Substrate inspection apparatus, film formation apparatus, substrate inspection method, and film formation method

Abstract

A substrate inspection apparatus is used, and the substrate inspection apparatus is characterized in that the substrate inspection apparatus is provided with: a support member that supports a substrate; an image capturing unit that captures an image of the substrate supported by the support unit; and a determination section that determines whether or not the substrate is broken on the basis of the imaging result of the imaging section, and that determines whether or not the substrate is broken on the basis of the distance between the first reference point and the second reference point calculated from the imaging result.

Description

Technical Field

[0001] The present invention relates to a substrate inspection device, a film forming device having the substrate inspection device, a substrate inspection method using the substrate inspection device, and a film forming method including the substrate inspection method. Background Art

[0002] As a flat panel display device, an organic EL display device is known. An organic EL element constituting an organic EL display device has the following basic structure: a functional layer is formed between two opposing electrodes (a cathode electrode and an anode electrode), and the functional layer has a light-emitting layer as an organic material layer that causes light emission. The functional layer and electrode layer of the organic EL element are formed by forming a film of the material constituting each layer on a substrate such as glass through a mask in a film forming device.

[0003] When a film forming device is forming a film, an image obtained by photographing a substrate using a photographing device is sometimes used for alignment, inspection, etc. of the substrate. Patent document 1 discloses the following technology: a linear light is irradiated on the surface of a substrate so as to cross the surface of the substrate in a width direction perpendicular to the conveying direction of the substrate, and on this basis, the substrate is photographed while being conveyed, and a plurality of images are connected to obtain an image of the entire substrate, and the edge of the substrate is detected based on the image to detect cracks in the substrate.

[0004] Prior Art Literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2017-150937 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, in the above structure in which the substrate is continuously photographed while being transported, if the substrate moves during transport due to insufficient holding of the substrate by the transport component, an appropriate image cannot be obtained, and cracks in the substrate cannot be detected. Therefore, a transport component that does not hinder photographing and can sufficiently hold the substrate and transport it with high accuracy is required, which increases the equipment cost.

[0009] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a technology for detecting cracks in a substrate with a low-cost and simple structure.

[0010] Means for solving problems

[0011] The substrate inspection device of the present invention is characterized in that the substrate inspection device comprises:

[0012] a supporting member, the supporting member supporting the substrate;

[0013] an imaging component that captures an image of the substrate supported by the supporting component; and

[0014] a determination unit that determines whether the substrate is cracked based on the imaging result of the imaging unit,

[0015] The determination unit determines whether the substrate is cracked based on a distance between a first reference point and a second reference point calculated based on the imaging result.

[0016] In addition, the substrate inspection method of the present invention is a substrate inspection method using a substrate inspection device, wherein the substrate inspection device comprises: a supporting member that supports a substrate; and a photographing member that photographs the substrate supported by the supporting member, wherein:

[0017] The substrate inspection method includes performing a determination step, in which, based on the imaging result of the imaging component, it is determined whether the substrate is cracked.

[0018] In the determination step, whether or not the substrate is cracked is determined based on a distance between a first reference point and a second reference point calculated from the imaging result.

[0019] Effects of the Invention

[0020] According to the present invention, it is possible to provide a technology for detecting cracks in a substrate with a low-cost and simple structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic structural diagram of a film forming device.

[0022] Figure 2 This is a schematic structural diagram of a substrate lifting device installed in a carrier transfer chamber.

[0023] Figure 3 This is a diagram showing a state where a substrate carrier is carried into a carrier delivery chamber.

[0024] Figure 4 This is a diagram showing a state in which a substrate is being carried into a carrier delivery chamber.

[0025] Figure 5 This is a diagram showing a state where a substrate is supported by a substrate lifting device in a carrier delivery chamber.

[0026] Figure 6 This is a diagram showing a state where a substrate is held on a substrate carrier in a carrier delivery chamber.

[0027] Figure 7 It is a top view illustrating the structure of a substrate and a substrate carrier.

[0028] Figure 8 is a cross-sectional view of the adsorption pad and clamping member of the substrate carrier.

[0029] Fig. 9 It is a diagram showing a peeling method of peeling a substrate from a substrate carrier.

[0030] Fig.10 2 is a diagram showing a captured image and an edge image of a substrate and a substrate carrier.

[0031] Fig.11 This is a diagram showing the diagonal dimensions of a substrate obtained during a crack inspection of the substrate.

[0032] Fig.12 This is a flow chart of the crack inspection of the substrate.

[0033] Fig.13 This is a schematic structural diagram of the film forming chamber.

[0034] Fig.14 A diagram illustrating the structure of an electronic device. DETAILED DESCRIPTION

[0035] Hereinafter, with reference to the accompanying drawings, the form for implementing the present invention will be described in detail by way of example based on the embodiments. However, the size, material, shape, relative arrangement, etc. of the structural components described in the present embodiment should be appropriately changed according to the structure and various conditions of the device to which the present invention is applied. That is, it is not intended to limit the scope of the present invention to the following embodiments.

[0036] The present invention can be applied to, for example, a film forming device that forms a thin film of a film forming material on the surface of a film forming object such as a substrate by evaporation or sputtering while conveying the substrate, and can be preferably applied to a device that forms a thin film (material film) of a desired pattern by vacuum evaporation. As the material of the substrate, any material such as glass, a thin film of a polymer material, a silicon wafer, a metal, etc. can be selected. For example, the substrate can also be a substrate on which a thin film of polyimide or the like is deposited on a glass substrate. In addition, as the evaporation material, any material such as an organic material, a metal material (metal, metal oxide, etc.) can also be selected. In addition, in addition to the vacuum evaporation device described in the following description, the present invention can also be applied to a film forming device including a sputtering device and a CVD (Chemical Vapor Deposition) device. Specifically, the technology of the present invention can be applied to manufacturing devices for organic electronic devices (such as organic light-emitting elements, thin-film solar cells), optical components, etc. Among them, a manufacturing device for an organic light-emitting element that forms an organic light-emitting element by evaporating the evaporation material and evaporating it on the substrate through a mask is also one of the preferred application examples of the present invention. Hereinafter, a case where the present invention is applied to an electronic device manufacturing apparatus will be described as an example, but the substrate inspection apparatus of the present invention is not limited thereto, and can be applied to the above-mentioned various manufacturing apparatuses.

[0037] (Example)

[0038] <Film forming equipment>

[0039] Figure 1 1 is a top view showing a schematic structure of a film forming device according to an embodiment of the present invention. Here, a film forming device in a production line of an organic EL display is described. When manufacturing an organic EL display, a substrate of a specified size is brought into the film forming device, and an organic EL and metal layer are formed. The substrate after film formation is brought out to a subsequent process, and is subjected to subsequent processing such as substrate cutting.

