Display device

Abstract

The invention provides a display device. A display device according to an exemplary embodiment of the present disclosure includes: at least one display panel; a plurality of wirings disposed on an outer surface of at least one side of the display panel; and a wiring substrate disposed on a rear surface or an upper surface of the at least one display panel and having a plurality of connection lines connected to each of the plurality of wirings. The plurality of connecting lines extend to a rear surface of the display panel to overlap a portion of the display panel, and may secure a degree of freedom of an attachment position of the transparent display panel.

Description

Technical Field

[0001] The present disclosure relates to a display device, and more particularly, for example but not limited to, to a display device having an island shape without forming a dead zone. Background Art

[0002] In recent years, with the development of various portable electronic devices such as mobile communication terminals and notebook computers, the demand for display devices suitable for these portable electronic devices has also been increasing.

[0003] Liquid crystal display devices, field emission display devices, organic light emitting diode display devices or inorganic light emitting diode display devices are being studied as display devices. Among display devices, the application fields of electroluminescent display devices, including organic light emitting display devices and inorganic light emitting display devices, in particular, are expanding, and they have the advantages of development of large-scale production technology, simple driving means, low power consumption, high image quality, large screen implementation, and flexibility.

[0004] The electroluminescent display device includes a plurality of pixels in a matrix form, and each of the plurality of pixels includes three or more sub-pixels and one or more thin film transistors TFT that respectively control each of the sub-pixels.

[0005] The descriptions provided in the discussion of related art section should not be considered as prior art simply because they are mentioned in or associated with this section. The discussion of related art section may include information describing one or more aspects of the subject technology, and the descriptions in this section do not limit the present disclosure. Summary of the invention

[0006] The present disclosure aims to provide a transparent display device having an island shape without forming a dead zone.

[0007] Another object to be achieved by the present disclosure is to provide a display device which attaches a transparent display panel to a wiring substrate by freely selecting an attachment position of the transparent display panel.

[0008] Another object to be achieved by the present disclosure is to provide a display device which attaches a transparent display panel to a wiring substrate by freely selecting a light emitting direction of the transparent display panel.

[0009] The purpose of the present disclosure is not limited to the above purpose, and those skilled in the art can clearly understand other purposes not mentioned above from the following description. In addition, it will be easily understood that the purposes and advantages of the present disclosure can be achieved using the means shown in the claims or their combination.

[0010] According to one aspect of the present disclosure, a display device includes: at least one display panel; a plurality of wirings arranged on an outer surface of at least one side of the display panel; and a wiring substrate, which can be arranged on a rear surface or an upper surface of the at least one display panel and can have a plurality of connecting lines connected to each of the plurality of wirings, and the plurality of connecting lines can extend to the rear surface of the display panel to overlap with a portion of the display panel.

[0011] Additional details of example embodiments are included in the detailed description and accompanying drawings.

[0012] According to an exemplary embodiment of the present disclosure, a wiring substrate and a source printed circuit board for introducing a signal are separately configured, and a signal is applied to a display panel through a wiring line on the wiring substrate to manufacture a transparent display device having an island shape without forming a dead zone. Therefore, there is no design restriction caused by the dead zone, thereby reducing the manufacturing cost. In addition, the source printed circuit board, the driver IC, etc. are arranged on the outermost frame of the display device so that the entire transparent display panel has uniform transparency.

[0013] According to the exemplary embodiment of the present disclosure, the wiring lines can be arranged in the entire area of ​​the wiring substrate, so that the degree of freedom of the attachment position of the transparent display panel can be ensured.

[0014] According to an exemplary embodiment of the present disclosure, the same size is adopted for the upper substrate and the lower substrate of the transparent display panel, and the side surfaces of the upper substrate and the lower substrate are surrounded by wiring that is in lateral contact with the pad. Therefore, the direction in which the display panel is attached to the wiring substrate can be selected to ensure the degree of freedom of the light emitting direction of the transparent display panel.

[0015] The effects according to the present disclosure are not limited to the contents exemplified above, and more various effects are included in this specification.

[0016] It is to be understood that both the foregoing general description and the following detailed description of the present disclosure are exemplary and explanatory and are intended to provide further explanation of the disclosure as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which:

[0018] Figure 1 is a block diagram of a display device according to an exemplary embodiment of the present disclosure;

[0019] Figure 2 yes Figure 1 A circuit diagram of a sub-pixel of a display device;

[0020] Figure 3is a perspective view showing a display device according to an exemplary embodiment of the present disclosure;

[0021] Figure 4 Is magnification Figure 3 a view of a portion of a display device;

[0022] Figure 5 is a perspective view showing placement of a plurality of transparent display panels as an example in a display device according to an exemplary embodiment of the present disclosure;

[0023] Figure 6 It is shown Figure 5 a cross-sectional view of a display device;

[0024] Figure 7 Is magnification Figure 6 A view of part A;

[0025] Figure 8 It is shown Figure 6 a cross-sectional view of a sub-pixel of a display panel;

[0026] Fig. 9 and Fig.10 is a view showing a pixel structure as an example;

[0027] Fig.11 is a perspective view showing placement of a plurality of transparent display panels as an example in a display device according to another exemplary embodiment of the present disclosure;

[0028] Fig.12 is a perspective view showing a display device according to still another exemplary embodiment of the present disclosure;

[0029] Fig.13A and Fig. 13B It is shown Fig.12 a cross-sectional view of a display device;

[0030] Fig.14 is a perspective view showing a display device according to still another exemplary embodiment of the present disclosure; and

[0031] Fig.15A and Fig. 15B It is shown Fig.14 A view of a cross section of a display device.

[0032] Throughout the drawings and detailed description, unless otherwise specified, the same drawing reference numerals should be understood to refer to the same elements, features, and structures. The sizes, lengths, and thicknesses of layers, regions, and elements and their descriptions may be exaggerated for clarity, illustration, and convenience. DETAILED DESCRIPTION

[0033] Reference will now be made in detail to embodiments of the present disclosure, examples of which may be illustrated in the accompanying drawings. The described progression of processing steps and / or operations is an example; however, the order of steps and / or operations is not limited to that described herein and may be varied as known in the art, except for steps and / or operations that must occur in a particular order. The names of the various elements used in the following explanations may be selected only for convenience in writing the specification and therefore may differ from the names used in the actual product.

[0034] By referring to the following and attached Figure 1 The advantages and features of the present disclosure and the methods for achieving these advantages and features will become clear from the exemplary embodiments described in detail. However, the present disclosure is not limited to the exemplary embodiments disclosed herein, but will be implemented in various forms. The exemplary embodiments are provided only by way of example so that those skilled in the art can fully understand the disclosure of the present disclosure and the scope of the present disclosure.

[0035] The shapes, sizes, proportions, angles, quantities, etc. used to describe the exemplary embodiments of the present disclosure in the accompanying drawings are only examples, and the present disclosure is not limited thereto. Throughout the specification, similar reference numerals generally represent similar elements. In addition, in the following description of the present disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of the present disclosure. Terms such as "including", "having", "consisting of", "consisting of", "formed of", etc. used herein are generally intended to allow the addition of other components, unless these terms are used together with the term "only". Unless otherwise expressly stated, any reference to the singular may include the plural.

[0036] When interpreting an element, even if not explicitly described, the element is also considered to include a margin of error. Any implementation described herein as "exemplary" is not necessarily to be considered preferred or advantageous over other implementations.

[0037] When describing a positional relationship, for example, when the positional relationship between two parts is described as "on", "above", "below", "under", and "beside", unless "just" or "directly" is used, one or more other parts may be disposed between the two parts. For example, when an element or layer is disposed "on" another element or layer, a third layer or element may be inserted therebetween.

[0038] When describing a time relationship, for example, when a time sequence is described as “after,” “subsequently,” “next,” and “before,” discontinuous cases may be included unless “just” or “directly” is used.

[0039] It should be understood that although the terms "first", "second", "A", "B", "(A)" or "(B)" etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present disclosure.

[0040] When describing the elements of the present disclosure, terms such as first, second, A, B, (a), (b) may be used. These terms are only used to distinguish the corresponding elements from other elements, and the nature, order, priority or quantity of the corresponding elements are not limited by these terms. It should be understood that when an element is referred to as being "coupled" or "connected to" another element, the element may be directly coupled or directly connected to the other element, or other intermediate elements may exist therebetween.

[0041] The term "at least one" should be understood to include any and all combinations of one or more of the associated listed elements. For example, the meaning of "at least one of a first element, a second element, and a third element" means a combination of two or more of the first element, the second element, and the third element, and all elements listed in the first element, the second element, or the third element.

[0042] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those generally understood by those of ordinary skill in the art to which the example embodiments belong. It should also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having, for example, a meaning consistent with that in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless expressly defined herein. For example, the term "part" or "unit" may apply to, for example, a separate circuit or structure, an integrated circuit, a computing block of a circuit device, or any structure configured to perform the described function, as understood by those of ordinary skill in the art.

[0043] The features of various embodiments of the present disclosure may be combined in part or in whole, and may be technically related or interoperable with each other. The embodiments may be implemented independently of each other, or may be implemented together in an associated relationship.

[0044] In the present disclosure, examples of display devices may include display devices in a narrow sense, such as a quantum dot module, an organic light emitting diode (OLED) module, or a liquid crystal module (LCM) having a display panel and a driver for driving the display panel. In addition, examples of display devices may include complete sets (or complete sets of equipment) or complete sets of electronic equipment, such as notebook computers, televisions (TVs), computer monitors, instrument equipment including automotive equipment or another type of equipment for vehicles, or mobile electronic devices such as smart phones or electronic tablets, which are complete products (or final products) including LCMs, OLED modules, and QD modules.

[0045] Therefore, in the present disclosure, examples of display devices may include display devices in a narrow sense themselves (such as LCM, OLED modules, QD modules) and complete sets of devices, which are final consumer devices or application products including LCM, OLED modules, QD modules, but are not limited to these.

[0046] In some embodiments, the LCM, OLED module, and QD module including the display panel and the driver may be referred to as a narrow display device, and the electronic device as the final product including the LCM, OLED module, and QD module may be referred to as a complete set of devices. For example, the narrow display device may include a display panel (such as an LCM, an OLED module, or a QD module) and a source printed circuit board (PCB), which is a controller for driving the display panel. The complete set of devices may also include a complete set of PCBs, which are complete set of controllers electrically connected to the source PCB to control the complete set of devices as a whole.

[0047] The display panel applied to the embodiments of the present disclosure may use any type of display panel, including a liquid crystal display panel, an organic light emitting diode (OLED) display panel, a quantum dot (QD) display panel, and an electroluminescent display panel. The display panel of the embodiment is not limited to a specific display panel capable of performing frame bending using a flexible substrate and a lower backplane support structure for an organic light emitting diode (OLED) display panel. Moreover, the shape or size of the display panel applied to the display device according to these embodiments is not limited.

[0048] In the example where the display panel is an organic light-emitting display panel, the display panel may include a plurality of gate lines, data lines, and pixels respectively arranged at the intersections of the gate lines and the data lines. Embodiments are not limited thereto. As an example, one or more signal wirings, such as sensing lines, emission control lines, and the like, may also be included. Moreover, the display panel may include an array including: a thin film transistor (TFT), which is an element for selectively applying a voltage to each pixel; a light-emitting element layer on the array; and an encapsulation substrate or encapsulation layer arranged on the array to cover the light-emitting element layer. The encapsulation substrate may protect the TFT and the light-emitting element layer from external impacts, and may prevent water or oxygen from penetrating into the light-emitting element layer. In addition, the layer arranged on the array may include an inorganic light-emitting layer, such as a nano-sized material layer, quantum dots, and the like.

[0049] The features of various embodiments of the present disclosure may be partially or completely connected or combined with each other, may interact with each other in various ways and be technically driven. The embodiments of the present disclosure may be implemented independently of each other, or may be implemented together in dependence on each other.

[0050] The exemplary embodiments of the present disclosure will be described below through the accompanying drawings and exemplary embodiments. For ease of explanation, the proportions of components shown in the drawings are different from the actual proportions, and therefore, the proportions of components shown in the drawings are not limited to the proportions shown in the drawings.

[0051] Figure 1 is a block diagram of a display device according to an exemplary embodiment of the present disclosure.

[0052] Reference Figure 1 The display device according to an exemplary embodiment of the present disclosure may include an image processor 101, a timing controller 102, a data driver 103, a gate driver 104, a display panel 100, etc. The display panel 100 may include a plurality of sub-pixels P and various types of signal lines for driving the plurality of sub-pixels P.

[0053] The image processor 101 may output a data signal DATA and a driving signal. For example, the image processor 101 may output a data signal DATA supplied from the outside, a data enable signal DE, etc., but is not limited thereto. In addition, in addition to the data enable signal DE, the image processor 101 may also output one or more of a vertical synchronization signal, a horizontal synchronization signal, and a clock signal.

[0054] For example, the data signal DATA together with the driving signal including the data enable signal DE or the vertical synchronization signal, the horizontal synchronization signal and the clock signal may be supplied from the image processor 101 to the timing controller 102. The timing controller 102 may output a gate timing control signal GDC for controlling the operation timing of the gate driver 104 and a data timing control signal DDC for controlling the operation timing of the data driver 103 based on the driving signal. In addition, the timing controller 102 may output the data signal DATA to the data driver 103.

[0055] In addition, the data driver 103 samples and latches the data signal DATA supplied from the timing controller 102 in response to the data timing control signal DDC supplied from the timing controller 102 to convert the data signal into a gamma reference voltage and output the converted gamma reference voltage.

[0056] The various types of signal lines may include, for example, a plurality of data lines DL1 to DLn for carrying data signals (which may be referred to as data voltages or image signals), a plurality of gate lines GL1 to GLm for carrying gate signals (which may be referred to as scan signals), and the like.

