Method for producing resin molded article, and resin molded article

Abstract

In a method for manufacturing a resin molded article, resin can be prevented from intruding into an electrode terminal and the periphery of the electrode terminal even if the irregularities of the electrode terminal of an embedded component and the periphery of the electrode terminal or the position of the embedded electrode terminal change greatly every time the electrode terminal is molded. A film (10) and a block member (50), which are insert members, are sandwiched between a first surface (91a) of a first mold (91), which is a first surface within the inner surface of the molding space (SP), and a second surface (92a) of a second mold (92), which is a second surface within the inner surface of the molding space (SP). A block member (50) in which an elastic polymer compound is disposed in a first portion (51) and a second portion (52) that are in contact with a first surface (91a) and a second surface (92a) is elastically deformed. Then, the periphery of the block member (50) is filled with a molten resin, and the resin around the block member (50) is cured. Further, the block member (50) is removed from the resin molded body (20) to expose the electrode terminal (15).

Description

Technical Field

[0001] The present invention relates to a resin molded product in which an embedding component is embedded and a method for manufacturing the same, and more particularly to a resin molded product in which the embedding component has an electrode terminal and a method for manufacturing the same. Background Art

[0002] In a resin molded article in which an insert component is embedded, electrode terminals are formed on the insert component such as a film or a substrate. In order to electrically connect to an electric component, an electronic component or a circuit included in the insert component from the outside, it is sometimes necessary to expose the electrode terminals.

[0003] If an electrode terminal is present in the embedded component, a gap may be formed between the mold and the connection portion, and resin may flow in. In order to suppress the formation of such a gap, an elastic body is provided at the tip of the mold holding pin, as described in Patent Document 1 (Japanese Patent No. 3994683).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent No. 3994683 Summary of the invention

[0007] Technical problem to be solved by the invention

[0008] For example, the technology described in Patent Document 1 proposes a manufacturing method in which a sheet-shaped elastic body is provided at the tip of a retaining pin so that no gap is generated between the retaining pin and the embedded component even if the terminal has some irregularities.

[0009] However, for example, if the thickness of the insert component varies or the unevenness of the electrode terminal and its surroundings increases, it is difficult to prevent the occurrence of gaps in the technology described in Patent Document 1.

[0010] The technical problem of the present invention is to prevent the resin from invading the electrode terminal and its surroundings even when the unevenness of the electrode terminal and its surroundings of the embedded component or the position of the embedded electrode terminal greatly changes each time molding.

[0011] Technical solutions to solve problems

[0012] Hereinafter, a plurality of methods will be described as technical means for solving the technical problem, and these methods can be arbitrarily combined as needed.

[0013] A method for manufacturing a resin molded product according to one aspect of the present invention comprises: a first step of placing an insert component having one main surface between a first mold and a second mold; a second step of closing the first mold and the second mold to form a molding space in which the insert component is accommodated; a third step of causing molten resin to flow into the molding space to mold the resin molded body in which the insert component is embedded; and a fourth step of opening the first mold and the second mold to remove the resin molded body in which the insert component is embedded. In the first step, a block component is placed on one main surface in such a manner as to contact an electrode terminal for electrical connection provided on one main surface. In the second step, the insert component and the block component are sandwiched by the first surface of the first mold as the first surface in the inner surface of the molding space and the second surface of the second mold as the second surface in the inner surface, so that the block component having an elastic polymer compound disposed on the first part and the second part in contact with the first surface and the second surface is elastically deformed. In the third step, the molten resin is filled around the block component and the resin around the block component is solidified. In the fourth step, the block component is removed from the resin molded body to expose the electrode terminal.

[0014] In the manufacturing method of the resin molded product thus constructed, even if the electrode terminal of the embedded component and its surroundings are uneven or the position of the embedded electrode terminal varies greatly, the block component is tightly fitted with the electrode terminal and its surroundings during the mold closing in the second step. In the state where the block component is tightly fitted with the electrode terminal and its surroundings, the molten resin can be filled around the block component in the third step.

[0015] In the manufacturing method of the above-mentioned resin molded product, the polymer compound can be configured to have elasticity by including a silicone elastomer or a fluorine elastomer, or being processed into a sponge shape. In the manufacturing method of the resin molded product configured in this way, a block component that is easy to fit closely to the terminal and its periphery and is appropriately deformed can be used for the manufacture of the resin molded product.

[0016] In the above-mentioned method for manufacturing a resin molded product, it is possible to configure such that a first distance between the surface of the first portion and the surface of the second portion before elastic deformation caused by sandwiching the block component between the first surface and the second surface is within a range of 1.2 to 3 times the second distance between the surface of the first portion and the surface of the second portion after elastic deformation. In the method for manufacturing a resin molded product configured in this way, it is possible to prevent damage to the block component and to allow the block component to be sufficiently closely fitted to the electrode terminal and its periphery.

[0017] In the above-mentioned method for manufacturing a resin molded product, the block member can be configured to have a hardness of Shore A20 or more and Shore A70 or less. In the method for manufacturing a resin molded product configured in this way, the block member having an appropriate hardness can be firmly attached to the electrode terminal and its periphery.

[0018] In the block component of the manufacturing method of the above-mentioned resin molded product, the polymer compound can be configured to account for more than 50% of the total volume. In the manufacturing method of the resin molded product configured in this way, the block component that is easily fitted to the terminal and its surroundings and appropriately deformed can be used for the manufacture of the resin molded product.

[0019] A resin molded product according to one aspect of the present invention comprises: a resin molded body molded into a predetermined shape; and an embedded component embedded in the resin molded body and having an electrode terminal for electrical connection on one main surface. The resin molded body has an opening that exposes a portion of the electrode terminal. The wall surface of the opening is curved in a concave shape.

[0020] The resin molded article having such a structure can firmly fix the sealing material when the sealing material is filled in the opening, for example, by the wall surface of the opening being bent into a concave shape.

[0021] The above-mentioned resin molded product can be configured such that the electrode terminal has a concave-convex shape or a curved surface shape. The resin molded product configured in this way can provide a high-quality resin molded product in which the electrode terminal is configured in a shape suitable for the application and no resin intrusion occurs in the electrode terminal and its surroundings.

[0022] The embedded component of the above-mentioned resin molded product has a plurality of electrode terminals, and the plurality of electrode terminals are arranged in the curved surface area of ​​the embedded component, or in the first plane area and the second plane area of ​​the embedded component. The resin molded product thus constructed can provide a resin molded product of good quality in which the plurality of electrode terminals are consistent with the shape of the embedded component and no resin intrusion occurs in the plurality of electrode terminals and their surroundings.

