Power supply circuit, method and equipment
By integrating the second power supply module in the power supply cable, detecting voltage and providing instantaneous current when necessary, the problem of insufficient demand for instantaneous large current of the GPU is solved, low-cost power supply support is achieved, equipment manufacturing costs are reduced, and equipment manufacturing costs are improved. System stability.
Patent Information
- Application Number
- CN202411255091.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-02-07
AI Technical Summary
Graphics processors (GPUs) have insufficient power supply support in terms of peak current. The existing technology solves the demand for instantaneous high current by integrating large capacitors in GPU chips, but increases the purchase cost of GPUs. How to do without increasing costs It is a challenge to meet the instantaneous high current requirements of the GPU.
By integrating the second power supply module in the power supply cable, the second power supply module detects the voltage value provided by the first power supply module, and when the voltage is less than the threshold, an instantaneous current is provided to the device to be powered, achieving the situation without changing the GPU chip The method to meet the GPU's instantaneous high current requirement.
By integrating the second power supply module into the power supply cable, this solution can meet the demand for instantaneous high current of the GPU, reduce the equipment manufacturing cost, and monitor the life of the second power supply module through the integrated circuit bus, ensuring the stability of the system and reliability.
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Figure CN119396261A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the field of electronic technology, and relate to but are not limited to a power supply circuit, method and device. Background Art
[0002] The peak current of the graphics processing unit (GPU) is about 2.5 to 3 times the GPU thermal design power (TDP), and it is increasing. The power supply unit (PSU) supports about 1.8 times the GPU TDP within 2 milliseconds (ms), and the system lacks the ability to support operations at 0.7 to 1.2 times the GPU thermal power.
[0003] In related technologies, GPU suppliers integrate large capacitors into GPU chips, solving the problem of providing instantaneous large currents for GPUs. However, this also increases the purchase cost of GPUs. For equipment manufacturers using GPUs, expensive GPU chips increase the manufacturing cost of the equipment. How to meet the instantaneous large current requirements of GPUs while reducing manufacturing costs has become a technical problem that needs to be solved urgently. Summary of the invention
[0004] In view of this, embodiments of the present application provide a power supply circuit, method and device.
[0005] The technical solution of the embodiment of the present application is implemented as follows:
[0006] In a first aspect, an embodiment of the present application provides a power supply circuit method, including a first power supply module, a power supply cable, and a second power supply module, wherein:
[0007] The output end of the first power supply module is connected to the first end of the power supply cable, and is used to continuously provide power to the device to be powered;
[0008] The second power supply module is integrated on the power supply cable and is used to provide instantaneous current to the device to be powered;
[0009] The second end of the power supply cable is connected to the device to be powered.
[0010] In a second aspect, an embodiment of the present application provides a power supply method, which is applied to a power supply circuit, wherein the power supply circuit includes a first power supply module, a power supply cable, and a second power supply module, wherein the output end of the first power supply module is connected to the first end of the power supply cable, and is used to continuously provide power to the device to be powered; the second power supply module is integrated on the power supply cable, and is used to provide instantaneous current to the device to be powered; the second end of the power supply cable is connected to the device to be powered, and the method includes:
[0011] Using the second power supply module to detect the current voltage value provided by the first power supply module to the device to be powered;
[0012] When the second power supply module determines that the current voltage value is less than the voltage threshold, the second power supply control module is used to provide instantaneous current to the device to be powered.
[0013] In a third aspect, an embodiment of the present application provides a power supply device, including:
[0014] A detection module, used to use the second power supply module to detect a current voltage value provided by the first power supply module to the device to be powered;
[0015] The instantaneous current providing module is used to use the second power supply control module to provide instantaneous current to the device to be powered when the second power supply module determines that the current voltage value is less than the voltage threshold.
[0016] In a fourth aspect, an embodiment of the present application provides an electronic device, including a device to be powered and a power supply circuit, the power supply circuit including a first power supply module, a power supply cable and a second power supply module, wherein:
[0017] The output end of the first power supply module is connected to the first end of the power supply cable, and is used to continuously provide power to the device to be powered;
[0018] The second power supply module is integrated on the power supply cable and is used to provide instantaneous current to the device to be powered;
[0019] The second end of the power supply cable is connected to the device to be powered.