[0057] For example, the data driver 103 may output the data signal DATA through the data lines DL1 to DLn.

[0058] In addition, the gate driver 104 may output a gate signal in response to the gate timing control signal GDC supplied from the timing controller 102 while changing the level of the gate voltage.

[0059] For example, the gate driver 104 may output a gate signal through the gate lines GL1 to GLm.

[0060] The plurality of data lines DL1 to DLn and the plurality of gate lines GL1 to GLm may intersect each other. Each of the plurality of data lines DL1 to DLn may be configured to extend in a first direction. Each of the plurality of gate lines GL1 to GLm may be configured to extend in a second direction different from the first direction.

[0061] When the sub-pixels P of the display panel 100 emit light in response to the data signal DATA and the gate signal supplied from the data driver 103 and the gate driver 104, the display panel 100 may display an image. Figure 2 , Figures 9 to 11 The specific structure of the sub-pixel P is described in detail.

[0062] Figure 2 yes Figure 1 A circuit diagram of a sub-pixel of a display device.

[0063] Reference Figure 2According to an exemplary embodiment of the present disclosure, a sub-pixel of a display device may include, for example, a switching transistor SW, a driving transistor DR, a compensation circuit CC, and a light-emitting diode OLED. The embodiment is not limited thereto. For example, one or more transistors and / or one or more capacitors may also be included.

[0064] The light emitting diode OLED may emit light according to the driving current formed by the driving transistor DR.

[0065] The switching transistor SW may perform a switching operation so that a data signal supplied through the data line DL is stored in the capacitor Cst as a data voltage in response to a gate signal supplied through the gate line GL. For example, when the switching transistor SW is turned on in response to a gate signal supplied through the gate line GL, the data signal supplied through the data line DL is stored in the capacitor Cst.

[0066] The driving transistor DR may operate in response to the data voltage stored in the capacitor Cst to allow a constant driving current to flow between the high potential power line EVDD and the low potential power line EVSS.

[0067] The compensation circuit CC is a circuit for compensating for a threshold voltage of the driving transistor DR, etc., and may include one or more thin film transistors and a capacitor. The configuration of the compensation circuit CC may vary according to a compensation method.

[0068] Figure 2 The sub-pixel shown is configured by a 2T (transistor) 1C (capacitor) structure including a switch transistor SW, a drive transistor DR, a capacitor Cst, and a light emitting diode OLED. When a compensation circuit CC is added, the sub-pixel can be configured in various forms (e.g., 3T1C, 4T1C, 5T1C, 6T1C, 3T2C, 4T2C, 5T2C, 6T2C, 7T1C, and 7T2C), but the exemplary embodiments of the present disclosure are not limited thereto. More or fewer transistors and capacitors may be included. The structure of each of the plurality of sub-pixels may be configured or designed differently depending on the type of display device.

[0069] Figure 3 is a perspective view showing a display device according to an exemplary embodiment of the present disclosure.

[0070] Figure 4 Is magnification Figure 3 A view of a portion of a display device.

[0071] Figure 5 A portion of the display panel 100 is enlarged.

[0072] Reference Figure 3 and Figure 4, a display device according to an exemplary embodiment of the present disclosure may include a display panel 100 and a wiring substrate 160 disposed on the rear surface of the display panel 100, but is not limited thereto. The present disclosure may also be applied to an example in which a plurality of display panels 100 are disposed on one wiring substrate 160. For example, a display device may include three display panels and one wiring substrate disposed on the rear surface of the display panel. This will refer to Fig.11 Detailed description.

[0073] The display panel 100 is a panel for displaying images to a user.

[0074] The display panel 100 may include a display element that displays an image, a driving element that drives the display element, and a wiring line that transmits various signals to the display element and the driving element, but is not limited thereto. The display element may be defined in different ways depending on the type of the display panel 100. For example, when the display panel 100 is an organic light-emitting display panel, the display element may be an organic light-emitting diode including an anode, an organic layer, and a cathode. As another example, the display element may be a micro LED.

[0075] Hereinafter, although it is assumed that the display panel 100 is an organic light emitting display panel, the display panel 100 is not limited to the organic light emitting display panel.

[0076] The display panel 100 may include an active area that allows an image to be displayed and an inactive area in which no image is displayed. For example, the active area may be partially or completely surrounded by the inactive area. As an example, the inactive area may be bent from the active area toward the rear surface of the display panel, but is not limited thereto.

[0077] The active area is a region where an image is displayed in the display panel 100. The sub-pixel P may be disposed in the active area of ​​the display panel 100.

[0078] In the active area, a plurality of sub-pixels constituting a plurality of pixels and a circuit for driving the plurality of sub-pixels may be provided. The plurality of sub-pixels are the smallest units constituting the active area, and a display element may be provided in each of the plurality of sub-pixels. A plurality of sub-pixels may constitute a pixel. For example, an organic light emitting diode including an anode, an organic layer and a cathode may be provided in each of the plurality of sub-pixels, but is not limited thereto. In addition, the circuit for driving the plurality of sub-pixels may include a driving element, a wiring line, and the like. For example, the circuit may be configured by a thin film transistor, a storage capacitor, a gate line, a data line, and the like, but is not limited thereto.

[0079] The non-active area is an area where no image is displayed. The non-active area may refer to an area outside the active area. Various types of signal lines may be arranged in the non-active area, and may be connected to various types of driving circuits.

[0080] For example, in the non-active area, various wiring lines and circuits for driving the organic light emitting diode in the active area may be arranged. For example, in the non-active area, a link line or a driving IC for transmitting signals to a plurality of sub-pixels and circuits in the active area may be arranged, but is not limited thereto.

[0081] Figure 3 The left and right sides of the gate driver IC may be defined as gate pad portions provided with gate driver ICs, and Figure 3 The lower side of may be defined as a data pad portion connected to the flexible film through the connection line 181, but the present disclosure is not limited thereto. For example, a gate pad portion may also be included in the data pad portion of the lower side.

[0082] At this time, the gate driver IC may be formed independently of the display panel 100 and electrically connected to the display panel 100 in various methods, but may also be configured as a gate in panel (GIP) to be installed in the display panel 100, but is not limited thereto. In this case, the non-active area may include a GIP region in which a GIP circuit is provided. For example, the GIP region may be located in the non-active region on the left and right sides of the display panel 100. In addition, the gate driver IC may be implemented by a chip on glass (COG) technology, a chip on film (COF) technology, etc.

[0083] The display panel 100 may also include various additional elements to generate various signals or drive pixels in the active area. Additional elements for driving pixels may include inverter circuits, multiplexers, electrostatic discharge (ESD) circuits, etc. The display panel 100 may also include additional elements associated with functions other than the pixel driving function. For example, the display panel 100 may include additional elements that provide a touch sensing function, a user authentication function (e.g., fingerprint recognition), a multi-level pressure sensing function, a tactile feedback function, etc. The additional elements may be located in an external circuit connected to the non-active area NA and / or the connection interface. However, the present disclosure is not limited thereto.

[0084] For example, a flexible film is provided at one end of the wiring substrate 160 to supply power supply voltage and data voltage to a plurality of sub-pixels and circuits of the active area through a plurality of connection lines 181. For example, the flexible film may be a tape carrier package (TCP) or a chip on film (COF). For example, one edge portion (or output bonding unit) of the flexible film may be attached to a plurality of third pads (or input pads) 183 provided on the wiring substrate 160 by a film attachment process using an anisotropic conductive film.

[0085] The connection line 181 may be configured of a metal material having low resistance, low reflectivity, and high transmittance, but is not limited thereto. For example, the connection line 181 may be arranged to have a constant spacing. For example, the connection line 181 is arranged on the entire surface of the wiring substrate 160 at a constant spacing to actively respond to the position change of the display panel 100, thereby ensuring the degree of freedom of the attachment position of the transparent display panel 100.

[0086] Meanwhile, the display panel 100 according to the exemplary embodiment of the present disclosure may further include a first substrate 110 , a second substrate 150 , an element unit, and a wiring 175 , but is not limited thereto.

[0087] The first substrate 110 may also be represented as a display substrate, a pixel array substrate, a lower substrate or a base substrate, but is not limited thereto. The first substrate 110 may be formed of a glass material or a plastic material, but is not limited thereto. In addition, the first substrate 110 may be formed of a flexible polymer film. The first substrate 110 may be a glass substrate, or a bendable thin glass substrate or a plastic substrate. For example, the first substrate 110 may be a glass substrate or a tempered glass. For example, the tempered glass may be any one of sapphire glass, gorilla glass, or a laminated glass thereof. For example, the flexible polymer film may be made of any one of polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyether sulfone (PES), cyclic olefin copolymer (COC), triacetyl cellulose (TAC) film, polyvinyl alcohol (PVA) film, polyimide (PI) film and polystyrene (PS), which is only an example and is not necessarily limited thereto.

[0088] The display panel 100 may include a plurality of pixels disposed on a first substrate 110 and pixel driving lines for driving the plurality of pixels.

[0089] For example, the pixel drive line may be disposed on the first surface of the first substrate 110 to supply a signal required to drive each pixel (or emit light) in the plurality of pixels. For example, the pixel drive line may include a data line for applying a data signal, a gate line for applying a gate signal, a pixel drive power line (or a first power line), and a pixel common power line (or a second power line). The embodiment is not limited thereto. In addition, according to the drive (or operation) of the pixel circuit disposed in the circuit area of ​​the pixel, the pixel drive line may also include a reference power line (or a sensing line).

[0090] Each pixel driving line may be electrically connected to a first pad portion PP1 disposed in a first edge portion (or lower side) of a first surface (or upper surface) of the first substrate 110. Specifically, each pixel driving line may be electrically connected to a plurality of first pads 171 included in a first pad portion PP1 disposed in a first edge portion (or lower side) of a first surface (or upper surface) of the first substrate 110.

[0091] The first pad portion PP1 may include a plurality of first pads 171 disposed side by side in the first direction (X direction) over the insulating layer exposed to the first edge portion of the first surface of the first substrate 110 .

[0092] For example, the plurality of first pads 171 included in the first pad portion PP1 may be divided (classified) into a plurality of first data pads, a plurality of first pixel driving power pads, and a plurality of first pixel common power pads, but not limited thereto. Accordingly, the first pad portion PP1 may include: a first data pad portion having a plurality of first data pads connected to a plurality of data lines; a first pixel driving power pad portion having a plurality of first pixel driving power pads connected to a plurality of pixel driving power lines; and a first pixel common power pad portion having a plurality of first pixel common power pads connected to a plurality of pixel common power lines, but not limited thereto. Optionally, the plurality of first pads 171 may also include a plurality of first reference power pads. Therefore, the first pad portion PP1 may also include a first reference power pad portion having a plurality of first reference power pads connected to a plurality of reference power lines.

[0093] Each of the plurality of pixels may be arranged in each of the plurality of pixel areas arranged at a first interval (or a first spacing) along a first direction (X direction) and a second direction (Y direction). Each of the plurality of pixels may include a self-luminous element and a pixel circuit, but is not limited thereto. The self-luminous element emits light according to a top emission method based on a signal supplied from a corresponding adjacent pixel drive line to release light to the upper portion of the first surface of the first substrate 110. The pixel circuit is connected to an adjacent pixel drive line to allow the self-luminous element to emit light. For example, the pixel circuit may include a drive thin film transistor that supplies a data current corresponding to a data signal supplied through a data line to the self-luminous element.

[0094] At the same time, the first substrate 110 may further include a chamfer 176 formed in a corner between the first surface and the outer surface. The chamfer 176 can minimize or reduce the degree to which the corner of the first substrate 110 is damaged due to a physical impact from the outside, and suppress the wiring 175 from being disconnected according to the corner of the first substrate 110. For example, the angle of the chamfer 176 is 45 degrees, but it is not necessarily limited to this. The chamfer 176 can be achieved by a chamfering process using a cutting wheel or a grinding wheel, but it is not necessarily limited to this. Therefore, the outer surface of the first pad 171 of the first pad portion PP1, which is set to contact the chamfer 176, is removed or ground together with the corner of the first substrate 110 through the chamfering process to include an inclined surface inclined at an angle corresponding to the angle of the chamfer 176.

[0095] Meanwhile, the first substrate 110 may also include, but is not limited to, a gate drive circuit (or gate driver IC) and other circuit components disposed in the active region. In addition, the first substrate 110 may also include a data drive circuit (or data driver IC). For example, the gate drive circuit may be a circuit for driving a plurality of gate lines, and may provide a gate signal to the gate lines.

[0096] The gate drive circuit may be disposed in the active area to supply a scan signal (or a gate signal) to the pixels disposed on the first substrate 110. The gate drive circuit may simultaneously supply a scan signal to the pixels disposed on a horizontal line parallel to the first direction (X direction). For example, the gate drive circuit may supply at least one scan signal to the pixels disposed on one horizontal line through at least one gate line.

[0097] In addition, for example, the gate driving circuit can be implemented by a shift register including a multi-stage circuit unit. For example, the display device according to the present disclosure may include a shift register that is disposed in an active area on the first substrate 110 and supplies a scan signal to a pixel, but is not limited thereto.

[0098] Each of the multi-stage circuit units may include a plurality of branch circuits that are spaced apart on each horizontal line of the first substrate 110 along the first direction (X direction). For example, each of the plurality of branch circuits includes at least one thin film transistor (or branch thin film transistor), and may be disposed one by one between at least one pixel (or pixel region) in a horizontal line along the first direction (X direction). Each of the multi-stage circuits generates a scan signal according to a predetermined order in response to a gating control signal supplied through the first pad portion PP1, and may supply the scan signal to the corresponding gating line. For example, the gating control signal may include a start signal, a plurality of shift clocks, at least one gating drive power supply, and at least one gating common power supply, but is not limited thereto. For example, a plurality of shift clocks may be divided (or classified) into a plurality of scan clocks and a plurality of carry clocks, but is not limited thereto. Here, a plurality of carry clocks may be omitted.