[0023] Effects of the Invention

[0024] The method for manufacturing a resin molded product according to the present invention can prevent the intrusion of resin even when the electrode terminal of the embedded component and the unevenness around it or the position of the embedded electrode terminal changes greatly each time molding. The resin molded product according to the present invention can easily and well perform electrical connection of the electrode terminal when the unevenness around the electrode terminal of the embedded component and the unevenness around it do not intrude with resin. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a plan view showing an example of the resin molded article according to the present invention.

[0026] Figure 2 Yes means Figure 1 A cross-sectional view of a resin molded product cut along line II.

[0027] Figure 3 It is a perspective view showing an example of the structure of a resin molded body in which a film is embedded.

[0028] Figure 4 This is a flowchart showing an example of the flow of the method for producing a resin molded article according to the present invention.

[0029] Figure 5 This is a cross-sectional view showing an example of a film used in the method for producing a resin molded article.

[0030] Figure 6 It is a cross-sectional view showing a state where the film and the block member are provided between the first mold and the second mold.

[0031] Figure 7 It is a cross-sectional view showing the state of the film and the block member between the first mold and the second mold after mold clamping.

[0032] Figure 8 It is a cross-sectional view showing a state where molten resin is injected into the molding space of the first mold and the second mold after the molds are clamped.

[0033] Fig. 9 It is a cross-sectional view showing the state of the film, the resin molded body, and the block member taken out from the first mold and the second mold.

[0034] Fig.10 It means from Fig. 9 A cross-sectional view of a resin molded body in a state where a block component is removed.

[0035] Fig.11 It is a cross-sectional view showing another example of the resin molded product according to Modification 1A.

[0036] Fig.12 This is a cross-sectional view showing an example of a film having a regulating portion according to Modification 1B.

[0037] Fig.13 It is a cross-sectional view showing an example of a first mold and a second mold having a suppression portion according to Modification 1C.

[0038] Fig.14 It is a cross-sectional view showing an example of the first mold, the second mold, and the film according to Modification 1D.

[0039] Fig.15 It is a cross-sectional view showing an example of a film according to Modification 1E.

[0040] Fig.16 Yes means Fig.15 A cross-sectional view of the film taken along line II-II.

[0041] Fig.17 This is a cross-sectional view showing an example of a film according to Modification 1F.

[0042] Fig.18 It is a cross-sectional view showing an example of an electrode terminal according to Modification 1G.

[0043] Fig.19 It is a cross-sectional view showing an example of an electrode terminal according to Modification 1G.

[0044] Fig. 20 It is a cross-sectional view showing an example of an electrode terminal according to Modification 1G.

[0045] Fig.21 It is a cross-sectional view showing an example of an electrode terminal according to Modification 1G.

[0046] Fig. 22 It is a cross-sectional view showing an example of an electrode terminal according to Modification 1G.

[0047] Fig.23 It is a plan view showing the electrode terminal and the block member according to Modification 1H in a state before injection molding.

[0048] Fig.24 It means in Fig.23 A cross-sectional view of the electrode terminal and the block component taken along the III-III line.

[0049] Fig.25 It means in Fig.23 A cross section of the electrode terminal and the block component after being cut at a portion corresponding to line IV-IV.

[0050] Fig.26 It means in Fig.23 A cross-sectional view of the electrode terminal and the block component after being cut along the VV line.

[0051] Fig. 27 It means in Fig.23 A cross-sectional view of the electrode terminal and the block component after being cut along the VI-VI line.

[0052] Fig.28 It is a cross-sectional view showing an example of a resin molded product according to the second embodiment.

[0053] Fig.29 It is a cross-sectional view showing another example of the resin molded product according to the second embodiment. DETAILED DESCRIPTION

[0054] <First embodiment>

[0055] (1) Overview of resin molded products

[0056] Figure 1 and Figure 2An example of a resin molded product manufactured by the method for manufacturing a resin molded product according to the first embodiment of the present invention is shown in FIG. Figure 1 and Figure 2 The resin molded product 1 shown includes a film 10 as an embedded component and a resin molded body 20 in which the film 10 is embedded. Figure 1 In FIG. 1 , the planar shape of the resin molded product 1 is shown. Figure 2 In the figure, the resin molded article 1 is shown Figure 1 The membrane 10 may be referred to as a membrane-like device.

[0057] The resin molded article 1 shown here is a heater. The film 10 has a copper wiring 16 for generating heat on one main surface 10a. In addition, the film 10 has an electrode terminal 15 for electrically connecting the copper wiring 16 on one main surface 10a. The copper wiring 16 is connected to the electrode terminal 15 so that power is supplied to the copper wiring 16 via the electrode terminal 15.

[0058] In the resin molded product 1 , the resin molded body 20 is formed on one main surface 10 a , and the resin molded body 20 is not formed on the other main surface 10 b . In other words, the other main surface 10 b of the film 10 is exposed to the outside of the resin molded product 1 .

[0059] Here, the case where the other main surface 10b is exposed to the outside of the resin molded product 1 is described, but the present invention can also be applied to a resin molded product in which the other main surface 10b is not exposed to the outside of the resin molded product 1, for example, a resin molded product in which the other main surface 10b is also covered by a resin molded body.

[0060] like Figure 3 As shown, the resin molded body 20 is in the shape of an octagonal plate. In the resin molded body 20, the opening 21 is formed at a position overlapping with a portion of the electrode terminal 15 when viewed from above. Here, the opening 21 is formed at a position overlapping with a portion of the electrode terminal 15 when viewed from above, but the opening 21 may also be formed at a position overlapping with the entire electrode terminal 15 when viewed from above. The opening 21 is a rectangular parallelepiped hole that penetrates the resin molded body 20. In the resin molded body 20, the opening 21 is arranged at a position overlapping with the electrode terminal 15 when viewed from above, so that a portion of the electrode terminal 15 is exposed at the bottom of the opening 21.

[0061] The resin molded product 1 has a connecting pin 30 electrically connected to the electrode terminal 15. The connecting pin 30 is connected to an external electrical device, circuit or electrical apparatus of the resin molded product 1. As an electrical device, for example, there is a power supply device that supplies power to a heater. As a circuit, for example, there is a power supply circuit that supplies power to a heater. As an electrical apparatus, for example, there is a power generation element that supplies power to a heater. In addition, here, the case where the resin molded product 1 has the function of a heater is described, and therefore, as an external electrical device, circuit or electrical apparatus, a power supply device, a power supply circuit or a power generation element is cited as an example. However, the electrical function of the resin molded product 1 is not limited to a heater, and therefore, various external electrical devices, circuits or electrical apparatuses can be selected in accordance with the electrical function of the resin molded product 1. The electrode terminal 15 and the connecting pin 30 are joined, for example, by solder or conductive paste.