[0020] In a fifth aspect, an embodiment of the present application provides a storage medium storing executable instructions for implementing the above method when executed by a processor.
[0021] In a sixth aspect, a computer program product includes a computer program or instructions, and when the computer program or instructions are executed by a processor, the steps in the above method are implemented. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1A A schematic diagram of a power supply circuit provided in an embodiment of the present application;
[0023] Figure 1B A schematic diagram of a power supply circuit provided in an embodiment of the present application;
[0024] Figure 1C A schematic diagram of a power supply circuit provided in an embodiment of the present application;
[0025] Figure 1D A schematic diagram of a power supply circuit provided in an embodiment of the present application;
[0026] Figure 2A A top view of a second power supply module provided in an embodiment of the present application;
[0027] Figure 2B A side view of a second power supply module provided in an embodiment of the present application;
[0028] Figure 2C A schematic diagram of the connection of modular cables provided in an embodiment of the present application;
[0029] Figure 2D A schematic diagram of a second power supply module provided in an embodiment of the present application;
[0030] Figure 3 A schematic diagram of an implementation flow of a power supply method provided in an embodiment of the present application;
[0031] Figure 4A A schematic diagram of instantaneous energy consumption versus power supply capacity provided in an embodiment of the present application;
[0032] Figure 4B A schematic diagram of local instantaneous energy consumption compared to power supply capacity provided in an embodiment of the present application;
[0033] Figure 4C A schematic diagram of a circuit connection provided in an embodiment of the present application;
[0034] Figure 5 A schematic diagram of the structure of a power supply device provided in an embodiment of the present application;
[0035] Figure 6 A hardware entity schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION
[0036] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the specific technical solution of the embodiments of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.
[0037] In the following description, reference is made to “some embodiments”, which describe a subset of all possible embodiments, but it will be understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.
[0038] In the following description, the terms "first\second\third" involved are merely used to distinguish similar objects and do not represent a specific ordering of the objects. It can be understood that "first\second\third" can be interchanged with a specific order or sequence where permitted, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein.
[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.
[0040] The present application embodiment provides a power supply circuit, such as Figure 1A As shown, the power supply circuit includes a first power supply module 11, a power supply cable 12 and a second power supply module 13, wherein:
[0041] The output end 111 of the first power supply module 11 is connected to the first end 121 of the power supply cable 12, and is used to continuously provide power to the device to be powered 14;
[0042] Here, the first power supply module 11 may be a power supply unit (PSU), which can supply power to all components of the electronic device, including the device to be powered 14. The device to be powered 14 may be a graphics processing unit (GPU) with instantaneous current demand. The power supply cable 12 is used to connect the first power supply module 11 and the device to be powered 14.
[0043] The second power supply module 13 is integrated on the power supply cable 12, and is used to provide instantaneous current to the device to be powered 14;
[0044] During implementation, the second power supply module 13 can be integrated on the power supply cable 13 between the first power supply module 11 and the device to be powered 14, so that when the power supply device 14 has an instantaneous current demand, the second power supply module 13 can be used to provide instantaneous current to the device to be powered 14.
[0045] The second end 122 of the power supply cable is connected to the device to be powered 14 .
[0046] In the embodiment of the present application, the power supply circuit includes a first power supply module, a power supply cable, and a second power supply module, wherein the output end of the first power supply module is connected to the first end of the power supply cable, and is used to continuously provide power to the device to be powered; the second power supply module is integrated on the power supply cable, and is used to provide instantaneous current to the device to be powered; the second end of the power supply cable is connected to the device to be powered. In this way, the second power supply module is integrated on the power supply cable, and only the physical structure of the power supply cable is changed to provide instantaneous current to the device to be powered, which is a low-cost way to provide instantaneous current.
[0047] In some embodiments, Figure 1B As shown, the power supply circuit also includes an integrated circuit bus 15 and a baseboard management controller 16;
[0048] The integrated circuit bus 15 is disposed between the second power supply module 13 and the baseboard management controller 16 , so that the baseboard management controller 16 can obtain the life information of the second power supply module 13 .
