System for processing wafer-shaped articles

Abstract

A system for processing wafer-shaped articles, the system comprising: three or more processing stations; and a robotic arm including a first set of end effectors, the first set of end effectors including three or more end effectors; wherein the robotic arm is configured to pick, with each of the three or more end effectors, a respective wafer-like article from a storage unit configured to store a plurality of wafer-like articles, and load one of the respective wafer-like articles to each of the three or more processing stations.

Description

Technical Field

[0001] The present invention relates to a system for processing wafer-shaped objects, such as semiconductor wafers. Background Art

[0002] Wafers such as semiconductor wafers may undergo various surface treatment processes such as etching, cleaning, polishing, and material deposition. When undergoing such surface treatment processes, a chuck is typically used to hold the wafer.

[0003] At least some of these surface treatment processes involve applying a liquid to the surface of the wafer. For example, the surface of the wafer can be etched by applying a treatment liquid such as hydrofluoric acid to selected locations on the wafer surface. Alternatively, the surface of the wafer can be cleaned by applying a cleaning liquid or rinse liquid such as isopropyl alcohol or deionized water to the wafer surface.

[0004] As the liquid is applied to the wafer surface, the wafer may be rotated, such as using a rotatable chuck (spin chuck), to assist in distributing the liquid over the wafer surface.

[0005] Additionally, the surface of the wafer may subsequently be dried by heating the wafer to cause evaporation of the liquid on the surface of the wafer, such as by heating the underside of the wafer using a heating element such as an LED in a chuck.

[0006] Of course, other types of processing equipment or devices for processing wafers are also well known in the art.

[0007] Generally speaking, the end effector of the robot arm is used to transfer the wafer to a chuck or other suitable support of a processing device or apparatus. In particular, the end effector contacts the lower side of the wafer to support the wafer from below and is used to carry the wafer.

[0008] An end effector is typically used to lower a wafer onto a chuck or other suitable support. The end effector is then withdrawn so that the wafer can be processed. Subsequently, the same or a different end effector is used to pick up the wafer from the chuck or other suitable support.

[0009] Wafers are typically delivered to a processing device in a container that holds multiple wafers, such as a front opening pod (FOUP). Individual wafers are then removed from the container using the end effector of a robotic arm. After processing, the wafers may be loaded into the same or a different container for subsequent delivery. Summary of the invention

[0010] Most generally, the present invention provides a system for processing wafer-shaped objects, wherein a robot is configured to simultaneously transfer three or more wafer-shaped objects from a storage unit to a group of three or more processing stations. In this way, a single robot can be used to transfer three or more wafer-shaped objects from a storage unit to a processing station, which enables the simultaneous processing of three or more wafer-shaped objects. This can increase the productivity of the system, i.e., increase the rate at which objects are processed. In addition, since three or more processing stations can be operated simultaneously, this can allow resource sharing between the processing stations, thereby simplifying the configuration of the system and improving the overall efficiency of the system.

[0011] According to a first aspect of the present invention, there is provided a system for processing wafer-shaped objects, the system comprising: three or more processing stations; and a robot arm comprising a first group of end effectors, the first group of end effectors comprising three or more end effectors; wherein the robot arm is configured to: pick up a corresponding wafer-shaped object from a storage unit configured to store a plurality of wafer-shaped objects with each of the three or more end effectors, and load one of the corresponding wafer-shaped objects into each of the three or more processing stations.

[0012] Thus, the robot arm can pick up three or more wafer-shaped objects from the storage unit (i.e., one for each end effector), and then load the three or more wafer-shaped objects into the processing stations (i.e., one for each processing station). In other words, the three or more corresponding wafer-shaped objects are transferred between the storage unit and the processing stations simultaneously.

[0013] The first aspect of the present invention may have any one of the following optional features, or any compatible combination.

[0014] The system of the present invention may also be referred to as an apparatus rather than a system.

[0015] Here, the wafer-shaped object may refer to a wafer, such as a semiconductor wafer. The wafer-shaped object may include a semiconductor substrate.

[0016] The processing station may be a wafer processing station.

[0017] For example, a processing station may be or may include a processing module, or a processing device, or a processing apparatus.

[0018] Each of the three or more processing stations is configured to process a single wafer-shaped object. Therefore, when one of the corresponding wafer-shaped objects is loaded into one of the processing stations by the robot arm, the processing station can process the wafer-shaped object.

[0019] The three or more processing stations may be configured to perform the same process, ie, so that the wafer-shaped articles loaded into each processing station undergo the same process.

[0020] Each of the three or more processing stations may include any suitable components for performing a desired process on a wafer-shaped object. For example, each of the three or more processing stations may include corresponding equipment for processing a wafer-shaped object.

[0021] As an example, each processing station can be configured to perform an etching and / or cleaning process on a wafer-shaped object. Each processing station can be configured to dispense a liquid (e.g., an etching liquid or a cleaning liquid) onto the surface of the wafer-shaped object. As another example, each processing station can be configured to perform a bevel etching process on the wafer-shaped object. Of course, other types of processing are also possible and are well known in the art.

[0022] Processing the wafer-shaped article may include adding or removing material from the wafer-shaped article, such as etching material from the wafer-shaped article or depositing material on the wafer-shaped article.

[0023] Processing the wafer-shaped article may include, for example, cleaning the wafer-shaped article using a cleaning or rinsing liquid such as a solvent or water.

[0024] Each processing station may comprise a (respective) fluid dispenser for dispensing a fluid onto the surface of the wafer-shaped article.

[0025] The fluid dispenser may be a liquid dispenser for dispensing a liquid onto a surface of the wafer-shaped article.

[0026] Each processing station may include more than one fluid distributor (multiple fluid distributors). For example, each processing station may include two or more than two fluid distributors.

[0027] For example, each processing station may include a first fluid dispenser for dispensing a first fluid, such as an acid or an etching or cleaning fluid. Additionally, each processing station may include a second fluid dispenser for dispensing a rinse fluid or liquid (e.g., deionized water). The second fluid dispenser may also be used to dispense a drying gas, such as nitrogen, to dry the wafer-shaped object.

[0028] Each processing station may include a (corresponding) chuck, such as a rotary chuck. The rotary chuck may alternatively be referred to as a spin chuck or a rotatable chuck. The chuck may be configured to receive a corresponding wafer-shaped object. The rotary chuck may include a drive mechanism, such as a motor, for driving the rotation of the rotary chuck.

[0029] The operation of loading the respective wafer-shaped article into each of the three or more processing stations may include loading the respective wafer-shaped article onto a chuck of each of the three or more processing stations.

[0030] More generally, each processing station may comprise a (respective) support configured to support the wafer-shaped article during processing operations performed thereon.

[0031] The operation of loading the respective wafer-shaped article into each of the three or more processing stations may include loading the respective wafer-shaped article onto a support of each of the three or more processing stations.

[0032] The support or rotating chuck can be configured to support a wafer-shaped object spaced apart from the surface of the support or rotating chuck. For example, the support or rotating chuck can be configured to support a wafer-shaped object spaced apart from the surface of the support or rotating chuck on a gas cushion according to Bernoulli's theorem. Such a support or rotating chuck can be referred to as a Bernoulli chuck or support. Alternatively, the support or rotating chuck can be configured to support a wafer-shaped object spaced apart from the surface of the support or rotating chuck on a plurality of pins extending from the surface of the support or rotating chuck. Of course, other mechanisms for supporting a wafer-shaped object above the surface of the support or rotating chuck are also possible.

[0033] More generally, a support or spin chuck may include a support or a support device or a support mechanism for supporting a wafer-shaped article spaced apart from a top surface of the support or spin chuck.

[0034] The corresponding wafer-shaped objects are picked up from a single storage unit.

[0035] The three or more end effectors are disposed on or within a single robotic arm.

[0036] The storage unit is configured to store a plurality of wafer-shaped objects.

[0037] The storage unit may be removable and / or detachable from the system.

[0038] The storage unit may be a container or a cassette configured to store a plurality of wafer-shaped articles.

[0039] The storage unit may be a container or cassette for transferring a plurality of wafer-shaped articles to and / or from the system.

[0040] The storage unit may be a container or cassette used to transfer a plurality of wafer-shaped articles between different processing devices in a wafer fabrication environment.

[0041] For example, the storage unit may be a FOUP.

[0042] The storage unit may form part of a system for processing wafer-shaped articles.

[0043] The system may thus comprise the storage unit.

[0044] Alternatively, the storage unit may be independent and / or separate from the system.

[0045] The storage unit may include any suitable structure for storing wafer-shaped objects. For example, the storage unit may include a rack or a plurality of shelves for storing a plurality of wafer-shaped objects.

[0046] The storage unit may be configured to store a plurality of wafer-shaped articles in a stack, for example in a substantially vertical stack.

[0047] The storage unit may be configured to store a plurality of wafer-shaped articles one above another.

[0048] The storage unit may be configured to store a plurality of wafer-shaped articles in a vertical column.

[0049] The storage unit may include a first portion configured to store unprocessed wafer-shaped objects (ie, objects that have not yet been processed by a processing station) and a second portion configured to store processed wafer-shaped objects (ie, objects that have been processed by a processing station).

[0050] There may be exactly or only three processing stations.

[0051] There may be more than three processing stations.

[0052] The robotic arm includes a first set of three or more end effectors, each of which is configured to pick up a single wafer-shaped article.

[0053] Each end effector may be adapted to pick up and support (eg, hold) a respective wafer-shaped article, and may include any suitable elements and / or mechanisms for performing this function.

[0054] For example, each end effector may include one or more support elements for holding or supporting the wafer-shaped article from below.

[0055] The end effector may also be referred to as a manipulator, or a wafer supporter, or a wafer transporter, or a wafer carrier.

[0056] In some cases, each end effector may include a holding mechanism for holding (e.g., clamping, holding) the wafer-shaped object to prevent the wafer-shaped object from falling. For example, each end effector may include a vacuum holder, wherein the vacuum is used to hold the wafer-shaped object on the end effector. Alternatively, the end effector may include a plurality of pins for clamping the edges of the wafer-shaped object to hold the wafer-shaped object on the end effector. Other types of holding mechanisms may also be used, or such holding mechanisms may not be used.

[0057] Each of the three or more end effectors in the first group can be associated with a respective one of the three or more processing stations. Thus, each end effector can then be used to load a wafer-shaped object into its associated processing station. However, in other embodiments, the end effectors can be used interchangeably to load a wafer-shaped object into different ones of the processing stations.

[0058] The three or more end effectors in the first group may be disposed at a working end or distal end of the robot arm. Each of the three or more end effectors may be movable relative to the working end or distal end of the robot arm to facilitate picking up wafer-shaped objects from the storage unit with the three or more end effectors and loading the wafer-shaped objects into the processing station.

[0059] The three or more end effectors of the first group may be provided on, attached to, or disposed at a common forearm of the robot arm.

[0060] The robot may include any suitable type of robot for transferring wafer-shaped articles between a storage unit and a processing station. The robot may include two or more articulated components (e.g., members). The robot may include one or more motors for controlling the movement of the robot and the end effector.

[0061] The term robotic arm may be used instead of the term manipulator arm.

[0062] The robot arm can move between a first position and a second position, in which each of the three or more end effectors in the first group is arranged to pick up a corresponding wafer-shaped object from the storage unit, and in which each of the three or more end effectors in the first group is arranged to load the corresponding wafer-shaped object into an associated one of the processing stations.

[0063] To pick up a wafer-shaped article, the end effector may be positioned below the wafer-shaped article and then raised to contact the underside of the wafer-shaped article and support the wafer-shaped article.