[0099] For example, the first substrate 110 may further include a gate control line group dispersed between a plurality of pixels and connected to a gate drive circuit. Each gate control line group may be selectively connected to a plurality of branch circuits provided in each of the multi-stage circuit units. For example, the gate control line group may include a start signal line, a plurality of shift clock lines, at least one gate drive power supply line, and at least one gate common power supply line, but is not limited thereto. For example, a plurality of shift clock lines may be divided (or classified) into a plurality of scan clock lines and a plurality of carry clock lines, but is not limited thereto. Here, a plurality of carry clock lines may be omitted.

[0100] The first pad portion PP1 may also include a first gate pad portion having a plurality of first gate pads connected to the gate control line group. For example, a plurality of first gate pads may be divided (or classified) into: a first start signal pad connected to a start signal line, a plurality of first shift clock pads connected to each of a plurality of shift clock lines, at least one first gate drive power pad connected to at least one gate drive power line, and at least one first gate common power pad connected to at least one gate common power line, but not limited thereto. Therefore, the first gate pad portion may include a first start signal pad, a plurality of first shift clock pads, at least one first gate drive power pad, and at least one first gate common power pad, but not limited thereto. For example, a plurality of first shift clock pads may be divided (classified) into a plurality of first scan clock pads connected to each of a plurality of scan clock lines and a plurality of first carry clock pads connected to each of a plurality of carry clock lines. Here, a plurality of carry clock lines may be omitted. In addition, a plurality of first carry clock pads may be omitted.

[0101] As an example, the second substrate 150 may be denoted as an encapsulation substrate, an upper substrate, or encapsulation glass, but is not limited thereto.

[0102] The second substrate 150 may be formed of a glass material or a plastic material, but is not limited thereto. In addition, the second substrate 150 may be formed of a flexible polymer film. The second substrate 150 may be a glass substrate, or a bendable thin glass substrate or a plastic substrate. For example, the second substrate 150 may be a glass substrate or a tempered glass. For example, the second substrate 150 may be formed of the same material as the first substrate 110, but is not limited thereto. In addition, the second substrate 150 may be formed of a different material from the first substrate 110. For example, the size of the second substrate 150 is smaller than the size of the first substrate 110, so that the first substrate 110 may be exposed, and the first pad portion PP1 may be located on the first surface of the exposed first substrate 110. For example, the flexible polymer film can be made of any one of polyethylene terephthalate (PET), polycarbonate (PC), acrylonitrile-butadiene-styrene copolymer (ABS), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyethersulfone (PES), cyclic olefin copolymer (COC), triacetyl cellulose (TAC) film, polyvinyl alcohol (PVA) film, polyimide (PI) film and polystyrene (PS), which are only examples and are not necessarily limited to these.

[0103] The second substrate 150 may be coupled (or bonded) to the first substrate 110. For example, the second substrate 150 may be coupled (or bonded) to the first surface of the first substrate 110 through an element unit. The second substrate 150 may include: a first surface facing the first substrate 110 or a rear surface (or back surface) coupled to the element unit; a front surface opposite to the rear surface; and an outer surface between the front surface and the rear surface, etc. Although not shown in detail, the element unit may be interposed between the first substrate 110 and the second substrate 150 so as to bond the second substrate 150 to the first substrate 110. The following will refer to Figures 6 to 8 Describe the component unit in detail.

[0104] The wiring substrate 160 may be disposed on the rear surface of the display panel 100 through an adhesive layer. The wiring substrate 160 may be formed of a glass material or a plastic material, but is not limited thereto. In addition, the wiring substrate 160 may be formed of a flexible polymer film. The wiring substrate 160 may be a glass substrate or a flexible polymer film, or may be a bendable thin glass substrate or a plastic substrate. For example, the wiring substrate 160 may be a glass substrate or a tempered glass. For example, the wiring substrate 160 may be formed of the same material as the first substrate 110, but is not limited thereto. In addition, the wiring substrate 160 may be formed of a material different from the first substrate 110. For example, the size of the wiring substrate 160 may be larger than the size of the display panel 100, so that the wiring substrate 160 may be exposed. The wiring substrate 160 may perform the function of transmitting signals to the pixel drive lines and increasing the rigidity of the display panel 100. For example, the transmittance of the wiring substrate 160 may be adjusted according to the specifications of the display panel 100.

[0105] Although not shown in detail, an adhesive layer may be interposed between the display panel 100 and the wiring substrate 160 to bond the display panel 100 to the wiring substrate 160. The display panel 100 and the wiring substrate 160 may be bonded to each other by the adhesive layer. Figure 6 and Figure 7 The adhesive layer is described in detail.

[0106] For example, the display device according to the exemplary embodiment of the present disclosure may include a second pad portion PP2 (see FIG. 1 ) provided on the wiring substrate 160. Figure 3 For example, the second pad portion PP2 may be disposed on the upper surface of the wiring substrate 160 and may be connected to the first pad portion PP1 disposed on the first substrate 110 (see Figure 3 )overlap.

[0107] The second pad portion PP2 may include a plurality of second pads, which are arranged at constant intervals along the first direction (X direction) and overlap each of the plurality of first pads 171 of the first pad portion PP1. For example, the plurality of second pads included in the second pad portion PP2 may be divided (classified) into a plurality of second data pads, a plurality of second pixel driving power pads, and a plurality of second pixel common power pads, but not limited thereto. Accordingly, the second pad portion PP2 may include: a second data pad portion having a plurality of second data pads, a second strobe pad portion having a plurality of second strobe pads, a second pixel driving power pad portion having a plurality of second pixel driving power pads, and a second pixel common power pad portion having a plurality of second pixel common power pads, but not limited thereto. Optionally, the plurality of second pads may also include a plurality of second reference power pads. Accordingly, the second pad portion PP2 may also include a second reference power pad portion having a plurality of second reference power pads.

[0108] For example, the second pad may be made of a Ti / Cu double-layer film suitable for a laser welding process, but is not limited thereto.

[0109] For example, a plurality of second strobe pads may be divided into (or classified into) a second start signal pad, a plurality of second shift clock pads, at least one second strobe drive power pad, and at least one second strobe common power pad. Accordingly, the second strobe pad portion may include a second start signal pad, a plurality of second shift clock pads, at least one second strobe drive power pad, and at least one second strobe common power pad. For example, a plurality of second shift clock pads may be divided (or classified) into a plurality of second scan clock pads and a plurality of second carry clock pads, but is not limited thereto. Here, a plurality of second carry clock pads may be omitted.

[0110] In addition, a plurality of wirings 175 may be provided on the lower side of the display panel 100 to surround the outer surface of the first substrate 110. The wiring 175 according to the exemplary embodiment may be provided on a first outer surface (or one side surface) among the outer surfaces of the first substrate 110. Here, the first outer surface may be an outer surface adjacent to the first edge portion (or the lower side) of the first substrate 110, but is not limited thereto. The wiring 175 may be provided to surround the first outer surface of the first substrate 110. For example, the wiring 175 may be provided to surround the outer surface adjacent to the first edge portion (or the lower side) of the first substrate 110. In addition, the wiring 175 may be provided to surround another outer surface of the first substrate 110.

[0111] For example, each of the plurality of wirings 175 may be connected one-to-one (or individually) to a pixel driving line disposed on the first substrate 110 to be directly connected to the pixel driving line. As another example, each of the plurality of wirings 175 may be connected one-to-one (or individually) to a pixel driving line disposed on the first substrate 110 through a plurality of pads 171 of the first pad portion PP1 disposed on the first substrate 110. In this case, due to the increased size of the pads 171, the resistance of the pixel driving line and / or the voltage drop of a signal applied to the pixel driving line may be reduced.

[0112] The plurality of wirings 175 according to an exemplary embodiment may be divided (or classified) into a plurality of data wirings, a plurality of gate wirings, a plurality of pixel driving power wirings, and a plurality of pixel common power wirings, but is not limited thereto.

[0113] Each of the plurality of data wirings may individually (or one-to-one) connect each of the plurality of first data pads provided in the first pad portion PP1 and each of the plurality of second data pads provided in the second pad portion PP2, but is not limited thereto.

[0114] Each of the plurality of gate wirings may individually (or one-to-one) connect each of the plurality of first gate pads provided in the first pad portion PP1 and each of the plurality of second gate pads provided in the second pad portion PP2, but is not limited thereto.

[0115] Each of the plurality of pixel driving power wirings may individually (or one-to-one) connect each of the plurality of first pixel driving power pads in the first pad portion PP1 and each of the plurality of second pixel driving power pads in the second pad portion PP2, but is not limited thereto.

[0116] Each of the plurality of pixel common power wirings may individually (or one-to-one) connect each of the plurality of first pixel common power pads provided in the first pad portion PP1 and each of the plurality of second pixel common power pads provided in the second pad portion PP2, but is not limited thereto.

[0117] According to the exemplary embodiment, a plurality of gating wirings can be divided (or classified) into a start signal wiring, a plurality of shift clock wirings, at least one gating drive power wiring, and at least one gating common power wiring. According to the exemplary embodiment, a plurality of shift clock wirings can be divided (or classified) into a plurality of scan clock wirings and a plurality of carry clock wirings. Here, a plurality of carry clock wirings can be omitted. Therefore, a plurality of shift clocks can be divided (or classified) into a plurality of scan clocks and a plurality of carry clocks, but is not limited thereto. Here, a plurality of carry clocks can be omitted.

[0118] In addition, the start signal wiring may electrically connect a first start signal pad provided in the first pad portion PP1 and a second start signal pad provided in the second pad portion PP2.

[0119] Each of the plurality of shift clock wirings may individually (or one-to-one) connect each of the plurality of first shift clock pads provided in the first pad portion PP1 and each of the plurality of second shift clock pads provided in the second pad portion PP2, but is not limited thereto.

[0120] Among the multiple shift clock wirings according to an exemplary embodiment, each of the multiple scan clock wirings can be individually (or one-to-one) connected to each of the multiple first scan clock pads set in the first pad portion PP1 and each of the multiple second scan clock pads set in the second pad portion PP2, but is not limited to this.

[0121] Among the plurality of shift clock wirings according to the exemplary embodiment, each of the plurality of carry clock wirings may connect each of the plurality of first carry clock pads provided in the first pad portion PP1 and each of the plurality of second carry clock pads provided in the second pad portion PP2 individually (or one-to-one). In addition, the plurality of carry clock wirings may be omitted.

[0122] In addition, at least one gate driving power wiring may electrically connect at least one first gate driving power pad provided in the first pad portion PP1 and at least one second gate driving power pad provided in the second pad portion PP2.

[0123] In addition, at least one gate common power wiring may electrically connect at least one first gate common power pad provided in the first pad portion PP1 and at least one second gate common power pad provided in the second pad portion PP2.

[0124] Each of the plurality of pixel driving power wirings may individually (or one-to-one) connect each of the plurality of first pixel driving power pads provided in the first pad portion PP1 and each of the plurality of second pixel driving power pads provided in the second pad portion PP2 .

[0125] Each of the plurality of pixel common power wirings may individually (or one-to-one) connect each of the plurality of first pixel common power pads provided in the first pad portion PP1 and each of the plurality of second pixel common power pads provided in the second pad portion PP2 .

[0126] Each of the plurality of reference power wirings may individually (or one-to-one) connect each of the plurality of first reference power pads provided in the first pad portion PP1 and each of the plurality of second reference power pads provided in the second pad portion PP2 .

[0127] In addition, the display device according to the exemplary embodiment may further include a third pad portion (or input pad portion) PP3, a wiring portion WP, and a link line portion LLP disposed on the wiring substrate 160, but is not limited thereto.

[0128] The third pad portion PP3 may be disposed at a first edge portion of the wiring substrate 160. For example, the third pad portion PP3 may be disposed at a lower side of the wiring substrate 160, but is not limited thereto. For example, the third pad portion PP3 may be disposed at a first edge portion (lower side) of an upper surface of the wiring substrate 160. For example, the third pad portion PP3 may include a plurality of third pads (or input pads) 183 that are spaced apart from each other to have a predetermined interval.

[0129] like Figure 3As shown, the wiring portion WP may be provided between the second pad portion PP2 and the link line portion LLP.

[0130] For example, the wiring part WP may include a plurality of connection lines 181 that connect the second pads of the second pad part PP2 and the link lines 182 of the link line part LLP individually (or one-to-one). The plurality of connection lines 181 are disposed between the second pad part PP2 and the link lines 182 of the link line part LLP.

[0131] The link line portion LLP may be provided between the wiring portion WP and the third pad portion PP3 .

[0132] For example, the link line portion LLP may include a plurality of link lines 182 that individually (or one-to-one) connect the connection line 181 of the wiring portion WP and the third pad 183 of the third pad portion PP3. For example, the plurality of link lines 182 may have a fan-shaped shape extending from the third pad portion PP3 toward the wiring portion WP. The plurality of link lines 182 are arranged between the wiring portion WP and the third pad 183 of the third pad portion PP3.

[0133] The display device according to the exemplary embodiment of the present disclosure may further include a driving circuit unit for driving the display panel.

[0134] The driving circuit unit drives the pixels (or light emission) disposed on the first substrate 110 based on the digital image data and synchronization signals supplied from the display driving system to display an image corresponding to the image data in the active area. The driving circuit unit includes, but is not limited to, a data driving circuit, a gate driving circuit, a display controller, and other circuit components. The driving circuit unit is connected to the third pad portion PP3 disposed on the first edge portion of the wiring substrate 160, and can output data signals, gate control signals, and driving power for driving the pixels (or light emission) disposed on the first substrate 110 to the third pad portion PP3. For example, the driving circuit unit is disposed outside the wiring substrate 160, so that an island-shaped transparent display device can be provided without forming a dead zone in the display device, but is not limited thereto.