[0049] Here, the integrated circuit bus I2C is a serial communication bus that can connect the second power supply module 13 and the baseboard management controller 16, so that the baseboard management controller 16 can obtain the life information of the second power supply module 13. The baseboard management controller (Board Management Controller, BMC) is a dedicated microcontroller embedded in the mainboard of the electronic device. BMC is responsible for managing the interface between the system management software and the platform hardware, and can realize management functions such as device information management, status monitoring, remote control, and maintenance management.
[0050] The life information is the effective use time of the second power supply module 13. In some embodiments, the life information may be the life information of the super capacitor used for charging and discharging in the second power supply module.
[0051] During the implementation, the baseboard management controller 16 can monitor in real time through the integrated circuit bus to obtain the effective working time of the second power supply module 13. If it is determined based on the effective working time that the second power supply module cannot work normally, a prompt message can be output to prompt the user to replace the second power supply module 13 in time.
[0052] In the embodiment of the present application, the integrated circuit bus is arranged between the second power supply module and the baseboard management controller. In this way, the baseboard management controller can obtain the life information of the second power supply module in real time, and further, when it is determined based on the effective working time that the second power supply module cannot work normally, it can output a prompt message to prompt the user to replace the second power supply module in time.
[0053] In some embodiments, Figure 1C As shown, the power supply circuit further includes a field programmable logic gate array 17; the integrated circuit bus 15 includes a first integrated circuit bus 151 and a second integrated circuit bus 152;
[0054] The integrated circuit bus is arranged between the second power supply module and the baseboard management controller, and includes:
[0055] The first integrated circuit bus 151 is provided between the second power supply module 13 and the field programmable logic gate array 17, so that the field programmable logic gate array 17 can read the power supply data of the second power supply module 13 by using the first integrated circuit bus 151, and store the power supply data in the register of the field programmable logic gate array 17;
[0056] Here, Field-Programmable Gate Array (FPGA) is a semiconductor chip based on programmable logic device technology, which has high flexibility and programmability.
[0057] In the implementation process, the second power supply module 13 and the FPGA 17 are connected by the first integrated circuit bus 151. The second power supply module 13 can be a power supply module integrated in the cable, that is, a modular cable integrated circuit (IC). For example, the FPGA reads the power supply data from the modular cable IC and stores the power supply data in the register of the FPGA.
[0058] The second integrated circuit bus 152 is arranged between the field programmable logic gate array 17 and the baseboard management controller 16, so that the baseboard management controller 17 can read the power supply data from the register of the field programmable logic gate array 17 and predict the life of the second power supply module 13 based on the power supply data.
[0059] During implementation, the second integrated circuit bus 152 is used to connect the FPGA 17 and the BMC 16. In this way, the BMC can use the power data recovered from the register of the FPGA to predict the life of the second power supply module 13. In some embodiments, the BMC can use the power data recovered from the register of the FPGA to predict the service life of the supercapacitor in the second power supply module 13.
[0060] In some embodiments, the FPGA can be used as a bridge to allow the BMC to access the powered device GPU through SPI-to-I2C, that is, the FPGA receives the data from the GPU through the I2C interface, and converts it into the data format of the SPI interface and sends it to the BMC, so that the BMC can obtain the GPU data, wherein the Serial Peripheral Interface (SPI) is full-duplex communication, that is, the master device and the slave device can send and receive data at the same time. I2C is half-duplex communication, that is, only one device can send data at the same time, and the other device can receive data.
[0061] In some embodiments, the BMC may also be directly connected to the powered device GPU via I2C to obtain GPU data.
[0062] In the embodiment of the present application, the first integrated circuit bus is arranged between the second power supply module and the field programmable logic gate array. In this way, the field programmable logic gate array 17 can use the first integrated circuit bus to read the power supply data of the second power supply module and store the power supply data in the register of the field programmable logic gate array. The second integrated circuit bus is arranged between the field programmable logic gate array and the baseboard management controller. In this way, the baseboard management controller can read the power supply data from the register of the field programmable logic gate array and predict the life of the second power supply module based on the power supply data.
