Vacuum sheet transfer mechanism and semiconductor inspection apparatus

Abstract

The application discloses a vacuum wafer transfer mechanism and a semiconductor detection device. The vacuum wafer transfer mechanism comprises a first fixing frame, a second fixing frame, a transfer assembly and a jacking mechanism. The first fixing frame is arranged in a buffer chamber, and the second fixing frame is arranged in a main chamber. The transfer assembly is used for transferring a wafer between the first fixing frame and the second fixing frame. The transfer assembly comprises a base and a rotary arm. The rotary arm is movably arranged in the base along a height direction, and the rotary arm is rotatably connected with the base. The jacking mechanism is arranged in the main chamber. The jacking mechanism comprises a driving assembly and a jacking block. The driving assembly is used for driving the jacking block to ascend, so as to lift the wafer upward to separate the wafer from the second fixing frame, or driving the jacking block to descend, so as to make the wafer fall onto the second fixing frame. The vacuum wafer transfer mechanism realizes the transmission of the wafer between the buffer chamber and the main chamber through the single-axis lifting of the transfer assembly, thereby reducing the probability of the occurrence of a position difference in the wafer transfer process, and improving the wafer transfer precision and reliability.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, and in particular relates to a vacuum wafer transfer mechanism and semiconductor testing equipment. Background Technology

[0002] In the semiconductor fabrication and quality inspection processes, there are numerous steps involving wafer transfer in a vacuum environment, such as transferring wafers to be processed and wafers already processed between a buffer chamber and a vacuum working chamber. The accuracy of this wafer transfer significantly impacts product quality and production speed.

[0003] In related technologies, the wafer transfer mechanism includes two lifting mechanisms respectively disposed in a buffer chamber and a vacuum working chamber, and a transfer arm disposed between the two chambers. The two lifting mechanisms move up and down synchronously to lift the wafer on the transfer arm or to lower the wafer onto the transfer arm.

[0004] However, the two lifting mechanisms may become asynchronous during long-term use, resulting in a positional difference between the wafers on both sides of the transfer arm, which leads to a decrease in wafer transfer accuracy and reliability. Summary of the Invention

[0005] This application provides a vacuum wafer transfer mechanism and a semiconductor testing device. The vacuum wafer transfer mechanism can realize the transfer of wafers between the buffer chamber and the main chamber through the single-axis lifting of the transfer component, thereby avoiding the position difference that may occur in the dual-axis lifting mode and improving the wafer transfer accuracy and reliability.

[0006] In a first aspect, embodiments of this application provide a vacuum wafer transfer mechanism for transferring wafers between a buffer chamber and a main chamber. The vacuum wafer transfer mechanism includes a first fixed frame, a second fixed frame, a transfer assembly, and a lifting mechanism. The first fixed frame is disposed in the buffer chamber; the second fixed frame is disposed in the main chamber; the transfer assembly is used to transfer wafers between the first fixed frame and the second fixed frame, and the transfer assembly includes a base and a rotating arm. The rotating arm is movably disposed on the base along the height direction, and the rotating arm is rotatably connected to the base to drive a first receiving part to transfer between the first fixed frame and the second fixed frame; the lifting mechanism is disposed in the main chamber, and the lifting mechanism includes a driving assembly and a lifting block. The driving assembly is used to drive the lifting block to rise, so as to lift the wafer upward and detach it from the second fixed frame, or to drive the lifting block to fall, so that the wafer falls onto the second fixed frame.

[0007] In some embodiments, the first fixing frame includes a plurality of first pins extending in the height direction, the plurality of first pins being arranged in an array to form a support surface, and / or the second fixing frame includes a plurality of second pins extending in the height direction, the plurality of second pins being arranged in an array to form a support surface.

[0008] In some embodiments, the lifting mechanism further includes a guide structure extending in the height direction, and the drive component drives the lifting block to reciprocate along the guide structure.

[0009] In some embodiments, the guide structure includes a guide member that slides with the second ejector pin, the guide member being connected to the lifting block, and the guide member being slidably connected to the second ejector pin to limit the direction of movement of the lifting block.

[0010] In some embodiments, the drive assembly includes a first drive member and an active block, the active block being drively connected to the lifting block, and the first drive member driving the active block to move along a first direction to drive the lifting block to move in the height direction.