[0135] That is, when the transparent display panel is simply attached to the mounting glass plate, the bonding area of ​​the driving integrated circuit IC, the printed circuit board, etc. exists inside the glass plate, which may result in a visually opaque dead zone. In addition, since the position of the display panel and the dead zone is fixed, the design may be restricted.

[0136] Therefore, according to an exemplary embodiment of the present disclosure, the wiring substrate 160 into which the signal is introduced is configured separately from the printed circuit board, and the signal is applied to the display panel 100 through the connection line 181 on the wiring substrate 160. Therefore, a transparent display device having an island shape without forming an opaque dead zone can be manufactured. Therefore, there is no design restriction caused by the dead zone, thereby reducing the manufacturing cost. Further, the source printed circuit board and the driver IC can be arranged on the outermost frame of the display device so that the entire transparent display panel 100 has uniform transparency. For reference, a transparent display device is a display device equipped with a transparent or translucent surface, and the display device can provide a function that allows the user to check the background while viewing the content displayed on the transparent display panel 100. The transparent display device can be applied to various fields, such as smart devices, windows, exhibition halls, advertising displays, and can expand new industries and application fields with the development of future technology.

[0137] According to an exemplary embodiment of the present disclosure, the spacing of the connection lines 181 on the wiring substrate 160 is set to be constant, and the connection lines 181 are formed over the entire area of ​​the wiring substrate 160 to actively respond to the position change of the display panel 100, thereby ensuring the degree of freedom of the attachment position of the transparent display panel 100. This will refer to Figures 5 to 7 Describe in more detail.

[0138] Figure 5 is a perspective view showing placement of a plurality of transparent display panels as an example in a display device according to an exemplary embodiment of the present disclosure.

[0139] Figure 6 It is shown Figure 5 A view of a cross section of a display device.

[0140] Figure 7 Is magnification Figure 6 View of section A.

[0141] Figure 5 An example is shown in which two display panels 100a and 100b are horizontally arranged on one wiring substrate 160, but it is not limited thereto. Other numbers of display panels are also possible.

[0142] Figure 6 Shown along Figure 5 A portion of a cross section taken along a connection line 181 of a display device is shown as an example. Figure 6 2A and 2B show a cross section of the first display panel 100 a or the second display panel 100 b , but for convenience of description, the first display panel 100 a and the second display panel 100 b are referred to as display panels 100 .

[0143] Reference Figures 5 to 7 , the display device according to the exemplary embodiment of the present disclosure may include, for example, two display panels (100a, 100b: 100) and one wiring substrate 160 disposed on the rear surface of the display panel (100a, 100b: 100), but is not limited thereto. However, the present disclosure is not limited to the number of display panels (100a, 100b: 100) and the wiring substrate 160. In addition, the display device according to the exemplary embodiment of the present disclosure may include, for example, an adhesive layer 106 disposed between the display panel 100 and the wiring substrate 160.

[0144] For example, the display panel (100a, 100b: 100) may include a first display panel 100a and a second display panel 100b. For example, the display panel (100a, 100b: 100) may be a first display panel 100a and a second display panel 100b arranged in sequence in a horizontal direction, but is not limited thereto. The first display panel 100a and the second display panel 100b may have the same size or different sizes. The first display panel 100a and the second display panel 100b may be arranged at the same height or at different heights. The attachment positions of the first display panel 100a and the second display panel 100b in the upper, lower, left and right directions may be freely changed. The formation positions of the link lines 182a and 182b and the third pads 183a and 183b corresponding to (belonging to) the first display panel 100a and the second display panel 100b may be changed according to the selected attachment position.

[0145] As described above, the connecting wires 181 are arranged at a predetermined interval on the entire surface of the wiring substrate 160 so that a margin can be left to actively respond to the position change of the first display panel 100a and the second display panel 100b and ensure the freedom of the attachment position of the first display panel 100a and the second display panel 100b.

[0146] The left and right positions of the first and second display panels 100 a and 100 b may be adjusted to set an integral multiple of the pitch of the connection lines 181 of the wiring substrate 160 , and the attachment position of the flexible film 195 may also be adjusted together.

[0147] The display panel 100 is a panel for displaying an image to a user. The display panel 100 may include an active area allowing an image to be displayed and an inactive area not displaying an image.

[0148] Figure 5 The lower side of may be defined as a data pad portion connected to the flexible film 195 through the connection line 181, but is not limited thereto. For example, a gate pad portion may also be included in the data pad portion of the lower side.

[0149] The flexible film 195 is a film that supplies signals to a plurality of sub-pixels and circuits in the active area, and may be electrically connected to the wiring substrate 160. The flexible film 195 is disposed at one end of the wiring substrate 160 to supply power voltage and data voltage to a plurality of sub-pixels and circuits in the active area through a plurality of connection lines 181. For example, the flexible film 195 may be disposed at the lower end of the wiring substrate 160 to supply power voltage and data voltage to a plurality of sub-pixels and circuits in the active area through a plurality of connection lines 181, but is not limited thereto. For example, a driver IC such as a data driver IC may be disposed on the flexible film 195.

[0150] The connection line 181 may be configured of a metal material having low resistance, low reflectivity, and high transmittance, but is not limited thereto. According to an exemplary embodiment of the present disclosure, the connection line 181 may extend to the rear surface of the display panel 100 to overlap a portion of the display panel 100. In addition, the connection line 181 may be provided to have a constant pitch.

[0151] An insulating layer 108 may be disposed on the connection line 181. The insulating layer 108 may be disposed to insulate the connection line 181 from a configuration above the connection line 181, and may be configured of, for example, a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0152] The flexible film 195 may be a tape carrier package (TCP) or a chip on film (COF). As an example, one edge portion (or output bonding unit) of the flexible film 195 may be attached to a plurality of third pads (or input pads) 183 provided on the wiring substrate 160. At this time, for example, one edge portion (or output bonding unit) of the flexible film 195 may be attached to a plurality of third pads (or input pads) 183 provided on the wiring substrate 160 by a film attachment process using an anisotropic conductive film, but is not limited thereto. In addition, the other edge portion (or input bonding unit) of the flexible film 195 may be attached to the printed circuit board 190. For example, the other edge portion (or input bonding unit) of the flexible film 195 may be attached to the printed circuit board 190 by a film attachment process using an anisotropic conductive film, but is not limited thereto.

[0153] The printed circuit board 190 is disposed at one end of the flexible film 195 to be connected to the flexible film 195. For example, the printed circuit board 190 may be disposed at the lower end of the flexible film 195 to be connected to the flexible film 195. The printed circuit board 190 is a component that supplies a signal to the driving IC. For example, the printed circuit board 190 may supply various signals such as a driving signal or a data signal to the driving IC.

[0154] As described above, each display panel (100a, 100b: 100) according to the exemplary embodiment of the present disclosure may include a first substrate (110a, 110b: 110), a second substrate (150a, 150b: 150), an element unit 140, and wirings (175a, 175b: 175), etc. The element unit 140 may be interposed between the first substrate 110 and the second substrate 150 so as to couple the second substrate 150 to the first substrate 110. The first substrate 110 and the second substrate 150 may be coupled to each other oppositely through the element unit 140.

[0155] That is, for example, the first display panel 100a may include a first first substrate 110a, a first second substrate 150a, an element unit 140, and a first wiring 175a, and the second display panel 100b may include a second first substrate 110b, a second second substrate 150b, an element unit 140, and a second wiring 175b.

[0156] That is, for example, the element unit 140 can be inserted between the first first substrate 110a and the first second substrate 150a to combine the first first substrate 110a to the first second substrate 150a, and another element unit 140 can also be inserted between the second first substrate 110b and the second second substrate 150b to combine the second first substrate 110b to the second second substrate 150b.

[0157] As described above, for the convenience of description below, when the first substrate 110 is mentioned, it includes the first first substrate 110a and the second first substrate 110b, and when the second substrate 150 is mentioned, it includes the first second substrate 150a and the second second substrate 150b. When the display panel 100 is mentioned, it includes the first display panel 100a and the second display panel 100b.

[0158] The first substrate 110 may also be represented as a display substrate, a pixel array substrate, a lower substrate or a base substrate, but is not limited thereto.

[0159] Each of the display panels 100 may include a plurality of pixels disposed on a first substrate 110 and pixel driving lines for driving the plurality of pixels.

[0160] Each pixel driving line may be electrically connected to a plurality of first pads 171 included in a first pad portion PP1 disposed in a first edge portion (or a lower side) of a first surface (or an upper surface) of the first substrate 110 .

[0161] For example, the plurality of first pads 171 included in the first pad portion PP1 may be divided (classified) into a plurality of first data pads, a plurality of first pixel driving power pads, and a plurality of first pixel common power pads, but is not limited thereto.

[0162] As an example, the second substrate 150 may be represented as an encapsulation substrate, an upper substrate, or an encapsulation glass, but is not limited thereto. The second substrate 150 may be formed of a glass material or a plastic material, but is not limited thereto. For example, the second substrate 150 may be formed of the same material as the first substrate 110, but is not limited thereto. In addition, the second substrate 150 may be formed of a material different from that of the first substrate 110. For example, the size of the second substrate 150 is smaller than that of the first substrate 110 to expose the first substrate 110, and a plurality of first pads 171 may be located on the first surface of the exposed first substrate 110.

[0163] The second substrate 150 may be coupled (or bonded) to the first substrate 110. For example, the second substrate 150 may be coupled (or bonded) to the first surface of the first substrate 110 through the element unit 140. The second substrate 150 may include a first surface facing the first substrate 110 or a rear surface (or back surface) coupled to the element unit 140, a front surface opposite to the rear surface, an outer surface between the front surface and the rear surface, and the like.

[0164] The element unit 140 may be interposed between the first substrate 110 and the second substrate 150 so as to bond the second substrate 150 to the first substrate 110. For example, the element unit 140 may be configured by a TFT element layer including a thin film transistor, a light emitting diode layer including a light emitting diode, and an encapsulation layer including an adhesive film, but is not limited thereto. The first substrate 110 and the second substrate 150 may be bonded relative to each other through the element unit 140. That is, for example, the first surface of the first substrate 110 may be coupled to one surface of the element unit 140, and the rear surface of the second substrate 150 may be coupled to the other surface of the element unit 140. Therefore, the first substrate 110 and the second substrate 150 bonded (or coupled) to each other through the element unit 140 may constitute the display panel 100.

[0165] Meanwhile, the wiring substrate 160 may be disposed on the rear surface of the display panel 100 through the adhesive layer 106. The wiring substrate 160 may be formed of a glass material or a plastic material, but is not limited thereto. In addition, the wiring substrate 160 may be formed of a flexible polymer film. The wiring substrate 160 may be a glass substrate or a flexible polymer film, or may be a bendable thin glass substrate or a plastic substrate. For example, the wiring substrate 160 may be a glass substrate or a tempered glass. For example, the wiring substrate 160 may be formed of the same material as the first substrate 110, but is not limited thereto. In addition, the wiring substrate 160 may be formed of a material different from the first substrate 110. For example, the size of the wiring substrate 160 may be larger than the size of the display panel 100, so that the wiring substrate 160 may be exposed. The wiring substrate 160 may perform the functions of transmitting signals to the pixel drive lines and increasing the rigidity of the display panel 100. For example, the transmittance of the wiring substrate 160 may be adjusted according to the specifications of the display panel 100.

[0166] The adhesive layer 106 may be interposed between the display panel 100 and the wiring substrate 160 so as to bond the display panel 100 to the wiring substrate 160. The display panel 100 and the wiring substrate 160 may be bonded relative to each other through the adhesive layer 106. For example, the second surface (or rear surface) of the first substrate 110 of the display panel 100 may be coupled to one surface of the adhesive layer 106, and the upper surface of the wiring substrate 160 may be coupled to the other surface of the adhesive layer 106. Therefore, the display panel 100 and the wiring substrate 160 bonded (or coupled) to each other through the adhesive layer 106 may constitute a transparent display device having an island shape.

[0167] For example, the display device according to the exemplary embodiment of the present disclosure may include a second pad portion PP2 (refer to Figure 3 For example, the second pad portion PP2 may be disposed on the upper surface of the wiring substrate 160, and the second pad portion PP2 may be disposed on the first pad portion PP1 disposed on the first substrate 110 (see Figure 3 )overlap.

[0168] The second pad portion PP2 may include a plurality of second pads 185, the plurality of second pads 185 being arranged along a first direction (X direction, refer to Figure 3 ) are arranged at a constant interval and overlap each of the plurality of first pads 171 of the first pad portion PP1. For example, the plurality of second pads 185 included in the second pad portion PP2 may be divided (classified) into a plurality of second data pads, a plurality of second pixel driving power pads, and a plurality of second pixel common power pads, but is not limited thereto.

[0169] For example, the second pad 185 may be formed of a Ti / Cu double film suitable for a laser welding process, but is not limited thereto.

[0170] A plurality of wirings 175 may be provided at the lower side of the display panel 100 so as to surround the outer surface of the first substrate 110, so that a step supplementary layer 107 considering a step may be provided. For example, the step supplementary layer 107 may be configured of a photo acrylic (PAC) organic insulating layer, but is not limited thereto.

[0171] Therefore, a plurality of second pads 185 are disposed on the upper surface of the step supplementary layer 107 and extend along the inclined side surface of the step supplementary layer 107 to be electrically connected to the connection line 181 thereunder. For example, the second pads 185 may be electrically connected to the connection line 181 disposed below the insulation layer 108 through a contact hole formed in the insulation layer 108.