[0062] In the resin molded product 1, the opening 21 of the resin molded body 20 is filled with a sealing material 40. The sealing material 40 is filled in a manner flush with the exposed surface of the resin molded body 20. The sealing material 40 is a member for sealing to prevent moisture from invading the electrode terminal 15 and the joint between the electrode terminal 15 and the connecting pin 30. The sealing material 40 includes, for example, epoxy resin, acrylic UV curing resin, polyethylene resin, polypropylene resin, polyurethane resin, polyimide resin, fluororesin, and silicone resin.

[0063] (2) Method for manufacturing resin molded products

[0064] exist Figure 4 , a part of the process of the method for manufacturing the resin molded article 1 is shown. Figure 4 The case where a resin molded body in which an insert component for manufacturing three resin molded products 1 is embedded is described in the three cycles C1, C2, and C3 shown in the figure. Here, for the sake of convenience, one resin molded body is manufactured in each of the cycles C1, C2, and C3 of the manufacturing process, but a configuration may be made so that a plurality of resin molded bodies are manufactured in each of the cycles C1, C2, and C3. Before the cycle C2 of the manufacturing process, one resin molded body is manufactured in the cycle C1 of the manufacturing process, and after the cycle C2 of the manufacturing process, one resin molded body is manufactured in the cycle C3 of the manufacturing process.

[0065] exist Figures 5 to 10 In the embodiment, the cross section of the film 10 or the resin molded body 20 in which the film 10 is embedded is shown in the order of the steps of the manufacturing method of the resin molded product 1. The cross section of the resin molded product 1 including the film 10 and the resin molded body 20 is shown in the embodiment described above. Figure 2 In order to manufacture the resin molded product 1, a plurality of Figure 5The film 10 shown. The film 10 as an embedded component has a film substrate 11. A copper wiring 16 and an electrode terminal 15 electrically connected to the copper wiring 16 are formed on one main surface 10a of the film 10. The film 10 is processed into a shape suitable for the resin molded product 1 by, for example, stamping. Here, the film 10 is processed into a circular planar shape smaller than the octagonal resin molded product 1. The circular film 10 provided with the copper wiring 16 is arranged in the central part of the resin molded body 20 when viewed from above.

[0066] In the first step S1, Figure 6 As shown, the film 10 as the embedded component is set between the first mold 91 and the second mold 92. The film 10 has one main surface 10a facing the forming molding space SP (refer to Figure 7 ) direction.

[0067] In the second step S2, the first mold 91 and the second mold 92 are molded together to form a molding space SP (see Figure 7 ).

[0068] In the third step S3, the molten resin MR is flowed into the molding space SP to mold the resin molded body 20 in which the film 10 is embedded (see Figure 8 ). In other words, in the third step S3, the molten resin MR is injected into the molding space SP and cooled to solidify the molten resin.

[0069] In the fourth step S4, the first mold 91 and the second mold 92 are opened, and the resin molded body 20 in which the film 10 is embedded is taken out. Fig. 9 The taken-out resin molded body 20 is shown in FIG.

[0070] In the fifth step S5, the connection pin 30 is connected to the electrode terminal 15 by solder, for example, and the sealing material 40 is filled in the opening 21. By connecting the connection pin 30 and filling the sealing material 40, the Figure 1 and Figure 2 The wall surface 21a (refer to Fig.10 ) is bent into a concave shape. Thus, since the sealing material 40 is bent into a concave shape, it is firmly fixed to the resin molded body 20 by the anchoring effect. Since the metal mold cannot be pulled out, it is difficult to use the mold to form a curved surface such as the wall surface 21a. However, since the block member 50 is made of an elastically deformable material, the force applied to the block member 50 during mold closing disappears when the mold is opened and the block member 50 returns to its original shape, so it is easy to be pulled out from the resin molded body 20.

[0071] In the first step S1 described above, the block member 50 (see FIG. 1 ) is placed on one main surface 10 a so as to contact the electrode terminal 15 provided on one main surface 10 a of the film 10 . Figure 6 ). The electrode terminal 15 is used for electrical connection of the copper wiring 16.

[0072] In the second step S2, the film 10 and the block member 50 are sandwiched by the first surface 91a of the first mold 91 and the second surface 92a of the second mold 92, so that the block member 50 is elastically deformed (see Figure 7 ).

[0073] The first surface 91a of the first mold 91 is the first surface in the inner surface of the molding space SP, and the second surface 92a of the second mold 92 is the second surface in the inner surface of the molding space SP. The molding space SP may be surrounded by only the first surface 91a and the second surface 92a. In other words, the inner surface of the molding space SP may be composed of only the first part (the first surface 91a) and the second part (the second surface 92a). In addition, the molding space SP may be surrounded by the first surface 91a, the second surface 92a, and a third surface other than these. In other words, the inner surface of the molding space SP may be composed of the first part (the first surface 91a), the second part (the second surface 92a), and a third surface other than these. The third surface is, for example, the surface of the third mold combined with the first mold 91 and the second mold 92, or the surface of the movable pin in the molding space SP when the movable pin provided in the mold is regarded as a component other than the first mold 91 and the second mold 92.

[0074] In the block member 50 , a polymer compound having elasticity is disposed at least in the first portion 51 and the second portion 52 that are in contact with the first surface 91 a and the second surface 92 a . Figure 7 The block member 50 shown is entirely made of a polymer compound having elasticity, and therefore the polymer compound having elasticity is necessarily disposed in the first portion 51 and the second portion 52 that are in contact with the first surface 91 a and the second surface 92 a .

[0075] In the third step S3, the molten resin MR is filled around the block member 50 and the resin around the block member 50 is cooled and solidified (see Figure 8 ). At this time, the molten resin MR does not intrude into the portion where the block member 50 is arranged. Figure 8 As shown, the electrode terminal 15 has a height difference (an example of unevenness) due to the thickness of the copper wiring 16. However, since the block member 50 is greatly deformed, no gap is generated between the block member 50 and the electrode terminal 15 into which the molten resin MR enters.

[0076] In the fourth step S4, the resin molded body 20 is taken out from the first mold 91 and the second mold 92 (see Fig. 9 ), the block member 50 is removed from the resin molded body 20 (refer to Fig.10 ), the electrode terminal 15 is exposed through the opening 21.

[0077] like Fig. 9 As shown, when the block component 50 disappears based on the clamping between the first mold 91 and the second mold 92, the elastic deformation is released and the original shape is restored. Since the block component 50 restored to its original shape protrudes from the resin molded body 20, the protruding portion of the block component 50 from the resin molded body 20 is grasped by a robot arm and removed from the resin molded body 20. The protruding portion of the block component 50 functions as a grasping portion that easily grasps the block component 50. For example, the block component 50 removed in the fourth step S4 of the previous cycle C1 can also be placed on the film 10 set in the first mold 91 and the second mold 92 in the first step S1 of the next cycle C2, for example, by a robot arm. In addition, the block component 50 removed in the fourth step S4 of the cycle C2 can also be placed on the film 10 set in the first step S1 of the next cycle C3. By using the block component 50 in multiple cycles C1, C2, and C3 in this way, the consumption of the block component 50 can be suppressed.