[0011] In some embodiments, the first direction is a horizontal direction, the active block has a first inclined surface, the lifting block has a second inclined surface, and the slope of the second inclined surface is consistent with that of the first inclined surface.

[0012] In some embodiments, the drive assembly includes a second drive member, the output end of which reciprocates along the height direction, and the output end of the second drive member is connected to the lifting block to drive the lifting block to move in the height direction.

[0013] In some embodiments, the rotating arm includes a first receiving portion and a second receiving portion distributed along its own length direction, the ends of which are connected to the rotating shaft of the rotating arm, and the first receiving portion and the second receiving portion are rotatably alternately located on the first fixed frame or the second fixed frame.

[0014] In some embodiments, the supporting surface of the first receiving part is flush with the supporting surface of the second receiving part, and the supporting surface of the first fixing frame is flush with the supporting surface of the second fixing frame.

[0015] Secondly, embodiments of this application provide a semiconductor testing device, which includes the vacuum transfer mechanism provided in any of the foregoing embodiments.

[0016] The vacuum wafer transfer mechanism in this embodiment sets the first and second fixed frames between the buffer chamber and the main chamber in a relatively fixed manner. The wafer is switched between the transfer assembly and different chambers by the vertical movement of the transfer component, thereby avoiding asynchronous position differences that may occur during the lifting and lowering of the two chambers and improving the accuracy and reliability of the wafer transfer process. The vacuum wafer transfer mechanism also includes a lifting mechanism in the main chamber. This lifting mechanism can rise or fall relative to the second fixed frame to switch the wafer's position between the second fixed frame and the lifting block, reducing the interval between wafer transfer and wafer inspection processes and improving wafer inspection efficiency. Attached Figure Description

[0017] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0018] Figure 1 This is a schematic diagram of the structure of the vacuum plate transfer mechanism in some embodiments of this application;

[0019] Figure 2 for Figure 1 The diagram shows a usage state of the vacuum plate transfer mechanism.

[0020] Figure 3 for Figure 1 The diagram shows another usage state of the vacuum plate transfer mechanism;

[0021] Figure 4 This is a schematic diagram of the structure of the vacuum plate transfer mechanism in some other embodiments of this application;

[0022] Figure 5 for Figure 4 The diagram shows a usage state of the vacuum plate transfer mechanism.

[0023] Figure 6 for Figure 4 The diagram shows another usage state of the vacuum plate transfer mechanism;

[0024] Figure 7 This is a schematic diagram of the structure of a vacuum plate transfer mechanism according to some embodiments of this application.

[0025] The reference numerals in the detailed embodiments are as follows:

[0026] 01. Buffer chamber; 02. Main chamber;

[0027] 110. First fixing frame; 111. First ejector pin; 120. Second fixing frame; 121. Second ejector pin;

[0028] 210. Base; 220. Swing arm; 221. First receiving part; 222. Second receiving part;

[0029] 310. Lifting block; 321. First driving component; 322. Second driving component; 330. Active block. Detailed Implementation

[0030] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0032] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0033] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0034] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0035] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0036] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0037] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0038] Due to the high precision requirements of semiconductor products, numerous vacuum operations occur during semiconductor fabrication, processing, and quality inspection. These operations often involve multiple wafer transfers within a vacuum environment, such as transferring wafers to be processed or already processed between a buffer chamber and the main vacuum chamber. The precision of this wafer transfer directly impacts product quality and production speed.

[0039] In related technologies, the wafer transfer mechanism includes two lifting mechanisms respectively set in the buffer chamber and the main chamber, and a transfer arm set between the two chambers. The two lifting mechanisms rise synchronously to lift the wafer away from the transfer arm for operation, and the two lifting mechanisms lower synchronously to lower the wafer to the transfer arm for transfer, thereby realizing the switching of different wafer processes.

[0040] However, the two lifting mechanisms may become asynchronous during long-term use. On the one hand, the wafer may fail to be lifted from the transfer arm to the lifting mechanism or lowered from the lifting mechanism to the transfer arm. On the other hand, it may cause a positional difference between the two chambers during wafer transfer, which will have a significant negative impact on wafer transfer accuracy and reliability.

[0041] To address the problems of the prior art, this application provides a vacuum wafer transfer mechanism and a semiconductor testing device. The vacuum wafer transfer mechanism provided in this application will be described below.

