. Thereafter, the first pusher mechanism 33 transports the 50 substrates W to the first substrate delivery position PP1.

[0152] [Step S03] Chemical solution processing (batch processing)

[0153] The first batch transport mechanism WTR1 receives 50 substrates W in a vertical posture from the first pusher 33A of the first pusher mechanism 33 at the first substrate delivery position PP1. Then, the first batch transport mechanism WTR1 transports the 50 substrates W in a vertical posture from the transfer device 3 to the batch processing device 7 via the single-wafer processing device 5. In addition, the first batch transport mechanism WTR1 transports the 50 substrates W to one of the two lifters LF1 and LF3 of the two chemical solution processing tanks BT1 and BT3.

[0154] In the transfer device 3 , the 50 substrates W held in a vertical position by the first pusher 33A are ready for batch processing in the batch processing tanks BT1 to BT4 . Therefore, the 50 substrates W can be batch processed immediately after being transferred to the batch processing device 7 .

[0155] For example, the first batch transport mechanism WTR1 transports 50 substrates W in a vertical position to the lifter LF1 of the chemical liquid treatment tank BT1. The lifter LF1 receives the 50 substrates W at a position above the chemical liquid treatment tank BT1. The lifter LF1 immerses the 50 substrates W in the chemical liquid (e.g., phosphoric acid) in the chemical liquid treatment tank BT1. Thus, an etching process (batch process) is performed. After the etching process, the lifter LF1 pulls the 50 substrates W from the phosphoric acid in the chemical liquid treatment tank BT1. In addition, when the 50 substrates W are transported to the lifter LF3 of another chemical liquid treatment tank BT3, the same process as that of the chemical liquid treatment tank BT1 is also performed.

[0156] [Step S04] Pure water cleaning process (batch process)

[0157] The first batch transport mechanism WTR1 receives 50 substrates W in a vertical position from the lifter LF1, for example, and transports the 50 substrates W to the lifter LF2 of the water washing tank BT2. The lifter LF2 receives the 50 substrates W at a position above the water washing tank BT2. The lifter LF2 immerses the 50 substrates W in the pure water in the water washing tank BT2. Thus, a cleaning process (batch process) is performed.

[0158] When the first batch transport mechanism WTR1 receives 50 substrates W in a vertical position from the lifter LF3, the first batch transport mechanism WTR1 transports the 50 substrates W to the lifter LF4 of the water washing treatment tank BT4. The lifter LF4 immerses the 50 substrates W in the pure water in the water washing treatment tank BT4.

[0159] [Step S05] First Horizontal Posture Transition

[0160] The first batch transport mechanism WTR1 receives 50 substrates W that have been subjected to a designated batch process in one of the two batch processing tanks BT2 and BT4. That is, the first batch transport mechanism WTR1 receives 50 substrates W that have been subjected to a pure water cleaning process from one of the two lifters LF2 and LF4. When transporting the 50 substrates W, for example, the lifter LF2 pulls up the 50 substrates W from the pure water in the pure water processing tank BT2. Thereafter, the first batch transport mechanism WTR1 transports the 50 substrates W from the batch processing apparatus 7 to the second posture conversion mechanism 55 of the single-wafer processing apparatus 5. Specifically, the first batch transport mechanism WTR1 transports the 50 substrates W to the upper portion of the standby tank 57 of the second posture conversion mechanism 55 disposed in front of the four batch processing tanks BT1 to BT4.

[0161] The second pusher mechanism 63 provided in the standby tank 57 receives 50 substrates W using the second pusher 63A. Fig. 7A , Figure 7B As shown, in order to align the 50 substrates W aligned in the width direction Y in the front-rear direction X, they are rotated 90 degrees around the vertical axis AX5.

[0162] like Figures 8A to 9C As shown, the second posture conversion unit 59 converts the 25 substrates W1 and the 25 substrates W2 from the vertical posture to the horizontal posture. The second posture conversion unit 59 transfers the 25 substrates W1 (25 substrates W2) converted to the horizontal posture to the belt conveyor 61 one by one. The belt conveyor 61 transfers the one substrate W in the horizontal posture forward to a position above the pin lifting unit 61C. Then, the pin lifting unit 61C raises the one substrate W on the two conveyor belts 61B by three lifting pins PN.

[0163] [Step S06] First single chip processing

[0164] The substrate transport robot CR2 receives the wet substrate W lifted by the three lift pins PN of the pin lifter 61C using the first robot 41 of the two robots 41. Then, the substrate transport robot CR2 transports the substrate W received by the first robot 41 to the first single wafer processing chamber SW1 of the rear tower TW1.