[0078] (3) Materials used in the manufacture of resin molded products

[0079] (3-1) Embedded components

[0080] In the first embodiment, the film 10 is taken as an example as an embedded component. The film substrate 11 of the film 10 needs to insulate the copper wirings 16. Therefore, the film substrate 11 is preferably insulating. The insulating film substrate 11 can be, for example, a resin film or an elastomer film. The material of the resin film includes, for example, a thermosetting resin and a thermoplastic resin. The material of the resin film includes, for example, polyimide, polyethylene terephthalate, polycarbonate, and cycloolefin.

[0081] The embedded component is not limited to a film-shaped component, and may be a component having a three-dimensional shape, for example. The embedded component may be, for example, a MID (Molded Interconnect Device). The embedded component may be, for example, a component having a wiring formed on the surface of a component having a three-dimensional shape by LDS (Laser Direct Structuring).

[0082] (3-2) Materials of resin molded body

[0083] Examples of thermoplastic resins that serve as the material of the molten resin MR include polyester resin, polyethylene terephthalate (PET) resin, acrylic resin, polycarbonate resin, polybutylene terephthalate (PBT) resin, triacetyl cellulose resin, polyimide resin, polyethylene naphthalate (PEN) resin, liquid crystal polymer (LCP) resin, cycloolefin polymer (COP), styrene resin, and ABS resin.

[0084] (3-3) Electrode terminals and copper wiring

[0085] The material of the electrode terminal 15 is, for example, a metal such as gold (Au), nickel (Ni), tin (Sn), copper (Cu), aluminum (Al), silver (Ag) or platinum (Pt) or an alloy containing them. The electrode terminal 15 is formed, for example, by plating or evaporation. The thickness of the electrode terminal 15 is, for example, 50 μm to 500 μm. In the case of a rectangular planar shape of the electrode terminal 15, for example, the long side and the short side are formed within a range of 1 mm to 50 mm. The thickness of the copper wiring 16 is, for example, 10 μm to 500 μm. Figure 2 The copper wiring 16 shown is formed by, for example, embedding a portion of the copper wire into the film substrate 11 by laser processing or ultrasonic processing. However, the copper wiring 16 may be wired without embedding the copper wire into the film substrate 11. Figures 5 to 10 2 shows a case where the copper wire is not embedded in the film substrate 11. When the copper wire is not embedded in the film substrate 11, the copper wire is fixed to the film substrate 11 by, for example, an adhesive to form the copper wiring 16. The copper wiring 16 has a width in the range of, for example, 0.01 mm to 0.5 mm.

[0086] The copper wiring may be formed by screen printing or photolithography, for example. The thickness of the copper wiring formed by such a method is, for example, 0.1 μm to 20 μm. The width of such copper wiring 16 is, for example, in the range of 0.05 mm to 5 mm. Here, the case of using the copper wiring 16 suitable for the heater is described, but the wiring connected to the electrode terminal 15 is not limited to the copper wiring 16, and may be formed of a metal such as nickel (Ni), aluminum (Al), gold (Au) or silver (Ag), or may be an alloy.

[0087] (3-4) Block components

[0088] As already described, the block component 50 is provided with an elastic polymer compound in the first portion 51 and the second portion 52 which are in contact with the first surface 91a of the first mold 91 and the second surface 92a of the second mold 92. In the first embodiment, the entire block component 50 is composed of an elastic polymer compound. The polymer compound of the block component 50 has elasticity by including a silicone elastomer or a fluorine elastomer, or by being processed into a sponge-like state. For example, the entire block component 50 is composed of a silicone elastomer or a fluorine elastomer. As a material of the block component 50 having elasticity by being processed into a sponge-like state, for example, there is foamed polyethylene. Even in the case where a sponge-like component is used for the block component 50, it is preferably processed so that there are no bumps on the surface in order to facilitate the removal of the block component 50 from the opening 21.

[0089] It is preferred that the first distance between the surface of the first portion 51 and the surface of the second portion 52 before elastic deformation generated by sandwiching the block member 50 by the first surface 91a and the second surface 92a is within a range of 1.2 to 3 times the second distance between the surface of the first portion 51 and the surface of the second portion 52 after elastic deformation. When (first distance / second distance) is less than 1.2, it is difficult for the block member 50 to fit closely with the electrode terminal 15 and its periphery, and a gap is likely to be generated. When (first distance / second distance) is greater than 3, it is difficult for the elastic deformation of the block member 50 to converge within the designed range, and the deviation of the shape of the opening portion 21 during manufacturing becomes large.

[0090] The block component 50 preferably has a hardness of Shore A20 or more and Shore A70 or less. When the hardness is less than Shore A20 (soft), the deformation of the block component 50 caused by the molten resin MR becomes larger, so the molten resin MR easily enters between the block component 50 and the electrode terminal 15. When the hardness is greater than Shore A70 (hard), when the block component 50 is elastically deformed between the first surface 91a of the first mold 91 and the second surface 92a of the second mold 92, the block component 50 is easily damaged and cannot follow the shape of the electrode terminal 15, and a gap is easily generated.

[0091] (3-5) Sealing materials

[0092] As the material of the sealing material 40, for example, resin adhesives and inorganic adhesives can be cited. For example, the resin adhesive can use acrylic UV curing resins, polyethylene resins, polypropylene resins, polyurethane resins, epoxy resins, fluorine resins, or silicone resins. For example, the inorganic adhesive can use glass frits and ceramics.

[0093] (4) Modification

[0094] (4-1) Modification 1A

[0095] In the first embodiment, the case where the sealing material 40 is filled in the opening 21 is described. However, the resin molded product 1 may be a resin molded product in which the sealing material 40 is not filled in the opening 21. Fig.11 2 shows an example of the resin molded product 1 in which the opening 21 is not filled with the sealing material 40 .

[0096] exist Fig.11 In the resin molded article 1 shown, the sealing material 40 is not filled in the opening 21, and one main surface 10a of the film 10 is exposed in the opening 21. In addition, the electrode terminal 15 is also exposed through the opening 21. For example, a connection pin 30 is joined to the exposed electrode terminal 15, and a connector 35 is connected to the connection pin 30.

[0097] (4-2) Modification 1B

[0098] In the first embodiment, the block member 50 is merely placed on the film 10, and no member is particularly provided to restrict the movement of the block member 50. Even if no member is provided to restrict the movement of the block member 50, when the block member 50 is made of, for example, a silicone elastomer or a fluorine elastomer, it is difficult for the block member 50 to move from a position where it is placed in close contact with one main surface 10a of the film 10.