[0042] Please see Figures 1 to 3The vacuum wafer transfer mechanism provided in this application embodiment is used to transfer wafers between a buffer chamber 01 and a main chamber 02. The vacuum wafer transfer mechanism includes a first fixed frame 110, a second fixed frame 120, a transfer assembly, and a lifting mechanism. The first fixed frame 110 is disposed in the buffer chamber 01, and the second fixed frame 120 is disposed in the main chamber 02. The transfer assembly is used to transfer wafers between the first fixed frame 110 and the second fixed frame 120. The transfer assembly includes a base 210 and a rotating arm 220. The rotating arm 220 is movably disposed on the base 210 along the height direction and is rotatably connected to the base 210. The lifting mechanism is disposed in the main chamber 02 and includes a drive assembly and a lifting block 310. The drive assembly is used to drive the lifting block 310 to rise, so as to lift the wafer upward and make it detach from the second fixed frame 120, or to drive the lifting block 310 to fall, so that the wafer falls to the second fixed frame 120.

[0043] The first mounting bracket 110 refers to the component within the buffer chamber 01 used to support the wafer, and the first mounting bracket 110 is fixedly installed within the buffer chamber 01. The second mounting bracket 120 refers to the component within the main chamber 02 used to support the wafer, and the second mounting bracket 120 is fixedly installed within the buffer chamber 01. The first mounting bracket 110 and the second mounting bracket 120 are kept relatively fixed.

[0044] Please see Figure 2 Taking the process of transferring the wafer to be tested from the first fixture 110 to the second fixture 120 as an example, the rotating arm 220 descends below the first fixture 110 and then rotates to be below the first fixture 110; the rotating arm 220 rises and lifts the wafer to be tested to separate it from the first fixture 110; the rotating arm 220 rotates to transfer the wafer to be tested to be above the second fixture 120; the rotating arm 220 descends to be below the second fixture 120, and the wafer to be tested falls smoothly to the second fixture 120 for testing.

[0045] Please see Figure 3 Taking the process of a wafer being tested in the main chamber 02 as an example, the wafer to be tested is transferred to the second fixed frame 120 by the transfer component. The rotating arm 220 rotates and exits the main chamber 02. The drive component drives the lifting block 310 to rise to a position higher than the second fixed frame 120. During the lifting process, the lifting block 310 lifts the wafer to be tested. The wafer to be tested uses the lifting block 310 as a workpiece stage for testing. After the test is completed, the drive device drives the lifting block 310 to fall to a position lower than the second fixed frame 120. The tested wafer falls smoothly to the second fixed frame 120 to be transferred out by the transfer component.

[0046] Therefore, the vacuum wafer transfer mechanism avoids the dual-axis lifting of the buffer chamber 01 and the main chamber 02. Switching between the wafer and different chambers can be achieved through the single-axis lifting of the transfer component, thus avoiding asynchronous position differences that may occur during the lifting of the two chambers and improving wafer transfer accuracy and reliability. The vacuum wafer transfer mechanism also includes a lifting mechanism within the main chamber 02. This lifting mechanism moves relative to the second fixed frame 120 within the main chamber 02 to switch between the wafer inspection position and the transfer position, improving wafer inspection efficiency.

[0047] It is understood that the vacuum wafer transfer mechanism provided in this application is not only applicable to semiconductor testing equipment, but also to various semiconductor processing equipment that performs wafer transfer operations under vacuum conditions.

[0048] Please see Figures 1 to 3 According to some embodiments of this application, the rotating arm 220 includes a first receiving part. The rotating arm 220 drives the first receiving part 221 to rise and fall to lift or lower the wafer. The rotating arm 220 drives the first receiving part 221 to rotate to transfer the wafer to the first fixed frame 110 in the buffer chamber 01 or the second fixed frame 120 in the main chamber 02.

[0049] Please see Figures 4 to 6 According to some other embodiments of this application, the rotating arm 220 includes a first receiving portion 221 and a second receiving portion 222 distributed along its own length direction. The ends of the first receiving portion 221 and the second receiving portion 222 are connected to the rotating shaft of the rotating arm 220. The first receiving portion 221 and the second receiving portion 222 are rotatably alternately located on the first fixed frame 110 or the second fixed frame 120.