[0063] In some embodiments, Figure 1D As shown, the power supply circuit includes N power supply cables 12 and N second power supply modules 13, where N is an integer greater than or equal to 1, wherein:
[0064] The i-th output end 111 of the first power supply module 11 is connected to the first end of the i-th power supply cable 12, and is used to continuously provide power to the i-th device to be powered 14, where i is an integer greater than or equal to 1 and less than or equal to N;
[0065] The i-th second power supply module 13 is integrated into the i-th power supply cable 14;
[0066] The i-th power supply cable 12 is connected to the i-th device 14 to be powered;
[0067] An integrated circuit bus is provided between every two second power supply modules 13 of the N second power supply modules 13 , so that the baseboard management controller can obtain life information of the N second power supply modules.
[0068] For example, when there are multiple powered devices in an electronic device that need to be provided with instantaneous current, such as GPUs, a second power supply module can be integrated on the cable that supplies power to each GPU to provide instantaneous current for each GPU.
[0069] During implementation, an integrated circuit bus is provided between every two second power supply modules 13 of the N second power supply modules 13 , so that the baseboard management controller can obtain the life information of the N second power supply modules.
[0070] Figure 2A A top view of a second power supply module provided in an embodiment of the present application, such as Figure 2A As shown, connectors 131 and 132 for connecting the integrated circuit bus 15, a downlink power cable 18 and an uplink power cable 19 are provided on the circuit board where the second power supply module 13 is provided. And the size example of the second power supply module provided, that is, the length and width of the second power supply module can be set to 25 millimeters (mm).
[0071] Figure 2B A side view of a second power supply module provided in an embodiment of the present application, such as Figure 2B As shown, connectors 131 and 132 for connecting the integrated circuit bus 15 , a downstream power cable 18 and an upstream power cable 19 are provided on the circuit board where the second power supply module 13 is provided.
[0072] Figure 2C A schematic diagram of the connection of modular cables provided in an embodiment of the present application is shown in FIG. Figure 2C As shown, it includes: 3 circuit boards with second power supply modules, and the circuit boards are connected through an integrated circuit bus 15, such as Figure 1B As shown, the integrated circuit bus 15 is connected to the baseboard management controller 16. In this way, the baseboard management controller can obtain the life information of N second power supply modules. Each second power supply module obtains system power from the first power supply module 11, and then supplies power to the corresponding device to be powered, that is, Figure 2C 141, 142 and 143 are shown to provide instantaneous current.
[0073] In an embodiment of the present application, the power supply circuit includes N power supply cables and N second power supply modules. The i-th output end of the first power supply module is connected to the first end of the i-th power supply cable, and is used to continuously provide power to the i-th device to be powered, where i is an integer greater than or equal to 1 and less than or equal to N; the i-th second power supply module is integrated in the i-th power supply cable; and the i-th power supply cable is connected to the i-th device to be powered. In this way, when there are multiple devices to be powered that need to be provided with instantaneous current in the electronic device, a second power supply module can be integrated on each power supply cable to realize the function of providing instantaneous current to each device to be powered. An integrated circuit bus is set between every two second power supply modules of the N second power supply modules, so that the baseboard management controller can obtain the life information of the N second power supply modules.
[0074] In some embodiments, the baseboard controller is further used to determine an identifier of each second power supply module; and obtain life information of the i-th second power supply module based on the identifier.
[0075] During implementation, the BMC may first provide an identifier for the newly added second power supply module to distinguish it from other second power supply modules; and then obtain the life information of each second power supply module based on the identifier.
[0076] For example, if Figure 2C As shown, the BMC can identify the three second power supply modules as 1, 2 and 3 respectively through the integrated circuit bus 15; and determine the life information of the corresponding second power supply modules based on the identifications 1, 2 and 3.
[0077] In the embodiment of the present application, the baseboard controller is also used to determine the identification of each second power supply module, and obtain the life information of the i-th second power supply module based on the identification. In this way, the life information of multiple second power supply modules can be determined using different identifications.