[0099] However, since the block member 50 receives force from the molten resin MR when the molten resin MR is injected, a restriction portion for reinforcing the restriction of the movement of the block member 50 may be provided in the film 10, that is, the embedded member. Fig.12 As shown, the film 10 may also be configured to have a protrusion 17 as a limiting portion. The protrusion 17 can limit the movement of the block component 50 in the in-plane direction of one main surface 10a. The protrusion 17 is formed, for example, by the same method as the method of forming the electrode terminal 15. It is preferred that a plurality of protrusions 17 are provided around the electrode terminal 15. Here, the protrusion 17 is indicated as a limiting portion, but the limiting portion is not limited to the protrusion 17. For example, it may also be configured to provide an opening in the film substrate 11 so that a portion of the block component 50 is embedded in the opening of the film substrate 11.

[0100] (4-3) Modification 1C

[0101] In the first embodiment, the block member 50 placed on the film 10 is elastically deformed by sandwiching the block member 50 between the planar first surface 91a and the second surface 92a. At this time, no portion is provided between the first mold 91 and the second mold 92 to suppress the movement of the block member 50. For example, Fig.13As shown, the first mold 91 may also be configured to have a recessed portion 93 as a suppressing portion on the first surface 91a. When the first mold 91 and the second mold 92 are molded together, a portion of the block member 50 is embedded in the recessed portion 93. By embedding a portion of the block member 50 in the recessed portion 93, the block member 50 is suppressed from moving in the in-plane direction of the first surface 91a. The suppressing portion may be provided in at least one of the first mold 91 and the second mold 92.

[0102] (4-4) Modification 1D

[0103] In the first embodiment, the electrode terminal 15 is arranged on a planar portion (planar portion 20a (see Figure 2 However, the electrode terminal 15 may also be arranged on the curved surface portion of the resin molded body 20. In this case, Fig.14 As shown, the electrode terminal 15 is disposed on the curved second surface 92a. Fig.14 In the case shown, the electrode terminal 15 and its surroundings also have a curved surface shape, but when the mold is closed, the block member 50 is deformed in a manner matching the curved surface shape. Therefore, during injection molding, the block member 50 can fully prevent the electrode terminal 15 and its surroundings from having a gap into which the molten resin MR can penetrate.

[0104] (4-5) Modification 1E

[0105] In the first embodiment, the case where the electrode terminal 15 and the copper wiring 16 are formed on the single-layer film substrate 11 of the film 10 made of resin is described. However, the film 10 may also have a multi-layer structure. Fig.15 and Fig.16 As shown, the film 10 may also include: an outer surface side design layer 12 for decorating the outer surface side of the resin molded product; an inner surface side design layer 13 for decorating the inner surface side of the resin molded product; and an outer coating layer 14 for protecting the copper wiring 16. Fig.16 The Fig.15 The cross section of the film 10 cut along the line II-II of FIG. The outer surface side design layer 12 is provided, for example, to conceal the copper wiring 16 in a manner that is not visible from the outside, or to decorate the resin molded product 1. The inner surface side design layer 13 is provided, for example, when the resin molded body 20 is transparent or translucent, to conceal the copper wiring 16 in a manner that is not visible from the outside, or to decorate the resin molded product 1.

[0106] (4-6) Modification 1F

[0107] In the first embodiment, the case where the copper wiring 16 is provided only on one main surface 10a of the film 10 is described. However, in the film 10, at least one of the electrode terminal 15 and the copper wiring 16 may be provided on multiple surfaces. In the embedded component, wiring may be provided on multiple surfaces of the embedded component, and electrode terminals and wiring may be provided. Fig.17 1 shows a case where the copper wiring 16 is provided on both the one main surface 10a and the other main surface 10b. The copper wiring 16 is arranged on the one main surface 10a and the other main surface 10b through the opening 11a formed in the film substrate 11. Fig.17 One main surface 10 a of the film 10 shown is formed into a resin molded body 20 , thereby manufacturing a resin molded product 1 .

[0108] Alternatively, a plurality of film substrates 11 may be stacked and provided, and the electrode terminals 15 and the copper wirings 16 may be provided on the plurality of film substrates 11 .

[0109] (4-7) Modification 1G

[0110] In the first embodiment, the case where the electrode terminal 15 has the same thickness is described. In the first embodiment, the electrode terminal 15 is deformed in a step-like manner from the portion in contact with the film substrate 11 to the portion in contact with the copper wiring 16 (see Figure 5 ). In addition, in the modification example 1D, an example in which the electrode terminal 25 is deformed into a concave shape is described (refer to Fig.14 ). However, the shape of the electrode terminal 15 is not limited to the above-mentioned shape.

[0111] exist Fig.18 , an electrode terminal 15 having an L-shaped cross section is shown.

[0112] exist Fig.19 FIG. 1 shows an electrode terminal 15 having a stepped cross-sectional shape. Fig.19 Although the electrode terminal 15 is shown to have a stepped shape with only one step, it may also have a stepped shape with a plurality of steps.

[0113] exist Fig. 20 , an electrode terminal 15 having an inclined portion 15a is shown. Fig. 20 The electrode terminal 15 is provided with only one inclined portion 15 a. However, the inclined portion 15 a may be provided at a plurality of locations with respect to one electrode terminal 15 .

[0114] exist Fig.21 2 shows an electrode terminal 15 having an arc-shaped surface. The surface of the electrode terminal 15 may be a curved surface other than an arc.

[0115] exist Fig. 22, the electrode terminal 15 is shown to be convexly bent toward the opposite side of the film substrate 11 .

[0116] Fig.18 , Fig.19 , Fig. 20 , Fig.21 , Fig. 22 The planar shape of the electrode terminal 15 may be any shape, such as a rectangle, a square, an oblong or a circle.

[0117] like Fig.18 , Fig.19 , Fig. 20 , Fig.21 , Fig. 22 As shown, even in the case of the electrode terminal 15 whose exposed surface is not a flat surface, the block member 50 is sufficiently deformed, so that the generation of a gap can be prevented.

[0118] (4-8) Modification 1H

[0119] In the first embodiment, the case where one block member 50 is used for a plurality of electrode terminals 15 is described. Fig.23 , Fig.24 , Fig.25 , Fig.26 and Fig. 27 As described above, one block member 50 may be applied to one electrode terminal 15. As for the relationship between the rectangular parallelepiped electrode terminal 15 and the rectangular parallelepiped block member 50, Fig.23 Three situations are shown in Fig.23 FIG. 4 shows a state where the electrode terminal 15 and the block member 50 have a rectangular planar shape. Fig.23 The electrode terminal 15 and the rectangular surface of the block member 50 , the first surface 91 a and the second surface 92 a of the first mold 91 and the second mold 92 are arranged, for example, in parallel. Fig.23 The block member 50 is shown in a state before the film 10 is injection molded.