[0165] The first single-wafer processing chamber SW1 holds and rotates the substrate W with the device surface facing upward in a horizontal posture by the holding and rotating unit 45, and supplies pure water to the device surface from the nozzle 46. Thereafter, the first single-wafer processing chamber SW1 supplies IPA to the device surface (upper surface) of the substrate W from the nozzle 46, and replaces the pure water on the substrate W with IPA.

[0166] [Step S07] Second single-chip processing

[0167] The substrate transfer robot CR1 of the single-wafer processing area R2 transfers the substrate W replaced with IPA from the first single-wafer processing chamber SW1 to any one of the five second single-wafer processing chambers SW2. Each second single-wafer processing chamber SW2 performs a drying process on one substrate W using carbon dioxide (supercritical fluid) in a supercritical state. The pattern collapse of the pattern surface (device surface) of the substrate W is suppressed by the drying process using the supercritical fluid.

[0168] [Step S08] Second vertical posture conversion

[0169] The substrate transport robot CR2 receives one substrate W1 from the second single-wafer processing chamber SW2 that has been subjected to the drying process using the second robot 41 of the two robots 41. Then, the substrate transport robot CR2 transports the substrate W1 received by the second robot 41 to the third posture switching unit 93.

[0170] When 25 substrates W1 are conveyed to the third posture conversion unit 93, Figures 10A to 10C As shown, the 25 substrates W are converted into the vertical posture again, and the 25 substrates W1 in the vertical posture are moved to the second substrate delivery position PP2.

[0171] The third posture conversion unit 93 converts the 25 substrates W1 from the horizontal posture to the vertical posture. The third pusher mechanism 95 receives the 25 substrates W1 through the third pusher 95A. After that, the third pusher mechanism 95 rotates the 25 substrates W1 by 90 degrees around the vertical axis AX8 so that the 25 substrates W1 arranged in the front-back direction X are arranged in the width direction Y. In addition, the third pusher mechanism 95 transports the 25 substrates W1 to the second substrate delivery position PP2.

[0172] Furthermore, when 25 substrates W2 (second substrate group) are conveyed to the third posture switching section 93, the 25 substrates W2 are conveyed to the second substrate delivery position PP2 in the same manner as the 25 substrates W1 (first substrate group).

[0173] [Step S09] Second Horizontal Posture Transition

[0174] The first batch transport mechanism WTR1 transports 25 substrates W1 (W2) in a vertical posture from the single-wafer processing device 5 to the transfer device 3. That is, the first batch transport mechanism WTR1 receives the 25 substrates W1 (W2) from the third pusher 95A moved to the second substrate delivery position PP2. Then, the first batch transport mechanism WTR1 transports the 25 substrates W1 (W2) in a vertical posture to the first pusher 33A moved to the first substrate delivery position PP1.

[0175] The first posture conversion unit 31 of the transfer device 3 receives 25 substrates W1 (W2) from the first pusher 33A. In addition, the first posture conversion unit 31 converts the 25 substrates W1 (W2) received from the first pusher 33A from the vertical posture to the horizontal posture. The method of converting to the horizontal posture is as follows: Figure 3C , Figure 3B and Figure 3A order.

[0176] [Step S10] Place the substrate in the carrier

[0177] The first carrier (empty carrier) is transported from the first storage rack 15 to the rack 19 by the carrier transport robot 17 of the stacker device 2. The substrate transport mechanism HTR of the transfer device 3 receives 25 substrates W1 that have been converted to a horizontal posture by the first posture conversion unit 31 and have been processed individually from the first posture conversion unit 31. Then, the substrate transport mechanism HTR transports and stores the 25 substrates W1 in the first carrier C placed on the rack 19.

[0178] Thereafter, the carrier transport robot 17 transports the first carrier C storing 25 substrates W1 from the rack 19 to one of the two load ports 9. Thereafter, the carrier transport robot 17 transports the second carrier C (empty carrier) from the second storage rack 15 to the rack 19. Similarly, the substrate transport mechanism HTR receives the 25 substrates W2 converted to the horizontal posture from the first posture conversion unit 31, and stores the received 25 substrates W2 in the second carrier C placed on the rack 19.

[0179] Thereafter, the carrier transport robot 17 transports the second carrier C storing 25 substrates W2 from the rack 19 to one of the two load ports 9. An external transport mechanism (not shown) transports the two carriers C from the load ports 9 to the next destination in sequence.