[0040] In this embodiment, a film forming device called a linear type is used as an example for explanation. In a linear film forming device, a plurality of chambers (cavities) are arranged in an array, and substrates, substrate carriers, and masks are sequentially transported to each chamber, and various processes are performed in each chamber. In the transportation of substrates, etc., conveying rollers and linear motors are used as conveying components. A plurality of conveying rollers are arranged along the conveying direction on both sides of the conveying path, and are respectively rotated by the driving force of an AC servo motor (not shown) to transport the substrate carrier 100 and the mask M to the inside and outside of each chamber. In each chamber, it is configured to be able to be set to a vacuum atmosphere or an inert gas atmosphere according to each chamber or according to a plurality of adjacent chambers. In order to maintain the vacuum state inside the vacuum container, the film forming device is equipped with a vacuum pump (not shown).

[0041] Furthermore, the film forming apparatus to which the substrate inspection apparatus of the present invention is applied is not limited to a linear type, but may be a cluster type film forming apparatus in which a film is formed while a substrate is transported between a plurality of chambers arranged around a transport robot.

[0042] exist Figure 1 In the figure, only the chambers that perform representative processing among the multiple chambers are marked with reference numerals R and the other chambers are omitted with black dots. Figure 1 In the figure, the arrow of the thin solid line indicates the conveying path of the substrate carrier 100, the arrow of the thin dotted line indicates the conveying path of the substrate 200, and the arrow of the thick solid line indicates the conveying path of the mask M. The actions of the devices equipped in each chamber are controlled by a control unit C such as a computer. The control unit C can be set separately for each device, or a common control unit C can be set for multiple devices. In general, it is a well-known technology to control various actions using a control unit. As the control unit C, for example, an information processing device or a processing circuit having computing resources such as a processor and a memory can be used.

[0043] First, the substrate carrier 100 and the substrate 200 are transported to the substrate loading chamber R1, and the substrate 200 is held on the upper side of the substrate carrier 100 in the substrate loading chamber R1. In the substrate loading chamber R1, the substrate carrier 100 is arranged in a state where the substrate holding surface faces upward in the vertical direction. The substrate 200 transported into the substrate loading chamber R1 is placed on the holding surface of the substrate carrier 100 in such a manner that the film-forming surface faces upward in the vertical direction. During this placement, the film-forming device photographs the substrate 200 and obtains position information, and performs position adjustment (first alignment) in such a manner that the substrate 200 comes to a predetermined position on the substrate carrier 100. The substrate carrier 100 and the substrate 200 held on the substrate carrier 100 are transported to the reversing chamber R2.

[0044] The reversing chamber R2 is provided with a reversing mechanism, which reverses the direction of the substrate holding surface of the substrate carrier 100 from the upper side in the vertical direction to the lower side in the vertical direction. In the reversing chamber R2, the substrate carrier 100 is rotated 180 degrees in an upside-down manner together with the substrate 200 to hold the substrate 200 at the lower side of the substrate carrier 100.

[0045] Furthermore, the mask M is transported to the reversing chamber R2 from a path different from the transport path of the substrate carrier 100. In the reversing chamber R2, the substrate carrier 100 holding the substrate 200 on the lower side is placed on the mask M. Then, the substrate 200 held on the substrate carrier 100 is transported to the film forming chamber R3 together with the mask M transported to the reversing chamber R2. In addition, the rotation of the substrate carrier 100, the merging with the mask M, and the placement on the mask M may be performed in different chambers, respectively.

[0046] The reversing chamber R2 is provided with an alignment device for aligning the substrate carrier 100 (and the substrate 200 held therein) with the mask M. The alignment device places the substrate carrier 100 on the mask M in a state where the substrate 200 and the mask M are in a predetermined positional relationship in the in-plane direction of the film-forming surface of the substrate 200. In the reversing chamber R2, when the substrate carrier 100 is placed on the mask M, the film forming device captures the substrate 200 and the mask M to obtain position information, and performs position adjustment of the substrate 200 and the mask M in the in-plane direction (second alignment).

[0047] Next, in the film forming chamber R3, after a thin film is formed on the surface of the substrate 200 via a mask M having an opening at a desired film forming position, the substrate carrier 100 and the like are transported to the mask unloading chamber R4. In addition, in general, in order to be able to form a thin film using different materials, such as Figure 1 As shown in the figure, a plurality of film forming chambers R3 are provided. Therefore, generally, a film forming process is performed in a specific film forming chamber R3 by conveying the substrate 200 once.

[0048] After film formation, in the mask unloading chamber R4, the substrate 200 held on the substrate carrier 100 is lifted from the mask M. The mask M that has been used a predetermined number of times is unloaded from the mask unloading chamber R4 to the outside of the device. The substrate 200 held on the substrate carrier 100 and the reused mask M are transported from the mask unloading chamber R4 to the transfer chamber R5. The mask M in the transfer chamber R5 is transported toward the reversing chamber R2. A mask stocker that stores a plurality of masks M and carries them out as needed may also be arranged on the production line. The substrate carrier 100 and the substrate 200 in the transfer chamber R5 are turned over in a reversing chamber (not shown) so that the film-forming surface of the substrate 200 and the substrate holding surface of the substrate carrier 100 face upward in the vertical direction, and then are transported to the substrate stripping chamber R6.

[0049] Then, in the substrate peeling chamber R6, the substrate 200 is peeled off from the substrate carrier 100. Thereafter, the substrate carrier 100 is carried out to the outside of the film forming apparatus or transported to the substrate loading chamber R1 again. In addition, the substrate 200 peeled off from the substrate carrier 100 is taken out to the outside. In addition, the present invention is not limited to Figure 1 The structure of upward deposition may also be a structure of downward deposition or a structure of side deposition. In this embodiment, after the substrate 200 is peeled off from the substrate carrier 100 in the substrate peeling chamber R6, the substrate 200 is inspected for cracks. The details of the method for inspecting cracks in the substrate 200 will be described later.

[0050] <Substrate lifting device>

[0051] Reference Figure 2The structure of the substrate lifting device disposed in the substrate loading chamber R1 is described. The substrate lifting device includes a carrier delivery chamber 300, a lifting mechanism 400, and a clamping rotating mechanism 500 as a clamping driving member. In addition, a plurality of lifting mechanisms 400 having the same structure may be disposed.

[0052] Figure 2 1 is a diagram showing the schematic structure of the carrier transfer chamber 300 and the substrate lifting device of this embodiment. The carrier transfer chamber 300 includes: an opening 311, the opening 311 allows the substrate carrier 100 to pass through; a carrier gate valve 312, the carrier gate valve 312 can open and close the opening 311; an opening 321, the opening 321 allows the substrate 200 to pass through; and a substrate gate valve 322, the substrate gate valve 322 can open and close the opening 321. In addition, the above-mentioned opening 311 and the carrier gate valve 312 are respectively arranged at Figure 2 Thus, the substrate carrier 100 enters the carrier delivery chamber 300 from the back side of the paper, and is carried out to the outside of the carrier delivery chamber 300 toward the front side of the paper. In addition, although not shown in the figure, an opening 311 and a carrier gate valve 312 are also provided on the right side of the carrier delivery chamber 300.