[0064] The robot arm can be configured to perform any suitable motion to pick up a corresponding wafer-shaped object from the storage unit using the end effector. For example, the robot arm can be configured to insert each of three or more end effectors into the storage unit so as to remove a corresponding wafer-shaped object from the storage unit using each end effector. The specific motion of the robot arm for picking up the wafer-shaped object from the storage unit can be adapted to the specific configuration of the storage unit.

[0065] Similarly, the robot arm can be configured to perform any suitable motion to load the corresponding wafer-shaped article into the processing station using the end effector. For example, the robot arm can be configured to lower the end effector onto the processing station to place the corresponding wafer-shaped article on the processing station. The specific motion of the robot arm for loading the wafer-shaped article into the processing station can be adapted to the specific configuration of the processing station.

[0066] The robotic arm may include a fixed end, with its working end and end effector being movable relative to the fixed end. The fixed end may be the proximal end of the robotic arm.

[0067] In operation, the robotic arm may first pick up a corresponding wafer-shaped object from a storage unit (e.g., a first portion of the storage unit) with each of the three or more end effectors. Next, the robotic arm may move the end effector from the storage unit to the processing station to load one of the corresponding wafer-shaped objects into each processing station. Once each processing station has been loaded with a wafer-shaped object, the system may be configured to process the wafer-shaped object by operating the processing station.

[0068] In this way, a single robot arm is configured to load wafer-shaped objects into three or more processing stations. This can simplify the construction of the system because the robot arm is shared between three or more processing stations, rather than using an independent robot arm for each processing station. In particular, by sharing the robot arm between three or more processing stations, the number of moving parts in the system can be significantly reduced. This can in turn facilitate the maintenance of the system, and reduce the number of potential failure points in the system, thereby improving the reliability and durability of the system. In addition, the robot arm of the present invention allows three or more wafers to be transferred simultaneously between the storage unit and the processing station. This can help increase the productivity of the system and allow parallel processing of wafer-shaped objects in three or more processing stations.

[0069] The robot arm can also be configured to remove (e.g., pick up) the wafer-shaped objects from the processing stations and transfer them back to the storage unit (e.g., the second portion of the storage unit) after processing the wafer-shaped objects. More specifically, each of the end effectors can pick up a corresponding wafer-shaped object from one of the processing stations and load the corresponding wafer-shaped object into the storage unit, e.g., into the same storage unit from which the wafer-shaped object was previously removed or into a different storage unit. The end effectors of the first group can be used to pick up the wafer-shaped objects from the processing stations. Alternatively, a second group of end effectors can be used, as discussed in more detail below.

[0070] The robot arm may be configured to simultaneously load a corresponding wafer-shaped object into each of the three or more processing stations. In other words, each of the three or more processing stations may be simultaneously loaded with a corresponding wafer-shaped object. This may reduce the amount of time required to load the three or more processing stations. Additionally, this may facilitate operating the three or more processing stations simultaneously (e.g., in parallel) because processing may be initiated simultaneously for each processing station (i.e., after loading the wafer-shaped object).

[0071] Loading corresponding wafer-shaped articles to each of three or more processing stations simultaneously may be achieved by configuring the three or more end effectors in the first group so that each end effector can reach its associated processing station when the robot is in the second position. Thus, the same movement (or group of movements) of the robot can allow the three or more processing stations to receive corresponding wafer-shaped articles simultaneously.

[0072] The robot arm can be configured to simultaneously pick up a corresponding wafer-shaped object from the storage unit with each of the three or more end effectors. In other words, three or more wafer-shaped objects can be picked up by the robot arm at the same time (one by each end effector). This can reduce the amount of time required to pick up the wafer-shaped objects and transfer them to the three or more processing stations, thereby increasing the productivity of the system.

[0073] The simultaneous picking up of the respective wafer-shaped objects can be achieved by arranging three or more end effectors in a first group so that each of the end effectors can reach a respective wafer-shaped object in the storage unit. In this way, the configuration of the three or more end effectors can be particularly adapted to the storage unit to allow the simultaneous picking up of the respective wafer-shaped objects by each of the end effectors. Thus, the same movement (or group of movements) of the robot arm can allow the simultaneous picking up of three or more wafer-shaped objects from the storage unit.

[0074] Three or more processing stations can be configured to operate simultaneously. For example, three or more processing stations can be configured to process wafers simultaneously, such as starting and completing processing simultaneously. In other words, three or more processing stations can be configured to operate in parallel. In this way, three or more wafer-shaped objects (one in each processing station) can be processed simultaneously. This can improve the productivity of the system. In addition, this can make the various parts of the system share between three or more wafer processing systems, thereby reducing component redundancy in the system and simplifying the construction and maintenance of the system. For example, by operating three or more processing stations simultaneously, a common fluid supply source, and / or a common discharge member, and / or a common suction line can be shared between three or more processing stations.

[0075] Thus, the three or more processing stations may share one or more of a common fluid supply, a common exhaust, and / or a common suction line.

[0076] More generally, three or more processing stations may share one or more components necessary or used to process a wafer-shaped object. In other words, a single component of the components may be provided for all three or more processing stations.

[0077] In the case where three or more processing stations are configured to operate simultaneously, the system may include: a fluid source (liquid source); and a supply valve configured to control the fluid supply from the fluid source to each of the three or more processing stations. Therefore, a single supply valve can be used to control the fluid supply from the fluid source to the three or more processing stations. When the supply valve is opened, the fluid can be supplied from the fluid source to each of the three or more processing stations. The supply valve may include any suitable type of valve, such as a needle valve or a ball valve. The fluid source may include any fluid used during the processing of the wafer-shaped object. For example, the fluid source may include a cleaning fluid or liquid (e.g., isopropyl alcohol (IPA), acetone) or a rinse fluid or liquid (e.g., deionized water). In other embodiments, the fluid source may include an etching fluid, such as hydrofluoric acid or other processing chemicals. In some cases, the system may include a plurality of fluid sources, each of which is connected to a corresponding supply valve for controlling the fluid supply from the fluid source to the three or more processing stations.

[0078] The supply valve may be configured to control a fluid flow rate from a fluid source to the three or more processing stations.

[0079] In addition to the shared supply valve configured to control the supply of fluid from the fluid source to each of the three or more processing stations, each processing station may have or be provided with a respective supply valve. The respective supply valve may be provided in the processing station or in a respective flow path leading from the shared supply valve to the processing station.

[0080] The respective supply valve may be an on / off valve, such as an open / close valve, for opening or closing the flow of fluid to the respective processing station.

[0081] Thus, the respective supply valves may control whether fluid is supplied to the processing station, and the shared supply valve may control the flow rate of the fluid flowing to the processing station when the respective supply valves are open.

[0082] In the case where three or more processing stations are configured to operate simultaneously, the system may include a discharge port, and a discharge valve configured to control the discharge of fluid from the three or more processing stations to the discharge port. Thus, a single discharge valve may be used to control the discharge of fluid from all three or more processing stations. The discharge valve may include any suitable type of valve, such as a needle valve or a ball valve or a suction valve.

[0083] For example, liquid can be dispensed onto the surface of the wafer-shaped object and thrown off the wafer-shaped object by the spinning of the wafer-shaped object. Liquid thrown off the wafer-shaped object can be collected and discharged from the discharge port.

[0084] Then, the collected liquid can be reused and redistributed on the surface of the wafer-shaped object. In the case of reusing the liquid, the liquid can be filtered before reuse, for example, by a filter in the discharge port and / or the discharge line.

[0085] Where three or more processing stations are configured to operate simultaneously, the system may include a suction source for generating suction (or vacuum), and a suction valve for controlling the application of suction to the three or more processing stations.

[0086] In particular, the suction source can be used to suction liquid that has been dispensed by the processing station and collected by the processing station. For example, the suction source can be used to suction liquid into the discharge port and / or discharge line. Thus, a single suction valve can be used to control the application of suction to all three or more processing stations. The suction valve can include any suitable type of valve, such as a needle valve or a ball valve.

[0087] Additionally or alternatively, each treatment station may have a corresponding suction valve. The corresponding suction valve may be arranged in the treatment station or in a corresponding flow path leading from a shared suction source or a shared suction valve to the treatment station.

[0088] The respective suction valve may be an on / off valve, for example an open / close valve, which is used to open or close the suction to the respective treatment station.

[0089] In view of the above, a single valve or valve group (such as a supply valve, and / or an exhaust valve, and / or an aspiration valve) may be required to control the simultaneous operation of three or more processing stations. This can facilitate parallel processing of multiple wafer-shaped objects and simplify the construction and maintenance of the system.

[0090] In some embodiments, as described above, in addition to a common valve (e.g., a common supply valve, discharge valve, or suction valve), each of the processing stations may additionally have a corresponding valve, e.g., a corresponding supply valve, and / or a discharge valve and / or a suction valve, to allow further control. For example, providing a corresponding supply valve at each of the processing stations may provide better control over the shutoff of liquid supplied from the processing device, e.g., via a liquid nozzle. For example, this may prevent and / or reduce the risk of any drops of liquid being dispensed after the liquid supply source is shut off.

[0091] Where three or more processing stations are configured to operate simultaneously, the system may include an exhaust system for controlling application of exhaust to the three or more processing stations.

[0092] Each of the three or more end effectors may be pivotally mounted about a first common axis. For example, each of the three or more end effectors may be pivotally mounted in, on, or to a robotic arm such that the three or more end effectors are pivotable or rotatable about the first common axis.

[0093] Pivotable about the first common axis may mean rotatable about the first common axis.

[0094] The first common axis may pass through the proximal end of each of the end effectors.

[0095] The first common axis may be perpendicular to a main plane of the end effector and / or perpendicular to the wafer-shaped object when the wafer-shaped object is supported by the end effector.

[0096] The three or more end effectors may be configured to align to pick up the respective wafer-shaped articles from the storage unit.

[0097] The three or more end effectors may be configured to be aligned along the first common axis to pick up corresponding wafer-shaped articles from the storage unit. This may be referred to as a first configuration of the end effectors.

[0098] The three or more end effectors being aligned may mean that the end effectors overlap, such as completely overlap or maximally overlap, when viewed along the first common axis. This may facilitate picking up wafers from a vertical wafer stack in the storage unit.

[0099] The three or more end effectors may be configured to fan out to load a corresponding wafer-shaped article into each of the three or more processing stations.

[0100] The three or more end effectors may be configured to fan out around or along the first common axis to load the respective wafer-shaped articles into each of the three or more processing stations. This may be referred to as a second configuration of the end effectors.

[0101] The three or more end effectors fanning out may mean that each of the three or more end effectors is at a different pivot angle relative to or about the first common axis.

[0102] The three or more end effectors may be configured to be at different pivot angles about the first common axis to load a corresponding wafer-shaped article into each of the three or more processing stations.

[0103] The three or more end effectors may be configured to rotate in parallel, or synchronously, or simultaneously between a first configuration and a second configuration of the three or more end effectors.

[0104] The three or more end effectors may be arranged in an overlapping manner from bottom to top along the first common axis. This may facilitate picking up a wafer from a vertically stacked wafer in the storage unit.

[0105] The robotic arm may include one or more motors for controlling pivoting or rotation of the end effector about the first common axis.

[0106] The robot may include a first forearm, and the three or more end effectors may be pivotably mounted to the first forearm, the three or more end effectors being pivotable or rotatable relative to the first forearm about a first common axis. This configuration allows the three or more end effectors of the first group to be moved together between the storage unit and the processing station, for example, by moving the first forearm. In addition, by making the end effectors pivotable or rotatable relative to the first forearm, the end effectors may be pivoted to assist in the picking and loading of wafer-shaped objects. The three or more end effectors of the first group may be arranged along the first common axis, so that each of the three or more end effectors is pivotable or rotatable about the first common axis. The robot may include one or more motors for controlling the pivoting of the end effectors about the first common axis.