[0180] According to the present embodiment, the transfer device 3, the single-wafer processing device 5, and the batch processing device 7 are sequentially arranged in a straight line. Since the substrate transfer robot CR2 of the single-wafer processing device 5 is not used when transferring the substrate W from the transfer device 3 to the batch processing device 7, the burden of the substrate transfer robot CR2 is reduced, and the substrate is quickly transferred to the batch processing device 7. Therefore, the productivity of the substrate processing system 1 can be improved.

[0181] In addition, the batch substrate transfer region R1 having the first batch transfer mechanism WTR1 extends from the transfer device 3 to the batch processing device 7 (four batch processing tanks BT1 to BT4). Therefore, the first batch transfer mechanism WTR1 receives the plurality of substrates W from the transfer device 3, and transfers the plurality of substrates W from the transfer device 3 to the batch processing device 7 in a vertical posture via the single-wafer processing device 5. In addition, after passing through the single-wafer processing device 5, the plurality of substrates W are in a state where they can be immediately processed using, for example, the batch processing tank BT1.

[0182] In addition, for example, the first transfer device may be provided in the batch processing apparatus 7, and the second transfer device may be provided in the single-wafer processing apparatus 5. In this case, when the unprocessed substrate W is taken out from the carrier C by the first transfer device, and the processed substrate W is stored in the carrier C by the second transfer device, the operation program of the substrate processing system 1 may become relatively complicated. According to the present embodiment, the transfer device 3 is common to the batch processing apparatus 7 and the single-wafer processing apparatus 5. Therefore, the operation program can be simply configured.

[0183] In addition, for example, an interface area is provided between the single-wafer processing device 5 and the batch processing device 7. In this case, due to the interface area, the substrate processing system 1 becomes longer in the front-to-back direction X where the transfer device 3 and the batch processing device 7 are arranged. In this regard, according to the present embodiment, the single-wafer processing device 5 has an interface area R3. Specifically, the single-wafer processing device 5 has an interface area R3 extending in the front-to-back direction X and, for example, a first single-wafer processing chamber SW1. In addition, the first single-wafer processing chamber SW1 is provided on the opposite side of the batch substrate transfer area R1 across the interface area R3. With this configuration, it is possible to suppress the substrate processing system 1 from becoming longer in the front-to-back direction X.

[0184] In addition, a second posture conversion mechanism 55 is provided in the batch processing apparatus side region R8 passing through the region R5. The second posture conversion mechanism 55 includes a second posture conversion unit 59 and a belt conveyor 61. The belt conveyor 61 is arranged on the opposite side of the batch processing apparatus 7 with the second posture conversion unit 59 interposed therebetween. That is, the second posture conversion unit 59 and the belt conveyor 61 are arranged in this order in the direction (front) from the batch processing apparatus 7 toward the transfer apparatus 3. Therefore, the substrate transport robot CR2 can receive the substrate W in a horizontal posture at a position away from the batch processing apparatus 7. Therefore, the distance that the substrate transport robot CR2 transports the substrate W becomes short, and the substrate W can be efficiently transported.

[0185] In addition, the third posture conversion unit 93 converts the plurality of substrates W transferred by the substrate transfer robot CR2 from a horizontal posture to a vertical posture. The first batch transfer mechanism WTR1 can receive the plurality of substrates W in the vertical posture from the third posture conversion unit 93 via the third pusher 95A, and transfer the plurality of substrates W from the single-wafer processing device 5 to the transfer device 3. In addition, by configuring in this way, an existing transfer device can be used as the transfer device 3.

[0186] In addition, the second posture conversion mechanism 55 can make the plurality of substrates W in the vertical posture stand by while immersing the plurality of substrates W in the immersion liquid stored in the standby tank 57 .

[0187] In addition, the second batch transport mechanism WTR2 can take out a plurality of substrates W1 (first substrate group) from a processing substrate group in which the plurality of substrates W1 (first substrate group) and other plurality of substrates W2 (second substrate group) are alternately arranged. The taken-out plurality of substrates W1 (first substrate group) are converted into a horizontal posture by the second posture conversion unit 59. In contrast, other plurality of substrates W2 (second substrate group) can wait while being immersed in the immersion liquid in the waiting tank 57. Thus, it is possible to prevent other plurality of substrates W2 (second substrate group) from drying out while waiting.