[0120] The first case is a case where the block member 50 covers the entire electrode terminal 15 in a plan view. Fig.24 2 shows a cross section of the film 10 and the resin molded body 20 molded in the first case, taken along line III-III.

[0121] The second case is a case where the block member 50 does not cover a portion of the electrode terminal 15 in the short-side direction in a plan view. Fig.25 2 shows a cross section of the film 10 and the resin molded body 20 molded in the second case, taken along the line VI-VI.

[0122] The third case is a case where the block member 50 does not cover a portion of the electrode terminal 15 in the short-side direction and a portion of the long-side direction in a plan view. Fig.26 2 shows a cross section of the film 10 and the resin molded body 20 molded in the third case, cut along the line VV.

[0123] in addition, Fig. 27 4 shows cross sections of the film 10 and the resin molded body 20 molded in the first, second, and third cases, taken along the line VI-VI.

[0124] The wall surface 21a of the opening 21 of the resin molded body 20 formed by the block member 50 is curved in a concave shape. This is because when the block member 50 is elastically deformed by the first surface 91a and the second surface 92a, the portion away from the first surface 91a and the second surface 92a is greatly deformed.

[0125] In addition, among the four sides of the rectangle of the block component 50 when viewed from above, the side that does not overlap with the electrode terminal 15 and is farthest from the electrode terminal 15 is easily deformed by the pressure of the molten resin MR. The internal pressure of the portion of the block component 50 overlapping with the electrode terminal 15 becomes higher due to the thickness of the electrode terminal 15. In contrast, the internal pressure of the portion of the block component 50 overlapping with the electrode terminal 15 becomes lower because it does not overlap with the electrode terminal 15. In this way, the side far from the electrode terminal 15 is easily deformed. In order to avoid such a situation, for example, it is considered to change the thickness of the block component 50 so that the distance to be flattened is the same. In the case of taking such a countermeasure, the block component 50 can be set to a shape in which the portion overlapping with the electrode terminal 15 is thin and the portion not overlapping with the electrode terminal 15 is thick when the first mold 91 and the second mold 92 are not molded.

[0126] The first surface 91a and the second surface 92a are not limited to planes, and are not limited to being arranged parallel to each other. Therefore, the shape of the block component 50 is not limited to a rectangular parallelepiped, and it is preferably selected from various shapes in accordance with the shapes and configuration relationship of the first surface 91a and the second surface 92a.

[0127] (4-9) Modification 1I

[0128] In the first embodiment, the case where the electrode terminal 15 is provided on one main surface 10a and the block component 50 is placed on the one main surface 10a is described. However, it is also possible to configure such that the electrode terminal 15 is provided on the other main surface 10b and the block component 50 is also placed on the other main surface 10b. For example, the film substrate 11 is arranged upright in the vertical direction, and the block components 50 are attached to the one main surface 10a side and the other main surface 10b side of the film substrate 11, thereby enabling the block components 50 to be placed.

[0129] (4-10) Modification 1J

[0130] In the first embodiment, the block member 50 is described as being composed of one polymer compound as a whole. However, the block member 50 may be composed of a plurality of polymer compounds. For example, the first portion 51 and the second portion 52 of the block member 50 may be made of the same silicone elastomer and polymer compounds having different Shore A hardnesses. Alternatively, the first portion 51 and the second portion 52 of the block member 50 may be made of a silicone elastomer and a fluorine elastomer.

[0131] In addition, the block component 50 may use materials other than polymer compounds for the parts other than the first part 51 and the second part 52. For example, a silicone elastomer may be used for the first part 51 and the second part 52, and a metal plate or a ceramic plate may be sandwiched between the first part 51 and the second part 52. The block component 50 in this case becomes a three-layer structure of silicone elastomer / metal plate or ceramic plate / silicone elastomer. In this way, when a material other than a polymer compound is used for the block component 50, it is preferred to construct the block component 50 in such a manner that the polymer compound occupies more than 50% of the total volume. By having the polymer compound occupy more than 50% of the total volume, the block component can be fully elastically deformed.

[0132] <Second embodiment>

[0133] (5) Overview of resin molded products

[0134] In the first embodiment, the case where the plurality of electrode terminals 15 are arranged on the same plane is described. However, the plurality of electrode terminals may be arranged on different planes or on a curved surface.

[0135] Fig.28 An example of the resin molded product 1 according to the second embodiment is shown in FIG. Fig.29 Other examples are shown in .

[0136] exist Fig.28 , a resin molded article 1 having a three-dimensional embedded component 60 having a curved surface is shown. The embedded component 60 is a component in which a film substrate 11 is attached to a three-dimensional base component 62 made of a thermosetting resin, and a copper wiring 16 and a plurality of electrode terminals 15 are formed on the film substrate 11. A plurality of electrode terminals 15 are arranged in a curved surface region 61 of the base component 62. The opening 21 of the resin molded article 20 is also formed in the curved surface region 61. In the second embodiment, the wall surface 21a of the opening 21 is also curved in a concave shape.

[0137] A plurality of electrode terminals 15 are provided on one main surface 60 a of the insert component 60 . A resin molded body 20 is formed on one main surface 60 a of the insert component 60 .

[0138] The block member 50 for forming the opening 21 is shaped like a rectangular parallelepiped. The contact surface 53 of the block member 50 that contacts the curved surface region 61 is a curved surface that matches the curved surface region 61. The opposing surface 54 that faces the contact surface 53 is a curved surface that easily matches the surface of the resin molded body 20 during mold clamping.

[0139] exist Fig.29 1 shows a resin molded article 1 having a three-dimensional embedded component 70 having at least two plane regions (a first plane region 71 and a second plane region 72). The embedded component 70 is a component in which a film substrate 11 is attached to a three-dimensional base component 73 made of a thermosetting resin, and copper wiring 16 and a plurality of electrode terminals 15 are formed on the film substrate 11. The electrode terminals 15 are respectively arranged in the first plane region 71 and the second plane region 72 of the base component 73. The opening 21 of the resin molded article 20 is formed in the boundary portion thereof in the first plane region 71 and across the second plane region 72. In the second embodiment, the wall surface 21a of the opening 21 is also curved in a concave shape.

[0140] A plurality of electrode terminals 15 are provided on one main surface 70 a of the insert component 70 . A resin molded body 20 is formed on one main surface 70 a of the insert component 70 .