[0107] The three or more end effectors may be pivotable or rotatable relative to the first forearm between a first configuration (e.g., a transfer configuration) in which the three or more end effectors are aligned with each other along the first common axis and a second configuration (e.g., a loading configuration) in which the three or more end effectors are at different pivot angles relative to / around the first common axis.

[0108] When the three or more end effectors pick up corresponding wafer-shaped articles from the storage unit, the three or more end effectors are placed in the first configuration.

[0109] The three or more end effectors may also be placed in the first configuration when the robot arm transfers wafer-shaped articles between the storage unit and the processing station.

[0110] In the first configuration, the end effectors are aligned with each other along the first common axis, i.e., the three or more end effectors are aligned when viewed along the first common axis. In other words, the end effectors of the first group are all at the same pivot angle about (relative to or around) the first common axis when in the first configuration.

[0111] As described above, this configuration facilitates picking up a respective wafer from the vertically stacked wafers in the storage unit.

[0112] Additionally, or alternatively, the first set of three or more end effectors may be more compact when in the first configuration, which may facilitate moving the robotic arm between the storage unit and the processing station.

[0113] In the second configuration, the end effectors are at different pivot angles, for example, they may be in a fan-shaped configuration whereby the end effectors are angularly spaced from each other about the first common axis.

[0114] This may facilitate loading wafer-shaped articles into the three or more processing stations simultaneously. In particular, the processing stations may be spaced apart (e.g., disposed adjacent to each other). Thus, in the second configuration, each end effector may be pivoted relative to the first common axis so that its position corresponds to its associated processing station.

[0115] For example, the configuration of the end effector in the second configuration may correspond to the spatial configuration of the processing stations.

[0116] For example, when the end effectors are in the second configuration, the end effectors may be arranged such that each end effector is arranged above its associated processing station. Then, the end effectors may be lowered toward the processing stations to simultaneously load corresponding wafer-shaped objects in the processing stations.

[0117] The robot arm can be configured to load the respective wafer-shaped articles into each of the three or more processing stations by: moving the first forearm toward the three or more processing stations with the three or more end effectors in the first configuration; and moving the three or more end effectors from the first configuration to the second configuration so that each of the three or more end effectors is above an associated one of the three or more processing stations.

[0118] Thus, as described above, when a wafer-shaped object is picked up from the storage unit and when the first forearm is moved toward the three or more processing stations, the end effectors are placed in the first configuration. Then, when the first forearm is in a loading position (e.g., adjacent to the three or more processing stations), the end effectors can be placed in a second configuration to allow loading of a wafer-shaped object into a processing station. The three or more end effectors can then be simultaneously lowered (e.g., by lowering the first forearm) to load a corresponding wafer-shaped object into each of the three or more processing stations.

[0119] The robot arm may be configured to pick up corresponding wafer-shaped objects using the end effector in the first configuration. This may facilitate picking up the wafer-shaped objects and reduce the number of movements required by the robot arm. This may be achieved by adapting the storage unit to the end effector in the first configuration so that three or more wafer-shaped objects can be picked up simultaneously when the end effector is in the first configuration.

[0120] The reverse of the above process can be performed to pick up wafer-shaped objects from the processing station and transfer them to a storage unit (the same storage unit where the wafer-shaped objects were previously located or a different storage unit). For example, in order to pick up the wafer-shaped objects from the processing station, the end effector can be placed in the second configuration. Then, once the wafer-shaped objects have been picked up from the processing station, the end effector can be placed in the first configuration and the first forearm can be advanced toward the storage unit to load the wafer-shaped objects in the storage unit.

[0121] The robotic arm may include a plurality of forearms.

[0122] Each of the three or more processing stations may include a rotary chuck having a set of retaining pins for retaining a corresponding wafer-shaped article; and each rotary chuck may be configured to rotate when the three or more end effectors are moved to the second configuration to prevent contact between the set of retaining pins and the associated end effector (to align the set of retaining pins with their associated end effector).

[0123] This can be used to ensure that the retaining pins do not interfere with (e.g., contact) the end effector during loading of the wafer-shaped article on the processing station. In particular, the rotary chuck can rotate synchronously with the pivoting or rotation of the end effector when they move to the second configuration. This can facilitate the procedure of loading the corresponding wafer-shaped article into the processing station.

[0124] The retaining pin may be movable, such as rotatable, to contact a radially outer edge of the wafer-shaped article when the wafer-shaped article is loaded onto the spin chuck, thereby preventing or limiting lateral movement of the wafer-shaped article relative to the spin chuck.

[0125] The retaining pin may be a rotatable clamping pin assembly.

[0126] The retaining pins may also contact an underside of the wafer-shaped article to support the wafer-shaped article from below so that the wafer-shaped article is supported spaced apart from the top surface of the spin chuck.

[0127] As an example, each end effector may be configured to support or hold a wafer-shaped object from below. For example, each end effector may include a pair of fingers (e.g., forks) that are used to support or hold a wafer-shaped object from below. In order to load a wafer-shaped object onto a given rotary chuck, the associated end effector may be lowered toward the rotary chuck. The end effector may then be pulled out from under the wafer-shaped object, with retaining pins on the rotary chuck being used to hold the wafer-shaped object on the rotary chuck. During this procedure, the rotary chuck may rotate synchronously with the movement of the end effector to ensure that the retaining pins do not contact the end effector so that the movement of the end effector is not inhibited by the retaining pins.

[0128] The rotation of the spin chuck may be synchronized with the movement of the end effector both when loading a wafer-shaped article onto the spin chuck and when picking up a wafer-shaped article from the spin chuck.

[0129] More generally, each of the three or more processing stations may include a rotary chuck having a set of retaining pins for retaining a corresponding wafer-shaped article; and each rotary chuck may be configured to rotate when the three or more end effectors are moved to load the corresponding wafer-shaped articles into the three or more processing stations to prevent contact between the set of retaining pins and the associated end effector.

[0130] Each rotary chuck may be configured to rotate synchronously with the movement of an associated end effector.

[0131] The three or more processing stations may be arranged at different vertices of a triangle. In other words, the three or more processing stations may be arranged in a triangular configuration. This may facilitate loading of the respective wafer-shaped articles into the processing stations. In particular, this may facilitate each end effector being able to reach its associated processing station at the same time, thereby facilitating simultaneous loading, for example, compared to a situation where the processing stations are arranged along a straight line. For example, when the three or more end effectors are fanned out in the second configuration described above, this may enable each end effector to reach its associated processing station.

[0132] The system may further include a holding unit configured to hold the storage unit.

[0133] The system comprises a plurality of holding units.

[0134] The system may include a support configured to support the holding unit.

[0135] The system may include a plurality of supports.

[0136] The robotic arm may be configured or operable to flip the first set of end effectors.

[0137] Flipping the first set of end effectors means turning the first set of end effectors upside down, or rotating the first set of end effectors 180 degrees around the longitudinal axis.

[0138] In particular, the robot arm may be configured or operable to flip the first set of end effectors while the first set of end effectors are conveying a wafer-shaped article so that the end effectors are positioned above the wafer-shaped article and support the wafer-shaped article from above after flipping.

[0139] For example, the end effectors may each include a clamping mechanism for clamping a wafer-shaped object so that the wafer-shaped object is held by the end effector when the end effector is flipped / inverted. For example, each of the end effectors may include a plurality of clamping elements, such as pins, which are configured or operable to clamp the radial outer edge of the wafer-shaped object on the end effector.

[0140] The robot arm may be configured to flip the first set of end effectors to load the wafer-shaped article onto the processing station.

[0141] Thus, the first set of end effectors can be used to support the wafer-shaped article from above and to lower the wafer-shaped article from above to the corresponding processing station.

[0142] For example, the first set of end effectors may each be disposed on, or connected to, a first forearm of the robot, and the first forearm may be connected to, or include, a pivot joint or a rotation joint, where the first forearm may rotate to flip the first set of end effectors.

[0143] The first forearm may be rotatable about a longitudinal axis of the first forearm to flip the first set of end effectors.

[0144] Flipping the first set of end effectors may include rotating a common axis about which the end effectors of the first set may pivot 180 degrees.

[0145] With this configuration, it may not be necessary to rotate the rotary chuck of the processing station simultaneously or synchronously with the pivoting of the corresponding end effector. In particular, since the corresponding end effector and the robot arm are positioned above the corresponding wafer loaded onto the rotary chuck, there may be no or reduced risk of contact or interference between the robot arm and the holding pins of the rotary chuck.

[0146] The robot may also include a second set of end effectors, which includes three or more end effectors; and the robot may be configured to pick up a corresponding wafer-shaped object from each of the three or more processing stations using each end effector in the second set, and load the corresponding wafer-shaped object into a storage unit (the same storage unit from which the wafer-shaped object was previously removed or a different storage unit). In this way, different sets of end effectors may be used to carry wafer-shaped objects before processing and wafer-shaped objects that have been processed. This may avoid cross-contamination between wafer-shaped objects. For example, in the case where the processing station is used to clean wafer-shaped objects, this may avoid cross-contamination between dirty (i.e., before processing) and clean wafer-shaped objects.

[0147] Alternatively, in other embodiments, the first set of end effectors may also be used to pick up wafer-shaped articles from the processing station, and the second set of end effectors may be omitted.

[0148] The second set of end effectors may be arranged and operated in a manner similar to the first set of end effectors described above.

[0149] The second set of end effectors may have any of the features described above for the first set of end effectors unless they are incompatible.

[0150] Each end effector in the second set may be associated with a respective one of the processing stations.

[0151] Each of the second set of end effectors may be pivotably mounted about a second common axis and may be pivotable or rotatable between a first configuration or arrangement and a second configuration or arrangement as discussed above with respect to the first set of end effectors.

[0152] The robot arm may include a second forearm, and the three or more end effectors in the second group may be pivotally mounted to the second forearm, the three or more end effectors being pivotable relative to the second forearm about a second common axis. Similar to the discussion above regarding the first group of end effectors, making the second group of end effectors pivotable relative to the second forearm may facilitate picking up corresponding wafer-shaped articles from the processing station and transferring them to the storage unit. The inventors of the present case have discovered that providing the first group of end effectors and the second group of end effectors on different forearms of the robot arm may facilitate using the two groups of end effectors for their respective tasks.

[0153] The first forearm and the second forearm may both be connected to the main arm portion of the robotic arm. In some cases, the first forearm and the second forearm may both be pivotally connected to the main portion of the robotic arm. This allows each forearm to pivot independently of the other, thereby increasing the relative range of motion between the two sets of end effectors.

[0154] Of course, in alternative embodiments, the first and second sets of end effectors may be pivotally mounted to the same arm or forearm.

[0155] The robot arm may be configured or operable to flip the second set of end effectors. This may be accomplished in the same manner as described above with respect to the first set of end effectors.

[0156] In this case, the second set of end effectors may be positioned over the respective wafer-shaped articles when picking up the respective wafer-shaped articles from the respective processing stations.

[0157] Once the second set of end effectors has picked up the wafer-shaped article from the processing station, the second set of end effectors can then be flipped so that the second set of end effectors are positioned below the wafer-shaped article and support the wafer-shaped article from below. In this configuration, the second set of end effectors can then be used to load the wafer-shaped article into the storage unit.

[0158] This can be achieved by the second set of end effectors being each disposed on, or connected to, a second forearm of the robot arm, and the second forearm can be connected to, or include a pivot joint or a swivel joint where the second forearm can be rotated in order to flip the second set of end effectors.