[0053] In addition, a carrier support member 330 is provided in the carrier delivery chamber 300, and the carrier support member 330 supports the substrate carrier 100 when the substrate 200 is placed on the substrate carrier 100. The carrier support member 330 supports the outer periphery of the substrate carrier 100 in a manner that does not hinder the movement of the support pins provided in the lifting mechanism. Alternatively, an opening portion may be provided in the carrier support member 330 in the area through which the support pins pass. In addition, a conveying roller for conveying the substrate carrier 100 may be provided in the substrate loading chamber R1 (carrier delivery chamber 300). In this case, when the substrate 200 is placed on the substrate carrier 100, the conveying roller can support the substrate carrier 100.

[0054] Furthermore, a photographing component 350 (photographing component) is provided in the carrier delivery chamber 300. Although only one photographing component 350 is shown in each figure, in general, a plurality of photographing components 350 are provided. The control unit C obtains position information based on an image obtained by photographing the substrate carrier 100 and the substrate 200 using the photographing component 350, thereby being able to adjust (align) the position of the substrate carrier 100 and the substrate 200. A wide-angle photographing component 350 capable of photographing the entire substrate may be provided, or a plurality of photographing components 350 having a field of view capable of photographing a portion of the substrate 200 may be provided. In the case of alignment based on an edge image of the substrate 200, the photographing component 350 is configured so that at least a portion of the edge and end of the substrate 200 is included in the field of view angle.

[0055] In addition, the imaging component 350 can also function as a distinguishing component for distinguishing the type of the substrate carrier 100 or the type of the substrate 200. For example, various marks can be marked in advance according to the type of the substrate carrier 100, and the type of the substrate carrier 100 can be distinguished based on the marks photographed by the imaging component 350. The imaging component 350 used for alignment and the imaging component 350 used as a distinguishing component can be provided separately, or one of the imaging components 350 generally provided for alignment can also be used as a distinguishing component.

[0056] In this embodiment, regarding the lifting mechanism 400, it is configured so that only the support pin 411 is inserted into the carrier delivery chamber 300, and regarding the clamping and rotating mechanism 500, it is configured so that only the press-in pin 511 is inserted into the carrier delivery chamber 300. In this way, it is possible to suppress the lubricant, wear powder, etc. from intruding into the carrier delivery chamber 300. In addition, it is possible to have a structure in which the entire substrate lifting device is arranged in the substrate loading chamber R1, or it is possible to have a structure in which the above-mentioned carrier delivery chamber 300 is equivalent to the substrate loading chamber R1. In the latter case, most of the structures of the lifting mechanism (structures other than the support pin 411) and most of the structures of the clamping and rotating mechanism 500 (structures other than the press-in pin 511) are arranged outside the substrate loading chamber R1.

[0057] The lifting mechanism 400 includes a plurality of support pins 411, a first plate 410 supporting the plurality of support pins 411, and a ball screw mechanism 420 as a first lifting member for lifting the first plate 410. The ball screw mechanism 420 includes a motor 421, a screw shaft 422 that is rotated by the motor 421, a nut portion 423 that moves up and down along the screw shaft 422 as the screw shaft 422 rotates, and a support column 424 that is fixed to the nut portion 423 and moves up and down together with the nut portion 423. The plurality of balls are configured to circulate endlessly between the inner circumference of the nut portion 423 and the outer circumference of the screw shaft 422. The first plate 410 is supported by the support column 424, and the support pins 411 move up and down together with the first plate 410 as the screw shaft 422 rotates. The plurality of support pins 411 as support members for supporting the substrate 200 are configured to be able to abut against the substrate 200 from below in the vertical direction. By moving the support pins 411 up and down in the carrier delivery chamber 300 , the substrate 200 is moved up and down.

[0058] In the present embodiment, a case where a ball screw mechanism is used as the lifting member for lifting the plate is shown, but other known techniques such as a rack-and-pinion system may be used as the lifting member.

[0059] In addition, the substrate lifting device has an alignment mechanism 430 as an alignment component, and the alignment mechanism 430 adjusts the position of the substrate 200 relative to the substrate carrier 100 by moving the plurality of support pins 411 in a vertical direction relative to the lifting direction of the substrate 200. In addition, in this embodiment, the lifting direction of the substrate 200 is a vertical direction. Therefore, the alignment mechanism 430 is configured to be able to move the plurality of support pins 411 in a horizontal direction. Specifically, the alignment mechanism 430 has a plurality of support pins 411 that can move in a horizontal direction. Figure 2 The first rail 431 extends in the left-right direction (hereinafter referred to as the "X-axis direction") and the second rail 432 extends in the perpendicular direction (hereinafter referred to as the "Y-axis direction") relative to the first rail 431. In addition, the X-axis direction and the Y-axis direction are both perpendicular to the vertical direction. The second rail 432 is configured to be able to reciprocate along the first rail 431.

[0060] Furthermore, the alignment mechanism 430 includes a base 433 on which the lifting mechanism 400 is placed. The base 433 is configured to be reciprocating along the second track 432. In addition, the alignment mechanism 430 includes: a first shaft portion 434, which is fixed to the base 433 and extends in the X-axis direction; and a second shaft portion 436, which is fixed to the base 433 and extends in the Y-axis direction. Furthermore, the alignment mechanism 430 includes a moving mechanism 435 that moves the first shaft portion 434 in the X-axis direction and a moving mechanism (not shown) that moves the second shaft portion 436 in the Y-axis direction. Regarding these moving mechanisms, various known technologies such as a ball screw mechanism and a rack-and-pinion mechanism can be adopted.

[0061] By using the alignment mechanism 430 configured as described above to move the lifting mechanism 400 and the base 433 in the X-axis direction and the Y-axis direction, the plurality of support pins 411 can be moved in the horizontal direction. Thus, the substrate 200 placed on the plurality of support pins 411 can be moved and adjusted in the horizontal direction, and the position of the substrate 200 relative to the substrate carrier 100 can be adjusted.

[0062] The clamping rotation mechanism 500 includes a plurality of press-in pins 511, a clamping plate 510 that supports the plurality of press-in pins 511, and a ball screw mechanism 520 that raises and lowers the clamping plate 510. The ball screw mechanism 520 includes a motor 521, a screw shaft 522 that is rotated by the motor 521, a nut portion 523 that moves up and down along the screw shaft 522 as the screw shaft 522 rotates, and a support column 524 that is fixed to the nut portion 523 and moves up and down together with the nut portion 523. The plurality of balls are configured to circulate endlessly between the inner peripheral surface of the nut portion 523 and the outer peripheral surface of the screw shaft 522. In addition, the clamping plate 510 is supported by the support column 524, and the press-in pins 511 move up and down together with the clamping plate 510 as the screw shaft 522 rotates. Furthermore, although the case where a ball screw mechanism is used as the lifting member for lifting and lowering the clamping plate 510 is shown, other known techniques such as a rack-and-pinion system may be used as the lifting member.

