Device and method for controlling perpendicularity between micro spring plates

Abstract

A device and a method for controlling perpendicularity between micro-spring plates relate to the technical field of electronic packaging, are used for correspondingly welding a substrate welded with a plurality of micro-springs and a PCB (Printed Circuit Board), and comprise a substrate base, a positioning plate and a glue injection frame, a positioning groove used for positioning the base plate is formed in the top of the base plate base, and guide columns are arranged on the two sides, corresponding to the positioning groove, of the base plate base. A glue injection frame is arranged at the position, corresponding to the substrate, of the substrate base; guide holes correspondingly matched with the two guide columns are formed in the bottom of the positioning plate, a plurality of positioning convex columns used for positioning the micro-spring are arranged at the position, corresponding to the position between the two guide holes, of the positioning plate in an array mode, and the length of the positioning convex columns is 15-20% of the length of the micro-spring; according to the method, the water-soluble filling glue is injected to enable the micro-spring to have rigidity, so that when the micro-spring and the PBC are welded, it is guaranteed that the micro-spring and a welding spot on the PBC are in accurate butt joint, and the perpendicularity of the micro-spring and the PBC can be effectively guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of electronic packaging, and in particular to a device and method for controlling the verticality between micro-spring plates. Background Art

[0002] The spring contacts of micro-spring solder columns have better impact resistance, vibration resistance, flexibility and other characteristics, especially the ability to resist large deformation in the Z direction. While ensuring the electrical performance of the contact interconnection, it provides better flexibility for the interconnection of inter-layer spring contact arrays in high temperatures and harsh environments, and is increasingly attracting attention from high-reliability packaging. However, the micro-spring itself has a small mass and poor stability, and is easily offset by external forces. The vertical interconnection of micro-springs is more difficult to achieve than solder columns. Especially when CCGA uses micro-spring pins for interconnection, the number of micro-spring arrays is large, and the clamping and welding process of the micro-spring conversion tooling is poorly controllable, resulting in problems such as micro-spring offset, poor coplanarity, and large inclination, which in turn causes the micro-spring pins of the CCGA device to deviate from the pads when assembled with the PCB board, resulting in poor solder joint reliability. Therefore, micro-spring assembly precision control technology is extremely important.

[0003] A Chinese patent (publication number: CN114698265A) discloses a method and device for controlling the verticality between micro-spring plates. The patent places a PCB coated with solder and with micro-springs placed in a fixed position; all micro-springs are compressed at the same time and then re-soldered to the PCB; another PCB coated with solder is placed in a fixed position, and the PCB with micro-springs soldered is turned over to align the micro-springs with the soldering points of another PCB and move downward, so that the micro-springs are compressed and then re-soldered to the PCB; however, the patent ignores factors such as micro-spring tolerance, guide column tolerance, micro-spring inclination and micro-spring stiffness difference, resulting in problems such as micro-spring offset and micro-spring position accuracy not being well solved. Summary of the invention

[0004] In order to overcome the deficiencies in the background technology, the present invention discloses a device for controlling the verticality between micro-spring plates.

[0005] In order to achieve the above-mentioned invention object, the present invention adopts the following technical scheme: A device for controlling the verticality between micro-spring plates is used to make a substrate welded with multiple micro-springs corresponding to a PBC plate, comprising a substrate base, a positioning plate and a glue injection frame; a positioning groove for positioning the substrate is provided on the top of the substrate base, and guide posts are provided on both sides of the positioning groove of the substrate base; a glue injection frame is provided at a position of the substrate corresponding to the substrate; a guide hole corresponding to the two guide posts is provided at the bottom of the positioning plate, and a plurality of positioning bosses for positioning the micro-springs are arranged in an array at a position between the two guide holes of the positioning plate, the length of the positioning boss is 15-20% of the length of the micro-spring, the diameter of the column body at one end of the positioning boss connected to the positioning plate is not less than the inner diameter of the micro-spring, and a chamfer or rounded corner structure is provided at the end of the positioning boss away from the positioning plate.