[0159] The second forearm may be rotatable about a longitudinal axis of the second forearm to flip the second set of end effectors.

[0160] Similar to the first group of end effectors, the second group of three or more end effectors may be pivotable relative to the second forearm between a first configuration (e.g., a transfer configuration) in which the three or more end effectors are aligned with each other along the second common axis and a second configuration (e.g., a loading configuration) in which the three or more end effectors are at different pivot angles relative to the second common axis.

[0161] The robot arm can be configured to pick up corresponding wafer-shaped objects from the three or more processing stations by placing the three or more end effectors in the second group in the second configuration so that each of the three or more end effectors in the second group is located above an associated one of the three or more processing stations. Then, the robot arm can be configured to place the end effectors of the second group in the first configuration to transfer the corresponding wafer-shaped objects to the storage unit.

[0162] Each of the three or more processing stations includes a rotary chuck having a set of holding pins for holding a corresponding wafer-shaped article; each rotary chuck can be configured to rotate when a second set of three or more end effectors is moved to a second configuration to align the holding pins of the set with their associated end effectors in the second set (and / or prevent contact between the holding pins of the set and their associated end effectors).

[0163] The robot arm may be configured to simultaneously pick up a respective wafer-shaped article from each of the three or more processing stations using each of the second set of three or more end effectors.

[0164] The robot arm may be configured to load corresponding wafer-shaped articles into the storage unit simultaneously.

[0165] The system may also include a shutter that is movable between a closed state, in which the shutter isolates the robot from the three or more processing stations, and an open state, in which the shutter allows the robot to access the three or more processing stations. In this way, the shutter can be closed during operation of the processing stations to avoid contamination during processing of the wafer-shaped objects. Advantageously, because a single robot is used to transfer the wafer-shaped objects between the storage unit and the processing stations, only a single shutter can be used. This helps to simplify the system and reduce the number of moving parts.

[0166] The three or more processing stations may comprise a processing module or be arranged inside a processing module, wherein the gate is arranged to cover an access opening of the processing module when the gate is closed. Thus, the gate may be opened to enable the robot arm to access the three or more processing stations. The storage unit may be located outside the processing module, i.e., such that the gate is located between the storage unit and the processing station when the gate is closed.

[0167] The system may include a first group of three or more processing stations and a second group of three or more processing stations, the first group of three or more processing stations and the second group of three or more processing stations being arranged adjacent to each other.

[0168] The robot arm may be configured to selectively load respective wafer-shaped articles into the first set of three or more processing stations or the second set of three or more processing stations.

[0169] In other words, there may be two groups of three or more processing stations adjacent to each other (e.g., side by side), wherein the robot arm is capable of loading a wafer-shaped object into any group of processing stations. Thus, a user or system may select one of the groups of three or more processing stations, and the robot arm may load a corresponding wafer-shaped object into the selected group of processing stations.

[0170] Alternatively, there may be more than two robots, wherein a first robot is configured to load wafer-shaped articles to a first set of processing stations, and a second robot is configured to load wafer-shaped articles to a second set of processing stations.

[0171] Where there is more than one robot arm, each of the robot arms may be configured to pick up wafer-shaped articles from the storage unit at one or more respective locations.

[0172] For example, the system may include a plurality of support members, such as four support members, for supporting the storage unit. The first robot may be configured to pick up a wafer-shaped object at a first subset of the support members (for example, two of the support members), and the second robot may be configured to pick up a wafer-shaped object at a second, different subset of the support members (for example, two of the support members).

[0173] In some embodiments, the first robot arm may be configured or operable to transfer or deliver the wafer-shaped object to the second robot arm. Additionally or alternatively, the second robot arm may be configured or operable to transfer or deliver the wafer-shaped object to the first robot arm. The transfer may be direct or via an intermediate transfer mechanism.

[0174] The first and second groups of processing stations being adjacent to each other may mean that the first and second groups of processing stations are positioned side by side in substantially the same plane (eg, the same horizontal plane).

[0175] The robot arm can interact with each group of three or more processing stations, as discussed above with respect to loading of three or more processing stations. In particular, the robot arm can be configured to simultaneously load corresponding wafer-shaped articles into processing stations in a selected group of processing stations.

[0176] The first and second sets of processing stations may have matching processing station layouts. This may facilitate loading wafer-shaped objects into the two sets of processing stations using the same robot. For example, the first and second sets of processing stations may be mirror images of each other.

[0177] The three or more processing stations in the first group can be configured to operate simultaneously, as discussed above. Likewise, the three or more processing stations in the second group can be configured to operate simultaneously, as discussed above.

[0178] The system may include a first gate through which the robot can access a first set of processing stations and a second gate through which the robot can access a second set of processing stations.

[0179] The system can be configured to control the robot to alternate between loading wafer-shaped objects into a first set of processing stations and loading wafer-shaped objects into a second set of processing stations. In this way, the robot can load processing stations of the second set while processing stations in the first set are in operation (and vice versa). This can help increase the productivity of the system.

[0180] The system may include two or more layers arranged overlapping from bottom to top, wherein each layer includes a corresponding set of three or more processing stations, wherein the robot is configured to selectively load a corresponding wafer-shaped object into the set of three or more processing stations of one of the two or more layers. In other words, there may be multiple sets of processing stations overlapping from bottom to top, wherein the robot is capable of loading a wafer-shaped object into any one of the sets of processing stations. Thus, a user or the system may select one of the sets of three or more processing stations, and the robot may load a corresponding wafer-shaped object into the selected set of processing stations.

[0181] The robotic arm may be mounted or attached (eg, pivotably mounted or pivotably attached) to a turret that is configured to move in a vertical direction to move the robotic arm between two or more levels.

[0182] The robot can interact with the processing stations of these groups in each layer, as discussed above with respect to the loading of three or more processing stations. In particular, the robot can be configured to simultaneously load corresponding wafer-shaped objects into the processing stations of the selected group of processing stations.

[0183] The processing stations of the groups arranged at different levels can have matching processing station layouts. This can facilitate loading wafer-shaped objects into the two groups of processing stations using the same robot arm. For example, each level can contain processing stations of the same spatial configuration.

[0184] In some cases, each layer may include a first group of three or more processing stations, and a second group of three or more processing stations adjacent to each other, as discussed above.

[0185] The system may also include an actuator for controlling the height of the robot arm in the system. This may facilitate picking up wafer-shaped items and loading them into the processing stations, as the picking and loading operations may involve raising and / or lowering the end effector. In the case where the system includes two or more levels with processing stations, this may also allow the robot arm to reach different levels.

[0186] The actuator may include any suitable type of actuator for controlling the height of the robotic arm. For example, the actuator may include a belt-driven actuator, a hoist system, and / or a pulley system. As mentioned above, the actuator may include a turret that is configured to move in a vertical direction.

[0187] Here, groups of three or more processing stations and groups of three or more end effectors are discussed. Generally speaking, the number of end effectors in a group may correspond to the number of processing stations in a group, so that each end effector may be associated with a respective processing station.

[0188] For example, the system may include N processing stations and the first set of end effectors may include N end effectors, where N is a number equal to or greater than 3. The system may include only or exactly N processing stations and the first set of end effectors may include only or exactly N end effectors.

[0189] The second set of end effectors, where present, may also include only or exactly N end effectors.

[0190] N can be equal to 3.

[0191] According to a second aspect of the present invention, there is provided a method for processing wafer-shaped objects, the method comprising: using a robot arm comprising a first group of end effectors including three or more end effectors, picking up a corresponding wafer-shaped object from a storage unit with each of the three or more end effectors; and loading one of the corresponding wafer-shaped objects into each of the three or more processing stations with the robot arm.

[0192] The method of the second aspect of the invention may be used together with the system of the first aspect of the invention. Hence, any features described above in relation to the first aspect of the invention may be shared with the second aspect of the invention.

[0193] The respective wafer-shaped articles may be loaded simultaneously into each of the three or more processing stations.

[0194] A corresponding wafer-shaped article is picked up simultaneously with each of the three or more end effectors.

[0195] The method may further include, after loading the corresponding wafer-shaped article into each of the three or more processing stations, operating the three or more processing stations to process the corresponding wafer-shaped article.

[0196] The method may include operating the three or more processing stations simultaneously to process respective wafer-shaped articles.

[0197] The robot may also include a second set of end effectors, which includes three or more end effectors, and the method may also include: after processing the corresponding wafer-shaped object, picking up one of the corresponding wafer-shaped objects from one of the three or more processing stations with each end effector in the second set; and loading the corresponding wafer-shaped object into a storage unit (which may be the same storage unit from which the wafer was previously removed or a different storage unit).

[0198] The term fluid used herein may mean liquid, and references to fluid herein may be replaced with the term liquid unless incompatible.

[0199] According to a third aspect of the present invention, there is provided a robotic arm comprising a first set of end effectors, the first set of end effectors comprising three or more end effectors;

[0200] Wherein, the robot arm is configured to: pick up a corresponding wafer-shaped object with each of the three or more end effectors from a storage unit configured to store a plurality of wafer-shaped objects, and load one of the corresponding wafer-shaped objects into each of the three or more processing stations.

[0201] The robot arm according to the third aspect of the invention may have any of the features of the robot arm according to the first or second aspect of the invention.

[0202] For example, the first set of end effectors according to the third aspect of the present invention may have any features of the first set of end effectors according to the first or second aspect of the present invention.

[0203] The robot arm may be configured to flip the first set of end effectors. This may be achieved in the same manner as described above with respect to the first or second aspects of the present invention.

[0204] According to a fourth aspect of the present invention, there is provided a robotic arm comprising a first set of end effectors, the first set of end effectors comprising three or more end effectors, wherein each of the three or more end effectors is pivotably mounted about a first common axis.

[0205] The robot arm according to the fourth aspect of the present invention may have any of the features of the robot arms according to the first to third aspects of the present invention.

[0206] For example, the first set of end effectors according to the fourth aspect of the present invention may have any features of the first set of end effectors according to the first to third aspects of the present invention.

[0207] The three or more end effectors may be pivotable to a first configuration in which the three or more end effectors are aligned along the first common axis and / or overlap along the first common axis.

[0208] The three or more end effectors may be pivotable to a second configuration in which the three or more end effectors fan out. BRIEF DESCRIPTION OF THE DRAWINGS

[0209] Embodiments of the present invention will now be discussed for purposes of example only with reference to the accompanying drawings, in which:

[0210] Figure 1 is a schematic diagram showing a top view of a system according to an embodiment of the present invention;

[0211] Figure 2a is a schematic diagram showing Figure 1 A top view of a robotic arm of the system, wherein an end effector of the robotic arm is in a loading configuration;

[0212] Figure 2b is a schematic diagram showing Figure 1 A top view of a robotic arm of the system, wherein an end effector of the robotic arm is in a transfer configuration;

[0213] Figure 3a is a schematic diagram showing Figure 1 A cross-sectional view of a portion of a robotic arm of the system, wherein an end effector of the robotic arm is in a transfer configuration;

[0214] Figure 3b is a schematic diagram showing Figure 1 a cross-sectional view of a portion of a robot arm of the system, wherein the end effectors of the robot arm are in a transfer configuration, and wherein each end effector carries a respective wafer-shaped article;

[0215] Figure 4a and 4b is a schematic diagram showing Figure 1 A top view of a portion of a system showing a process of loading a wafer onto a spin chuck;

[0216] Figure 5 is a schematic diagram showing Figure 1 A cross-sectional side view of a specific embodiment of a system;

[0217] Figure 6 is a schematic diagram showing a perspective view of a robotic arm that may be part of a system according to an embodiment of the present invention;

[0218] Figure 7a and 7b is a schematic diagram showing Figure 6 Alternative configurations of the robotic arm;

[0219] Figure 8 is a schematic diagram showing a perspective view of a robotic arm that may be part of a system according to an embodiment of the present invention;

[0220] Fig. 9 is a schematic diagram of a fluid supply system that may be part of a system according to an embodiment of the present invention;

[0221] Fig.10 is a schematic diagram of a fluid supply system that may be part of a system according to an embodiment of the present invention; and

[0222] Fig.11 is a schematic diagram of a fluid supply system that may be part of a system according to an embodiment of the present invention. DETAILED DESCRIPTION

[0223] Figure 1 A schematic diagram of a system 100 is shown in accordance with an embodiment of the present invention. Figure 1 The schematic diagram of shows a top view of the system 100. Therefore, Figure 1 The plane of the page in can correspond to a substantially horizontal plane. The system 100 is configured to process a wafer-shaped object, such as a semiconductor wafer. For convenience, this detailed description section will refer to a "wafer", however, it should be understood that the term "wafer" can refer to any wafer-shaped object.