[0188] The present invention is not limited to the above-described embodiments, and modifications may be made as described below.

[0189] (1) In the above-described embodiment, the second posture conversion mechanism 55 includes the standby groove 57 and the second pusher mechanism 63. In this regard, the second posture conversion mechanism 55 may include the second pusher mechanism 63 instead of the standby groove 57.

[0190] (2) In the above-mentioned embodiment, the second posture conversion mechanism 55 includes the standby tank 57, the second pusher mechanism 63, and the second batch transport mechanism WTR2. In this regard, the second posture conversion mechanism 55 may not include the standby tank 57, the second pusher mechanism 63, and the second batch transport mechanism WTR2. In this case, Fig. 12A , Fig. 12B As shown, the second posture conversion unit 59 includes a fourth thruster mechanism 101 .

[0191] The fourth pusher mechanism 101 includes a fourth pusher 101A for holding a plurality of (e.g., 25) substrates W in a vertical posture. The fourth pusher mechanism 101 moves the fourth pusher 101A up and down by one or more electric motors (not shown), and also rotates the fourth pusher 101A around a vertical axis AX9.

[0192] The fourth pusher 101A is disposed at the bottom of the posture conversion groove 82. Fig. 12AAs shown, the first batch transport mechanism WTR1 moves a pair of chucks 37 and 38 holding 25 substrates W to above the posture conversion groove 82.

[0193] The fourth pusher mechanism 101 raises the fourth pusher 101A while passing the fourth pusher 101A between the pair of chucks 77 and 78 of the second posture conversion unit 59. In addition, the fourth pusher mechanism 101 rotates the fourth pusher 101A 90 degrees around the vertical axis AX9. Thus, the direction in which the plurality of holding grooves MZ provided in the fourth pusher 101A are arranged can be changed from the front-back direction X to the width direction Y. The plurality of holding grooves MZ are grooves for holding a plurality of substrates W. Therefore, the fourth pusher 101A can receive 25 substrates W arranged in the width direction Y from the pair of chucks 37 and 38 of the first batch transfer mechanism WTR1.

[0194] Then, the first batch transport mechanism WTR1 moves the pair of chucks 37 and 38 from above the posture conversion groove 82. The fourth pusher mechanism 101 rotates the fourth pusher 101A 90 degrees in an arbitrary direction around the vertical axis AX9. Thus, the 25 substrates W (or the plurality of holding grooves MZ) aligned in the width direction Y are aligned in the front-rear direction X.

[0195] Afterwards, if Fig. 12B As shown in FIG. 1 , the fourth pusher mechanism 101 lowers the fourth pusher 101A holding 25 substrates W so as to move the 25 substrates W between the pair of chucks 77 and 78 in the open state. Then, the pair of chucks 77 and 78 clamp the 25 substrates W held by the fourth pusher 101A. That is, the pair of chucks 77 and 78 are closed. Thus, the pair of chucks 77 and 78 hold the 25 substrates W. Then, the fourth pusher 101A is lowered to the bottom of the posture conversion groove 82 where it does not interfere with the 25 substrates W held by the pair of chucks 77 and 78. The second posture conversion unit 59 rotates the pair of chucks 77 and 78 by 90 degrees in an arbitrary direction with the horizontal axis AX6 as the center. Thus, the second posture conversion unit 59 converts the 25 substrates W from a vertical posture to a horizontal posture while facing the device surface upward.

[0196] (3) In the above-mentioned embodiment and each variation, the belt conveyor 61, the second posture conversion unit 59 and the standby tank 57 are sequentially arranged at the rear. In this regard, the standby tank 57, the second posture conversion unit 59 and the belt conveyor 61 may be sequentially arranged at the rear. That is, Figure 1 The arrangement of the belt conveyor 61 , the second posture conversion unit 59 , and the standby tank 57 shown may be reversed.

[0197] (4) In the above-mentioned embodiments and various variations, it is also possible to Fig.13As shown, the second posture conversion mechanism 55 includes a substrate transport robot CR3 instead of the belt conveyor 61. In this case, the substrate transport robot CR3 has the same configuration as the substrate transport robot CR1. That is, the substrate transport robot CR3 includes a movable robot hand 41 that holds one substrate W.