[0078] Figure 2D A schematic diagram of a second power supply module provided in an embodiment of the present application, such as Figure 2D As shown, the second power supply module 13 includes a power control submodule 131, a voltage detection subcircuit 132 and a supercapacitor group 133 including at least one supercapacitor, wherein the voltage detection pin of the power control submodule 131 is connected to the voltage detection subcircuit 132, and the capacitor pin of the power control submodule 132 is connected to the supercapacitor;
[0079] Here, the power control submodule 131 can be selected as LTC3350, and the voltage detection pins VOUTSP and VOUTSN of the chip can be respectively connected to the resistor of the voltage detection subcircuit 132; the capacitor pins CAPRTN, CAP1, CAP2, CAP4 and CAP4 of the chip are respectively connected to each capacitor in the supercapacitor group 133.
[0080] The power control submodule 131 is used to detect the current voltage value using the voltage detection subcircuit 132; when it is determined that the current voltage value is less than the voltage threshold, the supercapacitor group 133 is used to provide instantaneous current to the device to be powered.
[0081] Here, the power control submodule 131 can be used to monitor whether there is a demand for instantaneous current, and when it is determined that there is a demand for instantaneous current, control the supercapacitor to provide the instantaneous current. For example, the power control submodule 131 can be selected as LTC3350, which can charge and monitor a series stack containing 1 to 4 supercapacitors.
[0082] During the implementation, the power control submodule 131 can detect the current voltage value across the resistor in the voltage detection subcircuit 132; when it is determined that the current voltage value is less than the voltage threshold, the supercapacitor group 133 is used to provide instantaneous current to the device to be powered. The voltage threshold can be obtained according to the actual test scenario and is a voltage value less than 12 volts (V).
[0083] In the embodiment of the present application, the second power supply module includes a power control submodule, a voltage detection subcircuit and a supercapacitor group including at least one supercapacitor. The power control submodule is used to detect the current voltage value using the voltage detection subcircuit; when it is determined that the current voltage value is less than the voltage threshold, the supercapacitor group is used to provide instantaneous current to the device to be powered. In this way, the power control submodule can determine that an instantaneous current needs to be provided to the device to be powered based on the detected voltage change value.
[0084] In some embodiments, the power control submodule is further used to bypass the supercapacitor group when it is determined that the current voltage value is greater than or equal to the voltage threshold, so as to utilize the first power supply module to power the device to be powered.
[0085] During the implementation process, Figure 2D As shown, the power control submodule 131 can detect the current voltage value at both ends of the resistor in the voltage detection subcircuit 132; when it is determined that the current voltage value is greater than or equal to the voltage threshold, it is determined that there is no need to provide instantaneous current to the device to be powered, that is, the supercapacitor group 133 can be bypassed, and the first power supply module can be used to continuously power the device to be powered, thereby meeting the power demand of the device to be powered.
[0086] In the embodiment of the present application, the power control submodule is also used to bypass the supercapacitor group when it is determined that the current voltage value is greater than or equal to the voltage threshold. In this way, when it is determined that there is no need to provide instantaneous current to the device to be powered, the first power supply module is used to continuously supply power to the device to be powered, so as to meet the power demand of the device to be powered.
[0087] The same power supply method in the embodiment of the present application is applied to a power supply circuit, wherein the power supply circuit includes a first power supply module, a power supply cable, and a second power supply module. The output end of the first power supply module is connected to the first end of the power supply cable to continuously provide power to the device to be powered; the second power supply module is integrated on the power supply cable to provide instantaneous current to the device to be powered; the second end of the power supply cable is connected to the device to be powered, such as Figure 3 As shown, power supply can be achieved through the following steps:
[0088] Step S310: using the second power supply module to detect a current voltage value provided by the first power supply module to the device to be powered;
[0089] During the implementation process, Figure 2D As shown, the power control submodule 131 in the second power supply module 13 can detect the current voltage value across the resistor in the voltage detection subcircuit 132, and can determine the voltage value as the current voltage value provided by the first power supply module for the device to be powered.
[0090] Step S320: When the second power supply module determines that the current voltage value is less than a voltage threshold, the second power supply control module is used to provide instantaneous current to the device to be powered.
[0091] During the implementation process, Figure 2D As shown, when it is determined that the current voltage value is less than the voltage threshold, the super capacitor group 133 in the second power supply module 13 is used to provide instantaneous current to the device to be powered.