[0224] The system 100 includes a storage unit 102 configured to store a plurality of wafers 104. In one example, the storage unit 102 can store the plurality of wafers 104 in one or more stacks, which can facilitate retrieval of wafers from the storage unit 102 and storage of wafers in the storage unit 102. For example, the storage unit can include a plurality of shelves configured to overlap from bottom to top, each shelf for receiving a corresponding wafer 104.

[0225] The storage unit 102 may be a container or a cassette, such as a FOUP.

[0226] Storage unit 102 may be transferred to system 100 from another device and / or from another location in a processing or manufacturing environment.

[0227] The system 100 may include a holding unit for receiving and holding the storage unit 102. The system 100 may include a plurality of such holding units. Therefore, the system 100 may be able to receive a plurality of storage units 102 at the same time.

[0228] The system 100 also includes a processing module 106, in which two groups of wafer processing stations are provided. In more detail, a first group of three processing stations 108a, 108b, 108c are located on a first side of the processing module 106, and a second group of three processing stations 110a, 110b, 110c are located on a second side of the processing module 106. Each wafer processing station in the first group and the second group is configured to process a single wafer. Examples of processes that the wafer processing station can be configured to perform include, for example, etching and / or cleaning processes and bevel etching processes. Wafer processing stations 108a, 108b, 108c are all configured to perform the same process, and similarly, wafer processing stations 110a, 110b, 110c in the second group are all configured to perform the same process. The processes performed by the first group and the second group can be the same process or different processes. The wafer processing stations 108a, 108b, 108c in the first group may be referred to as a first triplet, and the wafer processing stations 110a, 110b, 110c in the second group may be referred to as a second triplet.

[0229] Each wafer processing station in the first group and the second group includes a rotary chuck 109 (or spin chuck) configured to receive a wafer and rotate the wafer. The rotary chuck 109 can be any suitable type of rotary chuck, and their size can be suitable for the wafer to be processed. Each rotary chuck 109 can include a mechanism for fixing the wafer in a suitable position on the rotary chuck 109, such as a set of holding pins and / or a suction port for holding the wafer by applying suction to the wafer.

[0230] In addition, each wafer processing station is provided with a fluid dispenser 112, which is configured to dispense fluid onto a wafer received on the spin chuck 109. The fluid dispenser 112 is on a pivotable arm so that it can be pivoted between a dispensing position, in which the fluid dispenser is arranged above the spin chuck 109 to dispense fluid onto the wafer received on the spin chuck 109, and an idle position, in which the fluid dispenser is pivoted away from the spin chuck 109 (in the idle position). Figure 1 , all fluid dispensers 112 are shown in an idle position). The fluid dispenser 112 of each wafer processing station can be connected to a fluid source (not shown), which can include a cleaning fluid, a rinsing fluid, an etching fluid, or another type of processing fluid or chemical. In some cases, multiple fluid dispensers can be provided for each wafer processing station, each fluid dispenser being arranged to dispense a different fluid onto a wafer received on the spin chuck 109 (e.g., each fluid dispenser can be connected to a different fluid source).

[0231] The fluid dispenser 112 may be a liquid dispenser for dispensing liquid onto a wafer received on a spin chuck.

[0232] Each wafer processing station can include two or more of the fluid dispensers 112. For example, each processing station can include a first fluid dispenser for dispensing a first fluid, such as an acid or an etching or cleaning fluid. In addition, each processing station can include a second fluid dispenser for dispensing a rinse fluid, such as deionized water. The second fluid dispenser can also be used to dispense a gas, such as nitrogen, to dry the wafer.

[0233] The system 100 also includes a robot 114. The robot 114 is configured to transfer the wafer 104 between the single storage unit 102 and the wafer processing station in the processing module 106. The robot 114 includes a first group of three end effectors 116a, 116b, 116c, each of which is configured to hold a corresponding wafer. In the example shown, the end effectors 116a, 116b, 116c each have a pair of jaws (or a fork or pair or fork fingers) arranged to hold a single wafer. The jaws can be fixed or movable relative to each other as required. The jaws of each end effector can include a holding mechanism (e.g., a gripper or clamp) for holding the wafer on the jaws during wafer transfer between the storage unit 102 and the wafer processing station. Additionally or alternatively, the jaws of each end effector may include one or more suction ports for applying suction to a wafer placed on the jaws to hold the wafer on the jaws during wafer transfer between the storage unit 102 and the wafer processing station.Alternatively or additionally, the jaws of each end effector may be configured to support the wafer by contacting the wafer from below.

[0234] The robot arm 114 is configured to pick up a corresponding wafer from a single storage unit 102 using each of the end effectors 116a, 116b, 116c. The robot arm may then load the picked-up wafer into the first or second set of wafer processing stations. Figure 1 In the example shown, the robot 114 is shown in a position where the end effectors 116a, 116b, 116c are located above the first group of wafer processing stations 108a, 108b, 108c, so that the robot 114 is arranged to load wafers into the first group of wafer processing stations 108a, 108b, 108c. Each end effector 116a, 116b, 116c can be associated with a corresponding wafer processing station in the first group and the second group. In the example shown, the end effectors 116a, 116b, 116c are associated with the wafer processing stations 108a, 108b, 108c in the first group, respectively. Similarly, the end effectors 116a, 116b, 116c are associated with the wafer processing stations 110a, 110b, 110c in the second group, respectively. Therefore, the associated end effectors can be used by the robot 114 to load wafers into a given wafer processing station in the first group or the second group.

[0235] Of course, in other embodiments, a corresponding robot 114 may be provided for each of the first group of wafer processing stations and the second group of wafer processing stations, rather than providing a single robot for both groups of wafer processing stations.

[0236] The robot 114 may include a plurality of articulated members (or arms) to enable it to move between the storage unit 102 and the wafer processing station. The specific structure of the robot 114 may be adapted to the spatial configuration of the storage unit 102, the processing module 106, and the wafer processing station. In the example shown, the robot 114 includes a turret 118 (or base portion) to which an upper arm 120 (or intermediate arm) is pivotably connected. A first forearm 122 is pivotably connected to the upper arm 120. End effectors 116a, 116b, 116c are all pivotably connected to the working end (or distal end) of the first forearm 122, and the end effectors 116a, 116b, 116c are pivotably connected relative to the first forearm about a first common axis. For example, each of the end effectors 116a, 116b, 116c may be pivotably connected to a pivot 124 located at the working end (or distal end) of the first forearm 122. The first common axis may be substantially vertical, ie, the pivot 124 may extend in a substantially vertical direction.The robotic arm 114 may include any suitable arrangement of motors and / or actuators to control the movement of its various components.

[0237] The end effectors 116a, 116b, 116c are arranged overlapping from bottom to top in the vertical direction (ie, along the pivot 124). Spaces are provided between the end effectors 116a, 116b, 116c in the vertical direction so that the end effectors 116a, 116b, 116c can each pick up a corresponding wafer.

[0238] Robotic Arm 114 Figure 2a and 2b The end effectors 116a, 116b, 116c are pivotable relative to the first forearm 122 between a transfer configuration and a loading configuration. Figure 2a and 2b The dashed lines in FIG. 1 depict the positions where the end effectors 116a, 116b, 116c will hold the wafer 104. The loading configuration of the end effectors 116a, 116b, 116c is shown in FIG. Figure 1 and 2a . It can be seen that in the loading configuration, the end effectors 116a, 116b, 116c are at different pivot angles relative to the first common axis, so that they fan out about the pivot 124. With the end effectors 116a, 116b, 116 in the loading configuration, the robot 114 can position the end effectors 116a, 116b, 116c so that each end effector is located above its associated wafer processing station in a group of wafer processing stations. For example, in Figure 1 In the configuration shown, each end effector is positioned above its associated wafer processing station in the first group.

[0239] like Figure 1 As shown, the wafer processing stations 108a, 108b, 108c in the first group are arranged in a triangle, i.e., each wafer processing station in the first group is located at a vertex of the triangle. This allows each end effector to be positioned above its associated wafer processing station in the first group by pivoting the end effector 108a, 108b, 108c about the pivot 124. For example, the wafer processing stations 108a, 108b, 108c are located on an arc to assist in reaching them using the pivoting movement of the end effectors 116a, 116b, 116c. The wafer processing stations 110a, 110b, 110c in the second group can have a configuration that matches the configuration of the first group to similarly allow each end effector to be positioned above its associated wafer processing station in the second group. The configuration of the wafer processing stations 110a, 110b, 110c in the second group can correspond to a mirror image of the configuration of the wafer processing stations 108a, 108b, 108c, such as Figure 1 shown.

[0240] The end effectors 116a, 116b, 116c are arranged in a transmission manner. Figure 2b In the transport configuration, the end effectors 116a, 116b, 116c are all aligned with each other along the first common axis, i.e., the end effectors 116a, 116b, 116c are all at the same pivot angle relative to the pivot 124. Figure 2b Only the top end effector 116a can be seen in the top view. Figure 3a and Figure 3b 1 is a schematic diagram of a cross-sectional view of a portion of the robot arm 114, wherein the end effectors 116a, 116b, 116c are in a transfer configuration. Figure 3a and Figure 3b As shown, each end effector 116a, 116b, 116c is connected to the pivot 124, wherein the end effectors 116a, 116b, 116c are arranged overlapping from bottom to top along the pivot 124. Figure 3a In the embodiment, the end effectors 116a, 116b, 116c do not carry any wafers, and Figure 3b , each of the end effectors 116a, 116b, 116c is shown carrying a respective wafer 104. As can be seen, the end effectors 116a, 116b, 116c are spaced apart along a vertical axis to allow each end effector to carry a respective wafer when the end effectors 116a, 116b, 116c are in a transfer configuration.

[0241] The robot 114 can be configured to place the end effectors 116a, 116b, 116c in a transfer configuration when transferring wafers between the storage unit 102 and the wafer processing station. Advantageously, the transfer configuration of the end effectors 116a, 116b, 116c is more compact (e.g., compared to the loading configuration), thereby facilitating movement of the robot 114 between the storage unit 102 and the wafer processing station. In addition, the robot 114 can be configured to pick up a wafer 104 from the storage unit 102 with the end effectors 116a, 116b, 116c in the transfer configuration. In particular, in the case where the storage unit 102 stores a plurality of wafers 104 in a vertical stack as described above, the robot 114 can lift the stack of three wafers out of the storage unit 102 using the end effectors 116a, 116b, 116c in the transfer configuration. In this manner, the robot 114 can pick up three wafers 104 from a single storage unit 102 at the same time. For example, the vertical spacing of the wafer carrying shelves in the storage unit 102 can be arranged to match the vertical spacing between the end effectors 116a, 116b, 116c along the pivot 124, so that the end effectors 116a, 116b, 116c can be inserted into the storage unit 102 in a transfer configuration to lift out three wafers 104.