[0172] Meanwhile, the display device according to the exemplary embodiment of the present disclosure may further include a support layer 105, which is disposed between the display panel 100 and the wiring substrate 160 to maintain a constant gap between the display panel 100 and the wiring substrate 160. Specifically, the support layer 105 may be disposed between the first substrate 110 and the insulating layer 108. For example, the support layer 105 may be dispersed in the adhesive layer 106. The support layer 105 may be a columnar spacer. For example, the support layer 105 may be formed of the same material as the step supplementary layer 107, but is not limited thereto. For example, the support layer 105 may be configured of a photo acrylic (PAC) organic insulating layer, but is not limited thereto.

[0173] For example, after attaching the first display panel 100a and the second display panel 100b to the wiring substrate 160, in order to strengthen the connection between the wiring (175a, 175b: 175) and the second pad 185, solder paste 177 can also be applied between the side surface of the wiring (175a, 175b: 175) and the upper surface of the second pad 185, but is not limited to this.

[0174] For example, after applying the solder paste 177 , an infrared continuous wave (CW) laser with a wavelength of about 1064 mm may be used for reflow to reinforce the connection between the wiring ( 175 a , 175 b : 175 ) and the second pad 185 .

[0175] In addition, for example, a sealant 178 may be applied to cover the wiring (175a, 175b: 175), the second pad 185, a portion of the upper surface of the wiring substrate 160, and a portion of the lower side of the display panel 100 (including the solder paste 177). For example, the sealant 178 may be formed of a transparent organic material, but is not limited thereto.

[0176] Meanwhile, the structure of a sub-pixel of a display panel in a display device according to an exemplary embodiment of the present disclosure configured as described above will be described in detail with reference to the accompanying drawings.

[0177] Figure 8 It is shown Figure 6 FIG. 1 is a view of a cross section of a sub-pixel of a display panel.

[0178] For ease of description, Figure 8 In the figure, only the capacitor in the sub-pixel and the driving transistor 130b among the plurality of transistors are shown (the above Figure 2 DR).

[0179] Reference Figure 8 The first substrate 110 is a support member for supporting other components of the display device and may be configured of an insulating material, but is not limited thereto.

[0180] The first substrate 110 may be divided into an active area allowing an image to be displayed and an inactive area not displaying an image.

[0181] In the active region of the first substrate 110, a driving transistor 130b, a light emitting diode 120, an adhesive film 140b, etc. may be disposed. The adhesive film 140b may constitute an encapsulation layer.

[0182] A buffer layer 111 may be disposed over the first substrate 110 .

[0183] The driving transistor 130 b may be disposed over the buffer layer 111 .

[0184] Although not shown, a switching transistor may be disposed above the buffer layer 111, but is not limited thereto. In addition, other sensing transistors, compensation circuits, etc. may also be disposed on the display panel.

[0185] The switching transistor disposed over the buffer layer 111 may include a first gate electrode, a first source electrode, a first drain electrode, and a first semiconductor layer.

[0186] The driving transistor 130 b disposed over the buffer layer 111 may include a second gate electrode 131 b , a second source electrode 132 b , a second drain electrode 133 b , and a second semiconductor layer 134 b .

[0187] The gate insulating layer 112 may be disposed on the second semiconductor layer 134 b of the driving transistor 130 b. In addition, the gate insulating layer 112 may be disposed on a portion of the buffer layer 111 .

[0188] The second gate electrode 131 b may be disposed on the gate insulating layer 112 .

[0189] The interlayer insulating layer 113 may be disposed between the second gate electrode 131 b and the second source electrode 132 b and the second drain electrode 133 b. In addition, the interlayer insulating layer 113 may be disposed on a portion of the gate insulating layer 112 .

[0190] The second source electrode 132 b and the second drain electrode 133 b may be disposed over the interlayer insulating layer 113 .

[0191] The protective layer 114 may be disposed on the driving transistor 130 b. In addition, the protective layer 114 may be disposed on the interlayer insulating layer 113.

[0192] The planarization layer 115 may be disposed on the protection layer 114. The planarization layer 115 may be configured to protect the driving transistor 130b and planarize a step caused by the driving transistor 130b.

[0193] A plurality of light emitting diodes 120 may be disposed in a plurality of sub-pixels on the planarization layer 115. The light emitting diode 120 may include an anode 121, an organic layer 122, and a cathode 123.

[0194] The organic layer 122 may be disposed between the anode 121 and the cathode 123 .

[0195] The organic layer 122 is a region that emits light by recombination of electrons and holes supplied from the anode 121 and the cathode 123. For example, the organic layer 122 may include one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL), but the present disclosure is not limited thereto.

[0196] A bank 116 may be provided on the anode 121 and the planarization layer 115. The bank 116 is used to define a sub-pixel. Therefore, the bank 116 may be made of an insulating material including a black material. The bank 116 may be made of, for example, a transparent carbon-based mixture. Specifically, the bank BNK may include carbon black, but is not limited thereto. The bank 116 may also be made of a transparent insulating material.

[0197] An organic layer 122 may be disposed on the anode 121 and the bank 116 .

[0198] A cathode 123 may be disposed on the organic layer 122 .

[0199] The protective layer 140a may be disposed over the first substrate 110 on which the cathode 123 is disposed. That is, the protective layer 140a may be disposed on the cathode 123.

[0200] The adhesive film 140b and the second substrate 150 may be sequentially disposed on the protective layer 140a. However, the display device according to the exemplary embodiment of the present disclosure is not limited to such a laminated structure.

[0201] The adhesive film 140 b may be disposed on the protective layer 140 a , and the second substrate 150 may be disposed on the adhesive film 140 b .

[0202] The second substrate 150 may protect the light emitting diode 120 of the pixel unit together with the adhesive film 140 b , but is not limited thereto.

[0203] Hereinafter, a transparent pixel structure for implementing a transparent display panel and a transparent display device will be described in detail with reference to the accompanying drawings.

[0204] Fig. 9 and Fig.10 is a view showing a pixel structure as an example.

[0205] Fig. 9 and Fig.10 A transparent pixel structure of a transparent display device according to an exemplary embodiment is shown as an example. Fig. 9 shows a transparent pixel structure of a transparent pixel, and Fig.10 Four transparent pixels are shown as an example.

[0206] Reference Fig. 9 , one transparent pixel may be composed of a sub-pixel area SPA in which k sub-pixels SP_1 , SP_2 , . . . , SP_k representing different colors are formed and a transparent area TA.

[0207] Here, k indicating the number of sub-pixels included in one transparent pixel may be 3 or 4, and in some cases, may be a natural number of 2 or 5 or more. However, the present disclosure is not limited thereto.

[0208] In one transparent pixel, the sub-pixels SP_1, SP_2, . . . , SP_k may be adjacently disposed in the first direction. The plurality of data lines DL and the plurality of gate lines GL may intersect each other.

[0209] The transparent area TA may be disposed adjacent to the sub-pixel area SPA in the second direction. That is, the transparent area TA may be disposed adjacent to one or more sub-pixels SP_1, SP_2, . . . , SP_k in the second direction different from the first direction.

[0210] As described above, each transparent pixel includes a transparent area TA, so that the transparent pixel has a transparent structure. The transparent display panel and the transparent display device according to the exemplary embodiment may be implemented by a transparent pixel structure. However, the present disclosure is not limited thereto.

[0211] For example, in each transparent pixel, the height Hta of the transparent area TA may correspond to or be similar to the height Hspa of the sub-pixel area SPA, and the width Wta of the transparent area TA may be narrower than, equal to, or greater than the width Wspa of the sub-pixel area SPA. Preferably, the width Wta of the transparent area TA may be set to be greater than the width Wspa of the sub-pixel area SPA, but is not limited thereto. Here, the ratio (Ata / Aspa) between the size of the transparent area TA (Ata=Wta×Hta) determined by the width W and the height H and the size of the sub-pixel area SPA (Aspa=Wspa×Hspa) may be determined by at least one of the transmittance and the resolution of the transparent display device.

[0212] At this time, since the size Ata of the transparent area TA is larger than the size Aspa of the sub-pixel area SPA, that is, since the ratio (Ata / Aspa) between the size of the transparent area TA (Ata=Wta×Hta) and the size of the sub-pixel area SPA (Aspa=Wspa×Hspa) increases, the transparency of the transparent pixel can be improved and the transparency of the transparent display device can be improved.

[0213] Fig.10 It shows that Fig. 9 A view of four transparent pixels P1, P2, P3, P4 of a transparent pixel structure. The first transparent pixel P1 and the second transparent pixel P2 can be arranged adjacent to each other in the first direction, and the third transparent pixel P3 and the fourth transparent pixel P4 can also be arranged adjacent to each other in the first direction, but are not limited thereto. The first transparent pixel P1 and the third transparent pixel P3 can be arranged adjacent to each other in the second direction, and the second transparent pixel P2 and the fourth transparent pixel P4 can also be arranged adjacent to each other in the second direction, but are not limited thereto. More or fewer transparent pixels are also possible.

[0214] For example, the first direction may be a row direction or a horizontal direction, and the second direction may be a column direction or a vertical direction, but is not limited thereto. In another example, the first direction may be a column direction or a vertical direction, and the second direction may be a row direction or a horizontal direction.

[0215] Reference Fig.10 , the first transparent pixel P1 may include a plurality of sub-pixels and a transparent area, but is not limited thereto. For example, the first transparent pixel P1 may be composed of k first sub-pixels SP_11, SP_12, ..., SP_1k formed in the sub-pixel area SPA and adjacent in the first direction, and a first transparent area TA_1 disposed adjacent to the sub-pixel area SPA in the second direction.

[0216] Reference Fig.10, the second transparent pixel P2 adjacent to the first transparent pixel P1 in the first direction may include a plurality of sub-pixels and transparent areas, but is not limited thereto. For example, the second transparent pixel P2 may be composed of k second sub-pixels SP_21, SP_22, ..., SP_2k formed in the sub-pixel area SPA and adjacent in the first direction, and a second transparent area TA_2 disposed adjacent to the sub-pixel area SPA in the second direction.

[0217] Reference Fig.10 , the third transparent pixel P3 adjacent to the first transparent pixel P1 in the second direction may include a plurality of sub-pixels and transparent areas, but is not limited thereto. For example, the third transparent pixel P3 may be composed of k third sub-pixels SP_31, SP_32, ..., SP_3k formed in the sub-pixel area SPA and adjacent in the first direction, and a third transparent area TA_3 disposed adjacent to the sub-pixel area SPA in the second direction.

[0218] Reference Fig.10 , the fourth transparent pixel P4 adjacent to the third transparent pixel P3 in the first direction may include a plurality of sub-pixels and transparent areas, but is not limited thereto. For example, the fourth transparent pixel P4 may be composed of k fourth sub-pixels SP_41, SP_42, ..., SP_4k formed in the sub-pixel area SPA and adjacent in the first direction, and a fourth transparent area TA_4 disposed adjacent to the sub-pixel area SPA in the second direction.

[0219] The transparent areas TA_1 and TA_2 of the first and second transparent pixels P1 and P2 adjacent in the first direction may be disposed adjacent to each other in the first direction. In addition, the transparent areas TA_3 and TA_4 of the third and fourth transparent pixels P3 and P4 adjacent in the first direction may be disposed adjacent to each other in the first direction.

[0220] Meanwhile, according to another exemplary embodiment of the present disclosure, a plurality of display panels may be disposed on the wiring substrate not only in the left-right direction but also in the up-down direction, which will be described in detail with reference to the accompanying drawings.

[0221] Fig.11 is a perspective view illustrating placement of a plurality of transparent display panels as an example in a display device according to another exemplary embodiment of the present disclosure.

[0222] according to Fig.11 A display device according to another exemplary embodiment of the present disclosure is composed of the above Figures 5 to 7The display device of the exemplary embodiment is formed with substantially the same configuration except that a plurality of display panels (200a, 200b, 200c: 200) are provided not only in the left-right direction but also in the up-down direction on the wiring substrate 260. Therefore, the same configuration is denoted by the same reference numerals, and a description thereof will be omitted or briefly given.

[0223] Fig.11 An example is shown in which two display panels 200 a and 200 b are disposed on one wiring substrate 260 in a horizontal direction (or left and right) and one display panel 200 c is disposed above the two display panels 200 a and 200 b , but exemplary embodiments are not limited thereto.

[0224] Reference Fig.11 , a display device according to another exemplary embodiment of the present disclosure may include three display panels ( 200 a , 200 b , 200 c : 200 ) and one wiring substrate 260 disposed on rear surfaces of the display panels ( 200 a , 200 b , 200 c : 200 ).

[0225] For example, the display panel (200a, 200b, 200c: 200) may include a first display panel 200a and a second display panel 200b arranged in sequence in the horizontal direction. In addition, for example, the display panel (200a, 200b, 200c: 200) may also include a third display panel 200c arranged above the first display panel 200a and the second display panel 200b, but is not limited thereto. Other numbers of display panels are also possible. The first display panel 200a and the second display panel 200b may be lower display panels, and the third display panel 200c may be an upper display panel.

[0226] For example, the first display panel 200a, the second display panel 200b, and the third display panel 200c may have the same size or different sizes. In addition, the first display panel 200a and the second display panel 200b may be arranged at the same height or at different heights. The attachment positions of the first display panel 200a and the second display panel 200b in the upper, lower, left, and right directions may be freely changed.

[0227] For example, in Fig.11 The first display panel 200a and the second display panel 200b may be electrically connected to at least one first flexible film and at least one second flexible film through a plurality of first connection lines 281a. Fig.11 On the upper side of the third display panel 200c, the third display panel 200c may be electrically connected to at least one third flexible film through a plurality of second connection lines 281b.