[0198] After the second posture conversion unit 59 converts the 25 substrates W from the vertical posture to the horizontal posture, the substrate transport robot CR3 causes the robot hand 41 to enter between the pair of chucks 77 and 78 in the open state, and takes out one substrate W from the pair of chucks 77 and 78. Then, the substrate transport robot CR3 transports one substrate W to the substrate mounting portion PS1 in the front. The substrate transport robot CR2 in the single substrate transport region R4 takes out one substrate W from the substrate mounting portion PS1. In addition, the substrate transport robot CR3 may directly transfer one substrate W to the substrate transport robot CR2 in the single substrate transport region R4 without passing through the substrate mounting portion PS1.

[0199] (5) In the above-described embodiments and various variations, Figure 1 The single-wafer processing area R2 shown in the figure includes a substrate transfer robot CR1, a first single-wafer processing chamber SW1, and a second single-wafer processing chamber SW2. Fig.13 As shown, the single-wafer processing region R2 includes the first single-wafer processing chamber SW1, but does not include the substrate transfer robot CR1 and the second single-wafer processing chamber SW2.

[0200] In this case, the rear tower TW1 and the front tower TW2 of the single-wafer processing region R2 each include three first single-wafer processing chambers SW1. Each first single-wafer processing chamber SW1 processes one substrate W in a horizontal position using pure water and IPA, and then performs spin drying to dry one substrate W. In addition, the single-wafer processing region R2 only needs to include one or more first single-wafer processing chambers SW1.

[0201] (6) In the above embodiments and various variations, Figure 1 As shown, the second posture conversion unit 59 rotates the plurality of substrates W around the horizontal axis AX6 extending in the width direction Y so as to convert the plurality of substrates W into a horizontal posture. Fig.14 As shown in FIG. 1 , the second posture converting section 59 rotates the plurality of substrates W around a horizontal axis AX6 extending in the front-rear direction X. As shown in FIG.

[0202] In this case, the first batch transfer mechanism WTR1 can also transfer a plurality of (for example, 25) substrates W between the first pusher 33A at the first substrate delivery position PP1, the second pusher 63A, the third pusher 95A at the second substrate delivery position PP2, the four batch processing tanks BT1 to BT4, and the second posture conversion unit 59. In addition, the second posture conversion unit 59 can also be connected via the second posture conversion unit 59. Fig. 12B The fourth pusher 101A of the fourth pusher mechanism 101 shown receives a plurality of substrates W from the first batch transfer mechanism WTR1.

[0203] After the second posture conversion unit 59 converts the plurality of substrates W from the vertical posture to the horizontal posture, the substrate transport robot CR2 can move the first robot hand 41 between the two chucks 77 and 78 in the opened state and take out one substrate W using the first robot hand 41 .

[0204] In addition, in this variation, the first batch transfer mechanism WTR1 can be configured to be able to select any one of the following functions: the function of holding 50 substrates W (W1, W2), the function of holding 25 substrates W1 of the first substrate group, and the function of holding 25 substrates W2 of the second substrate group.

[0205] (7) In the above-described embodiment and various variations, the second posture conversion unit 59 is disposed in the batch processing device side region R8, and the standby tank 57 and the second posture conversion unit 59 are disposed in the front-rear direction X. In this regard, it is also possible to Fig.15 As shown, the second posture conversion unit 59 is provided in the substrate transfer region R4. That is, in the substrate transfer region R4, the second posture conversion unit 59 may be provided between the substrate transfer robot CR2 and the batch processing apparatus 7. In addition, the standby tank 57 is provided in the batch processing apparatus side region R8. Figure 1 5, the standby tank 57 and the second posture conversion unit 59 are arranged in the width direction Y. The second batch transfer mechanism WTR2 transfers the plurality of substrates W in the width direction Y to transfer the plurality of substrates W from the standby tank 57 to the second posture conversion unit 59. The second posture conversion unit 59 rotates the plurality of substrates W by 90 degrees in an arbitrary direction around a horizontal axis AX6 extending in the width direction Y.

[0206] (8) In the above-described embodiment and each variation, the single-chip processing device 5 includes the third posture conversion mechanism 91. Figure 1 6, the single-wafer processing apparatus 5 does not include the third posture conversion mechanism 91. In this case, the single-wafer processing apparatus 5 may include a substrate placement portion PS2 for placing, for example, 25 or more substrates W within the entry and exit range of the substrate transport mechanism HTR. The substrate placement portion PS2 is disposed between the transfer device 3 and the front tower TW2 in the single-wafer substrate processing region R2.