[0063] <Operation of placing a substrate on a substrate carrier>

[0064] Reference Figure 3~Figure 6 , an operation of holding the substrate 200 on the substrate carrier 100 in the carrier delivery chamber 300 using the substrate lifting device configured as described above will be described. Figure 3 This is a diagram showing a state where the substrate carrier 100 is carried into the carrier delivery chamber 300 . Figure 4 This is a diagram showing a state in which the substrate 200 is being carried into the carrier delivery chamber 300 . Figure 5This is a diagram showing a state where the substrate 200 is supported by the support pins 411 . Figure 6 1 is a diagram showing a state where the substrate 200 is held by the substrate carrier 100 .

[0065] First, the carrier gate valve 312 is operated to open the opening 311, and the substrate carrier 100 is carried into the carrier delivery chamber 300. The substrate carrier 100 carried into the carrier delivery chamber 300 is supported by the carrier support member 330 (see Figure 3 In addition, in order to make the structure of each part easy to understand, Figure 3 In the following drawings, illustration of the opening 311 and the carrier gate valve 312 is omitted.

[0066] The substrate carrier 100 is provided with a plurality of clamps 110 for holding the substrate 200 on the substrate carrier 100. The clamps 110 are rotatably provided on the substrate carrier 100 while being urged in a direction for clamping the substrate 200 held by the substrate carrier 100, that is, in a first rotation direction. Figure 3 In the drawing, the left clamp 110 is rotatably provided on the substrate carrier 100 when a force is applied in a clockwise direction, and the right clamp 110 is rotatably provided on the substrate carrier 100 when a force is applied in a counterclockwise direction.

[0067] After the substrate carrier 100 is supported by the carrier support member 330 , the opening 321 is opened by the operation of the substrate gate valve 322 , and the substrate 200 is carried into the carrier delivery chamber 300 (see FIG. 1 ). Figure 4 ). The substrate 200 is moved into the carrier transfer chamber 300 by a conveying robot. Figure 4 , only a part of the hand 250 of the transport robot that supports the substrate 200 is shown. The hand 250 is generally provided in a comb-teeth shape so as not to hinder the movement of the support pins 411 and the like.

[0068] In addition, when the substrate 200 is carried in, the plurality of support pins 411 are raised to a predetermined position together with the first plate 410 by the lifting mechanism 400. In addition, the plurality of support pins 411 are arranged to penetrate the plurality of through holes provided in the substrate carrier 100, and the top ends of the plurality of support pins 411 are moved to a position above the upper surface of the substrate carrier 100 and below the lower surface of the carried-in substrate 200.

[0069] Furthermore, the clamping rotating mechanism 500 causes the plurality of press-in pins 511 to rise together with the clamping plate 510, and the top ends of the press-in pins 511 press the corresponding clamping members 110. As a result, the clamping members 110 rotate in a second rotation direction opposite to the first rotation direction, and the substrate 200 is placed on the substrate carrier 100 from above (see FIG. Figure 4 ).

[0070] The order of loading the substrate 200 into the carrier delivery chamber 300 , raising the first plate 410 by the lifting mechanism 400 , and raising the clamping plate 510 by the clamping rotating mechanism 500 is not particularly limited, and they may be performed simultaneously.

[0071] After the substrate 200 is placed on the top of the plurality of support pins 411 and the hand 250 of the transfer robot is retracted, the first plate 410 is lowered to a predetermined position by the lifting mechanism 400. Thus, the substrate 200 is brought into a state of being sufficiently close to the substrate carrier 100 (see Figure 5 ).

[0072] In this state, the alignment mechanism 430 is used to adjust the movement of the substrate 200 in the X-axis direction and the Y-axis direction, and the position of the substrate 200 relative to the substrate carrier 100 is adjusted. After that, the first plate 410 is further lowered by the lifting mechanism 400, and the top ends of the plurality of support pins 411 are moved to a position below the lower surface of the substrate carrier 100. In this process, the substrate 200 is placed on the substrate carrier 100. In addition, a plurality of adsorption pads 130 (see Figure 8 ), the substrate 200 is in a state of being adsorbed by the plurality of adsorption pads 130. In addition, there is also a case where the adsorption by the adsorption pads 130 becomes insufficient if the substrate 200 is simply placed on the substrate carrier 100. Therefore, it is also preferred to go through the following process, that is, by pressing the substrate 200 downward, so that the adsorption by the adsorption pads 130 is more reliable.

[0073] After the substrate 200 is placed on the substrate carrier 100, the clamping plate 510 is lowered by the clamping rotation mechanism 500. As a result, the press pin 511 is separated from the clamp 110, and the clamp 110 rotates in the first rotation direction to clamp the substrate 200 into the substrate carrier 100. As a result, the substrate 200 is held on the substrate carrier 100 (see Figure 6 The substrate 200 held as described above is carried out from the carrier delivery chamber 300 together with the substrate carrier 100 and transported to the reversing chamber R2.

[0074] <Substrate and substrate carrier>

[0075] Next, refer to Figure 7 , Figure 8 , the substrate 200 and the substrate carrier 100 used in the film forming apparatus of this embodiment are described.

[0076] Figure 7 (a) is a top view of the substrate 200. The substrate 200 is substantially rectangular and is formed along the Figure 7 The film is cut at the cutting lines 211 and 212 indicated by the dashed lines in the figure. When used for a display, the inner portion surrounded by the dotted lines in the figure becomes an image display portion, which corresponds to a display element region.

[0077] Figure 7 (b) is a top view of the substrate carrier 100. The substrate carrier 100 is provided with a plurality of clamps 110. The number and arrangement of the clamps 110 can be appropriately set according to the size and weight of the substrate carrier and the substrate 200. The substrate carrier 100 has a predetermined area ( Figure 7 (b) and a plurality of through holes 121 arranged along the outer periphery of the substrate carrier 100. When the substrate 200 is held on the substrate carrier 100, the plurality of through holes 121 are arranged along the cutting lines 211 and 212 in the substrate 200, and the plurality of through holes 122 are arranged along the outer periphery of the substrate carrier 100. Figure 7 In addition, when the substrate 200 is held on the substrate carrier 100, the plurality of through holes 122 are provided along the outer periphery of the substrate 200 and are located at Figure 7 (a) is set outside the area surrounded by the dotted line.

[0078] The plurality of through holes 121 and 122 are used for the purpose of allowing the support pin 411 to pass through and for the purpose of installing the adsorption pad 130. The through holes used for the support pin 411 to pass through and the through holes used for installing the adsorption pad 130 can be appropriately set to be alternately arranged. The hole diameter of the through hole used for the support pin 411 to pass through and the hole diameter of the through hole used for installing the adsorption pad 130 can be set to be the same or different.

