Inspection support for semiconductor structure
By designing the semiconductor structure inspection of the tray, the problem of inconvenience and human factors in existing technologies is solved, and multi -angle testing of the semiconductor structure is realized, and the stability and convenience of inspection are improved.
Patent Information
- Application Number
- CN202310936717.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-27
- Publication Date
- 2025-01-28
AI Technical Summary
During multi-angle inspection of existing semiconductor structures, it is inconvenient for the inspector to hold the pallets, and the inspection results are greatly affected by the personnel, and there are problems of structural instability and human factors.
Design a semiconductor -structured inspection handle, including support seats and rotatable tray, the tray can rotate to most different inspection locations to achieve multi -angle testing of the semiconductor structure.
The multi -angle test of the semiconductor structure through the rotation of the tray has reduced the impact of human factors on the test results and improved the stability and convenience of inspection.
Smart Images
Figure CN119381335A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of semiconductor equipment, and in particular to an inspection bracket for semiconductor structures. Background Art
[0002] In the semiconductor industry, the preparation of semiconductor structures requires multiple preparation processes. Generally, after each preparation process is completed, the structure formed by the preparation needs to be inspected to determine whether the preparation of the semiconductor structure meets the requirements. For example, in the process of soldering the bare chip to the lead frame, the process of setting the connecting wire between the bare chip and the lead frame, etc. During the inspection, it is usually necessary to inspect the semiconductor structure from multiple angles. At present, when performing multi-angle inspections on semiconductor structures, it is usually necessary for the inspectors to hold the tray of the semiconductor structure, so that the semiconductor product stands at different angles, which makes the inspection operation inconvenient, and the inspection results are greatly affected by the inspectors. Summary of the invention
[0003] The present application provides a semiconductor structure inspection bracket, the inspection bracket comprising:
[0004] Support seat;
[0005] The tray is used to support the semiconductor structure. The tray is rotatably arranged on the support seat. The tray can be rotated to a plurality of different inspection positions. The inclination angle of the tray is different at different inspection positions, and the inclination angle of the semiconductor structure is different.
[0006] In some embodiments, the support seat includes a support base and a support arm disposed on the support base, and the tray is rotatably disposed on the support arm.
[0007] In some embodiments, the supporting arms include a first supporting arm and a second supporting arm spaced apart from each other in a first direction; and the tray is rotatably disposed between the first supporting arm and the second supporting arm.
[0008] In some embodiments, the inspection tray further includes a connection structure, wherein the connection structure rotatably connects the tray to the first supporting arm and the second supporting arm.
[0009] In some embodiments, the tray has a first end and a second end that are away from each other in a first direction, and the first supporting arm and the second supporting arm are respectively provided with a first opening and a second opening for the connecting structure to pass through;
[0010] The connection structure includes a first connection member and a second connection member. The first connection member passes through a first opening and is connected to a first end of the tray. The second connection member passes through a second opening and is connected to a second end of the tray.
[0011] In some embodiments, the first connecting member and the second connecting member can be loosely matched with the first supporting arm and the second supporting arm. When the first connecting member and the second connecting member are tightly matched with the first supporting arm and the second supporting arm, the tray is fixed; when the first connecting member and the second connecting member are loosely matched with the first supporting arm and the second supporting arm, the tray can be rotated to different inspection positions.
[0012] In some embodiments, the first opening extends in an arc shape along the width direction and the height direction of the first supporting arm, and the second opening extends in an arc shape along the width direction and the height direction of the second supporting arm; the first connecting member and the second connecting member are loosely matched with the first supporting arm and the second supporting arm, and when the tray is acted upon, the first connecting member and the second connecting member move along the first opening and the second opening, and the tray and the first connecting member and the second connecting member rotate synchronously.
[0013] In some embodiments, an operating handle is provided at the outer end of one of the first connecting member and the second connecting member to adjust the tightness of the first connecting member, the second connecting member and the first supporting arm, the second supporting arm;
[0014] The first connecting member and the second connecting member are detachably connected to the first end and the second end of the tray.
[0015] In some embodiments, the connection structure is a rotating screw, the tray has a threaded hole that cooperates with the screw, and the connection structure can fix the tray at different inspection positions.
[0016] In some embodiments, the tray has a supporting surface for setting the semiconductor structure, and the supporting surface is partially recessed inward to form a receiving groove for setting the semiconductor structure. The side wall of the receiving groove matches the size of the semiconductor structure to limit the semiconductor structure.