[0207] The substrate transport robot CR2 receives one substrate W from the second single-wafer processing chamber SW2 that has been subjected to the drying process, and transports the substrate W to the substrate mounting portion PS2. When, for example, 25 substrates W are transported to the substrate mounting portion PS2, the substrate transport mechanism HTR transports the 25 substrates W from the substrate mounting portion PS2 to the carrier C mounted on the shelf 19.

[0208] In addition, in the case of this modification, the third posture conversion mechanism 91 is not provided, which has the effect of simplifying the operation of returning the substrate W to the carrier C. However, the single-wafer processing device 5 may be elongated in the front-back direction X. In addition, the substrate transport mechanism HTR enters and exits the substrate mounting portion PS2 in addition to the carrier C mounted on the shelf 19 and the first posture conversion unit 31. Therefore, the transfer device 3 has an operation program that is a modification of the existing transfer device.

[0209] (9) In the above-described embodiment and each variation, the transfer device 3 includes a substrate transfer mechanism HTR, a posture conversion unit 31, and a pusher 33A. In this regard, the transfer device 3 may not include the posture conversion unit 31, but include the substrate transfer mechanism HTR and the pusher 33A. That is, the substrate transfer mechanism HTR may include the posture conversion unit 31 (the function of the posture conversion unit 31). Alternatively, the transfer device 3 may not include the substrate transfer mechanism HTR, but include the posture conversion unit 31 and the pusher 33A. In this case, the posture conversion unit 31 may include the substrate transfer mechanism HTR (the function of the substrate transfer mechanism HTR).

[0210] In this case, the substrate transport mechanism HTR (or the posture conversion unit 31) includes a multi-joint robot. The multi-joint robot takes out a plurality of (e.g., 5) substrates W from the carrier and converts the plurality of substrates W from a horizontal posture to a vertical posture. Then, the multi-joint robot holds the plurality of substrates W in the vertical posture on the pusher 33A.

[0211] (10) In the above-described embodiment and each variation, the second posture conversion mechanism 55 includes the second batch transport mechanism WTR2, the second posture conversion unit 59, and the belt conveyor 61. In this regard, the second posture conversion mechanism 55 may also include a multi-joint robot and a substrate placement unit. In the batch processing device side region R8, for example, the standby tank 57, the multi-joint robot, and the substrate placement unit are sequentially arranged in the front.

[0212] The multi-joint robot receives one substrate W from the second pusher 63A provided in the standby slot 57, and converts the one substrate W from a vertical posture to a horizontal posture. Then, the multi-joint robot transports the one substrate W to the substrate mounting portion in a horizontal posture. Then, the substrate transport robot CR2 in the single substrate transport region R4 takes out one substrate W from the substrate mounting portion.

[0213] (11) In the above-mentioned embodiment and each variation, the third posture conversion unit 93 may be, for example, a substrate loading unit and a multi-joint robot. In the single-piece substrate transfer region R4, the substrate loading unit is arranged between the substrate transfer robot CR2 and the multi-joint robot. The substrate transfer robot CR2 transfers a substrate W that has been dried to the substrate loading unit. The multi-joint robot takes out a substrate W from the substrate loading unit and converts the substrate W from a horizontal posture to a vertical posture. Thereafter, the multi-joint robot holds the substrate W in the vertical posture on the third pusher 95A.

[0214] (12) In the above-described embodiment and various variations, the substrate transport robot CR2 transports one substrate W in a horizontal posture between the belt conveyor 61, the six single-wafer processing chambers (the first single-wafer processing chamber SW1 and the second single-wafer processing chamber SW2), and the third posture conversion unit 93. The substrate transport may be shared by a plurality of substrate transport robots. Alternatively, one substrate W may be directly delivered between two substrate transport robots. Alternatively, one substrate W may be delivered via a substrate placement unit.

[0215] (13) In the above-described embodiment and each variation, the robot hand 41 of at least one of the three substrate transfer robots CR1 to CR3 can be moved by a multi-joint robot arm.

[0216] (14) In the above-described embodiment and each variation, for example, the batch processing tank BT1 performs immersion processing on 50 substrates W in which 25 substrates W1 and 25 substrates W2 are alternately arranged one by one. The 50 substrates W (W1, W2) are arranged at a half pitch (e.g., 5 mm). In this regard, the batch processing tank BT1 may perform immersion processing on 25 substrates W arranged at a full pitch (e.g., 10 mm) at a time.