[0079] Reference Figure 8 , the substrate carrier 100 is described in more detail. Figure 8 yes Figure 7 (b) AA section view. Figure 8As shown in the figure, the diameter of the through hole 121 for the support pin 411 to pass through is set to be larger than the outer diameter of the support pin 411. As a result, the support pin 411 can pass through the through hole, and the support pin 411 can be moved in the horizontal direction relative to the substrate carrier 100 during alignment. In addition, in order to suppress the positional deviation of the substrate 200, a positional deviation prevention member 411a made of an elastic material such as rubber is provided at the top end of the support pin 411.

[0080] In addition, the adsorption pad 130 is installed on the substrate carrier 100 in a state of passing through the through hole for the adsorption pad 130. The adsorption pad 130 includes: a metal pad body 131, the pad body 131 having a flange portion 131a; an adhesive member 132, the adhesive member 132 is provided at the top of the pad body 131 via an adhesive layer not shown; and a fixing member 133, the fixing member 133 is used to fix the pad body 131 to the through hole. In addition, the flange portion 131a and the fixing member 133 are integrated by a known method. In addition, the fixing member 133 and the substrate carrier 100 can be fixed by a known technique such as bolts. As the material of the adhesive member 132, in order to suppress the generation of exhaust gas that may have an adverse effect on the manufacturing process under vacuum, it is preferred to use fluororubber that does not contain siloxane bonds. In addition, the material constituting the adhesive layer is also preferably a known adhesive or double-sided tape that does not emit exhaust components. The adhesive member 132 is configured to be adjustable in a certain range in the vertical direction in the figure using a spacer not shown, etc., so that the amount of protrusion from the surface of the substrate carrier 100 can be managed. The above-mentioned protrusion amount depends on the size of the member constituting the adsorption pad 130 and the compression characteristics of the adhesive member 132, but is smaller than the thickness of the substrate 200. The hole diameter of the through hole for the adsorption pad 130 is larger than the outer diameter of the insertion portion of the pad body 131 inserted into the through hole, and the pad body 131 is allowed to swing to a certain extent in addition to the vertical movement.

[0081] Furthermore, the clamp 110 is provided on the substrate carrier 100 in a manner that allows it to rotate about the shaft 110a. In addition, the clamp 110 is urged in the first rotation direction by a spring 110b as a urging member. As described above, when the press-in pin 511 is pressed in, the clamp 110 overcomes the force of the spring 110b and rotates in the second rotation direction. When the press-in pin 511 is released, the clamp 110 is rotated in the first rotation direction by the force of the spring 110b. Figure 8In the figure, the state of the clamp 110 after being rotated in the second rotation direction by the press-in pin 511 is shown by a solid line, and the state of the clamp 110 after being rotated in the first rotation direction by the press-in pin 511 being released is shown by a dotted line. The clamp 110 rotates around the shaft portion 110a along the film forming surface of the substrate 200. Therefore, when the clamp 110 is pressed in by the press-in pin 511, the clamp 110 can retreat from above the substrate holding area of ​​the substrate carrier 100. In this way, a path for placing the substrate 200 on the substrate carrier 100 can be ensured by a simple structure.

[0082] <Substrate peeling operation from substrate carrier>

[0083] The substrate peeling chamber R6 is also provided with a substrate lifting device having the above-mentioned structure, and the substrate 200 can be peeled from the substrate carrier 100 by performing the steps of placing the substrate 200 on the substrate carrier 100 in the reverse order. Fig. 9 , the action of peeling the substrate 200 from the substrate carrier 100 is described. Fig. 9 (a) is a diagram showing a state where the substrate 200 is held by the substrate carrier 100 in the substrate peeling chamber R6. Fig. 9 (b) is a diagram showing a state in which the press-fit pin 511 rises and the clamp 110 rotates in the second rotation direction. Fig. 9 (c) is a diagram showing a state in which the support pins 411 are raised and the substrate 200 is peeled off from the substrate carrier 100 .

[0084] First, the substrate carrier 100 holding the substrate 200 is carried into the carrier delivery chamber 300 while the first plate 410 and the clamping plate 510 are waiting at the bottom, and are supported by the carrier support member 330 (see Fig. 9 (a)).

[0085] Then, the clamping rotating mechanism 500 is used to raise the plurality of press-in pins 511 together with the clamping plate 510, and the top ends of the press-in pins 511 press the corresponding clamping members 110. As a result, the clamping members 110 rotate in a second rotation direction opposite to the first rotation direction, and the substrate 200 is capable of being peeled off from the substrate carrier 100 (see FIG. Fig. 9 (b)). Then, the lifting mechanism 400 is used to raise the plurality of support pins 411 together with the first plate 410 to a predetermined position. In this process, the substrate 200 is pressed by the plurality of support pins 411 to be peeled off from the substrate carrier 100 and raised to a predetermined position (see Fig. 9 (c)).

[0086] Afterwards, the substrate 200 is carried out of the carrier delivery chamber 300 by the transfer robot. After the plurality of support pins 411 and the first plate 410 are lowered together, the substrate carrier 100 is carried out of the carrier delivery chamber 300 and is carried out to the outside of the film forming apparatus or transferred to the substrate loading chamber R1 again.

[0087] <Inspection of cracks in substrate>

[0088] As described above, a stripping operation of stripping the substrate 200 from the substrate carrier 100 is performed in the substrate stripping chamber R6. However, since the substrate 200 is adhered to the substrate carrier 100 by the adsorption pad 130, cracks may occur in the substrate 200 during the stripping operation. Even if cracks occur in the substrate 200 in a vacuum device such as the substrate stripping chamber R6, the operator cannot detect it by visual confirmation. If cracked fragments remain in the vacuum device, it may also cause a malfunction of the device. Therefore, the film forming device of the present embodiment is configured to perform a crack inspection in the substrate stripping chamber R6 to detect whether the substrate 200 is cracked after the stripping operation. In the crack inspection, the control unit C calculates the distance between the reference points of the substrate 200 based on the shooting results of the shooting component 350, and determines whether the substrate 200 is cracked based on the distance. The substrate inspection device and the inspection method in the substrate stripping chamber R6 of the present embodiment are described in detail below.

[0089] After the support pins 411 are raised to peel the substrate 200 from the substrate carrier 100, the substrate 200 is supported by the support pins 411 ( Fig. 9 (c)), the crack inspection is started. In the crack inspection, first, the photographing component 350 is used to photograph from the film-forming surface side of the substrate 200 in a manner that includes the edge portions near the four corners of the substrate 200. Specifically, the photographing component 350 is configured to obtain four images using the photographing component 350, and in each image, the four corners of the substrate 200 are included in the field of view of the photographing component 350. In the present embodiment, the photographing component 350 includes four cameras, and each camera is used to photograph the four corners of the substrate 200 respectively. That is, although not shown in the figure, a camera is provided at a position corresponding to each of the four corners of the substrate 200. In addition, as a substrate inspection device, it is sufficient to set the photographing component 350 in a manner that can photograph at least the peripheral areas of each of the four corners of the substrate 200, or a wide-angle photographing component 350 that can photograph the entire substrate may be provided.