[0017] In some embodiments, the sidewalls of the limiting groove are stepped to form a plurality of accommodating portions capable of accommodating semiconductor structures of different sizes.
[0018] The main technical effects achieved by the embodiments of the present application are:
[0019] The inspection tray provided in the embodiment of the present application is configured to have a structure having a support base and a tray, and the tray is rotatably disposed on the support base. Through the rotation of the tray, the tray has different inclination angles, and thus the semiconductor structure has different inclination angles, which facilitates multi-angle inspection of the semiconductor structure on the same tray, makes it more convenient to inspect the semiconductor structure, and at the same time can reduce or avoid the problem of unstable detection structure caused by the user's hands, etc., and can also reduce the adverse effects of human factors on the semiconductor structure during inspection, such as the risk of fingers touching the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 is a cross-sectional view of a semiconductor structure inspection bracket provided by an exemplary embodiment of the present application;
[0021] Figure 2 yes Figure 1 A top view of an inspection holder for the semiconductor structure shown;
[0022] Figure 3 is a side view of a semiconductor structure inspection bracket provided by an exemplary embodiment of the present application;
[0023] Figure 4 is another side view of a semiconductor structure inspection bracket provided by an exemplary embodiment of the present application;
[0024] Figure 5 is a cross-sectional view of a tray provided by an exemplary embodiment of the present application;
[0025] Figure 6 yes Figure 5 a top view of the tray shown;
[0026] Figure 7 is a cross-sectional view of another tray provided by an exemplary embodiment of the present application;
[0027] Figure 8 yes Figure 7 a top view of the tray shown;
[0028] Fig. 9 It is a side view of a support base provided by an exemplary embodiment of the present application. DETAILED DESCRIPTION
[0029] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.
[0030] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.
[0031] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".
[0032] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0033] An embodiment of the present application provides an inspection bracket for semiconductor structures. The inspection bracket includes a support seat and a tray. The tray is used to support the semiconductor structure, and the tray is rotatably disposed on the support seat. The tray can be rotated to a plurality of different inspection positions. The inclination angle of the tray is different at different inspection positions, and the inclination angle of the semiconductor structure is different. The above structure, by setting the inspection bracket to have a structure with a support seat and a tray, and the tray is rotatably disposed on the support seat, through the rotation of the tray, the tray has different inclination angles, and then the semiconductor structure has different inclination angles, which is convenient for multi-angle inspection of the semiconductor structure on the same tray, more convenient for the inspection of the semiconductor structure, and at the same time can reduce or avoid the problem of unstable detection structure caused by the user's hands and other reasons, and can also reduce the adverse effects of human factors on the semiconductor structure during inspection, such as the risk of fingers touching the product.
[0034] The following is combined with Figures 1 to 9 The inspection bracket of the semiconductor structure is described in detail.
[0035] First, please refer to Figure 1 , and when necessary, combine Figures 2 to 9 As shown, the inspection tray 100 for semiconductor structures includes a support base 10 and a tray 20 .
[0036] The tray 20 is used to support the semiconductor structure. The tray 20 is rotatably disposed on the support base 10, and the tray 20 can be rotated to a plurality of different inspection positions. The tilt angle of the tray 20 is different at different inspection positions, and the tilt angle of the semiconductor structure is different, for example Figure 3 and Figure 4 shown.
[0037] The semiconductor structure mentioned here can be a component after the bare chip is welded to the lead frame, or a component after the bare chip is welded to the lead frame and leads (copper wires, etc.) are set to electrically connect the bare chip and the lead frame, or it can be a packaged structural component.
[0038] For a semiconductor structure having a lead frame and a bare chip, when the semiconductor structure is placed in the tray 20 , the lead frame may be placed toward one side of the tray 20 .
[0039] During inspection, by tilting the semiconductor structure, inspectors can use an inspection device (such as an inspection tool with a magnifying lens) to inspect different parts of the semiconductor structure, such as the side edges, the glue and solder on the top, etc., to see if they meet the requirements.
[0040] In some embodiments, the support base 10 includes a support base 11 and a support arm 12 disposed on the support base 11 , and the tray 20 is rotatably disposed on the support arm 12 .
[0041] Please combine Figure 2 As shown, in some embodiments, the supporting arm 12 includes a first supporting arm 121 and a second supporting arm 122 spaced apart and opposite to each other in a first direction L. The tray 20 is rotatably disposed between the first supporting arm 121 and the second supporting arm 122 .
[0042] In some embodiments, the inspection tray 100 further includes a connection structure 30. The connection structure 30 rotatably connects the tray 20 to the first supporting arm 121 and the second supporting arm 122.
