Ultrasonic monitoring circuit, ultrasonic sensing panel, ultrasonic device and signal reading method

Abstract

The invention provides an ultrasonic monitoring circuit, an ultrasonic sensing panel, an ultrasonic device and a signal reading method, and relates to the technical field of ultrasound, and the ultrasonic monitoring circuit comprises a double-correlation sub-circuit which is connected with an acquisition sub-circuit, a first enable signal line, a second enable signal line and a processing sub-circuit, the processing sub-circuit is used for writing a deformation-free signal acquired by the acquisition sub-circuit into the processing sub-circuit under the control of a first enable signal of a first enable signal line, and writing a first deformation signal acquired by the acquisition sub-circuit into the processing sub-circuit under the control of a second enable signal of a second enable signal line; wherein the processing sub-circuit is used for outputting a second deformation signal according to the first deformation signal and the non-deformation signal, the non-deformation signal is a signal generated by the ultrasonic sensor in a non-deformation state, and the first deformation signal is a signal generated by the ultrasonic sensor in a deformation state. And the influence of temperature change on the monitoring result can be reduced.

Description

Technical Field

[0001] The present application relates to the field of ultrasonic technology, and in particular to an ultrasonic monitoring circuit, an ultrasonic sensor panel, an ultrasonic device and a signal reading method. Background Art

[0002] Currently, ultrasonic sensors can be used to transmit ultrasonic waves to objects and receive echoes reflected by the objects, and then obtain echo signals to complete ultrasonic monitoring. Ultrasonic technology can be widely used in industry, agriculture, biomedicine, consumer electronics and other fields.

[0003] For ultrasonic monitoring circuits, the echo signal read is generally at the nanoampere (nA) or microampere (uA) level, which is very close to the circuit noise level, resulting in noise interference in the echo signal. The noise may even overwhelm the echo signal, affecting the final monitoring results. Summary of the invention

[0004] The present application provides an ultrasonic monitoring circuit, an ultrasonic sensor panel, an ultrasonic device and a signal reading method, which can solve the problem that the echo signal is interfered by noise or even the noise drowns the echo signal and affects the final monitoring result.

[0005] In a first aspect, the present application provides an ultrasonic monitoring circuit, the ultrasonic monitoring circuit comprising:

[0006] a dual-correlation subcircuit connected to the acquisition subcircuit, the first enable signal line, the second enable signal line and the processing subcircuit, and configured to write the non-deformation signal acquired by the acquisition subcircuit into the processing subcircuit under the control of the first enable signal of the first enable signal line, and to write the first deformation signal acquired by the acquisition subcircuit into the processing subcircuit under the control of the second enable signal of the second enable signal line;

[0007] The processing subcircuit is used to output a second deformation signal according to the first deformation signal and the non-deformation signal, wherein the non-deformation signal is a signal generated by the ultrasonic sensor in a non-deformation state, and the first deformation signal is a signal generated by the ultrasonic sensor in a deformation state.

[0008] Optionally, the dual-correlation subcircuit includes a first storage module, a second storage module and an output module;

[0009] The first storage module is electrically connected to the acquisition sub-circuit, the first enable signal line, and the output module respectively, and is used to store the non-transformable signal under the control of the first enable signal;

[0010] The second storage module is electrically connected to the acquisition sub-circuit, the second enable signal line, and the output module respectively, and is used to store the first deformation signal under the control of the second enable signal;

[0011] The output module is also electrically connected to the processing sub-circuit, and is used to write the non-deformation signal into the processing sub-circuit, and write the first deformation signal into the processing sub-circuit.

[0012] Optionally, the first storage module includes a first transistor and a first capacitor; the second storage module includes a second transistor and a second capacitor;

[0013] The control electrode of the first transistor is electrically connected to the first enable signal line, the first electrode is electrically connected to the acquisition subcircuit and the output module respectively, and the second electrode is electrically connected to the first end of the first capacitor; the second end of the first capacitor is grounded;

[0014] The control electrode of the second transistor is electrically connected to the second enable signal line, the first electrode is electrically connected to the acquisition subcircuit and the output module respectively, and the second electrode is electrically connected to the first end of the second capacitor; the second end of the second capacitor is grounded.

[0015] Optionally, the ultrasonic monitoring circuit further includes a switch subcircuit; the switch subcircuit is arranged between the dual correlation subcircuit and the processing subcircuit; the switch subcircuit includes a plurality of input terminals, an output terminal, and a control terminal;

[0016] The multiple input terminals are connected to the multiple read lines in a one-to-one correspondence, each of the read lines is connected to the multiple dual-correlation sub-circuits, and the one output terminal is electrically connected to one of the processing sub-circuits; the control terminal is used to receive a switch control signal;

[0017] Wherein, the dual correlation subcircuit is used to write the non-deformation signal into the read line under the control of the first enable signal, and to write the first deformation signal into the read line under the control of the second enable signal;

[0018] The switch subcircuit is used to send the non-deformation signal in the read line to the processing subcircuit under the control of the switch control signal, and to send the first deformation signal in the read line to the processing subcircuit under the control of the switch control signal.

[0019] Optionally, the dual correlation subcircuit includes a third storage module and a fourth storage module; the processing subcircuit includes a subtractor module;

[0020] The third storage module is electrically connected to the acquisition subcircuit, the first enable signal line, and the subtractor module respectively, and is used to store the non-transformable signal under the control of the first enable signal;

[0021] The fourth storage module is electrically connected to the acquisition sub-circuit, the second enable signal line, and the processing sub-circuit respectively, and is used to store the first deformation signal under the control of the second enable signal;

[0022] The subtractor module is used to perform a subtraction between the first deformation signal and the non-deformation signal.

[0023] Optionally, the third storage module includes a third transistor and a third capacitor; the fourth storage module includes a fourth transistor and a fourth capacitor;

[0024] The control electrode of the third transistor is electrically connected to the first enable signal line, the first electrode is electrically connected to the acquisition subcircuit, and the second electrode is electrically connected to the first end of the third capacitor and the first input end of the subtractor module respectively; the second end of the third capacitor is grounded;

[0025] The control electrode of the fourth transistor is electrically connected to the second enable signal line, the first electrode is electrically connected to the acquisition subcircuit, and the second electrode is electrically connected to the first end of the fourth capacitor and the second input end of the subtractor module respectively; the second end of the fourth capacitor is grounded.

[0026] Optionally, the ultrasonic monitoring circuit further includes a switch subcircuit; the switch subcircuit is arranged between the acquisition subcircuit and the dual correlation subcircuit; the switch subcircuit includes a plurality of input terminals, an output terminal, and a control terminal;

[0027] The multiple input terminals are connected to the multiple readout lines in a one-to-one correspondence, each of the readout lines is connected to the multiple acquisition sub-circuits, and the one output terminal is electrically connected to one of the dual-correlation sub-circuits; the control terminal is used to receive a switch control signal;

[0028] Wherein, the acquisition subcircuit is used to write the non-deformation signal into the read line, and write the first deformation signal into the read line;

[0029] The switch subcircuit is used to send the non-deformation signal in the read line to the dual-correlation subcircuit under the control of the switch control signal, and to send the first deformation signal in the read line to the dual-correlation subcircuit under the control of the switch control signal.

[0030] In a second aspect, the present application provides an ultrasonic sensor panel, wherein the ultrasonic sensor panel comprises the ultrasonic monitoring circuit as described in the first aspect.

[0031] Optionally, the ultrasonic sensor panel includes a sensing area and a non-sensing area located outside the sensing area;

[0032] The sensing area includes a plurality of sub-pixels, and the acquisition sub-circuit and the dual correlation sub-circuit are arranged in the sub-pixels.

[0033] Optionally, the ultrasonic sensing panel further comprises a switch subcircuit in the ultrasonic monitoring circuit; the switch subcircuit is arranged in the non-sensing area;

[0034] The sensing area further comprises a plurality of readout lines, each of the readout lines being electrically connected to the dual-correlation subcircuits in a column of the subpixels respectively;

[0035] The multiple input terminals of the switch subcircuit are connected to the multiple read lines in a one-to-one correspondence.

[0036] Optionally, the ultrasonic sensor panel includes a sensing area and a non-sensing area located outside the sensing area;

[0037] The sensing area includes a plurality of sub-pixels, the acquisition sub-circuit is arranged in the sub-pixels, and the dual correlation sub-circuit is arranged in the non-sensing area.

[0038] Optionally, the ultrasonic sensing panel further comprises a switch subcircuit in the ultrasonic monitoring circuit; the switch subcircuit is arranged in the non-sensing area; the dual correlation subcircuit is arranged on a side of the switch subcircuit away from the sensing area;

[0039] The sensing area further comprises a plurality of readout lines, each of which is electrically connected to the acquisition subcircuit in a column of the subpixels;

[0040] The multiple input terminals of the switch subcircuit are connected to the multiple read lines in a one-to-one correspondence.