[0090] In the present embodiment, as the photographing component 350, an optical photographing device is used that can control the light amount, shutter speed, gain value, etc. of the illumination light from the light source by the control unit C. The control unit C can adjust the obtained image by controlling at least any one of the light amount, shutter speed, and gain value. Then, the control unit C of the present embodiment analyzes the image photographed by the photographing component 350 and recognizes the side of the surface constituting the substrate 200 as an edge. Therefore, for example, even in the case where the position of the substrate 200 in the vertical direction changes relative to the case where no crack occurs due to the substrate 200 being broken and supported obliquely on the support pin 411, an image capable of recognizing the edge can be obtained by adjusting each parameter.

[0091] Fig.10 (a) is a diagram showing the positional relationship between the viewing angles of the substrate 200 and the imaging unit 350 , and four viewing angles 351 to 354 are indicated by two-dot chain lines. Fig.10 (b) is a diagram showing an image captured by the imaging unit 350 , and shows the interior of the field of view 351 . Fig.10 (c) is a diagram showing an image captured by the imaging unit 350, and shows the inside of the field of view 352. At the time of imaging the substrate 200, the substrate 200 is supported by the support pins 411 on the upper side of the substrate carrier 100 in the vertical direction, so that when viewed from the imaging unit 350 disposed above the substrate peeling chamber R6, the substrate 200 and a portion of the substrate carrier 100 overlap.

[0092] As described above, in this embodiment, the imaging component 350 captures images in such a manner that the four corners of the substantially rectangular substrate 200 are included in each captured image. The range of the field angle 351 including the first corner of the substrate 200 in the imaging range includes the edge 210A of the substrate 200 and the edge 210C orthogonal to the edge 210A. Moreover, the corner of the substrate 200 of this embodiment is chamfered and has a corner edge 210B. In addition, a carrier mark may be formed on a portion of the substrate carrier 100 for alignment.

[0093] The control unit C can identify the edge of the substrate 200 and obtain the intersection coordinates of the edge based on the image captured by the imaging unit 350. In the field of view 351, the intersection coordinates of the intersection 220A of the edge 210A and the edge 210C are obtained, and the position information around the first corner of the substrate 200 is obtained.

[0094] Similarly, the range of the viewing angle 352 for photographing the second corner at a diagonal position with respect to the first corner of the substrate 200 includes the edge 210D parallel to the edge 210A of the substrate 200, the edge 210F orthogonal to the edge 210D, and the corner edge 210E. In addition, the position information of the intersection 220B is obtained by the control unit C, and is used as the intersection coordinates of the edge 210A and the edge 210C. When the position information of the intersection 220A and the intersection 220B at the diagonal position is obtained based on the first image including the intersection 220A and the second image including the intersection 220B, the control unit C calculates the distance L1 between the intersection 220A and the intersection 220B.

[0095] In addition, in this embodiment, the distance L2 between the intersection points of the edges respectively included in the field of view angle 353 for photographing the third corner and the field of view angle 354 for photographing the fourth corner is also calculated by the control unit C. That is, in this embodiment, the position information of the intersection point of the two sides is obtained by using the imaging component 350 and the control unit C, and it is used as a reference point set at the position closest to the first corner to the fourth corner, respectively, so that the diagonal distance of the two substrates 200 can be obtained.

[0096] Fig.11 (a) is a diagram showing the upper surface and the front surface of the substrate 200 where no cracks occur. Fig.11 (b) is a diagram showing the upper surface and the front surface of the substrate 200 in which a crack has occurred. When the substrate 200 is cracked, the substrate 200 is supported obliquely on the support pin 411, or the position is shifted due to the impact when the crack occurs. Therefore, there is a difference between the distance L1a when the substrate 200 is not cracked and the distance L1b when the substrate 200 is cracked. Therefore, in this embodiment, the distances L1 and L2 between the reference points located at the diagonal positions of the substrate 200 are calculated, and when either of the distances L1 and L2 deviates from a preset theoretical value range, the control unit C as a determination unit determines that the substrate 200 is cracked. In addition, in this embodiment, the distance between the reference points of the two substrates is obtained and used for substrate crack detection, but it can be configured to use only one distance information in substrate crack detection, or it can be configured to obtain distances other than the diagonal distance and use more distance information.

[0097] <Breakage inspection process>

[0098] Reference Fig.12, the processing flow of the crack inspection of the substrate 200 of this embodiment is described. When the film forming process is completed and the mask M is removed from the substrate 200, the substrate 200 and the substrate carrier 100 are moved into the substrate stripping chamber R6. At this time, the substrate 200 is moved in such a way that the edge of the substrate 200 is roughly included in the field of view angle 351 to the field of view angle 354 of the imaging component 350. Then, when the substrate 200 is stripped from the substrate carrier 100 and becomes a state supported only by the support pins 411, the crack inspection of the substrate 200 is started (S100).

[0099] First, in step S101, four locations around the corner of the substrate 200 are imaged by the imaging unit 350. The control unit C stores the imaged images in a memory, and performs image processing such as filtering on the imaged images to create edge images.

[0100] In step S102, the control unit C determines whether the edge can be detected based on the edge image. That is, the control unit C of this embodiment also functions as a determination unit that determines whether a defect occurs in the shooting of the edge image. The detection method is arbitrary, and it may be, for example, to determine whether the line segments corresponding to the edges 210A, 210B, and 210C can be extracted from the edge image in the field of view angle 351. In addition, for example, it may be determined by comparing the acquired edge image with the image pattern of the assumed edge image. Here, if the edge cannot be detected, the process proceeds to step S103, the user is notified of the occurrence of an error and the type of error, and the rupture inspection is terminated (S108).

[0101] When an edge is detected in step S102, the process proceeds to step S104, and the control unit C obtains the coordinates of the intersection point based on the edge. In this embodiment, the coordinates of the intersection point 220A (first reference point) of the edge 210A and the edge 210C included in the viewing angle 351 and the intersection point 220B (second reference point) of the edge 210D and the edge 210F included in the viewing angle 352 are obtained as position information. Similarly, the coordinates of the intersection point (third reference point) of the edge included in the viewing angle 353 and the intersection point (fourth reference point) of the edge included in the viewing angle 354 are also obtained as position information.

[0102] Then, the process proceeds to step S105, where the control unit C calculates the diagonal distance and uses it as the distance between the intersection points at the diagonal positions on the substrate 200. In this embodiment, the distance between the intersection point 220A within the viewing angle 351 and the intersection point 220B within the viewing angle 352 and the distance between the intersection point within the viewing angle 353 and the intersection point within the viewing angle 354 are calculated and used as the diagonal distance.