[0043] In some embodiments, the tray 20 has a first end 21 and a second end 22 that are opposite to each other in a first direction L, and the first supporting arm 121 and the second supporting arm 122 are respectively provided with a first opening 1201 and a second opening 1202 for the connection structure to pass through.
[0044] The connection structure includes a first connection member 31 and a second connection member 32. The first connection member 31 passes through the first opening 1201 to connect with the first end 21 of the tray 20, and the second connection member 32 passes through the second opening 1202 to connect with the second end 22 of the tray 20.
[0045] It should be noted that the first end 21 and the second end 22 of the tray 20 may be respectively provided with matching connection parts that can match with the first connecting member 31 and the second connecting member 32, such as connecting holes.
[0046] In other embodiments, corresponding intermediate connectors may be provided at the first end and the second end of the tray to be connected to the first connector and the second connector, or an intermediate connector may be provided at the back side of the tray, and the first connector and the second connector are connected to the tray respectively through the intermediate connector.
[0047] In some embodiments, the first connecting member 31 and the second connecting member 32 can be loosely matched with the first supporting arm 121 and the second supporting arm 122. When the first connecting member 31 and the second connecting member 32 are tightly matched with the first supporting arm 121 and the second supporting arm 122, the tray 20 is fixed. When the first connecting member 31 and the second connecting member 32 are loosely matched with the first supporting arm 121 and the second supporting arm 122, the tray 20 can be rotated to different inspection positions.
[0048] Please combine Figure 2 As shown, the first connecting member 31 includes a first connecting body 312 passing through the first opening 1201 and connected to the first end 21 of the tray 20, and a first limiting portion 311 located on the outside of the first supporting arm 121; the second connecting member 32 includes a second connecting body 322 passing through the second opening 1202 and connected to the second end 22 of the tray 20, and a second limiting portion 321 located on the outside of the second supporting arm 122.
[0049] The first connecting member 31 and the second connecting member 32 mentioned here are tightly matched with the first supporting arm 121 and the second supporting arm 122, which can be understood as the first limiting portion 311 and the second limiting portion 321 are tightly fitted with the first supporting arm 121 and the second supporting arm 122 respectively.
[0050] Here, the first connecting member 31 and the second connecting member 32 are loosely matched with the first supporting arm 121 and the second supporting arm 122, which can be understood as the first limiting portion 311 and the second limiting portion 321 are not tightly fitted to the first supporting arm 121 and the second supporting arm 122, respectively, or even not fitting at all.
[0051] In some embodiments, the first opening 1201 extends in an arc shape along the width direction and the height direction of the first supporting arm 121. The second opening 1202 correspondingly extends in an arc shape along the width direction and the height direction of the second supporting arm 122. The first connecting member 31 and the second connecting member 32 are loosely matched with the first supporting arm 121 and the second supporting arm 122, and when the tray 20 is acted upon, the first connecting member 31 and the second connecting member 32 move along the first opening 1201 and the second opening 1202, and the tray 20 and the first connecting member 31 and the second connecting member 32 rotate synchronously.
[0052] Here, the width direction of the first supporting arm 121 and the width direction of the second supporting arm 122 are consistent, which can be Figure 3 and Figure 4 Similarly, the height direction of the first supporting arm 121 and the height direction of the second supporting arm 122 mentioned here are consistent, which can be Figure 3 and Figure 4 The height direction H is shown.
[0053] Specifically, for example Figure 3 and Figure 4 As shown, the first opening 1201 extends in both the height direction H and the width direction W. The first opening 1201 extends in both the width direction.
[0054] The second opening 1202 has the same shape as the first opening 1201 and is arranged opposite to each other, so that the tray 20 can be more stable when installed on the support base 10, which is conducive to setting the angle.
[0055] In some embodiments, the first opening 1201 and the second opening 1202 may be configured in an arc shape.
[0056] In some embodiments, the connection structure 30 is a rotating screw, and the tray 20 has a threaded hole that cooperates with the screw. The connection structure can fix the tray at different inspection positions, that is, can fix the tray at different tilt angles.
[0057] for example, Figure 3 As shown, the tray 20 can be fixed by rotating screws in a position parallel to the top surface of the support base. Figure 4 As shown, the tray 20 can be fixed by rotating screws at a position forming a certain angle α with the top surface of the supporting base.
[0058] It is understandable that the first end 21 and the second end 22 of the tray 20 may be respectively provided with mating threaded holes that can be mated with the first connecting member 31 and the second connecting member 32 .