[0041] In a third aspect, the present application provides an ultrasound device, the ultrasound device comprising the ultrasound monitoring circuit as described in the first aspect;

[0042] The acquisition subcircuit and the dual correlation subcircuit are arranged on the ultrasonic sensor panel of the ultrasonic device, and the processing subcircuit is arranged on the peripheral integrated circuit of the ultrasonic device;

[0043] Alternatively, the acquisition subcircuit is arranged on the ultrasonic sensor panel, and the dual correlation subcircuit and the processing subcircuit are arranged on the peripheral integrated circuit;

[0044] Wherein, the peripheral integrated circuit is electrically connected to the ultrasonic sensor panel.

[0045] In a fourth aspect, the present application provides a signal reading method for controlling the ultrasonic monitoring circuit described in the first aspect, the signal reading method comprising:

[0046] A first enable signal is written to the first enable signal line so that the dual-correlation sub-circuit writes the non-deformation signal collected by the acquisition sub-circuit into the processing sub-circuit, and a second enable signal is written to the second enable signal line so that the dual-correlation sub-circuit writes the first deformation signal collected by the acquisition sub-circuit into the processing sub-circuit.

[0047] The ultrasonic monitoring circuit, ultrasonic sensor panel, ultrasonic device and signal reading method provided by the present application have at least the following advantages: the dual correlation subcircuit is connected to the acquisition subcircuit, the first enable signal line, the second enable signal line and the processing subcircuit, and is used to write the non-deformation signal collected by the acquisition subcircuit into the processing subcircuit under the control of the first enable signal of the first enable signal line, and write the first deformation signal collected by the acquisition subcircuit into the processing subcircuit under the control of the second enable signal of the second enable signal line, wherein the processing subcircuit is used to output the second deformation signal according to the first deformation signal and the non-deformation signal, the non-deformation signal is the signal generated by the ultrasonic sensor in the state without deformation, and the first deformation signal is the signal generated by the ultrasonic sensor in the state with deformation. In this way, the second deformation signal output by the processing subcircuit is the actual deformation signal of the ultrasonic sensor, achieving the purpose of denoising and removing the system base value, even if the ambient temperature of the ultrasonic monitoring circuit changes, denoising and removing the system base value through dual correlation sampling can also reduce the influence of temperature change on the monitoring result. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments of the present application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0049] Figure 1 It is one of the structural schematic diagrams of an ultrasonic monitoring circuit provided in an embodiment of the present application;

[0050] Figure 2 This is one of the structural schematic diagrams of an ultrasound pixel circuit provided in an embodiment of the present application;

[0051] Figure 3 is a structural schematic diagram of a processing sub-circuit provided in an embodiment of the present application;

[0052] Figure 4 It is a structural schematic diagram of an IV conversion circuit in the related art;

[0053] Figure 5 is a structural schematic diagram of a multiplexing switch circuit provided in an embodiment of the present application;

[0054] Figure 6 This is one of the timing diagrams of a signal reading method provided in an embodiment of the present application;

[0055] Figure 7 is a structural schematic diagram of another ultrasound pixel circuit provided in an embodiment of the present application;

[0056] Figure 8 This is the second structural schematic diagram of an ultrasonic monitoring circuit provided in an embodiment of the present application;

[0057] Fig. 9 This is a third structural diagram of an ultrasonic monitoring circuit provided in an embodiment of the present application;

[0058] Fig.10 This is the second timing diagram of a signal reading method provided in an embodiment of the present application;

[0059] Fig.11 This is the third timing diagram of a signal reading method provided in an embodiment of the present application;

[0060] Fig.12 It is a simulation schematic diagram of a dual-correlation subcircuit provided in an embodiment of the application;

[0061] Fig.13 It is a schematic diagram of simulation results of a dual-correlation subcircuit provided in an embodiment of the application. DETAILED DESCRIPTION

[0062] The following will be combined with the drawings in some embodiments to clearly and completely describe the technical solutions in some embodiments. Obviously, the described embodiments are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0063] In some embodiments, a plurality of signals have a first level and a second level. The first level and the second level only represent that the level of the signal has two states, and do not represent that the first level or the second level has a specific value.

[0064] The transistor in some embodiments may be a thin film transistor (TFT) or a metal oxide semiconductor (MOS) field effect transistor. The control electrode of the transistor may be a gate electrode, the first electrode may be a source electrode or a drain electrode, and the second electrode may be a drain electrode or a source electrode. For example, it may be an N-type TFT or a P-type TFT, which is not limited in the embodiments of the present application.

[0065] In ultrasonic projects such as ultrasonic imaging applications, the device will generate heat as the working time increases, causing the pixel state in the ultrasonic pixel circuit of the ultrasonic sensor panel to shift from the state at the initial power-on. For array imaging of ultrasonic sensor panels, power-on calibration is particularly important. Due to the non-uniformity of the process, the responses of different pixels of the device are different after leaving the factory, and there will be a system base value. This system base value will also change when the temperature changes and causes the pixel response to drift. The difference between pixels will cause the pixel response signal under actual excitation to be submerged, resulting in the inability to read the actual response signal.

[0066] For example, the current magnitude of the echo signal is uA, but the difference in the system base value may reach hundreds of uA. Even after power-on calibration, the noise caused by changes in the external environment or temperature drift may reach uA, which will drown out the actual echo signal. Therefore, it is necessary to remove noise and system base value in ultrasonic imaging to reduce the impact of temperature changes on monitoring results.

[0067] Figure 1 One of the structural schematic diagrams of an ultrasonic monitoring circuit provided in an embodiment of the present application is exemplarily shown, and the ultrasonic monitoring circuit includes:

[0068] The dual correlation subcircuit 10 is connected to the acquisition subcircuit 20, the first enable signal line Base_en, the second enable signal line Sig_en and the processing subcircuit 30, and is used to write the non-deformation signal acquired by the acquisition subcircuit 20 into the processing subcircuit 30 under the control of the first enable signal line Base_en, and write the first deformation signal acquired by the acquisition subcircuit 20 into the processing subcircuit 30 under the control of the second enable signal line Sig_en;

[0069] The processing subcircuit 30 is used to output a second deformation signal according to the first deformation signal and the non-deformation signal. The non-deformation signal is a signal generated by the ultrasonic sensor in a non-deformation state, and the first deformation signal is a signal generated by the ultrasonic sensor in a deformation state.

[0070] In some embodiments, the ultrasonic monitoring circuit can be applied to ultrasonic monitoring scenarios in the fields of industry, agriculture, biomedicine, and consumer electronics, such as under-screen fingerprint collection, ultrasonic fingerprint, ultrasonic medical treatment, etc. The ultrasonic monitoring circuit includes at least a double correlation subcircuit 10 for performing double correlation sampling (Correlated Double Sampling, CDS). Double correlation sampling refers to collecting a system base value and an actual signal containing the system base value. When the system and its surrounding environment do not change much in a short period of time, the system base value is considered to be almost unchanged, so that the system base value can be distinguished from the actual signal containing the system base value, and the purpose of removing the system base value can be achieved.

[0071] In some embodiments, the ultrasonic monitoring circuit includes an ultrasonic sensor, a collection subcircuit 20, a dual correlation subcircuit 10, and a processing subcircuit 30. The collection subcircuit 20 is electrically connected to the ultrasonic sensor, which can transmit ultrasonic waves to an object and receive echoes reflected by the object. The ultrasonic sensor can be a sensor made of piezoelectric material, such as polyvinylidene fluoride (PVDF).

[0072] In some embodiments, when the ultrasonic sensor is not deformed, the acquisition subcircuit 20 acquires signals from the ultrasonic sensor to obtain a non-deformation signal, which includes noise and a system base value. When the ultrasonic sensor is deformed, the acquisition subcircuit 20 acquires signals from the ultrasonic sensor to obtain a first deformation signal, which includes not only an actual deformation signal of the ultrasonic sensor, but also noise and a system base value.

[0073] In some embodiments, the dual correlation subcircuit 10 can read the non-deformation signal from the acquisition subcircuit 20 under the control of the first enable signal, and write the non-deformation signal into the processing subcircuit 30. The dual correlation subcircuit 10 can read the first deformation signal from the acquisition subcircuit 20 under the control of the second enable signal, and write the first deformation signal into the processing subcircuit 30. Then, the processing subcircuit 30 can remove the non-deformation signal from the first deformation signal according to the non-deformation signal, and output the second deformation signal. For example, the processing subcircuit 30 can perform a difference between the first deformation signal and the non-deformation signal to output the second deformation signal. Based on the dual correlation sampling, by writing the first enable signal to the first enable signal line Base_en and writing the second enable signal to the second enable signal line Sig_en, it can be considered that the second deformation signal output by the processing subcircuit 30 is the actual deformation signal of the ultrasonic sensor. In this way, the purpose of denoising and removing the system base value is achieved. Even if the ambient temperature of the ultrasonic monitoring circuit changes, the denoising and removal of the system base value by dual correlation sampling can reduce the influence of temperature change on the monitoring result.