[0092] In the embodiment of the present application, the second power supply module is first used to detect the current voltage value provided by the first power supply module to the device to be powered; then, when the second power supply module determines that the current voltage value is less than the voltage threshold, the second power supply control module is used to provide instantaneous current to the device to be powered. In this way, the second power supply module is integrated into the power supply cable, and only the physical structure of the power supply cable is changed to provide instantaneous current to the device to be powered, which is a low-cost instantaneous current providing method.
[0093] In some embodiments, the power supply circuit further includes an integrated circuit bus and a baseboard management controller; the integrated circuit bus is arranged between the second power supply module and the baseboard management controller, and the above power supply method further includes the following steps:
[0094] Step S330: using the baseboard management controller to obtain life information of the second power supply module.
[0095] like Figure 1B As shown, the power supply circuit further includes an integrated circuit bus 15 and a baseboard management controller 16 ; the integrated circuit bus 15 is arranged between the second power supply module 13 and the baseboard management controller 16 , so that the baseboard management controller 16 can obtain the life information of the second power supply module 13 .
[0096] Here, the integrated circuit bus I2C is a serial communication bus that can connect the second power supply module 13 and the baseboard management controller 16, so that the baseboard management controller 16 can obtain the life information of the second power supply module 13. The life information is the effective use time of the second power supply module 13. In some embodiments, the life information can be the life information of the super capacitor used for charging and discharging in the second power supply module.
[0097] During the implementation, the baseboard management controller 16 can monitor in real time through the integrated circuit bus to obtain the effective working time of the second power supply module 13. If it is determined based on the effective working time that the second power supply module cannot work normally, a prompt message can be output to prompt the user to replace the second power supply module 13 in time.
[0098] In the embodiment of the present application, the integrated circuit bus is arranged between the second power supply module and the baseboard management controller. In this way, the baseboard management controller can obtain the life information of the second power supply module in real time, and further, when it is determined based on the effective working time that the second power supply module cannot work normally, it can output a prompt message to prompt the user to replace the second power supply module in time.
[0099] Figure 4A A schematic diagram of instantaneous energy consumption versus power supply capacity provided in an embodiment of the present application, such as Figure 4A As shown, the horizontal axis is the time axis, and the vertical axis is the maximum current value collected at the target voltage. The current collected from 0 seconds to 10.0E-3 seconds is Figure 4A The partial schematic diagram 40 shown in FIG. 4 is enlarged to Figure 4B The diagram shows the instantaneous energy consumption compared to the power supply capability. Within 2 milliseconds (ms), the current provided by the power supply cannot meet the current demand of the device.
[0100] Figure 4C A schematic diagram of a circuit connection provided in an embodiment of the present application, such as Figure 4C As shown, the schematic diagram includes: a second power supply module 13 arranged on a power supply cable, a device to be powered (GPU) 14, an integrated circuit bus I2C, a BMC 16, and an FPGA 17, wherein:
[0101] The second power supply module 13 includes a power controller 131 and a super capacitor group 133 , wherein the power controller 133 can be selected as LTC3350.
[0102] The integrated circuit bus 15 includes a first integrated circuit bus connecting the power controller 131 and the FPGA 17 and a second integrated circuit bus for connecting the FPGA 17 and the BMC 16 .
[0103] During the implementation, the power controller 131 monitors the power (current) of the super capacitor group 133. The FPGA reads the power data from the power controller 131 and stores it in the FPGA register. The BMC calculates the life of the super capacitor group 133 using the power data restored in the FPGA register.
[0104] In this way, when it is determined that a large instantaneous current is required to be provided to the device 14 to be powered, the super capacitor group 133 can be used to provide a large instantaneous current to the device 14 to be powered, thereby solving the problem of Figure 4B The problem that the GPU cannot be provided with instantaneous high current is solved. In addition, the BMC can monitor the life of the super capacitor group 133 in real time, and prompt the user to replace the super capacitor group 133 when it is determined that the super capacitor group 133 needs to be replaced.
[0105] Based on the foregoing embodiments, an embodiment of the present application provides a power supply device, which includes the modules included and can be implemented by a processor in an electronic device; of course, it can also be implemented by a specific logic circuit; in the implementation process, the processor can be a central processing unit (CPU), a microprocessor (MPU), a digital signal processor (DSP) or a field programmable gate array (FPGA), etc.