[0217] (15) In the above-described embodiment and various variations, for example, the batch processing tank BT1 performs immersion processing on 50 substrates W of the processing substrate group at a time. Among the 50 substrates W (W1, W2), when the device surfaces of the 25 substrates W1 of the first substrate group face rightward, the device surfaces of the 25 substrates W2 of the second substrate group may face leftward. In addition, when the device surfaces of the 25 substrates W1 of the first substrate group face rightward, the device surfaces of the 25 substrates W2 of the second substrate group may also face rightward.

[0218] (16) In the above-described embodiment and various variations, the batch substrate transfer region R1 is not limited to being disposed on the side (left side) of the single wafer processing apparatus 5 , but may also pass above the single wafer processing apparatus 5 .

[0219] The present invention may be implemented in other specific forms without departing from the spirit or essence thereof. Therefore, the above description does not represent the scope of the invention and reference should be made to the appended claims.

[0220] [Explanation of Symbols]

[0221] 1: Substrate processing system

[0222] 3: Transfer device

[0223] 5: Single-chip processing device

[0224] 7: Batch processing device

[0225] 19: Rack

[0226] HTR: Substrate handling mechanism

[0227] 21: First posture conversion mechanism

[0228] 31: Posture conversion unit

[0229] 33: Propeller mechanism

[0230] 33A: 1st thruster

[0231] CR1, CR2: Substrate transfer robot

[0232] SW1: 1st single-wafer processing chamber

[0233] SW2: Second single-wafer processing chamber

[0234] 55: Second posture conversion mechanism

[0235] 57: Standby slot

[0236] 59: Second posture transition section

[0237] 61: Belt conveyor

[0238] WTR1: The first batch transport mechanism

[0239] WTR2: Second batch transport mechanism

[0240] 63: Second thruster mechanism

[0241] 63A: Second thruster

[0242] 65, 66: Chuck

[0243] 69,70: Holding slot

[0244] 73,74: Through slot

[0245] 91: The third posture conversion mechanism

[0246] 93: The third posture transition section

[0247] 95: 3rd thruster mechanism

[0248] 95A: 3rd thruster

[0249] R1: Batch substrate transfer area

[0250] R3: Interface area

[0251] R4: Single substrate transfer area

[0252] R5: Passing Zone

[0253] R7: Transfer device side area

[0254] R8: Batch processing unit side area.

Claims

1. A substrate processing system, characterized in that: Batch processing of processing a plurality of substrates at a time and single processing of processing the plurality of substrates one by one are performed, and The invention comprises: a transfer device provided with a carrier mounting frame for mounting carriers, wherein the carriers are used to store the plurality of substrates in a horizontal posture at predetermined intervals; a batch processing device for processing the plurality of substrates at one time; as well as A single-wafer processing device processes the plurality of substrates one by one; The transfer device, the single-chip processing device and the batch processing device are sequentially arranged in a straight line in a row. The transfer device includes a first posture conversion unit configured to convert the plurality of substrates taken out from the carrier placed on the carrier mounting frame from a horizontal posture to a vertical posture. The single chip processing device The device comprises: a plurality of single-wafer processing units for processing the plurality of substrates one by one; and a first substrate transport mechanism for transporting the plurality of substrates to the plurality of single-wafer processing units; The batch processing device The method comprises: a batch processing unit for processing the plurality of substrates at a time; and a first batch transport mechanism for transporting the plurality of substrates to the batch processing section at one time; The first batch transfer mechanism receives the plurality of substrates converted to the vertical posture by the first posture conversion unit on the transfer device side, and directly transfers them to the batch processing unit without using the first substrate transfer mechanism of the single-wafer processing unit.

2. The substrate processing system according to claim 1, characterized in that: The batch processing apparatus includes a batch substrate transfer area, and the batch substrate transfer area is an area where the first batch transfer mechanism moves. The batch substrate transfer area is arranged on one end side of the transfer device in a second horizontal direction orthogonal to a first horizontal direction in which the transfer device and the batch processing device are arranged. The batch substrate transfer area extends from the transfer device to the batch processing section of the batch processing device, The batch processing section performs the batch processing on the plurality of substrates transported by the first batch transport mechanism. The first batch transport mechanism receives the plurality of substrates that have been subjected to the batch processing and transports the plurality of substrates to the single-wafer processing device in a vertical posture. The single-wafer processing device uses the plurality of single-wafer processing sections to perform the single-wafer processing on the plurality of substrates subjected to the batch processing one by one, and The transfer device transfers the plurality of substrates that have been transferred from the single-wafer processing device and subjected to the single-wafer processing to the carrier mounted on the carrier mounting frame.