[0242] The turret 118 of the robot 114 may include or be mounted on an actuator to control the height of the robot 114 (and therefore the end effectors 116a, 116b, 116c) in the system 100. For example, this may allow the end effectors 116a, 116b, 116c to be raised and lowered, such as to pick up a wafer 104 from the storage unit 102 and load the wafer 104 onto a wafer processing station. In particular, picking up a wafer 104 from the storage unit 102 may include raising the end effector 116a, 116b, 116c to raise the wafer 104 off the storage unit 102. Loading the wafer 104 onto the wafer processing station may include lowering the end effector 116a, 116b, 116c to place the wafer on the wafer processing station.

[0243] The processing module 106 may include a first gate 126 and a second gate 128. The first gate 126 and the second gate 128 may be closed to isolate the robot 114 from the interior of the processing module 106. The first gate 126 may be opened to allow the robot 114 to access the first set of wafer processing stations 108a, 108b, 108c. Similarly, the second gate 128 may be opened to allow the robot 114 to access the second set of wafer processing stations 110a, 110b, 110c. Figure 1 The dashed lines shown by reference numerals 126 and 128 in FIG. 1 indicate the positions of the first gate 126 and the second gate 128 when they are closed.

[0244] The processing module 106 may also include a partition wall 130 located between adjacent wafer processing stations in the processing module 106. The partition wall 130 is used to prevent cross contamination between different wafer processing stations. For example, the partition wall 130 can act as a splash barrier to prevent fluid from splashing or otherwise transferring between adjacent wafer processing stations. Figure 1 Also shown is a set of exhaust outlets 138 located between the first and second sets of wafer processing stations in the process module 106. The exhaust outlets 138 may be used to extract fumes from within the process module 106.

[0245] Additionally, a wall may be provided between the first group of wafer processing stations 108a, 108b, 108c and the second group of wafer processing stations 110a, 110b, 110c in the processing module 106. For example, the wall may be along the middle of the processing module 106. The wall may isolate the first group of wafer processing stations 108a, 108b, 108c from the second group of wafer processing stations 110a, 110b, 110c. For example, this may allow maintenance to be performed on one group of wafer processing stations while still allowing the use of another group of wafer processing stations.

[0246] The processing module 106 may also include one or more maintenance doors for accessing the interior of the processing module 106, for example, to perform maintenance on the wafer processing stations. In the illustrated example, the processing module 106 includes a first maintenance door 132a arranged to provide access to the wafer processing station 108a, a second maintenance door 132b arranged to provide access to the wafer processing station 110a, a third maintenance door 134 arranged to provide access to the wafer processing stations 108b and 108c, and a fourth maintenance door 136 arranged to provide access to the wafer processing stations 110b and 110c.

[0247] The system 100 may include a controller (not shown) configured to control the operation of various components of the system 100. In particular, the controller may control the movement of the robot 114 to control the transfer of the wafer 104 between the storage unit 102 and the wafer processing station. The controller may also control the operation of the wafer processing station to control the process performed by the wafer processing station. The controller may include any suitable computing system or collection of computing systems capable of controlling the operation of the system 100. Additionally or alternatively, the system 100 may be controlled by a user. For example, the system 100 may include a user interface for controlling the movement of the robot 114 and / or the operation of the wafer processing station.

[0248] In use, the robot 114 may initially pick up three wafers 104 from a single storage unit 102, one for each end effector 116a, 116b, 116c. As described above, this may be accomplished by placing the end effectors 116a, 116b, 116c in a transfer configuration and lifting three wafers 104 from a stack of wafers stored in the storage unit 102. The robot 114 may then move the end effectors 116a, 116b, 116c toward either the first or second set of wafer processing stations, depending on which set of wafer processing stations is to be loaded with wafers. For purposes of example, loading wafers into the first set of wafer processing stations will be described, however, the steps described are equally applicable to the second set of wafer processing stations.

[0249] After picking up the wafer with the end effector 116a, 116b, 116c, the robot arm 114 can then move the end effector 116a, 116b, 116c in the transfer configuration toward the first group of wafer processing stations 108a, 108b, 108c. This can be achieved by opening the first gate 126 and advancing the first forearm 122 (and therefore the end effector 116a, 116b, 116c) into the processing module toward the first group of wafer processing stations 108a, 108b, 108c. The end effectors 116a, 116b, 116c can then be pivoted to place them into the loading configuration so that each end effector is positioned above its associated wafer processing station in the first group, as shown in FIG. Figure 1 As shown. In this position, the robot 114 can lower the end effectors 116a, 116b, 116c to place the wafer on the rotary chuck 109 of the wafer processing station 108a, 108b, 108c. The robot 114 can then withdraw the end effectors 116a, 116b, 116c from the wafer processing station, leaving the wafer 104 on the wafer processing station. For example, when the end effectors 116a, 116b, 116c are withdrawn, a retaining element (e.g., a retaining pin) on the rotary chuck 109 can be used to retain the wafer 104 on the rotary chuck 109. Therefore, the robot 114 can simultaneously load a corresponding wafer 104 to each of the wafer processing stations 108a, 108b, 108c in the first group. Similarly, the robot 114 can simultaneously load a corresponding wafer 104 to each of the wafer processing stations 110a, 110b, 110c in the second group.

[0250] After loading the wafer 104 into the first group of wafer processing stations 108a, 108b, 108c, the end effector 116a, 116b, 116c can be returned to the transfer configuration and the robot 114 can be withdrawn from the processing module 106. Subsequently, the first gate 126 can be closed and the wafer processing stations 108a, 108b, 108c can be operated simultaneously to simultaneously process the wafer 104. For example, the fluid dispenser 112 can dispense a fluid onto the surface of the wafer and spin the wafer with the spin chuck 109.

[0251] When the wafer processing stations 108a, 108b, 108c in the first group are operated to process the wafer 104, the robot arm can simultaneously load the wafer 104 from the storage unit 102 to the wafer processing stations 110a, 110b, 110c of the second group. A set of steps similar to the above steps can be performed to load the wafer 104 into the second group of wafer processing stations 110a, 110b, 110c.

[0252] After the wafers 104 are processed by the wafer processing stations 108a, 108b, 108c in the first group, the robot 114 can retrieve the wafers 104 and return them to the storage unit 102 (the same storage unit from which the wafers 104 were originally removed or a different storage unit). In particular, the first gate 126 can be opened so that the robot 114 can advance the end effectors 116a, 116b, 116c in the transfer configuration into the processing module 106 toward the first group of wafer processing stations. The end effectors 116a, 116b, 116c can then be pivoted to a loading configuration (e.g., as Figure 1 The robot 114 may then place the end effectors 116a, 116b, 116c in a transfer configuration to transfer the wafers to the storage unit 102. With the end effectors 116a, 116b, 116c in the transfer configuration, the robot 114 may load the wafers into the storage unit, for example by lowering the wafers 104 onto a shelf in the storage unit 102. The storage unit 102 may include a first portion for storing wafers 104 before processing and a second portion for storing processed wafers 104. In this case, the wafers 104 picked up from the first group of wafer processing stations may be loaded into the second portion of the storage unit 102. Similarly, after the wafers 104 are processed by the second group of wafer processing stations, the robot 114 may take the wafers 104 from the second group of wafer processing stations and load them into the storage unit 102.

[0253] In the above example, the same set of end effectors 116a, 116b, 116c is used to transfer the wafer 104 from the storage unit 102 to the wafer processing station, and from the wafer processing station to the storage unit 102. However, in other examples, the robot 114 may include a second set of end effectors so that different sets of end effectors can be used for each direction of wafer transfer. Figure 6 Describe an example of a robotic arm with two sets of end effectors.

[0254] Figure 4a and 4b An example of the motions performed during loading of a wafer 104 onto a spin chuck 109 of one of the wafer processing stations of the system 100 is shown in greater detail. Figure 4a and 4b is a top view showing only a portion of the system 100. In particular, only the end effector 116a and the spin chuck 109 in the first group with their associated wafer processing station 108a are shown.

[0255] like Figure 4a and 4b As shown, the spin chuck 109 of the wafer processing station 108a includes a set of retaining pins 402 arranged around its edge. The retaining pins 402 extend vertically from the surface of the spin chuck 109 and are arranged to retain the wafer 104 on the spin chuck 109 when the wafer 104 is placed on the spin chuck 109. The spin chuck 109 of each wafer processing station in the system 100 may include a comparable set of retaining pins.

[0256] The retaining pins may be movable, such as rotatable, to contact a radially outer edge of the wafer 104 on the spin chuck 109 to prevent or limit lateral movement of the wafer 104 relative to the surface of the spin chuck 109 .

[0257] Figure 4a and 4b The dotted line in FIG. 1 represents the position of the wafer 104 held by the end effector 116a. In order to position the end effector 116a above the rotating chuck 109 of the wafer processing station 108a, the robot arm 114 moves along Figure 4a The first forearm 122 is advanced toward the first group of wafer processing stations in the direction indicated by the arrow 404 in FIG. 1. At the same time, the end effector 116a is pivoted about the pivot 124, as shown in FIG. Figure 4a109, the robot arm 114 may then lower the end effector 116a toward the spin chuck 109.

[0258] To prevent the retaining pin 402 from interfering with the movement of the end effector 116a as the end effector 116a is lowered toward the rotary chuck 109, the rotary chuck 109 may be configured as follows. Figure 4a 116a. In this manner, the retaining pins 402 can be moved out of the way of the end effector 116a. In particular, the rotary chuck 109 can be rotated to ensure that no retaining pins 402 are directly below the end effector 116a when the end effector 116a is positioned above the rotary chuck 109. The direction of rotation of the rotary chuck 109 during loading of the wafer 104 can correspond to the direction in which the end effector 116a is pivoted (i.e., the same direction). Figure 4a In the example shown, the rotary chuck 109 rotates in a counterclockwise direction and the end effector 116a pivots in a counterclockwise direction. Alternatively, the rotation direction of the rotary chuck 109 during loading of the wafer 104 may be opposite to the direction in which the end effector 116a pivots. The rotary chuck 109 may be configured to rotate synchronously with the pivoting of the end effector 116a. Alternatively, the rotary chuck 109 may rotate before or after the end effector 116a pivots.

[0259] Once the end effector 116a is Figure 4b As shown positioned above the spin chuck 109, the robot arm 114 can lower the end effector 116 toward the spin chuck 109. As the end effector 116a is lowered toward the spin chuck 109, the retaining pins 402 can engage the outer edge of the wafer 104. Next, with the wafer 104 held on the spin chuck 109 by the retaining pins 402, the end effector 116a can be pulled out from under the wafer 104. In some cases, the wafer 104 can be spaced apart from the surface of the spin chuck 109, such as by an air cushion, by retaining pins, or by additional pins on the surface of the spin chuck 109 that contact the underside of the wafer to support the wafer 104.

[0260] Of course, the end effector may be lowered while the end effector is pivoting, rather than as a separate step.