[0050] Specifically, in some embodiments, a separate isolation valve is provided between the buffer chamber 01 and the main chamber 02. The first fixing frame 110 is fixedly installed in the buffer chamber 01, and the second fixing frame 120 is fixedly installed in the main chamber 02, so that the first fixing frame 110 and the second fixing frame 120 are relatively fixedly installed. In other embodiments, the buffer chamber 01 and the main chamber 02 are connected, the first fixing frame 110 and the second fixing frame 120 are directly fixedly connected, and the rotating arm 220 rotates to drive the first receiving part 221 and the second receiving part 222 to rotate alternately between the first fixing frame 110 and the second fixing frame 120.

[0051] Optionally, the pivot of the rotating arm 220 is located at the midline between the first receiving part 221 and the second receiving part 222. The first receiving part 221 and the second receiving part 222 have the same radius of rotation, so that the first receiving part 221 and the second receiving part 222 are interchangeable. The rotating arm 220 can continuously complete the position exchange of two different wafers at the first fixing frame 110 and the second fixing frame 120.

[0052] Optionally, the second receiving part 222 has the same structure as the first receiving part 221, or the structure of the second receiving part 222 is different from that of the first receiving part 221.

[0053] Therefore, the first receiving part 221 and the second receiving part 222 of the rotating arm 220 can simultaneously lift the wafer to be tested and the wafer already tested at the first fixed frame 110 and the second fixed frame 120, and realize the position exchange of the wafer to be tested and the wafer already tested by rotation. Two wafer transfers are achieved in just one stroke, which significantly improves the wafer feeding efficiency and thus improves the efficiency of the wafer inspection process.

[0054] According to certain embodiments of this application, the supporting surface of the first fixing frame 110 is flush with the supporting surface of the second fixing frame 120.

[0055] Optionally, the supporting surface of the second receiving part 222 is flush with the supporting surface of the first receiving part 221. During the lifting and lowering process of the rotating arm 220, the wafer to be tested and the wafer already tested can be kept at the same height position and simultaneously lifted or lowered to the fixed frame by the rotating arm 220, so as to shorten the operation time of the vacuum wafer feeding mechanism and improve the operation efficiency.

[0056] Optionally, there is a height difference between the support surface of the second receiving part 222 and the support surface of the first receiving part 221, so that the wafer to be tested and the wafer already tested can be lifted or lowered into the fixed frame in the cavity by the rotating arm 220 one after the other.

[0057] Therefore, the wafer to be tested and the wafer already tested can be simultaneously lifted or lowered into the fixed frame in the chamber by the rotating arm 220, which minimizes the time for the wafer to be transferred between the fixed frame and the rotating arm 220, thereby improving the wafer transfer efficiency and the efficiency of the testing operation.

[0058] According to certain embodiments of this application, the first fixing frame 110 includes a plurality of first pins 111 extending along the height direction, the plurality of first pins 111 being arranged in an array with their top ends flush.

[0059] Optionally, a plurality of first pins 111 are uniformly distributed along the circumference of the wafer.

[0060] Optionally, a plurality of first pins 111 are uniformly distributed along the radial direction of the wafer.

[0061] Thus, the array of multiple first pins 111 forms a supporting surface of the first fixture 110 to support the wafer, reducing the contact area between the first fixture 110 and the wafer, thereby reducing the probability of adhesion and adsorption when the wafer is separated from the first fixture 110. At the same time, the supporting surface formed by the multiple first pins 111 is perpendicular to the height direction, which can support the wafer from multiple positions, keeping the wafer in a horizontal position and helping to improve the reliability of wafer transfer.

[0062] It is understood that in some other embodiments, the first mounting bracket 110 includes a support platform with an area smaller than the wafer area to partially expose the bottom of the wafer, so that the rotating arm 220 can support the wafer through the exposed portion of the wafer bottom.

[0063] According to certain embodiments of this application, the second fixing frame 120 includes a plurality of second pins 121 extending along the height direction, the plurality of second pins 121 being arranged in an array with their top ends flush.

[0064] Optionally, the top end of the second ejector pin 121 is flush with the top end of the first ejector pin 111, so that the supporting surface of the first fixing frame 110 is flush with the supporting surface of the second fixing frame 120.

[0065] Optionally, a plurality of second pins 121 are uniformly distributed along the circumference of the wafer.

[0066] Optionally, a plurality of second pins 121 are uniformly distributed along the radial direction of the wafer.

[0067] Optionally, the distribution positions of the plurality of second ejector pins 121 relative to the wafer are the same as the distribution positions of the plurality of first ejector pins 111 relative to the wafer, so that the first fixing frame 110 and the second fixing frame 120 have the same or similar support effect on the same wafer.