[0228] The first flexible film, the second flexible film, and the third flexible film are respectively disposed at one end and the other end of the wiring substrate 260 to supply power voltage and data voltage to a plurality of sub-pixels and circuits in the active regions of the first display panel 200a, the second display panel 200b, and the third display panel 200c through a plurality of first connection lines 281a and a plurality of second connection lines 281b. Specifically, the first flexible film and the second flexible film may be disposed on the lower side of the wiring substrate 260, and the third flexible film may be disposed on the upper side of the wiring substrate 160.

[0229] For example, the first connection line 281 a and the second connection line 281 b may be configured of a metal material having low resistance, low reflectivity, and high transmittance, but is not limited thereto.

[0230] According to another embodiment of the present disclosure, the first connection line 281a may extend to the rear surface of the first display panel 200a and the second display panel 200b so as to overlap with a portion of the first display panel 200a and the second display panel 200b. The second connection line 281b may extend to the rear surface of the third display panel 200c so as to overlap with a portion of the third display panel 200c. In addition, the first connection line 281a and the second connection line 281b may be arranged to have a constant spacing.

[0231] The first flexible film, the second flexible film, and the third flexible film may be a tape carrier package (TCP) or a chip on film (COF). As an example, one edge portion (or output bonding unit) of the first flexible film may be attached to a plurality of first and third pads (or input pads) 283a provided on the wiring substrate 260. At this time, for example, one edge portion (or output bonding unit) of the first flexible film may be attached to a plurality of first and third pads (or input pads) 283a provided on the wiring substrate 260 by a film attachment process using an anisotropic conductive film, but is not limited thereto. In addition, another edge portion (or input bonding unit) of the first flexible film may be attached to the first printed circuit board. For example, another edge portion (or input bonding unit) of the first flexible film may be attached to the first printed circuit board by a film attachment process using an anisotropic conductive film, but is not limited thereto. For example, one edge portion (or output bonding unit) of the second flexible film may be attached to a plurality of second and third pads (or input pads) 283b provided on the wiring substrate 260. In addition, the other edge portion (or input bonding unit) of the second flexible film may be attached to the second printed circuit board. For example, one edge portion (or output bonding unit) of the third flexible film may be attached to a plurality of third third pads (or input pads) 283c provided on the wiring substrate 260. In addition, the other edge portion (or input bonding unit) of the third flexible film may be attached to the third printed circuit board. For example, the first printed circuit board and the second printed circuit board may be configured by one printed circuit board.

[0232] For example, a plurality of first link lines 282a may connect a plurality of first connection lines 281a and a first third pad 283a individually (or one-to-one). For example, a plurality of second link lines 282b may connect a plurality of first connection lines 281a and a second third pad 283b individually (or one-to-one). For example, a plurality of third link lines 282c may connect a plurality of second connection lines 281b and a third third pad 283c individually (or one-to-one).

[0233] As described above, each display panel (200a, 200b, 200c: 200) according to another exemplary embodiment of the present disclosure may include a first substrate 210a, 210b, 210c, a second substrate 250a, 250b, 250c, an element unit, and wirings 275a, 275b, 275c, but is not limited thereto.

[0234] That is, for example, the first display panel 200a may include a first first substrate 210a, a first second substrate 250a, an element unit, and a first wiring 275a. That is, for example, the second display panel 200b may include a second first substrate 210b, a second second substrate 250b, an element unit, and a second wiring 275b. In addition, for example, the third display panel 200c may include a third first substrate 210c, a third second substrate 250c, an element unit, and a third wiring 275c.

[0235] Meanwhile, according to another exemplary embodiment of the present disclosure, the wiring is arranged on the lower surface of the first substrate to cover the upper surface of the second substrate. Therefore, the display panel can be attached not only to the upper surface of the wiring substrate but also to the rear surface thereof, which will be described in detail below in conjunction with the accompanying drawings.

[0236] Fig.12 is a perspective view showing a display device according to still another embodiment of the present disclosure.

[0237] Fig.13A and Fig. 13B It is shown Fig.12 A view of a cross section of a display device.

[0238] Fig.12 , Fig.13A and Fig. 13B A display device according to another exemplary embodiment of the present disclosure is composed of Figures 5 to 7The display device of the exemplary embodiment is configured with substantially the same configuration, except that wirings 375a and 375b are provided on the lower surface of the first substrate 310 to cover the upper surface of the second substrate 350 and connection lines 381a and 381b are provided not only on the lower side but also on the left side of the display panel 300. Therefore, the same configuration is denoted by the same reference numerals, and a description thereof will be omitted or briefly given.

[0239] Fig.12 , Fig.13A and Fig. 13B An example in which one display panel 300 is disposed on one wiring substrate 360 ​​is shown, but is not limited thereto. The present disclosure can also be applied to an example in which a plurality of display panels 300 similar to the above exemplary embodiment are disposed on one wiring substrate 360. For example, a display device may include three display panels and one wiring substrate disposed on the rear surface of the display panel. This has been referred to Fig.11 Described in detail.

[0240] Fig.13A Shown along Fig.12 A portion of a cross section taken from a first connection line 381a of the display device is taken as an example, and Fig. 13B Shown along Fig.12 A portion of a cross section taken from a second connection line 381b of the display device is taken as an example.

[0241] Reference Fig.12 , Fig.13A and Fig. 13B , a display device according to still another exemplary embodiment of the present disclosure may include at least one display panel 300 and one wiring substrate 360 ​​disposed on a rear surface of the display panel 300 , but is not limited thereto.

[0242] Fig.12 The lower side of may be defined as a data pad portion, which is connected to the first flexible film through the first connection line 381a. Fig.12 The left side of may be defined as a gate pad portion connected to the second flexible film through the second connection line 381b, but the present disclosure is not limited thereto. For example, the gate pad portion may also be included in the data pad portion on the lower side.

[0243] The first flexible film and the second flexible film are films that supply signals to the multiple sub-pixels and circuits in the active area, and can be electrically connected to the wiring substrate 360. For example, the first flexible film and the second flexible film are provided at one end and the other end of the wiring substrate 360 ​​to supply power supply voltage, data voltage (signal), and selection signal to the multiple sub-pixels and circuits in the active area through the multiple first connection lines 381a and the second connection lines 381b. For example, a driver IC such as a data driver IC can be provided on the first flexible film and the second flexible film.

[0244] For example, the first connection line 381a and the second connection line 381b may be configured of a metal material having low resistance, low reflectivity, and high transmittance, but is not limited thereto. According to another exemplary embodiment of the present disclosure, the first connection line 381a and the second connection line 381b may extend to the rear surface of the display panel 300, respectively, so as to overlap with a portion of the display panel 300, but not overlap with each other. In addition, the first connection line 381a and the second connection line 381b may be arranged to have a constant interval.

[0245] The first connection line 381a may be disposed on the upper surface of the wiring substrate 360 ​​in the up-down direction (or vertical direction), and the second connection line 381b may be disposed on the upper surface of the wiring substrate 360 ​​in the left-right direction (or horizontal direction), but is not limited thereto. The first connection line 381a may be disposed on the lower side of the display panel 300, and the second connection line 381b may be disposed on the left side of the display panel 300, but is not limited thereto. In addition, the second connection line 381b may be disposed on the right side of the display panel 300. That is, the second connection line 381b may be disposed in at least one of the left side and the right side of the display panel 300.

[0246] The insulating layer 308 may be disposed on the first connection line 381a and the second connection line 381b. The insulating layer 308 may be disposed to insulate the first connection line 381a and the second connection line 381b from the configuration above the first connection line 381a and the second connection line 381b, and may be configured of, for example, a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0247] The first flexible film and the second flexible film may be a tape carrier package (TCP) or a chip on film (COF). At this time, for example, one edge portion (or output bonding unit) of the first flexible film may be attached to a plurality of first to third pads (or input pads) 383a provided on the wiring substrate 360, but is not limited thereto. In addition, the other edge portion (or input bonding unit) of the first flexible film may be attached to the first printed circuit board. For example, the other edge portion (or input bonding unit) of the first flexible film may be attached to the first printed circuit board by a film attachment process using an anisotropic conductive film, but is not limited thereto. For example, one edge portion (or output bonding unit) of the second flexible film may be attached to the second third pad (or input pad) 383b provided on the wiring substrate 360, and the other edge portion (or input bonding unit) of the second flexible film may be attached to the second printed circuit board.

[0248] For example, the plurality of first link lines 382a may connect the plurality of first connection lines 381a and the first to third pads 383a individually (or one to one). For example, the plurality of second link lines 382b may connect the plurality of second connection lines 381b and the second to third pads 383b individually (or one to one).

[0249] As described above, the display panel 300 according to still another exemplary embodiment of the present disclosure may include the first substrate 310 , the second substrate 350 , the element unit 340 disposed between the first substrate 310 and the second substrate 350 , and the wirings 375 a and 375 b , but is not limited thereto.

[0250] For example, the size of the second substrate 350 may be equal to or correspond to the size of the first substrate 310 , but is not limited thereto.

[0251] The second substrate 350 may be coupled (or bonded) to the first surface of the first substrate 310. For example, the second substrate 350 may be coupled (or bonded) to the first surface of the first substrate 310 through the element unit 340. The second substrate 350 may include a first surface facing the first substrate 310 or a rear surface (or back surface) coupled to the element unit 340, a front surface opposite to the rear surface, an outer surface between the front surface and the rear surface, and the like.

[0252] The element unit 340 may be interposed between the first substrate 310 and the second substrate 350 to bond the second substrate 350 to the first substrate 310. For example, the element unit 340 may be configured by a TFT element layer including a thin film transistor, a light emitting diode layer including a light emitting diode, and an encapsulation layer including an adhesive film, but is not limited thereto. The first substrate 310 and the second substrate 350 may be bonded to each other relative to each other through the element unit 340.

[0253] The display panel 300 may include a plurality of pixels disposed on the first substrate 310 and pixel drive lines for driving the plurality of pixels. Each pixel drive line may be electrically connected to a plurality of first first pads 371a disposed at a first edge portion (or lower side) of a first surface (or upper surface) of the first substrate 310 and / or a plurality of second first pads 371b disposed at a second edge portion (or left side). For example, the plurality of first first pads 371a may be divided (or classified) into a plurality of first data pads, a plurality of first pixel drive power pads, and a plurality of first pixel common power pads, and the plurality of second first pads 371b may be divided (or classified) into a plurality of first selection pads.

[0254] Fig.12 The display device according to another exemplary embodiment of the present disclosure adopts a top attachment method, that is, the display panel 300 is attached to the upper surface of the wiring substrate 360, and a pixel driving line and a plurality of pixels are disposed on the first substrate 310 of the display panel 300 to emit light to the upper surface of the wiring substrate 360. However, the present disclosure is not limited thereto.

[0255] Meanwhile, the wiring substrate 360 ​​may be disposed on the rear surface of the display panel 300 through the adhesive layer 306. For example, the second surface (or rear surface) of the first substrate 310 of the display panel 300 may be coupled to one surface of the adhesive layer 306, and the upper surface of the wiring substrate 360 ​​may be coupled to the other surface of the adhesive layer 306. Therefore, the display panel 300 and the wiring substrate 360, which are mutually coupled (or coupled) through the adhesive layer 306, may constitute a transparent display device having an island shape. Therefore, a transparent display device having an island shape without forming an opaque dead zone may be manufactured. Therefore, there is no design restriction due to the dead zone, thereby reducing manufacturing costs.

[0256] For example, the display device according to still another exemplary embodiment may include a second pad portion PP2 (see Figure 3 The second pad portion PP2 may include a plurality of second pads 385a and 385b which are arranged along a first direction (X direction, see Figure 3 ) are arranged at a constant interval and overlap with the plurality of first pads 371a and 371b of the first pad portion PP1 (see Figure 3). For example, the plurality of second pads 385a and 385b may include a plurality of first second pads 385a overlapping the plurality of first first pads 371a, respectively, and a plurality of second second pads 385b overlapping the plurality of second first pads 371b, respectively. That is, the plurality of first second pads 385a may be disposed on the lower side of the display panel 300, and the plurality of second pads 385b may be disposed on the left side of the display panel 300, but is not limited thereto. For example, the plurality of first second pads 385a may be divided (or classified) into a plurality of second data pads, a plurality of second pixel driving power pads, and a plurality of second pixel common power pads, and the plurality of second second pads 385b may be divided (or classified) into a plurality of second gate pads. In this case, a gate-in-panel (GIP) region and a GIP circuit are not required.

[0257] For example, the first second pad 385a and the second second pad 385b may adopt a Ti / Cu double film suitable for a laser welding process, but is not limited thereto.

[0258] A plurality of first wirings 375a and a plurality of second wirings 375b may be disposed on the lower side and the left side of the display panel 300 so as to surround the outer surface of the display panel 300. That is, a plurality of first wirings 375a and a plurality of second wirings 375b may be disposed on the lower side and the left side of the display panel 300 so as to cover a portion of the upper surface of the second substrate 350 and a portion of the lower surface of the first substrate 310 (including the outer surface of the display panel 300).

[0259] A plurality of first wirings 375a may be disposed on the lower side of the display panel 300. Thus, each of the first wirings 375a may be electrically connected to a side surface of each of the first first pads 371a disposed between the first substrate 310 and the second substrate 350. A plurality of second wirings 375b may be disposed on the left side of the display panel 300. Each of the second wirings 375b may be electrically connected to a side surface of each of the second first pads 371b disposed between the first substrate 310 and the second substrate 350.

[0260] A step supplement layer 307 considering steps formed by the plurality of first wirings 375a and the plurality of second wirings 375b may be disposed on the lower and left sides of the display panel 300. For example, the step supplement layer 307 may be composed of a photo acrylic (PAC) organic insulating layer, but is not limited thereto.

[0261] Therefore, each of the plurality of first second pads 385a and the plurality of second second pads 385b is disposed on the upper surface of the step supplementary layer 307 and extends along the inclined side surface of the step supplementary layer 307 to be electrically connected to the first connection line 381a and the second connection line 381b. For example, the plurality of first second pads 385a and the plurality of second second pads 385b may be electrically connected to the first connection line 381a and the second connection line 381b disposed under the insulating layer 308 through contact holes formed in the insulating layer 308, respectively.