3. The substrate processing system according to claim 1, characterized in that: The transfer device comprises: a substrate transfer mechanism having a robot arm, wherein the robot arm takes out the plurality of substrates from the carrier mounted on the carrier mounting frame in a horizontal posture; The first posture conversion unit converts the plurality of substrates conveyed by the substrate conveying mechanism from a horizontal posture to a vertical posture; as well as The first vertical holding section holds the plurality of substrates received from the first posture conversion section in a vertical posture; and The first batch transfer mechanism receives the plurality of substrates in a vertical posture from a first vertical holding portion.

4. The substrate processing system according to claim 2, characterized in that: The single-chip processing device includes an interface area extending in the first horizontal direction, The plurality of single-wafer processing units are arranged on the opposite side of the batch substrate transfer area across the interface area. The interface region includes a horizontal posture conversion mechanism that converts the plurality of substrates conveyed by the first batch conveying mechanism from a vertical posture to a horizontal posture, and The first substrate transfer mechanism transfers the plurality of substrates in a horizontal posture from the horizontal posture conversion mechanism to the plurality of single-wafer processing units.

5. The substrate processing system according to claim 2, characterized in that: The single-wafer processing apparatus includes a passing area and a single-wafer substrate transfer area extending in the first horizontal direction, respectively. The batch substrate transfer area, the through area, and the single substrate transfer area are sequentially arranged in the second horizontal direction. The plurality of single-wafer processing units are arranged on the opposite side of the passing area across the single-wafer substrate transfer area. The first substrate transfer mechanism is disposed in the single-piece substrate transfer area. The passing area The invention comprises: a transfer device side area adjacent to the transfer device; and a batch processing device side area, adjacent to the transfer device side area and the batch processing device; The batch processing device side area includes a horizontal posture conversion mechanism, which converts the plurality of substrates transported by the first batch transport mechanism from a vertical posture to a horizontal posture. The horizontal posture conversion mechanism The device comprises: a second posture conversion unit for converting the plurality of substrates from a vertical posture to a horizontal posture; and a second substrate transport mechanism, which is arranged on the opposite side of the batch processing apparatus across the second posture conversion unit and transports one of the plurality of substrates converted to a horizontal posture; and The first substrate transfer mechanism in the single-wafer transfer area receives the single substrate from the second substrate transfer mechanism, and transfers the single substrate to the plurality of single-wafer processing sections.

6. The substrate processing system according to claim 5, characterized in that: The single substrate transfer area The invention comprises: a third posture conversion unit, which is arranged between the transfer device and the first substrate conveying mechanism and converts the plurality of substrates conveyed by the first substrate conveying mechanism from a horizontal posture to a vertical posture; as well as a second vertical holding section for holding the plurality of substrates converted into the vertical posture by the third posture conversion section in the vertical posture; The first batch transfer mechanism receives the plurality of substrates from the second vertical holding portion and transfers the plurality of substrates to the transfer device in a vertical posture, and The transfer device converts the plurality of substrates that have been transferred from the single-wafer processing device and subjected to the single-wafer processing from a vertical posture to a horizontal posture, and transfers the plurality of substrates that have been converted to the horizontal posture to the carrier mounted on the carrier mounting frame.

7. The substrate processing system according to claim 5, characterized in that: The horizontal posture conversion mechanism includes a standby tank that is disposed between the second posture conversion unit and the batch processing device and stores an immersion liquid for immersing the plurality of substrates in a vertical posture.

8. The substrate processing system according to claim 7, characterized in that: The horizontal posture conversion mechanism includes a second batch conveying mechanism having a pair of chucks in which a plurality of pairs of holding grooves and a plurality of pairs of passing grooves are alternately arranged, and When a processing substrate group in which the multiple substrates are alternately arranged with other multiple substrates is immersed in the immersion liquid in the standby tank, the second batch transfer mechanism uses the pair of chucks to take out the multiple substrates from the processing substrate group and transfers the taken-out multiple substrates to the second posture conversion unit.

9. The substrate processing system according to claim 1, characterized in that: The first batch transfer mechanism includes a pair of chucks that hold the plurality of substrates in a vertical posture, and the first batch transfer mechanism transfers the plurality of substrates held in the vertical posture by the pair of chucks.

10. The substrate processing system according to claim 1, characterized in that: The batch processing part is a batch processing tank storing a processing liquid for immersing the plurality of substrates, and the plurality of single-wafer processing parts are a plurality of single-wafer processing chambers.

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