[0074] Optionally, the dual correlation sub-circuit 10 includes a first storage module 101, a second storage module 102 and an output module 103;

[0075] The first storage module 101 is electrically connected to the acquisition sub-circuit 20, the first enable signal line Base_en, and the output module 103, respectively, and is used to store the non-transformable signal under the control of the first enable signal;

[0076] The second storage module 102 is electrically connected to the acquisition sub-circuit 20, the second enable signal line Sig_en, and the output module 103, respectively, and is used to store the first deformation signal under the control of the second enable signal;

[0077] The output module 103 is also electrically connected to the processing sub-circuit 30 , and is used to write the non-deformation signal into the processing sub-circuit 30 , and write the first deformation signal into the processing sub-circuit 30 .

[0078] In some embodiments, the dual-correlation subcircuit 10 can start the first storage module 101 under the control of the first enable signal, read the non-deformation signal from the acquisition subcircuit 20, and store the non-deformation signal through the first storage module 101. The dual-correlation subcircuit 10 can start the second storage module 102 under the control of the second enable signal, read the first deformation signal from the acquisition subcircuit 20, and store the first deformation signal through the second storage module 102. In this way, the dual-correlation subcircuit 10 stores the non-deformation signal and the first deformation signal through the first storage module 101 and the second storage module 102, respectively.

[0079] In some embodiments, when the output module 103 wants to write the non-deformation signal and the first deformation signal into the processing sub-circuit 30 respectively, the first storage module 101 is turned on by a first enable signal, so that the output module 103 reads the non-deformation signal from the first storage module 101 and writes the non-deformation signal into the processing sub-circuit 30, and the second storage module 102 is turned on by a second enable signal, so that the output module 103 reads the first deformation signal from the second storage module 102 and writes the first deformation signal into the processing sub-circuit 30.

[0080] In a specific embodiment, the ultrasonic monitoring circuit can be applied to ultrasonic imaging, and the ultrasonic sensor, acquisition subcircuit 20 and dual-correlation subcircuit 10 in the ultrasonic monitoring circuit can be arranged on an ultrasonic sensor panel, and the ultrasonic sensor panel includes an ultrasonic pixel array, and the sub-pixels in the ultrasonic pixel array include ultrasonic pixel circuits. Specifically, the ultrasonic sensor, acquisition subcircuit 20 and dual-correlation subcircuit 10 in the ultrasonic monitoring circuit can be arranged in sub-pixels, and the ultrasonic sensor, acquisition subcircuit 20 and dual-correlation subcircuit 10 constitute a new ultrasonic pixel circuit. In this way, the ultrasonic pixel array formed on the ultrasonic sensor panel can be applied to arrayed imaging.

[0081] The ultrasonic sensor panel may further include a plurality of row scanning signal lines, each row scanning signal line being connected to an ultrasonic pixel circuit of a row of sub-pixels. Specifically, the output module 103 of the dual correlation sub-circuit 10 is also electrically connected to the row scanning signal line, and is used to read the non-deformation signal from the first storage module 101 and write the non-deformation signal to the processing sub-circuit 30 under the control of the row scanning signal of the row scanning signal line, and to read the first deformation signal from the second storage module 102 and write the first deformation signal to the processing sub-circuit 30 under the control of the row scanning signal of the row scanning signal line.

[0082] In current ultrasonic sensor panels, as the working time of pixels increases, the pixel temperature will change, and the signal read will change accordingly. In ultrasonic imaging applications, this will cause the echo image to be different from the initial state at power-on during processing. In this embodiment, by embedding the dual-correlation subcircuit 10 into the sub-pixel of the ultrasonic sensor panel, the second deformation signal output by the final processing subcircuit 30 can avoid the influence of temperature drift, remove noise interference other than the echo signal, and remove the system base value, thereby improving the ultrasonic imaging effect.

[0083] Optionally, the first storage module 101 includes a first transistor M3 and a first capacitor C1; the second storage module 102 includes a second transistor M4 and a second capacitor C2;

[0084] The control electrode of the first transistor M3 is electrically connected to the first enable signal line Base_en, the first electrode is electrically connected to the acquisition subcircuit 20 and the output module 103 respectively, and the second electrode is electrically connected to the first end of the first capacitor C1; the second end of the first capacitor C1 is grounded;

[0085] The control electrode of the second transistor M4 is electrically connected to the second enable signal line Sig_en, the first electrode is electrically connected to the acquisition subcircuit 20 and the output module 103 respectively, and the second electrode is electrically connected to the first end of the second capacitor C2; the second end of the second capacitor C2 is grounded.

[0086] In some embodiments, the first transistor M3 can control the connection between the acquisition subcircuit 20 and the first end of the first capacitor C1 in response to the first enable signal. For example, the first transistor M3 is an N-type TFT. When the first enable signal is a high-level signal, the first transistor M3 is turned on, the acquisition subcircuit 20 is connected to the first end of the first capacitor C1, and the dual-correlation subcircuit 10 can send the non-transformable signal collected by the acquisition subcircuit 20 to the first capacitor C1 for storage. When the first enable signal is a low-level signal, the first transistor M3 is turned off, and the connection between the acquisition subcircuit 20 and the first end of the first capacitor C1 is disconnected.

[0087] In some embodiments, the second transistor M4 can control the connection between the acquisition subcircuit 20 and the first end of the second capacitor C2 in response to the second enable signal. For example, the second transistor M4 is an N-type TFT. When the second enable signal is a high-level signal, the second transistor M4 is turned on, the acquisition subcircuit 20 and the first end of the second capacitor C2 are connected, and the dual-correlation subcircuit 10 can send the first deformation signal collected by the acquisition subcircuit 20 to the second capacitor C2 for storage. When the second enable signal is a low-level signal, the second transistor M4 is turned off, and the connection between the acquisition subcircuit 20 and the first end of the second capacitor C2 is disconnected.

[0088] In addition, when the output module 103 is to write the non-deformation signal and the first deformation signal into the processing sub-circuit 30 respectively, the first enable signal is used to turn on the first transistor M3, so that the output module 103 reads the non-deformation signal from the first capacitor C1 and writes the non-deformation signal into the processing sub-circuit 30, and the second enable signal is used to turn on the second transistor M4, so that the output module 103 reads the first deformation signal from the second capacitor C2 and writes the first deformation signal into the processing sub-circuit 30.

[0089] Figure 2 is one of the structural schematic diagrams of an ultrasound pixel circuit provided in an embodiment of the present application, Figure 2The ultrasonic sensor, the acquisition subcircuit 20 and the dual-correlation subcircuit 10 in the ultrasonic monitoring circuit are shown. The ultrasonic sensor is a PVDF sensor, the acquisition subcircuit 20 includes a transistor M1 and a transistor M2, and the output module 103 in the dual-correlation subcircuit 10 includes a transistor M5 and a transistor M6. The first storage module 101 in the dual-correlation subcircuit 10 includes a first transistor M3 and a first capacitor C1, and the control electrode of the first transistor M3 can be electrically connected to the first enable signal line Base_en. The second storage module 102 in the dual-correlation subcircuit 10 includes a second transistor M4 and a second capacitor C2. The control electrode of the second transistor M4 can be electrically connected to the second enable signal line Sig_en.

[0090] In the application scenario of ultrasound imaging, such as Figure 2 The ultrasonic sensor, the acquisition subcircuit 20 and the dual-correlation subcircuit 10 shown can be built into the sub-pixel of the ultrasonic sensor panel. As the ultrasonic pixel circuit of the ultrasonic sensor panel, the ultrasonic sensor panel can include a first enable signal line Base_en and a second enable signal line Sig_en. In addition, the ultrasonic sensor panel also includes a reset signal line Vrst, a bias voltage signal line Vbias, a control signal line Vclose, a row scan signal line Vgate, a power signal line VDD, and a read line OUT. Among them, the ultrasonic sensor panel may include a plurality of read lines OUT, each read line OUT is electrically connected to the output module 103 of the dual-correlation subcircuit 10 in a column of sub-pixels. Each read line OUT can be electrically connected to a processing subcircuit 30. Among them, the row scan signal line Vgate can be electrically connected to the gate drive circuit of the ultrasonic sensor panel, and the gate drive circuit can include a gate drive integrated on array substrate (Gate Driven on Array, GOA) circuit, and the GOA circuit is electrically connected to the row scan signal line Vgate, which can provide a row scan signal.

[0091] like Figure 2 As shown, the control electrode of transistor M1 is electrically connected to the reset signal line Vrst, the first electrode of transistor M1 is electrically connected to the first electrode of transistor M2, and the second electrode is electrically connected to the bias voltage signal line Vbias. The control electrode of transistor M2 is electrically connected to the control signal line Vclose, and the second electrode is electrically connected to the node N1. The control electrode of transistor M5 is electrically connected to the node N1, the first electrode is electrically connected to the power signal line VDD, and the second electrode is electrically connected to the first electrode of transistor M6. The control electrode of transistor M6 is electrically connected to the row scanning signal line Vgate, and the second electrode is electrically connected to the read line OUT.