[0262] Meanwhile, the display device according to another exemplary embodiment of the present disclosure may further include a supporting layer 305, which is disposed between the display panel 300 and the wiring substrate 360 ​​to maintain a constant gap between the display panel 300 and the wiring substrate 360. Specifically, the supporting layer 305 may be disposed between the first substrate 310 and the insulating layer 308. For example, the supporting layer 305 may be dispersedly disposed in the adhesive layer 306. The supporting layer 305 may be a columnar spacer, but is not limited thereto. For example, the supporting layer 305 may be formed of the same material as the step supplementary layer 307, but is not limited thereto. For example, the supporting layer 305 may be composed of a photo acrylic (PAC) organic insulating layer, but is not limited thereto.

[0263] In addition, for example, after the display panel 300 is attached to the wiring substrate 360, in order to reinforce the connection between the wirings 375a and 375b and the second pads 385a and 385b, the first solder paste 377a may be additionally applied between the side surface of the first wiring 375a and the upper surface of the first second pad 385a, respectively. In addition, the second solder paste 377b may be additionally applied between the side surface of the second wiring 375b and the upper surface of the second second pad 385b, respectively, in order to reinforce the connection between the wiring 375b and the second pad 385b, but is not limited thereto.

[0264] In addition, for example, a sealant 378 may be applied to cover the wirings 375a, 375b, the second pads 385a and 385b, a portion of the upper surface of the wiring substrate 360, and a portion of the lower side and the left side of the display panel 300 (including the solder pastes 377a, 377b). For example, the sealant 378 may be formed of a transparent organic material, but is not limited thereto.

[0265] Meanwhile, according to another exemplary embodiment of the present disclosure, a bottom attachment method is also adopted, that is, the display panel is attached to the rear surface (or lower surface) of the wiring substrate, and light is emitted from the rear surface to the upper surface of the wiring substrate. This will be described in detail with reference to the accompanying drawings.

[0266] Fig.14 is a perspective view showing a display device according to still another embodiment of the present disclosure.

[0267] Fig.15A and Fig. 15B It is shown Fig.14 A view of a cross section of a display device.

[0268] Fig.14 , Fig.15A and Fig. 15B A display device according to another embodiment of the present disclosure comprises Fig.12 and Fig.13A The display device according to still another exemplary embodiment is configured in substantially the same configuration, except that the display panel 400 is attached to the rear surface of the wiring substrate 460 and the positions of the first substrate 410 and the second substrate 450 are interchanged. Therefore, the same configuration is denoted by the same reference numerals, and a description thereof will be omitted or briefly given.

[0269] Fig.14 , Fig.15A and Fig. 15B An example in which one display panel 400 is disposed on one wiring substrate 460 is shown, but is not limited thereto. The present disclosure is also applicable to an example in which a plurality of display panels 400 are disposed on one wiring substrate 460 similarly to the above exemplary embodiment. For example, a display device may include three display panels and one wiring substrate disposed on the rear surface of the display panel. This has been referred to Fig.11 Described in detail.

[0270] Fig.15A Shown along Fig.14 A portion of a cross section taken from a first connection line 481a of the display device is taken as an example, and Fig. 15B The example shows the Fig.14 A portion of a cross section taken from a second connection line 481b of the display device.

[0271] Hereinafter, for the convenience of description, the rear surface direction of the wiring substrate 460 is defined as the rear surface (or lower surface) of the display panel 400 , and the front surface direction of the wiring substrate 460 is defined as the front surface (or upper surface) of the display panel 400 .

[0272] Reference Fig.14 , Fig.15A and Fig. 15B According to another exemplary embodiment of the present disclosure, a display device may include at least one display panel 400 and one wiring substrate 460 disposed on the upper surface of the display panel 400, but is not limited thereto. That is, for example, the display panel 400 may be disposed on the rear surface of the wiring substrate 460 relative to the viewing position of the viewer.

[0273] Fig.14The lower side may be defined as a data pad portion connected to the first flexible film through the first connection line 481a, and the left side may be defined as a gate pad portion connected to the second flexible film through the second connection line 481b, but the present disclosure is not limited thereto. For example, the gate pad portion may also be included in the data pad portion of the lower side.

[0274] The first flexible film and the second flexible film are films that supply signals to the multiple sub-pixels and circuits in the active area, and can be electrically connected to the wiring substrate 460. For example, the first flexible film and the second flexible film are provided at one end and the other end of the wiring substrate 460 to supply power voltage, data voltage (signal), and strobe signal to the multiple sub-pixels and circuits in the active area through the multiple first connection lines 481a and the second connection lines 481b. For example, a driver IC such as a data driver IC can be provided on the first flexible film and the second flexible film.

[0275] For example, the first connection line 481a and the second connection line 481b may be configured of a metal material having low resistance, low reflectivity, and high transmittance, but is not limited thereto. According to another exemplary embodiment of the present disclosure, the first connection line 481a and the second connection line 481b may extend to the upper surface of the display panel 400 so as to overlap with a portion of the display panel 400 but not overlap with each other. In addition, the first connection line 481a and the second connection line 481b may be arranged to have a constant interval.

[0276] The first connection line 481a may be disposed on the rear surface of the wiring substrate 460 in the up-down direction (or vertical direction), and the second connection line 481b may be disposed on the rear surface of the wiring substrate 460 in the left-right direction (or horizontal direction), but is not limited thereto. The first connection line 481a may be disposed on the lower side of the display panel 400, and the second connection line 481b may be disposed on the left side of the display panel 400, but is not limited thereto. In addition, the second connection line 481b may be disposed on the right side of the display panel 400. That is, the second connection line 481b may be disposed in at least one of the left and right sides of the display panel 400.

[0277] The insulating layer 408 may be disposed on the first connection line 481a and the second connection line 481b. The insulating layer 408 may be disposed to insulate the first connection line 481a and the second connection line 481b from the configuration above the first connection line 481a and the second connection line 481b, and may be configured of, for example, a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0278] The first flexible film and the second flexible film may be a tape carrier package (TCP) or a chip on film (COF). At this time, for example, one edge portion (or output bonding unit) of the first flexible film may be attached to a plurality of first to third pads (or input pads) 483a provided on the wiring substrate 460, but is not limited thereto. In addition, the other edge portion (or input bonding unit) of the first flexible film may be attached to the first printed circuit board. For example, the other edge portion (or input bonding unit) of the first flexible film may be attached to the first printed circuit board by a film attachment process using an anisotropic conductive film, but is not limited thereto. For example, one edge portion (or output bonding unit) of the second flexible film may be attached to the second third pad (or input pad) 483b provided on the wiring substrate 460, and the other edge portion (or input bonding unit) of the second flexible film may be attached to the second printed circuit board.

[0279] For example, the plurality of first link lines 482a may connect the plurality of first connection lines 481a and the first to third pads 483a individually (or one-to-one). For example, the plurality of second link lines 482b may connect the plurality of second connection lines 481b and the second to third pads 483b individually (or one-to-one).

[0280] As described above, the display panel 400 according to still another exemplary embodiment of the present disclosure may include the first substrate 410 , the second substrate 450 , the element unit 440 disposed between the first substrate 410 and the second substrate 450 , and the wirings 475 a and 475 b , but is not limited thereto.

[0281] For example, the size of the second substrate 450 may be equal to or correspond to the size of the first substrate 410 , but is not limited thereto.

[0282] Further, for example, in the display panel 400 of still another exemplary embodiment of the present disclosure, the first substrate 410 may be disposed on the rear surface (or back surface) of the second substrate 450 through the element unit 440. The second substrate 450 may include a first surface facing the first substrate 410 or a rear surface (or back surface) coupled to the element unit 440, a front surface opposite to the rear surface, an outer surface between the front surface and the rear surface, and the like.

[0283] The element unit 440 may be interposed between the first substrate 410 and the second substrate 450 to bond the second substrate 450 to the first substrate 410. For example, the element unit 440 may be composed of a TFT element layer including a thin film transistor, a light emitting diode layer including a light emitting diode, and an encapsulation layer including an adhesive film, but is not limited thereto. The first substrate 410 and the second substrate 450 may be bonded to each other relative to each other through the element unit 440.

[0284] The display panel 400 may include a plurality of pixels disposed on a first substrate 410 and pixel drive lines for driving the plurality of pixels. Each pixel drive line may be electrically connected to a plurality of first first pads 471a disposed at a first edge portion (or lower side) of a first surface (or upper surface) of the first substrate 410 and / or a plurality of second first pads 471b disposed at a second edge portion (or left side). For example, the plurality of first first pads 471a may be divided (or classified) into a plurality of first data pads, a plurality of first pixel drive power pads, and a plurality of first pixel common power pads, and the plurality of second first pads 471b may be divided (or classified) into a plurality of first selection pads.

[0285] Fig.14 A display device according to another exemplary embodiment of the present disclosure adopts a bottom attachment method, which attaches the display panel 400 to the rear surface of the wiring substrate 460, and sets a pixel driving line and a plurality of pixels on the first substrate 410 of the display panel 400 to emit light to the upper surface of the wiring substrate 460. However, the present disclosure is not limited thereto.

[0286] Meanwhile, the wiring substrate 460 may be disposed on the rear surface of the display panel 400 through the adhesive layer 406. That is, for example, the second surface (or upper surface) of the second substrate 450 of the display panel 400 may be coupled to one surface of the adhesive layer 406, and the rear surface of the wiring substrate 460 may be coupled to the other surface of the adhesive layer 406. Therefore, the display panel 400 and the wiring substrate 460 bonded (or coupled) to each other through the adhesive layer 406 may constitute a transparent display device having an island shape. Therefore, a transparent display device having an island shape without forming an opaque dead zone may be manufactured. Therefore, there is no design restriction due to the dead zone, thereby reducing manufacturing costs.

[0287] For example, the display device according to another exemplary embodiment may include a second pad portion PP2 (see Figure 3 The second pad portion PP2 may include a plurality of second pads 485a, 485b which are arranged along a first direction (X direction, see Figure 3 ) are arranged at a constant interval and are aligned with the plurality of first pads 471a and 471b of the first pad portion PP1 (see Figure 3) overlap. For example, the plurality of second pads 485a and 485b may include a plurality of first second pads 485a overlapping with the plurality of first first pads 471a, respectively, and a plurality of second second pads 485b overlapping with the plurality of second first pads 471b, respectively. That is, the plurality of first second pads 485a may be disposed on the lower side of the display panel 400, and the plurality of second pads 485b may be disposed on the left side of the display panel 400, but is not limited thereto. For example, the plurality of first second pads 485a may be divided (or classified) into a plurality of second data pads, a plurality of second pixel drive power pads, and a plurality of second pixel common power pads, and the plurality of second second pads 485b may be divided (or classified) into a plurality of second gate pads. In this case, the gate-in-panel (GIP) region and the GIP circuit are not required.

[0288] For example, the first and second pads 485a and 485b may adopt a Ti / Cu double film applied to a laser welding process, but are not limited thereto.

[0289] A plurality of first wirings 475a and a plurality of second wirings 475b may be disposed on the lower side and the left side of the display panel 400 so as to surround the outer surface of the display panel 400. That is, a plurality of first wirings 475a and a plurality of second wirings 475b may be disposed on the lower side and the left side of the display panel 400 so as to cover a portion of the rear surface of the first substrate 410 and a portion of the upper surface of the second substrate 450 (including the outer surface of the display panel 400).

[0290] A plurality of first wirings 475a may be disposed on the lower side of the display panel 500. Thus, each first wiring 475a may be electrically connected to a side surface of each first first pad 471a disposed between the first substrate 410 and the second substrate 450. A plurality of second wirings 475b may be disposed on the left side of the display panel 400. Each second wiring 475b may be electrically connected to a side surface of each second first pad 471b disposed between the first substrate 410 and the second substrate 450.

[0291] A step supplement layer 407 considering steps formed by the plurality of first wirings 475a and the plurality of second wirings 475b may be disposed on the lower and left sides of the display panel 400. For example, the step supplement layer 407 may be composed of a photo acrylic (PAC) organic insulating layer, but is not limited thereto.

[0292] Therefore, each of the plurality of first second pads 485a and the plurality of second second pads 485b is disposed on the upper surface of the step supplementary layer 407 and extends along the inclined side surface of the step supplementary layer 407 to be electrically connected to each of the first connection line 481a and the second connection line 481b. For example, the plurality of first second pads 485a and the plurality of second second pads 485b may be electrically connected to the first connection line 481a and the second connection line 481b disposed under the insulating layer 408 through contact holes formed in the insulating layer 408, respectively.

[0293] Meanwhile, the display device according to another exemplary embodiment of the present disclosure may further include a supporting layer 405, which is disposed between the display panel 400 and the wiring substrate 460 to maintain a constant gap between the display panel 400 and the wiring substrate 460. Specifically, the supporting layer 405 may be disposed between the second substrate 450 and the insulating layer 408. For example, the supporting layer 405 may be dispersedly disposed in the adhesive layer 406. The supporting layer 405 may be a columnar spacer, but is not limited thereto. For example, the supporting layer 405 may be formed of the same material as the step supplementary layer 407, but is not limited thereto. For example, the supporting layer 405 may be composed of a photo acrylic (PAC) organic insulating layer, but is not limited thereto.

[0294] In addition, for example, after the display panel 400 is attached to the wiring substrate 460, in order to reinforce the connection between the wirings 475a and 475b and the second pads 485a and 485b, the first solder paste 477a may be additionally applied between the side surface of the first wiring 475a and the upper surface of the first second pad 485a, respectively. In addition, the second solder paste 477b may be additionally applied between the side surface of the second wiring 475b and the upper surface of the second second pad 485b, respectively, in order to reinforce the connection between the wiring 475b and the second pad 485b, but is not limited thereto.