[0141] The block member 50 for forming the opening 21 has a shape of two rectangular parallelepipeds combined into a shape of Λ. The first contact surface 55 of the block member 50 that contacts the first planar region 71 is a plane that coincides with the first planar region 71. The second contact surface 56 that contacts the second planar region 72 is a plane that coincides with the second planar region 72. The first opposing surface 57 and the second opposing surface 58 that are opposite to the first contact surface 55 and the second contact surface 56 are two planes that are easy to coincide with the surface of the resin molded body 20 when the mold is closed.

[0142] (6) Method for manufacturing resin molded products

[0143] Second Embodiment Fig.28 and Fig.29 In the manufacturing method of the resin molded article 1 shown in the figure, the shapes of the insert parts 60 and 70 are different from the film 10 of the first embodiment, and accordingly, the shape of the block part 50 is different. However, the flow of the manufacturing method of the resin molded article 1 of the second embodiment is the same as that of the first embodiment. Figure 4 Therefore, the resin molded product 1 of the second embodiment can be manufactured by the same manufacturing method as the manufacturing method described in “(2) Manufacturing method of resin molded product” of the first embodiment.

[0144] (7) Modification

[0145] (7-1) Modification 2A

[0146] In the second embodiment, the resin molded product 1 in which the opening 21 is not filled with a sealing material has been described (see Fig.28 and Fig.29 However, in the resin molded product 1 of the second embodiment, the opening 21 may be filled with a sealing material, similarly to the resin molded product 1 of the first embodiment. In addition, in the second embodiment, when no sealing material is filled, such as using Fig.11 As described above, the connection pin 30 may be joined to the exposed electrode terminal 15 , and the connector 35 may be connected to the connection pin 30 .

[0147] (7-2) Modification 2B

[0148] In the method for manufacturing the resin molded article 1 of the second embodiment, as described in the modification 1B of the first embodiment, a restriction portion for restricting the movement of the block member 50 can be provided in the insert members 60 and 70. The restriction portion provided in the insert members 60 and 70 can be used, for example. Fig.12 The protrusions 17 or openings of the film substrate 11 are shown.

[0149] (7-3) Modification 2C

[0150] In the method for manufacturing the resin molded product 1 of the second embodiment, as described in the modification 1C of the first embodiment, the inhibition portion for inhibiting the movement of the block member 50 can be provided in at least one of the first mold 91 and the second mold 92. The inhibition portion provided in at least one of the first mold 91 and the second mold 92 can be used, for example. Fig.13 The recessed portion 93 shown. The suppression portion can be provided in at least one of the first mold 91 and the second mold 92.

[0151] (7-4) Modification 2D

[0152] In the second embodiment, the case where the plurality of electrode terminals 15 are arranged in the curved surface area 61 or the different first plane areas 71 and second plane areas 72 of the embedded component 60 is described. However, the area where the plurality of electrode terminals 15 are arranged is not limited to this, and for example, they may be arranged in different plurality of curved surface areas, or in a curved surface area and a plane area.

[0153] (7-5) Modification 2E

[0154] In the second embodiment, the resin molded product 1 without the design layer is described. However, the resin molded product 1 of the second embodiment may be provided with a design layer having the same function as at least one of the outer surface side design layer 12 and the inner surface side design layer 13 of the first embodiment. In addition, the resin molded product 1 of the second embodiment may be provided with an outer coating having the same function as the outer coating 14 of the first embodiment.

[0155] (7-6) Modification 2F

[0156] In the second embodiment, the case where the electrode terminal 15 and the copper wiring 16 are provided on one film substrate 11 is described. However, a plurality of film substrates 11 may be stacked and the electrode terminal 15 and the copper wiring 16 may be provided on each of the plurality of film substrates 11 .

[0157] (7-7) Modification 2G

[0158] In the second embodiment, the case where the electrode terminals 15 have the same thickness is described. However, the shape of the electrode terminals 15 in the second embodiment may be the various shapes described in the modified examples 1D and 1G of the first embodiment.

[0159] (7-8) Modification 2H

[0160] In the second embodiment, a case where one block member 50 is applied to the plurality of electrode terminals 15 is described. However, a plurality of block members 50 may be applied to the plurality of electrode terminals 15 of the second embodiment.

[0161] (7-9) Modification 2I

[0162] In the second embodiment, the plurality of electrode terminals 15 are provided on one main surface 60a, 70a and the block member 50 is placed on the one main surface 60a, 70a. However, the plurality of electrode terminals 15 may be provided on the other main surface and the block member 50 may also be placed on the other main surface.

[0163] (7-10) Modification 2J

[0164] In the second embodiment, the case where the entire block member 50 is composed of one polymer compound is described. However, as described in the modification 1J of the first embodiment, the block member 50 may be composed of a plurality of polymer compounds, and a material other than the polymer compound may be used in a portion other than the first portion 51 and the second portion 52. When a material other than the polymer compound is used for the block member 50, it is preferred that the block member 50 be constructed in such a manner that the polymer compound accounts for 50% or more of the total volume.

[0165] (8) Features

[0166] (8-1)

[0167] The manufacturing method of the resin molded product 1 of the first embodiment and the second embodiment comprises: a first step S1, setting an embedded component 60, 70 having a main surface 10a, 60a, 70a or a film 10 serving as an embedded component between a first mold 91 and a second mold 92; a second step S2, closing the first mold 91 and the second mold 92 to form a molding space SP for accommodating the embedded component 60, 70 or the film 10 serving as the embedded component; a third step S3, allowing molten resin MR to flow into the molding space SP to mold a resin molded body 20 embedded with the embedded component 60, 70 or the film 10 serving as the embedded component; and a fourth step S4, opening the first mold 91 and the second mold 92 and taking out the resin molded body 20 embedded with the embedded component 60, 70 or the film 10 serving as the embedded component.

[0168] In the first step S1 , the block member 50 is placed on one of the main surfaces 10 a , 60 a , 70 a so as to be in contact with the electrode terminal 15 for electrical connection provided on the one of the main surfaces 10 a , 60 a , 70 a .

[0169] In the second step S2, the embedded components 60, 70 or the film 10 and the block component 50 as the embedded components are clamped by the first surface 91a of the first mold 91 serving as the first surface within the inner surface of the molding space SP and the second surface 92a of the second mold 92 serving as the second surface within the inner surface, so that the block component 50 having an elastic polymer compound arranged in the first portion 51 and the second portion 52 in contact with the first surface 91a and the second surface 92a is elastically deformed.

[0170] In the third step S3 , the periphery of the block member 50 is filled with the molten resin MR, and the resin around the block member 50 is solidified.

[0171] In the fourth step S4 , the block member 50 is removed from the resin molded body 20 to expose the electrode terminal 15 .