[0059] In some embodiments, an operating handle is provided at the outer end of one of the first connecting member 31 and the second connecting member 32 to adjust the tightness of the first connecting member 31, the second connecting member 32 and the first supporting arm 121, the second supporting arm 122.
[0060] Please combine Figures 2 to 4 As shown, the first limiting portion 311 at the outer end of the first connecting member 31 is configured as an operating handle having a recessed portion 310. In some other embodiments, the operating handle may also be a rod-shaped handle structure provided at the first limiting portion.
[0061] Correspondingly, the second limiting portion 321 at the outer end of the second connecting member 32 can also be configured as an operating handle with a recessed portion, or a rod-shaped handle structure can be provided at the second limiting portion and used as an operating handle.
[0062] The setting of the operating handle facilitates the rotation and fixation of the first connecting member 31 and the second connecting member 32.
[0063] In some embodiments, the first connecting member 31 and the second connecting member 32 are detachably connected to the first end 21 and the second end 22 of the tray 20, so as to facilitate loading and unloading and replacement of the tray according to different needs, such as replacing trays of different sizes as needed.
[0064] In some embodiments, the tray 20 has a supporting surface for setting the semiconductor structure, and the supporting surface is partially recessed inward to form a receiving groove for setting the semiconductor structure. The side wall of the receiving groove matches the size of the semiconductor structure to limit the semiconductor structure.
[0065] The supporting surface may be understood as a surface on which one side of the semiconductor structure is disposed.
[0066] For example, please combine Figure 5 and Figure 6 As shown, the tray 20 has a supporting surface S1 for arranging the semiconductor structure, and the supporting surface S1 is partially recessed inward to form a receiving groove 201 for arranging the semiconductor structure. The receiving groove 201 has a bottom wall 202 and a side wall 203. When the semiconductor structure is arranged on the tray 20, it can be specifically arranged in the receiving groove 201, and the side wall 203 of the receiving groove 201 can limit the side of the semiconductor structure, such as the side of the lead frame.
[0067] Furthermore, in order to be applicable to the support and inspection of semiconductor structures with various edge sizes, the tray may be configured to be capable of supporting semiconductor structures with various edge sizes.
[0068] Regarding accommodating and fixing the semiconductor structure by means of an accommodating groove, in some embodiments, the sidewall of the accommodating groove is divided into a plurality of stepped sidewall sections to form a plurality of accommodating portions capable of accommodating semiconductor structures of different sizes.
[0069] Please combine Figure 7 and Figure 8 As shown, in some embodiments, the side wall 203 of the tray 20' includes a first section side wall 2031, a second section side wall 2032, a third section side wall 2033, a step wall 2034 connected between the first section side wall 2031 and the second section side wall 2032, and a step wall 2035 connected between the second section side wall 2032 and the third section side wall 2033. The side wall 2031 and the bottom wall 202 of the receiving groove 201 form a first receiving portion 2011 located at the bottom of the receiving groove 201. The step wall 2034 and the second section side wall 2032 form a second receiving portion 2012 located in the middle of the receiving groove 201. The step wall 2035 and the third section side wall 2033 form a third receiving portion 2013 located at the upper part of the receiving groove 201.
[0070] Should Figure 8 In the accommodating groove 201 shown, the first accommodating portion 2011 has a first length L1, the second accommodating portion 2012 has a second length L2, and the third accommodating portion 2013 has a third length L3, so that it can be suitable for accommodating a semiconductor structure with a first length L1, a semiconductor structure with a second length L2, and a semiconductor structure with a third length L3.
[0071] It can be understood that the first accommodating portion 2011 , the second accommodating portion 2012 and the third accommodating portion 2013 have different widths along the width direction W.
[0072] It is understandable that, in some other embodiments, the accommodating groove may be configured as a plurality of accommodating portions, or may be configured as accommodating portions having other plurality of different sizes.
[0073] Of course, in other embodiments, if the semiconductor structures have different lengths but the same width, the widths of the different receiving portions may be set to be the same. In addition, for semiconductor structures with the same length but different widths, similar methods may be used accordingly. Figure 8 Different accommodation parts are arranged in a stepped manner.