[0295] In addition, for example, the sealant 477 may be applied to cover the wirings 475a, 475b, the second pads 485a and 485b, a portion of the rear surface of the wiring substrate 460, and a portion of the lower side and the left side of the display panel 400 (including the solder paste 477a, 477b). For example, the sealant 478 may be formed of a transparent organic material, but is not limited thereto.

[0296] Exemplary embodiments of the present disclosure may also be described as follows:

[0297] According to one aspect of the present disclosure, a display device is provided. The display device includes: at least one display panel, a plurality of wirings arranged on an outer surface of at least one side of the display panel, and a wiring substrate, which is arranged on a rear surface or an upper surface of the at least one display panel and may have a plurality of connection lines connected to each of the plurality of wirings, and the plurality of connection lines extend to the rear surface of the display panel to overlap with a portion of the display panel.

[0298] The display device may further include: an adhesive layer which may be disposed between the display panel and the wiring substrate to bond the display panel to the wiring substrate; and a supporting layer which may be disposed between the display panel and the wiring substrate to maintain a gap between the display panel and the wiring substrate.

[0299] The support layer may be dispersed in the adhesive layer.

[0300] The display panel may include: a first substrate, a second substrate opposite to the first substrate, and an element unit located between the first substrate and the second substrate.

[0301] The element unit may include a thin film transistor (TFT) element layer, a light emitting diode layer, and an encapsulation layer.

[0302] The second substrate may have a size smaller than that of the first substrate to expose one side of the first substrate, and a plurality of first pads may be disposed on the exposed one side of the first substrate.

[0303] The size of the second substrate may be equal to that of the first substrate.

[0304] The display device may further include a plurality of second pads, and the plurality of second pads may be disposed on an upper surface or a rear surface of the wiring substrate to overlap with the plurality of first pads.

[0305] The wirings may be disposed to surround an outer surface of one side of the first substrate, and each of the plurality of wirings may be connected one-to-one to the pixel driving line through a first pad disposed on the first substrate.

[0306] Each of the plurality of wirings may connect each of the plurality of first pads with each of the plurality of second pads one-to-one.

[0307] The display device may further include a plurality of third pads, and the plurality of third pads may be provided on an upper surface or a rear surface of one side of the wiring substrate.

[0308] Each of the plurality of connection lines may connect each of the plurality of second pads with each of the plurality of third pads one-to-one.

[0309] The display device may further include: a printed circuit board which may be provided on one side of the wiring substrate; and a flexible film which may be connected to the third pad through one edge portion and may be connected to the printed circuit board through another edge portion.

[0310] The at least one display panel may be arranged sequentially in a horizontal direction or sequentially in a vertical direction.

[0311] The connection lines may be arranged at a constant pitch over the entire surface of the wiring substrate.

[0312] The at least one display panel may include at least one lower display panel, and at least one upper display panel disposed over the at least one lower display panel.

[0313] The connection line may include: a lower connection line that may extend to a rear surface of at least one lower display panel to overlap with a portion of the at least one lower display panel; and an upper connection line that may extend to a rear surface of at least one upper display panel to overlap with a portion of the at least one upper display panel.

[0314] The connection line may include: a first connection line that can be arranged in the up-down direction to overlap with a portion of the lower side of the display panel; and a second connection line that can be arranged in the left-right direction to overlap with a portion of at least one of the left and right sides of the display panel.

[0315] The wiring may include: a first wiring, which may be arranged on the lower side of the display panel to cover from a portion of the lower surface of the first substrate to a portion of the upper surface of the second substrate, and from a portion of the lower surface of the first substrate to a portion of the upper surface of the second substrate including the outer surface of the display panel; and a second wiring, which may be arranged on at least one of the left and right sides of the display panel to cover from a portion of the lower surface of the first substrate to a portion of the upper surface of the second substrate, and from a portion of the lower surface of the first substrate to a portion of the upper surface of the second substrate including the outer surface of the display panel.

[0316] The first wiring may be electrically connected to a side surface of a first first pad disposed between the first substrate and the second substrate, and the second wiring may be electrically connected to a side surface of a second first pad disposed between the first substrate and the second substrate.

[0317] The wiring may include a first wiring, which is arranged on the lower side of the display panel to cover from a portion of the lower surface of the second substrate to a portion of the upper surface of the first substrate, and from a portion of the lower surface of the second substrate to a portion of the upper surface of the first substrate includes the outer surface of the display panel; and a second wiring, which is arranged in at least one of the left and right sides of the display panel to cover from a portion of the lower surface of the second substrate to a portion of the upper surface of the first substrate, and from a portion of the lower surface of the second substrate to a portion of the upper surface of the first substrate includes the outer surface of the display panel.

[0318] The first wiring may be electrically connected to a side surface of a first first pad disposed between the first substrate and the second substrate, and the second wiring may be electrically connected to a second first pad disposed between the second substrate and the first substrate.

[0319] The display device may further include a step supplement layer, which may be arranged between a side of the display panel where wiring may be provided and the wiring substrate, and a plurality of second pads may be arranged on an upper surface of the step supplement layer and extend along an inclined side surface of the step supplement layer to be electrically connected to the connecting wire.

[0320] The display device may further include an insulating layer disposed on the connection line, and wherein the plurality of second pads may be electrically connected to the connection line through a contact hole formed in the insulating layer.

[0321] The display device may further include: a solder paste which may be applied between a side surface of the wiring and an upper surface of the second pad; and a sealant which may include the solder paste to cover the wiring, the second pad, a portion of the upper surface of the wiring substrate, and a portion of the lower side of the display panel.

[0322] The display panel may include: a first transparent pixel, which is composed of a plurality of first sub-pixels formed in a first sub-pixel area and adjacent to each other in a first direction, and a first transparent area arranged adjacent to the first sub-pixel area in a second direction; a second transparent pixel, which is composed of a plurality of second sub-pixels formed in a second sub-pixel area and adjacent to each other in the first direction, and a second transparent area arranged adjacent to the second sub-pixel area in the second direction; a third transparent pixel, which is composed of a plurality of third sub-pixels formed in a third sub-pixel area and adjacent to each other in the first direction, and a third transparent area arranged adjacent to the third sub-pixel area in the second direction; and a fourth transparent pixel, which is composed of a plurality of fourth sub-pixels formed in a fourth sub-pixel area and adjacent to each other in the first direction, and a fourth transparent area arranged adjacent to the fourth sub-pixel area in the second direction.

[0323] The first transparent area and the second transparent area in the first transparent pixel and the second transparent pixel adjacent to each other in the first direction may be disposed adjacent to each other, and the third transparent area and the fourth transparent area in the third transparent pixel and the fourth transparent pixel adjacent to each other in the first direction may be disposed adjacent to each other.

[0324] The size of the first transparent area may be larger than the size of the first sub-pixel area, the size of the second transparent area may be larger than the size of the second sub-pixel area, the size of the third transparent area may be larger than the size of the third sub-pixel area, and the size of the fourth transparent area may be larger than the size of the fourth sub-pixel area.

[0325] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are provided for illustrative purposes only and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure. All technical concepts within the equivalent scope of the present disclosure should be interpreted as falling within the scope of the present disclosure.

[0326] CROSS-REFERENCE TO RELATED APPLICATIONS

[0327] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0097518 filed in the Korean Intellectual Property Office on July 26, 2023, the disclosure of which is incorporated herein by reference in its entirety for all purposes as if fully set forth herein.

Claims

1. A display device, comprising: at least one display panel; a plurality of wirings, the plurality of wirings being disposed on an outer surface of at least one side of the at least one display panel; as well as a wiring substrate provided on a rear surface or an upper surface of the at least one display panel and having a plurality of connection lines connected to each of the plurality of wirings, The plurality of connection lines extend to the rear surface of the at least one display panel to overlap with a portion of the at least one display panel.

2. The display device according to claim 1, further comprising: an adhesive layer provided between the at least one display panel and the wiring substrate so as to bond the at least one display panel to the wiring substrate; as well as A support layer is provided between the at least one display panel and the wiring substrate to maintain a gap between the at least one display panel and the wiring substrate.

3. The display device according to claim 2, wherein: The support layer is dispersed in the adhesive layer.

4. The display device according to claim 1, wherein: The at least one display panel comprises: a first substrate; a second substrate opposite to the first substrate; and A component unit is interposed between the first substrate and the second substrate.

5. The display device according to claim 4, wherein: The element unit comprises a thin film transistor (TFT) element layer, a light emitting diode layer and a packaging layer.

6. The display device according to claim 4, wherein: The second substrate has a size smaller than that of the first substrate to expose one side of the first substrate, and a plurality of first pads are disposed on the exposed one side of the first substrate.

7. The display device according to claim 6, further comprising: A plurality of second pads are provided on an upper surface or a rear surface of the wiring substrate to overlap with the plurality of first pads.

8. The display device according to claim 7, wherein: The wirings are provided to surround the outer surface of the one side of the first substrate, and each of the plurality of wirings is connected one-to-one to a pixel driving line through the first pad provided on the first substrate.

9. The display device according to claim 7, wherein: Each of the plurality of wirings connects each of the plurality of first pads and each of the plurality of second pads on a one-to-one basis.

10. The display device according to claim 7, further comprising: A plurality of third pads are provided on an upper surface or a rear surface of one side of the wiring substrate.

11. The display device according to claim 10, wherein: Each of the plurality of connection lines connects each of the plurality of second pads with each of the plurality of third pads in a one-to-one manner.

12. The display device according to claim 10, further comprising: a printed circuit board, the printed circuit board being arranged on one side of the wiring substrate; as well as A flexible film is electrically connected to the third pad through one edge portion and electrically connected to the printed circuit board through another edge portion.

13. The display device according to claim 1, wherein: The at least one display panel is arranged sequentially in a horizontal direction or sequentially in a vertical direction.

14. The display device according to claim 1, wherein: The connection lines are arranged at a constant pitch over the entire surface of the wiring substrate.

15. The display device according to claim 1, wherein: The at least one display panel comprises: at least one lower display panel; and At least one upper display panel is disposed above the at least one lower display panel.

16. The display device according to claim 15, wherein: The connecting line comprises: a lower connection line extending to a rear surface of the at least one lower display panel to overlap a portion of the at least one lower display panel; and An upper connection line extends to a rear surface of the at least one upper display panel to overlap a portion of the at least one upper display panel.

17. The display device according to claim 4, wherein: The connecting line comprises: a first connection line disposed in a top-bottom direction to overlap a portion of a lower side of the at least one display panel; and A second connection line is disposed in a left-right direction to overlap a portion of at least one of a left side and a right side of the at least one display panel.

18. The display device according to claim 17, wherein: The wiring comprises: a first wiring disposed on the lower side of the at least one display panel to cover from a portion of the lower surface of the first substrate to a portion of the upper surface of the second substrate, the portion from the lower surface of the first substrate to a portion of the upper surface of the second substrate including an outer surface of the at least one display panel; and A second wiring, the second wiring is arranged on at least one of the left side and the right side of the at least one display panel to cover from a portion of the lower surface of the first substrate to a portion of the upper surface of the second substrate, and from a portion of the lower surface of the first substrate to a portion of the upper surface of the second substrate includes the outer surface of the at least one display panel.

19. The display device according to claim 18, wherein: The first wiring is electrically connected to a side surface of a first first pad disposed between the first substrate and the second substrate, and the second wiring is electrically connected to a side surface of a second first pad disposed between the first substrate and the second substrate.

20. The display device according to claim 17, wherein: The wiring comprises: a first wiring disposed on the lower side of the at least one display panel to cover from a portion of the lower surface of the second substrate to a portion of the upper surface of the first substrate, the portion from the portion of the lower surface of the second substrate to the portion of the upper surface of the first substrate including an outer surface of the at least one display panel; and A second wiring, the second wiring is arranged on at least one of the left side and the right side of the at least one display panel to cover from the portion of the lower surface of the second substrate to the portion of the upper surface of the first substrate, and the portion from the portion of the lower surface of the second substrate to the portion of the upper surface of the first substrate includes the outer surface of the at least one display panel.

21. The display device according to claim 20, wherein: The first wiring is electrically connected to a side surface of a first first pad disposed between the first substrate and the second substrate, and the second wiring is electrically connected to a side surface of a second first pad disposed between the first substrate and the second substrate.

22. The display device according to claim 7, further comprising: a step supplementary layer, the step supplementary layer being provided between the wiring substrate and a side of the at least one display panel provided with the wiring, The plurality of second pads are disposed on an upper surface of the step supplementary layer and extend along an inclined side surface of the step supplementary layer to be electrically connected to the connection line.

23. The display device according to claim 22, further comprising: An insulating layer is provided on the connecting line, and The plurality of second pads are electrically connected to the connection lines through contact holes formed in the insulating layer.

24. The display device according to claim 7, further comprising: A solder paste applied between a side surface of the wiring and an upper surface of the second pad; as well as A sealant including the solder paste covers the wiring, the second pad, a portion of the upper surface of the wiring substrate, and a portion of a lower side of the at least one display panel.

25. The display device according to claim 24, wherein: The first transparent area and the second transparent area in the first transparent pixel and the second transparent pixel adjacent in the first direction are arranged adjacent to each other, and the third transparent area and the fourth transparent area in the third transparent pixel and the fourth transparent pixel adjacent in the first direction are arranged adjacent to each other.

26. The display device according to claim 25, wherein: The size of the first transparent area is larger than the size of the first sub-pixel area, the size of the second transparent area is larger than the size of the second sub-pixel area, the size of the third transparent area is larger than the size of the third sub-pixel area, and the size of the fourth transparent area is larger than the size of the fourth sub-pixel area.

Images