[0172] In the method for manufacturing a resin molded product according to the first embodiment and the second embodiment or these modified examples, even when the electrode terminal 15 and its surroundings of the embedded component 60, 70 or the film 10 as the embedded component are uneven or the position of the embedded electrode terminal 15 varies greatly, the block component 50 is in close contact with the electrode terminal 15 and its surroundings during the mold closing in the second step S2. In the state where the block component 50 is in close contact with the electrode terminal 15 and its surroundings, the periphery of the block component 50 can be filled with the molten resin MR in the third step S3.

[0173] (8-2)

[0174] In the method for manufacturing the resin molded article 1 of the first embodiment and the second embodiment or these modified examples, the polymer compound has elasticity by, for example, containing a silicone elastomer or a fluorine elastomer, or being processed into a sponge-like state. As a result, the block member 50 that can be easily adhered to the electrode terminal 15 and its surroundings and can be appropriately deformed can be used for manufacturing the resin molded article 1.

[0175] (8-3)

[0176] In the manufacturing method of the resin molded article 1 of the first embodiment and the second embodiment or these modified examples, the first distance between the surface of the first portion 51 and the surface of the second portion 52 before elastic deformation caused by sandwiching the block member 50 by the first surface 91a and the second surface 92a is within a range of 1.2 to 3 times the second distance between the surface of the first portion 51 and the surface of the second portion 52 after elastic deformation. As a result, damage to the block member 50 can be prevented and the block member 50 can be sufficiently closely fitted to the electrode terminal 15 and its surroundings.

[0177] (8-4)

[0178] In the method for manufacturing the resin molded product 1 of the first and second embodiments or these modified examples, the block member 50 has a hardness of Shore A20 or more and Shore A70 or less. As a result, the block member 50 having an appropriate hardness can be firmly attached to the electrode terminal 15 and its periphery.

[0179] (8-5)

[0180] The block component 50 of the method for manufacturing the resin molded product 1 of the first embodiment and the second embodiment or these modified examples is configured such that the polymer compound accounts for 50% or more of the total volume. As a result, the block component 50 that can be easily adhered to the electrode terminal 15 and its surroundings and can be appropriately deformed can be used for manufacturing the resin molded product 1.

[0181] (8-6)

[0182] The resin molded product 1 of the first embodiment and the second embodiment or these modified examples includes a resin molded body 20 molded into a predetermined shape and a film 10 or an embedded component 60, 70 as an embedded component. The film 10 or the embedded component 60, 70 as an embedded component is embedded in the resin molded body 20, and has an electrode terminal 15 for electrical connection on one main surface 10a, 60a, 70a. The resin molded body 20 has an opening 21 that exposes a part of the electrode terminal 15. Moreover, the wall surface of the opening 21 is curved in a concave shape.

[0183] Such a resin molded article 1 can firmly fix the sealing material 40 when the sealing material 40 is filled in the opening 21 , for example, by bending the wall surface of the opening 21 in a concave shape.

[0184] (8-7)

[0185] In the resin molded product 1 of the first embodiment and the second embodiment or these modified examples, the electrode terminal 15 can be set to a concave-convex shape or a curved surface shape. In addition, it is possible to provide a resin molded product 1 of good quality in which the electrode terminal 15 is set to a shape suitable for the application and there is no intrusion of resin into the electrode terminal 15 and its surroundings.

[0186] (8-8)

[0187] The insert components 60 and 70 of the resin molded product 1 of the second embodiment or its modified example have a plurality of electrode terminals 15, and the plurality of electrode terminals 15 are arranged in the curved surface area 61 of the insert component 60, or in the first plane area 71 and the second plane area 72 of the insert component 70. In this way, it is possible to provide a resin molded product 1 of good quality in which the plurality of electrode terminals 15 are formed to conform to the shape of the insert components 60 and 70 and no resin intrusion occurs in the plurality of electrode terminals 15 and their peripheries.

[0188] The first and second embodiments of the present invention are described above, but the present invention is not limited to the above embodiments, and various modifications can be made without departing from the gist of the invention. In particular, the multiple embodiments and modifications described in this specification can be arbitrarily combined as needed.

[0189] Description of Reference Numerals

[0190] 1: resin molded product, 10: film (example of embedded component), 10a: one main surface, 15: electrode terminal, 20: resin molded body, 21: opening, 40: sealing material, 50: block component, 51: first part, 52: second part, 60, 70: embedded component, 60a, 70a: one main surface, 61: curved surface area, 71: first plane area, 72: second plane area, 91: first mold, 91a: first surface, 92: second mold, 92a: second surface, MR: molten resin, SP: molding space.

Claims

1. A method for producing a resin molded product, comprising: In a first step, an embedded component having a main surface is disposed between a first mold and a second mold; The second step is to close the first mold and the second mold to form a molding space for accommodating the embedded component; The third step is to flow molten resin into the molding space to mold the resin molded body in which the embedded component is embedded; as well as In the fourth step, the first mold and the second mold are opened and the resin molded body with the embedded component is taken out. In the first step, a block member is placed on the one main surface so as to contact an electrode terminal for electrical connection provided on the one main surface. In the second step, the embedding member and the block member are sandwiched by the first surface of the first mold as the first surface in the inner surface of the molding space and the second surface of the second mold as the second surface in the inner surface, so that the block member having the elastic polymer compound arranged in the first portion and the second portion in contact with the first surface and the second surface is elastically deformed. In the third step, the molten resin is filled around the block and the resin around the block is solidified. In the fourth step, the block member is removed from the resin molded body to expose the electrode terminal.

2. The method for producing a resin molded article according to claim 1, wherein The polymer compound has elasticity by including a silicone elastomer or a fluorine elastomer or by being processed into a sponge shape.

3. The method for producing a resin molded article according to claim 1 or claim 2, wherein: A first distance between the first portion and the second portion before elastic deformation caused by sandwiching the block member between the first and second surfaces is within a range of 1.2 to 3 times a second distance between the first portion and the second portion after elastic deformation.

4. The method for producing a resin molded article according to claim 1 or claim 2, wherein: The block member has a hardness of Shore A20 or more and Shore A70 or less.

5. The method for producing a resin molded article according to claim 1 or claim 2, wherein: The polymer compound occupies more than 50% of the total volume of the block member.

6. A resin molded article comprising: A resin molded body molded into a predetermined shape; and an embedded component embedded in the resin molded body and having an electrode terminal for electrical connection on one main surface, The resin molded body has an opening that exposes a portion of the electrode terminal. The wall surface of the opening is curved in a concave shape.

7. The resin molded article according to claim 6, wherein The electrode terminal is concave-convex or curved.

8. The resin molded article according to claim 6 or claim 7, wherein The embedded component has a plurality of electrode terminals. The plurality of electrode terminals are arranged in the curved surface region of the embedding component, or in the first planar region and the second planar region of the embedding component.

Images