[0074] It should be noted that the outer contour of the receiving groove or the receiving portion (which may be a contour perpendicular to the depth direction) is adapted to the outer contour of the semiconductor structure (which may be an outer contour perpendicular to the semiconductor thickness direction) to just accommodate the corresponding semiconductor structure. Taking the outer contour of the semiconductor structure as a rectangle as an example, if the semiconductor structure is a component after the bare chip is welded to the lead frame, the length and width of the receiving groove or the receiving portion may be adapted to the length and width of the lead frame respectively. If the semiconductor structure is a component after the bare chip is welded to the lead frame and a lead (copper wire, etc.) is set to electrically connect the bare chip to the lead frame, the length and width of the receiving groove or the receiving portion may also be adapted to the length and width of the lead frame respectively. If the semiconductor structure is a packaged structural component, the length and width of the receiving groove or the receiving portion may be adapted to the length and width of the structural component respectively.
[0075] It should be noted that the sidewall cross-section of the receiving groove 201 in the above embodiment is rectangular, which is applicable to semiconductor structures with rectangular edge contours. For semiconductor structures with other shapes, the receiving groove 201 can be adaptively set to other shapes.
[0076] It should also be noted that, in the above embodiment, the semiconductor structure is limited by forming a concave receiving groove 201. In some other embodiments, the semiconductor structure may also be limited by providing other fixing structures, such as fixing clips.
[0077] It should be noted that, in some other embodiments, the height of the tray may be fixed, and only the angle thereof may be rotatably adjusted.
[0078] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.
[0079] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the following claims.
[0080] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.
Claims
1. A semiconductor structure inspection bracket, characterized in that: The inspection tray comprises: Support seat; The tray is used to support the semiconductor structure. The tray is rotatably arranged on the support seat. The tray can be rotated to a plurality of different inspection positions. The inclination angle of the tray is different at different inspection positions, and the inclination angle of the semiconductor structure is different.
2. The inspection holder for semiconductor structure according to claim 1, characterized in that: The support seat comprises a support base and a support arm arranged on the support base, and the tray is rotatably arranged on the support arm.
3. The inspection holder for semiconductor structure according to claim 2, characterized in that: The supporting arms include a first supporting arm and a second supporting arm spaced apart from each other in a first direction; and the tray is rotatably disposed between the first supporting arm and the second supporting arm.
4. The inspection holder for semiconductor structure according to claim 3, characterized in that: The inspection bracket further comprises a connection structure, wherein the connection structure rotatably connects the tray to the first supporting arm and the second supporting arm.
5. The inspection holder for semiconductor structure according to claim 4, characterized in that: The tray has a first end and a second end which are away from each other in a first direction, and the first supporting arm and the second supporting arm are respectively provided with a first opening and a second opening for the connecting structure to pass through; The connection structure includes a first connection member and a second connection member. The first connection member passes through a first opening and is connected to a first end of the tray. The second connection member passes through a second opening and is connected to a second end of the tray.
6. The inspection holder for semiconductor structure according to claim 5, characterized in that: The first connecting member and the second connecting member can be loosely matched with the first supporting arm and the second supporting arm. When the first connecting member and the second connecting member are tightly matched with the first supporting arm and the second supporting arm, the tray is fixed; when the first connecting member and the second connecting member are loosely matched with the first supporting arm and the second supporting arm, the tray can be rotated to different inspection positions.
7. The inspection holder for semiconductor structure according to claim 6, characterized in that: The first opening extends in an arc shape along the width direction and the height direction of the first supporting arm, and the second opening extends in an arc shape along the width direction and the height direction of the second supporting arm; the first connecting member and the second connecting member are loosely matched with the first supporting arm and the second supporting arm, and when the tray is acted upon, the first connecting member and the second connecting member move along the first opening and the second opening, and the tray and the first connecting member and the second connecting member rotate synchronously.
8. The inspection holder for semiconductor structure according to claim 6, characterized in that: An operating handle is provided at the outer end of one of the first connecting member and the second connecting member to adjust the tightness of the first connecting member, the second connecting member and the first supporting arm, the second supporting arm; The first connecting member and the second connecting member are detachably connected to the first end and the second end of the tray.
9. The inspection holder for semiconductor structure according to any one of claims 5 to 8, characterized in that: The connection structure is a rotating screw, the tray has a threaded hole matched with the screw, and the connection structure can fix the tray at different inspection positions.
10. The inspection holder for semiconductor structure according to claim 1, characterized in that: The tray has a supporting surface for arranging the semiconductor structure, and a portion of the supporting surface is recessed inward to form a receiving groove for arranging the semiconductor structure. The side wall of the receiving groove matches the size of the semiconductor structure to limit the semiconductor structure.
11. The inspection holder for semiconductor structure according to claim 10, characterized in that: The sidewalls of the limiting grooves are stepped to form a plurality of accommodating portions capable of accommodating semiconductor structures of different sizes.