[0006] The method for using the device for controlling the verticality between micro-spring plates comprises the following steps: S1. Positioning the substrate: placing the substrate in the positioning groove of the substrate base, and placing the glue injection frame at the substrate position so that the bottom of the glue injection frame is sealed with the top of the substrate base; S2, micro spring positioning, install the positioning plate on the guide column, and insert the positioning boss into the top of the micro spring; S3, glue injection and curing, injecting water-soluble filling glue into the glue injection frame, and heating and curing the water-soluble filling glue according to the water-soluble filling glue heating and curing process; S4, reflow soldering, first remove the positioning plate and the glue injection frame, clean the top of the solidified micro spring, place the PBC board printed with solder paste on the top of the micro spring, then send it into the reflow soldering furnace for soldering, and then cool it down and take it out; S5. Cleaning and inspection: dissolve and remove the water-soluble filling glue, then clean and dry the substrate, and check whether the PBC board and micro spring welding results meet the standards.

[0007] Preferably, the water-soluble filling glue in step S3 is 98316UV glue.

[0008] Preferably, a separation plate for separating the microspring from the positioning boss is provided at the bottom of the positioning plate, and openings are provided on the surface of the separation plate at positions corresponding to the positioning boss and the guide column.

[0009] Preferably, handles are provided on both sides of the top of the positioning plate.

[0010] Preferably, positioning pins are provided on both sides of the top of the separation plate, and pin holes corresponding to the positioning pins are provided at positions of the positioning plate corresponding to the positioning pins, and the positioning pins can pass through the corresponding pin holes.

[0011] Preferably, a mounting plate for positioning the PBC board is included, and a clamping groove for positioning the PBC board is provided on the mounting plate surface; guide openings corresponding to the two guide columns are provided on both sides of the mounting plate corresponding to the clamping groove.

[0012] Preferably, one side of the top of the glue injection frame is connected to an overflow pipe; and ear plates corresponding to the two guide pillars are provided on both sides of the glue injection frame.

[0013] Due to the adoption of the above-mentioned technical solution, the present invention has the following beneficial effects: The present invention discloses a device for controlling the verticality between micro-spring plates, which has a simple structure, is easy to assemble, has a low production cost and a high yield rate. A glue injection frame is provided at a position of a substrate base corresponding to a substrate, that is, the glue injection frame can be placed at the position of the substrate, so that the bottom of the glue injection frame is sealed with the top of the substrate base, and water-soluble filling glue is injected into the glue injection frame. The water-soluble filling glue is heated and cured according to a water-soluble filling glue heating and curing process, so that the micro-spring can have rigidity, so that when the micro-spring is welded to a PBC board, the micro-spring and the welding point on the PBC board can be accurately connected, and the verticality of the micro-spring and the PBC board can be effectively guaranteed. Furthermore, an overflow pipe is connected to one side of the top of the glue injection frame, so that the glue injection height can be effectively controlled.

[0014] The present invention further provides a separation plate at the bottom of the positioning plate for separating the microspring from the positioning boss, so as to prevent the positioning boss from pulling the microspring when the positioning plate needs to be removed after welding, causing the microspring to deform, or causing the microspring to be directly separated from the substrate.

[0015] The present invention also includes a mounting plate for positioning the PBC board. The mounting plate surface is provided with a clamping groove for positioning the PBC board, that is, the PBC board can be installed in the clamping groove, so as to accurately locate the position of the PBC board; the mounting plate is provided with guide openings corresponding to the two guide columns on both sides of the corresponding clamping groove, and the mounting plate can be installed on the guide columns and move up and down along the guide columns, so as to facilitate the precise docking of the PBC board with the micro spring. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a cross-sectional view of the present invention; Figure 3 It is a schematic diagram of the structure of a substrate welded with micro springs; Figure 4 This is a schematic diagram of the state when welding the PBC board.