[0261] The operation of withdrawing the end effector 116a from beneath the wafer 104 may involve the following steps: Figure 4b The end effector 116a is pivoted as indicated by arrow 410 in FIG. 4 , for example, in a direction opposite to the pivoting direction indicated by arrow 406. At the same time, the robot 114 can retract the first forearm 122 away from the wafer processing station in the first group, for example, along Figure 4b In order to prevent the retaining pin 402 from interfering with the end effector 116a when the end effector 116a is withdrawn from the rotating chuck 109, the rotating chuck 109 can be rotated synchronously with the pivoting of the rotating chuck 109 to avoid collision between the retaining pin 402 and the end effector 116a. In particular, during the withdrawal of the end effector 116a, the rotating chuck 109 can be rotated synchronously with the pivoting of the rotating chuck 109 to avoid collision between the retaining pin 402 and the end effector 116a. Figure 4b The rotating chuck rotates as shown by arrow 414 in FIG. The rotation direction of the rotating chuck is the same as the pivot direction of the end effector 116a. Figure 4b In the example shown, the rotary chuck 109 rotates in a clockwise direction and the end effector 116a pivots in a clockwise direction. Alternatively, the direction of rotation of the rotary chuck during retraction of the end effector 116a may be in the opposite direction to the direction of pivoting of the end effector 116a during retraction of the end effector 116a.

[0262] Each of the retaining pins 402 can be rotated between a first position in which the retaining pin is configured to apply a clamping force on the radially outer edge of the wafer 104 and a second position in which the retaining pin does not apply a clamping force to the wafer 104. This can be achieved, for example, by providing the retaining pins 402 with a non-circular cross-section. When the wafer 104 is lowered onto the rotating chuck 109, the retaining pins 402 can be in the second position to allow the wafer 104 to be lowered onto the rotating chuck 109. The retaining pins 402 can then be rotated to the first position to apply a clamping force on the wafer 104 so as to securely hold the wafer 104 on the rotating chuck 109. This can allow the wafer 104 to be held by the retaining pins 402 above the upper surface of the rotating chuck 109, for example, so that there is a gap between the wafer 104 and the upper surface of the rotating chuck 109.

[0263] Regarding the above Figure 4a and 4b A similar procedure as described may be used to subsequently pick up the wafer 104 from the rotary chuck 109. In particular, the robotic arm 114 may insert the end effector 116 under the wafer 104 to lift the wafer 104 away from the rotary chuck. This may involve a similar sequence of pivoting and rotating motions as described above.

[0264] Motions similar to those discussed above with respect to the rotary chuck and end effector 116a of wafer processing station 108a may be performed by other end effectors and their associated rotary chucks of wafer processing stations to load wafers into all of the wafer processing stations of the first or second group.

[0265] As described above, in an alternative configuration, the robot arm may be configured to flip the end effector, such as by rotating the first forearm about its longitudinal axis, so that the end effector supports the wafer from above as it is used to lower the wafer onto the wafer processing station.

[0266] Figure 5 A schematic cross-sectional side view of a particular embodiment of the system 100 is shown. In this embodiment, the system 100 includes three layers 502, 504, 506, wherein two groups of three wafer processing stations are arranged in each layer. The groups of wafer processing stations in each layer are arranged as shown in FIG. Figure 1 Arrangement shown. Figure 5 In the view of FIG. 1 , only two wafer processing stations can be seen at each layer, however, each layer includes six wafer processing stations, such as Figure 1 Therefore, Figure 5 The system 100 includes a total of eighteen wafer processing stations.

[0267] like Figure 5 As shown, the system 100 includes an actuator 508 for controlling the height of the robot 114 in the system 100. In particular, the turret 118 of the robot 114 is connected to the actuator 508. As an example, the actuator 508 may include a belt drive configured to adjust the height of the robot 114. Other types of actuators 508 may also be used, such as a pulley system or an elevator system. Using the actuator 508, the robot 114 can be raised and lowered to allow the robot 114 to transfer wafers 104 between the storage unit 102 and the wafer processing station in each of the layers 502, 504, 506. The actuator 508 can also be used to control the height of the end effectors 116a, 116b, 116c during the above-mentioned pick and load procedures.

[0268] As described above, each of the end effectors 116a, 116b, 116c is arranged to overlap from bottom to top in the vertical direction. Therefore, the vertical position and / or height of each wafer supported by each of the end effectors 116a, 116b, 116c will be different.

[0269] To facilitate simultaneous loading of wafers onto the spin chucks 109, each spin chuck 109 may have an adjustable height, and the height of the spin chuck 109 may be adjusted to different heights corresponding to the different heights of the respective wafers supported by the respective end effectors 116a, 116b, 116c. For example, each of the spin chucks 109 may be attached to or mounted on a respective actuator that is configured to raise and / or lower the spin chuck 109.

[0270] Alternatively, each of the spin chucks 109 may be positioned or mounted at a different fixed height corresponding to a different height of a respective wafer supported by a respective end effector 116a, 116b, 116c.

[0271] Figure 6 A schematic perspective view of a robot 600 is shown that may form part of a system according to an embodiment of the present invention. For example, the robot 600 may correspond to the robot 114 of the system 100 discussed above.

[0272] The robot 600 has a similar construction as the robot 114 described above. In particular, the robot 600 includes a turret 602 connected to an actuator 604 for controlling the height of the robot 600. An upper arm 606 is pivotally connected to the turret 602. The robot 600 also includes a lower forearm 608 and an upper forearm 610, both of which are pivotally connected to the upper arm 606. In particular, the lower forearm 608 and the upper forearm 610 are each connected to the upper arm 606 via a first pivot (not shown). The lower forearm 608 and the upper forearm 610 can independently pivot about the first pivot.

[0273] The first group of three end effectors 612 are pivotally connected to the working end of the lower forearm 608, and the second group of three end effectors 614 are pivotally connected to the working end of the upper forearm 610. The end effectors 612 of the first group are mounted to a pivot at the working end of the lower forearm 608 in a manner similar to how the end effectors 116a, 116b, 116c described above are mounted at the working end of the first forearm 122. Likewise, the end effectors 614 of the second group are mounted to a pivot at the working end of the upper forearm 610 in a manner similar to how the end effectors 116a, 116b, 116c described above are mounted at the working end of the first forearm 122. Thus, the end effectors in the first group 612 can pivot relative to the lower forearm 608 between a transfer configuration and a loading configuration, and the end effectors in the second group 614 can likewise pivot relative to the upper forearm 610 between a transfer configuration and a loading configuration. Figure 6, the end effectors of the first group 612 are shown in a loading configuration, while the end effectors of the second group 614 are shown in a transfer configuration, i.e., the end effectors in the first group 612 are all at different pivot angles relative to the lower forearm 608, while the end effectors in the second group 614 are all at the same pivot angle relative to the upper forearm 610. Figure 6 , the three end effectors in the second group 614 are indistinguishable from one another.

[0274] The first set of end effectors 612 and the second set of end effectors 614 may each operate in a similar manner as the set of end effectors 116a, 116b, 116c described above.

[0275] When incorporated into the system 100, for example, the robot 600 can be configured to use the first set of end effectors 612 to transfer pre-processed wafers from the storage unit 102 to the wafer processing station, while the second set of end effectors 614 can be used to transfer processed wafers from the wafer processing station back to the storage unit 102. In this way, different sets of end effectors are used to handle pre-processed wafers and processed wafers, which can avoid contamination of processed wafers via the end effectors. The movement of the robot 600 for picking up and loading wafers using the first set of end effectors 612 and the second set of end effectors 614 can be similar to the movement described above with respect to the robot 114.

[0276] In an alternative embodiment (not shown), both the first set of end effectors 612 and the second set of end effectors 614 may be pivotally mounted on the same forearm of the robotic arm 600. For example, instead of including a lower forearm 608 and an upper forearm 610, the robotic arm 600 may alternatively include a single forearm pivotally connected to the upper arm 606. The single forearm may include a pivot at its working end to which both the first set 612 and the second set 614 of end effectors are pivotally connected. The first set 612 and the second set 614 of end effectors may be connected at opposite ends of the pivot, i.e., such that the working end of the single forearm is located between the first set 612 and the second set 614 of end effectors.

[0277] Of course, in alternative embodiments, the upper arm and single forearm may be replaced with a single arm.

[0278] Figure 7a and 7b show Figure 6 An alternative configuration of the robotic arm 600 in which the first set 612 and the second set 614 of end effectors are both in a transfer configuration and the lower forearm 608 and the upper forearm 610 overlap.

[0279] Figure 8is a schematic diagram showing a perspective view of a robotic arm 620 that may be part of a system according to an embodiment of the present invention. Figure 6 , 7a Features corresponding to those depicted in 7b are indicated using the same reference numerals and their detailed description is not repeated.

[0280] exist Figure 8 The robot arm 620 and Figure 6 The main difference between the robot arm 600 is that Figure 8 In the robot arm 620 , each of the lower forearm 608 and the upper forearm 610 can be rotated about its longitudinal axis to flip the end effectors of the first group 612 or the second group 614 .

[0281] In particular, each of the lower forearm 608 and the upper forearm 610 includes or is provided with a respective rotatable or pivotable joint 622 at which the forearm can rotate about its longitudinal axis.

[0282] As described above, each end effector may include a holding mechanism for holding the wafer on the end effector when the corresponding forearm is flipped over, such as a plurality of gripping elements or gripping pins that grip the wafer.

[0283] Fig. 9 is a schematic diagram depicting a fluid supply system 700 that can be used as part of a wafer processing system according to an embodiment of the present invention. For example, the fluid supply system 700 can be used as part of the above-described system 100. The fluid supply system 700 is configured to supply fluid to a group of three wafer processing stations.

[0284] The fluid supply system 700 includes a fluid source 702, an outlet of which is connected to a supply valve 704. The supply valve 704 may alternatively be or be referred to as a flow controller or flow rate controller that controls the flow rate or flow rate of a fluid (liquid).

[0285] Fluid source 702 may include a fluid reservoir or tank that holds fluid for use by the wafer processing station during wafer processing. For example, fluid source 702 may hold a cleaning fluid (e.g., IPA, acetone), a rinse fluid (e.g., deionized water), or any etching fluid that may be used to process a wafer. The fluid is typically a liquid.

[0286] The fluid source 702 may include a pump for pumping fluid from the fluid source 702 to the set of three wafer processing stations.

[0287] The supply valve 704 is connected in parallel to three fluid dispensers 706a, 706b, 706c. For example, the fluid dispensers 706a, 706b, 706c may correspond to the fluid dispensers 112 located in each wafer processing station in the first group or the second group in the system 100. Thus, each of the fluid dispensers 706a, 706b, 706c may include a nozzle (or fluid outlet) disposed on an arm such that the nozzle may be positioned above a spin chuck of a wafer processing station.

[0288] The supply valve 704 may include any suitable type of valve, such as a needle valve or a ball valve, and is configured to control the supply of fluid from the fluid source 702 to the three fluid distributors 706a, 706b, 706c. Thus, when the supply valve 704 is closed, no fluid is supplied to the fluid distributors 706a, 706b, 706c, and when the supply valve 704 is open, fluid is supplied from the fluid source 702 to each of the fluid distributors 706a, 706b, 706c. Thus, a single supply valve (i.e., the supply valve 704) may be controlled to control the simultaneous supply of fluid from the fluid source 702 to the fluid distributors located in the three wafer processing stations. This facilitates simultaneous (i.e., parallel) processing of three wafers and reduces the number of piping (or conduits) and valves required to control the fluid supply to the wafer processing stations.

[0289] Supply valve 704 may be configured to control the flow rate of fluid from fluid source 702 .

[0290] exist Fig.10 In the alternative embodiment shown, an independent supply valve may additionally be provided for each fluid distributor or processing station. Fig.10 As shown, a corresponding supply valve 705a, 705b, 705c is provided for each processing station. The corresponding supply valve 705a, 705b, 705c can each be an on / off valve, such as an open / close valve, which is used to open or close the fluid flow to the corresponding processing station and the fluid distributor 706a, 706b, 706c.

[0291] Therefore, the respective supply valves 705a, 705b, 705c can control whether the fluid is supplied to the processing station, and the shared supply valve 704 can control the flow rate of the fluid.