[0092] Among them, when the first transistor M3 is turned on, the first capacitor C1 can store the charge of the node N1, thereby storing the non-deformation signal. When the second transistor M4 is turned on, the second capacitor C2 can store the charge of the node N1, thereby storing the first deformation signal. When only the first transistor M3, the transistor M5 and the transistor M6 are turned on in the ultrasound pixel circuit, the non-deformation signal can be written to the read line OUT. When only the first transistor M3M4, the transistor M5 and the transistor M6 are turned on in the ultrasound pixel circuit, the first deformation signal can be written to the read line OUT.

[0093] In some embodiments, the signal written into the read line OUT by the dual correlation subcircuit 10 may be a current signal, which is then converted into a voltage signal in the processing subcircuit 30 of the ultrasonic monitoring circuit. In addition, the voltage signal may be converted into a digital signal to obtain a digital signal for data processing in the processor. For example, the processing subcircuit 30 may include a current-voltage (IV) conversion circuit, an analog-to-digital converter (ADC) circuit, and a processor circuit.

[0094] Figure 3 is a schematic diagram of the structure of a processing sub-circuit 30 provided in an embodiment of the present application, such as Figure 3 As shown, the processing subcircuit 30 includes an IV conversion circuit and an ADC circuit. The IV conversion circuit is composed of an operational amplifier and a resistor. This embodiment does not limit the structure of the operational amplifier. For example, it can be constructed by a MOS tube, such as Figure 4 The read line OUT can be electrically connected to the inverting input terminal (-) of the operational amplifier in the IV conversion circuit, the non-inverting input terminal (+) of the operational amplifier receives the reference voltage signal Vref, and the output terminal of the operational amplifier is electrically connected to the ADC circuit.

[0095] In some embodiments, the transistor M6 can be turned on by the row scanning signal of the row scanning signal line Vgate, and the first transistor M3 of the first capacitor C1 and the second transistor M4 of the second capacitor C2 can be used to perform two voltage readings using an ADC to obtain a non-deformation signal and a first deformation signal, respectively. Then, a subtraction operation is performed on the first deformation signal in the form of digital signals and the non-deformation signal in the processor circuit to obtain a second deformation signal. The second deformation signal is the signal amount of the charge corresponding to the actual deformation generated when the PVDF sensor receives the echo, which is called the actual deformation signal in this embodiment.

[0096] In current ultrasound imaging applications, as the demand for imaging area increases, the size of ultrasound pixel arrays also increases. For example, the array size of ultrasound sensor panels has increased from 200 columns of sub-pixels to 1360 columns of sub-pixels. The number of columns of peripheral circuits corresponding to the ultrasound pixel array also needs to increase. Each column of sub-pixels corresponds to a set of IV conversion circuits and ADC circuits, which places great demands on the number of peripheral circuits.

[0097] Optionally, the ultrasonic monitoring circuit further includes a switch subcircuit 40; the switch subcircuit 40 is arranged between the dual correlation subcircuit 10 and the processing subcircuit 30; the switch subcircuit 40 includes a plurality of input terminals, an output terminal, and a control terminal;

[0098] Multiple input terminals are connected to multiple read lines OUT in a one-to-one correspondence, each read line OUT is connected to multiple dual-correlation sub-circuits 10, and one output terminal is electrically connected to one processing sub-circuit 30; the control terminal is used to receive a switch control signal;

[0099] The dual correlation subcircuit 10 is used to write the non-deformed signal into the read line OUT under the control of the first enable signal, and to write the first deformed signal into the read line OUT under the control of the second enable signal;

[0100] The switch subcircuit 40 is used to send the non-deformation signal in the read line OUT to the processing subcircuit 30 under the control of the switch control signal, and to send the first deformation signal in the read line OUT to the processing subcircuit 30 under the control of the switch control signal.

[0101] In some embodiments, a plurality of dual-correlation subcircuits 10 and a processing subcircuit 30 can be connected via a switch subcircuit 40, thereby reducing the number of circuits in the processing subcircuit 30, such as reducing the number of circuit components in the processing subcircuit 30. In this way, the ultrasonic monitoring circuit can be applied to application scenarios of large-size ultrasonic pixel arrays, thereby reducing circuit costs.

[0102] In the application scenario of ultrasound imaging, referring to the relevant description in the above embodiments, Figure 2 The ultrasonic sensor, the acquisition subcircuit 20 and the dual-correlation subcircuit 10 shown can be built into the sub-pixels of the ultrasonic sensing panel, and each readout line OUT of the ultrasonic sensing panel is electrically connected to the output module 103 of the dual-correlation subcircuit 10 in a column of sub-pixels, so that the dual-correlation subcircuit 10 can write the non-deformation signal into the readout line OUT under the control of the first enable signal, and write the first deformation signal into the readout line OUT under the control of the second enable signal.

[0103] Specifically, the switch subcircuit 40 is arranged between a plurality of dual-correlation subcircuits 10 and a processing subcircuit 30; each input end of the switch subcircuit 40 is connected to a read line OUT, and an output end is connected to a processing subcircuit 30. The control end of the switch subcircuit 40 can receive a switch control signal, and under the control of the switch control signal, the switch subcircuit 40 selects a read line OUT and a processing subcircuit 30, thereby sending the non-deformation signal in the read line OUT to the processing subcircuit 30, or sending the first deformation signal in the read line OUT to the processing subcircuit 30. In this way, under the control of the switch control signal, the switch subcircuit 40 can sequentially control the plurality of read lines OUT to be respectively turned on to the processing subcircuit 30, and write the non-deformation signal or the first deformation signal into the processing subcircuit 30.

[0104] In some embodiments, the switch subcircuit 40 may be a multiplex switch circuit, the multiplex switch circuit comprising two N The switch subcircuit 40 may be a Mux switch circuit in which 4 switch control signals control 16 channels. Mux represents a multiplexer. Figure 5 As shown, the Mux switch circuit includes 16 input terminals, and the 16 input terminals are connected to the 16 read lines OUT1 to OUT16 in a one-to-one correspondence. The Mux switch circuit includes an output terminal, which can be electrically connected to a processing subcircuit 30, for example, an output terminal can be electrically connected to the inverting input terminal of the IV conversion circuit in the above embodiment. The Mux switch circuit includes a 4-level switch group, each level of the switch group is connected to a switch control line, and the 4-level switch group is connected to the 4 switch control lines (Mux1 to Mux4) in a one-to-one correspondence.

[0105] like Figure 5 As shown, the Mux switch circuit includes two types of switches, one type of switch is turned on at a high level, and the other type of switch is turned on at a low level. The number of the two types of switches in each level of switch group is equal and is set at intervals, so that the switch control signals of the four switch control lines Mux1 to Mux4 can be 4-bit binary data, for example, 0000 represents the read line OUT0 is turned on, 0001 represents the read line OUT1 is turned on, and 0010 represents the read line OUT2 is turned on. Each binary number represents the turn on of one of the read lines OUT, such as Figure 5 As shown, a total of 16 channels can be controlled.

[0106] Among them, by switching the Mux switch circuit, although the reading time will be increased, the number of peripheral circuits can be reduced. By balancing the structure of the Mux switch circuit and the reading time, the time and cost can be optimized.

[0107] Figure 6is one of the timing diagrams of a signal reading method provided in an embodiment of the present application, such as Figure 6 As shown, the reset signal of the reset signal line Vrst, the control signal of the control signal line Vclose, the row scan signal of the row scan signal line Vgate, the first enable signal of the first enable signal line Base_en, the second enable signal of the second enable signal line Sig_en, and the timing control logic of the switch control signals SW1 to SW16 are shown. Among them, the switch control signals SW1 to SW16 correspond to Figure 5 The specific switch states of the 16 channels in the Mux switch circuit shown can correspond to 4 bits of binary data. Figure 6 READ_OUT represents the non-deformation signal and the first deformation signal read out by the processing sub-circuit 30 . The non-deformation signal and the first deformation signal are converted by the IV conversion circuit and are voltage signals read out by the ADC circuit.

[0108] for Figure 2 The ultrasonic monitoring circuit in FIG. 1 is an example of an N-type transistor. Figure 6 During the GATE1 shown, a high-level signal is first written to the first enable signal line Base_en, so that the first transistor M3 is turned on, and then, under the control of the switch control signals SW1 to SW16, 16 channels are turned on in sequence, and the non-deformation signals of the ultrasonic sensors in a row of sub-pixels are read out from the read line OUT respectively. Then, the first enable signal line Base_en is pulled low, and a high-level signal is written to the second enable signal line Sig_en, so that the second transistor M4 is turned on, and then, under the control of the switch control signals SW1 to SW16, 16 channels are turned on in sequence, and the first deformation signals of the ultrasonic sensors in a row of sub-pixels are read out from the read line OUT respectively. GATE2 after GATE1 also reads a row of sub-pixels in the same reading manner. In addition, before the GATE1 period, a high-level signal can be written to the first enable signal line Base_en and the second enable signal line Sig_en in sequence to turn on the first transistor M3 and the second transistor M4 respectively, so that the first capacitor C1 stores the non-deformation signal, the second transistor M4 is turned on, and the second capacitor C2 stores the first deformation signal, so that it can be read from the capacitor when the first transistor M3 and the second transistor M4 are turned on during the GATE1 period.