[0017] In the figure: 1. substrate; 2. micro spring; 3. substrate base; 4. positioning plate; 5. guide column; 6. positioning boss; 7. separation plate; 8. handle; 9. positioning pin; 10. mounting plate; 11. glue injection frame; 12. overflow pipe. DETAILED DESCRIPTION

[0018] The present invention can be explained in detail through the following embodiments. The purpose of disclosing the present invention is to protect all technical improvements within the scope of the present invention. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", etc. indicating directions or positional relationships, they only correspond to the drawings of the present application for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific direction.

[0019] Embodiment 1, in combination with Figures 1 to 3 A device and method for controlling the verticality between micro-spring plates, used to make a substrate 1 welded with a plurality of micro-springs 2 be welded correspondingly with a PBC plate; comprising a substrate base 3 and a positioning plate 4; a positioning groove for positioning the substrate 1 is provided on the top of the substrate base 3, that is, the substrate 1 can be placed in the positioning groove when in use, so as to accurately determine the position of the substrate 1.

[0020] The base plate 3 is provided with guide posts 5 on both sides of the positioning groove; the bottom of the positioning plate 4 is provided with guide holes corresponding to the two guide posts 5, that is, the guide posts 5 can be inserted into the two guide holes of the positioning plate 4, so that the positioning plate 4 can move vertically up and down along the guide posts 5. The positioning plate 4 is arranged with a plurality of positioning bosses 6 for positioning the microspring 2 in an array corresponding to the position between the two guide holes, and the diameter of the column body of the positioning boss 6 connected to the positioning plate 4 is not less than the inner diameter of the microspring 2; It should be noted that the end of the positioning boss 6 facing away from the positioning plate 4 is chamfered or rounded to facilitate the microspring 2 to be mounted on the body of the positioning boss 6; since the diameter of the body of the end of the positioning boss 6 connected to the positioning plate 4 is not less than the inner diameter of the microspring 2, the microspring 2 can be tightly plugged into the positioning boss 6. This tight connection method is particularly important, as it is the key to ensuring the quality of subsequent welding. The microspring 2 is tightly plugged into the positioning boss 6, and the positioning boss 6 can be perpendicular to the substrate 1 to ensure that the microspring 2 is perpendicular to the substrate 1. At the same time, the positioning boss 6 can determine the position of the microspring 2 and ensure the verticality of the microspring 2.

[0021] It should be noted that the length of the positioning boss 6 is 15-20% of the length of the microspring 2 .

[0022] A glue injection frame 11 is provided at a position of the substrate base 3 corresponding to the substrate 1, that is, the glue injection frame 11 can be placed at the position of the substrate 1, so that the bottom of the glue injection frame 11 is sealed with the top of the substrate base 3, and water-soluble filling glue is injected into the glue injection frame 11. The water-soluble filling glue is heated and cured according to the water-soluble filling glue heating and curing process, so that the microspring 2 can have rigidity, so that when the microspring 2 is welded to the PBC board, the microspring 2 and the soldering point on the PBC board can be accurately connected, and the verticality of the microspring 2 and the PBC board can be effectively guaranteed; further, an overflow pipe 12 is connected to one side of the top of the glue injection frame 11, which can effectively control the glue injection height; ear plates corresponding to the two guide columns 5 are provided on both sides of the glue injection frame 11, that is, the glue injection frame 11 can be installed on the guide column 5 through the ear plates, so as to facilitate the accurate positioning of the position of the glue injection frame 11.