[0068] Therefore, the array of multiple second pins 121 forms a supporting surface for the second holder 120 to support the wafer, reducing the contact area between the second holder 120 and the wafer, thereby reducing the probability of adhesion and adsorption when the wafer separates from the second holder 120. The supporting surface formed by the multiple second pins 121 is perpendicular to the height direction to keep the wafer in a horizontal position, which helps to improve the stability of the wafer in the second holder 120, thereby improving wafer transfer reliability.

[0069] It is understood that in some other embodiments, the second mounting bracket 120 includes a support platform with an area smaller than the wafer to partially expose the bottom of the wafer, thereby enabling the rotating arm 220 to support the wafer through the exposed portion of the wafer bottom.

[0070] According to certain embodiments of this application, the lifting mechanism further includes a guide structure extending in the height direction, and the driving component drives the lifting block 310 to reciprocate along the guide structure.

[0071] Optionally, the guide structure includes a guide slide, and the drive assembly directly drives the lifting block 310 to slide within the guide slide to form a height difference with the second fixed frame 120.

[0072] Optionally, the guide structure includes a guide block and a guide groove that work together. One of the guide block and the guide groove is disposed in the second fixed frame 120 and the other is disposed in the main chamber 02. When the drive assembly drives the lifting block 310 to move, the guide block and the guide groove work together so that the lifting block 310 moves only in the height direction.

[0073] Optionally, the guide structure includes a guide member that slides with the second ejector pin 121. The guide member is connected to the lifting block 310 and slidably connected to the second ejector pin 121. When the driving assembly drives the lifting block 310 to rise or fall, the guide member slides back and forth along the second ejector pin 121 to limit the movement of the lifting block 310 in the height direction. Exemplarily, the guide member is correspondingly provided with one of the second ejector pins 121, or multiple guide members are provided, with multiple guide members corresponding one-to-one with multiple second ejector pins 121.

[0074] Therefore, the guide structure can limit the movement direction of the drive block to prevent the wafer from moving in the horizontal plane when it is transferred between the second fixture 120 and the drive block, thereby avoiding positional differences during wafer transfer and improving wafer feeding accuracy.

[0075] According to certain embodiments of this application, the drive assembly includes a first drive member 321, and the lifting block 310 is connected to the output end of the first drive member 321.

[0076] Optionally, the output end of the first driving member 321 moves along a first direction, which is different from the height direction. Specifically, the driving assembly also includes an active block 330, which is directly connected to the output end of the first driving member 321 and cooperates with the lifting block 310. The first driving member 321 drives the active block 330 to move along the first direction to drive the lifting block 310 to move in the height direction.

[0077] In some embodiments, the first direction is horizontal, the active block 330 has a first inclined surface, and the lifting block 310 has a second inclined surface, with the slopes of the first and second inclined surfaces being the same. Please refer to... Figure 1 The first driving member 321 drives the active block 330 to move to the right. The active block 330 pushes the lifting block 310 to move through the sliding cooperation of the first inclined surface and the second inclined surface. The lifting block 310 rises under the action of the guide structure to support the wafer at the second fixed frame 120. The first driving member 321 drives the active block 330 to move to the left. After the lifting block 310 is no longer supported by the active block 330, it falls back along the height direction due to its own weight, thereby transferring the wafer that has completed the test to the second fixed frame 120.

[0078] For example, the first driving element 321 is a linear motor, which directly drives the active block 330 to move in the horizontal direction to realize the lifting block 310 rising or falling. Alternatively, the first driving element 321 is a stepper motor, whose output end rotates to drive the active block 330 to move in the horizontal direction to realize the lifting block 310 rising or falling. For example, the output end of the stepper motor is connected to the active block 330 through a ball screw pair.

[0079] Optionally, the lifting mechanism also includes a damping element connected to the lifting block 310 to buffer the process of the lifting block 310 falling back under gravity, reducing the impact on the wafer when it is transferred from the lifting block 310 to the second fixed frame 120, and preventing the wafer from cracking.

[0080] In some other embodiments, the drive assembly includes a worm gear mechanism, with the worm gear disposed on the drive block 330 and the worm disposed on the lifting block 310. The first direction is the circumferential direction of the worm gear. The first drive member 321 drives the drive block 330 to rotate and drives the worm gear to rotate. The worm is raised and lowered under the drive of the worm gear structure to realize the position switching of the lifting block 310 relative to the second fixed frame 120.