[0109] In some embodiments, a subtractor may be added inside the ultrasonic pixel circuit to directly subtract the system base value, but this is not conducive to achieving a higher PPI for the ultrasonic sensor panel. Figure 6As shown, during GATE1, the signals of the PVDF sensor collected twice are read out, and then subtracted by a subtractor, so that the system base value can be directly removed in the sub-pixel. This is only an example, and the embodiment of the present application does not limit this.

[0110] Optionally, the dual correlation subcircuit 10 includes a third storage module 104 and a fourth storage module 105; the processing subcircuit 30 includes a subtractor module 301;

[0111] The third storage module 104 is electrically connected to the acquisition sub-circuit 20, the first enable signal line Base_en, and the subtractor module 301, respectively, and is used to store the non-transformable signal under the control of the first enable signal;

[0112] The fourth storage module 105 is electrically connected to the acquisition sub-circuit 20, the second enable signal line Sig_en, and the processing sub-circuit 30, respectively, and is used to store the first deformation signal under the control of the second enable signal;

[0113] The subtractor module 301 is used to perform a subtraction between the first deformation signal and the non-deformation signal.

[0114] In some embodiments, the dual-correlation subcircuit 10 can turn on the third storage module 104 under the control of the first enable signal, read the non-deformation signal from the acquisition subcircuit 20, and store the non-deformation signal through the first storage module 101, and the subtractor module 301 can read the non-deformation signal when the third storage module 104 is turned on. The dual-correlation subcircuit 10 turns on the second storage module 102 under the control of the second enable signal, reads the first deformation signal from the acquisition subcircuit 20, and stores the first deformation signal through the second storage module 102, and the subtractor module 301 can read the first deformation signal when the fourth storage module 105 is turned on. Then the subtractor module 301 can perform a difference between the first deformation signal and the non-deformation signal, and output the difference result to the lower circuit in the processing subcircuit 30, so that the output subcircuit finally outputs the second deformation signal, so that the actual deformation signal of the ultrasonic sensor is obtained, which can achieve the purpose of denoising and removing the system base value.

[0115] In a specific implementation, for an application scenario of ultrasound imaging, the ultrasonic sensor and the acquisition subcircuit 20 in the ultrasound monitoring circuit can be arranged in a subpixel, and the dual correlation subcircuit 10 can be arranged outside the ultrasound pixel array, for example, the dual correlation subcircuit 10 can be arranged in a non-sensing area of ​​the ultrasound sensor panel. This is only an example, and the embodiment of the present application does not limit this.

[0116] Figure 7 is a schematic diagram of the structure of another ultrasound pixel circuit provided in an embodiment of the present application, Figure 7FIG. 2 shows an ultrasonic sensor and a collection subcircuit 20 in an ultrasonic monitoring circuit, wherein the ultrasonic sensor is a PVDF sensor, and the collection subcircuit 20 includes transistors M7 to M10. Figure 7 As shown, the control electrode of transistor M1 is electrically connected to the reset signal line Vrst, the first electrode of transistor M7 is electrically connected to the first electrode of transistor M8, and the second electrode is electrically connected to the bias voltage signal line Vbias. The control electrode of transistor M8 is electrically connected to the control signal line Vclose, and the second electrode is electrically connected to the node N2. The control electrode of transistor M9 is electrically connected to the node N2, the first electrode is electrically connected to the power signal line VDD, and the second electrode is electrically connected to the first electrode of transistor M10. The control electrode of transistor M10 is electrically connected to the row scanning signal line Vgate, and the second electrode is electrically connected to the read line OUT. Node N2 is also connected to a capacitor C3, which can store the charge of node N2.

[0117] like Figure 7 The ultrasonic pixel circuit is a pixel circuit that uses a capacitor C3 to read the echo signal, but the dual-correlation subcircuit 10 needs to read twice, one time to read the non-deformation signal and the other time to read the first deformation signal. Then the non-deformation signal and the first deformation signal are written into the subtractor module 301 of the processing subcircuit 30, and the ADC circuit can be directly read once through the subtractor module 301. In this way, although the peripheral circuit will be more complicated, the sensing area of ​​the ultrasonic sensor panel will be relatively simple, which is convenient for the ultrasonic sensor panel to achieve a higher PPI, where PPI represents the pixel density unit (Pixels Per Inch).

[0118] Optionally, the third storage module 104 includes a third transistor M11 and a third capacitor C4; the fourth storage module 105 includes a fourth transistor M12 and a fourth capacitor C5;

[0119] The control electrode of the third transistor M11 is electrically connected to the first enable signal line Base_en, the first electrode is electrically connected to the acquisition subcircuit 20, and the second electrode is electrically connected to the first end of the third capacitor C4 and the first input end of the subtractor module 301 respectively; the second end of the third capacitor C4 is grounded;

[0120] The control electrode of the fourth transistor M12 is electrically connected to the second enable signal line Sig_en, the first electrode is electrically connected to the acquisition subcircuit 20, and the second electrode is electrically connected to the first end of the fourth capacitor C5 and the second input end of the subtractor module 301 respectively; the second end of the fourth capacitor C5 is grounded.

[0121] In some embodiments, the third transistor M11 can control the connection between the acquisition subcircuit 20 and the first end of the third capacitor C4 in response to the first enable signal. For example, the third transistor M11 is an N-type TFT. When the first enable signal is a high-level signal, the third transistor M11 is turned on, the acquisition subcircuit 20 and the first end of the third capacitor C4 are connected, and the dual-correlation subcircuit 10 can send the non-transformable signal collected by the acquisition subcircuit 20 to the third capacitor C4 for storage. When the first enable signal is a low-level signal, the third transistor M11 is turned off, and the connection between the acquisition subcircuit 20 and the first end of the third capacitor C4 is disconnected.

[0122] In some embodiments, the fourth transistor M12 can control the connection between the acquisition subcircuit 20 and the first end of the fourth capacitor C5 in response to the second enable signal. For example, the fourth transistor M12 is an N-type TFT. When the second enable signal is a high-level signal, the fourth transistor M12 is turned on, the acquisition subcircuit 20 and the first end of the fourth capacitor C5 are connected, and the dual-correlation subcircuit 10 can send the first deformation signal collected by the acquisition subcircuit 20 to the fourth capacitor C5 for storage. When the second enable signal is a low-level signal, the fourth transistor M12 is turned off, and the connection between the acquisition subcircuit 20 and the first end of the fourth capacitor C5 is disconnected.

[0123] Figure 8 This is a second structural diagram of an ultrasonic monitoring circuit provided in an embodiment of the present application. Figure 8 The double correlation subcircuit 10 in the ultrasonic monitoring circuit and the subtractor module 301 in the processing subcircuit 30 are shown. The subtractor module 301 is composed of an operational amplifier and a resistor. The third storage module 104 in the double correlation subcircuit 10 includes a third transistor M11 and a third capacitor C4. The control electrode of the third transistor M11 can be electrically connected to the first enable signal line Base_en, the first electrode can be electrically connected to the acquisition subcircuit 20, and the second electrode is respectively electrically connected to the first end of the third capacitor C4 and the in-phase input end of the subtractor module 301, and the in-phase input end is the first input end. The fourth storage module 105 in the double correlation subcircuit 10 includes a fourth transistor M12 and a fourth capacitor C5. The control electrode of the fourth transistor M12 can be electrically connected to the second enable signal line Sig_en, the first electrode can be electrically connected to the acquisition subcircuit 20, and the second electrode is respectively electrically connected to the first end of the fourth capacitor C5 and the inverting input end of the subtractor module 301, and the inverting input end is the second input end.

[0124] like Figure 8As shown, when the third transistor M11 is turned on, the third capacitor C4 can store the charge of the node N3, thereby storing the non-deformation signal, and the non-deformation signal can be read by the non-inverting input terminal of the subtractor module 301. When the fourth transistor M12 is turned on, the fourth capacitor C5 can store the charge of the node N3, thereby storing the first deformation signal, and the inverting input terminal of the subtractor module 301 can read the first deformation signal. Then, the operational amplifier of the subtractor module 301 performs a difference between the first deformation signal and the non-deformation signal, and outputs the difference result to the lower circuit in the processing subcircuit 30, so that the processing subcircuit 30 can perform IV conversion, analog-to-digital conversion and other processing, such as Figure 8 This is just an example, and the present application embodiment does not limit this.