[0023] The method for using the device for controlling the verticality between micro-spring plates comprises the following steps: S1, positioning the substrate 1, placing the substrate 1 in the positioning groove of the substrate base 3, and placing the glue injection frame 11 at the position of the substrate 1, so that the bottom of the glue injection frame 11 is sealed with the top of the substrate base 3; S2, positioning the microspring 2, installing the positioning plate 4 on the guide column 5, and inserting the positioning boss 6 into the top of the microspring 2; S3, glue injection and curing, injecting water-soluble filling glue into the glue injection frame 11, and heating and curing the water-soluble filling glue according to the water-soluble filling glue heating and curing process; preferably, the water-soluble filling glue is 98316UV glue, the curing temperature is 50-80° C., the curing time is 0.5-3h, and the 98316UV glue can be removed by hydrolysis later; S4, reflow soldering, first remove the positioning plate 4 and the glue injection frame 11, clean the top of the solidified micro spring 2, place the PBC board printed with solder paste on the top of the micro spring 2, then send it into the reflow soldering furnace for soldering, and then cool it down and take it out; S5. Cleaning and inspection: dissolve and remove the water-soluble filling glue, then clean and dry the substrate 1, and check whether the welding results of the PBC board and the microspring 2 meet the standards.

[0024] In the actual use of Example 2, it is found that since the diameter of the shaft at one end of the positioning boss 6 connected to the positioning plate 4 is not less than the inner diameter of the microspring 2, the microspring 2 is difficult to separate from the positioning boss 6; Combined with Figure 2 , a device for controlling the verticality between micro-spring plates, which is different from embodiment 1 in that, on the basis of embodiment 1, a separation plate 7 for separating the micro-spring 2 from the positioning boss 6 is provided at the bottom of the positioning plate 4, and openings are provided at positions corresponding to the positioning boss 6 and the guide column 5 on the surface of the separation plate 7, that is, the separation plate 7 can move away from the positioning plate 4 along the guide column 5, so that the micro-spring 2 tightly sleeved with the positioning boss 6 is separated from the positioning boss 6, and the positioning boss 6 is prevented from pulling the micro-spring 2 when the positioning plate 4 needs to be removed after welding, causing the micro-spring 2 to be deformed, or causing the micro-spring 2 to be directly separated from the substrate 1; It should be noted that the aperture of the openings corresponding to the separation plate 7 and the positioning boss 6 is smaller than the outer diameter of the microspring 2, so that the microspring 2 can be separated from the positioning boss 6; the openings corresponding to the separation plate 7 and the guide column 5 utilize the guiding function of the guide column 5 to ensure that the separation plate 7 can move vertically up and down along the guide column 5.

[0025] Embodiment 3, in combination with Figure 4, a device for controlling the verticality between micro-spring plates, which is different from Example 1 in that, on the basis of Example 1 or 2, it also includes a mounting plate 10 for positioning a PBC board, and the mounting plate 10 is provided with a clamping groove for positioning the PBC board, that is, the PBC board can be installed in the clamping groove, so as to accurately locate the position of the PBC board; the mounting plate 10 is provided with guide openings corresponding to two guide columns 5 on both sides of the corresponding clamping groove, and the mounting plate 10 can be installed on the guide column 5 and move up and down along the guide column 5, so as to facilitate the precise docking of the PBC board with the micro-spring 2.

[0026] Embodiment 4, in combination with Figures 1-2 , a device for controlling the verticality between micro-spring plates. On the basis of embodiment 2 or 3, handles 8 are provided on both sides of the top of the positioning plate 4 to facilitate lifting the positioning plate 4. It should be noted that when the positioning plate 4 is inverted, the handles 8 can serve as legs to support the positioning plate 4.

[0027] The separation plate 7 is provided with positioning pins 9 on both sides of the top, and the positioning plate 4 is provided with a pin hole corresponding to the positioning pin 9 at the position corresponding to the positioning pin 9, and the positioning pin 9 can pass through the corresponding pin hole, that is, the position of the separation plate 7 can be accurately positioned through the corresponding cooperation between the positioning pin 9 and the corresponding pin hole of the positioning plate 4. At the same time, when the micro-spring 2 is separated from the positioning boss 6, the separation plate 7 can be moved downward relative to the positioning plate 4 by pressing the positioning pin 9, which is easy to operate.