[0106] Figure 5 A schematic diagram of the structure of the power supply device provided in the embodiment of the present application is shown in FIG. Figure 5 As shown, the device 500 includes:
[0107] A voltage detection module 510 uses the second power supply module to detect a current voltage value provided by the first power supply module to the device to be powered;
[0108] The instantaneous current providing module 520 is used to use the second power supply control module to provide an instantaneous current to the device to be powered when the second power supply module determines that the current voltage value is less than a voltage threshold.
[0109] In some embodiments, the power supply module further includes an acquisition module 530 for acquiring life information of the second power supply module using the baseboard management controller.
[0110] The description of the above device embodiment is similar to the description of the above method embodiment, and has similar beneficial effects as the method embodiment. For technical details not disclosed in the device embodiment of the present application, please refer to the description of the method embodiment of the present application for understanding.
[0111] It should be noted that in the embodiment of the present application, if the above method is implemented in the form of a software function module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the embodiment of the present application is essentially or the part that contributes to the relevant technology can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions to enable an electronic device (which can be a mobile phone, a tablet computer, a laptop computer, a desktop computer, etc.) to execute all or part of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a U disk, a mobile hard disk, a read-only memory (ROM), a disk or an optical disk. In this way, the embodiment of the present application is not limited to any specific combination of hardware and software.
[0112] Correspondingly, an embodiment of the present application provides a storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps in the power supply method provided in the above embodiment are implemented.
[0113] Correspondingly, an embodiment of the present application provides an electronic device, Figure 6 A hardware entity diagram of an electronic device provided in an embodiment of the present application, such as Figure 6 As shown, the hardware entity of the device 600 includes: a memory 601 and a processor 602, wherein the memory 601 stores a computer program that can be run on the processor 602, and the processor 602 implements the steps in the power supply method provided in the above embodiment when executing the program.
[0114] The memory 601 is configured to store instructions and applications executable by the processor 602, and can also cache data to be processed or processed by the processor 602 and various modules in the electronic device 600 (for example, image data, audio data, voice communication data, and video communication data), which can be implemented through flash memory (FLASH) or random access memory (Random Access Memory, RAM).
[0115] It should be noted here that the description of the above storage medium and device embodiments is similar to the description of the above method embodiments, and has similar beneficial effects as the method embodiments. For technical details not disclosed in the storage medium and device embodiments of this application, please refer to the description of the method embodiments of this application for understanding.
[0116] It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the sequence number of the above-mentioned processes does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. The above-mentioned sequence numbers of the embodiments of the present application are only for description and do not represent the advantages and disadvantages of the embodiments.
[0117] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.
[0118] In the several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as: multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling, direct coupling, or communication connection between the components shown or discussed can be through some interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.
[0119] The units described above as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units; they may be located in one place or distributed on multiple network units; some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.
[0120] In addition, all functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may be a separate unit, or two or more units may be integrated into one unit; the above-mentioned integrated units may be implemented in the form of hardware or in the form of hardware plus software functional units.
[0121] A person skilled in the art can understand that all or part of the steps of implementing the above method embodiment can be completed by hardware related to program instructions, and the aforementioned program can be stored in a computer-readable storage medium. When the program is executed, it executes the steps of the above method embodiment; and the aforementioned storage medium includes: mobile storage devices, read-only memories (ROM), magnetic disks or optical disks, etc., various media that can store program codes.
[0122] Alternatively, if the above-mentioned integrated unit of the present application is implemented in the form of a software function module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the embodiment of the present application can be essentially or partly reflected in the form of a software product that contributes to the relevant technology. The computer software product is stored in a storage medium, including several instructions to enable an electronic device (which can be a mobile phone, a tablet computer, a laptop computer, a desktop computer, etc.) to execute all or part of the methods described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as mobile storage devices, ROMs, magnetic disks, or optical disks.
[0123] The methods disclosed in several method embodiments provided in this application can be arbitrarily combined without conflict to obtain new method embodiments.
[0124] The features disclosed in several product embodiments provided in this application can be arbitrarily combined without conflict to obtain new product embodiments.
[0125] The features disclosed in several method or device embodiments provided in this application can be arbitrarily combined without conflict to obtain new method embodiments or device embodiments.