[0103] In step S106, the control unit C confirms whether the calculated diagonal distance is within the theoretical value range, and determines whether the substrate 200 is cracked. In this embodiment, the theoretical value range is set to the design value ±3mm in consideration of manufacturing errors, measurement errors, etc. In addition, the theoretical value range is not limited to this value, and can be appropriately determined according to the structure of the substrate and the device. When the diagonal distance is within the theoretical value range, the control unit C determines that the substrate 200 is not cracked, and after the crack inspection is completed (S108), the substrate 200 and the substrate carrier 100 are automatically moved out of the substrate stripping chamber R6.

[0104] On the other hand, when it is confirmed in step S106 that the diagonal distance is not within the theoretical value range, the control unit C determines that the substrate 200 has cracked, and in step S107, the user is notified of the detection of the crack through the alarm, and the crack inspection is terminated (S108). The user who has learned from the alarm that the control unit C has determined that the substrate 200 has cracked manually removes the substrate 200 from the substrate peeling chamber R6. In addition, the method of notifying the user is not limited to the alarm, and other notification means such as notification on the display screen may also be used.

[0105] As described above, according to this embodiment, a portion of the substrate can be photographed while the substrate is stationary, and cracks in the substrate can be detected in the vacuum device based on the photographing results. As a result, high-precision conveying components are not required as in the prior art, and equipment costs can be suppressed. In addition, since it is not necessary to photograph the entire substrate, even if the size of the substrate is large, it is not necessary to increase the photographing components to expand the photographing range, and the cracks in the substrate can be inspected with a simple structure while suppressing the equipment costs of the photographing components.

[0106] In recent years, with the thinning and enlargement of substrates, substrates are prone to cracking. In addition, when the entire area of ​​the substrate is photographed for substrate crack detection, a photographing component capable of photographing a wider range is required, so the equipment cost tends to increase. However, according to the present invention, regardless of the size of the substrate, there is no need to excessively expand the photographing range, so the equipment cost of the photographing component can be suppressed. In addition, there is no need to project light onto the entire substrate in order to make the edge clear, so the equipment cost of the illumination light for image capture can also be suppressed.

[0107] In addition, the structure of the present invention is not limited to the above structure, and various changes can be made within the scope of not losing the identity with the technical solution embodied in the above embodiment. For example, in the above embodiment, the crack of the substrate is detected based on the diagonal distance of the substrate, but it is also possible to judge whether the substrate is cracked based on the distance between other intersections instead of the diagonal distance. Specifically, it can also be configured to confirm whether the distances between the four intersections along the four sides of the roughly rectangular substrate are respectively within the theoretical value range, and when any one is outside the theoretical value range, it is determined that the substrate is cracked. In addition, in the above embodiment, the intersection of the edge is used as the reference point of the substrate, but a substrate mark can also be set on the portion other than the image display portion on the substrate, and other components such as the substrate mark can be used as the reference point.

[0108] In addition, in the above-mentioned embodiment, the substrate crack inspection is performed in the substrate stripping chamber, but the substrate crack inspection may be performed in a chamber other than the substrate stripping chamber. For example, the substrate crack inspection may be performed in the substrate loading chamber using the substrate inspection device of the present invention before the substrate is held on the substrate carrier. The device and sequence for performing the substrate crack inspection are not limited to the above-mentioned embodiment.

[0109] <Film Forming Room>

[0110] Reference Fig.13 , the film forming process in the film forming chamber R3 is described in more detail. An evaporation source 600 as a film forming source is provided in the film forming chamber R3. The substrate 200 held on the substrate carrier 100 is supported in a state of being positioned in the film forming chamber R3 in a manner of facing downward. In addition, a mask M is also arranged on the lower side of the substrate 200 in a state of being positioned relative to the substrate 200. In the mask M, an opening is provided at a position corresponding to a position where a thin film is formed on the substrate 200. Thus, film formation is performed on the substrate 200 held on the substrate carrier 100 via the mask M.

[0111] In this embodiment, film formation (evaporation) based on vacuum evaporation is performed. Specifically, the film forming material is evaporated or sublimated from the evaporation source 600, and the film forming material is evaporated onto the substrate 200 to form a thin film on the substrate 200. Since the evaporation source 600 is a well-known technology, its detailed description is omitted. For example, the evaporation source 600 can be composed of a container such as a crucible for accommodating the film forming material and a heating device for heating the container. In addition, the film forming source is not limited to the evaporation source 600, and the film forming source can also be a sputtering cathode for film formation by sputtering.

[0112] <Method for manufacturing electronic device>

[0113] Next, an example of a method for manufacturing an electronic device using the film-forming apparatus of this embodiment will be described. Hereinafter, as an example of an electronic device, the structure of an organic EL display device is shown, and an example of a method for manufacturing the organic EL display device is described.

[0114] First, the organic EL display device to be manufactured will be described. Fig.14 (a) is an overall view of the organic EL display device 700. Fig.14 (b) shows the cross-sectional structure of a pixel.

[0115] like Fig.14 As shown in (a), in the display area 701 of the organic EL display device 700, a plurality of pixels 702 having a plurality of light-emitting elements are arranged in a matrix. The details will be described later, but the light-emitting elements each have the following structure, which has an organic layer sandwiched by a pair of electrodes. In addition, the pixel mentioned here refers to the smallest unit that can display the desired color in the display area 701. In the case of the organic EL display device of this embodiment, the pixel 702 is formed by a combination of a first light-emitting element 702R, a second light-emitting element 702G, and a third light-emitting element 702B that show different light. The pixel 702 is mostly composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but it can also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, as long as it is at least one color, and it is not particularly limited.

[0116] Fig.14 (b) Yes Fig.14 Schematic diagram of partial cross-section at line BB of (a). Pixel 702 is composed of a plurality of light-emitting elements, each of which has a first electrode (anode) 704, a hole transport layer 705, any one of light-emitting layers 706R, 706G, and 706B, an electron transport layer 707, and a second electrode (cathode) 708 on a substrate 703. The hole transport layer 705, the light-emitting layers 706R, 706G, 706B, and the electron transport layer 707 are equivalent to organic layers. In addition, in this embodiment, the light-emitting layer 706R is an organic EL layer that emits red light, the light-emitting layer 706G is an organic EL layer that emits green light, and the light-emitting layer 706B is an organic EL layer that emits blue light. The light-emitting layers 706R, 706G, and 706B are formed into patterns corresponding to light-emitting elements (sometimes also referred to as organic EL elements) that emit red light, green light, and blue light, respectively.

[0117] In addition, the first electrode 704 is formed separately for each light-emitting element. The hole transport layer 705, the electron transport layer 707, and the second electrode 708 may be formed in a manner shared by a plurality of light-emitting elements 702R, 702G, and 702B, or may be formed for each light-emitting element. In addition, in order to prevent the first electrode 704 and the second electrode 708 from being short-circuited due to foreign matter, an insulating layer 709 is provided between the first electrode 704. Furthermore, since the organic EL layer is degraded by moisture and oxygen, a protective layer 710 is provided to protect the organic EL element from moisture and oxygen.