[0028] The parts of the present invention that are not described in detail are prior art. It is obvious to those skilled in the art that the present invention is not limited to the details of the above-mentioned exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and it is intended that all changes that fall within the meaning and scope of equivalent elements are included in the present invention.

Claims

1. A device for controlling the verticality between micro spring plates, used for welding a substrate (1) welded with a plurality of micro springs (2) to a PBC plate, characterized in that: The invention comprises a substrate base (3), a positioning plate (4) and a glue injection frame (11); a positioning groove for positioning a substrate (1) is provided on the top of the substrate base (3); guide posts (5) are provided on both sides of the positioning groove of the substrate base (3); a glue injection frame (11) is provided at a position of the substrate base (3) corresponding to the substrate (1); a guide hole corresponding to the two guide posts (5) is provided at the bottom of the positioning plate (4); a plurality of positioning convex posts (6) for positioning a micro spring (2) are arranged in an array at a position corresponding to the position between the two guide holes of the positioning plate (4); the length of the positioning convex posts (6) is 15-20% of the length of the micro spring (2); the diameter of the column body of the end of the positioning convex post (6) connected to the positioning plate (4) is not less than the inner diameter of the micro spring (2); and a chamfered or rounded corner structure is provided at the end of the positioning convex post (6) away from the positioning plate (4).

2. The method for using the device for controlling the verticality between micro-spring plates as claimed in claim 1, characterized in that: The following steps are involved: S1, positioning the substrate (1), placing the substrate (1) in a positioning groove of the substrate base (3), and placing a glue injection frame (11) at the position of the substrate (1), so that the bottom of the glue injection frame (11) is sealed with the top of the substrate base (3); S2, positioning the microspring (2), installing the positioning plate (4) on the guide column (5), and inserting the positioning boss (6) into the top of the microspring (2); S3, glue injection and curing, injecting water-soluble filling glue into the glue injection frame (11), and heating and curing the water-soluble filling glue according to the water-soluble filling glue heating and curing process; S4, reflow soldering, first remove the positioning plate (4) and the glue injection frame (11), clean the top of the solidified micro spring (2), place a PBC board printed with solder paste on the top of the micro spring (2), then send it into the reflow soldering furnace for soldering, and then cool it down and take it out; S5. Cleaning and inspection: dissolve and remove the water-soluble filling glue, then clean and dry the substrate (1), and check whether the welding results of the PBC board and the microspring (2) meet the standards.

3. The method for using the device for controlling the verticality between micro-spring plates as claimed in claim 2, characterized in that: The water-soluble filling glue in step S3 is 98316UV glue.

4. The device for controlling the verticality between micro-spring plates as claimed in claim 1, characterized in that: A separation plate (7) for separating the microspring (2) from the positioning boss (6) is provided at the bottom of the positioning plate (4), and openings are provided on the surface of the separation plate (7) at positions corresponding to the positioning boss (6) and the guide column (5).

5. The device for controlling the verticality between micro-spring plates as claimed in claim 1, characterized in that: Handles (8) are provided on both sides of the top of the positioning plate (4).

6. The device for controlling the verticality between micro-spring plates as claimed in claim 4, characterized in that: Positioning pins (9) are provided on both sides of the top of the separation plate (7), and pin holes corresponding to the positioning pins (9) are provided on the positioning plate (4) at positions corresponding to the positioning pins (9), and the positioning pins (9) can pass through the corresponding pin holes.

7. The device for controlling the verticality between micro-spring plates as claimed in claim 1, characterized in that: It also comprises a mounting plate (10) for positioning the PBC board, the mounting plate (10) having a plate surface provided with a clamping groove for positioning the PBC board; and guide openings corresponding to the two guide posts (5) are provided on both sides of the mounting plate (10) corresponding to the clamping groove.

8. The device for controlling the verticality between micro-spring plates as claimed in claim 1, characterized in that: One side of the top of the glue injection frame (11) is connected to an overflow pipe (12); and ear plates corresponding to and matching the two guide pillars (5) are provided on both sides of the glue injection frame (11).

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