[0292] The respective supply valves can be arranged in the processing station or in the respective flow paths leading from a shared supply valve to the processing station.

[0293] As an example, the fluid supply system 700 may be used to supply fluid to a first group of wafer processing stations 108a, 108b, 108c in the system 100. Then, when the wafer 104 is loaded onto the spin chuck 109 of the wafer processing station 108a, 108b, 108c, the valve 704 may be operated to control the distribution of the fluid to the wafer during wafer processing.

[0294] For example, Fig. 9 The fluid supply system shown can be used to dispense a liquid, such as a rinsing liquid or a cleaning liquid, onto the backside of a wafer being processed.

[0295] Fluid supply system 700 can be adapted to supply fluid to multiple groups of wafer processing stations. This can be achieved by using corresponding supply valves to control the fluid supply to each group of wafer processing stations. In other words, multiple fluid supply valves can be connected in parallel to fluid source 702. Then, each supply valve can be connected in parallel to the fluid distributor of a corresponding group of wafer processing stations. Alternatively, a corresponding fluid source can be used for each group of wafer processing stations instead of sharing a single fluid source 702 between multiple groups of wafer processing stations.

[0296] In some cases, the wafer processing system of the present invention may include multiple fluid supply systems, for example, where multiple (e.g., two or more) fluids are used by the wafer processing stations. Each fluid supply system can be configured as a system 700, wherein the fluid source 702 of each fluid supply system contains different fluids. Then, each processing station can correspond to a corresponding fluid distributor, each of the multiple fluid supply systems corresponding to a fluid distributor. Then, the supply valve of each fluid supply system can be operated to control the supply of different fluids to the group of wafer processing stations.

[0297] A similar architecture to fluid supply system 700 may be used for a pumping (or vacuum) system used as part of a wafer processing system according to the present invention.

[0298] In an alternative configuration, the shared supply valve 704 may be omitted, and each fluid distributor 706a, 706b, 706c may be provided with a corresponding supply valve 705a, 705b, 705c and a corresponding liquid flow controller or liquid flow rate controller 704a, 704b, 704c instead. The corresponding supply valve 705a, 705b, 705c may be an on / off valve that allows the flow of fluid to the fluid distributor 706a, 706b, 706c or prevents the flow of fluid. When the corresponding supply valve 705a, 705b, 705c is opened to allow the flow of liquid, the corresponding liquid flow controller or liquid flow rate controller 704a, 704b, 704c may control the flow rate of the fluid supplied to the fluid distributor 706a, 706b, 706c.

[0299] For example, the configuration can be used for a fluid dispenser that distributes a fluid to the top side of a wafer being processed. For example, the fluid can be a processing liquid, or a rinsing liquid or a cleaning liquid.

[0300] A similar configuration may also be used for a pumping (or vacuum) system used as part of a wafer processing system according to the present invention.

[0301] As discussed above with respect to system 100, the spin chucks 109 of the wafer processing station can each include a suction port for applying suction to aspirate the collected liquid. Instead of fluid source 702, the suction system can include a suction source (e.g., a fan or vacuum pump), while instead of fluid distributors 706a, 706b, 706c, the suction system can include a suction port of the wafer processing station. Next, valve 704 can be used to control the application of suction from the suction source 702 to the suction ports 706a, 706b, 706c. For example, the suction port can be located in an exhaust line and / or in a collection container.

[0302] In the above description, embodiments including groups of three wafer processing stations and groups of three end effectors are discussed. It should be understood that other embodiments may include groups of wafer processing stations having different numbers (e.g., more than three) and end effectors. In general, the number of end effectors in a group of end effectors may correspond to the number of wafer processing stations in a group of wafer processing stations. In this manner, each end effector in a group of end effectors may be associated with a corresponding wafer processing station in a group of wafer processing stations.

[0303] These features disclosed in the above description, or in the following claims, or in the accompanying drawings, expressed in their specific form or according to means for performing the disclosed functions, or methods or procedures for obtaining the disclosed results, may be used to realize the invention in various forms, either alone or in any combination of such features, as the case may be.

[0304] Although the present invention has been described in conjunction with the above exemplary embodiments, many equivalent modifications and variations will be apparent to those skilled in the art in light of the present disclosure. Accordingly, the exemplary embodiments of the present invention set forth above are to be considered illustrative rather than restrictive. Various changes may be made to the embodiments without departing from the spirit and scope of the present invention.

[0305] To avoid any doubt, any theoretical explanations provided in this article are intended to enhance the reader's understanding. The inventors of this case do not wish to be bound by any of these theoretical explanations.

[0306] Any section headings used herein are for organizational purposes only and are not to be construed as limitations of the subject matter described.

[0307] Unless the context requires otherwise, throughout this specification (including the claims below), the terms "comprise" and "include", and variations such as "comprises", "comprising", and "including", will be understood to imply the inclusion of stated integers or steps or groups of integers or steps but not the exclusion of any other integers or steps or groups of integers or steps.

[0308] It should be noted that the singular forms "a", "an", and "the" used in the specification and the appended claims include plural references unless the context clearly indicates otherwise. Ranges may be expressed herein as from "about" a particular value and / or to "about" another particular value. When such a range is expressed, another embodiment includes from the particular value and / or to the other particular value. Similarly, when values ​​are expressed as approximations, by use of the antecedent "about", it will be understood that the particular value forms another embodiment. The term "about" in relation to a value is optional and means, for example, + / - 10%.

Claims

1. A system for processing wafer-shaped objects, the system comprising: Three or more processing stations; and a robotic arm comprising a first set of end effectors, the first set of end effectors comprising three or more end effectors; in, The robot arm is configured to pick up a corresponding wafer-shaped object from a storage unit configured to store a plurality of wafer-shaped objects with each of the three or more end effectors and load one of the corresponding wafer-shaped objects to each of the three or more processing stations.

2. The system of claim 1, wherein the robot arm is configured to simultaneously load the respective wafer-shaped articles into each of the three or more processing stations.

3. The system of claim 1 or 2, wherein the robot arm is configured to simultaneously pick up the corresponding wafer-shaped article from the storage unit with each of the three or more end effectors.

4. The system of any one of the preceding claims, wherein the three or more processing stations are configured to operate simultaneously.

5. The system of any one of the preceding claims, wherein each of the three or more end effectors is pivotably mounted about a first common axis. 6 . The system of claim 5 , wherein the three or more end effectors are configured to align to pick up the respective wafer-shaped articles from the storage unit.

7. The system of claim 5 or 6, wherein the three or more end effectors are configured to fan out to load the respective wafer-shaped articles into each of the three or more processing stations.

8. The system of any one of claims 5 to 7, wherein the three or more end effectors are configured to be at different pivot angles about the first common axis to load the respective wafer-shaped articles into each of the three or more processing stations.

9. The system of any one of claims 5 to 8, wherein the three or more end effectors are arranged overlapping from bottom to top along the first common axis.

10. The system of any of the preceding claims, wherein the robotic arm comprises a first forearm, and wherein the three or more end effectors are pivotally mounted to the first forearm, the three or more end effectors being pivotable relative to the first forearm about a first common axis.

11. The system of claim 10, wherein the three or more end effectors are pivotable relative to the first forearm between a first configuration in which the three or more end effectors are aligned with one another along the first common axis and a second configuration in which the three or more end effectors are at different pivot angles about the first common axis.

12. The system of claim 11, wherein the robot arm is configured to load the respective wafer-shaped article into each of the three or more processing stations by: With the three or more end effectors in the first configuration, moving the first forearm toward the three or more processing stations; and The three or more end effectors are moved from the first configuration to the second configuration such that each of the three or more end effectors is over an associated one of the three or more processing stations.

13. The system of claim 12, wherein: Each of the three or more processing stations includes a rotary chuck having a set of holding pins for holding the respective wafer-shaped article; and Each rotary chuck is configured to rotate when the three or more end effectors are moved to the second configuration to prevent contact between the set of retaining pins and the associated end effector.

14. The system of claim 13, wherein each rotary chuck is configured to rotate in synchronization with movement of the associated end effector.

15. The system according to any one of the preceding claims, wherein the three or more processing stations are arranged at different vertices of a triangle.

16. The system according to any of the preceding claims, wherein the system further comprises a holding unit configured to hold the storage unit. The system according to claim 16 , wherein the system comprises a plurality of the holding units.

18. The system of any of the preceding claims, wherein the robotic arm is configured to flip the first set of end effectors.

19. A system according to any one of the preceding claims, wherein: The robotic arm further includes a second set of end effectors, the second set of end effectors including three or more end effectors; and Wherein, the robot arm is configured to: pick up a corresponding wafer-shaped object from each of the three or more processing stations with each end effector in the second group, and load the corresponding wafer-shaped object into a storage unit.

20. The system of claim 19, wherein the robot arm is configured to simultaneously pick up the respective wafer-shaped article from each of the three or more processing stations with each of the three or more end effectors of the second set of end effectors.

21. The system of claim 19 or claim 20, wherein the robot arms are configured to load the respective wafer-shaped articles into the storage unit simultaneously.

22. The system of any one of claims 19 to 21, wherein the robotic arm includes a second forearm, and wherein the three or more end effectors in the second group are pivotally mounted to the second forearm, the three or more end effectors being pivotable relative to the second forearm about a second common axis.

23. The system of any one of claims 19 to 22, wherein the robotic arm is configured to flip the second set of end effectors.

24. A system according to any of the preceding claims, further comprising a gate that can be moved between a closed state and an open state, wherein in the closed state, the gate isolates the robot arm from the three or more processing stations, and in the open state, the gate allows the robot arm to access the three or more processing stations.

25. A system according to any of the preceding claims, comprising a first group of three or more processing stations and a second group of three or more processing stations, wherein the first group of three or more processing stations and the second group of three or more processing stations are arranged adjacent to each other, wherein the robot arm is configured to selectively load the corresponding wafer-shaped objects into the first group of three or more processing stations or the second group of three or more processing stations.

26. A system according to any of the preceding claims, comprising two or more layers arranged in an overlapping manner from bottom to top, wherein each layer comprises a corresponding set of three or more processing stations, wherein the robot arm is configured to selectively load the corresponding wafer-shaped object into the set of three or more processing stations of one of the two or more layers.

27. A method for processing a wafer-shaped article, the method comprising: using a robot arm including a first set of end effectors including three or more end effectors, by picking up a respective wafer-shaped article from a storage unit with each of the three or more end effectors; and One of the respective wafer-shaped articles is loaded into each of the three or more processing stations with the robot arm.

28. The method of claim 27, wherein the respective wafer-shaped articles are loaded simultaneously into each of the three or more processing stations.

29. The method of claim 27 or 28, wherein the respective wafer-shaped article is picked up simultaneously with each of the three or more end effectors.

30. The method according to any one of claims 27 to 29, further comprising: After the respective wafer-shaped articles are loaded into each of the three or more processing stations, the three or more processing stations are operated to process the respective wafer-shaped articles.

31. The method of claim 30, wherein the robotic arm further comprises a second set of end effectors, the second set of end effectors comprising three or more end effectors, the method further comprising: picking up one of the respective wafer-shaped articles from one of the three or more processing stations with each end effector in the second group after processing the respective wafer-shaped articles; and The respective wafer-shaped articles are loaded into a storage unit.

32. A robotic arm comprising a first set of end effectors, the first set of end effectors comprising three or more end effectors; in, The robot arm is configured to pick up a corresponding wafer-shaped object from a storage unit configured to store a plurality of wafer-shaped objects with each of the three or more end effectors and load one of the corresponding wafer-shaped objects to each of the three or more processing stations.

33. The robotic arm of claim 31 , wherein the robotic arm is configured to flip the first set of end effectors.

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