[0118] exist Fig.14 In (b), the hole transport layer 705 and the electron transport layer 707 are shown as one layer, but they may be formed of a plurality of layers including a hole blocking layer and an electron blocking layer depending on the structure of the organic EL display element. In addition, a hole injection layer having an energy band structure that allows smooth injection of holes from the first electrode 704 to the hole transport layer 705 may be formed between the first electrode 704 and the hole transport layer 705. Similarly, an electron injection layer may be formed between the second electrode 708 and the electron transport layer 707.

[0119] Next, an example of a method for manufacturing an organic EL display device will be described in detail.

[0120] First, a substrate (mother glass) 703 on which a circuit (not shown) for driving the organic EL display device and a first electrode 704 are formed is prepared.

[0121] Acrylic resin is formed by spin coating on the substrate 703 having the first electrode 704 formed thereon, and the acrylic resin is patterned by photolithography to form an opening at the portion where the first electrode 704 is formed, and an insulating layer 709 is formed. The opening corresponds to a light emitting region where the light emitting element actually emits light.

[0122] The substrate 703 on which the insulating layer 709 is patterned is placed on a substrate carrier provided with an adhesive member. The substrate 703 is held by the adhesive member. After being carried into the first organic material film forming device and turned over, the hole transport layer 705 is formed as a common layer on the first electrode 704 in the display region. The hole transport layer 705 is formed by vacuum evaporation. Since the hole transport layer 705 is actually formed to a size larger than the display region 701, a high-precision mask is not required.

[0123] Next, the substrate 703 formed with the hole transport layer 705 is carried into the second organic material film forming apparatus. The substrate and the mask are aligned and placed on the mask, and the red light emitting layer 706R is formed on the portion of the substrate 703 where the element emitting red light is arranged.

[0124] Similar to the film formation of the light-emitting layer 706R, the light-emitting layer 706G emitting green light is formed by the third organic material film formation device, and the light-emitting layer 706B emitting blue light is formed by the fourth organic material film formation device. After the film formation of the light-emitting layers 706R, 706G, and 706B is completed, the electron transport layer 707 is formed in the entire display area 701 by the fifth film formation device. The electron transport layer 707 is formed as a common layer on the light-emitting layers 706R, 706G, and 706B of the three colors.

[0125] The substrate on which the electron transport layer 707 has been formed is moved to a metallic vapor deposition material film forming apparatus, and a second electrode 708 is formed as a film.

[0126] After that, the substrate 703 is moved to a plasma CVD device to form a protective layer 710, completing the film forming process on the substrate 703. After flipping, the adhesive member is peeled off from the substrate 703, so that the substrate 703 is separated from the substrate carrier. After that, the organic EL display device 700 is completed after cutting.

[0127] From the time when the substrate 703 with the patterned insulating layer 709 is carried into the film forming apparatus until the film forming of the protective layer 710 is completed, if the substrate is exposed to an atmosphere containing moisture and oxygen, the light-emitting layer composed of the organic EL material may be degraded by moisture and oxygen. Therefore, in this embodiment, the substrate is carried in and out of the film forming apparatus in a vacuum atmosphere or an inert gas atmosphere.

[0128] Description of Reference Numerals

[0129] 200 ... substrate, 220A ... intersection point (first reference point), 220B ... intersection point (second reference point), 350 ... imaging component (imaging component), 411 ... supporting pin (supporting component), C ... control unit (determination component), L1 ... distance.

Claims

1. A substrate inspection device, characterized in that: The substrate inspection device comprises: a supporting member, the supporting member supporting the substrate; a photographing component for photographing the substrate supported by the supporting component; as well as a determination unit that determines whether the substrate is cracked based on the imaging result of the imaging unit, The determination unit determines whether the substrate is cracked based on a distance between a first reference point and a second reference point calculated based on the imaging result.

2. The substrate inspection device according to claim 1, characterized in that: The determination unit determines that the substrate is cracked when the distance deviates from a preset theoretical value range.

3. The substrate inspection device according to claim 1, characterized in that: The determination unit obtains position information of the first reference point and the second reference point according to the imaging result, and calculates the distance based on the position information.

4. The substrate inspection device according to claim 1, characterized in that: The substrate is roughly rectangular. The first reference point is set at the position of the first corner among the four corners of the surface closest to the substrate, The second reference point is set at a position closest to a second corner different from the first corner among the four corners.

5. The substrate inspection device according to claim 4, characterized in that: The first angle is located diagonally relative to the second angle.

6. The substrate inspection device according to claim 4, characterized in that: The photographing result includes a first image and a second image, the first image includes the first corner and the first reference point, and the second image includes the second corner and the second reference point.

7. The substrate inspection device according to claim 4, characterized in that: The first reference point is the intersection of two sides forming the first angle, The second reference point is an intersection point of two sides forming the second angle.

8. The substrate inspection device according to claim 1, characterized in that: The first reference point and the second reference point are marks set on the substrate.

9. The substrate inspection device according to claim 5, characterized in that: The substrate has a third reference point and a fourth reference point, the third reference point is set at a position closest to a third corner of the four corners, and the fourth reference point is set at a position closest to a fourth corner of the four corners that is located at a diagonal position relative to the third corner. The determination unit determines whether the substrate is cracked based on the distance between the first reference point and the second reference point and the distance between the third reference point and the fourth reference point.

10. The substrate inspection device according to claim 1, characterized in that: The supporting member is a plurality of pins that come into contact with the substrate from a lower side in a vertical direction.

11. The substrate inspection device according to claim 1, characterized in that: The substrate inspection device further includes a notification unit configured to notify a worker when the determination unit determines that the substrate has cracked.

12. The substrate inspection device according to claim 11, characterized in that: The notification component is an alarm.

13. The substrate inspection device according to any one of claims 1 to 12, characterized in that: The substrate inspection device further comprises: a vacuum container in which the supporting member and the photographing member are arranged; and A conveying component is used to convey the substrate to inside or outside of the vacuum container.

14. A film forming device, characterized in that: The film forming device comprises: a film forming source that forms a thin film on the substrate held by a substrate carrier; and The substrate inspection device according to any one of claims 1 to 12.

15. A substrate inspection method, the substrate inspection method being a substrate inspection method using a substrate inspection device, the substrate inspection device comprising: a support member that supports a substrate; and a photographing member that photographs the substrate supported by the support member, characterized in that: The substrate inspection method includes performing a determination step, in which, based on the imaging result of the imaging component, it is determined whether the substrate is cracked. In the determination step, whether or not the substrate is cracked is determined based on a distance between a first reference point and a second reference point calculated from the imaging result.

16. A film forming method, characterized in that: The film forming method is inspected by the substrate inspection method according to claim 15, and performs a film forming step of forming a thin film on the substrate held by a substrate carrier.

Images