[0081] In some other embodiments, the drive assembly further includes a linkage, with the first direction being horizontal. The two ends of the linkage are respectively hinged to the active block 330 and the lifting block 310. The first drive member 321 drives the active block 330 to reciprocate in the horizontal direction. The active block 330 pushes the lifting block 310 up or pulls the lifting block 310 down through the linkage.

[0082] Thus, the first driving member 321 indirectly drives the lifting block 310 to move along the height direction, so as to lift the wafer to be tested on the second fixing frame 120 or lower the tested wafer to the second fixing frame 120 for transfer.

[0083] Please see Figure 7 According to certain embodiments of this application, the drive assembly includes a second drive member 322, the output end of the second drive member 322 reciprocates along the height direction, and the output end of the second drive member 322 is connected to the lifting block 310 to drive the lifting block 310 to move in the height direction.

[0084] For example, the second drive unit 322 is configured as a linear motor or a telescopic cylinder to directly drive the lifting block 310 to move in the height direction.

[0085] Optionally, the drive assembly also includes a moving platform, which is fixed to the output of the second drive unit 322 and is used to carry the wafer.

[0086] Secondly, embodiments of this application provide a semiconductor testing device, which includes the vacuum transfer mechanism provided in any of the foregoing embodiments. Therefore, the semiconductor testing device has all the beneficial effects of the aforementioned vacuum transfer mechanism.

[0087] It should be understood that the semiconductor testing equipment provided in this application includes, but is not limited to, equipment for quality testing of semiconductor products or equipment for dimensional measurement of semiconductor products.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A vacuum tab mechanism, characterized by, A vacuum wafer transfer mechanism for transferring a wafer between a buffer chamber and a main chamber, the vacuum wafer transfer mechanism comprising: a first holder arranged in the buffer chamber; a second holder arranged in the main chamber, the second holder comprising a plurality of second pins extending in a height direction, the plurality of second pins being arranged in an array to form a support surface; a transfer assembly for transferring the wafer between the first holder and the second holder, the transfer assembly comprising a base and an arm movably arranged in the height direction on the base, the arm being rotatably connected to the base to transfer the wafer between the first holder and the second holder; a lifting mechanism arranged in the main chamber, the lifting mechanism comprising a driving assembly, a lifting block, and a guide structure extending in the height direction, the driving assembly driving the lifting block to reciprocate along the guide structure, the driving assembly being configured to drive the lifting block to move upward to lift the wafer upward to disengage the wafer from the second holder, or to move downward to lower the wafer onto the second holder; wherein the guide structure comprises a guide member slidingly engaged with the second pins, the guide member being connected to the lifting block, the guide member being slidingly connected to the second pins to restrict a movement direction of the lifting block.

2. The vacuum tab mechanism of claim 1, wherein, The first holder comprises a plurality of first pins extending in the height direction, the plurality of first pins being arranged in an array to form a support surface.

3. The vacuum tab mechanism of claim 1, wherein, The driving assembly comprises a first driving member and a driving block, the driving block being drivingly connected to the lifting block, the first driving member driving the driving block to move in a first direction to move the lifting block in the height direction.

4. The vacuum tab mechanism of claim 3, wherein, The first direction is a horizontal direction, the driving block has a first inclined surface, and the lifting block has a second inclined surface, the second inclined surface having a same slope as the first inclined surface.

5. The vacuum tab mechanism according to claim 1 or 2, characterized in that, The driving assembly comprises a second driving member, an output of the second driving member reciprocating in the height direction, the output of the second driving member being connected to the lifting block to drive the lifting block to move in the height direction.

6. The vacuum tab mechanism of claim 1, wherein, The arm comprises a first receiving portion and a second receiving portion distributed along a length of the arm, ends of the first receiving portion and the second receiving portion being connected to a rotation shaft of the arm, the first receiving portion and the second receiving portion being alternatively located at the first holder or the second holder.

7. The vacuum tab mechanism of claim 6, wherein, The support surface of the first receiving portion is arranged flush with the support surface of the second receiving portion, and the support surface of the first holder is arranged flush with the support surface of the second holder.

8. A semiconductor inspection apparatus characterized by comprising: A vacuum wafer transfer mechanism as claimed in any one of claims 1 to 7.

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