[0126] The above is only an implementation method of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
Claims
1. A power supply circuit, comprising a first power supply module, a power supply cable and a second power supply module, wherein: The output end of the first power supply module is connected to the first end of the power supply cable, and is used to continuously provide power to the device to be powered; The second power supply module is integrated on the power supply cable and is used to provide instantaneous current to the device to be powered; The second end of the power supply cable is connected to the device to be powered.
2. The power supply circuit according to claim 1, further comprising an integrated circuit bus and a baseboard management controller; The integrated circuit bus is arranged between the second power supply module and the baseboard management controller, so that the baseboard management controller can obtain the life information of the second power supply module.
3. The power supply circuit according to claim 2, wherein the power supply circuit further comprises a field programmable logic gate array; the integrated circuit bus comprises a first integrated circuit bus and a second integrated circuit bus; The integrated circuit bus is arranged between the second power supply module and the baseboard management controller, and includes: The first integrated circuit bus is provided between the second power supply module and the field programmable logic gate array, so that the field programmable logic gate array can read the power supply data of the second power supply module by using the first integrated circuit bus, and store the power supply data in the register of the field programmable logic gate array; The second integrated circuit bus is arranged between the field programmable logic gate array and the baseboard management controller, so that the baseboard management controller can read the power supply data from the register of the field programmable logic gate array and predict the life of the second power supply module based on the power supply data.
4. The power supply circuit according to claim 2, comprising N power supply cables and N second power supply modules, where N is an integer greater than or equal to 1, wherein: The i-th output end of the first power supply module is connected to the first end of the i-th power supply cable, and is used to continuously provide power to the i-th device to be powered, where i is an integer greater than or equal to 1 and less than or equal to N; The i-th second power supply module is integrated in the i-th power supply cable; The i-th power supply cable is connected to the i-th device to be powered; An integrated circuit bus is provided between every two second power supply modules of the N second power supply modules, so that the baseboard management controller can obtain life information of the N second power supply modules.
5. The power supply circuit according to claim 4, The baseboard controller is further used to determine an identifier of each second power supply module; and obtain life information of the i-th second power supply module based on the identifier.
6. The power supply circuit according to claim 1, wherein the second power supply module comprises a power control submodule, a voltage detection subcircuit and a supercapacitor group including at least one supercapacitor, wherein: The voltage detection pin of the power control submodule is connected to the voltage detection subcircuit, and the capacitor pin of the power control submodule is connected to the supercapacitor; The power control submodule is used to detect the current voltage value using the voltage detection subcircuit; when it is determined that the current voltage value is less than the voltage threshold, the supercapacitor group is used to provide instantaneous current to the device to be powered.
7. The power supply circuit according to claim 6, wherein the power control submodule is further used to bypass the supercapacitor group when it is determined that the current voltage value is greater than or equal to the voltage threshold, so as to utilize the first power supply module to power the device to be powered.
8. A power supply method, applied to a power supply circuit, the power supply circuit comprising a first power supply module, a power supply cable and a second power supply module, wherein the output end of the first power supply module is connected to the first end of the power supply cable, for continuously providing power to a device to be powered; The second power supply module is integrated on the power supply cable and is used to provide instantaneous current to the device to be powered; The second end of the power supply cable is connected to the device to be powered, and the method includes: Using the second power supply module to detect a current voltage value provided by the first power supply module to the device to be powered; When the second power supply module determines that the current voltage value is less than the voltage threshold, the second power supply control module is used to provide instantaneous current to the device to be powered.
9. The power supply method according to claim 8, wherein the power supply circuit further comprises an integrated circuit bus and a baseboard management controller; the integrated circuit bus is arranged between the second power supply module and the baseboard management controller, and the method further comprises: The baseboard management controller is used to obtain life information of the second power supply module.
10. An electronic device, comprising a device to be powered and a power supply circuit, wherein the power supply circuit comprises a first power supply module, a power supply cable and a second power supply module, wherein: The output end of the first power supply module is connected to the first end of the power supply cable, and is used to continuously provide power to the device to be powered; The second power supply module is integrated on the power supply cable and is used to provide instantaneous current to the device to be powered; The second end of the power supply cable is connected to the device to be powered.