[0125] Fig. 9 This is a third structural diagram of an ultrasonic monitoring circuit provided in an embodiment of the present application, such as Fig. 9 As shown, the dual correlation subcircuit 10 can be arranged between the IV conversion circuit of the processing subcircuit 30 and the subtractor module 301. The IV conversion circuit of the processing subcircuit 30 is electrically connected to the acquisition subcircuit 20. The non-deformed signal and the first deformed signal collected by the acquisition subcircuit 20 are first subjected to IV conversion and amplification, and the obtained non-deformed signal and the first deformed signal are voltage signals. Then, the dual correlation subcircuit 10 writes the non-deformed signal into the subtractor module 301 under the control of the first enable signal, and writes the first deformed signal into the subtractor module 301 under the control of the second enable signal.

[0126] Optionally, the ultrasonic monitoring circuit further includes a switch subcircuit 40; the switch subcircuit 40 is arranged between the acquisition subcircuit 20 and the dual correlation subcircuit 10; the switch subcircuit 40 includes a plurality of input terminals, an output terminal, and a control terminal;

[0127] Multiple input terminals are connected to multiple readout lines OUT in one-to-one correspondence, each readout line OUT is connected to multiple acquisition sub-circuits 20, and one output terminal is electrically connected to a dual-correlation sub-circuit 10; the control terminal is used to receive a switch control signal;

[0128] The acquisition sub-circuit 20 is used to write the non-deformation signal into the read line OUT, and write the first deformation signal into the read line OUT;

[0129] The switch subcircuit 40 is used to send the non-deformation signal in the read line OUT to the dual-correlation subcircuit 10 under the control of the switch control signal, and to send the first deformation signal in the read line OUT to the dual-correlation subcircuit 10 under the control of the switch control signal.

[0130] In some embodiments, multiple acquisition subcircuits 20 and a dual-correlation subcircuit 10 can be connected through a switch subcircuit 40, which can reduce the number of circuits in the dual-correlation subcircuit 10, such as reducing the number of circuit components in the dual-correlation subcircuit 10. In this way, the ultrasonic monitoring circuit can be applied to application scenarios of large-size ultrasonic pixel arrays, which can reduce circuit costs.

[0131] In the application scenario of ultrasound imaging, referring to the relevant description in the above embodiments, Figure 8 or Fig. 9 The dual correlation subcircuit 10 shown, as well as the subtractor module 301 and the IV conversion circuit in the processing subcircuit 30 can be placed outside the non-sensing area of ​​the ultrasonic sensor panel. The meaning of external placement is to be placed outside the subpixel, which is a relative description of the subpixel built into the ultrasonic sensor panel in the aforementioned embodiment. Each read line OUT of the ultrasonic sensor panel is electrically connected to the acquisition subcircuit 20 in a column of subpixels. The dual correlation subcircuit 10 can obtain the non-deformation signal from the read line OUT under the control of the first enable signal, and write the non-deformation signal into the subtractor module 301, and obtain the first deformation signal from the read line OUT under the control of the second enable signal, and write the first deformation signal into the subtractor module 301.

[0132] In some embodiments, each input terminal of the switch subcircuit 40 is connected to a read line OUT, and an output terminal is connected to a dual correlation subcircuit 10 such as Figure 8 As shown, or one output end is connected to an IV conversion circuit in a processing subcircuit 30, and the output end of the IV conversion circuit is further connected to a dual correlation subcircuit 10 as shown Fig. 9 This is just an example, and the present application embodiment does not limit this.

[0133] In some embodiments, the switch subcircuit 40 may be a multiplex switch circuit, the multiplex switch circuit comprising two N The switch subcircuit 40 may include 4 input terminals, 1 output terminal, and N control terminals, where N is a positive integer. For example, the switch subcircuit 40 may be a Mux switch circuit in which 4 switch control signals control 16 channels. Mux represents a multiplexer. In addition, the control logic of the switch subcircuit 40 may refer to the control logic of the switch subcircuit 40 in the above embodiment. Figure 5 The related description of the Mux switch circuit shown is not repeated here.

[0134] for Figure 8 or Fig. 9In the ultrasonic monitoring circuit shown, the ultrasonic sensor panel can be driven by a GOA circuit or by a GATE IC. When driven by a GOA circuit, since a row of sub-pixels can only be turned on once, when a read line OUT is turned on, the GOA circuits of all rows need to be turned on once. When driven by a GATE IC, since a row of sub-pixels can be turned on multiple times, the GATE IC can cooperate with the switch sub-circuit 40, a read line OUT is turned on and a row of sub-pixels is turned on, and then the next read line OUT is turned on and the same row of sub-pixels are still turned on. After all the sub-pixels in a row are read, the next row of sub-pixels can be turned on, and each sub-pixel can be read in sequence in conjunction with multiple read lines OUT. This is only an example, and the embodiment of the present application does not limit the driving method of the ultrasonic sensor panel.

[0135] Fig.10 This is a second timing diagram of a signal reading method provided in an embodiment of the present application, such as Fig.10 As shown in FIG. 1 , the driving mode of the ultrasonic sensor panel is GOA circuit driving. Figure 8 or Fig. 9 The ultrasonic monitoring circuit in FIG. 1 is an example of an N-type transistor. Fig.10 During the SW1 period shown in FIG. 1 , a high level signal is first written to the first enable signal line Base_en to control the third transistor M11 to turn on, so that the third capacitor C4 stores the non-deformable signal. Then, the first enable signal line Base_en is pulled low, and then a row scan signal is written to the row scan signal line Vgate. The row scan signal is at a high level, so that Figure 7 The transistor M10 of the acquisition subcircuit 20 in the ultrasonic pixel circuit shown is turned on, and a high level signal is written to the second enable signal line Sig_en to control the second transistor M4 to be turned on, so that the fourth capacitor C5 stores the first deformation signal. Fig.10 READ_OUT represents the second deformation signal read out by the processing sub-circuit 30 . The second deformation signal is converted by the IV conversion circuit and is a voltage signal read out by the ADC circuit. Fig.10 The last row of sub-pixels in GATE-END is turned on for signal reading. After a row of sub-pixels is read, the signal of the channel corresponding to the SW2 signal is read.

[0136] Fig.11 This is a timing diagram of a signal reading method provided in an embodiment of the present application. Fig.11 As shown in FIG. 1 , the driving mode of the ultrasonic sensor panel is GATE IC driving. Figure 8 or Fig. 9 The ultrasonic monitoring circuit in FIG. 1 is an example of an N-type transistor. Fig.11During the SW1 period shown in FIG. 1 , a high level signal is first written to the first enable signal line Base_en to control the third transistor M11 to turn on, so that the third capacitor C4 stores the non-deformable signal. Then, the first enable signal line Base_en is pulled low, and then a row scan signal is written to the row scan signal line Vgate. The row scan signal is at a high level, so that Figure 7 The transistor M10 of the acquisition subcircuit 20 in the ultrasonic pixel circuit shown is turned on, and a high level signal is written to the second enable signal line Sig_en to control the second transistor M4 to be turned on, so that the fourth capacitor C5 stores the first deformation signal. Fig.11 READ_OUT represents the second deformation signal read out by the processing sub-circuit 30 . The second deformation signal is converted by the IV conversion circuit and is a voltage signal read out by the ADC circuit. Fig.11 During the SWN period, the last read line OUT is turned on to read the signal. In this way, the GATE IC can cooperate with the switch sub-circuit 40 to read the next row of sub-pixels after the reading of one row of sub-pixels is completed.

[0137] Fig.12 is a simulation schematic diagram of a dual-correlation subcircuit 10 provided in an embodiment of the application, such as Fig.12 As shown, refer to Fig. 9 The IV conversion circuit and the dual-correlation subcircuit 10 in the ultrasonic monitoring circuit are used to build a simulation circuit. U1 and U3 are two switch chips, and U2 is an operational amplifier in the IV conversion circuit. When the switch chip U1 conducts the operational amplifier U2 and the capacitor C6, the non-deformation signal is stored in the capacitor C6. When the switch chip U3 conducts the operational amplifier U2 and the capacitor C7, the first deformation signal is stored in the capacitor C7. The simulation results are shown in FIG. Fig.13 As shown, when the signal SW_1 is at a high level, the current signal I_in is converted into a voltage signal V_out1, and the voltage signal V_out1 is a non-deformation signal. When the signal SW_2 is at a high level, the current signal I_in is converted into a voltage signal V_out2, and the voltage signal V_out2 is a first deformation signal.

[0138] The embodiment of the present application provides an ultrasonic sensor panel, which includes the ultrasonic monitoring circuit of the above embodiment. Specifically, the ultrasonic sensor panel includes the acquisition subcircuit 20 and the dual correlation subcircuit 10 in the ultrasonic monitoring circuit.

[0139] Optionally, the ultrasonic sensing panel includes a sensing area and a non-sensing area located outside the sensing area;

[0140] The sensing area includes a plurality of sub-pixels, and the acquisition sub-circuit 20 and the dual correlation sub-circuit 10 are arranged in the sub-pixels.

[0141] Optionally, the ultrasonic sensing panel further includes a switch subcircuit 40 in the ultrasonic monitoring circuit; the switch subcircuit 40 is arranged in the non-sensing area;

[0142] The sensing area further includes a plurality of readout lines OUT, each of which is electrically connected to a dual-correlation subcircuit 10 in a column of sub-pixels;

[0143] The multiple input terminals of the switch sub-circuit 40 are connected to the multiple read lines OUT in a one-to-one correspondence.

[0144] In some embodiments, the sensing area of ​​the ultrasonic sensor panel includes an ultrasonic pixel array, and the ultrasonic pixel array is formed by a plurality of sub-pixel arrays. Referring to the relevant description in the foregoing embodiments, the ultrasonic sensor, the acquisition sub-circuit 20, and the dual-correlation sub-circuit 10 in the ultrasonic monitoring circuit can be arranged in the sub-pixel, and the ultrasonic sensor, the acquisition sub-circuit 20, and the dual-correlation sub-circuit 10 constitute a new ultrasonic pixel circuit.

[0145] In this way, the acquisition subcircuit 20 and the dual correlation subcircuit 10 can be built into the sub-pixel of the ultrasonic sensor panel. Figure 2 The IV conversion circuit in the processing subcircuit 30 can be arranged in the non-sensing area of ​​the ultrasonic sensor panel, and the ADC circuit and the processor circuit can be arranged on a peripheral integrated circuit (IC) connected to the ultrasonic sensor panel, as shown. Figure 3 Alternatively, the IV conversion circuit and the ADC circuit in the processing subcircuit 30 may also be arranged on a peripheral IC. This is only an example, and the embodiment of the present application does not limit this.

[0146] In some embodiments, for the application scenario of a large-size ultrasound pixel array, the non-sensing area of ​​the ultrasound sensor panel further includes a switch subcircuit 40, for example, Figure 5 The Mux switch circuit shown. The switch subcircuit 40 is arranged between the dual-correlation subcircuit 10 and the processing subcircuit 30, for example, the Mux switch circuit is arranged at the non-sensing area border between the read line OUT and the peripheral IC. When the IV conversion circuit in the processing subcircuit 30 is arranged in the non-sensing area of ​​the ultrasonic sensor panel, one output end of the switch subcircuit 40 is electrically connected to the IV conversion circuit. When the IV conversion circuit and the ADC circuit in the processing subcircuit 30 are arranged on the peripheral IC, one output end of the switch subcircuit 40 is electrically connected to the peripheral IC, and then connected to the IV conversion circuit and the ADC circuit in the processing subcircuit 30. The non-sensing area also includes a plurality of switch control lines, such as Figure 5 The Mux switch circuit shown has four switch control lines Mux1 to Mux4.

[0147] Optionally, the ultrasonic sensing panel includes a sensing area and a non-sensing area located outside the sensing area;

[0148] The sensing area includes a plurality of sub-pixels, the acquisition sub-circuit 20 is arranged in the sub-pixels, and the dual correlation sub-circuit 10 is arranged in the non-sensing area.

[0149] Optionally, the ultrasonic sensing panel further includes a switch subcircuit 40 in the ultrasonic monitoring circuit; the switch subcircuit 40 is arranged in the non-sensing area; the dual correlation subcircuit 10 is arranged on a side of the switch subcircuit 40 away from the sensing area;

[0150] The sensing area further includes a plurality of readout lines OUT, each of which is electrically connected to a collection subcircuit 20 in a column of sub-pixels;

[0151] The multiple input terminals of the switch sub-circuit 40 are connected to the multiple read lines OUT in a one-to-one correspondence.

[0152] In some embodiments, referring to the relevant description in the above embodiments, the ultrasonic sensor and the acquisition subcircuit 20 in the ultrasonic monitoring circuit are arranged in the sub-pixel to form the following Figure 6 The dual correlation subcircuit 10 is arranged in the non-sensing area, and the dual correlation subcircuit 10 is electrically connected to the subtractor module 301 in the processing subcircuit 30, as shown in FIG. Figure 8 or Fig. 9 shown.

[0153] The IV conversion circuit in the processing subcircuit 30 can be set in the non-sensing area of ​​the ultrasonic sensor panel, and the ADC circuit and the processor circuit can be set on a peripheral IC connected to the ultrasonic sensor panel. Figure 7 As shown, the IV conversion circuit is arranged after the subtractor module 301, or, as shown in Figure 8 As shown, the IV conversion circuit is arranged before the dual correlation subcircuit 10. Alternatively, the IV conversion circuit and the ADC circuit in the processing subcircuit 30 may also be arranged on a peripheral IC. This is only an example, and the embodiment of the present application does not limit this.

[0154] In some embodiments, for the application scenario of a large-size ultrasound pixel array, the non-sensing area of ​​the ultrasound sensor panel further includes a switch subcircuit 40, for example, Figure 5 In the non-sensing area, the dual-correlation subcircuit 10 is arranged on the side of the switch subcircuit 40 away from the sensing area. Figure 7 When the position relationship is shown, one output terminal of the switch subcircuit 40 is electrically connected to the dual-correlation subcircuit 10. Figure 8 When the position relationship is shown, an output end of the switch subcircuit 40 is first electrically connected to the IV conversion circuit in the processing subcircuit 30, and the IV conversion circuit is then electrically connected to the dual correlation subcircuit 10. The non-sensing area also includes a plurality of switch control lines, such as Figure 5 The Mux switch circuit shown has four switch control lines Mux1 to Mux4.

[0155] An ultrasonic sensor panel provided in an embodiment of the present application can achieve the same technical effect as the ultrasonic monitoring circuit in the aforementioned embodiment, and will not be described again here to avoid repetition.

[0156] The embodiment of the present application provides an ultrasonic device, the ultrasonic device is the ultrasonic monitoring circuit of the aforementioned embodiment;

[0157] The acquisition subcircuit 20 and the dual correlation subcircuit 10 are arranged on the ultrasonic sensor panel of the ultrasonic device, and the processing subcircuit 30 is arranged on the peripheral integrated circuit of the ultrasonic device;

[0158] Alternatively, the acquisition subcircuit 20 is disposed on the ultrasonic sensor panel, and the dual correlation subcircuit 10 and the processing subcircuit 30 are disposed on a peripheral integrated circuit;

[0159] Wherein, the peripheral integrated circuit is electrically connected to the ultrasonic sensor panel.

[0160] In some embodiments, the ultrasonic device includes an ultrasonic sensor panel and a peripheral IC electrically connected to the ultrasonic sensor panel. When more wiring or components cannot be added to the ultrasonic sensor panel, part of the circuit modules of the ultrasonic monitoring circuit can be set in the peripheral IC.

[0161] In a specific implementation, the acquisition subcircuit 20 and the dual-correlation subcircuit 10 are arranged on the ultrasonic sensor panel of the ultrasonic device, and the processing subcircuit 30 is arranged on the peripheral integrated circuit of the ultrasonic device. The dual-correlation subcircuit 10 can be built into the sub-pixel of the ultrasonic sensor panel, or can be externally placed in the non-sensing area of ​​the ultrasonic sensor panel, which is not limited in the embodiment of the present application. The IV conversion circuit, ADC circuit and processor circuit in the processing subcircuit 30 can be arranged on the peripheral IC of the ultrasonic device.

[0162] In another specific implementation, the acquisition subcircuit 20 is disposed on the ultrasonic sensor panel, and the dual correlation subcircuit 10 and the processing subcircuit 30 are disposed on a peripheral integrated circuit. The acquisition subcircuit 20 is disposed in a subpixel and can be formed with the ultrasonic sensor as shown in FIG. Figure 6 The dual correlation subcircuit 10 and the processing subcircuit 30 may be arranged entirely on a peripheral IC of the ultrasound device.

[0163] In addition, for the application scenario of a large-size ultrasound pixel array, the non-sensing area of ​​the ultrasound sensor panel also includes a switch subcircuit 40, for example, Figure 5 The Mux switch circuit shown.

[0164] An ultrasonic device provided in an embodiment of the present application can achieve the same technical effect as the ultrasonic monitoring circuit in the aforementioned embodiment, and will not be described again here to avoid repetition.

[0165] The embodiment of the present application provides a signal reading method for controlling the ultrasonic monitoring circuit as in the above embodiment, and the signal reading method includes:

[0166] A first enable signal is written to the first enable signal line Base_en so that the dual-correlation sub-circuit 10 writes the non-deformation signal collected by the acquisition sub-circuit 20 into the processing sub-circuit 30, and a second enable signal is written to the second enable signal line Sig_en so that the dual-correlation sub-circuit 10 writes the first deformation signal collected by the acquisition sub-circuit 20 into the processing sub-circuit 30.

[0167] In some embodiments, in order to improve the effect of denoising and removing the system base value, the time interval between reading the non-deformation signal and the first deformation signal cannot be too long, so that the system and its surrounding environment do not change too much in a short period of time, and the second deformation signal output by the processing subcircuit 30 is more accurate. Figure 6 As shown, during GATE1, a high level signal is first written to the first enable signal line Base_en, then the first enable signal line Base_en is pulled low, and then a high level signal is written to the second enable signal line Sig_en.

[0168] In some embodiments, the reset signal of the reset signal line Vrst, the control signal of the control signal line Vclose, the row scan signal of the row scan signal line Vgate, the first enable signal of the first enable signal line Base_en, the second enable signal of the second enable signal line Sig_en, and the timing control logic of the switch control signals SW1~SW16 can refer to the relevant descriptions in the aforementioned embodiments and will not be repeated here.

[0169] A signal reading method provided in an embodiment of the present application can achieve the same technical effect as the ultrasonic monitoring circuit in the aforementioned embodiment, and will not be described again here to avoid repetition.

[0170] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0171] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0172] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present application.

[0173] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0174] The ultrasonic monitoring circuit, ultrasonic sensor panel, ultrasonic device and signal reading method provided by the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An ultrasonic monitoring circuit, characterized in that: The ultrasonic monitoring circuit comprises: a dual-correlation subcircuit connected to the acquisition subcircuit, the first enable signal line, the second enable signal line and the processing subcircuit, and configured to write the non-deformation signal acquired by the acquisition subcircuit into the processing subcircuit under the control of the first enable signal of the first enable signal line, and to write the first deformation signal acquired by the acquisition subcircuit into the processing subcircuit under the control of the second enable signal of the second enable signal line; The processing subcircuit is used to output a second deformation signal according to the first deformation signal and the non-deformation signal, wherein the non-deformation signal is a signal generated by the ultrasonic sensor in a non-deformation state, and the first deformation signal is a signal generated by the ultrasonic sensor in a deformation state.

2. The ultrasonic monitoring circuit according to claim 1, characterized in that: The dual-correlation subcircuit includes a first storage module, a second storage module and an output module; The first storage module is electrically connected to the acquisition sub-circuit, the first enable signal line, and the output module respectively, and is used to store the non-transformable signal under the control of the first enable signal; The second storage module is electrically connected to the acquisition sub-circuit, the second enable signal line, and the output module respectively, and is used to store the first deformation signal under the control of the second enable signal; The output module is also electrically connected to the processing sub-circuit, and is used to write the non-deformation signal into the processing sub-circuit, and write the first deformation signal into the processing sub-circuit.

3. The ultrasonic monitoring circuit according to claim 2, characterized in that: The first storage module includes a first transistor and a first capacitor; the second storage module includes a second transistor and a second capacitor; The control electrode of the first transistor is electrically connected to the first enable signal line, the first electrode is electrically connected to the acquisition subcircuit and the output module respectively, and the second electrode is electrically connected to the first end of the first capacitor; the second end of the first capacitor is grounded; The control electrode of the second transistor is electrically connected to the second enable signal line, the first electrode is electrically connected to the acquisition subcircuit and the output module respectively, and the second electrode is electrically connected to the first end of the second capacitor; the second end of the second capacitor is grounded.

4. The ultrasonic monitoring circuit according to any one of claims 1 to 3, characterized in that: The ultrasonic monitoring circuit further includes a switch subcircuit; the switch subcircuit is arranged between the dual correlation subcircuit and the processing subcircuit; the switch subcircuit includes a plurality of input terminals, an output terminal, and a control terminal; The multiple input terminals are connected to the multiple readout lines in a one-to-one correspondence, each of the readout lines is connected to the multiple dual-correlation sub-circuits, and the one output terminal is electrically connected to one of the processing sub-circuits; The control end is used to receive a switch control signal; Wherein, the dual correlation subcircuit is used to write the non-deformation signal into the read line under the control of the first enable signal, and to write the first deformation signal into the read line under the control of the second enable signal; The switch subcircuit is used to send the non-deformation signal in the read line to the processing subcircuit under the control of the switch control signal, and to send the first deformation signal in the read line to the processing subcircuit under the control of the switch control signal.

5. The ultrasonic monitoring circuit according to claim 1, characterized in that: The dual correlation subcircuit includes a third storage module and a fourth storage module; the processing subcircuit includes a subtractor module; The third storage module is electrically connected to the acquisition subcircuit, the first enable signal line, and the subtractor module respectively, and is used to store the non-transformable signal under the control of the first enable signal; The fourth storage module is electrically connected to the acquisition sub-circuit, the second enable signal line, and the processing sub-circuit respectively, and is used to store the first deformation signal under the control of the second enable signal; The subtractor module is used to perform a subtraction between the first deformation signal and the non-deformation signal.

6. The ultrasonic monitoring circuit according to claim 5, characterized in that: The third storage module includes a third transistor and a third capacitor; the fourth storage module includes a fourth transistor and a fourth capacitor; The control electrode of the third transistor is electrically connected to the first enable signal line, the first electrode is electrically connected to the acquisition subcircuit, and the second electrode is electrically connected to the first end of the third capacitor and the first input end of the subtractor module respectively; the second end of the third capacitor is grounded; The control electrode of the fourth transistor is electrically connected to the second enable signal line, the first electrode is electrically connected to the acquisition subcircuit, and the second electrode is electrically connected to the first end of the fourth capacitor and the second input end of the subtractor module respectively; the second end of the fourth capacitor is grounded.

7. The ultrasonic monitoring circuit according to claim 5 or 6, characterized in that: The ultrasonic monitoring circuit further includes a switch subcircuit; the switch subcircuit is arranged between the acquisition subcircuit and the dual correlation subcircuit; the switch subcircuit includes a plurality of input terminals, an output terminal, and a control terminal; The multiple input terminals are connected to the multiple readout lines in a one-to-one correspondence, each of the readout lines is connected to the multiple acquisition sub-circuits, and the one output terminal is electrically connected to one of the dual-correlation sub-circuits; the control terminal is used to receive a switch control signal; Wherein, the acquisition subcircuit is used to write the non-deformation signal into the read line, and write the first deformation signal into the read line; The switch subcircuit is used to send the non-deformation signal in the read line to the dual-correlation subcircuit under the control of the switch control signal, and to send the first deformation signal in the read line to the dual-correlation subcircuit under the control of the switch control signal.

8. An ultrasonic sensor panel, characterized in that: The ultrasonic sensor panel comprises an ultrasonic monitoring circuit as described in any one of claims 1-7.

9. The ultrasonic sensor panel according to claim 8, characterized in that: The ultrasonic sensor panel comprises a sensing area and a non-sensing area located outside the sensing area; The sensing area includes a plurality of sub-pixels, and the acquisition sub-circuit and the dual correlation sub-circuit are arranged in the sub-pixels.

10. The ultrasonic sensor panel according to claim 9, characterized in that: The ultrasonic sensor panel further comprises a switch subcircuit in the ultrasonic monitoring circuit; the switch subcircuit is arranged in the non-sensing area; The sensing area further comprises a plurality of readout lines, each of the readout lines being electrically connected to the dual-correlation subcircuits in a column of the subpixels respectively; The multiple input terminals of the switch subcircuit are connected to the multiple read lines in a one-to-one correspondence.

11. The ultrasonic sensor panel according to claim 8, characterized in that: The ultrasonic sensor panel comprises a sensing area and a non-sensing area located outside the sensing area; The sensing area includes a plurality of sub-pixels, the acquisition sub-circuit is arranged in the sub-pixels, and the dual correlation sub-circuit is arranged in the non-sensing area.

12. The ultrasonic sensor panel according to claim 11, characterized in that: The ultrasonic sensor panel further comprises a switch subcircuit in the ultrasonic monitoring circuit; the switch subcircuit is arranged in the non-sensing area; the dual correlation subcircuit is arranged on a side of the switch subcircuit away from the sensing area; The sensing area further comprises a plurality of readout lines, each of which is electrically connected to the acquisition subcircuit in a column of the subpixels; The multiple input terminals of the switch subcircuit are connected to the multiple read lines in a one-to-one correspondence.

13. An ultrasonic device, characterized in that: The ultrasonic device comprises an ultrasonic monitoring circuit as described in any one of claims 1 to 7; The acquisition subcircuit and the dual correlation subcircuit are arranged on the ultrasonic sensor panel of the ultrasonic device, and the processing subcircuit is arranged on the peripheral integrated circuit of the ultrasonic device; Alternatively, the acquisition subcircuit is arranged on the ultrasonic sensor panel, and the dual correlation subcircuit and the processing subcircuit are arranged on the peripheral integrated circuit; Wherein, the peripheral integrated circuit is electrically connected to the ultrasonic sensor panel.

14. A signal reading method, characterized in that: Used to control the ultrasonic monitoring circuit as described in any one of claims 1 to 7, the signal reading method comprises: A first enable signal is written to the first enable signal line so that the dual-correlation sub-circuit writes the non-deformation signal collected by the acquisition sub-circuit into the processing sub-circuit, and a second enable signal is written to the second enable signal line so that the dual-correlation sub-circuit writes the first deformation signal collected by the acquisition sub-circuit into the processing sub-circuit.

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